Heat dissipation assembly and electronic device

Abstract

The application discloses a heat dissipation assembly and an electronic device, and belongs to the technical field of electronic devices. The electronic device comprises a frame assembly, a mainboard assembly and a battery assembly which are installed in the frame assembly, the mainboard assembly extends along a first direction, the battery assembly comprises a battery protection plate, the battery protection plate extends along a second direction, and the heat dissipation assembly comprises a metal heat dissipation plate which is installed in the frame assembly, wherein the metal heat dissipation plate comprises a main heat dissipation plate segment and an auxiliary heat dissipation plate segment, the position of the main heat dissipation plate segment corresponds to the position of the mainboard assembly, and the position of the auxiliary heat dissipation plate segment corresponds to the position of the battery protection plate. Heat originally concentrated in the mainboard area is dispersed to a larger area, the heat flow density is reduced, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a heat dissipation component and electronic equipment. Background Technology

[0002] As the performance of high-end tablets continues to improve, the power consumption of components such as chips and motherboards has increased significantly, leading to increasingly serious problems such as concentrated heat generation and excessive temperature rise, which severely affect the stability and lifespan of the devices.

[0003] Currently, the mainstream heat dissipation solutions in the tablet industry are divided into two categories: passive heat dissipation and active heat dissipation. Both adopt composite thermal conductive structures such as thermal conductive gel / silicone grease, VC, and graphite, and complete heat conduction and air convection heat dissipation through dual paths on the front and back. The current industry's conventional heat dissipation optimization method is mainly to increase the thickness of graphite and VC structures. However, this method has significant technical defects. Thickening the heat dissipation structure will increase the overall thickness of the device, which violates the requirements of thin and light design. Moreover, it will interfere with the layout space of precision components such as motherboard and battery inside the tablet, resulting in poor structural adaptability. Summary of the Invention

[0004] This application provides a heat dissipation component and an electronic device, which solves the problems of large space occupation and insufficient heat dissipation performance of existing electronic devices' heat dissipation components.

[0005] The technical solution is as follows: The first aspect of this application provides a heat dissipation component for an electronic device. The electronic device includes a frame assembly, a motherboard assembly and a battery assembly installed within the frame assembly. The motherboard assembly extends along a first direction, and the battery assembly includes a battery protection board that extends along a second direction. The heat dissipation component includes a metal heat sink installed within the frame assembly. The metal heat sink includes a main heat sink segment and an auxiliary heat sink segment. The position of the main heat sink segment corresponds to the position of the motherboard assembly, and the position of the auxiliary heat sink segment corresponds to the position of the battery protection board.

[0006] In this application, some of the heat generated by the motherboard components can be quickly conducted to the auxiliary heatsink section through the main heatsink section. The large area of ​​the auxiliary heatsink section is used for heat diffusion and dissipation, which significantly increases the overall heat dissipation area. Part of the heat generated by the motherboard components collected by the main heatsink section is directly conducted to the corresponding main heat dissipation structure through the main heatsink section, while the other part is conducted laterally along the base of the metal heatsink to the auxiliary heatsink section. It is then evenly diffused within the large area of ​​the auxiliary heatsink section and conducted to the corresponding main heat dissipation structure through the auxiliary heatsink section. This disperses the heat originally concentrated in the motherboard area to a larger area, reduces the heat flux density, and improves the heat dissipation efficiency.

[0007] In some implementations, the battery assembly includes a protection plate area for mounting a battery protection board, which is recessed away from the metal heat sink. This recessed structure accommodates the thickness of the battery protection board, preventing the auxiliary heat sink section from bulging upwards to avoid the protection board, ensuring the overall flatness of the heat sink without increasing the overall thickness, while also ensuring good contact between the heat sink and the protection board, reducing contact thermal resistance.

[0008] In some implementations, the frame assembly includes a main heat dissipation structure, with a metal heat sink positioned between the main heat dissipation structure and the motherboard assembly to conduct heat from the motherboard assembly to the main heat dissipation structure. The frame assembly includes a screen and a backplate, both of which are part of the main heat dissipation structure. By utilizing the two largest exposed components of the electronic device as the final heat dissipation interface, the structural advantages of the device are fully utilized to maximize the heat dissipation surface area, allowing heat to be directly conducted to the outside air and improving overall heat dissipation efficiency.

[0009] In some implementations, the heat dissipation component includes a thermally conductive layer disposed between the main heat dissipation structure and the metal heat sink. This thermally conductive layer fills the microscopic air gap between the metal heat sink and the main heat dissipation structure, effectively reducing contact thermal resistance and improving heat transfer efficiency. Simultaneously, the insulating properties of the thermally conductive layer prevent electrical short circuits between the metal heat sink and the main heat dissipation structure, thus enhancing equipment operational safety.

[0010] In some implementations, the heat dissipation component includes a circumferential conductive structure that extends circumferentially along the electrical components to be shielded on the motherboard assembly. A metal heat sink is placed over the circumferential conductive structure to form a shielding cavity between the heat sink and the conductive structure. Integrating heat dissipation and electromagnetic shielding functions into the same metal heat sink eliminates the need for a separate shielding cover, effectively saving internal layout space in electronic devices, reducing overall weight and production costs, while improving the electromagnetic compatibility performance of the device.

[0011] In some implementations, one end of the circumferential conductive structure abuts against the conductive structure on the motherboard assembly, while the other end abuts against the metal heat sink. This forms a complete conductive loop within the shielding cavity, ensuring the reliability of the electromagnetic shielding effect. Simultaneously, through connection with the motherboard grounding structure, the shielded electromagnetic energy is discharged through the grounding system, preventing the accumulation of electromagnetic energy inside and the generation of secondary radiation.

[0012] In some implementations, the circumferential conductive structure includes circumferential conductive foam. One end of the circumferential conductive foam elastically abuts against the conductive structure on the motherboard assembly, and the other end elastically abuts against the metal heat sink. Utilizing the elastic deformation capability of the conductive foam, it effectively compensates for processing and assembly errors of various components, ensuring uniform and sufficient contact pressure, avoiding a decrease in shielding effect due to poor contact, and simultaneously providing cushioning and shock absorption to protect internal precision components.

[0013] In some implementations, the thermally conductive layer includes a graphite layer. The first end of the graphite layer is connected to the metal heat sink via a first thermally conductive insulating layer, and the second end of the graphite layer is connected to the main heat dissipation structure via a second thermally conductive insulating layer. Utilizing the excellent in-plane thermal conductivity of graphite, heat from the metal heat sink is evenly diffused to the entire surface of the graphite layer, reducing the temperature gradient of the main heat dissipation structure.

