A resin material and a method for producing the same

Abstract

This invention relates to a resin material and its preparation method, comprising prepolymerizing epoxy resin with reactive end-capped polysiloxane, cooling the reaction system after the reaction is completed, adding polyurethane-modified epoxy resin, phenylboronic acid, and amino-modified boron nitride nanosheets to the reaction system, stirring until homogeneous, then adding an inactive diluent and polyetheramine, and finally performing molding curing and low-temperature acclimation treatments sequentially to obtain the resin material. By prepolymerizing epoxy resin with reactive end-capped polysiloxane to form a covalently linked organosilicon-epoxy prepolymer, further introducing phenylboronic acid to construct dynamic reversible boron-oxygen bonds, and adding components such as amino-modified boron nitride nanosheets and polyurethane-modified epoxy resin, combined with a two-step post-treatment process of curing and low-temperature acclimation, the microstructure of the resin material not only reaches a stable state matching extreme service environments, but also endows it with excellent high and low temperature impact resistance and microcrack self-healing properties.

Description

Technical Field

[0001] This invention relates to the field of polymer materials technology, specifically to a resin material and its preparation method. Background Technology

[0002] The extreme environment of the liquid helium temperature range (approximately 4.2K) places stringent demands on high-performance resin materials. At this temperature, the resin materials must not only withstand the risk of brittle fracture caused by extremely low temperatures, but also maintain stable mechanical properties and dimensional accuracy over a wide temperature range to cope with repeated thermal cycling processes from room temperature to the liquid helium temperature range.

[0003] Currently, research on low-temperature resistant resin materials mainly focuses on epoxy resins, silicone resins, and their modified systems. To improve low-temperature toughness, existing technologies typically employ two strategies: one is to introduce flexible segments, such as using polyether epoxy resins or long-chain aliphatic curing agents, to improve the low-temperature mobility of molecular chains by reducing crosslinking density; the other is to add elastomers or thermoplastic resins for toughening modification.

[0004] However, existing technologies have significant drawbacks when applied to the liquid helium temperature range and the aforementioned wide temperature range. First, the extremely low temperatures completely freeze the molecular chain movement in traditional static cross-linked networks, leading to a sharp increase in the material's intrinsic brittleness. Studies have shown that in ordinary epoxy resins, molecular chain movement is hindered at liquid helium temperatures, shrinkage stress cannot be released, and microcracks are easily generated and difficult to repair. Second, traditional processes involving the addition of elastomers significantly reduce the resin's high-temperature resistance and dimensional stability, failing to meet the requirements for wide temperature range applications.

[0005] Therefore, there is an urgent need to develop a resin material that combines extremely low temperature toughness, wide temperature range stability, and self-healing ability.

[0006] The above background information is provided only to aid in understanding the concept and technical solution of this application. It does not necessarily belong to the prior art of this application, nor does it necessarily provide technical guidance. In the absence of clear evidence that the above information was disclosed before the filing date of this application, the above background information should not be used to evaluate the novelty and inventiveness of this application. Summary of the Invention

[0007] The purpose of this invention is to provide a novel resin material and its preparation method.

[0008] To achieve the above objectives, the technical solution adopted by the present invention is as follows: This invention provides a method for preparing a resin material, comprising: Epoxy resin was reacted with reactive end-capped polysiloxane at a temperature of 110°C to 130°C. After the reaction was completed, the reaction system was cooled to 20°C to 30°C. Polyurethane-modified epoxy resin, phenylboronic acid, and amino-modified boron nitride nanosheets were first added to the reaction system and stirred until homogeneous. Then, an inactive diluent and polyetheramine were added. Finally, molding and curing treatments and low-temperature acclimation treatments were performed sequentially to obtain the resin material. The low-temperature acclimatization includes: placing the cured product after the molding and curing treatment at a first temperature and then at a second temperature, wherein the first temperature is -205℃ to -185℃ and the second temperature is 170℃ to 190℃.

