Plasma processing apparatus with edge ring in-place detection function

Abstract

The application relates to the technical field of wafer processing equipment, in particular to a plasma processing equipment with edge ring in-situ detection function, which comprises a fixed platform, an arc-shaped part one, an arc-shaped part two, a laser emitting element and a laser receiving element; the arc-shaped part one and the arc-shaped part two are arranged in the fixed platform and symmetrically arranged about a dielectric window; a single beam emitted by the laser emitting element is divided into a plurality of split beams which pass through the dielectric window and are directed to an axis in the dielectric window in the circumferential direction of the arc-shaped part one; the laser receiving element is provided with a plurality of receiving ends corresponding to the split beams one by one; the arc-shaped part one and the arc-shaped part two are symmetrically arranged in the fixed platform outside the dielectric window, the single beam emitted by the laser emitting element is divided into a plurality of split beams which are directed to the axis in the dielectric window in the circumferential direction of the arc-shaped part one, and the plurality of laser receiving ends are correspondingly arranged on the arc-shaped part two, so that the receiving state of each split beam can be collected in real time during the process that the edge ring falls and presses the wafer.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, and more particularly to a plasma processing device with an edge ring in-situ detection function. Background Technology

[0002] In semiconductor manufacturing processes, wafers are placed on electrostatic chucks, and an edge ring descends via a drive cylinder to hold the wafer edges in place, serving to fix the wafer and regulate the airflow within the cavity. However, due to mechanical wear, air pressure fluctuations, obstructions from foreign objects, or jamming in the transmission mechanism, the edge ring may become skewed, jammed, or tilted to one side during its descent, preventing it from maintaining a horizontal position against the wafer. If this abnormal positioning is not detected in time, it can cause uneven etching in some areas of the wafer, or even break the wafer or damage the expensive electrostatic chuck in subsequent steps. Currently, existing etching equipment lacks dedicated devices for detecting this condition. Operators typically rely on visual inspection through an observation window or indirect judgment based on abnormal process parameters. This method is unreliable and cannot achieve automated alarm functionality. Summary of the Invention

[0003] This invention relates to a plasma processing device with edge ring in-situ detection function. The purpose is to use symmetrically arranged split arc-shaped component one and arc-shaped component two to carry laser emitters and laser receivers, and to use multiple circumferentially distributed probe beams to detect the landing posture of the edge ring in real time, thereby solving the problem that existing devices cannot accurately identify abnormal landing such as edge ring tilting or lifting.

[0004] To achieve the above objectives, the present invention provides a plasma processing device with edge ring in-situ detection function, comprising a fixed platform, an arc-shaped component one, an arc-shaped component two, a laser emitter, and a laser receiver: The fixed platform ring is located on the outside of the medium window, and the inner cavity of the medium window is equipped with an electrostatic chuck. The top of the electrostatic chuck is pressed against the wafer by the edge ring. The first arc-shaped component and the second arc-shaped component are disposed within the fixed platform and are symmetrically arranged about the medium window; The laser emitter is disposed on the arc-shaped component one, and the single beam emitted by the laser emitter is split into several beams that pass through the medium window and point to the central axis in the circumferential direction of the arc-shaped component one. The laser receiver is disposed on the second arc-shaped component. The laser receiver has a plurality of receiving ends that correspond one-to-one with each of the split beams, so as to receive each split beam passing through the medium window and detect the horizontal positioning attitude of the edge ring during the receiving process.

[0005] Optionally, the laser emitter includes an emitter body, a beam splitting unit, an optical cable, and several beam output platforms; The arc-shaped component has an assembly cavity extending circumferentially along its inner side, and a light-transmitting hole communicating with the assembly cavity is passed through its side near the central axis. The transmitting element body is disposed on the inner side wall of the assembly cavity, and its light-emitting end is connected to the beam splitting unit; Several light-emitting platforms are arranged circumferentially on the inner sidewall of the assembly cavity, and the light-emitting end of each light-emitting platform faces the light-transmitting hole and points to the central axis; each light-emitting platform is connected to the beam splitting unit through the optical cable so that the single beam emitted by the transmitter body is split into several beams by the beam splitting unit and then transmitted to each light-emitting platform through the optical cable.

[0006] Optionally, the plasma processing device with edge ring in-situ detection function further includes a second sliding part, a third magnetic drive part, and several fourth magnetic drive parts; The inner wall of the assembly cavity away from the central axis is recessed with a second sliding groove extending circumferentially. The second sliding part is slidably disposed in the second slide groove and its end extending out of the second slide groove is connected to the light output platform; The third magnetic drive unit is disposed on the second sliding part, and a plurality of fourth magnetic drive units are arranged at intervals along the circumference on the inner sidewall of the second sliding groove. The third magnetic drive unit and the plurality of fourth magnetic drive units are respectively connected to an independent power supply. By controlling the power on and off of each fourth magnetic drive unit, the third magnetic drive unit is attracted and driven to carry the light-emitting platform to make a circumferential deflection relative to the arc-shaped part.

