A multi-functional defect detection system

Abstract

This application relates to the field of defect detection technology, specifically to a multifunctional defect detection system, including a machine base and on the machine base: a conveying component that drives a substrate to move in the detection direction; a first detection component that includes multiple first imaging modules arranged side-by-side perpendicular to the detection direction; and a second detection component arranged sequentially along the detection direction with the first detection component, the second detection component including multiple line scanning cameras; wherein the conveying component sequentially drives the substrate past the first and second detection components, the first detection component detects first defects on the substrate surface, and the second detection component detects second defects on the substrate surface. This application utilizes the first and second detection components to detect different defects in the film layer on the substrate surface, ensuring that all defects are detected to guarantee film quality, and adapting to the defect detection needs of different film layers, thus broadening the applicability of the detection system.

Description

Technical Field

[0001] This application relates to the field of defect detection technology, and in particular to a multifunctional defect detection system. Background Technology

[0002] Inkjet printing is finding increasingly widespread applications in several emerging fields, such as new displays, RFID, thin-film solar cells, wearable flexible devices, PCBs, and smart skins. Inkjet printing technology offers advantages such as high material utilization, no need for photomasks, low equipment cost, and ease of large-size manufacturing. It enables low-cost, large-area printing of new display devices such as OLEDs and QLEDs, making it one of the most promising processes for fabricating new display devices.

[0003] In related technologies, when inspecting the film layer on the substrate surface, multiple line scanning cameras arranged in multiple rows with staggered positioning are usually used to achieve continuous scanning in the width direction of the substrate. Alignment correction is combined to ensure that the substrate is centered. The target defects are identified by matching the stitched images with the feature model, and the defect images are verified a second time using a re-inspection device to reduce misjudgment.

[0004] However, after a film is formed on the substrate surface using printing technology, there are many types of defects in the film layer, such as particles, voids, mura, and breaks. Moreover, different film layers require different types of defects to be detected during inspection. Therefore, inspection using only a line scan camera cannot identify all defects in the film layer, affecting the reliability of the inspection and failing to guarantee the quality of the film formation. In addition, the number of detectable defect types is limited, making it unable to handle the inspection of different film layers and resulting in a narrow applicability. Summary of the Invention

[0005] This application provides a multifunctional defect detection system to solve the technical problems in related technologies, such as the inability to identify all defects in the film layer, affecting detection reliability, failing to guarantee film quality, having a limited range of detectable defect types, being unable to handle the detection of different film layers, and having narrow applicability.

[0006] A multifunctional defect detection system includes a machine base and components arranged on the machine base: A conveying assembly for carrying a substrate and moving the substrate in the detection direction; A first detection component, comprising a plurality of first imaging modules, wherein the plurality of first imaging modules are arranged side by side perpendicular to the detection direction; The second detection component is arranged sequentially in the detection direction of the first detection component. The second detection component includes multiple line scanning cameras, which are arranged side by side perpendicular to the detection direction. The imaging direction of the line scanning cameras is arranged at an angle to the detection direction on the horizontal plane, and the imaging direction of the line scanning cameras is arranged at an angle to the vertical direction in the vertical plane. In this process, the conveying component sequentially drives the substrate to pass under the first detection component and the second detection component, whereby the first detection component detects a first defect on the surface of the substrate and the second detection component detects a second defect on the surface of the substrate.

[0007] In some embodiments, the first detection component further includes: Multiple first lifting drive components are respectively connected to multiple first imaging modules to adjust the height of the multiple first imaging modules respectively; Multiple rangefinders are arranged to correspond to multiple first imaging modules, and the rangefinders are used to measure the vertical distance between the first imaging module and the substrate. The substrate is driven to pass under the multiple ranging elements to determine the height of the substrate at various points. When a portion of the substrate moves into the field of view of the first imaging module, the height of the corresponding first imaging module is adjusted to ensure that the portion of the substrate located below the first imaging module is within the focal plane of the first imaging module.

[0008] In some embodiments, the rangefinder and the first imaging module are arranged at intervals in the detection direction, with the rangefinder located in front of or behind the first imaging module.

[0009] In some embodiments, the first detection component further includes a first lateral movement drive, which is driven to connect to the first detection component to drive the first detection component to move perpendicular to the detection direction.

[0010] In some embodiments, the second detection component further includes a second lateral movement drive, which is connected to the line scan camera to drive the line scan camera to move perpendicular to the detection direction.

[0011] In some embodiments, the multifunctional defect detection system further includes a re-inspection component located behind the first detection component, the re-inspection component comprising: A re-inspection vision module, wherein the re-inspection vision module is used to image the surface of the substrate; A re-inspection lifting drive is connected to the re-inspection vision module to drive the re-inspection vision module to move up and down. A re-inspection lateral movement drive is provided, which is connected to the re-inspection vision module to drive the re-inspection vision module to move perpendicular to the detection direction.

[0012] In some embodiments, the conveying assembly includes: A support platform for supporting the substrate; A rotating platform, wherein the support platform is mounted on the rotating end of the rotating platform, and the rotating platform drives the support platform and the substrate to rotate in a horizontal plane; A conveying drive is provided, which is driven to the rotary table to move the rotary table, the support platform, and the substrate in the detection direction.

[0013] In some embodiments, the multifunctional defect detection system further includes a first correction component, which comprises: Multiple positioning components are arranged on adjacent sides and in the middle of the support platform, and the positioning components are lower than the support surface of the support platform. Each positioning component includes a positioning rod and a positioning drive, and the positioning drive drives the positioning rod to extend above the support platform. Multiple abutting components are arranged on opposite sides of the support platform, and the positioning component and the abutting component are respectively arranged on opposite sides of the support platform; the abutting components are adapted to push the substrate so that the substrate abuts against the positioning rod.

