Plate drilling risk assessment method, terminal device and computer program product

Abstract

The application is suitable for the technical field of circuit board manufacturing, and provides a board drilling risk assessment method, a terminal device and a computer program product, comprising: acquiring a plurality of reference constant parameters and a plurality of processing variables related to board drilling; constructing a comprehensive risk index and an ICD risk index based on the plurality of reference constant parameters and the plurality of processing variables; and performing drilling risk assessment on the board according to the comprehensive risk index and the ICD risk index and generating a risk assessment result. The board drilling risk assessment method provided by the application can accurately predict the possibility of defects of the board in the drilling process, quickly judge the applicability and processing rationality of the board, avoid repeated testing, and shorten the development cycle.

Description

Technical Field

[0001] This application belongs to the field of circuit board manufacturing technology, and in particular relates to a method for assessing the drilling risk of circuit boards, a terminal device, and a computer program product. Background Technology

[0002] In circuit board manufacturing, high-frequency and high-speed boards, due to their low dielectric constant and low loss factor, exhibit low material polarity and low activity, making it difficult to completely remove residual adhesive from holes after drilling using conventional adhesive removal processes. The dielectric layer of these boards often contains a large amount of resin filler, resulting in high physical hardness, which accelerates drill bit wear, increases hole wall roughness, and accumulates frictional heat during drilling, further exacerbating resin gel residue. When using coated aluminum sheets for drilling, the polyethylene protective film on the aluminum sheet surface and the intermediate resin layer are prone to peeling off during drilling. These tiny residues are carried into the hole wall as the drill rotates, and the adhesive removal solution circulation system cannot completely remove the film debris adhering to the hole wall, ultimately leading to interconnection defects at the junction of the inner copper foil and the hole wall.

[0003] Traditional processes rely on manual experience to repeatedly drill holes and perform cross-sectional analysis on aluminum sheets. The risk level is determined by observing the microscopic morphology of the hole walls. This process requires multiple adjustments to drilling parameters, changes in aluminum sheet type, and waiting for test results, significantly extending the process verification cycle. It cannot meet the timeliness requirements of rapid R&D for high-frequency and high-speed boards and makes it difficult to accurately predict the risk of internal interconnection defects before drilling. Summary of the Invention

[0004] In view of this, embodiments of this application provide a method, terminal equipment and computer program product for assessing the risk of drilling in sheet materials, so as to accurately predict the possibility of defects in sheet materials during the drilling process, quickly determine the suitability of the sheet materials and the rationality of the processing, avoid repeated testing and shorten the research and development cycle.

[0005] The first aspect of this application provides a method for assessing drilling risk in sheet metal, including: Obtain multiple baseline constant parameters and multiple machining variables related to drilling in sheet metal; A comprehensive risk index and an ICD risk index are constructed based on the aforementioned multiple benchmark constant parameters and multiple processing variables. The drilling risk of the plate is assessed based on the comprehensive risk index and the ICD risk index, and the risk assessment results are generated.

[0006] In one implementation of the first aspect, obtaining multiple reference constant parameters and multiple processing variables related to drilling in the sheet metal includes: Before drilling the board, baseline values ​​for the resin layer thickness, PCB stack-up thickness, tool life, and drilling parameters related to board drilling are obtained, as well as... Obtain the lower and upper limits of PE film thickness, resin layer thickness, actual and upper limits of PCB stack thickness, actual and lower limits of tool life, actual and deviation thresholds of drilling parameters related to board drilling.

[0007] In one implementation of the first aspect, the construction of the comprehensive risk index and the ICD risk index based on the plurality of benchmark constant parameters and the plurality of processing variables includes: A comprehensive risk index is constructed based on the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack thickness, the actual and baseline values ​​of tool life, and the actual and baseline values ​​of drilling parameters.

[0008] In one implementation of the first aspect, the construction of the comprehensive risk index and the ICD risk index based on the plurality of benchmark constant parameters and the plurality of processing variables further includes: ICD risk indicators are constructed based on the lower and upper limits of the PE film thickness, the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack thickness, the actual and baseline values ​​of the tool life, and the actual and baseline values ​​of the drilling parameters.

[0009] In one implementation of the first aspect, the construction of a comprehensive risk index based on the lower and upper limits of the resin layer thickness, the actual and reference values ​​of the PCB stack-up thickness, the actual and reference values ​​of the tool life, and the actual and reference values ​​of the drilling parameters includes: A resin thickness influence term is constructed based on the lower and upper limits of the resin layer thickness. Wherein, C is the lower limit of the resin layer thickness, and D is the upper limit of the resin layer thickness. This is a reference value for the thickness of the resin layer; A PCB stack-up thickness influence term is constructed based on the actual value of the PCB stack-up thickness and the baseline value of the PCB stack-up thickness. Where E is the actual value of the PCB stack thickness. This is the reference value for the thickness of the PCB stack-up; A tool life influence term is constructed based on the actual tool life value and the baseline tool life value. Where G is the actual value of the tool life. This serves as a baseline value for tool life. A borehole parameter influence term is constructed based on the actual values ​​and the baseline values ​​of the borehole parameters. Where I is the actual value of the drilling parameters. These are the baseline values ​​for drilling parameters; A comprehensive risk index is constructed based on the resin thickness influence item, the PCB stack-up thickness influence item, the tool life influence item, and the drilling parameter influence item. ,in, , , and The influence coefficients of each of the aforementioned influence items are, This is the basic comprehensive risk constant.

[0010] In one implementation of the first aspect, the construction of the ICD risk index based on the lower and upper limits of the PE film thickness, the lower and upper limits of the resin layer thickness, the actual value and the reference value of the PCB stack thickness, the actual value and the reference value of the tool life, and the actual value and the reference value of the drilling parameters includes: A PE film thickness risk item is constructed based on the lower and upper limits of the PE film thickness. Where A is the lower limit of the PE film thickness and B is the upper limit of the PE film thickness; A resin thickness risk item is constructed based on the lower and upper limits of the resin layer thickness. Wherein, C is the lower limit of the resin layer thickness, and D is the upper limit of the resin layer thickness. This is a reference value for the thickness of the resin layer; A PCB stack-up thickness risk item is constructed based on the actual value of the PCB stack-up thickness and the baseline value of the PCB stack-up thickness. Where E is the actual value of the PCB stack thickness. This is the reference value for the thickness of the PCB stack-up; A tool life risk item is constructed based on the actual value of the tool life and the benchmark value of the tool life. Where G is the actual value of the tool life. This serves as a baseline value for tool life. A borehole parameter risk item is constructed based on the actual values ​​and the baseline values ​​of the borehole parameters. Where I is the actual value of the drilling parameters. These are the baseline values ​​for drilling parameters; ICD risk indicators are constructed based on the PE film thickness risk item, the resin thickness risk item, the PCB stack-up thickness risk item, the tool life risk item, and the drilling parameter risk item. + ; in, , , , and The risk coefficient for each of the aforementioned risk items. Based on the ICD risk constant.