[0007] Optionally, the plasma processing device with edge ring in-situ detection function further includes a light-transmitting sealing component; The light-transmitting sealing member is fixed inside the light-transmitting hole, and the light-transmitting sealing member is disposed near the outlet end of the light-transmitting hole near the central axis to block gas from entering the assembly cavity.

[0008] Optionally, several light-emitting platforms are arranged on the same circumference; or several light-emitting platforms are divided into two groups and arranged on a first circumference and a second circumference respectively, and the first circumference is located below the second circumference in the axial direction.

[0009] Optionally, the plasma processing device with edge ring in-situ detection function further includes a light-shielding component, which includes a blocking drive unit and a baffle plate; The inner wall of the light-emitting end of the light-emitting platform is recessed with a receiving groove extending radially therein; the blocking drive unit is disposed on the light-emitting platform, the shielding plate is movably disposed in the receiving groove and connected to the drive end of the blocking drive unit, and the blocking drive unit drives the shielding plate to extend radially out of the receiving groove along the light-emitting platform to block the beam splitting emitted by the light-emitting end of the light-emitting platform or retract into the receiving groove to avoid the beam splitting emitted by the light-emitting end of the light-emitting platform.

[0010] Optionally, the plasma processing device with edge ring in-situ detection function further includes a main circumferential drive component, which includes a connector, a first sliding part, a first magnetic drive part, and a plurality of second magnetic drive parts. The inner wall of the fixed platform is recessed with a first groove extending circumferentially. One end of the connector is fixed to the first arc-shaped component, and the other end extends circumferentially and is fixed to the second arc-shaped component; The first sliding part is movably disposed in the first slide groove and its end extending out of the first slide groove is connected to the connecting member; The first magnetic drive unit is disposed on the first sliding part, and a plurality of second magnetic drive units are arranged at intervals along the circumference on the inner sidewall of the first sliding groove; the first magnetic drive unit and the plurality of second magnetic drive units are respectively connected to an independent power supply, and by controlling the power on and off of each second magnetic drive unit, the first magnetic drive unit is attracted and driven to carry the arc-shaped part one and the arc-shaped part two to make circumferential deflection relative to the fixed platform.

[0011] Optionally, the plasma processing device with edge ring in-situ detection function further includes an axial drive component and a slide rail component; The axial drive component is disposed in the first slide groove, and its bottom is connected to the bottom wall of the first slide groove through the slide rail component. The drive end of the axial drive component is fixed to the bottom of the first sliding part to drive the first sliding part to move axially with the arc-shaped part one and the arc-shaped part two.

[0012] Optionally, the slide rail component includes a slide rail portion and a slider portion; The slide rail extends circumferentially and is fixed to the bottom wall of the first slide groove. The slider is fixed to the bottom of the axial drive member and slides circumferentially within the slide rail.

[0013] Optionally, the plasma processing device with edge ring in-situ detection function further includes an axial drive component; The first sliding part includes a plurality of sub-sliding parts arranged along the axial direction, and the opposite end faces of two adjacent sub-sliding parts form a first mating part and a second mating part; The axial drive member is disposed on the first docking part, and the second docking part has a recessed mounting groove. The driving end of the axial drive member is connected to the inner sidewall of the mounting groove to drive one of the two adjacent sub-sliding parts to move axially closer to or away from the other sub-sliding part.

[0014] The beneficial effects of this invention are as follows: This invention symmetrically arranges arc-shaped component one and arc-shaped component two within a fixed platform outside the dielectric window. The single beam emitted by the laser emitter is split into multiple beams pointing towards the central axis of the dielectric window around the circumference of the arc-shaped component. With the help of multiple laser receivers correspondingly arranged on the arc-shaped component two, the receiving status of each beam can be collected in real time during the process of the edge ring falling and pressing the wafer. This allows for accurate identification of whether the edge ring is skewed, stuck, or tilted on one side, or other non-horizontal placement abnormalities. Compared with traditional visual inspection or indirect judgment based on process parameters, this invention significantly improves the reliability of detection, can trigger automatic alarms in a timely manner, and effectively avoids problems such as uneven local etching, wafer breakage, or damage to the electrostatic chuck caused by abnormal edge ring placement. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a plasma processing device in some embodiments of the present invention; Figure 2 for Figure 1 The diagram shows an enlarged view of the neutron sliding section. Figure 3 for Figure 1 A magnified structural diagram of position A in the diagram; Figure 4 for Figure 1 A magnified structural diagram of position B in the diagram; Figure 5 for Figure 4 The diagram shows the structure of the light-emitting platform.

