Method for operating a solid-state snap-action cooling and heating device

Abstract

The application provides a running method of a solid-state elastic card refrigeration and heating device, and belongs to the technical field of refrigeration and heating. The device comprises a driver, a transmission device and a plurality of parallelly arranged refrigeration and heating modules. Each refrigeration and heating module comprises a sleeve, a pressure head and a solid-state elastic card unit arranged in the sleeve. The plurality of solid-state elastic card units have different phase change temperature zones. The transmission device reciprocates under the driving of the driver and pushes each pressure head to load or unload each solid-state elastic card unit through a plurality of cams. The running method comprises the following steps: detecting a current ambient temperature, determining a target temperature zone, matching a corresponding target solid-state elastic card unit and starting the corresponding refrigeration and heating module. The plurality of solid-state elastic card units with different phase change temperature zones are superimposed, each unit has optimal efficiency in different temperature zones, the most suitable module is accurately called, and the problem of low efficiency of a single material module in a non-suitable temperature zone is solved.

Description

Technical Field

[0001] This invention belongs to the field of refrigeration and heating technology, and more specifically, relates to the operation method of a solid-state spring-loaded refrigeration and heating device. Background Technology

[0002] With the global energy crisis and environmental issues becoming increasingly prominent, green and efficient cooling / heating technologies have become a focus of industry research and development. Elastic-calorimetric (elastomer) refrigeration technology, based on the latent heat of stress-induced martensitic phase transformation in shape memory alloys, is gradually becoming an ideal alternative to traditional refrigeration technologies due to its environmental friendliness, high efficiency, sustainability, and ease of operation. Currently, several refrigeration prototypes have been developed using this technology. By optimizing the loading frequency, heat transfer efficiency, and employing series active regeneration methods, some prototypes can achieve a cooling power of 260W and a cooling temperature range of 50.6K (277.1K to 327.7K), demonstrating promising application prospects.

[0003] However, the cooling performance of shape memory alloys is highly sensitive to temperature. Single-component shape memory alloys can only produce significant adiabatic temperature changes within a specific temperature range. For example, some NiTi shape memory alloys exhibit significant adiabatic temperature changes at low temperatures but weak effects at high temperatures, while others perform optimally near room temperature, showing poor performance at low and high temperatures. This leads to problems such as functional instability and a sharp drop in cooling / heating efficiency in areas with large temperature differences or frequent temperature fluctuations when using cooling / heating equipment made from a single shape memory alloy. This fails to meet users' needs for stable operation under different temperature conditions and severely limits the large-scale promotion and application of elastothermal cooling technology. Summary of the Invention

[0004] The purpose of this invention is to provide an operating method for a solid-state spring-loaded cooling and heating device. By using a cascaded design of multi-component solid-state spring-loaded unit modules, it achieves optimal cooling and heating efficiency over a wide temperature range, overcoming the temperature adaptation limitations of a single module.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A method for operating a solid-state spring-loaded cooling and heating device is provided. The solid-state spring-loaded cooling and heating device includes a driver, a transmission device, and multiple cooling and heating modules arranged in parallel. Each cooling and heating module includes a sleeve, a pressure head, and a solid-state spring-loaded unit placed within the sleeve. The solid-state spring-loaded units in the multiple cooling and heating modules have different phase change temperature zones. The transmission device reciprocates under the drive of the driver and pushes the pressure head of each cooling and heating module through multiple cams to load or unload each solid-state spring-loaded unit, so that the multiple solid-state spring-loaded units have optimal cooling and heating efficiency in different temperature ranges. The operation method of the solid-state spring-loaded cooling and heating device includes the following steps: S1: Detect the current ambient temperature and determine the target temperature range to which the current ambient temperature belongs; S2: Match the target solid-state cartridge unit corresponding to the target temperature range, and start the target cooling and heating module corresponding to the target solid-state cartridge unit.

[0006] In one possible implementation, the plurality of cooling and heating modules include a first temperature zone cooling and heating module, a second temperature zone cooling and heating module, and a third temperature zone cooling and heating module. The activation of the target cooling and heating module corresponding to the target solid-state cartridge unit includes the following steps: Based on the current ambient temperature, a target solid-state cartridge unit matching the current ambient temperature is determined from the solid-state cartridge units in the first temperature zone cooling and heating module, the second temperature zone cooling and heating module, and the third temperature zone cooling and heating module. Based on the optimal phase transition temperature value of the target solid-state cartridge unit, determine the target stress that drives the solid-state cartridge unit to undergo a phase transition; The loading force driving the target solid-state spring-loaded unit is calculated based on the target stress, and the target solid-state spring-loaded unit is loaded or unloaded according to the loading force, so that the heat transfer medium in the target cooling and heating module is heated or cooled.

[0007] In one possible implementation, the solid-state cartridge cooling and heating device further includes: a pump; If the actual cooling and heating efficiency of the target cooling and heating module does not meet the target cooling and heating efficiency, perform at least one of the following operations: A. Increase the driving frequency of the driver for the target solid-state ejector unit; B. Increase the flow rate of the pump to increase the flow rate of the heat transfer medium in the target cooling and heating module.

[0008] In one possible implementation, the solid-state spring-loaded cooling and heating device further includes an independently configured main controller and a temperature sensor; The temperature sensor is used to detect the current ambient temperature in real time and convert the temperature detection signal into an electrical signal to be sent to the main controller; The main controller has a built-in storage module with temperature range division rules, which is used to receive electrical signals sent by temperature sensors, match the corresponding target temperature range and target solid-state spring card unit, and output control signals to start the corresponding target cooling and heating module.

[0009] In one possible implementation, one group of the plurality of cooling and heating modules is selected to integrate a main control unit, and the remaining groups are respectively configured with slave control units; The main control unit is used to receive ambient temperature detection signals, determine the target cooling and heating module based on preset temperature range rules, and send start and stop commands to the corresponding slave control units to achieve unified scheduling of all cooling and heating modules.