[0009] This invention prepolymerizes epoxy resin with reactive end-capped polysiloxane, utilizing the ring-opening addition reaction between the epoxy groups in the epoxy resin and the reactive end-capped groups at the ends of the reactive end-capped polysiloxane to form a covalently linked organosilicon-epoxy prepolymer. This fundamentally avoids the phase separation problem caused by direct physical mixing of epoxy resin and organosilicon at the molecular structure level. Furthermore, phenylboronic acid is introduced into the resulting organosilicon-epoxy prepolymer. This phenylboronic acid can form dynamically reversible boron-oxygen bonds with the hydroxyl functional groups in the system, thereby endowing the material with stress release and microcrack self-healing functions over a wide temperature range. Further, this invention adds aminated boron nitride nanosheets, which possess a low coefficient of thermal expansion, high interfacial compatibility, and a two-dimensional nanosheet toughening mechanism, synergistically improving the low-temperature strength and insulation stability of the resin in the liquid helium temperature range. Finally, through curing and low-temperature acclimatization processes, residual stress inside the material is released, and dynamic rearrangement of the boron-oxygen bonds is promoted, enabling the resin material to fully adapt to the extreme low-temperature environment of 4.2K.

[0010] In some embodiments, the first temperature is -200°C to -190°C.

[0011] Furthermore, the first temperature is -196°C.

[0012] In some embodiments, the second temperature is 175°C to 185°C, such as 175°C, 178°C, 180°C, 182°C, or 185°C.

[0013] In some embodiments, the heat preservation time at the first temperature is 1h to 3h, preferably 1.5h to 2.5h.

[0014] In some embodiments, the heat preservation time at the second temperature is 0.5h to 2h, preferably 0.5h to 1.5h.

[0015] In some embodiments, the low-temperature acclimation further includes placing the cured product at a third temperature for insulation after the insulation at the first temperature has ended and before the insulation at the second temperature has begun.

[0016] Furthermore, the third temperature is 20℃~30℃.

[0017] Furthermore, the heat preservation time at the third temperature is 1h to 3h, preferably 1.5h to 2.5h.

[0018] In some embodiments, the reactive end-capping group of the reactive end-capping polysiloxane is one or more of amino and aminoalkyl groups.

[0019] Furthermore, the aminoalkyl group is an aminoalkyl group having 1 to 4 carbon atoms, such as aminomethyl, aminoethyl, aminopropyl, and aminobutyl.

[0020] In some embodiments, the main chain structure of the reactive end-capped polysiloxane is polydimethylsiloxane, polymethylphenylsiloxane, or a copolymer of the two.

[0021] Furthermore, the number-average molecular weight of the reactive end-capped polysiloxane is preferably 500-5000, and more preferably 800-3000.

[0022] In some specific embodiments, the reactive end-capped polysiloxane is an amino-terminated polydimethylsiloxane and / or an aminopropyl-terminated polydimethylsiloxane.

[0023] In some embodiments, the aminated boron nitride nanosheets are prepared by reacting boron nitride nanosheets with a silane coupling agent in the presence of a solvent.

[0024] Furthermore, the silane coupling agent is 3-aminopropyltriethoxysilane.

[0025] Furthermore, the mass ratio of the boron nitride nanosheets to the silane coupling agent is 1:(4~7), preferably 1:(4.5~6).

[0026] In some embodiments, the solvent is a mixture of ethanol and water, wherein the volume ratio of ethanol to water is (2~4):1, preferably (2.5~3.5):1, and more preferably (2.8~3.3):1.

[0027] In some embodiments, the mass ratio of the solvent to the total mass of the boron nitride nanosheets and the silane coupling agent is (3~4):1, preferably (3.3~3.8):1.

[0028] In some embodiments, the boron nitride nanosheets are subjected to a reflux reaction with a silane coupling agent.

[0029] Furthermore, the reflux reaction time is 5h to 7h.

[0030] In some embodiments, the reaction temperature of the boron nitride nanosheets with the silane coupling agent is 80°C to 90°C.

[0031] Furthermore, the reaction time between the boron nitride nanosheets and the silane coupling agent is 5h~7h.

[0032] In some embodiments, the preparation method of the aminated boron nitride nanosheets further includes: after the reaction is completed, filtering and drying the reaction system sequentially.

[0033] Furthermore, the drying temperature is 100℃~120℃, and the time is 4h~6h.

[0034] Furthermore, the drying temperature is 105℃~115℃, and the time is 4.5h~5.5h.

[0035] In some embodiments, the epoxy resin is a bisphenol F type epoxy resin.

[0036] In some embodiments, the inactive diluent is propylene glycol methyl ether acetate. The additives used for the inactive diluent are not specifically limited, but it is preferred that the viscosity of the system be adjusted to 3000-5000 mPa•s after the inactive diluent is added.

[0037] In some embodiments, the molding and curing process includes raising the system to be cured to a fourth temperature and holding it at the fourth temperature.

