Temperature control device

Abstract

The application provides a temperature control device, which comprises at least two semiconductor refrigerating sheets, each of which has oppositely arranged first and second surfaces, one of which corresponds to the hot end of the semiconductor refrigerating sheet, and the other of which corresponds to the cold end of the semiconductor refrigerating sheet; at least two cold plates, which are arranged in layers, and the semiconductor refrigerating sheets are located between two adjacent cold plates, the at least two cold plates comprise a first cold plate and a second cold plate, the first and second cold plates are arranged alternately, the first cold plate is connected with the first surface, and the second cold plate is connected with the second surface; and a switching assembly, which is connected with each cold plate and is configured to control the on-off state between the first and second cold plates. The temperature control device can meet different working condition requirements, and the structure of the temperature control device is relatively simple.

Description

Technical Field

[0001] This application relates to the field of temperature regulation equipment technology, and in particular to a temperature control device. Background Technology

[0002] Temperature controllers are mainly used in industrial production for high-precision temperature control of liquid media (such as water or oil), such as temperature control of injection molding machine molds.

[0003] In existing technologies, temperature control solutions for mold temperature controllers mainly fall into two categories. One is the resistance heating type: it heats the liquid medium using a resistance wire or PTC heating element, and then uses an air-cooled or water-cooled system to regulate the temperature. This type of solution suffers from low heating efficiency, poor temperature control accuracy, and the inability to actively cool down. The other is the thermoelectric cooler-assisted type: it introduces a thermoelectric cooler (TEC) into a traditional mold temperature controller for auxiliary cooling. The cold end of the TEC cools the liquid medium, while the hot end dissipates heat through air cooling. This type of solution suffers from limited functionality, efficiency constraints, and complex structure. Summary of the Invention

[0004] Based on this, this application provides a temperature control device to address the shortcomings of related technologies.

[0005] The temperature control device provided in this application embodiment includes:

[0006] A thermoelectric cooler has a first surface and a second surface disposed opposite to each other, one of the first surface and the second surface corresponding to the hot end of the thermoelectric cooler and the other corresponding to the cold end of the thermoelectric cooler.

[0007] At least two cold plates are stacked together, and a semiconductor cooling chip is located between two adjacent cold plates. The at least two cold plates include a first cold plate and a second cold plate, which are alternately arranged. The first cold plate is connected to a first surface, and the second cold plate is connected to a second surface.

[0008] A switching component is connected to each cold plate and is configured to control the on / off state between the first cold plate and the second cold plate.

[0009] In one possible implementation, the cold plate includes a first cold plate and two second cold plates, the two second cold plates being located on opposite sides of the first cold plate;

[0010] The first surface corresponds to the hot end of the thermoelectric cooler, and the second surface corresponds to the cold end of the thermoelectric cooler.

[0011] In one possible implementation, the switching component includes a first control valve configured to control the on / off state between the outlet of the device to be temperature controlled and the second cold plate.

[0012] In one possible implementation, the temperature control device further includes a water tank having a water tank outlet and a water tank return outlet, and the first control valve includes a first water inlet, a first water outlet, and a second water outlet.

[0013] The first water inlet is configured to connect to the water outlet of the device to be temperature controlled, the first water outlet is connected to the water return port of the water tank, the second water outlet is connected to the second cold plate, the water outlet of the water tank is connected to the first cold plate, and the first cold plate is configured to connect to the water inlet of the device to be temperature controlled.

[0014] In one possible implementation, both the first inlet and the first outlet are open, while the second outlet is closed, so that the water tank outlet, the first cold plate, the inlet of the temperature-controlled device, and the water tank return outlet are connected in sequence.

[0015] In one possible implementation, the switching component further includes a second control valve connected to the second cold plate and the water tank, and configured to control the on / off state between the second cold plate and the water tank.

[0016] In one possible implementation, the second control valve includes a second inlet, a third outlet, and a fourth outlet. The second cold plate is connected to the second inlet, the third outlet is connected to the water tank, and the fourth outlet is configured to connect to the return water end of the cooling source.

[0017] In one possible implementation, the first inlet, the second outlet, the third outlet, the first outlet, and the fourth outlet are opened, while the fourth outlet is closed, so that the water tank outlet, the first cold plate, the temperature control device, the second cold plate, and the water tank return outlet are connected in sequence.

