Method of manufacturing a mask frame assembly and apparatus for manufacturing a mask frame assembly

Abstract

The present application relates to a method of manufacturing a mask frame assembly and an apparatus for manufacturing a mask frame assembly. The method of manufacturing a mask frame assembly includes preparing a first mask bar disposed on one surface of a mask frame having an opening and a second mask bar crossing the first mask bar, placing a jig clamping the second mask bar at a first position such that the first mask bar and the second mask bar cross at a compensation angle, fixing the first mask bar and the second mask bar forming the compensation angle to each other, moving the jig to a second position, and fixing the second mask bar to one side of the mask frame.

Description

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2025-0020732, filed with the Korean Intellectual Property Office on February 18, 2025, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of this disclosure relate to a method for manufacturing a mask frame assembly and an apparatus for manufacturing a mask frame assembly. Background Technology

[0004] With the widespread use of mobile phones and, more recently, tablet PCs, portable electronic devices have become increasingly common. These mobile devices typically rely on display panels to convey visual information such as images and videos.

[0005] As the internal components used to drive the display panel become smaller, displays now occupy a larger proportion of the entire device. To accommodate this trend, display technology has evolved to include structures capable of bending or flexing from a flat configuration to a curved state.

[0006] Display panels typically generate images by applying a voltage to liquid crystal molecules, altering their alignment. This alteration can affect optical properties (such as birefringence, light polarization, dichroism, or light scattering), which are then translated into visible image changes on the screen.

[0007] Various techniques exist for forming thin films on substrates, including deposition methods that use masks to pattern the material to be deposited. Two types of masks are commonly used: patterned masks, which include multiple patterned holes for forming a light-emitting layer; and open masks, which do not have patterned holes but instead have openings for forming a common layer.

[0008] To simplify manufacturing, the aperture masks are typically large enough to handle multiple display panel sizes simultaneously. These aperture masks are usually welded to the mask frame while a specified tensile force is applied. Summary of the Invention

[0009] Embodiments of this disclosure provide a method for manufacturing a mask frame assembly and an apparatus for manufacturing a mask frame assembly, which is capable of precisely manufacturing the mask frame assembly.

[0010] According to embodiments of the present disclosure, a method for manufacturing a mask frame assembly is provided, the method comprising: preparing a first mask rod and a second mask rod intersecting the first mask rod on a surface of a mask frame having an opening; placing a clamp holding the second mask rod in a first position such that the first mask rod and the second mask rod intersect at a compensation angle; fixing the first mask rod and the second mask rod forming the compensation angle to each other; moving the clamp to a second position; and fixing the second mask rod to a side of the mask frame.

[0011] In some implementations, the first position and the second position may be spaced apart along the direction in which the first mask rod extends.

[0012] In some implementations, the compensation angle may be less than approximately 90 degrees.

[0013] In some implementations, moving the fixture to the second position can be performed after the first and second mask rods have been secured to each other.

[0014] In some implementations, securing the second mask rod to one side of the mask frame can be performed after the fixture has been moved to the second position.

[0015] In some embodiments, the first position may be spaced apart from the second axis, which is perpendicular to the first axis along which the first mask rod extends and passes through the intersection of the first and second mask rods.

[0016] In some implementations, the vertical distance between the first position and the second axis can be greater than the vertical distance between the second position and the second axis.

[0017] In some implementations, when the fixture is moved to the second position, the fixture can rotate the second mask rod in a predetermined direction.

[0018] In some embodiments, when the fixture is moved to the second position, the second mask rod can rotate relative to the intersection of the first and second mask rods.

[0019] In some implementations, the length of the first mask rod may be greater than the length of the second mask rod.

[0020] According to embodiments of the present disclosure, an apparatus for manufacturing a mask frame assembly is provided. The mask frame assembly includes a mask frame having an opening, a first mask rod disposed on the mask frame, and a second mask rod disposed intersecting the first mask rod. The apparatus for manufacturing the mask frame assembly includes: a clamp configured to clamp an end of the second mask rod and movable from a first position to a second position; a fixing device configured to fix the first mask rod and the second mask rod; and a controller configured to control the position of the clamp.

[0021] In some implementations, the first position and the second position may be spaced apart along the direction in which the first mask rod extends.

[0022] In some implementations, the controller may be configured to position the fixture at a first position such that the first mask rod and the second mask rod intersect at a compensation angle of less than about 90 degrees.

[0023] In some implementations, the controller is configured to move the fixture to a second position after the fixing device has secured the first mask rod and the second mask rod to each other.

[0024] In some embodiments, the fixing device may be configured to secure the second mask rod to a side of the mask frame when the clamp is placed in the second position.

[0025] In some embodiments, the first position may be spaced apart from the second axis, which is perpendicular to the first axis along which the first mask rod extends and passes through the intersection of the first and second mask rods.

[0026] In some implementations, the vertical distance between the first position and the second axis can be greater than the vertical distance between the second position and the second axis.

[0027] In some implementations, the controller may be configured to move the clamp from a first position to a second position to rotate the second mask rod in a preset direction.

[0028] In some implementations, the controller may be configured to move the fixture from a first position to a second position such that the second mask rod rotates relative to the intersection of the first and second mask rods.

[0029] In some implementations, the length of the first mask rod may be greater than the length of the second mask rod. Attached Figure Description

[0030] The above and other features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, in which: Figure 1 This is a schematic diagram illustrating an apparatus for manufacturing a mask frame assembly according to an embodiment of the present disclosure; Figure 2 yes Figure 1 A top view of the apparatus used to manufacture mask frame assemblies; Figure 3 This is a flowchart illustrating a method for manufacturing a mask frame assembly according to an embodiment of the present disclosure; Figure 4 It is shown Figure 1The diagram shows a process in which the fixture unit is placed in a first position so that the second mask rod and the first mask rod form a compensating angle. Figure 5 This is a schematic diagram illustrating the process of cutting one side of a second mask rod using a device for manufacturing a mask frame assembly; Figure 6 This is a schematic diagram illustrating the process of moving the fixture unit to the second position; Figure 7 yes Figure 6 A magnified view of part A; Figure 8 This is a schematic diagram illustrating the process of applying tensile force to the second mask rod by the fixture unit; Figure 9 yes Figure 8 A magnified view of part B; Figure 10 This is a schematic diagram illustrating a deposition apparatus according to an embodiment of the present disclosure; Figure 11 It is shown by Figure 10 A schematic diagram illustrating an embodiment of a display device manufactured using a deposition apparatus; and Figure 12 This shows the section intercepted along line VIII-VIII'. Figure 11 A cross-sectional view of a subpixel of a display device. Detailed Implementation

[0031] Embodiments of the present disclosure will be described more fully below with reference to the accompanying drawings. Throughout the drawings, the same reference numerals may denote the same elements.

[0032] It will be understood that the terms “first,” “second,” “third,” etc., are used herein to distinguish one element from another, and these elements are not limited by these terms. Thus, an “first” element in one embodiment may be described as a “second” element in another embodiment.