[0011] In one implementation of the first aspect, the step of assessing the drilling risk of the plate material based on the comprehensive risk index and the ICD risk index and generating a risk assessment result includes: If the comprehensive risk index or the ICD risk index is greater than the first risk threshold, a first risk assessment result characterizing the high risk of drilling the plate is generated. If the comprehensive risk index or the ICD risk index is not greater than the first risk threshold but greater than the second risk threshold, a risk warning result characterizing the risk in drilling the plate is generated.

[0012] If the comprehensive risk index or the ICD risk index is not greater than the second risk threshold, a process stability result characterizing the low risk of drilling the plate is generated.

[0013] In one implementation of the first aspect, the method further includes: When the actual value of the PCB stack thickness is greater than the upper limit value of the PCB stack thickness, a second risk assessment result is generated to characterize the high risk of drilling into the board material. When the actual value of the tool life is less than the lower limit of the tool life, a third risk assessment result is generated to characterize the high risk of drilling the plate. When the absolute value of the difference between the actual value of the drilling parameter and the reference value of the drilling parameter is greater than the deviation threshold of the drilling parameter, a fourth risk assessment result characterizing the high risk of drilling the plate is generated.

[0014] A second aspect of this application provides a terminal device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the method described in the first aspect.

[0015] A third aspect of this application provides a computer program product including a computer program that, when run, causes the method described in the first aspect to be executed.

[0016] The beneficial effects of the first aspect of the embodiments of this application are: by obtaining multiple benchmark constant parameters and multiple processing variables related to drilling of the board, and constructing comprehensive risk indicators and ICD risk indicators based on these parameters to conduct risk assessment, it is possible to accurately predict the possibility of defects in the board during the drilling process, quickly determine the suitability of the board and the rationality of the processing, avoid repeated testing, and shorten the research and development cycle.

[0017] It is understood that the beneficial effects of the second and third aspects mentioned above can be found in the relevant descriptions in the first aspect above, and will not be repeated here. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram illustrating the implementation process of the plate drilling risk assessment method provided in the embodiments of this application; Figure 2 This is a schematic diagram illustrating the implementation process of the plate drilling risk assessment method provided in the embodiments of this application; Figure 3 This is a schematic diagram illustrating the implementation process of the plate drilling risk assessment method provided in the embodiments of this application; Figure 4 This is a schematic diagram illustrating the implementation process of the plate drilling risk assessment method provided in the embodiments of this application; Figure 5 This is a schematic diagram illustrating the implementation process of the plate drilling risk assessment method provided in the embodiments of this application; Figure 6 This is a schematic diagram of the terminal device provided in the embodiments of this application; Figure 7 This is a schematic diagram of the computer program product provided in the application embodiment. Detailed Implementation

[0020] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0021] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0022] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0023] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0024] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0026] In the traditional high-frequency and high-speed plate drilling process, the roughness of the hole wall increases due to the large amount of resin filler in the plate dielectric layer and its hard physical properties. At the same time, the PE (Polyethylene) film and resin layer on the aluminum sheet surface generate film debris during drilling. This film debris is carried into the hole wall and cannot be completely removed by the circulating reaction of the adhesive removal solution. This causes internal interconnection defects (ICD) failure at the connection between the inner copper hole and the hole wall, which in turn affects the PTH (Plate-Through Hole) electroplating quality and product reliability. The low polarity and low activity of the material make it difficult to effectively remove residual adhesive inside the hole.

[0027] If the above problems are not solved, ICD failure will cause a continuous decline in product reliability. During the production process, it is necessary to repeatedly test different aluminum sheet materials and drilling parameter combinations, which will prolong the research and development cycle. At the same time, the unstable hole wall quality will cause product performance fluctuations during mass production. Furthermore, this problem will have a systematic impact on the manufacturing efficiency and yield of high-frequency and high-speed boards. Among them, the cumulative effect of internal interconnection defects has been proven to reduce the electrical performance stability of the final product.

[0028] In response, this application provides a method for assessing the risk of drilling in sheet metal, which can accurately predict the possibility of defects in the sheet metal during the drilling process, quickly determine the suitability of the sheet metal and the rationality of the processing, avoid repeated testing, and shorten the research and development cycle.

[0029] For ease of understanding, the following explains some key terms in this embodiment: The risk assessment method for drilling in sheet metal is used to predictively analyze and quantify potential defects or problems that may occur during the drilling process. It is particularly suitable for high-frequency, high-speed sheet metal with high precision and reliability requirements. This method can identify potential risk factors, allowing for preventative measures to be taken before or during actual production.

[0030] Reference constant parameters are relatively stable values ​​that are predetermined before drilling of sheet metal, representing various indicators under ideal or standard process conditions. These parameters are usually determined based on material properties, equipment performance, and historical experience, serving as a reference for measuring actual processing variables.

[0031] Processing variables refer to actual operational data that are monitored or acquired in real time during the drilling process of sheet metal, and may change over time or batches. These variables reflect the true state of the current production environment and process execution, and are key dynamic inputs for risk assessment.

[0032] The ICD risk metric is a quantitative indicator specifically designed to assess Inner Layer Interconnect Defects (ICDs). ICDs are a serious defect in printed circuit board manufacturing, typically manifesting as poor bonding between the via wall and the inner copper foil, which can be caused by factors such as residual adhesive, rough via walls, and residual film debris. This metric is designed to accurately predict the likelihood of ICDs occurring.

[0033] The risk assessment result is the final output of the plate drilling risk assessment method, usually presented as a clear risk level (e.g., high risk, medium risk, low risk) or specific recommendations. This result provides a basis for production decisions, guiding operators to make necessary process adjustments or material changes.

