A building full life cycle management method and system based on digital twinning

Abstract

The application relates to the technical field of digital twinning, and discloses a building full-life-cycle management method and system based on digital twinning, wherein the building full-life-cycle management method based on digital twinning comprises the following steps: step S1, establishing a component adjacency graph; step S2, generating apparent thermal resistance; step S3, obtaining a component residual error; step S4, calculating abnormal strength; step S5, generating residual thermal resistance; step S6, generating an additional thickness; and step S7, outputting a power reduction. Through the establishment of a component adjacency calculation graph, the BIM model can be converted into a calculable digital twinning basic carrier; in combination with an adjacency conduction weight, an adjacent residual error and abnormal strength, operation abnormalities can be converted into a component thermal resistance state of a life cycle stage; through long-period degradation evolution calculation, predictive life cycle evaluation can be realized; and through automatic back-calculation of a reconstruction thickness, the generation efficiency of a reconstruction scheme is improved.

Description

Technical Field

[0001] This invention relates to the field of digital twin technology, and more specifically, to a method and system for building lifecycle management based on digital twins. Background Technology

[0002] With the digital development of the construction industry, digital twin technology is gradually being applied to the entire lifecycle management of buildings. Currently, the operation and maintenance management of most buildings still relies on manual inspections, which is inefficient and makes it difficult to detect hidden structural performance degradation issues. The introduction of digital twin technology can achieve synchronous mapping between the physical building and the virtual model, providing digital support for operation and maintenance management. At present, most digital twin building management systems mainly focus on 3D visualization or simple energy consumption monitoring, lacking in-depth analysis capabilities for the thermal performance of the building envelope.

[0003] In existing technologies, monitoring the thermal performance of building envelopes typically involves placing sensors on the surface of the components to collect data such as temperature, heat flux, and humidity. Based on this data, the apparent thermal resistance of the components is then calculated to determine if performance degradation has occurred. Some technologies introduce humidity correction to adjust the apparent thermal resistance and eliminate its impact. However, most of these correction methods only consider the current surface humidity and do not account for the cumulative effect of historical humidity on the internal humid and thermal state of the components.

[0004] This leads to a situation where existing technologies, when identifying anomalies, are prone to misinterpreting historical high humidity-induced thermal resistance decreases as structural performance degradation, resulting in false alarms. Furthermore, existing anomaly identification technologies mostly assess residuals in individual components, making it difficult to distinguish between isolated sensor measurement errors and structurally propagating damp heat retention anomalies, thus resulting in low reliability. In addition, most existing technologies can only provide immediate anomaly alarms, failing to predict long-term component degradation or automatically generate modification plans, requiring manual secondary conversion, which is inefficient. Summary of the Invention

[0005] This invention provides a method and system for building lifecycle management based on digital twins, which solves the technical problems mentioned in the background.

[0006] This invention provides a building lifecycle management method based on digital twins, comprising the following steps: Step S1: Extract component parameters, material parameters and boundary parameters from the building digital model to establish a component adjacency diagram, and calculate the initial thermal resistance, total heat capacity and adjacency conductivity. Step S2: Collect the inner temperature, outer temperature, outward heat flux density and surface relative humidity, calculate the temperature difference between the two sides by combining the inner temperature and outer temperature, and calculate the apparent thermal resistance based on the temperature difference between the two sides and the outward heat flux density. Step S3: Calculate the time constant based on the initial thermal resistance and total heat capacity, calculate the humidity memory based on the surface relative humidity and time constant, calculate the corrected thermal resistance based on the initial thermal resistance and humidity memory, and compare the corrected thermal resistance with the apparent thermal resistance to obtain the component residual. Step S4: Calculate the adjacent conduction weight based on the adjacent conduction volume, extract the adjacent residuals associated with adjacent components, and calculate the anomaly intensity by combining the component residuals, adjacent conduction weights, and adjacent residuals. Step S5: Calculate the degradation rate by combining the abnormal intensity and humidity memory, calculate the cumulative degradation depth by time integration of the degradation rate, and calculate the remaining thermal resistance by combining the cumulative degradation depth, humidity memory and initial thermal resistance. Step S6: Extract the preset target thermal resistance, compare the remaining thermal resistance with the preset target thermal resistance to obtain the thermal resistance difference, and calculate the supplementary thickness based on the thermal resistance difference. Step S7: Calculate the updated thermal resistance based on the added thickness and remaining thermal resistance, and calculate the power reduction by combining the component area, updated thermal resistance, temperature difference between the two sides, and remaining thermal resistance.

[0007] This invention provides a building lifecycle management system based on digital twins, comprising: The component adjacency graph creation module is used to extract component parameters, material parameters, and boundary parameters from the building digital model to create a component adjacency graph, and to calculate the initial thermal resistance, total heat capacity, and adjacency conductivity. The apparent thermal resistance generation module is used to collect the inner temperature, outer temperature, outward heat flux density and surface relative humidity, calculate the temperature difference between the two sides by combining the inner temperature and outer temperature, and calculate the apparent thermal resistance based on the temperature difference between the two sides and the outward heat flux density. The component residual generation module is used to calculate the time constant based on the initial thermal resistance and total heat capacity, calculate the humidity memory based on the surface relative humidity and time constant, calculate the corrected thermal resistance based on the initial thermal resistance and humidity memory, and obtain the component residual by comparing the corrected thermal resistance with the apparent thermal resistance. The abnormal intensity generation module is used to calculate the adjacent conduction weight based on the adjacent conduction volume, extract the adjacent residual associated with adjacent components, and calculate the abnormal intensity by combining the component residual, the adjacent conduction weight and the adjacent residual. The residual thermal resistance generation module is used to calculate the degradation rate by combining the abnormal intensity and humidity memory, calculate the cumulative degradation depth by time integration of the degradation rate, and calculate the residual thermal resistance by combining the cumulative degradation depth, humidity memory and initial thermal resistance. The supplementary thickness generation module is used to extract the preset target thermal resistance, compare the remaining thermal resistance with the preset target thermal resistance to obtain the thermal resistance difference, and calculate the supplementary thickness based on the thermal resistance difference. The power reduction output module is used to calculate the updated thermal resistance based on the added thickness and remaining thermal resistance, and to calculate the power reduction by combining the component area, updated thermal resistance, temperature difference between the two sides, and remaining thermal resistance.

