Cooling device, process chamber for semiconductor equipment and method for preventing condensation

Abstract

The application discloses a cooling device, a process chamber of a semiconductor device and a condensation prevention method, and relates to the semiconductor field. The cooling device is applied to a semiconductor device, and the cooling device comprises a shell, a cooling pipeline, a flange and a heat insulation piece. The shell is provided with a groove, the groove bottom is provided with a channel, the cooling pipeline is arranged in the channel, the flange is arranged on the groove and connected with one end of the cooling pipeline, the heat insulation piece is arranged outside the cooling pipeline and between the flange and the groove bottom, and the shell is further provided with a first gas path. The outlet end of the first gas path is arranged opposite to the contact surface of the heat insulation piece and the groove bottom. The application can at least solve the problem that the condensate generated by the refrigeration component has an adverse effect on some electrical elements.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a cooling device, a process chamber for semiconductor equipment, and a method for preventing condensation. Background Technology

[0002] With the booming development of the high-tech industry, the integrated circuit industry has developed rapidly, and the chip manufacturing process has received increasing attention. The difficulties of deep hole etching in etching technology manufacturing have gradually become apparent. Since deep hole etching requires controlling the temperature of the electrostatic chuck (ESC) to a low range, it is necessary to use a coolant with a lower temperature to cool the ESC.

[0003] However, during the process, it was discovered that the external low-temperature cooling components of the chamber (such as refrigeration pipes) are prone to condensation, which can cause dripping of condensate over a long period of time. This can affect or even damage electrical components such as sensors and power wiring below, posing a significant safety hazard.

[0004] In related technologies, the problem of condensation is alleviated by adjusting the temperature difference between the cooling pipes and the inner cavity of the lower electrode. However, this method requires the installation of a heating element and a corresponding heating control device on the inner cavity of the lower electrode, which increases structural complexity, cost, and functional and structural redundancy. Summary of the Invention

[0005] The purpose of this application is to provide a cooling device, a process chamber for semiconductor equipment, and a method for preventing condensation, which can at least solve the problem that condensate generated by cooling components can have adverse effects on some electrical components.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows: This application provides a cooling device for use in semiconductor equipment. The cooling device includes: a housing, cooling pipes, flanges, and heat insulation components. The housing is provided with a groove, and the bottom of the groove is provided with a channel; The cooling pipe passes through the channel, and the flange is located in the groove and connected to one end of the cooling pipe; The heat insulation component is located on the outside of the cooling pipe and between the flange and the bottom of the tank; The housing is also provided with a first air passage, and the air outlet of the first air passage is arranged opposite to the contact surface of the heat insulation component and the bottom of the groove.

[0007] This application embodiment also provides a process chamber for a semiconductor device, the process chamber including a cavity, an interface component, and the aforementioned cooling device; The cavity is provided with an installation port, and the interface component is located at the installation port; The interface component is provided with a through hole, and the cooling pipe is connected to the cooling component located in the cavity through the through hole.

[0008] This application embodiment also provides an anti-condensation method applied to the above-mentioned cooling device, the anti-condensation method comprising: Set the preset temperature of the cooling pipeline, and set the initial purge gas flow rate according to the preset temperature; Detect the current humidity inside the casing and determine whether the current humidity is within a preset humidity range; If so, continue to introduce purge gas into the housing at the initial purge gas flow rate; If not, increase the purge gas flow rate based on the initial purge gas flow rate, and continue to introduce purge gas into the housing at the initial purge gas flow rate if the current humidity is within the preset humidity range.

[0009] In this embodiment, a heat insulation component separates the housing from the condenser pipes, effectively mitigating the problem of condensation caused by a temperature difference between the condenser pipes and the housing. Furthermore, a first air passage can be used to blow away humid air between the heat insulation component and the bottom of the housing, reducing humidity within the housing and further alleviating condensation. Additionally, this embodiment eliminates the need for heating elements and heating control devices, reducing structural complexity and cost, and avoiding functional and structural redundancy. Attached Figure Description

[0010] Figure 1 This is a partial structural schematic diagram of the semiconductor device disclosed in the embodiments of this application; Figure 2 This is a schematic diagram of the condensation device disclosed in the embodiments of this application; Figure 3 This is a cross-sectional view of the condensation device and interface component disclosed in the embodiments of this application; Figure 4 This is a partial cross-sectional view of the condensation device and interface component disclosed in the embodiments of this application; Figure 5 This is a schematic diagram of the shell structure disclosed in the embodiments of this application; Figure 6 This is a schematic diagram of the first blowing path disclosed in the embodiments of this application; Figure 7 This is a schematic diagram of the second blowing path disclosed in the embodiments of this application; Figure 8 This is a flowchart of the condensation method disclosed in the embodiments of this application.

