Multi-index test processing method based on audio analyzer

Abstract

The application discloses a multi-index test processing method based on an audio analyzer and relates to the technical field of vehicle-mounted audio performance testing. The application solves the problems of inaccurate measurement results of sensitive test items caused by the fact that a test sequence is not optimized according to thermal influence differences, the fact that precision and efficiency are difficult to achieve simultaneously caused by the fact that a fixed cooling duration cannot adapt to working conditions, and the fact that there is a lack of thermal state dynamic adjustment and data compensation means. The application automatically inserts test items that are not sensitive to temperature as cooling windows after high-temperature test items through optimized sequencing of the test sequence, uses the execution duration of the test items that are not sensitive to temperature to replace fixed cooling waiting, and makes the temperature of a power amplifier chip of test items that are sensitive to temperature decrease to a permissible range during execution, thereby significantly improving the measurement accuracy of sensitive indexes. Moreover, the cooling time that is originally idle waiting is converted into effective test time, the measurement precision is ensured, and the efficiency loss caused by the fact that a fixed waiting duration cannot adapt to working conditions is avoided.

Description

Technical Field

[0001] This invention relates to the field of vehicle audio performance testing technology, specifically a multi-index testing and processing method based on an audio analyzer. Background Technology

[0002] In the multi-index testing process of automotive audio analyzers, the test sequence typically includes large-signal test items and two types of small-signal test items: one type is temperature-sensitive test items, whose measurement accuracy is significantly affected by the power amplifier chip temperature; the other type is temperature-insensitive test items, whose measurement results are basically unaffected by temperature. After the large-signal test items are executed, the power amplifier chip temperature rises significantly, leading to an increase in the background noise. If the temperature-sensitive test items are executed immediately at this time, the measurement results will deviate significantly from the true value. The traditional method usually executes each test item in a preset order without optimizing the sequence according to the thermal effects of each test item. As a result, the power amplifier temperature often does not drop to the allowable range when the sensitive test items are executed, and the measurement results cannot reflect the true performance of the device under test.

[0003] To address this issue, current measurements often insert a fixed cooling wait time after large signal test items. However, heat dissipation conditions vary greatly under different operating conditions, and a fixed wait time cannot adapt to all conditions: insufficient waiting time results in incomplete temperature recovery and falsely low measurement results; excessive waiting time significantly reduces test efficiency and wastes time resources. Furthermore, the lack of real-time monitoring and dynamic adjustment capabilities for thermal conditions makes it impossible to adaptively optimize the test sequence during testing and to effectively compensate for test data that has been affected by thermal interference. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a multi-index testing and processing method based on an audio analyzer, which solves the problems of inaccurate measurement results of sensitive test items due to the lack of optimization of test sequences based on differences in thermal effects, the inability to achieve both accuracy and efficiency due to the inability to adapt fixed cooling times to working conditions, and the lack of dynamic adjustment and data compensation methods for thermal states.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multi-index testing and processing method based on an audio analyzer, comprising the following steps: Step 1: Extract the preset multi-index test sequence, divide it into high-heat set, medium-heat set and low-heat set according to the degree of temperature influence of each test item, and calculate the heat value of each test item; Step 2: Insert the test items in the high-heat set into the new sequence in their original order. After each high-heat test item, calculate the estimated background noise offset after execution based on its heat value, execution time, and current estimated background noise offset. If the offset exceeds the allowable threshold, select test items from the low-heat set and medium-heat set as cooling interleaving items and insert them until the estimated background noise offset drops below the allowable threshold, thus forming a preliminary test sequence. Step 3: Execute the test according to the preliminary test sequence. When the high-heat test item is executed, obtain the current actual thermal state and compare the deviation with the estimated thermal state. If the deviation exceeds the allowable range, supplement the cooling window from the test items that have not yet been executed in the sequence or from the candidate pool. Execute the current high-heat test item only after the thermal state drops to the allowable threshold.

[0006] As a further aspect of the present invention: the multi-index test sequence includes N test items, each test item including a type identifier, output amplitude A, execution duration T, and adjustment depth M.

[0007] As a further aspect of the present invention: the degree of temperature influence is divided into high-heat cluster, medium-heat cluster, and low-heat cluster, specifically: Determine the sensitive attributes of each test item based on its type identifier; If the test item type is affected by the power amplifier chip temperature and exceeds the temperature rise threshold per second, then its sensitivity attribute is set to 1, and it is classified into the high heat set. If the test item type is affected by the power amplifier chip temperature but does not exceed the temperature rise threshold per second, then its sensitivity attribute is set to 0.3, and it is classified into the medium heat set. If the test item type is unaffected by the power amplifier chip temperature, then its sensitivity attribute is set to 0, and it is classified into the low-heat set.