[0008] The beneficial effects of this invention are as follows: By extracting component parameters, material parameters, and boundary parameters from a building digital model and establishing a component adjacency graph, this invention achieves a unified organization of building envelope components from geometric objects to thermal calculation objects; by collecting internal and external temperatures, outward heat flux density, and surface relative humidity, and forming the temperature difference between the two sides, apparent thermal resistance, humidity memory, corrected thermal resistance, and component residuals, it can reflect the current thermal state and historical humidity influence without damaging the components; by combining adjacency conduction weights, adjacent residuals, and anomaly intensity, and further forming degradation rate, cumulative degradation depth, and residual thermal resistance, it can transform operational anomalies into the component thermal resistance state at the life cycle stage; by comparing with preset target thermal resistance and calculating supplementary thickness, updated thermal resistance, and reduced power, it can provide component-level results for insulation repair, model updates, and heat transfer power assessment, and facilitate the verification and marking of components with insufficient data quality. This invention is applicable to the operation and maintenance of public building envelopes, pre-assessment of energy-saving renovations, and verification of renovation plans, and helps to form traceable and updatable engineering management results under non-destructive data collection conditions. Attached Figure Description

[0009] Figure 1 This is a calculation flowchart of a building lifecycle management method based on digital twins according to the present invention; Figure 2 This is a schematic diagram of a building lifecycle management system based on digital twins according to the present invention. Detailed Implementation

[0010] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the subject matter described herein, and changes may be made to the function and arrangement of the elements discussed without departing from the scope of this specification. Various processes or components may be omitted, substituted, or added as needed in the examples. Furthermore, features described in some examples may be combined in other examples.

[0011] It should be noted that, unless otherwise defined, the technical or scientific terms used in one or more embodiments of the present invention should have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in one or more embodiments of the present invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" indicate that the element or object preceding the term encompasses the elements or objects listed following the term and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0012] like Figures 1-2 As shown, a building lifecycle management method based on digital twins includes the following steps: Step S1: Extract component parameters, material parameters and boundary parameters from the building digital model to establish a component adjacency diagram, and calculate the initial thermal resistance, total heat capacity and adjacency conductivity. Step S2: Collect the inner temperature, outer temperature, outward heat flux density and surface relative humidity, calculate the temperature difference between the two sides by combining the inner temperature and outer temperature, and calculate the apparent thermal resistance based on the temperature difference between the two sides and the outward heat flux density. Step S3: Calculate the time constant based on the initial thermal resistance and total heat capacity, calculate the humidity memory based on the surface relative humidity and time constant, calculate the corrected thermal resistance based on the initial thermal resistance and humidity memory, and compare the corrected thermal resistance with the apparent thermal resistance to obtain the component residual. Step S4: Calculate the adjacent conduction weight based on the adjacent conduction volume, extract the adjacent residuals associated with adjacent components, and calculate the anomaly intensity by combining the component residuals, adjacent conduction weights, and adjacent residuals. Step S5: Calculate the degradation rate by combining the abnormal intensity and humidity memory, calculate the cumulative degradation depth by time integration of the degradation rate, and calculate the remaining thermal resistance by combining the cumulative degradation depth, humidity memory and initial thermal resistance. Step S6: Extract the preset target thermal resistance, compare the remaining thermal resistance with the preset target thermal resistance to obtain the thermal resistance difference, and calculate the supplementary thickness based on the thermal resistance difference. Step S7: Calculate the updated thermal resistance based on the added thickness and remaining thermal resistance, and calculate the power reduction by combining the component area, updated thermal resistance, temperature difference between the two sides, and remaining thermal resistance.

[0013] In one embodiment of the present invention, in step S1, for the component Obtain the first from the building digital model Layer material thickness and the Initial thermal conductivity of the layer material According to the Layer material thickness and the first The calculation process for the initial thermal resistance of the layer material, based on its initial thermal conductivity, is as follows: Will Divide by To obtain single-layer thermal resistance, and to make the component From the Layer to the first The thermal resistance of each single layer is accumulated to obtain the component. initial thermal resistance ; For components Obtain component area from building digital model , No. Layer material density , No. Specific heat capacity of layered materials and the Layer material thickness The calculation process for the total heat capacity, based on the component area, material density, specific heat capacity, and thickness, is as follows: Will , and Multiply to obtain the single-layer heat capacity, and then multiply the components. From the Layer to the first The heat capacity of each layer is added together and then multiplied by the area of ​​the component. Obtain components Total heat capacity ; For adjacent components and components Obtaining components from building digital models With components Shared interface area The calculation process for adjacent conduction based on the shared interface area and initial thermal resistance is as follows: Will As molecules, components initial thermal resistance With components initial thermal resistance The sum is used as the denominator, and the ratio of the numerator to the denominator is calculated to obtain the component. With components Adjacent conduction between .

[0014] It should be noted that a building digital model is a digital building model that includes component objects, component spatial relationships, component material layers, and component boundary attributes, representing the identifiable and manageable enclosure components and their associated information in a physical building.

[0015] The enclosure component set is a collection of component objects that participate in the separation between the external environment and the indoor environment, representing the scope of exterior walls, roofs, floor edges, window frame perimeter walls, and other components involved in heat transfer within the enclosure.

[0016] The component area is the surface area of ​​a single enclosure component involved in heat transfer calculations, representing the geometric dimensions of the component in relation to heat flow conversion and power reduction estimation.

[0017] The number of component layers refers to the number of material layers that a single enclosure component is divided into along the thickness direction, which characterizes the complexity of the layered structure formed by the stacking of different materials.

[0018] The thickness of each layer is the thickness of each material layer in the component along the main heat transfer direction, which characterizes the contribution of the material layer to the initial thermal resistance and total heat capacity.

[0019] The initial thermal conductivity of each layer is a parameter of the thermal conductivity of the material under the design or calibration conditions. It is a material parameter, and the preferred values ​​are obtained from material testing reports, as-built data, or a confirmed material library. The rule for selecting values ​​is that the measured values ​​are preferred for the same batch of materials.

[0020] The density of each layer is the mass per unit volume of the material, which is a material parameter. The preferred values ​​are obtained from material testing reports, as-built data, or a confirmed material library. The rule for assigning values ​​is to assign values ​​to the actual material layers within the same component.

[0021] The specific heat capacity of each layer is the heat storage capacity corresponding to the temperature change per unit mass of the material. It is a material parameter, and the preferred values ​​are obtained from material testing reports, as-built data, or a confirmed material library. The rule for taking the values ​​is to keep them consistent for the same material in the same operating phase.

[0022] The shared interface area of ​​adjacent components is the area where two components come into contact or form a common boundary in the building digital model, representing the geometric channel scale of thermal influence transmission between components.

[0023] The initial thermal resistance is the area thermal resistance of the component under the calculated design or calibration conditions, which characterizes the heat transfer resistance of the component without taking into account operational degradation and the current effects of moisture.

[0024] Total heat capacity is the calculated overall heat storage capacity of the component, characterizing the fundamental impact of the component on temperature fluctuations and hygrothermal response hysteresis.

[0025] Adjacent conductance is the quantified result of thermal influence transfer between adjacent components obtained by calculation, which characterizes the strength of adjacent influence under the combined action of shared interface and initial thermal resistance of both parties.

[0026] It should be noted that the building digital model should undergo object cleanup and unit standardization before being used in calculations. Specifically, only components involved in heat transfer within the building envelope should be extracted from the model; interior decorative surfaces, furniture, equipment casings, and internal components not involved in external heat transfer can be excluded. Thickness should be standardized to meters, area to square meters, thermal conductivity to watts per meter Kelvin, density to kilograms per cubic meter, and specific heat capacity to jols per kilogram Kelvin. For example, an exterior wall component with an area of ​​42 square meters, an insulation layer thickness of 0.08 meters, and an insulation material thermal conductivity of 0.04 watts per meter Kelvin, and a base wall thickness of 0.20 meters and a base material thermal conductivity of 0.81 watts per meter Kelvin, should all be bound to the same exterior wall component identifier before subsequent calculations.

