Docking apparatus for semiconductor testing

Abstract

The application discloses a docking device for semiconductor testing, and particularly relates to the technical field of semiconductor testing, which comprises a plurality of positioning columns, and a plurality of limiting plates are fixed in the interspace surrounded by the plurality of positioning columns; a surrounding positioning piece is arranged above the limiting plates and is used for peripherally positioning an optical communication semiconductor device; a primary docking piece is arranged on one side of the limiting plate, and a lifting plate and a groove block are arranged on the primary docking piece. The surrounding positioning piece is adopted, a plurality of reinforcing blocks are matched with a surrounding plate, a positioning hole is used for peripherally accurately positioning the optical communication semiconductor device, the middle hole and the side hole are treated by chamfering to facilitate threading and connection, the setup time is greatly shortened, and the wiring error caused by inaccurate positioning in the traditional manual construction is avoided, so that the problems of long test time, low efficiency, unsatisfactory test result, accidents caused by too many and miscellaneous lines, fiber line bending and interface connection error are solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and more specifically, to a docking device for semiconductor testing. Background Technology

[0002] In existing testing environments, cable mode is time-consuming and labor-intensive. The installation and removal of the tester kit, and the checking of wiring interfaces, can easily lead to problems such as insecurely installed tester kits and incorrect wiring, resulting in low efficiency, long setup times, susceptibility to damage, and abnormal test data. A docking device kit is specifically designed to transform the previous manual setup method into a semi-automatic setup method. Existing patent publication number CN117116790A discloses a semiconductor packaging testing device. This solution uses a vacuum pickup with a vacuum hole communicating with an insulating pad hole, forming a main body made of silicon or rubber, and a socket contact and encapsulation contact formed of any one of polyimide film, engineering plastic, or synthetic resin. The vacuum pickup is attached to the mounting groove formed in the lower part of the upper socket by adhesive tape via the socket contact of the vacuum pickup. The vacuum pickup is then integrated into the upper socket. However, this design has the following problems.

[0003] Semiconductor testing requires docking equipment, but setting up the test environment is inefficient, time-consuming, and prone to damage. Existing setup methods are extremely time-consuming, taking around five hours, resulting in low efficiency and frequent problems. Procard horns may break or not be properly secured. Tester kits are cumbersome to install and remove, time-consuming, and not secure, easily loosening during testing and affecting results. This leads to longer testing times, lower efficiency, and unsatisfactory test results. Excessive and complex wiring also increases the risk of accidents, such as bent fiber optic cables and incorrect connector connections. Summary of the Invention

[0004] To address the aforementioned problems in the prior art, the present invention provides the following technical solution: a docking device for semiconductor testing, comprising multiple positioning posts, wherein multiple limiting plates are fixed in the gap formed by the multiple positioning posts; The limiting plate is provided with a surrounding positioning component, which is used for surrounding and positioning the outer wall of the optical communication semiconductor device. A primary docking component is installed on one side of the limiting plate, and an upper lifting plate and a groove block are installed on the primary docking component; A secondary docking component is installed on the inner wall of the groove block, and the secondary docking component has two spaced rows.

[0005] Preferably, the surrounding positioning element includes: Multiple reinforcing blocks are all set above the limiting plate, and each of the multiple reinforcing blocks is fixedly connected to a multiple positioning post in a one-to-one correspondence; A surrounding plate is fixedly surrounded between multiple reinforcing blocks, and multiple positioning holes are embedded on one side of each surrounding plate; Each of the positioning posts is fixedly connected to a fixing post at its top end, and a support block is fixedly installed at the top end of the fixing post. A top plate is fixedly installed on the top of the support block. A central hole is provided on the upper surface of the top plate, and side holes are provided on both sides of the central hole. The outer plate is fixedly installed at the bottom of the positioning column, and each of the limiting plates has a groove on its inner wall.

[0006] Preferably, the plurality of reinforcing blocks are arranged in a rectangular distribution, with right angles formed between adjacent surrounding plates.

[0007] Preferably, the two side holes are symmetrically arranged about the central hole, the cross-sectional area of ​​the central hole is larger than the cross-sectional area of ​​the side holes, and the inner walls of both the central hole and the side holes are rounded.

