Servo driver based on SIP packaging technology and manufacturing method thereof

Abstract

The application discloses a kind of servo driver based on SIP three-dimensional packaging technology and its manufacturing method, servo driver includes: power board is provided with power supply circuit;Control board is provided with control circuit, acquisition circuit and communication circuit, acquisition circuit and communication circuit are electrically connected with control circuit;Power board is provided with power device, drive circuit and monitoring circuit, drive circuit is used to drive power device, monitoring circuit is used to monitor power device;Wherein, power board, control board and power board are stacked in order from top to bottom, and power board, control board and power board are interconnected, power board is used to provide operating power for control board and power board, control board is used to control the working state of power board.The servo driver can realize miniaturization, anti-interference, impact resistance and anti-vibration.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of servo drive technology, and in particular to a servo drive based on SIP 3D packaging technology and its manufacturing method. Background Technology

[0002] Existing high-power servo drivers are complex, involving multiple components such as high current, multiple power supplies, isolated drives, and sampling circuits. Their PCB layout and routing are susceptible to electromagnetic interference from power devices. Furthermore, due to the presence of high-power devices and complex circuitry, they are large in size and have low power density. They also suffer from drawbacks such as insufficient heat dissipation, electromagnetic compatibility, interference immunity, shock resistance, and vibration resistance, making them unsuitable for applications requiring high reliability and strong environmental adaptability. Summary of the Invention

[0003] This application provides a servo driver based on SIP 3D packaging technology and its manufacturing method, which can achieve miniaturization, high heat dissipation, anti-interference and anti-vibration.

[0004] In a first aspect, embodiments of this application provide a servo driver based on SIP (System-in-Package) 3D packaging technology, comprising: The power board contains the power circuitry. The control board is equipped with a control circuit, a data acquisition circuit, and a communication circuit, wherein the data acquisition circuit and the communication circuit are both electrically connected to the control circuit. A power board is provided with power devices, a drive circuit, and a monitoring circuit. The drive circuit is used to drive the power devices, and the monitoring circuit is used to monitor the power devices. In some embodiments, the control circuit includes: DSP is used for feedback signal processing, fault diagnosis, and algorithm calculation. An FPGA is electrically connected to the DSP. The FPGA is used for communication interface timing control, resolver decoding, and generating excitation waveforms.

[0005] In some embodiments, the communication circuit includes at least one communication interface selected from JTAG, RS422, CAN1, CAN2, and 1553B.

[0006] In some embodiments, the power board, the control board, and the power board are stacked and then encapsulated with encapsulating resin.

[0007] In some embodiments, the power devices are placed at the bottom of the power board and separated by a ground plane.

[0008] In some embodiments, the heat-conducting block of the power device is exposed on the outer surface of the encapsulating resin, the heat-conducting block is connected to a mounting flange, and the mounting flange is connected to a heat dissipation structure.

[0009] In some embodiments, the power lines, bus lines, motor lines, and control signal lines of the servo driver are located on different sides of the servo driver.

[0010] In some embodiments, the control board is provided with a control layer power supply, and the power supply board has a cutout corresponding to the position of the control layer power supply.

[0011] In some embodiments, the power device is obtained by: sintering a SiC die onto a ceramic substrate at high temperature, then connecting them by aluminum ribbon bonding; optimizing the internal wiring and bonding structure using Ansoft Q3D simulation tool; filling the spaces between the ceramic substrate, the SiC die, and the aluminum ribbon with thermally conductive adhesive to form the power device; and adopting a dual-parallel configuration, with each power device consisting of two SiC dies connected in parallel.

[0012] Secondly, embodiments of this application also provide a method for manufacturing a servo driver based on SIP 3D packaging technology, including the following steps: The power board, control board, and power board are stacked sequentially from top to bottom. The power board is equipped with a drive power circuit, the control board is equipped with a control circuit, a data acquisition circuit, and a communication circuit. The data acquisition circuit and the communication circuit are both electrically connected to the control circuit. The power board is equipped with a power device, a drive circuit, and a monitoring circuit. The drive circuit is used to drive the power device, and the monitoring circuit is used to monitor the voltage and current of the power device. The stacked power board, control board, and power board are encapsulated with resin to obtain an encapsulated module; The potting module is cut to obtain a cut module; Nickel-gold is electroplated on the surface of the cutting module, and the interconnection of the power board, the control board and the power board is achieved by laser scribing to obtain a servo driver.