[0008] As a further aspect of the present invention: the specific formula for calculating the calorific value of each test item is as follows: Q = K1 × A × T + K2 × M; Where Q is the heat value, K1 and K2 are the heat measurement coefficients retrieved according to the model of the vehicle's infotainment chip under test, A is the output amplitude of the test item, T is the execution duration of the test item, and M is the modulation depth of the test item.

[0009] As a further aspect of the present invention: the formation of the preliminary test sequence specifically includes: Arrange the high-temperature test items in the high-temperature set according to their original order in the original test sequence to obtain the high-temperature subsequence; Arrange the test items in the low-heat set in ascending order of execution time to obtain the low-heat subsequence; Arrange the test items in the intermediate heat set according to their original order in the original test sequence to obtain the intermediate heat subsequence; Create a new sequence that is initialized to empty. For each high-temperature test item in the high-temperature subsequence, append it to the end of the new sequence. Then, sequentially select test items from the low-temperature subsequence as cooling interpolation items and insert them until the current estimated background noise offset drops below the allowable local noise offset threshold. The noise floor offset is the noise floor offset of the vehicle's power amplifier chip.

[0010] As a further aspect of the present invention: the step of sequentially selecting test items from the low-heat subsequence as cooling interpolation items for insertion until the currently estimated background noise offset drops below the allowable local noise offset threshold specifically includes: Calculate the estimated background noise offset after the current high-temperature test item is completed; If the estimated local noise offset exceeds the allowable local noise offset threshold, calculate the cooling time required to reduce the estimated local noise offset to within the allowable local noise offset threshold. Test items are taken out sequentially from the low-heat subsequence, and their execution times are accumulated until the total accumulated execution time is greater than or equal to the required cooling time for the first time. All low-heat test items taken this time are treated as cooling interleaving items and appended to the current high-heat test item in sequence, and then removed from the low-heat subsequence.

[0011] As a further aspect of the present invention: step two further includes: If there are no available test items in the low-temperature subsequence, but the current estimated background noise offset is still greater than the allowable local noise offset threshold, then take a medium-temperature test item from the medium-temperature subsequence in sequence, append it to the end of the new sequence, and remove it from the subsequence. Based on the heat value and execution time of the thermal test item, calculate the estimated background noise offset after its execution. If the estimated background noise offset is still greater than the allowable local noise offset threshold, repeat this process and continue inserting the next medium-temperature test item until the estimated background noise offset drops below the allowable local noise offset threshold.

[0012] As a further aspect of the present invention: the supplementation of cooling windows from test items or candidate pools that have not yet been executed in the sequence specifically includes: If the deviation between the current actual background noise offset and the estimated background noise offset exceeds the allowable range, then stop the next high-temperature test item and calculate the additional cooling time required for the current actual background noise offset to decay to the allowable local noise offset threshold. If all high-heat test items in the initial test sequence are completed and the remaining low-heat and medium-heat test items are not empty, then they are added to the end of the current cooling interleaving item list in order. Each time an item is added, its execution time is accumulated until the total time is greater than or equal to the additional cooling time for the first time. If all remaining low-heat and medium-heat test items have been used up, then reserve test items will be retrieved from the reserve pool and added to the end of the current cooling interleaving list until the total duration meets the cooling requirements. Execute the cooling interleaving items in the adjusted order. After all cooling interleaving items have been executed, execute the current high-heat test item.

[0013] As a further aspect of the present invention: the current actual thermal state is the background noise offset of the power amplifier chip collected in real time by an audio analyzer, and the estimated thermal state is the estimated background noise offset of the corresponding high-temperature test item calculated in step two.

[0014] As a further aspect of the present invention, it also includes step four: after completing all tests, a compensation operation is performed on the test items in the intermediate heat set, wherein the compensation operation specifically includes: Obtain the background noise offset before the test item is executed, and the output signal sequence collected during the execution of the test item; Select test items that have been executed before the test item, belong to the low-heat set, and whose background noise offset before execution and the background noise offset before the test item are within a preset deviation range as the reference sample set; The interference deviation signal of each reference sample is calculated and averaged point by point to obtain the average interference function; Subtract the average interference function from the output signal of the current test item to obtain the compensated signal; Perform spectral analysis on the compensated signal, calculate the signal-to-noise ratio and distortion index after compensation, and store the indexes before and after compensation, as well as the compensation reliability index, in the results table.

