Flatness inspection device and flatness inspection method

Abstract

The present disclosure provides a flatness inspection device and a flatness inspection method. The flatness inspection device includes an inspection stage having a first inspection position and a second inspection position. The second inspection position faces the first inspection position in a first direction. The flatness inspection device further includes a non-contact optical system having a rotation axis between the first inspection position and the second inspection position in a plan view defined by the first direction and a second direction intersecting the first direction. The non-contact optical system is configured to inspect a shape of a first inspection surface of a first inspection object at the first inspection position, and inspect a shape of a second inspection surface of a second inspection object at the second inspection position. The flatness inspection device further includes a first rotator that rotates the non-contact optical system around the rotation axis.

Description

Technical Field

[0001] This disclosure generally relates to a flatness inspection apparatus and a flatness inspection method. More specifically, this disclosure relates to a flatness inspection apparatus and a flatness inspection method using the flatness inspection apparatus at atmospheric pressure. Background Technology

[0002] Display devices provide an interface between the user and visual information. With the advancement of information technology, display devices are increasingly used in a wide variety of electronic devices. Various types of display devices are widely used in different fields, including, for example, liquid crystal displays (LCDs), organic light-emitting diode displays (OLEDs), and plasma display panels (PDPs).

[0003] Display devices and electronic devices including display devices can be manufactured by depositing light-emitting materials onto a substrate. For example, microdisplays such as virtual reality (VR), extended reality (XR), or augmented reality (AR) displays can be manufactured by depositing light-emitting materials onto a silicon wafer.

[0004] Silicon wafers have curved surfaces. Therefore, deposition processes can be performed after the flatness of the silicon wafer is increased by using a chuck, such as an electrostatic chuck. Summary of the Invention

[0005] Embodiments of this disclosure provide a flatness inspection device configured to prevent deposition defects.

[0006] Embodiments of this disclosure provide a flatness inspection method using a flatness inspection device.

[0007] According to an embodiment of this disclosure, a flatness inspection apparatus includes an inspection table having a first inspection position and a second inspection position. The second inspection position faces the first inspection position in a first direction. The flatness inspection apparatus also includes a non-contact optical system having a rotation axis located between the first and second inspection positions in a planar view defined by the first direction and a second direction intersecting the first direction. The non-contact optical system is configured to inspect the shape of a first inspection surface of a first inspection object at the first inspection position and to inspect the shape of a second inspection surface of a second inspection object at the second inspection position. The flatness inspection apparatus also includes a first rotator for rotating the non-contact optical system about the rotation axis.

[0008] In this implementation, the inspection station includes multiple inspection stations. These multiple inspection stations may include a first inspection station containing a first inspection position and a second inspection station containing a second inspection position.

[0009] In an embodiment, the flatness inspection device may further include a first guide for guiding the movement of a first inspection table in a second direction and in a direction opposite to the second direction; a second guide for guiding the movement of a second inspection table in a second direction and in a direction opposite to the second direction; a lifter located between the first and second guides, spaced apart from both the first and second inspection positions in the second direction, and including a conveyor that moves up and down in the first direction in a plan view; and a second rotator for flipping the conveyor between the first and second guides.

[0010] In an implementation, in a plan view, a first virtual line may be defined to overlap with a first inspection position, a non-contact optical system, and a second inspection position; the first virtual line intersects the inspection table; a second virtual line is parallel to the extension direction of the lift and intersects the inspection table; and a loading position where the first inspection object is placed may be located between the first and second virtual lines. The flatness inspection device is configured to move the first inspection object from the loading position to the first inspection position along a first guide, and to move the second inspection object from the loading position to the second inspection position along a second guide via the lift and the second rotator.

[0011] In an embodiment, the flatness inspection device may further include a first guide for guiding the movement of a first inspection table in a second direction and in a direction opposite to the second direction; a second guide for guiding the movement of a second inspection table in the second direction and in a direction opposite to the second direction; and a lift located between the first and second guides, spaced apart from both the first and second inspection positions in the second direction, and including a conveyor that moves up and down in the first direction in a plan view.

[0012] In an implementation, in a plan view, a first loading position may overlap with a first inspection position, a second loading position may overlap with a conveyor when the conveyor included in the elevator is at its lowest level, and a flatness inspection device is configured to move a second inspection object from the second loading position to the second inspection position via the elevator along a second guide.

[0013] In one embodiment, the inspection table rotates in conjunction with the non-contact optical system. When the non-contact optical system is not rotating and is in a first orientation, the flatness inspection device inspects the first inspection object at the first inspection position. When the inspection table and the non-contact optical system rotate from the first orientation to the second orientation, the flatness inspection device inspects the second inspection object at the second inspection position.

[0014] In an implementation, the first inspection object and the second inspection object can be selected from the group consisting of an electrostatic chuck, a silicon wafer, a mask, and a mask support.

[0015] In some embodiments, the silicon wafer may be included in a display device that includes a light-emitting material, or in an electronic device that includes a display device.

[0016] According to an embodiment of the present disclosure, the flatness inspection apparatus includes a first inspection table having a first inspection position; a second inspection table having a second inspection position facing the first inspection position in a first direction; a first non-contact optical system for inspecting the shape of a first inspection surface of a first inspection object at the first inspection position; and a second non-contact optical system for inspecting the shape of a second inspection surface of a second inspection object at the second inspection position.

[0017] In an embodiment, the flatness inspection device may further include a rotator for flipping the second inspection table.

[0018] In an implementation, in a plan view defined by a first direction and a second direction intersecting the first direction, the first loading position may overlap with the first inspection position, the second loading position may overlap with the second inspection table when the second inspection table is at a horizontal position before being flipped by the rotator, and the second inspection object may be positioned at the second inspection position by flipping the second inspection table by the rotator.

[0019] In this implementation, the object to be inspected may be selected from a group consisting of an electrostatic chuck, a silicon wafer, a mask, and a mask support.

[0020] In some embodiments, the silicon wafer may be included in a display device that includes a light-emitting material, or in an electronic device that includes a display device.

[0021] According to an embodiment of this disclosure, a flatness inspection method includes: placing a first inspection object at a first inspection position; inspecting the surface shape of a first inspection surface of the first inspection object in a non-contact manner using a non-contact optical system; placing a second inspection object at a second inspection position, the second inspection position facing the first inspection position in a first direction; inspecting the surface shape of a second inspection surface of the second inspection object in a non-contact manner using a non-contact optical system; and determining whether the flatness inspection result meets a predetermined standard.

[0022] In an implementation, the step of placing a first inspection object at a first inspection position may include: placing the first inspection object on a first inspection table including a loading position, and positioning the first inspection object at the first inspection position by moving the first inspection table in a second direction intersecting with a first direction; and the step of placing a second inspection object at a second inspection position may include: placing the second inspection object on the first inspection table including a loading position; positioning the first inspection table below a conveyor by moving the first inspection table in the second direction; conveying the second inspection object from the first inspection table to the conveyor; flipping the conveyor and moving the conveyor in the first direction; conveying the second inspection object from the flipped conveyor to the second inspection table; and positioning the second inspection object at the second inspection position by moving the second inspection table in the second direction intersecting with the first direction; and the step of inspecting the surface shape of the second inspection surface may include: rotating a non-contact optical system that has inspected the first inspection object at the first inspection position in a first orientation from the first orientation toward the second inspection position to the second orientation, and inspecting the second inspection surface.

[0023] In this implementation, if the flatness inspection results meet the predetermined standards, the first inspection object and the second inspection object can be used in the deposition process.

[0024] In this implementation, if the flatness inspection result does not meet the predetermined standard, the first inspection object and the second inspection object can be discarded, or a reprocessing step can be performed on the first inspection object and the second inspection object.