[0011] Explanation of reference numerals in the attached figures: 01-Cooling device; 10-Shell; 11-Groove; 111-Groove bottom; 112-Opening; 12-Channel; 13-First air passage; 131-First air passage unit; 132-Second air passage unit; 14-Second air passage; 15-Third air passage; 16-Chamfered structure; 20 - Cooling pipe; 21 - Input pipe; 22 - Output pipe; 30-Flange; 40 - Thermal insulation component; 41 - Thermal insulation sleeve; 42 - Thermal insulation pad; 50-Humidity detection element; 60 - Purge line; 70 - On / off valve; 80 - Flow valve; M - First gap; N - Second gap; 02-Cavity; 021-Mounting port; 03-Interface components. Detailed Implementation

[0012] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0013] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0014] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0015] refer to Figures 1 to 8 This application discloses a cooling device 01, which is applied to semiconductor equipment and is used to cool the devices to be cooled in the semiconductor equipment. The disclosed cooling device 01 includes a housing 10, a cooling pipe 20, a flange 30 and a heat insulation component 40.

[0016] The housing 10 is a basic component that provides an installation base for the cooling pipes 20, flanges 30, and insulation components 40. In some embodiments, the housing 10 has a groove 11, and the bottom 111 of the groove 11 has a channel 12. The cooling pipes 20 pass through the channel 12, and the flanges 30 are located in the groove 11 and connected to one end of the cooling pipes 20. Based on this, the flanges 30 can be accommodated by the groove 11, and the cooling pipes 20 can pass through the channel 12, thereby enabling the installation and fixation of the flanges 30 and the cooling pipes 20 to ensure the installation stability of the flanges 30 and the cooling pipes 20.

[0017] Optionally, the housing 10 may include a first housing unit and a second housing unit, which are interlocked to form the housing 10. The cooling pipe 20 and the flange 30 are fastened between the first housing unit and the second housing unit to facilitate the assembly and disassembly of the cooling pipe 20 and the flange 30.

[0018] In some embodiments, the cooling pipe 20 and the flange 30 can be fixedly connected, such as by welding, bonding, riveting, etc.; or they can be detachably connected, such as by screwing, snap-fitting, etc., as long as one end of the cooling pipe 20 and the flange 30 are reliably and sealedly connected, and the specific form is not limited.

[0019] In addition, the cooling pipe 20 may include an input pipe 21 and an output pipe 22, wherein the input pipe 21 is used to input a cooling medium with a lower temperature, and the output pipe 22 is used to output a cooling medium with a higher temperature after heat exchange.

[0020] The heat insulation element 40 is disposed on the outside of the cooling pipe 20 and between the flange 30 and the bottom 111 of the groove 11. Based on this, the heat insulation element 40 can separate the cooling pipe 20 from the housing 10 and prevent outside air from contacting the cooling pipe 20, thus providing a certain degree of heat insulation and reducing the heat transfer between the cooling pipe 20 and the housing 10, which helps reduce the formation of condensate on the outer wall of the cooling pipe 20. Furthermore, the heat insulation element 40 can also separate the flange 30 from the bottom 111 of the groove, providing a certain degree of heat insulation and reducing the heat transfer between the flange 30 and the housing 10, which helps reduce the formation of condensate between the flange 30 and the bottom 111 of the groove.

[0021] Optionally, the heat insulation component 40 can completely wrap around the outside of the condenser pipe, or it can partially wrap around the outside of the condenser pipe. In addition, the heat insulation component 40 can be made of a porous material, such as heat insulation cotton; thus, when the purging gas purges the heat insulation component, the purging gas can pass through the pores in the middle of the heat insulation component and reach all parts of the heat insulation component, thereby increasing the purging area.

