Wafer level test darkroom

Abstract

The application discloses a wafer-level test darkroom, which comprises a frame shell, an environment regulation subsystem, a docking transmission subsystem and an intelligent monitoring management subsystem; the frame shell comprises an inner shell, and the inner shell is composed of multiple layers of materials with electromagnetic shielding and vibration and impact suppression; the environment regulation subsystem is arranged on the frame shell and used for conveying laminar and filtered air to a test working area in the frame shell and controlling temperature and humidity in the sealed shell; the docking transmission subsystem is arranged on one side of the frame shell, and the docking transmission subsystem comprises a docking port used for docking a wafer mechanical hand; and the intelligent monitoring management subsystem is in communication connection with the environment regulation subsystem, the docking transmission subsystem, an external MES system, the wafer mechanical hand and optical test equipment. The application improves the accuracy, repeatability, automation degree and long-term operation reliability of wafer-level optical test.

Description

Technical Field

[0001] This invention belongs to the field of optical detection technology, and in particular relates to a wafer-level testing darkroom. Background Technology

[0002] In the manufacturing process of AR glasses, the core optical components (such as surface-embossed grating waveguides manufactured using semiconductor processes) need to undergo rigorous optical performance testing at the wafer stage, including uniformity, diffraction efficiency, angle and color consistency. These tests place extremely stringent requirements on the cleanliness, darkness (no stray light), temperature, humidity, and electromagnetic interference (EMI) of the testing environment. Therefore, a stable, controllable, and highly integrated darkroom environment is a prerequisite for ensuring the accuracy and repeatability of test data.

[0003] Currently, most anechoic chamber environments used for such precision optical testing are based on modifications of traditional equipment or general-purpose equipment, and they share the following common problems: 1. Insufficient integration and precision of environmental control: Existing solutions focus on the basic function of "light shielding," but lack systematic integration design for active, high-precision, and uniform control of the microenvironment (temperature, humidity, gas, and magnetism) within the anechoic chamber, failing to meet the extreme requirements of ultra-precision optical measurement for environmental stability; 2. Poor dynamic adaptation and automation compatibility: The interface between the anechoic chamber environment system and the automated wafer processing system (such as robotic arms and probe stations) is not smooth, lacking the ability to dynamically compensate for environmental parameters based on equipment status or external disturbances during testing, and the physical structure is not conducive to the sealing and connection of fully automated processes; 3. Challenges to system stability and reliability: Simple environmental control solutions are difficult to guarantee stability during long-term continuous operation, and imperfect electromagnetic compatibility design may introduce test noise, affecting the accuracy and repeatability of test results. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a wafer-level test anechoic chamber to construct a standardized test microenvironment that is precisely controllable, uniform, stable, intelligently linked, and has excellent electromagnetic shielding performance.

[0005] To achieve the above-mentioned technical objectives, the present invention is implemented using the following solution: This invention provides a wafer-level testing anechoic chamber, comprising a frame housing, an environmental control subsystem, a docking and transmission subsystem, and an intelligent monitoring and management subsystem. The frame housing includes an inner housing, which is made of a composite material with multi-layer electromagnetic shielding and vibration and shock suppression. The environmental control subsystem is located on the frame housing and is used to supply laminar flow and filtered air to the testing work area inside the frame housing and to control the temperature and humidity inside the sealed housing. The docking and transmission subsystem is located on one side of the frame housing and includes a docking port for docking with a wafer robot. The intelligent monitoring and management subsystem is communicatively connected to the environmental control subsystem, the docking and transmission subsystem, an external MES system, the wafer robot, and optical testing equipment.

[0006] Furthermore, the inner shell comprises, from the inside out, interconnected conductive coating, main shielding layer, damping layer, heat insulation and wave absorbing layer, and outer surface layer; the conductive coating is made of 304 stainless steel and its surface is treated with conductive spraying; the main shielding layer is made of cold-rolled steel plate, copper foil, or aluminum foil, and the conductive coating is bonded together with insulating adhesive, with copper-nickel alloy wire mesh pads used for conductive connection at the joints; the damping layer is a constraint layer damping material and is pasted on the outside of the main shielding layer; the heat insulation and wave absorbing layer is made of polyurethane foam internally doped with carbon powder or ferrite powder, or cut and spliced ​​from flexible magnetic wave absorbing material; the outer surface layer is made of powder-coated steel plate.

[0007] Furthermore, the frame shell also includes an outer frame, which is located outside the inner shell and is welded from Q235 material.