[0027] It should be noted that the shared interface area between adjacent components should be determined by the geometric contact relationships and spatial topological relationships in the building digital model. For parts such as exterior walls and roofs, exterior walls and floor slab edges, and exterior walls and window frame perimeter walls, the contact surfaces, overlap surfaces, or boundary surfaces between components in the model can be used as shared interfaces. If the model only provides component edges and lacks explicit contact surfaces, the equivalent shared interface area can be formed according to the contact length and structural thickness of the actual structural nodes, and the source mark should be retained in the data table. For example, when the contact length between the exterior wall and the floor slab edge is 12 meters and the equivalent contact width is 0.20 meters, the shared interface area can be recorded as 2.4 square meters and entered as a boundary parameter into the component adjacency diagram.

[0028] It should be noted that when material parameters are missing, values ​​that do not match the actual material should not be entered arbitrarily. First, supplement the missing parameters based on as-built documentation, material testing reports, the engineering material library, or data from components in the same batch. If it is still difficult to confirm, the component should be marked as pending verification, and the data quality mark should be retained in the calculation results. For example, if the name of the roof insulation material is clear but the thermal conductivity is missing, 0.035 Kelvin per meter from the material testing report can be used as the initial thermal conductivity. If it is only recorded as insulation board without a specific material type, the final thickness output for the renovation can be temporarily withheld, and it can be included in the batch calculation after on-site verification.

[0029] Enclosure components are typically composed of multiple layers of materials. Thickness, thermal conductivity, density, and specific heat capacity affect the thermal resistance and thermal inertia of the components, respectively. The shared interfaces between adjacent components determine whether thermal effects can be transmitted along wall-roof junctions, floor edges, and window frames. This embodiment extracts component parameters, material parameters, and boundary parameters from the building's digital model and forms a component adjacency graph, transforming the geometric model into component-level physical calculation objects. This ensures consistency in component identification, material layer data, and adjacent boundary data during subsequent operation, reducing the amount of manual work involved in repeatedly matching data between the model and data tables.

[0030] In one embodiment of the present invention, in step S2, for the component The calculation process for the temperature difference between the two sides, based on the inner and outer temperatures, is as follows: Calculate the time inner temperature Subtract the outer temperature Obtain components At the calculation time Temperature difference on both sides ; The calculation process for apparent thermal resistance based on the temperature difference between the two sides and the outward heat flux density is as follows: Components At the calculation time Temperature difference on both sides The absolute value of the component is used as the numerator. At the calculation time outward heat flux density absolute value and stable term The sum is used as the denominator, and the ratio of the numerator to the denominator is calculated to obtain the component. At the calculation time apparent thermal resistance .

[0031] It should be noted that the inner temperature refers to the indoor surface temperature of the component or the equivalent boundary temperature of the indoor side, which can be obtained by using a patch temperature sensor, a wireless temperature node, or a temperature measurement point in the area adjacent to the component in the building management system.

[0032] The outer temperature is the outdoor surface temperature of the component or the equivalent boundary temperature of the outdoor side, which can be obtained by outdoor surface temperature sensors, exterior facade temperature nodes, or environmental temperature recording devices corresponding to the component's location.

[0033] Outward heat flux density is the heat flux intensity per unit area from the inside to the outside of a component, which can be obtained by heat flux plate, thin heat flux meter or heat flux sensor calibrated on site.

[0034] Surface relative humidity refers to the relative humidity of the air or material environment near the surface of a component. It can be obtained by capacitive humidity sensors, wall temperature and humidity nodes, or inspection-type humidity recorders.

[0035] The temperature difference between the two sides is the difference between the calculated inner and outer temperatures of the component, which characterizes the heat transfer driving intensity of the component at the calculation time.

[0036] The stability term is a preset non-zero value used to avoid instability in the calculation of apparent thermal resistance when the outward heat flux density is close to zero. It is a preset parameter, and the preferred value is 0.05 to 0.20 watts per square meter. The value is determined by the rule that it is less than the conventional effective heat flux density and greater than the sensor noise level.

[0037] Apparent thermal resistance is the calculated area thermal resistance of a component under the current acquisition conditions, characterizing the instantaneous thermal state reflected by temperature difference and heat flow response.

[0038] It should be noted that the inner temperature, outer temperature, and outward heat flux density should be bound to the same component identifier and the same calculation time. For cases where the sensor installation location is offset from the building's digital model component, matching can be performed based on three types of information: the nearest component, the outer boundary of the room to which it belongs, and the installation record. For cases where multiple measuring points are set on the same component, obviously abnormal measuring points can be eliminated first, and then the average value within the same time window can be used as the component input. For example, if three temperature nodes are arranged on the inner side of an exterior wall with a sampling interval of 10 minutes, and one node shows a sudden change of more than 8 degrees Celsius compared to the other two nodes, it can be marked as needing verification, and the average temperature of the remaining two nodes can be used as the inner temperature.

[0039] It should be noted that the direction of the outward heat flux density should be consistent with the inner and outer directions of the component model. When installing the heat flux plate on site, the positive direction of the sensor should be marked in the equipment record; if the output direction of the equipment is opposite to the system-defined direction, the direction should be reversed during data access. For example, if the system defines outward as from indoors to outdoors, and a heat flux plate outputs a positive value indicating from outdoors to indoors, the data access program should correct the direction of the heat flux density and save the original and corrected values ​​in the calculation table for subsequent verification.

[0040] It should be noted that the stability term is only used to improve numerical stability and is not used as an empirical threshold for judging anomalies. When the weather is stable or the temperature difference between indoors and outdoors is small, the outward heat flux density may be close to the sensor resolution. In this case, the apparent thermal resistance is more sensitive to small noises; the system can add a low heat flux quality marker while retaining the results. For example, if the effective resolution of the heat flux meter is 0.02 W / m², and the stability term in the calculation is 0.10 W / m², when the heat flux density is 0.03 W / m² and the temperature difference between the two sides is 0.5 degrees Celsius at a certain moment, the result at that moment can be used for trend recording, but it should not be used as the sole basis for modification decisions.

[0041] The heat transfer state of a component during operation is reflected by both the boundary temperature difference and the heat flow response through the component. Temperature changes alone are usually insufficient to characterize the true heat transfer resistance of the material layer, and heat flow changes alone are also affected by indoor and outdoor boundary conditions. This embodiment binds the inner temperature, outer temperature, and outward heat flow density to the corresponding component, forming the temperature difference between the two sides and the apparent thermal resistance. This transforms a small number of field-collected parameters into evaluation results with the same dimensions as the component's thermal performance. This provides a unified input for subsequent calculations of corrected thermal resistance, component residuals, and residual thermal resistance, reducing interpretation differences between data sources from different sensors.