[0010] In one possible implementation, the plurality of cooling and heating modules include at least two of the following: a first temperature zone cooling and heating module, a second temperature zone cooling and heating module, and a third temperature zone cooling and heating module; The first temperature zone cooling and heating module includes a first solid-state spring clip unit, the second temperature zone cooling and heating module includes a second solid-state spring clip unit, and the third temperature zone cooling and heating module includes a third solid-state spring clip unit. The austenitic phase transformation end temperature Af1 of the first solid-state spring clip unit is greater than the austenitic phase transformation end temperature Af2 of the second solid-state spring clip unit, and the austenitic phase transformation end temperature Af2 of the second solid-state spring clip unit is greater than the austenitic phase transformation end temperature Af3 of the third solid-state spring clip unit.

[0011] In one possible implementation, the phase transformation temperature range of each solid spring card unit is characterized by its austenitic phase transformation end temperature Af or martensitic phase transformation end temperature Mf, where Af is the temperature at which the material completes the transformation from martensite to austenite, and is suitable for temperature range characterization under refrigeration conditions; and Mf is the temperature at which the material completes the transformation from austenite to martensite, and is suitable for temperature range characterization under heating conditions. Among them, the Af points or Mf points of different solid-state cartridge units are different from each other to form a gradation relationship covering a wide temperature range.

[0012] In one possible implementation, the solid-state ejector unit includes multiple solid-state ejector material components, and the multiple solid-state ejector material components are stacked in sequence. The solid spring clip material is provided with a gap between itself and the inner wall of the sleeve. The gap is used to reserve expansion space when the solid spring clip unit is loaded.

[0013] In one possible implementation, the solid-state spring-loaded cooling and heating device further includes a wide-temperature-range cooling and heating module arranged in parallel with the plurality of cooling and heating modules; The wide-temperature-range cooling and heating module includes multiple solid-state spring clip sub-units, each of which is composed of at least two types of solid-state spring clip materials, each of which has a different phase transition temperature range.

[0014] In one possible implementation, when the current ambient temperature is within the overlapping range of adjacent temperature zones, the two cooling and heating modules corresponding to the adjacent temperature zones are simultaneously activated to work together.

[0015] The beneficial effects of the operating method of the solid-state spring-loaded cooling and heating device provided by this invention are as follows: Compared with the prior art, this solution adopts a cascaded structure of multiple solid-state spring-loaded units with different phase change temperature zones, each solid-state spring-loaded unit corresponding to the temperature range with optimal cooling and heating efficiency. A drive mechanism drives a transmission device to reciprocate, and the transmission device pushes the pressure head of each cooling and heating module through multiple cams, loading or unloading each solid-state spring-loaded unit. This achieves synchronous or independent drive control of multiple modules by a single drive source, simplifying the drive system structure and reducing control complexity. By detecting the current ambient temperature, matching the target temperature range, and activating the control logic of the corresponding module, the module containing the solid-state spring-loaded unit most suitable for the current ambient temperature is precisely called into operation, enabling each cooling and heating module to achieve optimal performance within its corresponding temperature range. This avoids the inefficiency and insufficient accuracy of single-material modules in non-suitable temperature ranges. Simultaneously, the collaborative control mechanism formed by the cascaded structure enables smooth transitions between temperature ranges, reducing temperature fluctuations. This solution achieves the core objective of optimal cooling and heating efficiency over a wide temperature range by using a multi-phase variable temperature zone spring-loaded module stacking, a cam drive structure, and a temperature range matching control in a coordinated design. At the same time, it also improves the integration and reliability of the device and reduces manufacturing costs. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A flowchart of the operation method of the solid-state spring-loaded cooling and heating device provided by the present invention; Figure 2 This is a schematic diagram of the structure of a solid-state spring-loaded cooling and heating device provided in one embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a solid-state spring-loaded cooling and heating device provided in another embodiment of the present invention; Figure 4 This is a schematic diagram of the solid-state spring-loaded cooling and heating device provided in another embodiment of the present invention.

[0018] In the diagram: 100, Cooling and heating module; 101, Solid-state spring card unit; 102, Driver; 200, Backup cooling and heating module; 300, Controller. Detailed Implementation

[0019] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0020] Unless otherwise explicitly specified, the use of terms such as "first," "second," or "third" is intended to distinguish different objects, not to describe a specific order.

[0021] Unless otherwise expressly defined, the use of directional terms such as “center,” “lateral,” “longitudinal,” “horizontal,” “vertical,” “top,” “bottom,” “inner,” “outer,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “clockwise,” “counterclockwise,” “high,” and “low” to indicate orientation or positional relationships is based on the orientation and positional relationships shown in the accompanying drawings and is only for the convenience of describing the invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of the invention.

[0022] Please see Figure 1 and Figure 2 The operating method of the solid-state spring-loaded cooling and heating device provided by the present invention will now be described. The operating method of the solid-state spring-loaded cooling and heating device is applied to the device, which includes a driver 102, a transmission device, and multiple cooling and heating modules 100 arranged in parallel. Each cooling and heating module 100 includes a sleeve, a pressure head, and solid-state spring-loaded units 101 placed within the sleeve. The solid-state spring-loaded units 101 in the multiple cooling and heating modules 100 have different phase change temperature zones. The transmission device reciprocates under the drive of the driver 102 and pushes the pressure head of each cooling and heating module 100 through multiple cams, loading or unloading each solid-state spring-loaded unit 101, so that the multiple solid-state spring-loaded units 101 have optimal cooling and heating efficiency in different temperature zones.

[0023] The operating method includes the following steps: S1: Detect the current ambient temperature and determine the target temperature range to which the current ambient temperature belongs; S2: Match the target solid-state cartridge unit corresponding to the target temperature range, and start the target cooling and heating module corresponding to the target solid-state cartridge unit.