[0014] In some embodiments, the multifunctional defect detection system further includes a second correction component for capturing marker points on the substrate to determine the position of the substrate on the support platform. The second correction component is located on one side of the support platform. The second correction component includes: The first capture component includes a first capture driver and a first capture camera. The first capture driver is driven to drive the first capture camera to move in a direction perpendicular to the detection direction, so that the first capture camera is positioned above the support platform. As the support platform moves in the detection direction, the first capture camera captures the marking points on the substrate. A second capture assembly is arranged at a distance from the first capture assembly in the detection direction, with the second capture assembly located behind the first capture assembly. The second capture assembly includes a second capture driver, a transposition capture driver, and a second capture camera. The second capture driver is driven to the second capture camera to move the second capture camera perpendicular to the detection direction, so that the second capture camera is positioned above the support platform. As the support platform moves in the detection direction, the second capture camera captures the marker points on the substrate. The transposition capture driver is driven to the second capture camera to move the second capture camera in the detection direction.

[0015] In some embodiments, the multifunctional defect detection system further includes a third detection component, which is arranged at a distance from the first and second detection components in the detection direction; the third detection component includes: A film thickness detection assembly includes a rotary drive and a film thickness detector. The rotary drive is driven to rotate the film thickness detector in a horizontal plane. The film thickness detector is used to detect the film thickness on the surface of the substrate. An overflow detection imaging module is used to image the edge of the printed area on the substrate; The third lateral movement drive is connected to both the film thickness detection component and the overflow detection imaging module to drive the film thickness detection component and the overflow detection imaging module to move perpendicular to the detection direction. The substrate is adapted to pass under the film thickness detection component and the overflow detection imaging module.

[0016] The beneficial effects of the technical solution provided in this application include: This application provides a multifunctional defect detection system. When detecting defects in the film layer on the surface of a substrate, the substrate is placed on a conveying assembly, which drives the substrate to move in the detection direction so that the substrate passes under a first detection assembly and a second detection assembly. The first and second detection assemblies detect different defects in the film layer on the substrate surface, thereby ensuring the reliability of substrate detection. Furthermore, for different film layers, at least one of the first and second detection assemblies can be selected to detect the film layer, thereby meeting the detection requirements of different film layers and broadening the applicability of film layer detection.

[0017] In the first detection component, multiple first imaging modules arranged side by side perform imaging detection on different positions of the film layer on the substrate surface as the substrate passes beneath them. This meets the detection requirements of large-size substrates and improves detection efficiency. By detecting a portion of the film layer through each first imaging module, first-type defects such as impurities and missed spots on the film layer surface are identified, thereby ensuring film quality.

[0018] The second inspection component uses multiple line-scan cameras to scan and image the film layer on the substrate surface. As the substrate is transported along the inspection direction, the multiple line-scan cameras can complete a full scan of the substrate surface. The second inspection component can identify secondary defect types such as MURA defects in the film layer to ensure film quality. By limiting the imaging direction of the line-scan cameras, the influence of light fluctuations and moiré patterns on defect identification during the imaging process is avoided, ensuring that all defects are identified. This guarantees inspection reliability and film layer forming quality. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the multifunctional defect detection system provided in the embodiments of this application; Figure 2 A partial schematic diagram of the first detection component provided in an embodiment of this application; Figure 3 A schematic diagram of the re-inspection component and the third detection component provided in the embodiments of this application; Figure 4 This is a partial schematic diagram of the conveying assembly provided in an embodiment of this application; Figure 5 This is a schematic diagram of the internal structure of the support platform provided in an embodiment of this application; Figure 6 A schematic diagram of the ejector pin assembly provided in an embodiment of this application; Figure 7 A schematic diagram of the ejector pin provided in the embodiments of this application; Figure 8 A schematic diagram of the adsorption element provided in the embodiments of this application; Figure 9 A schematic diagram of the first correction component provided in an embodiment of this application; Figure 10 This is a schematic diagram of the second correction component provided in an embodiment of this application.

[0021] In the diagram: 1. Machine base; 11. First gantry; 12. Second gantry; 2. Conveying assembly; 21. Support platform; 22. Rotary table; 23. Conveying drive component; 3. First detection assembly; 31. First imaging module; 32. First lifting drive component; 33. Rangefinder; 34. First lateral movement drive component; 4. Second detection assembly; 41. Line scan camera; 42. Second lateral movement drive component; 5. Re-inspection assembly; 51. Re-inspection vision module; 52. Re-inspection lifting drive component; 53. Re-inspection lateral movement drive component; 6. Third detection assembly; 61. Film thickness detection assembly; 611. Film thickness detector; 612. Rotation drive component; 62. Overflow detection imaging module; 63. Third lateral movement drive component; 64. 7. First correction component; 71. Positioning component; 711. Positioning rod; 712. Positioning drive component; 72. Abutting component; 721. Abutting rod; 722. Abutting lifting drive component; 723. Abutting pushing drive component; 8. Second correction component; 81. First capture component; 811. First capture camera; 812. First capture drive component; 82. Second capture component; 821. Second capture camera; 822. Second capture drive component; 823. Positioning capture drive component; 9. Ejector pin assembly; 91. Ejector pin frame; 92. Ejector pin component; 921. Ejector rod; 922. Ball bearing; 93. Lifting drive component; 94. Adsorption component; 941. Adsorption rod; 942. Adsorption drive component. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] This application provides a multifunctional defect detection system that utilizes a first detection component and a second detection component to detect different defects in the film layer on the substrate surface, ensuring that all defects are detected to guarantee film quality. It adapts to the defect detection needs of different film layers, thus broadening the applicability of the detection system. This application solves the technical problems in related technologies, such as the inability to identify all defects in the film layer, affecting detection reliability, failing to guarantee film quality, having a limited range of detectable defect types, being unable to handle the detection of different film layers, and having narrow applicability.

