A copper material cold galvanizing wire drawing device with plated layer thickness real-time regulation

Abstract

The application discloses a copper material cold galvanization wire drawing device with real-time plated layer thickness regulation, and relates to the technical field of copper material cold galvanization wire drawing.The copper material cold galvanization wire drawing device with real-time plated layer thickness regulation comprises a workbench, a pay-off device, a cold galvanization tank, a wire drawing die and a winding device are sequentially arranged on the workbench, a cleaning device and an adjusting device are arranged in the cold galvanization tank, thickness detectors are arranged on the two sides of the wire drawing die, two guide rods are symmetrically arranged in the cold galvanization cavity, an adjusting frame is arranged on the workbench, a lifting device is arranged on the adjusting frame, an installation frame is arranged on the output end of the lifting device, an adjusting rod is arranged on the installation frame, guide wheels are rotatably arranged on the guide rods and the adjusting rod, the lifting device drives the adjusting rod to be lifted and adjusted according to the detection result of the thickness detector, the plated layer thickness is adjusted, the defective product rate is reduced, the adjusting step of tension is reduced, the processing quality is improved, and the adjusting time is shortened.

Description

Technical Field

[0001] This invention relates to the field of copper cold plating and wire drawing technology, specifically a copper cold plating and wire drawing device with real-time control of plating thickness. Background Technology

[0002] Copper is widely used in wires and cables, electronic components, communication equipment and other fields due to its excellent electrical conductivity, thermal conductivity and ductility. Cold plating refers to plating a protective layer onto the surface of copper through electroplating or other methods. Wire drawing refers to drawing copper into wires of the required diameter using a mold.

[0003] Under current technology, since wire drawing and cold plating are two different processes, the entire roll of copper is often processed in one step before entering the next step. It is impossible to adjust the coating thickness of cold plating according to the changes in the coating after wire drawing. As a result, defective products often appear in the roll. Once a defect occurs, the entire roll needs to be reworked or discarded, resulting in a high defect rate and serious waste. When adjusting the cold plating time, the unwinding speed is often adjusted, but this will cause fluctuations in the tension of the copper material in the equipment, which can easily damage and waste the copper material. Summary of the Invention

[0004] The purpose of this invention is to provide a copper cold plating wire drawing device with real-time control of plating thickness, so as to solve the problems of high defect rate, serious waste and easy damage to copper material when adjusting cold plating time in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: The copper cold plating wire drawing device with real-time adjustable plating thickness includes a worktable, on which an unwinding component, a cold plating tank, a wire drawing die, and a winding component are arranged in sequence. A partition is provided in the cold plating tank. The side of the partition near the unwinding component is a cleaning chamber, and the side of the partition near the winding component is a cold plating chamber. A cleaning component is provided in the cleaning chamber, and an adjusting component is provided in the cold plating chamber. Thickness detectors are provided on both sides of the wire drawing die. The adjusting component includes a guide rod, an adjusting rod, a guide wheel, an adjusting frame, a mounting frame, and a lifting component; Two guide rods are symmetrically installed inside the cold plating chamber. An adjustment frame is installed on the worktable. A lifting component is installed on the adjustment frame. An installation frame is installed at the output end of the lifting component. An adjustment rod is installed on the installation frame. Guide wheels are rotatably installed on both the guide rod and the adjustment rod.

[0006] When the device is in use, the cold plating tank is filled with electroplating solution. The copper material is first pulled from the uncoiling component and passed through the cold plating tank and the wire drawing die in sequence before being fixed on the rewinding component. Then the uncoiling component and the rewinding component are started to carry out cold plating and wire drawing operations. This can make the originally thin cold galvanized layer bond more tightly with the steel wire substrate, making the coating more firm and less likely to fall off. When the copper material passes through the cold plating tank, it passes through the front guide rod, the adjusting rod, and the rear guide rod in sequence. The thickness measuring instruments on both sides of the drawing die can detect the plating thickness of the copper material before and after drawing to determine whether the plating thickness meets the standard. When the plating thickness is lower than the standard value, the position of the adjusting rod is adjusted downward by the lifting component. At this time, the path of the copper material in the cold plating tank becomes longer, the cold plating time becomes longer, and the plating thickness of the copper material becomes thicker. When the coating thickness is higher than the standard value, the lifting frame drives the adjusting rod to descend, reducing the coating thickness. The coating thickness is adjusted accordingly by real-time detection of the coating thickness to meet processing requirements and improve the quality of cold-plated wire drawing. Thickness detectors are installed on both sides to determine whether cold plating or wire drawing affects the coating thickness. The cold plating time can be adjusted according to the requirements to avoid misjudgment caused by substandard coating thickness due to wire drawing. The cleaning component removes copper powder from the surface of the copper material before cold plating, preventing it from affecting the smoothness and density of the cold plating process and further improving product quality. At the same time, the lifting component drives the adjusting component to adjust the cold plating thickness without changing the length of the copper material between the unwinding and rewinding components. This maintains a constant unwinding and rewinding speed, reduces tension adjustment steps, avoids damage to the copper material, further improves processing quality, and shortens adjustment time.

