A temperature field control method and device for a test chamber and a test chamber

Abstract

This application provides a temperature field control method, device, and test chamber for a test chamber. The temperature field control device includes: an air circulation component that forms a circulating airflow within the test chamber; an evaporator disposed along the flow path of the circulating airflow; and a temperature compensation module disposed in the airflow stagnation zone, which performs temperature compensation in a bidirectional switching mode between hot and cold air, wherein the airflow stagnation zone is the area outside the flow path of the circulating airflow. The temperature compensation module includes a semiconductor module and a dual-channel PID controller. Part of the heat exchange plane of the semiconductor module is disposed opposite to the evaporator, and the dual-channel PID controller is used to control the heating and cooling directions of the semiconductor module. By setting a temperature compensation module with bidirectional switching capability in the airflow stagnation zone and controlling its temperature field, this application achieves active bidirectional temperature compensation for this area, thereby eliminating local temperature deviations and significantly improving steady-state temperature control accuracy and temperature field uniformity.

Description

Technical Field

[0001] This application relates to the technical field of temperature field control devices, and more particularly to a temperature field control method, device, and test chamber for a test chamber. Background Technology

[0002] In reliability testing of products such as semiconductor chips and electronic components, test chambers are devices that simulate the corresponding environments. As advanced process chips place increasingly stringent requirements on testing conditions, the temperature field control capabilities of traditional test chambers over ultra-wide temperature ranges have become insufficient.

[0003] Specifically, conventional test chambers typically achieve temperature stability by using a compressor operating at full power output in conjunction with a heater to offset excess cooling energy. The internal air circulation path generally involves an agitator fan driving the airflow sequentially through the evaporator and heater before entering the main chamber, forming a circulating flow. However, within this circulation structure, certain areas (e.g., between the air duct and the main chamber) become airflow stagnation zones because the airflow from the agitator fan cannot directly cover them. Poor airflow and insufficient heat exchange in these areas result in significantly larger temperature deviations compared to other areas under extreme temperature conditions, directly impacting the overall temperature uniformity and steady-state temperature control accuracy within the chamber.

[0004] Therefore, there is an urgent need for a method, device, and test chamber for temperature field control in test chambers. Summary of the Invention

[0005] The purpose of this application is to provide a method, device, and test chamber for temperature field control in a test chamber, thereby solving the aforementioned technical problems.

[0006] The objective of this application is achieved through the following technical solution: This application provides a method for temperature field control in a test chamber, the test chamber including a temperature field control device, the temperature field control device comprising: An air circulation component is disposed within the test chamber of the test chamber and configured to generate a circulating airflow within the test chamber; Temperature control equipment is installed in the flow path of the circulating airflow; A temperature control compensation module is disposed in the airflow stagnation area within the test chamber and configured to perform temperature compensation on the airflow stagnation area in a bidirectional switching working mode between hot and cold; wherein, the airflow stagnation area is the region of the test chamber located outside the flow path of the circulating airflow; the temperature control compensation module includes a semiconductor module and a dual-channel PID controller, a portion of the heat exchange plane of the semiconductor module is disposed opposite to the temperature control device, and the dual-channel PID controller is used to control the heating and cooling directions of the semiconductor module; A multi-channel temperature and humidity controller is electrically connected to the air circulation component, the temperature control device, and the dual-channel PID controller via connecting wires. The method includes: The multi-channel temperature and humidity controller receives setting operations; in response to the setting operations, it obtains the target temperature of the test chamber; and it obtains the actual temperature inside the test chamber. Based on the target temperature and the actual temperature, a control strategy is obtained by the multi-channel temperature and humidity controller; the control strategy includes operation mode judgment and multiple control stages determined according to the operation mode; the air circulation component is controlled to operate according to the determined operation mode and its corresponding control stages to form a circulating airflow in the test chamber; the temperature adjustment device is controlled to adjust the temperature of the circulating airflow. When the actual temperature meets the stability conditions of the test chamber, the temperature control compensation module uses a dual-channel PID controller to switch between heating and cooling in both directions, and controls the semiconductor module to perform temperature compensation for the airflow stagnation zone.

[0007] In some optional embodiments, the operation mode determination includes: When the actual temperature is lower than the difference between the target temperature and the first threshold, it is determined to be in heating mode; When the actual temperature is higher than the difference between the target temperature and the second threshold, it is determined to be in cooling mode; When the actual temperature is greater than or equal to the difference between the target temperature and the first threshold, and less than or equal to the sum of the target temperature and the second threshold, it is determined to be in constant temperature mode.

[0008] In some optional embodiments, the test chamber includes a main chamber and an air duct, with a partition between the air duct and the main chamber; the air circulation assembly includes a stirring fan blade disposed at the air outlet of the air duct; the airflow stagnation zone is the area between the air duct and the main chamber that cannot be directly covered by the airflow; the semiconductor module is elongated and attached to the partition between the air duct and the main chamber, or embedded in the partition.

[0009] In some optional embodiments, the temperature control device includes an evaporator disposed in the flow path of the circulating airflow, the evaporator being disposed at one end of the air inlet of the air duct, and a portion of the heat exchange plane of the semiconductor module being disposed opposite to a heat exchange plane of the evaporator; the temperature control device also includes a heater disposed between the evaporator and the stirring fan blades within the air duct. The temperature field control device also includes a variable frequency compressor, a microchannel condenser, and an evaporator control valve connected in series in the pipeline of the evaporator; the temperature and humidity multichannel temperature controller is electrically connected to the variable frequency compressor, the microchannel condenser, the evaporator control valve, and the dual-channel PID controller respectively through connecting wires; The control of the temperature regulating device to adjust the temperature of the circulating airflow includes: In heating mode, the heater is controlled to heat the circulating airflow; in cooling mode, the evaporator is controlled to cool the circulating airflow.

