Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a display panel, the display panel comprising a display area, a bending area and a binding area, the bending area being bent so that the binding area is located on the backlight side of the display area; a flexible circuit board, the flexible circuit board being connected with the binding area, the flexible circuit board comprising a first part, the first part being supported between the display area and the binding area. The first part of the flexible circuit board is supported and connected between the display area and the binding area, thereby improving the space utilization.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the trend towards thinner and lighter consumer electronics, the space requirements for internal modules in terminal products such as smartphones, foldable screen devices, and tablets are becoming increasingly stringent. In traditional OLED display modules, flexible printed circuit boards (FPCs) typically employ either forward bonding (FPC and driver IC located on opposite sides of the display panel) or reverse bonding (FPC and driver IC located on the same side of the display panel). However, after the display panel is bent, additional support pads (spacers) are usually required between the bonding area and the display area to maintain the bending radius of the bending area, occupying space in the Z-direction; flexible printed circuit boards typically extend parallel in a multi-layered form, occupying a significant length in the Y-direction; and spatial interference exists between the driver IC (DIC), the bonding area, and components on the flexible printed circuit board in both the Z and Y directions, making it difficult to further reduce the overall thickness of the module. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a display module and display device that solve the problem of low space utilization.

[0004] To achieve the above objectives, the technical solution adopted in this embodiment of the invention is: a display module, comprising:

[0005] The display panel includes a display area, a bending area, and a bonding area, wherein the bending area is bent such that the bonding area is located on the backlight side of the display area;

[0006] A flexible circuit board is bonded to the bonding area. The flexible circuit board includes a first part, which is supported between the display area and the bonding area.

[0007] In some embodiments, the flexible circuit board further includes a second portion located on the side of the first portion away from the bending area in the first direction, the first direction being parallel to the direction from the bending area to the display area;

[0008] The first part is a multi-layer board structure, and the second part is a double-layer board structure. The second part has a binding part for binding and connecting with the binding area.

[0009] In some embodiments, the flexible circuit board further includes a third portion located on the side of the second portion away from the first portion, and the third portion is bent to the side of the bonding area opposite to the display area;

[0010] Multiple components on the flexible circuit board are disposed in the third part, and the components are disposed on the side of the third part away from the display area.

[0011] In some embodiments, the flexible circuit board further includes a third portion located on the side of the second portion away from the first portion, and the third portion is attached to the backlight side of the display area;

[0012] Multiple components on the flexible circuit board are disposed in the third part, and the components are disposed on the side of the third part away from the display area.

[0013] In some embodiments, in a direction perpendicular to the light-emitting surface of the display panel, the side of the component facing away from the display area is located on the side of the bonding area closer to the display area.

[0014] In some embodiments, a supporting adhesive layer is also included, which is supported between the second portion and the display area.

[0015] In some embodiments, the components on the flexible circuit board are disposed in the first part, and the components are located on the side of the first part away from the display area, and the binding area is provided with a first clearance groove for avoiding the components.

[0016] In some embodiments, a driver IC is disposed on the side of the bonding area away from the display area in a direction perpendicular to the light-emitting surface of the display panel. In the first direction, the driver IC is located on the side of the first clearance groove near the bending area, or the driver IC is located on the side of the first clearance groove away from the bending area.

[0017] In some embodiments, in a direction perpendicular to the light-emitting surface of the display panel, a driver IC is provided on the side of the bonding area closer to the display area, and a second clearance groove for avoiding the driver IC is provided on the first part.

[0018] In some embodiments, in the first direction, the orthographic projection of the component on the display area and the orthographic projection of the driver IC on the display area at least partially overlap.

[0019] In some implementations, it also includes:

[0020] A first back film and a heat dissipation support plate are stacked sequentially on the backlight side of the display panel.

[0021] The second back film is disposed on the side of the bonding area near the display area;

[0022] The first portion of the flexible circuit board is supported and connected between the second back film and the heat dissipation support plate.

[0023] In some embodiments, the flexible circuit board further includes a second portion, which is located on the side of the first portion away from the bending area in the first direction;

[0024] The first part is a multi-layer board structure, the second part is a double-layer board structure, and the second part has a binding part for binding and connecting with the binding area;

[0025] The display module further includes a supporting adhesive layer, which is supported between the second portion and the display area, and in the first direction, the supporting adhesive layer is located on the side of the second back film away from the bending area.

[0026] In some embodiments, the supporting adhesive layer includes a substrate and adhesive layers disposed on opposite sides of the substrate.

[0027] This disclosure also provides a display device, including the display module described above.