[0007] As a preferred technical solution, the lifting component includes a module slide rail, a slide rail slider, a lifting rod, a lifting wheel, a threaded slider, a first screw, a first transmission wheel, a second transmission wheel, a transmission chain, and a second screw; Two modular slide rails are installed inside the cleaning chamber. Each modular slide rail has a slide rail slider. The two slide rail sliders are connected by a lifting rod. A lifting wheel is rotatably mounted on the lifting rod. A threaded slider is mounted on one of the slide rail sliders. A first screw is rotatably mounted inside the cleaning chamber. The first screw is threadedly engaged with the threaded slider. A first transmission wheel is mounted on the first screw. A second transmission wheel is rotatably mounted on the adjusting frame. The second transmission wheel and the first transmission wheel are connected by a transmission chain. A second screw is fitted onto the second transmission wheel. The mounting frame is mounted on the lower end of the second screw.

[0008] As a preferred technical solution, the cleaning component includes a cleaning body, a mounting cavity, a cleaning cylinder, an adsorption hole, a drain hole, an air outlet, a negative pressure pipe, and an air pump. The cleaning chamber contains a cleaning body, which has an installation cavity. The installation cavity contains a cleaning cylinder. The inner wall of the cleaning cylinder has multiple suction holes evenly distributed. The outer wall of the cleaning cylinder has a drain hole. The cleaning body has an air outlet hole. A negative pressure pipe is installed on the air outlet hole. An air pump is connected to the negative pressure pipe.

[0009] As a preferred technical solution, the adsorption hole is inclinedly opened on the cleaning cylinder, the air outlet is annular around the cleaning cylinder, and the cleaning cylinder is rotatably installed in the mounting cavity.

[0010] As a preferred technical solution, the cleaning component further includes a mounting plate, a drive gear, a transmission gear, a driven gear, and a linkage rod; An installation plate is installed inside the cleaning chamber. A drive gear is installed on the first screw. A transmission gear is rotatably installed on the installation plate and meshes with the drive gear. A driven gear is rotatably installed on the installation plate and meshes with the transmission gear. A linkage rod is coaxially installed on the driven gear, and the cleaning body is installed on the linkage rod.

[0011] As a preferred technical solution, the guide wheel and the lifting wheel are both installed on the same horizontal plane, and the guide wheel and the lifting wheel are both provided with wire grooves.

[0012] As a preferred technical solution, the cold plating tank is provided with symmetrical installation grooves on both sides, and the partition plate is provided with a middle groove. The installation groove and the middle groove are located on the same axis, and wire rings are installed on both the installation groove and the middle groove.

[0013] As a preferred technical solution, the unwinding component includes an unwinding drive and an unwinding body, the winding component includes a winding drive and a winding body, and a controller is provided on the worktable. The controller is electrically connected to the thickness detector, the unwinding drive, and the winding drive.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. Real-time detection of coating thickness and adjustment of cold plating coating thickness accordingly improves cold plating wire drawing quality, reduces defect rate and avoids material waste; 2. Clean the copper powder on the surface of the copper material before cold plating using a cleaning component to prevent the copper powder from affecting the smoothness and density of the cold plating process, thereby further improving product quality.

