Stress-vibration-microseismic super-long time continuous monitoring device and installation method thereof

Abstract

This invention provides a stress-vibration-microseismic ultra-long-term continuous monitoring device and its installation method, relating to the field of engineering monitoring technology. The device includes: a stress monitoring module comprising a strain gauge with an epoxy resin storage chamber at one end; a front-end connecting shell, the closed end of which is fixedly connected to the other end of the strain gauge, and a first connecting structure on the inner side of the closed end; an extension opening on the front-end connecting shell; a fixing device including a mounting ring fitted to the inner wall of the cavity of the front-end connecting shell; a support arm on the mounting ring extending out of the front-end connecting shell through the extension opening; and a vibration-microseismic monitoring module inserted into the cavity of the front-end connecting shell, one end of which has a second connecting structure, and the other end has a polygonal protrusion. This device integrates multiple sensors into a single package, achieving completely simultaneous point-of-sale acquisition, ensuring the homogeneity of vibration waveforms and microseismic signals, and can be directly used for analysis of pre-rupture mechanisms.

Description

Technical Field

[0001] This invention belongs to the field of engineering monitoring technology, specifically relating to a stress-vibration-microseismic ultra-long-term continuous monitoring device and its installation method. Background Technology

[0002] With the depletion of shallow resources, mineral resource extraction and underground engineering construction are increasingly extending into deeper areas. Deep rock masses are situated in complex mechanical environments characterized by high ground stress, intense tectonic activity, and severe excavation disturbance, making them prone to major engineering disasters such as rockbursts. Long-term, stable, and reliable monitoring of stress changes, vibration responses, and micro-fracture (micro-seismic) events in the surrounding rock is crucial for achieving accurate disaster early warning and mechanism research.

[0003] Currently, safety monitoring in deep engineering commonly employs multiple single-function sensors (such as stress gauges, accelerometers, and microseismic monitoring probes) installed separately in different boreholes. This approach has significant drawbacks. Firstly, the dispersed installation locations of sensors with different spatial sources and parameters lead to spatially inconsistent monitoring data, making it difficult to accurately reflect the multi-field coupled response information of the same rock mass unit and hindering effective correlation analysis. Secondly, multi-sensor coupling is unreliable and its state is unknown. Traditional sensors use cement or chemical slurry coupling, which is prone to decoupling under long-term ground pressure and disturbance, and the coupling quality cannot be quantitatively monitored, making it difficult to guarantee data validity.

[0004] Therefore, there is an urgent need for a highly reliable in-situ integrated monitoring device that can achieve self-sensing. Summary of the Invention

[0005] The purpose of this invention is to provide a stress-vibration-microseismic long-term continuous monitoring device and its installation method to improve the above-mentioned problems. To achieve the above objective, the technical solution adopted by this invention is as follows:

[0006] In a first aspect, this application provides a stress-vibration-microseismic ultra-long-term continuous monitoring device, comprising:

[0007] A stress monitoring module, comprising a strain gauge, one end of which is provided with an epoxy resin storage chamber; the epoxy resin storage chamber is filled with epoxy resin.

[0008] The front connecting shell includes a closed end and an open end. The closed end is fixedly connected to the other end of the strain gauge, and a first connecting structure is provided on the inner side of the closed end. The front connecting shell is provided with an extension opening.

[0009] A fixing device includes a mounting ring that fits against the inner wall of the cavity of the front connecting shell; the mounting ring is provided with a support arm corresponding to the extension opening, and the support arm extends out of the front connecting shell through the extension opening;

[0010] A vibration-micro-vibration monitoring module is inserted into the cavity of the front connecting shell. One end of the vibration-micro-vibration monitoring module is provided with a second connecting structure, and the other end is provided with a polygonal protrusion. The second connecting structure is connected to the first connecting structure.

[0011] Optionally, the fixing device includes at least four support arms, which are evenly distributed on the mounting ring, and each support arm is hinged with a fixing piece for adhering to the surrounding rock.

[0012] Optionally, a guide slope is provided at the end of the extension port near the stress monitoring module.

[0013] Optionally, the support arm is hinged to the mounting ring.

[0014] Optionally, the vibration-microseismic monitoring module includes a vibration-microseismic sensor and a sealing cover;

[0015] The vibration-micro-vibration sensor is fixedly mounted on the sealed cover;

[0016] The diameter of the vibration-micro-vibration sensor is smaller than the inner diameter of the mounting ring; the diameter of the sealing cover is equal to the outer diameter of the mounting ring.