[0014] In some implementations, a thermally conductive insulating structure is provided between the edge of the first thermally conductive insulating layer and the edge of the second thermally conductive insulating layer, extending along the circumferential edge of the graphite layer. This completely encloses the graphite layer within a sealed space, effectively preventing graphite delamination and powder shedding caused by vibration and temperature changes during long-term use, avoiding the risk of electrical short circuits caused by graphite powder shedding, and ensuring the long-term stability of thermal conductivity.

[0015] In some implementations, the circumferential conductive structure includes a circumferential conductive adhesive. One end of the adhesive is bonded to a conductive structure on the motherboard assembly, and the second end is bonded to a metal heat sink. This forms a strong bond, ensuring connection stability and conductivity, making it suitable for applications requiring high assembly precision. Simultaneously, the adhesive structure effectively seals the shielding cavity.

[0016] In some implementations, the thermally conductive layer includes a graphite layer. The first end of the graphite layer is bonded to a metal heat sink, and the second end of the graphite layer has a pre-set gap with the main heat dissipation structure. This ensures that only one end of the graphite layer is subjected to a fixed force, while the other end can freely expand and contract, preventing internal stress caused by thermal expansion and contraction from leading to delamination of the graphite layer. Simultaneously, the pre-set gap provides electrical isolation between the graphite layer and the main heat dissipation structure, preventing short-circuit faults.

[0017] In some implementations, the heat dissipation assembly also includes a thermally conductive silicone part and an insulating sheet. The thermally conductive silicone part wraps around the electrical component to be shielded, and the first end of the insulating sheet abuts against the thermally conductive silicone part, while the second end of the insulating sheet abuts against the metal heat sink. The thermally conductive silicone part can tightly adhere to the surface of the component to be shielded, improving heat conduction efficiency, while filling gaps to provide cushioning and shock absorption; the insulating sheet forms reliable electrical isolation between the component and the metal heat sink, preventing short-circuit faults and ensuring safe operation of the equipment.

[0018] In some implementations, a recess is provided on the side of the metal heat sink closest to the motherboard assembly, and an insulating sheet is installed within the recess. This recess precisely positions the insulating sheet, preventing insulation failure due to displacement during assembly and use. It also accommodates the thickness of the insulating sheet, avoiding an increase in the height of the shielding cavity, ensuring a compact overall structure of the heat dissipation assembly, and improving the utilization of internal space.

[0019] According to another aspect of this application, an electronic device is provided, the electronic device including a frame assembly, a motherboard assembly, a battery assembly, and a heat dissipation assembly mounted in the frame assembly, the motherboard assembly extending along a first direction, the battery assembly including a battery protection board extending along a second direction, the frame assembly including a screen and a back panel, the heat dissipation assembly being the aforementioned heat dissipation assembly, and the battery assembly including a protection board area for mounting the battery protection board, the protection board area being recessed in a direction away from the metal heat dissipation plate.

[0020] With the above technical solution, since the electronic device includes the above heat dissipation component, it has at least all the beneficial effects of the heat dissipation component, which will not be elaborated here. Attached Figure Description

[0021] Figure 1 A front view schematic diagram of the electronic device with the back panel hidden according to an embodiment of this application; Figure 2 A schematic diagram of the structure of an electronic device with a concealed back panel and heat dissipation components provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the metal heat sink provided in the embodiments of this application; Figure 4 A simplified structural diagram of an embodiment of the circumferential conductive structure of this application using circumferential conductive foam; Figure 5 A simplified structural diagram of an embodiment of the circumferential conductive structure of this application using circumferential conductive foam; Figure 6 A front view of the screen side of an electronic device provided in an embodiment of this application; Figure 7 A front view of the back panel side of the electronic device provided in an embodiment of this application; Figure 8 A comparative schematic diagram of heat dissipation for existing electronic devices and electronic devices provided in the embodiments of this application.

[0022] The meanings of the various symbols in the attached icons are as follows: 100. Electronic devices; 10. Frame assembly; 11. Screen; 12. Back panel; 20. Mainboard assembly; 21. Electrical components to be shielded; 30. Battery assembly; 31. Battery body; 32. Battery protection board; 41. Metal heat sink; 411. Main heat sink section; 412. Auxiliary heat sink section; 413. Recessed area; 42. Thermally conductive layer; 421. First thermally conductive insulating adhesive layer; 422. Second thermally conductive insulating adhesive layer; 423. Third thermally conductive insulating adhesive layer; 43. Circumferential guiding structure; 431. Circumferential conductive foam; 432. Circumferential conductive adhesive; 44. Preset gap; 45. Thermally conductive silicone part; 46. ​​Insulating sheet. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings. The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0024] In the description of this application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0026] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] In this application, "and / or" is merely a way of describing the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0028] It should be noted that, in this application, the words "in one embodiment," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in one embodiment," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment," "exemplarily," and "for example" is intended to present the relevant concepts in a specific manner.

[0029] Currently, mainstream heat dissipation solutions in the tablet industry are divided into two categories: passive heat dissipation and active heat dissipation. Both employ composite thermal conductive structures such as thermal gel / silicone grease, VC (thermal conductive gel), and graphite, and achieve heat conduction and air convection dissipation through dual paths on the front and back. The current industry standard for heat dissipation optimization mainly involves increasing the thickness of graphite and VC structures. However, this method has significant technical drawbacks. Thickening the heat dissipation structure increases the overall thickness of the device, violating the requirements for thin and light designs. Furthermore, it can interfere with the layout of precision components such as the motherboard and battery inside the tablet, resulting in poor structural adaptability. In addition, simply thickening the graphite and VC structure for heat dissipation optimization faces many other insurmountable technical bottlenecks: First, graphite materials exhibit significant anisotropy in thermal conductivity, with its in-plane thermal conductivity being much higher than its thickness-direction thermal conductivity. Simply increasing the thickness of the graphite layer offers limited improvement in vertical heat conduction efficiency; instead, it can lead to insufficient lateral heat diffusion within the graphite layer, forming localized hotspots. Secondly, the heat dissipation efficiency of the VC vapor chamber is closely related to its internal capillary structure design, working fluid type, and filling volume. When the VC thickness increases to a certain extent, the circulation resistance of its internal working fluid will increase significantly, which will reduce the heat dissipation effect. At the same time, the increase in VC thickness will also lead to a linear increase in its weight, seriously affecting the portability of the device. Thirdly, the thickened heat dissipation structure will significantly increase the overall weight of the device. For tablets that need to be held for a long time, the increased weight will directly lead to increased user fatigue, seriously affecting the user experience. Finally, simply increasing the thickness of the heat dissipation structure does not fundamentally change the design concept of a single vertical heat dissipation channel. It cannot effectively solve the problem of concurrent heat generation from multiple heat sources, nor can it make full use of the idle space inside the device to expand the heat dissipation area. The improvement in heat dissipation efficiency is very limited and cannot meet the heat dissipation requirements of the next generation of high-performance tablet products.

