Heat dissipation structure and server

Abstract

The application relates to a heat dissipation structure and a server. The heat dissipation structure comprises a substrate, an electronic component, a heat dissipation member and an air guide member. The electronic component is assembled on the substrate. The heat dissipation member is assembled on the side of the electronic component away from the substrate. The heat dissipation member is provided with a heat dissipation air duct for dissipating heat of the electronic component. The width of the heat dissipation member is smaller than the width of the substrate. The air guide member comprises a mounting part and at least one air guide baffle part. The mounting part is fixed to the substrate. The mounting part comprises a main plate part arranged on the side of the heat dissipation member away from the electronic component and two side plate parts arranged on the opposite sides of the main plate part. The side plate parts are bent and connected to the main plate part. The side plate parts are located on one side of the heat dissipation member. The air guide baffle part is connected to the side plate part and at least partially arranged on the adjacent side of the air inlet end of the heat dissipation air duct. The air guide baffle part can at least block the airflow from flowing through the adjacent side of the heat dissipation air duct. The heat dissipation structure can balance the heat dissipation efficiency and the overall production cost of the electronic equipment.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and in particular to heat dissipation structures and servers. Background Technology

[0002] In some electronic devices such as servers, the internal electronic components generate a large amount of heat during operation. To ensure that these components operate stably and reliably within their allowable operating temperatures and to extend their lifespan, heat dissipation structures are used to promptly remove and dissipate this heat into the surrounding environment. Air cooling is one of the most widely used heat dissipation methods due to its simple structure, low cost, and ease of maintenance.

[0003] However, the size of the heat dissipation structure is mainly constrained by the heat output of the electronic components and their own physical dimensions. A common practice is to customize a heat sink based on the heat generated by the electronic component. However, this often results in the heat sink being much smaller than the substrate used to support or fix the electronic component. This leads to greater resistance and less airflow when cooling air passes through the heat sink, preventing the heat from being fully dissipated and resulting in lower-than-expected heat dissipation efficiency, thus limiting further improvements in the performance of the electronic components.

[0004] To address the aforementioned issues, an intuitive approach is to increase the size of the heatsink so that it fills the entire substrate or airflow space on the airflow projection surface, thus forcing all cooling air to flow through the heatsink. However, this method would undoubtedly significantly increase the size and weight of the heatsink, leading to higher production costs. Summary of the Invention

[0005] Therefore, it is necessary to provide a heat dissipation structure that can balance the heat dissipation efficiency and production cost in order to address the above problems.

[0006] This application provides a heat dissipation structure, including:

[0007] substrate;

[0008] Electronic components are assembled on the substrate;

[0009] A heat sink is mounted on the side of the electronic component facing away from the substrate. The heat sink has a heat dissipation channel for cooling the electronic component, and the width of the heat sink is smaller than the width of the substrate.

[0010] An air guide component includes a mounting portion and at least one air guide baffle portion. The mounting portion is fixed to the substrate and includes a main board portion disposed on the side of the heat sink away from the electronic components, and two side plate portions disposed on opposite sides of the main board portion. The side plate portions are bent and connected to the main board portion and are located on one side of the heat sink. The air guide baffle portion is connected to the side plate portions and is at least partially disposed on the adjacent side of the air inlet end of the heat dissipation duct. The air guide baffle portion is at least capable of blocking airflow from flowing through the adjacent side of the heat dissipation duct.

[0011] In one embodiment, the air guide further includes a mounting portion fixed to the substrate, and the mounting portion includes a main board portion disposed on the side of the heat sink away from the electronic components, and two side plate portions disposed on opposite sides of the main board portion. The side plate portions are bent and connected to the main board portion and located on one side of the heat sink, and the air guide baffle portion is connected to the side plate portions.

[0012] In one embodiment, the side plate portion is provided with a first flange that bends toward the heat sink portion on the side away from the main board portion. The first flange is sandwiched between the heat sink portion and the substrate, and the substrate, the first flange and the heat sink portion are fastened together by a first fastener.

