Magnetic component structure with glue injection channel and electrical equipment

Abstract

The application provides a magnetic component structure with a glue filling channel and electrical equipment, and belongs to the technical field of electrical equipment. The magnetic component structure comprises a magnetic core, a framework and a winding. The magnetic core comprises a cylindrical portion; the cylindrical portion has a glue filling channel; the framework is sleeved on the cylindrical portion; the framework has a hollow portion in communication with the glue filling channel; the winding is wound on the framework; and the glue filling channel is used for injecting heat-conducting glue, so that the heat-conducting glue can fill the hollow portion through the glue filling channel and contact the winding, to transfer the heat of the magnetic core to the winding through the heat-conducting glue. The design of the glue filling channel and the hollow portion of the application makes full use of the existing space between the magnetic core and the framework, can timely lead out the heat of the cylindrical portion, uses the winding as a heat sink, does not need to additionally install a heat-conducting structure, and realizes high-efficiency heat dissipation.

Description

Technical Field

[0001] This invention belongs to the field of electrical equipment technology, and more specifically, relates to a magnetic component structure and electrical equipment with a potting channel. Background Technology

[0002] Magnetic components are widely used in switching power supplies, chargers, communication power supplies, and new energy power generation. Magnetic components mainly consist of a magnetic core, a frame, and windings. The magnetic core forms the magnetic circuit, the frame supports the windings and provides electrical isolation, and the windings, wound on the frame, transmit electrical energy. During operation, both the magnetic core and windings generate heat. Core losses are particularly significant under high-frequency conditions, leading to increased core temperature and becoming the primary heat source.

[0003] For heat dissipation of magnetic cores, existing technologies typically rely on natural convection or thermal conduction between the core's outer surface and the air. Since the core is usually encased in windings and a frame, heat is difficult to transfer effectively to the external environment, resulting in poor heat dissipation and making the core the hottest part of the entire structure, forming a thermal bottleneck. If heat cannot be dissipated in time, the core temperature will become too high, leading to a decrease in permeability, a reduction in saturation flux density, and even permanent damage to the magnetic materials. The winding insulation layer ages faster at high temperatures, shortening the lifespan of the magnetic components. Furthermore, uneven temperature distribution at hot spots can cause localized thermal stress, affecting structural reliability and electrical performance. Summary of the Invention

[0004] The purpose of this invention is to provide a magnetic component structure and electrical device with a potting channel, which aims to solve the technical problem of poor heat dissipation of the magnetic core in the prior art.

[0005] To achieve the above objectives, in a first aspect, the technical solution adopted by the present invention is: to provide a magnetic component structure with a potting channel, comprising: Magnetic core; the magnetic core includes a cylindrical portion; the cylindrical portion has a potting channel; A skeleton, fitted onto the cylindrical portion; the skeleton has a hollow portion that communicates with the glue-filling channel; and The winding is wound on the frame; The glue-filling channel is used for injecting thermally conductive adhesive, so that the thermally conductive adhesive can fill the hollow part through the glue-filling channel and come into contact with the winding, so as to transfer the heat of the cylindrical part to the winding through the thermally conductive adhesive.

[0006] In one possible implementation, there is a radial gap between the skeleton and the cylindrical portion, and the glue channel communicates with the radial gap; the thermally conductive adhesive can be injected through the glue channel and sequentially fill the radial gap and the hollow portion.

[0007] In some embodiments, multiple hollow portions are distributed circumferentially along the skeleton, and the glue-filling channel is radially opposite to and connected to one of the hollow portions.

[0008] In one possible implementation, the glue-filling channel is a guide groove formed on the outer circumferential surface of the cylindrical portion, with at least one end of the guide groove penetrating the cylindrical portion in the axial direction to form a glue-filling inlet, and the opening side of the guide groove being radially opposite to and connected to the hollow portion.

[0009] In some embodiments, the inner wall of the guide channel is a smoothly transitioned curved surface; and / or The width of the opening side of the guide groove in the circumferential direction is greater than the width of the hollow part in the circumferential direction.

[0010] In one possible implementation, the magnetic core further includes an outer casing having a mounting cavity, within which the cylindrical portion, the frame, and the winding are all located; the cavity wall of the mounting cavity is a smooth curved surface to accommodate at least a portion of the outer surface of the winding.

[0011] In some embodiments, the cylindrical portion includes two separate cylindrical units that are axially connected, and the outer casing includes two separate shell units that are axially connected. The two cylindrical units and the two shell units correspond one-to-one and are integrally connected. Each of the cylindrical units is provided with the glue-filling channel, and the glue-filling channel axially penetrates the corresponding shell unit to form a glue-filling inlet; The two axial ends of the skeleton respectively abut against the inner sidewalls of the two shell units.

[0012] The beneficial effects of the magnetic component structure with a potting channel provided by this invention are as follows: Compared with the prior art, the magnetic component structure with a potting channel of this invention, by setting a potting channel in the cylindrical part of the magnetic core and setting a hollow part on the frame that communicates with the potting channel, allows the thermally conductive adhesive to be directly filled into the hollow part through the potting channel and come into contact with the winding. Therefore, the heat generated in the cylindrical part can be directly transferred to the winding through the thermally conductive adhesive, and dissipated outwards by utilizing the large surface area of ​​the winding itself, reducing the thermal resistance from the cylindrical part to the external environment and improving the heat dissipation effect of the magnetic core.

[0013] Because the heat from the cylindrical section can be dissipated in a timely manner, problems such as decreased permeability, reduced saturation flux density, and even permanent damage to magnetic materials caused by excessive core temperature are avoided. Simultaneously, the windings, by directly participating in heat dissipation, slow down the thermal aging process of the insulation layer. Furthermore, the uniform filling with thermally conductive adhesive helps reduce localized hot spots and lower thermal stress, thereby improving the overall long-term operational reliability and service life of the magnetic component structure.

[0014] This invention utilizes the windings of the magnetic component structure itself as a heat sink, achieving efficient heat dissipation without the need for additional heat sinks, fans, or external heat-conducting structures. The design of the potting channels and hollowed-out sections makes full use of the existing space between the magnetic core and the frame, without increasing the overall size and weight of the transformer, which is conducive to achieving high power density, miniaturization, and integration of the magnetic component structure.

[0015] In a second aspect, the present invention also provides an electrical device, comprising: Encapsulation box; A liquid cooling plate, fitted to the outer surface of the potting cartridge, is used to cool the potting cartridge; and The aforementioned magnetic component structure with a potting channel is placed horizontally inside the potting box. The potting box is filled with thermally conductive adhesive, which is in contact with the outer surface of the magnetic core. The thermally conductive adhesive is also filled into the hollowed-out portion through the potting channel and comes into contact with the winding.

[0016] In one possible implementation, the electrical device further includes a housing; the liquid cooling plate and the potting compound are both located within the housing; a circuit board is also provided within the housing. The potting box includes a main box with an open end and an insulating plate covering the open end. The liquid cooling plate is attached to one side of the potting box opposite the opening end; the circuit board is located on the side of the insulating plate away from the opening end; The magnetic core is connected to pins that pass through the insulating plate and are plugged into the circuit board.

