Movement module and electronic device

Abstract

The application mainly relates to a movement module and an electronic device. The movement module comprises a movement shell, a loudspeaker and a support. The support and the loudspeaker surround to form an acoustic cavity. The inside of the loudspeaker is provided with a first containing space which is communicated with the acoustic cavity. The loudspeaker, the support and the movement shell further cooperate outside the loudspeaker to form a second containing space which is not communicated with the acoustic cavity. The loudspeaker comprises a coil, a spider and a metal piece arranged on the spider. The number of the metal pieces is two. Each metal piece comprises a first soldering pad, a second soldering pad and a transition part. The first soldering pad and the second soldering pad are exposed from the spider. The first soldering pad is located in the first containing space and connected with the coil. The second soldering pad is located in the second containing space, which is beneficial to avoid the movement module from being burnt.

Description

[0001] This application is a divisional application of Chinese patent application filed on December 30, 2022, with application number 202280092222.3 and the invention title "Mechanical Module and Electronic Device". Technical Field

[0002] This application relates to the technical field of electronic devices, specifically to mechanism modules and electronic devices. Background Technology

[0003] With the increasing popularity of electronic devices, they have become indispensable social and entertainment tools in people's daily lives, and people's demands for electronic devices are also getting higher and higher. Electronic devices such as headphones and smart glasses are also widely used in people's daily lives. They can be used in conjunction with terminal devices such as mobile phones and computers to provide users with an auditory feast. Summary of the Invention

[0004] This application provides a mechanism module, which includes a mechanism housing, a speaker and a bracket disposed within the mechanism housing, the bracket and the speaker forming an acoustic cavity, the acoustic cavity being in communication with the external environment, the speaker having a first accommodating space communicating with the acoustic cavity inside, the speaker, the bracket and the mechanism housing further cooperating outside the speaker to form a second accommodating space not communicating with the acoustic cavity, the speaker including a coil, a frame and two metal parts disposed on the frame, one of which serves as the positive terminal of the speaker and the other as the negative terminal of the speaker, each metal part including a first pad and a second pad, and a transition portion connecting the first pad and the second pad, the first pad and the second pad being exposed from the frame, the first pad being located within the first accommodating space and connected to the coil, and the second pad being located within the second accommodating space.

[0005] In some implementations, the spacing between the first pads of the two metal parts is greater than the spacing between the second pads of the two metal parts.

[0006] In some embodiments, the transition portion is embedded within the basin frame, or the transition portion is waterproofly sealed onto the basin frame.

[0007] In some embodiments, the second pads of the two metal parts are arranged side by side and spaced apart, one end of each transition portion is connected to the corresponding second pad, the two transition portions extend in a direction away from each other, and each first pad is connected to the other end of the corresponding transition portion.

[0008] In some embodiments, the loudspeaker includes a magnetic shield and a magnet disposed within the magnetic shield, the magnet and the magnetic shield forming a magnetic gap, a coil extending into the magnetic gap, a frame including an annular peripheral wall and an annular flange connected to the inner wall surface of the annular peripheral wall, and a boss disposed at the connection between the annular flange and the annular peripheral wall, the magnetic shield being fixed on the annular flange, the boss being used to support a metal component, and a second solder pad being exposed from the boss.

[0009] In some embodiments, two bosses are provided circumferentially along the annular peripheral wall, and each boss supports a metal part.

[0010] In some embodiments, the basket has a major axis and a minor axis that are perpendicular to the vibration direction of the speaker and orthogonal to each other, the size of the basket in the major axis direction is larger than the size of the basket in the minor axis direction, and the two metal parts are located at the same end of the basket in the major axis direction.

[0011] In some embodiments, the movement housing is provided with an acoustic hole, and the bracket and the movement housing cooperate to form a first adhesive groove surrounding at least a portion of the acoustic hole. The first adhesive groove contains a first adhesive for sealing the assembly gap between the bracket and the movement housing.

[0012] In some embodiments, the basin stand includes a first annular platform and a second annular platform arranged in a stepped manner. The second annular platform surrounds the periphery of the first annular platform. A portion of the lower end of the support is supported on the first annular platform, and another portion of the lower end of the support forms a gap area with the second annular platform, such that the support, the basin stand, and the core housing cooperate to form a second adhesive groove. The second adhesive groove contains a second adhesive for sealing the assembly gap between any two of the support, the basin stand, and the core housing.

[0013] In some embodiments, the loudspeaker includes a magnetic shield connected to a frame, with the upper end of a bracket resting on the frame and cooperating with the frame and the magnetic shield to form a third adhesive reservoir containing a third adhesive for sealing the assembly gap between the bracket, the frame, and the magnetic shield.

[0014] This application provides an electronic device, which includes a support component and the aforementioned movement module. The support component is connected to the movement housing to support the movement module when worn in the wearing position. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1This is a schematic diagram of the front outline of the user's ear as described in this application; Figure 2 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application; Figure 3 yes Figure 2 A schematic diagram of an embodiment of the earphone in the wearing state; Figure 4 yes Figure 2 A structural schematic diagram of the headphones from one perspective; Figure 5 yes Figure 2 A structural diagram of the earphone from another perspective; Figure 6 yes Figure 2 A structural schematic diagram of the headphone from another perspective; Figure 7 This is a schematic diagram of an embodiment of the auxiliary structure provided in this application; Figure 8 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application; Figure 9 yes Figure 8 A structural schematic diagram of the headphones from one perspective; Figure 10 yes Figure 8 A structural diagram of the earphone from another perspective; Figure 11 This is a schematic diagram of the structure of an embodiment of the headphones provided in this application; Figure 12 This is a comparison diagram of frequency response curves measured at the same listening position when the core module is located at different positions on the ear in one embodiment of the headphones provided in this application. Figure 13 yes Figure 10 A schematic cross-sectional view of an embodiment of the earphone along the B1-B1 cutting direction; Figure 14 This is a schematic diagram of the structure of one embodiment of the movement housing provided in this application; Figure 15 This is a schematic diagram of the structure of one embodiment of the movement housing provided in this application; Figure 16 This is a schematic diagram of the structure of one embodiment of the bracket provided in this application; Figure 17 yes Figure 13 An enlarged structural schematic diagram of a middle earphone embodiment in region C1; Figure 18 yes Figure 13 An enlarged structural schematic diagram of a middle earphone embodiment in region C2; Figure 19 This is an exploded structural diagram of an embodiment of the loudspeaker provided in this application; Figure 20 yes Figure 19 A schematic cross-sectional view of an embodiment of a loudspeaker along the B2-B2 section direction; Figure 21 yes Figure 19 A cross-sectional view of an embodiment of a loudspeaker along the B3-B3 section direction; Figure 22 yes Figure 21 A magnified schematic diagram of an embodiment of a central loudspeaker in region C3; Figure 23 yes Figure 19 A partial structural schematic diagram of an embodiment of a loudspeaker; Figure 24 yes Figure 19 A schematic diagram of the cross-sectional structure of an embodiment of the middle basin frame along the B2-B2 section direction; Figure 25 yes Figure 19 An exploded view of one embodiment of the basin stand. Detailed Implementation

[0017] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0018] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0019] Combination Figure 1 The user's ear 100 may include physiological parts such as the external auditory canal 101, concha 102, cymba conchae 103, triangular fossa 104, antihelix 105, scaphoid fossa 106, helix 107, and antitragus 108. While the external auditory canal 101 has a certain depth and extends to the tympanic membrane of the ear, for ease of description and in conjunction with... Figure 1 Unless otherwise specified, the external auditory canal 101 in this application specifically refers to its entrance (i.e., ear hole) away from the tympanic membrane. Furthermore, physiological sites such as the concha 102, cymba concha 103, and triangular fossa 104 have a certain volume and depth; and the concha 102 is directly connected to the external auditory canal 101, which means that the aforementioned ear hole can be simply regarded as being located at the bottom of the concha 102.

[0020] Furthermore, individual differences may exist among different users, resulting in variations in ear shape, size, and other dimensional differences. To facilitate description and reduce (or even eliminate) these individual differences, a simulator containing a head and its (left and right) ears can be manufactured based on ANSI: S3.36, S3.25 and IEC: 60318-7 standards, such as the GRAS 45BC KEMAR. Therefore, in this application, descriptions such as "user wearing headphones," "headphones in wearing state," and "in wearing state" refer to the headphones described in this application being worn on the ears of the aforementioned simulator. Of course, due to individual differences among users, the headphones worn by different users may differ somewhat from those worn on the ears of the aforementioned simulator, but such differences should be tolerable.