[0017] Optionally, the stress monitoring module further includes two annular sealing gaskets, which are respectively disposed at both ends of the strain gauge.

[0018] Optionally, the first connecting structure is a screw, and the second connecting structure is a screw hole.

[0019] This application also provides an installation method for the above-mentioned stress-vibration-microseismic ultra-long-term continuous monitoring device, including:

[0020] Place the fixing device into the cavity of the front connecting shell, with the mounting ring facing the open end and the support arm facing the closed end.

[0021] Insert the vibration-micro-vibration monitoring module into the cavity of the front connecting shell from the open end, pass through the middle of the mounting ring, so that the second connecting structure contacts the first connecting structure, and complete the initial assembly;

[0022] The pre-assembled stress monitoring module, front-end connecting shell, fixing device, and vibration-microseismic monitoring module are placed into the borehole as a whole; epoxy resin is extruded from the strain rose and used to fill the gap between the strain rose and the surrounding rock.

[0023] By twisting the polygonal protrusion, the vibration-micro-vibration monitoring module is pushed into the front connecting shell, so that the second connecting structure is connected to the first connecting structure; at the same time, the support arm of the fixing device is pushed out of the extension port, so that the support arm unfolds outside the front connecting shell.

[0024] Optionally, the epoxy resin storage chamber is equipped with a push plunger, and the push plunger is equipped with a displacement sensor. The method includes:

[0025] The target extrusion volume is calculated based on the cross-sectional area of ​​the annular gap in the strain gauge monitoring area, the effective monitoring length, and the filling coefficient.

[0026] The epoxy resin is pushed by a plunger, and the displacement data of the plunger is acquired in real time. The volume of the resin is calculated based on the displacement data. When the volume of the resin dispensed is equal to the target extrusion volume, the extrusion is stopped.

[0027] Optionally, each of the support arms is provided with a pressure sensor, and the method includes:

[0028] When advancing the vibration-micro-vibration monitoring module, the pressure data on each support arm is acquired in real time. It is determined whether the pressure data is less than the preset pressure threshold. If so, the polygonal protrusion is twisted to advance the module until the pressure data reaches the preset pressure threshold.

[0029] The beneficial effects of this invention are as follows:

[0030] This invention integrates a triaxial vibration sensor and a microseismic fracture sensor, making them coaxial, sharing the same contact surface, and encapsulating them in a single package. This achieves completely simultaneous data acquisition at the same point, ensuring from the source that the vibration waveform and microseismic signal originate from the same rock source, at the same time, and along the same propagation path. This allows for direct use in analyzing pre-fracture mechanisms, whereas existing technologies can only perform post-hoc data fitting, resulting in a significant gap in accuracy and reliability. Furthermore, the vibration-microseismic monitoring module and stress monitoring module feature a detachable design, allowing the high-cost vibration-microseismic monitoring module to be recycled and reused, effectively reducing costs.

[0031] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing embodiments of the invention. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of the stress-vibration-micro-vibration long-term continuous monitoring device according to an embodiment of this application;

[0034] Figure 2 This is a schematic diagram of the front-end connection shell structure in an embodiment of this application;

[0035] Figure 3 This is a schematic diagram of the fixing device structure according to an embodiment of this application;

[0036] Figure 4 This is a schematic diagram of the vibration-microseismic monitoring module structure in an embodiment of this application.

[0037] Symbol Explanation: 100-Strain rosette; 200-Epoxy resin storage chamber; 300-Front-end connecting shell; 301-Extension port; 302-Guide slope; 400-Fixing device; 401-Mounting ring; 402-Support arm; 403-Fixing plate; 500-Vibration-micro-vibration monitoring module; 501-Vibration-micro-vibration sensor; 502-Sealing cover; 503-Screw hole; 504-Polygonal protrusion; 600-Annular sealing gasket. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0039] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0040] Existing technologies use separate vibration sensors and microseismic sensors located at different points and on different axes, which can only obtain independent vibration and microseismic signals and cannot reflect the linkage between fracture and vibration in the same rock block at the same location. Therefore, existing technologies can only rely on post-hoc data fitting, resulting in insufficient accuracy and reliability.