[0018] In one possible implementation, the temperature control device further includes a third control valve configured to control the on / off state between the second cold plate and the outlet of the cooling source.

[0019] The third control valve, the first inlet, the second outlet, the second inlet, and the third outlet are opened, while the first outlet and the fourth outlet are closed, so that the water tank, the first cold plate, the equipment to be controlled at temperature, and the second cold plate are connected in sequence, and the second cold plate is connected to the cooling source.

[0020] In one possible implementation, the temperature control device further includes a drive pump connected to the water tank outlet and configured to drive the temperature-controlled medium in the water tank into the first cold plate.

[0021] The temperature control device of this application embodiment includes a thermoelectric cooler, a cold plate, and a switching component. The thermoelectric cooler includes a first surface and a second surface, and the cold plate includes a first cold plate and a second cold plate. Since the first surface is connected to the first cold plate and the second surface is connected to the second cold plate, when the first surface corresponds to the cold end of the thermoelectric cooler, the second surface corresponds to the hot end of the thermoelectric cooler. The same thermoelectric cooler can cool the first cold plate and heat the second cold plate, and when the first surface corresponds to the hot end of the thermoelectric cooler, the same thermoelectric cooler can heat the first cold plate and cool the second cold plate. Thus, the hot and cold ends of the thermoelectric cooler can be fully utilized to achieve cooling and heating. Furthermore, the temperature control device can switch the first cold plate and the second cold plate to participate in temperature regulation by switching the switching component, thereby achieving functions such as rapid heating, high-temperature heating, precise temperature control, and rapid cooling. This is beneficial for the temperature control device to cope with different working conditions, and the structure of the temperature control device is also relatively simple.

[0022] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that the temperature control device provided by this application can solve, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific embodiments. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the temperature control device provided in the embodiments of this application;

[0025] Figure 2 This is a schematic diagram of the structure of the semiconductor refrigeration chip and cold plate in the temperature control device provided in the embodiments of this application;

[0026] Figure 3 for Figure 2 Exploded view;

[0027] Figure 4 Another schematic diagram of the semiconductor refrigeration chip and cold plate in the temperature control device provided in the embodiments of this application;

[0028] Figure 5 Another structural schematic diagram of the semiconductor refrigeration chip and cold plate in the temperature control device provided in the embodiments of this application;

[0029] Figure 6 Another schematic diagram of the temperature control device provided in the embodiments of this application;

[0030] Figure 7 This is a schematic diagram illustrating the working principle of the temperature control device provided in the embodiments of this application;

[0031] Figure 8 A schematic diagram illustrating the working principle of the temperature control device in this application during rapid heating;

[0032] Figure 9 for Figure 8 A simplified diagram;

[0033] Figure 10 A schematic diagram illustrating the working principle of the temperature control device in this application during high-temperature heating.

[0034] Figure 11 for Figure 10 A simplified diagram;

[0035] Figure 12 A schematic diagram illustrating the working principle of the temperature control device in this application embodiment when performing rapid cooling or precise temperature control;

[0036] Figure 13 for Figure 12 A simplified diagram.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100 - Semiconductor cooling chip; 110 - First surface; 120 - Second surface;

[0039] 200 - Cold-rolled steel plate; 210 - First cold-rolled steel plate; 220 - Second cold-rolled steel plate;

[0040] 300 - Switching Component;

[0041] 310 - First control valve; 311 - First inlet; 312 - First outlet; 313 - Second outlet;

[0042] 320 - Second control valve; 321 - Second inlet; 322 - Third outlet; 323 - Fourth outlet;

[0043] 330 - Third control valve;

[0044] 400 - Water tank; 410 - Water tank outlet; 420 - Water tank return outlet;

[0045] 500-Drive Pump;

[0046] 600 - Overflow valve;

[0047] 20 - Equipment to be controlled by temperature;

[0048] 30 - Cooling source. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0050] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0052] The terms "first," "second," and "third" (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0053] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or display that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or display.