[0021] It should be noted that in medicine, anatomy, and other fields, the human body can be defined by three basic planes: the sagittal plane, the coronal plane, and the horizontal plane; and three basic axes: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane is a section perpendicular to the ground along the anteroposterior direction of the body, dividing the body into left and right parts. The coronal plane is a section perpendicular to the ground along the left-right direction of the body, dividing the body into anterior and posterior parts. The horizontal plane is a section parallel to the ground along the vertical direction of the body, dividing the body into superior and inferior parts. Correspondingly, the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane; the coronal axis is the axis along the left-right direction of the body and perpendicular to the sagittal plane; and the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane. Furthermore, the "front side of the ear" mentioned in this application is a concept relative to "back side of the ear." The former refers to the side of the ear away from the head, while the latter refers to the side of the ear facing the head; both refer to the user's ear. Specifically, by observing the ear of the simulator along the direction of the human coronal axis, one can obtain... Figure 1 A schematic diagram of the front outline of the ear is shown.

[0022] As an example, combined Figure 2 and Figure 3The earphone 10 may include a mechanism module 11 and a hook-shaped structure 12 connected to the mechanism module 11. When worn, the mechanism module 11 is located at the front of the ear, and at least part of the hook-shaped structure 12 is located at the back of the ear, allowing the earphone 10 to hang on the ear when worn. The mechanism module 11 may be configured not to block the ear canal when worn, making the earphone 10 an "open-back" earphone. It is worth noting that due to individual differences among users, when the earphone 10 is worn by different users, the mechanism module 11 may partially cover the ear canal, but the ear canal will still not be completely blocked.

[0023] To improve the stability of the earphone 10 during wear, the earphone 10 can adopt any one or a combination of the following methods: First, at least a portion of the hook-shaped structure 12 is configured as a contoured structure that conforms to at least one of the back of the ear and the head, thereby increasing the contact area between the hook-shaped structure 12 and the ear and / or the head, thus increasing the resistance to the earphone 10 falling off the ear. Second, at least a portion of the hook-shaped structure 12 is configured as an elastic structure, allowing it to have a certain deformation during wear, thereby increasing the positive pressure of the hook-shaped structure 12 on the ear and / or the head, thus increasing the resistance to the earphone 10 falling off the ear. Third, at least a portion of the hook-shaped structure 12 is configured to rest against the head during wear, creating a reaction force that holds the ear, causing the core module 11 to be held against the front of the ear, thereby increasing the resistance to the earphone 10 falling off the ear. Fourth, the mechanism module 11 and the hook structure 12 are configured to clamp the physiological parts such as the antihelix and conchae from the front and back sides of the ear when worn, thereby increasing the resistance to the earphone 10 falling off the ear. Fifth, the mechanism module 11 or the auxiliary structure connected to it is configured to extend at least partially into the physiological parts such as the conchae, cymba conchae, triangular fossa, and scaphoid fossa, thereby increasing the resistance to the earphone 10 falling off the ear.

[0024] As an example, combined Figures 2 to 3The earphone 10 may include an auxiliary structure 15 connected to the mechanism module 11. At least a portion of the auxiliary structure 15 is located on the front side of the ear when worn, meaning that at least a portion of the auxiliary structure 15 and the mechanism module 11 are located on the same side of the ear when worn, thus assisting the mechanism module 11 when worn. Specifically, when worn, the mechanism module 11 presses against the first ear region corresponding to the cymba concha, and the auxiliary structure 15 presses against the second ear region corresponding to the antihelix; that is, the mechanism module 11 and the auxiliary structure 15 press against different areas of the ear. Thus, compared to the earphone 10 only having the mechanism module 11, the earphone 10 further includes an auxiliary structure 15 that cooperates with the mechanism module 11. This not only increases the contact area between the earphone 10 and the front side of the ear but also avoids the force between the earphone 10 and the front side of the ear being concentrated in a small area, which helps improve the stability and comfort of the earphone 10 when worn. In addition, when viewed along the thickness direction of the core module 11, the distance between the auxiliary structure 15 and the hook structure 12 is smaller than the distance between the core module 11 and the hook structure 12. This reduces the shear stress generated by the clamping force of the earphone 10 on the ear, and even transforms it into compressive stress. This helps improve the stability and comfort of the earphone 10 when worn. The thickness direction X can be defined as the direction in which the core module 11 moves closer to or further away from the ear when worn.

[0025] Furthermore, the auxiliary structure 15 can be detachably connected to the mechanism module 11 via any of the following methods: snap-fit, double-sided adhesive, or threads. The earphone 10 can be equipped with multiple auxiliary structures 15 of the same or different specifications to facilitate replacement or use by different users.

[0026] As an example, combined Figure 3 When worn, and observed along the thickness direction X, the extension direction of the auxiliary structure 15 (e.g.) Figure 3 The dashed arrow A1 points behind the head and in the direction perpendicular to the body's axis, pointing directly to the top of the head (e.g., ...). Figure 3 The angle between the dashed arrow A2) is an acute angle. This not only makes it easier for the auxiliary structure 15 to press against the ear area corresponding to the antihelix, but also allows the auxiliary structure 15 to press against the larger central area of ​​the antihelix, which helps improve the stability and comfort of the earphone 10 when worn.

[0027] As an example, combined Figures 2 to 6The movement module 11 may have a first inner surface IS1 facing the ear along the thickness direction X and a first outer surface OS1 facing away from the ear when worn, as well as a connecting surface connecting the first inner surface IS1 and the first outer surface OS1. The auxiliary structure 15 may be connected to at least the aforementioned connecting surface; for example, the auxiliary structure 15 may be connected only to the aforementioned connecting surface, or the auxiliary structure 15 may be connected not only to the aforementioned connecting surface but also further connected to the first outer surface OS1. This helps to control the distance between the auxiliary structure 15 and the hook-shaped structure 12 in the thickness direction X within a reasonable range, avoiding situations where the distance is too small, resulting in excessive holding force at the auxiliary structure 15, or too large, resulting in insufficient holding force at the auxiliary structure 15.

[0028] It should be noted that, viewed along the thickness direction X, the movement module 11 can be shaped as a circle, ellipse, rounded square, or rounded rectangle. When the movement module 11 is circular or elliptical, the aforementioned connecting surface can refer to the curved side of the movement module 11; while when the movement module 11 is rounded square or rounded rectangle, the aforementioned connecting surface can include the lower side LS, upper side US, front side FS, and rear side RS mentioned later. Furthermore, the movement module 11 can have a length direction Y and a width direction Z that are perpendicular to the thickness direction X and orthogonal to each other. The length direction Y can be defined as the direction in which the movement module 11 approaches or moves away from the back of the user's head when worn, and the width direction Z can be defined as the direction in which the movement module 11 approaches or moves away from the top of the user's head when worn. Therefore, for ease of description, this application uses a rounded rectangle shape as an example for illustrative purposes. The length of the movement module 11 in the length direction Y can be greater than the width of the movement module 11 in the width direction Z. Based on this, the aforementioned connecting surfaces may include an upper surface US facing away from the external auditory canal along the width direction Z and a lower surface LS facing towards the external auditory canal in the wearing state, and a posterior surface RS facing towards the back of the head and an anterior surface FS facing away from the back of the head along the length direction Y in the wearing state. The auxiliary structure 15 may be connected to at least the posterior surface RS; for example, the auxiliary structure 15 may be connected only to the posterior surface RS, or, for another example, the auxiliary structure 15 may be connected not only to the posterior surface RS but also further connected to the upper surface US. This allows the auxiliary structure 15 to primarily press against the larger central area of ​​the antihelix.

[0029] Furthermore, the thickness of the auxiliary structure 15 can be smaller than the thickness of the core module 11 in the thickness direction, in order to balance the weight and size of the earphone 10. Specifically, when viewed along the length direction Y or the width direction Z, the connection point between the auxiliary structure 15 and the core module 11 can be located between one-third and two-thirds of the thickness of the core module 11 in the thickness direction X. For example, the connection point between the auxiliary structure 15 and the core module 11 is located at half the thickness of the core module 11 in the thickness direction X. This helps to control the distance between the auxiliary structure 15 and the hook structure 12 in the thickness direction X within a reasonable range, avoiding situations where the distance is too small, resulting in excessive holding force at the auxiliary structure 15, or too large, resulting in insufficient holding force at the auxiliary structure 15.

[0030] As an example, for example Figure 5 and Figure 6 For example, Figure 9 and Figure 10 The hook-shaped structure 12 and the auxiliary structure 15 are staggered in the thickness direction X. In this way, the earphone 10 can better fit the thickness of the ear, which not only helps to avoid the auxiliary structure 15 exerting too much pressure on the helix and causing discomfort, but also helps to prevent the auxiliary structure 15 from lifting the core module 11 and causing instability.