[0042] In one embodiment of the present invention, in step S3, for the component The calculation process for the time constant, based on the initial thermal resistance, total heat capacity, component area, and material hygrothermal retention coefficient, is as follows: Initial thermal resistance With total heat capacity Multiply, then divide the product by the area of ​​the component. Multiply by the material's damp heat retention coefficient Obtain components time constant ; The formula for calculating humidity memory based on surface relative humidity and time constant is as follows: ; in, Representing components At the calculation time Humidity memory capacity, Representing components time constant, Representing components At the time of integration Surface relative humidity, Indicates the time of integration within the formula. Indicates the calculation time Integral time and time constant The exponential decay factor constituted; The calculation process for the corrected thermal resistance, based on the initial thermal resistance and humidity memory, is as follows: Components initial thermal resistance As a molecule, the humidity influence coefficient Humidity memory Add one to the product of the products and use the result as the denominator. Calculate the ratio of the numerator to the denominator to obtain the component. At the calculation time Corrected thermal resistance ; Based on the corrected thermal resistance, apparent thermal resistance, and initial thermal resistance, the formula for calculating the component residual is as follows: ; ; in, Representing components At the calculation time The normalized residual, Representing components At the calculation time Corrected thermal resistance, Representing components At the calculation time apparent thermal resistance, Representing components The initial thermal resistance, Representing components At the calculation time The component residuals.

[0043] It should be noted that the material moisture retention coefficient is a custom parameter that characterizes the difference in the material's moisture absorption, diffusion and release rates. The preferred value is 0.5 to 3.0. The rule for the value is that materials with higher porosity and slower release should take a larger value, while dense materials with faster moisture absorption and release should take a smaller value.

[0044] The time constant is the time scale for the duration of the component's damp heat effect obtained from the calculation, characterizing the time range within which historical surface relative humidity still has an impact on the current corrected thermal resistance.

[0045] The humidity memory value is a weighted result of the historical relative humidity of the surface obtained through calculation, which characterizes the cumulative degree of the influence of near-surface humidity of the component at the current moment.

[0046] The humidity influence coefficient is a custom parameter that characterizes the influence of humidity memory on the corrected thermal resistance. The preferred value is 0.1 to 2.0, and the value is determined based on the test or on-site calibration data of the change in thermal conductivity of the material after it gets damp.

[0047] The corrected thermal resistance is the area thermal resistance after being calculated and affected by humidity memory, which characterizes the usable thermal resistance level of the component relative to the initial thermal resistance under the current humid and hot conditions.

[0048] The normalized residual is the relative difference between the calculated corrected thermal resistance and the apparent thermal resistance, representing the degree of deviation when the apparent thermal resistance is lower than the humidity correction expectation.

[0049] The component residual is the non-negative residual result obtained by calculation, which represents the component anomaly after retaining only the direction of thermal resistance decrease.

[0050] It should be noted that the surface relative humidity should be standardized to a normalized value between 0 and 1 before being included in the calculation. If the field device outputs a percentage, the conversion should be completed during data access, and the sensor range, installation height, and installation location should be recorded. For locations such as the inside of roofs, the inside of exterior walls, and around window frames, sensors should be avoided in areas significantly affected by condensation droplets and rain to reduce the bias of the collected values ​​towards local liquid water. For example, if the output of a wall surface temperature and humidity node is 75%, the system should internally record it as 0.75, while saving the original data source and acquisition time.

[0051] It should be noted that the humidity memory should be determined based on the historical time period according to the time constant, and implemented using discrete data that matches the sampling interval. In practice, the system can use sampling intervals of 5 minutes, 10 minutes, 30 minutes, or 1 hour. When there are short-term gaps in historical data, adjacent valid values ​​can be used to linearly fill in the gaps. If consecutive gaps exceed 20% of the time constant, the calculation result for that moment should be marked as insufficient data. For example, if the time constant of a certain exterior wall component is 72 hours and the on-site sampling interval is 10 minutes, then the system uses the surface relative humidity sequence of the past 72 hours to form the humidity memory.

[0052] It should be noted that the material's damp heat retention coefficient and humidity influence coefficient can be verified through material data, short-term on-site calibration, or historical operation and maintenance data. For the same structural layer combination, the recommended value from the material library can be used first, and then corrected based on the change in apparent thermal resistance measured by the heat flow plate. For exterior walls that are subject to long-term rain and moisture, the material's damp heat retention coefficient can be selected between 1.5 and 3.0, while for lightweight parts with good ventilation, it can be selected between 0.5 and 1.5. For example, the thermal conductivity of a certain porous insulation material changes significantly after being exposed to moisture. After a 30-day comparative test, the humidity influence coefficient was set to 0.8 and kept consistent throughout the same batch of exterior wall components.

[0053] When porous materials are exposed to humid environments, the moisture in the pores alters their thermal conductivity. Furthermore, there is a lag between moisture adsorption and release; therefore, the current surface relative humidity is often insufficient to fully represent the internal humid and thermal state of the component. This embodiment describes the impact of historical humidity using a time constant and humidity memory, and characterizes the deviation in the direction of thermal resistance decrease by correcting for thermal resistance and component residuals. This allows for the correlation between short-term data acquisition and the material's long-term humid and thermal response, enabling anomaly detection to be independent of a single-moment humidity reading and providing humidity-historical-related input for lifecycle degradation calculations.

[0054] In one embodiment of the present invention, in step S4, the formula for calculating the adjacent conduction weight based on the adjacent conduction volume is as follows: ; in, Representing components For components Adjacency conduction weight, Representing components With components Adjacent conduction between them Representation and Components Adjacent sets of components, Representing components With component set Middle components Adjacent conduction between; Based on the component residuals, adjacent conduction weights, and adjacent residuals, the formula for calculating the anomaly intensity is as follows: ; in, Representing components At the calculation time abnormal intensity, Representing components At the calculation time Component residuals Representing components The adjacency influence coefficient, Representation and Components Adjacent sets of components, Representing components For components Adjacency conduction weight, Representing components At the calculation time The adjacent residuals.

[0055] It should be noted that the adjacent component set is the set of components that share an interface or common boundary with the target component in the building digital model, representing the range of components that may have a thermal impact on the target component.

[0056] The adjacency conduction weight is the calculated relative conduction contribution of adjacent components to the target component, representing the proportion of the impact of each of the multiple adjacent components on the abnormal propagation of the target component.

[0057] The adjacent residual is the component residual corresponding to the adjacent components of the target component at the same calculation time, which represents the abnormal state of the direction of thermal resistance decrease of the surrounding components.

[0058] The adjacency influence coefficient is a custom parameter that characterizes the degree to which the target component receives the influence of adjacent residuals. The preferred value is between 0 and 1. The value is determined by taking a larger value for components with significant thermal bridging effects or continuous shared interfaces, and a smaller value for components with smaller shared interfaces or significant separations.

[0059] The abnormal intensity is the combined result of the weighted influence of the residual of the target component itself and the residual of its adjacent components, and it characterizes the intensity of thermal resistance reduction exhibited by the component and its adjacent regions.

