High-frequency crystal oscillator epoxy resin packaging structure, device and process

Abstract

The application provides a high-frequency crystal oscillator epoxy resin packaging structure, equipment and process, relates to the field of crystal oscillator, and includes a base, a mounting groove is formed in the top of the base, a crystal chip is arranged in the mounting groove, a pin is arranged in the base, the pin includes a first pin, a second pin, a third pin and a fourth pin, two chip pins of the crystal chip are connected with the second pin and the fourth pin respectively, and an upper cover is fixedly arranged on the top of the base; the mounting groove includes a connecting groove and a positioning groove arranged below the connecting groove, the connecting groove is mainly in quadrangular prism shape, the positioning groove is mainly in inverted quadrangular platform shape, the upper cover includes a cover plate, and a connecting block matched with the connecting groove is arranged in the middle of the bottom end of the cover plate. The high-frequency crystal oscillator epoxy resin packaging structure is suitable for epoxy resin injection molding production, epoxy resin replaces ceramic material base, and the problems of high energy consumption, low yield and large batch production difficulty of the ceramic base in the prior art are solved.

Description

Technical Field

[0001] This invention relates to the field of crystal oscillator manufacturing, and more specifically, to a high-frequency crystal oscillator epoxy resin encapsulation structure, equipment, and process. The encapsulation structure can be widely used in electronic measuring instruments such as digital television testing instruments and communication network testing instruments as a high-precision clock reference source. Background Technology

[0002] Currently, traditional passive high-frequency crystal oscillator products require a ceramic base made by mixing ceramic materials, pressing the ceramic materials together, pressing together a metal layer, and then firing the entire assembly. After firing, a welding ring needs to be sintered again at the edge of the ceramic base to facilitate the subsequent welding of the metal cover. This process consumes a lot of energy, and the multiple sintering and pressing processes result in low yield and make mass production difficult. Furthermore, because ceramics are relatively brittle, during the subsequent encapsulation process, when the metal cover is pressed onto the ceramic base using electrodes, it is prone to crushing or microcracks during welding, leading to product defects.

[0003] Therefore, we have made improvements to this by proposing a high-frequency crystal oscillator epoxy resin encapsulation structure, equipment, and process. The encapsulation technology of existing passive high-frequency crystal oscillators has been transformed from the current ceramic base and metal cover encapsulation form to a copper or iron bracket using high-temperature resistant epoxy resin injection molding to form an integrated multi-row and multi-column base. Then, a metal cover is made of the same high-temperature resistant epoxy resin, and the base box and cover are ultrasonically hermetically welded. Summary of the Invention

[0004] The purpose of this invention is to solve the problems of current passive high-frequency crystal oscillator products using ceramic bases, which result in huge energy consumption, low yield, and difficulty in mass production.

[0005] To achieve the above-mentioned objectives, the present invention provides the following epoxy resin encapsulation structure, equipment, and process for high-frequency crystal oscillators to improve the aforementioned problems, specifically as follows: A high-frequency crystal oscillator epoxy resin encapsulation structure includes a base, a mounting groove on the top of the base, a crystal oscillator chip inside the mounting groove, and pins inside the base, including pin 1, pin 2, pin 3, and pin 4. Pin 1 and pin 2 are located on one side of the base, and pin 3 and pin 4 are located on the other side of the base. Pins 1, 2, 3, and 4 are arranged clockwise. Two chip pins of the crystal oscillator chip are connected to pin 2 and pin 4, respectively. A top cover is fixedly provided on the top of the base. The mounting groove includes a connecting groove and a positioning groove located below the connecting groove. The main body of the connecting groove is a quadrangular prism, and the main body of the positioning groove is an inverted quadrangular frustum. Both the connecting groove and the positioning groove have chamfered or rounded corners on their side edges. The upper cover includes a cover plate. The bottom center of the cover plate is provided with a connecting block that matches the connecting groove. The bottom of the connecting block is provided with a positioning block whose periphery fits against the inner wall of the positioning groove. The height of the positioning block is less than the depth of the mounting groove. The base includes a lower base and an upper base located above the lower base. The lower base and the upper base are integrally formed by injection molding. The lower plane of the upper base is flush with the upper plane of the pin. The pin is embedded above the lower base. The mounting groove passes through the upper base. The four sides of the lower base are inclined with an inclination angle β < 15°.

[0006] As a preferred technical solution of this application, two pin slots are provided on both sides of the bottom of the base. The ends of pin 1, pin 2, pin 3 and pin 4 that are away from the mounting slot are bent twice and extend along the side of the bottom of the base into the adjacent pin slot.

[0007] A high-frequency crystal oscillator epoxy resin encapsulation device includes a second mounting box and a first mounting box located to one side of the second mounting box. Mounting frames are provided on both sides inside the second mounting box. A first fixing plate is installed below the mounting frames. An injection molding mechanism is installed within the mounting frames. The mounting frames are used to install the injection molding mechanism. The injection molding mechanism includes a barrel, with a feeding hopper connected to the front end of the barrel. The feeding hopper is positioned corresponding to a feeding window. An extrusion head is installed at the bottom of the barrel. Several diverter connectors are evenly spaced and connected to the bottom circumference of the extrusion head. A lifting structure is provided below the first fixing plate. An injection mold is provided between the first fixing plate and the lifting structure. The injection mold closer to the first mounting box is a top cover mold, and the injection mold further away from the first mounting box is a base mold. Several diverter structures are installed on the top of the first fixing plate. The injection mold includes an upper mold and a lower mold. A limiting frame is provided between the upper mold and the lower mold on the side further away from the first mounting box. The top of the limiting frame... A compensation groove is provided in the middle of the end, and a pin bracket is provided in the compensation groove. Several No. 1 positioning holes corresponding to the positioning posts are provided above the compensation groove. The pin bracket includes a bracket body, and several stamping holes are provided on the bracket body. Several pins are provided inside the stamping holes. Several No. 2 positioning holes corresponding to the positioning posts are provided around the top of the bracket body. A pre-cut groove is provided at the connection between the pins and the bracket body. The bracket body, stamping holes, No. 2 positioning holes, pre-cut groove and pins are formed by one-time stamping. The lifting structure is used to drive the lower mold to move for mold closing and mold opening. A support plate is provided below the lifting structure. A No. 2 fixing plate is provided between the two injection molding mechanisms. A three-axis module is provided below the No. 2 fixing plate. A chip mounting structure is installed below the three-axis module. A bending and welding mechanism is provided inside the No. 1 mounting box. A transfer structure is also installed inside the No. 2 mounting box. The transfer structure includes an active part, a driven part and a compensation component.

[0008] A high-frequency crystal oscillator epoxy resin encapsulation process includes the following steps: S1. Pin bracket fabrication: A pin bracket is provided, which is formed by stamping copper or iron material. The pin bracket includes a bracket body, a stamping hole, a positioning hole, a pre-cut groove, and pins. The pins are connected to the bracket body through the pre-cut groove. S2, Base injection molding: Position the pin bracket in the base mold, so that the pin part extends into the cavity, inject high temperature resistant epoxy resin into the base mold, and injection mold the base, the base including the mounting groove and the pin groove; S3. Injection molding of the top cover: Inject high-temperature resistant epoxy resin into the mold of the top cover and injection mold the top cover. S4. Crystal oscillator chip installation: Install the crystal oscillator chip in the mounting slot of the base, and electrically connect the pins of the crystal oscillator chip to pins 2 and 4 among the pins. S5. Assembly and welding: Assemble the upper cover and the base, and perform airtight sealing by ultrasonic welding. S6, Pin bending and separation: Bend the pins so that they are bent along the pin slots of the base and separate the pins from the pin holders through pre-cut slots; S7. Finished Product Collection and Mass Production: Collect the welded finished products and repeat steps S to S to achieve multi-row, multi-column array-style mass production.