[0016] Explanation of reference numerals in the attached figures: 1. Fixed platform; 101. First slide groove; 2. Medium window; 31. Assembly cavity; 32. Light-transmitting hole; 33. Second slide groove; 34. Arc-shaped component one; 35. Arc-shaped component two; 4. Emitting component body; 5. Beam splitting unit; 6. Optical cable; 7. Light-emitting platform; 71. Receiving groove; 8. Main circumferential drive component; 81. Connecting component; 82. First sliding part; 821. Sub-sliding part; 83. First magnetic drive part; 84. Second magnetic drive part; 9. Axial drive component; 10. Light-transmitting sealing component; 111. Second sliding part; 112. Third magnetic drive part; 113. Fourth magnetic drive part; 12. Light-shielding component; 121. Sealing drive part; 122. Shielding plate. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0018] This invention relates to a plasma processing device with edge ring in-situ detection function. The purpose is to use symmetrically arranged split arc-shaped component one and arc-shaped component two to carry laser emitters and laser receivers, and to use multiple circumferentially distributed probe beams to detect the landing posture of the edge ring in real time, thereby solving the problem that existing devices cannot accurately identify abnormal landing such as edge ring tilting or lifting.

[0019] To address the problems existing in the prior art, embodiments of the present invention provide a plasma processing device with an edge ring in-situ detection function. For example... Figure 1 As shown, the plasma processing equipment with edge ring in-situ detection function includes a fixed platform 1, an arc-shaped component 34, an arc-shaped component 35, a laser emitter, and a laser receiver. The fixed platform 1 has a cylindrical cavity inside; and a through-hole for placing and removing wafers is provided on the fixed platform 1. The circumferential length of both the arc-shaped component 34 and the arc-shaped component 35 is preferably one-quarter of a circle. An operating space communicating with the through-hole exists between the arc-shaped component 34 and the arc-shaped component 35.

[0020] In some embodiments, such as Figure 1 As shown, the fixed platform 1 is arranged around the outside of the medium window 2, and the inner cavity of the medium window 2 is provided with an electrostatic chuck. The top of the electrostatic chuck is pressed with a wafer by an edge ring.

[0021] In some embodiments, such as Figure 1 As shown, the first arc-shaped component 34 and the second arc-shaped component 35 are disposed within the fixed platform 1 and are symmetrically arranged about the medium window 2.

[0022] In some embodiments, such as Figure 1As shown, the laser emitter is disposed on the arc-shaped component 34. The single beam emitted by the laser emitter is split into several beams passing through the medium window 2 and pointing towards its central axis in the circumferential direction of the arc-shaped component 34. The laser receiver is disposed on the arc-shaped component 35. The laser receiver has several receiving ends corresponding to each of the beams to receive the beams passing through the medium window 2 and detect the horizontal positioning attitude of the edge ring during the receiving process.

[0023] By employing a single-beam beam splitting into multiple circumferential beams and a one-to-one correspondence receiver setup, compared to detection methods that only emit a single beam, simultaneous monitoring of multiple feature positions along the circumference of the edge ring can be achieved. This allows for the sensitive detection of non-uniform positioning anomalies such as localized lifting or unilateral tilting of the edge ring, which cannot be identified by a single beam. Simultaneously, through cross-verification of multiple signals, misjudgments caused by transient interference susceptible to single-beam light can be effectively eliminated, significantly improving the reliability of the detection results. Furthermore, the design of splitting a single beam into multiple beams requires only one light source to complete multi-position detection, reducing hardware costs and power consumption while ensuring the consistency of light emission from each beam, providing a stable data foundation for multi-dimensional determination of the horizontal positioning attitude of the edge ring.

[0024] In some embodiments, such as Figure 1 , Figure 3 and Figure 4 As shown, the laser emitter includes an emitter body 4, a beam splitting unit 5, an optical cable 6, and several light-emitting platforms 7.

[0025] In some embodiments, such as Figure 3 As shown, the arc-shaped component 34 has an assembly cavity 31 extending circumferentially within it, and a light-transmitting hole 32 communicating with the assembly cavity 31 is provided through its side near the central axis. Preferably, the circumferential length of the light-transmitting hole 32 is consistent with the circumferential length of the assembly cavity 31.