[0060] It should be noted that the set of adjacent components should be given by the component adjacency diagram, and objects that are only close in the model but do not have thermally affected boundaries should be excluded. For junctions between exterior walls and roofs, edges between exterior walls and floor slabs, and exterior walls and the walls surrounding window frames, objects with a non-zero shared interface area can be included in the set of adjacent components. For objects with expansion joints, air gaps, or discontinuous connections, the boundary parameters should be used to determine whether to retain the adjacency relationship. For example, if an exterior wall has a continuous contact surface with the walls surrounding a window frame, and the shared interface area is 1.2 square meters, then the walls surrounding the window frame can be considered as adjacent components of that exterior wall.

[0061] It should be noted that the adjacency connectivity weight should be normalized across all adjacent components of the target component. If the target component has no adjacent components, or if all adjacent connectivity is difficult to obtain effectively due to missing data, the adjacency influence term for the target component can be set to zero, and the data quality can be marked as insufficient adjacency. If some adjacent components lack component residuals, the same calculation process should be performed on those adjacent components first; if they are still missing, they should not participate in this adjacency weighting. For example, if a roof edge component has only one valid adjacent exterior wall component, then that exterior wall component accounts for the entire valid adjacent contribution in this adjacency weighting.

[0062] It should be noted that adjacent residuals should use data from the same calculation time. If the sampling times of different sensors are not completely consistent, interpolation or window averaging can be performed using a unified time grid. The window length should be shorter than the period of significant changes in the thermal environment in the current scenario, typically ranging from 10 minutes to 1 hour; for facades with rapidly changing sunlight, a shorter window can be used. For example, if the abnormal intensity of an exterior wall component is calculated at 10:00 AM, and the most recent sampling times of the components around the window frame are 9:50 AM and 10:10 AM, adjacent residuals at 10:00 AM can be obtained through time interpolation.

[0063] The decrease in thermal resistance in building envelope structures often extends along shared interfaces, thermal bridge nodes, and continuous material layers. When an anomaly occurs at a measurement point on a single component, it is necessary to determine whether it is structurally related to the thermal response of adjacent components. This embodiment incorporates the anomaly intensity of the target component into the adjacent residuals by using adjacent conduction weighting, so that adjacent components with larger shared interface areas and higher conduction have a greater impact. This allows for the differentiation between isolated measurement point fluctuations and anomalies with component-related relationships, and provides inputs that are more consistent with the component topology for subsequent degradation rate calculations.

[0064] In one embodiment of the present invention, in step S5, the formula for calculating the degradation rate based on the abnormal intensity and humidity memory is as follows: ; in, Representing components At the calculation time The rate of degradation, Representing components The baseline degradation factor, Representing components At the calculation time abnormal intensity, Representing components Humidity acceleration coefficient, Representing components At the calculation time Humidity memory capacity; The formula for calculating the cumulative degradation depth based on the degradation rate is as follows: ; in, Representing components At the calculation time The cumulative depth of degradation, Representing components At the initial moment The cumulative depth of degradation, Representing components At the initial moment, Representing components At the time of integration The rate of degradation, Indicates the time of integration within the formula; The formula for calculating the remaining thermal resistance is as follows, based on the cumulative degradation depth, humidity memory, and initial thermal resistance: ; in, Representing components At the calculation time Residual thermal resistance, Representing components The initial thermal resistance, Representing components At the calculation time The cumulative depth of degradation, Representing components The humidity influence coefficient, Representing components At the calculation time Humidity memory.

[0065] It should be noted that the baseline degradation coefficient is a custom parameter that characterizes the degradation trend of a component caused by abnormal strength per unit time. The preferred value is one part per million to one part per ten thousand per day. The value is determined based on the material durability level, existing maintenance records and on-site calibration results.

[0066] The humidity acceleration factor is a custom parameter that characterizes the effect of humidity memory on the degradation rate. It is preferably set to a value between 0 and 2.0. The rule for setting the value is to take a larger value for components that are in a high humidity environment for a long time and whose materials are sensitive to moisture absorption.

[0067] The degradation rate is the rate at which the calculated percentage of thermal resistance degradation of a component increases over time, characterizing the rate of degradation change under the combined effects of abnormal strength and humidity memory.

[0068] The initial moment is the starting point for life cycle assessment or system cumulative calculation. It is a preset parameter, and the value is determined by the time when the sensing system is operating stably and the basic material parameters have been verified.

[0069] The cumulative degradation depth at the initial moment is the relative degradation ratio that already exists at the initial moment. It is a preset parameter, and the preferred value is 0 to 0.30. The value rule is that newly built components can be 0, and existing components are assigned a value according to the test and evaluation results.

[0070] The cumulative degradation depth is the calculated long-term degradation ratio of the component relative to its initial thermal resistance, characterizing the degree of thermal resistance loss accumulated from the initial moment to the calculation moment.

[0071] Residual thermal resistance is the area thermal resistance that a component can still provide under the combined influence of cumulative degradation depth and humidity memory, and it characterizes the thermal resistance status used for retrofitting at the current life cycle stage.

[0072] It should be noted that the time unit for the degradation rate should be consistent with the integration time unit. If the system updates the degradation status daily, the baseline degradation coefficient should be in daily units; if the system updates hourly, it should be converted to hourly units. For example, if a component is updated daily, the baseline degradation coefficient is one ten-thousandth of a day, and the humidity acceleration factor is 0.8, then the system updates the degradation rate daily based on the abnormal intensity and humidity memory amount of the day, and writes the result into the component's lifecycle record.

[0073] It should be noted that the cumulative degradation depth should be consistent with the interpretable range of the actual project. For new buildings, the initial cumulative degradation depth is usually taken as 0; for existing buildings, an initial value can be given based on heat flow testing, material sampling testing, or historical maintenance data. The cumulative degradation depth should not be continuously extrapolated. When it reaches a high value close to 1, it should be marked as a component condition requiring on-site verification. For example, if an existing exterior wall is found to have a 10% decrease in thermal resistance compared to the design state after testing, the initial cumulative degradation depth can be set to 0.10.

[0074] It should be noted that a reasonableness check should be performed before outputting the residual thermal resistance. The residual thermal resistance should be positive and consistent with the component material structure, on-site heat flow testing, and historical trends. If a single data point causes a sudden drop in residual thermal resistance, it should be verified in conjunction with sensor quality markings, weather changes, and construction and maintenance records. For example, if the residual thermal resistance of a roof component remains stable between 2.1 and 2.3 Kelvin per watt for 30 consecutive days, and on a certain day a malfunction of the external temperature sensor results in a value of 0.5 Kelvin per watt, this result should be marked as abnormal sampling and should not be used for thickness calculations.

[0075] The degradation of the thermal performance of building envelope components is cumulative over time. When damp conditions and component-related anomalies persist, the available thermal resistance of the components gradually changes over operating time. This embodiment converts the anomaly intensity and humidity memory into a degradation rate, and then uses this rate to accumulate the cumulative degradation depth, which in turn forms the residual thermal resistance. This allows short-term anomalies in operational monitoring to be transformed into interpretable thermal resistance results for the entire lifecycle, enabling subsequent insulation repair decisions to consider not only a single heat flow response but also the ongoing historical impact.