[0008] Furthermore, the frame shell also includes a main sealing door, which adopts the same structure as the inner shell and is sealed to the frame shell through a magnetic sealing strip and an inflatable silicone sealing ring. An observation window is provided on the main sealing door, which uses double-layer optical glass. The inner layer of optical glass is coated with a transparent conductive film, and the space between the two layers of optical glass is evacuated and filled with argon gas.

[0009] Furthermore, the environmental control subsystem includes an air handling unit and a return air duct. The air handling unit is mounted on the frame housing and includes a fan module, an air handling module, a supply air plenum, and a flow equalization device. The return air duct is located on the side or bottom of the frame housing. The fan module, air handling module, supply air plenum, flow equalization device, and return air duct constitute an air circulation path that passes through the test work area. The air handling module includes a PID controller, a cooler, an electric heater, an ultrasonic humidifier, a condenser dehumidifier, and temperature and humidity sensors. Several temperature and humidity sensors are placed at the supply air inlet, return air inlet, and four corners of the test work area of ​​the frame housing. The PID controller is communicatively connected to the cooler, electric heater, ultrasonic humidifier, condenser dehumidifier, and temperature and humidity sensors.

[0010] Furthermore, the air handling unit also includes a pre-filter, a medium-efficiency filter, a high-efficiency filter, and a chemical filter. The pre-filter, medium-efficiency filter, and high-efficiency filter are placed on the air circulation path, while the chemical filter is located in the return air duct.

[0011] Furthermore, the docking port includes a port frame, a feeding port, a sealing baffle, a drive and locking mechanism, and an electrical and communication interface module. The port frame has an integrated flange structure, and multiple tapered positioning pins are set around the port frame. The tapered positioning pins match the positioning sleeves on the wafer robot base. The feeding port is connected to the frame housing. The drive and locking mechanism is embedded in the port frame and includes a lead screw slide driven by a servo motor. The sealing baffle is fixedly connected to the slide, and a sealing strip is installed on the edge of the sealing baffle to seal the feeding port. The electrical and communication interface module is set on the port frame and includes a power quick-connect connector, a gigabit Ethernet interface, a fiber optic MPO interface, and a UHF RFID reader for identifying wafer cassettes.

[0012] Furthermore, the intelligent monitoring and management subsystem includes a core controller, which is a PLC or an industrial PC. The core controller communicates with the environmental control subsystem and the docking transmission subsystem via a bus. The core controller also communicates with the external MES system, wafer robot, and optical testing equipment via an industrial switch. The intelligent monitoring and management subsystem is equipped with an environmental pre-conditioning mode and a test collaboration mode, and can automatically control the wafer loading process and perform darkroom status detection and early warning. Beneficial effects

[0013] The inner shell of this invention's frame housing is made of a composite material with multi-layer electromagnetic shielding and vibration and shock suppression. An environmental control subsystem is installed on the frame housing to supply laminar flow and filtered air to the testing work area within the frame housing and to control the temperature and humidity inside the sealed housing. A docking and transmission subsystem is located on one side of the frame housing and includes a docking port for docking with a wafer manipulator. An intelligent monitoring and management subsystem communicates with the environmental control subsystem, the docking and transmission subsystem, the external MES system, the wafer manipulator, and the optical testing equipment. This achieves high precision, high uniformity, and ultra-stability in the testing microenvironment, significantly improving the accuracy and repeatability of optical testing data. It also achieves efficient and seamless integration with automated wafer production lines, greatly improving the automation level and overall capacity of the testing process, enhancing the long-term reliability and stability of the system, and optimizing the test signal-to-noise ratio.

[0014] The frame shell of this invention effectively isolates external environmental fluctuations and equipment heat generation interference through the heat insulation and damping characteristics of the composite inner shell. This highly stable and uniform environment fundamentally eliminates problems such as changes in the refractive index of optical materials and detector response drift caused by temperature and humidity drift. This allows the repeatability of wafer-level optical parameter (such as diffraction efficiency and uniformity) measurements (such as 3σ value) to be improved by more than an order of magnitude compared to ordinary laboratory or simple darkroom environments.

[0015] The composite shielding structure of this invention (conductive layer, main shielding layer, and wave-absorbing layer) provides electromagnetic shielding effectiveness of up to 60dB or more, effectively suppressing external electromagnetic interference and crosstalk between internal circuits.

[0016] The environmental control subsystem of this invention adopts a distributed, low-disturbance laminar flow air supply design and multi-point sensor closed-loop control, which can control the temperature fluctuation of the working area inside the dark room within ±0.1℃, the humidity fluctuation within ±1%RH, and the surface temperature difference of the working area less than 0.3℃.

