A CPO light engine device and system

Abstract

The application provides a CPO light engine device and system, and relates to the technical field of optics.The CPO light engine device comprises a shell, a substrate, and a plurality of light source modules, each of which is fixed to the inner wall of the shell, and the substrate is fixed in the shell;the substrate is further provided with a control module, a fiber communication connection module, and a light engine module, and the light engine module at least comprises a silicon light processing PIC unit;each light source module comprises a plurality of light source units.For any target light source module, the control module sends an enabling signal to the target light source unit in the target light source module to turn on the target light source unit to send an optical carrier to the light engine module.The silicon light processing PIC unit receives and generates a corresponding number of modulated light signals based on the optical carrier.Based on this, the CPO light engine device and system provided by the application saves resources by integrating the light module, simplifies the complexity of the device system in which the CPO is located, and saves device resources.

Description

Technical Field

[0001] This invention relates to the field of co-packaged optical technology, and more specifically, to a CPO optical engine device and system. Background Technology

[0002] With the rapid development of artificial intelligence and machine learning technologies, data centers are increasingly demanding low-latency, high-capacity data exchange. Engineers often use co-packaged optics (CPO) technology to address the long electrical signal transmission path between traditional pluggable optical transceiver modules and switch / server ASIC chips. Existing CPO technology significantly shortens the transmission distance of high-speed electrical signals between silicon photonic integrated circuits (PICs) and electrical chips by co-packaging them, effectively reducing signal attenuation. Currently, the connection between PICs and fiber optic arrays (FAUs) mainly uses two methods: one is active coupling followed by fixation with UV adhesive / epoxy resin, and the other is using pluggable optical connectors. Because silicon's indirect bandgap characteristics prevent direct laser generation, CPO systems must rely on external light source modules to provide optical power.

[0003] However, existing external light source solutions have several limitations. For example, independent light source modules occupy the front panel space of the device and reduce channel density. For another example, the collaborative work between the CPO and the light source module needs to be achieved through an additional controller on the motherboard, which increases system complexity and affects collaborative efficiency. For yet another example, polarization-maintaining fiber transmission requires the FAU component to strictly calibrate the slow axis direction of the fiber, and this precision adjustment process significantly increases production costs. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a CPO optical engine device and system, which saves front panel resources of switch or server equipment by integrating an optical module, and realizes the transmission of optical carrier to PIC chip directly inside the optical engine through an optical fiber communication connection module, thereby simplifying the complexity of the equipment system in which the CPO is located and saving equipment resources.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of the present invention are as follows: In a first aspect, the present invention provides a CPO optical engine device, comprising: a housing, a substrate, and multiple light source modules, wherein the substrate and each light source module are fixed inside the housing; the substrate is further provided with a control module, an optical fiber communication connection module, and an optical engine module, wherein the optical engine module includes at least a silicon photonics processing (PIC) unit; each light source module includes multiple light source units, each light source unit being fixed to the inner wall of the housing; the control module is connected to the enable terminal of each light source unit, and each light source unit is optically connected to the silicon photonics processing (PIC) unit through the optical fiber communication connection module; For any target light source module, the control module is used to send an enable signal to the target light source unit in the target light source module to turn on the target light source unit; the target light source module is used to characterize the light source module in the working state among multiple light source modules; Each target light source unit is used to send optical carriers to the optical engine module; The silicon photonics (PIC) processing unit is used to receive optical carriers and generate multiple modulated optical signals based on the optical carriers; Alternatively, the silicon photonics processing (PIC) unit is used to receive the peer-modulated optical signal from the current CPO optical engine device and generate a reference electrical signal based on the peer-modulated optical signal.

[0006] Optionally, each light source module also includes a temperature control unit and a temperature acquisition unit. The temperature control unit is fixed to the inner wall of the housing, and the hot end of the temperature control unit is in contact with the inner wall of the housing. Multiple light source units and the temperature acquisition unit are fixed to the cold end of the temperature control unit, and the temperature acquisition unit is located at the center of the area where multiple light source units are located. The control module is also connected to the control terminal of the temperature control unit and the output terminal of the temperature acquisition unit. For any target light source module, the temperature acquisition unit is used to acquire the temperature data of the current target light source module; The control module receives temperature data from the target light source module and sends control commands to the corresponding temperature control unit based on the temperature data to adjust the temperature of the current target light source module, so that each target light source module is in a constant temperature state.