[0054] In existing technologies, temperature control solutions for mold temperature controllers are mainly divided into two categories. One is the resistance heating type: it heats the liquid medium through resistance wire or PTC heating element, and achieves temperature regulation in conjunction with an air-cooled or water-cooled heat dissipation system. This type of solution has drawbacks such as low heating efficiency, poor temperature control accuracy, and inability to actively cool down. The other is the semiconductor thermoelectric cooler (TEC) assisted type: it introduces a semiconductor thermoelectric cooler (TEC) into a traditional mold temperature controller for auxiliary cooling. The cold end of the TEC cools the liquid medium, while the hot end dissipates heat through air cooling. This type of solution has the following problems: First, since the temperature controller only utilizes the cooling function of the TEC and does not fully utilize its heating capacity, it leads to system redundancy (such as requiring an additional heat dissipation module), resulting in the temperature controller having a single function. Second, since the cooling efficiency of the TEC is closely related to the temperature difference between the cold and hot ends, a large temperature difference under high-temperature conditions causes a sharp drop in cooling efficiency, thus limiting the efficiency of the temperature controller. Third, since the temperature controller requires additional components such as cooling fans and air ducts, it increases the size of the equipment and maintenance costs, and also makes the structure of the temperature controller complex.

[0055] Based on this, this application provides a temperature control device that controls the flow of the temperature control medium in one or both of the first and second cold plates by setting a switching component. This allows the temperature control medium to absorb heat from the thermoelectric cooler, thereby realizing the heating function of the temperature controller, or allows the thermoelectric cooler to absorb heat from the temperature control medium, thereby realizing the cooling function of the temperature controller. Thus, the temperature control device of this embodiment makes full use of the hot end and cold end of the thermoelectric cooler to achieve temperature regulation, thereby simplifying the structure of the temperature control device.

[0056] The specific implementation of the temperature control device provided in this application will be described in detail below with reference to the accompanying drawings.

[0057] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, the temperature control device provided in this application embodiment includes a thermoelectric cooler 100, at least two cold plates 200 and a switching component 300. Each thermoelectric cooler 100 has a first surface 110 and a second surface 120 disposed opposite to each other. One of the first surface 110 and the second surface 120 corresponds to the hot end of the thermoelectric cooler 100, and the other corresponds to the cold end of the thermoelectric cooler 100.

[0058] At least two cold plates 200 are stacked, with a thermoelectric cooler 100 located between two adjacent cold plates 200. Each cold plate 200 includes a first cold plate 210 and a second cold plate 220, which are alternately arranged. The first cold plate 210 is connected to a first surface 110, and the second cold plate 220 is connected to a second surface 120. A switching assembly 300 is connected to each cold plate 200 and configured to control the on / off state between the first cold plate 210 and the second cold plate 220.

[0059] The temperature control device of this embodiment can be used for temperature control of injection molding machine molds, thermal management in semiconductor manufacturing processes, temperature control systems of medical devices, and temperature regulation of precision chemical reactions. In these scenarios, the device requiring temperature control is referred to as the device to be controlled 20. The device to be controlled 20 needs to meet core requirements such as rapid heating, high-temperature heating, precise temperature control, and rapid cooling. Due to the Peltier effect of the thermoelectric cooler 100, when the thermoelectric cooler 100 is working, one side of its thickness direction surface is heated, while the other side of its thickness direction surface is cooled. For ease of explanation, these two surfaces are referred to as the first surface 110 and the second surface 120.

[0060] Alternatively, the first surface 110 may correspond to the hot end of the thermoelectric cooler 100, and the second surface 120 may correspond to the cold end of the thermoelectric cooler 100. Since the first surface 110 is connected to the first cold plate 210, the thermoelectric cooler 100 can heat the first cold plate 210. Since the second surface 120 is connected to the second cold plate 220, the thermoelectric cooler 100 can cool the second cold plate 220.

[0061] The switching component 300 is used to control the flow of the temperature-controlled medium in the first cold plate 210, thereby raising the temperature of the temperature-controlled medium; alternatively, the switching component 300 is used to control the flow of the temperature-controlled medium in the second cold plate 220, thereby lowering the temperature of the temperature-controlled medium; or alternatively, the switching component 300 is used to control the flow of the temperature-controlled medium in both the first cold plate 210 and the second cold plate 220, thereby precisely adjusting the temperature of the temperature-controlled medium. The temperature-controlled medium can be water or oil, etc., and this embodiment of the application does not impose any limitations on this.