[0076] In one embodiment of the present invention, in step S6, for the component The calculation process for the thermal resistance difference based on the remaining thermal resistance and the preset target thermal resistance is as follows: Preset target thermal resistance Subtract the remaining thermal resistance Obtain the thermal resistance difference; The calculation process for the supplementary thickness based on the thermal resistance difference is as follows: When the thermal resistance difference is less than zero, the positive thermal resistance difference is assigned a value of zero; when the thermal resistance difference is greater than or equal to zero, the positive thermal resistance difference is assigned a value equal to the thermal resistance difference. The positive thermal resistance difference is then compared with the thermal conductivity of the repair material. Multiplication yields the supplementary thickness ;in, Representing components The preset target thermal resistance, Representing components At the calculation time Residual thermal resistance, Representing components The thermal conductivity of the repair material, Representing components At the calculation time The added thickness.

[0077] It should be noted that the preset target thermal resistance is the area thermal resistance that the component should achieve under the target of renovation or maintenance. It is a preset parameter, and the preferred value is determined based on the building type, the enclosure part and the energy-saving renovation level. The rule for the value is that the same target is used for the same enclosure part within the same evaluation batch.

[0078] The thermal resistance difference is the difference between the calculated preset target thermal resistance and the remaining thermal resistance, representing the degree to which the current thermal resistance of the component is insufficient relative to the modification target.

[0079] Positive thermal resistance difference is a non-negative thermal resistance gap obtained from the thermal resistance difference value, which represents the area thermal resistance that needs to be supplemented only when the remaining thermal resistance is lower than the preset target thermal resistance.

[0080] The thermal conductivity of the repair material is a parameter representing the thermal conductivity of the selected supplementary or repaired insulation material. It is a preset parameter, with a preferred value of 0.020 to 0.080 watts per meter Kelvin. The rule for selecting this value is to prioritize the values ​​from the test reports of the materials to be constructed.

[0081] The supplementary thickness is the equivalent insulation material thickness that the component needs to be increased according to the calculation, which represents the repair scale required to increase the remaining thermal resistance to the preset target thermal resistance.

[0082] It should be noted that the preset target thermal resistance should be established in a target table according to component type before calculation. The target values ​​for exterior walls, roofs, floor edges, and window frame perimeter walls can be different, and the target values ​​for the same component can also be different under different renovation levels; the target table should record the source, applicable building type, and applicable enclosure location. For example, if the target thermal resistance for exterior wall renovation of a public building is set at 2.6 square Kelvin per watt, and the target thermal resistance for roof renovation is set at 3.5 square Kelvin per watt, then the system should be bound to the corresponding enclosure components respectively and should not be mixed.

[0083] It should be noted that the thermal conductivity of the repair material should be consistent with the actual material to be used. If the insulation material with a thermal conductivity of 0.040 W / m Kelvin is planned to be used during the construction phase, the supplementary thickness should be output according to the parameters of this material; if it is subsequently replaced with a material with a thermal conductivity of 0.030 W / m Kelvin, the supplementary thickness should be recalculated, and the material version should be retained. For example, if the remaining thermal resistance of an exterior wall is 1.8 square meters Kelvin per watt, and the preset target thermal resistance is 2.6 square meters Kelvin per watt, when using a repair material with a thermal conductivity of 0.040 W / m Kelvin, the supplementary thickness is approximately 0.032 meters.

[0084] It should be noted that when the remaining thermal resistance has reached or exceeded the preset target thermal resistance, the system should output an additional thickness of 0 and record the component as currently not requiring additional thickness. For bill of quantities applications, the system can save both the theoretical additional thickness and the suggested rounded thickness, but the suggested rounded thickness should not overwrite the theoretical calculation result. For example, if the theoretical additional thickness of a component is 0.032 meters, and the commonly used plate thickness for construction materials is 0.040 meters, then 0.032 meters can be saved as the calculation result in the model properties, and 0.040 meters can be recorded in the construction suggestion field.

[0085] Thermal insulation repair design needs to align the remaining thermal resistance of components with the engineering objectives. The degree of insufficient thermal resistance should be translated into the thickness of workable material, while components whose remaining thermal resistance already meets the objectives should not be included in the supplementary scope. This embodiment uses preset target thermal resistance, positive thermal resistance difference, and the thermal conductivity of the repair material to determine the supplementary thickness, enabling the thermal resistance evaluation results to be converted into component-level modification parameters. This allows for the output of thickness data for engineering quantity statistics and model attribute updates, and reduces the bias of manual estimation based solely on risk levels.

[0086] In one embodiment of the present invention, in step S7, for the component The calculation process for the updated thermal resistance, based on the added thickness and remaining thermal resistance, is as follows: Increase thickness Divide by the thermal conductivity of the repair material Obtain the additional thermal resistance, and combine the additional thermal resistance with the remaining thermal resistance. Add them together to obtain the updated thermal resistance. ; in, Representing components At the calculation time The added thickness, Representing components The thermal conductivity of the repair material, Representing components At the calculation time Residual thermal resistance, Representing components At the calculation time The updated thermal resistance; The formula for calculating the power reduction is as follows, based on the component area, the replacement thermal resistance, the temperature difference between the two sides, and the remaining thermal resistance: ; in, Representing components At the calculation time Power reduction Representing components The area of ​​the components, Representing components At the calculation time The temperature difference on both sides Representing components At the calculation time Residual thermal resistance, Representing components At the calculation time The updated thermal resistance.

[0087] It should be noted that the added thermal resistance is the increase in area thermal resistance corresponding to the added thickness, which characterizes the contribution of the newly added repair material to the thermal resistance of the component.

[0088] The updated thermal resistance is the area thermal resistance of the component after the supplementation and repair, which characterizes the target state of the component after the insulation and supplementation are completed.

[0089] The difference in reciprocal thermal resistance represents the difference in heat transfer capacity between the remaining thermal resistance and the replaced thermal resistance, characterizing the degree of reduction in heat transfer capacity per unit area before and after the repair.

[0090] The power reduction is the calculated reduction in heat transfer power of the component under the current temperature difference between the two sides, representing the immediate reduction in heat loss brought about by the supplementary repair.

[0091] It should be noted that updated thermal resistance should be written back to the corresponding component's attribute field in the building's digital model, and the calculation time, the thermal conductivity of the repaired material, the added thickness, and data quality markers should be retained. For cases where the same component is calculated multiple times, version records can be retained in chronological order to avoid overwriting historical results. For example, if an exterior wall component outputs an added thickness of 0.032 meters and an updated thermal resistance of 2.6 square Kelvin per watt in the first evaluation, and subsequently outputs an added thickness of 0.024 meters after material replacement and re-evaluation, then the corresponding material parameters should be recorded in both versions.

[0092] It should be noted that the power reduction is estimated using the current temperature difference between the two sides. Therefore, it represents the reduction in heat transfer power under the boundary conditions at a given calculation time, and is not equivalent to the annual energy savings. To generate a phased energy-saving estimate, the power reduction can be calculated at multiple points in time, then the time can be summarized, and the running time can be combined to form the energy result. For example, for an exterior wall with an area of ​​42 square meters, a current temperature difference of 12 degrees Celsius, a remaining thermal resistance of 1.8 square kJ / W, and a replacement thermal resistance of 2.6 square kJ / W, the power reduction is approximately 86 watts.