[0007] Optionally, the light source module further includes a lens, and the optical fiber communication connection module includes at least a light source-side optical fiber array unit. The light source-side optical fiber array unit includes multiple transmission optical fibers, each transmission optical fiber corresponding to a light source unit. The lens is set on the straight line where the light output optical axis of each light source unit is located, and is located between each light source unit and the fiber core end face of the corresponding transmission optical fiber. The fiber core end face of the transmission optical fiber is located on the image-side focal plane of the lens.

[0008] Optionally, the light source module also includes an isolator, which is disposed between the optical path between each light source unit and the lens and / or between the lens and each transmission fiber; wherein the optical axis of the isolator is coaxial with the light output optical axis of each light source unit, the optical axis of the lens, and the core axis of each transmission fiber.

[0009] Optionally, when each light source module is disposed in multiple recesses of the housing, the CPO light engine device further includes a partition frame and a first fixing member, wherein the partition frame is fixed inside the housing by the first fixing member; The orthographic projection area of ​​each light source module on the housing is located within the orthographic projection area of ​​the partition frame on the housing.

[0010] Optionally, the silicon photonics processing PIC unit includes at least an optical splitter waveguide assembly, multiple modulators, and multiple photodetectors, with the total number of modulators being the same as the total number of photodetectors; the output terminal of the optical splitter waveguide assembly is connected to the input terminal of each modulator, and the input terminal of the optical splitter waveguide assembly is connected to the output terminal of each light source unit; the control terminal of each modulator acquires the target electrical signal through the electrical interface of the substrate, and the target electrical signal is used to characterize the input electrical signal on the switch / server ASIC chip side; An optical splitter waveguide assembly is used to receive each optical carrier and generate multiple branch optical carriers based on each optical carrier; A modulator is used to generate a corresponding number of modulated optical signals based on each branch optical carrier and the target electrical signal; A photodetector is used to receive the modulated optical signal from the peer of the current CPO optical engine device and convert the modulated optical signal into a reference electrical signal, which is then fed back to the switch / server ASIC chip through the electrical interface of the substrate.

[0011] Optionally, the optical fiber communication connection module includes at least a light source-side optical fiber array unit and an optical engine-side optical fiber array unit. Both the light source-side optical fiber array unit and the optical engine-side optical fiber array unit are fixed inside the housing. The optical engine-side optical fiber array unit includes a transmit input pigtail, a transmit output pigtail, and a receive input pigtail. The pigtail of the light source side fiber array unit is connected to the first end of the pigtail of the transmit input end; the second end of the pigtail of the transmit input end is connected to the light source input end of the silicon photonics processing PIC unit; the light source output end of the silicon photonics processing PIC unit is connected to the first end of the pigtail of the transmit output end, and the second end of the pigtail of the transmit output end serves as the output port of the CPO optical engine device, and is connected to the communication counterpart of the current CPO optical engine device through an optical fiber patch cord. The first end of the receiving end input pigtail serves as the input port of the CPO optical engine device, and is connected to the communication peer of the current CPO optical engine device via an optical fiber patch cord to receive the modulated optical signal from the peer of the current CPO optical engine device; the second end of the receiving end input pigtail is connected to the modulation receiver of the silicon photonics processing (PIC) unit.

[0012] Optionally, the CPO optical engine device further includes a second fixing member, which includes a plurality of U-shaped grooves disposed on the inner wall of the housing and a plurality of positioning posts disposed on the surface of the substrate, so as to fix the substrate inside the housing through the cooperation between the positioning posts and the corresponding U-shaped grooves.

[0013] Optionally, the CPO optical engine device also includes a power supply module, which is mounted on the substrate and connected to the power port of the substrate via a flexible circuit board.

[0014] In a second aspect, the present invention also provides a CPO optical engine system, including the CPO optical engine device of any of the first aspects described above.

[0015] The CPO optical engine device and system provided in this invention have the following beneficial effects: The CPO optical engine device in this application includes a housing, a substrate, and multiple light source modules. Each light source module is fixed to the inner wall of the housing, and the substrate is fixed inside the housing. The substrate also houses a control module, an optical fiber communication connection module, and an optical engine module. Each optical engine module includes at least a silicon photonics processing (PIC) unit. Each light source module includes multiple light source units. The control module is connected to the enable terminal of each light source unit, and each light source unit is optically connected to the PIC unit via the optical fiber communication connection module. For any target light source module, the control module sends an enable signal to the target light source unit within the target light source module, activating the target light source unit. Each target light source unit then sends an optical carrier to the optical engine module. The PIC unit receives the optical carrier and generates a corresponding number of modulated optical signals based on it; or it receives the modulated optical signal from the peer of the current CPO optical engine device's communication peer and generates a reference electrical signal based on the peer modulated optical signal. Based on this, the CPO optical engine device and system provided in this application saves front panel resources of switches or server equipment by integrating optical modules, and directly realizes the transmission of optical carrier to PIC chip through optical fiber communication connection module inside the optical engine, simplifying the complexity of the equipment system where CPO is located and saving equipment resources.