[0062] Alternatively, the first surface 110 corresponds to the cold end of the thermoelectric cooler 100, and the second surface 120 corresponds to the hot end of the thermoelectric cooler 100. The first surface 110 is connected to the first cold plate 210, and the thermoelectric cooler 100 can cool the first cold plate 210. The second surface 120 is connected to the second cold plate 220, and the thermoelectric cooler 100 can heat the second cold plate 220.

[0063] The switching component 300 is used to control the flow of the temperature control medium in the first cold plate 210, thereby cooling the temperature control medium; or, the switching component 300 is used to control the flow of the temperature control medium in the second cold plate 220, thereby heating the temperature control medium; or, the switching component 300 is used to control the flow of the temperature control medium in the first cold plate 210 and the second cold plate 220, thereby precisely adjusting the temperature of the temperature control medium.

[0064] In this way, both the hot end and the cold end of the thermoelectric cooler 100 participate in the temperature regulation of the temperature control medium, thereby making full use of the thermoelectric cooler 100 to realize the cooling, heating and precise temperature regulation of the temperature control device. The temperature control device does not have additional components such as cooling fans, thus simplifying the structure of the temperature control device.

[0065] In a specific setup, the number of cold plates 200 is two, three or more. Since the thermoelectric cooler 100 is sandwiched between two adjacent cold plates 200, the thermoelectric cooler 100 is one less than the number of cold plates 200.

[0066] For example, refer to Figure 4 As shown, when there are three cold plates 200, there are two thermoelectric coolers 100. There can be two first cold plates 210 and one second cold plate 220. Along the thickness direction of the cold plates 200, the first cold plates 210, the second cold plates 220 and the first cold plate 210 are stacked in sequence. One thermoelectric cooler 100 is located between the second cold plate 220 and the upper first cold plate 210, and another thermoelectric cooler 100 is located between the second cold plate 220 and the lower first cold plate 210.

[0067] In this way, the second surfaces 120 of the two thermoelectric coolers 100 are both connected to the second cold plate 220, and the second surfaces 120 correspond to the cold ends of the thermoelectric coolers 100, thereby enabling the two thermoelectric coolers 100 to cool the second cold plate 220. The first surfaces 110 correspond to the hot ends of the thermoelectric coolers 100, and the first surfaces 110 of the upper thermoelectric cooler 100 can heat the upper first cold plate 210, and the first surfaces 110 of the lower thermoelectric cooler 100 can heat the lower first cold plate 210.

[0068] For example, refer to Figure 4 As shown, when there are three cold plates 200, there are two thermoelectric coolers 100. There can be two first cold plates 210 and one second cold plate 220. Along the thickness direction of the cold plates 200, the first cold plates 210, the second cold plates 220 and the first cold plate 210 are stacked in sequence. One thermoelectric cooler 100 is located between the second cold plate 220 and the upper first cold plate 210, and another thermoelectric cooler 100 is located between the second cold plate 220 and the lower first cold plate 210.

[0069] In this way, the second surfaces 120 of both thermoelectric coolers 100 are connected to the second cold plate 220, and the second surfaces 120 correspond to the hot ends of the thermoelectric coolers 100, thereby enabling the two thermoelectric coolers 100 to heat the second cold plate 220. The first surfaces 110 correspond to the cold ends of the thermoelectric coolers 100, and the first surfaces 110 of the upper thermoelectric cooler 100 can cool the upper first cold plate 210, and the first surfaces 110 of the lower thermoelectric cooler 100 can cool the lower first cold plate 210.

[0070] For example, refer to Figure 5 As shown, when there are four cold plates 200, there are three thermoelectric coolers 100, and two first cold plates 210 and two second cold plates 220. Along the thickness direction of the cold plates 200, the first cold plates 210, the second cold plates 220, the first cold plates 210 and the second cold plates 220 are stacked in sequence. The thermoelectric cooler 100 is sandwiched between adjacent first cold plates 210 and second cold plates 220. The first surface 110 corresponds to the cold end of the thermoelectric cooler 100, and the second surface 120 corresponds to the hot end of the thermoelectric cooler 100.