[0041] Example 1:

[0042] See Figure 1 This embodiment provides a stress-vibration-micro-vibration long-term continuous monitoring device, including a stress monitoring module, a front-end connecting shell 300, a fixing device 400, and a vibration-micro-vibration monitoring module 500;

[0043] The stress monitoring module includes a strain gauge 100, one end of which is provided with an epoxy resin storage chamber 200. The epoxy resin storage chamber 200 is filled with epoxy resin. The epoxy resin storage chamber 200 adopts a retractable sealing structure. The epoxy resin is uniformly squeezed to the monitoring part of the strain gauge 100 by mechanical extrusion, so that the epoxy resin fully fills the periphery and gaps of the monitoring area of ​​the strain gauge 100. By utilizing the matching properties of the epoxy resin with the strain gauge 100 and the surrounding rock of the borehole wall, the deformation of the surrounding rock is converted into a strain signal. Then, by using the stress-strain transformation calculation formula, stress data that can truly reflect the stress state and change law of the surrounding rock is obtained, realizing the real-time capture of stress signals.

[0044] See Figure 2 The front-end connecting shell 300 includes a closed end and an open end. The closed end is fixedly connected to the other end of the strain rose 100, and a first connecting structure is provided on the inner side of the closed end. An extension port 301 is provided on the front-end connecting shell 300.

[0045] See Figure 3 The fixing device 400 includes a mounting ring 401, which fits against the inner wall of the cavity of the front connecting shell. The mounting ring 401 is provided with a support arm 402 corresponding to the extension port 301. The support arm 402 extends out of the front connecting shell 300 through the extension port 301. After the support arm 402 extends out of the extension port 301, it is used to fit tightly and firmly with the surrounding rock of the borehole, ensuring that the sensor can stably collect the stress, vibration and micro-vibration signals of the surrounding rock, and avoiding the impact of equipment loosening on the accuracy of monitoring data.

[0046] See Figure 4 The vibration-micro-vibration monitoring module 500 is inserted into the cavity of the front connecting shell 300. One end of the vibration-micro-vibration monitoring module 500 is provided with a second connecting structure, and the other end is provided with a polygonal protrusion 504. The second connecting structure is connected to the first connecting structure. Optionally, the first connecting structure is a screw, and the second connecting structure is a screw hole 503. The front and rear ends of the machine body are firmly fixed by the threaded connection between the screw and the screw hole 503.

[0047] The vibration-microseismic monitoring module 500 integrates a triaxial vibration sensor and a microseismic sensor, placing them in the same housing to effectively reduce module size and installation difficulty, while avoiding signal interference caused by separate sensor placement. The sensor's rear end is connected to the power supply module, data transmission module and storage unit, and wireless timing server via shielded cables, ensuring stable power supply to the sensors and enabling real-time transmission and temporary storage of vibration waveforms and microseismic rupture signals, ensuring no monitoring data loss.

[0048] The data transmission module adopts a dual-communication mode redundancy design, enabling parallel operation of both WiFi and LoRa communication modes to complement and adapt to the communication needs of different deep engineering scenarios: WiFi mode is suitable for scenarios with good signal coverage and short transmission distances in the monitoring area, achieving high-speed data transmission; LoRa mode is suitable for scenarios with weak signals and long transmission distances, such as deep tunnels and underground chambers, offering advantages such as low power consumption, anti-interference, and long-distance transmission; the microseismic event data, vibration waveform data, and stress change data collected by the two communication modes will be independently stored and partitioned for calculation in the data server according to data type classification, facilitating subsequent data query, analysis, and traceability, and improving data processing efficiency.

[0049] The wireless time server serves as the time reference for the entire monitoring system. It can accurately synchronize the standard time signal to each monitoring and acquisition unit through wireless synchronization technology, thereby achieving time synchronization of all modules in the entire monitoring system. The time synchronization accuracy reaches the preset standard, ensuring that the timestamps of the three types of monitoring data—stress, vibration, and microseismic events—are completely consistent. This provides a reliable time reference for subsequent multi-parameter joint analysis and precise location of microseismic events.

[0050] As an optional implementation, the fixing device 400 includes at least four support arms 402, which are evenly distributed on the mounting ring 401. Each support arm 402 is hinged with a fixing plate 403 for adhering to the surrounding rock. The fixing plate 403 has a certain thickness to ensure that the rear end of the machine body can be tightly bonded to the surrounding rock.

