Semiconductor test probe

Abstract

The application discloses a semiconductor test probe, which comprises a shell, a connector and a cable; the shell comprises a first shell and a second shell, the first shell and the second shell are assembled together, the shell has a receiving cavity defined by the first shell and the second shell, and the second shell has a first mounting hole and a second mounting hole; the first wire head and the second wire head have a spacing therebetween, and the semiconductor test probe comprises a holder, the holder comprises a first end and a second end, the first end is fixedly connected with the first wire head, and the second end is fixedly connected with the second wire head. Through the arrangement of the holder, the spacing of the two wire heads is better fixed, the hidden danger of cable deflection is reduced, the coplanar waveguide structure and the signal integrity of high-frequency test are improved, and thus the test data is more accurate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing, and more particularly to a semiconductor test probe. Background Technology

[0002] Semiconductor test probes are high-precision testing tools used in the semiconductor industry; they can also be understood as sophisticated "electrical signal connectors." They are packaged on probe cards, forming a crucial overall testing system.

[0003] The core task of semiconductor test probes is to identify and reject defective chips by physically contacting extremely tiny solder joints on the chip wafer before chip packaging, thereby avoiding high subsequent packaging costs.

[0004] The chip probe testing process can be mainly divided into four steps: Precise alignment: The probe station uses a high-precision camera to precisely align the probe tip on the probe card with the bonding pad of the first chip on the wafer.

[0005] Physical contact: The probe card remains stationary, and the chip is raised by moving the wafer stage. The probe tip contacts the solder pad and applies a precisely controlled overdrive pressure to ensure reliable electrical contact without damaging the chip.

[0006] Electrical testing: Automated testing equipment applies specific voltages and signals to the chip through probes and quickly collects the chip's response data, completing the judgment of parameters such as function, speed and current in a very short time (usually only tens to hundreds of milliseconds).

[0007] Labeling and Classification: After the test is completed, the system will label the defective products according to the results (such as inkjet dots) and generate an accurate "wafer result mapping map" to guide the subsequent process to only package qualified chips.

[0008] The core advantage of dual-needle probes lies in solving the dilemma of limited space and the inability to deploy multiple sets of probes. Integrating two or more signals together greatly improves space requirements. Multiple signal tests can be arranged in a small space, improving the efficiency, accuracy, and stability of chip testing. Summary of the Invention

[0009] The technical problem to be solved by the present invention is to provide a semiconductor test probe that provides more accurate test data.

[0010] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: A semiconductor test probe includes: a housing, a connector, and a cable; the housing includes a first housing and a second housing, the first housing and the second housing being assembled together, the housing having a receiving cavity defined by the first housing and the second housing, and the second housing having a first mounting hole and a second mounting hole; The connector includes a first connector mounted in a first mounting hole and a second connector mounted in a second mounting hole. The first connector includes a first connecting end exposed outside the second housing, and the second connector includes a second connecting end exposed outside the second housing. The cable includes a first cable and a second cable. The first cable includes a first wire tail, a first wire middle, and a first wire head. The first wire tail is connected to a first connector, the first wire middle is located in a receiving cavity, and the first wire head is exposed outside the housing. The second cable includes a second wire tail, a second wire middle, and a second wire head. The second wire tail is connected to a second connector, the second wire middle is located in a receiving cavity, and the second wire head is exposed outside the housing. The first wire head and the second wire head are spaced apart. The semiconductor test probe includes a retainer with a first end and a second end. The first end is fixedly connected to the first wire head, and the second end is fixedly connected to the second wire head.

[0011] Existing dual-probe conductor test probes suffer from misalignment of the probe tips and spacing, leading to inaccurate alignment with chip pads and resulting in deflection. This causes inconsistent probe depths, with one probe penetrating while the other misses, or the signal (S) probe penetrating while the ground (G) probe misses. This damages the coplanar waveguide structure of the GSG pins, affecting test accuracy, impairing signal integrity in high-frequency tests, and distorting test data.

[0012] Compared with the prior art, the semiconductor test probe of the present invention includes a retainer, which includes a first end and a second end. The first end is fixedly connected to a first wire head, and the second end is fixedly connected to a second wire head. The retainer better fixes the distance between the two wire heads, reduces the risk of cable deflection, improves the coplanar waveguide structure, and enhances the signal integrity of high-frequency tests, thereby making the test data more accurate.