[0030] To solve the above problem, see Figures 1 to 5This application provides a heat dissipation component for an electronic device 100. This heat dissipation component expands the heat dissipation area by changing the overall shape of the heat dissipation structure and fully utilizing the unused space inside the device, while simultaneously addressing the heat dissipation needs of multiple heat sources. This improves heat dissipation efficiency without increasing the device's thickness or weight. The electronic device 100 includes a frame assembly 10, a motherboard assembly 20 installed within the frame assembly 10, and a battery assembly 30. See [link to relevant documentation]. Figure 1 , Figure 2 As shown, the frame assembly 10 is the supporting structure of the electronic device 100, used to house and fix all internal components, and is also a major component of the appearance of the electronic device 100.

[0031] The motherboard assembly 20 is the core control unit of the electronic device 100, and all electronic components are integrated on the motherboard assembly 20. The battery assembly 30 is the energy supply unit of the electronic device 100, providing power support for all functions of the electronic device 100. (See also...) Figure 2 As shown, the motherboard assembly 20 extends along the first direction and serves as the control and processing unit of the electronic device 100. It integrates multiple heat-generating and electromagnetic radiation source devices, such as a processor, memory, and power management chip. These devices generate heat and electromagnetic radiation during operation due to the thermal effect of current and electromagnetic induction. The processor generates the most heat and emits the strongest electromagnetic radiation, making it the primary target for heat dissipation and electromagnetic shielding. While the heat generation and electromagnetic radiation of the memory and power management chip are relatively smaller, they still require appropriate heat dissipation and shielding to ensure their normal operation. Optionally, the first direction is the length or width direction of the electronic device 100, consistent with the long side extension direction of the motherboard assembly 20. The motherboard assembly 20 has a rectangular structure to accommodate the internal space of the electronic device 100. Its long side extension direction aligns with the length or width direction of the electronic device 100, effectively utilizing the internal space and facilitating component layout and wiring.

[0032] The battery assembly 30 provides power to the electronic device 100 and includes a battery body 31 and a battery protection board 32. The battery protection board 32 extends along a second direction and is used to realize functions such as charge / discharge protection, overcurrent protection, and overvoltage protection of the battery. It also generates a certain amount of heat during operation. Optionally, the second direction is the width or length direction of the electronic device 100. The heat dissipation assembly includes a metal heat sink 41, which is installed inside the frame assembly 10. The metal heat sink 41 is made of a metal material with excellent thermal conductivity, possessing good thermal conductivity and structural strength, such as aluminum alloy or copper alloy. In addition to aluminum alloy and copper alloy, other metal materials such as magnesium alloy and titanium alloy can also be used. These materials also have good thermal conductivity and structural strength and can be selected according to the specific needs of the electronic device 100. Among them, aluminum alloy is the most widely used in flat panel electronic devices 100 due to its advantages of being lightweight, having high thermal conductivity, and being low cost.

[0033] See Figures 1 to 3 As shown, the metal heat sink 41 includes a main heat sink section 411 and an auxiliary heat sink section 412. The main heat sink section 411 extends along the first direction and refers to the area on the metal heat sink 41 corresponding to the position of the motherboard assembly 20. It is mainly responsible for conducting the heat generated by the motherboard assembly 20. The shape and size of the main heat sink section 411 are adapted to the shape and size of the motherboard assembly 20 and can cover the upper surface of the motherboard assembly 20, ensuring that the heat generated by all heat-generating devices on the motherboard assembly 20 can be effectively collected by the main heat sink section 411. The auxiliary heat dissipation plate segment 412 extends along the second direction, referring to the area on the metal heat dissipation plate 41 corresponding to the position of the battery protection plate 32. It is integrally formed and connected with the main heat dissipation plate segment 411. The auxiliary heat dissipation plate segment 412 extends outward from one edge of the main heat dissipation plate segment 411, and its extension direction forms a preset angle with the extension direction of the main heat dissipation plate segment 411. Its shape and size are adapted to the shape and size of the battery protection plate 32, and it can cover the upper surface of the battery protection plate 32, ensuring that heat can be quickly conducted between the two plate segments. The integral forming connection eliminates the connection interface between the main heat dissipation plate segment 411 and the auxiliary heat dissipation plate segment 412, avoiding the generation of contact thermal resistance, allowing heat to flow freely between the two plate segments, and realizing the rapid conduction and diffusion of heat.

[0034] See Figures 1 to 3As shown, a preset angle is formed between the first direction and the second direction. The preset angle can be determined according to the relative layout of the motherboard assembly 20 and the battery assembly 30 inside the electronic device 100. Optionally, it is 90 degrees, so that the metal heat sink 41 forms a T-shaped heat dissipation structure. In the T-shaped heat dissipation structure, the main heat sink segment 411 forms the vertical side of the T, and the auxiliary heat sink segment 412 forms the horizontal side of the T. The angled area formed between the horizontal side and the vertical side of the T is the heat dissipation area of ​​the auxiliary heat sink segment 412. In some specially designed electronic devices 100, the preset angle can also be other angles such as 60 degrees, 75 degrees, 105 degrees, 120 degrees, etc., as long as it can ensure that the auxiliary heat sink segment 412 extends to the side of the motherboard assembly 20 and makes full use of the idle space between the motherboard assembly 20 and the battery assembly 30. For example, when the motherboard assembly 20 and the battery protection board 32 are arranged diagonally side by side, the preset angle can be set to an angle that matches the angle between the two to ensure that the auxiliary heat sink segment 412 can accurately cover the area of ​​the battery protection board 32, while making full use of the idle space between the two.