[0031] As an example, combined Figure 7 The auxiliary structure 15 may include a connecting portion 151 connected to the core module 11 and an extension portion 152 connected to the connecting portion 151. The auxiliary structure 15 can contact the anti-heel through the extension portion 152. The hardness of the extension portion 152 can be less than that of the core module 11; for example, the material of the extension portion 152 may be plastic or rubber. Thus, the extension portion 152 can undergo different elastic deformations when the earphone 10 is worn by different users, ensuring that the holding force of the auxiliary structure 15 at the anti-heel is appropriate. Of course, the hardness of the connecting portion 151 can also be less than that of the core module 11 (specifically, the core housing 111 mentioned later); for example, the material of the connecting portion 151 may be the same as that of the extension portion 152. Accordingly, the connection between the connecting portion 151 and the core module 11 can be configured as either detachable or non-detachable, depending on requirements.

[0032] Furthermore, the auxiliary structure 15 may include a flexible insert 153 connected to the extension portion 152. The flexible insert 153 may be disposed within the extension portion 152 or on the side of the extension portion 152 facing the antihelix. The hardness of the flexible insert 153 may be less than that of the extension portion 152, making the portion of the auxiliary structure 15 in contact with the antihelix more flexible. This improves the stability and comfort of the earphone 10 when worn.

[0033] As an example, combined Figure 5 and Figure 6 The aforementioned connecting surface may be provided with a mounting groove extending circumferentially along the movement module 11, and the connecting part 151 is fixed within the aforementioned mounting groove. The aforementioned mounting groove may be annular, and the connecting part 151 may also be configured as a matching annular structure (e.g., Figure 7 As shown, the connecting part 151 is nested in the aforementioned mounting groove. Of course, the aforementioned mounting groove can also be C-shaped or U-shaped. For example, the aforementioned mounting groove is set on the rear side RS and extends further to the lower side LS and the upper side US. The connecting part 151 can also be set as a matching C-shaped or U-shaped structure, and the connecting part 151 is embedded in the aforementioned mounting groove.

[0034] As an example, combined Figures 8 to 10 The connecting portion 151 can cover at least a portion of the first outer surface OS1, for example, the entire first outer surface OS1 can be covered by the connecting portion 151, that is... Figures 2 to 6 The first outer surface OS1 shown in the figure is Figures 8 to 10 It is not visible in the middle. This increases the connection area between the connecting part 151 and the movement module 11, and the two can be connected by adhesive bonding or injection molding. The extension part 152 may have a second inner surface IS2 facing the antihelix and a second outer surface OS2 facing away from the antihelix in the wearing state. At least one of the second inner surface IS2 and the second outer surface OS2 is inclined towards the antihelix in the extending direction of the auxiliary structure 15. For example, both the second inner surface IS2 and the second outer surface OS2 are inclined towards the antihelix in the extending direction of the auxiliary structure 15, that is, the extension part 152 is bent towards the first inner surface IS1 relative to the connecting part 151. This allows the extension part 152 to better contact the antihelix while also considering the thickness of the extension part 152. Furthermore, combined with... Figure 14 and Figure 15 In addition to covering at least a portion of the first outer surface OS1, the connecting portion 151 can also cover at least a portion of the aforementioned connecting surface (e.g., the rear surface RS). This not only increases the connection area between the connecting portion 151 and the movement module 11, but also improves the comfort of the movement module 11 when it contacts the ear at the rear surface RS.

[0035] As an example, combined Figure 4 and Figure 13The mechanism module 11 may include a mechanism housing 111 connected to the hook-shaped structure 12 and a speaker 112 disposed within the mechanism housing 111. When worn, the mechanism housing 111 has a sound outlet 111a on its inner side facing the ear (e.g., the first inner side IS1 mentioned above). Sound waves generated by the speaker 112 propagate through the sound outlet 111a to enter the external auditory canal. It is worth noting that the sound outlet 111a may also be located on the side of the mechanism housing 111 corresponding to the lower side LS, or at the corner between the aforementioned inner side and the lower side LS.

[0036] Furthermore, combined Figure 13 and Figures 2 to 11 The earphone 10 may include a main control circuit board 13 disposed within the core housing 111 and a battery 14 disposed at the end of the hook-shaped structure 12 away from the core module 11. The battery 14 and the speaker 112 are respectively coupled to the main control circuit board 13, so that the battery 14 can supply power to the speaker 112 under the control of the main control circuit board 13. Of course, the battery 14 and the speaker 112 may both be disposed within the core housing 111.

[0037] As an example, combined Figure 4 or Figure 11 When worn, the inner side of the housing 111 or auxiliary structure 15 (specifically, the extension 152) facing the ear may have electrode terminals 16, which can be coupled to the main control circuit board 13. There may be two electrode terminals 16, used as the positive and negative charging terminals of the earphone 10 respectively, to enable the earphone 10 to perform charging functions; or there may be three electrode terminals 16, with two used as the positive and negative charging terminals of the earphone 10 respectively, and the remaining one used as a detection terminal for the earphone 10, facilitating functions such as charging detection and detection of the earphone 10 being placed in or removed from the charging case.

[0038] As an example, combined Figure 3 and Figure 1Since the cymba conchae and the connected cavum conchae both have a certain volume and depth, after the mechanism module 11 is pressed against the ear area corresponding to the antihelix, there can be a certain distance between the inner surface of the mechanism housing 111 (such as the first inner surface IS1 mentioned above) and the cymba conchae and cavum conchae. In other words, when worn, the mechanism module 11, together with the cymba conchae and cavum conchae, can form an auxiliary cavity communicating with the external auditory canal, and the sound outlet 111a is at least partially located in the aforementioned auxiliary cavity. Thus, when worn, the sound waves generated by the speaker 112 and propagated through the sound outlet 111a are limited by the aforementioned auxiliary cavity, that is, the aforementioned auxiliary cavity can concentrate the sound waves, allowing more sound waves to propagate into the external auditory canal, thereby improving the volume and sound quality of the sound heard by the user in the near field, which is beneficial to improving the acoustic effect of the headphones 10. Furthermore, since the mechanism module 11 can be configured not to block the external auditory canal when worn, the aforementioned auxiliary cavity can be semi-open. Thus, the sound waves generated by the speaker 112 and propagated through the sound outlet 111a, in addition to most of them propagating to the external auditory canal, a small portion propagates to the outside of the earphone 10 and the ear through the gap between the mechanism module 11 and the ear (such as a part of the concha not covered by the mechanism module 11), thereby forming a first sound leakage in the far field; at the same time, the mechanism module 11 generally has an acoustic hole (such as the pressure relief hole 111c mentioned later), and the sound waves propagated through the aforementioned acoustic hole generally form a second sound leakage in the far field, and the phase of the aforementioned first sound leakage and the phase of the aforementioned second sound leakage are (close to) opposite to each other, so that the two can cancel each other out of phase in the far field, which helps to reduce the sound leakage of the earphone 10 in the far field.

[0039] Furthermore, the earphone 10 may include an adjustment mechanism connecting the core module 11 and the hook-shaped structure 12. Different users can adjust the relative position of the core module 11 on the ear using this mechanism while wearing the earphone, ensuring the core module 11 is in a suitable position, thus forming the aforementioned auxiliary cavity with the cymba concha and the concha cavity. In addition, due to the existence of the adjustment mechanism, users can also adjust the earphone 10 to achieve a more stable and comfortable fit.

[0040] As an example, combined Figure 12 First, the earphone 10 is worn on the simulator. Then, the position of the mechanism module 11 on the ear of the simulator is adjusted. Then, the frequency response curve of the earphone 10 is measured by a detector (e.g., a microphone) placed in the ear canal of the simulator (e.g., the location of the eardrum, i.e., the hearing position), thereby simulating the listening effect after the user wears the earphone 10. The aforementioned frequency response curve can be used to characterize the relationship between vibration magnitude and frequency; the horizontal axis of the aforementioned frequency response curve can represent frequency, in Hz; the vertical axis of the aforementioned frequency response curve can represent vibration magnitude, in dB. Figure 12 In the diagram, curve 12_1 represents the frequency response curve when the mechanism module 11 is not forming the aforementioned auxiliary cavity with the concha in the wearing state, and curve 12_2 represents the frequency response curve when the mechanism module 11 is in conjunction with the concha in the wearing state to form the aforementioned auxiliary cavity. Based on this, from... Figure 12 The comparison of the frequency response curves shown directly and without doubt shows that curve 12_2 is generally above curve 12_1. That is, compared to when the core module 11 does not form the aforementioned auxiliary cavity with the concha when worn, when the core module 11 forms the aforementioned auxiliary cavity with the concha when worn, it is more conducive to improving the acoustic effect of the earphone 10.