[0033] It should be understood that, unless the context clearly indicates otherwise, the description of features or aspects within each implementation should generally be considered applicable to other similar features or aspects in other implementations.

[0034] As used in this article, the singular forms “a,” “one,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0035] As used herein, the term “and / or” includes any and all combinations of one or more of the relevant listed items. Expressions such as “at least one of…” following a list of elements modify the entire list, not individual elements within it.

[0036] For ease of description, spatial relative terms such as “below,” “under,” “lower,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature and another element(s) as shown in the figures. It will be understood that, in addition to the orientations depicted in the figures, the spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below,” “under,” or “below” other elements or features will consequently be oriented “above” other elements or features. Thus, the exemplary terms “below” and “below” can encompass both above and below orientations.

[0037] It will be understood that when a component is referred to as being "on," "connected to," "linked to," or "adjacent to" another component, it can be directly on, directly connected to, directly linked to, or directly adjacent to the other component, or there can be intervening components. It will also be understood that when a component is referred to as being "between" two components, it can be the only component between the two components, or there can be one or more intervening components. It will also be understood that when a component is referred to as "covering" another component, it can be the only component covering the other component, or one or more intervening components can also cover the other component. Other terms used to describe relationships between components should be interpreted in a similar manner.

[0038] In this document, when two or more elements or values ​​are described as substantially the same or approximately equal to each other, it will be understood that the elements or values ​​are the same, equal to each other within measurement error, or sufficiently close in value (if measurably unequal) to be functionally equal to each other as will be understood by those skilled in the art. For example, given the measurement in question and the error associated with the measurement of a particular quantity (i.e., limitations of the measurement system), the term “about” as used herein includes the value and means within an acceptable deviation range of a particular value as determined by those skilled in the art. For example, “about” may mean within one or more standard deviations as understood by those skilled in the art, such as ±30%, ±20%, ±10%, or ±5% of the value. Furthermore, it will be understood that when a parameter may be described herein as having a particular value “about”, according to exemplary embodiments, the parameter may be exactly that particular value, or may be approximately that particular value within measurement error as will be understood by those skilled in the art. Other uses of these and similar terms to describe relationships between components should be interpreted in a similar manner.

[0039] In this document, it will be understood that terms such as “including,” “comprising,” and “having” indicate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0040] In the following implementation, unless the context clearly indicates otherwise, terms such as connection or combination do not necessarily refer to a direct and / or fixed connection or combination of two components, and do not exclude the insertion of another component between the two components.

[0041] Embodiments of this disclosure relate to assembling a mask frame using intersecting mask rods that engage at a compensating angle to accommodate deformation during fixation. For example, a method according to an embodiment includes pre-setting the intersection angle between a first mask rod and a second mask rod before applying a tensile force, such that any deformation of the first mask rod during the tensioning of the second mask rod is offset. This method allows the second mask rod to ultimately be substantially parallel to the sides of the mask frame to which it is fixed, although natural deformation may occur when a tensile force is applied.

[0042] By controlling the initial cross angle (referred to as the compensation angle) and coordinating the sequence of clamping, securing, and pulling operations, the method according to the embodiment allows for precise alignment of the mask rods during mask frame assembly. This improves dimensional consistency across the assembly units and reduces the risk of misalignment during deposition processes that rely on strict mask geometry. Therefore, the described apparatus and method for manufacturing mask frame assemblies can achieve repeatable, high-precision assembly of mask frame components using relatively efficient mechanical operations.

[0043] Figure 1 This is a schematic diagram illustrating an apparatus 1 for manufacturing a mask frame assembly according to an embodiment of the present disclosure, and Figure 2 yes Figure 1 The top view of apparatus 1 for manufacturing mask frame assemblies is shown.

[0044] In this paper, a mask frame assembly is used to deposit a deposition material on a substrate, and may include a first mask rod MS1 and a second mask rod MS2 that separate and / or define a deposition area, and a mask frame MF that fixes the first mask rod MS1 and the second mask rod MS2.

[0045] The mask frame MF may have a rectangular shape forming an opening through which deposited material can pass, and for example, the sides forming the mask frame MF may extend in a first direction and a second direction.

[0046] In an implementation, the first mask rod MS1 may be relatively longer than the second mask rod MS2.

[0047] In this paper, "first direction" can be interpreted as the direction along which a side of the mask frame MF extends, and for example, the first direction can be the Y-axis (based on...). Figure 1 (along the direction in which it extends)

[0048] "Second direction" can be interpreted as the direction along which the other side of the mask frame MF extends; for example, the second direction could be the X-axis (based on...). Figure 1 ( ) along the direction in which it extends, and the second direction may be a direction perpendicular to the first direction.

[0049] In this article, references Figure 4 "First axis AX1" can be the longitudinal center axis of the first mask rod MS1, and for example, the first axis AX1 can be an axis extending in a first direction.

[0050] refer to Figure 4 "Second axis AX2" can be the longitudinal center axis of the second mask rod MS2 when the clamping unit 100 (e.g., the second clamp 120) holding the second mask rod MS2 is placed at the second position P2.

[0051] refer to Figure 4 The "third axis AX3" can be the longitudinal center axis of the second mask rod MS2 when the clamping unit 100 (e.g., the second clamp 120) holding the second mask rod MS2 is placed at the first position P1.

[0052] refer to Figure 1 and Figure 2 The apparatus 1 for manufacturing a mask frame assembly according to an embodiment of the present disclosure may include a clamping unit 100, a fixing unit 200 (also referred to as a fixing device) and a controller 300 (also referred to as a controller circuit).

[0053] The clamping unit 100 clamps the first mask rod MS1 and the second mask rod MS2, and may include a first clamp 110 clamping the first mask rod MS1 and a second clamp 120 clamping the second mask rod MS2.

[0054] In this document, clamping unit 100 may be interpreted as a term referring to the first clamp 110 or the second clamp 120, or as a term generally referring to the first clamp 110 and the second clamp 120. For example, clamping unit 100 may also be referred to herein as a clamp.

[0055] The first clamp 110 can hold the end of the first mask rod MS1. For example, multiple first clamps 110 can be provided, and multiple first clamps 110 can respectively hold opposite ends of the first mask rod MS1.

[0056] The first clamp 110 can move linearly in a first direction and / or a second direction. For example, the first clamp 110 can be powered from an external source and move linearly in the first direction and / or the second direction.

[0057] A plurality of first clamps 110 holding opposite ends of the first mask rod MS1 can move away from each other in a first direction, thereby applying a tensile force to the first mask rod MS1 in the first direction.

[0058] Therefore, when the first clamp 110 moves in the first direction and applies a tensile force to the first mask rod MS1, the fixing unit 200 can fix the first mask rod MS1, to which the tensile force is applied, to the mask frame MF, which can reduce the phenomenon of the first mask rod MS1 fixed to the mask frame MF sagging.

[0059] Multiple first clamps 110 that hold opposite ends of the first mask rod MS1 can move in a second direction, which allows for precise adjustment of the position of the first mask rod MS1 in the second direction.