[0034] like Figure 1As shown in the embodiment of this application, a method for assessing drilling risk in sheet metal is provided, including: Step S1: Obtain multiple baseline constant parameters and multiple processing variables related to drilling of the sheet metal.

[0035] In applications, there are several ways to obtain baseline constant parameters and processing variables. For example, one approach involves manually consulting standard process documents or databases to input preset baseline constant parameters, such as standard resin layer thickness, standard PCB (Printed Circuit Board) stack-up thickness, ideal tool life, and optimal drilling parameters. Simultaneously, operators at the drilling site manually record and input current processing variables, such as actual PCB stack-up thickness, current number of holes drilled, and actual drilling parameter settings, using measuring tools or equipment displays. Another approach is to store the baseline constant parameters in a central database and automatically retrieve them during each evaluation by an automated system. Processing variables are then collected in real-time by sensors integrated into the drilling equipment; for example, optical sensors measure board thickness, counters record tool life, and the equipment controller acquires parameters such as drilling speed and feed rate.

[0036] Step S2: Construct a comprehensive risk index and an ICD risk index based on the multiple benchmark constant parameters and the multiple processing variables.

[0037] In application, one way to construct comprehensive risk indicators and ICD risk indicators is to perform a simple linear combination or weighted average of the obtained baseline constant parameters and machining variables to form a preliminary risk score. For example, a simple formula can be set to directly add the deviations between the actual plate thickness and the baseline plate thickness, the deviations between the actual tool life and the baseline tool life, etc., to obtain a comprehensive value. Another way to construct comprehensive risk indicators and ICD risk indicators is to use a preset rule set or lookup table to determine the risk. For example, when a certain machining variable exceeds a preset range, its corresponding risk item is directly set to a high value, and then all risk items are summed up.

[0038] Step S3: Perform a drilling risk assessment on the plate material based on the comprehensive risk index and the ICD risk index, and generate a risk assessment result.

[0039] In application, after obtaining the comprehensive risk index and the ICD risk index, they need to be interpreted to derive the assessment results. For example, one assessment method is to set a single risk threshold; if any index exceeds this threshold, it is directly judged as high risk, otherwise it is judged as low risk. Another assessment method is to compare the calculated index values ​​with predefined risk ranges, for example, dividing the risk into two levels: "acceptable" and "unacceptable".

[0040] The method provided in this application introduces quantified benchmark constant parameters and processing variables, and constructs comprehensive risk indicators and ICD risk indicators to accurately predict the possibility of defects in the drilling process of the board, quickly determine the suitability of the board and the rationality of the processing, avoid repeated testing, shorten the research and development and production cycle, improve overall production efficiency and product reliability, and provide a more reliable and efficient risk management means for drilling processing of high-frequency and high-speed boards.

[0041] In one embodiment, obtaining multiple reference constant parameters and multiple processing variables related to drilling in the sheet metal includes: Before drilling the board, baseline values ​​for the resin layer thickness, PCB stack-up thickness, tool life, and drilling parameters related to board drilling are obtained, as well as... Obtain the lower and upper limits of PE film thickness, resin layer thickness, actual and upper limits of PCB stack thickness, actual and lower limits of tool life, actual and deviation thresholds of drilling parameters related to board drilling.

[0042] In applications, the baseline value for resin layer thickness refers to the target thickness of the resin layer on the board under ideal or standard process conditions. Its function is to provide a reference standard for subsequent actual measurements. It can be determined by consulting board design specifications, historical production data, or through experimental verification. The baseline value for PCB stack-up thickness refers to the total stack-up thickness of the PCB board under design or standard process conditions. It serves as an important basis for measuring whether the actual stack-up thickness meets design requirements and can be obtained from product design drawings, process documents, or through measurements of qualified samples. The baseline value for tool life refers to the total expected effective working time or total number of drill holes under standard drilling conditions. It is used to assess the degree of tool wear and remaining service life and is usually provided by the tool supplier, statistically based on historical experience data, or determined through pre-conducted life tests. The baseline values ​​for drilling parameters refer to the various operating parameters that should be set for drilling equipment under standard process conditions, such as spindle speed, feed rate, and drilling depth. These parameters are the foundation for ensuring drilling quality and efficiency and can be obtained from equipment operation manuals, process specifications, or through process optimization experiments.

[0043] In applications, the lower and upper limits of PE film thickness define the acceptable range for PE film thickness, ensuring that the PE film provides adequate protection and support during drilling. These limits can be set according to the material supplier's technical specifications or process requirements. The lower and upper limits of resin layer thickness define the acceptable range for the resin layer thickness on the board, crucial for controlling drilling quality and avoiding defects such as delamination. These values ​​are typically given by the board manufacturer's technical specifications or PCB design standards. The actual value of PCB stack-up thickness refers to the actual total thickness of the board to be processed. It is key data for assessing whether the board meets design requirements and predicting drilling risks, and can be obtained through online measuring equipment or offline precision measuring instruments. The upper limit of PCB stack-up thickness is the maximum allowable thickness of the PCB stack-up. Exceeding this value may lead to drilling quality problems or equipment interference, and is usually determined by design specifications or process safety margins. The actual value of tool life refers to the cumulative time the tool has been used or the number of drilling operations, used for real-time monitoring of tool wear. This can be recorded and statistically analyzed through the drilling equipment's control system or external sensors. The lower limit of tool life is the minimum life threshold at which a tool is considered no longer suitable for use. Below this value, the tool should be replaced to avoid drilling defects. This value is typically set based on experience, experimentation, or safety standards. Actual drilling parameters refer to the parameters actually executed by the drilling equipment during current operation, such as actual rotational speed and actual feed rate. These values ​​reflect the operating status of the equipment and can be read in real time by the equipment controller or sensors. The deviation threshold of drilling parameters refers to the maximum allowable deviation between the actual value and the reference value. Exceeding this range indicates a potential abnormality in the drilling process. This threshold is usually set by process engineers based on experience and quality requirements.

[0044] The above technical solution enables the comprehensive and detailed acquisition of various key parameters related to board drilling before the drilling process, including baseline values, actual values, upper and lower limits, and deviation thresholds. This detailed and targeted parameter acquisition method allows for full consideration of the board's inherent quality characteristics, tool wear status, and real-time drilling conditions when constructing comprehensive risk indicators and ICD risk indicators. For example, by comparing the actual value of the PCB layer thickness with the baseline and upper limit, the quality risk of the board itself can be determined; by comparing the actual value of the tool life with the baseline and lower limit, the tool wear risk can be assessed; and by comparing the actual value of the drilling parameters with the baseline and deviation thresholds, the stability of the processing can be monitored.