[0024] The operation method of the solid-state spring-loaded cooling and heating device provided by this invention, compared with the prior art, adopts a cascaded structure of multiple solid-state spring-loaded units 101 with different phase change temperature zones for cooling and heating modules 100. Each solid-state spring-loaded unit 101 corresponds to the temperature range with optimal cooling and heating efficiency. A driver 102 drives a transmission device to reciprocate. The transmission device pushes the pressure head of each cooling and heating module 100 through multiple cams, loading or unloading each solid-state spring-loaded unit 101. This achieves synchronous drive control of multiple modules from a single drive source, simplifying the drive system structure and reducing control complexity. By detecting the current ambient temperature, matching the target temperature range, and activating the control logic of the corresponding module, the module containing the solid-state spring-loaded unit 101 most suitable for the current ambient temperature is precisely called into operation. This allows each cooling and heating module 100 to achieve optimal performance within its corresponding temperature range, avoiding the inefficiency and insufficient accuracy of single-material modules in non-suitable temperature ranges. Simultaneously, the collaborative control mechanism formed by the cascaded structure enables smooth transitions between temperature ranges, reducing temperature fluctuations. This solution achieves the core objective of optimal cooling and heating efficiency over a wide temperature range by using a multi-phase variable temperature zone spring-loaded module stacking, a cam drive structure, and a temperature range matching control in a coordinated design. At the same time, it also improves the integration and reliability of the device and reduces manufacturing costs.

[0025] It should be noted that: The solid-state spring unit 101 is made of shape memory alloy, which can undergo martensitic phase transformation and reverse phase transformation through stress-induced transformation. It absorbs or releases latent heat during loading (applying stress) and unloading (releasing stress), thereby realizing the function of cooling or heating.

[0026] It should be noted that the different phase transformation temperature ranges in this application refer to the differences in the phase transformation characteristic temperatures (such as the austenitic phase transformation end temperature Af or the martensitic phase transformation end temperature Mf) of each solid-state spring card unit 101, so that each material can achieve optimal cooling or heating performance in different ambient temperature ranges.

[0027] Compared to the temperature range of a single cooling and heating module 100, the wide temperature range significantly expands the stable operating temperature range of the system through the superposition of multi-phase temperature-changing zone materials, enabling it to meet the optimal cooling and heating efficiency from low to high temperatures.

[0028] Regarding the loading method of the drive mechanism, the transmission device is equipped with multiple cams, each cam corresponding to and engaging with the pressure head of each cooling / heating module 100. When the driver 102 drives the transmission device to reciprocate, each cam moves synchronously with the transmission device, pushing the corresponding pressure head to reciprocate along the sleeve axis, thereby loading or unloading each solid-state spring clip unit 101. By adjusting the profile curve of the cams, the stroke and loading force of each pressure head can be controlled to adapt to the differentiated driving force requirements of the solid-state spring clip units 101 in different temperature zones.

[0029] In one embodiment, the plurality of cooling and heating modules 100 include at least two combinations of a first temperature zone cooling and heating module, a second temperature zone cooling and heating module, and a third temperature zone cooling and heating module. The first temperature zone cooling and heating module includes a first solid-state spring clip unit, the second temperature zone cooling and heating module includes a second solid-state spring clip unit, and the third temperature zone cooling and heating module includes a third solid-state spring clip unit. The austenitic phase transformation end temperature Af1 of the first solid-state spring clip unit is greater than the austenitic phase transformation end temperature Af2 of the second solid-state spring clip unit, and the austenitic phase transformation end temperature Af2 of the second solid-state spring clip unit is greater than the austenitic phase transformation end temperature Af3 of the third solid-state spring clip unit.

[0030] In this embodiment, step S2, which involves activating the target cooling and heating module corresponding to the target solid-state cartridge unit, includes the following steps: S21: Based on the current ambient temperature, determine the target solid-state ejector unit that matches the current ambient temperature from the solid-state ejector units in the first temperature zone cooling and heating module, the second temperature zone cooling and heating module, and the third temperature zone cooling and heating module. S22: Determine the target stress that drives the solid-state explosive unit to undergo a phase change based on the optimal phase change temperature of the target solid-state explosive unit; S23: Calculate the loading force of the target solid-state cartridge unit based on the target stress, and drive the target solid-state cartridge unit to load or unload according to the loading force, so as to raise or lower the temperature of the heat transfer medium in the target cooling and heating module.

[0031] Specifically, the main controller 300 has a built-in phase transition temperature-stress database for each solid-state spring-loaded unit 101. This database pre-stores the target stress parameters (e.g., 600-800 MPa for high-temperature materials, 800-1000 MPa for room-temperature materials, and 300-400 MPa for low-temperature materials) required to drive a complete phase transition for materials with different phase transition temperatures (e.g., NixTiyZm series alloys). There is a correlation between phase transition temperature and required driving stress: generally, materials with higher phase transition temperatures require greater driving stress to induce a complete phase transition. Based on the target solid-state spring-loaded unit and its phase transition temperature matched in step S2, the main controller 300 retrieves the corresponding target stress from the database.

[0032] The main controller 300 calculates the required loading force based on the target stress and the cross-sectional area of ​​the target solid-state spring unit using the formula "loading force = target stress × material cross-sectional area".

[0033] Subsequently, the main controller 300 sends control commands to the driver 102 of the target module. The driver 102, according to the calculated loading force, performs loading or unloading operations on the solid spring clip unit 101 inside the sleeve through the pressure head. During loading, the material undergoes an austenitic-to-martensite phase transformation and releases heat, causing the heat transfer medium inside the module to heat up (heating mode); during unloading, a reverse martensite-to-austenite phase transformation occurs and heat is absorbed, causing the heat transfer medium to cool down (cooling mode), achieving a stable output of heat and cold.