[0013] Furthermore, both the first cable and the second cable include an inner conductive layer, an intermediate insulating layer, and an outer conductive layer. Both the first cable and the second cable include a first contact pin, a second contact pin, and a third contact pin. The first contact pin is physically and electrically connected to the outer conductive layer, the second contact pin is physically and electrically connected to the inner conductive layer, and the third contact pin is physically and electrically connected to the outer conductive layer. The first contact pin and the third contact pin are grounding pins, and the second contact pin is a signal pin. The cage physically connects the outer conductive layers of the first cable and the second cable, and the cage also insulates over the outer conductive layers of both cables. The inventors discovered that when a metal cage electrically connects the first and second cables, it easily leads to electric field disturbances, causing resonance points in the insertion loss. Insulating the outer conductive layers of both cables with the cage avoids this resonance phenomenon.

[0014] Furthermore, the retainer is a plastic retainer, and the semiconductor test probe includes a fixing adhesive. The retainer is fixed to the first wire tip by the fixing adhesive, and the retainer is fixed to the second wire tip by the fixing adhesive. The inventors discovered through experiments that when a metal retainer is electrically connected to the first and second cables, it easily leads to electric field disturbances, causing resonance points in the insertion loss. Using a plastic retainer avoids this resonance point phenomenon. Fixing the plastic retainer and wire tip with fixing adhesive, compared to welding and mechanical fixation, results in a more uniform stress distribution and avoids localized damage to the wire tip.

[0015] Furthermore, the retainer is provided with an adhesive groove, through which the first and second wire tips pass. The semiconductor test probe includes a fixing adhesive located in the adhesive groove. The fixing adhesive fixes the first wire tip to the retainer and the second wire tip to the retainer. Fixing the plastic retainer and wire tips with the fixing adhesive, compared to welding and mechanical fixation, results in uniform stress distribution and avoids localized damage to the wire tips. The adhesive groove provides additional contact surface for the adhesive, resulting in a total bonding area much larger than the area where the cable directly contacts the retainer surface. A larger area means less stress per unit area, leading to higher bonding reliability.

[0016] Furthermore, the retainer is provided with a first through hole and a second through hole, the first through hole and the second through hole penetrating the retainer along the thickness direction of the retainer, the first wire head passing through the first through hole, and the second wire head passing through the second through hole; The opening of the adhesive reservoir faces the ends of the first and second wire heads. This orientation reduces interference from the housing portion on the dispensing equipment during dispensing.

[0017] Furthermore, in a cross-section perpendicular to the cage thickness direction, the outer contour of the cage is shaped like a racetrack. The racetrack-shaped cage has a small volume and has little impact on the elastic deformation of the first and second thread heads.

[0018] Furthermore, the housing includes a front end face, the receiving cavity extends forward through the front end face, the first wire head and the second wire head both extend from the receiving cavity away from the front end face, and the first wire head and the second wire head both extend forward and downward from the receiving cavity. The retainer is positioned closer to the ends of the first and second wire heads relative to the front end face. This proximity of the retainer to the ends of the wire heads better constrains their deflection, thereby improving the coplanar waveguide structure of the GSG pin arrangement, enhancing testing accuracy, and improving signal integrity in high-frequency testing.

[0019] Furthermore, the first cable includes a first bend and a second bend, the first bend connecting the head of the first cable and the middle of the first cable, the second bend connecting the middle of the first cable and the tail of the first cable, and the bending direction of the first bend being opposite to the bending direction of the second bend. The second cable includes a third bend and a fourth bend. The third bend connects the head of the second cable and the middle of the second cable, and the fourth bend connects the middle of the second cable and the tail of the second cable. The bending direction of the fourth bend is opposite to that of the third bend. Both the first and second wire tips are cantilevered and elastically deformable when in contact with the external wafer. This elastic deformation of the first and second wire tips during contact with the external wafer provides the needle tip with flexibility, reducing damage to the conductive wafer being tested.

[0020] Furthermore, the included angle between the first connector and the second connector is between 30° and 70°. The first connector extends backward and upward relative to the housing, and the second connector also extends backward and upward relative to the housing. This small included angle design of the connectors increases applicability to various field scenarios, occupies less space, and avoids interference between test probes.