[0017] In some embodiments, the insulating plate is provided with clearance holes; a portion of the winding and a portion of the cylindrical portion pass through the clearance holes; and / or The direction perpendicular to the opening end is defined as the first direction. Two sets of glue-filling channels are arranged at intervals along the first direction, one of which is close to the liquid cooling plate.

[0018] Compared with existing technologies, the electrical device provided by this invention features a magnetic component structure that rests flat within a potting housing, with a uniform and small distance between the outer surfaces of the windings and magnetic core and the bottom surface of the potting housing. After the thermally conductive adhesive is filled, a uniformly thick thermally conductive adhesive layer is formed between the magnetic component structure and the bottom surface of the potting housing, resulting in a large contact area and low thermal resistance. Heat transferred from the windings and magnetic core to the thermally conductive adhesive is then quickly and uniformly conducted to the bottom surface of the potting housing.

[0019] The thermally conductive adhesive fills the entire interior of the potting enclosure, ensuring that all parts of the magnetic component are encapsulated by a thermally conductive medium. Combined with active cooling from the liquid cooling plate, the heat generated by the magnetic component can be dissipated to an external cold source via the shortest path. Furthermore, because the thermally conductive adhesive itself has a certain thermal diffusion capacity, and the liquid cooling plate provides a constant low-temperature boundary, the temperature gradient within the entire potting enclosure is small, preventing performance degradation or failure caused by localized overheating.

[0020] The potting enclosure is filled with thermally conductive adhesive, completely sealing the magnetic component structure and isolating it from environmental factors such as moisture, dust, and salt spray, thereby improving the IP protection rating of the electrical equipment. Simultaneously, after the thermally conductive adhesive cures, it forms a mechanical buffer for the magnetic component structure, enhancing its vibration and impact resistance. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of a magnetic component structure with a potting channel provided in an embodiment of the present invention; Figure 2 A schematic diagram of the mating structure between the magnetic core and the frame of a magnetic component structure with a potting channel provided in an embodiment of the present invention; Figure 3 A schematic diagram of the magnetic core with a potting channel provided in an embodiment of the present invention; Figure 4 A cross-sectional structural diagram of a magnetic component structure with a potting channel provided in an embodiment of the present invention; Figure 5 A schematic diagram of the structure of an electrical device provided in an embodiment of the present invention (one side plate of the device housing is hidden in the figure to show the internal structure of the electrical device). Figure 6 for Figure 5 A schematic diagram of the exploded structure; Figure 7 This is a schematic diagram of the structure of a potting box for an electrical device provided in one embodiment of the present invention.

[0023] In the picture: 1. Magnetic core; 11. Cylindrical section; 111. Cylindrical unit; 12. Outer casing; 121. Shell unit; 122. Mounting cavity; 13. Glue channel; 2. Skeleton; 21. Hollowed-out section; 22. Radial gap; 3. Windings; 4. Encapsulation box; 41. Main box; 42. Insulating board; 421. Clearance hole; 5. Liquid cooling plate; 6. Equipment casing; 7. Circuit board. Detailed Implementation

[0024] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0025] It should be noted that when an element is referred to as being "set on" another element, it can be directly on or indirectly on that other element. It should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0026] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a number" means two or more, unless otherwise explicitly specified.

[0027] Please refer to the following: Figures 1 to 4 The magnetic component structure with a potting channel provided by the present invention will now be described. The magnetic component structure with a potting channel includes a magnetic core 1, a frame 2, and a winding 3. The magnetic core 1 includes a cylindrical portion 11; the cylindrical portion 11 has a potting channel 13; the frame 2 is sleeved on the cylindrical portion 11; the frame 2 has a hollow portion 21, which communicates with the potting channel 13; the winding 3 is wound on the frame 2; wherein, the potting channel 13 is used for injecting thermally conductive adhesive, so that the thermally conductive adhesive can fill the hollow portion 21 through the potting channel 13 and contact the winding 3, so as to transfer the heat generated by the cylindrical portion 11 to the winding 3 through the thermally conductive adhesive.

[0028] The magnetic core 1 is the core magnetic circuit component of this magnetic structure. It is made of ferrite material with high permeability and provides a closed path with low magnetic resistance for the magnetic field generated by the winding 3. Specifically, the cylindrical part 11 of the magnetic core 1 is the central magnetic column of the magnetic core 1. It is the core part with the highest magnetic flux density and the lowest magnetic resistance in the entire closed magnetic circuit. Most of the magnetic field generated by the winding 3 is concentrated in the cylindrical part 11 to form a closed loop. In addition, the cylindrical part 11 also provides a mounting reference surface for the frame 2. The frame 2 can be tightly fitted onto the cylindrical part 11 to achieve precise circumferential and axial positioning of the frame 2 and the magnetic core 1.

[0029] In related technologies, the cylindrical part 11 is generally a solid structure. The solid cylindrical part 11 indirectly supports the winding 3 wound on the frame 2 through the frame 2. It can withstand the tension during the winding process of the winding 3 as well as the vibration and impact during transportation and use, ensuring that the air gap between the winding 3 and the magnetic core 1 is uniform and the relative position accuracy is stable over a long period of time.

[0030] Since the traditional cylindrical part 11 is a solid structure and is surrounded by the winding 3, the heat generated by the magnetic core 1 when it is working can only be transferred to the outside through the frame 2 and the winding 3. The winding 3 also generates heat when it is working, making it difficult for the heat of the magnetic core 1 to be effectively transferred to the external environment. As a result, the heat dissipation effect is poor, and the magnetic core 1 becomes the part with the highest temperature in the whole, forming a thermal bottleneck.

[0031] In this embodiment, an independent potting channel 13 is formed in the cylindrical part 11, forming an internal fluid channel from the external injection port of the magnetic core 1 to the joint surface of the magnetic core 1 and the skeleton 2. This allows the thermally conductive adhesive to break through the covering barrier of the skeleton 2 and the winding 3 and penetrate into the central area where the heat generation of the magnetic core 1 is most concentrated, opening up the heat dissipation path of the core heat source of the magnetic core 1 and realizing the direct export of heat from the source of generation.

[0032] Preferably, the glue-filling channel 13 can be one or more grooves extending axially along the cylindrical portion 11, or it can be multiple independent channels distributed circumferentially along the cylindrical portion 11. One or both ends of the glue-filling channel 13 penetrate the end face of the cylindrical portion 11 to form an inlet for injecting thermally conductive adhesive.

[0033] The skeleton 2 is injection molded from insulating, high-temperature resistant plastic, and has an overall hollow cylindrical structure. The skeleton 2 has at least one perforated portion 21, and each perforated portion 21 communicates with the glue-filling channel 13. The perforated portion 21 can be multiple strip-shaped holes, round holes, or irregularly shaped holes distributed circumferentially along the skeleton 2. The number, shape, and distribution of the perforated portions 21 correspond to the glue-filling channel 13, ensuring that when the skeleton 2 is fitted onto the cylindrical portion 11, the perforated portions 21 and the glue-filling channel 13 are radially opposite and communicate with each other.

[0034] The perforated portion 21 provides a direct channel for the thermally conductive adhesive to flow from the potting channel 13 to the winding 3. In traditional frames with continuous walls, the thermally conductive adhesive cannot penetrate the frame to contact the winding 3. This embodiment, through its perforated design, allows the thermally conductive adhesive to directly wet the internal surface of the winding 3, shortening the heat conduction path while maintaining the insulating effect of the frame 2. Furthermore, the perforated portion 21 reduces the weight of the frame 2 and increases the contact area between the thermally conductive adhesive and the winding 3, further improving heat dissipation.