[0015] 3. By using the lifting mechanism to drive the adjusting mechanism, the cold plating thickness is adjusted, and the unwinding and rewinding speeds are kept constant. This reduces the tension adjustment steps, avoids damage to the copper material, further improves processing quality, and shortens adjustment time. Attached Figure Description

[0016] Figure 1 This is a first-view structural diagram of the present invention; Figure 2 This is a schematic diagram of the second perspective structure of the present invention; Figure 3 This is a schematic diagram of the first partial cross-sectional structure of the present invention; Figure 4 This is a schematic diagram of the structure of the second partial section of the present invention; Figure 5 This is a partial structural diagram of the present invention; Figure 6 This is a schematic diagram of the third partial cross-sectional structure of the present invention; Figure 7 This is a schematic diagram of the cleaning cylinder structure in Embodiment 1 of the present invention; Figure 8 This is a schematic diagram of the cleaning cylinder structure in Embodiment 2 of the present invention.

[0017] In the diagram: 1. Workbench; 2. Unwinding section; 3. Cold plating tank; 4. Wire drawing die; 5. Rewinding section; 6. Cleaning chamber; 7. Cold plating chamber; 8. Cleaning component; 801. Cleaning body; 802. Mounting cavity; 803. Cleaning cylinder; 804. Suction hole; 805. Drain hole; 806. Air outlet; 807. Negative pressure pipe; 808. Air pump; 809. Mounting plate; 810. Drive gear; 811. Transmission gear; 812. Driven gear; 813. Linkage rod; 9. Adjusting component; 901. Guide rod; 902. Adjusting rod; 903. Guide wheel; 904. Adjusting frame; 905. Mounting frame; 10. Thickness measuring instrument; 11. Lifting component; 1101. Module slide rail; 1102. Slide rail slider; 1103. Lifting rod; 1104. Lifting wheel; 1105. Threaded slider; 1106. First screw; 1107. First transmission wheel; 1108. Second transmission wheel; 1109. Transmission chain; 1110. Second screw; 12. Wire channel; 13. Mounting channel; 14. Partition; 15. Intermediate channel; 16. Wire ring; 17. Controller. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Example 1: As Figures 1-8As shown, the present invention provides a technical solution for a copper cold plating wire drawing device with real-time control of plating thickness. The copper cold plating wire drawing device with real-time control of plating thickness includes a worktable 1. On the worktable 1, an unwinding component 2, a cold plating tank 3, a wire drawing die 4, and a winding component 5 are arranged in sequence. A partition 14 is arranged in the cold plating tank 3. The side of the partition 14 near the unwinding component 2 is a cleaning chamber 6, and the side of the partition 14 near the winding component 5 is a cold plating chamber 7. A cleaning component 8 is arranged in the cleaning chamber 6, and an adjusting component 9 is arranged in the cold plating chamber 7. Thickness detectors 10 are arranged on both sides of the wire drawing die 4. The adjusting component 9 includes a guide rod 901, an adjusting rod 902, a guide wheel 903, an adjusting frame 904, a mounting frame 905, and a lifting component 11; Two guide rods 901 are symmetrically installed inside the cold plating chamber 7. An adjustment frame 904 is installed on the worktable 1. A lifting component 11 is installed on the adjustment frame 904. A mounting frame 905 is installed at the output end of the lifting component 11. An adjustment rod 902 is installed on the mounting frame 905. Guide wheels 903 are rotatably installed on both the guide rods 901 and the adjustment rods 902.

[0020] When the device is in use, the cold plating tank 3 is filled with electroplating solution. The copper material is first pulled from the unwinding part 2 through the cold plating tank 3 and the wire drawing die 4 and then fixed on the winding part 5. Then the unwinding part 2 and the winding part 5 are started to carry out cold plating and wire drawing operations, which can make the originally thin cold galvanized layer bond more tightly with the steel wire substrate, making the coating more firm and less likely to fall off. When the copper material passes through the cold plating tank 3, it passes through the front guide rod 901, the adjusting rod 902, and the rear guide rod 901 in sequence. The thickness measuring instruments 10 on both sides of the drawing die 4 can detect the plating thickness of the copper material before and after drawing to determine whether the plating thickness meets the standard. When the plating thickness is lower than the standard value, the position of the adjusting rod 902 is adjusted downward by the lifting component 11. At this time, the path of the copper material in the cold plating tank 3 becomes longer, the cold plating time becomes longer, and the plating thickness of the copper material becomes thicker. When the coating thickness is higher than the standard value, the lifting frame drives the adjusting rod 902 to descend, reducing the coating thickness. By detecting the coating thickness in real time, the coating thickness of cold plating is adjusted accordingly, thereby improving the quality of cold plating wire drawing, reducing the defect rate and avoiding material waste. Thickness detectors 10 are installed on both sides to determine whether cold plating or wire drawing affects the coating thickness. The cold plating time can be adjusted according to the requirements to avoid misjudgment caused by substandard coating thickness due to wire drawing. The thickness gauge 10 can use either the eddy current method or the X-ray fluorescence method. When the eddy current method is used, the thickness detector 10 includes a probe coil. The high-frequency alternating magnetic field generated by the probe coil passes through the tin plating layer. At this time, eddy currents are generated in the copper substrate. The thicker the plating layer, the greater the attenuation of the eddy current signal. The thickness detector 10 judges the plating thickness by the change of the probe signal, thus realizing the plating thickness detection. When using X-ray fluorescence method, the thickness detector 10 includes an X-ray emitter and an energy spectrum detector. The X-ray emitter emits X-rays to irradiate the copper wire, exciting the plating atoms to emit characteristic fluorescence. The intensity of the fluorescence is proportional to the thickness of the plating. The thickness detector 10 calculates the plating thickness based on the fluorescence intensity detected by the energy spectrum detector, thus realizing the detection of plating thickness.