[0021] Furthermore, the distance between the first and second wire heads is d, where 150um ≤ d ≤ 10000um. The large spacing between the two needles allows for wider applicability of the solder joints. Attached Figure Description

[0022] Figure 1 This is a perspective view of a semiconductor test probe according to an embodiment of the present invention; Figure 2 Is it like this? Figure 1 Another perspective 3D view of the semiconductor test probe shown; Figure 3 Is it like this? Figure 1 An exploded view of the semiconductor test probe shown. Figure 4 Is it like this? Figure 1 Another exploded view of the semiconductor test probe shown; Figure 5 Is it like this? Figure 4 A further exploded view of the semiconductor test probe shown; Figure 6 Is it like this? Figure 5 Another exploded view of the semiconductor test probe shown; Figure 7 Is it like this? Figure 1 A three-dimensional cross-sectional view of the semiconductor test probe shown. Figure 8 Is it like this? Figure 1 Another three-dimensional cross-sectional view of the semiconductor test probe shown; Figure 9 Is it like this? Figure 1 A perspective view of the cage shown; Figure 10 Is it like this? Figure 3 A 3D view of the connector, cable, and set screw shown. Figure 11 Is it like this? Figure 10 A magnified view of a portion of the cable shown.

[0023] Figure label: 11-First housing; 111-First groove; 112-Second groove; 113-Main body; 114-Spacer; 115-First limiting groove; 116-Second limiting groove; 117-First plane; 118-First screw hole; 12-Second housing; 121-First mounting hole; 122-Second mounting hole; 123-Main body; 124-Mounting part; 125-Assembly hole; 1251-Upper hole; 1252-Lower hole; 126-Second plane; 127-Second screw hole; 128-Third groove; 1291-First wire hole; 1292-Second wire hole; 13-Receiving cavity; 14-Front end face; 21-First connector; 211-First connecting end; 212-Third connecting end; 22-Second connector; 221-Second connecting end; 222-Fourth connecting end Part; 31-First cable; 311-First cable tail; 312-First cable middle; 313-First cable head; 314-First bend; 315-Second bend; 32-Second cable; 321-Second cable tail; 322-Second cable middle; 323-Second cable head; 324-Third bend; 325-Fourth bend; 40-Retainer; 41-First end; 42-Second end; 43-Adhesive groove; 44-Fixing adhesive; 45-First through hole; 46-Second through hole; 51-Inner conductive layer; 52-Intermediate insulating layer; 53-Outer conductive layer; 54-First contact pin; 55-Second contact pin; 56-Third contact pin; 61-First set screw; 62-Second set screw; 63-First mounting groove; 64-Second mounting groove; 65-First mating surface; 66-Second mating surface. Detailed Implementation

[0024] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0025] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms “a,” “the,” and “the” used in this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should be understood that the terms "first," "second," and similar terms used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one; "a plurality of" indicates two or more. Unless otherwise stated, terms such as "front," "rear," "lower," and / or "upper" are for ease of description only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" indicate that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including" and their equivalents, but do not exclude other elements or objects.

[0027] The exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations may complement or combine with each other.

[0028] like Figures 1 to 11 As shown, a semiconductor test probe conforming to the present invention includes: a housing, a connector, and a cable.

[0029] The housing includes a first housing 11 and a second housing 12, which are assembled together. The housing has a receiving cavity 13 defined by the first housing 11 and the second housing 12, and the second housing 12 has a first mounting hole 121 and a second mounting hole 122.

[0030] like Figure 5 As shown, the first housing 11 is flat and has a first groove 111 and a second groove 112 located behind the first groove 111. The first housing 11 includes a main body portion 113 and a spacer portion 114. The spacer portion 114 is recessed downward relative to the main body portion 113 and separates the first groove 111 and the second groove 112. The spacer portion 114 is provided with a first limiting groove 115 and a second limiting groove 116, and the first limiting groove 115 and the second limiting groove 116 communicate with the first groove 111 and the second groove 112.