[0045] Compared to methods that only obtain general parameters, this approach provides richer and more accurate data support, significantly improving the accuracy and sensitivity of risk indicator construction and making the results of drilling risk assessment for sheet metal more reliable. This not only helps identify potential high-risk factors before drilling, enabling early warning and intervention, but also effectively avoids misjudgments caused by incomplete or inaccurate parameter information, thereby improving the yield rate of drilling processing, reducing production costs, and ensuring product quality.

[0046] In one embodiment, step S2, constructing a comprehensive risk index and an ICD risk index based on the plurality of benchmark constant parameters and the plurality of processing variables, includes: Step S21: Construct a comprehensive risk index based on the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack thickness, the actual and baseline values ​​of the tool life, and the actual and baseline values ​​of the drilling parameters.

[0047] As a specific implementation method, a comprehensive risk index calculation model can be established. This model quantifies the deviation or state of resin layer thickness, PCB stack-up thickness, tool life, and drilling parameters into different risk contribution values. For example, a function can be defined that outputs a higher risk contribution value when the actual resin layer thickness is close to its lower or upper limit; a corresponding risk contribution value is also generated when the actual PCB stack-up thickness deviates from the benchmark value by more than a certain threshold. Similarly, the remaining percentage of tool life or the deviation of drilling parameters from set values ​​can be converted into risk scores through a preset mapping relationship. Finally, these independent risk scores can be weighted and averaged or combined through a nonlinear function to obtain a comprehensive risk index between 0 and 100, where higher values ​​represent higher drilling risks. For example, a rule-based expert system can be used to directly output the comprehensive risk index based on the deviation of each parameter and a preset risk level rule.

[0048] Through the above technical solution, this application can construct a comprehensive risk index based on the lower and upper limits of resin layer thickness, the actual and benchmark values ​​of PCB stack-up thickness, the actual and benchmark values ​​of tool life, and the actual and benchmark values ​​of drilling parameters. This refined index construction method enables the comprehensive risk index to more comprehensively and accurately reflect various potential risks that the board may face during the drilling process, such as drilling quality problems caused by material properties, tool wear, or deviations in process parameters. Compared to simply constructing risk indicators in a general way, this solution significantly improves the targeting and accuracy of risk assessment by incorporating multiple key and interrelated parameters, thereby helping to promptly identify and avoid potential drilling defects, ensure processing quality, and optimize production efficiency.

[0049] In one embodiment, step S2, which constructs a comprehensive risk index and an ICD risk index based on the plurality of benchmark constant parameters and the plurality of processing variables, further includes: Step S22: Construct an ICD risk index based on the lower and upper limits of the PE film thickness, the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack thickness, the actual and baseline values ​​of the tool life, and the actual and baseline values ​​of the drilling parameters.

[0050] In applications, the ICD risk index is a quantitative assessment of the likelihood of interconnect defects (IDDs) occurring in a board during drilling. Interconnect defects typically refer to poor or broken connections between conductive layers within a printed circuit board (PCB), and are a key factor affecting PCB reliability. Constructing an ICD risk index aims to predict and quantify the risk of such internal defects from specific dimensions, such as material properties and processing parameters. This can be achieved by establishing mathematical models, statistical regression analysis, or expert system rules, mapping multiple relevant parameters to a single risk value or level. The lower and upper limits of the PE film thickness are key parameters controlling the material properties of the PE film layer, which is typically used as a protective or auxiliary layer in PCB manufacturing. These parameters can be obtained through supplier specifications, material testing reports, or actual measurements. When constructing the ICD risk index, deviations in the PE film thickness can directly affect the stress and thermal effects on the material during drilling, as well as the quality of subsequent lamination, thus indirectly affecting ICD formation. For example, excessively thin or thick PE film layers may cause stress concentration and uneven heat dissipation during drilling, or cause delamination in subsequent processes, thereby increasing the risk of ICD.

[0051] This application's solution acquires multiple baseline constant parameters and processing variables related to board drilling, and further utilizes these parameters to construct an ICD risk index based on a comprehensive risk index. Specifically, the lower and upper limits of the PE film thickness are introduced because the PE film has a significant impact on drilling quality and subsequent lamination in PCB manufacturing; its thickness exceeding a reasonable range may directly lead to internal defects, such as ICD. By combining the PE film thickness parameter with other key parameters (such as resin layer thickness, PCB stack-up thickness, tool life, and drilling parameters), a more comprehensive ICD risk assessment model can be established. These parameters collectively reflect the material properties, structural characteristics, and processing conditions of the board. For example, resin layer thickness affects the thermal stress distribution during drilling, PCB stack-up thickness affects drilling depth and accuracy, and tool life and drilling parameters are directly related to the mechanical stress and heat generation during the drilling process. By comprehensively considering these factors, the ICD risk index can more accurately capture potential risk points that may lead to interconnect defects. Once the ICD risk index is constructed, it is used together with the comprehensive risk index to assess the drilling risk of the board. This dual assessment mechanism allows the risk assessment results to not only reflect the overall drilling risk, but also to pay special attention to the risk of internal defects, thereby providing more detailed and targeted risk warnings.

[0052] As a specific implementation method, the ICD risk index can be constructed using a weighted summation model. For example, the ICD risk index can be defined as a function that takes the lower and upper limits of the PE film thickness, the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack-up thickness, the actual and baseline values ​​of tool life, and the actual and baseline values ​​of drilling parameters as inputs. Specifically, a risk item can be defined for each parameter. For example, the PE film thickness risk item can quantify its impact on ICD risk based on the difference or ratio between its lower and upper limits; the resin thickness risk item can be reflected based on the difference or ratio between its lower and upper limits; the PCB stack-up thickness risk item can be calculated based on the absolute value or relative deviation of the difference between its actual and baseline values; the tool life risk item can be evaluated based on the difference or ratio between its baseline and actual values; and the drilling parameter risk item can be calculated based on the absolute value or relative deviation of the difference between its actual and baseline values. Then, these risk items are weighted and summed using preset weighting coefficients, and possibly an underlying ICD risk constant is added to obtain the final ICD risk index. These weighting coefficients can be trained and optimized through historical data analysis, expert experience, or machine learning models to ensure that the ICD risk index accurately reflects the actual probability of interconnect defects occurring.