[0016] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This shows one of the structural schematic diagrams of the CPO optical engine device provided in an embodiment of the present invention; Figure 2 A block diagram of the CPO optical engine device provided in an embodiment of the present invention is shown; Figure 3 A second schematic diagram of the CPO optical engine device provided in an embodiment of the present invention is shown; Figure 4 The third schematic diagram of the CPO optical engine device provided in this embodiment of the invention is shown. Figure 5The fourth schematic diagram of the CPO optical engine device provided in this embodiment of the invention is shown. Figure 6 The fifth schematic diagram of the CPO optical engine device provided in this embodiment of the invention is shown. Figure 7 A block diagram of a silicon photonics processing PIC unit provided in an embodiment of the present invention is shown; Figure 8 The sixth schematic diagram of the CPO optical engine device provided in the embodiment of the present invention is shown.

[0019] Icons: 10-CPO optical engine device; 101-Housing; 102-Substrate; 103-Light source module; 104-Control module; 105-Fiber optic communication connection module; 106-Optical engine module; 107-Power supply module; 201-Silicon photonics (PIC) processing unit; 202-Light source unit; 203-Temperature control unit; 204-Temperature acquisition unit; 205-Lens; 206-Light source side fiber optic array unit; 207-Isolator; 208-Separator frame; 209-First fixing component; 210-Second fixing component; 211-Optical engine side fiber optic array unit; 301-Optical splitter waveguide assembly; 302-Modulator; 303-Photodetector. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0022] It should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0023] For ease of explanation, the following interpretations are provided for the relevant technical terms used in this application: Optical Engine: An optical engine is a modular optical system that integrates optical components, electronic drive, and control systems to generate, modulate, and transmit / receive optical signals. The core optoelectronic integration of an optical engine includes two key chips: a photonic integrated circuit (PIC) and an electronic integrated circuit (EIC). The collaborative work of these two types of chips forms the basis of a modern optical engine.

[0024] CPO (Co-Packaged Optics) optical engines are an advanced optoelectronic integration technology that integrates optical devices and electronic chips (such as ASICs, switch chips, etc.) in the same package with high density. They are mainly used in high-speed data centers, AI computing, and optical communication.

[0025] Silicon Photonics Unit (PIC): A chip used to process the generation, modulation, routing, and detection of optical signals. It mainly includes components such as a light source, modulator, waveguide structure, and detector. EIC chip: A chip used to provide electrical signal driving, control and signal processing. It mainly includes driving circuit, receiving circuit, control circuit and digital processing circuit. The driving circuit includes laser driver, modulator driver, etc., the receiving circuit includes transimpedance amplifier (TIA), limiting amplifier (LA), etc., the control circuit includes automatic power control (APC), temperature control circuit, etc., and the digital processing circuit includes CDR (clock data recovery) and DSP (digital signal processing), etc.

[0026] FAU (Fiber Array Unit): A high-precision fiber optic array component used to achieve parallel transmission and coupling of multi-channel optical signals, widely used in optical communication, photonic integration and optical sensing.

[0027] BOOT: The tapered / arc-shaped rubber or plastic sheath that fits over the junction of the connector and the optical fiber.

[0028] Please refer to Figure 1 , Figure 1 The diagram shows a structural schematic of the CPO light engine device provided in an embodiment of the present invention. In this embodiment, the CPO light engine device 10 includes a housing 101, a substrate 102, and multiple light source modules. The substrate and each light source module are fixed inside the housing 101.

[0029] Please Figure 1 Based on, refer to Figure 2 , Figure 2 A block diagram of the CPO optical engine device provided in an embodiment of the present invention is shown. In this embodiment, a control module 104, an optical fiber communication connection module 105, and an optical engine module 106 are also provided on the substrate 102. The optical engine module 106 includes at least a silicon photonics processing PIC unit 201. Each light source module 103 includes multiple light source units 202. To solve the device space problem and improve heat dissipation performance, each light source unit 202 is fixed to the inner wall of the housing 101. The control module 104 is connected to the enable terminal of each light source unit 202. Each light source unit 202 is optically connected to the silicon photonics processing PIC unit 201 through the optical fiber communication connection module 105.