[0017] The standardized docking port of the docking and transmission subsystem of this invention enables wafer robots to achieve "plug-and-play" docking with the darkroom, reducing the docking and calibration time for wafer loading / unloading from several minutes in the traditional manual or semi-automatic method to seconds.

[0018] The intelligent monitoring and management subsystem of this invention can pre-adjust the environment according to the MES task order and coordinate with the testing equipment to minimize non-core testing time (such as waiting for the environment to stabilize and manual operation), so that the darkroom can be seamlessly embedded into the fully automated production line as a standardized process module, increasing the automation rate of the wafer testing process to nearly 100% and effectively improving the overall utilization rate of the testing equipment.

[0019] The intelligent monitoring and management subsystem of this invention can monitor the operating status of key components of each subsystem in the darkroom in real time, realize predictive maintenance, avoid unplanned downtime, ensure the reliability of continuous operation 24 / 7, and significantly extend the average annual fault-free operation time. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a wafer-level testing anechoic chamber provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the docking port structure in a wafer-level testing anechoic chamber provided by an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a leveling and vibration damping mechanism in a wafer-level testing anechoic chamber provided by an embodiment of the present invention; Figure 4 This is a schematic diagram of the top structure of a wafer-level testing anechoic chamber provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the bottom structure of a wafer-level testing anechoic chamber provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the internal structure of a wafer-level testing anechoic chamber provided in an embodiment of the present invention; In the diagram: 1. Environmental control subsystem; 2. Main sealing door; 3. Integrated operation control panel; 4. Dating and transmission subsystem; 5. Frame housing; 6. Air handling unit; 7. Test work area; 8. Horizontal detection sensor; 9. Air flotation vibration damping device; 10. Outer frame; 11. Intelligent monitoring and management subsystem; 12. Drive and locking mechanism; 13. Electrical and communication interface module; 14. Temperature and humidity sensor; 15. Return air duct; 16. Wafer stage; 17. Inner wafer robot; 18. Wafer edge finding device; 19. Barcode scanner. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention. Example 1

[0022] like Figures 1 to 6 As shown, this embodiment provides a wafer-level testing anechoic chamber, including a frame housing 5, an environmental control subsystem 1, a docking and transmission subsystem 4, and an intelligent monitoring and management subsystem 11. The frame housing 5 includes an inner housing, which is made of a composite material with multi-layer electromagnetic shielding and vibration and shock suppression. The environmental control subsystem 1 is located on the frame housing 5 and is used to supply laminar flow and filtered air to the testing work area 7 inside the frame housing 5 and control the temperature and humidity inside the sealed housing 5. The docking and transmission subsystem 4 is located on one side of the frame housing 5 and includes a docking port for docking with a wafer manipulator. The intelligent monitoring and management subsystem 11 is communicatively connected to the environmental control subsystem 1, the docking and transmission subsystem 4, an external MES system, the wafer manipulator, and optical testing equipment. This wafer-level testing anechoic chamber is a modular, enclosed box structure that adopts an integrated architecture of "functional zoning and multi-environmental factor control," deeply integrating environmental control, physical shielding, air control unit, and vibration reduction system, rather than a simple light-shielding shell.