[0010] In some optional embodiments, in the heating mode, the plurality of control stages include: In the first stage, the air circulation assembly and the heater are controlled to operate at maximum power; In the second stage, the output ratio of the air circulation component and the heater is determined by proportional-integral-derivative (PID) calculation to stabilize the temperature. In the third stage, the heater is controlled to operate at 10% to 51% of the preset power. In the fourth stage, after the temperature has remained stable for a predetermined period of time, the temperature control compensation module is controlled to switch between hot and cold modes, and the temperature control device is controlled to operate at 1% to 10% of the preset power.

[0011] In some optional embodiments, in cooling mode, the plurality of control phases include: In the first stage, the air circulation assembly and the variable frequency compressor are controlled to operate at maximum power, and the microchannel condenser and the evaporator control valve are controlled to operate at maximum capacity. In the second stage, the output ratios of the air circulation component, the variable frequency compressor, the microchannel condenser, and the evaporator control valve are determined based on proportional-integral-derivative (PID) calculations to stabilize the temperature. In the third stage, the variable frequency compressor, the microchannel condenser, and the evaporator control valve are controlled to operate at 10% to 51% of the preset power. In the fourth stage, after the temperature has remained stable for a predetermined period of time, the temperature control compensation module is controlled to switch between hot and cold modes, and the variable frequency compressor, the microchannel condenser, and the evaporator control valve are controlled to operate at 1% to 10% of the preset power or capacity.

[0012] In some alternative embodiments, a portion of the semiconductor module is disposed adjacent to the evaporator in the thickness direction of the partition, and another portion of the semiconductor module extends toward the air outlet of the duct.

[0013] In some alternative embodiments, the semiconductor module is mounted in the central region of the airflow stagnation zone in the vertical direction.

[0014] This application also provides a temperature field control device for implementing the temperature field control method described in any of the above claims.

[0015] This application also provides a test chamber, including the temperature field control device as described above.

[0016] In some alternative embodiments, the test chamber is a constant temperature and humidity test chamber.

[0017] Combining the aforementioned technical solutions and the technical problems they solve, the technical solution protected in this application identifies airflow stagnation zones in a traditional air circulation architecture and installs a temperature control compensation module with a bidirectional switching operating mode for heating and cooling within these zones. This enables the previously ineffective heat exchange-deficient local blind areas to acquire independent active temperature compensation capabilities. Under the control of a dual-channel PID controller, the semiconductor module can flexibly switch between heating and cooling directions based on the real-time temperature deviation of these zones, unlike traditional heaters which can only compensate in one direction. This achieves precise bidirectional temperature control of the airflow stagnation zone. By aligning a portion of the heat exchange plane of the semiconductor module in the temperature control compensation module with the evaporator, the energy generated by the semiconductor module can be efficiently carried away by the main circulating airflow, ensuring efficient operation of the bidirectional temperature control. By integrating the main refrigeration circuit components, such as the variable frequency compressor, microchannel condenser, and evaporator control valve, with a dual-channel PID controller through a multi-channel temperature and humidity controller, a unified control system can be achieved. This enables coordinated operation between main cycle temperature control and local compensation temperature control. Specifically, the main refrigeration circuit is responsible for providing the basic temperature field environment, while the temperature compensation module is responsible for fine-tuning the airflow stagnation zone. The synergistic effect of the two results in high steady-state temperature control accuracy and more uniform temperature within the test chamber.

[0018] Meanwhile, a temperature control compensation module containing a semiconductor module is installed in the airflow stagnation zone of the test chamber, and works in conjunction with a multi-channel temperature and humidity controller to implement a graded control strategy. After the temperature reaches initial stability, the temperature control compensation module uses dual-channel PID control to switch between hot and cold modes on the semiconductor module, compensating for the temperature in the stagnation zone. This control method eliminates the problem of low control accuracy caused by the thermal equilibrium of traditional test chambers, and solves the technical bottleneck of poor temperature uniformity in the airflow stagnation zone, meeting the requirements of advanced process chip testing for an ultra-wide temperature range and high-precision temperature field. Attached Figure Description

[0019] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a structural diagram of a test chamber provided by related technologies.

[0021] Figure 2 This is a schematic diagram of the structure of a test chamber provided in an embodiment of this application.

[0022] Figure 3 This is a schematic flowchart of a temperature field control method provided in an embodiment of this application.

[0023] Figure 4 This is a schematic diagram of an H-bridge commutation circuit for implementing bidirectional switching between hot and cold modes in a semiconductor module, as provided in an embodiment of this application. Detailed Implementation

[0024] The present application will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0025] See Figure 1 This is a schematic diagram of a test chamber in related technologies. 101 is the stirring fan blade of the air circulation component; 102 is the heater; 103 is the airflow stagnation zone; 104 is the evaporator; 105 is the air duct; and 106 is the air circulation path within the inner chamber.

[0026] The following shortcomings are commonly observed: Firstly, the steady-state temperature control accuracy can only reach ±0.5℃, which is insufficient to meet the ±0.1℃ accuracy requirement of high-end chip testing. Secondly, the temperature uniformity deviation at multiple points within the chamber is relatively large, typically only reaching ±1.0℃, failing to meet the stringent standard of ≤±0.3℃ uniformity for advanced process testing. One of the root causes of these shortcomings is the existence of airflow stagnation zones, which result in a lack of effective active temperature compensation methods in these localized areas. Relying solely on heat exchange from the main circulating airflow is insufficient to eliminate temperature deviations in these areas.

[0027] To address the problem of insufficient steady-state temperature control accuracy and temperature field uniformity caused by the lack of active temperature compensation in the airflow stagnation zone of existing temperature field control devices, this application proposes a temperature field control method, device, and test chamber for a test chamber. This method incorporates a temperature control compensation module with bidirectional hot and cold switching capability in the airflow stagnation zone, achieving active bidirectional temperature compensation for this area. This eliminates local temperature deviations and improves overall steady-state temperature control accuracy and temperature field uniformity. The temperature field control device will be described first, followed by the control method and the test chamber.