[0034] Furthermore, when determining the target stress, if the phase transition temperature of the target solid-state spring card unit is in the critical region of two adjacent temperature range materials, the main controller 300 can select one of the two adjacent modules to start or start them simultaneously according to the preset temperature range overlap rule, so as to achieve a smooth transition when switching temperature ranges and avoid temperature fluctuations.

[0035] It should be noted that there is a synergistic relationship between step S22 and step S2: step S2 matches the target material according to the ambient temperature, while step S22 precisely matches the driving stress according to the phase change temperature of the material. Together, they form a dual control mechanism of "temperature range matching - stress adaptation" to ensure that the target module's material can undergo a complete phase change and release the maximum latent heat when it is working, thereby achieving the optimal cooling and heating efficiency.

[0036] Furthermore, regarding the cross-sectional area design of the solid-state spring clip unit 101 in each temperature zone module, since the phase change induced stress of the materials differs in each temperature zone, to ensure that each module can obtain an appropriate stress level when the driver 102 outputs the same loading force, the cross-sectional area of ​​the solid-state spring clip unit 101 in different temperature zone modules is designed differently according to its phase change induced stress requirements. Specifically, the phase change induced stress of the solid-state spring clip unit in the high-temperature zone is higher, so its cross-sectional area is relatively smaller to obtain a larger driving stress under the same loading force; the phase change induced stress of the solid-state spring clip unit in the low-temperature zone is lower, so its cross-sectional area is relatively larger to avoid material damage due to excessive stress. This differentiated design ensures that each temperature zone module can operate normally under the same driving source output.

[0037] In one embodiment, the solid-state cartridge cooling and heating device further includes a pump. When the actual cooling and heating efficiency of the target cooling and heating module does not meet the target cooling and heating efficiency, at least one of the following operations is performed: Operation A: Increase the driving frequency of the target solid-state ejector unit by the driver 102. The main controller 300 sends a frequency adjustment command to the driver 102, gradually increasing the loading / unloading cycle frequency of the target solid-state ejector unit within a preset frequency range until the actual efficiency reaches the target efficiency. Increasing the frequency can increase the number of phase changes of the material per unit time, thereby increasing the rate of heat and cold output.

[0038] Operation B: Increase the pump flow rate to increase the flow rate of the heat transfer medium in the target cooling / heating module. The main controller 300 sends a flow regulation command to the fluid pump of the target module to increase the circulation flow rate of the heat transfer medium within the pump's rated flow range. The increased flow rate can improve the heat exchange efficiency between the heat transfer medium and the solid-state spring card unit 101, reduce the accumulation and loss of heat and cold in the module, and thus improve the overall cooling / heating efficiency.

[0039] The two adjustment methods can be used individually or in combination to address efficiency issues in different scenarios.

[0040] In one embodiment, the solid-state cartridge cooling and heating device further includes an independently configured main controller 300 and a temperature sensor.

[0041] A temperature sensor is installed in the environmental sensing area of ​​the device to ensure that the detected temperature accurately reflects the ambient temperature. The sensor collects temperature data in real time and converts the temperature detection signal into a standard electrical signal via wired or wireless communication, sending it to the main controller 300.

[0042] The main controller 300 has a built-in storage module containing pre-stored temperature range division rules (such as the correspondence between temperature ranges and target temperature ranges, and the matching rules between target temperature ranges and target materials and modules). After receiving the electrical signal from the temperature sensor, the main controller 300 analyzes the temperature value using a built-in algorithm, quickly matches the corresponding target temperature range and target solid-state cartridge unit according to the stored rules, and outputs a start control signal to the target cooling / heating module, while simultaneously outputting a standby signal to other modules.

[0043] Specifically, the main controller 300 uses an embedded microcontroller 300, such as the STM32 series.

[0044] Furthermore, the temperature range division rules also include the logic for determining the overlapping temperature range: when the detected ambient temperature is within the overlapping range of two adjacent temperature ranges, the main controller 300 selects the module with better efficiency in the overlapping range to start, or periodically switches between the two modules, based on the current operating mode (cooling or heating) and efficiency curve of the device, in order to achieve the best energy efficiency ratio.

[0045] In another embodiment, a main control unit is selected from a plurality of cooling and heating modules 100, and the remaining modules are configured with slave control units, as specifically implemented as follows: The main control unit is integrated within the selected cooling / heating module 100, serving as both the control function of that module and the unified scheduling function of the entire device. The main control unit includes an ambient temperature detection signal receiving module, a preset temperature range rule processing module, and a command sending module. It can acquire ambient temperature detection signals through the device's temperature sensor, determine the target cooling / heating module based on preset temperature range rules, and generate corresponding start / stop commands.

[0046] Each cooling / heating module 100, which is not part of the main control unit, is equipped with an independent slave control unit. The slave control unit establishes a connection with the main control unit through a communication bus (such as a CAN bus) and receives start / stop commands sent by the main control unit in real time. When a start command is received, the slave control unit controls the corresponding module's driver 102, fluid pump, and other components to start working; when a stop command is received, it controls the corresponding module to stop and enter standby mode.

[0047] The main control unit also has a fault monitoring function. When the main control unit detects a fault in a slave control unit or corresponding module, it automatically removes the module from the work queue and reassigns the temperature range coverage task. At the same time, it sends a compensation start command to the backup cooling and heating module 200 to ensure the integrity of the overall system function.

[0048] When selecting an integrated main control unit, the room temperature zone module is preferred, as it falls between the high temperature zone module and the low temperature zone module and is used more frequently.