[0015] This invention provides a multi-index testing and processing method based on an audio analyzer. Compared with existing technologies, it has the following advantages: (1) This invention optimizes the sorting of the test sequence and automatically inserts temperature-insensitive test items as cooling windows after high-temperature test items. It uses the execution time of these test items to replace the fixed cooling wait, so that the power amplifier chip temperature has dropped to the allowable range when the temperature-sensitive test items are executed. This significantly improves the measurement accuracy of sensitive indicators and transforms the original idle waiting cooling time into effective test time. While ensuring measurement accuracy, it avoids the efficiency loss caused by the fixed waiting time not being able to adapt to the working conditions, thus improving test efficiency. (2) By monitoring the background noise offset of the power amplifier chip in real time, the present invention dynamically supplements the cooling window when there is a deviation between the theoretical estimate and the actual thermal state, thereby realizing the adaptive adjustment of the test process and enhancing the adaptability to different working conditions. (3) The present invention uses a low-temperature test item with a thermal state similar to the test item to be compensated as a reference sample, extracts thermal interference feature signals and performs compensation, further eliminating the influence of residual thermal interference on the measurement data and improving the reliability of the test results. Attached Figure Description

[0016] Figure 1 This is a diagram illustrating the steps of the method of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example 1 Please see Figure 1 This application provides a multi-index testing and processing method based on an audio analyzer, including the following steps: Step 1: Extract the preset multi-index test sequence, divide it into high-heat set, medium-heat set and low-heat set according to the degree of temperature influence of each test item, and calculate the heat value of each test item; Step 2: Insert the test items in the high-heat set into the new sequence in their original order. After each high-heat test item, calculate the estimated background noise offset after execution based on its heat value, execution time, and current estimated background noise offset. If the offset exceeds the allowable threshold, select test items from the low-heat set and medium-heat set as cooling interleaving items and insert them until the estimated background noise offset drops below the allowable threshold, thus forming a preliminary test sequence. Step 3: Execute the test according to the preliminary test sequence. When the high-heat test item is executed, obtain the current actual thermal state and compare the deviation with the estimated thermal state. If the deviation exceeds the allowable range, supplement the cooling window from the test items that have not yet been executed in the sequence or from the candidate pool. Execute the current high-heat test item only after the thermal state drops to the allowable threshold.

[0019] Example 2 Furthermore, based on Example 1, the multi-index testing and processing method based on an audio analyzer is described in more detail, specifically including the following steps: Step 1: Extract a preset multi-index test sequence containing N test items. Each test item includes its type identifier, output amplitude A, execution duration T, and tuning depth M. Obtain the model of the vehicle amplifier chip under test and retrieve its thermal characteristic parameters, including thermal coefficients K1 and K2, background noise (i.e., inherent noise) attenuation constant γ, heat-to-noise conversion coefficient β, and allowable local noise offset threshold Dp, based on the model. The sensitivity attributes of each test item are classified according to its type identifier: if the test item type is affected by the power amplifier chip temperature (such as sensitivity, noise ratio, distortion, separation, etc.) and exceeds the temperature rise threshold per second, the sensitivity attribute is considered as 1. If the test item type is affected by the power amplifier chip temperature but does not exceed the temperature rise threshold per second, and is between the two, and has a certain but not high requirement for temperature, then its sensitivity attribute is considered to be 0.3. If the type is unaffected by the power amplifier chip temperature (such as parameter reading, status query, digital interface, no-load signal test, etc.), then the sensitivity attribute will be considered as 0; Test items with a sensitivity attribute of 1 are classified into the high-heat set, test items with a sensitivity attribute of 0.3 are classified into the medium-heat set, and test items with a sensitivity attribute of 0 are classified into the low-heat set. The caloric value Q for each test item is calculated using the formula: Q = K1 × A × T + K2 × M.