[0028] Example 1 This application provides a temperature field control device for a test chamber, comprising: An air circulation component is disposed within the test chamber of the test chamber and configured to generate a circulating airflow within the test chamber; An evaporator is disposed in the flow path of the circulating airflow; A temperature control compensation module is installed in the airflow stagnation area inside the test chamber and is configured to perform temperature compensation on the airflow stagnation area in a bidirectional switching working mode of hot and cold. The airflow stagnation zone is the area of ​​the test chamber located outside the flow path of the circulating airflow; the temperature control compensation module includes a semiconductor module and a dual-channel PID controller, a portion of the heat exchange plane of the semiconductor module is arranged opposite to the temperature control device, and the dual-channel PID controller is used to control the heating and cooling directions of the semiconductor module.

[0029] In the above technical solution, the temperature control compensation module is configured to operate in a bidirectional switching mode between heating and cooling. Its core is that the semiconductor module, under the control of the dual-channel PID controller, can flexibly switch between heating and cooling modes according to the real-time temperature deviation of the airflow stagnation zone, rather than only performing temperature compensation in one direction.

[0030] As an example, part of the heat exchange plane of the semiconductor module is positioned opposite the evaporator, so that when the semiconductor module is performing a cooling operation, the heat generated at its hot end can be effectively carried away by the airflow flowing through the evaporator, thereby ensuring cooling efficiency; when performing a heating operation, heat can be directly released to the airflow stagnation area.

[0031] The evaporator is the end heat exchange component of the refrigeration cycle. Low-temperature and low-pressure refrigerant flows inside it. When the circulating airflow passes over the surface of the evaporator, the heat in the airflow is absorbed by the refrigerant, thereby achieving cooling and dehumidification of the airflow.

[0032] The temperature control compensation module is located in the airflow stagnation zone within the test chamber and is configured to perform temperature compensation in the airflow stagnation zone using a bidirectional switching operating mode (hot and cold). The airflow stagnation zone is the area within the test chamber located outside the flow path of the circulating airflow. To explain the airflow stagnation zone as used in this application: Within the test chamber, although the air circulation component drives the air to form a main circulating airflow, due to the limitations of the internal structure of the chamber, there are areas that cannot be directly or fully reached by the main circulating airflow. The airflow in these areas is significantly lower than in other areas along the main circulating airflow path, resulting in a low air exchange rate and difficulty in effectively removing or replenishing heat with the main circulating airflow, thus forming blind spots with localized temperature deviations. This application refers to such areas located outside the main circulating airflow path and with poor airflow as airflow stagnation zones. Figure 2 In the example shown, the airflow stagnation zone is roughly located between the air duct and the main cavity, near the baffle that the airflow from the stirring fan blades cannot directly cover. This area, being at the edge or leeward side of the main circulating airflow, is the source of deterioration in temperature field uniformity.

[0033] The temperature control compensation module is specifically located within this airflow stagnation zone, and its operating mode is bidirectional switching between heating and cooling. This bidirectional switching means that, unlike traditional heaters that can only perform heating compensation in one direction, the temperature control compensation module has the ability to flexibly switch between heating and cooling modes. When the actual temperature of the airflow stagnation zone is lower than the target set temperature, the temperature control compensation module switches to heating mode, releasing heat to the area to raise the temperature; when the actual temperature of the airflow stagnation zone is higher than the target set temperature, the temperature control compensation module switches to cooling mode, absorbing heat from the area to lower the temperature. This bidirectional adjustment capability allows the temperature control compensation module to proactively and precisely intervene in both directions—adding heat to areas with insufficient heat and absorbing heat from areas with excessive heat—based on the real-time temperature deviation in the airflow stagnation zone. This fundamentally solves the problem in traditional solutions where the airflow stagnation zone can only passively rely on the main circulating airflow for slow heat exchange, making it difficult to eliminate temperature deviations.

[0034] The temperature control compensation module includes a semiconductor module and a dual-channel PID controller. A portion of the heat exchange plane of the semiconductor module is positioned opposite to the temperature control device. The dual-channel PID controller controls the heating and cooling directions of the semiconductor module. Specifically, the semiconductor module is the core actuator for achieving bidirectional switching between heating and cooling. Its working principle is based on the Peltier effect: when a direct current passes through a thermocouple composed of two different semiconductor materials, one end absorbs heat (cools) and the other end releases heat (heats). Furthermore, by changing the direction of the current, the heat-absorbing and heat-releasing ends can be interchanged. Therefore, the semiconductor module inherently possesses the physical characteristic of achieving bidirectional switching between heating and cooling by changing the direction of the current. The dual-channel PID controller is a hardware control unit that integrates two independent PID control algorithm output channels, corresponding to the heating current direction and the cooling current direction of the semiconductor module, respectively. The dual-channel PID controller receives the temperature signal from a temperature sensor located in the airflow stagnation zone in real time. After comparing and calculating with the target set temperature, it automatically determines whether to output a heating or cooling current, and the magnitude of the current, thereby controlling the heating or cooling power of the semiconductor module.

[0035] A portion of the heat exchange plane of the semiconductor module (which can be understood as the cooling end or heating end) is positioned opposite the evaporator. In this physical layout, the cooling and heating ends of the semiconductor module exist simultaneously during operation. When the semiconductor module performs cooling compensation on the airflow stagnation area, the side facing the stagnation area is the cooling end (heat absorption), while the side facing away from the stagnation area is the heating end (heat release). If the waste heat generated by this heating end cannot be carried away in time, it will be transferred back to the airflow stagnation area through heat conduction and radiation, severely weakening the cooling compensation effect. In this embodiment, a portion of the heat exchange plane of the semiconductor module is positioned opposite the evaporator, creating an effective heat transfer path between one plane of this heat exchange end and the evaporator. When the semiconductor module is in cooling mode, the waste heat generated at its hot end can be transferred to the evaporator side through this heat exchange plane and efficiently carried away by the main circulating airflow flowing through the evaporator, thereby minimizing the risk of heat transfer back to the airflow stagnation area and ensuring the high efficiency of cooling compensation. When the semiconductor module is in heating mode, it directly releases heat to the stagnation area; in this case, the portion opposite the evaporator is the cooling end.