[0028] The beneficial effect of this disclosure is that the first part of the flexible circuit board is supported and connected between the display area and the bonding area, thereby improving space utilization. Attached Figure Description

[0029] Figure 1 A schematic diagram illustrating the display module in an embodiment of this disclosure;

[0030] Figure 2 A schematic diagram illustrating the display module in an embodiment of this disclosure;

[0031] Figure 3 A schematic diagram illustrating the display module in an embodiment of this disclosure;

[0032] Figure 4 A schematic diagram illustrating the display module in an embodiment of this disclosure;

[0033] Figure 5 A schematic diagram illustrating the display module in an embodiment of this disclosure;

[0034] Figure 6 A schematic diagram illustrating the display module in an embodiment of this disclosure;

[0035] Figure 7 This is a schematic diagram illustrating the display module in an embodiment of the present disclosure. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0037] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0038] The features such as “parallel,” “perpendicular,” and “identical” used in the embodiments of this disclosure include features such as “parallel,” “perpendicular,” and “identical” in the strict sense, as well as cases such as “generally parallel,” “generally perpendicular,” and “generally identical” that include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art.

[0039] Furthermore, in this document, unless otherwise defined, the terms “basic,” “substantial,” “approximately,” and “about” are used to describe and explain minor variations. When used with an event or situation, these terms may cover a situation where the event or situation occurs precisely or approximately.

[0040] refer to Figures 1-7 This embodiment provides a display module, including:

[0041] The display panel includes a display area 11, a bending area 12, and a bonding area 13, wherein the bending area 12 is bent such that the bonding area 13 is located on the backlight side of the display area 11.

[0042] A flexible circuit board is bonded to the bonding area 13. The flexible circuit board includes a first part 21, which is supported between the display area 11 and the bonding area 13.

[0043] In this embodiment, the flexible circuit board includes a first portion 21, which is supported between the display area 11 and the bonding area 13 to ensure the bending radius of the bending area 12. For example, the first portion 21 is supported between the display area 11 and the bonding area 13, replacing the support pad in the conventional technology, to ensure the bending radius of the bending area 12.

[0044] refer to Figure 1 As shown, in some exemplary embodiments, the flexible circuit board further includes a second portion 22 in the first direction (reference θ). Figure 1 In the X direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the first direction is parallel to the direction from the bending area 12 to the display area 11;

[0045] The first part 21 is a multi-layer board structure, and the second part 22 is a double-layer board structure. The second part 22 has a binding part for binding and connecting with the binding area 13.

[0046] The first part 21 adopts a multi-layer board structure to ensure the strength of the first part 21, thereby ensuring the bending radius of the bending area 12. The second part 22 adopts a double-layer board structure, which has a certain degree of flexibility and facilitates the bonding connection between the second part 22 and the display panel.

[0047] In some exemplary embodiments, the flexible circuit board further includes a third portion 23, which is located on the side of the second portion 22 away from the first portion 21, and the third portion 23 is bent to the side of the bonding area 13 away from the display area 11 (i.e., the third portion 23 and the first portion 21 partially overlap in the orthographic projection of 11), and is fixedly connected to the bonding area 13 by adhesive.

[0048] Multiple components 201 on the flexible circuit board are disposed in the third part 23, and the components 201 are disposed on the side of the third part 23 opposite to the display area 11.

[0049] The first part 21 is located between the display area 11 and the binding area 13. The component 201 is disposed on the side of the third part 23 away from the display area 11 to avoid interference between the component 201 and the display area 11 and other components.

[0050] In some exemplary embodiments, the display module further includes a support adhesive layer 3, which is supported and disposed between the second portion 22 and the display area 11.

[0051] The supporting adhesive layer 3 can be a double-sided adhesive with a substrate (such as a PET substrate + acrylic adhesive). That is, the supporting adhesive layer 3 includes a substrate and adhesive layers on opposite sides of the substrate. The structure of the supporting adhesive layer 3 with a substrate double-sided adhesive can ensure support strength while connecting the second part 22 to the bonding area 13 and the display area 11. The thickness of the supporting adhesive layer 3 can be set according to actual needs. The supporting adhesive layer 3 has the dual functions of buffering stress and filling gaps.

[0052] For example, in the first direction, there is a gap between the supporting adhesive layer 3 and the first portion 21. The first portion 21 is a multilayer board structure with at least 3 layers, and the second portion 22 is a double-layer board structure. The gap between the supporting adhesive layer 3 and the first portion 21 facilitates the extension of the second portion 22 from the first portion 21 to the bonding area 13 for bonding connection with the bonding area 13.

[0053] In an exemplary embodiment, the display module further includes:

[0054] The first back film 4 and the heat dissipation support plate 5 are stacked sequentially on the backlight side of the display panel.

[0055] The second back film 6 is disposed on the side of the bonding area 13 near the display area 11;

[0056] The first portion 21 of the flexible circuit board is supported and connected between the second back film 6 and the heat dissipation support plate 5. The first side of the flexible circuit board away from the display area 11 is connected to the side of the second back film 6 facing the display area 11 by adhesive (e.g., PSA adhesive). The second side of the flexible circuit board close to the display area 11 is connected to the backlight side of the heat dissipation support plate 5 by adhesive (e.g., PSA adhesive).

[0057] In the first direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the binding portion is located on the side of the second back film 6 away from the bending area 12.

[0058] In an exemplary embodiment, in a direction perpendicular to the light-emitting surface of the display panel, a driver IC 101 is disposed on the side of the bonding area 13 away from the display area 11. In the first direction, the driver IC 101 is located on the side of the third part 23 near the bending area 12, and in the first direction, there is a gap between the driver IC 101 and the third part 23 to avoid interference between the driver IC 101 and the third part 23.