[0008] Preferably, the primary docking component includes a guide frame, a socket block, a linkage bar, a guide rod, a linkage block, and multiple lower docking holes; The guide frame is fixedly installed on one side of the limiting plate, and the sleeve block slides on the inner wall of the guide frame; The linkage bar is fixedly connected to one side of the socket block, and the guide rod slides through the inner wall of the socket block. The guide rod is fixedly connected to the guide frame. A linkage block is fixed on the other side of the socket block. The linkage block is fixedly connected to the groove block and to the lifting plate. Multiple lower holes are opened on the inner wall of the lifting plate.

[0009] Preferably, the guide frame and the sleeve block are slidably connected, and the cross-sectional shape of the guide rod is circular.

[0010] Preferably, the linkage block and the socket block are arranged vertically, and the groove block is fixedly connected to the lifting plate.

[0011] Preferably, the secondary docking component includes a lifting column, a limiting sleeve, a limiting block, a connecting strip, multiple mounting holes, and two support rods; The lifting column is slidably installed on the inner wall of the groove block, the limiting sleeve is fixedly connected to the outer wall of the lifting column, and the bottom end of the lifting column is fixedly connected to the limiting block; The connecting strip is fixedly connected to one side of the limiting block, and the lifting column is fixedly connected to another spacer. Multiple mounting holes are opened on the inner wall of the spacer. Two support rods are fixedly installed between two adjacent spaced rows.

[0012] Preferably, the cross-sectional area of ​​the top end of the lower pair of holes is greater than the cross-sectional area of ​​the bottom end of the lifting column; The limiting sleeve abuts against the groove block.

[0013] Preferably, the support rods are arranged perpendicularly to the spacer rows, and there is a gap between two support rods.

[0014] The technical effects and advantages of the present invention.

[0015] 1. This invention uses a surrounding positioning component, which cooperates with multiple reinforcing blocks and a surrounding plate. The positioning holes are used to achieve precise positioning of the optical communication semiconductor device. The outer plate and the top plate provide support from the lower surface and the top surface, respectively. The middle hole and the side hole are rounded to facilitate wire threading and docking. The overall structure allows the device to be positioned immediately upon placement without repeated adjustments, which greatly shortens the setup time and avoids wiring errors caused by inaccurate positioning in traditional manual assembly.

[0016] 2. This invention utilizes a primary docking component. Through the coordinated operation of the guide frame, socket block, guide rod, and linkage bar, lifting the linkage bar can drive the upper lifting plate and the lower mating hole to move upward synchronously, achieving primary positioning and docking installation. The slot block is fixedly connected to the upper lifting plate, resulting in a stable and reliable structure. This avoids the problems of tester kits not being firmly clamped and loosening during testing, which can lead to abnormal data, in traditional methods. The installation process is fast and has good repeatability.

[0017] 3. This invention utilizes a two-stage docking mechanism, consisting of a lifting column, a limiting sleeve, a limiting block, and a connecting strip, along with mounting holes on the spacer row. This allows four tester kits to be installed and fixed onto the procard in sequence simultaneously. The support rod ensures structural stability, while the docking device kit provides a cable management system to prevent cable wear and bending during installation and removal. The modular design allows for independent replacement of each component, and anti-static protection ensures testing safety. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the docking device for semiconductor testing according to the present invention.

[0019] Figure 2 This is a partial structural diagram of the connection between the groove and the positioning column of the present invention.

[0020] Figure 3 This is a partial structural diagram of the connection between the fixed column and the support block of the present invention.

[0021] Figure 4 This is a partial structural diagram of the connection between the linkage bar and the sleeve block of the present invention.

[0022] Figure 5 This is a partial structural diagram of the linkage bar of the present invention, viewed from below.

[0023] Figure 6 For the present invention Figure 1 Enlarged structural diagram at point A in the middle.

[0024] Figure 7 This is a partial structural diagram of the connection between the spacer and the support rod of the present invention.

[0025] Figure 8 This is a partial structural diagram of the connection between the connecting strip and the limiting block of the present invention.

