Method for manufacturing a structure

Abstract

The present disclosure relates to a method for manufacturing a structure (1) comprising a metal-containing layer (11) bonded to a first carbon allotrope layer (12). The method comprises: providing a substrate (13); coating the substrate (13) with a polymer to obtain a polymer layer (14); depositing a metal-containing material on the polymer layer (14) to obtain the metal-containing layer (11); bonding the first carbon allotrope layer (12) to the metal-containing layer (11); and dissolving the polymer layer (14) using a solvent (2) for releasing the substrate (13) from the metal-containing layer (11).

Description

Technical Field

[0001] This disclosure relates to a structure comprising a carbon allotrope layer, and more particularly to a method for manufacturing a structure comprising a metal-containing layer bonded to a first carbon allotrope layer. Background Technology

[0002] Optical filters are essential components in photonics and imaging technologies, designed to selectively transmit or block light of specific wavelengths. These filters play a crucial role in applications such as spectroscopy, telecommunications, biomedical imaging, and photography. By controlling the spectral composition of light, optical filters can improve system accuracy, optimize the signal-to-noise ratio, and achieve the desired separation of optical properties.

[0003] Optical filters are generally classified into bandpass filters, long-pass filters, short-pass filters, and neutral density filters, each designed for specific wavelength control. The materials and coating technologies used—from dielectric multilayers to metal thin films—determine their performance, including spectral range, durability, and heat resistance.

[0004] In imaging systems, optical filters improve accuracy and contrast by eliminating unwanted wavelengths, thereby reducing chromatic aberration or glare. For example, narrowband filters in fluorescence microscopy ensure precise excitation and detection of specific fluorophores, enabling high-resolution imaging of biological samples. In telecommunications, optical filters ensure efficient wavelength multiplexing and demultiplexing, supporting high-bandwidth data transmission.

[0005] Metal layers bonded to carbon nanotube (CNT) films as metal layers can be used as optical filters. The problem with obtaining such filters is that the inherently high surface roughness of CNT films leads to a decrease in the optical performance of the filters, and when filters are obtained by directly depositing metal layers on CNT films, the radiation passing through the filters is scattered.

[0006] One solution to this problem is to planarize the surface of the CNT film before depositing metal onto it, thereby reducing its surface roughness. However, the problem associated with planarizing the CNT film is that each CNT film needs to be planarized individually during mass production of filters, which is both time-consuming and expensive. Summary of the Invention

[0007] The purpose of this disclosure is to provide a method for manufacturing a structure comprising a metal-containing layer bonded to a first carbon allotrope layer.

[0008] The objective of this disclosure is achieved by the method described in the independent claim. Preferred embodiments of this disclosure are disclosed in the dependent claims.

[0009] This disclosure is based on the concept of providing a method for manufacturing a structure, the structure comprising a metal-containing layer bonded to a first carbon allotrope layer, wherein the method includes: - Provide a substrate with a flat surface; - Use a polymer to coat the flat surface of the substrate to obtain a polymer layer bonded to the flat surface of the substrate; - Deposit a metal-containing material onto a polymer layer to obtain a metal-containing layer bonded to the polymer layer; - Provides the first carbon allotropic layer; - The first carbon allotropic layer is bonded to the metal-containing layer; - After bonding the first carbon allotrope layer to the metal-containing layer, the polymer layer is dissolved using a solvent to release the substrate from the metal-containing layer to obtain a structure comprising the metal-containing layer bonded to the first carbon allotrope layer.

[0010] The advantage of this disclosure is that, despite the inherent surface roughness of carbon allotropic layers, the method can still provide a smooth, metal-containing layer on the carbon allotropic layer.

[0011] Another advantage of this disclosure is that the surface smoothness of the metal-containing layer can be controlled by controlling the smoothness of the substrate. In other words, this method achieves control over the optical properties of the structure.

[0012] Another advantage of this disclosure is that the substrate can be reused for mass production of the structure, thereby reducing the costs involved in production.

[0013] Another advantage of this disclosure is that the porosity of the resulting structure is lower than that of structures obtained by directly depositing a metal-containing layer on a carbon allotrope layer.