[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: In the scheme of this application: 1. By setting up a high-frequency crystal oscillator epoxy resin encapsulation structure, which is adapted to epoxy resin injection molding production, epoxy resin can replace ceramic material base, solving the problems of huge energy consumption, low yield and difficulty in mass production of ceramic base in the existing technology. 2. Through the set lifting structure, the force plate pressurizes the middle of the extrusion plate. The auxiliary hydraulic rod, force frame, transmission assembly and dispersion assembly work together to pressurize the bottom periphery of the extrusion plate during the injection process, so that the extrusion plate is subjected to more uniform force. This makes the mold less prone to deformation when large molds are used for injection molding, and solves the problem of uneven force on large molds in the prior art. 3. By using a bending and welding mechanism, ultrasonic welding is employed to weld the crystal oscillator base and cover plate, expanding the advantages of epoxy resin compared to ceramic bases and achieving higher sealing performance of the crystal oscillator welding; at the same time, the bending and welding mechanism adds a bending structure during the welding process, achieving bending of the crystal oscillator pins while welding. 4. By setting up a high-frequency crystal oscillator epoxy resin encapsulation equipment, it is possible to use epoxy resin to replace ceramic bases and metal covers to prepare crystal oscillators and achieve automated production; 5. This packaging structure can be widely used in electronic measuring instruments such as digital television testing instruments and communication network testing instruments as a high-precision clock reference source, and has broad market application prospects. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the epoxy resin encapsulation structure for a high-frequency crystal oscillator. Figure 2 A schematic diagram showing the disassembled structure of the epoxy resin encapsulation structure of a high-frequency crystal oscillator. Figure 3 A schematic diagram of a partial cross-sectional view of the epoxy resin encapsulation structure of a high-frequency crystal oscillator. Figure 4 This is a schematic diagram of the pin structure in the epoxy resin encapsulation structure of a high-frequency crystal oscillator. Figure 5This is a schematic diagram of the epoxy resin encapsulation structure of a high-frequency crystal oscillator with the pins in the unbent state. Figure 6 This is a schematic diagram of the epoxy resin encapsulation equipment for high-frequency crystal oscillators. Figure 7 This is a schematic diagram of the mounting bracket in an epoxy resin encapsulation device for high-frequency crystal oscillators. Figure 8 This is a schematic diagram of the triaxial module and chip mounting structure in an epoxy resin encapsulation device for high-frequency crystal oscillators. Figure 9 This is a schematic diagram of the chip mounting structure in an epoxy resin packaging device for a high-frequency crystal oscillator. Figure 10 This is a schematic diagram showing the disassembled structure of the chip mounting structure in the epoxy resin packaging equipment for high-frequency crystal oscillators. Figure 11 This is a schematic diagram of the transfer structure in the epoxy resin encapsulation equipment for high-frequency crystal oscillators. Figure 12 This is a schematic diagram of the injection mold in the epoxy resin encapsulation equipment for high-frequency crystal oscillators. Figure 13 for Figure 12 Enlarged view of point A in the middle; Figure 14 This is a schematic diagram of the pin support structure in an epoxy resin encapsulation device for a high-frequency crystal oscillator. Figure 15 This is a schematic diagram of the connection between the epoxy resin encapsulation device for a high-frequency crystal oscillator and the pin support. Figure 16 This is a schematic diagram of the ejector pin in an epoxy resin encapsulation device for a high-frequency crystal oscillator. Figure 17 A schematic diagram showing the locations of the injection molding mechanism and the current shunt structure in the epoxy resin encapsulation equipment for high-frequency crystal oscillators; Figure 18 This is a cross-sectional schematic diagram of the shunt structure in the epoxy resin encapsulation equipment for high-frequency crystal oscillators. Figure 19 This is a schematic diagram of the chip loading structure in an epoxy resin packaging equipment for high-frequency crystal oscillators. Figure 20 This is a schematic diagram of the main hydraulic rod in the epoxy resin encapsulation equipment for high-frequency crystal oscillators. Figure 21 This is a schematic diagram of the transmission and dispersion components in an epoxy resin encapsulation device for a high-frequency crystal oscillator. Figure 22 This is a schematic diagram of the bending and welding mechanism in the epoxy resin encapsulation equipment for high-frequency crystal oscillators. Figure 23 for Figure 22 Enlarged view of point B in the middle; Figure 24 This is a schematic diagram of the structure of the mold body in the epoxy resin encapsulation equipment for high-frequency crystal oscillators, viewed in cross section along the limiting hole. Figure 25 This is a schematic diagram of the structure of the mold body along the slot in the epoxy resin encapsulation equipment for high-frequency crystal oscillators.

[0011] The image shows: 1. Base; 1a. Lower part of base; 1b. Upper part of base; 1c. Pin slot; 2. Pin; 2a. Pin No. 1; 2a1. Fixed section No. 1; 2a2. Extension section No. 1; 2a3. Clearance slot No. 1; 2b. Pin No. 2; 2b1. Fixed section No. 2; 2b2. Extension section No. 2; 2b3. Connecting section No. 2; 2b4. Clearance slot No. 2; 2c. Pin No. 3; 2c1. Fixed section No. 3; 2c2. Extension section No. 3; 2d. Pin No. 4; 2d1. Fixed section No. 4; 2d2. Connecting section No. 4; 3. Top cover; 3a. Cover plate; 3b. Positioning block; 3c. Connecting block; 4. Mounting slot; 4a. Connecting slot; 4b. Positioning slot; 5. Crystal oscillator chip; 6. Mounting box No. 1; 7. Mounting box No. 2; 71. Box body 72. Box door; 73. Feeding window; 8. Bending and welding mechanism; 81. First moving module; 82. Mounting plate; 83. Ultrasonic welding machine; 84. Welding head; 85. Bending die; 851. Die body; 852. Connecting plate; 853. Inclined groove; 854. Baffle; 86. Bending assembly; 861. Limiting hole; 862. Bending groove; 863. Guide groove; 864. Arc strip; 865. Drive rod; 866. Movable hole; 867. Slot; 868. Spring groove; 869. First return spring; 87. Ejection assembly; 871. Force plate; 872. Ejector rod; 873. Top plate; 874. Sealing rod; 88. Air blowing assembly; 881. Air groove; 882. Sealing ring; 883. Second return spring 884. Gas delivery trough; 885. Limiting block; 886. Nozzle; 887. Connecting cavity; 89. Connecting assembly; 891. Slide groove; 892. Sliding column; 893. Moving block; 894. No. 3 return spring; 9. Lifting structure; 91. Main hydraulic rod; 911. No. 1 cylinder; 912. Main push rod; 913. No. 1 piston; 914. No. 1 segment assembly; 9141. No. 1 sealing sleeve; 9142. No. 1 sliding ring; 9143. No. 4 return spring; 9144. No. 1 drain port; 9145. No. 1 lower connecting hole; 9146. No. 1 upper connecting hole; 915. No. 2 segment assembly; 9151. No. 2 sealing sleeve; 9152. No. 2 sliding ring; 9153. No. 5 return spring; 9154. No. 2 drain port. 9155. Upper connecting hole No. 2; 9156. Lower connecting hole No. 2; 916. Force plate; 92. Extrusion plate; 93. Stabilizing column; 94. Auxiliary hydraulic rod; 95. Force frame; 96. Transmission assembly; 961. Connecting rod No. 1; 962. Connecting rod No. 2; 963. Connecting rod No. 3; 964. Connecting seat; 965. Limiting sleeve; 966. Limiting column; 97. Dispersion assembly; 971. Primary force arch; 972. Secondary force arch; 973. Tertiary force arch; 974. Pressure plate; 10. Mounting bracket; 11. Fixed plate No. 1; 12. Support plate; 13. Chip feeding structure; 14. Injection molding mechanism; 141. Barrel; 142. Extrusion head; 143. Diverter connector; 144. Feed hopper; 15. Diverter structure;151. Diverter; 152. Feed Inlet; 153. Discharge Outlet; 16. Transfer Structure; 161. L-shaped Plate No. 1; 162. Ball Bearing Nut Pair; 163. L-shaped Plate No. 2; 164. Stabilizing Rail No. 1; 165. Stabilizing Slider No. 1; 166. Sliding Column; 167. Compensation Component; 1671. Fixing Plate No. 3; 1672. Limit Pin; 168. Stabilizing Rail No. 2; 169. Stabilizing Slider No. 2; 17. Discharge Window; 18. Fixing Plate No. 2; 19. Three-Axis Module; 19X, X-Axis Module; 19a. Auxiliary Guide Rail; 19Y, Y-Axis Module; 19Z, Z-Axis Pneumatic Rod; 20. Chip Installation structure; 201. Mounting frame; 202. Adjusting rod; 203. Stabilizing rod; 204. Adjusting block; 205. Adjusting groove; 206. Adsorption assembly; 207. Dispensing syringe; 208. Adsorption head; 209. Needle; 2010. Drive motor; 21. Injection mold; 211. Upper mold; 212. Lower mold; 213. Limiting frame; 214. Compensation groove; 215. Pin bracket; 2151. Bracket body; 2152. Punching hole; 2153. Second positioning hole; 2154. Pre-cut groove; 216. Positioning post; 217. First positioning hole; 218. Cavity; 219. Ejector pin. Detailed Implementation

[0012] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0013] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0014] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0015] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0016] Please refer to Figure 1 and Figure 2A high-frequency crystal oscillator epoxy resin encapsulation structure includes a base 1, a mounting groove 4 on the top of the base 1, a crystal oscillator chip 5 inside the mounting groove 4, and pins 2 inside the base 1. The pins 2 include a first pin 2a, a second pin 2b, a third pin 2c, and a fourth pin 2d. The first pin 2a and the second pin 2b are located on one side of the base 1, and the third pin 2c and the fourth pin 2d are located on the other side of the base 1. The first pin 2a, the second pin 2b, the third pin 2c, and the fourth pin 2d are arranged clockwise. The two chip pins of the crystal oscillator chip 5 are connected to the second pin 2b and the fourth pin 2d, respectively. A top cover 3 is fixedly provided on the top of the base 1. Furthermore, such as Figure 3 As shown, the mounting groove 4 includes a connecting groove 4a and a positioning groove 4b located below the connecting groove 4a. The main body of the connecting groove 4a is a quadrangular prism, and the main body of the positioning groove 4b is an inverted quadrangular frustum. The side edges of the connecting groove 4a and the positioning groove 4b are chamfered or rounded. The upper cover 3 includes a cover plate 3a. The bottom center of the cover plate 3a is provided with a connecting block 3c that matches the connecting groove 4a. The bottom of the connecting block 3c is provided with a positioning block 3b whose periphery fits against the inner wall of the positioning groove 4b. The height of the positioning block 3b is less than the depth of the mounting groove 4. The positioning block 3b is inserted into the mounting groove 4 to facilitate the limiting of the cover plate 3a during ultrasonic welding. Furthermore, such as Figure 1 , Figure 2 and Figure 3 As shown, the base 1 includes a lower base 1a and an upper base 1b located above the lower base 1a. The lower base 1a and the upper base 1b are integrally formed by injection molding. The lower plane of the upper base 1b is flush with the upper plane of the pin 2. The pin 2 is embedded above the lower base 1a. The mounting groove 4 passes through the upper base 1b. The four sides of the lower base 1a are all inclined, with an inclination angle β < 15°. Specifically, the inclination angle β is 1°, which facilitates demolding from the lower mold of the base.

[0017] Furthermore, such as Figure 1 , Figure 2 and Figure 3 As shown, two pin slots 1c are provided on both sides of the bottom end of the base 1a. The ends of pin 2a, pin 2b, pin 2c and pin 2d away from the mounting slot 4 are bent twice and extend along the side of the base 1a into the adjacent pin slot 1c. The pin 2 in the four pin slots 1c is used to connect to the circuit board.