[0051] The vibration-microseismic monitoring module 500 is relatively expensive. The stress monitoring module at the front end of the fuselage and the vibration-microseismic monitoring module 500 at the rear end are designed to be detachable, so that the vibration-microseismic monitoring module can be recycled and reused.

[0052] As an optional implementation, a guide slope 302 is provided at the end of the extension port 301 near the stress monitoring module. The guide slope 302 is made of a wear-resistant, low-friction coefficient material, and its function is to reduce the friction during the outward extension and inward retraction of the support arm 402, making the extension and retraction of the support arm 402 smoother and more stable, and preventing the fixing device 400 from failing to fit tightly with the surrounding rock due to jamming.

[0053] As an optional implementation, the support arm 402 is hinged to the mounting ring 401.

[0054] As an optional implementation, the vibration-microseismic monitoring module 500 includes a vibration-microseismic sensor 501 and a sealing cover 502;

[0055] The vibration-micro-vibration sensor 501 is fixedly mounted on the closed cover 502;

[0056] The diameter of the vibration-micro-vibration sensor 501 is smaller than the inner diameter of the mounting ring 401; the diameter of the sealing cover 502 is equal to the outer diameter of the mounting ring 401.

[0057] The vibration-micro-vibration sensor 501 can be inserted into the front connecting shell 300 through the mounting ring 401, but the sealing cover 502 is the same size as the mounting ring 401. When the vibration-micro-vibration sensor 501 is pushed inward, the sealing cover 502 also pushes the mounting ring 401 inward, thereby completely squeezing the support arm 402 out of the extension port 301.

[0058] As an optional implementation, the stress monitoring module further includes two annular sealing gaskets 600, which are respectively disposed at both ends of the strain gauge 100. The function of the annular sealing gaskets 600 is to prevent epoxy resin from escaping to both sides, which would result in a loose connection between the surrounding rock, epoxy resin, and strain gauge 100, leading to poor monitoring performance. Simultaneously, the size of the gaskets is variable, selected to fit the aperture size.

[0059] The core monitoring parameters of this monitoring device have been rigorously calibrated to ensure that the monitoring accuracy meets the actual needs of deep engineering safety monitoring. The specific parameter standards are as follows: the vibration acquisition frequency range is 1Hz-2000Hz, which can be flexibly adjusted according to monitoring needs; the vibration range is 0-40 cm / s, which can cover the common range of surrounding rock vibration in deep engineering; the stress measurement range is 0Mpa-100Mpa, which is suitable for the stress monitoring needs of different deep engineering projects; the stress resolution reaches 1uε, and the basic acquisition error is controlled within ±1uε to ensure the accuracy of stress data; the microseismic sensor sampling rate is 5kHz, which can accurately capture the instantaneous signal of microseismic rupture; the microseismic bandwidth is 2kHz; the sensor sensitivity is 100V / (m / s), which can effectively identify weak microseismic signals; the time synchronization accuracy of the entire monitoring system reaches 10ns, ensuring the time consistency of multi-parameter data.

[0060] The data storage and transmission employ a dual guarantee mechanism of real-time uploading and local caching to ensure that monitoring data is not lost: When the wireless acquisition instrument is connected to the data server normally, the waveform files, stress data, and microseismic data in the storage module will be sent to the data server one by one in real time, realizing real-time backup and processing of data; when on-site communication is interrupted or signal is abnormal, the storage module will automatically switch to local caching mode, and the waveform files and various monitoring data will be stored in the local storage unit in an overlay storage manner. After the communication is restored to normal, the system will automatically wake up the data upload function and upload the cached waveform files and monitoring data to the data server completely, ensuring the continuity and integrity of the monitoring data.

[0061] Example 2:

[0062] An installation method for a stress-vibration-microseismic ultra-long-term continuous monitoring device includes:

[0063] Place the fixing device 400 into the cavity of the front connecting shell 300, so that the mounting ring 401 faces the open end and the support arm 402 faces the closed end.

[0064] Insert the vibration-micro-vibration monitoring module 500 into the cavity of the front connecting shell 300 from the open end, pass through the middle of the mounting ring 401, so that the second connecting structure contacts the first connecting structure, and complete the initial assembly; that is, let the screw hole 503 make initial contact connection with the screw, without needing to screw it inward.

[0065] The pre-assembled stress monitoring module, front-end connecting shell 300, fixing device 400 and vibration-microseismic monitoring module 500 are placed into the borehole as a whole; epoxy resin is extruded from the strain rose 100 to fill the gap between the strain rose 100 and the surrounding rock.