[0030] In one possible implementation, the optical engine module of this embodiment also includes a transimpedance amplifier and a driver chip. The silicon photonics processing PIC unit, the transimpedance amplifier, and the driver chip can be 3D packaged to form a chiplet.

[0031] For any target light source module, the control module 104 is used to send an enable signal to the target light source unit in the target light source module to turn on the target light source unit; the target light source module is used to characterize the light source module in the working state among multiple light source modules.

[0032] Each target light source unit is used to send optical carriers to the light engine module.

[0033] The silicon photonics (PIC) processing unit is used to receive optical carriers and generate multiple modulated optical signals based on the optical carriers.

[0034] Alternatively, the silicon photonics processing PIC unit 201 is also used to receive the peer-to-peer modulated optical signal from the current CPO optical engine device communication peer, and generate a reference electrical signal based on the peer-to-peer modulated optical signal.

[0035] It should be noted that this embodiment does not limit the laser wavelength between the light source modules. The laser wavelengths between the light source modules can be the same or different. The laser wavelength setting can be flexibly configured based on user needs to match different optical carrier requirements.

[0036] In one possible implementation, the laser wavelengths of each light source module in this embodiment are the same.

[0037] In this embodiment, the target light source unit is used to characterize the light source unit of the target channel in the light source module that is in operation among multiple light source modules, so as to output a corresponding number of optical carriers. It should be noted that this embodiment does not limit the number of target light source units that are turned on, that is, this embodiment does not limit the number of optical carriers emitted from the current target light source module to the silicon photonics processing PIC unit. It can be selected by the user. For example, if the silicon photonics processing PIC unit needs to perform inter-carrier modulation processing of eight target wavelengths, then eight target light source units in the current target light source module can be turned on for processing by the silicon photonics processing PIC unit.

[0038] In one possible implementation, taking the transmission direction as an example, after selecting a target light source module that matches the target wavelength based on user requirements, this embodiment can send an enable signal to the target light source units in the target light source module through the control module, thereby activating a certain number of target light source units in the target light source module, that is, selecting the corresponding optical carrier transmission channel in the target light source module to realize the generation and emission of the optical carrier. In this embodiment, the optical carrier is transmitted to the optical engine module through the optical fiber communication connection module, and is processed by the silicon photonics (PIC) unit to obtain multiple modulated optical signals.

[0039] It should be noted that this embodiment does not limit the number of modulated optical signals, which can be flexibly set by the user, for example, 16 or 32.

[0040] In another possible implementation, taking the receiving direction as an example, the silicon photonics processing (PIC) unit in this embodiment is also used to receive the peer-modulated optical signal from the current CPO optical engine device communication peer, and generate a reference electrical signal based on the peer-modulated optical signal.

[0041] Based on this, the CPO optical engine device provided in this embodiment has a built-in light source without changing the shape of the CPO. At the same time, it integrates an optical module and realizes the transmission of optical carrier to the PIC chip through an optical fiber communication connection module. This allows the collaborative processing between the CPO and the light source to be completed inside the device, thereby saving front panel resources of the switch or server equipment and reducing the design complexity of the switch or server.

[0042] Please refer to Figure 3 , Figure 3This diagram illustrates another structural schematic of the CPO light engine device provided in an embodiment of the present invention. In this embodiment, each light source module 103, in addition to the light source unit 202, also includes a temperature control unit 203 and a temperature acquisition unit 204. In this embodiment, the temperature control unit 203 is fixed to the inner wall of the outer casing 101, and the hot end of the temperature control unit 203 is in contact with the inner wall of the outer casing 101. Multiple light source units 202 and the temperature acquisition unit 204 are fixed to the cold end of the temperature control unit 203, and the temperature acquisition unit 204 is located at the center of the area where multiple light source units 202 are located. The control module is also connected to the control terminal of the temperature control unit 203 and the output terminal of the temperature acquisition unit 204.

[0043] For any target light source module, the temperature acquisition unit 204 is used to acquire the temperature data of the current target light source module.

[0044] The control module 104 is used to receive temperature data from each target light source module and send control commands to the corresponding temperature control unit based on the temperature data to adjust the temperature of the current target light source module so that each target light source module is in a constant temperature state.

[0045] It should be noted that this embodiment does not limit the implementation method and structure of the temperature control unit, temperature acquisition unit, etc. In one possible implementation, the control module in this embodiment can adjust the temperature of the light source module by adjusting the operating current of the temperature control unit.