[0025] In an implementation, the step of placing a first inspection object at a first inspection position may include: placing the first inspection object on a first inspection table including a first loading position; the step of placing a second inspection object at a second inspection position may include: placing the second inspection object on a conveyor table including a second loading position; moving the conveyor table in a first direction; conveying the second inspection object from the conveyor table to the second inspection table; and positioning the second inspection table at the second inspection position by moving the second inspection table in a direction opposite to the second direction; and the step of inspecting the surface shape of the second inspection surface may include: rotating a non-contact optical system that has inspected the first inspection object at the first inspection position when it is in a first orientation from the first orientation toward the second inspection position to the second orientation, and inspecting the second inspection surface.

[0026] In one embodiment, the step of placing the first inspection object at the first inspection position may include: placing the first inspection object on an inspection table including a loading position; and the step of placing the second inspection object at the second inspection position may include: placing the second inspection object on an inspection table including a loading position; and positioning the second inspection object at the second inspection position by rotating in conjunction with a non-contact optical system.

[0027] The flatness inspection device and the flatness inspection method using the flatness inspection device can inspect the object being inspected at a second inspection position where it has been deformed by gravity. If the object being inspected is not deformed by gravity (or is deformed at a negligible level), the object can be inspected only at the first inspection position. Therefore, flatness inspection can be performed in an environment identical to the actual deposition environment.

[0028] Furthermore, flatness inspection devices and methods can inspect surface shapes deformed by gravity in an atmospheric environment (e.g., chuck flatness, substrate flatness (e.g., surface shape), mask support flatness, mask sag, etc.). Based on the inspection results, the inspected object may or may not be used in the deposition process. By performing inspections before the deposition process, the reliability of deposition quality can be improved. Attached Figure Description

[0029] The accompanying drawings (which are included to provide a further understanding of this disclosure) together with its description illustrate non-limiting embodiments of this disclosure.

[0030] Figure 1 and Figure 2 This is a view showing a flatness inspection apparatus according to an embodiment of the present disclosure.

[0031] Figure 3 It shows the use Figure 1 A flowchart of the flatness inspection method using a flatness inspection device.

[0032] Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 , Figure 19 , Figure 20 , Figure 21 , Figure 22 and Figure 23This is a view illustrating a flatness inspection method according to an embodiment of the present disclosure.

[0033] Figure 24 This is a view showing a flatness inspection apparatus according to an embodiment of the present disclosure.

[0034] Figure 25 , Figure 26 , Figure 27 , Figure 28 and Figure 29 This illustrates the use of embodiments according to this disclosure. Figure 24 A view of the flatness inspection method of the flatness inspection device.

[0035] Figure 30 This is a view showing a flatness inspection apparatus according to an embodiment of the present disclosure.

[0036] Figure 31 , Figure 32 and Figure 33 This illustrates the use of embodiments according to this disclosure. Figure 30 A view of the flatness inspection method of the flatness inspection device.

[0037] Figure 34 and Figure 35 This is a view showing a flatness inspection apparatus according to an embodiment of the present disclosure and a flatness inspection method using the flatness inspection apparatus.

[0038] Figure 36 This is a view illustrating a deposition process of an inspection object inspected using a flatness inspection apparatus according to an embodiment of the present disclosure, and a flatness inspection method using the flatness inspection apparatus.

[0039] Figure 37 This is a block diagram illustrating an electronic device according to an embodiment.

[0040] Figure 38 This is a schematic diagram of an electronic device according to an embodiment.

[0041] Figure 39 This is a view showing a display device according to an embodiment of the present disclosure.

[0042] Figure 40 It is shown Figure 39 A block diagram of the display device. Detailed Implementation

[0043] The non-limiting embodiments of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings. The same reference numerals or symbols always denote the same elements, and overlapping descriptions of identical parts may be omitted.

[0044] The display device according to the embodiments can be applied to various electronic devices. The electronic device according to the embodiments may include a display device, and may also include additional modules or devices with other additional functions in addition to the display device.

[0045] This disclosure relates to a flatness inspection apparatus comprising at least one non-contact optical system that inspects an object without physical contact with it. The non-contact optical system prevents deformation or errors in the inspected object by avoiding physical contact.

[0046] Flatness inspection apparatuses allow for the inspection of the flatness of objects, such as chucks, substrates, mask supports, etc., under atmospheric conditions and before performing deposition steps. Therefore, flatness inspection apparatuses provide a more efficient inspection process that reduces process time and eliminates the cost of depositing on defective components.

[0047] Figure 1 and Figure 2 This is a view showing a flatness inspection apparatus according to an embodiment of the present disclosure.

[0048] refer to Figure 1 and Figure 2 The flatness inspection device FID1 according to the embodiments of the present disclosure may include an inspection table IST, a non-contact optical system OPS, a first rotator RO1, a first guide GU1, a second guide GU2, a lift LI, and a second rotator RO2.

[0049] In an implementation, the inspection station IST may include a first inspection position IP1 and a second inspection position IP2 facing the first inspection position IP1 in a first direction DR1.

[0050] In one implementation, the inspection station IST may include multiple inspection stations. In another implementation, the multiple inspection stations IST may include a first inspection station IST1 containing a first inspection position IP1 and a second inspection station IST2 containing a second inspection position IP2.

[0051] In an implementation, the non-contact optical system OPS may include a rotation axis located between a first inspection position IP1 and a second inspection position IP2 in a plane (hereinafter referred to as "side") defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1.

[0052] In the implementation, the non-contact optical system OPS can inspect the shape of the first inspection surface of the first inspection object at the first inspection position IP1, and can also inspect the shape of the second inspection surface of the second inspection object deformed by gravity at the second inspection position IP2.

[0053] For example, non-contact optical systems (OPS) can be used without restriction, as long as they are devices that can inspect the shape of a surface in a non-contact manner.

[0054] For example, in one implementation, the non-contact optical system (OPS) can use a coordinate measuring machine (CMM) and autofocus sensors, confocal displacement sensors, laser displacement sensors, capacitive sensors, eddy current sensors, multi-beam optical sensors (MOS), etc. The non-contact optical system (OPS) can inspect the shape of the inspection surface (e.g., a first inspection surface and a second inspection surface) point by point.

[0055] By integrating a CMM into an autofocus sensor, both the CMM and the autofocus sensor can be devices for measuring the shape of an inspected surface in a non-contact manner. For example, an autofocus sensor using an optical or laser sensor can automatically adjust the focus, resulting in higher speed and accuracy.

[0056] In implementations, a confocal displacement sensor can be a device for measuring the height, microstructure, thickness, etc., of an inspected surface in a non-contact manner. For example, a confocal color sensor can use light in different wavelength bands to measure the distance to a surface, and the precise distance can be determined using the principle of color difference. Confocal displacement sensors can also measure transparent materials such as silicon.

[0057] A laser displacement sensor can be a device that uses triangulation principles and confocal methods to measure the distance between an inspection surface and the sensor (e.g., the thickness of an object, the height of an object surface, etc.) in a non-contact manner. A laser beam can be projected onto the inspection surface, and the distance can be calculated by measuring the angle of the reflected light. When using the confocal method, the laser beam can be projected to a specific focal point, and the distance can be calculated by measuring the angle of the reflected light.

[0058] A capacitive sensor is a device that measures the position, distance, thickness, or material transitions of an object by using the material between two electrodes, the dielectric constant of the object, or changes in the gap. Capacitive sensors can have a fast response speed.

[0059] Eddy current sensors can measure distances non-contactly using the principle of electromagnetic induction. Eddy current sensors offer high linearity, high-speed measurement, and high resolution.