[0024] Reference Figure 1A multifunctional defect detection system includes a machine base 1 and a conveying assembly 2, a first detection assembly 3, and a second detection assembly 4 arranged on the machine base 1. The first detection assembly 3 and the second detection assembly 4 are arranged at intervals in the detection direction, and the detection ends of both the first detection assembly 3 and the second detection assembly 4 are located above the machine base 1. The conveying assembly 2 carries the substrate and drives the substrate to be conveyed in the detection direction, so that the substrate passes under the detection ends of the first detection assembly 3 and the second detection assembly 4. During the conveying process of the substrate, the detection process of the film layer on the surface of the substrate can be completed.

[0025] The first detection component 3 and the second detection component 4 detect different types of defects, respectively. The first detection component 3 is used to detect the first defects of the film layer, including missed defects, impurities, etc.; the second detection component 4 is used to detect the second defects of the film layer, including MURA, etc.

[0026] This configuration allows the first detection component 3 and the second detection component 4 to detect different defects in the film layer on the substrate surface, avoiding the possibility of missing certain defects and ensuring the reliability of substrate inspection. Furthermore, for different film layers, at least one of the first detection component 3 and the second detection component 4 can be selected to inspect the film layer, thereby meeting the inspection requirements of different film layers and broadening the applicability of film layer inspection.

[0027] In this embodiment, the first detection component 3 is located in front of the second detection component 4, meaning that as the substrate is transported, the substrate first passes under the first detection component 3 and then under the second detection component 4. In other embodiments, the first detection component 3 may also be located behind the second detection component 4, meaning that as the substrate is transported, the substrate first passes under the second detection component 4 and then under the first detection component 3.

[0028] It should be noted that the front and rear directions in this embodiment are based on the movement direction of the substrate. That is, after the substrate is loaded, when the substrate approaches various detection components in the detection direction, the detection components that the substrate passes first are located in front, and the detection components that the substrate passes later are located behind.

[0029] Reference Figure 1 The machine tool 1 is equipped with a first gantry frame 11, and the first detection component 3 is mounted on the first gantry frame 11. The substrate passes under the first gantry frame 11.

[0030] The first detection component 3 includes multiple first imaging modules 31, which are arranged side-by-side perpendicular to the detection direction. In this embodiment, each first imaging module 31 includes a camera, and correspondingly, the first detection component 3 also includes a supplementary light for illuminating the first imaging module 31.

[0031] With this configuration, as the substrate passes under the first detection component 3, multiple first imaging modules 31 respectively perform imaging detection on different positions of the film layer on the substrate surface, meeting the detection requirements of large-size substrates and improving detection efficiency. By detecting a portion of the film layer by each first imaging module 31, it is ensured that first-type defects such as impurities and missed spots on the film layer surface are identified, thereby guaranteeing the quality of the film layer.

[0032] Reference Figure 1 and Figure 2 The first detection component 3 further includes a first transverse drive component 34, which is driven to connect with the first detection component 3 to drive the first detection component 3 to move in a direction perpendicular to the detection direction.

[0033] Reference Figure 1 and Figure 2 Specifically, the first transverse drive 34 is mounted on the first gantry 11, and multiple first imaging modules 31 are mounted on the drive end of the first transverse drive 34. The first transverse drive 34 synchronously drives the multiple first imaging modules 31 to move in a direction perpendicular to the detection direction, thereby changing the position of all the first imaging modules 31. In this embodiment, the first transverse drive 34 includes a linear motor or a lead screw mechanism.

[0034] With this configuration, when the width of the imaging field formed by all the first imaging modules 31 is narrower than the width of the film layer on the substrate surface, the substrate passes under the first detection component 3 first, and then all the first imaging modules 31 scan and detect a portion of the film layer on the substrate surface. Then, by changing the position of all the first imaging modules 31, the substrate passes under the first detection component 3 again, thus ensuring comprehensive detection of the film layer on the surface of large-size substrates. Therefore, this configuration is suitable for the detection requirements of large-size substrates. In this embodiment, the large-size substrate includes substrates processed by G6 and G8.5 generation lines.

[0035] Reference Figure 2 The first detection component 3 also includes multiple first lifting drive components 32 and multiple rangefinders 33.

[0036] Reference Figure 1 and Figure 2 Multiple first lifting drive components 32 are respectively driven and connected to multiple first imaging modules 31 to adjust the height of the multiple first imaging modules 31 respectively. In this embodiment, the first lifting drive component 32 is installed on the drive end of the first lateral drive component 34. The first lifting drive component 32 includes a lead screw mechanism or a linear motor.

[0037] Multiple rangefinders 33 are arranged corresponding to multiple first imaging modules 31, and the rangefinders 33 are used to measure the vertical distance between the first imaging module 31 and the substrate. In this embodiment, the rangefinder 33 includes a laser rangefinder.

[0038] The substrate is driven to pass under multiple ranging elements 33 to determine the height of each part of the substrate. When part of the substrate moves into the field of view of the first imaging module 31, the height of the corresponding first imaging module 31 is adjusted to ensure that the part of the substrate located below the first imaging module 31 is within the focal plane of the first imaging module 31.

[0039] Understandably, since the substrate is not completely flat, the height of the film layer on the substrate surface also varies. The height of each position on the substrate is measured by the ranging device 33, and the height of the first imaging module 31 is adjusted accordingly to ensure that the substrate is within the field of view of the first imaging module 31 and also within the focal plane of the first imaging module 31, so as to ensure clear imaging of the film layer on the substrate surface.

[0040] Reference Figure 1 and Figure 2 In this system, the ranging device 33 is located in front of or behind the first imaging module 31. As the substrate is transported, the ranging device 33 scans various points on the substrate surface to obtain height data for each point. Subsequently, the height of the first imaging module 31 can be adjusted according to the specific imaging position of the substrate.