[0021] The cleaning component 8 cleans the copper powder on the surface of the copper material before cold plating, preventing the copper powder from affecting the smoothness and density of the cold plating, thus further improving product quality. At the same time, the lifting component 11 drives the adjusting component 9 to adjust the cold plating thickness without changing the length of the copper material between the unwinding component 2 and the rewinding component 5, maintaining the unwinding and rewinding speeds constant, reducing tension adjustment steps, avoiding damage to the copper material, further improving processing quality and shortening adjustment time.

[0022] The lifting component 11 includes a module slide rail 1101, a slide rail slider 1102, a lifting rod 1103, a lifting wheel 1104, a threaded slider 1105, a first screw 1106, a first transmission wheel 1107, a second transmission wheel 1108, a transmission chain 1109, and a second screw 1110. Two modular slide rails 1101 are installed inside the cleaning chamber 6. Slide rail sliders 1102 are provided on the modular slide rails 1101. The two slide rail sliders 1102 are connected by a lifting rod 1103. A lifting wheel 1104 is rotatably installed on the lifting rod 1103. A threaded slider 1105 is installed on one slide rail slider 1102. A first screw 1106 is rotatably installed inside the cleaning chamber 6. The first screw 1106 is threadedly engaged with the threaded slider 1105. A first transmission wheel 1107 is installed on the first screw 1106. A second transmission wheel 1108 is rotatably installed on the adjusting frame 904. The second transmission wheel 1108 and the first transmission wheel 1107 are connected by a transmission chain 1109. A second screw 1110 is fitted on the second transmission wheel 1108. A mounting frame 905 is installed at the lower end of the second screw 1110.

[0023] When the thickness gauge 10 detects that the coating thickness does not meet the standard, the thickness gauge 10 sends an electrical signal to control the slide rail slider 1102 to slide along the module slide rail 1101. The slide rail slider 1102 will drive the threaded slider 1105 to move synchronously through the lifting rod 1103. Since the threaded slider 1105 is threadedly engaged with the first screw 1106, and the first screw 1106 is rotatably installed in the cleaning chamber 6, the sliding of the threaded slider 1105 will drive the first screw 1106 to rotate. The first screw 1106 will drive the first transmission wheel 1107 to rotate synchronously. The first transmission wheel 1107 drives the second transmission wheel 1108 to rotate through the transmission chain 1109. The second transmission wheel 1108 drives the second screw 1110 to rotate. The second screw 1110 is threadedly engaged with the second transmission wheel 1108, which is rotatably mounted on the adjusting frame 904. Therefore, the second screw 1110 will drive the adjusting wheel on the adjusting rod 902 to move up and down through the mounting frame 905, thereby adjusting the cold plating time of the copper material in the cold plating chamber 7 and changing the thickness of the copper plating layer to meet the processing requirements. The length of the copper material in the cold plating chamber 7 is indirectly adjusted by adjusting the length of the copper material in the cleaning chamber 6. It is not necessary to change the unwinding and rewinding speed to meet the length changes within the cold plating range, and it will not affect the overall tension. This avoids defects caused by tension changes and tension periods, reduces tension adjustment steps, avoids damage to the copper material, further improves processing quality, and shortens adjustment time.