[0046] In one possible implementation, the temperature control unit in this embodiment may include a thermoelectric cooler (TEC). In this embodiment, each light source unit in each light source module is attached to the cold end of the thermoelectric cooler, while the hot end of the thermoelectric cooler is in contact with and fixed to the inner wall of the housing.

[0047] To reduce the device size of the light source module, in this embodiment, the light source unit can be a laser chip. At the same time, each laser chip is eutectic-bonded onto a ceramic substrate to form a COC structure. Subsequently, the COC structure is mounted on the cold end of a thermoelectric cooler to adjust the temperature of the current light source module through the thermoelectric cooler.

[0048] In this embodiment, the temperature acquisition unit can be a thermistor. The thermistor is set at the center of the area where multiple light source units are located to acquire the average temperature of the current light source module, obtain temperature data, and send the temperature data to the control module. The control module can then improve the temperature of the current light source module based on the temperature control unit, thereby achieving stable laser power output that is not affected by changes in the external ambient temperature.

[0049] In addition, to further improve the heat dissipation performance of the CPO light engine device, this embodiment can provide thermal conductive gel or thermal conductive pad between the light engine module and the inner wall of the housing to conduct the heat generated by the light engine module to the housing and then conduct it away through the housing.

[0050] In one possible implementation, the outer casing in this embodiment may be made of a tungsten-copper alloy material, or other materials with high thermal conductivity and low coefficient of thermal expansion.

[0051] Please continue to refer to this. Figure 3 In this embodiment, the light source module 103 further includes multiple lenses 205, each lens 205 corresponding to a light source unit 202. The optical fiber communication connection module 105 includes at least a light source side optical fiber array unit 206, which includes multiple transmission optical fibers, each transmission optical fiber corresponding to a light source unit 202. The lens 205 is disposed on the straight line of the light output optical axis of each light source unit 202 and is located between each light source unit 202 and the fiber core end face of the corresponding transmission optical fiber.

[0052] In this embodiment, the fiber core end face is used to characterize the plane exposed after the optical fiber is cut, which is perpendicular to the optical fiber axis. The fiber core end face of the transmission optical fiber is located on the image-side focal plane of the lens.

[0053] Based on this, in this embodiment, the emitted light from each target light source unit can be coupled to the corresponding transmission fiber in the corresponding light source side fiber array unit through a lens.

[0054] Furthermore, to prevent reflected light from returning to the target light source unit in the outgoing light path, thereby affecting the normal operation of the light source module, please refer to [further details]. Figure 3 In this embodiment, the light source module 103 further includes an isolator 207, which is disposed between the optical path between each light source unit 202 and the lens 205 and / or between the lens 205 and each transmission fiber; wherein, the optical axis of the isolator 207 is coaxial with the light output optical axis of each light source unit 202, the optical axis of the lens 205 and the fiber core axis of each transmission fiber.

[0055] Please continue to refer to this. Figure 3 In this embodiment, the CPO light engine device 10 also includes a power supply module 107, which is disposed on the substrate 102 and connected to the power port of the substrate 102 through a flexible circuit board FPC.

[0056] In this embodiment, the operating current of each light source module can be provided by the light source power supply board. In order not to change the shape of CPO, the light source power supply board can be directly attached to the inner wall of the housing to provide power to each light source module and other devices.

[0057] In one possible implementation, the power supply board for the light source in this embodiment can be connected to the power ports of each light source module via wire bonding. To ensure a reliable and stable electrical connection, the power supply board also includes a flexible printed circuit board (FPC) connector, which connects to the power ports of the substrate via the FPC. In this embodiment, the connection between the FPC and the substrate can be achieved through soldering or by using a rigid-flex PCB.

[0058] After the control module turns on the target light source unit, the emitted light from each target light source unit is dispersed and needs to be collimated / focused before it can enter the light engine module.

[0059] In one possible implementation, the fiber optic communication connection module in this embodiment can be implemented by a fiber optic array unit (FAU). Each FAU includes multiple transmission fibers, and each transmission fiber can be divided into various functional pigtails according to its function, including but not limited to transmit input pigtails, transmit output pigtails, and receive input pigtails. In this embodiment, each transmission fiber of the FAU is coiled and arranged in a guide groove in the housing.

[0060] Furthermore, to secure the various units within the light source module to the inner wall of the housing, this embodiment can create multiple grooves on the inner wall to accommodate the light source unit, lens, and isolator, thereby ensuring a stable optical transmission link. Simultaneously, to prevent interference from other components in the CPO optical engine device on the optical transmission links, please refer to... Figure 4 , Figure 4 This diagram shows another structural schematic of the CPO light engine device provided in an embodiment of the present invention. In this embodiment, the CPO light engine device 10 further includes a partition frame 208 and a first fixing member 209. The partition frame 208 is fixed inside the outer shell 101 by the first fixing member 209.

