Processor liquid cooling mechanism for a server

CN122593591APending Publication Date: 2026-08-18YUNKE (SHANDONG) ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202610785357.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-02
Publication Date
2026-08-18

AI Technical Summary

Technical Problem

[0003]现有液冷系统通常仅依靠冷却液的自然流动或强制循环来带走热量,忽略了冷却液在受热过程中会析出气泡并粘附于散热板表面的物理现象;由于缺乏主动、有效的气泡清除机制,这些气泡会逐渐在散热板表面聚集,形成一层阻碍热量传递的“气膜热阻”,这层气膜显著降低了散热板与冷却液之间的实际热交换效率,导致处理器产生的热量无法被及时、高效地传导给冷却液,从而造成处理器局部温度升高,冷却效果下降

Benefits of technology

1.通过液冷盒、冷凝机组与循环管路的配合,利用冷却液持续带走散热板上的热量,实现了对处理器的有效降温;

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Abstract

The application relates to the technical field of processor heat dissipation, and discloses a liquid cooling mechanism for a processor of a server, which comprises a liquid cooling box close to the processor and a condensing unit, liquid inlet covers and liquid outlet covers are fixedly installed at the top of the two ends of the liquid cooling box respectively, liquid inlet pipes and liquid outlet pipes which are in communication with each other are fixedly installed between the liquid inlet covers and the liquid outlet covers and the condensing unit, and the liquid cooling mechanism further comprises a plurality of heat dissipation plates which are fixedly installed on the inner wall of the liquid cooling box, a plurality of scraping frames which are installed between two adjacent heat dissipation plates and are used for scraping bubbles adhered to the surface of the heat dissipation plates, and a moving mechanism which is used for driving the scraping frames to move longitudinally and reciprocally. The liquid cooling mechanism drives the impeller by using the flow of the cooling liquid, and then drives the scraping frames to move up and down, automatically scrapes the bubbles adhered to the surface of the heat dissipation plates, solves the problem that the heat conduction is hindered due to the bubbles generated by the cooling liquid under the action of heat, and significantly improves the heat exchange efficiency of the heat dissipation plates.
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Description

Technical Field

[0001] This invention relates to the field of processor heat dissipation technology, and more particularly to a liquid cooling mechanism for a server processor. Background Technology

[0002] Liquid cooling is a heat dissipation method for electronic devices that absorbs and dissipates heat generated by the device through the circulation of liquid. Compared to traditional fan cooling, liquid cooling can more effectively reduce device temperature, and is quieter and more stable. Commonly used liquids include substances with good thermal conductivity such as water and ethylene glycol. It is widely used in high-end computers, servers, and other fields to improve system performance and extend device life.

[0003] Existing liquid cooling systems typically rely solely on the natural flow or forced circulation of coolant to remove heat, neglecting the physical phenomenon that coolant precipitates bubbles and adheres to the surface of the heat sink during heating. Due to the lack of an active and effective bubble removal mechanism, these bubbles gradually accumulate on the surface of the heat sink, forming a "film thermal resistance" layer that hinders heat transfer. This film significantly reduces the actual heat exchange efficiency between the heat sink and the coolant, causing the heat generated by the processor to be unable to be transferred to the coolant in a timely and efficient manner, resulting in a local increase in processor temperature and a decrease in cooling effect. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a liquid cooling mechanism for server processors.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A liquid cooling mechanism for a server processor includes a liquid cooling box and a condenser unit that are closely attached to the processor. An inlet shroud and an outlet shroud are respectively and fixedly installed through the top of both ends of the liquid cooling box. An inlet pipe and an outlet pipe that communicate with each other are fixedly installed between the inlet shroud and the outlet shroud and the condenser unit. The mechanism also includes: A plurality of heat dissipation plates are uniformly and fixedly installed on the inner wall of the liquid cooling box; Several scraping frames are installed between two adjacent heat sinks to remove air bubbles adhering to the surface of the heat sinks. A moving mechanism is used to drive the scraper frame to move longitudinally and reciprocally.

[0006] As a further embodiment of the present invention, the moving mechanism includes a fixed plate fixedly installed on the inner wall of the top of each scraper frame, a lifting rod fixedly installed at the top of the fixed plate, a connecting plate fixedly installed between the tops of multiple lifting rods, and a driving assembly installed between the connecting plate and the liquid inlet pipe.