[0060] In implementation, multi-beam optical sensors can use multiple beams to measure the stress and curvature of an inspection surface in real time. For example, multi-beam optical sensors can be primarily used to monitor changes in stress and curvature during thin film deposition or thermal processing.

[0061] However, the embodiments disclosed herein are not necessarily limited thereto. For example, the non-contact optical system OPS can use a laser Fizeau interferometer, phase measurement deflection method (PMD), area scanning interferometer, etc. The non-contact optical system OPS can inspect the shape of the inspection surface (e.g., the first inspection surface and the second inspection surface) one by one.

[0062] In implementations, a laser Fizeau interferometer can be a device that measures the shape of a surface or the quality of high-precision optical components by using the interference phenomenon of light. For example, in an implementation, a non-contact optical system (OPS) can split a laser beam into a reference beam and an inspection beam, project each beam onto a high-quality surface and an inspection surface, and then analyze the interference fringes of the reflected light. For example, in an implementation, the height, thickness, shape, etc., of the inspection surface can be measured by the interference pattern.

[0063] A PMD (Programmable Dimensioning Device) is a device that can measure three-dimensional shapes in a non-contact manner. A PMD can project periodic patterns onto a screen, and the deformation of the pattern projected onto the inspection surface can be used to measure the height, slope, and other parameters of the inspection surface. For example, PMDs can provide high precision down to the nanometer level.

[0064] A surface scanning interferometer is a device that uses an interferometer to measure surface features or defects at high resolution. It can scan a large area at once to analyze surface shape, providing high resolution and high accuracy.

[0065] By using the non-contact optical system (OPS), deformation or errors in the inspected object due to contact can be prevented. Furthermore, the surface shape of various inspected objects can be detected.

[0066] In one implementation, the first rotator RO1 can rotate about the rotation axis of the non-contact optical system OPS. For example, the rotation axis can be arranged to extend on a third direction DR3.

[0067] In this implementation, the first guide GU1 can guide the path of the first inspection station IST1 along the second direction DR2.

[0068] In this implementation, the second guide GU2 can guide the path of the second inspection station IST2 in the second direction DR2.

[0069] In one embodiment, the lift LI may be located (e.g., in the first direction DR1) between the first guide GU1 and the second guide GU2. The lift LI may be spaced apart from the first inspection position IP1 and the second inspection position IP2 in the second direction DR2, and may include a conveyor MST that raises and lowers (e.g., moves up and down) the inspection object in the first direction DR1.

[0070] In one implementation, the second rotator RO2 can be flipped (e.g., reversed by 180°) the transfer platform MST between the first guide GU1 and the second guide GU2.

[0071] In an implementation, in a side view, the loading position LP where the inspection object is placed can be located between the first virtual line VL1 and the second virtual line VL2.

[0072] The first virtual line VL1 can be defined as a line extending in the first direction DR1, overlapping the first inspection position IP1, the non-contact optical system OPS, and the second inspection position IP2, and intersecting the inspection table IST. The second virtual line VL2 can be defined as a line parallel to the extension direction of the lift LI (e.g., the first direction DR1) and intersecting the inspection table IST.

[0073] The object to be inspected can be moved from the loading position LP to the first inspection position IP1 via the first guide GU1, and from the loading position LP to the second inspection position IP2 via the second guide GU2 via the lift LI and the second rotator RO2.

[0074] However, the embodiments disclosed herein are not necessarily limited thereto. For example, the flatness inspection device FID1 may include more components, or some components may be omitted or replaced.

[0075] For example, in one implementation, the flatness inspection device FID1 may include an additional alignment camera AL, which may verify that the object being inspected is placed in the correct position at the loading position LP.

[0076] For example, the inspection station IST is described as being located on the surface plates (P1, P2). However, embodiments of this disclosure are not necessarily limited to this.

[0077] Figure 3 It shows the use Figure 1 A flowchart of the flatness inspection method using a flatness inspection device.

[0078] refer to Figure 3 In an implementation, the object to be inspected may be selected from the group consisting of a chuck (e.g., an electrostatic chuck), a substrate (e.g., a silicon wafer), a mask, and a support for supporting the mask.

[0079] In an embodiment, the flatness inspection method according to the present disclosure may include chuck inspection in step S100, substrate inspection in step S200, mask support inspection in step S300, and mask inspection in step S400.

[0080] To increase substrate flatness and reduce mask sag, a deposition apparatus may include a first chuck for the substrate and a second chuck for the mask. The flatness of the chucks (e.g., the first and second chucks), the flatness of the substrate, the flatness of the mask support, and the amount of mask sag can affect the reliability of the deposition quality.

[0081] Typically, to find the cause of deposition failure, the deposition facility is shut down and a cause analysis is conducted. In this case, additional time is required to analyze the cause, and there are costs associated with treating the deposition defects.

[0082] In the case of the flatness inspection apparatus and the flatness inspection method using the flatness inspection apparatus according to the embodiments of the present disclosure, the chuck inspection in step S100, the substrate inspection in step S200, the mask support inspection in step S300 and / or the mask inspection in step S400 can be performed before performing the deposition process.

[0083] Flatness inspection apparatus and flatness inspection method using the flatness inspection apparatus according to embodiments of the present disclosure can be provided for inspecting the flatness of a chuck, the flatness (e.g., surface shape) of a substrate held by a chuck, the flatness of a mask support, and the sag (e.g., surface shape deformed by gravity) of a mask held by a chuck under atmospheric conditions.

[0084] Based on the inspection results, the object being inspected may or may not be used in the deposition process. Pre-inspection before the deposition process can improve the reliability of deposition quality.

[0085] Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 , Figure 19 , Figure 20 , Figure 21 , Figure 22 and Figure 23 This is a view illustrating a flatness inspection method according to an embodiment of the present disclosure.

[0086] refer to Figure 4 and Figure 5The flatness inspection apparatus FID1 according to the embodiment may have a non-contact optical system OPS and a rotating conveyor MST. If the non-contact optical system OPS is in a non-rotational orientation, then when the non-contact optical system OPS is in an initial orientation (e.g., a first orientation), the non-contact optical system OPS can inspect the inspection object OB (e.g., a first chuck CK1) at a first inspection position IP1. The non-contact optical system OPS can inspect the inspection object OB (e.g., a second chuck CK2) at a second inspection position IP2.

[0087] Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 This shows the use of Figure 1 , Figure 2 and Figure 4 A view of the chuck inspection in step S100 of the flatness inspection method of the flatness inspection device FID1. In the following text, for the sake of brevity, any repetitive detailed descriptions of elements identical or similar to those of the flatness inspection device FID1 described above will be omitted or simplified.

[0088] refer to Figure 1 , Figure 2 , Figure 4 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 In one embodiment, the first inspection object (e.g., the first chuck CK1) may be placed at the first inspection position IP1. In another embodiment, placing the first inspection object (e.g., the first chuck CK1) at the first inspection position IP1 may include placing the first inspection object (e.g., the first chuck CK1) on the first inspection table IST1, including the loading position LP, in step S110, and positioning the first inspection object (e.g., the first chuck CK1) at the first inspection position IP1 in step S120 by moving the first inspection table IST1 in a second direction DR2 intersecting the first direction DR1.

[0089] For example, in one embodiment, the first guide GU1 may be a linear guide. For example, in one embodiment, the first inspection table IST1 may be placed on a track included in the linear guide. The first inspection table IST1 may move along the track in a second direction DR2 and in a direction opposite to the second direction DR2. Therefore, the first inspection table IST1 may be located at a first inspection position IP1, or it may be located below a conveyor MST included in an elevator LI (e.g., in a direction opposite to the first direction DR1), which is spaced apart from the first inspection position IP1 in the second direction DR2.