[0035] With the above structure, the main heat sink section 411 of the metal heat sink 41 can be correspondingly set with the motherboard assembly 20, which is the main heat source, to centrally conduct the large amount of heat generated by the motherboard assembly 20. The auxiliary heat sink section 412 can simultaneously achieve dual heat dissipation functions: on the one hand, the auxiliary heat sink section 412 covers the area of ​​the battery protection board 32, and simultaneously conducts the heat generated by the battery protection board 32 during operation, making up for the shortcomings of existing heat dissipation solutions that only focus on motherboard heat dissipation and ignore the heat dissipation of the battery protection board 32. On the other hand, some of the heat generated by the motherboard component 20 can be quickly conducted to the auxiliary heatsink section 412 through the main heatsink section 411. The large area of ​​the auxiliary heatsink section 412 facilitates heat diffusion and dissipation, significantly increasing the overall heat dissipation area. Part of the heat collected by the main heatsink section 411 from the motherboard component 20 is directly conducted to the corresponding main heat dissipation structure, while the other part is conducted laterally along the base of the metal heatsink 41 to the auxiliary heatsink section 412, where it is evenly diffused within its large area before being conducted to the corresponding main heat dissipation structure. This disperses the heat originally concentrated in the motherboard area over a larger area, reducing heat flux density and improving heat dissipation efficiency. (See also...) Figure 8As shown, the heat dissipation solution of this application embodiment, compared with the prior art, can significantly reduce the local heat flux density in the motherboard area and avoid hot spot concentration. Since there is a preset angle between the first direction and the second direction, the auxiliary heat dissipation plate segment 412 can extend to the side of the motherboard assembly 20, making full use of the idle angle space between the motherboard assembly 20 and the battery assembly 30. It does not require expanding the area of ​​the heat dissipation structure in the motherboard area, effectively avoiding the spatial interference problem between the heat dissipation structure and other components on the motherboard. This makes the heat dissipation area of ​​the auxiliary heat dissipation plate segment 412 sufficient, effectively expanding the heat dissipation area and improving the overall heat dissipation capacity without occupying additional overall layout space or increasing the overall thickness.

[0036] Because the battery protection plate 32 is thinner than the battery body 31, allowing for more flexible space adjustment, the battery assembly 30 in this embodiment includes a protection plate area for mounting the battery protection plate 32. This protection plate area is recessed away from the metal heat sink 41. The protection plate area is a specially reserved mounting area on the battery body 31 for the battery protection plate 32. The recessed design (0.4mm~0.6mm) allows the battery protection plate 32 to be embedded inside the battery body 31, rather than protruding from its surface. The protection plate area is a specially reserved area on the battery assembly 30 for mounting the battery protection plate 32, located on one edge of the battery body 31. By setting the protection plate area as a recessed structure, sufficient installation space can be provided for the auxiliary heat dissipation plate segment 412 of the metal heat sink 41 without increasing the overall thickness of the electronic device 100. If the protection plate area is not set as a recessed structure, the battery protection plate 32 will protrude from the surface of the battery body 31. In order to avoid interference with the battery protection plate 32, the auxiliary heat dissipation plate segment 412 needs to protrude upward, which will increase the overall thickness of the electronic device 100. The recessed structure can accommodate the thickness of the battery protection plate 32, so that the auxiliary heat dissipation plate segment 412 can remain flat and will not increase the overall thickness, thus avoiding physical interference between the auxiliary heat dissipation plate segment 412 and the battery protection plate 32.

[0037] The frame assembly 10 in this embodiment includes a main heat dissipation structure. A metal heat sink 41 is disposed between the main heat dissipation structure and the motherboard assembly 20 to conduct heat from the motherboard assembly 20 to the main heat dissipation structure for final dissipation. The main heat dissipation structure is the final interface for heat exchange between the electronic device 100 and the outside air. All heat collected by the metal heat sink 41 is ultimately conducted to the main heat dissipation structure and then dissipated into the outside air through the main heat dissipation structure. The frame assembly 10 includes a screen 11 and a back panel 12. See [link to relevant documentation]. Figure 6 , Figure 7As shown, both screen 11 and back plate 12 are primary heat dissipation structures. Screen 11 and back plate 12 are the two largest components on electronic device 100, possessing the largest heat dissipation surface area, making them the most ideal primary heat dissipation structures. Using both as primary heat dissipation structures effectively utilizes the heat dissipation surface area of ​​electronic device 100, improving heat dissipation efficiency. Leveraging the advantages of screen 11 and back plate 12 covering most of the exposed surface of electronic device 100, having sufficient overall heat dissipation area, and being in direct contact with the outside air, this application can flexibly combine the metal heat sink 41 structure of this embodiment with conventional heat transfer methods commonly used in the industry, based on the internal layout limitations of electronic device 100, the temperature sensitivity characteristics of the components, user habits, and cost control requirements.

[0038] In one embodiment, the heat dissipation method of this application is adopted, which combines heat dissipation of the screen 11 with heat dissipation of the back plate 12 using a conventional heat transfer method. In this case, the heat generated by the motherboard assembly 20 and battery protection board 32 collected by the metal heat sink 41 is preferentially conducted to the screen 11, and then dissipated through natural convection and thermal radiation between the screen 11 and the outside air. The back plate 12 retains the conventional heat transfer method commonly used in the industry, achieving auxiliary heat dissipation on the back plate 12 side. This approach is suitable for electronic devices 100 where the back plate 12 integrates a large number of precision components such as antenna modules, camera modules, fingerprint recognition modules, and wireless charging modules, resulting in severely limited space on the back plate 12 side for arranging the heat dissipation structure of this application. It also effectively reduces the operating temperature of the back plate 12, significantly improving the tactile comfort of the user's handheld use and avoiding discomfort and anxiety caused by overheating of the back plate 12.

[0039] In another embodiment, the heat dissipation method of this application is adopted, which combines heat dissipation of the back plate 12 with heat dissipation of the screen 11 side using a traditional heat transfer method. In this case, the heat generated by the motherboard assembly 20 and battery protection board 32 collected by the metal heat sink 41 is preferentially conducted to the back plate 12, and then dissipated through natural convection and thermal radiation between the back plate 12 and the outside air. The screen 11 side retains the existing industry-standard traditional heat transfer method to achieve auxiliary heat dissipation on the screen 11 side. This is suitable for electronic devices 100 that use advanced display devices such as OLED, Mini-LED, and Micro-LED, which are relatively sensitive to temperature. It can effectively prevent problems such as screen burn-in, color drift, brightness decay, and pixel aging caused by excessive local temperature of the screen 11, and extend the service life of the display device. At the same time, it can also avoid the large amount of heat transferred to the screen 11 side from affecting the sensitivity and response speed of the touch module, ensuring the accuracy and smoothness of touch operation, especially suitable for professional creative tablet devices that support high refresh rates and high-precision touch.