[0060] The controller 300 can adjust the position of the first clamp 110, and for example, the controller 300 can simultaneously control the positions of multiple first clamps 110 that hold opposite ends of the first mask rod MS1.

[0061] The controller 300 can control the first clamp 110 holding the opposite end of the first mask rod MS1 to move in the same direction.

[0062] For example, the controller 300 can control the second clamp 120 holding the opposite end of the second mask rod MS2 to move in opposite directions based on the opening of the mask frame MF, and the controller 300 can control the first clamp 110 holding the opposite end of the first mask rod MS1 to move in the same direction based on the opening of the mask frame MF.

[0063] Therefore, the first clamp 110 can move the first mask rod MS1 parallel in the first direction and / or the second direction, and the second clamp 120 can rotate the second mask rod MS2, so that the angle formed between the first mask rod MS1 and the second mask rod MS2 can be changed.

[0064] After the first mask rod MS1 and the second mask rod MS2 are fixed, the movement of the first clamp 110 in the second direction can be restricted.

[0065] For example, after the fixing unit 200 fixes the first mask rod MS1 and the second mask rod MS2 to each other, the controller 300 can restrict the first clamp 110 from moving in the second direction.

[0066] For example, after the fixing unit 200 fixes the first mask rod MS1 and the second mask rod MS2 to each other, the controller 300 can control the second clamp 120 to move from the first position P1 to the second position P2, and at the same time, the controller 300 can restrict the first clamp 110 from moving in the second direction.

[0067] The movement of the first clamp 110 can be restricted between the time when the first mask rod MS1 and the second mask rod MS2 are fixed and the time when the tensile force is applied to the first mask rod MS1.

[0068] For example, between the time when the first mask rod MS1 and the second mask rod MS2 are fixed and the time when the tensile force is applied to the first mask rod MS1, the second clamp 120 holding the second mask rod MS2 can move from the first position P1 to the second position P2, and at the same time, the movement of the first clamp 110 can be restricted.

[0069] For example, between the time when the fixing unit 200 fixes the first mask rod MS1 and the second mask rod MS2 and the time when the clamping unit 100 applies a tensile force to the first mask rod MS1 and the second mask rod MS2, the controller 300 can control the second clamp 120 holding the second mask rod MS2 to move from the first position P1 to the second position P2, and at the same time, the controller 300 can restrict the movement of the first clamp 110.

[0070] The clamping unit 100 can clamp the end of the second mask rod MS2 and can move from the first position P1 to the second position P2. For example, the second clamp 120 can clamp the end of the second mask rod MS2 and can move from the first position P1 to the second position P2 while clamping the second mask rod MS2.

[0071] In this paper, "first position P1" is defined as the position of the second clamp 120 where the first mask rod MS1 and the second mask rod MS2 form a compensation angle CA.

[0072] "Second position P2" is defined as the position where the second clamp 120 applies a tensile force to the second mask rod MS2 and / or the position where a side of the second clamp 120 is positioned in the engagement area of ​​the mask frame MF.

[0073] In this article, the “joining area” can be interpreted as the area on the mask frame MF where the second mask rod MS2 contacts it and is fixed to it by the fixing unit 200.

[0074] The second clamp 120 can clamp the end of the second mask rod MS2. For example, multiple second clamps 120 can be provided, and multiple second clamps 120 can respectively clamp the opposite ends of the second mask rod MS2.

[0075] The second clamp 120 can move linearly in a first direction and / or a second direction. For example, the second clamp 120 can be powered from an external source and move linearly in the first direction and / or the second direction.

[0076] The plurality of second clamps 120 holding the opposite ends of the second mask rod MS2 can move away from each other in a second direction, which can apply a tensile force to the second mask rod MS2 in the second direction.

[0077] Therefore, when the second clamp 120 moves in the second direction and applies a tensile force to the second mask rod MS2, the fixing unit 200 can fix the second mask rod MS2, to which the tensile force is applied, to the mask frame MF, which can reduce the phenomenon of the second mask rod MS2 fixed to the mask frame MF sagging.

[0078] Multiple second clamps 120 holding the opposite ends of the second mask rod MS2 can move in a first direction, which allows for precise adjustment of the position of the second mask rod MS2 in the first direction.

[0079] The controller 300 can adjust the position of the second clamp 120, and for example, the controller 300 can simultaneously control the positions of multiple second clamps 120 that hold opposite ends of the second mask rod MS2.

[0080] For example, the controller 300 can control the second clamp 120 holding the opposite end of the second mask rod MS2 to move in opposite directions based on the opening of the mask frame MF.

[0081] Therefore, the second clamp 120 holding the opposite end of the second mask rod MS2 can move in opposite directions to rotate the second mask rod MS2. This can adjust the angle formed by the first mask rod MS1 and the second mask rod MS2 in order to pre-compensate for the angle of the first mask rod MS1 twisting during the process of tensioning the second mask rod MS2.

[0082] refer to Figure 1 According to the embodiments of the present disclosure, the fixing unit 200 can fix the first mask rod MS1 and the second mask rod MS2 to each other.

[0083] For example, the fixing unit 200 can be located in the area where the first mask rod MS1 intersects with the second mask rod MS2 (hereinafter referred to as the "intersection point CP") (see [reference]). Figure 4 In the process, the first mask rod MS1 is fixed to the second mask rod MS2.

[0084] The fixing unit 200 can fix the first mask rod MS1 to one side of the mask frame MF, and the fixing unit 200 can fix the second mask rod MS2 to the other side of the mask frame MF.

[0085] The fixing unit 200 may include various devices capable of fixing the first mask rod MS1 and the second mask rod MS2 to each other or to the mask frame MF. For example, the fixing unit 200 may include a laser welding apparatus, a tungsten inert gas (TIG) welding apparatus, a metallic inert gas (MIG) welding apparatus, a resistance welding apparatus, an ultrasonic welding apparatus, an electron beam welding apparatus, a plasma arc welding apparatus, and a spot welding apparatus. The fixing unit 200 may also be referred to as a fixing device.

[0086] refer to Figure 1 and Figure 2 According to the embodiments of the present disclosure, the controller 300 can control the position of the clamping unit 100.

[0087] For example, the controller 300 can adjust the angle formed by the first mask rod MS1 and the second mask rod MS2 by controlling the position of the clamping unit 100, apply a tensile force to the first mask rod MS1 and / or the second mask rod MS2, or move the end of the second mask rod MS2 to the engagement area of ​​the mask frame MF.

[0088] For example, according to an embodiment, by fixing the first mask rod MS1 and the second mask rod MS2 to each other while positioning the second clamp 120 at the first position P1, the two mask rods can be welded together at a compensation angle CA that is intentionally deviated from a right angle. This pre-applied angle may be formed taking into account the possibility of deformation of the first mask rod MS1 when tensile force is subsequently applied to the second mask rod MS2, and can be selected such that the second mask rod MS2 is eventually aligned parallel to the mask frame MF after deformation.