[0041] Preferably, the ranging element 33 is located in front of the first imaging module 31, and the substrate passes through the ranging element 33 before passing through the first imaging module 31. Therefore, by measuring the height of the substrate surface in advance, the first lifting drive element 32 can be provided with the height information of the substrate's required imaging position in advance, allowing for quick and timely adjustment of the height of the first imaging module 31. This ensures that accurate imaging detection is completed after the substrate passes through the ranging element 33 and the first imaging module 31. This optimizes the detection cycle and improves detection efficiency.

[0042] Reference Figure 3 The multifunctional defect detection system also includes a re-inspection component 5, which is located behind the first detection component 3. In this embodiment, the re-inspection component 5 is installed on the side of the first gantry 11, and the re-inspection component 5 and the first detection component 3 are located on opposite sides of the first gantry 11.

[0043] Reference Figure 3 The re-inspection component 5 includes a re-inspection vision module 51, a re-inspection lifting drive 52, and a re-inspection lateral movement drive 53. The re-inspection vision module 51 is used to image the substrate surface. In this embodiment, the re-inspection vision module 51 includes a camera.

[0044] Reference Figure 3The re-inspection lifting drive 52 is driven by the re-inspection vision module 51 to drive the re-inspection vision module 51 to move up and down. The re-inspection lateral movement drive 53 is driven by the re-inspection vision module 51 to drive the re-inspection vision module 51 to move perpendicular to the detection direction. In this embodiment, both the re-inspection lateral movement drive 53 and the re-inspection lifting drive 52 include a lead screw mechanism or a linear motor.

[0045] Reference Figure 3 Specifically, the re-inspection vision module 51 is installed on the drive end of the re-inspection lifting drive 52, the re-inspection lifting drive 52 is installed on the drive end of the re-inspection lateral movement drive 53, and the re-inspection lateral movement drive 53 is installed on the first gantry 11.

[0046] With this configuration, after the first detection component 3 identifies a first defect in the film layer on the substrate surface, as the substrate is transported, the re-inspection lateral drive 53 moves the re-inspection vision module 51 to the location of the first defect on the substrate surface. Then, the re-inspection lifting drive 52 adjusts the height of the re-inspection vision module 51 so that the first defect on the substrate surface detected by the first detection component 3 is within the focal plane of the re-inspection vision module 51. This allows for the re-inspection of the first defect on the substrate surface detected by the first detection component 3, reducing the possibility of misjudgment by the first detection component 3.

[0047] Reference Figure 1 In this embodiment, the second detection component 4 is arranged sequentially with the first detection component 3 in the detection direction. The second detection component 4 is located behind the first detection component 3. The substrate passes through the first detection component and the re-inspection component 5 first, and then passes under the second detection component 4.

[0048] Reference Figure 1 A second gantry frame 12 is fixed on the machine base 1, and the substrate is adapted to pass through the second gantry frame 12. The second detection component 4 is installed on the second gantry frame 12.

[0049] Reference Figure 1 The second detection component 4 includes multiple line scan cameras 41, which are arranged side by side perpendicular to the detection direction. The imaging direction of the line scan cameras 41 is arranged at an angle to the detection direction on the horizontal plane, and the imaging direction of the line scan cameras 41 is arranged at an angle to the vertical direction in the vertical plane.

[0050] With this configuration, the second detection component 4 scans and images the film layer on the substrate surface using multiple line scan cameras 41. As the substrate is transported in the detection direction, the multiple line scan cameras 41 can complete a full scan of the substrate surface. The second detection component 4 can identify secondary defect types such as MURA defects in the film layer to ensure the quality of the film layer. By limiting the imaging direction of the line scan cameras 41, the influence of light fluctuations and moiré patterns on defect identification during the imaging process is avoided, ensuring that all defects are identified, thereby guaranteeing detection reliability and ensuring the quality of film layer formation.

[0051] Reference Figure 1 Furthermore, the second detection component 4 also includes a second lateral movement drive 42, which is driven by the line scan camera 41 to move the line scan camera 41 perpendicular to the detection direction. In this embodiment, the second lateral movement drive 42 is mounted on the second gantry 12. The second lateral movement drive 42 includes a linear motor or a lead screw mechanism.

[0052] With this configuration, the second lateral drive 42 moves the line scan camera 41 perpendicular to the detection direction. When the substrate size is too large, the entire substrate can be inspected by moving the line scan camera 41 and scanning it multiple times. When the substrate is placed at the designated position on the transport assembly 2, the scanning position of the line scan camera 41 can be changed by moving it, ensuring that the substrate passes through the field of view of the line scan camera 41, thereby meeting the inspection requirements of substrates of different sizes.

[0053] Reference Figure 3 The multifunctional defect detection system further includes a third detection component 6, which is arranged at intervals from the first detection component 3 and the second detection component 4 in the detection direction. In this embodiment, the third detection component 6 is arranged behind the first detection component 3 and is mounted on the first gantry 11, with the third detection component 6 and the re-inspection component 5 located on the same side of the first gantry 11. When the substrate passes under the third detection component 6, the third detection component 6 detects defects in the film layer on the substrate surface.

[0054] Reference Figure 3 The third detection component 6 includes a film thickness detection component 61 and a third transverse drive component 63. The film thickness detection component 61 is used to detect the film thickness on the substrate surface to determine whether the film layer on the substrate surface is uniform.

[0055] Reference Figure 3 The third transverse drive 63 is mounted on the first gantry 11, and the film thickness detection component 61 is mounted on the third transverse drive 63. The third transverse drive 63 drives the film thickness detection component 61 to move perpendicular to the detection direction. In this embodiment, the third transverse drive 63 includes a linear motor or a lead screw mechanism.