[0053] like Figure 2 As shown, in one embodiment, step S21 includes: Step S211: Construct a resin thickness influence term based on the lower and upper limits of the resin layer thickness. Wherein, C is the lower limit of the resin layer thickness, and D is the upper limit of the resin layer thickness. This is the reference value for the thickness of the resin layer.

[0054] In applications, the resin thickness impact term is used to quantify the potential influence of the resin layer thickness on drilling risks. Resin layer thickness is a critical parameter in PCB manufacturing; excessive thickness can lead to problems such as delamination, burrs, or rough hole walls during drilling. This impact term is typically constructed based on a lower limit C and an upper limit D for the resin layer thickness, and the deviation is assessed by comparing the actual resin layer thickness with the baseline value.

[0055] Step S212: Construct a PCB stack-up thickness influence item based on the actual value of the PCB stack-up thickness and the reference value of the PCB stack-up thickness. Where E is the actual value of the PCB stack thickness. This is the reference value for the thickness of the PCB stack.

[0056] In applications, the PCB stack-up thickness impact factor aims to assess the influence of PCB stack-up thickness on drilling risk. PCB stack-up thickness is directly related to factors such as tool load and heat accumulation. The actual PCB stack-up thickness E is compared to the baseline value. The difference between these values ​​is an important basis for assessing borehole risk. The calculation of this impact factor can be based on the actual value E and the benchmark value. The difference is used to quantify its impact, so as to ensure that the increase in risk can be accurately reflected when the actual laminate thickness deviates from the benchmark value.

[0057] Step S213: Construct a tool life influence item based on the actual tool life value and the reference tool life value. Where G is the actual value of the tool life. This serves as the baseline value for tool life.

[0058] In applications, the tool life impact term measures the effect of drilling tool wear on drilling quality and risk. The actual tool life value G is compared to the baseline tool life value. The difference between these values ​​is a key indicator for determining whether a tool is nearing failure, potentially leading to decreased drilling quality or tool breakage. This influence factor can be constructed based on a baseline value for tool life. The difference between the actual tool life and the baseline value G, for example, when the actual tool life is significantly lower than the baseline value, the value of this effect term will increase accordingly, thus indicating a higher drilling risk.

[0059] Step S214: Construct a drilling parameter influence term based on the actual values ​​of the drilling parameters and the reference values ​​of the drilling parameters. Where I is the actual value of the drilling parameters. These are the baseline values ​​for drilling parameters.

[0060] In applications, the drilling parameter impact term is used to assess the influence of various parameters used during the drilling process (such as rotational speed, feed rate, and cutter speed) on drilling risks. Deviations between the actual value (I) of a drilling parameter and its reference value can lead to unstable drilling quality, hole wall damage, or low processing efficiency. This impact term can be calculated based on the deviation between the actual parameter (I) and the reference parameter; for example, the absolute value of the difference between the two parameters can be used to quantify its impact, reflecting the risks associated with deviations from the reference value.

[0061] Step S215: Construct a comprehensive risk index based on the resin thickness influence item, the PCB layer thickness influence item, the tool life influence item, and the drilling parameter influence item. ,in, , , and The influence coefficients of each of the aforementioned influence items are, This is the basic comprehensive risk constant.

[0062] In application, the comprehensive risk index is a quantitative value used to comprehensively assess the potential risks of the board drilling process. It provides a unified risk measure by integrating data from multiple dimensions, including resin thickness influence, PCB layer thickness influence, tool life influence, and drilling parameter influence. The various influence items with corresponding influence coefficients are summed, and a basic comprehensive risk constant is added to obtain a value that reflects the overall risk level. (Influence coefficients are also mentioned.) , , and This is used to adjust the weight of each influencing factor in the calculation of the comprehensive risk index. Different influencing factors may contribute differently to the final drilling risk; for example, tool life may be more critical than resin layer thickness. By setting appropriate coefficients, it can be ensured that the comprehensive risk index can more accurately reflect the actual risk distribution. These coefficients can be determined and optimized through expert experience, historical data analysis, or machine learning. The basic comprehensive risk constant represents the inherent and unavoidable minimum risk level of the plate drilling process under ideal or baseline conditions for all influencing factors. It provides a baseline for the comprehensive risk index, ensuring that the system can still identify a certain basic risk even if all controllable factors perform well. This constant can be set according to industry standards, safety regulations, or historical statistical data.

[0063] Through the above technical solution, this application can quantify and integrate the risk contribution of multiple key parameters in the board drilling process, thereby overcoming the problems of strong subjectivity and insufficient accuracy in risk assessment in traditional methods. By constructing specific quantitative impact items for each influencing factor (such as resin layer thickness, PCB stack-up thickness, tool life, and drilling parameters) and introducing adjustable impact coefficients and basic comprehensive risk constants, the calculation process of the comprehensive risk index becomes more transparent, objective, and traceable. This not only improves the accuracy and reliability of risk assessment but also clearly identifies the specific factors that lead to increased risk and their degree of contribution, providing clear guidance for timely adjustment of processing technology, tool replacement, or optimization of material parameters, thereby effectively reducing the scrap rate and production costs in the board drilling process.

[0064] like Figure 3 As shown, in one embodiment, step S22 includes: Step S221: Construct a PE film thickness risk item based on the lower and upper limits of the PE film thickness. Where A is the lower limit of the PE film thickness and B is the upper limit of the PE film thickness.

[0065] In application, the PE film thickness risk term aims to quantify the impact of PE film thickness on ICD risk. PE film thickness is one of the key factors affecting drilling quality and ICD risk; excessive thickness may lead to uneven stress on the sheet material or thermal stress concentration during drilling, thereby increasing the probability of ICD occurrence. Constructing the PE film thickness risk term involves analyzing the lower limit A and upper limit B of the PE film thickness, transforming it into a quantifiable risk value.

[0066] Step S222: Construct a resin thickness risk item based on the lower and upper limits of the resin layer thickness. Wherein, C is the lower limit of the resin layer thickness, and D is the upper limit of the resin layer thickness. This is the reference value for the thickness of the resin layer.