[0026] In some embodiments, such as Figure 3 As shown, the transmitter body 4 is located on the inner wall of the assembly cavity 31, and its light-emitting end is connected to the beam splitting unit 5. The transmitter body 4 is preferably located at the middle position of the inner wall of the assembly cavity 31 in the circumferential direction. This arrangement can make the beams after splitting more uniformly distributed in the circumferential direction of the arc-shaped component 34, avoid inconsistent light intensity attenuation caused by excessively long optical path on one side, and ensure the initial consistency of each detection signal. The beam splitting unit 5 can be a fiber-coupled beam splitter, a microlens array, or an integrated optical beam splitting prism. Its function is to equally distribute the single laser beam output by the transmitter body 4 into several beams, and the several beams are symmetrically arranged about the transmitter body 4. This simplifies the configuration of the light source for multi-beam emission, reduces the complexity of multi-source calibration, and ensures the wavelength and phase consistency of each beam.

[0027] In some embodiments, such as Figure 4 As shown, a plurality of light-emitting platforms 7 are arranged circumferentially at intervals on the inner sidewall of the assembly cavity 31, and the plurality of light-emitting platforms 7 are preferably arranged at equal intervals circumferentially; and the light-emitting end of each light-emitting platform 7 faces the light-transmitting hole 32 and points to the central axis (referring to the central axis of the medium window 2); each light-emitting platform 7 is connected to the beam splitting unit 5 through the optical cable 6 so that the single beam emitted by the transmitter body 4 is split into a plurality of beams by the beam splitting unit 5 and then transmitted to each light-emitting platform 7 through the optical cable 6.

[0028] The circumferentially spaced light-emitting platforms 7 can precisely guide the multiple beams split from the beam-splitting unit 5 to the central axis of the medium window 2, so that each beam uniformly covers the circumferential positioning area of ​​the edge ring at a preset angle. This avoids the detection blind zone that exists in single-point light emission, and decouples the spatial constraints between the beam-splitting unit 5 and the light-emitting end through the flexible transmission of the optical cable 6. It can flexibly adapt to the internal assembly structure of the arc-shaped component 34, ensuring the independence and pointing accuracy of each beam path. At the same time, this arrangement makes each light-emitting platform 7 and the receiving end on the arc-shaped component 35 form a one-to-one detection optical path.

[0029] In some embodiments, the structure of the light-emitting platform 7 can be a laser head with an integrated collimating lens, a micro-optical module with a tail fiber coupling, or an adjustable emitter with a built-in aperture. Its housing can be adapted to the fixed interface on the inner side wall of the assembly cavity 31. The front collimating part is set directly opposite the light-transmitting hole 32 to ensure high parallelism and pointing accuracy of the split beam and reduce detection errors caused by light spot divergence. Preferably, a modular packaging structure is adopted, which is convenient for individual disassembly and maintenance, reduces the later operation and maintenance costs, and can be adapted to the detection requirements of edge rings of different specifications by adjusting the focal length of the collimating lens or the aperture diameter.

[0030] In some embodiments, such as Figure 4 As shown, the plasma processing device with edge ring in-situ detection function further includes a second sliding part 111, a third magnetic drive part 112, and several fourth magnetic drive parts 113.

[0031] In some embodiments, such as Figure 4As shown, the inner wall of the assembly cavity 31 away from the central axis is recessed with a second sliding groove 33 extending circumferentially; the second sliding part 111 is slidably disposed in the second sliding groove 33 and its end extending out of the second sliding groove 33 is connected to the light-emitting platform 7; the third magnetic drive part 112 is disposed in the second sliding part 111, and a plurality of fourth magnetic drive parts 113 are arranged circumferentially at intervals on the inner wall of the second sliding groove 33. The third magnetic drive part 112 and the plurality of fourth magnetic drive parts 113 are respectively connected to an independent power supply. By controlling the power on and off of each fourth magnetic drive part 113, the third magnetic drive part 112 is attracted and driven to carry the light-emitting platform 7 to make circumferential deflection relative to the arc-shaped part 34.

[0032] By using a magnetically driven non-contact transmission method, the sealing risks and particulate contamination problems caused by traditional mechanical linkages or pneumatic structures extending into the process cavity are completely avoided, making it suitable for the high cleanliness requirements of plasma processing equipment. The second slide 33 provides a stable circumferential guiding reference for the second sliding part 111. In conjunction with multiple fourth magnetic drive parts 113 arranged at intervals along the circumference, the adsorption position of the third magnetic drive part 112 can be precisely controlled, thereby realizing the small angle deflection adjustment of the light-emitting platform 7 relative to the arc-shaped part 34. This allows the direction of each beam to be dynamically calibrated according to the actual size and installation position error of the edge ring, ensuring that multiple beams are always aligned with the detection area of ​​the edge ring. At the same time, the control logic with independent power supply for each magnetic drive part can realize both fixed-point fine adjustment of a single light-emitting platform 7 and synchronous deflection of multiple light-emitting platforms 7, greatly improving the flexibility and efficiency of optical path calibration. Online correction of detection accuracy can be completed without disassembling the equipment, reducing maintenance difficulty and downtime costs.

