Modular combined patch-type LED lamp

Abstract

The application discloses a modular combined patch type LED lamp and relates to the technical field of novel lighting, which comprises a frame assembly, the frame assembly comprises a main body frame, a plurality of sub-module assemblies are arranged on the top of the main body frame, the sub-module assemblies comprise heat storage mechanisms and thermal resistance mechanisms, the heat storage mechanisms are used for absorbing peak heat in the starting stage of the LED lamp, the thermal resistance mechanisms are used for adjusting the heat conduction of the contact interface so as to adjust the light decay speed of new sub-modules, the thermal resistance mechanisms comprise fixed pressure plates and movable pressure plates, and a plurality of elastic metal gaskets are arranged between the bottom of the fixed pressure plate and the top of the movable pressure plate. The modular combined patch type LED lamp can change the heat conduction efficiency by extruding the elastic metal gasket, thereby being capable of adjusting the light decay speed of the new sub-modules, the light decay speed of the new sub-modules is quickly adjusted to the same degree as that of the old sub-modules, and the situation that the modular street lamp causes a safety hidden danger due to a light spot is avoided.

Description

Technical Field

[0001] This invention relates to the field of novel lighting technology, specifically to a modularly assembled surface-mount LED lamp. Background Technology

[0002] Surface mount LED is an abbreviation for surface mount device. In LED packaging technology, it is one of the two major packaging forms alongside traditional through-hole LED. Surface mount LEDs are suitable for making thin and light lamps, such as light strips and panel lights. Modular combination is a new lighting method in the evolution of LED lights. It refers to the pre-integration of multiple LED chips, driver power supply and heat sink into a standardized sub-module, and then splicing several such sub-modules into a complete large lamp. When a module in the modular lamp fails, only the power needs to be cut off and the small module replaced, and the other modules will continue to work normally.

[0003] In existing technologies, modular surface-mount LED lights are commonly used in modular streetlights. When used outdoors in summer, modular streetlights face high temperatures and uneven heat dissipation. This factor accelerates the light decay of the surface-mount LED light sub-modules. Because the surface temperature of outdoor streetlight housings is extremely high in summer, and although the modular design has independent heat sinks, each sub-module is located in a different position on the pole. Sub-modules in the middle have poor heat dissipation, while sub-modules on the edges have enhanced heat dissipation due to ambient airflow. This difference in operating temperature leads to different degrees of light decay in different sub-modules of the same modular streetlight. Replacing a damaged old sub-module with a brand new one will result in a huge difference in brightness between the old and new, which can easily create light spots on the road and pose a safety hazard.

[0004] Therefore, we propose a modularly assembled surface-mount LED light to address the problems mentioned above. Summary of the Invention

[0005] The purpose of this invention is to provide a modularly assembled surface-mount LED light to solve the problem mentioned in the background art, where the replacement of existing street light sub-modules results in a significant difference in brightness between the old and new modules due to different degrees of light decay.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a modularly assembled surface-mount LED lamp, comprising a frame assembly, the frame assembly including a main frame, the top of the main frame being provided with multiple sub-module assemblies, each sub-module assembly including a heat storage mechanism and a thermal resistance mechanism, the heat storage mechanism being used to absorb the peak heat during the LED lamp's start-up phase, the thermal resistance mechanism being used to adjust the heat conduction at the contact interface thereby adjusting the light decay rate of the new sub-module, the thermal resistance mechanism including a constant pressure plate and a dynamic pressure plate, multiple elastic metal gaskets being provided between the bottom of the constant pressure plate and the top of the dynamic pressure plate, the cross-section of the elastic metal gaskets being corrugated, and the multiple elastic metal gaskets being arranged in an alternating stacked arrangement.

[0007] Preferably, the multiple sub-module components are configured as three groups: an outer circle, a middle circle, and an inner circle, and each group of sub-module components is evenly arranged along the circumferential direction.

[0008] Preferably, the bottom of the constant pressure plate is provided with a plurality of air guide grooves, and the inner wall of each air guide groove is matched with each upward protruding surface of its adjacent elastic metal gasket. The bottom of the dynamic pressure plate is provided with a plurality of flow grooves, and the inner wall of each flow groove is matched with each downward protruding surface of its adjacent elastic metal gasket.