[0014] Another advantage of this disclosure is that the preparation of carbon allotropic materials and metal-containing layers is decoupled in this method, thereby allowing each process to be optimized separately. Attached Figure Description

[0015] This disclosure is described in detail with reference to the accompanying drawings, in which: Figure 1 Schematic cross-sectional views of the structure are shown during different steps (1-1 to 1-7) of the method according to some embodiments; Figure 2 Schematic cross-sectional views of the structure are shown during different steps (2-1 to 2-7) of the method according to some embodiments; Figure 3a and 3bSchematic cross-sectional views of the structure are shown during different steps (3-1 to 3-9) of the method according to some embodiments. Detailed Implementation

[0016] This disclosure relates to a method for manufacturing a structure 1, the structure 1 including a metal-containing layer 11 bonded to a first carbon allotropic layer 12. For example, the structure 1 can be used as an optical filter for blocking electromagnetic radiation of other wavelengths, such as visible light.

[0017] Provide substrate The method includes providing a substrate 13 having a flat surface 131, such as Figure 1 Step 1-1 Figure 2 Step 2-1 and Figure 3 are illustrated in step 3-1. In other words, at least one surface of substrate 13 has a flat shape. For example, substrate 13 is silicon, such as a silicon wafer; quartz; glass; sapphire; a polymer, such as polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polycarbonate (PC), or polyimide (PI); silicon dioxide (SiO2); a metal, such as gold, silver, aluminum, or copper; or a dielectric-coated substrate, such as TiO2, Al2O3, ZnO, or HfO2, mica, or polymethylsiloxane (PDMS).

[0018] The flat surface 131 has low surface roughness. According to some embodiments, the surface roughness of the flat surface 131 of the substrate 13 is at most 20 nm, preferably at most 5 nm, for example 0.01 to 1 nm, wherein the surface roughness is determined as the arithmetic mean of the filtered roughness profile determined from the deviation around the centerline within the evaluation length.

[0019] Using polymer-coated substrates The method includes coating a flat surface 131 of a substrate 13 with a polymer to obtain a polymer layer 14 bonded to the flat surface 131 of the substrate 13, such as Figure 1 Steps 1-2 Figure 2 Steps 2-2 and 3-2 in Figure 3 are exemplarily shown. Preferably, the polymer layer 14 has a uniform thickness. Due to the low surface roughness of the flat surface 131 of the substrate 13, the polymer layer 14 also has a low surface roughness. This is because the polymer layer 14 replicates the surface structure of the flat surface 131. The purpose of the polymer layer 14 is to serve as a smooth, removable substrate for forming the metal-containing layer 11.

[0020] Preferably, the polymer is an easily soluble polymer. Preferably, the polymer is suitable for dip coating or spin coating applications, or for vapor deposition. According to some embodiments, the polymer is selected from the group consisting of: polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), cyclic olefin polymer (COP), cyclic olefin copolymer (COC), polydimethylsiloxane (PDMS), polycarbonate (PC), polyethylene terephthalate (PET), polystyrene (PS), fluoropolymers, polyetheretherketone (PEEK), polyimide (PI), polyethylene glycol (PEG), polyvinylidene fluoride (PVDF), poly(3-hexylthiophene) (P3HT), poly(ethylene oxide) (PEO), poly(lactic acid) (PLA), poly(4-vinylphenol) (PVP), and SU-8.

[0021] According to some embodiments, the polymer is coated onto the flat surface 131 of the substrate 13 using either dip coating or spin coating. This is to obtain a uniform thickness of the polymer layer 14. In dip coating, the substrate 13 is immersed in a liquid polymer and allowed to cure. In spin coating, a liquid polymer is applied to the flat surface 131 of the substrate 13, and the substrate 13 is rotated about an axis perpendicular to the flat surface 131, thereby causing the polymer to spread uniformly on the flat surface 131 and cure.

[0022] Preferably, the polymer is amorphous. In other words, the polymer has low crystallinity. Low crystallinity makes the polymer more easily dissolved by solvents than polymers with high crystallinity.

[0023] Preferably, the thickness of the polymer layer 14 is 0.1 to 5 µm, for example 0.5 to 2 µm.

[0024] Deposited metal-containing materials The method includes depositing a metal-containing material on a polymer layer 14 to obtain a metal-containing layer 11 bonded to the polymer layer 14, such as... Figure 1 Steps 1-3 Figure 2 Steps 2-3 and step 3-3 in Figure 3 are exemplarily shown. In other words, the metal-containing layer 11 is deposited on the polymer layer 14, located on the surface opposite to the surface bonded to the substrate 13. The purpose of the metal-containing layer 11 is to serve as a functional layer of the structure. For example, the metal-containing layer 11 serves as a filtering element in the aforementioned optical filter.