[0038] Furthermore, the fourth temperature is 100℃~120℃.

[0039] Furthermore, the heat preservation time at the fourth temperature is 1 hour to 3 hours.

[0040] Furthermore, the temperature is increased to the fourth temperature at a heating rate of 15~25℃ / h.

[0041] In some embodiments, the raw materials of the resin material, by weight, include: 40-50 parts epoxy resin 10-30 parts of polyurethane-modified epoxy resin, 20-30 parts of reactive end-capped polysiloxane, 10-15 parts of phenylboronic acid 3-6 parts of aminated boron nitride nanosheets 5-8 parts of polyetheramine, 50-150 parts of non-reactive diluent.

[0042] Further, the raw materials of the resin material, by weight, include: 40-45 parts epoxy resin, 10-30 parts of polyurethane-modified epoxy resin, 20-25 parts of reactive end-capped polysiloxane, 10-12 parts of phenylboronic acid 3-6 parts of aminated boron nitride nanosheets 5-8 parts of polyetheramine, 50-70 parts of non-reactive diluent.

[0043] In some specific embodiments, the raw materials of the resin material, by weight, include: 40-45 parts of bisphenol F type epoxy resin, 10-30 parts of polyurethane-modified epoxy resin, 20-25 parts of amino-terminated polydimethylsiloxane and / or aminopropyl-terminated polydimethylsiloxane 10-12 parts of phenylboronic acid 3-6 parts of aminated boron nitride nanosheets 5-8 parts of polyetheramine, 50-70 parts of propylene glycol methyl ether acetate.

[0044] A second aspect of the present invention provides a resin material prepared by the preparation method described above.

[0045] A third aspect of the present invention provides an application of the resin material as described above, the application including the use of the resin material in engineering fields such as liquid helium transport pipeline joints, cryogenic vacuum valve seals, and cryogenic components of superconducting accelerators.

[0046] Due to the application of the above-mentioned technical solution, the present invention has the following advantages compared with the prior art: This invention prepolymerizes epoxy resin with reactive end-capped polysiloxane to form a covalently linked organosilicon-epoxy prepolymer. It further introduces phenylboronic acid to construct dynamic reversible boron-oxygen bonds, and adds components such as aminated boron nitride nanosheets and polyurethane-modified epoxy resin. Combined with a two-step post-treatment process of curing and low-temperature acclimation, this not only enables the resin material's microstructure to reach a stable state matching extreme service environments, but also endows it with excellent high and low temperature impact resistance and microcrack self-healing properties. After cycling from 4.2K to 40℃, the resin material still maintains high mechanical, adhesive, and electrical properties. Detailed Implementation

[0047] In this invention, unless the context explicitly requires otherwise, the numerical range referred to as "numerical value A to numerical value B" refers to the range including the endpoints A and B. The numerical range referred to as "above" or "below" refers to the numerical range including the stated number. "Optional" or "optional" indicates that certain substances, components, execution steps, application conditions, etc., may or may not be used, and there is no limitation on the manner of use.

[0048] In this invention, the "reactively end-capped polysiloxane" refers to a polysiloxane compound capable of chemically reacting with the epoxy groups of an epoxy resin, thereby covalently linking it to the epoxy resin network. Its molecular chain ends contain at least one reactive functional group, preferably an amino or aminoalkyl group. Through this reactive end-capping, the polysiloxane can form a stable organosilicon-epoxy prepolymer with the epoxy resin during the prepolymerization stage, thereby improving the flexibility, low-temperature impact resistance, and crack resistance of the epoxy resin.

[0049] In this invention, the "polyurethane-modified epoxy resin" refers to a modified polymer formed by introducing polyurethane segments into an epoxy resin network through chemical bonding. Specifically, the isocyanate groups (-NCO) at the ends of the polyurethane prepolymer react with the hydroxyl groups (-OH) or epoxy groups on the epoxy resin molecular chain to form a copolymer structure linked by urethane bonds; or, polyurethane and epoxy resin form an interpenetrating polymer network (IPN), allowing them to interpenetrate and entangle at the molecular level, thereby combining the flexibility and impact resistance of polyurethane with the high strength, high adhesion, and good electrical insulation properties of epoxy resin.

[0050] The present invention will be further described below with reference to embodiments. However, the present invention is not limited to the following embodiments. The implementation conditions used in the embodiments can be further adjusted according to different requirements of specific applications, and the implementation conditions not specified are conventional conditions in the industry. The technical features involved in the various embodiments of the present invention can be combined with each other as long as they do not conflict with each other.