[0041] As an example, combined Figure 14 and Figure 15 The movement housing 111 may include an inner movement housing 1111 and an outer movement housing 1112 that are interlocked along the thickness direction X. When worn, the inner movement housing 1111 is closer to the ear than the outer movement housing 1112. The parting surface 111b between the outer movement housing 1112 and the inner movement housing 1111 is located away from the end of the movement module 11 connected to the hook structure 12 (hereinafter referred to as the "connection end") (e.g., ...). Figure 14 The direction indicated by the middle arrow Y) is inclined towards the side where the inner case 1111 of the movement is located. In this way, the connecting part 151 can be mainly connected to the outer case 1112 of the movement, which not only helps to increase the connection area between the auxiliary structure 15 and the movement module 11 without increasing the size of the movement module 11 in the length direction Y, but also helps to simplify the connection structure between the auxiliary structure 15 and the movement module 11.

[0042] As an example, combined Figure 14 and Figure 15 The inner housing 1111 of the movement may include a bottom wall 1113 and a first side wall 1114 connected to the bottom wall 1113. The outer housing 1112 of the movement may include a top wall 1115 and a second side wall 1116 connected to the top wall 1115. The second side wall 1116 and the first side wall 1114 are engaged with each other along the parting surface 111b, and can support each other. Specifically, viewed along the width direction Z, and in the length direction Y (specifically... Figure 14 and Figure 15In the positive direction indicated by the middle arrow Y, the portion of the first sidewall 1114 away from the aforementioned connecting end gradually approaches the bottom wall 1113 in the thickness direction X, and the portion of the second sidewall 1116 away from the aforementioned connecting end gradually moves away from the top wall 1115 in the thickness direction X, so that the scoring mold surface 111b is inclined towards the side where the inner housing 1111 of the movement is located in the direction away from the aforementioned connecting end. Accordingly, the sound outlet 111a can be provided on the bottom wall 1113. Of course, the sound outlet 111a can also be provided on the side of the first sidewall 1114 corresponding to the lower side surface LS, or it can be provided at the corner between the first sidewall 1114 and the bottom wall 1113.

[0043] Furthermore, the inner casing 1112 of the mechanism may be provided with an embedding groove 1117 located at least partially on the second side wall 1116, and the auxiliary structure 15 is partially embedded in the embedding groove 1117, so that the outer surface of the area of ​​the inner casing 1111 of the mechanism not covered by the auxiliary structure 15 is continuously transitioned with the outer surface of the auxiliary structure 15, which is beneficial to improving the continuity of the appearance of the earphone 10.

[0044] As an example, combined Figure 14 The housing 111 of the mechanism may be provided with a pressure relief hole 111c. The pressure relief hole 111c allows the space on the side of the speaker 112 facing the main control circuit board 13 to communicate with the external environment, that is, air can freely enter and exit the aforementioned space. This helps to reduce the resistance of the diaphragm of the speaker 112 during vibration. The pressure relief hole 111c can be oriented towards the top of the head when worn, which helps to prevent sound waves propagating through the pressure relief hole 111c from forming sound leakage (i.e., the aforementioned second sound leakage) and being heard. Based on the Helmholtz resonator, the aperture of the pressure relief hole 111c can be as large as possible so that the resonant frequency of the second sound leakage is shifted as high as possible to a higher frequency band (e.g., a frequency range greater than 4kHz), which further helps to prevent the second sound leakage from being heard.

[0045] Furthermore, the housing 111 can be provided with a tuning hole 111d. The tuning hole 111d shifts the resonant frequency of the second leakage sound as high as possible towards a higher frequency band (e.g., a frequency range greater than 4kHz), which helps to further prevent the second leakage sound from being heard. The area of ​​the tuning hole 111d can be smaller than the area of ​​the pressure relief hole 111c, so that more space on the side of the speaker 112 facing the main control circuit board 13 can communicate with the external environment through the pressure relief hole 111c. Furthermore, the distance between the sound outlet hole 111a and the pressure relief hole 111c in the width direction Z is greater than the distance between the sound outlet hole 111a and the tuning hole 111d in the width direction Z, to avoid the sound waves propagating through the sound outlet hole 111a and the pressure relief hole 111c respectively being out of phase and canceling each other out in the near field. This helps to increase the volume of the sound propagating through the sound outlet hole 111a heard by the user. Correspondingly, the distance between the tuning hole 111d and the sound outlet hole 111a in the length direction Y can be reasonably designed according to actual needs.

[0046] As an example, combined Figure 14 The sound outlet 111a, pressure relief hole 111c, and sound tuning hole 111d can be disposed on the inner shell 1111 of the movement. For example, the sound outlet 111a can be disposed on the bottom wall 1113, while the pressure relief hole 111c and the sound tuning hole 111d can be disposed on the first side wall 1114. The pressure relief hole 111c and the sound tuning hole 111d can be disposed on opposite sides of the first side wall 1114 along the width direction Z. Thus, since the sound outlet 111a, pressure relief hole 111c, and sound tuning hole 111d are all disposed on the inner shell 1111 of the movement, the structure of the outer shell 1112 of the movement is simplified, which helps to reduce processing costs. Furthermore, since the pressure relief hole 111c and the sound tuning hole 111d are disposed on opposite sides of the first side wall 1114 along the width direction Z, the parting surface 111b can be symmetrically disposed about a reference plane perpendicular to the width direction Z, which helps to improve the appearance quality of the movement module 11.

[0047] As an example, combined Figure 15 The mechanism module 11 may include metallic functional patterns such as an antenna pattern 1141 and / or a touch pattern 1142 disposed between the mechanism housing 1112 and the auxiliary structure 15 (e.g., the connecting portion 151). The antenna pattern 1141 may be formed on the outer side of the mechanism housing 1112 using laser-direct-structuring (LDS) technology. The touch pattern 1142 may also be formed on the outer side of the mechanism housing 1112 using laser-direct-structuring technology. In some embodiments, the touch pattern 1142 may be a flexible touch circuit board adhered to the outer side of the mechanism housing 1112.

[0048] Furthermore, the housing 1112 of the main unit is provided with metallized holes that are respectively connected to the antenna pattern 1141 and the touch pattern 1142. At this time, since the main control circuit board 13 is located inside the housing 111, for example, the main control circuit board 13 is connected to the housing 1112, allowing the main control circuit board 13 to contact the inner wall of the corresponding metallized hole through elastic metal parts such as pogo pins or metal springs. For example, the antenna pattern 1141 and the touch pattern 1142 are respectively connected to pogo pins 131 and 132 soldered on the main control circuit board 13. Correspondingly, the speaker 112 is located on the side of the main control circuit board 13 facing away from the housing 1112. Thus, compared to the antenna pattern 1141 and touch pattern 1142 being respectively located on the inner side of the chassis housing 1112 facing the speaker 112, the antenna pattern 1141 being located on the outer side of the chassis housing 1112 can increase the distance between it and the main control circuit board 13, that is, increase the antenna clearance area, thereby increasing the anti-interference capability of the antenna pattern 1141; the touch pattern 1142 being located on the outer side of the chassis housing 1112 can shorten the distance between it and the external signal trigger source (such as the user's finger), that is, reduce the touch distance, thereby increasing the sensitivity of the touch pattern 1142 when triggered by the user.

[0049] Furthermore, the antenna pattern 1141 can surround the touch pattern 1142 to make full use of the space on the outside of the casing 1112. The antenna pattern 1141 can be U-shaped, and the touch pattern 1142 can be square. Correspondingly, the antenna pattern 1141 and the touch pattern 1142, along with their respective metallized holes, can be disposed on the top wall 1115.

[0050] As an example, combined Figure 13 The mechanism module 11 may include a bracket 115 disposed within the mechanism housing 111. The bracket 115 and the speaker 112 can enclose an acoustic cavity 116, thereby isolating the acoustic cavity 116 from other structures within the mechanism housing 111 (such as the main control circuit board 13), which helps improve the acoustic performance of the mechanism module 11. The mechanism housing 111 is provided with acoustic holes, such as at least one of a pressure relief hole 111c and a tuning hole 111d. The bracket 115 is provided with an acoustic channel 1151 connecting the acoustic holes and the acoustic cavity 116, allowing the acoustic cavity 116 to communicate with the external environment, i.e., allowing air to freely enter and exit the acoustic cavity 116. This helps reduce the resistance of the speaker 112's diaphragm during vibration.