[0026] The attached diagram is labeled as follows: 1. Positioning post; 2. Limiting plate; 3. Lifting plate; 4. Spacing row; 5. Reinforcing block; 6. Surrounding plate; 7. Positioning hole; 8. Fixing post; 9. Support block; 10. Groove; 11. Outer plate; 12. Top plate; 13. Central hole; 14. Side hole; 15. Guide frame; 16. Sleeve block; 17. Linkage bar; 18. Guide rod; 19. Linkage block; 20. Lower alignment hole; 21. Groove block; 22. Lifting post; 23. Limiting sleeve; 24. Limiting block; 25. Connecting strip; 26. Mounting hole; 27. Support rod. Detailed Implementation

[0027] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and specific embodiments.

[0028] In this plan, reference is made to Figure 1 - Figure 2 The illustrated docking device for semiconductor testing includes multiple positioning posts 1, with multiple limiting plates 2 fixed in the gaps formed by the multiple positioning posts 1; a surrounding positioning element is provided above the limiting plate 2, which is used for surrounding positioning of the outer wall of the optical communication semiconductor device; a primary docking element is installed on one side of the limiting plate 2, and an upper lifting plate 3 and a slot block 21 are installed on the primary docking element; a secondary docking element is installed on the inner wall of the slot block 21, and two spaced rows 4 are provided on the secondary docking element.

[0029] The principle of this technology is to position the outer wall of the optical communication semiconductor device around the positioning component, while the primary docking component is used to achieve a primary lifting docking installation position for the optical communication semiconductor device, and the secondary docking component is used to achieve a secondary lifting docking installation position for the optical communication semiconductor device.

[0030] In this plan, reference is made to Figure 1 - Figure 3As shown, the surrounding positioning components include: multiple reinforcing blocks 5, all positioned above the limiting plate 2, with each reinforcing block 5 fixedly connected to a corresponding positioning post 1; a surrounding plate 6, fixedly surrounding the multiple reinforcing blocks 5, with multiple positioning holes 7 embedded on one side of each surrounding plate 6; a fixing post 8 fixedly connected to the top of each positioning post 1, with a support block 9 fixedly installed at the top of the fixing post 8; a top plate 12 fixedly installed on the top of the support block 9, with a central hole 13 on the upper surface of the top plate 12, and side holes 14 on both sides of the central hole 13; and an outer plate 11 fixedly installed at the bottom of the positioning post 1, with a groove 10 on the inner wall of each limiting plate 2. The multiple reinforcing blocks 5 are arranged in a rectangular distribution, with right angles between adjacent surrounding plates 6. The two side holes 14 are symmetrically arranged about the central hole 13, with the cross-sectional area of ​​the central hole 13 being larger than that of the side holes 14, and the inner walls of both the central hole 13 and the side holes 14 being rounded.

[0031] The principle of this technology is to place the optical communication semiconductor device within multiple surrounding plates 6, while the outer plate 11 supports the lower surface of the optical communication semiconductor device. The outer plate 11 supports the positioning post 1, the positioning post 1 supports the reinforcing block 5, the reinforcing block 5 supports the surrounding plate 6, and the multiple positioning holes 7 on the surrounding plate 6 realize the peripheral positioning operation of the optical communication semiconductor device. At the same time, the positioning post 1 supports the fixing post 8, the fixing post 8 supports the support block 9, the support block 9 supports the top plate 12, and the side holes 14 and the central hole 13 on the top plate 12 can facilitate the threading and docking operations of the top of the optical communication semiconductor device.

[0032] In this plan, reference is made to Figure 4 - Figure 6 As shown, the primary docking component includes a guide frame 15, a socket block 16, a linkage bar 17, a guide rod 18, a linkage block 19, and multiple lower docking holes 20. The guide frame 15 is fixedly installed on one side of the limiting plate 2, and the socket block 16 slides on the inner wall of the guide frame 15. The linkage bar 17 is fixedly connected to one side of the socket block 16, and the guide rod 18 slides through the inner wall of the socket block 16, with the guide rod 18 fixedly connected to the guide frame 15. The other side of the socket block 16 is fixedly equipped with a linkage block 19, which is fixedly connected to the slot block 21 and the upper lifting plate 3. Multiple lower docking holes 20 are all opened on the inner wall of the upper lifting plate 3. The guide frame 15 and the socket block 16 are slidably connected, and the cross-sectional shape of the guide rod 18 is circular. The linkage block 19 is vertically arranged with the socket block 16, and the slot block 21 is fixedly connected to the upper lifting plate 3. Bolts are inserted into the positioning holes 7 to perform docking and installation operations on the external optical module of the optical communication semiconductor device.