[0033] In order to receive the split beam emitted by the adjusted light-emitting platform 7, a driving structure is also provided in the arc-shaped component 35. This driving structure is used to drive the receiving end of the laser receiver to adapt to circumferential synchronous adjustment.

[0034] In some embodiments, such as Figure 4 The plasma processing equipment with edge ring in-situ detection function further includes a light-transmitting sealing component 10; the light-transmitting sealing component 10 is fixed inside the light-transmitting hole 32, and the light-transmitting sealing component 10 is disposed near the outlet end of the light-transmitting hole 32 near the central axis, so as to block gas from entering the assembly cavity 31.

[0035] The light-transmitting sealing component 10, while ensuring the smooth passage of the split beam and without interfering with the detection optical path, forms a reliable physical isolation barrier at the edge of the medium window 2. This effectively blocks reaction byproducts and the high-pressure environment inside the fixed platform 1 from entering the assembly cavity 31 of the arc-shaped component 34, preventing the optical components from being corroded by corrosive gases and the optical surface from being deposited with contaminants, thus fundamentally ensuring the long-term stability of the laser emitting component.

[0036] In some embodiments, the material of the light-transmitting sealing component 10 can be high-purity quartz glass, sapphire, or calcium fluoride crystal. These materials combine excellent transmittance in the deep ultraviolet and visible light bands with extremely high resistance to plasma corrosion. They can maintain stable optical performance in the harsh environment of long-term exposure to the etching cavity, avoiding the aging, cracking, or surface crystallization problems that are prone to occur in traditional organic glass or ordinary optical materials. Among them, high-purity quartz glass has low cost and good thermal stability, and is suitable for most conventional etching processes. Sapphire has high hardness and stronger etching resistance, and is suitable for heavy plasma environments with high bias voltage, high fluorine and chlorine-based gases. Calcium fluoride has extremely low laser absorption in the deep ultraviolet band, and is suitable for short-wavelength laser detection scenarios. It can be flexibly selected according to actual process requirements and laser wavelength, so as to minimize beam splitting transmission loss and further extend the service life of the sealing component and reduce maintenance frequency.

[0037] In some embodiments, several of the light-emitting platforms 7 are arranged on the same circumference.

[0038] In some embodiments, the plurality of light-emitting platforms 7 are divided into two groups and disposed on a first circumference and a second circumference, respectively, with the first circumference located axially below the second circumference. By dividing the light-emitting platforms 7 into upper and lower groups and arranging them staggered along the axial direction, the positioning posture of the edge ring can be detected simultaneously from two different height layers. Compared to a single circumference arrangement, which can only obtain occlusion information at a single axial position, dual-circumference detection can capture the tilt characteristics of the edge ring in the axial height difference dimension. When the edge ring is tilted, the attenuation or occlusion of the light signals received by the upper and lower receiving ends will form differentiated feedback, which can distinguish whether the edge ring is not fully positioned or is partially tilted, and can accurately determine the tilt direction and tilt angle, greatly improving the dimensionality and accuracy of posture recognition.

[0039] In some embodiments, such as Figure 5 As shown, the plasma processing equipment with edge ring in-situ detection function also includes a light shield 12, which includes a blocking drive unit 121 and a baffle plate 122.

[0040] In some embodiments, such as Figure 5As shown, the inner wall of the light-emitting end of the light-emitting platform 7 has a recessed receiving groove 71 extending radially therein; the blocking drive part 121 is provided on the light-emitting platform 7, and the shielding plate 122 is movably disposed in the receiving groove 71 and connected to the drive end of the blocking drive part 121. The blocking drive part 121 drives the shielding plate 122 to extend radially out of the receiving groove 71 to block the beam splitting emitted by the light-emitting end of the light-emitting platform 7 or to retract into the receiving groove 71 to avoid the beam splitting emitted by the light-emitting end of the light-emitting platform 7.