[0051] Furthermore, the bracket 115 and the movement housing 111 cooperate to form at least a portion of the first adhesive groove 1171 surrounding the aforementioned acoustic hole. The first adhesive groove 1171 contains a first adhesive for sealing the assembly gap between the bracket 115 and the movement housing 111, i.e., waterproof sealing is achieved through the first adhesive. This helps prevent external liquids such as sweat and rain from intruding into the space where the main control circuit board 13 is located inside the movement housing 111. Thus, based on the Helmholtz resonator, compared to the related technology where a silicone sleeve is pressed onto the movement housing 111 by the bracket 115 for waterproof sealing, this technical solution eliminates the need for the aforementioned silicone sleeve by using the first adhesive for waterproof sealing. This helps to shorten the length of the portion of the acoustic cavity 116 that communicates with the external environment (including the acoustic channel 1151 and the aforementioned acoustic hole). This also allows the resonant frequency of the leakage sound (i.e., the second leakage sound mentioned above) that is propagated through the pressure relief hole 111c to be shifted as far as possible to a higher frequency band (e.g., a frequency range greater than 4kHz), thereby further preventing the second leakage sound from being heard.

[0052] It should be noted that: when the aforementioned acoustic hole is a pressure relief hole 111c, the first adhesive groove 1171 surrounds at least a portion of the pressure relief hole 111c; when the aforementioned acoustic hole is a sound adjustment hole 111d, the first adhesive groove 1171 surrounds at least a portion of the sound adjustment hole 111d; when the aforementioned acoustic hole is both a pressure relief hole 111c and a sound adjustment hole 111d, the first adhesive groove 1171 surrounds at least a portion of both the pressure relief hole 111c and the sound adjustment hole 111d. For ease of description and in conjunction with... Figure 14 This application uses the aforementioned acoustic holes as pressure relief hole 111c and sound adjustment hole 111d, with the first adhesive groove 1171 surrounding at least a portion of the pressure relief hole 111c and sound adjustment hole 111d, as an example for illustrative purposes. Further, if the gap between the bracket 115 and the movement housing 111 (e.g., its bottom wall 1113) is sufficiently large, or if the bottom wall 1113 and the first side wall 1114 in the movement housing 111 are not integrally formed structural components (i.e., two separate structural components), then the first adhesive groove 1171 can surround the entire acoustic hole, that is, the first adhesive groove 1171 is a complete annular structure.

[0053] As an example, combined Figure 16 and Figure 13The bracket 115 may include an annular main body 1152 and a docking portion 1153 connected to the annular main body 1152. The annular main body 1152 is sleeved around the periphery of the speaker 112 to form an acoustic cavity 116, and an acoustic channel 1151 passes through the docking portion 1153 and the annular main body 1152. Further, the docking portion 1153 is located between the annular main body 1152 and the mechanism housing 111, and surrounds at least a portion of the aforementioned acoustic hole. The docking portion 1153 and the mechanism housing 111 cooperate to form a first adhesive receiving groove 1171. Since the aforementioned acoustic hole can be a pressure relief hole 111c and a sound tuning hole 111d, two docking portions 1153 are correspondingly provided, and two first adhesive receiving grooves 1171 are also correspondingly provided. Accordingly, the docking portion 1153 cooperates with the first sidewall 1114 to form the first adhesive receiving groove 1171. Thus, since the bracket 115 is arranged in a ring shape, the speaker 112 is exposed on the side facing the main control circuit board 13, which helps to reduce the thickness of the core module 11 in the thickness direction X.

[0054] As an example, combined Figure 17 and Figure 14 The inner side of the movement housing 111 may be provided with a recessed area 1119, and the aforementioned acoustic holes may be located at the bottom of the recessed area 1119. The movement module 11 may include an acoustic barrier 118 disposed within the recessed area 1119, and the mating part 1153 presses the acoustic barrier 118 onto the bottom of the recessed area 1119. This not only helps to prevent the bracket 115 from scratching the acoustic barrier 118 during assembly, but also helps to reduce the assembly gap between the bracket 115, the acoustic barrier 118, and the inner housing 1111, and prevents the acoustic barrier 118 from shaking. The acoustic barrier 118 can be pre-fixed to the bottom of the recessed area 1119 using double-sided tape or glue; alternatively, the acoustic barrier 118 can be pre-fixed to the protective steel mesh 119, and the protective steel mesh 119 can then be pre-fixed to the bottom of the recessed area 1119 using double-sided tape or glue. Accordingly, since the aforementioned acoustic holes can be pressure relief holes 111c and sound adjustment holes 111d, two recessed areas 1119 are provided accordingly, and two acoustic barrier meshes 118 are also provided accordingly.

[0055] Furthermore, the aforementioned first adhesive can be used to seal the assembly gap between the bracket 115 and the acoustic barrier 118 and / or the assembly gap between the acoustic barrier 118 and the movement housing 111 (e.g., the sidewall of the recessed area 1119), which facilitates further waterproof sealing.

[0056] As an example, combined Figure 13 , Figure 14 and Figure 16The mating portion 1153 can be used to form the bottom wall and one side wall of the first adhesive-containing groove 1171, and the movement housing 111 can be used to form the other side wall of the first adhesive-containing groove 1171. The groove wall on the movement housing 111 is positioned opposite to the groove wall on the mating portion 1153, so that the first adhesive-containing groove 1171 has a certain width and depth. Alternatively, the mating portion 1153 can be used to form one side wall of the first adhesive-containing groove 1171, and the movement housing 111 can be used to form the bottom wall and the other side wall of the first adhesive-containing groove 1171; or, the mating portion 1153 can be used to form a portion of one side wall and the bottom wall of the first adhesive-containing groove 1171, and the movement housing 111 can be used to form another portion of the other side wall and the bottom wall of the first adhesive-containing groove 1171.

[0057] As an example, combined Figures 17 to 25 The speaker 112 may include a frame 1121 and a magnetic shield 1122 connected to the frame 1121. The lower end of the bracket 115 may be supported on the frame 1121. The acoustic channel 1151 may be open on the side facing the frame 1121, and the frame 1121 may further block the open portion of the acoustic channel 1151. In this case, it can be simply regarded as a first glue container 1171 surrounding part of the aforementioned acoustic hole, so as to facilitate subsequent filling of glue into the first glue container 1171 by means of a dispensing process.

[0058] Furthermore, the speaker 112 may include a diaphragm 1123 and a surround 1124, with the surround 1124 connecting the diaphragm 1123 and the frame 1121. After the speaker 112 is assembled inside the housing 111, the diaphragm 1123, the surround 1124, and the surrounding frame 1121 and housing 111 can prevent sweat, rainwater, or other liquid droplets entering through the sound outlet 111a from further penetrating the space within the housing 111 where the main control circuit board 13 is located. Based on this, the speaker 112 may include a magnet 1125 disposed within a magnetic shield 1122 and a coil 1126 connected to the diaphragm 1123. The magnet 1125 and the magnetic shield 1122 form a magnetic gap, and the coil 1126 extends into the aforementioned magnetic gap. The loudspeaker 112 may include a magnetic plate 1127 disposed on the side of the magnet 1125 facing the diaphragm 1123. The magnetic plate 1127, the magnetic cover 1122 and the coil 1126 overlap in the vibration direction of the loudspeaker 112 (e.g., the thickness direction X, which will not be described in detail below) so that the magnetic field lines of the magnetic field generated by the magnet 1125 pass through the coil 1126 more.

[0059] In some embodiments, the basin stand 1121 may include a first annular platform 11211 and a second annular platform 11212 arranged in a stepped manner, with the second annular platform 11212 surrounding the periphery of the first annular platform 11211; a portion of the lower end of the bracket 115 may be supported on the first annular platform 11211, and another portion of the lower end of the bracket 115 may form a gap area with the second annular platform 11212, so that the bracket 115, the basin stand 1121 and the core housing 111 cooperate to form a second adhesive groove 1172, which contains a second adhesive for sealing the assembly gap between any two of the bracket 115, the basin stand 1121 and the core housing 111, so as to perform a corresponding waterproof seal.

[0060] In some embodiments, the upper end of the bracket 115 may be placed on the basin frame 1121 and cooperate with the basin frame 1121 and the magnetic cover 1122 to form a third adhesive groove 1173. The third adhesive groove 1173 contains a third adhesive for sealing the assembly gap between the bracket 115 and the basin frame 1121 and the magnetic cover 1122, so as to perform a corresponding waterproof seal.