[0049] Multiple solid-state spring-loaded card units 101 include at least two arbitrary combinations of a first-temperature-zone spring-loaded card material, a second-temperature-zone spring-loaded card material, and a third-temperature-zone spring-loaded card material; wherein, the phase transition temperature of the first-temperature-zone spring-loaded card material is greater than the phase transition temperature of the second-temperature-zone spring-loaded card material, and the phase transition temperature of the second-temperature-zone spring-loaded card material is greater than the phase transition temperature of the third-temperature-zone spring-loaded card material. That is, when two materials are selected, any two materials from the three temperature zones can be selected for combination according to the temperature range of the operating environment; when three materials are selected, the temperature ranges of the three groups of materials decrease sequentially. The phase transition temperature range of the first-temperature-zone spring-loaded card material (i.e., the high-temperature zone spring-loaded card material) is 30–50°C, the phase transition temperature range of the second-temperature-zone spring-loaded card material (i.e., the room-temperature zone spring-loaded card material) is -10–30°C, and the phase transition temperature range of the third-temperature-zone spring-loaded card material (i.e., the low-temperature zone spring-loaded card material) is -30–-10°C. The temperature ranges of each group of solid-state spring card units 101 are interconnected, forming a continuous wide temperature range coverage, ensuring that the cooling and heating functions of the equipment are seamlessly connected without any performance gaps when switching between different ambient temperatures.

[0050] The phase transformation temperature range of each temperature zone spring-loaded material is defined and distinguished by its phase transformation temperature (i.e., the characteristic temperature range in which the material undergoes martensitic or reverse phase transformation), rather than by its composition. This provides a clear physical definition and engineering basis for the technical feature of "different phase transformation temperature zones" in this invention. Specifically, the phase transformation temperature zone of each of the multiple solid spring-loaded units 101 is characterized by its austenitic phase transformation end temperature Af or martensitic phase transformation end temperature Mf. Af is the temperature at which the material completes its transformation from martensite to austenite, applicable to refrigeration conditions (unloading and heat absorption); Mf is the temperature at which the material completes its transformation from austenite to martensite, applicable to heating conditions (loading and heat release). The Af or Mf points of different solid spring-loaded units 101 are different from each other to form a gradation relationship covering a wide temperature range.

[0051] In practical applications, the device includes at least two cooling and heating modules 100, meaning that at least two materials can be selected for arbitrary combination depending on the temperature range of the operating environment. High-temperature environments (such as outdoor summer and high-temperature industrial scenarios): A combination of first-temperature zone spring clip material and second-temperature zone spring clip material can be selected to ensure stable heating or cooling in the range of high temperature above 30℃ and room temperature. For normal temperature environments (such as indoor offices and home use): a combination of second-zone and third-zone spring card materials can be selected to adapt to a temperature range of -10℃ to 30℃ and meet daily cooling and heating needs. Wide temperature range environment (such as high-altitude areas with large temperature differences, outdoor mobile devices): The first temperature zone spring card material, the second temperature zone spring card material and the third temperature zone spring card material can be selected to cover a wide temperature range from -10℃ to 50℃, so as to achieve stable operation in all scenarios.

[0052] Specifically, by setting three different phase-change temperature zones for the spring-loaded materials, each module undertakes the cooling and heating tasks within its optimal efficiency temperature range. The three work together to form a tiered coverage across a wide temperature range. When switching temperature zones, the efficiency of the module in the previous temperature zone has not yet decreased significantly before the module in the next temperature zone can start working. The coordinated output of the two in the overlapping temperature zones ensures a smooth transition of the overall output efficiency and avoids the efficiency degradation phenomenon that occurs at the temperature zone boundaries of a single material module.

[0053] Specifically, the solid-state spring card unit 101 in the cooling and heating module 100 is made of NixTiyZm shape memory alloy, where Z is at least one of V, La, and Cu or its content is zero. The cooling / heating temperature range of the material is precisely controlled by adjusting the element ratio.

[0054] The specific components of the solid-state cartridge unit 101 corresponding to each temperature range are as follows: The first temperature zone spring-loaded material has a composition of NixTiy (zero Z content), satisfying x + y = 100, where x ranges from 49 to 50, preferably x = 49.2 to 49.8. This composition is a shape memory alloy with a phase transformation temperature range of 30-50°C, capable of undergoing significant adiabatic temperature changes under stress-induced conditions at high temperatures. In this embodiment, the martensitic phase transformation end temperature Mf of the first temperature zone spring-loaded material is controlled above 30°C, and the austenitic phase transformation end temperature Af is controlled below 50°C, ensuring sufficient phase transformation driving force within the 30-50°C temperature range.

[0055] The second-temperature zone spring-loaded material has a composition of NixTiy (zero Z content), satisfying x + y = 100, with x ranging from 50 to 51, preferably x = 50.1 to 50.5. This composition is a shape memory alloy with a phase transformation temperature range of -10 to 30°C, suitable for room temperature and near-room temperature environments, exhibiting stable latent heat of phase transformation and high cooling and heating efficiency. In this embodiment, the martensitic phase transformation termination temperature Mf of the second-temperature zone spring-loaded material is controlled below -10°C, and the austenitic phase transformation termination temperature Af is controlled around 30°C, ensuring excellent phase transformation reversibility within the -10 to 30°C temperature range.

[0056] The composition of the third-temperature zone spring card material is NixTiyZm (Z content is not zero), where Z is at least one of V, La, and Cu, satisfying x+y+m=100 (m is the mass percentage of Z element), with x ranging from 49 to 51 and m ranging from 4 to 8, preferably x=50-50.8 and m=6. The introduction of doping elements (such as V) lowers the phase transformation temperature range of the solid spring card, stabilizing it at -30 to -10℃, maintaining good phase transformation characteristics and latent heat release absorption capacity even at low temperatures. In this embodiment, the martensitic phase transformation end temperature Mf of the third-temperature zone spring card material is controlled below -30℃, and the austenitic phase transformation end temperature Af is controlled at around -10℃, ensuring stable latent heat of phase transformation within the low-temperature range of -30 to -10℃.