[0090] In this implementation, the non-contact optical system OPS can inspect the surface shape of the first inspection surface of the first inspection object at the first inspection position IP1 without contacting the first inspection object (e.g., the first chuck CK1). By inspecting the surface shape (e.g., flatness) of the first inspection surface, deposition defects caused by flatness can be prevented.

[0091] In an implementation, the second inspection object (e.g., the second chuck CK2) may be placed at the second inspection position IP2. In an implementation, the step of placing the second inspection object (e.g., the second chuck CK2) at the second inspection position IP2 may include: placing the second inspection object (e.g., the second chuck CK2) on the first inspection table IST1, including the loading position LP, in step S130; positioning the first inspection table IST1 below the transfer table MST by moving the first inspection table IST1 in the second direction DR2 in step S140; transferring the second inspection object (e.g., the second chuck CK2) from the first inspection table IST1 to the transfer table MST in step S150; flipping the transfer table MST and moving the transfer table MST in the first direction DR1 in step S160; transferring the second inspection object (e.g., the second chuck CK2) from the flipped transfer table MST to the second inspection table IST2 in step S170; and positioning the second inspection object (e.g., the second chuck CK2) at the second inspection position IP2 by moving the second inspection table IST2 in the direction opposite to the second direction DR2 in step S180.

[0092] For example, the second guide GU2 can also be a linear guide. For example, the second inspection table IST2 can be placed on a track included in the linear guide. The second inspection table IST2 can move along the track in the second direction DR2 and in the opposite direction to the second direction DR2. Therefore, the second inspection table IST2 can be located at the second inspection position IP2, or it can be located above the conveyor MST included in the elevator LI (e.g., in the first direction DR1), which is spaced apart from the second inspection position IP2 in the second direction DR2.

[0093] In one embodiment, the non-contact optical system (OPS) can inspect the surface shape of the second inspection surface of the second inspection object at the second inspection position IP2 without contacting the second inspection object (e.g., the second chuck CK2). In another embodiment, the second inspection surface can be deformed by gravity. For example, when inspecting a substrate mounted on the second chuck CK2, the second inspection surface may refer to the deposition surface on which a deposition process is performed. By inspecting the surface shape (e.g., flatness) of the first inspection surface, deposition defects caused by flatness can be prevented.

[0094] In one implementation, while the non-contact optical system OPS is in its initial orientation (e.g., first orientation), the non-contact optical system OPS, having inspected the first inspection object at the first inspection position IP1 without contacting the first inspection object, can then rotate toward the second inspection position IP2 to be in a second orientation, and inspect the second inspection object at the second inspection position IP2 without contacting the second inspection object (see reference). Figure 14 ).

[0095] refer to Figure 15 This can determine whether the flatness inspection results meet the established standards, such as predetermined standards.

[0096] In this implementation, if the flatness inspection result meets the established criteria (e.g., predetermined criteria), the inspection object OB (e.g., the first inspection object and the second inspection object) can be determined as a good inspected product PQ1. In step PR1, the good inspected product PQ1 can be used in another process. For example, an already inspected inspection object OB (e.g., a chuck for a substrate) can be used in another flatness inspection process for another inspection object OB (e.g., a substrate). For example, an already inspected inspection object OB can be used in a subsequent deposition process.

[0097] In this implementation, if the flatness inspection result does not meet the established criteria (e.g., a predetermined criterion), the inspection object OB (e.g., the first inspection object and the second inspection object) can be identified as a defective inspected object PQ2. The defective inspected object PQ2 can be discarded or subjected to a reprocessing step PR2.

[0098] Figure 16 , Figure 17 , Figure 18 , Figure 19 , Figure 20 and Figure 21 It shows the use Figure 1 , Figure 2 and Figure 4A view of the substrate WAF inspection in step S200 of the flatness inspection method of the flatness inspection apparatus FID1. Figure 22 It shows the use Figure 1 , Figure 2 and Figure 4 A view of the mask support member MSU being inspected in step S300 of the flatness inspection method of the flatness inspection device FID1. Figure 23 It shows the use Figure 1 , Figure 2 and Figure 4 A view of the mask MA inspection in step S400 of the flatness inspection method of the flatness inspection device FID1. In the following text, for the sake of brevity, any repetitive detailed descriptions of elements identical or similar to those of the flatness inspection device FID1 and the described chuck inspection S100 will be omitted or simplified.

[0099] refer to Figure 1 , Figure 2 , Figure 4 and Figure 16 In this embodiment, the first inspection stage IST1 can be located at the loading position LP. The first chuck CK1 to be inspected can be placed on the first inspection stage IST1 at the loading position LP. In step S210, the substrate WAF, which is the object to be inspected OB, can be placed on the first chuck CK1 to be inspected.

[0100] refer to Figure 17 The first inspection stage IST1 can be moved in the second direction DR2 to be positioned below the transfer stage MST (e.g., in the direction opposite to the first direction DR1). In step S220, the substrate WAF can be transferred from the first inspection stage IST1 to the transfer stage MST.

[0101] refer to Figure 18 and Figure 19 In steps S230 and S240, the transfer stage MST can be flipped, and the substrate WAF can be moved in the first direction DR1 using the lift LI.

[0102] refer to Figure 20 and Figure 21 Then, in steps S250 and S260, the substrate WAF can be transferred to the second inspection stage IST2. The second inspection stage IST2 can move in the opposite direction to the second direction DR2 and be positioned at the second inspection position IP2. The non-contact optical system OPS can rotate from the first orientation to the second orientation to inspect the surface shape of the substrate WAF at the second inspection position IP2. The surface shape of the substrate WAF can be a shape that has been deformed by gravity at the second inspection position IP2.

[0103] refer to Figure 22 and Figure 23 The mask support MSU can be inspected using an object that has already been inspected (e.g., the first chuck CK1). The mask MA can be inspected using an object that has already been inspected in steps S300 and S400 (e.g., the first chuck CK1 and the mask support MSU). For example, after the object to be inspected OB can be placed at the loading position LP, the inspection can be performed by moving it to the first inspection position IP1.

[0104] Figure 24 This is a view showing a flatness inspection apparatus according to an embodiment of the present disclosure. Figure 25 , Figure 26 , Figure 27 , Figure 28 and Figure 29 It shows the use Figure 24 A view of the flatness inspection method of the flatness inspection device.

[0105] Figure 24 Flatness inspection device FID2 and Figure 1 and Figure 2 The difference between the FID1 flatness inspection device and the FID1 device may lie only in that the MST conveyor does not rotate and there are multiple loading positions. For the sake of brevity, references may be omitted in the following explanation. Figures 1 to 23 The overlapping description of the flatness inspection device FID1 and the flatness inspection method using the flatness inspection device.

[0106] refer to Figure 24 In this implementation, there may be multiple loading positions. For example, in this implementation, the multiple loading positions may include a first loading position LP1 and a second loading position LP2.

[0107] and Figure 1 and Figure 2 The implementation methods differ. Figure 24 The flatness inspection device FID2 can be used without rotating the MST conveyor. For example, Figure 24 The flatness inspection device FID2 may not include the second rotator RO2.

[0108] In an implementation, in a side view, the first loading position LP1 may overlap with the first inspection position IP1 (e.g., in the first direction DR1), and the second loading position LP2 may overlap with the transport station MST (e.g., in the first direction DR1) when the transport station MST may be located at the lowest level (e.g., the first level LE1).

[0109] refer to Figure 25In one embodiment, the step of placing the first inspection object OB1 at the first inspection position IP1 may include placing the first inspection object OB1 on the first inspection table IST1, which includes the first loading position LP1, in step S100'. In another embodiment, the robot arm that places the first inspection object OB1 on the first inspection table IST1 moves left and right as well as forward and backward (e.g., in the second direction DR2 and in the direction opposite to the second direction DR2).