[0018] Furthermore, such as Figure 4As shown, pin 2d (4th pin) includes a fixed segment 2d1 and a connecting segment 2d2, with the connecting segment 2d2 located on the side of the fixed segment 2d1 near the mounting slot 4. Pin 2c (3rd pin) includes a fixed segment 2c1 and an extension segment 2c2, with the extension segment 2c2 located on the side of the fixed segment 2c1 near the mounting slot 4. Pin 2b (2nd pin) includes a fixed segment 2b1, an extension segment 2b2, and a connecting segment 2b3, with the extension segment 2b2 located at the end of the fixed segment 2b1 near the mounting slot 4. The connecting segment 2b3 is located in front of the end of the extension segment 2b2 and extends behind the connecting segment 2d2. The connecting segments 2b3 and 2d2 are used to connect to the crystal oscillator chip 5. The extension segments 2c2 and 2d2 extend backward, respectively. A second clearance groove 2b4 is provided in front of 2b2, located behind the third extension section 2c2. The second clearance groove 2b4 is used to increase the distance between the second extension section 2b2 and the third extension section 2c2. Both sides of the second clearance groove 2b4 are chamfered. The first pin 2a includes a first fixed section 2a1 and a first extension section 2a2. The first extension section 2a2 is connected to the end of the first fixed section 2a1 and is located behind the second connecting section 2b3. A first clearance groove 2a3 is provided at the front end of the first extension section 2a2 to avoid the second connecting section 2b3. Chamfers are provided at the rear end of the second connecting section 2b3 and at the corresponding position of the first clearance groove 2a3.

[0019] Please refer to Figure 6 , Figure 7 , Figure 8 , Figure 11 , Figure 12 Figure 13 , Figure 14 , Figure 15 and Figure 22A high-frequency crystal oscillator epoxy resin encapsulation device is used to prepare a high-frequency crystal oscillator epoxy resin encapsulation structure. It includes a second mounting box 7 and a first mounting box 6 located to one side of the second mounting box 7. The second mounting box 7 includes a box body 71, with doors 72 installed on both sides of the front end of the box body 71. A feeding window 73 is provided on the door 72. The second mounting box 7 and the first mounting box 6 are used to protect the internal structure. Mounting frames 10 are provided on the upper sides of both sides inside the second mounting box 7. A first fixing plate 11 is fixedly installed below the mounting frame 10. An injection molding mechanism 14 is installed inside the mounting frame 10. The mounting frame 10 is used to install the injection molding mechanism 14. The injection molding mechanism 14 includes a barrel 141, with a feeding hopper 144 connected to the front end of the barrel 141. The feeding hopper 144 is positioned relative to the feed... Corresponding to material window 73, an extrusion head 142 is installed at the bottom of the material cylinder 141. Several diversion joints 143 are evenly spaced and connected to the bottom circumference of the extrusion head 142. The material cylinder 141 has a heating structure and a screw extrusion structure inside. Epoxy resin is fed into the feeding hopper 144 and then enters the material cylinder 141. After being melted, the epoxy resin is driven by the extrusion mechanism and dispersed through the diversion joints 143. A lifting structure 9 is provided below the first fixing plate 11. An injection mold 21 is provided between the first fixing plate 11 and the lifting structure 9. The injection mold 21 closer to the first mounting box 6 is the top cover mold, and the injection mold 21 farther from the first mounting box 6 is the base mold. Several diversion structures 15 are installed on the top of the first fixing plate 11. The injection mold 21 includes... The upper mold 211 and lower mold 212 of the upper cover mold are provided with several sets of mold cavities that match the upper cover of the crystal oscillator. Each mold cavity group includes several mold cavities. Adjacent mold cavities are connected by a connecting groove, which is flush with the mold parting line. A limiting frame 213 is provided between the upper mold 211 and lower mold 212 on the side away from the first mounting box 6. A compensation groove 214 is provided in the middle of the top of the limiting frame 213. A pin bracket 215 is provided in the compensation groove 214. Several first positioning holes 217 corresponding to positioning pins 216 are provided above the compensation groove 214. The pin bracket 215 includes a bracket body 2151. Several stamping holes 2152 are provided on the bracket body 2151. The component has several pins 2. Several second positioning holes 2153 corresponding to the positioning posts 216 are opened around the top of the main body 2151. A pre-cut groove 2154 is opened at the connection between the pins 2 and the main body 2151. The pre-cut groove 2154 allows the connection between the pins 2 and the pre-cut groove 2154 to easily break when the pins 2 are pulled. The main body 2151, the stamping holes 2152, the second positioning holes 2153, the pre-cut groove 2154, and the pins 2 are formed by one-time stamping. The lifting structure 9 is used to drive the lower mold 212 to move for mold closing and opening. The injection mold 21 near the first mounting box 6 is used to produce the crystal oscillator top cover, and another injection mold 21 is used to produce the crystal oscillator base. A support plate 12 is provided below the lifting structure 9.Support plate 12 is used for the installation of lifting structure 9. Support plate 12 is fixedly connected to the inner wall of No. 2 mounting box 7. No. 2 fixing plate 18 is provided between the two injection molding mechanisms 14. No. 2 fixing plate 18 is fixedly connected to two No. 1 fixing plates 11. A three-axis module 19 is provided below No. 2 fixing plate 18. The three-axis module 19 includes auxiliary guide rail 19a, X-axis module 19X, Y-axis module 19Y and Z-axis air rod 19Z. Auxiliary guide rail 19a and X-axis module 19X are fixedly connected to the bottom of No. 2 fixing plate 18. Y-axis module 19Y is fixedly connected to the bottom of the slide of auxiliary guide rail 19a and X-axis module 19X. Z-axis air rod 19Z is fixedly connected to one side of the slide of Y-axis module 19Y. X-axis module 19X drives Y-axis module 19Y to move laterally. Group 19Y drives the Z-axis pneumatic rod 19Z to move back and forth. A chip mounting structure 20 is installed below the three-axis module 19. A chip loading structure 13 is also located below the three-axis module 19. The chip loading structure 13 passes through the rear inner wall of the second mounting box 7 and extends to the rear of the second mounting box 7. The first mounting box 6 has a bending and welding mechanism 8 inside. The second mounting box 7 also has a transfer structure 16 inside. The transfer structure 16 includes an active part, a driven part, and a compensation component 167. The transfer structure 16 is used to drive the pin support 215 to move, achieving automated transfer instead of manual labor. The active part and the driven part are respectively installed on the front and rear inner walls of the second mounting box 7. Both the active part and the driven part extend into the first mounting box 6 and are fixedly connected to the inner wall of the first mounting box 6.

[0020] Furthermore, such as Figure 7 , Figure 19 , Figure 21 and Figure 22 As shown, the lifting structure 9 includes a main hydraulic rod 91 fixedly installed on the support plate 12. The top of the main hydraulic rod 91 is provided with an extrusion plate 92. The main hydraulic rod 91 is used to drive the extrusion plate 92 to move up and down. The extrusion plate 92 is used to drive the lower mold 212 to move. Auxiliary hydraulic rods 94 are provided on both sides of the main hydraulic rod 91. The top of the two auxiliary hydraulic rods 94 is provided with a force-bearing frame 95. The two sides of the force-bearing frame 95 are provided with transmission components 96. The top of the transmission components 96 is provided with a dispersion component 97. The auxiliary hydraulic rods 94, the force-bearing frame 95, the transmission components 96 and the dispersion component 97 work together to apply pressure to the bottom periphery of the extrusion plate 92 during the injection molding process, so that the extrusion plate 92 is subjected to more uniform force.