[0007] As a further embodiment of the present invention, a liquid pushing mechanism is installed on the inner side of the scraper frame. The liquid pushing mechanism includes a sliding groove that extends through the outer surfaces of opposite sides of the scraper frame. A C-shaped frame is slidably installed on the inner wall of the sliding groove. A liquid pushing plate is rotatably installed on the inner wall of the C-shaped frame. A guide assembly is installed between the C-shaped frame and the heat sink.

[0008] As a further embodiment of the present invention, the guide assembly includes a spring rod fixedly installed at the end of the C-shaped frame, and a closed-loop guide groove adapted to the telescopic end of the spring rod is provided on the outer surface of the heat sink plate. The telescopic end of the spring rod is slidably installed with the inner wall of the closed-loop guide groove.

[0009] As a further embodiment of the present invention, the closed-loop guide groove is composed of a stretching section groove, a springback section groove, and a lifting section groove connected end to end, and a limiting groove is formed on the inner wall of the starting end of the stretching section groove.

[0010] As a further embodiment of the present invention, multiple elastic ropes are fixedly installed between the C-shaped frame and the inner wall of the scraper frame near the liquid inlet pipe.

[0011] As a further embodiment of the present invention, the driving assembly includes a support base fixedly installed on the top of the liquid cooling box, with a rotating shaft rotatably installed through both ends of the support base, a turntable fixedly installed at one end of the rotating shaft, a swivel pin fixedly installed on the outer surface of the turntable, and a rectangular groove through the side of the connecting plate, with the swivel pin slidably installed on the inner wall of the rectangular groove.

[0012] As a further embodiment of the present invention, a rotating drum is fixedly installed through the outer surface of the inlet pipe, an impeller is rotatably installed on the inner wall of the rotating drum, the inlet of the inlet pipe corresponds to the blade of the impeller, and a transmission assembly is installed between the impeller and the rotating shaft.

[0013] As a further embodiment of the present invention, the transmission assembly includes transmission wheels that are respectively fixedly installed on the impeller and the rotation center of the shaft, and a transmission belt is sleeved between the outer surfaces of the two transmission wheels.

[0014] The beneficial effects of this invention are as follows: 1. By combining the liquid cooling box, condenser unit and circulation pipeline, the coolant continuously removes heat from the heat sink, thus achieving effective cooling of the processor; 2. The impeller is driven by the flow of coolant, which in turn drives the scraper frame to move up and down, automatically scraping away the air bubbles adhering to the surface of the heat sink. This solves the problem of heat conduction being hindered by air bubbles generated when the coolant is heated, and significantly improves the heat exchange efficiency of the heat sink. 3. By scraping the C-shaped frame and pushing the liquid plate together, while removing air bubbles, the coolant that has absorbed heat in the liquid cooling box is actively pushed to the side of the liquid outlet pipe. This helps to discharge the heated coolant in a timely manner, reduce its mixing with the subsequently entering low-temperature coolant, ensure the stratification and rapid renewal of hot and cold liquids, and thus maintain a stable cooling effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a liquid cooling mechanism for a server processor according to the present invention. Figure 2 This is a schematic diagram of the liquid cooling box structure of a server processor liquid cooling mechanism proposed in this invention; Figure 3 This is a schematic diagram of the internal structure of the liquid cooling box of a server processor liquid cooling mechanism proposed in this invention; Figure 4 This is a schematic diagram of the connection plate structure of the processor liquid cooling mechanism of a server proposed in this invention; Figure 5 This is a schematic diagram of the scraper frame structure of a server processor liquid cooling mechanism proposed in this invention; Figure 6 This is a schematic diagram of the liquid-push plate structure of the liquid cooling mechanism for the processor of a server proposed in this invention. Figure 7 This is a schematic diagram of the heat sink structure of a liquid cooling mechanism for a server processor according to the present invention. Figure 8 This is a schematic diagram of the internal structure of the rotating drum of a server processor liquid cooling mechanism proposed in this invention. Figure 9 for Figure 2 Enlarged view of the structure at point A in the middle; Figure 10 for Figure 7 Enlarged view of the structure at point B in the middle.