[0071] For example, refer to Figure 5 As shown, when there are four cold plates 200, there are three thermoelectric coolers 100, and two first cold plates 210 and two second cold plates 220. Along the thickness direction of the cold plates 200, the first cold plates 210, the second cold plates 220, the first cold plates 210 and the second cold plates 220 are stacked in sequence. The thermoelectric cooler 100 is sandwiched between adjacent first cold plates 210 and second cold plates 220. The first surface 110 corresponds to the hot end of the thermoelectric cooler 100, and the second surface 120 corresponds to the cold end of the thermoelectric cooler 100.

[0072] The temperature control device in this application embodiment includes a semiconductor cooling chip 100, a cold plate 200, and a switching component 300. The semiconductor cooling chip 100 includes a first surface 110 and a second surface 120, and the cold plate 200 includes a first cold plate 210 and a second cold plate 220. Since the first surface 110 is connected to the first cold plate 210 and the second surface 120 is connected to the second cold plate 220, when the first surface 110 corresponds to the cold end of the thermoelectric cooler 100, the second surface 120 corresponds to the hot end of the thermoelectric cooler 100. The same thermoelectric cooler 100 can cool the first cold plate 210 and heat the second cold plate 220 respectively. When the first surface 110 corresponds to the hot end of the thermoelectric cooler 100, the same thermoelectric cooler 100 can heat the first cold plate 210 and cool the second cold plate 220 respectively. Thus, the cold and hot ends of the thermoelectric cooler 100 can be fully utilized to achieve cooling and heating. Furthermore, the temperature control device can switch the switching component 300 to enable one or both of the first cold plate 210 and the second cold plate 220 to participate in temperature regulation, thereby achieving functions such as rapid heating, high-temperature heating, precise temperature control, and rapid cooling. This is beneficial for the temperature control device to cope with different working conditions, and the structure of the temperature control device is also relatively simple.

[0073] In some embodiments, the temperature control device may further include a temperature sensor and a flow sensor. The temperature sensor is used to detect the temperature of the cold plate 200 and the thermoelectric cooler 100, and the flow sensor is used to detect the flow rate of the cold plate 200. Thus, the power of the thermoelectric cooler 100 and the flow rate of the cold plate 200 can be adjusted according to different operating modes.

[0074] Reference Figure 2 As shown, in one possible implementation, at least three cold plates 200 include a first cold plate 210 and two second cold plates 220, with the two second cold plates 220 located on opposite sides of the first cold plate 210. The first surface 110 corresponds to the hot end of the thermoelectric cooler 100, and the second surface 120 corresponds to the cold end of the thermoelectric cooler 100.

[0075] In other words, in this configuration, the second cold plate 220, the first cold plate 210, and the second cold plate 220 are stacked sequentially along the thickness direction of the cold plate 200. One semiconductor cooling chip 100 is located between the first cold plate 210 and the upper second cold plate 220, and another semiconductor cooling chip 100 is located between the first cold plate 210 and the lower second cold plate 220.

[0076] The first surfaces 110 of the two thermoelectric coolers 100 are both connected to the first cold plate 210, thereby enabling the two thermoelectric coolers 100 to heat the first cold plate 210. The second surface 120 of the upper thermoelectric cooler 100 can cool the upper second cold plate 220, and the second surface 120 of the lower thermoelectric cooler 100 can cool the lower second cold plate 220.

[0077] Thus, when the switching component 300 controls the temperature control medium to circulate between the second cold plate 220 and the device to be controlled 20, the temperature control device can be applied to the working condition of rapid heating. When the switching component 300 controls the temperature control medium to circulate between the first cold plate 210, the second cold plate 220 and the device to be controlled 20, the temperature control device can be applied to the working condition of high-temperature heating.

[0078] Reference Figure 1 , Figure 6 , Figure 7 As shown, in some embodiments, the switching component 300 includes a first control valve 310 configured to control the on / off state between the outlet of the temperature-controlled device 20 and the second cold plate 220.

[0079] Understandably, during use, the temperature control medium circulates between the temperature control device and the device 20 to be temperature controlled. The first cold plate 210 is connected to the device 20 to be temperature controlled, and the second cold plate 220 can be selectively connected to the device 20 to be temperature controlled.

[0080] That is, by controlling the water outlet of the device to be temperature controlled 20 to be connected to the second cold plate 220 through the first control valve 310, the temperature control medium is circulated between the first cold plate 210, the second cold plate 220 and the device to be temperature controlled 20, thereby reducing the temperature difference between the first surface 110 and the second surface 120, thereby enabling the semiconductor cooling chip 100 to reach a higher heating temperature, thereby heating the temperature control medium to a higher temperature, which is beneficial for the device to be temperature controlled 20 to achieve high-temperature heating.