[0059] For example, the driver IC 101 is bonded via COP (Chip On PlastIC 101) technology, but is not limited thereto.

[0060] refer to Figure 2 As shown, in some exemplary embodiments, the flexible circuit board further includes a second portion 22 in the first direction (reference θ). Figure 2 In the X direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the first direction is parallel to the direction from the bending area 12 to the display area 11;

[0061] The first part 21 is a multi-layer board structure, and the second part 22 is a double-layer board structure. The second part 22 has a binding part for binding and connecting with the binding area 13.

[0062] The first part 21 adopts a multi-layer board structure to ensure the strength of the first part 21, thereby ensuring the bending radius of the bending area 12. The second part 22 adopts a double-layer board structure, which has a certain degree of flexibility and facilitates the bonding connection between the second part 22 and the display panel.

[0063] In some exemplary embodiments, the flexible circuit board further includes a third portion 23, which is located on the side of the second portion 22 away from the first portion 21, and the third portion 23 is attached to the backlight side of the display area 11.

[0064] Multiple components 201 on the flexible circuit board are disposed in the third part 23, and the components 201 are disposed on the side of the third part 23 opposite to the display area 11.

[0065] The third part 23 is attached to the backlight side of the display area 11, utilizing the space of the bonding area 13 away from the bending area 12 in the first direction to reduce the Z-direction space of the display module.

[0066] For example, the component 201 has a first side facing away from the display area 11, and the bonding area 13 has a second side facing away from the display area 11. The first side of the component 201 and the second side of the bonding area 13 are not at the same height, and the first side of the component 201 is located on the side of the second side of the bonding area 13 closer to the display area 11, which improves space utilization.

[0067] In some exemplary embodiments, the display module further includes a support adhesive layer 3, which is supported and disposed between the second portion 22 and the display area 11.

[0068] The supporting adhesive layer 3 can be a double-sided adhesive with a substrate (such as a PET substrate + acrylic adhesive). That is, the supporting adhesive layer 3 includes a substrate and adhesive layers on opposite sides of the substrate. The structure of the supporting adhesive layer 3 with a substrate double-sided adhesive can ensure support strength while connecting the second part 22 to the bonding area 13 and the display area 11. The thickness of the supporting adhesive layer 3 can be set according to actual needs. The supporting adhesive layer 3 has the dual functions of buffering stress and filling gaps.

[0069] For example, in the first direction, there is a gap between the supporting adhesive layer 3 and the first portion 21. The first portion 21 is a multilayer board structure with at least 3 layers, and the second portion 22 is a double-layer board structure. The gap between the supporting adhesive layer 3 and the first portion 21 facilitates the extension of the second portion 22 from the first portion 21 to the bonding area 13 for bonding connection with the bonding area 13.

[0070] In an exemplary embodiment, the display module further includes:

[0071] The first back film 4 and the heat dissipation support plate 5 are stacked sequentially on the backlight side of the display panel.

[0072] The second back film 6 is disposed on the side of the bonding area 13 near the display area 11;

[0073] The first portion 21 of the flexible circuit board is supported and connected between the second back film 6 and the heat dissipation support plate 5. The first side of the flexible circuit board away from the display area 11 is connected to the side of the second back film 6 facing the display area 11 by adhesive (e.g., PSA adhesive). The second side of the flexible circuit board close to the display area 11 is connected to the backlight side of the heat dissipation support plate 5 by adhesive (e.g., PSA adhesive).

[0074] In the first direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the binding portion is located on the side of the second back film 6 away from the bending area 12.

[0075] In the first direction, the third part 23 is located on the side of the second part 22 away from the first part 21, and there is a gap between the third part 23 and the supporting adhesive layer 3, which facilitates a smooth transition between the second part 22 and the third part 23 and avoids stress concentration.

[0076] In an exemplary embodiment, a driver IC 101 is provided on the side of the bonding area 13 away from the display area 11 in a direction perpendicular to the light-emitting surface of the display panel.

[0077] For example, the driver IC 101 is bonded via COP (Chip On PlastIC 101) technology, but is not limited thereto.

[0078] refer to Figure 3 As shown, in some exemplary embodiments, the flexible circuit board further includes a second portion 22 in the first direction (reference θ). Figure 3 In the X direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the first direction is parallel to the direction from the bending area 12 to the display area 11;

[0079] The first part 21 is a multi-layer board structure, and the second part 22 is a double-layer board structure. The second part 22 has a binding part for binding and connecting with the binding area 13.

[0080] The first part 21 adopts a multi-layer board structure to ensure the strength of the first part 21, thereby ensuring the bending radius of the bending area 12. The second part 22 adopts a double-layer board structure, which has a certain degree of flexibility and facilitates the bonding connection between the second part 22 and the display panel.

[0081] In an exemplary embodiment, the component 201 on the flexible circuit board is disposed in the first portion 21, and the component 201 is located on the side of the first portion 21 away from the display area 11. The binding area 13 is provided with a first clearance groove 131 for avoiding the component 201.