[0061] It should be noted that the specific assembly process of the mechanism module 11 may include the following steps, and the order of all steps can be adjusted as needed: 1) Pre-fix the acoustic barrier mesh 118 and the protective steel mesh 119 to the bottom of the recessed area 1119 using double-sided tape; 2) Fix the speaker 112 to the bottom wall 1113 and apply adhesive to the assembly gap between them, with the corresponding adhesive accumulating on the second annular platform 11212 of the speaker 112; 3) Before the adhesive in step 2) cures, fix the bracket 115 to the speaker 112, wherein the lower end of the bracket 115 supports... On the first annular platform 11211 of the speaker 112, glue is also applied between the lower end of the bracket 115 and the second annular platform 11212. The mating part 1153 of the bracket 115 presses the acoustic barrier 118 and cooperates with the first side wall 1114 to form the first glue-receiving groove 1171. The upper end of the bracket 115 is placed on the frame 1121 and cooperates with the frame 1121 and the magnetic cover 1122 to form the third glue-receiving groove 1173. 4) Apply glue to the assembly gap between the first glue-receiving groove 1171, the third glue-receiving groove 1173 and the lower end of the bracket 115 and the speaker 112 and the inner shell 1111 of the mechanism. Since the assembly gap between the lower end of the bracket 115 and the speaker 112 and the inner shell 1111 of the mechanism is very close to the first adhesive groove 1171, the assembly gap between the lower end of the bracket 115 and the speaker 112 and the inner shell 1111 of the mechanism can be simply regarded as a continuation of the first adhesive groove 1171, that is, the first adhesive groove 1171 and the second adhesive groove 1172 can be connected.

[0062] Based on the detailed description above, both the first adhesive (and the second adhesive) and the silicone sleeve can improve the waterproof performance of the earphone 10 at the assembly point of the bracket 115 and the core housing 111, thereby giving the space where the main control circuit board 13 is located inside the core housing 111 a high waterproof rating. Based on this, the speaker 112 can have a first accommodating space communicating with the acoustic cavity 116. The speaker 112, bracket 115, and core housing 111 can further cooperate externally to form a second accommodating space that is not communicating with the acoustic cavity 116. The aforementioned first accommodating space can be formed by the frame 1121, the magnetic shield 1122, the diaphragm 1123, and the surround 1124. Therefore, structures such as the magnet 1125, the coil 1126, and the magnetic plate 1127 can be disposed within the aforementioned first accommodating space; structures such as the main control circuit board 13 can be disposed within the aforementioned second accommodating space. In other words, for the speaker 112, the aforementioned first accommodating space and the aforementioned second accommodating space can be two spaces with a certain volume, one inside and one outside the speaker 112. It is worth noting that the aforementioned first accommodating space can communicate with the acoustic cavity 116 through a through hole 11213 on the frame 1121. Specifically, in the embodiment where the acoustic hole is a pressure relief hole 111c (or a tuning hole 111d), the through hole 11213 can be located on the side of the frame 1121 near the pressure relief hole 111c or the tuning hole 111d; while in the embodiment where the acoustic hole is both a pressure relief hole 111c and a tuning hole 111d, two sets of through holes 11213 can be provided, one set located on the side of the frame 1121 near the pressure relief hole 111c, and the other set located on the other side of the frame 1121 near the tuning hole 111d.

[0063] As an example, combined Figure 23 and Figure 25The speaker 112 may include two metal parts 1128 disposed on the frame 1121, one of which serves as the positive terminal of the speaker 112, and the other as the negative terminal. Each metal part 1128 may include a first pad 11281 and a second pad 11282, and a transition portion 11283 connecting the first pad 11281 and the second pad 11282. The first pad 11281 and the second pad 11282 may be exposed on the frame 1121. In this case, the first pad 11281 may be located in the first accommodating space and connected to the coil 1126, and the second pad 11282 may be located in the second accommodating space, so that the coil 1126 can be connected to the main control circuit board 13 through the metal part 1128. The spacing between the first pads 11281 of the two metal components 1128 can be greater than the spacing between the second pads 11282 of the two metal components 1128. Thus, on the one hand, although the first pads 11281 are located within the first accommodating space with a lower waterproof rating, the larger spacing between the first pads 11281 of the two metal components 1128 makes it less likely that sweat, rainwater, or other droplets entering the first accommodating space through the acoustic holes (e.g., pressure relief hole 111c or sound tuning hole 111d) and acoustic channel 1151 will cause a short circuit between the first pads 11281 of the two metal components 1128, thereby preventing the earphone 10 from being burned out. On the other hand, since the second pads 11282 are located within the second accommodating space with a higher waterproof rating, even a smaller spacing between the second pads 11282 of the two metal components 1128 will not cause a short circuit, thereby preventing the earphone 10 from being burned out. In addition, the small spacing between the second pads 11282 of the two metal parts 1128 allows for the shortening of the wires or flexible circuit boards connecting the two metal parts 1128 to the main control circuit board 13, thereby simplifying the wiring structure of the speaker 112 and reducing costs.

[0064] As an example, combined Figure 23 The frame 1121 may have a major axis (e.g., length direction Y) and a minor axis (e.g., width direction Z) perpendicular to the vibration direction of the speaker 112 and orthogonal to each other. The dimension of the frame 1121 in the major axis direction may be larger than its dimension in the minor axis direction; for example, the length-to-width ratio of the frame 1121 may match the length-to-width ratio of the mechanism module 11. In this case, the two metal pieces 1128 may be located at the same end of the frame 1121 in the major axis direction to simplify the wiring of the headphone 10. Correspondingly, the two metal pieces 1128 may be located between two sets of through holes 11213 in the width direction.

[0065] In some embodiments, the transition portion 11283 can be embedded within the frame 1121, for example, the metal part 1128 and the frame 1121 are injection molded using a metal insert process. Thus, since the transition portion 11283 is not exposed from the frame 1121, even a small gap between the transition portions 11283 of the two metal parts 1128 will not cause a short circuit, thereby preventing the earphone 10 from burning out.

[0066] In some embodiments, the transition portion 11283 can be waterproofly sealed to the frame 1121. For example, the metal part 1128 is first fixed to the frame 1121 and then the transition portion 11283 is covered with adhesive. In this way, even if the distance between the transition portions 11283 of the two metal parts 1128 is small, the transition portion 11283 is waterproofly sealed to the frame 1121, so that the transition portions 11283 of the two metal parts 1128 will not short-circuit, thereby preventing the headphones 10 from being burned out.

[0067] As an example, combined Figure 25 The second pads 11282 of the two metal parts 1128 can be arranged side by side and spaced apart. One end of each transition portion 11283 can be connected to the corresponding second pad 11282. The two transition portions 11283 extend in directions away from each other. Each first pad 11281 can be connected to the other end of the corresponding transition portion 11283, so that the distance between the first pads 11281 of the two metal parts 1128 is greater than the distance between the second pads 11282 of the two metal parts 1128. The curvature of the transition portion 11283 can be consistent with the trend of change of the area on the tray 1121 where the metal parts 1128 are arranged.

[0068] As an example, combined Figure 25 The basin frame 1121 may include an annular peripheral wall 11214 and an annular flange 11215 connected to the inner wall surface of the annular peripheral wall 11214, and a boss 11216 disposed at the connection between the annular flange 11215 and the annular peripheral wall 11214. The magnetic shield 1122 may be fixed to the annular flange 11215 to facilitate connection between the magnetic shield 1122 and the basin frame 1121. The boss 11216 supports the metal component 1128, allowing the transition portion 11283 to be hidden within the boss 11216 while the second pad 11282 can be exposed from the boss 11216, facilitating connection between the coil 1126 and the metal component 1128, and preventing short circuits in the transition portions 11283 of the two metal components 1128.

[0069] As an example, combined Figure 23 and Figure 25Two bosses 11216 can be spaced apart along the circumference of the annular peripheral wall 11214. For example, a boss 11216 can be split in two at the middle. In this case, each boss 11216 can support a metal part 1128, that is, the transition part 11283 of a metal part 1128 can be hidden in a corresponding boss 11216. Thus, even if sweat, rainwater or other droplets accumulate on one of the bosses 11216 and its exposed second pad 11282, the droplets are unlikely to flow to the other boss 11216 and its exposed second pad 11282, which helps to avoid short-circuiting of the second pads 11282 of the two metal parts 1128.

[0070] As an example, combined Figure 19 and Figure 23 The coil 1126 may include an annular body 11261 and leads 11262 connected to the annular body 11261. The annular body 11261 and the leads 11262 may be the same conductor. Based on this, the annular body 11261 can be obtained by winding the aforementioned conductor a certain number of turns according to actual needs. The annular body 11261 can be connected to the diaphragm 1123. The leads 11262 can be the two ends of the aforementioned conductor, that is, there can be two leads 11262. The two leads 11262 can be connected one-to-one with the second pads 11282 of the two metal parts 1128. Furthermore, the annular body 11261 may be located inside the frame 1121, for example, extending into the magnetic gap formed by the magnet 1125 and the magnetic shield 1122. In this case, after the excitation signal is input to the speaker 112, the lead wire 11262 follows the annular body 11261 and moves relative to the frame 1121. The annular body 11261 pushes the diaphragm 1123 to generate sound waves.