[0093] It should be noted that the final output should serve the maintenance checklist, renovation design, and model updates. The system can output remaining thermal resistance, preset target thermal resistance, supplementary thickness, updated thermal resistance, power reduction, and data quality flags according to component identification. For components with insufficient data quality, a review prompt should be given instead of including them in the construction checklist. For example, if the humidity data of the wall surrounding a window frame is missing by more than 20% of the time constant, the system can retain the remaining thermal resistance trend but mark it as requiring review in the supplementary thickness field.

[0094] After completing the thickness calculation, project management also needs to understand the thermal resistance status of the repaired component and the heat loss that can be reduced under the current boundary conditions. Updated thermal resistance reflects the thermal state of the component after the new repair material is incorporated, while reduced power reflects the difference in heat transfer capacity before and after the modification under the same temperature difference on both sides. This embodiment calculates updated thermal resistance and reduced power, and binds the results to component identifiers, generating modification result data that can be written into the building digital model. This facilitates maintenance personnel in selecting repair targets by component, verifying material thickness, and estimating phased energy-saving effects.

[0095] In one embodiment of the present invention, such as Figure 2 As shown, a building lifecycle management system based on digital twins includes: The component adjacency graph creation module is used to extract component parameters, material parameters, and boundary parameters from the building digital model to create a component adjacency graph, and to calculate the initial thermal resistance, total heat capacity, and adjacency conductivity. The apparent thermal resistance generation module is used to collect the inner temperature, outer temperature, outward heat flux density and surface relative humidity, calculate the temperature difference between the two sides by combining the inner temperature and outer temperature, and calculate the apparent thermal resistance based on the temperature difference between the two sides and the outward heat flux density. The component residual generation module is used to calculate the time constant based on the initial thermal resistance and total heat capacity, calculate the humidity memory based on the surface relative humidity and time constant, calculate the corrected thermal resistance based on the initial thermal resistance and humidity memory, and obtain the component residual by comparing the corrected thermal resistance with the apparent thermal resistance. The abnormal intensity generation module is used to calculate the adjacent conduction weight based on the adjacent conduction volume, extract the adjacent residual associated with adjacent components, and calculate the abnormal intensity by combining the component residual, the adjacent conduction weight and the adjacent residual. The residual thermal resistance generation module is used to calculate the degradation rate by combining the abnormal intensity and humidity memory, calculate the cumulative degradation depth by time integration of the degradation rate, and calculate the residual thermal resistance by combining the cumulative degradation depth, humidity memory and initial thermal resistance. The supplementary thickness generation module is used to extract the preset target thermal resistance, compare the remaining thermal resistance with the preset target thermal resistance to obtain the thermal resistance difference, and calculate the supplementary thickness based on the thermal resistance difference. The power reduction output module is used to calculate the updated thermal resistance based on the added thickness and remaining thermal resistance, and to calculate the power reduction by combining the component area, updated thermal resistance, temperature difference between the two sides, and remaining thermal resistance.

[0096] This invention can be deployed in building operation and maintenance platforms, energy-saving renovation assessment platforms, or building digital model management systems. In practical applications, a building digital model containing enclosure components, material layers, and boundary relationships is first imported, and unified component identifiers are established for components such as exterior walls, roofs, floor edges, and window frame perimeter walls. Subsequently, sensor data on internal temperature, external temperature, outward heat flux density, and surface relative humidity are integrated into the same database. Sensor placement can combine sampling of key components with increased density in high-risk areas. Temperature nodes can be set on the inner and outer sides of exterior walls, heat flux plates can be set on representative components, and near-surface humidity nodes can be set on moisture-prone areas. The data collection interval can be configured from 10 minutes to 1 hour. Before system operation, sensor time synchronization, component identifier binding, material parameter verification, and data quality rule settings should be completed.

[0097] During system operation, calculation results are generated for each component at each calculation point. The final output includes component identification, calculation time, temperature difference between the two sides, apparent thermal resistance, humidity memory, component residual, abnormal strength, cumulative degradation depth, residual thermal resistance, preset target thermal resistance, supplementary thickness, updated thermal resistance, power reduction, and data quality flags. The residual thermal resistance is used to determine the thermal state of the component at its current life cycle stage; the supplementary thickness is used to generate the insulation repair design input and bill of quantities; the updated thermal resistance is used to write back to the building digital model and represent the post-renovation state; and the power reduction is used to express the reduction in heat transfer power under the current boundary conditions. For example, for an exterior wall component with an area of ​​36 square meters, a temperature difference of 10 degrees Celsius between the two sides, a residual thermal resistance of 1.7 square meters Kelvin per watt, a preset target thermal resistance of 2.5 square meters Kelvin per watt, and a repair material thermal conductivity of 0.040 W / m Kelvin, the system outputs a supplementary thickness of approximately 0.032 meters, an updated thermal resistance of approximately 2.5 square meters Kelvin per watt, and a power reduction of approximately 68 watts.

[0098] In project management, the above results can be summarized by component, floor, enclosure part, or renovation batch. Designers can select components that need additional insulation based on the supplementary thickness and match the theoretical thickness with the commonly used board thickness for construction; maintenance personnel can arrange the retesting and maintenance sequence based on abnormal strength and cumulative degradation depth; energy management personnel can assess the phased energy-saving trend based on the summarized results of power reduction at multiple calculation times. For components with insufficient data quality, the system outputs a check mark, allowing engineers to prioritize checking sensors, material parameters, or model boundary relationships, thereby improving traceability and executability in deployment applications.

[0099] The content of this embodiment has been described above, but this embodiment is not limited to the specific implementation methods described above. The specific implementation methods described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms based on the guidance of this embodiment, all of which are within the protection scope of this embodiment.

Claims

1. A building lifecycle management method based on digital twins, characterized in that, Includes the following steps: Step S1: Extract component parameters, material parameters and boundary parameters from the building digital model to establish a component adjacency diagram, and calculate the initial thermal resistance, total heat capacity and adjacency conductivity. Step S2: Collect the inner temperature, outer temperature, outward heat flux density and surface relative humidity, calculate the temperature difference between the two sides by combining the inner temperature and outer temperature, and calculate the apparent thermal resistance based on the temperature difference between the two sides and the outward heat flux density. Step S3: Calculate the time constant based on the initial thermal resistance and total heat capacity, calculate the humidity memory based on the surface relative humidity and time constant, calculate the corrected thermal resistance based on the initial thermal resistance and humidity memory, and compare the corrected thermal resistance with the apparent thermal resistance to obtain the component residual. Step S4: Calculate the adjacent conduction weight based on the adjacent conduction volume, extract the adjacent residuals associated with adjacent components, and calculate the anomaly intensity by combining the component residuals, adjacent conduction weights, and adjacent residuals. Step S5: Calculate the degradation rate by combining the abnormal intensity and humidity memory, calculate the cumulative degradation depth by time integration of the degradation rate, and calculate the remaining thermal resistance by combining the cumulative degradation depth, humidity memory and initial thermal resistance. Step S6: Extract the preset target thermal resistance, compare the remaining thermal resistance with the preset target thermal resistance to obtain the thermal resistance difference, and calculate the supplementary thickness based on the thermal resistance difference. Step S7: Calculate the updated thermal resistance based on the added thickness and remaining thermal resistance, and calculate the power reduction by combining the component area, updated thermal resistance, temperature difference between the two sides, and remaining thermal resistance.