[0067] In applications, the resin thickness risk term is used to assess the contribution of resin layer thickness to ICD risk. The resin layer in PCB boards serves as insulation and adhesion, and its thickness directly affects heat conduction, stress distribution, and hole wall integrity during drilling. Excessive resin layer thickness can lead to problems during drilling, such as resin burning, delamination, or rough hole walls, thus triggering ICD. Constructing the resin thickness risk term involves converting the actual resin layer thickness into a risk value based on the lower limit C, upper limit D, and a baseline value for resin layer thickness.

[0068] Step S223: Construct a PCB stack-up thickness risk item based on the actual value of the PCB stack-up thickness and the baseline value of the PCB stack-up thickness. Where E is the actual value of the PCB stack thickness. This is the reference value for the thickness of the PCB stack.

[0069] In applications, the PCB stack-up thickness risk item aims to quantify the impact of PCB stack-up thickness on ICD risk. PCB stack-up thickness is an important indicator of the overall structural stability of the board material, and its relationship with benchmark values... Deviations in this process can cause changes in the rigidity and thermal expansion coefficient of the board material during drilling, thereby increasing the risk of ICD (Integrated Circuit Difference). This is achieved by comparing the actual value E of the PCB stack-up thickness with a reference value. This allows for the calculation of a risk value that reflects the degree of deviation. For example, the actual value E can be compared to the benchmark value. The difference is calculated and mapped to the value of the risk item; the larger the difference, the higher the risk item.

[0070] Step S224: Construct a tool life risk item based on the actual tool life value and the baseline tool life value. Where G is the actual value of the tool life. This serves as the baseline value for tool life.

[0071] In applications, the tool life risk term is used to assess the contribution of tool life to ICD risk. Tool life directly affects drilling quality and efficiency. Tool wear or insufficient tool life can lead to rough hole walls, increased burrs, inaccurate hole diameter, and even delamination of the sheet metal, thereby increasing the risk of ICD. Constructing the tool life risk term involves comparing the actual tool life value G with a benchmark value. This allows for the calculation of a risk value that reflects the condition of the tool. For example, this can be based on a baseline value for tool life. The difference between the actual value G and the actual value G determines the risk item. The larger the difference (the closer the tool life is to being exhausted), the higher the risk item.

[0072] Step S225: Construct a drilling parameter risk item based on the actual values ​​and baseline values ​​of the drilling parameters. Where I is the actual value of the drilling parameters. These are the baseline values ​​for drilling parameters.

[0073] In applications, the drilling parameter risk item is a feature designed to quantify the impact of drilling parameters on ICD risk. Drilling parameters, such as feed rate, spindle speed, and cutter speed, are core control variables in the drilling process, and their values ​​are compared to baseline values. Deviations in drilling parameters can directly lead to heat accumulation, stress concentration, or abnormal cutting forces during the drilling process, significantly increasing the risk of ICD (Inductively Coupled Drilling). A drilling parameter risk term is constructed by comparing the actual value I of the drilling parameter with the reference value. This allows for the calculation of a risk value that reflects the degree of deviation. For example, the absolute value of the difference between two parameters can be used to quantify the impact and reflect the risk arising from the deviation of a parameter from its baseline value.

[0074] Step S226: Construct ICD risk indicators based on the PE film thickness risk item, the resin thickness risk item, the PCB stack-up thickness risk item, the tool life risk item, and the drilling parameter risk item. + .

[0075] in, , , , and The risk coefficient for each of the aforementioned risk items. Based on the ICD risk constant.

[0076] In application, the ICD risk index is a comprehensive quantitative value used to fully assess the likelihood of ICD occurring in the drilling process of the sheet metal. The ICD risk index is constructed by summing the risk items with respective risk coefficients and adding a basic ICD risk constant to obtain the final ICD risk index. Risk coefficient , , , and These coefficients, used to adjust the importance of each risk item in the overall ICD risk assessment, can be determined and optimized based on historical data, expert experience, or experimental results. The basic ICD risk constant represents the basic ICD risk inherent in the board material itself or caused by environmental factors, assuming all parameters are ideal.

[0077] Through the aforementioned technical solution, this application refines ICD risk assessment from a macro-level perspective down to the individual key factors constituting the risk. By independently quantifying the risks of multiple dimensions, such as PE film thickness, resin layer thickness, PCB stack-up thickness, tool life, and drilling parameters, and assigning different influence coefficients for comprehensive consideration, the construction of ICD risk indicators becomes more scientific, comprehensive, and accurate. This meticulous risk item decomposition and weighted combination method effectively avoids overlooking potential ICD risks caused by abnormalities in a single parameter or slight deviations in multiple parameters, thereby significantly improving the sensitivity and accuracy of ICD risk assessment. Therefore, the solution of this application can provide a more refined risk warning and management basis for the board drilling process, helping to promptly identify and correct process deviations or material problems that may lead to ICD, thereby effectively reducing the occurrence rate of ICD and ensuring the quality and production efficiency of board drilling.

[0078] like Figure 4 As shown, in one embodiment, step S3, which involves assessing the drilling risk of the plate material based on the comprehensive risk index and the ICD risk index and generating a risk assessment result, includes: Step S31: If the comprehensive risk index or the ICD risk index is greater than the first risk threshold, generate a first risk assessment result characterizing the high risk of drilling the plate.

[0079] Step S32: If the comprehensive risk index or the ICD risk index is not greater than the first risk threshold but greater than the second risk threshold, generate a risk warning result characterizing the risk in drilling the plate.

[0080] Step S33: If the comprehensive risk index or the ICD risk index is not greater than the second risk threshold, generate a process stability result characterizing the low risk of drilling the plate.

[0081] In application, the comprehensive risk index and ICD risk index are values ​​calculated using the methods described above, quantifying various risk factors that may exist during the drilling process of sheet metal. The first and second risk thresholds are preset numerical boundaries used to classify different risk levels. These thresholds can be determined based on historical data analysis, expert experience, industry standards, or experimental verification. For example, by statistically analyzing a large amount of drilling data, the critical values ​​of indicators leading to high or medium risk can be identified. The first risk assessment result, risk warning result, and process stability result are output information generated by the system based on the comparison between the risk indicators and the thresholds. These results can be presented in various forms, such as text prompts displayed on the user interface (e.g., "High Risk," "Medium Risk," "Process Stable"), color indicators (e.g., red, yellow, green), sound alarms, email notifications, or sent as control commands to automated equipment to trigger corresponding processing flows (e.g., stopping drilling, adjusting parameters, continuing production, etc.).