[0016] In the diagram: 1. Liquid cooling box; 2. Condensing unit; 3. Liquid inlet pipe; 4. Liquid outlet pipe; 5. Liquid inlet cover; 6. Liquid outlet cover; 7. Heat sink plate; 8. Scraper frame; 9. Lifting rod; 10. Connecting plate; 11. Fixing plate; 12. Slide groove; 13. C-shaped frame; 14. Push plate; 15. Spring rod; 16. Elastic rope; 17. Closed-loop guide groove; 171. Tension section groove; 172. Rebound section groove; 173. Lifting section groove; 174. Limiting groove; 18. Drum; 19. Impeller; 20. Rotating shaft; 21. Support base; 22. Turntable; 23. Dial column; 24. Rectangular groove; 25. Transmission wheel; 26. Transmission belt. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0018] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0019] See attached document Figure 1 -Appendix Figure 10 A liquid cooling mechanism for a server processor includes a liquid cooling box 1 and a condenser unit 2 that are tightly attached to the processor. An inlet shroud 5 and an outlet shroud 6 are fixedly installed through the top of both ends of the liquid cooling box 1. An inlet pipe 3 and an outlet pipe 4, respectively, are fixedly installed between the inlet shroud 5 and the outlet shroud 6 and the condenser unit 2, respectively, and are mutually connected. In use, the liquid cooling box 1 is pressed tightly against the processor surface, allowing it to absorb the heat generated by the processor during operation. Coolant is continuously circulated into the liquid cooling box 1 through the condenser unit 2, the inlet pipe 3, and the outlet pipe 4, enabling the coolant to dissipate heat from the heat sink 7 inside the liquid cooling box 1, thereby achieving a cooling effect on the processor. The mechanism also includes: Several heat dissipation plates 7 are evenly fixedly installed on the inner wall of the liquid cooling box 1; Several scraper frames 8 are installed between two adjacent heat sink plates 7 to scrape off air bubbles adhering to the surface of the heat sink plate 7. The moving mechanism is used to drive the scraper frame 8 to move longitudinally back and forth.

[0020] In this embodiment, the moving mechanism includes a fixed plate 11 fixedly installed on the inner wall of the top of each scraper frame 8. A lifting rod 9 is fixedly installed on the top of the fixed plate 11. A connecting plate 10 is fixedly installed between the tops of multiple lifting rods 9. A driving assembly is installed between the connecting plate 10 and the liquid inlet pipe 3. The driving assembly includes a support base 21 fixedly installed on the top of the liquid cooling box 1. A rotating shaft 20 is rotatably installed through both ends of the support base 21. A turntable 22 is fixedly installed at one end of the rotating shaft 20. A paddle is fixedly installed on the outer surface of the turntable 22. 23. A rectangular groove 24 is provided through the side of the connecting plate 10. The pusher 23 is slidably installed on the inner wall of the rectangular groove 24. A rotating drum 18 is fixedly installed through the outer surface of the liquid inlet pipe 3. An impeller 19 is rotatably installed on the inner wall of the rotating drum 18. The liquid inlet of the liquid inlet pipe 3 corresponds to the blade of the impeller 19. A transmission assembly is installed between the impeller 19 and the rotating shaft 20. The transmission assembly includes transmission wheels 25 that are fixedly installed at the rotation center of the impeller 19 and the rotating shaft 20 respectively. A transmission belt 26 is sleeved between the outer surfaces of the two transmission wheels 25.

[0021] When the coolant in the inlet pipe 3 flows into the liquid cooling box 1, the flow of coolant will drive the impeller 19 to rotate, so that the impeller 19 drives the rotating shaft 20 to rotate through the transmission wheel 25 and the transmission belt 26, so that the rotating shaft 20 drives the turntable 22 to rotate. Since the pin 23 installed on the turntable 22 is inserted into the rectangular slot 24 opened on the connecting plate 10, the turntable 22 will drive the connecting plate 10 to move up and down through the pin 23 when it rotates, so that the connecting plate 10 can drive the scraper 8 to move up and down through the lifting rod 9, so that the scraper 8 can scrape off the air bubbles adhering to the surface of the heat sink 7, and avoid the air bubbles precipitated by the coolant due to heat adhering to the surface of the heat sink 7, which would affect the heat conduction effect of the heat sink 7.

[0022] In this embodiment, a liquid pushing mechanism is installed on the inner side of the scraper frame 8. The liquid pushing mechanism includes a sliding groove 12 that runs through the outer surfaces of opposite sides of the scraper frame 8. A C-shaped frame 13 is slidably installed on the inner wall of the sliding groove 12. A liquid pushing plate 14 is rotatably installed on the inner wall of the C-shaped frame 13. A guide component is installed between the C-shaped frame 13 and the heat sink 7.