[0041] The shielding plate 122 is integrated into the receiving slot 71 of the light-emitting platform 7 itself. The structure is compact and does not occupy the assembly cavity 31 space of the arc-shaped part 34. During normal operation of the plasma process, it can be completely retracted to avoid obstruction, ensuring that the split beam is projected onto the edge ring detection position without obstruction, thus avoiding interference with normal in-situ detection. When it is necessary to calibrate the optical path, perform blank cavity detection, or perform equipment maintenance, the blocking drive unit 121 can drive the shielding plate 122 to extend radially, accurately blocking the light path of the corresponding light-emitting end. Independent shielding of single-point or multi-point optical paths can be completed without disassembling the equipment. It can achieve self-calibration of the reference light intensity of each split beam, eliminate detection errors caused by light source aging and optical component contamination, and actively block laser leakage during non-detection periods to prevent laser from directly hitting the internal components of the cavity and causing damage or interference with the process plasma. At the same time, the radial extension shielding method has a fast response speed and short action stroke. With independent control logic, it can flexibly realize time-division multiplexing of multiple beams, further improving the reliability and maintainability of the detection system.

[0042] In some embodiments, the blocking drive unit 121 can be a miniature piezoelectric ceramic driver, a miniature cylinder, a miniature electromagnetic armature driver, or a miniature linear voice coil motor. These drive components are small in size and have a fast response speed, which can perfectly fit the limited internal space of the optical platform 7 and can be integrated without modifying the original assembly structure.

[0043] In some embodiments, such as Figure 1 As shown, the plasma processing device with edge ring in-situ detection function further includes a main circumferential drive component 8, which includes a connector 81, a first sliding part 82, a first magnetic drive part 83, and a plurality of second magnetic drive parts 84.

[0044] In some embodiments, such as Figure 1 As shown, the inner sidewall of the fixed platform 1 is recessed with a first groove 101 extending circumferentially; one end of the connector 81 is fixed to the arc-shaped member 34, and the other end extends circumferentially and is fixed to the arc-shaped member 35; the first sliding part 82 is movably disposed in the first groove 101 and its end extending out of the first groove 101 is connected to the connector 81. In some embodiments, such as Figure 1 As shown, the first magnetic drive unit 83 is disposed on the first sliding part 82, and a plurality of second magnetic drive units 84 are arranged circumferentially on the inner sidewall of the first slide groove 101; the first magnetic drive unit 83 and the plurality of second magnetic drive units 84 are respectively connected to an independent power supply, and by controlling the power on and off of each second magnetic drive unit 84, the first magnetic drive unit 83 is attracted and driven to carry the arc-shaped member 34 and the arc-shaped member 35 to perform circumferential deflection relative to the fixed platform 1.

[0045] The first chute 101 provides a stable circumferential guiding reference for the connector 81 and the first sliding part 82. Together with the arc-shaped part 34 and arc-shaped part 35 symmetrically fixed at both ends of the connector 81, it realizes the synchronous linkage adjustment of the laser transceiver components on both sides, ensuring that the symmetry of the optical path on both sides does not shift during the circumferential deflection process, and avoiding the optical path misalignment problem caused by single-end adjustment. The magnetic drive non-contact transmission completely avoids the sealing risks and particulate contamination brought about by the traditional mechanical transmission structure, and is suitable for the high cleanliness requirements of plasma processing equipment. Multiple second magnetic drive parts 84 arranged at intervals along the circumference, together with independent power supply control logic, can accurately control the adsorption position of the first magnetic drive part 83, realize the small angle deflection calibration of the arc-shaped part 34 and arc-shaped part 35, and adapt to the edge ring detection requirements of different diameter specifications.

[0046] In some embodiments, the plasma processing device with edge ring in-situ detection function further includes an axial drive component and a slide rail component; the axial drive component is disposed within the first slide groove 101, and its bottom is connected to the bottom wall of the first slide groove 101 through the slide rail component. The drive end of the axial drive component is fixed to the bottom of the first sliding part 82 to drive the first sliding part 82 to move the arc-shaped component 34 and the arc-shaped component 35 axially. This embodiment ensures that the laser emitter and the laser receiver can be adjusted both axially and circumferentially.

[0047] The axial drive component slides and engages with the bottom wall of the first slide groove 101 via a slide rail component, providing a stable axial and circumferential guide reference for the arc-shaped component 34 and the arc-shaped component 35. It can drive the laser emitters and receivers on both sides to move synchronously up and down and circumferentially along the medium window 2, accurately adapting to edge rings of different thicknesses and the axial position differences of the edge rings at different process stages, ensuring that the beam splitter is always aligned with the effective detection area of ​​the edge ring, and avoiding detection failure caused by axial position deviation.

[0048] In some embodiments, the axial drive member may be, but is not limited to, a miniature cylinder.

[0049] In some embodiments, the slide rail component includes a slide rail portion and a slider portion; the slide rail portion extends circumferentially and is fixed to the bottom wall of the first slide groove 101, the slider portion is fixed to the bottom of the axial drive member, and the slider portion is slidably disposed within the slide rail portion circumferentially.