[0089] According to one embodiment, the controller 300 can be configured to move the second clamp 120 from the first position P1 to the second position P2 only after the first mask rod MS1 and the second mask rod MS2 have been fixed together. This sequence allows the predetermined compensation angle CA to be maintained during the repositioning of the second mask rod MS2 in preparation for final fixation to the mask frame MF. By maintaining the compensation angle CA via this controlled repositioning operation, the apparatus 1 for manufacturing the mask frame assembly can ensure that the second mask rod MS2 is ultimately aligned parallel to the mask frame MF even if there is bending or twisting in the first mask rod MS1.

[0090] The method of controlling the position of the fixture unit 100 by the controller 300 is described in detail below when describing the method of manufacturing the mask frame assembly.

[0091] Figure 3 This is a flowchart illustrating a method for manufacturing a mask frame assembly according to an embodiment of the present disclosure.

[0092] refer to Figure 3 A method for manufacturing a mask frame assembly according to an embodiment of the present disclosure may include: preparing a first mask rod MS1 and a second mask rod MS2 intersecting the first mask rod MS1 on one surface of a mask frame MF having an opening (S100); arranging a clamping unit 100 holding the second mask rod MS2 in a first position P1 such that the first mask rod MS1 intersects the second mask rod MS2 to form a compensation angle CA (S200); fixing the first mask rod MS1 and the second mask rod MS2 to each other while forming the compensation angle CA (S300); moving the clamping unit 100 to a second position P2 (S400); and fixing the second mask rod MS2 to a side of the mask frame MF (S500).

[0093] When the second mask rod MS2 is fixed to the first mask rod MS1 at the intersection CP and then a tensile force is applied to the second mask rod MS2, the first mask rod MS1, which is fixed to the second mask rod MS2, can be twisted by a predetermined angle due to the tensile force.

[0094] For example, due to the tensile force applied to the second mask rod MS2, one side of the first mask rod MS1 can deform in the direction of the tensile force, and therefore, the second mask rod MS2, which is fixed to one side of the first mask rod MS1, can be bent or deformed.

[0095] Therefore, due to at least one of the deformations of the first mask rod MS1 and the second mask rod MS2, a twist may occur relative to the first axis AX1 on one side of the first mask rod MS1, which is fixed to the second mask rod MS2 (see [link]). Figure 8 and Figure 9 ).

[0096] Due to the torsional deformation on one side of the first mask rod MS1, the second mask rod MS2, which is fixed to one side of the first mask rod MS1, may be biased towards one side of the mask frame MF. This may lead to design errors, such as the second mask rod MS2 being arranged not parallel to one side of the mask frame MF.

[0097] According to the apparatus 1 and method for manufacturing a mask frame assembly according to embodiments of the present disclosure, a second mask rod MS2 is fixed to a first mask rod MS1 such that the second mask rod MS2 and the first mask rod MS1 form a compensation angle CA to pre-compensate (correct) the deformation angle in the first mask rod MS1 and / or the second mask rod MS2. Therefore, even if deformation occurs, the second mask rod MS2 can be manufactured such that it is completely parallel or nearly parallel to a side of the mask frame MF. A detailed description is provided below.

[0098] In the operation (S100) of preparing the first mask rod MS1 and the second mask rod MS2 that intersects with the first mask rod MS1, the controller 300 can control the operation of the fixture unit 100 to mount the first mask rod MS1 and the second mask rod MS2 on a surface of the mask frame MF.

[0099] According to an embodiment, in this method, taking into account the deformation of the first mask rod MS1 caused by the tensile force applied to the second mask rod MS2, the operation of placing the jig unit 100 at the first position P1 (S200) is performed before welding to introduce a compensation angle CA. This pre-positioning operation allows the mask rods to engage with an intentional angular offset (which is selected based on the anticipated mechanical behavior).

[0100] As a result, according to the implementation method, the entire manufacturing sequence from operation S100 to operation S500 can achieve correction of the post-weld bending effect without repeated adjustments. By creating a process that incorporates geometry compensation before applying tensile force, this method can achieve parallel alignment of the second mask rod MS2 with the mask frame MF in a single streamlined operation.

[0101] Figure 4 It is shown Figure 1 The diagram shows a process in which the fixture unit 100 is placed at the first position P1 such that the second mask rod MS2 and the first mask rod MS1 form a compensation angle CA.

[0102] The operation of placing the fixture unit 100 at the first position P1 can be performed before the operation of fixing the first mask rod MS1 and the second mask rod MS2 to each other (S300).

[0103] refer to Figure 3 and Figure 4 In the operation of placing the fixture unit 100 at the first position P1 (S200), the controller 300 can place the second fixture 120 at the first position P1, so that the first mask rod MS1 and the second mask rod MS2 form a compensation angle CA.

[0104] For example, the controller 300 can move the position of the second clamp 120 holding the second mask rod MS2 to the first position P1, so that the first mask rod MS1 and the second mask rod MS2 form a compensation angle CA based on the intersection point CP.

[0105] In this paper, the “compensation angle CA” is the angle formed by the first mask rod MS1 and the second mask rod MS2, in order to pre-compensate for the deformation that occurs in the first mask rod MS1 and / or the second mask rod MS2 due to the tensile force applied to the second mask rod MS2.

[0106] For example, the compensation angle CA can be approximately equal to or similar to the angle at which a side of the first mask rod MS1, which is fixed to the second mask rod MS2 and is perpendicular to each other, twists or rotates when a tensile force is applied to the second mask rod MS2.

[0107] In implementation, the compensation angle CA can be less than about 90 degrees. For example, the compensation angle CA can be greater than or equal to about 85 degrees and less than or equal to about 90 degrees.

[0108] In the operation of placing the fixture unit 100 at the first position P1 (S200), the controller 300 can place the second fixture 120 at the first position P1, so that the second mask rod MS2 is placed along the third axis AX3.

[0109] In this paper, the "third axis AX3" is defined as the axis that passes through the intersection point CP and forms a compensation angle CA with the first axis AX1.

[0110] The first position P1 may be spaced apart from the second position P2, and for example, the first position P1 may be spaced apart from the second position P2 along the direction in which the first mask rod MS1 extends.

[0111] The first position P1 can be spaced apart from the second axis AX2, which is perpendicular to the first mask rod MS1 along its extension and passes through the intersection point CP of the first mask rod MS1 and the second mask rod MS2.

[0112] The vertical distance between the first position P1 and the second axis AX2 can be relatively greater than the vertical distance between the second position P2 and the second axis AX2. For example, the second position P2 can be arranged on the second axis AX2, and the first position P1 can be spaced apart from the second axis AX2.

[0113] In the operation (S300) of fixing the first mask rod MS1 and the second mask rod MS2 to each other when forming a compensation angle CA, the fixing unit 200 can fix the first mask rod MS1 and the second mask rod MS2 to each other at the intersection point CP.