[0057] Furthermore, the Ni / Ti ratio differences in the spring card materials for each temperature zone are achieved through precise batching in the smelting process: the first temperature zone uses a Ti-rich formulation (Ni < 50 at%) to reduce the sensitivity of the martensitic phase transformation temperature to compositional fluctuations; the second temperature zone uses a near-equal atomic ratio formulation (Ni ≈ 50 at%) to obtain the widest phase transformation hysteresis window; the third temperature zone, based on the near-equal atomic ratio, is doped with V, with V atoms partially replacing Ni or Ti sites, thereby shifting the temperature range downward by changing the lattice electron concentration and phase transformation driving force. The phase transformation temperature range of the materials in each temperature zone is controlled within the range of 15-20℃, ensuring a 5-10℃ overlap between adjacent temperature zones. This overlap provides a buffer for temperature zone switching, avoiding working blind spots caused by temperature fluctuations.

[0058] By adjusting the elemental ratio of the NixTiyZm alloy, the cooling / heating temperature range of the material was controlled, ensuring that the phase transformation characteristics of the material in each temperature zone were highly compatible with the target temperature range, thereby improving the cooling and heating efficiency of the equipment at the corresponding temperature.

[0059] In addition, the selected NiTi-based shape memory alloy has good mechanical properties and phase transformation stability, long cycle life, and is green and environmentally friendly with no harmful emissions, which meets the requirements of sustainable development. The selection of doping elements takes into account both the phase transformation regulation effect and the processing performance of the material, which is convenient for industrial production.

[0060] Furthermore, the temperature range division rules stored in the main controller 300 are mapped to the phase transition temperatures Af / Mf points of each group of solid-state spring clip units 101: each temperature range interval in the temperature range division rules corresponds to at least one Af point or Mf point. When the main controller 300 determines the target temperature range, it quickly matches the corresponding target solid-state spring clip unit according to the mapping relationship. The establishment of this mapping relationship directly links the material physical properties with the system control logic, reduces intermediate conversion steps, and improves the system's response speed and control accuracy.

[0061] In some embodiments, the pressure head cooperates with the cam of the transmission device and reciprocates along the sleeve axis under the push of the cam. In specific operation, the driver 102 applies pressure to the solid spring clip unit 101 in the sleeve through the pressure head (loading process), causing the material to undergo a martensitic phase transformation and release heat; then the driver 102 removes the pressure (unloading process), and the material returns to the austenitic phase and absorbs the surrounding heat; through the cyclic operation of loading and unloading, heat or cold is continuously generated, and then the energy is output through the heat transfer medium to realize the cooling or heating function.

[0062] Preferably, when the main controller 300 sends a loading force command to the driver 102, it will simultaneously make corrections and compensations based on the current number of cycles of the solid-state card unit 101. When the number of cycles of the material exceeds a preset threshold, the main controller 300 will appropriately increase the loading force according to the stored fatigue correction coefficient to compensate for the insufficient phase change driving force caused by material fatigue, so as to ensure that the material can undergo a complete phase change throughout its entire life cycle and maintain stable cooling and heating efficiency.

[0063] Preferably, a gap is reserved between the solid spring clip unit 101 and the inner wall of the sleeve. This gap is used to allow for expansion space when the solid spring clip unit 101 is loaded. The width of the reserved gap is determined based on the expansion coefficient and maximum loading pressure of the solid spring clip unit 101. For example, the width of the reserved gap is 0.5-2 mm.

[0064] During loading, the lateral expansion rate of the solid spring clip unit 101 is approximately 1%-3%. The width of the reserved gap must ensure that the material does not contact the inner wall of the sleeve even under maximum expansion. For example, if the diameter of the solid spring clip unit 101 is 50mm and the maximum lateral expansion rate is 3%, the inner diameter of the sleeve is designed to be 51.5-52mm, with a reserved gap of 1.5-2mm to fully accommodate the expansion of the material.

[0065] The shape of the reserved gap is adapted to the cross-sectional shape of the inner wall of the sleeve and the solid spring clip unit 101. If the solid spring clip unit 101 is circular, the reserved gap is annular; if the solid spring clip unit 101 is square, the reserved gap is rectangular, ensuring that the expansion of the solid spring clip unit 101 in all directions can be fully accommodated.

[0066] The reserved gap design effectively solves the problem of lateral expansion interference during the loading process of the solid-state spring clip unit 101, avoids stress damage to the solid-state spring clip unit 101 caused by compression, and ensures the smooth progress of the phase change process of the solid-state spring clip unit 101. This maintains the stability of cooling and heating efficiency and extends the service life of the material. At the same time, the existence of the gap also reduces heat conduction between the material and the inner wall of the sleeve, reduces heat loss, and further improves the energy utilization efficiency of the system.

[0067] The sleeve has an inner wall partition that covers the entire area of ​​the inner wall, including the cylindrical surface opposite to the solid spring clip unit 101 and the end faces at both ends, to ensure all-round protection and heat insulation.

[0068] The thickness of the partition is set according to functional requirements, such as 0.1-0.5mm. If it is too thick, it will occupy too much reserved gap space, and if it is too thin, it cannot guarantee the buffering and heat insulation effect. The connection method between the partition and the inner wall of the sleeve is selected according to the material characteristics: if Teflon or POM film is used, it is fixed by brushing; if nylon, polyester or silicone film is used, it is fixed by bonding and pressure to ensure that the partition does not fall off or deform during long-term use.

[0069] On the one hand, the soft partition can buffer the expansion of the solid spring clip unit 101, avoiding rigid collisions between the material and the inner wall of the sleeve, thus further protecting the material. On the other hand, the thermal insulation performance of the partition can effectively block heat transfer between the inside and outside of the sleeve, reducing the loss of cold or heat generated by the solid spring clip unit 101 through the sleeve wall, ensuring that heat exchange is concentrated between the flow cavity and the heat transfer medium, significantly improving the energy utilization efficiency of the system, while also reducing the impact of ambient temperature on the working state of the material and enhancing the stability of the system.