[0082] For example, the first clearance groove 131 may be a through groove that penetrates the binding area 13, or it may be a blind groove that does not penetrate the binding area 13.

[0083] The components 201 of the flexible circuit board are housed in the first clearance groove 131 on the bonding area 13, which further reduces the space of the display module in the direction (Z direction) perpendicular to the light-emitting surface of the display panel.

[0084] In some exemplary embodiments, the display module further includes a support adhesive layer 3, which is supported and disposed between the second portion 22 and the display area 11.

[0085] The supporting adhesive layer 3 can be a double-sided adhesive with a substrate (such as a PET substrate + acrylic adhesive). That is, the supporting adhesive layer 3 includes a substrate and adhesive layers on opposite sides of the substrate. The structure of the supporting adhesive layer 3 with a substrate double-sided adhesive can ensure support strength while connecting the second part 22 to the bonding area 13 and the display area 11. The thickness of the supporting adhesive layer 3 can be set according to actual needs. The supporting adhesive layer 3 has the dual functions of buffering stress and filling gaps.

[0086] For example, in the first direction, there is a gap between the supporting adhesive layer 3 and the first portion 21. The first portion 21 is a multilayer board structure with at least 3 layers, and the second portion 22 is a double-layer board structure. The gap between the supporting adhesive layer 3 and the first portion 21 facilitates the extension of the second portion 22 from the first portion 21 to the bonding area 13 for bonding connection with the bonding area 13.

[0087] In an exemplary embodiment, the display module further includes:

[0088] The first back film 4 and the heat dissipation support plate 5 are stacked sequentially on the backlight side of the display panel.

[0089] The second back film 6 is disposed on the side of the bonding area 13 near the display area 11;

[0090] The first portion 21 of the flexible circuit board is supported and connected between the second back film 6 and the heat dissipation support plate 5. The first side of the flexible circuit board away from the display area 11 is connected to the side of the second back film 6 facing the display area 11 by adhesive (e.g., PSA adhesive). The second side of the flexible circuit board close to the display area 11 is connected to the backlight side of the heat dissipation support plate 5 by adhesive (e.g., PSA adhesive).

[0091] The second back film 6 has a through hole corresponding to the first clearance groove 131. For example, in the first direction, the cross-sectional area of ​​the through hole is greater than or equal to the cross-sectional area of ​​the first clearance groove 131, so that the component 201 can be smoothly accommodated in the first clearance groove 131.

[0092] For example, in an embodiment where the first clearance slot 131 is a blind slot, there is a gap between the component 201 and the bottom of the first clearance slot 131 in a direction perpendicular to the light-emitting surface of the display panel.

[0093] For example, in a direction parallel to the light-emitting surface of the display panel, there is a gap between the component 201 and the sidewall of the first clearance groove 131 to avoid interference between the component 201 and the first clearance groove 131.

[0094] In the first direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the binding portion is located on the side of the second back film 6 away from the bending area 12.

[0095] refer to Figure 4 As shown, in some exemplary embodiments, the flexible circuit board further includes a second portion 22 in the first direction (reference θ). Figure 4 In the X direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the first direction is parallel to the direction from the bending area 12 to the display area 11;

[0096] The first part 21 is a multi-layer board structure, and the second part 22 is a double-layer board structure. The second part 22 has a binding part for binding and connecting with the binding area 13.

[0097] The first part 21 adopts a multi-layer board structure to ensure the strength of the first part 21, thereby ensuring the bending radius of the bending area 12. The second part 22 adopts a double-layer board structure, which has a certain degree of flexibility and facilitates the bonding connection between the second part 22 and the display panel.

[0098] In an exemplary embodiment, the component 201 on the flexible circuit board is disposed in the first portion 21, and the component 201 is located on the side of the first portion 21 away from the display area 11. The binding area 13 is provided with a first clearance groove 131 for avoiding the component 201.

[0099] For example, the first clearance groove 131 may be a through groove that penetrates the binding area 13, or it may be a blind groove that does not penetrate the binding area 13. Figure 4In this context, the first clearance groove 131 is a through groove that penetrates the binding area 13, but it is not limited to this.

[0100] The components 201 of the flexible circuit board are housed in the first clearance groove 131 on the bonding area 13, which further reduces the space of the display module in the direction (Z direction) perpendicular to the light-emitting surface of the display panel.

[0101] In some exemplary embodiments, the display module further includes a support adhesive layer 3, which is supported and disposed between the second portion 22 and the display area 11.

[0102] The supporting adhesive layer 3 can be a double-sided adhesive with a substrate (such as a PET substrate + acrylic adhesive). That is, the supporting adhesive layer 3 includes a substrate and adhesive layers on opposite sides of the substrate. The structure of the supporting adhesive layer 3 with a substrate double-sided adhesive can ensure support strength while connecting the second part 22 to the bonding area 13 and the display area 11. The thickness of the supporting adhesive layer 3 can be set according to actual needs. The supporting adhesive layer 3 has the dual functions of buffering stress and filling gaps.