[0061] The orthographic projection area of ​​each light source module 103 on the housing 101 is located within the orthographic projection area of ​​the partition frame 208 on the housing 101.

[0062] Based on this, in this embodiment, the light source unit, lens and isolator and other devices can be separated by a partition frame to avoid damage and contamination to the internal wiring and optical end face of the light source side during subsequent assembly operations.

[0063] In one possible implementation, the first fastener 209 in this embodiment can be matched with the U-shaped groove and positioning post provided on the housing 101 and the partition frame 208, thereby fixing the partition frame 208 through the U-shaped groove and positioning post.

[0064] In another possible implementation, the arrangement between the housing 101 and the partition frame 208 can also be assembled by structural adhesive bonding or low-temperature solder welding.

[0065] Please refer to Figure 5 , Figure 5 This diagram illustrates another structural schematic of the CPO optical engine device provided in this embodiment of the invention. In this embodiment, the CPO optical engine device 10 further includes a second fixing member 210. The second fixing member 210 includes a plurality of U-shaped grooves disposed on the inner wall of the outer shell 101 and a plurality of positioning posts disposed on the surface of the substrate 102, so as to fix the substrate 102 inside the outer shell 101 through the cooperation between the positioning posts and the corresponding U-shaped grooves.

[0066] In this embodiment, positioning posts and U-shaped grooves for assembly positioning are provided on the outer shell and the substrate. The mutual positioning between the outer shell and the substrate is achieved through the cooperation between the positioning posts and the U-shaped grooves, thereby ensuring that the relative position between the two meets the requirements.

[0067] In one possible implementation, the housing and the substrate can be assembled using structural adhesive or by low-temperature soldering.

[0068] To transmit the optical carrier to the optical engine module, please refer to... Figure 6 , Figure 6 This paper shows another structural schematic diagram of the CPO optical engine device provided in an embodiment of the present invention. In this embodiment, the optical fiber communication connection module 105 includes not only the light source side optical fiber array unit, but also the optical engine side optical fiber array unit 211. The optical engine side optical fiber array unit 211 is fixed on the substrate 102. The optical engine side optical fiber array unit 211 includes a transmit input pigtail, a transmit output pigtail, and a receive input pigtail.

[0069] The pigtail of the light source-side fiber array unit 206 is connected to the first end of the transmit input pigtail. The second end of the transmit input pigtail is connected to the light source input of the silicon photonics processing (PIC) unit in the optical engine module 106; the light source output of the PIC unit is connected to the first end of the transmit output pigtail, and the second end of the transmit output pigtail serves as the output port of the CPO optical engine device, connected to the communication counterpart of the current CPO optical engine device via a fiber optic patch cord.

[0070] The first end of the receiving end input pigtail serves as the input port of the CPO optical engine device, and is connected to the communication peer of the current CPO optical engine device via an optical fiber patch cord to receive the modulated optical signal from the peer of the current CPO optical engine device; the second end of the receiving end input pigtail is connected to the modulation receiver of the silicon photonics processing (PIC) unit.

[0071] To avoid interference from multiple transmission fibers in the light source-side fiber array unit and the optical engine-side fiber array unit, in this embodiment, each transmission fiber of the light source-side fiber array unit and the optical engine-side fiber array unit is coiled in the guide groove of the housing.

[0072] This embodiment does not limit the connection relationship between the pigtails. In one possible implementation, the connection between the pigtail of the light source-side fiber array unit and the first end of the pigtail of the transmitter input end can be achieved by fusion splicing. That is, the two ends are fused together by a fusion splicer, and then a coating machine is used to coat the fusion splice position. The coated fiber is then coiled up above the partition frame. In another possible implementation, this embodiment can also use other miniature connectors to achieve the connection between the two.

[0073] In one possible implementation method, please refer to Figure 7 , Figure 7 A schematic diagram of a silicon photonics processing (PIC) unit 201 provided in an embodiment of the present invention is shown. The PIC unit includes at least an optical splitter waveguide assembly 301, multiple modulators 302, and multiple photodetectors 303. In this embodiment, the total number of modulators is the same as the total number of photodetectors to achieve equivalent bidirectional communication.