[0022] To further reduce condensation, the housing 10 may also be provided with a first air passage 13, such as... Figures 5 to 7 As shown, the outlet of the first air passage 13 is positioned opposite to the contact surface of the heat insulation component 40 and the tank bottom 111. Based on this, the first air passage 13 can purge gas onto the contact surface between the heat insulation component 40 and the tank bottom 111 to remove humid gas and reduce the formation of condensate at the contact surface. Optionally, the purge gas can be CDA (Clean Dry Air) or N2, etc.

[0023] Based on the above configuration, this embodiment of the application can separate the housing 10 from the condenser pipe using the heat insulation component 40, thereby effectively alleviating the problem of condensation in the condenser pipe caused by the temperature difference between the condenser pipe and the housing 10. Furthermore, the first air passage 13 can blow gas between the heat insulation component 40 and the bottom 111 of the housing 10 to remove humid air, which helps reduce the humidity inside the housing 10, thus effectively alleviating the condensation problem. In addition, this embodiment of the application eliminates the need for heating elements and heating control devices, reducing structural complexity and cost, and avoiding functional and structural redundancy.

[0024] refer to Figure 5 In some embodiments, the first air passage 13 may include a first air duct unit 131 and a second air duct unit 132. The inlet of the first air duct unit 131 is located on the side wall of the housing 10, and the outlet of the first air duct unit 131 is located at the bottom of the tank 111 and communicates with the second air duct unit 132. The outlet of the second air duct unit 132 is positioned opposite to the contact surface between the heat insulation member 40 and the bottom of the tank 111. Based on this arrangement, purge gas can be transmitted from the first air duct unit 131 to the second air duct unit 132, and then from the second air duct unit 132 to the contact surface between the heat insulation member 40 and the bottom of the tank 111. This purge gas removes humid gas from the contact surface, reducing the formation of condensate at the contact surface.

[0025] Optionally, the first air passage unit 131 may extend longitudinally along the housing 10, and the second air passage unit 132 may extend laterally along the housing 10, with the two intersecting and communicating at the bottom 111 of the groove 11. Additionally, the outer wall of the housing 10 may be provided with a first connector, which communicates with the air inlet of the first air passage unit 131 and also with the purge line 60, so as to transmit the purge gas in the purge line 60 to the first air passage unit 131.

[0026] Continue to refer to Figure 5In some embodiments, a chamfered structure 16 is provided at the connection between the channel 12 and the bottom of the tank 111. The outlet of the second air duct unit 132 is located at the chamfered structure 16. Thus, by setting the chamfered structure 16, a certain space can be formed at the connection between the channel 12 and the bottom of the tank 111 (i.e., between the chamfered structure and the heat insulation member 40), so that the purging gas output by the second air duct unit 132 can enter the space, so that the purging gas can be blown toward the contact surface between the heat insulation member 40 and the bottom of the tank 111, and it is beneficial to increase the purging area.

[0027] In some more specific embodiments, the chamfer structure 16 may extend circumferentially along the channel 12 to form an annular chamfer structure 16. Exemplarily, the chamfer structure 16 may have an inclined plane or an inclined arc surface, etc.

[0028] refer to Figure 6 The diagram illustrates that purge gas enters from the first air duct unit 131 into the second air duct unit 132, where it is diverted to two channels 12 located on either side of the first air duct unit 131. Since the second air duct unit 132 is connected to two chamfered structures 16, the purge gas can flow along the channel formed by the gap between the chamfered structure and the heat insulation member 40, purging the contact surface between the heat insulation member 40 and the bottom of the tank 111. In some embodiments, since the heat insulation member 40 has a porous structure, the purge gas can further enter the pores of the heat insulation member 40 to purge the water vapor inside the heat insulation member, and then discharge to the outside of the housing 10 through the pores in the heat insulation member.

[0029] refer to Figure 3 and Figure 4 In some embodiments, a first gap M may be provided between the outer peripheral wall of the flange 30 and the side wall of the groove 11. Purge gas can be introduced into the first gap M to blow away the moist gas in the first gap M, which helps to reduce the formation of condensate at that location.