[0035] The winding 3 is made of enameled copper or aluminum wire and is tightly or evenly wound around the outer circumference of the frame 2. The number of turns, wire diameter, and number of layers of the winding 3 are set according to the electrical parameter requirements of the magnetic component structure. After the thermally conductive adhesive is filled through the potting channel 13 and the hollow part 21, the thermally conductive adhesive comes into direct contact with the inner surface of the winding 3 (i.e., the side facing the frame 2) and the gaps between the turns of the winding 3, forming a continuous heat conduction interface.

[0036] In this embodiment, winding 3 not only serves as a carrier for electrical energy transmission but also functions as a heat sink. The thermally conductive adhesive directly transfers the heat generated by the magnetic core 1 to winding 3. The heat can then be conducted along the wires of winding 3 to the entire surface of winding 3 and dissipated to the external environment thanks to the large surface area of ​​winding 3. By utilizing the thermal conductivity and heat dissipation area of ​​winding 3 itself to dissipate heat from the magnetic core 1, the need for additional heat sinks is avoided, achieving a balance between compact structure and efficient heat dissipation.

[0037] Specifically, the assembly process of the magnetic component structure is as follows: First, the winding 3 is wound onto the frame 2, then the frame 2 is fitted onto the cylindrical part 11, and the circumferential position of the frame 2 is adjusted so that the hollow part 21 on the frame 2 is radially aligned with the glue-filling channel 13; of course, the frame 2 can also be fitted onto the cylindrical part 11 first, and then the winding 3 is wound onto the frame 2. Then, thermally conductive adhesive is injected from the injection port of the glue-filling channel 13, and the thermally conductive adhesive flows along the glue-filling channel 13 to the position opposite to the hollow part 21.

[0038] Because the perforated portion 21 is connected to the potting channel 13, the thermally conductive adhesive passes through the perforated portion 21 under pressure and comes into direct contact with the inner surface of the winding 3. With continuous injection, the thermally conductive adhesive gradually fills the potting channel 13, the radial gap 22 between the skeleton 2 and the cylindrical portion 11, and the perforated portion 21, and eventually impregnates part of the winding 3. Excess thermally conductive adhesive can be discharged along subsequent channels or vent holes to ensure a dense filling.

[0039] It should be noted that, in this embodiment, the thermally conductive adhesive is an insulating potting material with good flowability and thermal conductivity, such as thermally conductive silicone grease, thermally conductive epoxy resin, thermally conductive polyurethane, or silicone gel. Before injection, the thermally conductive adhesive is in a liquid or semi-fluid state, and its viscosity can be selected according to the actual potting process requirements (e.g., a viscosity of 1000~5000 mPa·s at 23°C) to ensure that the thermally conductive adhesive can flow smoothly through the potting channel 13 and enter the hollow portion 21. After curing or solidifying, the thermally conductive adhesive forms a solid or gel-like substance with a certain degree of elasticity.

[0040] The magnetic component structure with a potting channel provided by this invention, compared with the prior art, provides a potting channel 13 in the cylindrical portion 11 of the magnetic core 1, and a hollow portion 21 communicating with the potting channel 13 on the frame 2. This allows the thermally conductive adhesive to be directly filled into the hollow portion 21 through the potting channel 13 and come into contact with the winding 3. As a result, the heat generated by the cylindrical portion 11 can be directly transferred to the winding 3 through the thermally conductive adhesive, and dissipated outward with the help of the large surface area of ​​the winding 3 itself. This reduces the thermal resistance of the cylindrical portion 11 to the external environment and improves the heat dissipation effect of the magnetic core 1.

[0041] Because the heat from the cylindrical section 11 can be dissipated in a timely manner, problems such as decreased permeability, reduced saturation flux density, and even permanent damage to the magnetic material caused by excessively high temperatures in the magnetic core 1 are avoided. Simultaneously, the winding 3, by directly participating in heat dissipation, slows down the thermal aging process of the insulation layer. Furthermore, the uniform filling with thermally conductive adhesive helps reduce localized hot spots and lower thermal stress, thereby improving the overall long-term operational reliability and service life of the magnetic component structure.

[0042] This invention utilizes the winding 3 of the magnetic component structure itself as a heat sink, achieving efficient heat dissipation without the need for additional heat sinks, fans, or external heat-conducting structures. The design of the potting channel 13 and the hollowed-out portion 21 makes full use of the existing space between the magnetic core 1 and the frame 2, without increasing the overall size and weight of the transformer, which is conducive to achieving high power density, miniaturization, and integration of the magnetic component structure.

[0043] In some embodiments, the frame 2 and the cylindrical portion 11 may be connected by a method such as Figure 2 and Figure 4 The structure shown is described in the following document. Figure 2 and Figure 4 There is a radial gap 22 between the skeleton 2 and the cylindrical part 11, and the glue channel 13 is connected to the radial gap 22; the thermally conductive glue can be injected through the glue channel 13 and sequentially fill the radial gap 22 and the hollow part 21.

[0044] A radial gap 22 exists between the frame 2 and the cylindrical portion 11, meaning that the frame 2 and the cylindrical portion 11 are in a clearance fit, and the inner wall of the frame 2 and the outer wall of the cylindrical portion 11 of the magnetic core 1 are not completely fitted together. Preferably, the radial gap 22 is continuously distributed along the circumference of the cylindrical portion 11. The outlet of the potting channel 13 faces the radial gap 22, so that after the thermally conductive adhesive is injected from the potting channel 13, it first enters and fills the entire radial gap 22, and then flows further to the winding 3 through the perforated portion 21.

[0045] After the radial gap 22 is completely filled with thermally conductive adhesive, a circumferentially uniform thermally conductive adhesive layer is formed between the outer peripheral surface of the cylindrical portion 11 and the inner wall of the frame 2. This thermally conductive adhesive layer covers the entire outer peripheral surface of the cylindrical portion 11, allowing the heat generated by the magnetic core 1 to be uniformly transferred from all directions of the cylindrical portion 11 to the thermally conductive adhesive, avoiding the problem of uneven local heat conduction caused by the limited distribution of the potting channels 13. Compared to the thermally conductive adhesive only contacting the winding 3 in a point-like manner through discrete hollow portions 21, this embodiment achieves full circumferential heat collection and transfer through the radial gap 22.

[0046] The radial gap 22 serves as a buffer zone for the thermally conductive adhesive to flow from the filling channel 13 to the hollow section 21, and also reduces flow resistance. The thermally conductive adhesive first diffuses within the radial gap 22 and establishes a certain pressure distribution before being evenly pressed into the hollow section 21. This sequence of diffusion followed by filling avoids the thermally conductive adhesive directly impacting the hollow section 21 and generating eddies or air bubbles, facilitates air removal, ensures that the hollow section 21 is completely filled, and improves the density and consistency of the filling.