[0024] The cleaning component 8 includes a cleaning body 801, a mounting cavity 802, a cleaning cylinder 803, an adsorption hole 804, a drain hole 805, an air outlet 806, a negative pressure pipe 807, and an air pump 808. The cleaning chamber 6 contains a cleaning body 801, which has an installation cavity 802. The installation cavity 802 contains a cleaning cylinder 803. The inner wall of the cleaning cylinder 803 has multiple suction holes 804 evenly distributed. The outer wall of the cleaning cylinder 803 has a drain hole 805. The cleaning body 801 has an air outlet 806, and a negative pressure pipe 807 is installed on the air outlet 806. The negative pressure pipe 807 is connected to an air pump 808.

[0025] When the copper material passes through the cleaning cylinder 803, the air pump 808 draws air outward through the negative pressure pipe 807, forming a gas passage from the outside to the inner cylinder of the cleaning cylinder 803, through the adsorption hole 804, through the drain hole 805, and through the air outlet 806. When the gas enters the cleaning cylinder 803, it blows off the copper powder on the copper material. The copper powder is discharged from the negative pressure pipe 807 with the gas flow, thus cleaning the copper material. This can improve the smoothness and density of the cold plating and further improve the product quality. Compared to traditional cleaning methods, this cleaning method directly removes impurities, eliminates the need for frequent replacement of cleaning devices, enables continuous cleaning, reduces the time cost of replacing consumables, and improves production efficiency.

[0026] The adsorption hole 804 is inclinedly opened on the cleaning cylinder 803, and the air outlet 806 is annular around the cleaning cylinder 803. The cleaning cylinder 803 is rotatably installed in the mounting cavity 802.

[0027] The suction holes 804 are set at an angle. When the airflow enters the suction holes 804, it will push the cleaning cylinder 803 to rotate in the mounting cavity 802. This achieves all-round cleaning while avoiding local blockage of the suction holes 804 due to the fixed air path. The annularly opened air outlet 806 ensures that the gas is smoothly discharged as the cleaning cylinder 803 rotates, further improving the cleaning quality and reducing the maintenance frequency.

[0028] The cleaning component 8 also includes a mounting plate 809, a drive gear 810, a transmission gear 811, a driven gear 812, and a linkage rod 813; A mounting plate 809 is installed inside the cleaning chamber 6. A drive gear 810 is installed on the first screw 1106. A transmission gear 811 is rotatably mounted on the mounting plate 809. The transmission gear 811 meshes with the drive gear 810. A driven gear 812 is rotatably mounted on the mounting plate 809. The driven gear 812 meshes with the transmission gear 811. A linkage rod 813 is coaxially mounted on the driven gear 812. The cleaning body 801 is mounted on the linkage rod 813.

[0029] When the plating thickness is adjusted, the wiring path of the copper material in the cleaning chamber 6 will change. At this time, the rotation of the first screw 1106 will drive the drive gear 810 to rotate synchronously. Due to the gear meshing, the drive gear 810 drives the driven gear 812 to rotate through a certain angle via the transmission gear 811. The driven gear 812 will drive the cleaning body 801 to rotate synchronously via the linkage rod 813, ensuring the parallelism between the copper material and the cleaning cylinder 803, avoiding interference between the cleaning body 801 and the copper material caused by the change in the copper material wiring path, thus ensuring the cleaning effect and avoiding damage to the copper material.

[0030] The guide wheel 903 and the lifting wheel 1104 are both installed on the same horizontal plane, and both the guide wheel 903 and the lifting wheel 1104 are provided with wire grooves 12.

[0031] Both the guide wheel 903 and the lifting wheel 1104 are rotatably mounted, which can effectively reduce the frictional loss of the copper material. The wire groove 12 further reduces the bending damage of the copper material.

[0032] The cold plating tank 3 has symmetrical installation grooves 13 on both sides, and the partition plate 14 has an intermediate groove 15. The installation grooves 13 and the intermediate groove 15 are located on the same axis, and wire rings 16 are installed on both the installation grooves 13 and the intermediate groove 15.

[0033] The wire ring 16 avoids the wear of copper material caused by friction between the copper material and the cold plating tank 3 and the partition 14. The same axis reduces the damage to the copper material caused by bending, further ensuring product quality.

[0034] The unwinding component 2 includes an unwinding drive and an unwinding body, and the winding component 5 includes a winding drive and a winding body. A controller 17 is provided on the workbench 1. The controller 17 is electrically connected to the thickness detector 10, the unwinding drive, and the winding drive.