[0030] Correspondingly, the housing 10 may also be provided with a second air passage 14, the air outlet of which is connected to the first gap M. In this way, purging gas can be introduced into the first gap M through the second air passage 14 to blow away the moist gas in the first gap M.

[0031] Optionally, the second air passage 14 can be located on the side wall of the groove 11, with the outlet of the second air passage 14 located on the inner wall of the groove 11 to introduce purge gas into the groove 11. Alternatively, the inlet of the second air passage 14 can be located on the outer wall of the groove 11 and can be connected to the purge pipe 60 via a second connector.

[0032] Furthermore, the outlet end of the second air passage 14 can be positioned opposite to the outer peripheral wall of the flange 30. This allows for direct blowing of gas onto the outer peripheral wall of the flange 30, preventing the adhesion of humid air and the formation of condensation. Optionally, the axis of the outlet end of the second air passage 14 can be perpendicular to the outer peripheral wall of the flange 30; alternatively, it can form an acute or obtuse angle to accommodate different operating conditions.

[0033] Continue to refer to Figure 3 and Figure 4 In some embodiments, a second gap N may be provided between the outer peripheral wall of the heat insulation member 40 and the side wall of the groove 11. Purge gas can be introduced into the second gap N to blow away the moist gas in the second gap N, which helps to reduce the formation of condensate at that location.

[0034] Correspondingly, the housing 10 may also be provided with a third air passage 15, the air outlet of which is connected to the second gap N. In this way, purging gas can be introduced into the second gap N through the third air passage 15 to blow away the moist gas in the second gap N.

[0035] Optionally, the third air passage 15 can be located on the side wall of the groove 11, with the outlet of the third air passage 15 located on the inner wall of the groove 11 to introduce purge gas into the groove 11. Alternatively, the inlet of the third air passage 15 can be located on the outer wall of the groove 11 and can be connected to the purge pipe 60 via a third connector.

[0036] Furthermore, the outlet end of the third air passage 15 can be positioned opposite to the contact surfaces of the heat insulation component 40 and the flange component 30. This allows for direct blowing of gas onto the contact surfaces of the heat insulation component 40 and the flange component 30, preventing the formation of condensation due to the adhesion of humid air. Optionally, the axis of the outlet end of the third air passage 15 can be perpendicular to the outer peripheral wall of the heat insulation component 40 or the flange component 30. Alternatively, it can form an acute or obtuse angle to accommodate different operating conditions.

[0037] refer to Figure 5 In some embodiments, the sidewall of the groove 11 may be provided with an opening 112, and the first gap M and the second gap N may be connected to the opening 112. In this way, the purge gas containing humid gas in the first gap M and the second gap N can be discharged through the opening 112, thereby effectively reducing the generation of condensate in the housing 10.

[0038] Alternatively, the opening 112 may be located near the groove area of ​​the recess 11.

[0039] Considering that the heat insulation component 40 is located between the flange component 30 and the bottom wall of the groove 11, the second gap N is located inside the first gap M. When the opening 112 is close to the groove area of ​​the groove 11, the first gap M is located between the second gap N and the opening 112. In this way, the second gap N, the first gap M and the opening 112 can be connected in sequence, so as to improve the utilization rate of each gap and the opening 112. Furthermore, the second gap N and the opening 112 can be connected without the need for additional air passages, which helps to reduce structural complexity.

[0040] To increase the purging area, the housing 10 may be provided with multiple second air passages 14, which are arranged circumferentially around the housing 10. This allows for multi-point purging, increasing the purging area of ​​the flange 30 and improving the purging efficiency of the humid air in the first gap M. For example, the multiple second air passages 14 may be evenly or non-uniformly arranged along the circumference of the housing 10, depending on factors such as the shape of the housing 10 and flange 30, and the arrangement of the purging positions.

[0041] In addition, the housing 10 may also be provided with multiple third air passages 15, which are arranged circumferentially around the housing 10. This allows for multi-point purging, increasing the purging area of ​​the contact surfaces of the heat insulation component 40 and the flange component 30, and improving the purging efficiency of the second gap N and the humid air at the contact surfaces. For example, the multiple third air passages 15 may be evenly or non-uniformly arranged along the circumference of the housing 10, depending on factors such as the shape of the housing 10 and the heat insulation component 40, and the arrangement of the purging positions.