[0047] Furthermore, the presence of the radial gap 22 allows for a certain dimensional tolerance between the cylindrical part 11 and the frame 2, eliminating the need for high-precision machining. Even if there is a slight deviation in the concentricity of the cylindrical part 11 and the frame 2, the radial gap 22 can still be completely filled by the thermally conductive adhesive without affecting the heat conduction effect. This not only reduces the machining accuracy requirements for the magnetic core 1 and the frame 2, but also enhances the electrical insulation performance and withstand voltage rating of the product, improving its operational reliability in harsh environments such as high pressure and high humidity.

[0048] In some embodiments, the aforementioned hollow portion 21 can be adopted as follows: Figure 2 and Figure 4 The structure shown is described in the following document. Figure 2 and Figure 4 The hollowed-out parts 21 are distributed in multiple intervals along the circumference of the skeleton 2, and the glue-filling channel 13 is radially opposite to and connected to one of the hollowed-out parts 21.

[0049] The skeleton 2 has multiple perforated sections 21 (e.g., 2, 4, or 6) spaced apart in the circumferential direction. These perforated sections 21 can be strip-shaped holes, round holes, or other shapes. The glue-filling channel 13 on the cylindrical part 11 is directly opposite and connected to only one of the perforated sections 21 in the radial direction, while the other perforated sections 21 are indirectly connected to the glue-filling channel 13 through the radial gap 22 between the skeleton 2 and the cylindrical part 11.

[0050] After the thermally conductive adhesive is injected through the filling channel 13, it first diffuses circumferentially on the outer periphery of the cylindrical portion 11 through the radial gap 22, forming a continuous thermally conductive adhesive layer. Due to the presence of the radial gap 22, the thermally conductive adhesive can bypass the solid part of the skeleton 2 and flow from the directly opposite hollowed-out portions 21 to both sides, sequentially filling the remaining hollowed-out portions 21 in the circumferential direction. Therefore, in this embodiment, only one filling channel 13 needs to be provided on the cylindrical portion 11 to achieve the filling of all the hollowed-out portions 21 in the circumferential direction, avoiding the increased processing difficulty and cost and the problem of reduced structural strength of the cylindrical portion 11 caused by opening multiple filling channels 13 in the circumferential direction of the cylindrical portion 11.

[0051] Of course, multiple potting channels 13 can also be provided on the cylindrical portion 11. Preferably, this embodiment provides two potting channels 13. The smaller number of two potting channels 13 results in less damage to the magnetic circuit. Compared with the multiple potting channel scheme, it can carry more power with the same magnetic core 1 size, thereby improving the power density of the magnetic component structure.

[0052] During the adhesive filling process, as the thermally conductive adhesive sequentially fills the radial gaps 22 and each hollow section 21, the air inside the hollow section 21 and the air at the end of the radial gaps 22 are driven to the last unfilled hollow section 21 or its far end, and finally discharged from the vent. The sequential filling mechanism ensures that each hollow section 21 is completely filled without any air cavitation residue, thus guaranteeing full contact between the winding 3 and the thermally conductive adhesive.

[0053] Since the radial gap 22 serves to distribute the thermally conductive adhesive circumferentially, extremely high radial alignment accuracy is not required between the adhesive channel 13 and the hollowed-out portion 21. As long as the outlet of the adhesive channel 13 is within the circumferential coverage of any hollowed-out portion 21, the thermally conductive adhesive can smoothly enter that hollowed-out portion 21 and further diffuse to other hollowed-out portions 21. This reduces the assembly alignment accuracy requirements between the cylindrical portion 11 of the magnetic core 1 and the frame 2, simplifying the production assembly process.

[0054] Preferably, based on the above embodiment, the hollow part 21 is a strip-shaped hole that extends along the axial direction of the skeleton 2; the circumferential inlet edge of the strip-shaped hole is provided with a guide slope, which is flared toward the glue-filling channel 13 and the radial gap 22.

[0055] The guide slope flares out towards the potting channel 13 and the radial gap 22, effectively forming a funnel-shaped or gradually expanding guide structure at the entrance of the strip hole. When the thermally conductive adhesive flows from the potting channel 13 into the radial gap 22 and towards the strip hole, the guide slope effectively gathers and guides the adhesive into the strip hole, avoiding flow eddies, local stagnation, or pressure drops caused by sharp inlet edges (such as right angles or acute angles). This reduces the flow resistance of the thermally conductive adhesive entering the strip hole, allowing even high-viscosity thermally conductive adhesives to fill the strip hole quickly and smoothly.

[0056] In some embodiments, the above-mentioned potting channel 13 can be adopted as follows: Figures 1 to 4 The structure shown is described in the following document. Figures 1 to 4 The glue-filling channel 13 is a guide groove formed on the outer peripheral surface of the cylindrical part 11. At least one end of the guide groove extends through the cylindrical part 11 in the axial direction to form a glue-filling inlet. The opening side of the guide groove is opposite to and connected to the hollow part 21 in the radial direction.

[0057] The flow channel is axially formed on the outer circumferential surface of the cylindrical portion 11, and its channel-shaped structure provides a clear and continuous flow path for the thermally conductive adhesive. Compared to creating complex channels or relying on random gaps in the cylindrical portion 11, the flow channel has a regular cross-sectional shape and smooth inner wall, resulting in low resistance to the thermally conductive adhesive flowing within the channel. This allows for rapid delivery from the adhesive inlet at the axial end to the predetermined position opposite the hollowed-out portion 21. Furthermore, the axially continuous design of the flow channel allows for adhesive injection from one or both sides of the magnetic component structure, providing flexibility for different assembly layouts.

[0058] The opening side of the flow channel is radially opposite to and connected to the hollowed-out portion 21. This means that the thermally conductive adhesive in the flow channel can be directly aligned with the inlet of the hollowed-out portion 21, preventing the adhesive from spreading disorderly on the outer circumferential surface of the cylindrical portion 11. This ensures that most of the thermally conductive adhesive is first guided to the core area that needs heat dissipation, rather than being wasted in non-heat dissipation areas. At the same time, the flow channel can serve as the main distribution channel, working in conjunction with the aforementioned radial gap 22 to diffuse the adhesive circumferentially from inside the channel to other hollowed-out portions 21 that are not directly opposite each other, achieving circumferential distribution.

[0059] The guide groove is formed on the outer peripheral surface of the cylindrical part 11, which also increases the contact area between the cylindrical part 11 and the thermally conductive adhesive. The thermally conductive adhesive not only contacts the bottom and wall of the groove, but also connects with the adhesive layer in the radial gap 22 through the opening side of the groove, so that the heat of the magnetic core 1 can be transferred to the thermally conductive adhesive from multiple directions on the outer peripheral surface of the cylindrical part 11. The increase in contact area further reduces the thermal resistance from the magnetic core 1 to the thermally conductive adhesive.

[0060] Preferably, both ends of the guide groove extend through the cylindrical portion 11. This through structure allows the thermally conductive adhesive to push the air inside the groove out from the other end or from the perforated portion 21 during the injection process. When one end of the guide groove serves as the adhesive inlet, the other end can remain open or be connected to the exhaust port, forming a smooth exhaust path. This ensures that the guide groove and the subsequent radial gap 22 and perforated portion 21 are completely filled with the thermally conductive adhesive, leaving no air pockets.