[0013] In one embodiment, the side plate portion has an extension portion at one end near the air inlet end, and the extension portion is bent relative to the side plate portion to form the air guide baffle portion.

[0014] In one embodiment, at least one of the motherboard portion and the side plate portion is provided with a plurality of protrusions extending toward the heat sink, and the plurality of protrusions are arranged in an array on the motherboard portion and / or the side plate portion.

[0015] In one embodiment, at least one of the motherboard portion and the side plate portion protrudes in a direction close to the heat sink to form the protrusion.

[0016] In one embodiment, the air guide baffle portion has a second flange on the side facing the substrate, and the substrate and the second flange are fastened together by a second fastener.

[0017] In one embodiment, the air guide baffle includes a guide section and a baffle section connected to each other. The baffle section is located on the side adjacent to the air inlet end of the heat dissipation duct, and the guide section is located on the front side of the air inlet end for guiding airflow to the middle of the air inlet end.

[0018] In one embodiment, the air guide baffle is inclined, and the distance from the baffle to the heat sink increases in the direction away from the air inlet.

[0019] In one embodiment, the air guide is made of an insulating material; and / or,

[0020] The air guide component is made of polyethylene terephthalate or polycarbonate.

[0021] This application also provides a server, including the heat dissipation structure described above.

[0022] The aforementioned heat dissipation structure includes a substrate, electronic components, a heat sink, and an air guide. The electronic components are mounted on the substrate. The heat sink is mounted on the side of the electronic components facing away from the substrate. The heat sink has a heat dissipation channel for cooling the electronic components, and the width of the heat sink is smaller than the width of the substrate. The air guide includes at least one air guide baffle, which is at least partially located on the adjacent side of the air inlet of the heat dissipation channel and can at least block airflow from flowing through the adjacent side of the heat dissipation channel. This allows the air guide baffle to directly block the airflow that was originally intended to flow through the gaps on the side of the heat sink, forcing most or even all of the cooling airflow into the interior of the heat dissipation channel, reducing the possibility of airflow bypassing the heat sink, increasing the airflow through the heat sink, and thus enhancing the heat dissipation effect. Compared to directly increasing the size of the heat sink, this solution only adds a simple air guide without significantly increasing the overall structure of the heat sink, helping to control the overall weight and production cost, while effectively improving heat dissipation efficiency, thus balancing heat dissipation efficiency and production cost. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a heat dissipation structure in the prior art.

[0024] Figure 2 This is a schematic diagram of the heat dissipation structure in one embodiment of this application.

[0025] Figure 3 This is a schematic diagram of the structure of the air guide before bending in one embodiment of this application.

[0026] Figure 4 This is a schematic diagram of an angle structure of the air guide component in one embodiment of this application.

[0027] Figure 5 This is a schematic diagram of the air guide component from another angle in one embodiment of this application.

[0028] Figure 6 This is a schematic diagram of an angled assembly structure of the air guide and heat dissipation component in one embodiment of this application.

[0029] Figure 7 This is a schematic diagram of the assembly structure of the air guide and heat dissipation component from another angle in one embodiment of this application.

[0030] Figure 8This is a schematic diagram of the heat dissipation structure in another embodiment of this application.

[0031] Figure 9 This is a schematic diagram of the heat dissipation structure in another embodiment of this application.