[0103] For example, in the first direction, there is a gap between the supporting adhesive layer 3 and the first portion 21. The first portion 21 is a multilayer board structure with at least 3 layers, and the second portion 22 is a double-layer board structure. The gap between the supporting adhesive layer 3 and the first portion 21 facilitates the extension of the second portion 22 from the first portion 21 to the bonding area 13 for bonding connection with the bonding area 13.

[0104] In an exemplary embodiment, the display module further includes:

[0105] The first back film 4 and the heat dissipation support plate 5 are stacked sequentially on the backlight side of the display panel.

[0106] The second back film 6 is disposed on the side of the bonding area 13 near the display area 11;

[0107] The first portion 21 of the flexible circuit board is supported and connected between the second back film 6 and the heat dissipation support plate 5. The first side of the flexible circuit board away from the display area 11 is connected to the side of the second back film 6 facing the display area 11 by adhesive (e.g., PSA adhesive). The second side of the flexible circuit board close to the display area 11 is connected to the backlight side of the heat dissipation support plate 5 by adhesive (e.g., PSA adhesive).

[0108] The second back film 6 has a through hole corresponding to the first clearance groove 131. For example, in the first direction, the cross-sectional area of ​​the through hole is greater than or equal to the cross-sectional area of ​​the first clearance groove 131, so that the component 201 can be smoothly accommodated in the first clearance groove 131.

[0109] For example, in an embodiment where the first clearance slot 131 is a blind slot, there is a gap between the component 201 and the bottom of the first clearance slot 131 in a direction perpendicular to the light-emitting surface of the display panel.

[0110] For example, in a direction parallel to the light-emitting surface of the display panel, there is a gap between the component 201 and the sidewall of the first clearance groove 131 to avoid interference between the component 201 and the first clearance groove 131.

[0111] In the first direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the binding portion is located on the side of the second back film 6 away from the bending area 12.

[0112] In an exemplary embodiment, in a direction perpendicular to the light-emitting surface of the display panel, a driver IC 101 is provided on the side of the bonding area 13 away from the display area 11, and in the first direction, the driver IC 101 is provided on the side of the first clearance groove 131 away from the bending area 12.

[0113] For example, the driver IC 101 is bonded via COP (Chip On PlastIC 101) technology, but is not limited thereto.

[0114] refer to Figure 5 As shown, in some exemplary embodiments, the flexible circuit board further includes a second portion 22, which is located on the side of the first portion 21 away from the bending area 12 in the first direction (refer to the X direction in FIG5), and the first direction is parallel to the direction from the bending area 12 to the display area 11;

[0115] The first part 21 is a multi-layer board structure, and the second part 22 is a double-layer board structure. The second part 22 has a binding part for binding and connecting with the binding area 13.

[0116] The first part 21 adopts a multi-layer board structure to ensure the strength of the first part 21, thereby ensuring the bending radius of the bending area 12. The second part 22 adopts a double-layer board structure, which has a certain degree of flexibility and facilitates the bonding connection between the second part 22 and the display panel.

[0117] In an exemplary embodiment, the component 201 on the flexible circuit board is disposed in the first portion 21, and the component 201 is located on the side of the first portion 21 away from the display area 11. The binding area 13 is provided with a first clearance groove 131 for avoiding the component 201.

[0118] For example, the first clearance groove 131 may be a through groove that penetrates the binding area 13, or it may be a blind groove that does not penetrate the binding area 13. Figure 5 In this context, the first clearance groove 131 is a through groove that penetrates the binding area 13, but it is not limited to this.

[0119] The components 201 of the flexible circuit board are housed in the first clearance groove 131 on the bonding area 13, which further reduces the space of the display module in the direction (Z direction) perpendicular to the light-emitting surface of the display panel.

[0120] In some exemplary embodiments, the display module further includes a support adhesive layer 3, which is supported and disposed between the second portion 22 and the display area 11.

[0121] The supporting adhesive layer 3 can be a double-sided adhesive with a substrate (such as a PET substrate + acrylic adhesive). That is, the supporting adhesive layer 3 includes a substrate and adhesive layers on opposite sides of the substrate. The structure of the supporting adhesive layer 3 with a substrate double-sided adhesive can ensure support strength while connecting the second part 22 to the bonding area 13 and the display area 11. The thickness of the supporting adhesive layer 3 can be set according to actual needs. The supporting adhesive layer 3 has the dual functions of buffering stress and filling gaps.

[0122] For example, in the first direction, there is a gap between the supporting adhesive layer 3 and the first portion 21. The first portion 21 is a multilayer board structure with at least 3 layers, and the second portion 22 is a double-layer board structure. The gap between the supporting adhesive layer 3 and the first portion 21 facilitates the extension of the second portion 22 from the first portion 21 to the bonding area 13 for bonding connection with the bonding area 13.

[0123] In an exemplary embodiment, the display module further includes:

[0124] The first back film 4 and the heat dissipation support plate 5 are stacked sequentially on the backlight side of the display panel.