[0009] Preferably, the bottom of the fixed pressure plate is provided with rotating holes near the four corners, and the inner wall of each rotating hole is rotatably connected with an adjusting bolt. One end of each adjusting bolt passes through the moving pressure plate to its bottom, and the outer surface of each adjusting bolt is threaded with an adjusting nut. The adjusting bolt and adjusting nut are designed together to adjust the preload of multiple elastic metal washers.

[0010] Preferably, a scale marking rod is fixedly connected to the bottom of the fixed pressure plate near both sides, and one end of each scale marking rod movably passes through the moving pressure plate to its bottom, and the scale marking rod is used to determine the adjustment position of the moving pressure plate.

[0011] Preferably, each of the elastic metal gaskets has a long slot opening near the four corners on its top, each of the adjusting bolts moves inside each long slot opening, and each of the elastic metal gaskets has a square opening near its two sides on its top, and each of the scale marker rods moves inside each square opening.

[0012] Preferably, the heat storage mechanism includes two symmetrically arranged storage boxes, each of which has a piston plate slidably connected inside. An expansion cavity is provided between one side of each piston plate and the inner wall of the corresponding storage box, and the expansion cavity is filled with expansion gas.

[0013] Preferably, an elastic bladder is fixedly connected to one side of each of the two piston plates, the two elastic bladders are placed inside the two storage boxes respectively, and the interior of the elastic bladders is filled with phase change material, and a slow-temperature zone is provided between the two storage boxes.

[0014] Preferably, the submodule component further includes a die-bonding layer, with an LED chip disposed on the top of the die-bonding layer and an aluminum substrate disposed on the bottom of the die-bonding layer. The heat storage mechanism is disposed between the bottom of the aluminum substrate and the top of the constant pressure plate. A connecting base is fixedly connected to the bottom of the constant pressure plate, and a limit insertion block is fixedly connected to the bottom of the connecting base. A heat dissipation substrate is disposed on the bottom of the dynamic pressure plate.

[0015] Preferably, the top of the main frame is provided with multiple mounting slots, and each limiting insertion block is slidably inserted into the interior of each mounting slot. The top and bottom of the main frame are respectively provided with a lens cover and a lamp base. The top and bottom edges of the main frame are respectively provided with multiple upper cover positioning slots and lower cover positioning slots. Multiple lamp cover clips are fixedly connected to the bottom edge of the lens cover, and each lamp cover clip engages with each upper cover positioning slot. Multiple base clips are fixedly connected to the top edge of the lamp base, and each base clip engages with each lower cover positioning slot. A support frame is fixedly installed at the bottom of the lamp base.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. During use, the thermal resistance mechanism, also known as the thermal resistance interface layer, contains multiple alternating stacked elastic metal pads with micro-corrugations. By compressing the elastic metal pads, the heat conduction efficiency is changed, thereby adjusting the light decay rate of the new sub-module. This allows the light decay rate of the new sub-module to be quickly adjusted to the same level as the old sub-module, avoiding safety hazards caused by light spots in modular streetlights.

[0017] 2. During use, the gap between the corrugated part of the elastic metal gasket and the air guide groove changes, thereby changing the air circulation area. With the air flow rate in the environment remaining constant, when the gas circulation area decreases, the gas flow speed will increase, which can further improve the heat transfer effect. The preload of multiple stacked elastic metal gaskets is adjusted by turning the adjusting nut on the outside of the adjusting bolt.

[0018] 3. During use, when the street light is turned on, the LED chip heats up, and the expanding gas expands due to the heat, pushing the piston plate and elastic bladder outward. The solid phase change material filled inside the elastic bladder absorbs heat and gradually melts. The melting process absorbs the peak heat when the light is turned on, slowing down the rise in junction temperature and preventing a sudden spike in junction temperature. When the street light is working stably, the phase change material is completely melted and continues to absorb heat in the slow-temperature zone, thereby maintaining a stable junction temperature and reducing temperature fluctuations. The small junction temperature fluctuations reduce light decay. It does not interfere with the adjustable thermal resistance interface layer, so the two functions of slowing down light decay and accelerating matching can be achieved independently. Attached Figure Description