[0032] Figure label:

[0033] 1. Heat dissipation structure; 2. Substrate; 3. Electronic components; 4. Heat sink; 41. Heat dissipation duct; 5. Air guide; 51. Air guide baffle; 511. Second flange; 512. Air guide section; 513. Air baffle section; 52. Mounting section; 521. Main board section; 522. Side plate section; 523. First flange; 524. Extension section; 525. Protrusion; 6. First fastener; 7. Second fastener;

[0034] 10. Substrate; 20. Electronic components; 30. Heat sink. Detailed Implementation

[0035] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0036] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0041] In electronic devices, especially high-power-density communication equipment, servers, and graphics processors, electronic components 20 (such as CPUs, ASICs, power modules, and chip modules) generate a large amount of heat during operation. To ensure the stable and reliable operation of electronic components 20 within their permissible operating temperatures and to extend their lifespan, an effective heat dissipation structure must be employed to promptly remove and dissipate this heat into the surrounding environment. Air cooling is one of the most widely used heat dissipation methods due to its simple structure, low cost, and ease of maintenance. Its basic principle is that cooling air flows across the surface of the heat sink 30, and convection heat transfer removes the heat absorbed by the heat sink 30 from the electronic components 20.

[0042] However, in existing designs, the size of the heat sink 30 is primarily constrained by the heat dissipation power (heat flux density) of the electronic components 20 and their own physical dimensions. A common practice is to refer to... Figure 1A heat sink 30 is "tailor-made" for the electronic component 20 based on its heat generation, and the base size of the heat sink 30 matches the size of the electronic component 20. This makes the size of the entire heat sink 30 much smaller than the size of the circuit board (PCB) or substrate 10 or housing used to support the electronic component 20, resulting in the flow area of ​​the heat dissipation channel formed by the heat sink 30 being much smaller than the flow area of ​​the airflow channel formed by the corresponding circuit board (PCB) or substrate 10 or housing. While this design saves materials and reduces weight, it introduces a significant problem in the air-cooling system: when the cooling airflow flows into the heat dissipation channel formed by the heat sink 30, the flow area of ​​the heat dissipation channel is much smaller than the flow area of ​​the entire airflow channel (the airflow channel is nested within the heat dissipation channel, and the flow area of ​​the airflow channel is determined by the circuit board, substrate 10, or housing where the electronic component 20 is located), and the air resistance at the heat dissipation channel is much greater than the air resistance at other parts of the airflow channel, such as the air resistance on the adjacent sides of the heat dissipation channel. According to fluid dynamics principles, the local wind speed flowing through the heat dissipation channel will be significantly reduced, and the airflow will easily "detour" or "leak" from the open area around the heat sink 30 where the resistance is lower. As a result, only a portion of the cooling air effectively penetrates the heat dissipation channel for heat exchange, while a considerable portion of the airflow fails to play its role, forming a "short-circuit flow." This results in the heat sink 30 not being able to be fully dissipated, and the heat dissipation efficiency is lower than theoretically expected, thus restricting further improvement in the performance of the electronic component 20.

[0043] To address the aforementioned issues, a straightforward approach is to increase the size of the heat sink 30, allowing it to fill the entire substrate 10 or airflow channel on the airflow projection surface, thus forcing all cooling air to flow through the heat sink. However, this method undoubtedly increases the volume and weight of the heat sink 30 significantly. Especially when the heat sink 30 uses expensive heat sink fin materials (such as aluminum or copper), it leads to a sharp increase in production costs, making it unacceptable in many cost-sensitive applications.

[0044] In view of this, this application proposes a heat dissipation structure 1, which can balance heat dissipation efficiency and production cost.

[0045] See Figure 2 , Figure 2The diagram shows a schematic of the heat dissipation structure 1 in one embodiment of this application. The heat dissipation structure 1 provided in one embodiment of this application includes a substrate 2, electronic components 3, a heat sink 4, and an air guide 5. The electronic components 3 are mounted on the substrate 2. The heat sink 4 is mounted on the side of the electronic components 3 away from the substrate 2. The heat sink 4 is provided with a heat dissipation channel 41 for dissipating heat from the electronic components 3, and the width of the heat sink 4 is smaller than the width of the substrate 2. The air guide 5 includes at least one air guide baffle portion 51. The air guide baffle portion 51 is at least partially disposed on the adjacent side of the air inlet end of the heat dissipation channel 41, and is at least able to block the airflow from flowing through the adjacent side of the heat dissipation channel 41.