[0110] refer to Figure 26 , Figure 27 , Figure 28 and Figure 29 In an embodiment, the step of placing the second inspection object OB2 at the second inspection position IP2 may include: placing the second inspection object OB2 on the transfer table MST including the second loading position LP2 in step S210'; moving the transfer table MST in the first direction DR1 in step S220'; transferring the second inspection object OB2 from the transfer table MST to the second inspection table IST2 in step S230'; and positioning the second inspection table IST2 at the second inspection position IP2 (see reference) in step S240' by moving the second inspection table IST2 in the direction opposite to the second direction DR2. Figure 27 In step S230', where the second inspection object OB2 is transferred from the transfer station MST to the second inspection station IST2, the transfer station MST may be located at the highest level (e.g., the second level LE2). For example, the second level LE2 may be spaced further from the ground than the first level LE1 (e.g., in the first direction DR1).

[0111] refer to Figure 29 In step S240', during the step of checking the surface shape of the second inspection surface, the non-contact optical system OPS for checking the first inspection object OB1 at the first inspection position IP1 can rotate from the first orientation and face the second inspection position IP2 with the second orientation, and then check the surface shape of the second inspection object OB2.

[0112] Figure 30 This is a view showing a flatness inspection apparatus according to an embodiment of the present disclosure. Figure 31 , Figure 32 and Figure 33 It shows the use Figure 30 A view of the flatness inspection method of the flatness inspection device.

[0113] Figure 30 Flatness inspection device FID3 and Figure 1 and Figure 2 Flatness inspection device FID1 and Figure 24Unlike the FID2 flatness inspection device, the inspection table IST can rotate in conjunction with the non-contact optical system OPS (e.g., together with the non-contact optical system OPS). For example, the inspection table IST can rotate the non-contact optical system OPS by a specific angle. In the following text, for the sake of simplicity, references to the above will be omitted or simplified. Figures 1 to 29 Any repeated detailed descriptions of the flatness inspection devices FID1, FID2 and any components using the same or similar flatness inspection methods as those described.

[0114] refer to Figure 30 and Figure 31 In this embodiment, the inspection table IST can rotate in conjunction with the non-contact optical system OPS (e.g., together with the non-contact optical system OPS). For example, the non-contact optical system OPS and the inspection table IST can be physically connected to each other. Therefore, when the non-contact optical system OPS rotates via the first rotator RO1, the inspection table IST can also rotate.

[0115] In this implementation, if the non-contact optical system OPS does not rotate and is in the first orientation, the first inspection object OB1 at the first inspection position IP1' can be inspected in step S100''. If the inspection stage IST and the non-contact optical system OPS rotate in step S210'', the non-contact optical system OPS can be in the second orientation in step S220'', and the second inspection object OB2 at the second inspection position IP2' can be inspected.

[0116] In an implementation, the step of placing the first inspection object OB1 at the first inspection position IP1' may include placing the first inspection object OB1 on the inspection stage IST including the loading position LP. The step of placing the second inspection object OB2 at the second inspection position IP2' may include: placing the second inspection object OB2 on the inspection stage IST including the loading position LP in step S210'', and positioning the second inspection object OB2 at the second inspection position IP2' in steps S210'' and S220'' by rotating the inspection stage IST in conjunction with the non-contact optical system OPS.

[0117] Figure 34 and Figure 35 This is a view showing a flatness inspection apparatus according to an embodiment of the present disclosure and a flatness inspection method using the flatness inspection apparatus.

[0118] In the implementation method, with Figure 1 and Figure 2 Flatness inspection device FID1, Figure 24 Flatness inspection device FID2 and Figure 30The flatness inspection device FID3 is different. Figure 34 and Figure 35 The flatness inspection device FID4 may have multiple non-contact optical systems (see OPS1, OPS2). In the following text, for the sake of brevity, any repeated detailed descriptions of elements that are the same as or similar to the flatness inspection devices FID1, FID2, FID3 described above and the flatness inspection methods using them may be omitted or simplified.

[0119] In an implementation, the flatness inspection device FID4 may include: a first inspection table IST1, including a first inspection position IP1; a second inspection table IST2, including a second inspection position IP2 facing the first inspection position IP1 in a first direction DR1; a first non-contact optical system OPS1, for inspecting the shape of a first inspection surface of a first inspection object OB1 (e.g., a first chuck CK1) at the first inspection position IP1; a second non-contact optical system OPS2, for inspecting the shape of a second inspection surface of a second inspection object OB2 (e.g., a second chuck CK2) deformed by gravity at the second inspection position IP2; and a rotator RO, for flipping the second inspection table IST2. Although Figure 34 The embodiment shown depicts two non-contact optical systems in the flatness inspection device FID4, but the embodiments disclosed herein are not necessarily limited thereto, and in some embodiments, the flatness inspection device FID4 may have three or more non-contact optical systems.

[0120] In an implementation, in a side view, the first loading position LP1 may overlap with the first inspection position IP1 (e.g., in the first direction DR1), and the second loading position LP2 may overlap with the second inspection position IST2 (e.g., in the first direction DR1) when the second inspection table IST2 is at the horizontal position before being flipped.

[0121] In one implementation, the second inspection object OB2 (e.g., the second chuck CK2) can be positioned at the second inspection position IP2 by rotating the second inspection table IST2 by the rotary RO.

[0122] Figures 1 to 35 This is an example, and the embodiments disclosed herein are not necessarily limited thereto. For example, the number of non-contact optical systems, the number of loading positions, whether the non-contact optical systems rotate, whether the chuck rotates, etc., can be varied in many ways.

[0123] Figure 36 This is a view showing a deposition process of an inspected object inspected using a flatness inspection device according to an embodiment of the present disclosure, and a flatness inspection method using the flatness inspection device.

[0124] For example, a deposition process can be performed after a flatness inspection process. The deposition process can be performed in a deposition chamber (CH).

[0125] For example, in one embodiment, the deposition source DS, the first chuck CK1, the substrate B1, the mask MA, the mask support MSU, and the second chuck CK2 can be placed inside the deposition chamber CH.

[0126] For example, the first chuck CK1 and the second chuck CK2 can be electrostatic chucks (ESCs). For instance, an ESC can be a chuck used in the manufacturing process of a display device and an electronic device including the display device. An ESC can use an electric field to hold or move an object (e.g., substrate B1, mask MA, etc.). In embodiments, the ESC can hold the object in a non-contact manner to prevent physical damage to the object.

[0127] For example, in an embodiment, the mask MA may include a fine metal mask (FMM), an open metal mask (SMM), etc. The mask MA can be used to deposit a specific pattern on a substrate B1 using a deposition material provided by a deposition source DS. For example, the mask MA may include a first region P1 and a second region P2. The first region P1 is a region through which the deposition material provided by the deposition source DS cannot pass. The second region P2 is a region through which the deposition material provided by the deposition source DS can pass.

[0128] For example, the mask support unit (MSU) can support the mask MA by holding the mask MA in the proper position, so that the deposited material can be deposited at a precise location.

[0129] As described above, in the implementation, the substrate B1 may be a wafer (corresponding to...) Figures 16 to 21 (WAF). In an embodiment, the silicon wafer may be included in a display device that includes a light-emitting material, or in an electronic device that includes a display device.

[0130] However, the embodiments disclosed herein are not necessarily limited thereto.

[0131] For example, substrate B1 may include glass, plastic, etc.

[0132] The above explains that the second chuck CK2 and substrate B1 and WAF are inspected at the second inspection position IP2, and the first chuck CK1, mask support MSU and mask MA are inspected at the first inspection position IP1.