[0036] Through the above setup, the temperature field control device in this embodiment identifies the airflow stagnation zone and adds a temperature control compensation module with bidirectional switching capability between hot and cold air within this zone. This temperature control compensation module uses a semiconductor module as the actuator and a dual-channel PID controller as the control core. Through the physical layout of the semiconductor module's partial heat exchange plane relative to the evaporator, it achieves active and precise temperature compensation for the airflow stagnation zone. The main circulating airflow is responsible for maintaining the basic temperature field of the test chamber, while the temperature control compensation module is responsible for fine-tuning the temperature in this localized area of ​​airflow stagnation. The combined effect of these two mechanisms effectively eliminates temperature deviations in the airflow stagnation zone, thereby significantly improving the overall steady-state temperature control accuracy and temperature field uniformity of the chamber.

[0037] It should be understood that Figure 2 The layout shown is merely an illustrative example and is not intended to limit the scope of protection of this application. In other embodiments, the specific shape, size, number, and installation position and orientation of the semiconductor module within the airflow stagnation area can be adjusted according to the specific structure and size of the cavity, as long as it can provide temperature compensation for bidirectional switching between hot and cold airflow stagnation.

[0038] In summary, the airflow stagnation zone has obtained an independent, bidirectionally adjustable local temperature control source, which fundamentally solves the problem of temperature runaway caused by poor airflow in this area, thereby effectively improving the overall steady-state temperature control accuracy and temperature field uniformity of the test chamber.

[0039] In some embodiments, the test chamber includes a main chamber and an air duct, with a partition between the air duct and the main chamber; the air circulation assembly includes a stirring fan blade disposed at the air outlet of the air duct; the airflow stagnation zone is the area between the air duct and the main chamber that cannot be directly covered by the airflow.

[0040] Specifically, the physical location of the airflow stagnation zone is the blind area separated from the main cavity by a partition and not directly reached by the airflow from the agitator fan blades. This area has a low air exchange rate because it is located at the edge or leeward side of the main circulating airflow. Placing the semiconductor module here allows for precise intervention in the localized areas most in need of temperature compensation, achieving temperature field optimization.

[0041] The test chamber can be considered not as a single empty cavity, but rather as two functionally distinct yet interconnected spatial regions divided by a partition. The main chamber, typically larger in volume, serves as the primary working space for placing the sample and conducting temperature and humidity tests, and is the main component of the test chamber. The air duct, a relatively narrow airflow channel, provides a defined and controllable flow path for the circulating airflow, allowing it to undergo heat exchange and propulsion before entering the main chamber. The partition, acting as a physical barrier separating the main chamber and the air duct, creates distinct airflow zones within the test chamber: one side is the high-speed main circulating airflow channel, while the other side is the relatively still or low-speed main working space. It should be understood that the specific shape and size of the partition can be adjusted according to the overall design of the test chamber. For example, the partition can be a single flat plate or composed of multiple segments, as long as it effectively creates a clear airflow zone between the main chamber and the air duct.

[0042] The air circulation assembly includes a stirring fan blade positioned at the air outlet of the air duct. The stirring fan blade is the power component driving the air circulation throughout the test chamber; it is driven to rotate by a motor, blowing air from the air duct into the main chamber at a certain speed and pressure. Located at the air outlet of the air duct, the airflow, after passing through various processing components within the air duct, is ultimately accelerated by the stirring fan blade and delivered into the main chamber. Figure 2 In the example shown, the agitator blades are located at the upper air outlet of the duct, blowing airflow from the duct to the upper area of ​​the main cavity, where the airflow then circulates clockwise. It should be understood that the specific type of agitator blades can be a centrifugal blade, or an axial flow blade, a cross-flow blade, or other form of fan, as long as it can effectively drive the air in the duct to the main cavity and form a stable circulating airflow.

[0043] The airflow stagnation zone is the area between the air duct and the main cavity that cannot be directly covered by the airflow. As mentioned earlier, the stirring fan blades are located at the air outlet of the air duct, and the airflow they blow has a clear direction, mainly flowing along the preset circulation path of the main cavity. However, in the transition area between the air duct and the main cavity, especially on the leeward side of the partition and its surrounding space, because it is outside the mainstream direction of the airflow from the stirring fan blades, the airflow cannot directly and fully reach this area, resulting in a significantly lower air exchange rate than other areas on the main circulation airflow path. This area can be considered as the airflow stagnation zone in this application. Physically, this area is located between the air duct and the main cavity.

[0044] In some embodiments, the evaporator is disposed at one end of the air inlet of the air duct, a portion of the heat exchange plane of the semiconductor module is disposed opposite to one heat exchange plane of the evaporator, and a heater is provided between the evaporator and the stirring fan blades in the air duct.

[0045] Based on the above layout, the flow path of the main circulating airflow in the test chamber is as follows: the airflow first enters the air inlet of the air duct from the bottom of the main chamber, and continues to flow after passing through the evaporator. The airflow is then regulated by the heater for temperature compensation. Finally, the airflow regulated by the heater reaches the air outlet of the air duct, is accelerated by the stirring fan blades, and blown into the main chamber. After completing the heat exchange with the sample in the main chamber, it flows back to the air inlet of the air duct from the bottom, forming a complete circulation loop.

[0046] The evaporator is located at one end of the air inlet of the air duct. The circulating air must pass through the evaporator before entering the air duct, and all the air participating in the main circulation will undergo heat exchange treatment by the evaporator. This layout ensures that the main circulation airflow has been temperature-regulated before entering the main chamber, providing a relatively uniform basic temperature field for the entire test chamber.

[0047] In some embodiments, the system also includes a variable frequency compressor, a microchannel condenser, and an evaporator control valve, which are connected in series with the evaporator.