[0025] By depositing a metal-containing material on the polymer layer 14, a layered structure in the order of metal-containing layer 11, polymer layer 14 and substrate 13 is obtained.

[0026] According to some embodiments, the metal-containing material is a metal selected from the group consisting of: molybdenum (Mo), niobium (Nb), zirconium (Zr), aluminum (Al), silver (Ag), gold (Au), copper (Cu), titanium (Ti), nickel (Ni), and chromium (Cr), or the metal-containing material is a silicide selected from the group consisting of: molybdenum silicide, niobium silicide, zirconium silicide, aluminum silicide, silver silicide, gold silicide, copper silicide, titanium silicide, nickel silicide, cobalt silicide, and platinum silicide. Tungsten silicides and chromium silicides, or the metal-containing material selected from the group consisting of: indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO), titanium dioxide (TiO2), zinc oxide (ZnO), titanium nitride (TiN), tantalum nitride (TaN), magnesium fluoride (MgF2), calcium fluoride (CaF2), lithium fluoride (LiF), zinc sulfide (ZnS), zinc selenide (ZnSe), cadmium sulfide (CdS), and lead sulfide (PbS).

[0027] According to some embodiments, the metal-containing material is deposited by methods such as physical vapor deposition (PVD), such as electron beam physical vapor deposition (EBPVD) or thermal evaporation; atomic layer deposition (ALD); electrodeposition; dip coating; or spin coating.

[0028] The thickness of the metal-containing layer 11 depends on the desired properties of the metal-containing layer 11. Preferably, the thickness of the metal-containing layer 11 is 10 to 50 nm.

[0029] Provide the first carbon allotropic layer The method includes providing a first carbon allotrope layer 12. The first carbon allotrope layer 12 is a thin film comprising at least one carbon allotrope. The purpose of the first carbon allotrope layer 12 is to provide mechanical stability to the structure 1.

[0030] Preferably, the first carbon allotrope layer 12 is a layer comprising carbon allotropes, wherein the carbon allotropes are selected from carbon nanotubes and graphene.

[0031] Carbon nanotubes (CNTs) are tubular structures formed from carbon with diameters in the nanometer range. In this disclosure, the term "carbon nanotube" encompasses both single-walled carbon nanotubes (SWCNTs) and multi-walled carbon nanotubes (MWCNTs). Graphene is a carbon allotrope composed of a single layer of atoms arranged in a honeycomb-like planar nanostructure.

[0032] Preferably, the first carbon allotrope layer 12 comprises at least 50% by weight, preferably at least 75% by weight, more preferably at least 90% by weight, and most preferably at least 99% by weight of carbon allotrope. For example, the first carbon allotrope layer 12 is composed of carbon allotrope.

[0033] Document WO2023 / 209271A1 discloses a method for preparing a carbon allotropic thin film, which can be used as a first carbon allotropic layer 12.

[0034] According to some embodiments, the first carbon allotrope layer 12 is bonded to a frame 15 for supporting the first carbon allotrope layer 12, such as... Figure 2 As exemplified. In other words, the first carbon allotrope layer 12 is provided in the form of being bonded to a frame 15. The purpose of the frame 15 is to provide support for the first carbon allotrope layer 12. For example, the frame 15 is a ring-shaped metal frame 15.

[0035] According to some embodiments, providing a first carbon allotrope layer 12 includes bonding the first carbon allotrope layer 12 to a frame 15.

[0036] Combined with the first carbon allotrope layer The method includes bonding a first carbon allotropic layer 12 to a metal-containing layer 11, such as Figure 1 Steps 1-4 Figure 2 Steps 2-4 and steps 3-4 in Figure 3 are exemplarily shown. For example, bonding the first carbon allotrope layer 12 to the metal-containing layer 11 is performed by contacting the first carbon allotrope layer 12 with the metal-containing layer 11. Preferably, the first carbon allotrope layer 12 is contacted with the metal-containing layer 11 in an environment containing a liquid medium (e.g., isopropanol (IPA) or acetone). The purpose of the liquid medium is to promote the bonding of the first carbon allotrope layer 12 to the metal-containing layer 11.