[0033] The principle of this technology is that the linkage bar 17 is raised simultaneously, which drives the two socket blocks 16 to move upward and the limiting plate 2 supports the guide frame 15. This allows the socket blocks 16 to move upward along the outer wall of the guide rod 18. At the same time, the socket blocks 16 drive the linkage block 19 to move upward, which causes the slot block 21 to move upward. The linkage block 19 also drives the lifting plate 3 to move upward, which in turn drives multiple lower holes 20 to move upward. When the upper surface of the socket block 16 is limited by the top position of the inner wall of the guide frame 15, the height of the socket block 16 is limited. The socket block 16 drives the linkage block 19 to be limited in height, and the linkage block 19 drives the lifting plate 3 to be limited in height. The multiple lower holes 20 on the lifting plate 3 can achieve primary positioning and docking installation of the outer periphery of the optical communication semiconductor device. In this way, the light is positioned and docked through the lower holes 20.

[0034] In this plan, reference is made to Figure 6 - Figure 8 As shown, the secondary docking component includes a lifting column 22, a limiting sleeve 23, a limiting block 24, a connecting strip 25, multiple mounting holes 26, and two support rods 27. The lifting column 22 is slidably installed on the inner wall of the groove block 21, the limiting sleeve 23 is fixedly connected to the outer wall of the lifting column 22, and the bottom end of the lifting column 22 is fixedly connected to the limiting block 24. The connecting strip 25 is fixedly connected to one side of the limiting block 24. The lifting column 22 is fixedly connected to another spacer 4, and the multiple mounting holes 26 are all opened on the inner wall of the spacer 4. The two support rods 27 are fixedly installed between two adjacent spacer 4. The top cross-sectional area of ​​the lower hole 20 is larger than the bottom cross-sectional area of ​​the lifting column 22. The limiting sleeve 23 abuts against the groove block 21. The support rods 27 are vertically arranged between the spacer 4, and there is a gap between the two support rods 27.

[0035] The principle of this technology is as follows: when the slot block 21 is lifted, the slot block 21 can drive the limiting sleeve 23 to move upward. The limiting sleeve 23 drives the lifting column 22 to move upward. The lifting column 22 drives one of the interval rows 4 to move upward. The interval row 4 drives two support rods 27 to move upward. At the same time, the support rods 27 drive the interval row 4 to move upward. Then the connecting strip 25 is lifted. The connecting strip 25 drives the limiting block 24 to continue to move upward in a second stage. The limiting block 24 drives the lifting column 22 to move upward. The upper surface of the limiting block 24 is limited by the lower surface of the slot block 21. At the same time, the lifting column 22 drives the limiting sleeve 23 to move upward. Simultaneously, the limiting sleeve 23 separates from the slot block 21. The lifting column 22 drives the limiting block 24 to move upward. At the same time, the lifting column 22 causes one of the interval rows 4 to move upward. The interval row 4 drives two support rods 27 to move upward. The support rods 27 drive the interval row 4 to move upward. The multiple mounting holes 26 on the interval row 4 move upward. The four tester kits are positioned and fixed above the optical communication semiconductor device by bolts inserted into multiple mounting holes 26. This allows for the sequential installation of the four tester kits onto four different optical communication semiconductor device fixing modules, enabling simultaneous installation and fixation of all four tester kits onto the ProCard. The docking device kit also provides cable management capabilities, organizing previously scattered and messy cables into a cable management system that avoids wear and bending during installation and removal. The docking device kit employs modular assembly, high-precision adjustment, and strict anti-static protection. Each component, including the test kit and light source bracket, can be independently installed and replaced. The screw tightening torque is strict, ensuring a secure fit without damaging the parts.

[0036] The above description is only a preferred embodiment of the present invention and does not constitute any limitation on the present invention. Modifications, equivalent substitutions, etc., made within the scope of the technical solution of the present invention should all fall within the protection scope of the present invention.