[0125] The second back film 6 is disposed on the side of the bonding area 13 near the display area 11;

[0126] The first portion 21 of the flexible circuit board is supported and connected between the second back film 6 and the heat dissipation support plate 5. The first side of the flexible circuit board away from the display area 11 is connected to the side of the second back film 6 facing the display area 11 by adhesive (e.g., PSA adhesive). The second side of the flexible circuit board close to the display area 11 is connected to the backlight side of the heat dissipation support plate 5 by adhesive (e.g., PSA adhesive).

[0127] The second back film 6 has a through hole corresponding to the first clearance groove 131. For example, in the first direction, the cross-sectional area of ​​the through hole is greater than or equal to the cross-sectional area of ​​the first clearance groove 131, so that the component 201 can be smoothly accommodated in the first clearance groove 131.

[0128] For example, in an embodiment where the first clearance slot 131 is a blind slot, there is a gap between the component 201 and the bottom of the first clearance slot 131 in a direction perpendicular to the light-emitting surface of the display panel.

[0129] For example, in a direction parallel to the light-emitting surface of the display panel, there is a gap between the component 201 and the sidewall of the first clearance groove 131 to avoid interference between the component 201 and the first clearance groove 131.

[0130] In the first direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the binding portion is located on the side of the second back film 6 away from the bending area 12.

[0131] In an exemplary embodiment, in a direction perpendicular to the light-emitting surface of the display panel, a driver IC 101 is provided on the side of the bonding area 13 away from the display area 11, and in the first direction, the driver IC 101 is provided on the side of the first clearance groove 131 near the bending area 12.

[0132] For example, the driver IC 101 is bonded via COP (Chip On PlastIC 101) technology, but is not limited thereto.

[0133] refer to Figure 6 As shown, in some exemplary embodiments, the flexible circuit board further includes a second portion 22 in the first direction (reference θ). Figure 6 In the X direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the first direction is parallel to the direction from the bending area 12 to the display area 11;

[0134] The first part 21 is a multi-layer board structure, and the second part 22 is a double-layer board structure. The second part 22 has a binding part for binding and connecting with the binding area 13.

[0135] The first part 21 adopts a multi-layer board structure to ensure the strength of the first part 21, thereby ensuring the bending radius of the bending area 12. The second part 22 adopts a double-layer board structure, which has a certain degree of flexibility and facilitates the bonding connection between the second part 22 and the display panel.

[0136] In some exemplary embodiments, the flexible circuit board further includes a third portion 23 located on the side of the second portion 22 away from the first portion 21, and the third portion 23 is bent to the side of the bonding area 13 opposite to the display area 11 and is fixedly connected to the bonding area 13 by adhesive, the third portion 23 covering approximately 2 / 3 of the first portion 21;

[0137] Multiple components 201 on the flexible circuit board are disposed in the third part 23, and the components 201 are disposed on the side of the third part 23 opposite to the display area 11.

[0138] The first part 21 is located between the display area 11 and the binding area 13. The component 201 is disposed on the side of the third part 23 away from the display area 11 to avoid interference between the component 201 and the display area 11 and other components.

[0139] In some exemplary embodiments, the display module further includes a support adhesive layer 3, which is supported and disposed between the second portion 22 and the display area 11.

[0140] The supporting adhesive layer 3 can be a double-sided adhesive with a substrate (such as a PET substrate + acrylic adhesive). That is, the supporting adhesive layer 3 includes a substrate and adhesive layers on opposite sides of the substrate. The structure of the supporting adhesive layer 3 with a substrate double-sided adhesive can ensure support strength while connecting the second part 22 to the bonding area 13 and the display area 11. The thickness of the supporting adhesive layer 3 can be set according to actual needs. The supporting adhesive layer 3 has the dual functions of buffering stress and filling gaps.

[0141] For example, in the first direction, there is a gap between the supporting adhesive layer 3 and the first portion 21. The first portion 21 is a multilayer board structure with at least 3 layers, and the second portion 22 is a double-layer board structure. The gap between the supporting adhesive layer 3 and the first portion 21 facilitates the extension of the second portion 22 from the first portion 21 to the bonding area 13 for bonding connection with the bonding area 13.

[0142] In an exemplary embodiment, the display module further includes:

[0143] The first back film 4 and the heat dissipation support plate 5 are stacked sequentially on the backlight side of the display panel.

[0144] The second back film 6 is disposed on the side of the bonding area 13 near the display area 11;

[0145] The first portion 21 of the flexible circuit board is supported and connected between the second back film 6 and the heat dissipation support plate 5. The first side of the flexible circuit board away from the display area 11 is connected to the side of the second back film 6 facing the display area 11 by adhesive (e.g., PSA adhesive). The second side of the flexible circuit board close to the display area 11 is connected to the backlight side of the heat dissipation support plate 5 by adhesive (e.g., PSA adhesive).

[0146] In the first direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the binding portion is located on the side of the second back film 6 away from the bending area 12.