[0021] Furthermore, such as Figure 20As shown, the main hydraulic rod 91 includes a first cylinder 911, a main push rod 912 is inserted through the top of the first cylinder 911, a first piston 913 is fixedly mounted on the main push rod 912 inside the first cylinder 911, a first segment assembly 914 is fixedly mounted on the upper exterior of the first cylinder 911, and a second segment assembly 915 is fixedly mounted on the lower exterior of the first cylinder 911. The first segment assembly 914 and the second segment assembly 915 have the same structure and are horizontally symmetrical. The first segment assembly 914 includes a first sealing sleeve 9141, a first sliding cavity is provided between the first sealing sleeve 9141 and the first cylinder 911, a first sliding ring 9142 slides inside the first sliding cavity, a fourth return spring 9143 is sleeved on the first cylinder 911 and located on the upper end face of the first sealing sleeve 9141, the first segment assembly 914 has a first drain port 9144 on both sides that communicates with the bottom of the side wall of the first sliding cavity, and a number of first upper connecting holes 9146 and first lower connecting holes 9145 that communicate with the inside of the first cylinder 911 are respectively provided at the top and bottom of the first sliding cavity, and a force receiving plate 916 is fixedly connected to the top of the main push rod 912. The second segment assembly 915 includes a second sealing sleeve 9151. A second sliding cavity is provided between the second sealing sleeve 9151 and the first cylinder 911. A second sliding ring 9152 slides inside the second sliding cavity. A fifth return spring 9153 is sleeved on the first cylinder 911 and located on the lower end face of the second sliding ring 9152. Both sides of the second sealing sleeve 9151 are provided with second drain ports 9154 that communicate with the top of the side wall of the second sliding cavity. The top and bottom of the second sliding cavity are provided with several second upper connecting holes 9155 and second lower connecting holes 9156 that communicate with the inside of the first cylinder 911. The second drain port 9154 and the upper inlet of the auxiliary hydraulic rod 94 are connected through an oil supply pipe. The first drain port 9144 and the lower inlet of the auxiliary hydraulic rod 94 are connected through an oil supply pipe. When the extrusion plate 92 needs to be lifted to close the mold, hydraulic oil is input into the lower inlet of the main hydraulic rod 91, pushing the first piston 913 and the main ejector rod 912 upward. The end of the main ejector rod 912 closest to the first piston 913 is thicker. When the first piston 913 moves to its highest point, it restricts the first piston 913 to be positioned between the first lower connecting hole 9145 and the first upper connecting hole 9146. At this time, the hydraulic pressure above the first piston 913 is lower than the hydraulic pressure below it. The hydraulic oil below the first piston 913 enters the first sliding cavity through the first lower connecting hole 9145, pushing the first sliding ring 9142 upward. The first lower connecting hole 9145 is offset from the first drain port 9144. Hydraulic oil flows from the first drain port 9144 through the lower inlet of the auxiliary hydraulic rod 94, causing the auxiliary hydraulic rod 94 to rise. When it is necessary to lower the auxiliary hydraulic rod 94 for mold parting, hydraulic oil is input into the upper inlet of the main hydraulic rod 91, pushing the first piston 913 and the main ejector rod 912 downwards. The portion of the main ejector rod 912 below the first piston 913 restricts the first piston 913 to be positioned between the second upper connecting hole 9155 and the second lower connecting hole 9156. At this time, the hydraulic pressure below the first piston 913 is lower than the hydraulic pressure above it. The hydraulic oil above the first piston 913 enters the second sliding cavity through the second upper connecting hole 9155, pushing the second sliding ring 9152 downwards. The second upper connecting hole 9155 is offset from the second drain port 9154. Hydraulic oil flows from the second drain port 9154 through the upper inlet of the auxiliary hydraulic rod 94, causing the auxiliary hydraulic rod 94 to retract. During this process, hydraulic oil enters the first sliding cavity from the first upper connecting hole 9146, pushing the first sliding ring 9142 downward to re-block the first drain port 9144. When the first piston 913 moves to a position below the first lower connecting hole 9145, the upper pressure of the first sliding ring 9142 is greater than the lower pressure, causing the first sliding ring 9142 to adhere to the lower end of the first sliding cavity. The fourth return spring 9143 further ensures the stability of the first sliding ring 9142. When the main hydraulic rod 91 rises again, the operation of the second segment component 915 is the same as that of the first segment component 914 when the main hydraulic rod 91 retracts. The auxiliary hydraulic rod 94 is fixedly connected to the main push rod 912 through the fixing frame. After the main push rod 912 drives the extrusion plate 92 to rise and achieve mold closing, the auxiliary hydraulic rod 94 rises and causes the dispersion component 97 to push the bottom of the extrusion plate 92 around, so that the lower mold 212 is subjected to more even force. The four corners of the bottom end of the extrusion plate 92 are provided with stabilizing columns 93. The stabilizing column 93 consists of an inner rod and a slide cylinder. The inner rod is slidably connected inside the slide cylinder. The inner rod is fixedly connected to the extrusion plate 92, and the slide cylinder is fixedly connected to the support plate 12.

[0022] Furthermore, such as Figure 21As shown, the transmission assembly 96 includes a first connecting rod 961 hinged to the side of the force-bearing frame 95. The end of the first connecting rod 961 is hinged to a second connecting rod 962 and a third connecting rod 963. The end of the second connecting rod 962 is hinged to the support plate 12. The end of the third connecting rod 963 is hinged to a connecting seat 964. A limiting sleeve 965 is fixedly provided on the outside of the connecting seat 964. A limiting post 966 is slidably inserted on the force-bearing frame 95. The top of the limiting post 966 is fixedly connected to the extrusion plate 92. The limiting sleeve 965 and the limiting post 966 restrict the connecting seat 964 to move only up and down. When the force-bearing frame 95 moves upward, the first connecting rod 961 pushes the second connecting rod 962 and the third connecting rod 963, increasing the angle between the second connecting rod 962 and the third connecting rod 963. The connecting seat 964 moves upward and pushes the dispersion assembly 97. The dispersion assembly 97 includes a primary force-bow 971 hinged to the connecting seat 964. Secondary force-bows 972 are hinged to the tops of both ends of the primary force-bow 971. An angle is formed between the secondary force-bows 972 and the primary force-bow 971, with the angle being 30° to 90°, preferably 30° to 60°. This angle allows for more uniform dispersion of the pressure plates 974. Tertiary force-bows 973 are hinged to the tops of both ends of the secondary force-bows 972. The tops of both ends of the tertiary force-bows 973 are fixed. A pressure plate 974 is provided. When the primary force-bearing bow 971 is subjected to force, the primary force-bearing bow 971 compresses the secondary force-bearing bow 972. When the forces at both ends of the primary force-bearing bow 971 are unbalanced, it rotates until the forces at both ends are balanced. The end of the secondary force-bearing bow 972 compresses the tertiary force-bearing bow 973. The principle of the tertiary force-bearing bow 973 is the same as that of the secondary force-bearing bow 972. When the forces at both ends of the tertiary force-bearing bow 973 are unbalanced, it rotates until the forces at both ends are balanced, thereby achieving more uniform support for the pressure plate 92.

[0023] Furthermore, such as Figure 22 and Figure 23 As shown, the bending and welding mechanism 8 includes a first moving module 81, which is fixedly connected to the top inner wall of the first mounting box 6. A mounting plate 82 is mounted on the slider of the first moving module 81, an ultrasonic welding machine 83 is mounted on the mounting plate 82, a welding head 84 is provided below the ultrasonic welding machine 83, a bending mold 85 is provided below the welding head 84, and an ejection assembly 87 is provided below the bending mold 85. The ejector assembly 87 includes a force-bearing plate 871, and a number of top plates 873 are fixedly connected to the top of the force-bearing plate 871. Both sides of the top of the top plate 873 are provided with protrusions. A push rod 872 is provided between adjacent top plates 873. The cross section of the push rod 872 is cross-shaped and corresponds to the bottom of the base 1. A sealing rod 874 is provided on one side of the top plate 873. A groove is opened on one side of the top of the sealing rod 874. The push rod 872 and the sealing rod 874 are both fixedly connected to the force-bearing plate 871.

[0024] Furthermore, such as Figure 23 , Figure 24 and Figure 25 As shown, the bending die 85 includes a die body 851, on which a bending assembly 86 is provided. A sloping groove 853 is formed on one side of the die body 851, and baffles 854 are hinged to the inner walls of the front and rear sides of the sloping groove 853. A connecting plate 852 is fixed to the top of the other side of the die body 851. A connecting assembly 89 is provided between the connecting plate 852 and the mounting plate 82. The connecting assembly 89 includes a sliding groove 891 formed on the mounting plate 82, and the interior of the sliding groove 891 is slidably connected to the connecting plate 852. A fixedly connected movable block 893 has a sliding column 892 inserted through its middle. The two ends of the sliding column 892 are fixedly connected to the inner walls of the top and bottom ends of the sliding groove 891, respectively. A third return spring 894 is sleeved on the sliding column 892 and located above the movable block 893. When the bending die 85 is pushed upward, the connecting plate 852 drives the movable block 893 to move upward. After the die body 851 loses its thrust, the third return spring 894 pushes the movable block 893 to reset the bending die 85.

[0025] Furthermore, such as Figure 5 , Figure 24 and Figure 25 As shown, the bending assembly 86 includes several limiting holes 861 corresponding to the push rod 872, which are opened on the mold body 851. Two bending grooves 862 are opened on both sides of the limiting holes 861. The bending grooves 862 expand outward in an arc shape from the bottom. A guide groove 863 is opened on the outer side of the bending grooves 862. A movable hole 866 passes through the guide grooves 863 on the same side as the limiting holes 861. A drive rod 865 is provided on both sides of the limiting holes 861 and is located in the movable hole 866. The movable hole 866 extends into the two farthest slots 867. Several arc-shaped strips 864 are fixed on the drive rods 865 and are located inside the guide grooves 863 respectively. The outer depth of the guide grooves 863 gradually decreases from bottom to top. When the drive rods 865 move upward, the outer side of the arc-shaped strips 864 is squeezed. The bottom end of 864 rotates towards the inside of the limiting hole 861. The bottom of the mold body 851 has several slots 867 corresponding to the top plate 873. The top two sides of the top plate 873 have spring grooves 868. The first reset spring 869 is installed inside the spring groove 868. The bottom end of the first reset spring 869 abuts against the drive rod 865. The push rod 872 pushes the crystal oscillator into the limiting hole 861. The pin 2 bends downward along the lower part of the bending groove 862. At the same time, the top plate 873 enters the slot 867. The protrusion of the top plate 873 pushes the drive rod 865 to move upward. The crystal oscillator moves upward to the position of the arc strip 864. The arc strip 864 rotates to bend the downward pin 2 into the pin groove 1c at the bottom of the crystal oscillator. The arc strip 864 is elastic and can better squeeze the pin 2.

[0026] Furthermore, such as Figure 25 As shown, the mold body 851 is equipped with an air blowing assembly 88. The air blowing assembly 88 includes an air groove 881 formed at the bottom of the mold body 851. An air delivery groove 884 is formed on one side of the air groove 881. A sealing ring 882 is slidably arranged inside the air groove 881. A second return spring 883 is provided on the top of the sealing ring 882. A limit block 885 is fixed inside the air groove 881 near the air delivery groove 884. The limit block 885 is located below the air delivery groove 884 and on one side of the connecting plate 852. The device is provided with several nozzles 886 corresponding to the bending assembly 86. The connecting plate 852 has a communicating cavity 887 inside. Several air delivery grooves 884 and nozzles 886 are connected to the communicating cavity 887. The groove position of the sealing rod 874 corresponds to the limiting block 885. The sealing rod 874 is inserted into the air groove 881, compressing the air in the air groove 881 until it pushes the sealing ring 882 to move and be offset from the air delivery groove 884. The compressed gas enters the air delivery groove 884 and the gas is blown out from the nozzle 886.