[0061] In this embodiment, the flow guide groove is located on the outer circumferential surface of the cylindrical portion 11. From a manufacturing perspective, the flow guide groove is an open groove structure that can be directly machined onto the outer circumferential surface of the cylindrical portion 11 through methods such as molding, mechanical cutting (e.g., milling), or engraving after injection molding. This process is simple and inexpensive. Compared to closed internal channels, the flow guide groove eliminates the need for complex core pulling or drilling processes, resulting in simpler mold design and a higher yield. For brittle materials such as ferrites, creating open flow guide grooves is easier and less prone to cracking than machining elongated holes.

[0062] Moreover, although the flow channel is opened, the main body of the cylindrical part 11 is preserved. Compared with the method of opening multiple through holes or deep holes in the circumference of the cylindrical part 11, the flow channel weakens the structural strength of the magnetic core 1 to the least extent.

[0063] In some embodiments, the inner wall of the guide channel is a smoothly transitioned curved surface.

[0064] The inner wall of the flow channel adopts a smooth transition curved surface (such as a U-shaped cross section, an arc bottom, or an elliptical arc surface) without any sharp inner corners. When the thermal conductive adhesive flows in the flow channel, the smooth curved surface can reduce the frictional resistance between the fluid and the wall surface as well as the eddy current loss caused by the sudden change in flow direction, so that the thermal conductive adhesive can uniformly fill the entire flow channel with lower injection pressure and faster flow rate.

[0065] The flow channel is formed on the cylindrical portion 11 of the magnetic core 1, and the material of the magnetic core 1 typically has high hardness and brittleness. If the cross-section of the flow channel has sharp inner angles, these sharp angles are prone to becoming stress concentration points during the manufacturing, assembly, or use of the magnetic component, leading to microcracks or even fracture in the cylindrical portion 11. In this embodiment, by designing the inner wall of the flow channel as a smoothly transitioned curved surface, sharp angles are eliminated, allowing stress to be evenly distributed along the curved surface, reducing the risk of cracking of the magnetic core 1, and improving reliability.

[0066] In some embodiments, the width of the opening side of the guide groove in the circumferential direction is greater than the width of the hollow portion 21 in the circumferential direction.

[0067] The opening width of the guide channel is greater than the circumferential width of the hollow portion 21, meaning that the opening area of ​​the guide channel can completely cover the inlet range of the hollow portion 21 in the circumferential direction. Even if there is a certain assembly deviation between the cylindrical portion 11 and the frame 2 in the circumferential direction (for example, the hollow portion 21 is not perfectly aligned with the guide channel due to manufacturing tolerances or assembly alignment errors), the redundant width of the guide channel opening can still ensure that the entire inlet of the hollow portion 21 is included within the projection range of the guide channel. This ensures that after the thermally conductive adhesive flows out of the guide channel, it can be directly aligned and enter the hollow portion 21 regardless of the assembly deviation, avoiding adhesive blockage or filling failure due to misalignment, and improving the manufacturing tolerance and yield of the product.

[0068] Furthermore, the wider opening of the guide channel acts as a circumferentially extending buffer zone before the inlet of the hollow section 21. As the thermally conductive adhesive flows from the guide channel to the hollow section 21, it first diffuses and establishes a lower pressure gradient within the wider opening area before uniformly entering the narrower hollow section 21. This transition design reduces abrupt changes in flow rate and pressure loss at the inlet, lowering flow resistance and allowing the thermally conductive adhesive to fill the hollow section 21 more smoothly and steadily, especially suitable for high-viscosity thermally conductive adhesives. Simultaneously, the wider opening allows some of the adhesive to diffuse circumferentially within the radial gap 22, providing an adhesive source for filling other circumferentially hollow sections 21.

[0069] The increased width of the guide groove opening means that a wider circumferential area on the outer periphery of the cylindrical portion 11 is directly covered by the thermally conductive adhesive. The heat generated by the magnetic core 1 is first transferred to the outer periphery of the cylindrical portion 11. The wider opening allows a larger surface area of ​​the cylindrical portion 11 to contact the thermally conductive adhesive, thereby collecting the heat from the magnetic core 1 more efficiently. This heat is then concentrated and transported to the hollow portion 21 through the adhesive in the guide groove and transferred to the winding 3, further reducing the contact thermal resistance between the magnetic core 1 and the thermally conductive adhesive.

[0070] In some embodiments, the magnetic core 1 may also employ, as shown in the following examples: Figure 2 and Figure 3 The structure shown is described in the following document. Figure 2 and Figure 3 The magnetic core 1 also includes an outer mounting part 12, which has a mounting cavity 122. The cylindrical part 11, the frame 2 and the winding 3 are all located in the mounting cavity 122. The cavity wall of the mounting cavity 122 is a smooth curved surface to fit at least part of the outer surface of the winding 3.

[0071] The outer part 12 and the cylindrical part 11 can be integrally formed or assembled separately and then fixedly connected. An installation cavity 122 is formed inside the outer part 12. The cylindrical part 11 is located in the central region of the installation cavity 122. The frame 2 is fitted onto the cylindrical part 11, and the winding 3 is wound around the outer periphery of the frame 2, so that the cylindrical part 11, the frame 2, and the winding 3 are all accommodated inside the installation cavity 122. The cavity wall surface of the installation cavity 122 is a smooth curved surface, the shape of which matches the outer surface shape of the winding 3, and can conform to at least a portion of the outer surface of the winding 3.

[0072] The outer part 12 and the cylindrical part 11 together constitute the complete magnetic core 1 structure. The cylindrical part 11 serves as the central post (the central post of the magnetic circuit), and the outer part 12 serves as the external magnetic yoke (the side post and bottom of the magnetic circuit), forming a closed or nearly closed magnetic circuit between them. When the winding 3 is energized, the magnetic flux starts from the cylindrical part 11, returns through the outer part 12, and forms a complete magnetic field line loop.

[0073] The outer casing 12 completely or partially encloses the cylindrical part 11, the frame 2, and the winding 3 within the mounting cavity 122, providing physical protection and preventing collisions with external objects. Simultaneously, as a continuous magnetic conductor, the outer casing 12 shields against external electromagnetic interference, reducing electromagnetic radiation from the magnetic structure to the surrounding circuits and mitigating the impact of external magnetic fields on the structure's operation, thus improving electromagnetic compatibility.

[0074] The cavity wall of mounting cavity 122 is a smooth curved surface and is adapted to at least a portion of the outer surface of winding 3. This means that the outer surface of winding 3 and the inner wall of outer mounting portion 12 can be in close contact or have only a small gap. Preferably, thermally conductive adhesive can be filled between winding 3 and outer mounting portion 12 (or the thermally conductive adhesive injected from the aforementioned potting channel 13 can overflow into this gap), so that the heat of winding 3 can not only be dissipated to the air through its own surface, but also directly conducted to outer mounting portion 12. As part of magnetic core 1, outer mounting portion 12 has a large surface area and heat capacity, which can further transfer heat to the external environment or the heat dissipation structure in contact with it.

[0075] In addition, the outer mounting part 12, as the mounting base, also serves to fix and limit the winding 3. The winding 3 is not directly fixed, but indirectly fixed through the outer mounting part 12. Therefore, there is no need to add additional fixing structures such as brackets, clips or binding straps to the winding 3, which reduces material costs and assembly time.