[0020] Step Two Obtain the index order of the preset original test item sequence and extract the execution time Te of each test item; Arrange the high-temperature test items in the high-temperature set according to their original order in the original sequence to obtain the high-temperature subsequence; Arrange the test items in the insensitive low-temperature set in ascending order of Te to obtain the low-temperature subsequence; Arrange the test items in the middle set according to the order in the original sequence to obtain the middle thermal sequence; Create a new sequence initialized to empty, and perform the following construction operation for each high-temperature test item in the high-temperature subsequence: The current high-heat test item is appended to the end of the new sequence. During the execution of this test item, the power amplifier chip generates heat due to the output of audio signals, which causes the noise floor offset to increase. At the same time, the execution time also allows the chip to obtain a certain amount of natural heat dissipation. Based on the heat value Q and execution time of this test item, the estimated noise floor offset after its execution is calculated, and this value is used as the estimated noise floor offset Dcur of the current power amplifier chip. The specific formula is: Dcure = Dbefore × exp(-Thot / γ) + Q × β; Where Dbefore is the estimated noise floor offset of the power amplifier chip before the high-temperature test begins, Thot is the execution time of the high-temperature test, and exp(-Thot / γ) is the proportion of noise offset caused by natural heat dissipation within the time Thot. If the current Dcur ≤ the allowable local noise offset threshold Dp, then no cooling is required, and the next high-heat test item is added directly after this test. If Dcur > Dp, then calculate the cooling time required to reduce Dcur to within Dp: Tcool = γ × ln(Dcur / Dp). Take test items sequentially from the low-heat subsequence, calculate the duration Tl for each item taken, and accumulate them to the total cooling duration. Repeat this process until the total cooling duration is greater than or equal to Tcool for the first time, or until there are no more test items available in the low-heat subsequence. Then, add all the low-heat test items taken in this step to the current high-heat test item in the new sequence in order, and remove them from the low-heat subsequence. If the total cooling time is greater than or equal to the required cooling time for the first time, and the estimated impact has dropped below Dp, then the cooling is complete, and the next high-temperature test item can be processed. If there are no available test items in the low-heat subsequence, but the estimated impact is still greater than Dp, then a medium-heat test item is taken out sequentially from the neutron thermal sequence, appended to the end of the new sequence, and removed from the subsequence. The medium-heat test generates less heat when it is executed, and its execution time also provides cooling time. The combined effect of the two is net cooling or constant temperature. Based on the heat value and execution time of the test item, the estimated noise floor offset after its execution is calculated, and this value is used as the estimated noise floor offset De of the current power amplifier chip. If De is still greater than Dp, repeat this process and continue to insert the next medium-temperature test item until De drops below Dp; All low-heat test items, medium-heat test items, and candidate test items inserted this time are treated as cooling interleavings of the current high-heat test items, and the positions of these interleaving items in the new sequence are marked as adjustable; After all high-temperature test items have been sorted in the new sequence, the remaining low-temperature test items in the low-temperature subsequence and the remaining medium-temperature test items in the medium-temperature subsequence are appended to the end of the new sequence according to their relative order in the original sequence to form the preliminary sequencing sequence. If, during the initial test sequence sorting process, there are no available test items for either the low-heat or medium-heat subsequences, but the current estimated background noise offset is still greater than the allowable threshold, then pre-set candidate test items (such as cooling placeholder items that do not produce substantial test results, such as no-load operation or state maintenance) are retrieved from the candidate pool and added to the end of the new sequence until the current estimated background noise offset drops below the allowable threshold. The candidate test items are only used to provide cooling time and do not participate in the subsequent normal test item sorting.

[0021] Step 3: For each test item in the preliminary test sequence, the test is performed sequentially. When the next high-temperature test is about to be performed, the actual noise floor offset Dreal of the current power amplifier chip is extracted, and the estimated noise floor offset Dcur of the current power amplifier chip corresponding to the high-temperature test item is read. If |Dreal-Dcur|≤Dp×0.1, it means that the deviation between the real-time state and the theoretical prediction is within the allowable range. Then, the high-heat test item and its subsequent cooling interleaving items are executed directly according to the preliminary test sequence. If the deviation exceeds the allowable range, stop the next high-temperature test item, and calculate the additional cooling time Tx required for the actual noise floor offset Dreal to decay to the allowable threshold Dp: The specific calculation formula is: Tx=(1 / α)×ln(Dreal / Dp), where α is the attenuation coefficient during the thermal recovery process; If, in the initial test sequence, there are test items that are inserted into the remaining low-heat and medium-heat subsequences after all high-heat test items have been completed, they are appended to the end of the current cooling interleaving item list in order. For each one appended, its execution time Tg is accumulated until Tg is greater than or equal to Tx for the first time. If all the low-heat and medium-heat test items added at the end have been used up or there are no remaining, then the preset candidate test items are retrieved from the candidate pool and added to the end of the current cooling interleaving item list until the total duration meets the cooling requirements. And execute these cooling interleaving items in the adjusted order: first execute the low-heat and medium-heat test items already arranged in the preliminary test sequence, then execute the test items added from the end, and after all cooling interleaving items have been executed, execute the current high-heat test item. If the low-heat and medium-heat tests, which were originally scheduled to be at the end of the preliminary test sequence after all the high-heat tests have been completed, are partially selected, then these parts will be deleted, and the remaining parts will be kept in their original positions. After all the high-heat tests and their cooling interleaving tests have been completed, they will be executed in the order of the preliminary test sequence.