[0074] In this embodiment, the output terminal of the optical splitter waveguide assembly 301 is connected to the input terminal of each modulator 302, and the input terminal of the optical splitter waveguide assembly 301 is connected to the output terminal of each light source unit in the light source module 103; the control terminal of each modulator obtains the target electrical signal through the electrical interface of the substrate, and the target electrical signal is used to characterize the input electrical signal on the switch / server ASIC chip side.

[0075] The optical splitter waveguide assembly 301 is used to receive each optical carrier and generate multiple branch optical carriers based on each optical carrier; A modulator is used to generate a corresponding number of modulated optical signals based on each branch optical carrier and the target electrical signal; The photodetector 303 is used to receive the modulated optical signal from the peer of the current CPO optical engine device and convert the modulated optical signal into a reference electrical signal, which is then fed back to the switch / server ASIC chip through the electrical interface of the substrate.

[0076] Based on this, taking the transmission direction as an example, the optical carrier transmission principle in the CPO optical engine device in this embodiment is as follows: Each target light source unit sends an optical carrier to the optical engine module. The optical carrier is collimated / focused by a lens and enters the pigtail of the fiber array unit on the light source side. Subsequently, it enters the silicon photonics (PIC) processing unit in the optical engine module through the pigtail at the transmit input end of the fiber array unit on the optical engine side for modulation processing. That is, it is evenly divided into multiple optical carriers through the optical splitter waveguide component and enters the modulator. For example, 8 optical carriers are divided into 16 / 32 channels, and then modulated by the modulator to output 16 / 32 channels of modulated optical signals. The modulated optical signals are then coupled to the transmit output pigtail and finally transmitted to the communication peer through the output port of the CPO optical engine device via the fiber optic patch cord.

[0077] Taking the receiving direction as an example, the modulated optical signal transmitted from the other end enters through the input port of the CPO optical engine device and is coupled to the input pigtail of the receiving end. The signal is then transmitted through the pigtail to the optical receiving port of the silicon photonics processing (PIC) unit, where it is converted from light to light by each photodetector to obtain a reference electrical signal. This reference electrical signal is then fed back to the switch / server ASIC chip through the interface electrical interface of the substrate.

[0078] In summary, please refer to the following: Figure 8 , Figure 8 A schematic diagram of the structure of the CPO optical engine device provided in an embodiment of the present invention is shown. Figure 8 A schematic diagram of a CPO optical engine device after fiber splicing and coiling is shown. This CPO optical engine device directly realizes the transmission of optical carrier to PIC chip through optical fiber communication connection module inside the optical engine, so as to simplify the complexity of the equipment system where CPO is located and save equipment resources.

[0079] Following the same approach as the previous embodiment, the present invention also provides a CPO optical engine system, including the CPO optical engine device of any of the first aspects described above, so as to save front panel resources of switches or server equipment by integrating optical modules, and at the same time realize the transmission of optical carrier to PIC chip directly inside the optical engine through optical fiber communication connection modules, thereby simplifying the complexity of the equipment system in which the CPO is located and saving equipment resources.

[0080] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative; for example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0081] In addition, the functional modules in the various embodiments of the present invention can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0082] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0083] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A CPO light engine device, characterized in that, The CPO optical engine device includes: a housing, a substrate, and multiple light source modules. The substrate and each of the light source modules are fixed inside the housing. The substrate is also provided with a control module, an optical fiber communication connection module, and an optical engine module. The optical engine module includes at least a silicon photonics processing (PIC) unit. Each light source module includes multiple light source units, and each light source unit is fixed to the inner wall of the housing. The control module is connected to the enable terminal of each light source unit, and each light source unit is optically connected to the silicon photonics processing (PIC) unit through the optical fiber communication connection module. For any target light source module, the control module is used to send an enable signal to the target light source unit in the target light source module to turn on the target light source unit; the target light source module is used to characterize the light source module in the working state among the plurality of light source modules; Each of the target light source units is used to send an optical carrier to the optical engine module; The silicon photonics (PIC) processing unit is used to receive the optical carrier and generate multiple modulated optical signals based on the optical carrier. Alternatively, the silicon photonics processing (PIC) unit may also be used to receive the peer-modulated optical signal from the current CPO optical engine device communication peer, and generate a reference electrical signal based on the peer-modulated optical signal.

2. The CPO light engine device according to claim 1, characterized in that, Each light source module also includes a temperature control unit and a temperature acquisition unit. The temperature control unit is fixed to the inner wall of the housing, and the hot end of the temperature control unit is in contact with the inner wall of the housing. The multiple light source units and the temperature acquisition unit are fixed to the cold end of the temperature control unit, and the temperature acquisition unit is located at the center of the area where the multiple light source units are located. The control module is also connected to the control terminal of the temperature control unit and the output terminal of the temperature acquisition unit. For any target light source module, the temperature acquisition unit is used to acquire the temperature data of the current target light source module; The control module is used to receive temperature data of the target light source module and send control commands to the corresponding temperature control unit based on the temperature data to adjust the temperature of the current target light source module so that each target light source module is in a constant temperature state.