[0051] Unless otherwise specified, the reagents used in the following examples and comparative examples are commercially available products or can be prepared by referring to existing techniques. Specifically, bisphenol F epoxy resin was purchased from Shandong Aimont New Material Co., Ltd., model EMTE170; polyurethane modified epoxy resin was purchased from Zhuzhou Shilin Polymer Co., Ltd., SL3412; amino-terminated polydimethylsiloxane was purchased from Guangdong Wengjiang Chemical Reagent Co., Ltd., PEG-7 amino-terminated polydimethylsiloxane; aminopropyl-terminated polydimethylsiloxane was purchased from Chengdu McCarthy Chemical Co., Ltd.; polyetheramine was purchased from Shenzhen Jiadida New Material Technology Co., Ltd., EC301; and boron nitride nanosheets were purchased from Suzhou Napo Materials Technology Co., Ltd., NS-BN.

[0052] Example 1: This embodiment provides a resin material, the raw material formula of which is as follows, by weight parts: 45 parts of bisphenol F type epoxy resin, 10 parts of polyurethane modified epoxy resin, 25 parts of amino-terminated polydimethylsiloxane, 12 parts of phenylboronic acid, 4 parts of amino-modified boron nitride nanosheets, 6 parts of polyetheramine, and 50 parts of propylene glycol methyl ether acetate.

[0053] The preparation method of this resin material is as follows: Four parts of boron nitride nanosheets and 24 parts of 3-aminopropyltriethoxysilane were added to 100 parts of an ethanol-water mixed solution (ethanol to water volume ratio of 3:1), and the mixture was refluxed at 85°C for 6 hours. After filtration, the filter residue was dried at 110°C for 5 hours to obtain amino-boron nitride.

[0054] 45 parts of bisphenol F epoxy resin and 25 parts of amino-terminated polydimethylsiloxane were added to the reactor and stirred at 120°C for 2 hours. The mixture was then cooled to room temperature (25±5°C) to obtain the organosilicon-epoxy prepolymer.

[0055] Ten parts of polyurethane-modified epoxy resin, 12 parts of phenylboronic acid and 4 parts of amino-modified boron nitride nanosheets were added to the above-mentioned organosilicon-epoxy prepolymer. The mixture was sonicated at room temperature for 40 min, then mechanically stirred for 2 h. Then, 50 parts of propylene glycol methyl ether acetate and 6 parts of polyether amine were added and stirred for 0.5 h to obtain a crosslinked system.

[0056] The above crosslinking system was injected into the sealing mold, heated to 110°C at a heating rate of 20°C / 1h, and held at that temperature for 2h for curing.

[0057] The above-mentioned curing system was subjected to low-temperature acclimatization: first, it was kept at -196℃ for 2 hours, then at room temperature for 2 hours, and finally at 180℃ for 1 hour to obtain a liquid helium temperature-resistant dynamic cross-linked resin material resistant to high and low temperature impacts.

[0058] The -196℃ low-temperature environment can be achieved using liquid helium, while the 180℃ high-temperature environment can be provided using a constant temperature chamber or temperature control platform. To avoid condensation or oxidation on the sample surface, the sample transfer process between low and high temperatures can be carried out in a dry, inert atmosphere.

[0059] Example 2: This embodiment provides a resin material, the raw material formula of which is as follows, by weight parts: 40 parts of bisphenol F type epoxy resin, 30 parts of polyurethane modified epoxy resin, 20 parts of aminopropyl-terminated polydimethylsiloxane, 10 parts of phenylboronic acid, 5 parts of amino-modified boron nitride nanosheets, 5 parts of polyetheramine, and 70 parts of propylene glycol methyl ether acetate.

[0060] The preparation method of this resin material is as follows: Five parts of boron nitride nanosheets and 24 parts of 3-aminopropyltriethoxysilane were added to 100 parts of an ethanol-water mixed solution (ethanol to water volume ratio of 3:1), and the mixture was refluxed at 85°C for 6 hours. After filtration, the filter residue was dried at 110°C for 5 hours.

[0061] 40 parts of bisphenol F epoxy resin and 20 parts of aminopropyl-terminated polydimethylsiloxane were added to the reactor and stirred at 120°C for 2 hours. The mixture was then cooled to room temperature (25±5°C) to obtain the organosilicon-epoxy prepolymer.