[0031] like Figures 4-6 As shown, the second housing 12 includes a body portion 123 and a mounting portion 124 connected to the rear end of the body portion 123. The body portion 123 cooperates with the first housing 11 to form a receiving cavity 13. The mounting portion 124 extends rearward from the body portion 123 beyond the first housing 11 and is provided with a plurality of mounting holes 125 for mounting semiconductor test probes to external devices. The mounting holes 125 are countersunk holes, which include an upper hole portion 1251 and a lower hole portion 1252. The diameter of the upper hole portion 1251 is larger than the diameter of the lower hole portion.

[0032] The second housing 12 includes a second plane 126 located on its lower side, and the first housing 11 has a first plane 117 located on its upper end. The second plane 126 of the second housing 12 is assembled and abuts against the first plane 117 of the first housing 11. The first housing 11 is provided with a first screw hole 118, and the second housing 12 is provided with a second screw hole 127. The first housing 11 and the second housing 12 are fixed together by mounting screws to the first screw hole 118 and the second screw hole 127. Figure 8 As shown, the second housing 12 has a third groove 128 recessed upward from the second plane 126, and the third groove 128 communicates with the second groove 112. Figure 3 and Figure 6 As shown, the second housing 12 has a first wire hole 1291 and a second wire hole 1292. The first wire hole 1291 communicates with the first mounting hole 121, and the second wire hole 1292 communicates with the second mounting hole 122. The diameter of the first wire hole 1291 is smaller than the diameter of the first mounting hole 121, and the diameter of the second wire hole 1292 is smaller than the diameter of the second mounting hole 122.

[0033] The connector is used to connect external cables. The connector includes a first connector 21 mounted in a first mounting hole 121 and a second connector 22 mounted in a second mounting hole 122. The first connector 21 includes a first connecting end 211 exposed outside the second housing 12 and a third connecting end 212 located inside the first mounting hole 121. The second connector 22 includes a second connecting end 221 exposed outside the second housing 12 and a fourth connecting end 222 located inside the second mounting hole 122.

[0034] like Figure 4As shown, the cable includes a first cable 31 and a second cable 32. The first cable 31 includes a first tail portion 311, a first middle portion 312, and a first head portion 313. The first tail portion 311 is connected to the third connecting end 212 of the first connector 21. The first middle portion 312 is located in the receiving cavity 13, and the first head portion 313 is exposed outside the housing. The second cable 32 includes a second tail portion 321, a second middle portion 322, and a second head portion 323. The second tail portion 321 is connected to the fourth connecting end 222 of the second connector 22. The second middle portion 322 is located in the receiving cavity 13, and the second head portion 323 is exposed outside the housing. The middle portion 312 of the first line passes through the first limiting groove 115. The middle portion 312 is laterally constrained by the spacer portion 114, reducing the offset of the first cable 31. Because the spacer portion 114 is recessed downwards relative to the first plane 117, the middle portion 312 has vertically movable space, allowing for elastic deformation when the first cable 31 contacts the conductive sheet of the wafer under test, thus reducing damage to the tip of the first cable 31 or the conductive sheet of the wafer. The middle portion 322 of the second line passes through the second limiting groove 116. The middle portion 322 is laterally constrained by the spacer portion 114, reducing the offset of the second cable 32. Because the spacer portion 114 is recessed downwards relative to the first plane 117, the middle portion 322 has vertically movable space, allowing for elastic deformation when the second cable 32 contacts the conductive sheet of the wafer under test, thus reducing damage to the tip of the second cable 32 or the conductive sheet of the wafer.

[0035] There is a gap between the first wire head 313 and the second wire head 323. The semiconductor test probe includes a retainer 40, which includes a first end 41 and a second end 42. The first end 41 is fixedly connected to the first wire head 313, and the second end 42 is fixedly connected to the second wire head 323.

[0036] Existing dual-probe conductor test probes suffer from misalignment of the probe tips and spacing, leading to inaccurate alignment with chip pads and resulting in deflection. This causes inconsistent probe depths, with one probe penetrating while the other misses, or the signal (S) probe penetrating while the ground (G) probe misses. This damages the coplanar waveguide structure of the GSG pins, affecting test accuracy, impairing signal integrity in high-frequency tests, and distorting test data.