[0050] In some embodiments, such as Figure 2 As shown, the plasma processing device with edge ring in-situ detection function also includes an axial drive component 9.

[0051] In some embodiments, such as Figure 2 As shown, the first sliding part 82 includes a plurality of sub-sliding parts 821 arranged along the axial direction. The opposite end faces of two adjacent sub-sliding parts 821 form a first docking part and a second docking part. The axial driving member 9 is disposed on the first docking part, and the second docking part has a recessed mounting groove. The driving end of the axial driving member 9 is connected to the inner sidewall of the mounting groove to drive one of the two adjacent sub-sliding parts 821 to move closer to or away from the other sub-sliding part 821 along the axial direction.

[0052] The first sliding part 82 is divided into multiple sub-sliding parts 821 arranged along the axial direction. With the axial driving member 9 between adjacent sub-sliding parts 821, the arc-shaped part 1 34 and arc-shaped part 2 35 can be independently adjusted in the axial direction, so that the upper and lower light-emitting platforms 7 can respectively adapt to the detection requirements of the double circumferential arrangement. When the edge ring has an axial stepped structure or uneven thickness in different areas, the corresponding sub-sliding part 821 can be driven individually to perform micro-axial extension and retraction, accurately matching the focusing height of each layer of beam splitting, avoiding the problem of not being able to take into account multiple height detection points. At the same time, this segmented structure distributes the axial adjustment load to multiple sub-sliding parts 821, reducing the load requirement of a single axial drive component 9, improving the response speed and position accuracy of the adjustment action, and the adjacent sub-sliding parts 821 form a rigid force transmission path through the cooperation of the first docking part, the second docking part and the mounting groove, which not only ensures coaxiality during the adjustment process, but also avoids relative shaking between multi-layer structures, further improving the detection stability of the dual-circumferential optical path. The detection height can be finely adapted without modifying the overall frame, greatly enhancing the equipment's compatibility with edge rings of different specifications.

[0053] In some specific embodiments, such as Figure 2 As shown, the first docking portion is the upper end face of the lower sub-sliding portion 821, and the second docking portion is the lower end face of the upper sub-sliding portion 821.

[0054] In some embodiments, the axial drive 9 may be, but is not limited to, a cylinder.

[0055] In some embodiments, the plasma processing equipment includes plasma deposition equipment, plasma etching equipment, and plasma resist stripping equipment. All three types of equipment require edge rings to hold the wafer during the process to optimize the cavity airflow field and ensure process uniformity. They also all pose a risk of wafer damage and device scrapping due to abnormal edge ring placement. This detection structure can be directly integrated into the fixing platform 1 outside the dielectric window 2 of the above-mentioned equipment without modifying the core process components of the cavity. It can complete the horizontal attitude detection in real time during the edge ring falling and pressing stage, adapting to the high cleanliness requirements of different process environments. Whether it is the thin film uniformity control in the deposition process, the pattern accuracy guarantee in the etching process, or the wafer surface integrity protection in the resist stripping process, it can effectively avoid process defects caused by edge ring skew or lifting, significantly reducing equipment downtime and wafer scrapping costs, and has broad process adaptability and equipment compatibility.

[0056] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the present invention. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A plasma processing device with edge ring in-situ detection function, characterized in that, Includes a fixed platform, arc-shaped component one, arc-shaped component two, laser emitter, and laser receiver: The fixed platform ring is located on the outside of the medium window, and the inner cavity of the medium window is equipped with an electrostatic chuck. The top of the electrostatic chuck is pressed against the wafer by the edge ring. The first arc-shaped component and the second arc-shaped component are disposed within the fixed platform and are symmetrically arranged about the medium window; The laser emitter is disposed on the arc-shaped component one, and the single beam emitted by the laser emitter is split into several beams that pass through the medium window and point to the central axis in the circumferential direction of the arc-shaped component one. The laser receiver is disposed on the second arc-shaped component. The laser receiver has a plurality of receiving ends that correspond one-to-one with each of the split beams, so as to receive each split beam passing through the medium window and detect the horizontal positioning attitude of the edge ring during the receiving process.

2. The plasma processing device with edge ring in-situ detection function according to claim 1, characterized in that, The laser emitter includes an emitter body, a beam splitting unit, an optical cable, and several light-emitting platforms; The arc-shaped component has an assembly cavity extending circumferentially along its inner side, and a light-transmitting hole communicating with the assembly cavity is passed through its side near the central axis. The transmitting element body is disposed on the inner side wall of the assembly cavity, and its light-emitting end is connected to the beam splitting unit; Several light-emitting platforms are arranged circumferentially on the inner sidewall of the assembly cavity, and the light-emitting end of each light-emitting platform faces the light-transmitting hole and points to the central axis; each light-emitting platform is connected to the beam splitting unit through the optical cable so that the single beam emitted by the transmitter body is split into several beams by the beam splitting unit and then transmitted to each light-emitting platform through the optical cable.