[0071] As an example, combined Figure 23 The speaker frame 1121 may be provided with a clearance groove 11217, and the orthogonal projection of the lead wire 11262 along the vibration direction of the speaker 112 may at least partially fall within the clearance groove 11217. The depth of the clearance groove 11217 may be greater than 0 and less than or equal to 0.2 mm. Thus, the clearance groove 11217 can, to a certain extent, increase the distance between the lead wire 11262 and the speaker frame 1121, reducing the risk of collision between the lead wire 11262 and the speaker frame 1121 during the movement of the lead wire 11262 relative to the speaker frame 1121 following the movement of the annular body 11261, especially when the speaker 112 is operating with small amplitude; and reducing the travel distance after the lead wire 11262 collides with the speaker frame 1121, especially when the speaker 112 is operating with large amplitude; this is beneficial to improving the reliability of the speaker 112.

[0072] In some embodiments, in the vibration direction of the loudspeaker 112, the distance between the lead wire 11262 and the bottom of the clearance groove 11217 when the loudspeaker 112 is not input with an excitation signal can be greater than the maximum amplitude of the movement of the lead wire 11262 relative to the frame 1121, so as to further reduce the risk of collision between the lead wire 11262 and the frame 1121 and reduce the travel after the lead wire 11262 collides with the frame 1121.

[0073] In some embodiments, the clearance groove 11217 can be located near the end where the lead wire 11262 is connected to the annular body 11261. That is, the clearance groove 11217 can be correspondingly set at a position where the amount of movement of the lead wire 11262 following the movement of the annular body 11261 is relatively large. The aforementioned position is also a position where the risk of collision between the lead wire 11262 and the basin stand 1121 is relatively high, so as to further reduce the risk of collision between the lead wire 11262 and the basin stand 1121 and reduce the travel after the lead wire 11262 collides with the basin stand 1121.

[0074] As an example, combined Figure 23 The lead wire 11262 may include a first extension 11263 connected to the annular body 11261 and a second extension 11264 bent relative to the first extension 11263. The orthographic projection of the first extension 11263 along the vibration direction of the speaker 112 may at least partially fall within the clearance groove 11217 to reduce the risk of the lead wire 11262 colliding with the frame 1121 and to reduce the travel after the lead wire 11262 collides with the frame 1121. Similarly, at least the portion of the second extension 11264 near the first extension 11263 along the vibration direction of the speaker 112 may fall within the clearance groove 11217 to further reduce the risk of the lead wire 11262 colliding with the frame 1121 and to reduce the travel after the lead wire 11262 colliding with the frame 1121. Accordingly, the end of the second extension 11264 away from the first extension 11263 may be connected to the second pad 11282. Of course, in some other embodiments, the lead 11262 may be arranged in a straight line or an arc.

[0075] In some embodiments, the ratio between the length of the second extension 11264 and the length of the first extension 11263 can be between 2 and 15. If the ratio is too small, the amplitude of the end of the second extension 11264 furthest from the first extension 11263 may still be large, potentially leading to wire breakage or desoldering at the second pad 11282. If the ratio is too large, the weight of the second extension 11264 may be excessive, causing excessive strain on the first extension 11263, and resulting in a larger overall size of the speaker 112, which is detrimental to product miniaturization. Furthermore, the distance between the second extension 11264 and the annular body 11261 in a direction perpendicular to the vibration direction of the speaker 112 (e.g., the width direction Z) can be between 1.1 mm and 2.1 mm. If the aforementioned spacing is too small, the amplitude of the second extension 11264 may still be too large, which may cause the second extension 11264 to collide with the frame 1121, or the second extension 11264 to break or detach from the second solder pad 11282. If the aforementioned ratio is too large, the first extension 11263 may deform excessively toward the frame 1121 due to its excessive weight, which may cause it to collide with the frame 1121 and may also cause the overall size of the speaker 112 to be too large, which is not conducive to product miniaturization.

[0076] In some implementations, for example Figure 23 The angle between the second extension 11264 and the first extension 11263 can be an obtuse angle, which helps to reduce the stress between the second extension 11264 and the first extension 11263, thereby increasing the reliability of the lead 11262.

[0077] In some implementations, for example Figure 24 At least a portion of the second extension 11264 and the frame 1121 can be spaced further apart in the direction of vibration of the speaker 112 by gradually decreasing the distance in the direction of extension away from the first extension 11263 (e.g., the opposite direction of arrow Y). This is to make the portion of the second extension 11264 close to the first extension 11263 and the first extension 11263 as far away from the frame 1121 as possible in the direction of vibration of the speaker 112, thereby reducing the risk of the lead wire 11262 colliding with the frame 1121 and reducing the travel after the lead wire 11262 collides with the frame 1121.

[0078] In some embodiments, the frame 1121 may be provided with a plurality of through holes 11213 spaced apart around the annular body 11261. The clearance groove 11217 may communicate with the through holes 11213 to simplify the structure of the frame 1121. The orthographic projection of the second extension 11264 along the vibration direction of the speaker 112 may at least partially fall within the through hole 11213 to reduce the area where the second extension 11264 may collide with the frame 1121, thereby increasing the reliability of the speaker 112. The plurality of through holes 11213 may be divided into two groups, and the orthographic projections of the second extensions 11264 of the two leads 11262 along the vibration direction of the speaker 112 may each at least partially fall within the through hole 11213. Based on this, each group of through holes 11213 may further include a plurality of through holes 11213 spaced apart from each other, for example... Figure 23 The four shown are examples; of course, each group of through holes 11213 may also include only one relatively large through hole 11213.

[0079] As an example, combined Figure 23 and Figure 25 The speaker frame 1121 may be provided with pads for connecting to the lead wire 11262. There may be two pads, one serving as the positive terminal of the speaker 112 and the other as the negative terminal. These pads may be the metal part 1128 mentioned above, or other arrangements well known to those skilled in the art, which will not be described further below. Furthermore, the lead wire 11262 has a first end 1126a near the annular body 11261 and a second end 1126b away from the annular body 11261. The second end 1126b may be fixed to a corresponding pad; for example, the end of the lead wire 11262 away from the annular body 11261 may be soldered to the first pad 11281. The ratio between the length of the lead wire 11262 and the maximum amplitude of the coil 1126's movement relative to the speaker frame 1121 may be between 8 and 75. If the aforementioned ratio is too small, the amplitude of the second end 1126b may still be too large, potentially leading to breakage of the lead wire 11262 or detachment from the aforementioned solder pad. If the aforementioned ratio is too large, the lead wire 11262 may deform excessively towards the frame 1121 due to its excessive weight, making it prone to collision with the frame 1121 and resulting in a larger overall size of the speaker 112, which is not conducive to product miniaturization. In short, this technical solution helps to improve the technical problem of stress concentration in the lead wire 11262.

[0080] In some embodiments, the ratio between the diameter of the lead wire 11262 and its length can be between 50 and 1000. If the ratio is too small, the lead wire 11262 may break due to insufficient stiffness; if the ratio is too large, the lead wire 11262 may deform excessively towards the basin frame 1121 due to its excessive weight, thus making it prone to collision with the basin frame 1121.

[0081] In some embodiments, a fixed position 1126c of the lead 11262 between the first end 1126a and the second end 1126b can be further fixed to the frame 1121, making it difficult for the vibration of the lead 11262 following the annular body 11261 to be transmitted to the solder pad. This helps to avoid resonance at the end of the lead 11262 near the solder pad or a shift of the peak frequency of resonance to a higher frequency band (e.g., above 10kHz), thereby reducing the risk of the lead 11262 breaking or detaching from the solder pad. The portion of the lead 11262 between the first end 1126a and the fixed position 1126c can be suspended relative to the frame 1121, and the portion of the lead 11262 between the second end 1126b and the fixed position 1126c can also be suspended relative to the frame 1121 to reduce the risk of the lead 11262 colliding with the frame 1121.

[0082] As an example, combined Figure 19 and Figure 23 A support block 11218 can be provided on the speaker frame 1121. The support block 11218 is located between the first end 1126a and the second end 1126b, and can correspond to the fixed position 1126c. At this time, the lead wire 11262 can be fixed to the support block 11218 at the fixed position 1126c, so that at least part of the lead wire 11262 is suspended relative to the speaker frame 1121. In this way, since the support block 11218 is part of the structure of the speaker frame 1121, the fixed position 1126c is more accurate, which helps to prevent workers from arbitrarily fixing a certain position on the lead wire 11262 to the speaker frame 1121, thereby improving the product consistency of the speaker 112 in mass production and thus increasing the yield rate.