[0048] Specifically, the three components mentioned above, together with the evaporator, constitute a vapor compression refrigeration cycle. The variable frequency compressor compresses the low-temperature, low-pressure gaseous refrigerant, transforming it into a high-temperature, high-pressure gaseous refrigerant, which is then discharged into the condenser. Unlike traditional fixed-frequency compressors, the variable frequency compressor's speed can be continuously adjusted within a certain range according to load demand, thereby changing the refrigerant's mass flow rate and allowing for flexible adjustment of the main refrigeration circuit's refrigeration output power over a wide range. The microchannel condenser is connected in series between the variable frequency compressor and the evaporator control valve. Its function is to cool and condense the high-temperature, high-pressure gaseous refrigerant discharged from the variable frequency compressor into a normal-temperature, high-pressure liquid refrigerant. The evaporator control valve is connected in series between the outlet of the microchannel condenser and the inlet of the evaporator. Its function is to throttle and regulate the refrigerant flow rate entering the evaporator, thereby controlling the evaporation pressure and temperature of the refrigerant within the evaporator. The evaporator control valve can be an electronic expansion valve or a thermostatic expansion valve, as long as it can adjust its opening based on a control signal or the evaporator outlet superheat. By adjusting the opening of the evaporator control valve, the cooling capacity of the evaporator can be controlled, so that the main circulating airflow can achieve the desired temperature drop after passing through the evaporator.

[0049] In some embodiments, the evaporator control valve includes a regulating assembly and a fluid orifice, see reference. Figure 2 The regulating component includes a valve body connected to the evaporator inlet, a valve needle mounted within the valve body, and a drive motor. The valve body has a fluid orifice communicating with the evaporator inlet. The drive motor controls the valve needle to open and close the fluid orifice and controls the flow rate. The output shaft of the drive motor is connected to the valve needle via a coupling. In this embodiment, a controller is provided, electrically connected to the drive motor. The controller can control the drive motor to activate the valve needle, thereby controlling the flow rate within the fluid orifice, facilitating the operator's adjustment of the evaporation temperature at any time. The regulating component allows for dynamic adjustment of the evaporation temperature without increasing energy consumption, thus improving energy efficiency.

[0050] In some embodiments, a multi-channel temperature and humidity controller is also included, which is electrically connected to the variable frequency compressor, the microchannel condenser, the evaporator control valve, and the dual-channel PID controller via connecting wires.

[0051] Specifically, the multi-channel temperature and humidity controller is a centralized control unit that integrates multiple temperature and humidity signal acquisition channels and multiple control signal output channels. It is electrically connected via connecting wires to multiple temperature and humidity sensors (not shown in the figure) distributed at different locations within the test chamber, acquiring real-time temperature and humidity data from key locations such as the main chamber, air ducts, and airflow stagnation areas. Simultaneously, the controller is electrically connected via connecting wires to the variable frequency compressor, microchannel condenser (for example, controlling the speed of its cooling fan), evaporator control valve, and dual-channel PID controller, forming a unified control network.

[0052] Under this hardware architecture, the multi-channel temperature and humidity controller can comprehensively determine the current heat load state of the test chamber based on real-time temperature and humidity signals fed back by various sensors, and issue independent adjustment commands to each actuator. For example, the multi-channel temperature and humidity controller can send speed adjustment signals to the variable frequency compressor to change the refrigerant flow, send opening adjustment signals to the evaporator control valve to change the evaporation temperature, and send target temperature commands to the dual-channel PID controller to control the heating or cooling direction and power of the semiconductor module. All actuators work collaboratively under the unified coordination of the multi-channel temperature and humidity controller, so that the main refrigeration circuit and the temperature control compensation module are no longer two independent systems, but an organically coordinated whole.

[0053] It should be understood that the specific form of the connecting wires is not limited to ordinary cables. In other embodiments, shielded cables, flexible ribbon cables, or optical fibers can also be used as signal transmission media. The communication method between the multi-channel temperature and humidity controller and each actuator can be analog signals (such as 4-20mA current signals or 0-10V voltage signals) or digital communication protocols (such as RS-485, CAN bus, or Modbus protocol), as long as reliable control signal transmission can be achieved. In addition, the specific hardware form of the multi-channel temperature and humidity controller can be an independent instrument-type controller, an integrated control board embedded in the test chamber's operation panel, or an external industrial computer with a data acquisition card. This embodiment does not limit this.

[0054] Through the aforementioned hardware architecture, the temperature field control device of this embodiment possesses the following physical capabilities: the cooling output power of the main refrigeration circuit can be continuously adjusted over a wide range through the speed regulation of the variable frequency compressor and the opening degree of the evaporator control valve, rather than only being able to output at full load; the semiconductor module of the temperature control compensation module can independently switch between hot and cold modes under the control of a dual-channel PID controller; and the multi-channel temperature and humidity controller, as a unified control center, can coordinate the working states of the two subsystems. This hardware architecture employs different cooling strategies at different operating stages—for example, enabling the main refrigeration circuit to output at full load during the initial rapid cooling stage, and reducing the main refrigeration circuit to a low-power state and finely compensating it through the temperature control compensation module during the steady-state maintenance stage—providing the necessary physical basis. However, it should be clarified that this embodiment only describes the hardware structure and its connection relationships for achieving the above capabilities. How to schedule the components and what control timing and logic are used during specific operation are design choices at the control method level and do not constitute a structural limitation on the temperature field control device of this invention.

[0055] In some embodiments, the semiconductor module is elongated and attached to or embedded in the partition between the air duct and the main cavity.

[0056] Specifically, the semiconductor module is designed in a long, narrow shape. The airflow stagnation zone itself is a long, narrow area extending along the partition. Its temperature deviation often exhibits a certain distribution pattern; for example, the deviation is greatest in the central area and gradually decreases towards the air inlet and outlet. If the semiconductor module were designed in a compact shape, its heat exchange range would be limited to a small local point, only able to compensate for the temperature of the air near that point, and unable to effectively cover the entire length of the airflow stagnation zone. With the long, narrow design, the temperature compensation effect of the semiconductor module can cover a larger area, allowing the air within the entire stagnation zone to be more significantly affected by the semiconductor module.