[0040] In another embodiment, the heat dissipation method of this application combines both the screen 11 and the back plate 12. In this case, the heat collected by the metal heat sink 41 from the motherboard assembly 20 and the battery protection board 32 is divided into two paths: one conducts to the screen 11, and the other conducts to the back plate 12. Ultimately, heat is exchanged with the outside air through both the screen 11 and the back plate 12, fully utilizing the entire exposed heat dissipation area of ​​the screen 11 and the back plate 12, accelerating heat dissipation, and representing the most efficient heat dissipation method. This method is suitable for flagship electronic devices 100 that emphasize high performance and support long-term high-load operation. It effectively avoids problems such as processor throttling, system lag, and performance fluctuations when the device is running large 3D games, performing high-definition video editing, or running professional productivity software, ensuring continuous and stable output of device performance and meeting the high-intensity usage needs of professional users.

[0041] The heat dissipation component in this embodiment includes a thermally conductive layer 42, which is disposed between the main heat dissipation structure and the metal heat sink 41. The thermally conductive layer 42 is a material layer filled between two thermally conductive components to reduce contact thermal resistance and improve heat conduction efficiency. Optionally, the thermally conductive layer 42 is made of an insulating material with good thermal conductivity. The insulating material can prevent electrical short circuits between the metal heat sink 41 and the main heat dissipation structure, ensuring the electrical safety of the electronic device 100. Commonly used insulating and thermally conductive materials include thermally conductive silicone, thermally conductive gel, thermally conductive pads, and graphite sheets. These materials can fill the tiny air gaps between the metal heat sink 41 and the main heat dissipation structure, eliminating the thermal resistance caused by the air gaps and ensuring efficient heat conduction between the metal heat sink 41 and the main heat dissipation structure. The thickness of the thermally conductive layer 42 is controlled within a small range. An excessively thick thermally conductive layer 42 will increase thermal resistance and affect heat conduction efficiency, while an excessively thin thermally conductive layer 42 will not be able to completely fill the air gaps, also affecting heat conduction efficiency. Meanwhile, the heat-conducting layer 42 also possesses certain insulation properties, which can prevent electrical short circuits between the metal heat sink 41 and the main heat dissipation structure, thereby improving the electrical safety of the electronic device 100. The metal heat sink 41 is conductive, and the screen 11 and back plate 12 in the main heat dissipation structure may also be conductive. If the two come into direct contact, an electrical short circuit will occur, damaging the internal circuitry of the electronic device 100 and potentially causing a safety accident. Therefore, the heat-conducting layer 42 must possess good insulation properties.

[0042] The heat dissipation assembly in this embodiment includes a circumferential guide structure 43, which extends circumferentially along the electrical components 21 to be shielded on the motherboard assembly 20. The electrical components 21 to be shielded refer to electronic components on the motherboard assembly 20 that generate strong electromagnetic radiation or are sensitive to electromagnetic radiation, such as processors, radio frequency chips, and memory. These components need to be electromagnetically shielded to prevent electromagnetic interference. A metal heat sink 41 is placed on the circumferential guide structure 43 to form a shielding cavity between the metal heat sink 41 and the circumferential guide structure 43. The shielding cavity is a closed conductive space that can effectively shield internal electromagnetic radiation and prevent external electromagnetic radiation from entering the cavity and affecting the normal operation of the components.

[0043] The circumferential guide structure 43 refers to a conductive component that extends continuously around the electrical component 21 to be shielded. It is used to cooperate with the metal heat sink 41 to form a closed conductive space. The circumferential guide structure 43 must be continuous and must not have any breaks or gaps, otherwise it will lead to electromagnetic leakage and reduce the electromagnetic shielding effect. Its height needs to be designed according to the height of the electrical component to be shielded to ensure that the metal heat sink 41 will not come into contact with the electrical component to be shielded after it is covered.

[0044] The shielding cavity refers to a closed conductive space enclosed by the metal heat sink 41 and the circumferential guide structure 43. Based on the Faraday cage effect, it can effectively shield internal electromagnetic radiation. Through the above structure, the metal heat sink 41 can not only achieve heat dissipation, but also cooperate with the circumferential guide structure 43 to form an electromagnetic shielding cavity, effectively shielding the electromagnetic radiation generated by the electrical components to be shielded on the motherboard assembly 20, preventing electromagnetic radiation from interfering with the outside world, and also preventing external electromagnetic radiation from affecting sensitive components inside the electronic device 100. Integrating heat dissipation and electromagnetic shielding into one unit eliminates the need for a separate shielding structure. In existing technologies, heat dissipation and electromagnetic shielding are two independent functions, implemented by heat dissipation components and shielding components respectively. The shielding cover is usually a separate metal cover placed on top of the electrical component to be shielded, occupying a large amount of internal space. This effectively saves the internal layout space of the electronic device 100, reduces the weight and cost of the entire device, simplifies the assembly process, and eliminates the need for a separate shielding structure. This not only saves the space occupied by the shielding cover itself, but also saves the gap space between the shielding cover and the heat dissipation component. It also reduces the number of parts, lowers material and assembly costs, and improves production efficiency.

[0045] Specifically, in this embodiment, one end of the circumferential guide structure 43 abuts against the conductive structure on the motherboard assembly 20, and the other end abuts against the metal heat sink 41. The conductive structure on the motherboard assembly 20 may be a grounding copper foil or a grounding pad, and is part of the grounding system of the electronic device 100. By abutting against the conductive structure on the motherboard assembly 20, such as the copper leakage area (gold plating), and the metal heat sink 41 at both ends, the circumferential guide structure 43 can ensure that the shielding cavity forms a complete conductive loop, ensuring the reliability of the electromagnetic shielding effect. The shielding cavity can be reliably grounded, further improving the electromagnetic shielding performance and dissipating the shielded electromagnetic energy through the grounding system.