[0070] In some embodiments, the solid-state spring clip unit 101 is a sheet with a thickness of 0.1-1mm. The specific dimensions are adjusted according to the sleeve specifications and cooling / heating power requirements. Multiple sheets are stacked sequentially along the sleeve axis, ensuring a tight fit between the sheets without significant gaps to guarantee effective force transmission. The number of sheets stacked is set according to the module power requirements; each cooling / heating module 100 contains 5-20 sheets.

[0071] Since each piece of material is an independent stress-bearing unit, during loading and unloading, stress is only applied to a single piece. Even if a piece is damaged such as by cracks, only that single piece will fail and will not affect the normal operation of other pieces.

[0072] The sheet-like shape and stacked arrangement design solve the problems of concentrated stress and easy overall failure of traditional block materials, thus improving the service life of the solid-state spring-loaded unit 101 and the reliability of the system. The stacked material experiences uniform stress distribution during loading, effectively reducing the damaging effects of loading forces, preventing buckling deformation, and ensuring the sufficiency and stability of the phase transition process. Simultaneously, the flexible adjustment of the sheet size and the number of stacked layers allows the system to be designed to match power requirements, enhancing its scalability and customization capabilities.

[0073] Furthermore, the sheet thickness of the solid-state spring clip unit 101 in different temperature zones is optimized according to its phase transition temperature: the sheet thickness of the first solid-state spring clip unit is 0.3-0.8 mm, the sheet thickness of the second solid-state spring clip unit is 0.2-0.6 mm, and the sheet thickness of the third solid-state spring clip unit is 0.1-0.4 mm. Materials with lower phase transition temperatures require less driving force and can use thinner sheets to reduce internal stress and improve phase transition response speed; materials with higher phase transition temperatures need to withstand greater driving force and can use thicker sheets to enhance structural strength.

[0074] In addition, in order to meet the flow requirements of the heat transfer medium inside the sleeve, a flow cavity needs to be set inside the sleeve. This flow cavity can be composed of two parts together or separately: The first part is the flow gap: a 0.5-2mm gap is reserved between the solid spring clip unit 101 (plate-shaped or block-shaped) and the inner wall of the sleeve. This gap extends along the length of the sleeve, forming a fluid flow channel. When designing the flow gap size, the expansion factor of the solid spring clip unit 101 needs to be considered. That is, even after the solid spring clip unit 101 expands, the aforementioned flow gap can still exist to ensure the flow of the heat exchange medium.

[0075] The second part is the overcurrent perforation: multiple overcurrent perforations are formed on the solid-state ejector unit 101. The shape of the overcurrent perforation can be polygonal or circular, the diameter is 1-5mm, and the arrangement can be radial. When the solid-state ejector units 101 are stacked, the overcurrent perforations on each group of solid-state ejector units 101 are aligned in sequence to form a channel that runs through the stacking direction of the solid-state ejector units 101.

[0076] The heat exchange medium can flow through flow gaps, flow perforations, or a combination of both, ensuring full contact with the solid-state spring clip unit 101 for efficient heat exchange. The number and diameter of the flow perforations can be adjusted according to the cooling and heating power requirements to ensure that the fluid flow rate matches the latent heat release / absorption rate of the material.

[0077] In some embodiments, please refer to Figure 3 and Figure 4 In addition to the aforementioned multiple cooling and heating modules 100, this solid-state spring-loaded cooling and heating device also includes a wide-temperature-range cooling and heating module 200 connected in parallel with the multiple cooling and heating modules 100. The structure of the wide-temperature-range cooling and heating module 200 is the same as that of the aforementioned cooling and heating modules 100, except that the wide-temperature-range cooling and heating module 200 includes multiple solid-state spring-loaded sub-units, each composed of at least two types of solid-state spring-loaded materials, each with a different phase transition temperature range. Through the combined use of multiple materials, the wide-temperature-range cooling and heating module 200 has a wider applicable temperature range than any single-temperature-range cooling and heating module 100.

[0078] For example, if the temperature range of the material in the first temperature zone is 30-50℃, the temperature range of the material in the second temperature zone is -10-30℃, and the temperature range of the material in the third temperature zone is -30 to -10℃, then the combined temperature range of the three zones is -30 to 50℃, and the temperature range of the spare solid-state spring card unit must completely cover this -30 to 50℃ range.

[0079] The wide-temperature-range cooling and heating module 200 is connected in parallel with the aforementioned multiple cooling and heating modules 100 and is uniformly controlled by the system controller 300. When the multiple cooling and heating modules 100 are working, the controller 300 monitors the cooling and heating efficiency in real time through temperature and flow sensors. If the efficiency of the multiple cooling and heating modules 100 is insufficient due to ambient temperature fluctuations or performance degradation, it is first adjusted by increasing the drive frequency or fluid pump speed; if the set cooling / heating capacity still cannot be achieved after adjustment, the wide-temperature-range cooling and heating module 200 is automatically activated to work in conjunction with the multiple cooling and heating modules 100 to compensate for the cooling / heating capacity; if a cooling and heating module 100 fails, the wide-temperature-range cooling and heating module 200 can directly replace the failed cooling and heating module 100 to ensure continuous system operation.

[0080] The addition of the wide-temperature-range cooling and heating module 200 provides redundancy for the system, solves the system failure problem when the cooling and heating module 100 has insufficient performance or malfunctions, and significantly improves the system's reliability, fault tolerance and continuous working capability.