[0027] Furthermore, such as Figure 8 , Figure 9 and Figure 10 As shown, the chip mounting structure 20 includes a mounting frame 201, which is fixedly connected to the push rod end of the Z-axis pneumatic rod 19Z. An adjusting rod 202 is rotatably mounted inside the mounting frame 201. Several adjusting blocks 204 are provided on one side of the adjusting rod 202, and a stabilizing rod 203 is inserted through one side of each adjusting block 204. The stabilizing rod 203 is fixedly connected to the inner wall of the mounting frame 201. Several adjusting grooves 205 corresponding to the adjusting blocks 204 are opened on the adjusting rod 202, with one end of each groove close to the other. A movable column that slides inside the adjusting groove 205 is fixedly mounted on one side of each adjusting block 204. Rotation of the adjusting rod 202 controls the adjusting block 204 to move closer to or further away from the mounting frame 201. An adsorption component 206 is fixedly mounted on the side of the adjusting block 204 away from the mounting frame 201. A dispensing syringe 207 is fixedly installed. A drive motor 2010 is fixedly installed on the top of the mounting frame 201. The shaft of the drive motor 2010 is connected to the adjusting rod 202 via a belt and pulley. The drive motor 2010 is used to drive the adjusting rod 202 to rotate. The bottom end of the adjusting block 204 is equipped with an adsorption head 208. The bottom end of the dispensing syringe 207 is equipped with a needle 209. The adjusting block 204 is connected to an air pump. The adjusting block 204 is equipped with a sensor or vision detection component. The sensor can be a pressure sensor or a distance sensor. The vision detection component can be an industrial camera. The appropriate time is used to pick up and put down the chip. The adjusting block 204 can be used to control the on / off state. The adsorption head 208 is used to pick up the crystal oscillator chip 5. The dispensing syringe 207 is connected to a glue tank. The dispensing syringe 207 delivers glue through a pump. The glue is injected into the chip connection point through the needle 209.

[0028] Furthermore, such as Figure 12, Figure 13 As shown, the upper mold 211 and lower mold 212 of the base mold are provided with several sets of cavity groups. Each cavity group includes several cavities 218. The cavities 218 in the same cavity group are connected by a connecting groove. The cavity 218 on the lower mold 212 matches the shape of the lower part 1a of the base. The cavity 218 on the upper mold 211 matches the shape of the upper part 1b of the base. The top of the lower mold 212 of the base mold is provided with a special-shaped groove that matches the shape of the pin 2 of the pin bracket 215. When the pin bracket 215 is placed on the lower mold 212, the pin 2 extends into the cavity 218.

[0029] Furthermore, such as Figure 7 and Figure 11 As shown, the active part includes a first L-shaped plate 161 fixedly connected to the inner wall of the second mounting box 7. A ball bearing nut assembly 162 is mounted on the first L-shaped plate 161. A first stabilizing slider 165 is fixedly mounted on the slider of the ball bearing nut assembly 162. A first stabilizing slide rail 164 is provided between the first stabilizing slider 165 and the first L-shaped plate 161. The first stabilizing slider 165 is slidably connected to the first L-shaped plate 161 through the first stabilizing slide rail 164. A control motor is provided at one end of the ball bearing nut assembly 162. The control motor is driven by the ball bearing nut assembly 162. The driven part includes a second L-shaped plate 163, which is also fixedly connected to the inner wall of the second mounting box 7. A sliding post 166 is provided above the second L-shaped plate 163. A second stabilizing slider 169 is slidably mounted on the sliding post 166. A second stabilizing slide rail 168 is provided between the second stabilizing slider 169 and the second L-shaped plate 163. The second stabilizing slider 169 is slidably connected to the second L-shaped plate 163 through the second stabilizing slide rail 168. Compensation components 167 are provided on both the slide table of the ball nut pair 162 and the second stabilizing slider 169. The two compensation components 167 are symmetrically arranged. The compensation components 167 include two third fixing plates 1671 that are fixedly connected to the slide table of the ball nut pair 162 and the second stabilizing slider 169, respectively. A limiting pin 1672 is fixedly provided on the top of the third fixing plate 1671. The upper part of the limiting pin 1672 is frustum-shaped. In some embodiments, the limiting pin 1672 can be configured to be composed of three arc-shaped pieces, with a connecting rod and a cylinder in the middle to control the three arc-shaped pieces to move towards the middle for easy insertion into the first positioning hole 217.

[0030] Furthermore, such as Figure 7 , Figure 17 and Figure 18As shown, a flow-diverting structure 15 is provided at the upper center of each pair of cavity groups and each pair of mold cavity groups. The flow-diverting structure 15 includes a flow divider 151. The top of the flow divider 151 is provided with an inlet 152, and the bottom two sides of the flow divider 151 are provided with outlets 153. The two outlets 153 are connected to the inlet 152. The inlet 152 is connected to the flow-diverting connector 143 through a conveying pipe. The flow-diverting connector 143 conveys epoxy resin to the inlet 152, and then diverts it from the two outlets 153 to the corresponding two cavity groups or two mold cavity groups. The length of each conveying pipe is the same to ensure the balance of injection pressure.

[0031] Furthermore, such as Figure 16 As shown, a number of ejector pins 219 are embedded at the bottom of the upper mold 211. Each ejector pin 219 includes a compression spring and a pin body. The ejector pins 219 are on the support body 2151 between adjacent punch holes 2152. When the mold is separated, the support body 2151 is separated from the upper mold 211.

[0032] A high-frequency crystal oscillator epoxy resin encapsulation process, applied to high-frequency crystal oscillator epoxy resin encapsulation equipment, includes the following steps: S1: Preparation of pin bracket 215: The pin bracket 215 is made by one-time stamping process and is made of copper or iron. During the stamping process, the depth of the pre-cut groove 2154 is controlled to be 2 / 3-3 / 4 of the thickness of the pin 2 to ensure that the pin 2 can be completely separated from the bracket body 2151 without cracks when separated later. The diameter of the second positioning hole 2153 is matched with the diameter of the positioning post 216 of the base mold to prevent the pin bracket 215 from shifting during subsequent injection molding, which would cause the relative position deviation between the pin 2 and the base 1.

[0033] S2: Base 1 injection molding: S2.1, Pin bracket 215 positioning: First, place the limiting frame 213 on the top of the lower mold 212 of the base mold. The bottom contour of the limiting frame 213 is completely matched with the top positioning structure of the lower mold 212 to achieve initial fixation. Then, place the pin bracket 215 prepared in step S1 into the compensation groove 214 of the limiting frame 213, so that the positioning post 216 of the base mold passes through the first positioning hole 217 of the compensation groove 214 and the second positioning hole 2153 of the pin bracket 215. Finally, ensure that the end of the pin 2 away from the pre-cut groove 2154 extends into the cavity 218, and the gap between the pin 2 and the inner wall of the cavity 218 is uniform, so as to avoid the pin 2 being excessively wrapped by epoxy resin after injection molding, which would affect the conductivity.

[0034] S2.2 Determination of Injection Molding Material and Process Parameters: High-temperature resistant epoxy resin is selected as the injection molding material. If the long-term operating temperature of the crystal oscillator needs to be ≥220℃, PPS or LCP is selected. If it is necessary to balance cost and basic temperature resistance (long-term temperature resistance 120-180℃), ASA high heat-resistant plastic raw material specified by the customer is selected. If the material is a type with poor flowability such as PEEK or PI, the vacuum cavity of the base mold needs to be evacuated to a vacuum (vacuum degree ≤-0.095MPa) before mold closing to avoid air bubbles being generated inside the base 1 after injection molding.

[0035] S2.3, Mold Closure, Injection and Cooling: The lifting structure 9 is activated, and the main ejector rod 912 of the main hydraulic rod 91 moves the extrusion plate 92 upward, pushing the lower mold 212 and upper mold 211 to close. Once the first piston 913 of the main hydraulic rod 91 moves to the area between the first lower connecting hole 9145 and the first upper connecting hole 9146, hydraulic oil is delivered to the auxiliary hydraulic rod 94 through the first drain port 9144 of the first segmented component 914. The auxiliary hydraulic rod 94 moves the force-bearing frame 95, the transmission component 96, and the dispersion component 97 upward, ensuring that the pressure plate 974 of the dispersion component 97 evenly supports the bottom periphery of the extrusion plate 92, ensuring that the pressure deviation at each point of the mold is ≤0.05MPa. Subsequently, molten epoxy resin is injected according to the following parameters: Kingfa 740 heating temperature 220-240℃, PPS... Heating temperature 300-320℃, filling speed 5-10mm / s, to avoid pin 2 being punched out of shape; after injection, hold pressure (pressure 8-12MPa, time 15-30s, the worse the material flowability, the longer the holding time), then cool with water for 20-40s, and after the base 1 is completely cured, separate the mold. When separating the mold, push the pin bracket 215 away from the upper mold 211 through the ejector pin 219 to prevent the surface of the base 1 from being scratched.

[0036] S3: Top cover 3 injection molded: The injection molding of the top cover 3 must be of the same material and from the same batch as the base 1 to avoid sealing failure due to differences in material shrinkage during subsequent ultrasonic welding. The specific steps are as follows: The mold cavity assembly of the top cover mold must be compatible with the top structure of the base 1. Figure 1-3 The upper cover 3 has a cover plate 3a, a positioning block 3b, and a connecting block 3c. The injection molding process parameters are completely consistent with those of the base 1 (heating temperature, mold closing pressure, holding time, and cooling time are the same). After molding, the upper cover 3 is left in the upper mold 211 of the upper cover mold and is temporarily fixed by the micro suction structure of the inner wall of the mold cavity to avoid scratching the mating surface of the upper cover 3 and the base 1 during the transfer process. The roughness of the mating surface must be ≤Ra0.8μm to ensure the airtightness of the subsequent ultrasonic welding.