[0133] By considering both cases where deformation under gravity has occurred and cases where it has occurred, flatness checks can be performed under conditions identical to the actual deposition environment. For example, it is assumed here that the second object to be checked, OB2 (e.g., the second chuck CK2 and the substrate WAF), is deformed by gravity.

[0134] However, the embodiments disclosed herein are not necessarily limited thereto. For example, Figure 36 Taking a horizontal sedimentation chamber CH as an example, however, embodiments of this disclosure can also be used with a vertical sedimentation chamber.

[0135] For example, if the object OB is deformed by gravity, it can be inspected at the second inspection position IP2. If the object OB does not experience gravitational deflection (or the gravitational deflection is negligible), it can be inspected only at the first inspection position IP1. For example, if the deposition chamber CH is vertical, the second chuck CK2, substrate B1, WAF, first chuck CK1, mask support MSU, and mask MA can all be deformed by gravity. Therefore, the flatness of the object OB can be inspected at the second inspection position IP2 to perform a flatness check in an environment identical to the actual deposition environment.

[0136] The display device according to one or more embodiments can be applied to various electronic devices. The electronic device according to one or more embodiments includes the aforementioned display device, and may also include modules or devices with other additional functions in addition to the display device.

[0137] Figure 37 This is a block diagram illustrating an electronic device according to an embodiment.

[0138] refer to Figure 37 According to the embodiments, the electronic device EA may include a display module DM, a processor PC, a memory ME, and a power module PM.

[0139] A processor PC may include a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and / or a controller.

[0140] The data required for the operation of the processor PC or display module DM can be stored in the memory ME. When the processor PC executes the application stored in the memory ME, image data signals and / or input control signals are transmitted to the display module DM, and the display module DM can process the received signals and output image information through the display screen.

[0141] The power module PM may include a power module such as a power adapter and / or battery device, and a power conversion module that converts the power supplied by the power module to generate the power desired or required for the operation of the electronic device EA.

[0142] At least one of the components of the electronic device EA described above may be included in the display device according to the embodiments described above. Furthermore, some of the individual modules that are functionally included in a single module may be included in the display device, and other modules may be disposed separately from the display device. For example, the display device may include a display module DM, and the processor PC, memory ME, and power module PM may be disposed as another device in the electronic device EA besides the display device.

[0143] Figure 38 This is a schematic diagram of an electronic device according to an embodiment.

[0144] refer to Figure 38 The display device according to one or more embodiments may include not only electronic devices for image display (such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d, desktop monitors 10_1e, and / or similar devices), but also wearable electronic devices (such as smart glasses 10_2a, head-mounted displays 10_2b, smartwatches 10_2c, and / or similar devices) containing a display module, and vehicle electronic devices 10_3 (such as vehicle dashboards, center consoles, central information displays (CIDs) located on the dashboard, interior mirror displays, and / or similar devices) containing a display module. However, embodiments of this disclosure are not necessarily limited thereto, and the display device can be applied to a variety of small, medium, and large display devices.

[0145] Figure 39 This is a view showing a display device according to an embodiment of the present disclosure.

[0146] refer to Figure 39 The display device may include a lens 10, a display module 20, and a housing 30. The display module 20 may be located near the lens 10. The housing 30 may accommodate the lens 10 and the display module 20. Although the lens 10 and the display module 20 are housed within... Figure 39 On the first side of the housing 30, but according to embodiments of this disclosure, it is not necessarily limited to this.

[0147] For example, the lens 10 can be housed on a first side of the housing 30, and the display module 20 can be housed on a second side of the housing 30 opposite to the first side of the housing 30. When the lens 10 and the display module 20 are housed on opposite sides of the housing 30, the housing 30 can have a light-transmitting portion.

[0148] For example, the display device may be a head-mounted display device worn on the user's head. According to some embodiments, the head-mounted display device may also include a headband for securing the display device to the user's head.

[0149] However, the embodiments of this disclosure are not necessarily limited thereto. For example, in Figure 39 In the text, the display device has been described as being implemented as Figure 38 The head-mounted display 10_2b is an example; however, this disclosure is not limited thereto.

[0150] For example, the display device can take the form of smart glasses designed in the shape of eyeglasses. Alternatively, the display device can be implemented as a virtual reality (VR) display device to support virtual reality.

[0151] Furthermore, the display device can be implemented as an augmented reality (AR) display device for supporting augmented reality. The AR display device may have the shape of a smartphone, smart glasses, head-mounted display, etc., but embodiments according to this disclosure are not necessarily limited to these shapes.

[0152] Furthermore, the display device can be implemented as a mixed reality (MR) display device for supporting mixed reality. The MR display device can have the shape of a smartphone, smart glasses, a head-mounted display, etc., but embodiments according to this disclosure are not necessarily limited to these shapes.

[0153] The display module 20 may include a first display panel. The first display panel may be a left-eye display panel corresponding to the user's left eye.

[0154] The display module 20 may include a second display panel. The second display panel may be a right-eye display panel corresponding to the user's right eye.

[0155] Lens 10 may include a left-eye lens corresponding to the left-eye display panel and a right-eye lens corresponding to the right-eye display panel.

[0156] Figure 40 It is shown Figure 39 A block diagram of the display device.

[0157] refer to Figure 39 and Figure 40The display device includes a display panel 101, an eye tracker 601, and a display panel driver. The display panel driver drives the display panel 101. The display panel driver includes a drive controller 201, a gate driver 301, a transmit driver 401, and a data driver 501.

[0158] The display panel 101, eye tracker 601, drive controller 201, gate driver 301, transmitter driver 401, and data driver 501 can be referred to as the first display panel 101, the first eye tracker 601, the first drive controller 201, the first gate driver 301, the first transmitter driver 401, and the first data driver 501, respectively. For example, the first display panel 101 can be a left-eye display panel corresponding to the user's left eye.

[0159] For example, the drive controller 201 and the data driver 501 can be integrally formed. A drive module that includes at least the integrally formed drive controller 201 and data driver 501 can be referred to as a timing controller embedded data driver (TED).

[0160] The display panel 101 has a display area for displaying an image thereon and a peripheral area adjacent to the display area.

[0161] The display panel 101 includes multiple gate lines, multiple data lines, multiple emitter lines, and multiple pixels electrically connected to the gate lines, data lines, and emitter lines. The gate lines may extend in a first direction, the data lines may extend in a second direction intersecting the first direction, and the emitter lines may extend in the first direction.

[0162] The drive controller 201 receives input image data IMG1 and input control signal CONT1 from an external device (e.g., a host device, an accessory device, or an application processor). For example, the input image data IMG1 may include red image data, green image data, and blue image data. For example, the input image data IMG1 may include white image data. For example, the input image data IMG1 may include magenta image data, yellow image data, and cyan image data. The input control signal CONT1 may include a master clock signal and a data enable signal. The input control signal CONT1 may also include a vertical synchronization signal and a horizontal synchronization signal.

[0163] The drive controller 201 generates a first control signal CONT11, a second control signal CONT12, a third control signal CONT13, and a data signal DATA1 based on the input image data IMG1 and the input control signal CONT1.

[0164] The drive controller 201 generates a first control signal CONT11 based on the input control signal CONT1 for controlling the operation of the gate driver 301, and outputs the first control signal CONT11 to the gate driver 301. The first control signal CONT11 may include a vertical start signal and a gate clock signal.

[0165] The drive controller 201 generates a second control signal CONT12 based on the input control signal CONT1 for controlling the operation of the data driver 501, and outputs the second control signal CONT12 to the data driver 501. The second control signal CONT12 may include a horizontal start signal and a load signal.

[0166] The drive controller 201 generates a data signal DATA1 based on the input image data IMG1. The drive controller 201 outputs the data signal DATA1 to the data driver 501.