[0066] The epoxy resin storage chamber 200 is equipped with a plunger. Before installation, the plunger is in the extended state, and the chamber volume is at its maximum, pre-filled with epoxy resin. After the device is inserted into the borehole, the plunger is axially compressed by the external propulsion mechanism, which reduces the volume of the chamber and extrudes the epoxy resin at a uniform speed and in a directional manner.

[0067] After the epoxy resin solidifies, the front end of the device is fixed in the drilled hole. By twisting the polygonal protrusion 504, the vibration-micro-vibration monitoring module 500 is pushed into the front connecting shell 300, connecting the second connecting structure (screw hole 503) with the first connecting structure (screw). At the same time, the support arm 402 of the fixing device 400 is pushed out of the extension opening 301, allowing the support arm 402 to expand outside the front connecting shell 300 until it is completely and tightly fitted against the hole wall. At this point, the vibration-micro-vibration monitoring module 500 can no longer be pushed inward, and the entire device is fixed in the drilled hole. The design of the support arm 402 gradually expanding from the inside to the outside can push away external obstacles, preventing small stones or other obstacles in the drilled hole from getting stuck in the angle between the support arm 402 and the fixing plate 403.

[0068] As an optional implementation, the epoxy resin storage chamber 200 is equipped with a push plunger, and the push plunger is equipped with a displacement sensor. The method includes:

[0069] The basic field parameters are obtained, the theoretical target filling volume is calculated, and the final target filling volume is obtained by correcting for the measured field temperature, soil and rock properties, and borehole deviation. The basic field parameters include the cross-sectional area of ​​the annulus of the strain rosette 100 monitoring area, the effective monitoring length, and the filling coefficient.

[0070] The extrusion speed of the push plunger is controlled for filling, and displacement, pressure and temperature data are monitored in real time during the extrusion process. The extrusion speed and remaining target volume are dynamically adjusted based on the real-time monitoring data.

[0071] After the filling is completed, the coupling quality is quantitatively evaluated using multi-dimensional indicators. If the coupling quality is unqualified, the pressure holding and filling process is triggered until the coupling quality meets the standard.

[0072] The final target filling volume is obtained based on the measured temperature, soil properties, and borehole deviation correction, including:

[0073] A correction coefficient model was established based on the actual measured temperature on site.

[0074] ;

[0075] in, This is a temperature correction factor. The activation energy for the viscous flow of epoxy resin. It is the gas constant (80314 J / (mol·K)). T The temperature was measured on-site (inside the borehole). This refers to the standard application temperature for epoxy resin.

[0076] Soil and rock correction coefficient model:

[0077] ;

[0078] in, This is the soil and rock correction factor. This is the porosity correction factor, determined based on the porosity of the rock samples on site, with a value ranging from 0 to 0.3. This is a correction factor for fracture development, determined based on geological surveys, with a value ranging from 0 to 0.4.

[0079] Drilling deviation correction factor:

[0080] ;

[0081] in, This is the drilling deviation correction factor. , These are the measured maximum and minimum radii of the borehole. Design radius for drilling, r For strain gauge with a radius of 100;

[0082] The final target fill volume is:

[0083] V =V0× × × ;

[0084] in, V V0 represents the theoretical target filling volume, where V0 is the final target filling volume. This is a temperature correction factor. This is the soil and rock correction factor. This is the drilling deviation correction factor.

[0085] The first 60% of the resin volume is extruded at a constant rate v1, where v1 = v0 × v0 is the extrusion speed at standard temperature;

[0086] When the extrusion volume is 60%-90%, linear deceleration extrusion is used, and the speed is:

[0087] ;

[0088] in, v1 is the extrusion speed; v2 is a constant rate. V To fill the volume to the final target, This represents the volume already extruded;

[0089] When the extrusion volume is 90%-100%, low constant speed extrusion is used, at which time the speed is 0.2v1;

[0090] The extrusion volume mentioned above is calculated using the displacement data of the plunger.

[0091] Optionally, a coupling positioning contact sensor and a pressure sensor are installed inside the epoxy resin storage chamber 200;

[0092] The current extrusion speed can be adjusted according to the real-time monitored pressure. For example, if the pressure is less than a certain threshold, the extrusion speed can be increased appropriately; when the pressure is greater than a certain threshold, the extrusion speed can be decreased appropriately.