[0037] Compared with the prior art, the semiconductor test probe of the present invention includes a retainer 40, which includes a first end 41 and a second end 42. The first end 41 is fixedly connected to the first wire head 313, and the second end 42 is fixedly connected to the second wire head 323. The retainer 40 better fixes the spacing between the two wire heads, reduces the risk of cable deflection, improves the coplanar waveguide structure, and enhances the signal integrity of high-frequency tests, thereby making the test data more accurate.

[0038] Both the first cable 31 and the second cable 32 include an inner conductive layer 51, an intermediate insulating layer 52, and an outer conductive layer 53. Both the first cable 31 and the second cable 32 include a first contact pin 54, a second contact pin 55, and a third contact pin 56. The first contact pin 54 is physically and electrically connected to the outer conductive layer 53, the second contact pin 55 is physically and electrically connected to the inner conductive layer 51, and the third contact pin 56 is physically and electrically connected to the outer conductive layer 53. The first contact pin 54 and the third contact pin are grounding pins, and the second contact pin is a signal pin.

[0039] The retainer 40 physically connects to the outer conductive layer 53 of the first cable 31 and the outer conductive layer 53 of the second cable 32, and also insulates against the outer conductive layers 53 of the first cable 31 and the second cable 32. The inventors discovered that when the metal retainer 40 is electrically connected to the first cable 31 and the second cable 32, it easily leads to electric field disturbance, causing resonance points in the insertion loss. By insulating the outer conductive layers 53 of the first cable 31 and the second cable 32 with the retainer 40, the phenomenon of resonance points in the insertion loss can be avoided.

[0040] The retainer 40 is a plastic retainer 40. The semiconductor test probe includes a fixing adhesive 44. The retainer 40 is fixed to the first wire tip 313 and the second wire tip 323 by the fixing adhesive 44. When a metal retainer 40 is electrically connected to the first cable 31 and the second cable 32, it can easily lead to electric field disturbance, causing resonance points in the insertion loss. Using a plastic retainer 40 avoids this resonance point phenomenon. Fixing the plastic retainer 40 and the wire tip with the fixing adhesive 44, compared to welding and mechanical fixation, results in a more uniform stress distribution and avoids localized damage to the wire tip.

[0041] The retainer 40 is provided with an adhesive groove 43. The first wire tip 313 and the second wire tip 323 pass through the adhesive groove 43. The semiconductor test probe includes a fixing adhesive 44, which is located in the adhesive groove 43. The fixing adhesive 44 fixes the first wire tip 313 to the retainer 40 and the second wire tip 323 to the retainer 40. Fixing the plastic retainer 40 and the wire tips with the fixing adhesive 44 provides a more uniform stress distribution compared to welding and mechanical fixation, preventing localized damage to the wire tips. The adhesive groove 43 provides additional contact surface for the adhesive, resulting in a total bonding area much larger than the area where the cable directly contacts the surface of the retainer 40. A larger area means less stress per unit area, leading to higher bonding reliability.

[0042] The retainer 40 has a first through hole 45 and a second through hole 46, which extend through the retainer 40 along its thickness direction. A first wire head 313 passes through the first through hole 45, and a second wire head 323 passes through the second through hole 46. The adhesive reservoir 43 opens towards the ends of the first and second wire heads 313 and 323. This opening of the adhesive reservoir 43 reduces interference from the housing portion on the dispensing equipment during dispensing.

[0043] In a cross-section perpendicular to the thickness direction of the retainer 40, the outer contour of the retainer 40 is shaped like a racetrack. The racetrack-shaped retainer 40 has a small volume and has little impact on the elastic deformation of the first thread head 313 and the second thread head 323.

[0044] The housing includes a front end face 14, a receiving cavity 13 extending forward through the front end face 14, a first wire head 313 and a second wire head 323 both extending from the receiving cavity 13 away from the front end face 14, and the first wire head 313 and the second wire head 323 both extending forward and downward from the receiving cavity 13.

[0045] The retainer 40 is closer to the ends of the first wire head 313 and the second wire head 323 than the front end face 14. The proximity of the retainer 40 to the ends of the wire heads better constrains the deflection of the wire heads, thereby improving the coplanar waveguide structure of the GSG pin arrangement, improving test accuracy, and improving the signal integrity of high-frequency tests.