[0022] Step Four: After completing all tests in the rectification sequence, obtain the raw data for all test items, iterate through all test items in the medium-temperature set that have certain temperature requirements, and perform compensation operations for each test item: Obtain the background noise offset Db before the execution of the test item and the output signal sequence Vr(t) collected during the execution of the test item. Iterate through all other test items that have been completed before this test item and select test items that meet the following conditions as reference samples: The test item belongs to the low-heat set, and the background noise offset Dr before execution satisfies 0.8×Db≤Dr≤1.2×Db. All the selected test items will be used as the reference sample set. For each reference sample in the reference sample set, perform the following operations: The output signal sequence Vf and the corresponding preset input signal sequence Uf collected during the execution of the reference sample are obtained, and the nominal transfer function H of the vehicle chip is obtained. Uf and H are convolved to obtain the standard output signal sequence Vs of the reference sample under the condition of no thermal interference. The interference deviation signal Df of the reference sample is calculated as Df = Vf - Vs. The average interference function Dm is obtained by averaging the Df values ​​of all reference samples point by point. If the reference sample set is empty, then Dm = 0. Subtract Dm from the output signal Vr of the current test item to obtain the compensated signal Vc; Perform a fast Fourier transform on Vc to obtain the frequency domain signal, and calculate the signal-to-noise ratio and distortion index after compensation. The original indicators before and after compensation, along with the indicators after compensation, are stored together in the results table. The number of samples in the reference sample set and the energy value of the average interference feature function are also stored in the results table as compensation credibility indicators, and finally stored in the storage system.

[0023] Some of the data in the above formulas are numerical calculations with dimensions removed, and the contents not described in detail in this specification are all prior art known to those skilled in the art.

[0024] The above embodiments are only used to illustrate the technical methods of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical methods of the present invention without departing from the spirit and scope of the technical methods of the present invention.

Claims

1. A multi-index testing and processing method based on an audio analyzer, characterized in that, Includes the following steps: Step 1: Extract the preset multi-index test sequence, divide it into high-heat set, medium-heat set and low-heat set according to the degree of temperature influence of each test item, and calculate the heat value of each test item; Step 2: Insert the test items in the high-heat set into the new sequence in their original order. After each high-heat test item, calculate the estimated background noise offset after execution based on its heat value, execution time, and current estimated background noise offset. If the offset exceeds the allowable threshold, select test items from the low-heat set and medium-heat set as cooling interleaving items and insert them until the estimated background noise offset drops below the allowable threshold, thus forming a preliminary test sequence. Step 3: Execute the test according to the preliminary test sequence. When the high-heat test item is executed, obtain the current actual thermal state and compare the deviation with the estimated thermal state. If the deviation exceeds the allowable range, supplement the cooling window from the test items that have not yet been executed in the sequence or from the candidate pool. Execute the current high-heat test item only after the thermal state drops to the allowable threshold.

2. The multi-index testing and processing method based on an audio analyzer according to claim 1, characterized in that, The multi-index test sequence contains N test items, each of which includes a type identifier, output amplitude A, execution duration T, and adjustment depth M.

3. The multi-index testing and processing method based on an audio analyzer according to claim 1, characterized in that, The degree of temperature influence is divided into high-heat clusters, medium-heat clusters, and low-heat clusters, specifically: Determine the sensitive attributes of each test item based on its type identifier; If the test item type is affected by the power amplifier chip temperature and exceeds the temperature rise threshold per second, then its sensitivity attribute is set to 1, and it is classified into the high heat set. If the test item type is affected by the power amplifier chip temperature but does not exceed the temperature rise threshold per second, then its sensitivity attribute is set to 0.3, and it is classified into the medium heat set. If the test item type is unaffected by the power amplifier chip temperature, then its sensitivity attribute is set to 0, and it is classified into the low-heat set.

4. The multi-index testing and processing method based on an audio analyzer according to claim 1, characterized in that, The specific formula for calculating the calorie value of each test item is as follows: Q = K1 × A × T + K2 × M; Where Q is the heat value, K1 and K2 are the heat measurement coefficients retrieved according to the model of the vehicle's infotainment chip under test, A is the output amplitude of the test item, T is the execution duration of the test item, and M is the modulation depth of the test item.