[0076] Please see Figure 3Based on the above embodiments, the cylindrical part 11 includes two separate cylindrical units 111 that are axially connected, and the outer part 12 includes two separate shell units 121 that are axially connected. The two cylindrical units 111 and the two shell units 121 correspond one-to-one and are integrally connected. Each cylindrical unit 111 is provided with a glue-filling channel 13, and the glue-filling channel 13 axially passes through the corresponding shell unit 121 to form a glue-filling inlet. The two axial ends of the skeleton 2 respectively abut against the inner sidewalls of the two shell units 121.

[0077] Each cylindrical unit 111 and its corresponding shell unit 121 constitute an independent half-core module. Two half-core modules are joined together along the axial direction to form a complete core 1.

[0078] Since the skeleton 2 needs to be fitted onto the cylindrical part 11, and the winding 3 has been pre-wound onto the skeleton 2, if the magnetic core 1 is an integral structure, the skeleton 2 cannot pass through the outer part 12 and fit onto the cylindrical part 11. This embodiment adopts a split structure, where the two half-core modules can be assembled from the two axial ends of the skeleton 2 respectively. First, the skeleton 2 is placed in a predetermined position, and then the two half-core modules are axially joined from both sides towards the middle, so that the skeleton 2 fits onto the cylindrical part 11. After assembly, the two axial ends of the skeleton 2 respectively abut against the inner sidewalls of the two shell units 121, achieving precise positioning and clamping fixation of the skeleton 2 in the axial direction, preventing axial movement of the skeleton 2 during subsequent potting or use.

[0079] The glue-filling channel 13 on each cylindrical unit 111 axially extends through the corresponding shell unit 121, forming a glue-filling inlet on the outer end face of the shell unit 121. Thermally conductive glue can be injected from the axial end face of the magnetic component structure (i.e., the outside of the shell unit 121), rather than from the inside or side of the magnetic core 1. When the magnetic component structure is installed, the glue-filling inlet on the outer end face of the shell unit 121 is exposed, facilitating glue filling and eliminating the need to reserve complex glue-filling pipelines inside the magnetic core 1.

[0080] Furthermore, each of the two cylindrical units 111 has an independent potting channel 13, and each channel passes through the corresponding shell unit 121, meaning that the magnetic component structure can be injected with thermally conductive adhesive from both ends simultaneously. When potting adhesive from both ends simultaneously, gas can be discharged sequentially through the joint of the two cylindrical units 111, the hollow portion 21, and the gaps in the winding 3 itself. Potting adhesive from both ends simultaneously shortens the flow distance of the thermally conductive adhesive, allowing it to fill the entire radial gap 22 and all hollow portions 21 more quickly, which is especially suitable for magnetic component structures with a long axial length; in addition, during the potting process, one end can be injected with adhesive while the other end is used as an exhaust port to achieve smooth exhaust and ensure dense filling.

[0081] Please see Figure 7Based on the same inventive concept, this application also provides an electrical device, including a potting box 4, a liquid cooling plate 5, and the aforementioned magnetic component structure with potting channels. The liquid cooling plate 5 is disposed in contact with the outer surface of the potting box 4 for cooling the potting box 4; the magnetic component structure with potting channels is horizontally placed inside the potting box 4; wherein, the interior of the potting box 4 is filled with thermally conductive adhesive, the thermally conductive adhesive is in contact with the outer surface of the magnetic core 1, and the thermally conductive adhesive is filled into the hollow portion 21 through the potting channels 13 and contacts the winding 3.

[0082] The potting housing 4 has an internal cavity for accommodating the magnetic component structure and filling it with thermally conductive adhesive. The potting housing 4 can be made of metal (such as aluminum or copper) or thermally conductive plastic, providing good thermal conductivity and structural strength. A liquid cooling plate 5 is fitted onto the outer surface of the potting housing 4. The liquid cooling plate 5 has internal coolant channels and is externally connected to a cooling circulation system. During operation, the coolant flows through the liquid cooling plate 5, actively carrying away heat.

[0083] The magnetic component structure is positioned horizontally inside the potting housing 4, meaning the cylindrical portion 11 of the magnetic core 1 is axially parallel to the bottom surface of the potting housing 4. Since the axial length of this magnetic component structure is typically much greater than its radial dimension, placing it vertically would require a significantly taller internal space within the potting housing 4, increasing the overall height of the electrical equipment. When placed horizontally, the height of the potting housing 4 matches the radial dimension of the magnetic component structure, thereby reducing the overall height of the electrical equipment, minimizing space requirements, and facilitating layout integration with other flat components. Furthermore, with the magnetic component structure horizontally, the path for heat transfer from the magnetic component structure with its potting channels to the bottom surface of the potting housing 4 via the thermally conductive adhesive is shorter, resulting in lower thermal resistance.

[0084] Except for the space occupied by the magnetic components, all the gaps inside the potting box 4 are filled with thermally conductive adhesive. The thermally conductive adhesive is in direct contact with the outer surface of the magnetic core 1, and at the same time, it is fully in contact with the inner surface of the winding 3 and the inter-turn gap through the potting channel 13 on the cylindrical part 11 of the magnetic core 1, the radial gap 22 between the skeleton 2 and the cylindrical part 11, and the hollow part 21 of the skeleton 2.

[0085] When the magnetic component is in operation, the magnetic core 1 and winding 3 generate heat. Thermally conductive adhesive transfers the heat from the cylindrical portion 11 directly to the winding 3 through the potting channel 13 and the perforated portion 21. Simultaneously, the thermally conductive adhesive itself also wraps around the outer casing 12 and the winding 3, forming a three-dimensional thermally conductive network. The thermally conductive adhesive concentrates the heat of the entire magnetic component structure to the inner wall of the potting housing 4. Because the potting housing 4 is filled with thermally conductive adhesive and is typically made of a highly thermally conductive material, the heat is rapidly transferred to the outer surface of the potting housing 4. A liquid cooling plate 5 is attached to the outer surface of the potting housing 4. As the coolant flows through the liquid cooling plate 5, it carries away the heat transferred from the potting housing 4, achieving efficient and controllable heat dissipation.

[0086] Compared with the prior art, the electrical equipment provided by this invention features a magnetic component structure that is placed flat inside the potting housing 4. The distance between the outer surfaces of the winding 3 and the magnetic core 1 and the bottom surface of the potting housing 4 is uniform and small. After the thermally conductive adhesive is filled, a uniformly thick thermally conductive adhesive layer is formed between the magnetic component structure and the bottom surface of the potting housing 4, resulting in a large contact area and low thermal resistance. Heat transferred from the winding 3 and the magnetic core 1 to the thermally conductive adhesive can be quickly and uniformly conducted to the bottom surface of the potting housing 4.

[0087] The thermally conductive adhesive fills the entire interior of the potting enclosure 4, ensuring that all parts of the magnetic component are encapsulated by the thermally conductive medium. Combined with the active cooling of the liquid cooling plate 5, the heat generated by the magnetic component can be dissipated to an external cold source via the shortest path. Furthermore, because the thermally conductive adhesive itself has a certain thermal diffusion capacity, and the liquid cooling plate 5 provides a constant low-temperature boundary, the temperature gradient inside the entire potting enclosure 4 is small, preventing performance degradation or failure caused by localized overheating.