[0147] In an exemplary embodiment, in a direction perpendicular to the light-emitting surface of the display panel, a driver IC 101 is disposed on the side of the bonding area 13 near the display area 11, and a second clearance groove 211 for avoiding the driver IC 101 is disposed on the first portion 21. A through hole corresponding to the second clearance groove 211 is formed on the second back film 6. In a direction parallel to the light-emitting surface of the display panel, the cross-sectional area of ​​the through hole is greater than or equal to the cross-sectional area of ​​the second clearance groove 211, so that the driver IC 101 can be smoothly accommodated in the second clearance groove 211.

[0148] For example, in the first direction, the distance between the component 201 and the bending area 12 is less than the distance between the driver ICs 101.

[0149] For example, in the first direction, the bonding area 13 has a first edge away from the bending area 12, and the distance between the component 201 and the first edge is less than the distance between the driver IC 101 and the first edge.

[0150] For example, the orthographic projection of the component 201 in the display area 11 at least partially overlaps with the orthographic projection of the driver IC 101 in the display area 11, or the orthographic projection of the component 201 in the display area 11 does not overlap with the orthographic projection of the driver IC 101 in the display area 11.

[0151] For example, in the first direction, the orthographic projection of the component 201 in the display area 11 at least partially overlaps with the orthographic projection of the driver IC 101 in the display area 11, thereby reducing the space of the display module in the first direction.

[0152] For example, the second clearance groove 211 can be a through groove that passes through the first part 21, or it can be a blind groove opened on the side of the first part 21 away from the display area 11.

[0153] For example, the driver IC 101 is bonded via COP (Chip On PlastIC 101) technology, but is not limited thereto.

[0154] refer to Figure 7 As shown, in some exemplary embodiments, the flexible circuit board further includes a second portion 22 in the first direction (reference θ). Figure 7 In the X direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the first direction is parallel to the direction from the bending area 12 to the display area 11;

[0155] The first part 21 is a multi-layer board structure, and the second part 22 is a double-layer board structure. The second part 22 has a binding part for binding and connecting with the binding area 13.

[0156] The first part 21 adopts a multi-layer board structure to ensure the strength of the first part 21, thereby ensuring the bending radius of the bending area 12. The second part 22 adopts a double-layer board structure, which has a certain degree of flexibility and facilitates the bonding connection between the second part 22 and the display panel.

[0157] In some exemplary embodiments, the flexible circuit board further includes a third portion 23, which is located on the side of the second portion 22 away from the first portion 21, and the third portion 23 is attached to the backlight side of the display area 11.

[0158] Multiple components 201 on the flexible circuit board are disposed in the third part 23, and the components 201 are disposed on the side of the third part 23 opposite to the display area 11.

[0159] The third part 23 is attached to the backlight side of the display area 11, utilizing the space of the bonding area 13 away from the bending area 12 in the first direction to reduce the Z-direction space of the display module.

[0160] For example, the component 201 has a first side facing away from the display area 11, and the bonding area 13 has a second side facing away from the display area 11. The first side of the component 201 and the second side of the bonding area 13 are not at the same height, and the first side of the component 201 is located on the side of the second side of the bonding area 13 closer to the display area 11, which improves space utilization.

[0161] In some exemplary embodiments, the display module further includes a support adhesive layer 3, which is supported and disposed between the second portion 22 and the display area 11.

[0162] The supporting adhesive layer 3 can be a double-sided adhesive with a substrate (such as PET substrate + acrylic adhesive). That is, the supporting adhesive layer 3 includes a substrate and adhesive layers on opposite sides of the substrate. The structure of the supporting adhesive layer 3 with a substrate double-sided adhesive can ensure support strength while connecting the second part 22 to the bonding area 13 and the display area 11. The thickness of the supporting adhesive layer 3 can be set according to actual needs. The supporting adhesive layer 3 has the dual functions of buffering stress and filling gaps.

[0163] For example, in the first direction, there is a gap between the supporting adhesive layer 3 and the first portion 21. The first portion 21 is a multilayer board structure with at least 3 layers, and the second portion 22 is a double-layer board structure. The gap between the supporting adhesive layer 3 and the first portion 21 facilitates the extension of the second portion 22 from the first portion 21 to the bonding area 13 for bonding connection with the bonding area 13.

[0164] In an exemplary embodiment, the display module further includes:

[0165] The first back film 4 and the heat dissipation support plate 5 are stacked sequentially on the backlight side of the display panel.

[0166] The second back film 6 is disposed on the side of the bonding area 13 near the display area 11;

[0167] The first portion 21 of the flexible circuit board is supported and connected between the second back film 6 and the heat dissipation support plate 5. The first side of the flexible circuit board away from the display area 11 is connected to the side of the second back film 6 facing the display area 11 by adhesive (e.g., PSA adhesive). The second side of the flexible circuit board close to the display area 11 is connected to the backlight side of the heat dissipation support plate 5 by adhesive (e.g., PSA adhesive).

[0168] In the first direction, the second portion 22 is located on the side of the first portion 21 away from the bending area 12, and the binding portion is located on the side of the second back film 6 away from the bending area 12.