[0013] The servo driver and its manufacturing method based on SIP three-dimensional packaging technology according to the embodiments of this application have at least the following beneficial effects: In order to achieve miniaturization and other purposes, the servo driver of this application adopts SIP stacking technology to electrically mount the main components of the intelligent servo control system onto three packaging carrier boards and stack them in three-dimensional space.

[0014] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a servo driver based on SIP 3D packaging technology according to an embodiment of this application; Figure 2 This is a circuit schematic diagram of a servo driver based on SIP 3D packaging technology provided in another embodiment of this application; Figure 3 This is a schematic diagram of the structure of a power device provided in another embodiment of this application; Figure 4 This is a flowchart of the steps of a method for manufacturing a servo driver based on SIP 3D packaging technology, provided in another embodiment of this application. Detailed Implementation

[0016] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. The step numbers in the following embodiments are set only for ease of explanation, and there is no limitation on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0017] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0018] The terms "first," "second," "third," and "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0019] In this invention, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] Servo drives are core components of automated equipment, evolving from analog to digital, and then to integrated and intelligent systems. Based on high-performance digital signal processors or microcontrollers, they achieve high-precision, high-dynamic-response control of motor speed, position, and torque through software control algorithms, and are widely used in CNC machine tools, robotics, and even aerospace.

[0021] Existing high-power servo controllers are generally implemented on a single board, with the control area, power drive area, and heat dissipation structure arranged in separate layouts. This results in a large overall driver size, low power density, and inconvenient installation. Furthermore, they have weak anti-interference capabilities; the control area is susceptible to electromagnetic interference from the power area, and the electromagnetic radiation generated by the power area also interferes with the surrounding environment. Additionally, existing servo controllers have poor shock and vibration resistance; because components are not potted and fixed, they cannot be used in high-intensity shock and vibration environments. Moreover, their heat dissipation is inadequate; during prolonged high-load operation, heat cannot be dissipated in time, easily damaging the module.

[0022] This application presents a servo driver based on SIP (System-in-Package) 3D packaging technology, realizing a highly integrated, highly reliable, and miniaturized servo control module. It features small size, excellent heat dissipation, superior vibration and shock resistance, and good electromagnetic compatibility and anti-interference design. It can be used in fields with extremely high reliability and environmental adaptability requirements, such as missile-borne single-unit systems and aerospace applications. Combined with a rational board layout and wiring, and excellent heat dissipation channels, it can overcome the shortcomings of existing servo controllers. SIP stands for System In Package, which encapsulates multiple components and circuits within a single package / substrate to form a complete system.

[0023] The embodiments of this application will be further described below with reference to the accompanying drawings.

[0024] In a first aspect, embodiments of this application propose a servo driver based on SIP (System-in-Package) 3D packaging technology, comprising: a power board 100, a control board 200, and a power board 300. The power board 100 is provided with a power supply circuit; the control board 200 is provided with a control circuit, a data acquisition circuit, and a communication circuit. Both the data acquisition circuit and the communication circuit are electrically connected to the control circuit. The communication circuit is used to communicate with the power board or an external device, and the data acquisition circuit is used to acquire feedback signals from the power board to control the operating state of the power board based on the feedback signals. The power board 300 is provided with power devices, a drive circuit, and a monitoring circuit. The drive circuit is used to drive the power devices, and the monitoring circuit is used to monitor the power devices. The power board 100, control board 200, and power board 300 are stacked sequentially from top to bottom and interconnected. The power board 100 provides operating power to the control board 200 and the power board 300, and the control board 200 controls the operating state of the power board 300.

[0025] like Figure 2 The diagram shown is a specific circuit diagram of a servo driver based on SIP 3D packaging technology according to an embodiment of this application. The power supply circuit on the power board 100 includes multiple DC-DC chips for converting 28V power to 12V power, and converting 12V power to voltages such as 1.0V, 1.8V, 3.3V and 5.0V.