[0056] Therefore, as the substrate is transported in the detection direction, the film thickness detection component 61 can scan the film layer on the substrate surface in the detection direction. The third transverse drive 63 can then scan the film layer on the substrate surface perpendicular to the detection direction, thus achieving comprehensive detection of the film layer.

[0057] Reference Figure 3 The third detection component 6 further includes a third lifting drive 64, which is mounted on the third transverse drive 63. The film thickness detection component 61 is mounted on the drive end of the third lifting drive 64. The third lifting drive 64 drives the film thickness detection component 61 to move vertically, thereby changing the distance between the film thickness detection component 61 and the substrate, achieving accurate measurement. In this embodiment, the third lifting drive 64 includes a linear motor or a lead screw mechanism.

[0058] Reference Figure 3 The film thickness detection assembly 61 includes a rotary drive 612 and a film thickness detector 611. The rotary drive 612 is driven to rotate the film thickness detector 611 in a horizontal plane. In this embodiment, the rotary drive 612 includes a motor. The film thickness detector 611 includes an interferometer.

[0059] It should be noted that the detection range of the film thickness gauge 611 is rectangular. By rotating the film thickness gauge 611 in the horizontal plane, the length direction of the detection range of the film thickness gauge 611 can be changed.

[0060] Generally, uneven film thickness is prone to occur at the edges of the film layer on the substrate surface. When detecting the film layer edge extending along the detection direction, the length direction of the detection range of the film thickness detector 611 is arranged perpendicular to the detection direction. At this time, as the substrate is transported in the detection direction, the film layer edge extending along the detection direction can be detected. When detecting the film layer edge extending perpendicular to the detection direction, the length direction of the detection range of the film thickness detector 611 is arranged along the detection direction. At this time, as the third transverse drive 63 drives the film thickness detection assembly 61 to move perpendicular to the detection direction, the film layer edge extending perpendicular to the detection direction can be detected.

[0061] Reference Figure 3 Furthermore, the third detection component 6 also includes an overflow detection imaging module 62, which is used to image the edge of the printed area on the substrate to detect whether functional liquid overflows from the printed area on the substrate surface. The overflow detection imaging module 62 is mounted on the driving end of the third lifting drive 64. In this embodiment, the overflow detection imaging module 62 includes a camera.

[0062] With this configuration, the overflow detection imaging module 62 images the edge of the film layer on the substrate surface, and the conveying component 2 conveys the substrate in the detection direction, while the third transverse drive 63 drives the overflow detection imaging module 62 to move in the vertical detection direction, thus enabling the detection of all edges of the film layer on the substrate.

[0063] Reference Figure 3 The overflow detection imaging module 62 and the film thickness detection component 61 are both arranged at the driving end of the third transverse drive 63. The overflow detection imaging module 62, the film thickness detection component 61, and the re-inspection vision module 51 are all arranged on the same side of the first gantry 11. In this embodiment, the stroke of the third transverse drive 63 and the stroke of the re-inspection transverse drive 53 are both greater than the width of the substrate that the conveying component 2 can carry (the width of the substrate here is the dimension of the substrate perpendicular to the detection direction). Therefore, when the re-inspection component 5 is working, the overflow detection imaging module 62 and the film thickness detection component 61 move to the outermost edge to avoid interfering with the movement of the re-inspection vision module 51. When either the overflow detection imaging module 62 or the film thickness detection component 61 is working, the re-inspection vision module 51 moves to the outermost edge to avoid interfering with the movement of the overflow detection imaging module 62 and the film thickness detection component 61.

[0064] In this embodiment, the re-inspection lateral movement drive 53 and the third lateral movement drive 63 are both the same linear motor. By arranging two sets of moving parts inside the linear motor, and using the two sets of moving parts as the drive ends of the re-inspection lateral movement drive 53 and the third lateral movement drive 63 respectively, the structure on the first gantry can be simplified.

[0065] It is important to note that, depending on the requirements of different film layers, one or more of the first detection component 3, the second detection component 4, and the third detection component 6 can be adaptively selected for defect detection. This allows for the detection of different defects in the film layers on the substrate surface, ensuring the reliability of substrate inspection. Furthermore, it meets the detection needs of different film layers, broadening the applicability of film layer inspection.

[0066] Reference Figure 1 and Figure 4 The conveying assembly 2 includes a support platform 21, a rotary table 22, and a conveying drive component 23.

[0067] Reference Figure 1 and Figure 4 The support platform 21 is used to support the substrate. The support platform 21 is mounted on the rotating end of the rotary table 22, and the rotary table 22 drives the support platform 21 and the substrate to rotate in the horizontal plane. The conveying drive unit 23 is driven to the rotary table 22 to drive the rotary table 22, the support platform 21 and the substrate to move in the detection direction.

[0068] With this configuration, after the substrate is loaded onto the support stage 21, the rotary table 22 drives the support stage 21 and the substrate to rotate in the horizontal plane, thereby arranging the substrate along the detection direction in either the length or width direction to achieve substrate positioning. This allows for convenient positioning to various locations on the substrate, facilitating defect location. The conveying drive unit 23 drives the support stage 21 and the substrate to move in the detection direction, allowing the substrate to sequentially pass through different detection components.

[0069] In this embodiment, the rotary table 22 includes an electric rotary table. The conveying drive component 23 includes a linear motor or a lead screw mechanism.

[0070] In this embodiment, the surface of the support platform 21 is provided with an air flotation structure to support the substrate using an air film.

[0071] In this embodiment, the support platform 21 has a sandwich space in the middle.