[0046] The electronic component 3 can be a chip, such as a CPU, GPU, or power chip, or a module integrating multiple electronic components, or some power devices; this application does not impose specific limitations on this. The substrate 2 can be configured as a circuit board, or as a device housing, mounting plate, or other support structure; this application does not impose specific limitations on this. The heat sink 4 is fixed to the side of the electronic component 3 away from the substrate 2, thereby dissipating heat from the electronic component 3. Specifically, the heat sink 4 can be a finned heat sink 4 formed by multiple heat sink fins arranged in sequence. The gaps between adjacent heat sink fins form a small heat dissipation channel 41 for airflow, thereby utilizing the contact between the airflow and the heat sink fins to exchange heat and dissipate the heat generated by the electronic component 3. Furthermore, the width of the heat sink 4 is smaller than the width of the substrate 2, meaning that the heat sink 4 does not fill the entire space of the substrate 2 in the width direction (which is roughly perpendicular to the airflow direction). Therefore, an open airflow channel is left on the adjacent side of the heat sink 4, that is, the side in the width direction. The air resistance in this area is much smaller than the resistance in the heat dissipation channel 41, which can easily lead to airflow short-circuiting and leakage. As a result, the heat of the heat sink 4 cannot be fully dissipated, which in turn leads to the actual heat dissipation efficiency of the electronic component 3 being lower than the theoretical expectation, affecting the overall performance of the electronic component 3.

[0047] To reduce this issue, an air guide 5 is provided, which includes at least one air guide baffle 51. The air guide baffle 51 is located on the adjacent side of the air inlet of the heat dissipation duct 41, that is, in the gap between the side of the heat sink 4 and the side of the substrate 2. This allows the air guide baffle 51 to directly block the airflow that was originally intended to flow through the gap on the side of the heat sink 4, forcing most or even all of the cooling airflow into the heat dissipation duct 41. This reduces the possibility of airflow bypassing the heat sink 4, increases the airflow through the heat sink 4, and thus enhances the heat dissipation effect. Moreover, compared to directly increasing the size of the heat sink 4, this solution only adds a simple air guide 5, without significantly increasing the overall structure of the heat sink 4. This helps control the overall weight and production cost, while effectively improving heat dissipation efficiency, thus balancing heat dissipation performance and production cost.

[0048] It should be noted that the air guide baffle 51 is located on the adjacent side of the air inlet end of the heat dissipation duct 41, that is, at the corner position between the air inlet side of the heat sink 4 and its adjacent side, and is connected to the heat sink 4. In this way, the airflow can be guided and blocked before it enters the area where the heat dissipation duct 41 is located, to prevent the airflow from being diverted into the side gap in advance, further improve the effect of air guiding and blocking, and ensure that more airflow can enter the heat dissipation duct 41 to participate in heat exchange.

[0049] When the electronic component 3 is fixed on one side of the substrate 2 in the width direction, that is, one side of the electronic component 3 is flush with the side edge of the substrate 2 and the other side has a gap, the air-cooled airflow can easily flow through the gap on the other side. Therefore, the air guide baffle 51 can be provided only on the adjacent side of the other side of the air inlet end of the heat dissipation air duct 41. When the electronic component 3 is arranged more centrally on the substrate 2, that is, there are gaps on both sides of the electronic component 3, the air guide baffle 51 can be provided on the adjacent sides of the air inlet end of the heat dissipation air duct 41 respectively.

[0050] The air guide component 5 is made of insulating material, thereby improving the safety of the electronic device and reducing the possibility of accidental short circuits. The air guide component 5 can be made of sheet metal with insulation treatment, or it can be made directly of insulating material, thus ensuring structural strength while adapting to different installation scenarios and reducing manufacturing difficulty. The air guide component 5 can be snapped onto the heat sink 4, or connected to the substrate 2 by adhesive or screwing, without altering the basic structure of the original heat sink 4 and substrate 2, facilitating the modification and upgrading of existing equipment and enhancing its adaptability.