Claims

1. A docking device for semiconductor testing comprising a plurality of positioning posts (1), characterized in that: Multiple limiting plates (2) are fixed in the gap formed by the multiple positioning posts (1); The limiting plate (2) is provided with a surrounding positioning component above it, which is used for surrounding positioning of the outer wall of the optical communication semiconductor device; A primary docking component is installed on one side of the limiting plate (2), and an upper lifting plate (3) and a groove block (21) are installed on the primary docking component. A secondary docking component is installed on the inner wall of the groove block (21), and the secondary docking component is provided with two spaced rows (4).

2. The docking device for semiconductor testing according to claim 1, characterized in that: The surrounding positioning element includes: Multiple reinforcing blocks (5) are all set above the limiting plate (2), and the multiple reinforcing blocks (5) are respectively fixedly connected to the multiple positioning posts (1) one by one; The surrounding plate (6) is fixedly surrounded between multiple reinforcing blocks (5), and multiple positioning holes (7) are embedded on one side of each surrounding plate (6). Each of the positioning posts (1) is fixedly connected to a fixing post (8) at its top end, and a support block (9) is fixedly installed at the top end of the fixing post (8). The top plate (12) is fixedly installed on the top of the support block (9). The upper surface of the top plate (12) is provided with a central hole (13), and side holes (14) are provided on both sides of the central hole (13). The outer plate (11) is fixedly installed at the bottom of the positioning column (1), and the inner wall of each of the limiting plates (2) is provided with a groove (10).

3. The docking device for semiconductor testing according to claim 2, characterized in that: The multiple reinforcing blocks (5) are arranged in a rectangular distribution, and right angles are formed between two adjacent surrounding plates (6).

4. The docking device for semiconductor testing according to claim 2, characterized in that: The two side holes (14) are symmetrically arranged about the central hole (13). The cross-sectional area of ​​the central hole (13) is larger than that of the side holes (14). The inner walls of both the central hole (13) and the side holes (14) are rounded.

5. The docking device for semiconductor testing according to claim 1, characterized in that: The primary docking component includes a guide frame (15), a socket block (16), a linkage bar (17), a guide rod (18), a linkage block (19), and multiple lower docking holes (20). The guide frame (15) is fixedly installed on one side of the limiting plate (2), and the sleeve block (16) slides on the inner wall of the guide frame (15); The linkage bar (17) is fixedly connected to one side of the socket block (16), and the guide rod (18) slides through the inner wall of the socket block (16). The guide rod (18) is fixedly connected to the guide frame (15). A linkage block (19) is fixed on the other side of the socket block (16). The linkage block (19) is fixedly connected to the groove block (21). The linkage block (19) is fixedly connected to the upper lifting plate (3). Multiple lower holes (20) are opened on the inner wall of the upper lifting plate (3).

6. The docking device for semiconductor testing according to claim 5, characterized in that: The guide frame (15) and the sleeve block (16) are slidably connected, and the cross-sectional shape of the guide rod (18) is circular.

7. The docking device for semiconductor testing according to claim 5, characterized in that: The linkage block (19) and the socket block (16) are vertically arranged, and the groove block (21) is fixedly connected to the lifting plate (3).

8. The docking device for semiconductor testing according to claim 1, characterized in that: The secondary docking component includes a lifting column (22), a limiting sleeve (23), a limiting block (24), a connecting strip (25), multiple mounting holes (26), and two support rods (27). The lifting column (22) is slidably installed on the inner wall of the groove block (21), the limiting sleeve (23) is fixedly connected to the outer wall of the lifting column (22), and the bottom end of the lifting column (22) is fixedly connected to the limiting block (24). The connecting strip (25) is fixedly connected to one side of the limiting block (24), the lifting column (22) is fixedly connected to another spacer (4), and multiple mounting holes (26) are opened on the inner wall of the spacer (4); Two support rods (27) are fixedly installed between two adjacent spaced rows (4).

9. The docking device for semiconductor testing according to claim 8, characterized in that: The top cross-sectional area of ​​the lower hole (20) is greater than the bottom cross-sectional area of ​​the lifting column (22); The limiting sleeve (23) abuts against the groove block (21).

10. The docking device for semiconductor testing according to claim 8, characterized in that: The support rod (27) is arranged perpendicularly to the spacer row (4), and there is a gap between the two support rods (27).

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