[0023] Specifically, the frame shell 5, as the structural body and shielding subsystem, constitutes the physical basis and basic barrier of the anechoic chamber, including: 1. The outer frame 10 is made of Q235 material such as A3 steel plate and is connected by welding. Its overall flatness is better than 0.1mm / m; it is made of Q235 material with high rigidity and low thermal expansion coefficient, providing stable mechanical support for the entire system. 2. The inner shell adopts a composite plate structure, with the following specific lamination sequence from the inside to the outside: ① Inner surface layer: 2mm thick 304 stainless steel plate, with electrostatic powder coating, surface resistivity range of 10^6 ~ 10^9 Ω / sq, used to prevent static electricity accumulation; ② Main shielding layer: 1.5mm thick cold-rolled steel plate, bonded to the inner surface layer with insulating adhesive, all joints are made of copper-nickel alloy wire mesh gasket to achieve continuous conductive connection, ensuring electromagnetic shielding effectiveness (SE) greater than 60dB in the 10kHz-1GHz frequency range; ③ Damping layer: 5mm thick constraint layer damping material (such as asphalt-based damping film), pasted on the outside of the main shielding layer, used to suppress structural resonance and reduce vibration transmission; ④ Heat insulation and wave absorption layer: 25mm thick polyurethane foam, internally doped with carbon powder or ferrite powder, with both heat insulation and high-frequency electromagnetic wave absorption functions; ⑤ Outer surface layer: 1mm thick powder-coated steel plate, serving a protective and decorative function; This composite structure not only provides excellent electromagnetic shielding effectiveness (EMI) SE), and can also suppress internal vibration transmission and external impact, creating a static and stable physical basis for optical testing. 3. The main sealing door 2 also adopts the composite plate structure of the inner shell mentioned above, and is sealed to the frame shell 5 with two sealing strips. The first is a magnetic sealing strip, used for initial adsorption and sealing, and the second is an inflatable silicone rubber sealing ring. When the door is closed, it is first adsorbed by the magnetic strip, and then clean and dry air of 0.3-0.5MPa is injected into the silicone rubber ring by the pneumatic system to expand it, so as to achieve airtightness, light tightness and a certain degree of acoustic tightness. An observation window is set on the main sealing door 2. The observation window adopts double-layer optical glass, with a transparent conductive film (ITO) coated on the inner side to prevent fogging. The interlayer is evacuated and filled with argon gas. The light transmittance is greater than 92%, and it is heat-insulating and anti-condensation. A multi-layer sealing structure driven by pneumatic or electric means (such as rubber sealing ring combined with metal finger spring) can simultaneously achieve light sealing, air sealing and electromagnetic sealing when the door is closed, ensuring the absolute sealing of the darkroom during testing.

[0024] The high-precision environmental control subsystem is the core of maintaining the microenvironment inside the darkroom. It includes an air handling unit 6, which is an independent module mounted on the top of the main frame via a shock absorber. Inside, it contains a fan module (using an EC backward centrifugal fan with an adjustable airflow range of 30-300 m³ / h), an air handling module, and a three-stage filter system consisting of primary, medium, and high-efficiency filters. The treated air is then sent to the air supply static pressure box and the flow equalization device. This device has a perforated plate structure with an opening rate of approximately 40%, ensuring that the airflow is delivered vertically downward into the test working area 7 at a velocity of less than 0.2 m / s. After passing through the working area, the airflow returns to the environmental control unit via the return air channel 15 at the bottom of the side wall, forming a vertical unidirectional (laminar) air circulation path. This effectively ensures the uniformity and cleanliness of the airflow in the working area, removes heat from the equipment, and ensures high uniformity of temperature and humidity on the wafer plane (temperature difference < ±0.3℃). The air handling module is integrated into the air handling unit 6. Temperature regulation uses a combination of a thermoelectric cooler (TEC) and a heating wire. Cooling water circulation removes heat from the TEC's hot end. Humidity regulation uses a combination of an ultrasonic humidifier and a condenser dehumidifier. Multiple temperature and humidity sensors 14 (such as the SHT85 type, with an accuracy of ±0.1°C and ±1%RH) are arranged at the air supply outlet, return air outlet, and the four corners of the working area. A high-precision PID controller performs real-time PID calculations based on the deviation between the average value of these temperature and humidity sensors 14 and the set value, dynamically adjusting the TEC power, heating wire power, and humidifier / dehumidifier duty cycle to achieve a working area temperature control accuracy of ±0.1°C and humidity of ±1%RH. Along the air circulation path, there are sequentially installed G4 pre-filters (filtering particles ≥5μm), F7 medium-efficiency filters (filtering particles ≥1μm), and H13 high-efficiency filters (filtering efficiency ≥99.97% for 0.3μm particles). In the return air duct 15, there is also a replaceable chemical filter (activated carbon filter) to adsorb volatile organic compounds (VOCs) and maintain the internal cleanliness to ISO Class 5 (Class 100) or higher standards.

[0025] The docking port of the docking transmission subsystem 4 includes a port frame, a feeding port, a sealing baffle, a drive and locking mechanism 12, and an electrical and communication interface module 13. Specifically, the port frame is an integrated flange structure with three precision tapered positioning pins around its perimeter for engaging with positioning sleeves on the external robotic arm base to achieve sub-millimeter repeatability. The feeding port connects to the frame housing 5. The port frame is embedded with a sealing door drive and locking mechanism 12, which includes a servo motor-driven lead screw slide for controlling the raising and lowering of a metal sealing baffle that matches the shape of the port. The baffle edge is fitted with a fluororubber sealing strip to seal the feeding port. The port frame also integrates an electrical and communication interface module, which includes a 24V DC power quick-connect connector, a Gigabit Ethernet interface (RJ45), a fiber optic MPO interface, and a UHF RFID reader for identifying wafer cassettes, used to exchange control signals, wafer ID information, and synchronization commands with the transmission equipment. When the wafer robot arrives with the wafer loaded, it automatically opens the sealed baffle of the feeding port. Through the port frame and electrical and communication interface module, it completes position calibration and information handshake with the AGV. The wafer is then sent into the predetermined station inside the dark chamber. The entire process requires no manual intervention and the environmental disturbance inside the dark chamber is minimized.