[0081] Alternatively, the water outlet of the device to be temperature controlled 20 can be disconnected from the second cold plate 220 by the first control valve 310, thereby allowing the temperature control medium to circulate between the first cold plate 210 and the device to be temperature controlled 20, and thus the temperature control medium can be rapidly heated by the first cold plate 210, which is beneficial for the device to be temperature controlled 20 to achieve rapid heating.

[0082] Continue to refer to Figure 1 , Figure 6 , Figure 7 As shown, in one possible implementation, the temperature control device further includes a water tank 400, which has a water tank outlet 410 and a water tank return outlet 420. The first control valve 310 includes a first inlet 311, a first outlet, and a second outlet.

[0083] The first inlet 311 is configured to be connected to the outlet of the device to be temperature controlled 20, the first outlet 312 is connected to the return outlet 420 of the water tank, the second outlet 313 is connected to the second cold plate 220, the water tank outlet 410 is connected to the first cold plate 210, and the first cold plate 210 is configured to be connected to the inlet of the device to be temperature controlled 20.

[0084] It is understandable that the temperature control medium of the temperature control device is provided by the water tank 400 and output from the first cold plate 210 to the device to be controlled 20. The temperature control medium of the device to be controlled 20 returns to the temperature control device from the first water inlet 311. For ease of understanding, the water path that passes through the first cold plate 210 and provides the temperature control medium to the device to be controlled 20 is called the main water path, and the water path that passes through the second cold plate 220 is called the auxiliary water path. By adjusting the opening and closing state of the first water outlet 312 and the second water outlet 313, the on and off state of the first cold plate 210 and the second cold plate 220 can be controlled, thereby realizing the connection or disconnection of the main water path and the auxiliary water path.

[0085] Reference Figure 8 , Figure 9 As shown, in some embodiments, the first inlet 311 and the first outlet 312 are both open, and the second outlet 313 is closed, so that the water tank outlet 410, the first cold plate 210, the inlet of the temperature control device 20 and the water tank return outlet 420 are connected in sequence.

[0086] In other words, under rapid heating conditions, the first control valve 310 can be controlled to open the first inlet 311 and the first outlet 312, so that the first control valve 310 connects the inlet of the device to be controlled 20 and the return outlet 420 of the water tank, and the second outlet 313 can be controlled to close, so that the first control valve 310 disconnects the outlet of the device to be controlled 20 and the second cold plate 220, thereby disconnecting the main water circuit from the auxiliary water circuit. After the temperature control medium flows back from the device to be controlled 20, the first cold plate 210 can heat the temperature control medium that flows back from the device to be controlled 20. The temperature control medium circulates continuously between the water tank outlet 410, the first cold plate 210, the water inlet of the device to be controlled 20, and the water tank return outlet 420. Through water circuit switching and temperature difference control between the hot and cold ends, the heating efficiency of the semiconductor cooling chip 100 can reach 1.5-1.6, which can achieve rapid heating. Therefore, this working mode is suitable for rapid heating in low-temperature areas and is relatively energy-efficient.

[0087] Reference Figure 1 , Figure 6 , Figure 7As shown, in one possible implementation, the switching component 300 further includes a second control valve 320, which is connected to the second cold plate 220 and the water tank 400 and is configured to control the on / off state between the second cold plate 220 and the water tank 400.

[0088] Thus, the second control valve 320 can control the second cold plate 220 to disconnect from the water tank 400, thereby disconnecting the auxiliary water circuit from the main water circuit, and thus rapidly heating, rapidly cooling, or precisely controlling the temperature of the temperature-controlled medium. Alternatively, the second control valve 320 can control the second cold plate 220 to connect with the water tank 400, thereby coupling the auxiliary water circuit and the main water circuit, and thus heating the temperature-controlled medium at high temperature.

[0089] Reference Figure 7 As shown, in some embodiments, the second control valve 320 includes a second inlet 321, a third outlet 322 and a fourth outlet 323. The second cold plate 220 is connected to the second inlet 321, the third outlet 322 is connected to the water tank 400, and the fourth outlet 323 is configured to be connected to the return water end of the cooling source 30.