[0088] Furthermore, the interior of the potting housing 4 is filled with thermally conductive adhesive, completely sealing the magnetic component structure and isolating it from environmental factors such as moisture, dust, and salt spray, thereby improving the IP protection rating of the electrical equipment. Simultaneously, after the thermally conductive adhesive cures, it forms a mechanical buffer for the magnetic component structure, enhancing its vibration and impact resistance.

[0089] In some embodiments, the above-described electrical equipment may also employ, for example... Figure 5 and Figure 6 The structure shown is described in the following document. Figure 5 and Figure 6 The electrical equipment also includes a housing 6; the liquid cooling plate 5 and the potting box 4 are both located inside the housing 6; the housing 6 also contains a circuit board 7; the potting box 4 includes a main box 41 with an open end and an insulating plate 42 covering the open end; the liquid cooling plate 5 is attached to the side of the potting box 4 opposite to the open end; the circuit board 7 is located on the side of the insulating plate 42 away from the open end; the magnetic core 1 is connected to pins, which pass through the insulating plate 42 and are inserted into the circuit board 7.

[0090] The equipment housing 6 serves as the outer shell structure of the entire electrical equipment, housing and protecting the internal components. The equipment housing 6 can be made of metal or engineering plastic, possessing the necessary mechanical strength. A potting compound 4 is disposed inside the equipment housing 6. The potting compound 4 includes a main housing 41 with an open end and an insulating plate 42 covering the open end. The main housing 41 forms a potting cavity inside, accommodating the magnetic component structure and filling it with thermally conductive adhesive. The insulating plate 42 seals the open end of the main housing 41 and also serves as an isolation and connection interface between the internal components and the circuit board 7.

[0091] The liquid cooling plate 5 is attached to one side of the potting housing 4 opposite to the open end. Generally, if the top of the potting housing 4 is the open end, then the liquid cooling plate 5 is attached to the outer bottom surface of the potting housing 4. The liquid cooling plate 5 has coolant channels inside for actively cooling the potting housing 4. The liquid cooling plate 5 is also located inside the equipment housing 6 and can be connected to an external cooling circulation system.

[0092] Circuit board 7 is located inside device housing 6, on the side of insulating plate 42 away from the opening end (i.e., the outer side of insulating plate 42, away from main housing 41). Circuit board 7 has drive, control, or power conversion circuitry. Magnetic core 1 is connected to pins that pass through insulating plate 42 and insert into circuit board 7 to achieve conductive connection. When the pins pass through insulating plate 42, the holes on insulating plate 42 can be sealed to prevent thermally conductive adhesive from leaking to the side of circuit board 7, while also meeting high-voltage creepage distance and clearance requirements.

[0093] Specifically, the liquid cooling plate 5, the insulating plate 42, and the circuit board 7 are arranged parallel to each other, and the potting housing 4 is located between the liquid cooling plate 5 and the circuit board 7. That is, the potting housing 4, the liquid cooling plate 5, and the circuit board 7 are stacked vertically. This magnetic component structure is placed flat inside the main housing 41, and the pins directly pass through the insulating plate 42 and plug into the circuit board 7, eliminating the need for additional wires or connectors, shortening the electrical path, and reducing parasitic parameters. The liquid cooling plate 5 is attached to the bottom surface of the main housing 41, directly cooling the potting housing 4, resulting in a short and efficient heat transfer path.

[0094] During assembly, the magnetic component structure can be pre-installed into the main housing 41, then covered with the insulating plate 42 and the pins can be protruded to form a pre-encapsulation assembly; then potting and curing are performed; finally, the encapsulated assembly, liquid cooling plate 5, and circuit board 7 are installed into the equipment housing 6 at one time and the pins are soldered.

[0095] It should be noted that the insulating board 42 can be a single unit, completely covering the opening end of the main box 41, such as... Figure 7 As shown; the insulating plates 42 can also be multiple plates arranged side by side, collectively covering the opening end of the main box 41, such as... Figure 6 As shown. Furthermore, the number of these magnetic components within the potting housing 4 depends on the specific requirements of the electrical equipment.

[0096] In some embodiments, the insulating plate 42 may be adopted as follows: Figure 7 The structure shown is described in the following document. Figure 7The insulating plate 42 is provided with a clearance hole 421; a part of the winding 3 and a part of the cylindrical part 11 pass through the clearance hole 421. That is to say, the height of the main box 41 is designed to be less than the sum of the overall height of the magnetic component structure when it is laid flat and the overall thickness of the thermally conductive adhesive, so that a part of the magnetic component structure must protrude from the opening end of the main box 41 in the vertical direction, and this protruding part just passes through the clearance hole 421 on the insulating plate 42.

[0097] If the clearance hole 421 is not provided, in order to fully accommodate the magnetic component structure inside the main housing 41, the height of the main housing 41 must not be less than the maximum height of the magnetic component structure when laid flat. For high-power magnetic component structures, the outer diameter of its winding 3 is usually larger, which leads to a corresponding increase in the height of the main housing 41 and the thickness of the entire electrical equipment.

[0098] In this embodiment, by creating a clearance hole 421 in the insulating plate 42, a portion of the winding 3 and a portion of the cylindrical portion 11 are allowed to extend through the hole to the outside of the main housing 41. In this way, the height of the main housing 41 is no longer limited by the overall height of the magnetic component structure, but only needs to ensure that the potting compound can completely cover the key heat dissipation area of ​​the magnetic component structure. Specifically, the height of the main housing 41 only needs to be greater than the height required from the lower edge of the magnetic component structure to the lowest liquid level of the potting compound, thus reducing the overall height of the potting housing 4. Furthermore, since the circuit board 7 is typically a thin plate with limited component height, the protruding portion of the magnetic component structure can extend into the gaps between components, achieving staggered use of space and thereby improving the space utilization rate inside the device housing 6.

[0099] Furthermore, the reduced height of the main housing 41 means that the lower surface of the magnetic component structure is closer to the liquid cooling plate 5. The path for heat to transfer from the magnetic component structure to the bottom surface of the main housing 41 via the thermally conductive adhesive is shorter, resulting in lower thermal resistance. Simultaneously, since some of the windings 3 and the cylindrical portion 11 protrude from the main housing 41, the surfaces of these protruding parts can directly contact the air inside the device housing 6 or the auxiliary heat dissipation structure, forming additional auxiliary heat dissipation paths and further improving the overall heat dissipation capacity.

[0100] In some embodiments, the direction perpendicular to the opening end is defined as the first direction. Two sets of glue-filling channels 13 are arranged at intervals along the first direction. One set of glue-filling channels 13 is close to the liquid cooling plate 5 and is located inside the main housing 41. The other set of glue-filling channels 13 is away from the liquid cooling plate 5 and is located inside the clearance hole 421, corresponding horizontally to the insulating plate 42. Part of the entrance of this set of glue-filling channels 13 is located above the insulating plate 42, and part of the entrance is located inside the main housing 41.

[0101] The first direction is actually the vertical direction. Two sets of potting channels 13 are spaced apart along this vertical direction, and are divided into a first set and a second set. The first set of potting channels is close to the liquid cooling plate 5, and this set of channels 13 is entirely located inside the main housing 41. The second set of potting channels is away from the liquid cooling plate 5. This set of channels 13 is located within the clearance hole 421 on the insulating plate 42, and is horizontally aligned with the insulating plate 42. Specifically, part of the potting inlet of this set of channels 13 is located above the insulating plate 42, and the other part is located inside the main housing 41, meaning the inlet crosses the plane of the insulating plate 42. The two sets of potting channels 13 are arranged vertically along the first direction, independent of each other but indirectly connected through the radial gap 22 and the hollow portion 21 inside the magnetic component structure.