[0062] Add 30 parts of polyurethane-modified epoxy resin, 10 parts of phenylboronic acid and 5 parts of amino-modified boron nitride nanosheets to the above-mentioned organosilicon-epoxy prepolymer, sonicate at room temperature for 40 min, then mechanically stir for 2 h, then add 70 parts of propylene glycol methyl ether acetate and 5 parts of polyether amine, stir for 0.5 h to obtain a crosslinked system.

[0063] The above crosslinking system was injected into the sealing mold, heated to 110°C at a heating rate of 20°C / 1h, and held at that temperature for 2h for curing.

[0064] The above-mentioned curing system was subjected to low-temperature acclimatization: first, it was kept at -196℃ for 2 hours, then at room temperature for 2 hours, and finally at 180℃ for 1 hour to obtain a liquid helium temperature-resistant dynamic cross-linked resin material resistant to high and low temperature impacts.

[0065] Comparative Example 1: This comparative example provides a resin material that is basically the same as that in Example 1, except that this comparative example does not undergo low-temperature acclimatization.

[0066] Comparative Example 2: This comparative example provides a resin material that is basically the same as that in Example 1, except that the low-temperature acclimatization process parameters are different. The specific low-temperature acclimatization process parameters of this comparative example are: first, keep warm in a -80℃ low-temperature chamber for 2 hours, then keep warm at room temperature for 2 hours, and finally keep warm in a 150℃ oven for 1 hour.

[0067] Comparative Example 3: This comparative example provides a resin material that is basically the same as that in Example 1, except that the low-temperature acclimatization process parameters are different. The specific low-temperature acclimatization process parameters of this comparative example are: first, keep warm in a -250℃ low-temperature chamber for 2 hours, then keep warm at room temperature for 2 hours, and finally keep warm in a 100℃ oven for 1 hour.

[0068] Comparative Example 4: This comparative example provides a resin material that is essentially the same as that in Example 1, except that: this comparative example does not prepare an organosilicon-epoxy prepolymer, but instead directly adds bisphenol F type epoxy resin, amino-terminated polydimethylsiloxane, polyurethane-modified epoxy resin, phenylboronic acid, and amino-modified boron nitride nanosheets to a reaction vessel, sonicates at room temperature for 40 min, then mechanically stirs for 2 h, then adds propylene glycol methyl ether acetate, then adds polyether amine, and stirs for 0.5 h. That is, a one-pot method is used to prepare the crosslinking system.

[0069] Comparative Example 5: This comparative example provides a resin material that is basically the same as that in Example 1, except that: an equal mass of nano-alumina is used to replace boron nitride nanosheets to prepare modified alumina, and an equal mass of modified alumina is used to replace aminated boron nitride nanosheets to prepare the resin material.

[0070] Performance testing: (1) Volume resistivity: The volume resistivity was tested in accordance with GB / T 31838.2-2019 "Dielectric and resistive properties of solid insulating materials - Part 2: Resistive properties (DC method) Test method for volume resistivity and volume resistivity".

[0071] (2) Electrical strength: The test shall be conducted in accordance with GB / T 1408.1-2016 "Test methods for electrical strength of insulating materials - Part 1: Test at power frequency".

[0072] (3) Bending strength: Tested according to GB / T 9341-2008 "Test method for bending properties of plastics".

[0073] (4) Bond strength: Tested in accordance with GB / T 7124-2008 "Determination of tensile shear strength of adhesives".

[0074] (5) Impact strength: The impact strength of plastic cantilever beams shall be tested in accordance with GB / T 1843-2008 "Determination of impact strength of plastic cantilever beams".

[0075] (6) Bending strength retention rate: Bending strength retention rate (%) = (σ f,1 / σ f,0 ) × 100%, where σ f,0 It is the bending strength of the sample in its initial state, σ f,1 It is the bending strength of the sample after thermal shock treatment.

[0076] The performance of the sample after thermal shock treatment refers to the performance test results after the sample has undergone 10 cycles of thermal shock treatment under the following conditions: Each thermal shock treatment constitutes one cycle, and each cycle includes the following steps in sequence: (a) The sample was kept in a low-temperature environment of 4K (-269°C) for 10 hours; (b) Remove the sample from the 4K low-temperature environment and transfer it to a high-temperature environment of 40°C for 2 hours; (c) Place the sample back in a low-temperature environment of 4K for 10 hours.