[0042] refer to Figure 7 After the purging gas enters the housing 10 through the second gas passage 14, it is blocked by the flange 30 and changes direction. It flows through the first gap M between the flange 30 and the housing 10, purging around the flange 30, and flows out of the housing 10 through the opening 112, carrying away the water vapor in the housing 10. Figure 7 The purge path of the purge gas is shown in some embodiments where there are two second gas passages 14. In this embodiment, the two second gas passages 14 are located on two opposite side walls of the housing 10, which can promote the flow of purge gas and improve purge efficiency. However, the number of second gas passages 14 is not limited by this embodiment.

[0043] refer to Figure 3 and Figure 4In some embodiments, the heat insulation component 40 may include a heat insulation sleeve 41 and a heat insulation pad 42. The heat insulation pad 42 is connected to one end of the heat insulation sleeve 41, which wraps around the outside of the cooling pipe 20. The heat insulation pad 42 is fitted onto the outside of the cooling pipe 20 and is located between the flange 30 and the bottom of the tank 111. Based on this arrangement, the heat insulation sleeve 41 can separate the cooling pipe 20 from the housing 10, thereby alleviating the problem of condensation forming on the outside of the cooling pipe 20 due to the temperature difference between the cooling pipe 20 and the housing 10. Similarly, the heat insulation pad 42 can separate the flange 30 from the bottom of the tank 111, thereby alleviating the problem of condensation forming between the flange 30 and the housing 10 due to the temperature difference between them.

[0044] Optionally, the heat insulation sleeve 41 and the heat insulation pad 42 can be welded or bonded together to ensure the airtightness between them.

[0045] In addition, the outlet of the first air passage 13 can be positioned opposite to the connection between the heat insulation sleeve 41 and the heat insulation pad 42. In this way, the purging gas blown out through the first air passage 13 can blow away the humid gas at the connection between the heat insulation sleeve 41 and the heat insulation pad 42, thereby reducing the formation of condensate at the connection.

[0046] refer to Figure 2 In some embodiments, the cooling device 01 may further include a humidity detection element 50, which is disposed within the housing 10 and used to detect the humidity within the housing 10. Based on this, the humidity within the housing 10 can be detected to lay the foundation for subsequent humidity control. For example, the humidity detection element 50 may be a humidity sensor, etc.

[0047] Optionally, if the humidity detection element 50 detects that the humidity inside the housing 10 is high, the flow rate of the purge gas can be increased to increase the amount of purge gas and blow more humid gas out of the housing 10, which helps to reduce the formation of condensate inside the housing 10.

[0048] Continue to refer to Figure 2 In some embodiments, the cooling device 01 may further include a purge line 60, a switching valve 70, and a flow valve 80. The purge line 60 is connected to at least one of the first air passage 13, the second air passage 14, and the third air passage 15 provided in the housing 10, to deliver purge gas to at least one of the first air passage 13, the second air passage 14, and the third air passage 15 through the purge line 60, and to introduce purge gas into the housing 10 through at least one of the first air passage 13, the second air passage 14, and the third air passage 15. Optionally, the switching valve 70 may be a pneumatic diaphragm valve, etc., and the flow valve 80 may be a self-regulating needle valve or a speed regulating valve, etc.

[0049] Both the switching valve 70 and the flow valve 80 are located in the purge line 60 to facilitate the connection or switching of the purge line 60 and to control the flow rate of the purge gas in the purge line 60.

[0050] In addition, the humidity detection element 50 can be electrically connected to the flow valve 80 so as to adjust the opening of the flow valve 80 by means of the detected humidity parameter, thereby controlling the flow rate of the purge gas entering the housing 10.

[0051] Based on the cooling device 01 described above, this application also discloses a process chamber for a semiconductor device. The disclosed process chamber includes a cavity 02, an interface 03, and the cooling device 01 described above.