[0019] Figure 1 This is a first-view perspective perspective view of a modularly assembled surface-mount LED lamp according to the present invention. Figure 2 This is a second-view perspective perspective view of a modularly assembled surface-mount LED lamp according to the present invention; Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle; Figure 4 This is a perspective view of the main frame of a modularly assembled surface-mount LED lamp according to the present invention. Figure 5 This is a sectional perspective view of the main frame of a modularly assembled surface-mount LED lamp according to the present invention. Figure 6 This is a perspective view of a sub-module component of a modularly assembled surface-mount LED lamp according to the present invention. Figure 7 This is a perspective view of the thermal resistance mechanism of a modularly assembled surface-mount LED lamp according to the present invention. Figure 8 This is a partial sectional perspective view of the heat storage mechanism of a modularly assembled surface-mount LED lamp according to the present invention. Figure 9 A first-view perspective perspective view of the thermal resistance mechanism structure of a modularly assembled surface-mount LED lamp according to the present invention. Figure 10 This is a second-view perspective perspective view of the thermal resistance mechanism structure of a modularly assembled surface-mount LED lamp according to the present invention.

[0020] In the picture: 1. Frame assembly; 101. Main frame; 102. Upper cover positioning groove; 103. Lower cover positioning groove; 104. Mounting groove; 2. Lamp base; 21. Base locking block; 3. Support frame; 4. Lens cover; 41. Lamp cover locking block; 5. Submodule assembly; 501. LED chip; 502. Die-bonding layer; 503. Aluminum substrate; 504. Heat dissipation substrate; 505. Connecting base; 506. Limiting insertion block; 51. 510. Heat storage mechanism; 511. Storage box; 512. Expansion chamber; 513. Piston plate; 514. Elastic bladder; 515. Slow-temperature zone; 52. Thermal resistance mechanism; 520. Constant pressure plate; 521. Air guide groove; 522. Elastic metal gasket; 523. Dynamic pressure plate; 524. Flow groove; 525. Adjusting bolt; 526. Adjusting nut; 527. Scale mark rod; 528. Long groove movable port; 529. Square movable port. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1 to 10 The present invention provides a technical solution: This invention provides a modularly assembled surface-mount LED lamp, including a frame assembly 1. The frame assembly 1 includes a main frame 101. Multiple sub-module assemblies 5 are arranged on the top of the main frame 101. Each sub-module assembly 5 includes a heat storage mechanism 51 and a thermal resistance mechanism 52. The heat storage mechanism 51 is used to absorb the peak heat during the LED lamp's start-up phase. The thermal resistance mechanism 52 is used to adjust the heat conduction at the contact interface, thereby adjusting the light decay rate of the new sub-module. The thermal resistance mechanism 52 includes a constant pressure plate 520 and a dynamic pressure plate 523. Multiple elastic metal gaskets 522 are arranged between the bottom of the constant pressure plate 520 and the top of the dynamic pressure plate 523. The cross-section of the elastic metal gaskets 522 is corrugated. The multiple elastic metal gaskets 522 are arranged alternately. The multiple sub-module assemblies 5 are arranged in three groups: an outer ring, a middle ring, and an inner ring. Each group of sub-module assemblies 5 is evenly arranged along the circumferential direction.

[0023] In use, the modular streetlight integrates multiple sub-module components 5. During adjustment or replacement, each sub-module component 5 can be operated individually, or the entire group of sub-module components 5 can be operated as a whole. Each sub-module component 5 contains a thermal resistance mechanism 52, also known as a thermal resistance interface layer. This thermal resistance interface layer mainly uses multiple alternately stacked elastic metal pads 522. The elastic metal pads 522 have slight corrugations, and their surfaces are not completely flat. Therefore, when the multiple stacked elastic metal pads 522 are compressed, their overall structure changes, thereby altering the thermal conductivity of the thermal resistance interface layer. This allows the light decay rate of the new sub-module to be adjusted based on the detected light decay coefficient of the old sub-module, enabling the light decay rate of the new sub-module to quickly match that of the old sub-module. This prevents safety hazards caused by light spots in the modular streetlight. The specific adjustment principle is as follows: By pressing the moving pressure plate 523 towards the fixed pressure plate 520, the stacked elastic metal pads 522 are compressed. The tighter they are compressed, the smaller the gaps between the corrugations of the elastic metal pads 522, the larger the contact area between the metals, and the fewer the air gaps. This results in higher heat conduction efficiency, lower thermal resistance, lower junction temperature of the LED chip 501, and slower light decay. Conversely, when the stacked elastic metal pads 522 are loosened, the air gaps between the corrugations of the elastic metal pads 522 increase. Since the thermal conductivity of gas is worse than that of metal, the heat conduction efficiency is lower, the thermal resistance is higher, and the light decay is faster. This method adjusts the light decay rate of the new sub-module so that it can synchronize with the light decay rate of the old sub-module in the shortest possible time, thereby achieving consistent street light brightness and improving road safety.