[0167] The drive controller 201 generates a third control signal CONT13 based on the input control signal CONT1 for controlling the operation of the transmitter driver 401, and outputs the third control signal CONT13 to the transmitter driver 401.

[0168] In response to a first control signal CONT11 received from the drive controller 201, the gate driver 301 generates a gate signal GS1 to drive the gate line. The gate driver 301 outputs the gate signal GS1 to the gate line. For example, the gate driver 301 may sequentially output the gate signal GS1 to the gate line. For example, the gate driver 301 may be mounted in the peripheral region of the display panel 101. For example, the gate driver 301 may be integrated into the peripheral region of the display panel 101.

[0169] The transmitter driver 401, in response to a third control signal CONT13 received from the drive controller 201, generates a transmit signal EM1 to drive the transmit line. The transmitter driver 401 outputs the transmit signal EM1 to the transmit line. For example, the transmitter driver 401 may sequentially output the transmit signal EM1 to the transmit line. For example, the transmitter driver 401 may be mounted in the peripheral area of ​​the display panel 101. For example, the transmitter driver 401 may be integrated into the peripheral area of ​​the display panel 101.

[0170] Although, for ease of explanation, the gate driver 301 is located on the first side of the display panel 101, and the emitter driver 401 is located on the side of the display panel 101 adjacent to the gate driver 301. Figure 40The first side of the display panel 101 is opposite to the second side, but the embodiments according to this disclosure are not necessarily limited to this. For example, both the gate driver 301 and the emitter driver 401 may be located on the first side of the display panel 101. For example, both the gate driver 301 and the emitter driver 401 may be located on both sides of the display panel 101. For example, the gate driver 301 and the emitter driver 401 may be integrally formed.

[0171] Data driver 501 can receive a second control signal CONT12 and a data signal DATA1 from drive controller 201. Data driver 501 can convert the data signal DATA1 into a data voltage VDATA1 of analog type. Data driver 501 outputs the data voltage VDATA1 to the data line.

[0172] The eye tracker 601 can track the user's gaze. For example, the eye tracker 601 can track the user's left eye gaze. The eye tracker 601 can output a gaze signal ET1 to the drive controller 201.

[0173] In this embodiment, the display panel driver can determine the central viewing area and the peripheral viewing area of ​​the display panel 101 based on the user's line of sight, drive the central viewing area of ​​the display panel 101 with a first duty cycle, and drive the peripheral viewing area of ​​the display panel 101 with a second duty cycle. The first duty cycle is smaller than the second duty cycle.

[0174] The display device also includes a second display panel 102, a second eye tracker 602, and a second display panel driver. The second display panel driver drives the second display panel 102. The second display panel driver includes a second drive controller 202, a second gate driver 302, a second transmit driver 402, and a second data driver 502.

[0175] For example, the second display panel 102 may be a right-eye display panel corresponding to the user's right eye.

[0176] For example, the second drive controller 202 and the second data driver 502 can be integrally formed. A drive module that includes at least the integrally formed second drive controller 202 and second data driver 502 can be referred to as a second timing controller embedded data driver (TED).

[0177] The second display panel 102 has a display area on which an image is displayed and a peripheral area adjacent to the display area.

[0178] The second display panel 102 includes a plurality of second gate lines, a plurality of second data lines, a plurality of second emitter lines, and a plurality of second pixels electrically connected to the second gate lines, the second data lines, and the second emitter lines. The second gate lines may extend in a first direction, the second data lines may extend in a second direction, and the second emitter lines may extend in the first direction.

[0179] The second drive controller 202 receives second input image data IMG2 and second input control signal CONT2 from an external device (e.g., a host device, an accessory device, or an application processor). For example, the second input image data IMG2 may include red image data, green image data, and blue image data. For example, the second input image data IMG2 may include white image data. For example, the second input image data IMG2 may include magenta image data, yellow image data, and cyan image data. The second input control signal CONT2 may include a master clock signal and a data enable signal. The second input control signal CONT2 may also include a vertical synchronization signal and a horizontal synchronization signal.

[0180] The second drive controller 202 generates control signals CONT21, CONT22, CONT23, and DATA2 based on the second input image data IMG2 and the second input control signal CONT2.

[0181] The second drive controller 202 generates a 2-1 control signal CONT21 based on the second input control signal CONT2 for controlling the operation of the second gate driver 302, and outputs the 2-1 control signal CONT21 to the second gate driver 302. The 2-1 control signal CONT21 may include a second vertical start signal and a second gate clock signal.

[0182] The second drive controller 202 generates a 2-2 control signal CONT22 based on the second input control signal CONT2 to control the operation of the second data driver 502, and outputs the 2-2 control signal CONT22 to the second data driver 502. The 2-2 control signal CONT22 may include a second level start signal and a second load signal.

[0183] The second drive controller 202 generates a second data signal DATA2 based on the second input image data IMG2. The second drive controller 202 outputs the second data signal DATA2 to the second data driver 502.

[0184] The second drive controller 202 generates a 2-3 control signal CONT23 based on the second input control signal CONT2 for controlling the operation of the second transmitter driver 402, and outputs the 2-3 control signal CONT23 to the second transmitter driver 402.

[0185] The second gate driver 302, in response to the 2-1 control signal CONT21 received from the second drive controller 202, generates a second gate signal GS2 to drive the second gate line. The second gate driver 302 outputs the second gate signal GS2 to the second gate line. For example, the second gate driver 302 may sequentially output the second gate signal GS2 to the second gate line. For example, the second gate driver 302 may be mounted in the peripheral region of the second display panel 102. For example, the second gate driver 302 may be integrated into the peripheral region of the second display panel 102.

[0186] The second transmitter driver 402, in response to the 2-3 control signal CONT23 received from the second drive controller 202, generates a second transmit signal EM2 to drive the second transmit line. The second transmitter driver 402 outputs the second transmit signal EM2 to the second transmit line. For example, the second transmitter driver 402 can sequentially output the second transmit signal EM2 to the second transmit line. For example, the second transmitter driver 402 can be installed in the peripheral area of ​​the second display panel 102. For example, the second transmitter driver 402 can be integrated into the peripheral area of ​​the second display panel 102.

[0187] Although, for ease of explanation, the second gate driver 302 is located on the first side of the second display panel 102, and the second emitter driver 402 is located on the second display panel 102 at the same level as the second gate driver 302. Figure 40 The second side is opposite to the first side of the second display panel 102, but the embodiments according to this disclosure are not necessarily limited to this. For example, both the second gate driver 302 and the second transmitter driver 402 may be located on the first side of the second display panel 102. For example, both the second gate driver 302 and the second transmitter driver 402 may be located on opposite sides of the second display panel 102. For example, the second gate driver 302 and the second transmitter driver 402 may be integrally formed.

[0188] The second data driver 502 can receive the 2-2 control signal CONT22 and the second data signal DATA2 from the second drive controller 202. The second data driver 502 can convert the second data signal DATA2 into a second data voltage VDATA2 of analog type. The second data driver 502 outputs the second data voltage VDATA2 to the second data line.

[0189] The second eye tracker 602 can track the user's second gaze. For example, the second eye tracker 602 can track the user's right eye gaze. The second eye tracker 602 can output a second gaze signal ET2 to the second drive controller 202.

[0190] The second eye tracker 602 can track the user's second field of vision. For example, the second eye tracker 602 can track the user's right eye vision. The second eye tracker 602 can output a second field of vision signal (i.e., a second gaze signal ET2) to the second drive controller 202.

[0191] The flatness inspection device according to the embodiments can be applied to the manufacturing process of various display devices, including computers, laptops, cellular phones, smartphones, PMPs, PDAs, or MP3 players.