[0090] It should be noted that, in order to cope with the working conditions of rapid cooling or precise temperature control, the auxiliary water circuit needs to introduce a cooling temperature control medium. Therefore, the temperature control device in this embodiment can also be connected to an external cooling source 30 to provide a cooling temperature control medium for the second cold plate 220 through the cooling source 30. Excess temperature control medium can be returned to the cooling source 30.

[0091] Reference Figure 10 , Figure 11 As shown, in one possible implementation, the first inlet 311, the second outlet 313, the second inlet 321, and the third outlet 322 are opened, while the first outlet 312 and the fourth outlet 323 are closed, so that the water tank outlet 410, the first cold plate 210, the temperature control device 20, the second cold plate 220, and the water tank return outlet 420 are connected in sequence.

[0092] In this way, during high-temperature heating, the main water circuit and the auxiliary water circuit are connected, and the cooling source 30 is not introduced. That is, the first control valve 310 controls the second cold plate 220 to be connected to the outlet of the device to be temperature controlled 20, and the first control valve 310 controls the outlet of the device to be temperature controlled 20 to be disconnected from the water tank 400. The second control valve 320 controls the second cold plate 220 to be disconnected from the return water of the cooling source 30, and the second control valve 320 controls the second cold plate 220 to be connected to the water tank 400. This allows the first cold plate 210 and the second cold plate 220 to be connected, and the temperature control medium circulates between the water tank 400, the first cold plate 210, the device to be temperature controlled 20, and the second cold plate 220, thereby reducing the temperature difference between the first cold plate 210 and the second cold plate 220, and thus reducing the temperature difference between the first surface 110 and the second surface 120. This allows the semiconductor cooling chip 100 to achieve a greater heating power, thereby heating the temperature control medium to a relatively high temperature and achieving precise temperature control.

[0093] For example, both the first control valve 310 and the second control valve 320 can be two-position three-way solenoid valves.

[0094] Reference Figure 7 , Figure 12 , Figure 13 As shown, in one possible implementation, the temperature control device further includes a third control valve 330, which is configured to control the on / off state between the second cold plate 220 and the outlet of the cooling source 30, and the third control can prevent the temperature control medium from flowing back to the outlet of the cooling source 30.

[0095] The third control valve 330, the first water inlet 311, the second water outlet 313, the second water inlet 321, and the third water outlet 322 are opened, while the first water outlet 312 and the fourth water outlet 323 are closed, so that the water tank 400, the first cold plate 210, the temperature control device 20, and the second cold plate 220 are connected in sequence, and the second cold plate 220 is connected to the cooling source 30.

[0096] Thus, in the case of rapid cooling or precise temperature control, the main water circuit and the auxiliary water circuit are connected, and the cooling source 30 is introduced. That is, the first control valve 310 controls the second cold plate 220 to be connected to the outlet end of the device to be temperature controlled 20, the first control valve 310 controls the outlet end of the device to be temperature controlled 20 to be disconnected from the water tank 400, the second control valve 320 controls the second cold plate 220 to be disconnected from the return end of the cooling source 30, and the second control valve 320 controls the second cold plate 220 to be connected to the water tank 400, thereby connecting the first cold plate 210 and the second cold plate 220, and the third control valve 330 controls the second cold plate 220 to be connected to the inlet end of the cooling source 30.

[0097] In this way, the temperature control medium circulates between the water tank 400, the first cold plate 210, the device to be temperature controlled 20, and the second cold plate 220, thereby effectively reducing the temperature difference between the first cold plate 210 and the second cold plate 220, and thus reducing the temperature difference between the first surface 110 and the second surface 120. A large amount of cooling temperature control medium is introduced to compensate for the insufficient cooling of the semiconductor refrigeration chip 100, thereby achieving rapid cooling. Alternatively, a small amount of cooling temperature control medium can be introduced to adjust the power of the first cold plate 210 and the second cold plate 220, thereby achieving fine temperature control with an accuracy of up to 0.1℃.

[0098] Reference Figure 1 , Figure 7 As shown, in some embodiments, the temperature control device further includes a drive pump 500, which is connected to the water tank outlet 410 and configured to drive the temperature-controlled medium in the water tank 400 into the first cold plate 210. With this configuration, the drive pump 500 can drive the temperature-controlled medium to circulate along the main water path or along the auxiliary water path.