[0082] In one embodiment, = =50, = =10, = =20, = =30, = 25, =2.0, =1.0; =0.10mm, =1.6mm, =300 holes =280krpm; A=0.02, B=0.08, C=0.09, D=0.11, E=1.8, G=250, I=300. Comprehensive risk index X= =50 0.2+10 0.125+20 0.167+30 0.0714 + 2.0 = 10 + 1.25 + 3.33 + 2.14 + 2.0 = 18.72. ICD risk indicator Y = + =1.5+10+1.25+3.33+2.14+1=19.22.

[0083] The first risk threshold is 10, and the second risk threshold is 5. The comprehensive risk index X = 18.72, and the ICD risk index Y = 19.22, both of which are greater than the first risk threshold of 10. This generates a first risk assessment result characterizing the high risk of drilling the plate. The first risk assessment result includes the risk sources being the aluminum sheet (contribution 10.0) and tool wear (contribution 3.33). This can remind operators to replace the matching aluminum sheet, replace the drill bit (reducing risk item G), and check whether the plate thickness meets the process requirements.

[0084] The above technical solution transforms abstract risk indicators into specific, actionable risk levels (high risk, medium risk, low risk), making drilling risk assessment results more intuitive and understandable. This not only helps operators quickly identify potential problems and take timely preventative or corrective measures to avoid high-risk situations, but also optimizes the production process, improving drilling quality and production efficiency. This tiered assessment mechanism provides a clear decision-making basis for the plate drilling process, significantly enhancing the effectiveness and responsiveness of risk management.

[0085] like Figure 5 As shown, in one embodiment, the method further includes: Step S4: When the actual value of the PCB stack thickness is greater than the upper limit value of the PCB stack thickness, a second risk assessment result characterizing the high risk of drilling holes in the board is generated.

[0086] In applications, if the actual PCB stack-up thickness exceeds the upper limit, it indicates that the physical dimensions of the board have significantly deviated from the standard. PCB stack-up thickness is a critical dimensional parameter in board manufacturing, and its upper limit is the maximum allowable thickness set according to product design and process requirements. When the actual measured PCB stack-up thickness exceeds this upper limit, it may lead to high-risk situations such as uneven tool stress during drilling, decreased hole wall quality, or even tool breakage.

[0087] Step S5: When the actual value of the tool life is less than the lower limit of the tool life, a third risk assessment result characterizing the high risk of drilling the plate is generated.

[0088] In application, if the actual tool life is less than the lower limit, it indicates that the tool is severely worn or its performance has deteriorated. Tool life refers to the time or number of drilling operations a tool can effectively perform while maintaining its cutting performance and machining quality. The lower limit is the minimum permissible life set based on the tool material, structure, machining conditions, and empirical data. When the actual tool life is below this lower limit, continued use will greatly increase the risk of tool breakage, hole wall roughness, and hole diameter deviation during drilling.

[0089] Step S6: When the absolute value of the difference between the actual value of the drilling parameter and the reference value of the drilling parameter is greater than the deviation threshold of the drilling parameter, a fourth risk assessment result characterizing the high risk of drilling the plate is generated.

[0090] In applications, if the absolute value of the difference between the actual drilling parameters and the reference values ​​exceeds the deviation threshold, it indicates that the drilling process conditions are severely out of control. Drilling parameters (such as spindle speed and feed rate) are key process parameters affecting drilling quality and efficiency. The reference values ​​are optimal or standard parameters determined based on factors such as plate type, hole diameter, and tool characteristics. The deviation threshold is the maximum allowable range for drilling parameters to deviate from the reference values. When the deviation between the actual drilling parameters and the reference values ​​exceeds this threshold, it may lead to high risks such as substandard drilling quality, plate damage, and tool failure.

[0091] Through the above technical solution, this application establishes a direct risk assessment mechanism for key parameters, in addition to the conventional comprehensive risk assessment system. This enables the system to perform real-time or near-real-time anomaly monitoring of core elements such as PCB layer thickness, tool life, and drilling parameters. Once these parameters deviate significantly beyond the safe range, a high-risk warning is triggered directly, generating the corresponding risk assessment result, without needing to calculate comprehensive risk indicators and ICD risk indicators. This immediate response capability significantly improves the sensitivity and accuracy of drilling risk assessment, effectively avoiding serious quality problems or equipment damage caused by the loss of control over key parameters, thereby ensuring the stability and reliability of board drilling processing.

[0092] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0093] Figure 6 This is a schematic diagram of the structure of a terminal device provided in an embodiment of this application. Figure 6 As shown, the terminal device 6 in this embodiment includes: at least one processor 60 ( Figure 6 (Only one is shown in the diagram) a processor, a memory 61, and a computer program 62 stored in the memory 61 and executable on the at least one processor 60, wherein the processor 60 executes the computer program 62 to implement the steps in any of the above-described method embodiments.

[0094] The terminal device 6 can be a desktop computer, laptop, handheld computer, cloud server, industrial control computer, digital machine tool, etc. This terminal device may include, but is not limited to, a processor 60 and a memory 61. Those skilled in the art will understand that... Figure 6This is merely an example of terminal device 6 and does not constitute a limitation on terminal device 6. It may include more or fewer components than shown in the figure, or combine certain components, or different components, such as input / output devices, network access devices, etc.

[0095] The processor 60 can be a Central Processing Unit (CPU), or it can be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0096] In some embodiments, the memory 61 may be an internal storage unit of the terminal device 6, such as a hard disk or memory of the terminal device 6. In other embodiments, the memory 61 may be an external storage device of the terminal device 6, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the terminal device 6. Furthermore, the memory 61 may include both internal and external storage units of the terminal device 6. The memory 61 is used to store the operating system, applications, bootloader, data, and other programs, such as the program code of the computer program. The memory 61 can also be used to temporarily store data that has been output or will be output.

[0097] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0098] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0099] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps described in the various method embodiments above.

[0100] like Figure 7 As shown, this application embodiment provides a computer program product 70, including a computer program 62. When the computer program 62 is run, the steps in the above embodiments of the plate drilling risk assessment method are executed.