[0114] The controller 300 can control the operation of the fixing unit 200 to fix the first mask rod MS1 and the second mask rod MS2 to each other when a compensation angle CA is formed. For example, the fixing unit 200 can weld the first mask rod MS1 and the second mask rod MS2 at the intersection CP, thereby fixing the first mask rod MS1 and the second mask rod MS2 to each other when a compensation angle CA is formed.

[0115] The operation of fixing the first mask rod MS1 and the second mask rod MS2 to each other (S300) can be performed after the operation of placing the fixture unit 100 at the first position P1 (S200).

[0116] The operation of fixing the first mask rod MS1 and the second mask rod MS2 to each other (S300) can be performed before the operation of moving the fixture unit 100 to the second position P2 (S400).

[0117] In the operation (S300) of fixing the first mask rod MS1 and the second mask rod MS2 to each other, the second clamp 120 can be placed at the first position P1.

[0118] In the operation (S300) of fixing the first mask rod MS1 and the second mask rod MS2 to each other, the controller 300 can place the second clamp 120 at the first position P1 and control the operation of the second clamp 120.

[0119] In the operation (S300) of fixing the first mask rod MS1 and the second mask rod MS2 to each other, the movement of the first clamp 110 and the second clamp 120 can be restricted. For example, when the first mask rod MS1 and the second mask rod MS2 are fixed to each other, the controller 300 can restrict the movement or rotation of the first clamp 110 and the second clamp 120.

[0120] According to the embodiment, the use of the first position P1 when fixing the second mask rod MS2 to the first mask rod MS1 allows the compensation angle CA to be physically set during welding. If the second fixture 120 is instead placed at the second position P2 corresponding to the final alignment target, the angle generated at the intersection CP will be vertical and will not provide compensation for deformation.

[0121] In this embodiment, by fixing the mask rod when the second clamp 120 is positioned at the first position P1, and then moving the second clamp 120 to the second position P2 before applying a tensile force, the structure temporarily maintains the geometry of the intentionally offset compensation angle CA. When a tensile force is subsequently applied to the second mask rod MS2, the deformation of the first mask rod MS1 causes the second mask rod MS2 to rotate as desired to a state of parallel alignment with the mask frame MF.

[0122] Figure 5 This is a schematic diagram illustrating the process of cutting a side of the second mask rod MS2 using the apparatus 1 for manufacturing a mask frame assembly.

[0123] refer to Figure 5After the first mask rod MS1 and the second mask rod MS2 are fixed to each other, the controller 300 can cut one side of the second mask rod MS2. For example, after the first mask rod MS1 and the second mask rod MS2 are fixed to each other at a compensation angle CA, the controller 300 can use a cutting unit to cut one side of the second mask rod MS2.

[0124] Therefore, by performing the process of fixing the second mask rod MS2 to the first mask rod MS1 and cutting the second mask rod MS2, the mask frame assembly can be separated from each other to form multiple deposition openings with a preset width.

[0125] According to the implementation, cutting one side of the second mask rod MS2 after fixing it at the compensation angle CA also allows the individual segments of the second mask rod MS2 to respond more predictably to subsequent tensile forces applied during final assembly. By separating the second mask rod MS2 into discrete segments between the intersection points CP, each segment can be better aligned with the corresponding engagement area of ​​the mask frame MF, thereby contributing to a uniform deposition geometry throughout the entire mask frame assembly.

[0126] Figure 6 This is a schematic diagram illustrating the process of the fixture unit 100 moving to the second position P2, and Figure 7 yes Figure 6 An enlarged view of part A in the image.

[0127] refer to Figure 3 , Figure 6 and Figure 7 In the operation of moving the clamp unit 100 to the second position P2 (S400), the controller 300 can move the second clamp 120 holding the second mask rod MS2 to the second position P2.

[0128] In the operation of moving the clamp unit 100 to the second position P2 (S400), the controller 300 can move the second clamp 120 from the first position P1 to the second position P2, and can restrict the movement of the first clamp 110.

[0129] The operation of moving the fixture unit 100 to the second position P2 (S400) can be performed after cutting the second mask rod MS2.

[0130] The operation of moving the fixture unit 100 to the second position P2 (S400) can be performed before the operation of fixing the second mask rod MS2 to one side of the mask frame MF (S500).

[0131] The operation of moving the clamp unit 100 to the second position P2 (S400) can be performed before the tensile force is applied to the second mask rod MS2. For example, the controller 300 can move the second clamp 120 from the first position P1 to the second position P2 before the tensile force is applied to the second mask rod MS2 by moving the second clamp 120 in the second direction.

[0132] In the operation (S400) of moving the fixture unit 100 to the second position P2, the second fixture 120 can rotate the second mask rod MS2 in a preset direction. For example, the second fixture 120 can rotate the second mask rod MS2 based on the intersection point CP of the first mask rod MS1 and the second mask rod MS2.

[0133] For example, the end of the second clamp 120, which is positioned on the mask frame MF, can be rotated based on the intersection point CP of the first mask rod MS1 and the second mask rod MS2.

[0134] The second position P2 can be located on the second axis AX2.

[0135] An imaginary line passing through the intersection CP of the first mask rod MS1 and the second mask rod MS2, and the second position P2, can be perpendicular to the first axis AX1.

[0136] In the operation (S400) of moving the clamp unit 100 to the second position P2, the second clamp 120 can move from the first position P1 to the second position P2 in the first direction, and for example, the controller 300 can control the operation of the second clamp 120 so that the second clamp 120 moves from the first position P1 to the second position P2 in the first direction.

[0137] In this case, even if the second clamp 120 clamps the end of the second mask rod MS2 and moves to the second position P2, because the second mask rod MS2 is fixed to the first mask rod MS1 while forming a compensation angle CA with the first mask rod MS1, the second mask rod MS2 still forms a compensation angle CA with the first mask rod MS1 at the intersection point CP.

[0138] Furthermore, since no tensile force is applied to the second mask rod MS2 during the operation (S400) of moving the fixture unit 100 to the second position P2, one side of the first mask rod MS1 to which the second mask rod MS2 is connected can still extend along the first axis AX1, and the end of the second mask rod MS2 fixed to one side of the first mask rod MS1 can extend along the third axis AX3.

[0139] In this embodiment, because the second mask rod MS2 is connected to one side of the first mask rod MS1 at a compensation angle CA, even if the second clamp 120 moves to the second position P2 (i.e., the point on the second axis AX2), the end of the second mask rod MS2 connected to the first mask rod MS1 can extend along the third axis AX3.

[0140] According to the embodiment, by performing the movement of the second clamp 120 from the first position P1 to the second position P2 before applying tensile force, the apparatus 1 for manufacturing the mask frame assembly can distinguish the mechanical repositioning of the second mask rod MS2 from any stress-induced deformation. This controlled movement allows the compensation angle CA, which is pre-defined to counteract the expected deformation, to be maintained at the intersection CP throughout the clamping transition. As a result, the compensation angle CA remains unchanged even when the clamp unit 100 is rotated to a position aligned with the expected mounting direction.