[0093] When the dispensing volume equals the final target filling volume or the coupling contact is triggered, the extrusion automatically stops and pressure is maintained.

[0094] If the pressure decreases by ≤10% after holding the pressure for 5 minutes, it is considered acceptable; if the decrease is 10-20%, the holding time should be extended to 10 minutes; if the decrease is greater than 20%, 5-10% of the target volume should be added.

[0095] A triple control system consisting of displacement closed-loop, pressure closed-loop, and position feedback is adopted to achieve bubble-free, gap-free, and equal-impedance filling of the monitoring area between the epoxy resin strain gauge 100 and the surrounding rock of the borehole wall.

[0096] As an optional implementation, each of the support arms 402 is provided with a pressure sensor, and the method includes:

[0097] When advancing the vibration-microseismic monitoring module 500, the pressure data on each support arm 402 is acquired in real time. It is determined whether the pressure data is less than the preset pressure threshold. If so, it means that the support arm 402 is not in close and tight contact with the surrounding rock. The polygonal protrusion 504 is twisted to advance the module, so that the support arm 402 expands further until the pressure data reaches the preset pressure threshold.

[0098] When it is necessary to disassemble and recycle the vibration-micro-vibration monitoring module 500, twist the polygonal protrusion 504 in the opposite direction to remove the vibration-micro-vibration monitoring module 500. After the pressure is removed, the fixing device 400 will loosen, the support arm 402 will be retracted, and it can also be removed.

[0099] Based on the data monitored by the device, early warnings are issued using a deep learning model:

[0100] Using 10ns precision wireless time synchronization as a unified time reference, strict alignment of stress, vibration, and fracture data timestamps is achieved, and a common feature set is constructed, including:

[0101] Stress characteristics: real-time stress, stress change rate, stress acceleration, and stress cumulative offset;

[0102] Vibration characteristics: vibration velocity, vibration energy, dominant vibration frequency, and effective vibration value;

[0103] Rupture characteristics: microseismic amplitude, microseismic energy, event count, and P-wave arrival time.

[0104] The above features are normalized, and then spatiotemporal features are extracted through one-dimensional convolution and temporal convolution networks. An adaptive attention mechanism is used to calculate weights and fuse stress features, vibration features, and fracture features.

[0105] The fused features are incorporated into the pre-trained prediction model, which outputs the risk level and issues an early warning.

[0106] Before installation, a comprehensive on-site survey must be conducted to provide a scientific basis for equipment layout and parameter settings. The survey includes the geological conditions of the monitoring area, such as deep-buried tunnels (e.g., surrounding rock lithology, integrity, and fracture development), engineering structural characteristics (e.g., tunnel cross-sectional dimensions and support structure type), construction disturbance range (e.g., blasting operation area and tunneling face), and surrounding environment (e.g., groundwater). During the survey, high-risk monitoring areas such as tunnel intersections, areas where rock bursts have occurred, and fractured surrounding rock zones should be identified and marked. Monitoring equipment should be prioritized in these areas to improve the targeting of disaster early warning.

[0107] To ensure the accuracy of microseismic event location, comprehensive exploration of vibration patterns, and full coverage of stress evolution patterns, the deployment of monitoring equipment must strictly adhere to the following requirements: the installation distance between two adjacent integrated monitoring devices should not exceed 30m to ensure no blind spots in the monitoring signal; in the axial direction on both sides of the tunnel, no fewer than three integrated monitoring devices must be deployed on each side, using a linear and uniform deployment method to achieve comprehensive monitoring of the tunnel's axial direction; simultaneously, monitoring devices must be distributed on both the left and right sides of each tunnel section, with no fewer than three monitoring devices per section, to ensure comprehensive acquisition of stress, vibration, and microseismic signals within the section, providing comprehensive data support for multi-dimensional analysis of surrounding rock stability.

[0108] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A stress-vibration-microseismic ultra-long-term continuous monitoring device, characterized in that, include: The stress monitoring module includes a strain gauge (100), one end of which is provided with an epoxy resin storage chamber (200); the epoxy resin storage chamber (200) is filled with epoxy resin. The front connecting shell (300) includes a closed end and an open end. The closed end is fixedly connected to the other end of the strain rose (100), and the inner side of the closed end is provided with a first connecting structure. The front connecting shell (300) is provided with an extension port (301). A fixing device (400) includes a mounting ring (401) that fits against the inner wall of the cavity of the front connecting shell; the mounting ring (401) is provided with a support arm (402) corresponding to the extension port (301), and the support arm (402) extends out of the front connecting shell (300) through the extension port (301). Vibration-micro-vibration monitoring module (500), the vibration-micro-vibration monitoring module (500) is inserted into the cavity of the front connecting shell (300), one end of the vibration-micro-vibration monitoring module (500) is provided with a second connecting structure, and the other end is provided with a polygonal protrusion (504), the second connecting structure is connected to the first connecting structure.