[0051] The heat dissipation structure 1 can be applied to the heat dissipation of computing chips inside the server, thereby improving airflow utilization within the limited internal space of the server. This improves chip heat dissipation without increasing the overall size and weight of the server, ensuring stable operation over extended periods. Optionally, the air guide 5 is made of polyethylene terephthalate or polycarbonate. These insulating plastic materials are inexpensive, can be molded in a single injection molding process, and are easy to bend into any shape according to actual needs. This allows for effective airflow control while minimizing the overall material and processing costs of the heat dissipation structure 1.

[0052] To facilitate the installation of the air guide 5, in some embodiments of this application, reference is made to... Figures 2 to 7The air guide 5 also includes a mounting portion 52, which is fixed to the substrate 2. The mounting portion 52 includes a main board portion 521 located on the side of the heat sink 4 away from the electronic components 3, and two side plate portions 522 located on opposite sides of the main board portion 521. The side plate portions 522 are bent and connected to the main board portion 521 and are located on one side of the heat sink 4. The air guide baffle portion 51 is connected to the side plate portions 522. Specifically, the air guide baffle portion 51 is connected to the mounting portion 52, and the mounting portion 52 is fixed to the substrate 2, thereby fixing the air guide baffle portion 51 to the substrate 2. No additional structural adjustments are required to the heat sink 4 itself, making installation more convenient and avoiding additional processing costs for the heat sink 4. The mounting part 52 includes a main board part 521 located on the side of the heat sink 4 away from the electronic component 3, and two side plate parts 522 located on opposite sides of the main board part 521. In other words, the main board part 521 is located on the top of the heat sink 4, and the two side plate parts 522 are bent from both sides of the main board part 521 and extend to both sides of the width direction of the heat sink 4. That is, the air guide 5 is covered by the heat dissipation structure 1, thereby ensuring the fixed stability of the air guide 5, and thus ensuring the installation stability of the air guide baffle part 51, and ensuring the wind-blocking effect of the air guide baffle part 51.

[0053] The main board portion 521 can abut against the top surface of the heat sink 4 away from the electronic component 3, or it can be spaced apart from the top surface of the heat sink 4. Two side plates 522 extend along both sides of the heat sink 4. An air guide baffle 51 is positioned at the air inlet of the side plates 522. The structure is stable, easy to install, and can simultaneously block gaps on both sides, making it suitable for applications where the electronic component 3 is centrally located on the substrate 2. The main board portion 521 can be integrally formed with the side plates 522, and the air guide 5 can be formed by bending, resulting in low processing costs and sufficient structural strength to meet usage requirements. Alternatively, in other embodiments, the main board portion 521 and the side plates 522 can be bonded together or fixed using fasteners.

[0054] Furthermore, the side plate portion 522, away from the main board portion 521, has a first flange 523 that bends towards the heat sink 4. The first flange 523 is sandwiched between the heat sink 4 and the substrate 2, and the substrate 2, the first flange 523, and the heat sink 4 are fastened together by a first fastener 6. Specifically, the side plate portion 522, away from the air guide baffle portion 51, has a first flange 523. The first flange 523 is bent and extends towards the substrate 2, so that the first flange 523 is sandwiched between the heat sink 4 and the substrate 2. This not only provides a positioning and engaging function for the heat sink 4 during installation, but also ensures the stability of the installation portion 52.

[0055] Furthermore, the first fastener 6 is securely connected to the substrate 2, the first flange 523, and the heat sink 4, thereby simultaneously achieving the fixed installation of both the air guide 5 and the heat sink 4 to the substrate 2. This eliminates the need for separate fabrication of installation structures, and the installation of the air guide 5 can be completed simultaneously with the installation and fixation of the heat sink 4, reducing installation steps and improving assembly efficiency. Of course, in other embodiments, the substrate 2 and the heat sink 4 can also be connected using the first fastener 6, with the first flange 523 snap-fitted or adhesively connected to the heat sink 4. Other installation and fixation methods can also be used, and this application does not limit this approach.