[0026] The darkroom is also equipped with a level detection sensor 8 and an air-float vibration damping device 9, which are respectively connected to the intelligent monitoring and management subsystem 11. The air-float vibration damping device 9 is located at the bottom of the darkroom to reduce the vibration frequency, and the level detection sensor 8 is located at the bottom of the darkroom, next to the air-float vibration damping device 9, to sense the level of the platform.

[0027] The intelligent monitoring and management subsystem 11 is the "brain" coordinating the operation of the entire system. Its hardware is located in the intelligent management controller installation area within the frame housing 5, and its software runs on an industrial PC or PLC. The hardware of the intelligent monitoring and management subsystem 11 is comprised of a core controller, which can be a high-performance PLC (such as the Siemens S7-1500 series) or an industrial PC. The core controller's I / O modules are connected via a fieldbus (such as PROFINET) to all relevant sensors and actuators, including temperature and humidity sensors, differential pressure sensors, door status switches, fan frequency converters, TEC drives, and solenoid valves, in the frame housing 5, environmental control subsystem 1, and docking transmission subsystem 4. The core controller communicates with external MES systems, wafer robot controllers, and the main controller of optical testing equipment via an industrial switch.

[0028] The control logic and software functions of the intelligent monitoring and management subsystem 11 are as follows: (1) Environmental pre-conditioning mode: After receiving the test task from MES, the system calls the preset environmental parameters (such as 23°C, 45%RH) according to the wafer process recipe. The intelligent management system starts the environmental control subsystem in advance and uses the model built from historical data to predict the stabilization time, ensuring that the environment is completely stable at the set point when the robot loads the wafer; (2) Test Collaboration Mode: When the optical test equipment in the dark room transports the wafer on the wafer stage 16 to the test work area 7 after passing through the wafer edge finding device 18 and / or barcode scanner 19 via the inner wafer robot 17 to start high-sensitivity photoelectric detection, it will send a hard-wired signal or network command for "acquisition start" to this system. After receiving the command, the system will immediately reduce the fan speed from the normal level (e.g., 80%) to the minimum maintenance level (e.g., 20%) for a preset time (e.g., 2 seconds) to minimize the impact of airflow vibration on the optical platform. The system will automatically recover after the acquisition is completed. (3) Automated process control: When the wafer robot arrives at the docking port with the wafer, the controller of the docking transmission subsystem 4 sends a "request docking" command via Ethernet. After verifying the legality of the command, the system controls the sealing door drive and locking mechanism 12 to open the sealing baffle and verifies the wafer box ID by reading it with RFID. After confirming that there is no error, the system guides the robot to complete the wafer loading. The entire process is displayed in real time on the touch screen of the integrated operation control panel 3, showing the status and logs.

[0029] (4) Status monitoring and early warning: The system continuously monitors all relevant sensor data and key component operating parameters (such as fan current and TEC voltage). Once the data deviates from the normal range (such as abnormal increase in filter voltage difference), an early warning is issued on the local HMI and the upper computer MES system to indicate maintenance needs and realize predictive maintenance. Example 2

[0030] This embodiment provides a wafer-level testing anechoic chamber, which differs from Embodiment 1 in that: for weight considerations, the main shielding layer can be made of copper foil or aluminum foil instead of steel plate, but the conductivity continuity at the joints must be ensured; the absorbing layer can also be made of flexible magnetic absorbing material (FMA) cut and spliced ​​together; for applications with larger heat loads, temperature regulation can be achieved by using a combination of compressor refrigeration and electric heater instead of TEC to improve cooling capacity and energy efficiency ratio; the intelligent monitoring and management subsystem 11 can adopt a distributed control architecture, which can be managed by independent embedded controllers and communicate with the main controller through a unified fieldbus to improve the modularity and reliability of the system.