[0077] Repeat steps (a) to (b) above for a total of 10 complete cycles to complete the thermal shock treatment.

[0078] The performance tests of the resin materials obtained in each embodiment and comparative example are shown in Table 1.

[0079] Table 1 As shown in Table 1, the resin material prepared in the embodiments of the present invention exhibits excellent performance in electrical properties (volume resistivity, electrical strength), mechanical properties (flexural strength, impact strength), and adhesive properties (bonding strength). More importantly, even after repeated and severe extreme temperature difference shocks between 4K ultra-low temperature and 40℃ high temperature, the above-mentioned properties of the resin material still maintain a good level, verifying its excellent resistance to extreme thermal cycling conditions.

[0080] The present invention has been described in detail above, with the aim of enabling those skilled in the art to understand and implement the invention. However, this description should not be construed as limiting the scope of protection of the invention. All equivalent changes or modifications made in accordance with the spirit and essence of the invention should be included within the scope of protection of the invention.

Claims

1. A method for preparing a resin material, characterized in that, include: Epoxy resin was reacted with reactive end-capped polysiloxane at a temperature of 110°C to 130°C. After the reaction was completed, the reaction system was cooled to 20°C to 30°C. Polyurethane-modified epoxy resin, phenylboronic acid, and amino-modified boron nitride nanosheets were first added to the reaction system and stirred until homogeneous. Then, an inactive diluent and polyetheramine were added. Finally, molding and curing treatments and low-temperature acclimation treatments were performed sequentially to obtain the resin material. The low-temperature acclimatization includes: placing the cured product after the molding and curing treatment at a first temperature and then at a second temperature, wherein the first temperature is -205℃ to -185℃ and the second temperature is 170℃ to 190℃.

2. The method for preparing the resin material according to claim 1, characterized in that, The heat preservation time at the first temperature is 1h to 3h, and the heat preservation time at the second temperature is 0.5h to 2h.

3. The method for preparing the resin material according to claim 1, characterized in that, The low-temperature acclimatization also includes placing the cured product at a third temperature for insulation after the insulation at the first temperature is completed and before the insulation at the second temperature begins.

4. The method for preparing the resin material according to claim 3, characterized in that, The third temperature is 20℃~30℃; and / or, The heat preservation time at the third temperature is 1 hour to 3 hours.

5. The method for preparing the resin material according to claim 1, characterized in that, The reactive end-capping group of the reactive end-capping polysiloxane is one or more of amino and aminoalkyl groups.

6. The method for preparing the resin material according to claim 1, characterized in that, The main chain structure of the reactive end-capped polysiloxane is polydimethylsiloxane, polymethylphenylsiloxane, or a copolymer of the two.

7. The method for preparing the resin material according to claim 1, characterized in that, The aminated boron nitride nanosheets are prepared by reacting boron nitride nanosheets with a silane coupling agent in the presence of a solvent.

8. The method for preparing the resin material according to claim 7, characterized in that, The silane coupling agent is 3-aminopropyltriethoxysilane; and / or... The mass ratio of the boron nitride nanosheets to the silane coupling agent is 1:(4~7); and / or, The solvent is a mixture of ethanol and water, wherein the volume ratio of ethanol to water is (2~4):1; and / or, The mass ratio of the solvent to the total mass of the boron nitride nanosheets and the silane coupling agent is (3~4):1; and / or, The reaction temperature of the boron nitride nanosheets with the silane coupling agent is 80℃~90℃.

9. The method for preparing the resin material according to claim 1, characterized in that, The epoxy resin is bisphenol F type epoxy resin; and / or... The inactive diluent is propylene glycol methyl ether acetate.

10. The method for preparing the resin material according to claim 1, characterized in that, The molding and curing process includes: placing the system to be cured at 40℃~60℃, then raising the temperature to 100℃~120℃, and holding it at 100℃~120℃ for 1h~3h.

11. The method for preparing the resin material according to any one of claims 1 to 10, characterized in that, The raw materials of the resin material, by weight, include: 40-50 parts epoxy resin 10-30 parts of polyurethane-modified epoxy resin, 20-30 parts of reactive end-capped polysiloxane, 10-15 parts of phenylboronic acid 3-6 parts of aminated boron nitride nanosheets 5-8 parts of polyetheramine, 50-150 parts of non-reactive diluent.

12. A resin material, characterized in that, The resin material is prepared by the preparation method according to any one of claims 1 to 11.

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