[0037] S4: Crystal oscillator chip 5 installation: This step relies on the three-axis module 19 and the chip mounting structure 20 to achieve precise installation and electrical connection of the crystal oscillator chip 5, as detailed below: S4.1, Chip loading adjustment: Start the X-axis module 19X and Y-axis module 19Y of the three-axis module 19 to move the chip mounting structure 20 above the chip box of the chip loading structure 13; start the drive motor 2010 to drive the adjustment rod 202 to rotate, and the adjustment groove 205 of the adjustment rod 202 drives the adjustment block 204 to slide along the stabilizing rod 203 through the movable column (refer to the adjustment logic of the chip mounting structure in Figure 8-10), so that the spacing of the adsorption head 208 is consistent with the matrix spacing of the crystal oscillator chip 5 in the chip box.

[0038] S4.2, Chip Adsorption and Transfer: The adsorption component 206 generates negative pressure (negative pressure value -0.06 to -0.08MPa) through an air pump, causing the adsorption head 208 to pick up the crystal oscillator chip 5. The adsorption force is controlled at 5-10N to avoid damaging the chip. Then, the triaxial module 19 moves the chip mounting structure 20 to the mounting slot 4 of the base 1, and the spacing of the adsorption heads 208 is adjusted again to match the array spacing of the base 1.

[0039] S4.3 Electrical Connection and Fixing: The adsorption head 208 places the crystal oscillator chip 5 into the mounting slot 4, ensuring that the pins of the crystal oscillator chip 5 are aligned with pins 2b and 2d (deviation ≤ 0.05 mm); the dispensing syringe 207 is activated, and high-temperature silver paste (silver paste conductivity ≥ 5 × 10⁻⁶) is injected through the needle 209 at the contact points between the chip pins and pins 2b and 2d. 4 (S / cm, dispensing amount 0.005-0.01mL / dip), then bake at 120-150℃ for 30-60min. After the silver paste is cured, the electrical connection between the crystal oscillator chip 5 and pin 2 is achieved and the chip is fixed.

[0040] S5: Assembly and Welding S5.1, Pre-assembly of the upper cover 3 and the base 1: Activate the transfer structure 16, whose active part, the ball nut pair 162, drives the compensation component 167 to move, so that the limiting pin 1672 of the compensation component 167 is inserted into the second positioning hole 2153 of the pin bracket 215, thereby driving the pin bracket 215 and the base 1 containing the crystal oscillator chip 5 to move above the lower mold 212 of the upper cover mold; activate the lifting structure 9 corresponding to the upper cover mold, the lower mold 212 drives the base 1 to move upward, so that the positioning block 3b of the upper cover 3 is embedded in the positioning groove 4b of the mounting groove 4 of the base 1 (gap 0.02-0.03mm), and at the same time, the connecting block 3c of the upper cover 3 and the connecting groove 4a of the base 1 are interference-fitted (interference amount 0.01-0.02mm), forming a pre-assembled body without relative wobbling.

[0041] S5.2, Ultrasonic Welding: The pre-assembled part is conveyed through the transfer structure 16 to the bending mold 85 and the ejection component 87 of the bending and welding mechanism 8; the first moving module 81 is started, driving the ultrasonic welding machine 83 to move downward, so that the welding head 84 is in contact with the top of the cover 3; ultrasonic welding is performed according to the following parameters: welding frequency 20-40kHz, welding pressure 0.1-0.3MPa (to avoid epoxy resin deformation), welding time 0.5-1.5s; after welding, the airtightness is tested by a helium mass spectrometer leak detector to ensure that the leakage rate is ≤1×10⁻ 8 Pa・m³ / s.

[0042] S6: Pin 2 Bending and Separation: This step relies on the bending die 85 and the ejection assembly 87 to achieve precise bending and separation of pin 2, as detailed below: S6.1, Pin 2 bending: The lifting structure of the ejector assembly 87, such as the hydraulic rod, is activated. The force plate 871 drives the push rod 872, the top plate 873, and the sealing rod 874 to move upward. The push rod 872 pushes the pre-assembled body into the limiting hole 861 of the bending mold 85. Pin 2 is initially bent vertically downward along the arc surface of the bending groove 862. The top plate 873 continues to move upward, inserts into the slot 867, and pushes the drive rod 865 upward. The drive rod 865 drives the arc strip 864 to rotate along the guide groove 863 (the outer depth gradually decreases from bottom to top) towards the inside of the limiting hole 861, bending pin 2 a second time into the pin groove 1c of the base 1.

[0043] S6.2, Pin 2 Separation: The ejector assembly 87 continues to move upward, and the pre-assembled body drives pin 2 to move upward. Pin 2 breaks at the pre-cut groove 2154 of the bracket body 2151 due to concentrated force, thus separating the two. The separated bracket body 2151 is transported to the waste collection area through the transfer structure 16. The exposed length of pin 2 is controlled at 0.5-1.0mm (matching the pin exposure requirements of the 3.2mm×2.5mm package).

[0044] S7: Finished Product Collection and Mass Production S7.1 Finished Product Collection: After bending is completed, the ejector component 87 continues to move upward, ejecting the welded finished product from the limiting frame 213; at the same time, the sealing rod 874 is inserted into the air groove 881 and pushes the sealing ring 882 upward. The compressed gas in the air groove 881 is blown out from the nozzle 886 through the air delivery groove 884 and the connecting cavity 887, blowing the finished product into the inclined groove 853 of the bending mold 85, and finally falling into the finished product collection box lined with anti-static foam to avoid scratches or static damage to the finished product.

[0045] S7.2, Mass Production: Remove the waste 2151 of the separated bracket body, replace it with a new pin bracket 215, and repeat steps S1 to S6; with the help of automated transfer and welding equipment, the daily production capacity can reach 100,000 to 150,000 units, achieving efficient mass production.

[0046] The injection molding material selected in this invention For epoxy resin materials with poor flowability, vacuum chambers can be set in the top cover mold and the base mold. The vacuum chamber is connected to the cavity group or mold cavity group. After the mold is closed, the inside of the vacuum chamber is first evacuated to a vacuum before injection molding.

[0047] The usage process of the epoxy resin encapsulation structure, equipment, and process for the high-frequency crystal oscillator provided by this invention is as follows: The compensation component 167 moves to one end of the first mounting box 6, and then injection molding begins. Epoxy resin material is fed into the two feeding hoppers 144 and heated in the barrel 141. The limiting frame 213 is placed on the lower mold 212. The bottom of the limiting frame 213 has a groove identical to the compensation groove 214, which matches the shape of the lower mold 212. The limiting frame 213 is precisely positioned at the top of the lower mold 212. Then, the pin bracket 215 is placed, with the unbent pin 2 extending into the cavity 218. After the two main ejector rods 912 lift the extrusion plate 92 to achieve mold closing, the auxiliary hydraulic rod 94 lifts the dispersion component 97 to push the bottom perimeter of the extrusion plate 92 upwards, making the lower mold 212 more evenly stressed. The barrel 141 extrudes the epoxy resin. The grease is fed into the extruder 142 and distributed to the feed port 152 through the diverter 143. Then, it is diverted and discharged from the two discharge ports 153 to the corresponding two cavity groups. Then, it fills each cavity and mold cavity through the connecting groove. After pressure holding and cooling, the mold is separated. The main hydraulic rod 91 retracts and the auxiliary hydraulic rod 94 retracts to realize the mold separation. At this time, the ejector pin 219 drives the lower mold 212 to descend, which drives the limit frame 213 and the pin support 215. The compensation component 167 catches the limit frame 213, and the limit pin 1672 is inserted into the first positioning hole 217 and the second positioning hole 2153 to separate the limit frame 213 from the lower mold 212. The active part drives the limit frame 213 to move to the bottom of the three-axis module 19. The chip loading structure 13 conveys the chip box to the bottom of the three-axis module 19. The chip box has crystal oscillator chips 5 arranged in a matrix. The three-axis module 19 drives the chip mounting structure 20 to move onto the chip box. During the movement of the chip mounting structure 20, the drive motor 2010 drives the adjusting rod 202 to rotate. When the adjusting rod 202 rotates, it controls the adjusting block 204 to move closer or further away, thereby adjusting the distance between the multiple adsorption heads 208 so that the distance between the adsorption heads 208 is equal to the spacing of the matrix-arranged crystal oscillator chips 5. Then, the adsorption heads 208 are used to adsorb the crystal oscillator chips. The three-axis module 19 drives the chip mounting structure 20 to move onto the injection-molded base 1. During the movement, the spacing of the adsorption heads 208 is adjusted to be equal to the spacing of the base 1 on the pin bracket 215. The adsorption heads 208 are inserted into the mounting slots 4 on the corresponding base 1, and the crystal oscillator chips are released. The needle 209 injects silver paste onto the chip pins of the crystal oscillator chip, completing the installation and paste injection of all crystal oscillator chips on the base 1 in sequence. After the paste injection is completed, the transfer structure 16 drives the limiting frame 213 to move below the upper mold 211 of the upper cover mold. The main hydraulic rod 91, near the first mounting box 6, runs again to drive the extrusion plate 92 to move upward. The lower mold 212 of the upper cover mold pushes the limiting frame 213 upward, and the mounting groove 4 fits onto the positioning block 3b until the connecting groove 4a fits onto the connecting block 3c. Since the connecting groove 4a is slightly smaller than the connecting block 3c, the connecting groove 4a and the connecting block 3c form a temporary connection through interference fit. The main hydraulic rod 91 drives the extrusion plate 92 to move downward, and the base 1 drives the upper cover 3 to detach from the upper mold 211 of the upper cover mold.The compensation component 167 catches the limit frame 213 again, and the transfer structure 16 continues to move the limit frame 213 between the bending die 85 and the ejection component 87. A lifting structure is provided below the force plate 871. The lifting structure is connected to the second moving module. The second moving module and the first moving module 81 move synchronously. The lifting structure can be a hydraulic rod, an electric telescopic rod, or a cylinder. The position of the first row of bases 1 near the first mounting box 6 is aligned with the position of the bending component 86. The force plate 871 moves upward, and the push rod 872 pushes the crystal oscillator into the limit hole 861. The connection between the pin 2 and the bracket body 2151 is broken. The presence of the pre-cut groove 2154 makes the pin 2 and the bracket body 2151... With low connection strength, pin 2 is bent downwards along the arc below the bending groove 862. Simultaneously, the top plate 873 enters the slot 867. The protrusion of the top plate 873 pushes the drive rod 865 upwards, and the crystal oscillator moves upwards to the position of the arc strip 864. The arc strip 864 rotates to bend the downward-facing pin 2 into the pin groove 1c at the bottom of the crystal oscillator. The arc strip 864 is elastic and can better compress the pin 2. During this process, the sealing rod 874 is also inserted into the air groove 881, compressing the air in the air groove 881 until it pushes the sealing ring 882 to move and displace it from the air delivery groove 884. The compressed gas enters the air delivery groove 884, and the gas is blown out from the nozzle 886. The ejector assembly 87 continues to move upwards, driving the bending. The mold 85 moves upward, and the crystal oscillator in the bending assembly 86 contacts the welding head 84. The ultrasonic welding machine 83 starts and welds the base 1 and pin 2 of the crystal oscillator through the welding head 84. After welding is completed, the force plate 871 moves downward, the bending mold 85 resets, the sealing ring 882 resets under the elastic force of the second reset spring 883, and the drive rod 865 resets under the elastic force of the first reset spring 869. Torsion springs are provided between the two ends of the drive rod 865 and the mold body 851. The arc strip 864 resets under the action of the torsion springs. Then, the first moving module 81 drives the mounting plate 82 to move, and the second moving module connects to drive the ejector assembly 87 to move, continuing to complete the bending of the remaining pin 2 in the first column and the welding of the crystal oscillator. The upper cover 3, which subsequently enters the limiting hole 861, will push out the previously welded crystal oscillator. Gas blown from nozzle 886 will blow the ejected crystal oscillator into the inclined groove 853. After the welding of the first row of base 1 and pin 2 is completed, the transfer structure 16 moves the limiting frame 213 to align the position of the second row of base 1 with the position of the bending assembly 86. This process continues until all base 1 and pin 2 on the limiting frame 213 are welded. Then, an employee's hand reaches into the first mounting box 6 through the discharge window 17 and pushes the baffle 854. The baffle 854 opens, catching the crystal oscillator falling from the inclined groove 853. The limiting frame 213 is then removed, the pin bracket 215 on the limiting frame 213 is replaced, and the crystal oscillator is placed back into the base mold.