[0024] It should also be noted that multiple elastic metal gaskets 522 are provided between the bottom of the fixed pressure plate 520 and the top of the dynamic pressure plate 523, and the cross-section of the elastic metal gaskets 522 is corrugated. Multiple air guide grooves 521 are provided at the bottom of the fixed pressure plate 520, and the inner wall of each air guide groove 521 matches each upward protrusion of its adjacent elastic metal gasket 522. Multiple flow grooves 524 are provided at the bottom of the dynamic pressure plate 523, and the inner wall of each flow groove 524 matches each downward protrusion of its adjacent elastic metal gasket 522.

[0025] Please see Figure 6 , Figure 7 , Figure 9 and Figure 10When the stacked elastic metal pads 522 are pressed, as the corrugated part of the uppermost elastic metal pad 522 is embedded into the corresponding air guide groove 521, the air circulation area becomes smaller and smaller. With the air flow rate in the environment remaining constant, the gas flow speed will increase when the gas circulation area decreases, which can further improve the heat transfer effect. At this time, the corrugated part of the lowermost elastic metal pad 522 is embedded into the corresponding flow groove 524, and produces the same effect as above, so as to accelerate the light decay speed of the new submodule.

[0026] It should also be noted that the bottom of the pressure plate 520 is provided with rotating holes near the four corners, and the inner wall of each rotating hole is rotatably connected with an adjusting bolt 525. One end of each adjusting bolt 525 passes through the moving pressure plate 523 to its bottom. The outer surface of each adjusting bolt 525 is threaded with an adjusting nut 526. The adjusting bolts 525 and adjusting nuts 526 are designed together to adjust the preload of multiple elastic metal washers 522. The multiple sub-module components 5 are set into three groups: outer ring, middle ring and inner ring, and each group of sub-module components 5 is evenly arranged along the circumferential direction.

[0027] Please see Figures 4 to 7 , Figure 9 and Figure 10 The preload of multiple stacked elastic metal pads 522 is adjusted by turning the adjusting nut 526 outside the adjusting bolt 525. When a single submodule is replaced, the preload of the thermal resistance interface layer in the replaced submodule is adjusted individually, so that the light decay rate of the new submodule is quickly synchronized with the light decay rate of the old submodule. However, during normal use, the outer ring of the street light is closest to the external environment and has the best heat dissipation effect. Conversely, the inner ring has the worst heat dissipation effect. Therefore, by adjusting the preload of the outer ring module assembly 5, the middle ring module assembly 5, and the inner ring module assembly 5 as a whole, the light decay rate can be increased from the outside to the inside. This prevents the light decay of the outer ring from becoming too large after the street light has been used for a long time, and reduces the phenomenon of light spots on the road surface caused by the large difference in brightness of the street light.

[0028] It should also be noted that the bottom of the fixed pressure plate 520 is fixedly connected to the two side edges with scale marking rods 527. One end of each scale marking rod 527 moves through the moving pressure plate 523 to its bottom and is used to determine the adjustment position of the moving pressure plate 523.

[0029] Please see Figure 6 , Figure 7 , Figure 9 and Figure 10When each adjusting bolt 525 is adjusted to change the preload of the elastic metal washer 522, the degree of preload adjustment at each corner is determined by observing the scale on both sides of the scale marking rod 527 during adjustment, and the adjustment level of the preload is recorded.

[0030] It should also be noted that each elastic metal gasket 522 has a long groove opening 528 near the four corners on its top, and each adjusting bolt 525 moves inside each long groove opening 528. Each elastic metal gasket 522 has a square opening 529 near its two sides on its top, and each scale mark rod 527 moves inside each square opening 529.

[0031] Please see Figure 9 and Figure 10 When the stacked elastic metal pads 522 are compressed, the corrugations are flattened, and the two sides of the elastic metal pads 522 will stretch outward. When the pressure of the elastic metal pads 522 is released, the flattened corrugations return to their original shape, and the long slot movable opening 528 will move outside the adjusting bolt 525, thus providing space for the deformation of the elastic metal pads 522. Similarly, the square movable opening 529 provides deformation space for the position of the scale mark rod 527.