[0072] Reference Figure 5 and Figure 6 The conveying assembly 2 further includes a pin assembly 9, which comprises a pin frame 91, a lifting drive 93, and multiple pins 92. The pin frame 91 moves vertically within the support platform 21 via a slide rail. Multiple pins 92 are mounted on the pin frame 91, and the upper surface of the support platform 21 has multiple through holes for the pins 92 to pass through. The lifting drive 93 is driven by the pin frame 91 to move the pin frame 91 and all pins 92 vertically, allowing the pins 92 to pass through the through holes and extend above the support platform 21. In this embodiment, the lifting drive 93 includes a lead screw mechanism, a linear motor, a cylinder, or an electric cylinder.

[0073] With this configuration, when the substrate is loaded and unloaded, the ejector pins 92 rise above the support platform 21, and the substrate is supported by multiple ejector pins 92, thereby leaving space between the substrate and the support platform 21, and leaving space for the external robot arm to facilitate the loading and unloading of the substrate.

[0074] Reference Figure 6 and Figure 7 Specifically, the ejector pin 92 includes an ejector rod 921.

[0075] Reference Figure 6 and Figure 7 Furthermore, the ejector pin 92 also includes a ball 922, which is mounted on the top of the ejector rod 921, and the ejector rod 921 supports the substrate through the ball 922.

[0076] With this configuration, when the substrate is being loaded and unloaded, the substrate comes into contact with the ball bearing 922, resulting in rolling friction between the ball bearing 922 and the substrate, thus making it less likely to damage the substrate.

[0077] Reference Figure 6 and Figure 8 The ejector pin assembly 9 also includes multiple adsorption elements 94, which are fixed on the ejector pin holder 91 and are used to adsorb and support the substrate.

[0078] Reference Figure 6 and Figure 8 Specifically, the adsorption member 94 includes an adsorption rod 941 and an adsorption drive member 942. The top of the adsorption rod 941 is adapted to adsorb the substrate, and the adsorption drive member 942 drives the adsorption rod 941 to move up and down. The adsorption rod 941 is adapted to extend through the through hole to the top of the support platform 21 or retract into the support platform 21. In this embodiment, the adsorption drive member 942 includes a lead screw mechanism, a linear motor, a cylinder, or an electric cylinder.

[0079] With this configuration, when the substrate is being loaded or unloaded, the adsorption rod 941 rises together with the ejector pin frame 91 and extends above the support platform 21. The adsorption drive unit drives the adsorption rod 941 to move further, so that the adsorption rod 941 adsorbs onto the bottom surface of the substrate, thereby adsorbing and fixing the substrate onto the adsorption rod 941. Therefore, when the substrate moves up and down with the ejector pin 92, it is not easy for it to move arbitrarily in the horizontal direction, ensuring that the position of the substrate in the horizontal plane does not change.

[0080] Reference Figure 5 and Figure 9 The multifunctional defect detection system also includes a first correction component 7, which corrects the substrate on the support platform 21 by mechanical positioning to ensure that the substrate is completely located on the support platform 21.

[0081] This configuration allows the first correction component 7 to correct the substrate's alignment, facilitating the determination of its actual position on the support stage 21 and enabling precise identification of the location of detected defects. Furthermore, the first correction component 7 ensures the substrate is completely positioned on the support stage 21, preventing any gaps or overhangs at the substrate's edges and ensuring no deformation, thus guaranteeing the quality of the film formation on the substrate surface.

[0082] Reference Figure 5 and Figure 9 Specifically, the first correction component 7 includes multiple positioning components 71 and multiple abutment components 72.

[0083] Reference Figure 5 and Figure 9 Multiple positioning components 71 are arranged on adjacent sides of the support platform 21. The positioning components 71 are mounted on the side of the support platform 21 and are lower than the support surface of the support platform 21. The positioning component 71 includes a positioning rod 711 and a positioning drive member 712. The positioning drive member 712 drives the positioning rod 711 to extend above the support platform 21. In this embodiment, the positioning drive member 712 includes a cylinder.

[0084] Reference Figure 5 and Figure 9 Multiple abutment components 72 are arranged on opposite sides of the support platform 21, and positioning components 71 and abutment components 72 are respectively arranged on opposite sides of the support platform 21. The abutment components 72 are adapted to push the substrate so that the substrate abuts against the positioning rod 711.

[0085] With this configuration, the substrate is pushed by the abutment component 72 in the detection direction and perpendicular to the detection direction, so that the substrate abuts against the positioning rod 711 in the detection direction and perpendicular to the detection direction, thereby achieving the positioning of the substrate and ensuring that the substrate is completely located on the support stage 21.

[0086] Reference Figure 5 and Figure 9 Specifically, the abutting component 72 includes an abutting rod 721, an abutting lifting drive 722, and an abutting pushing drive 723. Both the abutting lifting drive 722 and the abutting pushing drive 723 are driven to the abutting rod 721. Specifically, the abutting pushing drive 723 is mounted on the support platform 21, and the abutting lifting drive 722 is mounted on the driving end of the abutting pushing drive 723. The abutting lifting drive 722 is driven to the abutting rod 721, thus enabling the abutting rod 721 to move up and down and horizontally. Therefore, the abutting lifting drive 722 causes the abutting rod 721 to extend above the support platform 21 or retract below the support surface of the support platform 21, and the abutting pushing drive 723 causes the abutting rod 721 to move closer to or away from the support platform 21. In this embodiment, both the abutting lifting drive 722 and the abutting pushing drive 723 include a lead screw mechanism, a linear motor, a cylinder, or an electric cylinder.

[0087] With this configuration, after the substrate is loaded onto the support platform 21, both the positioning rod 711 and the abutment rod 721 rise, and the abutment rod 721 moves toward the positioning rod 711. Thus, the abutment rod 721 pushes the substrate toward the positioning rod 711, and the substrate is initially positioned by mechanically abutting the edge.