[0048] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. Those skilled in the art can understand the specific meaning of these terms in this invention according to the specific circumstances.

[0049] Obviously, the embodiments described above are only some embodiments of the present invention, and not all embodiments. The accompanying drawings show preferred embodiments of the present invention, but do not limit the scope of the patent. Any equivalent structures made using the content of the present invention specification and drawings, directly or indirectly applied to other related technical fields, such as electronic measuring instruments like digital television testing instruments and communication network testing instruments, are similarly within the scope of protection of the present invention.

Claims

1. A high-frequency crystal oscillator epoxy resin encapsulation structure, characterized in that, The device includes a base (1), with a mounting groove (4) on the top of the base (1). A crystal oscillator chip (5) is disposed inside the mounting groove (4). The base (1) has pins (2) inside. The pins (2) include pin 1 (2a), pin 2 (2b), pin 3 (2c), and pin 4 (2d). Pin 1 (2a) and pin 2 (2b) are located on one side of the base (1), and pin 3 (2c) and pin 4 (2d) are located on the other side of the base (1). Pin 1 (2a), pin 2 (2b), pin 3 (2c), and pin 4 (2d) are arranged clockwise. The two chip pins of the crystal oscillator chip (5) are connected to pin 2 (2b) and pin 4 (2d) respectively. A top cover (3) is fixedly provided on the top of the base (1). The mounting groove (4) includes a connecting groove (4a) and a positioning groove (4b) located below the connecting groove (4a). The main body of the connecting groove (4a) is a quadrangular prism, and the main body of the positioning groove (4b) is an inverted quadrangular frustum. The side edges of the connecting groove (4a) and the positioning groove (4b) are chamfered or rounded. The upper cover (3) includes a cover plate (3a). The bottom center of the cover plate (3a) is provided with a connecting block (3c) that matches the connecting groove (4a). The bottom of the connecting block (3c) is provided with a positioning block (3b) whose periphery fits against the inner wall of the positioning groove (4b). The height of the positioning block (3b) is less than the depth of the mounting groove (4). The base (1) includes a lower base (1a) and an upper base (1b) located above the lower base (1a). The lower base (1a) and the upper base (1b) are integrally formed by injection molding. The lower plane of the upper base (1b) is flush with the upper plane of the pin (2). The pin (2) is embedded above the lower base (1a). The mounting groove (4) passes through the upper base (1b). The four sides of the lower base (1a) are all inclined with an inclination angle β < 15°.

2. The epoxy resin encapsulation structure for a high-frequency crystal oscillator according to claim 1, characterized in that, Two pin slots (1c) are provided on both sides of the bottom of the lower part (1a) of the base. The ends of the first pin (2a), the second pin (2b), the third pin (2c) and the fourth pin (2d) away from the mounting slot (4) are bent twice and extend along the side of the lower part (1a) of the base to the interior of the adjacent pin slot (1c). Pin 4 (2d) includes a fixed section 4 (2d1) and a connecting section 4 (2d2), with the connecting section 4 (2d2) located on the side of the fixed section 4 (2d1) near the mounting slot (4). Pin 3 (2c) includes a fixed section 3 (2c1) and an extension section 3 (2c2), with the extension section 3 (2c2) located on the side of the fixed section 3 (2c1) near the mounting slot (4). Pin 2 (2b) includes a fixed section 2 (2b1), an extension section 2 (2b2), and a connecting section 2 (2b3), with the extension section 2 (2b2) ​​located at the end of the fixed section 2 (2b1) near the mounting slot (4). The connecting section 2 (2b3) is located in front of the end of the extension section 2 (2b2) ​​and extends to the connecting section 4 (2d1). d2) Behind, the third extension segment (2c2) and the fourth connecting segment (2d2) extend backward respectively. The second extension segment (2b2) ​​has a second clearance groove (2b4) located behind the third extension segment (2c2) in front. Both sides of the second clearance groove (2b4) are chamfered. The first pin (2a) includes a first fixed segment (2a1) and a first extension segment (2a2). The first extension segment (2a2) is connected to the end of the first fixed segment (2a1) and is located behind the second connecting segment (2b3). The front end of the first extension segment (2a2) has a first clearance groove (2a3) for avoiding the second connecting segment (2b3). The rear end of the second connecting segment (2b3) and the corresponding position of the first clearance groove (2a3) are both chamfered.

3. A high-frequency crystal oscillator epoxy resin encapsulation device, used to prepare the high-frequency crystal oscillator epoxy resin encapsulation structure as described in claim 2, comprising a second mounting box (7) and a first mounting box (6) located on one side of the second mounting box (7), characterized in that, The second mounting box (7) has mounting brackets (10) on both sides inside. A first fixing plate (11) is installed below the mounting bracket (10). An injection molding mechanism (14) is installed inside the mounting bracket (10). The mounting bracket (10) is used to install the injection molding mechanism (14). The injection molding mechanism (14) includes a barrel (141). A feeding hopper (144) is connected to the front end of the barrel (141). The position of the feeding hopper (144) corresponds to the feeding window (73). An extrusion head (142) is installed at the bottom of the barrel (141). Several diverter joints (143) are connected at equal intervals on the bottom circumference of the extrusion head (142). A lifting mechanism is provided below the first fixing plate (11). Structure (9), an injection mold (21) is provided between the first fixing plate (11) and the lifting structure (9). The injection mold (21) on the side closer to the first mounting box (6) is the upper cover mold, and the injection mold (21) on the side away from the first mounting box (6) is the base mold. Several diversion structures (15) are installed on the top of the first fixing plate (11). The injection mold (21) includes an upper mold (211) and a lower mold (212). A limiting frame (213) is provided between the upper mold (211) and the lower mold (212) on the side away from the first mounting box (6). A compensation groove (214) is opened in the middle of the top of the limiting frame (213). A pin bracket is provided in the compensation groove (214). (215), several first positioning holes (217) corresponding to the positioning posts (216) are provided above the compensation groove (214). The pin bracket (215) includes a bracket body (2151). Several stamping holes (2152) are provided on the bracket body (2151). Several pins (2) are provided inside the stamping holes (2152). Several second positioning holes (2153) corresponding to the positioning posts (216) are provided around the top of the bracket body (2151). A pre-cut groove (2154) is provided at the connection between the pins (2) and the bracket body (2151). The bracket body (2151), stamping holes (2152), and second positioning holes (2153) are provided. 53) The pre-cut groove (2154) and pin (2) are formed by one-time stamping. The lifting structure (9) is used to drive the lower mold (212) to move for mold closing and mold opening. A support plate (12) is provided below the lifting structure (9). A second fixing plate (18) is provided between the two injection molding mechanisms (14). A three-axis module (19) is provided below the second fixing plate (18). A chip mounting structure (20) is installed below the three-axis module (19). A bending and welding mechanism (8) is provided inside the first mounting box (6). A transfer structure (16) is also installed inside the second mounting box (7). The transfer structure (16) includes an active part, a driven part and a compensation component (167).