[0037] Preferably, if the first carbon allotrope layer 12 is bonded to the frame 15, then the surface of the first carbon allotrope layer 12 opposite to the surface bonded to the frame 15 is bonded to the metal-containing layer 11. Thus, the metal-containing layer 11 and the frame 15 are connected to the opposite surfaces of the first carbon allotrope layer 12.

[0038] By bonding the first carbon allotrope layer 12 to the metal-containing layer 11, a layered structure is obtained in the order of optional framework 15, first carbon allotrope layer 12, metal-containing layer 11, polymer layer 14 and substrate 13.

[0039] Pre-binding treatment According to some embodiments, the method includes pretreating the metal-containing layer 11 before bonding the first carbon allotrope layer 12 to the metal-containing layer 11 to improve the adhesion of the first carbon allotrope layer 12 to the metal-containing layer 11. The purpose of the pretreating is to control the surface termination and hydrophobicity of the metal-containing layer 11.

[0040] For example, the pretreatment is plasma treatment, heat treatment, or chemical treatment, such as acid treatment or thiol treatment.

[0041] Dissolved polymer layer The method includes, after bonding the first carbon allotropic layer 12 to the metal-containing layer 11, dissolving the polymer layer 14 using solvent 2, such as... Figure 1 Steps 1-5 and 1-6 Figure 2 Steps 2-5 and 2-6, and steps 3-5 and 3-6 in Figure 3 are exemplarily shown. Thereby, the substrate 13 is released from the metal-containing layer 11, resulting in a structure 1 including the metal-containing layer 11 bonded to the first carbon allotropic layer 12, as shown below. Figure 1 Steps 1-7 and Figure 2 Steps 2-7 are shown as an example.

[0042] Solvent 2 contains solvent components capable of dissolving the polymer. In other words, solvent 2 depends on the polymer used. Solvent 2 may include a single solvent component or a mixture of multiple solvent components. For example, the solvent component may be selected from the group consisting of: water, acetone, chloroform, toluene, dichloromethane (DCM), ethyl acetate, cyclohexane, xylene, phenol, dichlorobenzene, trifluoroacetic acid, dimethylacetamide (DMAc), N-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), hexane, tetrahydrofuran, water, ethanol, methanol, propylene glycol methyl ether acetate (PGMEA), and perfluorotributylamine.

[0043] According to some embodiments, dissolving the polymer layer 14 includes heating the solvent 2 to increase the solubility of the polymer. For example, the solvent 2 is heated to a temperature of 40 to 80°C.

[0044] For example, dissolving the polymer layer 14 is performed by the following steps: placing the layered structure of the optional framework 15, the first carbon allotrope layer 12, the metal-containing layer 11, the polymer layer 14, and the substrate 13 in a container 3 containing solvent 2, thereby at least partially immersing the layered structure in solvent 2 and allowing solvent 2 to dissolve the polymer layer 14, such as... Figure 2 Steps 2-5 and 2-6 are illustrated exemplarily.

[0045] Encapsulation containing metal layers According to some embodiments, the method includes providing a laminate 16, the laminate 16 including a second carbon allotropic layer 161 bonded to a metal mesh 162, as exemplarily shown in steps 3-7 of FIG3.

[0046] The second carbon allotrope layer 161 is a layer comprising at least one carbon allotrope. The purpose of the second carbon allotrope layer 161 is to allow a metal-containing layer 11 to be encapsulated between the first carbon allotrope layer 12 and the second carbon allotrope layer 161.

[0047] Preferably, the second carbon allotrope layer 161 is a layer comprising a carbon allotrope selected from carbon nanotubes and graphene.

[0048] Preferably, the second carbon allotrope layer 161 comprises at least 50% by weight, preferably at least 75% by weight, more preferably at least 90% by weight, and most preferably at least 99% by weight of carbon allotrope. For example, the second carbon allotrope layer 161 is composed of carbon allotrope.

[0049] For example, the metal mesh 162 is formed from stainless steel, Si3N4, molybdenum, carbon nanotubes, SiO2, indium tin oxide (ITO), polymethyl methacrylate or polyethylene terephthalate (PET).

[0050] For example, the metal mesh 162 is formed of stainless steel with a thickness of 50µm.

[0051] For example, the metal mesh 162 has a hexagonal pattern, wherein the width of each hexagon is about 1 to 2 mm.