[0141] According to the implementation, this method can help improve the alignment of the second mask rod MS2 relative to one side of the mask frame MF. Because the compensation angle CA is held during the transition from the first position P1 to the second position P2 and before the application of tension force, the second mask rod MS2 can ultimately be tensioned and fixed in such a way that its longitudinal axis is parallel to or nearly parallel to the corresponding edge of the mask frame MF. This can reduce design errors caused by undesirable deflection or angular misalignment and allows for the consistent formation of deposition openings with uniform width.

[0142] Figure 8 This is a schematic diagram illustrating the process by which the fixture unit 100 applies a tensile force to the second mask rod MS2, and Figure 9 yes Figure 8 A magnified view of part B.

[0143] refer to Figure 3 and Figure 8 In the operation (S500) of fixing the second mask rod MS2 to one side of the mask frame MF, the second clamp 120 can apply a tensile force to the second mask rod MS2.

[0144] For example, the controller 300 can move the second clamp 120 located at the second position P2 in the second direction, thereby the controller 300 can apply a tensile force to the second mask rod MS2 held by the second clamp 120.

[0145] refer to Figure 3 and Figure 9 In this case, one side of the first mask rod MS1 located at the intersection CP may deform toward the second clamp 120 due to the tensile force applied to the second mask rod MS2.

[0146] For example, due to the tensile force applied to the second mask rod MS2, a side of the first mask rod MS1 may be twisted or rotated by a predetermined angle.

[0147] However, because the second mask rod MS2 is fixed to the first mask rod MS1 at a compensation angle CA rather than at a right angle to pre-correct / compensate for the torsional and / or rotational deformation angle of the first mask rod MS1, the second mask rod MS2, which forms the compensation angle CA on one side of the first mask rod MS1 in which deformation has occurred, can be positioned parallel to or almost parallel to one side of the mask frame MF.

[0148] In the operation (S500) of fixing the second mask rod MS2 to one side of the mask frame MF, the fixing unit 200 can fix one side of the second mask rod MS2 to the mask frame MF while the second clamp 120 applies a tensile force to the second mask rod MS2.

[0149] The method for manufacturing a mask frame assembly according to embodiments of the present disclosure and the apparatus 1 for manufacturing a mask frame assembly can achieve the effect of accurately manufacturing a mask frame assembly by combining a first mask rod MS1 and a second mask rod MS2 by using a preset or calculated compensation angle CA.

[0150] According to the implementation method, the compensation angle CA can be determined based on a known or experimentally derived correlation between the tensile force applied to the second mask rod MS2 and the final deformation angle of the first mask rod MS1 at the intersection CP. For example, the compensation angle CA can be calculated based on one or more of the tensile modulus of the mask rod material, the dimensions of the mask rod, the clamping geometry, and the expected magnitude and direction of the applied tensile force. By setting the compensation angle CA accordingly, the final position of the second mask rod MS2 can be predicted and controlled with high precision.

[0151] By incorporating a compensation angle CA into the initial fixing of the second mask rod MS2 to the first mask rod MS1, the apparatus 1 and method for manufacturing a mask frame assembly according to the embodiment can eliminate the need for repeated feedback or realignment steps after assembly to correct misalignment caused by deformation. This can facilitate repeatable, high-throughput manufacturing of the mask frame assembly while reducing deviations in pattern accuracy, which can improve production yield and apparatus quality in downstream processes.

[0152] Figure 10 This is a schematic diagram showing a deposition apparatus 600 according to an embodiment of the present disclosure.

[0153] refer to Figure 10 The deposition apparatus 600 includes a vacuum chamber 620 for depositing a cathode or common layer (such as a portion of an intermediate layer) of an organic light-emitting display device.

[0154] A deposition source 630 may be located at the bottom of a vacuum chamber 620. A mask frame assembly may be mounted on the deposition source 630. Mask rods MS1 and MS2 may be mounted on a mask frame MF. The mask frame MF may have multiple openings corresponding to multiple deposition areas for simultaneously fabricating multiple unit display devices. A deposition substrate 1000 may be located on the mask rods MS1 and MS2. A magnet 610 may be mounted on the deposition substrate 1000, which generates magnetic force to attach the mask rods MS1 and MS2 to the deposition substrate 1000.

[0155] When the deposited material is ejected from the deposition source 630 toward the mask rods MS1 and MS2, the deposited material traveling through the opening OP1 of the mask frame MF passes through the opening OP2 formed in the mask rods MS1 and MS2 and is deposited on a surface of the deposition substrate 1000.

[0156] Figure 11 It is shown by Figure 10 A schematic diagram illustrating an embodiment of a display device DS manufactured by the deposition apparatus 600 shown, and Figure 12 This shows the section intercepted along line VIII-VIII'. Figure 11 A cross-sectional view of a subpixel of a display device DS.

[0157] refer to Figure 11 A display device DS manufactured according to embodiments of the present disclosure may include a display area DA and a peripheral area PA located outside the display area DA. The display device DS may provide an image by means of an array of a plurality of pixels PX arranged in two dimensions in the display area DA.

[0158] The peripheral area PA is the area where no image is provided, and it may completely or partially surround the display area DA. Within the peripheral area PA, drivers and other devices for providing electrical signals or power to the pixel circuits corresponding to pixels PX can be provided. Pads (areas to which electronic components or printed circuit boards can be electrically connected) can also be provided within the peripheral area PA.

[0159] In the following description, the display device DS is described as including an organic light-emitting diode (OLED) as a light-emitting element, but the display device DS disclosed herein is not limited thereto.

[0160] In this embodiment, the display device DS may be a light-emitting display device including an inorganic light-emitting diode (e.g., an inorganic light-emitting display device). The inorganic light-emitting diode may include a PN diode comprising a material based on inorganic semiconductors.

[0161] When a voltage is applied to a PN junction diode in the forward direction, holes and electrons are injected. The energy generated by the recombination of holes and electrons can be converted into light energy, thereby emitting light in a specific color. The aforementioned inorganic light-emitting diodes can have widths ranging from several micrometers to hundreds of micrometers, and in some embodiments, inorganic light-emitting diodes can be referred to as micrometer LEDs.

[0162] In an implementation, the display device DS may be a quantum dot light-emitting display.

[0163] Display devices (DS) can be used as displays for a variety of products, such as televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices, as well as portable electronic devices, such as mobile phones, smartphones, tablet PCs, mobile communication terminals, e-notebooks, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs).

[0164] Furthermore, the display device DS according to the embodiments can be used in wearable devices such as smartwatches, smartwatch phones, glasses displays, and head-mounted displays (HMDs).

[0165] Furthermore, the display device DS according to the embodiments can be used as, for example, a vehicle's dashboard, a central information display (CID) placed on the vehicle's central instrument panel or dashboard, an interior mirror display replacing the vehicle's side mirrors, and a display screen placed on the back of the front seat as an entertainment device for the vehicle's rear seats.