[0088] Furthermore, multiple positioning components 71 are also arranged in the middle of the support platform 21. These positioning components 71 are arranged in groups, with each group of multiple positioning components 71 arranged perpendicular to the detection direction, and the multiple groups of positioning components 71 are spaced apart in the detection direction. The positioning rod 711 of the positioning component 71 located in the middle of the support platform 21 can extend to the top of the support platform 21.

[0089] With this configuration, when inspecting substrates of different sizes, the positioning rods 711 of the different positioning components 71 are raised to position the substrates, thereby meeting the inspection requirements of substrates of different sizes and broadening the applicability of the defect detection system.

[0090] It should be noted that when the substrate is loaded onto the support platform 21 and supported by multiple ejector pins 92, the substrate is initially positioned by the first correction component 7, so that the substrate moves relative to the ejector pins 92. After the initial positioning is completed, the ejector pins 92 descend and place the initially positioned substrate on the support platform 21.

[0091] This avoids damaging the substrate by friction on the support platform 21, and also prevents wear on the support platform 21.

[0092] Reference Figure 1 and Figure 10 The multifunctional defect detection system also includes a second correction component 8, which is used to capture the marking points on the substrate to determine the position of the substrate on the support stage 21, thereby feeding back to the rotary stage 22 to drive the substrate to rotate, thereby realizing substrate correction.

[0093] It should be noted that due to factors such as cutting precision, the accuracy of the substrate's edges is difficult to guarantee, and the length direction of the printed area on the substrate surface may also differ from the actual length direction of the substrate. Therefore, at least two marking points are generally arranged on the substrate surface to determine the position of the printed area on the substrate surface.

[0094] Reference Figure 1 and Figure 10 Specifically, the second correction component 8 is located on one side of the support stage 21. The second correction component 8 includes a first capture component 81 and a second capture component 82, which are arranged at intervals in the detection direction. Two marker points on the substrate are arranged at intervals in the detection direction. As the substrate is transported, the first capture component 81 and the second capture component 82 capture the positions of the two marker points respectively, thereby improving the capture efficiency of the marker points.

[0095] In this embodiment, since the substrate is mechanically corrected by the first correction component 7 after being loaded onto the carrier stage 21, it can be ensured that when the substrate is transported in the detection direction, the marking point of the substrate passes through the field of view of the first capture component 81 and the second capture component 82.

[0096] It should be noted that if only one capture component is used, if the substrate is not captured by the mark point during the transport of the substrate in the detection direction, the entire substrate needs to be moved back so that the substrate passes through the capture component again, resulting in low detection efficiency.

[0097] Reference Figure 1 and Figure 10 In this embodiment, the first capturing component 81 and the second capturing component 82 respectively capture two marker points on the substrate, which facilitates the quick capture of the marker points on the substrate and the positioning of the substrate.

[0098] Reference Figure 1 and Figure 10 Specifically, the first capture assembly 81 includes a first capture drive 812 and a first capture camera 811. The first capture drive 812 is driven to the first capture camera 811 to move the first capture camera 811 in a direction perpendicular to the detection direction, so that the first capture camera 811 is positioned above the support stage 21. As the support stage 21 moves in the detection direction, the first capture camera 811 captures the marking points on the substrate.

[0099] By arranging the first capture drive unit 812, the first capture camera 811 can be moved away from above the support platform 21 to avoid interference with the loading and unloading of the substrate. The first capture drive unit 812 includes a cylinder, a lead screw mechanism, or a linear motor.

[0100] Reference Figure 1 and Figure 10 Specifically, the second capture assembly 82 is located behind the first capture assembly 81. The second capture assembly 82 includes a second capture drive 822, a transposition capture drive 823, and a second capture camera 821. The second capture drive 822 is driven to the second capture camera 821 to move the second capture camera 821 perpendicular to the detection direction, positioning the second capture camera 821 above the support stage 21. As the support stage 21 moves in the detection direction, the second capture camera 821 captures the marker points on the substrate.

[0101] By arranging the second capture drive 822, the second capture camera 821 can be moved away from above the support platform 21 to avoid interference with the loading and unloading of the substrate. The second capture drive 822 includes a cylinder, a lead screw mechanism, or a linear motor.

[0102] Reference Figure 1 and Figure 10 Furthermore, the position capture drive 823 is driven by the second capture camera 821 to move the second capture camera 821 in the detection direction. In this embodiment, the second capture drive 822 is mounted on the drive end of the position capture drive 823, and the second capture camera 821 is mounted on the drive end of the second capture drive 822. Thus, the position capture drive 823 can drive the second capture camera 821 to move in the detection direction. The position capture drive 823 includes a cylinder, a lead screw mechanism, or a linear motor.

[0103] This configuration, by changing the distance between the first capture camera 811 and the second capture camera 821 in the detection direction when inspecting substrates of different sizes, ensures simultaneous capture of two marker points on substrates of different sizes. Therefore, it broadens the applicability of the defect detection system.

[0104] This application provides a multifunctional defect detection system. When detecting defects in the film layer on the surface of a substrate, the substrate is placed on a conveying assembly 2, which drives the substrate to move in the detection direction so that the substrate passes under the first detection assembly 3 and the second detection assembly 4. The first detection assembly 3 and the second detection assembly 4 detect different defects in the film layer on the substrate surface, thereby ensuring the reliability of substrate detection. Furthermore, for different film layers, at least one of the first detection assembly 3 and the second detection assembly 4 can be selected to detect the film layer, thereby meeting the detection requirements of different film layers and broadening the applicability of film layer detection.

[0105] In the first detection component 3, multiple first imaging modules 31 arranged side by side perform imaging detection on different positions of the film layer on the substrate surface as the substrate passes under them. This meets the detection requirements of large-size substrates and improves detection efficiency. By detecting a portion of the film layer through each first imaging module 31, first defects such as impurities and missed spots on the film layer surface are identified, thereby ensuring the quality of the film layer.