3. The CPO light engine device according to claim 1 or 2, characterized in that, The light source module further includes a lens, and the optical fiber communication connection module includes at least a light source-side optical fiber array unit. The light source-side optical fiber array unit includes multiple transmission optical fibers, each transmission optical fiber corresponding to a light source unit. The lens is disposed on the straight line of the light output optical axis of each light source unit and is located between each light source unit and the fiber core end face of the corresponding transmission optical fiber. The fiber core end face of the transmission optical fiber is located on the image-side focal plane of the lens.

4. The CPO light engine device according to claim 3, characterized in that, The light source module further includes an isolator, which is disposed between the optical path between each of the light source units and the lens and / or between the lens and each of the transmission optical fibers; wherein the optical axis of the isolator is coaxial with the light output optical axis of each of the light source units, the optical axis of the lens, and the core axis of each of the transmission optical fibers.

5. The CPO light engine device according to claim 1 or 2, characterized in that, When each of the light source modules is disposed in the multiple recesses of the housing, the CPO light engine device further includes a partition frame and a first fixing member, the partition frame being fixed inside the housing by the first fixing member; The orthographic projection area of ​​each of the light source modules on the housing is located within the orthographic projection area of ​​the partition frame on the housing.

6. The CPO optical engine device according to claim 1 or 2, characterized in that, The silicon photonics processing (PIC) unit includes at least an optical splitter waveguide assembly, multiple modulators, and multiple photodetectors, wherein the total number of modulators is the same as the total number of photodetectors; the output terminal of the optical splitter waveguide assembly is connected to the input terminal of each modulator, and the input terminal of the optical splitter waveguide assembly is connected to the output terminal of each light source unit; the control terminal of each modulator acquires a target electrical signal through the electrical interface of the substrate, and the target electrical signal is used to characterize the input electrical signal on the switch / server ASIC chip side; The optical splitter waveguide assembly is used to receive each of the optical carriers and generate multiple branch optical carriers based on each of the optical carriers; The modulator is used to generate a corresponding number of modulated optical signals based on each of the branch optical carriers and the target electrical signal; The photodetector is used to receive the modulated optical signal from the peer of the current CPO optical engine device and convert the modulated optical signal into a reference electrical signal, which is then fed back to the switch / server ASIC chip through the electrical interface of the substrate.

7. The CPO light engine device according to claim 1, characterized in that, The optical fiber communication connection module includes at least a light source-side optical fiber array unit and an optical engine-side optical fiber array unit. Both the light source-side optical fiber array unit and the optical engine-side optical fiber array unit are fixed inside the housing. The optical engine-side optical fiber array unit includes a transmit input pigtail, a transmit output pigtail, and a receive input pigtail. The pigtail of the light source side fiber array unit is connected to the first end of the transmit input pigtail; the second end of the transmit input pigtail is connected to the light source input end of the silicon photonics processing PIC unit; the light source output end of the silicon photonics processing PIC unit is connected to the first end of the transmit output pigtail, and the second end of the transmit output pigtail serves as the output port of the CPO optical engine device, and is connected to the communication counterpart of the current CPO optical engine device through an optical fiber patch cord. The first end of the receiving end input pigtail serves as the input port of the CPO optical engine device, and is connected to the communication peer of the current CPO optical engine device via an optical fiber patch cord to receive the modulated optical signal from the peer of the current CPO optical engine device; the second end of the receiving end input pigtail is connected to the modulation receiver of the silicon photonics processing (PIC) unit.

8. The CPO light engine device according to claim 1 or 2, characterized in that, The CPO optical engine device further includes a second fixing member, which includes a plurality of U-shaped grooves disposed on the inner wall of the housing and a plurality of positioning posts correspondingly disposed on the surface of the substrate, so as to fix the substrate inside the housing through the cooperation between the positioning posts and the corresponding U-shaped grooves.

9. The CPO optical engine device according to claim 1 or 2, characterized in that, The CPO optical engine device further includes a power supply module, which is disposed on the substrate and connected to the power port of the substrate via a flexible circuit board.

10. A CPO light engine system, characterized in that, Includes the CPO light engine device as described in any one of claims 1 to 9.

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