[0101] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying computer program code to a device / terminal equipment, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0102] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0103] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0104] In the embodiments provided in this application, it should be understood that the disclosed terminal devices and methods can be implemented in other ways. For example, the terminal device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0105] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0106] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for assessing the risk of drilling holes in sheet metal, characterized in that, include: Obtain multiple baseline constant parameters and multiple machining variables related to drilling in sheet metal; A comprehensive risk index and an ICD risk index are constructed based on the aforementioned multiple benchmark constant parameters and multiple processing variables. The drilling risk of the plate is assessed based on the comprehensive risk index and the ICD risk index, and the risk assessment results are generated.

2. The method for assessing drilling risk in sheet metal as described in claim 1, characterized in that, The acquisition of multiple reference constant parameters and multiple processing variables related to drilling of the plate includes: Before drilling the board, baseline values ​​for the resin layer thickness, PCB stack-up thickness, tool life, and drilling parameters related to board drilling are obtained, as well as... Obtain the lower and upper limits of PE film thickness, resin layer thickness, actual and upper limits of PCB stack thickness, actual and lower limits of tool life, actual and deviation thresholds of drilling parameters related to board drilling.

3. The method for assessing drilling risk in sheet metal as described in claim 2, characterized in that, The construction of comprehensive risk indicators and ICD risk indicators based on the multiple benchmark constant parameters and the multiple processing variables includes: A comprehensive risk index is constructed based on the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack thickness, the actual and baseline values ​​of tool life, and the actual and baseline values ​​of drilling parameters.

4. The method for assessing drilling risk in sheet metal as described in claim 3, characterized in that, The construction of the comprehensive risk index and ICD risk index based on the multiple benchmark constant parameters and the multiple processing variables also includes: ICD risk indicators are constructed based on the lower and upper limits of the PE film thickness, the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack thickness, the actual and baseline values ​​of the tool life, and the actual and baseline values ​​of the drilling parameters.

5. The method for assessing drilling risk in sheet metal as described in claim 3, characterized in that, The comprehensive risk index is constructed based on the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack-up thickness, the actual and baseline values ​​of tool life, and the actual and baseline values ​​of drilling parameters, including: A resin thickness influence term is constructed based on the lower and upper limits of the resin layer thickness. Wherein, C is the lower limit of the resin layer thickness, and D is the upper limit of the resin layer thickness. This is a reference value for the thickness of the resin layer; A PCB stack-up thickness influence term is constructed based on the actual value of the PCB stack-up thickness and the baseline value of the PCB stack-up thickness. Where E is the actual value of the PCB stack thickness. This is the reference value for the thickness of the PCB stack-up; A tool life influence term is constructed based on the actual tool life value and the baseline tool life value. Where G is the actual value of the tool life. This serves as a baseline value for tool life. A borehole parameter influence term is constructed based on the actual values ​​and the baseline values ​​of the borehole parameters. Where I is the actual value of the drilling parameters. These are the baseline values ​​for drilling parameters; A comprehensive risk index is constructed based on the resin thickness influence item, the PCB stack-up thickness influence item, the tool life influence item, and the drilling parameter influence item. ,in, , , and The influence coefficients of each of the aforementioned influence items are, This is the basic comprehensive risk constant.

6. The method for assessing drilling risk in sheet metal as described in claim 4, characterized in that, The ICD risk index is constructed based on the lower and upper limits of the PE film thickness, the lower and upper limits of the resin layer thickness, the actual and baseline values ​​of the PCB stack thickness, the actual and baseline values ​​of the tool life, and the actual and baseline values ​​of the drilling parameters. A PE film thickness risk item is constructed based on the lower and upper limits of the PE film thickness. Where A is the lower limit of the PE film thickness and B is the upper limit of the PE film thickness; A resin thickness risk item is constructed based on the lower and upper limits of the resin layer thickness. Wherein, C is the lower limit of the resin layer thickness, and D is the upper limit of the resin layer thickness. This is a reference value for the thickness of the resin layer; A PCB stack-up thickness risk item is constructed based on the actual value of the PCB stack-up thickness and the baseline value of the PCB stack-up thickness. Where E is the actual value of the PCB stack thickness. This is the reference value for the thickness of the PCB stack-up; A tool life risk item is constructed based on the actual value of the tool life and the benchmark value of the tool life. Where G is the actual value of the tool life. This serves as a baseline value for tool life. A borehole parameter risk item is constructed based on the actual values ​​and the baseline values ​​of the borehole parameters. Where I is the actual value of the drilling parameters. These are the baseline values ​​for drilling parameters; ICD risk indicators are constructed based on the PE film thickness risk item, the resin thickness risk item, the PCB stack-up thickness risk item, the tool life risk item, and the drilling parameter risk item. + ; in, , , , and The risk coefficient for each of the aforementioned risk items. Based on the ICD risk constant.

7. The method for assessing drilling risk in sheet metal as described in any one of claims 1 to 6, characterized in that, The step of conducting a drilling risk assessment of the plate material based on the comprehensive risk index and the ICD risk index, and generating a risk assessment result, includes: If the comprehensive risk index or the ICD risk index is greater than the first risk threshold, a first risk assessment result characterizing the high risk of drilling the plate is generated. If the comprehensive risk index or the ICD risk index is not greater than the first risk threshold but greater than the second risk threshold, a risk warning result characterizing the risk in drilling the plate is generated. If the comprehensive risk index or the ICD risk index is not greater than the second risk threshold, a process stability result characterizing the low risk of drilling the plate is generated.

8. The method for assessing drilling risk in sheet metal as described in any one of claims 2 to 6, characterized in that, The method further includes: When the actual value of the PCB stack thickness is greater than the upper limit value of the PCB stack thickness, a second risk assessment result is generated to characterize the high risk of drilling into the board material. When the actual value of the tool life is less than the lower limit of the tool life, a third risk assessment result is generated to characterize the high risk of drilling the plate. When the absolute value of the difference between the actual value of the drilling parameter and the reference value of the drilling parameter is greater than the deviation threshold of the drilling parameter, a fourth risk assessment result characterizing the high risk of drilling the plate is generated.

9. A terminal device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method as described in any one of claims 1 to 8.

10. A computer program product, characterized in that, Includes a computer program, which, when run, causes the method described in any one of claims 1 to 8 to be performed.

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