[0052] The cavity 02 may be provided with an installation port 021, and an interface component 03 is provided at the installation port 021 to close the installation port 021 and ensure the process environment inside the process cavity. Optionally, the installation port 021 may be opened on the bottom wall of the cavity 02, and the interface component 03 may be installed from inside the cavity 02 to the installation port 021.

[0053] The interface component 03 may have a through hole through which the cooling pipe 20 is connected to a cooling component located inside the cavity 02. Based on this, cooling medium can be supplied to the cooling component through the cooling pipe 20, and the cooled medium after heat exchange can be discharged, facilitating the cooling of the cooling component. Optionally, the cooling component may be a support device for holding the wafer.

[0054] Optionally, the interface component 03 can be connected to the flange by fastening screws; the interface plate can be fixed to the cavity 02 by fastening screws.

[0055] Based on the aforementioned cooling device 01, this application embodiment also discloses an anti-condensation method applied to the aforementioned cooling device 01. The disclosed anti-condensation method includes: Set the preset temperature of the cooling pipe 20, and set the initial purge gas flow rate according to the preset temperature; Detect the current humidity inside the housing 10 and determine whether the current humidity is within the preset humidity range; If so, continue to introduce purge gas into the housing 10 at the initial purge gas flow rate; If not, increase the purge gas flow rate based on the initial purge gas flow rate, and continue to introduce purge gas into the housing 10 at the initial purge gas flow rate if the current humidity is within the preset humidity range.

[0056] Based on the above steps, this embodiment of the application uses a non-contact humidity detection element 50 to detect the humidity inside the housing 10, and controls the flow rate of the purge gas introduced into the housing 10 according to the humidity, so as to blow away the humid air inside the housing 10 through the purge gas, thereby alleviating the problem of condensation forming inside the housing 10.

[0057] Optionally, the humidity detection element 50 can detect the average humidity inside the housing 10. If the current humidity is higher than the preset humidity range, the purge gas flow rate is increased to reduce the average humidity inside the housing 10; conversely, if the current humidity is lower than the preset humidity range, the purge gas flow rate is decreased to bring the average humidity inside the housing 10 within the preset humidity range.

[0058] In the embodiments of this application, such as Figure 8 As shown, the specific process of the anti-condensation method includes: Set the temperature T of the cooling pipe 20 (or the temperature inside the casing 10). Open the switch valve 70; Set the opening degree of the flow valve to 80; Introduce the initial purge gas flow rate Q1. The flow valve 80 needs to be set starting from a small flow rate, and the specific flow rate can be determined based on the experimental measurement value. The humidity detection element 50 detects the current humidity inside the housing 10 and determines whether the current humidity is within the preset humidity range; If the current humidity is within the preset humidity range, purge gas Q1 will continue to be introduced; If the current humidity is outside the preset humidity range, the opening of the flow valve 80 is adjusted by the logic algorithm to automatically adjust the purge gas flow until the current humidity is within the preset humidity range, and purge gas continues to be introduced with Q1. After a certain process time interval, identify whether a process switch is needed; If so, close the switch valve 70, reset the temperature inside the cooling pipe 20 or housing 10, and then repeat the above process. If not, continue to purge with Q1.

[0059] In summary, this embodiment of the application isolates air from contact with the cooling pipe 20 through the heat insulation component 40, reduces the humidity of the gas inside the housing 10 by purging gas, and monitors the humidity inside the housing 10 in real time through the humidity detection element 50. Based on this, multiple functions such as heat insulation and humidity reduction can be achieved through the above three aspects, thereby reducing the risk of condensation or frost forming inside the housing 10.

[0060] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A cooling device applied to semiconductor equipment, characterized in that, The cooling device (01) includes: a housing (10), cooling pipes (20), flanges (30), and insulation components (40); The housing (10) is provided with a groove (11), and the bottom (111) of the groove (11) is provided with a channel (12). The cooling pipe (20) passes through the channel (12), and the flange (30) is located in the groove (11) and connected to one end of the cooling pipe (20); The heat insulation component (40) is located on the outside of the cooling pipe (20) and between the flange (30) and the bottom of the tank (111); The housing (10) is also provided with a first air passage (13), and the air outlet of the first air passage (13) is arranged opposite to the contact surface of the heat insulation component (40) and the bottom of the groove (111).