[0023] When the scraper frame 8 moves downward, it will drive the C-shaped frame 13 to move downward, so that the C-shaped frame 13 moves towards the liquid outlet pipe 4 under the guidance of the spring rod 15 installed at the end and the tension section groove 171 (at this time, the elastic rope 16 is stretched), so that the C-shaped frame 13 can drive the pusher plate 14 to push the heat-absorbing coolant towards one end of the liquid outlet pipe 4, so that the heated coolant is discharged from the liquid cooling box 1 as much as possible, reducing the mixing with the subsequent coolant and ensuring the cooling effect of the subsequent coolant on the heat sink 7.

[0024] In this embodiment, the guide assembly includes a spring rod 15 fixedly installed at the end of the C-shaped frame 13. A closed-loop guide groove 17, adapted to the telescopic end of the spring rod 15, is formed on the outer surface of the heat sink 7. The telescopic end of the spring rod 15 is slidably installed against the inner wall of the closed-loop guide groove 17. The closed-loop guide groove 17 is composed of a stretching section groove 171, a rebound section groove 172, and a lifting section groove 173 connected end-to-end. A limiting groove 174 is formed on the inner wall of the starting end of the stretching section groove 171, creating a stepped structure between the starting end of the stretching section groove 171 and the ending end of the lifting section groove 173. The ending end of the limiting groove 174 is sloped. When the scraper frame 8 moves the C-shaped frame 13 upward, the end of the spring rod 15 is inserted into it, ensuring that the spring rod 15 can only move along the stretching section groove 171, thereby stabilizing the movement path of the C-shaped frame 13; the starting end of the rebound section groove 172 is deeper than the depth of the stretching section groove 171, so that the starting end of the rebound section groove 172 and the ending end of the stretching section groove 171 form a step, so that the end of the spring rod 15 can only move along the rebound section groove 172 after entering the rebound section groove 172 from the stretching section groove 171; multiple elastic ropes 16 are fixedly installed between the C-shaped frame 13 and the inner wall of the scraper frame 8 near the liquid inlet pipe 3.

[0025] As the C-frame 13 is pushed, the pusher plate 14 will also slowly descend, so that when the C-frame 13 is pushed to the spring section groove 172, the pusher plate 14 is in a horizontal state, so that the stretched elastic rope 16 can pull the pusher plate 14 to the lifting section groove 173 through the C-frame 13, thus preventing the pusher plate 14 from pushing the coolant back. When the scraper frame 8 moves the C-frame 13 upward to the limiting groove 174, the end of the spring rod 15 will penetrate into the limiting groove 174, ensuring that the end of the spring rod 15 can only move within the stretching section groove 171, thus ensuring the stability of the movement path of the C-frame 13.

[0026] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects: When in use, the liquid cooling box 1 is pressed against the surface of the processor so that the liquid cooling box 1 absorbs the heat generated by the processor when it is working. Coolant is continuously injected into the liquid cooling box 1 through the condenser unit 2, the inlet pipe 3 and the outlet pipe 4, so that the coolant can carry the heat of the heat sink 7 inside the liquid cooling box 1, thereby achieving the cooling effect on the processor. When the coolant in the inlet pipe 3 flows into the liquid cooling box 1, the flow of coolant will drive the impeller 19 to rotate, so that the impeller 19 drives the rotating shaft 20 to rotate through the transmission wheel 25 and the transmission belt 26, and the rotating shaft 20 drives the turntable 22 to rotate. Since the pin 23 installed on the turntable 22 is inserted into the rectangular slot 24 opened on the connecting plate 10, the turntable 22 will drive the connecting plate 10 to move up and down through the pin 23 when it rotates, so that the connecting plate 10 can drive the scraper 8 to move up and down through the lifting rod 9, so that the scraper 8 can scrape off the air bubbles adhering to the surface of the heat sink 7, and avoid the air bubbles precipitated by the coolant due to heat adhering to the surface of the heat sink 7, which would affect the heat conduction effect of the heat sink 7. When the scraper frame 8 moves downward, it will drive the C-shaped frame 13 to move downward, so that the C-shaped frame 13 moves towards the liquid outlet pipe 4 under the guidance of the spring rod 15 installed at the end and the tension section groove 171 (at this time, the elastic rope 16 is stretched), so that the C-shaped frame 13 can drive the pusher plate 14 to push the heat-absorbing coolant towards one end of the liquid outlet pipe 4, so that the heated coolant is discharged from the liquid cooling box 1 as much as possible, reducing the mixing with the subsequent coolant, and ensuring the cooling effect of the subsequent coolant on the heat sink 7; As the C-frame 13 is pushed, the pusher plate 14 will also be driven to slowly descend, so that when the C-frame 13 is pushed to the springback groove 172, the pusher plate 14 is in a horizontal state, so that the stretched elastic rope 16 can pull the pusher plate 14 to the lifting groove 173 through the C-frame 13, thus preventing the pusher plate 14 from pushing the coolant back. When the scraper frame 8 moves the C-shaped frame 13 upward to the limiting groove 174, the end of the spring rod 15 will penetrate into the limiting groove 174, ensuring that the end of the spring rod 15 can only move within the tension section groove 171, thus ensuring the stability of the C-shaped frame 13's movement path.