[0032] It should also be noted that the heat storage mechanism 51 includes two symmetrically arranged storage boxes 510. Piston plates 512 are slidably connected inside the two storage boxes 510. An expansion cavity 511 is provided between one side of the two piston plates 512 and the inner wall of the corresponding storage box 510. The expansion cavity 511 is filled with expansion gas. An elastic bladder 513 is fixedly connected to the opposite side of the two piston plates 512. The two elastic bladders 513 are placed inside the two storage boxes 510 respectively. The elastic bladders 513 are filled with phase change material. A slow-temperature zone 514 is provided between the two storage boxes 510.

[0033] Please see Figures 6 to 8The heat storage mechanism 51 is added between the aluminum substrate 503 and the thermal resistance interface layer. When the street light is turned on, the LED chip 501 heats up. At this time, the expansion gas inside the expansion chamber 511 expands due to heat, and the expansion force pushes the piston plate 512 outward, thereby pushing the elastic bladder 513 connected to the piston plate 512 outward from the storage box 510. The solid phase change material filled inside the elastic bladder 513 absorbs heat and gradually melts. The melting process absorbs the peak heat when the light is turned on, delaying the rise in junction temperature and preventing a sudden spike in junction temperature. When the lamp is working stably, the phase change material is completely melted and continues to absorb heat in the slow-temperature zone 514, thereby maintaining a stable junction temperature and reducing temperature fluctuations. When the street light is turned off and cooled, the melted phase change material releases heat and gradually solidifies. After cooling, the expanding gas contracts, thereby pulling the piston plate 512 back, and then pulling the elastic bladder 513 back into the storage box 510 to prepare for the next working cycle. By reducing light decay through small junction temperature fluctuations, it does not interfere with the adjustable thermal resistance interface layer, so that the two functions of slowing down light decay and accelerating matching can be achieved separately.

[0034] It should also be noted that the submodule component 5 further includes a die-bonding layer 502, with an LED chip 501 disposed on the top of the die-bonding layer 502 and an aluminum substrate 503 disposed on the bottom of the die-bonding layer 502. The heat storage mechanism 51 is disposed between the bottom of the aluminum substrate 503 and the top of the pressure plate 520. A connecting base 505 is fixedly connected to the bottom of the pressure plate 520, and a limit insertion block 506 is fixedly connected to the bottom of the connecting base 505. A heat dissipation substrate 504 is disposed on the bottom of the dynamic pressure plate 523.

[0035] Please see Figures 6 to 10 The aluminum substrate 503 is a circuit board, and the LED chip 501 is soldered onto this board. The heat generated during operation is dissipated through the heat dissipation substrate 504. The heat dissipation substrate 504 is provided with multiple fins. The metal fins help to accelerate heat dissipation. The die bonding layer 502 is disposed between the aluminum substrate 503 and the LED chip 501. It is used to firmly fix the LED chip 501 to a designated position on the aluminum substrate 503 to ensure that it will not loosen or fall off during subsequent packaging, transportation and use, and is also used to dissipate heat from the LED chip 501 in a timely manner.

[0036] It should also be noted that the top of the main frame 101 is provided with multiple mounting slots 104, and each limiting insertion block 506 is slidably inserted into the interior of each mounting slot 104. The top and bottom of the main frame 101 are respectively provided with a lens cover 4 and a lamp base 2. Multiple upper cover positioning slots 102 and lower cover positioning slots 103 are respectively provided at the top and bottom edges of the main frame 101. Multiple lamp cover clips 41 are fixedly connected to the bottom edge of the lens cover 4, and each lamp cover clip 41 engages with each upper cover positioning slot 102. Multiple base clips 21 are fixedly connected to the top edge of the lamp base 2, and each base clip 21 engages with each lower cover positioning slot 103. A support frame 3 is fixedly installed at the bottom of the lamp base 2.