[0166] refer to Figure 12 The display device DS may include a stacked structure of substrate 1000, pixel circuit layer PCL, display element layer DEL and encapsulation layer 3000.

[0167] The substrate 1000 may have a multilayer structure, including a base layer comprising a polymer resin and an inorganic layer. For example, the substrate 1000 may include a barrier layer comprising a base layer comprising a polymer resin and an inorganic insulating layer.

[0168] For example, substrate 1000 may include a first base layer 1010, a first barrier layer 1020, a second base layer 1030, and a second barrier layer 1040 stacked sequentially. The first base layer 1010 and the second base layer 1030 may include, for example, polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), and / or cellulose acetate propionate (CAP).

[0169] The first barrier layer 1020 and the second barrier layer 1040 may include inorganic insulating materials, such as silicon oxide, silicon oxynitride and / or silicon nitride. The substrate 1000 may have flexible properties (e.g., the substrate 1000 may be a flexible substrate).

[0170] The pixel circuit layer PCL is disposed on the substrate 1000. Figure 12 The pixel circuit layer PCL shown includes a thin-film transistor (TFT) and a buffer layer 1110, a first gate insulating layer 1120, a second gate insulating layer 1130, an interlayer insulating layer 1140, a first planarization insulating layer 1150, and a second planarization insulating layer 1160 disposed below and / or above the components of the TFT. However, the embodiments are not limited thereto.

[0171] The buffer layer 1110 can reduce or block the infiltration of foreign matter, moisture or external air from below the substrate 1000 and provide a flat surface on the substrate 1000.

[0172] The buffer layer 1110 may include inorganic insulating materials, such as silicon oxide, silicon oxynitride, or silicon nitride, and may be formed as a single-layer or multi-layer structure including the aforementioned materials.

[0173] In an embodiment, the thin-film transistor (TFT) disposed on the buffer layer 1110 may include a semiconductor layer Act, and the semiconductor layer Act may include polysilicon.

[0174] In implementation, the semiconductor layer Act may include, for example, amorphous silicon, oxide semiconductor, organic semiconductor, etc.

[0175] The semiconductor layer Act may include a channel region C and a drain region D and a source region S disposed on opposite sides of the channel region C. The gate electrode GE may overlap with the channel region C.

[0176] The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include conductive materials, such as molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and the gate electrode GE may be formed as a multilayer or a single layer comprising these materials.

[0177] The first gate insulating layer 1120 disposed between the semiconductor layer Act and the gate electrode GE may include an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiN). X ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) X For example, zinc oxide (ZnO) X This may include zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0178] The second gate insulating layer 1130 may cover the gate electrode GE. Similar to the first gate insulating layer 1120, the second gate insulating layer 1130 may include an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiN). X ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) X For example, zinc oxide (ZnO) X This may include zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0179] An upper electrode Cst2 of the storage capacitor Cst can be disposed on the second gate insulating layer 1130. The upper electrode Cst2 can overlap with the gate electrode GE below the upper electrode Cst2. The overlapping gate electrode GE and the upper electrode Cst2 can together with the second gate insulating layer 1130 therebetween form the storage capacitor Cst. That is, the gate electrode GE can be used as the lower electrode Cst1 of the storage capacitor Cst.

[0180] In this way, the storage capacitor Cst and the thin-film transistor TFT can be formed to overlap each other. In some embodiments, the storage capacitor Cst can be formed not to overlap with the thin-film transistor TFT.

[0181] The upper electrode Cst2 may include, for example, aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or multiple layers of the aforementioned materials.

[0182] The interlayer insulating layer 1140 may cover the upper electrode Cst2. The interlayer insulating layer 1140 may include, for example, silicon oxide (SiO2) or silicon nitride (SiN). X ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) X Zinc oxide (ZnO) X The interlayer insulation layer 1140 may include zinc oxide (ZnO) and / or zinc peroxide (ZnO2). The interlayer insulation layer 1140 may be a single layer or multiple layers comprising the aforementioned inorganic insulating material.

[0183] The drain electrode DE and the source electrode SE can each be positioned on the interlayer insulating layer 1140. The drain electrode DE and the source electrode SE can be connected to the drain region D and the source region S respectively through contact holes formed in the insulating layer beneath the drain electrode DE and the source electrode SE. The drain electrode DE and the source electrode SE can include materials with good conductivity. The drain electrode DE and the source electrode SE can include conductive materials (including, for example, molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc.), and can be formed as multiple layers or a single layer comprising the above materials. As an example, the drain electrode DE and the source electrode SE can have a Ti / Al / Ti multilayer structure.

[0184] The first planarization insulating layer 1150 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 1150 may include an organic insulator, such as a general polymer (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorinated polymer, a p-xylene polymer, a vinyl alcohol polymer, and blends thereof.

[0185] The second planarization insulating layer 1160 may be disposed on the first planarization insulating layer 1150. The second planarization insulating layer 1160 may include the same material as the first planarization insulating layer 1150, and may include organic insulators, such as general polymers (e.g., PMMA or PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and blends thereof.

[0186] The display element layer (DEL) can be disposed on the pixel circuit layer (PCL) of the aforementioned structure. The display element layer (DEL) may include an organic light-emitting diode (OLED) as a display element (e.g., a light-emitting element), and the OLED may include a stacked structure of pixel electrodes 2100, an intermediate layer 2200, and a common electrode 2300. The OLED may emit, for example, red, green, or blue light, or it may emit red, green, blue, or white light. The OLED can emit light through a light-emitting region, and the light-emitting region may be defined as a pixel (PX).

[0187] The pixel electrode 2100 of the organic light-emitting diode (OLED) can be electrically connected to the thin-film transistor (TFT) through contact holes formed in the second planarization insulating layer 1160 and the first planarization insulating layer 1150 and contact metal CM disposed on the first planarization insulating layer 1150.

[0188] Pixel electrode 2100 may include conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In embodiments, pixel electrode 2100 may include, for example, a reflective film, which includes silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. In embodiments, pixel electrode 2100 may further include a film formed of ITO, IZO, ZnO, or In2O3 above / below the aforementioned reflective film.

[0189] A pixel defining film 1170 is disposed on the pixel electrode 2100, the pixel defining film 1170 having an opening 1170P exposing a central portion of the pixel electrode 2100. The pixel defining film 1170 may comprise an organic insulating material and / or an inorganic insulating material. The opening 1170P may define a light-emitting region for light emitted from an organic light-emitting diode (OLED). For example, the size / width of the opening 1170P may correspond to the size / width of the light-emitting region. Therefore, the size and / or width of the pixel PX may depend on the size and / or width of the opening 1170P of the corresponding pixel defining film 1170.

[0190] The intermediate layer 2200 may include a light-emitting layer 2220 formed corresponding to the pixel electrode 2100. In one embodiment, the light-emitting layer 2220 may include a polymer or a low-molecular-weight organic material that emits light in a specific color. In another embodiment, the light-emitting layer 2220 may include an inorganic light-emitting material or may include quantum dots.