[0057] Regarding the installation relationship between the semiconductor module and the partition, this embodiment provides two specific methods. The first method is adhesive mounting, in which one heat exchange plane of the semiconductor module is attached to the surface of the partition using a thermally conductive medium. Specific methods for adhesive mounting include using thermally conductive grease or adhesive to bond the semiconductor module to the partition surface, using screws and a pressure plate to press the semiconductor module firmly onto the partition surface, or using elastic fasteners such as clips or spring clips to hold and fix the semiconductor module to the partition surface. The advantage of adhesive mounting is its simplicity, requiring no significant structural modifications to the partition, making it suitable for upgrading existing traditional temperature and humidity test chambers.

[0058] The second type is embedded installation, where the semiconductor module is embedded into a mounting slot (space) inside the partition, forming an integrated heat exchange interface between the semiconductor module and the partition. The advantage of embedded installation is that the structure is more compact, and the semiconductor module does not occupy extra space in the airflow stagnation area, which helps maintain the integrity of the internal space of the test chamber.

[0059] In some embodiments, a portion of the semiconductor module is disposed adjacent to the evaporator in the thickness direction of the partition, and another portion of the semiconductor module extends toward the air outlet of the duct.

[0060] This layout minimizes the heat transfer distance between the hot end of the semiconductor module and the cold source of the evaporator, reducing thermal resistance and improving waste heat removal efficiency.

[0061] In some embodiments, the semiconductor module is mounted in the middle region of the airflow stagnation zone in the vertical direction. In the middle region, relative to the upper and lower parts, the air is almost completely still, making it difficult for heat to be carried away by the main circulating airflow or exchanged through natural convection. Therefore, the temperature deviation in this region is often the most concentrated and severe.

[0062] Example 2 This application also provides a test chamber, including the temperature field control device as described in any of the preceding claims.

[0063] In some embodiments, the test chamber is a constant temperature and humidity test chamber.

[0064] As an example, a test chamber is provided. The entire chamber system consists of a multi-channel temperature and humidity controller, connecting wires, a variable frequency compressor, a microchannel condenser, a refrigeration adjustable evaporation temperature device, and a semiconductor module. The semiconductor module is installed in the middle of the air circulation vacuum area (airflow stagnation zone) in the traditional mode.

[0065] The test chamber operates in the following modes: A. During the initial stage of system operation, the "multi-channel temperature and humidity controller" monitors temperature changes in real time and sends commands through the "connecting wires" to enable the "inverter compressor," "microchannel condenser," and "adjustable evaporation temperature device" to operate at full capacity. B. After the system's set temperature stabilizes, the "multi-channel temperature and humidity controller" sends commands via the "connecting wires" to cause the "inverter compressor," "microchannel condenser," and "adjustable evaporator temperature control device" to change their output values ​​to stabilize the temperature. C. After the system has been running stably for a period of time, the "multi-channel temperature and humidity controller" sends commands through the "connecting wires" to continuously reduce the output value, keeping the "inverter compressor," "microchannel condenser," and "adjustable evaporation temperature device" at their lowest operating conditions, in "sleep mode." D. Once the temperature stabilizes in stage C, the "multi-channel temperature and humidity controller" sends a command through the "connecting wire" to the "semiconductor module". The "semiconductor module" uses a dual-channel PID function to switch between heating and cooling directions, keeping the air duct / inner chamber within ±0.1℃. Because the heating / cooling direction of the "semiconductor module" can be switched back and forth, the uniformity of the "air circulation vacuum area" in the traditional mode is improved to ±0.3℃.

[0066] Example 3 See Figure 3 This application provides a temperature field control method for use with the temperature field control device described in Example 1.

[0067] The method includes: S101, receive setting operation using the multi-channel temperature and humidity controller; respond to the setting operation to obtain the target temperature of the test chamber; obtain the actual temperature inside the test chamber; S102, based on the target temperature and the actual temperature, the control strategy is obtained by the multi-channel temperature and humidity controller; the control strategy includes operation mode judgment and multiple control stages determined according to the operation mode; the air circulation component is controlled to operate according to the determined operation mode and its corresponding control stages to form a circulating airflow in the test chamber; the temperature adjustment device is controlled to adjust the temperature of the circulating airflow. S103, when the actual temperature meets the stability conditions of the test chamber, the temperature control compensation module uses a dual-channel PID controller to switch between heating and cooling in both directions, and controls the semiconductor module to perform temperature compensation for the airflow stagnation zone.

[0068] The stable condition here is, for example, that the actual temperature enters the range of ±0.5℃ from the target temperature and remains there for a certain period of time (e.g., 5 minutes). During this time, the main temperature control device (such as a heater or compressor) typically reduces its output power and enters a "sleep" or low-power maintenance state. If the temperature in the airflow stagnation zone is higher than the mainstream field due to poor heat dissipation, the semiconductor module switches to cooling mode under the control of the dual-channel PID controller 42 to absorb heat from the stagnation zone; conversely, if the temperature in the stagnation zone is too low, it switches to heating mode to replenish the heat. This bidirectional switching capability solves the problem of traditional unidirectional heating compensation being unable to cope with localized overheating, and also avoids the high energy consumption and low accuracy defects of traditional hot-cold counterbalancing temperature control methods.

[0069] In some implementations, the operation mode determination includes: When the actual temperature is lower than the difference between the target temperature and the first threshold, it is determined to be in heating mode; When the actual temperature is higher than the difference between the target temperature and the second threshold, it is determined to be in cooling mode; When the actual temperature is greater than or equal to the difference between the target temperature and the first threshold, and less than or equal to the sum of the target temperature and the second threshold, it is determined to be in constant temperature mode.

[0070] In some embodiments, controlling the temperature regulating device to adjust the temperature of the circulating airflow includes: In heating mode, the heater is controlled to heat the circulating airflow; in cooling mode, the evaporator is controlled to cool the circulating airflow.