[0046] The first cable 31 includes a first bend 314 and a second bend 315. The first bend 314 connects the first cable head 313 and the first cable middle portion 312, and the second bend 315 connects the first cable middle portion 312 and the first cable tail portion 311. The bending direction of the first bend 314 is opposite to that of the second bend 315. A portion of the first bend 314 is located in the first groove 111, and a portion of the first bend 314 is located outside the housing. The first bend 314 bends upward and forward. A portion of the second bend 315 is located in the second groove 112, and a portion of the second bend 315 is located in the third groove 128. The second bend 315 bends downward and backward.

[0047] The second cable 32 includes a third bend 324 and a fourth bend 325. The third bend 324 connects the second cable head 323 and the second cable middle portion 322, and the fourth bend 325 connects the second cable middle portion 322 and the second cable tail portion 321. The bending direction of the fourth bend 325 is opposite to that of the third bend 324. A portion of the third bend 324 is located in the first groove 111 and is located outside the housing. The third bend 324 bends upward and forward. A portion of the fourth bend 325 is located in the second groove 112 and a portion of the fourth bend 325 is located in the third groove 128. The fourth bend 325 bends downward and backward.

[0048] The first bend 314 and the third bend 324 are arranged parallel to each other, and the second bend 315 and the fourth bend 325 extend away from the middle of the first line 312 and the middle of the second line 322, respectively, thus forming an acute angle. This arrangement, when used with the connector, reduces external interference.

[0049] Both the first wire tip 313 and the second wire tip 323 are cantilevered, and both the first wire tip 313 and the second wire tip 323 have elastic deformation when in contact with the external wafer. This elastic deformation of the first wire tip 313 and the second wire tip 323 during contact with the external wafer ensures that the needle tip is flexible during the piercing process, reducing damage to the conductive sheet being tested on the wafer.

[0050] The included angle between the first connector 21 and the second connector 22 is between 30° and 70°. The first connector 21 extends backward and upward relative to the housing, and the second connector 22 extends backward and upward relative to the housing. Preferably, the included angle between the first connector 21 and the second connector 22 is 30° or 60°. The small included angle design of the connectors increases the applicability of field scenarios, occupies less space, and avoids interference between test probes.

[0051] The distance between the first wire head 313 and the second wire head 323 is d, where 150um ≤ d ≤ 10000um. The large spacing between the two pins allows for wider applicability of the solder joints.

[0052] The second housing 12 has a first mounting groove 63 and a second mounting groove 64 extending upward and forward from its rear bottom. The semiconductor test probe includes a first set screw 61 and a second set screw 62. The first connector 21 includes a first mating surface 65, and the second connector 22 includes a second mating surface 66. The first set screw 61 is threadedly connected to the first mounting groove 63, and the second set screw 62 is threadedly connected to the second mounting groove 64. The first set screw 61 and the second set screw 62 respectively abut against the first mating surface 65 and the second mating surface 66 of the first connector 21. Traditional semiconductor test probes have threads on the connector; however, because the connector is exposed outside the housing, it is easily touched or mishandled by the operator, leading to loosening. This invention achieves stable installation of the first connector 21 and the second connector 22 by recessing the first set screw 61 and the second set screw 62 into the first mounting groove 63 and the second mounting groove 64.

[0053] This invention is not limited to the specific embodiments described above. Any modifications made by those skilled in the art based on the above concept without creative effort are within the scope of protection of this invention.

Claims

1. A semiconductor test probe comprising: Housing, connector and cable; the housing includes a first housing (11) and a second housing (12) assembled together, the housing having a receiving cavity (13) defined by the first housing (11) and the second housing (12), the second housing (12) having a first mounting hole (121) and a second mounting hole (122). The connector includes a first connector (21) mounted in a first mounting hole (121) and a second connector (22) mounted in a second mounting hole (122). The first connector (21) includes a first connecting end (211) exposed outside the second housing (12), and the second connector (22) includes a second connecting end (221) exposed outside the second housing (12). The cable includes a first cable (31) and a second cable (32). The first cable (31) includes a first wire tail (311), a first wire middle (312), and a first wire head (313). The first wire tail (311) is connected to a first connector (21), the first wire middle (312) is located in the receiving cavity (13), and the first wire head (313) is exposed outside the housing. The second cable (32) includes a second wire tail (321), a second wire middle (322), and a second wire head (323). The second wire tail (321) is connected to a second connector (22), the second wire middle (322) is located in the receiving cavity (13), and the second wire head (323) is exposed outside the housing. The feature is that there is a gap between the first wire head (313) and the second wire head (323), and the semiconductor test probe includes a retainer (40), the retainer (40) includes a first end (41) and a second end (42), the first end (41) is fixedly connected to the first wire head (313), and the second end (42) is fixedly connected to the second wire head (323).