[0052] In these embodiments, after dissolving the polymer layer 14, the method includes bonding a second carbon allotrope layer 161 to the metal-containing layer 11, as exemplarily shown in steps 3-8 of FIG3. In other words, the surface of the second carbon allotrope layer 161 opposite to the surface bonded to the metal mesh 162 is bonded to the metal-containing layer 11. In yet another sense, the second carbon allotrope layer 161 is bonded to the surface of the metal-containing layer 11 opposite to the surface bonded to the first carbon allotrope layer 12. For example, the second carbon allotrope layer 161 is bonded to the metal-containing layer 11 by contacting it with the metal-containing layer 11.

[0053] Preferably, the second carbon allotrope layer 161 is brought into contact with the metal-containing layer 11 in an environment containing a liquid medium (e.g., isopropanol (IPA) or acetone). The purpose of the liquid medium is to promote the bonding of the second carbon allotrope layer 161 to the metal-containing layer 11.

[0054] Thus, a structure 1 is obtained comprising, in sequence, a first carbon allotrope layer 12, a metal-containing layer 11, a second carbon allotrope layer 161, and a metal mesh 162, as exemplarily shown in steps 3-9 of FIG3. In other words, a structure 1 is obtained, which includes a metal-containing layer 11 sandwiched or encapsulated between the first carbon allotrope layer 12 and the second carbon allotrope layer 161 on the metal mesh 162.

[0055] For example, a laminate 16 including a second carbon allotrope layer 161 bonded to a metal mesh 162 is placed in a container 3 containing a solvent 2, and the second carbon allotrope layer 161 is bonded to the metal-containing layer 11 by contacting the second carbon allotrope layer 161 with the metal-containing layer 11 in the container 3.

[0056] Example Example 1 The silicon wafer substrate was coated using PMMA by immersing it in a solution of polymethyl methacrylate (PMMA) (2% molar mass) dissolved in methyl isobutyl ketone (MIBK) and acetic acid (MIBK:acetic acid = 3:1) at an immersion / removal speed of 25 / 25 mm / min. The coated substrate was then baked in a ventilated oven at 100°C for 15 minutes.

[0057] A 30 nm thick gold-palladium layer was deposited on a coated substrate using physical vapor deposition (PVD) (Quorum, Aalto University Scanning Electron Microscopy Laboratory).

[0058] The carbon nanotube film is transferred to the palladium layer by immersing it in isopropanol (IPA) at room temperature and then drying it, thus binding the carbon nanotube film to the palladium layer with a ring-shaped metal framework having a central pore.

[0059] The PMMA layer is dissolved by placing the layered structure in a container containing acetone at room temperature until the substrate is released from the remaining layered structure.

[0060] Thus, a structure including a gold-palladium layer on a carbon nanotube film was obtained.

[0061] Example 2 The silicon wafer substrate was coated using PMMA by immersing it in a solution of polymethyl methacrylate (PMMA) (2% molar mass) dissolved in methyl isobutyl ketone (MIBK) and acetic acid (MIBK:acetic acid = 3:1) at an immersion / removal speed of 25 / 25 mm / min. The coated substrate was then baked in a ventilated oven at 100°C for 15 minutes.

[0062] A 30 nm thick molybdenum layer was deposited on a coated substrate using physical vapor deposition (PVD) (Angstrom, Thin Film Laboratory, Aalto University).

[0063] The molybdenum layer was treated with H2 plasma at a power of 40W and a flow rate of 20 SCCM for 3 minutes.

[0064] The carbon nanotube film is transferred onto the molybdenum layer by immersing it in isopropanol (IPA) at room temperature and then drying it, thus bonding the first carbon nanotube film to the molybdenum layer.

[0065] The PMMA layer was dissolved by placing the layered structure in a container containing acetone at standard room temperature until the substrate was released from the remaining layered structure, allowing the layered structure to float on the surface of the acetone solution. A few drops of IPA were added to the acetone to reduce the surface tension of the acetone solution and promote the floating of the layered structure.

[0066] A second carbon nanotube film bonded to a metal mesh is immersed in an acetone solution at an angle that minimizes bubble formation. The second carbon nanotube film is then slowly lifted from the acetone solution to bring it into contact with the remaining layered molybdenum layer, allowing the floating layered structure to adhere to the surface of the second carbon nanotube film and obtain the final structure. The final structure is then removed from the container and heated to 80°C on a hot plate to bond the second carbon nanotube film to the molybdenum layer.