[0035] The controller 17 is responsible for receiving and analyzing the detection signal from the thickness detector 10, and then controlling the movement of the unwinding drive, the winding drive, and the slide rail slider 1102. The depth of the cold plating tank 3 is the determining factor affecting the adjustment range. Therefore, when the adjustment range is large, the controller 17 needs to control the running speed of the unwinding component 2 and the winding component 5 to adjust the cold plating time and expand the adjustment range.

[0036] Example 2: The difference between this example and Example 1 is that the structure of the cleaning cylinder 803 is different.

[0037] The adsorption hole 804 is inclinedly opened on the cleaning cylinder 803, and the air outlet 806 is annular around the cleaning cylinder 803. The cleaning cylinder 803 is rotatably installed in the mounting cavity 802.

[0038] The suction holes 804 are set at an angle. When the airflow enters the suction holes 804, it will push the cleaning cylinder 803 to rotate in the mounting cavity 802. This achieves all-round cleaning while avoiding local blockage of the suction holes 804 due to the fixed air path. The annularly opened air outlet 806 ensures that the gas is smoothly discharged as the cleaning cylinder 803 rotates, further improving the cleaning quality and reducing the maintenance frequency.

[0039] Working principle of the invention: When the device is in use, the cold plating tank 3 is filled with electroplating solution. The copper material is first pulled from the unwinding part 2 through the cold plating tank 3 and the wire drawing die 4 and then fixed on the winding part 5. Then the unwinding part 2 and the winding part 5 are started to carry out cold plating and wire drawing operations, which can make the originally thin cold galvanized layer bond more tightly with the steel wire substrate, making the coating more firm and less likely to fall off. When the copper material passes through the cold plating tank 3, it passes through the front guide rod 901, the adjusting rod 902, and the rear guide rod 901 in sequence. The thickness measuring instruments 10 on both sides of the drawing die 4 can detect the plating thickness of the copper material before and after drawing to determine whether the plating thickness meets the standard. When the plating thickness is lower than the standard value, the position of the adjusting rod 902 is adjusted downward by the lifting component 11. At this time, the path of the copper material in the cold plating tank 3 becomes longer, the cold plating time becomes longer, and the plating thickness of the copper material becomes thicker. When the coating thickness is higher than the standard value, the lifting frame drives the adjusting rod 902 to descend, reducing the coating thickness. The coating thickness is adjusted accordingly by real-time detection of the coating thickness to meet processing requirements and improve the quality of cold-plated wire drawing. Thickness detectors 10 are installed on both sides to determine whether cold plating or wire drawing affects the coating thickness. The cold plating time can be adjusted according to the requirements to avoid misjudgment caused by substandard coating thickness due to wire drawing. The cleaning component 8 cleans the copper powder on the surface of the copper material before cold plating, preventing the copper powder from affecting the smoothness and density of the cold plating, thus further improving product quality. At the same time, the lifting component 11 drives the adjusting component 9 to adjust the cold plating thickness without changing the length of the copper material between the unwinding component 2 and the rewinding component 5, maintaining the unwinding and rewinding speeds constant, reducing tension adjustment steps, avoiding damage to the copper material, further improving processing quality and shortening adjustment time.

[0040] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A copper cold plating wire drawing device for real-time control of plating thickness, characterized in that: The copper cold plating wire drawing device with real-time thickness control includes a worktable (1), on which an unwinding component (2), a cold plating tank (3), a wire drawing die (4), and a winding component (5) are arranged in sequence. A partition (14) is arranged in the cold plating tank (3). The side of the partition (14) near the unwinding component (2) is a cleaning chamber (6), and the side of the partition (14) near the winding component (5) is a cold plating chamber (7). A cleaning component (8) is arranged in the cleaning chamber (6), and an adjusting component (9) is arranged in the cold plating chamber (7). Thickness detectors (10) are arranged on both sides of the wire drawing die (4). The adjusting component (9) includes a guide rod (901), an adjusting rod (902), a guide wheel (903), an adjusting frame (904), a mounting frame (905), and a lifting component (11). Two guide rods (901) are symmetrically installed inside the cold plating chamber (7). An adjustment frame (904) is installed on the worktable (1). A lifting component (11) is installed on the adjustment frame (904). A mounting frame (905) is installed at the output end of the lifting component (11). An adjustment rod (902) is installed on the mounting frame (905). Guide wheels (903) are rotatably installed on both the guide rod (901) and the adjustment rod (902).