[0037] Please see Figures 1 to 7 By inserting the limiting insert 506 into the hole of the large inner diameter of the mounting groove 104, and sliding it into the small inner diameter of the mounting groove 104, the sub-module component 5 is quickly installed on the main frame 101 and installed evenly in a circumferential direction. The lens cover 4 covers the outside of the modularly assembled sub-module component 5, which is responsible for light transmission and protection of the sub-module. The lamp base 2 is fixed on the top of the support frame 3. The support frame 3 is used to install on the top of the lamp post. The lamp base 2 serves as an installation platform to support the lighting functional module. When installing the lens cover 4 and the lamp base 2 with the main frame 101, each lamp cover clip 41 is inserted into the corresponding upper cover positioning groove 102 to complete the installation of the lens cover 4 with the main frame 101. Each base clip 21 is inserted into the corresponding lower cover positioning groove 103 to complete the installation of the lamp base 2 with the main frame 101.

[0038] The working principle of this device is as follows: During use, inserting each lampshade clip 41 into the corresponding upper cover positioning slot 102 completes the installation of the lens cover 4 and the main frame 101. Inserting each base clip 21 into the corresponding lower cover positioning slot 103 completes the installation of the lamp base 2 and the main frame 101. By inserting the limiting insert 506 into the mounting slot 104, the sub-module assembly 5 is quickly installed on the main frame 101. The preload of the multiple stacked elastic metal washers 522 is adjusted by turning the adjusting nut 526 outside the adjusting bolt 525. When replacing a single sub-module, the preload of the thermal resistance interface layer in the replaced sub-module is adjusted individually. Therefore, by adjusting the outer ring module assembly 5 as a whole... The preload of the middle circle module component 5 and the inner circle module component 5 allows the light decay rate to increase sequentially from the outside to the inside. By tightening the moving pressure plate 523 towards the fixed pressure plate 520, the stacked elastic metal pads 522 are pressed tightly. The tighter the pressing, the smaller the gaps between the corrugations of the elastic metal pads 522, the larger the contact area between the metals, and the fewer the air gaps, thus slowing down the light decay. Conversely, loosening the stacked elastic metal pads 522 increases the air gaps between the corrugations, thus accelerating the light decay. This method adjusts the light decay rate of the new submodule so that it can synchronize with the light decay rate of the old submodule in the shortest possible time. When the stacked elastic metal pads are pressed... When the uppermost elastic metal pad 522 is embedded into the corresponding air guide groove 521, the air circulation area decreases. With the airflow volume remaining constant, the reduced air circulation area leads to increased airflow speed, further enhancing heat transfer. Simultaneously, the lowermost elastic metal pad 522 is embedded into the corresponding flow groove 524, producing the same effect and accelerating the light decay rate of the new submodule. When adjusting the preload, the degree of preload adjustment at each corner can be determined by observing the scale markings on both sides of the scale rod 527, and the preload adjustment level can be recorded. When the streetlight is activated, the LED chip 501 heats up. At this time, the expansion gas inside the expansion chamber 511 expands due to heat, and the expansion force pushes the piston plate 512 and its connected elastic bladder 513 outward. The solid phase change material filled inside the elastic bladder 513 absorbs heat and gradually melts. The melting process absorbs the peak heat when the light is turned on, slows down the rise in junction temperature, and prevents the junction temperature from soaring. When the street light is working stably, the phase change material is completely melted and continues to absorb heat in the slow-temperature zone 514, thereby maintaining a stable junction temperature and reducing temperature fluctuations. When the street light is turned off and cooled, the melted phase change material releases heat and gradually solidifies. After cooling, the expansion gas contracts, thereby pulling the piston plate 512 back, and then pulling the elastic bladder 513 back into the storage box 510 to prepare for the next working cycle.

[0039] The wiring diagram of the LED chip 501 in this invention is common knowledge in the field, and its working principle is a well-known technology. The appropriate model is selected according to the actual use. Therefore, the control method and wiring layout of the LED chip 501 will not be explained in detail.

[0040] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A modularly assembled surface-mount LED light, comprising a frame assembly (1), the frame assembly (1) including a main frame (101), and a plurality of sub-module assemblies (5) disposed on the top of the main frame (101), characterized in that: The submodule component (5) includes a heat storage mechanism (51) and a thermal resistance mechanism (52). The heat storage mechanism (51) is used to absorb the peak heat during the LED lamp start-up phase. The thermal resistance mechanism (52) is used to adjust the heat conduction at the contact interface to adjust the light decay rate of the new submodule. The thermal resistance mechanism (52) includes a constant pressure plate (520) and a dynamic pressure plate (523). Multiple elastic metal pads (522) are provided between the bottom of the constant pressure plate (520) and the top of the dynamic pressure plate (523). The cross section of the elastic metal pads (522) is corrugated. The multiple elastic metal pads (522) are stacked alternately.