5. The multi-index testing and processing method based on an audio analyzer according to claim 1, characterized in that, The formation of the preliminary test sequence specifically includes: Arrange the high-temperature test items in the high-temperature set according to their original order in the original test sequence to obtain the high-temperature subsequence; Arrange the test items in the low-heat set in ascending order of execution time to obtain the low-heat subsequence; Arrange the test items in the intermediate heat set according to their original order in the original test sequence to obtain the intermediate heat subsequence; Create a new sequence that is initialized to empty. For each high-temperature test item in the high-temperature subsequence, append it to the end of the new sequence. Then, sequentially select test items from the low-temperature subsequence as cooling interpolation items and insert them until the current estimated background noise offset drops below the allowable local noise offset threshold. The noise floor offset is the noise floor offset of the vehicle's power amplifier chip.

6. The multi-index testing and processing method based on an audio analyzer according to claim 5, characterized in that, The step of sequentially selecting test items from the low-heat subsequence as cooling interpolation items for insertion until the currently estimated background noise shift drops below the allowable local noise shift threshold specifically includes: Calculate the estimated background noise offset after the current high-temperature test item is completed; If the estimated noise floor offset exceeds the allowable local noise offset threshold, calculate the cooling time required to reduce the estimated noise floor offset to within the allowable local noise offset threshold. Test items are taken out sequentially from the low-heat subsequence, and their execution times are accumulated until the total accumulated execution time is greater than or equal to the required cooling time for the first time. All low-heat test items taken this time are treated as cooling interleaving items and appended to the current high-heat test item in sequence, and then removed from the low-heat subsequence.

7. The multi-index testing and processing method based on an audio analyzer according to claim 1, characterized in that, Step two also includes: If there are no available test items in the low-temperature subsequence, but the current estimated background noise offset is still greater than the allowable local noise offset threshold, then take a medium-temperature test item from the medium-temperature subsequence in sequence, append it to the end of the new sequence, and remove it from the subsequence. Based on the heat value and execution time of the thermal test item, calculate the estimated background noise offset after its execution. If the estimated background noise offset is still greater than the allowable local noise offset threshold, repeat this process and continue inserting the next medium-temperature test item until the estimated background noise offset drops below the allowable local noise offset threshold.

8. The multi-index testing and processing method based on an audio analyzer according to claim 1, characterized in that, The process of supplementing the cooling window from test items or candidate pools that have not yet been executed in the sequence specifically includes: If the deviation between the current actual background noise offset and the estimated background noise offset exceeds the allowable range, then stop the next high-temperature test item and calculate the additional cooling time required for the current actual background noise offset to decay to the allowable local noise offset threshold. If all high-heat test items in the initial test sequence are completed and the remaining low-heat and medium-heat test items are not empty, then they are added to the end of the current cooling interleaving item list in order. Each time an item is added, its execution time is accumulated until the total time is greater than or equal to the additional cooling time for the first time. If all remaining low-heat and medium-heat test items have been used up, then reserve test items will be retrieved from the reserve pool and added to the end of the current cooling interleaving list until the total duration meets the cooling requirements. Execute the cooling interleaving items in the adjusted order. After all cooling interleaving items have been executed, execute the current high-heat test item.

9. The multi-index testing and processing method based on an audio analyzer according to claim 1, characterized in that, The current actual thermal state is the background noise offset of the power amplifier chip collected in real time by the audio analyzer, and the estimated thermal state is the estimated background noise offset of the corresponding high-temperature test item calculated in step two.

10. The multi-index testing and processing method based on an audio analyzer according to claim 9, characterized in that, It also includes step four: After completing all tests, perform a compensation operation on the test items in the intermediate heat set. The compensation operation specifically includes: Obtain the background noise offset before the test item is executed, and the output signal sequence collected during the execution of the test item; Select test items that have been executed before the test item, belong to the low-heat set, and whose background noise offset before execution and the background noise offset before the test item are within a preset deviation range as the reference sample set; The interference deviation signal of each reference sample is calculated and averaged point by point to obtain the average interference function; Subtract the average interference function from the output signal of the current test item to obtain the compensated signal; Perform spectral analysis on the compensated signal, calculate the signal-to-noise ratio and distortion index after compensation, and store the indexes before and after compensation, as well as the compensation reliability index, in the results table.

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