[0056] The first flange 523 can also be integrally formed on the side plate portion 522. That is, the mounting portion 52, the side plate portion 522, and the first flange 523 can be formed by bending them sequentially via the air guide 5, without the need for additional splicing. This simplifies processing, increases structural strength, reduces the likelihood of deformation and breakage, and ensures a longer service life. The first fastener 6 can specifically be a common fixing structure such as a screw or bolt. This application does not impose specific restrictions here, as long as a stable connection can be achieved.

[0057] Of course, in some other embodiments, see [reference] Figure 8 The air guide 5 further includes a mounting portion 52, which includes two side plate portions 522 disposed on opposite sides of the main board portion 521. The two side plate portions 522 can be directly fixedly connected to one side of the heat sink 4. The air guide baffle portion 51 is connected to the side plate portions 522. The two side plate portions 522 can be fixed to the heat sink 4 by a first fastener 6. Alternatively, a first flange 523 can be provided on the side of the side plate portion 522 facing the substrate 2. The first flange 523 is bent and connected to the side plate portion 522. The first flange 523 is sandwiched between the heat sink 4 and the substrate 2. The first fastener 6 is fastened to the substrate 2, the first flange 523, and the heat sink 4.

[0058] To facilitate the stable fixing of the air guide baffle portion 51, the air guide baffle portion 51 and the mounting portion 52 can be integrally formed. For example, see [reference needed]. Figures 2 to 8 The side plate portion 522 has an extension portion 524 near the air inlet end. The extension portion 524 is bent relative to the side plate portion 522 to form the air guide baffle portion 51. Specifically, the extension portion 524 can be regarded as a part of the side plate portion 522 located at the air inlet end of the heat dissipation duct 41, that is, a part of the side plate portion 522 protruding from the heat sink 4. Thus, the air guide baffle portion 51 is formed directly by bending the extension portion of the side plate portion 522, without the need for additional splicing and installation. The processing and forming are simple, the structure is stable, and there is no additional processing cost. At the same time, it can ensure the windproof sealing of the air guide baffle portion 51, reduce the leakage of airflow from the connection gap between the air guide baffle portion 51 and the side plate portion 522, and ensure the air guiding and blocking effect.

[0059] In this embodiment, the air guide 5 is an integrally bent structure that can be directly bent from a single sheet of material to obtain the required shape. It is easy to process, has low production costs, high overall structural strength, requires no additional splicing, and is suitable for mass production.

[0060] To further ensure the stable installation of the air guide baffle 51 and reduce the possibility of accidental deflection of the air guide baffle 51, in some embodiments of this application, see [reference needed]. Figures 2 to 8 The air guide baffle portion 51 has a second flange 511 on the side facing the substrate 2, and a second fastener 7 is fastened to the substrate 2 and the second flange 511. Specifically, the second flange 511 is formed by bending and extending from the bottom end of the air guide baffle portion 51 towards the substrate 2, and can fit against the surface of the substrate 2. The second flange 511 is then directly fastened to the substrate 2 by the second fastener 7, which is equivalent to additionally fixing the air guide baffle portion 51 from the bottom end. This prevents the air guide baffle portion 51 from shaking or deforming under airflow impact when it is only connected by the side plate portion 522, ensuring that the air guide baffle portion 51 always remains in the preset blocking position, improving the overall stability of the structure and the reliability of the air guiding effect. The second fastener 7 can be a commonly used fastener such as screws or bolts, which is compatible with existing installation processes and does not require additional adjustments to the processing flow.