[0027] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A liquid cooling mechanism for a server processor, comprising a liquid cooling box (1) in close contact with the processor and a condenser unit (2), characterized in that, The liquid cooling box (1) has an inlet hood (5) and an outlet hood (6) fixedly installed at the top of both ends, respectively. The inlet hood (5) and the outlet hood (6) are respectively fixedly installed with an inlet pipe (3) and an outlet pipe (4) that are mutually connected to the condenser unit (2). The box also includes: Several heat dissipation plates (7) are uniformly fixedly installed on the inner wall of the liquid cooling box (1); Several scraping frames (8) are installed between two adjacent heat sinks (7) to scrape off air bubbles adhering to the surface of the heat sinks (7); The moving mechanism is used to drive the scraper frame (8) to move longitudinally back and forth.

2. The liquid cooling mechanism for a server processor according to claim 1, characterized in that, The moving mechanism includes a fixed plate (11) fixedly installed on the inner wall of the top of each scraper frame (8), a lifting rod (9) fixedly installed on the top of the fixed plate (11), a connecting plate (10) fixedly installed between the tops of multiple lifting rods (9), and a driving assembly installed between the connecting plate (10) and the liquid inlet pipe (3).

3. The liquid cooling mechanism for a server processor according to claim 2, characterized in that, A liquid pushing mechanism is installed on the inner side of the scraper frame (8). The liquid pushing mechanism includes a sliding groove (12) that runs through the outer surfaces of opposite sides of the scraper frame (8). A C-shaped frame (13) is slidably installed on the inner wall of the sliding groove (12). A liquid pushing plate (14) is rotatably installed on the inner wall of the C-shaped frame (13). A guide assembly is installed between the C-shaped frame (13) and the heat sink (7).

4. The liquid cooling mechanism for a server processor according to claim 3, characterized in that, The guide assembly includes a spring rod (15) fixedly installed at the end of the C-shaped frame (13). The outer surface of the heat sink (7) is provided with a closed-loop guide groove (17) adapted to the telescopic end of the spring rod (15). The telescopic end of the spring rod (15) is slidably installed with the inner wall of the closed-loop guide groove (17).

5. The liquid cooling mechanism for a server processor according to claim 4, characterized in that, The closed-loop guide groove (17) is composed of a stretching section groove (171), a springback section groove (172), and a lifting section groove (173) connected end to end.

6. The liquid cooling mechanism for a server processor according to claim 5, characterized in that, Multiple elastic ropes (16) are fixedly installed between the C-shaped frame (13) and the inner wall of the scraper frame (8) near the liquid inlet pipe (3).

7. The liquid cooling mechanism for a server processor according to claim 2, characterized in that, The drive assembly includes a support base (21) fixedly installed on the top of the liquid cooling box (1). A rotating shaft (20) is rotatably installed through both ends of the support base (21). A turntable (22) is fixedly installed at one end of the rotating shaft (20). A swivel post (23) is fixedly installed on the outer surface of the turntable (22). A rectangular groove (24) is opened through the side of the connecting plate (10). The swivel post (23) is slidably installed on the inner wall of the rectangular groove (24).

8. The liquid cooling mechanism for a server processor according to claim 7, characterized in that, A rotating drum (18) is fixedly installed through the outer surface of the inlet pipe (3). An impeller (19) is rotatably installed on the inner wall of the rotating drum (18). The inlet of the inlet pipe (3) corresponds to the blade of the impeller (19). A transmission assembly is installed between the impeller (19) and the rotating shaft (20).

9. The liquid cooling mechanism for a server processor according to claim 8, characterized in that, The transmission assembly includes transmission wheels (25) that are fixedly installed at the rotation center of the impeller (19) and the shaft (20), respectively, and a transmission belt (26) is sleeved between the outer surfaces of the two transmission wheels (25).

10. The liquid cooling mechanism for a server processor according to claim 5, characterized in that, A limiting groove (174) is provided on the inner wall of the starting end of the stretching section groove (171).