[0046] See Figure 4 As shown in one embodiment of this application, the circumferential guide structure 43 includes a circumferential conductive foam 431. One end of the circumferential conductive foam 431 elastically abuts against the conductive structure on the motherboard assembly 20, and the other end elastically abuts against the metal heat sink 41. Conductive foam is a commonly used electromagnetic shielding material with good conductivity, elasticity, and shielding effect, and is widely used in the electromagnetic shielding field of electronic equipment 100. The conductive foam is a conductive elastic material made by wrapping conductive cloth around a foamed sponge substrate, possessing good conductivity and elastic deformation capability. The foamed sponge substrate has good elasticity and compressibility, and can generate elastic deformation within a certain pressure range. The connection via elastic contact effectively compensates for dimensional errors generated during the processing and assembly of the metal heat sink 41, circumferential conductive foam 431, and mainboard assembly 20. In actual production, any component will have certain dimensional errors during processing, and there will also be certain assembly errors during assembly. These errors will lead to uneven contact pressure between the circumferential guide structure 43 and the metal heat sink 41 and mainboard assembly 20, and may even result in poor contact. The elastic deformation capability of the circumferential conductive foam 431 can effectively compensate for these errors, ensuring good contact between the components and avoiding a decrease in electromagnetic shielding effect due to poor contact. Poor contact will lead to increased contact resistance, which will not only affect the electromagnetic shielding effect, but also cause heat to be generated at the contact points, increasing the power consumption of the electronic device 100, and in severe cases, it may even cause the contact points to overheat and be damaged.

[0047] Meanwhile, the elastic properties of the circumferential conductive foam 431 can also play a certain role in buffering and shock absorption. When the electronic device 100 is subjected to external impact or vibration, the circumferential conductive foam 431 can absorb some of the impact energy and reduce the impact force transmitted to the electrical components to be shielded. When the electronic device 100 is subjected to external impact, it can absorb some of the impact energy and protect the electrical components to be shielded on the motherboard assembly 20 from damage. The electrical components to be shielded are usually some precision electronic components that are very sensitive to external impact and vibration. If subjected to a large impact force, it may cause damage to the components or the pins to fall off, affecting the normal operation of the electronic device 100.

[0048] In this embodiment, since the metal heat sink 41 is not fixed to the circumferential guide structure 43, it is fixed to the main heat dissipation structure. This fixing method is simple, reliable, easy to assemble, and also easy to disassemble and maintain. When it is necessary to replace or repair internal components, it is only necessary to remove the metal heat sink 41 from the main heat dissipation structure. The thermally conductive layer 42 in this embodiment includes a graphite layer. The first end of the graphite layer is connected to the metal heat sink 41 through the first thermally conductive insulating adhesive layer 421, and the second end of the graphite layer is connected to the main heat dissipation structure through the second thermally conductive insulating adhesive layer 422. The graphite layer has good in-plane thermal conductivity and can quickly and evenly diffuse the heat on the metal heat sink 41 to the entire surface of the graphite layer, and then conduct it to the main heat dissipation structure for dissipation.

[0049] Both the first thermally conductive insulating adhesive layer 421 and the second thermally conductive insulating adhesive layer 422 are made of adhesives that combine thermal conductivity and insulation. Optionally, thermally conductive silicone double-sided adhesive can be used. Thermally conductive silicone double-sided adhesive is a commonly used thermally conductive adhesive material with good thermal conductivity, insulation, adhesion and temperature resistance. It can simultaneously achieve the three functions of thermal conductivity, insulation and adhesion. While achieving heat conduction, it can ensure electrical isolation between the metal heat sink 41, the graphite layer and the main heat dissipation structure to prevent short circuit faults and fix the metal heat sink 41. The first thermally conductive insulating adhesive layer 421 and the second thermally conductive insulating adhesive layer 422 firmly bond the metal heat sink 41, the graphite layer and the main heat dissipation structure together to form a whole. This not only achieves efficient heat conduction but also ensures electrical safety and fixes the metal heat sink 41.

[0050] In this embodiment of the application, a thermally conductive insulating adhesive structure is provided between the edge of the first thermally conductive insulating adhesive layer 421 and the edge of the second thermally conductive insulating adhesive layer 422. The thermally conductive insulating adhesive structure extends along the circumferential edge of the graphite layer. The thermally conductive insulating adhesive structure is made of the same material as the first thermally conductive insulating adhesive layer 421 and the second thermally conductive insulating adhesive layer 422, and can form a good bond with both of them to jointly constitute a closed space. The thermally conductive insulating adhesive structure completely encapsulates the graphite layer within the closed space formed by the first thermally conductive insulating adhesive layer 421, the second thermally conductive insulating adhesive layer 422, and the thermally conductive insulating adhesive structure. This closed space completely isolates the graphite layer from the external environment, preventing dust, moisture, and other external contaminants from entering the graphite layer and affecting its thermal conductivity. It effectively prevents the graphite layer from delaminating or shedding powder due to vibration, stretching, temperature changes, and other factors during long-term use. The graphite layer is composed of multiple layers of stacked graphite sheets with relatively weak bonding between layers. During long-term use, it is prone to delamination and powder shedding due to vibration, temperature changes, and other factors. The closed space effectively prevents this phenomenon, avoiding the risk of electrical short circuits caused by graphite powder shedding and ensuring long-term stability of thermal conductivity. Graphite powder is conductive; if it falls and scatters onto the internal circuitry of the electronic device 100, it can cause short circuits, damage internal components, and even lead to safety accidents. The closed space effectively prevents graphite powder shedding, eliminating this safety hazard.

[0051] See Figure 5 As shown, optionally, in another embodiment of this application, the circumferential guide structure 43 includes a circumferential conductive adhesive 432. The first end of the circumferential conductive adhesive 432 is bonded to the conductive structure on the motherboard assembly 20, and the second end of the circumferential conductive adhesive 432 is bonded to the metal heat sink 41. The conductive adhesive is an adhesive filled with conductive particles, which, after curing, possesses good conductivity and bonding strength. By bonding, a strong connection can be formed between the circumferential guide structure 43 and the conductive structure on the motherboard assembly 20 and the metal heat sink 41. This connection has high stability and reliable conductivity, making it suitable for applications requiring high assembly precision and connection reliability. Simultaneously, the bonding method of the circumferential conductive adhesive 432 can effectively seal the shielding cavity, preventing dust, moisture, etc., from entering the shielding cavity and protecting the electrical components to be shielded from the influence of the external environment.

[0052] The thermally conductive layer 42 in this embodiment includes a graphite layer. The first end of the graphite layer is bonded to the metal heat sink 41, and the second end of the graphite layer has a predetermined gap 44 with the main heat dissipation structure. Alternatively, a third thermally conductive insulating adhesive layer 423 can be used for bonding; specifically, thermally conductive insulating adhesive. The predetermined gap 44 refers to a small distance between the graphite layer and the main heat dissipation structure, ensuring insulation and preventing short circuits. Simultaneously, the graphite layer is only subjected to the connecting force from the first end, while the other end is free, making delamination less likely.