3. The plasma processing device with edge ring in-situ detection function according to claim 2, characterized in that, It also includes a second sliding part, a third magnetic drive part, and several fourth magnetic drive parts; The inner wall of the assembly cavity away from the central axis is recessed with a second sliding groove extending circumferentially. The second sliding part is slidably disposed in the second slide groove and its end extending out of the second slide groove is connected to the light output platform; The third magnetic drive unit is disposed on the second sliding part, and a plurality of fourth magnetic drive units are arranged at intervals along the circumference on the inner sidewall of the second sliding groove. The third magnetic drive unit and the plurality of fourth magnetic drive units are respectively connected to an independent power supply. By controlling the power on and off of each fourth magnetic drive unit, the third magnetic drive unit is attracted and driven to carry the light-emitting platform to make a circumferential deflection relative to the arc-shaped part.

4. The plasma processing device with edge ring in-situ detection function according to claim 2, characterized in that, It also includes light-transmitting sealing components; The light-transmitting sealing member is fixed inside the light-transmitting hole, and the light-transmitting sealing member is disposed near the outlet end of the light-transmitting hole near the central axis to block gas from entering the assembly cavity.

5. The plasma processing device with edge ring in-situ detection function according to claim 2, characterized in that, Several light-emitting platforms are arranged on the same circumference; or several light-emitting platforms are divided into two groups and arranged on a first circumference and a second circumference respectively, and the first circumference is located below the second circumference in the axial direction.

6. The plasma processing device with edge ring in-situ detection function according to claim 2, characterized in that, It also includes a light-shielding component, which includes a blocking drive unit and a baffle plate; The inner wall of the light-emitting end of the light-emitting platform is recessed with a receiving groove extending radially therein; the blocking drive unit is disposed on the light-emitting platform, the shielding plate is movably disposed in the receiving groove and connected to the drive end of the blocking drive unit, and the blocking drive unit drives the shielding plate to extend radially out of the receiving groove along the light-emitting platform to block the beam splitting emitted by the light-emitting end of the light-emitting platform or retract into the receiving groove to avoid the beam splitting emitted by the light-emitting end of the light-emitting platform.

7. The plasma processing device with edge ring in-situ detection function according to claim 1, characterized in that, It also includes a main circumferential drive component, which includes a connector, a first sliding part, a first magnetic drive part, and a plurality of second magnetic drive parts; The inner wall of the fixed platform is recessed with a first groove extending circumferentially. One end of the connector is fixed to the first arc-shaped component, and the other end extends circumferentially and is fixed to the second arc-shaped component; The first sliding part is movably disposed in the first slide groove and its end extending out of the first slide groove is connected to the connecting member; The first magnetic drive unit is disposed on the first sliding part, and a plurality of second magnetic drive units are arranged at intervals along the circumference on the inner sidewall of the first sliding groove; the first magnetic drive unit and the plurality of second magnetic drive units are respectively connected to an independent power supply, and by controlling the power on and off of each second magnetic drive unit, the first magnetic drive unit is attracted and driven to carry the arc-shaped part one and the arc-shaped part two to make circumferential deflection relative to the fixed platform.

8. The plasma processing device with edge ring in-situ detection function according to claim 7, characterized in that, It also includes axial drive components and slide rail components; The axial drive component is disposed in the first slide groove, and its bottom is connected to the bottom wall of the first slide groove through the slide rail component. The drive end of the axial drive component is fixed to the bottom of the first sliding part to drive the first sliding part to move axially with the arc-shaped part one and the arc-shaped part two.

9. The plasma processing device with edge ring in-situ detection function according to claim 8, characterized in that, The slide rail component includes a slide rail section and a slider section; The slide rail extends circumferentially and is fixed to the bottom wall of the first slide groove. The slider is fixed to the bottom of the axial drive member and slides circumferentially within the slide rail.

10. The plasma processing device with edge ring in-situ detection function according to claim 9, characterized in that, It also includes axial drive components; The first sliding part includes a plurality of sub-sliding parts arranged along the axial direction, and the opposite end faces of two adjacent sub-sliding parts form a first mating part and a second mating part; The axial drive member is disposed on the first docking part, and the second docking part has a recessed mounting groove. The driving end of the axial drive member is connected to the inner sidewall of the mounting groove to drive one of the two adjacent sub-sliding parts to move axially closer to or away from the other sub-sliding part.

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