2. The semiconductor test probe of claim 1, wherein: The first cable (31) and the second cable (32) both include an inner conductive layer (51), an intermediate insulating layer (52) and an outer conductive layer (53). The first cable (31) and the second cable (32) both include a first contact pin (54), a second contact pin (55) and a third contact pin (56). The first contact pin (54) is physically and electrically connected to the outer conductive layer (53), the second contact pin (55) is physically and electrically connected to the inner conductive layer (51), and the third contact pin (56) is physically and electrically connected to the outer conductive layer (53). The first contact pin (54) and the third contact pin are grounding pins, and the second contact pin is a signal pin. The retainer (40) is physically connected to the outer conductive layer (53) of the first cable (31) and the outer conductive layer (53) of the second cable (32), and the retainer is insulated from the outer conductive layer (53) of the first cable (31) and the outer conductive layer (53) of the second cable (32).

3. The semiconductor test probe of claim 1, wherein: The retainer (40) is a plastic retainer (40), and the semiconductor test probe includes a fixing adhesive (44). The retainer (40) is fixed to the first wire head (313) by the fixing adhesive (44), and the retainer (40) is fixed to the second wire head (323) by the fixing adhesive (44).

4. The semiconductor test probe as described in claim 1, characterized in that: The retainer (40) is provided with a glue groove (43), and the first wire head (313) and the second wire head (323) pass through the glue groove (43). The semiconductor test probe includes a fixing adhesive (44), which is located in the glue groove (43). The fixing adhesive (44) fixes the first wire head (313) to the retainer (40) and fixes the second wire head (323) to the retainer (40).

5. The semiconductor test probe as described in claim 4, characterized in that: The retainer (40) is provided with a first through hole (45) and a second through hole (46). The first through hole (45) and the second through hole (46) penetrate the retainer (40) along the thickness direction. The first wire head (313) passes through the first through hole (45) and the second wire head (323) passes through the second through hole (46). The opening of the adhesive reservoir (43) faces the ends of the first wire head (313) and the second wire head (323).

6. The semiconductor test probe as described in claim 1, characterized in that: In a cross section perpendicular to the thickness direction of the retainer (40), the outer contour of the retainer (40) is in the shape of a racetrack.

7. The semiconductor test probe as described in claim 1, characterized in that: The housing includes a front end face (14), the receiving cavity (13) extends forward through the front end face (14), the first wire head (313) and the second wire head (323) both extend from the receiving cavity (13) away from the front end face (14), and the first wire head (313) and the second wire head (323) both extend forward and downward from the receiving cavity (13); The retainer (40) is closer to the ends of the first thread head (313) and the second thread head (323) relative to the front end face (14).

8. The semiconductor test probe as described in claim 1, characterized in that: The first cable (31) includes a first bend (314) and a second bend (315). The first bend (314) connects the first wire head (313) and the first wire middle (312). The second bend (315) connects the first wire middle (312) and the first wire tail (311). The bending direction of the first bend (314) is opposite to the bending direction of the second bend (315). The second cable (32) includes a third bend (324) and a fourth bend (325). The third bend (324) connects the head (323) of the second cable and the middle (322) of the second cable. The fourth bend (325) connects the middle (322) of the second cable and the tail (321) of the second cable. The bending direction of the fourth bend (325) is opposite to that of the third bend (324). The first line head (313) and the second line head (323) are both cantilevered, and the first line head (313) and the second line head (323) have elastic deformation when in contact with the external wafer.

9. The semiconductor test probe as described in claim 1, characterized in that: The included angle between the first connector (21) and the second connector (22) is between 30° and 70°. The first connector (21) extends backward and upward relative to the housing, and the second connector (22) extends backward and upward relative to the housing.

10. The semiconductor test probe as described in claim 1, characterized in that: The distance between the first line head (313) and the second line head (323) is d, where 150um≤d≤10000um.

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