[0053] In this embodiment, a thermally conductive silicone part 45 is provided between the second end of the graphite layer and the main heat dissipation structure. The thermally conductive silicone part 45 possesses both thermal conductivity and insulation properties, capable of filling the pre-defined gap 44 between the graphite layer and the main heat dissipation structure, eliminating thermal resistance caused by air gaps, and improving the efficiency of heat conduction from the graphite layer to the main heat dissipation structure. Simultaneously, the thermally conductive silicone part 45 possesses a certain degree of elastic deformation capability, capable of compensating for processing and assembly errors of various components, ensuring good contact, and also playing a buffering and shock-absorbing role, protecting the graphite layer from damage. To avoid excessive bonding force on the graphite layer, the thermally conductive silicone part 45 is connected using an adhesive dispensing method.

[0054] The heat dissipation assembly in this embodiment further includes a thermally conductive silicone part 45 and an insulating sheet 46. The thermally conductive silicone part 45 wraps around the electrical component to be shielded, and can completely cover the upper surface and side surface of the electrical component to be shielded, and is in close contact with the surface of the electrical component to be shielded. The first end of the insulating sheet 46 abuts against the thermally conductive silicone part 45, and the second end of the insulating sheet 46 abuts against the metal heat sink 41. The thermally conductive silicone part 45 and the insulating sheet 46 together constitute the thermally conductive and insulating structure between the electrical component to be shielded and the metal heat sink 41, which can realize the rapid conduction of heat and ensure electrical safety. The thermally conductive silicone part 45 can tightly adhere to the surface of the electrical component to be shielded, quickly conducting the heat generated by it to the metal heat sink 41. The heat generated by the electrical component to be shielded will first be conducted to the thermally conductive silicone part 45 wrapped around its surface, then through the thermally conductive silicone part 45 to the insulating sheet 46, then through the insulating sheet 46 to the metal heat sink 41, and finally through the metal heat sink 41 to the main heat dissipation structure for dissipation. The thermally conductive silicone part 45 has good thermal conductivity and adhesion, which can effectively reduce the contact thermal resistance between the electrical component to be shielded and the insulating sheet 46, improve the heat conduction efficiency, and at the same time fill the gap between the electrical component to be shielded and the surrounding components, playing a role in buffering, shock absorption and insulation. The thermally conductive silicone part 45 can fill the gap between the electrical component to be shielded and the circumferential guide structure 43 and the insulating sheet 46, fixing the electrical component to be shielded inside the shielding cavity and preventing the electrical component to be shielded from displacement during use. At the same time, the thermally conductive silicone part 45 has good elasticity and insulation, which can play a role in buffering, shock absorption and electrical isolation, protecting the electrical component to be shielded from damage.

[0055] The insulating sheet 46 is made of a high-insulation-strength material. Optionally, the insulating sheet 46 is made of insulating materials such as polyimide (PI), polyester (PET), and polycarbonate (PC). These materials have extremely high insulation strength and good heat resistance and mechanical strength, which can form a reliable electrical isolation between the electrical component to be shielded and the metal heat sink 41. The insulating sheet 46 has high insulation strength and can withstand high voltage, preventing electrical short circuits between the electrical component to be shielded and the metal heat sink 41, and ensuring the safe operation of the electronic equipment 100. The surface of the electrical component to be shielded is usually energized. If it comes into direct contact with the metal heat sink 41, it will cause an electrical short circuit, damaging the electrical component to be shielded and the metal heat sink 41, and may even cause a safety accident. By setting the insulating sheet 46, a reliable electrical isolation can be formed between the electrical component to be shielded and the metal heat sink 41, avoiding the occurrence of short circuit faults.

[0056] See Figure 4 and Figure 5 As shown, in this embodiment, the metal heat sink 41 near the motherboard assembly 20 has a recess 413, and the insulating sheet 46 is installed in the recess 413. The shape and size of the recess 413 are adapted to the insulating sheet 46, which can accurately position the insulating sheet 46 and prevent it from shifting during assembly and use. At the same time, the recess 413 can accommodate the thickness of the insulating sheet 46, avoiding the space occupation caused by the insulating sheet 46 protruding from the surface of the metal heat sink 41. If the insulating sheet 46 protrudes from the surface of the metal heat sink 41, it will occupy the space inside the shielding cavity, resulting in an increase in the height of the shielding cavity, thereby increasing the overall thickness of the electronic device 100. This ensures the compactness of the overall structure of the heat dissipation assembly and further improves the utilization rate of the internal space of the electronic device 100. By setting the recess 413 to accommodate the thickness of the insulating sheet 46, electrical isolation between the electrical component to be shielded and the metal heat sink 41 can be achieved without increasing the height of the shielding cavity, ensuring the compactness of the overall structure of the heat dissipation assembly and improving the utilization rate of the internal space of the electronic device 100.

[0057] Optionally, the side of the metal heat sink 41 near the motherboard assembly 20 in this embodiment may also be a plane.

[0058] Optionally, in one embodiment, the thermally conductive layer 42 in this application embodiment includes a graphite layer. A protruding structure is provided on the side of the metal heat sink 41 near the main heat dissipation structure. The protruding structure protrudes towards the main heat dissipation structure and extends circumferentially along the metal heat sink 41. The protruding structure is a continuous annular structure that extends around the entire circumference of the metal heat sink 41 and is integrally formed with the metal heat sink 41. The protruding structure and the main heat dissipation structure are bonded together using thermally conductive insulating adhesive. This thermally conductive insulating adhesive can ensure reliable bonding while guaranteeing electrical isolation between the protruding structure and the main heat dissipation structure. The protruding structure surrounds a groove, the shape of which matches the shape of the graphite layer. It is a continuous recessed area, in which the graphite layer is accommodated. The first end of the graphite layer is bonded to the bottom wall of the groove through thermally conductive insulating adhesive, and the second end of the graphite layer is also bonded to the main heat dissipation structure through thermally conductive insulating adhesive, so that the graphite layer is stably held between the bottom wall of the groove and the main heat dissipation structure.