2. The cooling device according to claim 1, characterized in that, The first airway (13) includes a first airway unit (131) and a second airway unit (132); The air inlet of the first air duct unit (131) is located on the side wall of the housing (10), and the air outlet of the first air duct unit (131) is located at the bottom of the groove (111) and communicates with the second air duct unit (132). The air outlet of the second air duct unit (132) is positioned opposite to the contact surface of the heat insulation component (40) and the bottom of the groove (111).

3. The cooling device according to claim 2, characterized in that, The connection between the channel (12) and the bottom of the groove (111) is provided with a chamfered structure (16), and the air outlet of the second air duct unit (132) is located at the chamfered structure (16).

4. The cooling device according to claim 1, characterized in that, There is a first gap (M) between the outer peripheral wall of the flange (30) and the side wall of the groove (11). The housing (10) is also provided with a second air passage (14), the outlet of the second air passage (14) is connected to the first gap (M) and is disposed opposite to the outer peripheral wall of the flange (30).

5. The cooling device according to claim 1, characterized in that, There is a second gap (N) between the outer peripheral wall of the heat insulation member (40) and the side wall of the groove (11). The housing (10) is also provided with a third air passage (15), the air outlet of the third air passage (15) is connected to the second gap (N), and is disposed opposite to the contact surface of the heat insulation member (40) and the flange member (30).

6. The cooling device according to claim 4 or 5, characterized in that, The sidewall of the groove (11) is provided with an opening (112). The first gap (M) between the outer peripheral wall of the flange (30) and the inner wall of the groove (11), and the second gap (N) between the outer peripheral wall of the heat insulation member (40) and the inner wall of the groove (11), are both connected to the opening (112).

7. The cooling device according to claim 6, characterized in that, The housing (10) is provided with multiple second air passages (14) and multiple third air passages (15). Multiple second air passages (14) are arranged circumferentially along the housing (10), and multiple third air passages (15) are arranged circumferentially along the housing (10).

8. The cooling device according to claim 1, characterized in that, The heat insulation component (40) includes a heat insulation sleeve (41) and a heat insulation pad (42), wherein the heat insulation pad (42) is connected to one end of the heat insulation sleeve (41); The heat insulation sleeve (41) is wrapped around the outside of the cooling pipe (20), and the heat insulation pad (42) is sleeved on the outside of the cooling pipe (20) and located between the flange (30) and the bottom of the groove (111). The outlet of the first air passage (13) is positioned opposite to the connection between the heat insulation sleeve (41) and the heat insulation pad (42).

9. The cooling device according to claim 1, 4, or 5, characterized in that, The cooling device further includes a humidity detection element (50), which is disposed inside the housing (10) and is used to detect the humidity inside the housing (10).

10. The cooling device according to claim 9, characterized in that, The cooling device also includes a purge pipe (60), a switching valve (70), and a flow valve (80). The purge line (60) is connected to at least one of the first air passage (13), the second air passage (14) and the third air passage (15) provided in the housing (10); The switching valve (70) and the flow valve (80) are both located in the purging pipeline (60). The humidity detection element (50) is electrically connected to the flow valve (80).

11. A process chamber for a semiconductor device, characterized in that, The process chamber includes a cavity (02), an interface component (03), and a cooling device (01) as described in any one of claims 1 to 10. The cavity (02) is provided with an installation port (021), and the interface component (03) is provided at the installation port (021); The interface component (03) is provided with a through hole, and the cooling pipe (20) is connected to the cooling component located in the cavity (02) through the through hole.

12. A method for preventing condensation, applied to the cooling device (01) according to any one of claims 1 to 10, characterized in that, The anti-condensation method includes: Set the preset temperature of the cooling pipe (20) and set the initial purge gas flow rate according to the preset temperature; Detect the current humidity inside the housing (10) and determine whether the current humidity is within a preset humidity range; If so, continue to introduce purge gas into the housing (10) at the initial purge gas flow rate; If not, increase the purge gas flow rate based on the initial purge gas flow rate, and continue to introduce purge gas into the housing (10) at the initial purge gas flow rate if the current humidity is within the preset humidity range.

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