2. The modularly assembled surface-mount LED lamp according to claim 1, characterized in that: The multiple sub-module components (5) are set into three groups: outer circle, middle circle and inner circle, and each group of sub-module components (5) is evenly arranged along the circumferential direction.

3. The modularly assembled surface-mount LED lamp according to claim 2, characterized in that: The bottom of the constant pressure plate (520) is provided with a plurality of air guide grooves (521), and the inner wall of each air guide groove (521) is matched with each upward protruding surface of its adjacent elastic metal gasket (522). The bottom of the dynamic pressure plate (523) is provided with a plurality of flow grooves (524), and the inner wall of each flow groove (524) is matched with each downward protruding surface of its adjacent elastic metal gasket (522).

4. The modularly assembled surface-mount LED lamp according to claim 3, characterized in that: The bottom of the constant pressure plate (520) is provided with rotating holes near the four corners, and the inner wall of each rotating hole is rotatably connected with an adjusting bolt (525). One end of each adjusting bolt (525) passes through the moving pressure plate (523) to its bottom. The outer surface of each adjusting bolt (525) is threaded with an adjusting nut (526). The adjusting bolt (525) and the adjusting nut (526) are designed together to adjust the preload of multiple elastic metal washers (522).

5. The modularly assembled surface-mount LED lamp according to claim 4, characterized in that: The bottom of the constant pressure plate (520) is fixedly connected to the two side edges with scale marking rods (527). One end of each scale marking rod (527) moves through the moving pressure plate (523) to its bottom. The scale marking rods (527) are used to determine the adjustment position of the moving pressure plate (523).

6. The modularly assembled surface-mount LED lamp according to claim 5, characterized in that: Each of the elastic metal gaskets (522) has a long slot (528) near the four corners at the top. Each of the adjusting bolts (525) moves inside each long slot (528). Each of the elastic metal gaskets (522) has a square slot (529) near its two sides at the top. Each of the scale markers (527) moves inside each square slot (529).

7. The modularly assembled surface-mount LED lamp according to claim 6, characterized in that: The heat storage mechanism (51) includes two symmetrically arranged storage boxes (510). Piston plates (512) are slidably connected inside the two storage boxes (510). An expansion cavity (511) is provided between one side of the two piston plates (512) and the inner wall of the corresponding storage box (510), and the expansion cavity (511) is filled with expansion gas.

8. The modularly assembled surface-mount LED lamp according to claim 7, characterized in that: An elastic bladder (513) is fixedly connected to each of the two piston plates (512) on opposite sides. The two elastic bladders (513) are placed inside the two storage boxes (510) respectively, and the interior of the elastic bladders (513) is filled with phase change material. A slow-temperature zone (514) is provided between the two storage boxes (510).

9. The modularly assembled surface-mount LED lamp according to claim 8, characterized in that: The submodule component (5) further includes a die-bonding layer (502), with an LED chip (501) disposed on the top of the die-bonding layer (502) and an aluminum substrate (503) disposed on the bottom of the die-bonding layer (502). The heat storage mechanism (51) is disposed between the bottom of the aluminum substrate (503) and the top of the pressure plate (520). A connecting base (505) is fixedly connected to the bottom of the pressure plate (520), and a limit insertion block (506) is fixedly connected to the bottom of the connecting base (505). A heat dissipation substrate (504) is disposed on the bottom of the dynamic pressure plate (523).

10. The modularly assembled surface-mount LED lamp according to claim 9, characterized in that: The top of the main frame (101) is provided with multiple mounting slots (104), and each of the limiting insertion blocks (506) is slidably inserted into the interior of each mounting slot (104). The top and bottom of the main frame (101) are respectively provided with a lens cover (4) and a lamp base (2). The top and bottom edges of the main frame (101) are respectively provided with multiple upper cover positioning slots (102) and lower cover positioning slots (103). Multiple lamp cover clips (41) are fixedly connected to the bottom edge of the lens cover (4), and each lamp cover clip (41) is engaged with each upper cover positioning slot (102). Multiple base clips (21) are fixedly connected to the top edge of the lamp base (2), and each base clip (21) is engaged with each lower cover positioning slot (103). A support frame (3) is fixedly installed at the bottom of the lamp base (2).

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