[0192] The above description is an example of the technical features of this disclosure, and those skilled in the art to which this disclosure pertains will be able to make various modifications and variations. Therefore, the embodiments of this disclosure described herein can be implemented individually or in combination with each other. The embodiments disclosed in this disclosure are examples and do not limit the technical spirit of this disclosure. The embodiments describe the technical spirit of this disclosure and do not limit the scope of the technical spirit of this disclosure. Therefore, it should be understood that the foregoing is an illustrative example of various embodiments and should not be construed as limiting, and modifications to embodiments and other embodiments are intended to be included within the scope of this disclosure.

Claims

1. Flatness inspection device, including: An inspection table has a first inspection position and a second inspection position, wherein the second inspection position faces the first inspection position in a first direction. A non-contact optical system having a rotation axis located between a first inspection position and a second inspection position in a planar view defined by a first direction and a second direction intersecting the first direction, the non-contact optical system being configured to inspect the shape of a first inspection surface of a first inspection object at the first inspection position, and also being configured to inspect the shape of a second inspection surface of a second inspection object at the second inspection position; as well as A first rotator is configured to rotate the non-contact optical system about the rotation axis.

2. The flatness inspection device according to claim 1, wherein: The inspection station includes multiple inspection stations. The plurality of inspection stations include: The first inspection station includes the first inspection position; and The second inspection station includes the second inspection position.

3. The flatness inspection device according to claim 2 further includes: The first guide is configured to guide the movement of the first inspection table in the second direction and in the direction opposite to the second direction; The second guide is configured to guide the movement of the second inspection table in the second direction and the direction opposite to the second direction; An elevator, located between the first guide and the second guide, spaced apart from both the first inspection position and the second inspection position in the second direction, and including a conveyor configured to move up and down in the first direction in the plan view; as well as A second rotator is configured to flip the conveyor between the first guide and the second guide.

4. The flatness inspection device according to claim 3, wherein, In the plan view: The first virtual line is defined to overlap with the first inspection position, the non-contact optical system, and the second inspection position, and the first virtual line intersects with the inspection table; The second virtual line is parallel to the extension direction of the elevator and intersects the inspection table; as well as The loading position of the first inspection object is located between the first virtual line and the second virtual line, and The flatness inspection device is configured as follows: Move the first inspection object from the loading position to the first inspection position along the first guide; as well as The second inspection object is moved from the loading position to the second inspection position via the lift and the second rotator along the second guide.

5. The flatness inspection device according to claim 2 further includes: The first guide is configured to guide the movement of the first inspection table in the second direction and in the direction opposite to the second direction; The second guide is configured to guide the movement of the second inspection table in the second direction and the direction opposite to the second direction; as well as An elevator, located between the first guide and the second guide, spaced apart from both the first inspection position and the second inspection position in the second direction, and including a conveyor configured to move up and down in the first direction in the plan view.

6. The flatness inspection device according to claim 5, wherein, In the plan view: The first loading position overlaps with the first inspection position. When the conveyor included in the elevator is at its lowest level, the second loading position overlaps with the conveyor. The flatness inspection device is configured to move the second inspection object from the second loading position to the second inspection position via the lift along the second guide.

7. The flatness inspection device according to claim 1, wherein, The inspection table rotates in conjunction with the non-contact optical system. When the non-contact optical system is not rotating and is in the first orientation, the flatness inspection device inspects the first inspection object at the first inspection position, and When the inspection table and the non-contact optical system rotate from the first orientation to the second orientation, the flatness inspection device inspects the second inspection object at the second inspection position.

8. The flatness inspection device according to claim 1, wherein, The first inspection object and the second inspection object are selected from the group consisting of an electrostatic chuck, a silicon wafer, a mask, and a mask support.

9. The flatness inspection device according to claim 8, wherein, The silicon wafer is included in a display device that includes a light-emitting material, or in an electronic device that includes the display device.

10. Flatness inspection device, including: The first inspection station has the first inspection position; The second inspection table has a second inspection position, which faces the first inspection position in a first direction. A first non-contact optical system is configured to inspect the shape of a first inspection surface of a first inspection object at the first inspection location; as well as A second non-contact optical system is configured to inspect the shape of a second inspection surface of a second inspection object at the second inspection position.

11. The flatness inspection apparatus of claim 10, further comprising a rotator configured to flip the second inspection table.

12. The flatness inspection device according to claim 11, wherein, In the plan view defined by the first direction and the second direction intersecting the first direction: The first loading position overlaps with the first inspection position; When the second inspection table is at the horizontal position before it is flipped by the rotator, the second loading position overlaps with the second inspection table; as well as The second object to be inspected is positioned at the second inspection location by the rotator flipping the second inspection table.

13. The flatness inspection device according to claim 10, wherein, The first inspection object and the second inspection object are selected from the group consisting of an electrostatic chuck, a silicon wafer, a mask, and a mask support.

14. The flatness inspection device according to claim 13, wherein, The silicon wafer is included in a display device that includes a light-emitting material, or in an electronic device that includes the display device.

15. Flatness inspection methods include: Place the first object to be inspected at the first inspection position; The surface shape of the first inspection surface of the first inspection object is inspected in a non-contact manner using a non-contact optical system; The second inspection object is placed at the second inspection position, which faces the first inspection position in the first direction; The surface shape of the second inspection surface of the second inspection object is inspected in a non-contact manner using the non-contact optical system. as well as Determine whether the flatness inspection results meet the predetermined standards.

16. The flatness inspection method according to claim 15, in, Placing the first object to be inspected at the first inspection location includes: The first object to be inspected is placed on a first inspection table including a loading position; and The first inspection object is positioned at the first inspection location by moving the first inspection table in a second direction intersecting the first direction, and Placing the second object to be inspected at the second inspection location includes: Place the second object to be inspected on the first inspection table, including the loading position; The first inspection table is positioned below the conveyor by moving it in the second direction; The second inspection object is transferred from the first inspection station to the transfer station; Flip the conveyor and move the conveyor in the first direction; The second inspection object is transferred from the flipped conveyor to the second inspection table; and The second inspection object is positioned at the second inspection location by moving the second inspection table in the direction opposite to the second direction. The process of inspecting the surface shape of the second inspection surface includes: rotating the non-contact optical system, which has already inspected the first inspection position when in a first orientation, from the first orientation toward the second inspection position to a second orientation, and inspecting the second inspection surface.

17. The flatness inspection method according to claim 15, wherein, When the flatness inspection result meets the predetermined standard, the deposition process is performed using the first inspection object and the second inspection object.

18. The flatness inspection method according to claim 15, wherein, If the flatness inspection result does not meet the predetermined standard, then the first inspection object and the second inspection object are discarded, or the first inspection object and the second inspection object are reprocessed.

19. The flatness inspection method according to claim 15, in, Placing the first object to be inspected at the first inspection position includes placing the first object to be inspected on a first inspection table including a first loading position. Placing the second object to be inspected at the second inspection location includes: Place the second object to be inspected on a conveyor belt that includes the second loading position; Move the conveyor in the first direction; The second inspection object is transferred from the conveyor to the second inspection station; and The second inspection table is positioned at the second inspection position by moving it in a direction opposite to the second direction. The process of inspecting the surface shape of the second inspection surface includes: rotating the non-contact optical system, which has already inspected the first inspection position when in a first orientation, from the first orientation toward the second inspection position to a second orientation, and inspecting the second inspection surface.

20. The flatness inspection method according to claim 15, in, Placing the first object to be inspected at the first inspection position includes placing the first object to be inspected on an inspection table including a loading position, and Placing the second object to be inspected at the second inspection location includes: The second object to be inspected is placed on the inspection table including the loading position; and The second object to be inspected is positioned at the second inspection location by rotating in conjunction with the non-contact optical system.

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