[0191] In an embodiment, the intermediate layer 2200 may include a first functional layer 2210 and a second functional layer 2230 positioned below and above the light-emitting layer 2220, respectively. For example, the first functional layer 2210 may include a hole transport layer (HTL), or may include a hole transport layer (HTL) and a hole injection layer (HIL). The second functional layer 2230 is a component positioned on the light-emitting layer 2220 and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer 2210 and / or the second functional layer 2230 may be a common layer formed to cover the entire substrate 1000, similar to the common electrode 2300 described below.

[0192] A common electrode 2300 may be disposed on and overlap with the pixel electrode 2100. The common electrode 2300 may include a conductive material with a low work function. For example, in one embodiment, the common electrode 2300 may include a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. In another embodiment, the common electrode 2300 may further include a layer such as ITO, IZO, ZnO, or In2O3 disposed on the (semi-)transparent layer comprising the aforementioned materials. The common electrode 2300 may be integrally formed to cover the entire substrate 1000.

[0193] The encapsulation layer 3000 is disposed on the display element layer DEL and may cover the display element layer DEL. The encapsulation layer 3000 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer, and as an example, Figure 12 The encapsulation layer 3000 is shown to include a first inorganic encapsulation layer 3100, an organic encapsulation layer 3200, and a second inorganic encapsulation layer 3300, which are stacked sequentially.

[0194] The first inorganic encapsulation layer 3100 and the second inorganic encapsulation layer 3300 may comprise one or more inorganic materials, including, for example, alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 3200 may comprise a polymer-based material. Polymer-based materials may include, for example, acrylic resins, epoxy resins, polyimides, and polyethylene. In an embodiment, the organic encapsulation layer 3200 may comprise acrylates. The organic encapsulation layer 3200 may be formed by curing monomers or applying polymers. The organic encapsulation layer 3200 may have transparency.

[0195] In an embodiment, a touch sensor layer may be disposed on the encapsulation layer 3000, and an optical functional layer may be disposed on the touch sensor layer. The touch sensor layer may obtain coordinate information based on external input (such as a touch event). The optical functional layer may reduce the reflectivity of light incident on the display device DS from outside the display device DS (external light) and / or improve the color purity of light emitted from the display device DS. In an embodiment, the optical functional layer may include a phase retarder and / or a polarizer. The phase retarder may be of film type or liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be of film type or liquid crystal coating type. The film type may include a stretchable synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a specific array. The phase retarder and polarizer may also include a protective film.

[0196] An adhesive component can be placed between the touch sensor layer and the optical functional layer. The adhesive component can be, for example, a pressure-sensitive adhesive (PSA), but is not limited to this.

[0197] A cover window CW can be disposed on the encapsulation layer 3000, and when a touch sensor layer and / or optical functional layer are disposed, the cover window CW can be disposed on top of them. The cover window CW can include at least one of, for example, glass, sapphire, and plastic. The cover window CW can include, for example, ultrathin tempered glass or colorless polyimide. In embodiments, the cover window CW can have a structure in which a flexible polymer layer is disposed on one surface of a glass substrate, or it can consist only of a polymer layer.

[0198] The cover window (CW) can be attached via an adhesive component. The adhesive component can be, for example, a liquid optically clear resin (OCR) or optically clear adhesive (OCA) and / or pressure-sensitive adhesive (PSA).

[0199] The method for manufacturing a mask frame assembly according to embodiments of the present disclosure and the apparatus for manufacturing a mask frame assembly combine a first mask rod and a second mask rod by using a preset or calculated compensation angle to achieve the effect of accurately manufacturing a mask frame assembly.

[0200] Although this disclosure has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims.

Claims

1. A method for manufacturing a mask frame assembly, the method comprising: Prepare a first mask rod arranged on one surface of a mask frame with an opening and a second mask rod intersecting the first mask rod; The clamp holding the second mask rod is placed in the first position, such that the first mask rod and the second mask rod intersect at a compensating angle; The first mask rod and the second mask rod that form the compensation angle are fixed to each other; Move the clamp to the second position; as well as The second mask rod is fixed to one side of the mask frame.

2. The method according to claim 1, wherein, The first position and the second position are spaced apart in the direction in which the first mask rod extends.

3. The method according to claim 1, wherein, The compensation angle is less than 90 degrees.

4. The method according to claim 2, wherein, Moving the clamp to the second position is performed after the first mask rod and the second mask rod are secured to each other.

5. The method according to claim 4, wherein, Securing the second mask rod to one side of the mask frame is performed after the fixture is moved to the second position.

6. The method according to claim 4, wherein, The first position is spaced apart from the second axis, which is perpendicular to the first axis along which the first mask rod extends, and passes through the intersection of the first mask rod and the second mask rod.

7. The method according to claim 6, wherein, The vertical distance between the first position and the second axis is greater than the vertical distance between the second position and the second axis.

8. The method according to claim 1, wherein, When the clamp is moved to the second position, the clamp causes the second mask rod to rotate in a preset direction.

9. The method according to claim 8, wherein, When the fixture is moved to the second position, the second mask rod rotates relative to the intersection of the first mask rod and the second mask rod.

10. The method according to claim 1, wherein, The length of the first mask rod is greater than the length of the second mask rod.

11. An apparatus for manufacturing a mask frame assembly, the mask frame assembly including a mask frame having an opening, a first mask rod disposed on the mask frame, and a second mask rod disposed intersecting the first mask rod, the apparatus comprising: A clamp is configured to hold the end of the second mask rod and is movable from a first position to a second position; A fixing device is configured to fix the first mask rod and the second mask rod to each other; as well as A controller configured to control the position of the clamp.

12. The apparatus according to claim 11, wherein, The first position and the second position are spaced apart in the direction in which the first mask rod extends.

13. The apparatus according to claim 11, wherein, The controller is configured to position the fixture at the first position such that the first mask rod and the second mask rod intersect at a compensation angle of less than 90 degrees.

14. The apparatus according to claim 12, wherein, The controller is configured to move the clamp to the second position after the fixing device has secured the first mask rod and the second mask rod to each other.

15. The apparatus according to claim 14, wherein, The fixing device is configured to fix the second mask rod to one side of the mask frame when the clamp is placed in the second position.

16. The apparatus according to claim 14, wherein, The first position is spaced apart from the second axis, which is perpendicular to the first axis along which the first mask rod extends, and passes through the intersection of the first mask rod and the second mask rod.

17. The apparatus according to claim 16, wherein, The vertical distance between the first position and the second axis is greater than the vertical distance between the second position and the second axis.

18. The apparatus according to claim 11, wherein, The controller is configured to move the clamp from the first position to the second position, thereby causing the second mask rod to rotate in a preset direction.

19. The apparatus according to claim 18, wherein, The controller is configured to move the clamp from the first position to the second position such that the second mask rod rotates relative to the intersection of the first mask rod and the second mask rod.

20. The apparatus according to claim 11, wherein, The length of the first mask rod is greater than the length of the second mask rod.

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