2. The stress-vibration-microseismic ultra-long-term continuous monitoring device according to claim 1, characterized in that, The fixing device (400) includes at least four support arms (402) that are evenly distributed on the mounting ring (401), and each support arm (402) is hinged with a fixing piece (403) for adhering to the surrounding rock.

3. The stress-vibration-microseismic ultra-long-term continuous monitoring device according to claim 1, characterized in that, The extension port (301) is provided with a guide slope (302) at one end near the stress monitoring module.

4. The stress-vibration-microseismic ultra-long-term continuous monitoring device according to claim 1, characterized in that, The support arm (402) is hinged to the mounting ring (401).

5. The stress-vibration-microseismic ultra-long-term continuous monitoring device according to claim 1, characterized in that, The vibration-micro-vibration monitoring module (500) includes a vibration-micro-vibration sensor (501) and a sealing cover (502). The vibration-micro-vibration sensor (501) is fixedly mounted on the closed cover (502); The diameter of the vibration-micro-vibration sensor (501) is smaller than the inner diameter of the mounting ring (401); the diameter of the sealing cover (502) is equal to the outer diameter of the mounting ring (401).

6. The stress-vibration-microseismic ultra-long-term continuous monitoring device according to claim 1, characterized in that, The stress monitoring module also includes two annular sealing gaskets (600), which are respectively disposed at both ends of the strain gauge (100).

7. The stress-vibration-microseismic ultra-long-term continuous monitoring device according to claim 1, characterized in that, The first connecting structure is a screw, and the second connecting structure is a screw hole (503).

8. The installation method of the stress-vibration-microseismic ultra-long-term continuous monitoring device according to any one of claims 1-7, characterized in that, include: Place the fixing device (400) into the cavity of the front connecting shell (300) with the mounting ring (401) facing the open end and the support arm (402) facing the closed end. Insert the vibration-micro-vibration monitoring module (500) into the cavity of the front connecting shell (300) from the open end, pass through the middle of the mounting ring (401), so that the second connecting structure contacts the first connecting structure, and complete the initial assembly; The pre-assembled stress monitoring module, front-end connecting shell (300), fixing device (400) and vibration-microseismic monitoring module (500) are placed into the borehole as a whole; epoxy resin is extruded from the strain rose (100) to fill the gap between the strain rose (100) and the surrounding rock; By twisting the polygonal protrusion (504), the vibration-micro-vibration monitoring module (500) is pushed into the front connecting shell (300), so that the second connecting structure is connected to the first connecting structure; at the same time, the support arm (402) of the fixing device (400) is pushed out of the extension port (301), so that the support arm (402) is unfolded outside the front connecting shell (300).

9. The installation method of the stress-vibration-micro-vibration ultra-long-term continuous monitoring device according to claim 8, characterized in that, The epoxy resin storage chamber (200) is equipped with a push plunger, and the push plunger is equipped with a displacement sensor. The method includes: Obtain basic field parameters, calculate the theoretical target filling volume, and correct for the final target filling volume based on the measured field temperature, soil and rock properties, and borehole deviation. The extrusion speed of the push plunger is controlled for filling, and the extrusion speed and remaining target volume are dynamically adjusted based on real-time monitoring data during the extrusion process; After filling is completed, the pressure holding stage begins. The coupling quality is quantitatively evaluated using multi-dimensional indicators. If the coupling quality is unqualified, a refilling process is triggered until the coupling quality meets the standards.

10. The installation method of the stress-vibration-microseismic ultra-long-term continuous monitoring device according to claim 8, characterized in that, Each of the support arms (402) is provided with a pressure sensor, and the method includes: When advancing the vibration-micro-vibration monitoring module (500), the pressure data on each support arm (402) is acquired in real time. It is determined whether the pressure data is less than the preset pressure threshold. If so, the polygonal protrusion (504) is twisted to advance until the pressure data reaches the preset pressure threshold.

Images