4. The epoxy resin encapsulation equipment for a high-frequency crystal oscillator according to claim 3, characterized in that, The lifting structure (9) includes a main hydraulic rod (91) fixedly installed on the support plate (12). The top of the main hydraulic rod (91) is provided with a pressing plate (92). Auxiliary hydraulic rods (94) are provided on both sides of the main hydraulic rod (91). The top of the two auxiliary hydraulic rods (94) is provided with a force-bearing frame (95). The two sides of the force-bearing frame (95) are provided with a transmission assembly (96). The top of the transmission assembly (96) is provided with a dispersing assembly (97). The transmission assembly (96) includes a first connecting rod (961) hinged to the side of the force-bearing frame (95). The end of the first connecting rod (961) is hinged to a second connecting rod (962) and a third connecting rod (963). The end of the second connecting rod (962) is hinged to the support plate (12). The end of the third connecting rod (963) is hinged to a connecting seat (964). A limiting sleeve (965) is fixedly provided on the outside of the connecting seat (964). A limiting post (966) is slidably inserted on the force-bearing frame (95). The top of the limiting post (966) is fixedly connected to the extrusion plate (92). The dispersion component (97) includes a primary force-bow (971) hinged to a connecting seat (964). The tops of both ends of the primary force-bow (971) are hinged to secondary force-bows (972). An angle is provided between the secondary force-bows (972) and the primary force-bows (971). The tops of both ends of the secondary force-bows (972) are hinged to tertiary force-bows (973). The tops of both ends of the tertiary force-bows (973) are fixedly provided with pressure plates (974).

5. The epoxy resin encapsulation equipment for a high-frequency crystal oscillator according to claim 4, characterized in that, The main hydraulic rod (91) includes a first cylinder (911), a main push rod (912) is inserted through the top of the first cylinder (911), a first piston (913) is fixedly mounted on the main push rod (912) inside the first cylinder (911), a first segment assembly (914) is fixedly mounted on the upper exterior of the first cylinder (911), and a second segment assembly (915) is fixedly mounted on the lower exterior of the first cylinder (911). The first segment assembly (914) and the second segment assembly (915) have the same structure and are horizontally symmetrical. The first segment assembly (914) includes a first sealing sleeve (9141), and a first sliding cavity is provided between the first sealing sleeve (9141) and the first cylinder (911). A first sliding ring (9142) slides inside the first sliding cavity. Both sides of the first segment assembly (914) are provided with a first drain port (9144) communicating with the bottom of the side wall of the first sliding cavity. The top and bottom of the first sliding cavity are provided with a number of first upper connecting holes (9146) and first lower connecting holes (9145) communicating with the inside of the first cylinder (911). The top of the main push rod (912) is fixedly connected to a force-receiving plate (916). The second segment assembly (915) includes a second sealing sleeve (9151). A second sliding cavity is provided between the second sealing sleeve (9151) and the first cylinder (911). A second sliding ring (9152) slides inside the second sliding cavity. A second drain port (9154) is provided on both sides of the second sealing sleeve (9151) and communicates with the top of the side wall of the second sliding cavity. Several second upper connecting holes (9155) and second lower connecting holes (9156) are provided at the top and bottom of the second sliding cavity and communicate with the inside of the first cylinder (911). The second drain port (9154) and the upper inlet of the auxiliary hydraulic rod (94) are connected by an oil supply pipe. The first drain port (9144) and the lower inlet of the auxiliary hydraulic rod (94) are connected by an oil supply pipe. The auxiliary hydraulic rod (94) is fixedly connected to the main push rod (912).

6. The epoxy resin encapsulation equipment for a high-frequency crystal oscillator according to claim 5, characterized in that, The bending and welding mechanism (8) includes a first moving module (81), a mounting plate (82) is mounted on the slider of the first moving module (81), an ultrasonic welding machine (83) is mounted on the mounting plate (82), a welding head (84) is provided below the ultrasonic welding machine (83), a bending mold (85) is provided below the welding head (84), and an ejection assembly (87) is provided below the bending mold (85). The ejection assembly (87) includes a force plate (871), and a number of top plates (873) are fixedly connected to the top of the force plate (871). Both sides of the top of the top plate (873) are provided with protrusions, and a push rod (872) is provided between adjacent top plates (873). A sealing rod (874) is provided on one side of the top plate (873). A groove is opened on one side of the top of the sealing rod (874). The push rod (872) and the sealing rod (874) are both fixedly connected to the force plate (871).

7. The epoxy resin encapsulation equipment for a high-frequency crystal oscillator according to claim 6, characterized in that, The bending die (85) includes a die body (851), on which a bending assembly (86) is provided. A sloping groove (853) is provided on one side of the die body (851), and baffles (854) are hinged to the inner walls of the front and rear sides of the sloping groove (853). A connecting plate (852) is fixed to the top of the other side of the die body (851), and a connecting assembly (89) is provided between the connecting plate (852) and the mounting plate (82). 89) includes a slide groove (891) opened on the mounting plate (82), a movable block (893) fixedly connected to the connecting plate (852) is slidably provided inside the slide groove (891), a sliding column (892) is inserted through the middle of the movable block (893), the two ends of the sliding column (892) are fixedly connected to the inner wall of the top and bottom ends of the slide groove (891) respectively, and a No. 3 return spring (894) is sleeved on the sliding column (892) located above the movable block (893); The bending assembly (86) includes several limiting holes (861) on the mold body (851) corresponding to the push rod (872). Two bending grooves (862) are provided on both sides of each limiting hole (861). The bending grooves (862) expand outwards in an arc shape from the bottom. A guide groove (863) is provided on the outer side of each bending groove (862). A movable hole (866) passes through the guide grooves (863) on the same side as the limiting hole (861). A drive rod is provided on both sides of each limiting hole (861) within the movable hole (866). 865), the drive rod (865) is fixed with a number of arc-shaped strips (864) respectively located inside the guide groove (863), the outer depth of the guide groove (863) gradually decreases from bottom to top, the bottom of the mold body (851) is provided with a number of slots (867) corresponding to the top plate (873), the top two sides of the top plate (873) are provided with spring grooves (868), the spring groove (868) is provided with a first reset spring (869) inside, the bottom end of the first reset spring (869) abuts against the drive rod (865); The mold body (851) is equipped with an air blowing assembly (88) inside. The air blowing assembly (88) includes an air groove (881) opened at the bottom end of the mold body (851). An air delivery groove (884) is opened on one side of the air groove (881). A sealing ring (882) is slidably arranged inside the air groove (881). A second return spring (883) is provided on the top of the sealing ring (882). The side of the air groove (881) near the air delivery groove (884) is... A fixed limiting block (885) is fixed below the air supply channel (884). A plurality of nozzles (886) corresponding to the bending assembly (86) are provided on one side of the connecting plate (852). A connecting cavity (887) is provided inside the connecting plate (852). A plurality of air supply channels (884) and nozzles (886) are connected to the connecting cavity (887). The groove position of the sealing rod (874) corresponds to the limiting block (885).

8. The epoxy resin encapsulation equipment for a high-frequency crystal oscillator according to claim 3, characterized in that, The chip mounting structure (20) includes a mounting frame (201). An adjusting rod (202) is rotatably mounted inside the mounting frame (201). A plurality of adjusting blocks (204) are provided on one side of the adjusting rod (202). A stabilizing rod (203) is inserted through one side of each of the adjusting blocks (204). The stabilizing rod (203) is fixedly connected to the inner wall of the mounting frame (201). A plurality of adjusting grooves (205) corresponding to the adjusting blocks (204) are opened on the adjusting rod (202). One end of each of the adjusting grooves (205) is close to each other. A sliding plate is fixedly mounted on one side of each adjusting block (204). The movable column inside the adjustment groove (205) is fixedly provided with an adsorption component (206) on the side of the adjustment block (204) away from the mounting frame (201). A dispensing syringe (207) is fixedly provided on the side of the adsorption component (206) away from the mounting frame (201). A drive motor (2010) is fixedly provided on the top of the mounting frame (201). The drive motor (2010) is used to drive the adjustment rod (202) to rotate. An adsorption head (208) is provided at the bottom of the adjustment block (204). A needle (209) is provided at the bottom of the dispensing syringe (207). The adjustment block (204) is connected to an air pump.

9. The epoxy resin encapsulation equipment for a high-frequency crystal oscillator according to claim 3, characterized in that, The upper mold (211) and lower mold (212) of the base mold are provided with a number of cavity groups, each cavity group including a number of cavities (218). The cavities (218) of the same cavity group are connected by a connecting groove. The cavity (218) on the lower mold (212) matches the shape of the lower part (1a) of the base. The cavity (218) on the upper mold (211) matches the shape of the upper part (1b) of the base. The top of the lower mold (212) of the base mold is provided with a special groove that matches the shape of the pin (2) of the pin bracket (215). When the pin bracket (215) is placed on the lower mold (212), the pin (2) extends into the cavity (218).

10. A high-frequency crystal oscillator epoxy resin encapsulation process, applied to the high-frequency crystal oscillator epoxy resin encapsulation equipment as described in claim 9, characterized in that, Includes the following steps: S1. Pin bracket preparation: A pin bracket (215) is provided by stamping copper or iron material. The pin bracket (215) includes a bracket body (2151), a stamping hole (2152), a second positioning hole (2153), a pre-cut groove (2154) and a pin (2). The pin (2) is connected to the bracket body (2151) through the pre-cut groove (2154). S2, Base injection molding: Position the pin bracket (215) in the base mold, so that the pin (2) extends into the cavity (218), inject high temperature resistant epoxy resin into the base mold, and injection mold the base (1). The base (1) includes the mounting groove (4) and the pin groove (1c). S3, Injection molding of the top cover: Inject high-temperature resistant epoxy resin into the mold of the top cover and injection mold the top cover (3); S4. Crystal chip installation: Install the crystal chip (5) in the mounting slot (4) of the base (1) and electrically connect the pins of the crystal chip (5) to pin 2 (2b) and pin 4 (2d) in the pin (2); S5. Assembly and welding: Assemble the upper cover (3) and the base (1) and perform airtight sealing by ultrasonic welding; S6, Pin bending and separation: Bend the pin (2) so that the pin (2) bends along the pin groove (1c) of the base (1) and separates the pin (2) from the pin support (215) through the pre-cut groove (2154); S7. Finished Product Collection and Mass Production: Collect the welded finished products and repeat steps S1 to S6 to achieve multi-row, multi-column array-style mass production.

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