[0071] In some implementations, in the heating mode, the plurality of control stages include: In the first stage, the air circulation assembly and the heater are controlled to operate at maximum power; In the second stage, the output ratio of the air circulation component and the heater is determined by proportional-integral-derivative (PID) calculation to stabilize the temperature. In the third stage, the heater is controlled to operate at 10% to 51% of the preset power. In the fourth stage, after the temperature has remained stable for a predetermined period of time, the temperature control compensation module is controlled to switch between hot and cold modes, and the temperature control device is controlled to operate at 1% to 10% of the preset power.

[0072] In some implementations, in the cooling mode, the plurality of control stages include: In the first stage, the air circulation assembly and the variable frequency compressor are controlled to operate at maximum power, and the microchannel condenser and the evaporator control valve are controlled to operate at maximum capacity. In the second stage, the output ratios of the air circulation component, the variable frequency compressor, the microchannel condenser, and the evaporator control valve are determined based on proportional-integral-derivative (PID) calculations to stabilize the temperature. In the third stage, the variable frequency compressor, the microchannel condenser, and the evaporator control valve are controlled to operate at 10% to 51% of the preset power. In the fourth stage, after the temperature has remained stable for a predetermined period of time, the temperature control compensation module is controlled to switch between hot and cold modes, and the variable frequency compressor, the microchannel condenser, and the evaporator control valve are controlled to operate at 1% to 10% of the preset power or capacity.

[0073] Through the four-stage hierarchical control described above, this embodiment constructs a complete process of rapid heating-stable transition-low power consumption maintenance-precise compensation. This strategy not only solves the overshoot problem during the heating process, but also achieves dual optimization of energy consumption and accuracy through the collaborative work of the main device and the compensation module.

[0074] As an example, regarding the underlying logic of semiconductor modules implementing bidirectional switching between hot and cold modes, combined with... Figure 4 The H-bridge commutation circuit consists of four sets of relay contacts (K1~K4) and a DC 24V power supply. The semiconductor module is connected to the H-bridge drive circuit. When heating is required, K1 and K4 are closed, K2 and K3 are open, and current flows through the semiconductor module in the first direction. When cooling is required, K2 and K3 are closed, K1 and K4 are open, and current flows through the semiconductor module in the second direction (opposite to the first direction). The change in current direction causes the semiconductor module to switch between heat absorption and heat release states, thus achieving bidirectional switching between heating and cooling. The dual-channel PID controller corresponds to two independent control loops for heating and cooling, respectively. It can calculate precise control quantities based on the temperature deviation in the stagnation zone, drive the H-bridge circuit, and achieve precise temperature control at the ±0.1℃ level.

[0075] As another example, see Figure 2 This is a schematic diagram of a test chamber provided in an embodiment of this application, wherein 101 is the stirring fan blade of the air circulation assembly; 102 is the heater; 104 is the evaporator; 105 is the air duct; 106 is the internal air circulation path; 107 is the multi-channel temperature and humidity controller; 108 is the evaporator control valve; 109 is the microchannel condenser; 110 is the variable frequency compressor; and 111 is the semiconductor module. This method... Figure 2 In practical applications, the control logic is described as follows: Internal parameter description of the multi-channel temperature and humidity controller: SV: Setpoint; PV: Actual value; T1: Heater 1; T2: Heater 2; H1: Humidifier 1; H2: Humidifier 2; COM1: Variable frequency compressor; COND: Microchannel condenser; SF: Refrigeration adjustable evaporation temperature device (evaporator); PLT: Semiconductor module (the control logic part of the circuit is written as PLD).

[0076] 1. Upon startup, the multi-channel temperature and humidity controller compares the internal parameters (SV and PV) and uses multiple parameter formulas to determine the overall system operating mode: (SV+3℃≥PV≤SV-6℃) constant temperature mode, (SV+3℃<PV) cooling mode, (PV<SV-6℃) heating mode; the same logic can be applied to compare the humidity (SV / PV) values ​​to determine the overall humidity system operating mode. 2. During the initial stage of system operation (heating): Output: 《COM1+COND+T1+T2 / (H1+H2)》*PID*100%; During the initial stage of system operation (cooling): Output: 《COM1+COND+SF》*PID*100% 3. After the system temperature / humidity stabilizes (constant temperature / humidity), the output of each component is calculated according to the preset value of 50% to 100% of the PID of the COM1+COND+SF+T1+T2 / (H1+H2)*PID. 4. After the system temperature / humidity has been continuously stabilized (constant temperature / humidity): 《COM1+COND+SF+T1 / H1》*PID* Each component is calculated and output according to the preset value of 10%~51%; 5. After step 4 stabilizes (constant temperature / humidity): the semiconductor module PLD switches between cooling and heating bidirectionally through the normally open and normally closed contacts of intermediate relays K1 to K4, so that the air duct / inner chamber can achieve precise temperature control within ±0.1℃; the low temperature is combined with the output of each component according to the preset value of 1% to 10% of 《COM1+COND+SF+T1+H1》*PID*.

[0077] In this context, 《 》 represents a control channel group (or control formula), which is the set of all actuators involved in temperature regulation at this stage. "+" is not mathematical addition, but rather indicates multi-channel parallel control—managing these components simultaneously, but each component responds independently according to preset logic. " / " should be understood as "and" or "considering simultaneously," meaning the temperature control loop and humidity control loop operate in parallel. In practical applications, humidity can be disregarded. *PID*100% indicates the full-load output stage—the control quantity calculated by the PID algorithm is output directly to each actuator channel at 100% without attenuation.

[0078] In practical applications, T2 (heater 2) is a high-power / coarse-adjustment heater. It only participates in the initial heating and stable transition periods, providing the large amount of heat required for rapid heating. It completely withdraws after entering the precision temperature control stage to avoid temperature fluctuations caused by high-power heating. T1 (heater 1) is a low-power / fine-adjustment heater. It participates throughout the process and operates alone at low power (10%~51%, or even 1%~10%) during the continuous stable phase. It works in conjunction with the semiconductor module (PLT) to achieve ultra-precise steady-state temperature control of ±0.1℃.

[0079] It should be noted that in the embodiments of this application, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be single or multiple. It is worth noting that "at least one" can also be interpreted as "one or more".