[0102] The first set of potting channels is located at the lower part of the cylindrical section 11, adjacent to the liquid cooling plate 5. When thermally conductive adhesive is injected through this potting channel 13, it quickly fills the potting channel 13 itself and the radial gap 22 and the hollow part 21 connected to it, forming a highly thermally conductive medium at the bottom of the magnetic component structure. The heat generated at the bottom of the magnetic core 1 is directly conducted to the bottom surface of the potting box 4 through this thermally conductive adhesive layer, with a short path and low thermal resistance.

[0103] When injecting thermally conductive adhesive into the main housing 41, it can be injected through the first set of injection channels. Specifically, an opening can be provided on the insulating plate 42, and the thermally conductive adhesive is injected into the main housing 41 through the opening, filling the inner cavity of the main housing 41 from bottom to top. Since the upper inlet of the second set of injection channels is located above the insulating plate 42, and the lower inlet is connected to the inside of the main housing 41, during injection, the thermally conductive adhesive gradually rises from the bottom, pushing the air inside the main housing 41 upwards. The air is eventually discharged through the upper inlet of the second set of injection channels. This bottom-injection and top-outjection method utilizes gravity and air pressure difference to ensure that all gaps inside the main housing 41 are completely filled with thermally conductive adhesive, leaving no air pockets.

[0104] When rapid potting or when the thermally conductive adhesive has a high viscosity, it can be injected simultaneously from two sets of potting channels 13. Specifically, an opening is provided on the insulating plate 42, and the thermally conductive adhesive is injected into the main housing 41 through the opening, filling the inner cavity of the main housing 41 from bottom to top, and then injected into the first set of potting channels. At the same time, thermally conductive adhesive can also be injected through the clearance hole 421, and part of the thermally conductive adhesive enters the second set of potting channels simultaneously. The two streams of adhesive merge inside the main housing 41, shortening the flow path to half of the original, thus reducing the potting time. Since each set of channels only needs to fill half the height, the required injection pressure is reduced, which reduces the impact of the adhesive on the winding 3 and the frame 2, and lowers the risk of damage.

[0105] However, it should be noted that all side panels of the main box 41 in this embodiment are closed and cannot be provided with glue inlets. In other words, thermally conductive adhesive can only enter the inner cavity of the main box 41 from the open end.

[0106] In addition, in this embodiment, the upper inlet of the second set of potting channels is located at the highest point of the entire potting system, above the insulating plate 42, and is itself connected to the interior of the main box 41, so it can be directly used as an exhaust port. During the potting process, air is discharged from this inlet; after the potting is completed, the inlet can be subsequently sealed or naturally filled by the glue, without the need for additional processing of exhaust holes, thus simplifying the manufacturing process of the potting box 4.

[0107] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A magnetic component structure with a potting channel, characterized in that, include: Magnetic core (1); the magnetic core (1) includes a cylindrical portion (11); the cylindrical portion (11) has an adhesive channel (13); A skeleton (2) is fitted onto the cylindrical portion (11); the skeleton (2) has a hollow portion (21) that communicates with the glue-filling channel (13); and The winding (3) is wound on the frame (2); The glue-filling channel (13) is used for injecting thermally conductive adhesive, so that the thermally conductive adhesive can fill the hollow part (21) through the glue-filling channel (13) and contact the winding (3) to transfer the heat of the cylindrical part (11) to the winding (3) through the thermally conductive adhesive.

2. The magnetic component structure with a potting channel as described in claim 1, characterized in that, There is a radial gap (22) between the skeleton (2) and the cylindrical part (11), and the glue channel (13) is connected to the radial gap (22); the thermally conductive adhesive can be injected through the glue channel (13) and sequentially fill the radial gap (22) and the hollow part (21).

3. The magnetic component structure with a potting channel as described in claim 2, characterized in that, The hollowed-out portions (21) are distributed in multiple circumferentially along the skeleton (2), and the glue-filling channel (13) is radially opposite to and connected to one of the hollowed-out portions (21).

4. The magnetic component structure with a potting channel as described in claim 1, characterized in that, The glue-filling channel (13) is a guide groove formed on the outer peripheral surface of the cylindrical part (11). At least one end of the guide groove passes through the cylindrical part (11) in the axial direction to form a glue-filling inlet. The opening side of the guide groove is radially opposite to and connected to the hollow part (21).

5. The magnetic component structure with a potting channel as described in claim 4, characterized in that, The inner wall of the guide channel is a smoothly transitioned curved surface; and / or The width of the opening side of the guide groove in the circumferential direction is greater than the width of the hollow part (21) in the circumferential direction.

6. The magnetic component structure with a potting channel as described in claim 1, characterized in that, The magnetic core (1) also includes an outer mounting part (12), which has a mounting cavity (122). The cylindrical part (11), the skeleton (2) and the winding (3) are all located in the mounting cavity (122). The cavity wall of the mounting cavity (122) is a smooth curved surface to fit at least part of the outer surface of the winding (3).

7. The magnetic component structure with a potting channel as described in claim 6, characterized in that, The cylindrical part (11) includes two separate cylindrical units (111) that are axially connected, and the outer part (12) includes two separate shell units (121) that are axially connected. The two cylindrical units (111) and the two shell units (121) correspond to each other and are integrally connected. Each of the cylindrical units (111) is provided with the glue-filling channel (13), and the glue-filling channel (13) axially penetrates the corresponding shell unit (121) to form a glue-filling inlet; The two axial ends of the skeleton (2) respectively abut against the inner sidewalls of the two shell units (121).

8. An electrical device, characterized in that, include: Encapsulated container (4); A liquid cooling plate (5) is attached to the outer surface of the potting box (4) and is used to cool the potting box (4); as well as The magnetic component structure with a potting channel according to any one of claims 1-7 is placed horizontally inside the potting box (4); The potting box (4) is filled with thermally conductive adhesive, which is in contact with the outer surface of the magnetic core (1). The thermally conductive adhesive is filled into the hollow part (21) through the potting channel (13) and comes into contact with the winding (3).

9. The electrical equipment as described in claim 8, characterized in that, The electrical equipment also includes a housing (6); the liquid cooling plate (5) and the potting box (4) are both located inside the housing (6); the housing (6) also contains a circuit board (7); The potting box (4) includes a main box (41) with an open end and an insulating plate (42) covering the open end; The liquid cooling plate (5) is attached to one side of the potting box (4) opposite to the opening end; the circuit board (7) is located on the side of the insulating plate (42) away from the opening end; The magnetic core (1) is connected to pins that pass through the insulating plate (42) and are plugged into the circuit board (7).

10. The electrical equipment as claimed in claim 9, characterized in that, The insulating plate (42) is provided with a clearance hole (421); a portion of the winding (3) and a portion of the cylindrical portion (11) pass through the clearance hole (421); and / or The direction perpendicular to the opening end is defined as the first direction. Two sets of glue-filling channels (13) are arranged at intervals along the first direction, one set of which is close to the liquid cooling plate (5).

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