[0081] Furthermore, the wide-temperature-range cooling and heating module 200 is in standby mode when not in operation, and its heat transfer medium circulation system maintains low power consumption to ensure a rapid response when needed and shorten startup delay. Once the wide-temperature-range cooling and heating module 200 is started, the main controller 300 dynamically adjusts the output ratio of the wide-temperature-range cooling and heating module 200 based on the difference between the current ambient temperature and the target temperature. This optimizes the power distribution between the cooling and heating module 100 and the wide-temperature-range cooling and heating module, achieving optimal overall energy efficiency while ensuring effective cooling and heating.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An operating method for a solid-state cartridge cooling and heating device, applicable to solid-state cartridge cooling and heating devices, characterized in that, The solid-state spring-loaded cooling and heating device includes a driver, a transmission device, and multiple cooling and heating modules arranged in parallel. Each cooling and heating module includes a sleeve, a pressure head, and a solid-state spring-loaded unit placed inside the sleeve. The solid-state spring-loaded units in the multiple cooling and heating modules have different phase change temperature zones. The transmission device reciprocates under the drive of the driver and pushes the pressure head of each cooling and heating module through multiple cams to load or unload each solid-state spring-loaded unit, so that the multiple solid-state spring-loaded units have optimal cooling and heating efficiency in different temperature ranges. The operation method of the solid-state spring-loaded cooling and heating device includes the following steps: S1: Detect the current ambient temperature and determine the target temperature range to which the current ambient temperature belongs; S2: Match the target solid-state cartridge unit corresponding to the target temperature range, and start the target cooling and heating module corresponding to the target solid-state cartridge unit.

2. The operating method of the solid-state cartridge cooling and heating device as described in claim 1, characterized in that, The plurality of cooling and heating modules include a first temperature zone cooling and heating module, a second temperature zone cooling and heating module, and a third temperature zone cooling and heating module; The activation of the target cooling and heating module corresponding to the target solid-state cartridge unit includes the following steps: Based on the current ambient temperature, a target solid-state cartridge unit matching the current ambient temperature is determined from the solid-state cartridge units in the first temperature zone cooling and heating module, the second temperature zone cooling and heating module, and the third temperature zone cooling and heating module. Based on the optimal phase transition temperature value of the target solid-state cartridge unit, determine the target stress that drives the solid-state cartridge unit to undergo a phase transition; The loading force driving the target solid-state spring-loaded unit is calculated based on the target stress, and the target solid-state spring-loaded unit is loaded or unloaded according to the loading force, so that the heat transfer medium in the target cooling and heating module is heated or cooled.

3. The operating method of the solid-state spring-loaded cooling and heating device as described in claim 2, characterized in that, The solid-state cartridge cooling and heating device also includes: a pump; If the actual cooling and heating efficiency of the target cooling and heating module does not meet the target cooling and heating efficiency, perform at least one of the following operations: A. Increase the driving frequency of the driver for the target solid-state ejector unit; B. Increase the flow rate of the pump to increase the flow rate of the heat transfer medium in the target cooling and heating module.

4. The operating method of the solid-state spring-loaded cooling and heating device as described in claim 1, characterized in that, The solid-state spring-loaded cooling and heating device also includes an independently configured main controller and temperature sensor; The temperature sensor is used to detect the current ambient temperature in real time and convert the temperature detection signal into an electrical signal to be sent to the main controller; The main controller has a built-in storage module with temperature range division rules, which is used to receive electrical signals sent by temperature sensors, match the corresponding target temperature range and target solid-state spring card unit, and output control signals to start the corresponding target cooling and heating module.

5. The operating method of the solid-state spring-loaded cooling and heating device as described in claim 1, characterized in that, One group of the multiple cooling and heating modules may be selected to integrate a main control unit, and the remaining groups may be configured with slave control units respectively; The main control unit is used to receive ambient temperature detection signals, determine the target cooling and heating module based on preset temperature range rules, and send start and stop commands to the corresponding slave control units to achieve unified scheduling of all cooling and heating modules.

6. The operating method of the solid-state spring-loaded cooling and heating device as described in claim 1, characterized in that, The plurality of cooling and heating modules include at least two of the following: a first temperature zone cooling and heating module, a second temperature zone cooling and heating module, and a third temperature zone cooling and heating module; The first temperature zone cooling and heating module includes a first solid-state spring clip unit, the second temperature zone cooling and heating module includes a second solid-state spring clip unit, and the third temperature zone cooling and heating module includes a third solid-state spring clip unit. The austenitic phase transformation end temperature Af1 of the first solid-state spring clip unit is greater than the austenitic phase transformation end temperature Af2 of the second solid-state spring clip unit, and the austenitic phase transformation end temperature Af2 of the second solid-state spring clip unit is greater than the austenitic phase transformation end temperature Af3 of the third solid-state spring clip unit.

7. The operating method of the solid-state spring-loaded cooling and heating device as described in claim 6, characterized in that, The phase transformation temperature range of each solid spring card unit is characterized by its austenitic phase transformation end temperature Af or martensitic phase transformation end temperature Mf. Af is the temperature at which the material completes the transformation from martensite to austenite, which is suitable for the temperature range characterization of refrigeration conditions; Mf is the temperature at which the material completes the transformation from austenite to martensite, which is suitable for the temperature range characterization of heating conditions. Among them, the Af points or Mf points of different solid-state cartridge units are different from each other to form a gradation relationship covering a wide temperature range.

8. The operating method of the solid-state spring-loaded cooling and heating device as described in claim 1, characterized in that, The solid-state ejector unit includes multiple solid-state ejector material components, and the multiple solid-state ejector material components are stacked in sequence. The solid spring clip material is provided with a gap between itself and the inner wall of the sleeve. The gap is used to reserve expansion space when the solid spring clip unit is loaded.

9. The operating method of the solid-state spring-loaded cooling and heating device as described in claim 8, characterized in that, The solid-state spring-loaded cooling and heating device also includes a wide-temperature-range cooling and heating module that is connected in parallel with the multiple cooling and heating modules. The wide-temperature-range cooling and heating module includes multiple solid-state spring clip sub-units, each of which is composed of at least two types of solid-state spring clip materials, each of which has a different phase transition temperature range.

10. The method of operating the solid-state spring-loaded cooling and heating device as described in any one of claims 1-9, characterized in that, When the current ambient temperature is within the overlapping range of adjacent temperature zones, the two cooling and heating modules corresponding to the adjacent temperature zones are activated simultaneously to work together.

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