[0080] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are configured to distinguish similar objects and are not necessarily configured to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0081] This application describes the invention from the perspectives of purpose, performance, progress, and novelty, and it meets the functional enhancement and use requirements emphasized by the Patent Law. The above description and drawings are merely preferred embodiments of this application and are not intended to limit this application. Therefore, all structures, devices, features, etc., that are similar to or identical to those of this application, i.e., all equivalent substitutions or modifications made in accordance with the scope of this patent application, shall fall within the scope of protection of this patent application.

Claims

1. A method for temperature field control in a test chamber, characterized in that, The test chamber includes a temperature field control device, which includes: An air circulation component is disposed within the test chamber of the test chamber and configured to generate a circulating airflow within the test chamber; Temperature control equipment is installed in the flow path of the circulating airflow; A temperature control compensation module is disposed in the airflow stagnation area within the test chamber and configured to perform temperature compensation on the airflow stagnation area in a bidirectional switching working mode between hot and cold; wherein, the airflow stagnation area is the region of the test chamber located outside the flow path of the circulating airflow; the temperature control compensation module includes a semiconductor module and a dual-channel PID controller, a portion of the heat exchange plane of the semiconductor module is disposed opposite to the temperature control device, and the dual-channel PID controller is used to control the heating and cooling directions of the semiconductor module; A multi-channel temperature and humidity controller is electrically connected to the air circulation component, the temperature control device, and the dual-channel PID controller via connecting wires. The method includes: The multi-channel temperature and humidity controller receives setting operations; in response to the setting operations, it obtains the target temperature of the test chamber; and it obtains the actual temperature inside the test chamber. Based on the target temperature and the actual temperature, a control strategy is obtained by the multi-channel temperature and humidity controller; the control strategy includes operation mode judgment and multiple control stages determined according to the operation mode; the air circulation component is controlled to operate according to the determined operation mode and its corresponding control stages to form a circulating airflow in the test chamber; the temperature adjustment device is controlled to adjust the temperature of the circulating airflow. When the actual temperature meets the stability conditions of the test chamber, the temperature control compensation module uses a dual-channel PID controller to switch between heating and cooling in both directions, and controls the semiconductor module to perform temperature compensation for the airflow stagnation zone.

2. The temperature field control method according to claim 1, characterized in that, The operation mode determination includes: When the actual temperature is lower than the difference between the target temperature and the first threshold, it is determined to be in heating mode; When the actual temperature is higher than the difference between the target temperature and the second threshold, it is determined to be in cooling mode; When the actual temperature is greater than or equal to the difference between the target temperature and the first threshold, and less than or equal to the sum of the target temperature and the second threshold, it is determined to be in constant temperature mode.

3. The temperature field control method according to claim 2, characterized in that, The test chamber includes a main chamber and an air duct, with a partition between the air duct and the main chamber; the air circulation assembly includes a stirring fan blade located at the air outlet of the air duct; the airflow stagnation zone is the area between the air duct and the main chamber that cannot be directly covered by the airflow; the semiconductor module is elongated and is attached to the partition between the air duct and the main chamber, or embedded in the partition.

4. The temperature field control method according to claim 3, characterized in that, The temperature control device includes an evaporator disposed in the flow path of the circulating airflow, the evaporator being disposed at one end of the air inlet of the air duct, and a portion of the heat exchange plane of the semiconductor module being disposed opposite to one heat exchange plane of the evaporator; the temperature control device also includes a heater disposed between the evaporator and the stirring fan blades in the air duct. The temperature field control device further includes a variable frequency compressor, a microchannel condenser, and an evaporator control valve connected in series in the pipeline of the evaporator; the temperature and humidity multichannel temperature controller is electrically connected to the variable frequency compressor, the microchannel condenser, the evaporator control valve, and the dual-channel PID controller respectively through connecting wires; The control of the temperature regulating device to adjust the temperature of the circulating airflow includes: In heating mode, the heater is controlled to heat the circulating airflow; in cooling mode, the evaporator is controlled to cool the circulating airflow.

5. The temperature field control method according to claim 4, characterized in that, In the heating mode, the multiple control stages include: In the first stage, the air circulation assembly and the heater are controlled to operate at maximum power; In the second stage, the output ratio of the air circulation component and the heater is determined by proportional-integral-derivative (PID) calculation to stabilize the temperature. In the third stage, the heater is controlled to operate at 10% to 51% of the preset power. In the fourth stage, after the temperature has remained stable for a predetermined period of time, the temperature control compensation module is controlled to switch between hot and cold modes, and the temperature control device is controlled to operate at 1% to 10% of the preset power.

6. The temperature field control method according to claim 4, characterized in that, In cooling mode, the multiple control stages include: In the first stage, the air circulation assembly and the variable frequency compressor are controlled to operate at maximum power, and the microchannel condenser and the evaporator control valve are controlled to operate at maximum capacity. In the second stage, the output ratios of the air circulation component, the variable frequency compressor, the microchannel condenser, and the evaporator control valve are determined based on proportional-integral-derivative (PID) calculations to stabilize the temperature. In the third stage, the variable frequency compressor, the microchannel condenser, and the evaporator control valve are controlled to operate at 10% to 51% of the preset power. In the fourth stage, after the temperature has been stable for a predetermined period of time, the temperature control compensation module is controlled to switch between hot and cold modes, and the variable frequency compressor, the microchannel condenser and the evaporator control valve are controlled to operate at 1% to 10% of the preset power or capacity.

7. The temperature field control method according to claim 4, characterized in that, A portion of the semiconductor module is disposed adjacent to the evaporator in the thickness direction of the partition, and another portion of the semiconductor module extends toward the air outlet of the air duct.

8. The temperature field control method according to claim 4, characterized in that, The semiconductor module is installed in the middle region of the airflow stagnation zone in the vertical direction.

9. A temperature field control device, characterized in that, Used to implement the temperature field control method according to any one of claims 1-8.

10. A test chamber, characterized in that, Includes the temperature field control device as described in claim 9.

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