2. The building lifecycle management method based on digital twins according to claim 1, characterized in that, Step S1 includes: Extract the set of building envelope components, component area, number of component layers, thickness of each layer, initial thermal conductivity of each layer, density of each layer, specific heat capacity of each layer, and shared interface area of ​​adjacent components from the building digital model; Divide the thickness of each layer by the corresponding initial thermal conductivity to obtain the single-layer thermal resistance, and add up the thermal resistances of all single layers in the same component to obtain the initial thermal resistance. Multiply the density, specific heat capacity, and thickness of each layer, add up all the products within the same component, and then multiply by the area of ​​the component to obtain the total heat capacity; The adjacent conductivity is obtained by calculating the ratio of the numerator to the denominator by taking the shared interface area of ​​adjacent components as the numerator and the sum of the initial thermal resistances of two adjacent components as the denominator.

3. The building lifecycle management method based on digital twins according to claim 1, characterized in that, Step S2 includes: Bind the inner temperature, outer temperature, and outward heat flux density to the corresponding components; The temperature difference between the two sides is obtained by subtracting the outer temperature from the inner temperature. The absolute value of the temperature difference between the two sides is used as the numerator, and the sum of the absolute value of the outward heat flux density and the steady term is used as the denominator. The ratio of the numerator to the denominator is calculated to obtain the apparent thermal resistance. The steady term is a preset non-zero value.

4. The building lifecycle management method based on digital twins according to claim 1, characterized in that, Step S3 includes: Multiply the initial thermal resistance and the total heat capacity, divide the product by the component area, and then multiply it by the material's hygrothermal retention coefficient to obtain the time constant; Within a historical time period defined by a time constant, the surface relative humidity is integrated with an exponential decay weight, and the integral result is divided by the time constant to obtain the humidity memory value. The corrected thermal resistance is obtained by calculating the ratio of the initial thermal resistance to the denominator by multiplying the humidity influence coefficient and the humidity memory by one. The normalized residual is obtained by subtracting the apparent thermal resistance from the corrected thermal resistance and dividing by the initial thermal resistance. The larger of the normalized residual and zero is then taken to obtain the component residual.

5. A building lifecycle management method based on digital twins according to claim 1, characterized in that, Step S4 includes: For each adjacent component of the target component, the adjacency conduction between the target component and the adjacent component is used as the numerator, and the sum of the adjacency conduction between the target component and all adjacent components is used as the denominator. The ratio of the numerator to the denominator is calculated to obtain the adjacency conduction weight. Extract the component residual of each adjacent component as the adjacent residual; The adjacent residuals are multiplied by the corresponding adjacent conduction weights and accumulated. The accumulated value is then multiplied by the adjacent influence coefficient and added to the component residual of the target component to obtain the abnormal intensity.

6. The building lifecycle management method based on digital twins according to claim 1, characterized in that, Step S5 includes: Multiply the humidity memory value by the humidity acceleration factor and add one to form the humidity acceleration term. Multiply the abnormal intensity, the baseline degradation factor, and the humidity acceleration term to obtain the degradation rate. The degradation rate is integrated over time from the initial time to the calculation time, and then added to the cumulative degradation depth at the initial time to obtain the cumulative degradation depth at the calculation time. Multiply the initial thermal resistance by the difference between the unit value and the cumulative degradation depth, and use the product as the numerator. Add one to the product of the humidity influence coefficient and the humidity memory value as the denominator, and calculate the ratio of the numerator to the denominator to obtain the remaining thermal resistance.

7. A building lifecycle management method based on digital twins according to claim 1, characterized in that, Step S6 includes: Extract the preset target thermal resistance corresponding to the component; The thermal resistance difference is obtained by subtracting the remaining thermal resistance from the preset target thermal resistance. When the thermal resistance difference is less than zero, the positive thermal resistance difference is assigned a value of zero; when the thermal resistance difference is greater than or equal to zero, the positive thermal resistance difference is assigned a value of the thermal resistance difference. The added thickness is obtained by multiplying the positive thermal resistance difference by the thermal conductivity of the repair material.

8. A building lifecycle management method based on digital twins according to claim 1, characterized in that, Step S7 includes: The increased thermal resistance is obtained by dividing the increased thickness by the thermal conductivity of the repair material, and the increased thermal resistance is added to the remaining thermal resistance to obtain the updated thermal resistance. The reciprocal difference of thermal resistance is obtained by subtracting the reciprocal of the updated thermal resistance from the reciprocal of the remaining thermal resistance. The power reduction is obtained by multiplying the component area, the absolute value of the temperature difference between the two sides, and the reciprocal difference of thermal resistance.

9. A building lifecycle management system based on digital twins, characterized in that, Implementing a building lifecycle management method based on digital twins as described in any one of claims 1 to 8, comprising: The component adjacency graph creation module is used to extract component parameters, material parameters, and boundary parameters from the building digital model to create a component adjacency graph, and to calculate the initial thermal resistance, total heat capacity, and adjacency conductivity. The apparent thermal resistance generation module is used to collect the inner temperature, outer temperature, outward heat flux density and surface relative humidity, calculate the temperature difference between the two sides by combining the inner temperature and outer temperature, and calculate the apparent thermal resistance based on the temperature difference between the two sides and the outward heat flux density. The component residual generation module is used to calculate the time constant based on the initial thermal resistance and total heat capacity, calculate the humidity memory based on the surface relative humidity and time constant, calculate the corrected thermal resistance based on the initial thermal resistance and humidity memory, and obtain the component residual by comparing the corrected thermal resistance with the apparent thermal resistance. The abnormal intensity generation module is used to calculate the adjacent conduction weight based on the adjacent conduction volume, extract the adjacent residual associated with adjacent components, and calculate the abnormal intensity by combining the component residual, the adjacent conduction weight and the adjacent residual. The residual thermal resistance generation module is used to calculate the degradation rate by combining the abnormal intensity and humidity memory, calculate the cumulative degradation depth by time integration of the degradation rate, and calculate the residual thermal resistance by combining the cumulative degradation depth, humidity memory and initial thermal resistance. The supplementary thickness generation module is used to extract the preset target thermal resistance, compare the remaining thermal resistance with the preset target thermal resistance to obtain the thermal resistance difference, and calculate the supplementary thickness based on the thermal resistance difference. The power reduction output module is used to calculate the updated thermal resistance based on the added thickness and remaining thermal resistance, and to calculate the power reduction by combining the component area, updated thermal resistance, temperature difference between the two sides, and remaining thermal resistance.

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