[0061] In some embodiments of this application, the air guide baffle 51 includes a guide section 512 and a baffle section 513 connected to each other. The baffle section 513 is located on the adjacent side of the air inlet end of the heat dissipation duct 41, and the guide section 512 is located on the front side of the air inlet end, for guiding airflow to the middle of the air inlet end. Specifically, if only the baffle section 513 is provided (see... Figure 9The airflow on the opposite sides of the air intake side of the heat sink 4 will flow to the opposite sides of the heat sink 4 under the guidance of the wind deflector 513. Under the Coanda effect, the sides of the heat sink 41 will quickly reach the heat dissipation limit. And because the wind speed on the sides of the heat sink 41 is very fast, the airflow near the middle area of ​​the heat sink 4 will be carried to the sides (Bernoulli principle), which causes the wind speed in the middle area of ​​the heat sink 4 to be lower than the original uniform air intake state, resulting in uneven wind speed in the entire heat sink 41. The heat dissipation effect in the middle area does not meet expectations, and there is still room for improvement in the overall heat dissipation efficiency. With the additional air guide section 512, the air guide section 512 can extend closer to the middle of the heat sink 4, allowing the air guide section 512 to directly guide the airflow blocked by the wind baffle section 513 on both sides to the middle area of ​​the air inlet of the heat sink duct 41. This forms a buffer rectification area between the two extension sections 524. The airflow on the opposite sides of the air inlet side of the heat sink 4 collides and mixes in this buffer rectification area before being evenly blown towards the heat sink duct 41. This fundamentally balances the problem of large differences in airflow velocity between the two sides and the middle area of ​​the heat sink 4. It not only prevents airflow leakage from the side gaps but also balances the airflow distribution at the air inlet of the entire heat sink duct 41, allowing more airflow to flow into the heat sink duct 41 in the middle of the heat sink 4. This makes the airflow distribution of the heat sink duct 41 in each area of ​​the entire heat sink 4 more uniform, further improving the overall heat dissipation efficiency and better ensuring the overall heat dissipation effect of the electronic component 3. Of course, in other embodiments, the air guide baffle portion 51 may only include the air blocking portion 513, which is located on the adjacent side of the air inlet end of the heat dissipation air duct 41.

[0062] Among them, see Figures 2 to 8 The air guide section 512 can be integrally bent with the air baffle section 513 without additional splicing processing. The structure is simple, the processing difficulty is low, and it will not increase the production cost. In actual processing, the extension section 524 can be bent away from the heat sink 4 first, and then bent towards the heat sink 4. The two sections bent in sequence are at least partially overlapped to form the air baffle section 513. The free end of the extension section 524 extends into the area between the two extension sections 524 to form the air guide section 512.

[0063] Optionally, the air guide baffle 51 is inclined, and the distance from the baffle to the heat sink 4 increases in the direction away from the air inlet end; that is, the air guide baffle 51 is inclined outward as a whole, so that the air inlet end of the heat dissipation air duct 41 is flared, so that the air guide baffle 51 can better guide the lateral airflow, gradually guide the airflow to the air inlet area of ​​the heat dissipation air duct 41, reduce the possibility of the airflow directly impacting the baffle and causing turbulence when the air guide baffle is vertically set, reduce the resistance of airflow, and allow more airflow to flow smoothly into the heat dissipation air duct 41, further improving the air guiding and rectification effect.

[0064] Reference Figures 2 to 7 Because the air guide 5 is housed within the heat dissipation duct 41, if the surface of the air guide 5 is planar, when airflow passes through the heat dissipation duct 41, due to Bernoulli's principle, the airflow may flow along the inner surface of the air guide 5, resulting in insufficient airflow entering the heat dissipation duct 41 for heat dissipation, thus wasting cooling airflow. To improve this situation, in some embodiments of this application, the main board portion 521 and the side plate portion 522 are provided with multiple protrusions 525 protruding towards the heat dissipation component 4, and the multiple protrusions 525 are arranged in an array in the main board portion 521 and / or the side plate portion 522. The protrusions 525 can disrupt the planar structure of the inner surface of the air guide 5, reducing the continuous flow of air along the inner surface, allowing more airflow to enter the airflow between the heat dissipation fins to participate in heat exchange, further improving airflow utilization and enhancing the heat dissipation effect. At the same time, the protrusions 525 can also improve the overall structural strength of the air guide 5, reduce the probability of deformation of the air guide 5 due to airflow impact, and extend the service life of the air guide 5.