[0099] For example, the drive pump 500 may include a hydraulic pump or a hydraulic motor.

[0100] Reference Figure 6 As shown, in some embodiments, the temperature control device is also provided with an overflow valve 600, which is located between the drive pump 500 and the first cold plate 210. The overflow valve 600 can play the role of stabilizing pressure and overflowing, and providing safety protection.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A temperature control device, characterized in that, include: A thermoelectric cooler (100) has a first surface (110) and a second surface (120) disposed opposite to each other, one of the first surface (110) and the second surface (120) corresponding to the hot end of the thermoelectric cooler (100) and the other corresponding to the cold end of the thermoelectric cooler (100); At least two cold plates (200) are stacked together, and the semiconductor cooling chip (100) is located between two adjacent cold plates (200). The at least two cold plates (200) include a first cold plate (210) and a second cold plate (220). The first cold plate (210) and the second cold plate (220) are alternately arranged. The first cold plate (210) is connected to the first surface (110), and the second cold plate (220) is connected to the second surface (120). A switching component (300) is connected to each of the cold plates (200) and is configured to control the on / off state between the first cold plate (210) and the second cold plate (220).

2. The temperature control device according to claim 1, characterized in that, The cold plate (200) includes a first cold plate (210) and two second cold plates (220), with the two second cold plates (220) located on opposite sides of the first cold plate (210); The first surface (110) corresponds to the hot end of the semiconductor cooling chip (100), and the second surface (120) corresponds to the cold end of the semiconductor cooling chip (100).

3. The temperature control device according to claim 1 or 2, characterized in that, The switching assembly (300) includes a first control valve (310) configured to control the on / off state between the outlet of the temperature-controlled device (20) and the second cold plate (220).

4. The temperature control device according to claim 3, characterized in that, It also includes a water tank (400), which has a water tank outlet (410) and a water tank return outlet (420), and the first control valve (310) includes a first inlet (311), a first outlet (312) and a second outlet (313); The first inlet (311) is configured to be connected to the outlet of the device to be temperature controlled (20), the first outlet (312) is connected to the return outlet (420) of the water tank, the second outlet (313) is connected to the second cold plate (220), the water tank outlet (410) is connected to the first cold plate (210), and the first cold plate (210) is configured to be connected to the inlet of the device to be temperature controlled (20).

5. The temperature control device according to claim 4, characterized in that, The first inlet (311) and the first outlet (312) are both open, and the second outlet (313) is closed, so that the water tank outlet (410), the first cold plate (210), the water inlet of the temperature control device (20) and the water tank return outlet (420) are connected in sequence.

6. The temperature control device according to claim 4, characterized in that, The switching assembly (300) further includes a second control valve (320) connected to the second cold plate (220) and the water tank (400), and configured to control the on / off state between the second cold plate (220) and the water tank (400).

7. The temperature control device according to claim 6, characterized in that, The second control valve (320) includes a second inlet (321), a third outlet (322) and a fourth outlet (323). The second cold plate (220) is connected to the second inlet (321), the third outlet (322) is connected to the water tank (400), and the fourth outlet (323) is configured to be connected to the return end of the cooling source (30).

8. The temperature control device according to claim 7, characterized in that, The first water inlet (311), the second water outlet (313), the second water inlet (321), and the third water outlet (322) are opened, while the first water outlet (312) and the fourth water outlet (323) are closed, so that the water tank outlet (410), the first cold plate (210), the temperature control device (20), the second cold plate (220), and the water tank return outlet (420) are connected in sequence.

9. The temperature control device according to claim 7, characterized in that, It also includes a third control valve (330) configured to control the on / off state between the second cold plate (220) and the outlet of the cooling source (30); The third control valve (330), the first inlet (311), the second outlet (313), the second inlet (321), and the third outlet (322) are opened, while the first outlet (312) and the fourth outlet (323) are closed, so that the water tank (400), the first cold plate (210), the temperature control device (20), and the second cold plate (220) are connected in sequence, and the second cold plate (220) is connected to the cooling source (30).

10. The temperature control device according to claim 4, characterized in that, It also includes a drive pump (500) connected to the water tank outlet (410) and configured to drive the temperature-controlled medium in the water tank (400) into the first cold plate (210).

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