[0031] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A wafer-level testing anechoic chamber, characterized in that, It includes a frame housing, an environmental control subsystem, a docking and transmission subsystem, and an intelligent monitoring and management subsystem. The frame housing includes an inner housing, which is made of a composite material with multi-layer electromagnetic shielding and vibration and shock suppression. The environmental control subsystem is located on the frame housing and is used to deliver laminar flow and filtered air to the test work area inside the frame housing and to control the temperature and humidity inside the sealed housing. The docking and transmission subsystem is located on one side of the frame housing and includes a docking port for docking with a wafer robot. The intelligent monitoring and management subsystem communicates with the environmental control subsystem, the docking and transmission subsystem, the external MES system, the wafer robot, and the optical testing equipment.

2. The wafer-level testing anechoic chamber according to claim 1, characterized in that, The inner shell consists of, from the inside out, interconnected conductive coating, main shielding layer, damping layer, heat insulation and wave absorbing layer, and outer shell layer. The conductive coating is made of 304 stainless steel and its surface is treated with conductive spraying. The main shielding layer is made of cold-rolled steel plate, copper foil, or aluminum foil, and the conductive coating is bonded to it with insulating adhesive. The joints are connected by copper-nickel alloy wire mesh gaskets. The damping layer is a constraint layer damping material and is pasted on the outside of the main shielding layer. The heat insulation and wave absorbing layer is made of polyurethane foam doped with carbon powder or ferrite powder, or a flexible magnetic wave absorbing material cut and spliced ​​together. The outer shell layer is made of powder-coated steel plate.

3. The wafer-level testing anechoic chamber according to claim 1, characterized in that, The frame shell also includes an outer frame, which is set outside the inner shell and is welded from Q235 material.

4. The wafer-level testing darkroom according to claim 1, characterized in that, The frame shell also includes a main sealing door, which adopts the same structure as the inner shell and is sealed to the frame shell through a magnetic sealing strip and an inflatable silicone sealing ring. An observation window is set on the main sealing door. The observation window uses double-layer optical glass. The inner layer of optical glass is coated with a transparent conductive film. The space between the two layers of optical glass is evacuated and filled with argon gas.

5. The wafer-level testing darkroom according to claim 1, characterized in that, The environmental control subsystem includes an air handling unit and a return air duct. The air handling unit is mounted on the frame housing and includes a fan module, an air handling module, a supply air plenum, and a flow equalization device. The return air duct is located on the side or bottom of the frame housing. The fan module, air handling module, supply air plenum, flow equalization device, and return air duct constitute an air circulation path that passes through the test work area. The air handling module includes a PID controller, a cooler, an electric heater, an ultrasonic humidifier, a condenser dehumidifier, and temperature and humidity sensors. Several temperature and humidity sensors are placed at the supply air inlet, return air inlet, and four corners of the test work area of ​​the frame housing. The PID controller is communicatively connected to the cooler, electric heater, ultrasonic humidifier, condenser dehumidifier, and temperature and humidity sensors.

6. The wafer-level testing anechoic chamber according to claim 5, characterized in that, The air handling unit also includes a pre-filter, a medium-efficiency filter, a high-efficiency filter, and a chemical filter. The pre-filter, medium-efficiency filter, and high-efficiency filter are placed on the air circulation path, while the chemical filter is located in the return air duct.

7. The wafer-level testing anechoic chamber according to claim 1, characterized in that, The docking port includes a port frame, a feeding port, a sealing baffle, a drive and locking mechanism, and an electrical and communication interface module. The port frame has an integrated flange structure, with multiple tapered positioning pins around its perimeter. These pins match the positioning sleeves on the wafer robot base. The feeding port connects to the frame housing. The drive and locking mechanism is embedded in the port frame and includes a servo motor-driven lead screw slide. The sealing baffle is fixedly connected to the slide, and a sealing strip is installed on the edge of the sealing baffle to seal the feeding port. The electrical and communication interface module is located on the port frame and includes a power quick-connect connector, a gigabit Ethernet interface, a fiber optic MPO interface, and a UHF RFID reader for identifying wafer cassettes.

8. The wafer-level testing darkroom according to claim 1, characterized in that, The intelligent monitoring and management subsystem includes a core controller, which is a PLC or industrial PC. The core controller communicates with the environmental control subsystem and the docking transmission subsystem via a bus. The core controller also communicates with the external MES system, wafer robot, and optical testing equipment via an industrial switch. The intelligent monitoring and management subsystem is equipped with an environmental pre-conditioning mode and a test collaboration mode, and can automatically control the wafer loading process and perform darkroom status detection and early warning.

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