[0065] The protrusion 525 can be provided only on the main board portion 521, or it can be provided on both the main board portion 521 and the side plate portion 522. The protrusion 525 can be integrally formed on the corresponding position of the air guide 5 by stamping or injection molding, which is simple to process and does not add too much processing cost. For example, at least one of the main board portion 521 and the side plate portion 522 is partially raised towards the heat sink 4 to form the protrusion 525. The protrusion height of the protrusion 525 can be adjusted according to the actual distance between the air guide 5 and the heat sink 4, as long as it does not structurally interfere with the heat sink 4, and this application does not make specific limitations here.

[0066] This application also proposes a server, which includes a heat dissipation structure. The specific structure of the heat dissipation structure is as described in the above embodiments. Since this server adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: substrate; Electronic components are assembled on the substrate; A heat sink is mounted on the side of the electronic component facing away from the substrate. The heat sink has a heat dissipation channel for cooling the electronic component, and the width of the heat sink is smaller than the width of the substrate. An air guide component includes a mounting portion and at least one air guide baffle portion. The mounting portion is fixed to the substrate and includes a main board portion disposed on the side of the heat sink away from the electronic components, and two side plate portions disposed on opposite sides of the main board portion. The side plate portions are bent and connected to the main board portion and are located on one side of the heat sink. The air guide baffle portion is connected to the side plate portions and is at least partially disposed on the adjacent side of the air inlet end of the heat dissipation duct. The air guide baffle portion is at least capable of blocking airflow from flowing through the adjacent side of the heat dissipation duct.

2. The heat dissipation structure according to claim 1, characterized in that, The side plate portion away from the main board portion has a first flange that bends toward the heat sink. The first flange is sandwiched between the heat sink and the substrate. The substrate, the first flange and the heat sink are fastened together by a first fastener.

3. The heat dissipation structure according to claim 1, characterized in that, The side plate portion has an extension portion at one end near the air inlet end, and the extension portion is bent relative to the side plate portion to form the air guide baffle portion.

4. The heat dissipation structure according to claim 1, characterized in that, At least one of the main board portion and the side plate portion is provided with a plurality of protrusions protruding toward the heat sink, and the plurality of protrusions are arranged in an array on the main board portion and / or the side plate portion.

5. The heat dissipation structure according to claim 4, characterized in that, At least one of the main board portion and the side plate portion protrudes in a direction close to the heat sink to form the convex portion.

6. The heat dissipation structure according to claim 1, characterized in that, The air guide baffle is provided with a second flange on the side facing the base plate, and the base plate and the second flange are fastened together by a second fastener.

7. The heat dissipation structure according to claim 1, characterized in that, The air guide baffle includes an air guide section and an air baffle section connected to each other. The air baffle section is located on the side adjacent to the air inlet end of the heat dissipation air duct, and the air guide section is located on the front side of the air inlet end, for guiding the airflow to the middle of the air inlet end.

8. The heat dissipation structure according to claim 1, characterized in that, The air guide baffle is inclined, and the distance from the baffle to the heat sink increases in the direction away from the air inlet.

9. The heat dissipation structure according to any one of claims 1 to 8, characterized in that, The air guide component is made of insulating material; and / or, The air guide component is made of polyethylene terephthalate or polycarbonate.

10. A server, characterized in that, Includes the heat dissipation structure as described in any one of claims 1 to 9.

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