[0059] The raised structure refers to the continuous annular structure protruding outward from the surface of the metal heat sink 41, and the groove refers to the recessed area formed by the raised structure. The raised structure and the groove can be integrally formed on the metal heat sink 41 through processes such as stamping and bending, which is simple and inexpensive. By setting circumferentially extending raised structures and forming grooves on the metal heat sink 41, the graphite layer can be precisely positioned. During assembly, the graphite layer can be directly placed in the groove. The sidewalls of the groove can restrict the horizontal movement of the graphite layer, preventing it from shifting during assembly and use. This avoids the reduction in heat conduction area and heat dissipation effect caused by shifting, ensuring that the graphite layer is always in the correct position and maintaining a stable heat conduction area and effect. The raised structure is bonded to the main heat dissipation structure with thermally conductive insulating adhesive. The large bonding area ensures a strong connection, guaranteeing the strength of the connection between the metal heat sink 41 and the main heat dissipation structure and preventing the metal heat sink 41 from loosening. Loosening of the metal heat sink 41 would lead to poor contact with the circumferential guide structure 43, affecting the electromagnetic shielding effect, and also cause poor contact with the thermally conductive layer 42, weakening the heat dissipation effect. The strong bond between the raised structure and the main heat dissipation structure effectively avoids these problems, ensuring the stable operation of the heat dissipation components and the electromagnetic shielding structure. Simultaneously, the groove provides space for the graphite layer without increasing the overall thickness of the electronic device 100. The depth of the groove matches the thickness of the graphite layer, and the graphite layer is sandwiched between the bottom wall of the groove and the main heat dissipation structure, without adding extra thickness to the electronic device 100. This prevents the graphite layer from being excessively compressed during assembly, which could lead to a decrease in its thermal conductivity.

[0060] According to another aspect of this application, an electronic device 100 is provided, see [link to application]. Figures 1 to 3 , Figures 6 to 7As shown, the electronic device 100 includes a frame assembly 10, a motherboard assembly 20 installed within the frame assembly 10, a battery assembly 30, and a heat dissipation assembly. The motherboard assembly 20 extends along a first direction, the battery assembly 30 includes a battery protection board 32 extending along a second direction, the frame assembly 10 includes a screen 11 and a back panel 12, and the heat dissipation assembly is the aforementioned heat dissipation assembly. The battery assembly 30 includes a protection board area for mounting the battery protection board 32, which is recessed away from the metal heat sink 41. By adopting the aforementioned heat dissipation assembly, heat dissipation efficiency can be significantly improved without increasing the overall thickness and weight of the device. Simultaneously, the heat dissipation function and electromagnetic shielding function are integrated, effectively saving internal layout space of the electronic device 100, reducing the overall weight and cost, improving the operational stability and reliability of the electronic device 100, and extending the service life of the electronic device 100. The electronic device 100 can be a tablet computer, laptop computer, smartphone, portable game console, portable media player, or any other electronic device requiring heat dissipation and electromagnetic shielding.

[0061] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A heat dissipating assembly, characterized by, An electronic device includes a frame assembly, a motherboard assembly and a battery assembly mounted within the frame assembly, the motherboard assembly extending along a first direction, the battery assembly including a battery protection board extending along a second direction, and a heat dissipation assembly including: A metal heat sink is installed inside the frame assembly. The metal heat sink includes a main heat sink section and an auxiliary heat sink section. The position of the main heat sink section corresponds to the position of the motherboard assembly, and the position of the auxiliary heat sink section corresponds to the position of the battery protection board.

2. The heat dissipation assembly according to claim 1, characterized in that, The battery assembly includes a protection plate area for mounting the battery protection plate, the protection plate area being recessed in a direction away from the metal heat sink.

3. The heat dissipation assembly according to claim 1, characterized in that, The frame assembly includes a main heat dissipation structure, and the metal heat sink is disposed between the main heat dissipation structure and the motherboard assembly to conduct heat from the motherboard assembly to the main heat dissipation structure. The frame assembly includes a screen and a back panel, and both the screen and the back panel are part of the main heat dissipation structure.

4. The heat dissipation assembly according to claim 3, characterized in that, The heat dissipation component includes a heat-conducting layer, which is disposed between the main heat dissipation structure and the metal heat sink.

5. The heat dissipation assembly according to claim 4, characterized in that, The heat dissipation assembly includes a circumferential conductive structure that extends circumferentially along the electrical components to be shielded on the motherboard assembly. The metal heat sink is disposed on the circumferential conductive structure to form a shielding cavity between the metal heat sink and the circumferential conductive structure.

6. The heat dissipation assembly according to claim 5, characterized in that, One end of the circumferential conductive structure abuts against the conductive structure on the motherboard assembly, and the other end abuts against the metal heat sink.

7. The heat dissipation assembly according to claim 6, characterized in that, The circumferential conductive structure includes circumferential conductive foam, one end of which elastically abuts against the conductive structure on the motherboard assembly, and the other end of which elastically abuts against the metal heat sink.

8. The heat dissipation assembly according to claim 7, characterized in that, The thermally conductive layer includes a graphite layer. The first end of the graphite layer is connected to the metal heat sink through a first thermally conductive insulating adhesive layer, and the second end of the graphite layer is connected to the main heat dissipation structure through a second thermally conductive insulating adhesive layer.

9. The heat dissipation assembly according to claim 8, characterized in that, A thermally conductive insulating adhesive structure is provided between the edge of the first thermally conductive insulating adhesive layer and the edge of the second thermally conductive insulating adhesive layer, and the thermally conductive insulating adhesive structure extends along the circumferential edge of the graphite layer.

10. The heat dissipation assembly according to claim 6, characterized in that, The circumferential conductive structure includes a circumferential conductive adhesive, the first end of which is bonded to a conductive structure on the motherboard assembly, and the second end of which is bonded to the metal heat sink.

11. The heat dissipation assembly according to claim 10, characterized in that, The thermally conductive layer includes a graphite layer, with a first end of the graphite layer bonded to the metal heat sink, and a second end of the graphite layer having a predetermined gap with the main heat dissipation structure.

12. The heat dissipation assembly according to claim 5, characterized in that, The heat dissipation assembly further includes a thermally conductive silicone part and an insulating sheet. The thermally conductive silicone part wraps around the electrical component to be shielded. The first end of the insulating sheet abuts against the thermally conductive silicone part, and the second end of the insulating sheet abuts against the metal heat sink.

13. The heat dissipation assembly according to claim 12, characterized in that, The metal heat sink has a recessed area on the side near the motherboard assembly, and the insulating sheet is installed in the recessed area.

14. An electronic device, characterized in that, The electronic device includes a frame assembly, a motherboard assembly, a battery assembly, and a heat dissipation assembly mounted within the frame assembly. The motherboard assembly extends along a first direction. The battery assembly includes a battery protection board that extends along a second direction. The frame assembly includes a screen and a back panel. The heat dissipation assembly is the heat dissipation assembly according to any one of claims 1 to 13. The battery assembly includes a protection plate area for mounting the battery protection board, and the protection plate area is recessed in a direction away from the metal heat sink.

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