2. The copper cold plating wire drawing device for real-time control of plating thickness according to claim 1, characterized in that: The lifting component (11) includes a module slide rail (1101), a slide rail slider (1102), a lifting rod (1103), a lifting wheel (1104), a threaded slider (1105), a first screw (1106), a first transmission wheel (1107), a second transmission wheel (1108), a transmission chain (1109), and a second screw (1110). Two modular slide rails (1101) are installed inside the cleaning chamber (6). Each modular slide rail (1101) has a slide rail slider (1102). The two slide rail sliders (1102) are connected by a lifting rod (1103). A lifting wheel (1104) is rotatably mounted on the lifting rod (1103). A threaded slider (1105) is mounted on one of the slide rail sliders (1102). A first screw (1106) is rotatably mounted inside the cleaning chamber (6). 06) The first screw (1106) is threadedly engaged with the threaded slider (1105). The first drive wheel (1107) is mounted on the first screw (1106). The second drive wheel (1108) is rotatably mounted on the adjusting frame (904). The second drive wheel (1108) and the first drive wheel (1107) are connected by a drive chain (1109). The second screw (1110) is fitted on the second drive wheel (1108). The mounting frame (905) is mounted on the lower end of the second screw (1110).

3. The copper cold plating wire drawing device for real-time control of plating thickness according to claim 2, characterized in that: The cleaning component (8) includes a cleaning body (801), a mounting cavity (802), a cleaning cylinder (803), an adsorption hole (804), a drain hole (805), an air outlet (806), a negative pressure pipe (807), and an air pump (808). The cleaning chamber (6) is provided with a cleaning body (801), the cleaning body (801) is provided with an installation cavity (802), the installation cavity (802) is provided with a cleaning cylinder (803), the inner wall of the cleaning cylinder (803) is provided with a plurality of adsorption holes (804), the outer wall of the cleaning cylinder (803) is provided with a drain hole (805), the cleaning body (801) is provided with an air outlet (806), a negative pressure pipe (807) is installed on the air outlet (806), and a vacuum pump (808) is connected to the outside of the negative pressure pipe (807).

4. The copper cold plating wire drawing device for real-time control of plating thickness according to claim 3, characterized in that: The adsorption hole (804) is inclinedly opened on the cleaning cylinder (803), the air outlet (806) is annular around the cleaning cylinder (803), and the cleaning cylinder (803) is rotatably installed in the mounting cavity (802).

5. A copper cold plating wire drawing device for real-time control of plating thickness according to claim 3 or 4, characterized in that: The cleaning component (8) also includes a mounting plate (809), a drive gear (810), a transmission gear (811), a driven gear (812), and a linkage rod (813). An installation plate (809) is installed inside the cleaning chamber (6). A drive gear (810) is installed on the first screw (1106). A transmission gear (811) is rotatably installed on the installation plate (809). The transmission gear (811) meshes with the drive gear (810). A driven gear (812) is rotatably installed on the installation plate (809). The driven gear (812) meshes with the transmission gear (811). A linkage rod (813) is coaxially installed on the driven gear (812). The cleaning body (801) is installed on the linkage rod (813).

6. The copper cold plating wire drawing device for real-time control of plating thickness according to claim 2, characterized in that: The guide wheel (903) and the lifting wheel (1104) are both installed on the same horizontal plane, and the guide wheel (903) and the lifting wheel (1104) are both provided with wire grooves (12).

7. The copper cold plating wire drawing device for real-time control of plating thickness according to claim 1, characterized in that: The cold plating tank (3) has symmetrically provided mounting grooves (13) on both sides, and the partition plate (14) has provided an intermediate groove (15). The mounting groove (13) and the intermediate groove (15) are located on the same axis, and wire rings (16) are installed on both the mounting groove (13) and the intermediate groove (15).

8. The copper cold plating wire drawing device for real-time control of plating thickness according to claim 1, characterized in that: The unwinding component (2) includes an unwinding drive and an unwinding body, and the winding component (5) includes a winding drive and a winding body. A controller (17) is provided on the workbench (1). The controller (17) is electrically connected to the thickness detector (10), the unwinding drive, and the winding drive.

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