[0067] This yields a structure comprising a molybdenum layer sandwiched between two carbon nanotube films on a metal mesh.

Claims

1. A method for manufacturing a structure (1), said structure (1) comprising a metal-containing layer (11) bonded to a first carbon allotropic layer (12), characterized in that, The method includes: - Provide a substrate (13) having a flat surface (131); - Use a polymer to coat the flat surface (131) of the substrate (13) to obtain a polymer layer (14) bonded to the flat surface (131) of the substrate (13); - Deposit a metal-containing material on the polymer layer (14) to obtain a metal-containing layer (11) bonded to the polymer layer (14); - Provides a first carbon allotropic layer (12); - Bonding the first carbon allotropic layer (12) to the metal-containing layer (11); and - After bonding the first carbon allotrope layer (12) to the metal-containing layer (11), the polymer layer (14) is dissolved using a solvent (2) to release the substrate (13) from the metal-containing layer (11) to obtain a structure (1) comprising the metal-containing layer (11) bonded to the first carbon allotrope layer (12).

2. The method according to claim 1, characterized in that, The first carbon allotrope layer (12) is a layer comprising carbon allotropes selected from carbon nanotubes and graphene.

3. The method according to claim 1 or 2, characterized in that, The surface roughness of the flat surface (131) of the substrate (13) is at most 20 nm, preferably at most 5 nm, for example 0.01 to 1 nm, wherein the surface roughness is determined as the arithmetic mean of the filtered roughness profile determined from the deviation around the centerline within the evaluation length.

4. The method according to any one of the preceding claims, characterized in that, The polymer is selected from the group consisting of polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), cyclic olefin polymer (COP), cyclic olefin copolymer (COC), polydimethylsiloxane (PDMS), polycarbonate (PC), polyethylene terephthalate (PET), polystyrene (PS), fluoropolymers, polyether ether ketone (PEEK), polyimide (PI), and SU-8.

5. The method according to any one of the preceding claims, characterized in that, The polymer is coated onto the flat surface (131) of the substrate (13) using dip coating or spin coating.

6. The method according to any one of the preceding claims, characterized in that, The metal-containing material is a metal selected from the group consisting of molybdenum (Mo), niobium (Nb), zirconium (Zr), aluminum (Al), silver (Ag), gold (Au), copper (Cu), titanium (Ti), nickel (Ni), and chromium (Cr), or a metal-containing material is a silicide selected from the group consisting of molybdenum silicide, niobium silicide, zirconium silicide, aluminum silicide, silver silicide, gold silicide, copper silicide, titanium silicide, nickel silicide, and chromium silicide, or a metal-containing material selected from the group consisting of indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO), titanium dioxide (TiO2), zinc oxide (ZnO), titanium nitride (TiN), tantalum nitride (TaN), magnesium fluoride (MgF2), calcium fluoride (CaF2), lithium fluoride (LiF), zinc sulfide (ZnS), zinc selenide (ZnSe), cadmium sulfide (CdS), and lead sulfide (PbS).

7. The method according to any one of the preceding claims, characterized in that, Metallic materials are deposited using the following methods: physical vapor deposition (PVD), such as electron beam physical vapor deposition (EBPVD) or thermal evaporation; atomic layer deposition (ALD); electrodeposition; dip coating; or spin coating.

8. The method according to any one of the preceding claims, characterized in that, The method includes pretreating the metal-containing layer (11) before bonding the first carbon allotrope layer (12) onto the metal-containing layer (11), wherein the pretreating is selected from plasma treatment, heat treatment and chemical treatment.

9. The method according to any one of the preceding claims, characterized in that, The first carbon allotrope layer (12) has been incorporated into the framework (15) for supporting the first carbon allotrope layer (12).

10. The method according to any one of the preceding claims, characterized in that, The method includes: - Provide a laminate (16) comprising a second carbon allotropic layer (161) bonded to a metal mesh (162); and - After dissolving the polymer layer (14), the second carbon allotrope layer (161) is bonded to the metal-containing layer (11) to obtain a structure (1) comprising the first carbon allotrope layer (12), the metal-containing layer (11), the second carbon allotrope layer (161) and the metal mesh (162).

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