[0106] The second detection component 4 uses multiple line scanning cameras 41 to scan and image the film layer on the substrate surface. As the substrate is transported in the detection direction, the multiple line scanning cameras 41 can complete a full scan of the substrate surface. The second detection component 4 can identify secondary defect types such as MURA defects in the film layer to ensure the quality of the film layer. By limiting the imaging direction of the line scanning cameras 41, the influence of light fluctuations and moiré patterns on defect identification during the imaging process is avoided, ensuring that all defects are identified, thereby guaranteeing detection reliability and ensuring the quality of film layer formation.

[0107] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0108] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0109] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A multifunctional defect detection system, characterized in that, It includes the machine base and the components arranged on the machine base: A conveying assembly for carrying a substrate and moving the substrate in the detection direction; A first detection component, comprising a plurality of first imaging modules arranged side-by-side perpendicular to the detection direction; The second detection component is arranged sequentially with the first detection component along the detection direction. The second detection component includes multiple line scanning cameras arranged side by side perpendicular to the detection direction. The imaging direction of the line scanning cameras is arranged at an angle to the detection direction on the horizontal plane, and the imaging direction of the line scanning cameras is arranged at an angle to the vertical direction in the vertical plane. In this process, the conveying component sequentially drives the substrate to pass under the first detection component and the second detection component, whereby the first detection component detects a first defect on the surface of the substrate and the second detection component detects a second defect on the surface of the substrate.

2. The multifunctional defect detection system according to claim 1, characterized in that, The first detection component also includes: Multiple first lifting drive components are respectively connected to multiple first imaging modules to adjust the height of the multiple first imaging modules respectively; Multiple rangefinders are arranged to correspond to multiple first imaging modules, and the rangefinders are used to measure the vertical distance between the first imaging module and the substrate. The substrate is driven to pass under the multiple ranging elements to determine the height of the substrate at various points. When a portion of the substrate moves into the field of view of the first imaging module, the height of the corresponding first imaging module is adjusted to ensure that the portion of the substrate located below the first imaging module is within the focal plane of the first imaging module.

3. The multifunctional defect detection system according to claim 2, characterized in that, The rangefinder and the first imaging module are arranged at intervals along the detection direction, with the rangefinder located in front of or behind the first imaging module.

4. The multifunctional defect detection system according to claim 1, characterized in that, The first detection component further includes a first lateral movement drive, which is driven to connect to the first detection component to drive the first detection component to move in a direction perpendicular to the detection direction.

5. The multifunctional defect detection system according to claim 1, characterized in that, The second detection component further includes a second lateral movement drive, which is connected to the line scan camera to drive the line scan camera to move in a direction perpendicular to the detection direction.

6. The multifunctional defect detection system according to claim 1, characterized in that, It also includes a re-inspection component, which is located behind the first detection component, and the re-inspection component includes: A re-inspection vision module, wherein the re-inspection vision module is used to image the surface of the substrate; A re-inspection lifting drive is connected to the re-inspection vision module to drive the re-inspection vision module to move up and down. A re-inspection lateral movement drive is provided, which is connected to the re-inspection vision module to drive the re-inspection vision module to move perpendicular to the detection direction.

7. The multifunctional defect detection system according to claim 1, characterized in that, The conveying assembly includes: A support platform for supporting the substrate; A rotating platform, wherein the support platform is mounted on the rotating end of the rotating platform, and the rotating platform drives the support platform and the substrate to rotate in a horizontal plane; A conveying drive is provided, which is driven to the rotary table to move the rotary table, the support platform, and the substrate in the detection direction.

8. The multifunctional defect detection system according to claim 7, characterized in that, It also includes a first correction component, which comprises: Multiple positioning components are arranged on adjacent sides and in the middle of the support platform, and the positioning components are lower than the support surface of the support platform. Each positioning component includes a positioning rod and a positioning drive, and the positioning drive drives the positioning rod to extend above the support platform. Multiple abutting components are arranged on opposite sides of the support platform, and the positioning component and the abutting component are respectively arranged on opposite sides of the support platform; the abutting components are adapted to push the substrate so that the substrate abuts against the positioning rod.

9. The multifunctional defect detection system according to claim 8, characterized in that, It also includes a second correction component, which is used to capture the marking points on the substrate to determine the position of the substrate on the support platform. The second correction component is located on one side of the support platform. The second correction component includes: The first capture component includes a first capture driver and a first capture camera. The first capture driver is driven to drive the first capture camera to move in a direction perpendicular to the detection direction, so that the first capture camera is positioned above the support platform. As the support platform moves in the detection direction, the first capture camera captures the marking points on the substrate. A second capture assembly is arranged at a distance from the first capture assembly in the detection direction, with the second capture assembly located behind the first capture assembly. The second capture assembly includes a second capture driver, a transposition capture driver, and a second capture camera. The second capture driver is driven to the second capture camera to move the second capture camera perpendicular to the detection direction, so that the second capture camera is positioned above the support platform. As the support platform moves in the detection direction, the second capture camera captures the marker points on the substrate. The transposition capture driver is driven to the second capture camera to move the second capture camera in the detection direction.

10. The multifunctional defect detection system according to claim 1, characterized in that, It also includes a third detection component, which is arranged at a distance from the first and second detection components in the detection direction; the third detection component includes: A film thickness detection assembly includes a rotary drive and a film thickness detector. The rotary drive is driven to rotate the film thickness detector in a horizontal plane. The film thickness detector is used to detect the film thickness on the surface of the substrate. An overflow detection imaging module is used to image the edge of the printed area on the substrate; The third lateral movement drive is connected to both the film thickness detection component and the overflow detection imaging module to drive the film thickness detection component and the overflow detection imaging module to move perpendicular to the detection direction. The substrate is adapted to pass under the film thickness detection component and the overflow detection imaging module.

Images