[0083] It should be noted that in embodiments where the frame 1121 has multiple annular bodies 11261 with spaced through holes 11213, the support block 11218 can be located between two adjacent through holes 11213, making the frame 1121 structure simple and reliable. In addition, the support block 11218 can also serve as a reinforcing rib of the frame 1121 to increase its structural strength. Furthermore, for the leads 11262 corresponding to the positive or negative terminals of the speaker 112, multiple fixed positions 1126c and corresponding support blocks 11218 can be provided, such as two or three.

[0084] In some embodiments, the lead 11262 can be fixed to the support block 11218 with adhesive 11219. The adhesive 11219, after curing, can be elastic, such as a soft adhesive like silicone. This helps absorb vibrations of the lead 11262 following the annular body 11261, reducing stress on the lead 11262 at the fixed position 1126c, thereby reducing the risk of lead 11262 breakage. Of course, in applications with a lower risk of breakage, the adhesive 11219 can also be a hard adhesive.

[0085] In some embodiments, a limiting groove may be provided on the side of the support block 11218 that contacts the lead wire 11262. This helps to increase the consistency of the relative positions of the support block 11218 and the lead wire 11262 in mass production, thereby improving the product yield. It is worth noting that in embodiments where the lead wire 11262 is fixed to the support block 11218 with adhesive 11219, the aforementioned clearance groove can also serve as an adhesive receiving groove, so as to accumulate sufficient adhesive 11219 on the support block 11218 to fix the lead wire 11262.

[0086] In some embodiments, the first length of the lead 11262 between its first end 1126a and the support block 11218 can be greater than the second length of the lead 11262 between its second end 1126b and the support block 11218. This reduces the risk of breakage due to the lead 11262 being too short, while maintaining the total length of the lead 11262. For example, the ratio between the first length and the second length can be between 1 and 12. If the ratio is too small, the amplitude of the lead 11262 at the support block 11218 may still be large, easily leading to breakage.

[0087] In some embodiments, when the loudspeaker 112 is not receiving an input excitation signal, the first end 1126a and the fixed position 1126c of the lead wire 11262 supported by the support block 11218 are on the same reference plane perpendicular to the vibration direction of the loudspeaker 112. This helps to reduce the stress within the lead wire 11262, thereby reducing the risk of the lead wire 11262 breaking.

[0088] As an example, combined Figure 23 The second extension 11264 can be fixed to the support block 11218 and the aforementioned pads. For example, the second extension 11264 is soldered to the pads at its second end 1126b, and fixed to the support block 11218 with adhesive 11219 at the fixed position 1126c. The end of the second extension 11264 connected to the first extension 11263 is taken as the starting point of the second extension 11264, and the second end 1126b is taken as the ending point of the second extension 11264. The position where the second extension 11264 is fixed to the support block 11218 (e.g., fixed position 1126c) can be located between one-half and three-quarters of the length of the second extension 11264.

[0089] As an example, combined Figure 19 , Figure 21 and Figure 22 The diaphragm 1123 may include an integrally connected main body 11231, a first annular connecting portion 11232, and a second annular connecting portion 11233. The first annular connecting portion 11232 is connected to the coil 1126, and the second annular connecting portion 11233 is connected to the surround 1124. The main body 11231 may be configured as a dome-shaped structure protruding away from the coil 1126. Furthermore, the orthogonal projection of the second annular connecting portion 11233 onto the vibration direction of the speaker 112 may cover the lead wire 11262, and the second annular connecting portion 11233 is bent relative to the first annular connecting portion 11232 away from the coil 1126, creating a gap between it and the lead wire 11262 in the vibration direction of the speaker 112, which helps to avoid unnecessary collisions between the lead wire 11262 and the surround 1124 or the diaphragm 1123 connected to it.

[0090] As an example, combined Figures 19 to 22The folded ring 1124 may include an integrally connected third annular connecting portion 11241, a pleated portion 11242, and a fourth annular connecting portion 11243. The third annular connecting portion 11241 may be connected to the side of the second annular connecting portion 11233 opposite to the coil 1126, and the fourth annular connecting portion 11243 may be connected to the frame 1121 (e.g., annular peripheral wall 11214) via a reinforcing member 11244. Furthermore, the pleated portion 11242 may protrude in a direction opposite to the lead wire 11262, which helps to avoid unnecessary collisions between the two.

[0091] Based on the foregoing description, this application provides an electronic device that may include a support component and a mechanism module 11. The support component can be connected to the mechanism housing 111 to support the mechanism module 11 when worn. The support component can be configured as an ear hook structure (e.g., a hook-like structure 12) that hangs on the ear when worn, or as a headband structure that passes over the top of the head when worn. Further, the wearing position can be a location on the user's cheek near the ear, a location on the front of the ear, or another physiological part of the user's body. Therefore, the electronic device can be, in addition to headphones 10, smart glasses or other terminal devices including the mechanism module 11. The mechanism module 11 may include a speaker 112 and a transducer based on bone conduction principles. As an example, the electronic device may include a speaker 112 for generating air-conducted sound. Furthermore, for electronic devices including a speaker 112, the electronic device can also be a mobile phone, smartwatch, or other terminal devices.

[0092] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this application.

Claims

1. A movement module, characterized in that, The mechanism module includes a mechanism housing, a speaker and a bracket disposed within the mechanism housing, the bracket and the speaker forming an acoustic cavity, the acoustic cavity communicating with the external environment, the speaker having a first accommodating space communicating with the acoustic cavity inside, the speaker, the bracket and the mechanism housing further cooperating outside the speaker to form a second accommodating space not communicating with the acoustic cavity, the speaker including a coil, a frame and two metal parts disposed on the frame, one of which serves as the positive terminal of the speaker and the other as the negative terminal of the speaker, each of which includes a first pad and a second pad, and a transition portion connecting the first pad and the second pad, the first pad and the second pad being exposed from the frame, the first pad being located within the first accommodating space and connected to the coil, and the second pad being located within the second accommodating space.

2. The movement module according to claim 1, characterized in that, The spacing between the first pads of the two metal parts is greater than the spacing between the second pads of the two metal parts.

3. The movement module according to claim 1, characterized in that, The transition portion is embedded in the basin frame, or the transition portion is waterproofly sealed on the basin frame.

4. The movement module according to claim 2, characterized in that, The second pads of the two metal parts are arranged side by side and spaced apart. One end of each transition portion is connected to the corresponding second pad. The two transition portions extend in a direction away from each other. Each first pad is connected to the other end of the corresponding transition portion.

5. The movement module according to claim 4, characterized in that, The loudspeaker includes a magnetic shield and a magnet disposed within the magnetic shield, the magnet and the magnetic shield forming a magnetic gap, the coil extending into the magnetic gap, the frame including an annular peripheral wall and an annular flange connected to the inner wall surface of the annular peripheral wall, and a boss disposed at the connection between the annular flange and the annular peripheral wall, the magnetic shield being fixed on the annular flange, the boss being used to support the metal component, and the second solder pad being exposed from the boss.

6. The movement module according to claim 5, characterized in that, Two bosses are provided at circumferential intervals along the annular peripheral wall, and each boss supports one of the metal parts.

7. The movement module according to claim 1, characterized in that, The basket has a major axis and a minor axis that are perpendicular to the vibration direction of the speaker and orthogonal to each other. The size of the basket in the major axis direction is larger than the size of the basket in the minor axis direction. The two metal pieces are located at the same end of the basket in the major axis direction.

8. The movement module according to claim 1, characterized in that, The movement housing is provided with an acoustic hole, and the bracket cooperates with the movement housing to form a first adhesive groove surrounding at least a portion of the acoustic hole. The first adhesive groove contains a first adhesive for sealing the assembly gap between the bracket and the movement housing.

9. The movement module according to claim 8, characterized in that, The basin stand includes a first annular platform and a second annular platform arranged in a stepped manner. The second annular platform is arranged around the periphery of the first annular platform. A portion of the lower end of the bracket is supported on the first annular platform, and another portion of the lower end of the bracket forms a gap area with the second annular platform, so that the bracket, the basin stand and the core housing cooperate to form a second adhesive groove. The second adhesive groove contains a second adhesive for sealing the assembly gap between any two of the bracket, the basin stand and the core housing.

10. The movement module according to claim 8, characterized in that, The loudspeaker includes a magnetic shield connected to the frame, the upper end of the bracket rests on the frame and cooperates with the frame and the magnetic shield to form a third adhesive groove, the third adhesive groove containing a third adhesive for sealing the assembly gap between the bracket, the frame and the magnetic shield.

11. An electronic device, characterized in that, The electronic device includes a support component and a movement module as described in any one of claims 1-10, wherein the support component is connected to the movement housing to support the movement module when worn in a wearing position.

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