[0169] In the first direction, the third part 23 is located on the side of the second part 22 away from the first part 21, and there is a gap between the third part 23 and the supporting adhesive layer 3, which facilitates a smooth transition between the second part 22 and the third part 23 and avoids stress concentration.

[0170] In an exemplary embodiment, a driver IC 101 is disposed on the side of the bonding area 13 near the display area 11 in a direction perpendicular to the light-emitting surface of the display panel. A second clearance groove 211 is provided on the first portion 21 to avoid the driver IC 101. A through hole corresponding to the second clearance groove 211 is formed on the second back film 6. In a direction parallel to the light-emitting surface of the display panel, the cross-sectional area of ​​the through hole is greater than or equal to the cross-sectional area of ​​the second clearance groove 211, so that the driver IC 101 can be smoothly accommodated within the second clearance groove 211.

[0171] For example, the second clearance groove 211 can be a through groove that passes through the first part 21, or it can be a blind groove opened on the side of the first part 21 away from the display area 11.

[0172] For example, the driver IC 101 is bonded via COP (Chip On PlastIC 101) technology, but is not limited thereto.

[0173] refer to Figures 1-7 As shown, for example, the display module also includes a polarizer POL and a cover plate CG stacked sequentially on the light-emitting side of the display panel, and the polarizer and the cover plate are connected by optical adhesive OCA.

[0174] This disclosure also provides a display device, including the display module described above.

[0175] The display device includes, but is not limited to, components such as: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will understand that the above-described structure of the display device does not constitute a limitation on the display device; the display device may include more or fewer of the aforementioned components, or combine certain components, or arrange different components. In embodiments of the present invention, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television set, a wearable electronic device, a navigation display device, etc.

[0176] The display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.

[0177] The following points need to be explained:

[0178] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0179] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0180] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0181] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display module, characterized in that, include: The display panel includes a display area, a bending area, and a bonding area, wherein the bending area is bent such that the bonding area is located on the backlight side of the display area; A flexible circuit board is bonded to the bonding area. The flexible circuit board includes a first part, which is supported between the display area and the bonding area.

2. The display module according to claim 1, characterized in that, The flexible circuit board further includes a second portion, which is located on the side of the first portion away from the bending area in a first direction, and the first direction is parallel to the direction from the bending area to the display area. The first part is a multi-layer board structure, and the second part is a double-layer board structure. The second part has a binding part for binding and connecting with the binding area.

3. The display module according to claim 2, characterized in that, The flexible circuit board further includes a third part, which is located on the side of the second part away from the first part, and the third part is bent to the side of the bonding area away from the display area; Multiple components on the flexible circuit board are disposed in the third part, and the components are disposed on the side of the third part away from the display area.

4. The display module according to claim 2, characterized in that, The flexible circuit board further includes a third part, which is located on the side of the second part away from the first part, and the third part is attached to the backlight side of the display area; Multiple components on the flexible circuit board are disposed in the third part, and the components are disposed on the side of the third part away from the display area.

5. The display module according to claim 4, characterized in that, In a direction perpendicular to the light-emitting surface of the display panel, the side of the component facing away from the display area is located on the side of the bonding area closer to the display area.

6. The display module according to claim 2, characterized in that, It also includes a support adhesive layer disposed between the second portion and the display area.

7. The display module according to claim 2, characterized in that, The components on the flexible circuit board are disposed in the first part, and the components are located on the side of the first part away from the display area. The binding area is provided with a first clearance groove for avoiding the components.

8. The display module according to claim 7, characterized in that, In a direction perpendicular to the light-emitting surface of the display panel, a driver IC is disposed on the side of the bonding area away from the display area. In the first direction, the driver IC is located on the side of the first clearance groove near the bending area, or the driver IC is located on the side of the first clearance groove away from the bending area.

9. The display module according to claim 3, characterized in that, In a direction perpendicular to the light-emitting surface of the display panel, a driver IC is provided on the side of the bonding area closer to the display area, and a second clearance groove is provided on the first part to avoid the driver IC.

10. The display module according to claim 9, characterized in that, In the first direction, the orthographic projection of the component on the display area and the orthographic projection of the driver IC on the display area at least partially overlap.

11. The display module according to claim 1, characterized in that, Also includes: A first back film and a heat dissipation support plate are stacked sequentially on the backlight side of the display panel. The second back film is disposed on the side of the bonding area near the display area; The first portion of the flexible circuit board is disposed between the second back film and the heat dissipation support plate.

12. The display module according to claim 11, characterized in that, The flexible circuit board further includes a second portion, which is located on the side of the first portion away from the bending area in a first direction, and the first direction is parallel to the direction from the bending area to the display area. The first part is a multi-layer board structure, the second part is a double-layer board structure, and the second part has a binding part for binding and connecting with the binding area; The display module further includes a supporting adhesive layer, which is supported between the second portion and the display area, and in the first direction, the supporting adhesive layer is located on the side of the second back film away from the bending area.

13. The display module according to claim 12, characterized in that, The supporting adhesive layer includes a substrate and adhesive layers disposed on opposite sides of the substrate.

14. A display device, characterized in that, Includes the display module as described in any one of claims 1-13.

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