[0026] like Figure 2 As shown in some embodiments of this application, the control circuit on the control board 200 includes a DSP (Digital Signal Processor) and an FPGA (Field Programmable Gate Array). The DSP is used for feedback signal processing, fault diagnosis, and algorithm calculation. The FPGA is electrically connected to the DSP and is used for communication interface timing control, resolver decoding, and generating excitation waveforms. The servo driver, based on the DSP and FPGA, implements high-current drive (peak phase current 180A, 270V), signal monitoring, and intelligent control functions for the servo motor. The DSP chip is mainly responsible for control algorithm calculation, feedback signal processing, and fault diagnosis, while the FPGA is mainly responsible for communication interface timing control, resolver decoding, excitation waveform generation, and communication with the DSP. The dual-core collaborative operation improves efficiency and control accuracy.

[0027] like Figure 2As shown, in some embodiments of this application, the acquisition circuit on the control board 200 includes a signal processing module and an ADC module. The signal processing module is used to denoise and amplify the received signal and then send it to the ADC module. The ADC module is used to convert the analog signal into a digital signal and send it to the FPGA, so that the FPGA and DSP can perform calculations and processing on the signal.

[0028] like Figure 2 As shown, in some embodiments of this application, the communication circuit includes at least one communication interface selected from JTAG, RS422, CAN1, CAN2, and 1553B. In this example, the servo driver simultaneously possesses communication interfaces such as JTAG, RS422, CAN, and 1553B, allowing external systems to send motor action commands to it in real time and monitor the motor's operating status in real time.

[0029] like Figure 2 As shown in some embodiments of this application, the monitoring circuit of the power board 300 includes a voltage monitoring module and a current monitoring module. The voltage monitoring module is used to monitor voltage information in real time, and the current monitoring module is used to monitor current information in real time. In addition, the monitoring circuit may also include a temperature monitoring circuit to monitor temperature information in real time. Therefore, the servo driver has overcurrent, overvoltage, undervoltage, and overheat protection functions, monitors the operating status in real time, and once a fault signal is detected, the control circuit immediately shuts off the output of the power device to protect the servo driver and avoid damage. The voltage monitoring module and the current monitoring module are connected to the control circuit through a modulation chip. The modulation chip can achieve signal isolation and convert voltage and current signals into digital signals before sending them to the control circuit.

[0030] like Figure 2 As shown, in some embodiments of this application, the power device 400 on the power board 300 includes a SiC MOS transistor array for controlling the working state of the motor, and the driving circuit is a MOS driving circuit for controlling the conduction state of the MOS transistor array.

[0031] To achieve miniaturization, shock resistance, and vibration resistance, the servo driver of this application employs a SIP stacking process. The main components of the intelligent servo control system—DSP, FPGA, FLASH, SiC MOS, MOS driver, drive power supply, ADC acquisition, RS422, CAN, 1553B, voltage monitoring module, current monitoring module, connectors, and power module—are electrically mounted onto three packaging substrates, stacked in three-dimensional space, and then encapsulated using a specific encapsulating resin, ultimately forming a finished module with dimensions of 65mm × 56mm × 26.6mm. The servo driver of this application uses a three-layer three-dimensional stack and is encapsulated with a specific encapsulating resin, exhibiting miniaturization and high power density characteristics. Each substrate layer uses BT resin material. The top layer of the module is the power board 100, the middle layer is the control board 200, and the bottom layer is the power board 300.

[0032] like Figure 1 As shown, in some embodiments of this application, the power circuit, control circuit, and power supply circuit are separated by power board 100, control board 200, and power board 300. The power device 400 is placed at the bottom of the power board and separated by a ground plane, effectively reducing electromagnetic interference from high current and switching noise in the power device 400 on the power board 300. Furthermore, the interlayer interconnects are rationally laid out. On the four sides of the module, the left and right sides are for busbars and motor lines respectively, the top side is for power lines, and the bottom side is for control signal lines, separating strong and weak signals. Strong signals refer to the main power circuit, busbars, and motor lines on the power board 300, while weak signals refer to communication signals, drive control signals, current and voltage acquisition signals, and sensor acquisition signals on the control board 200.

[0033] The servo driver employs a custom-designed, high-efficiency SiC power device. The power MOSFETs are also custom-designed SiC power devices, with SiC dies sintered at high temperatures onto a specific ceramic substrate and then connected via aluminum ribbon bonding. Ansoft Q3D simulation tools are used to optimize the internal routing and bonding structure, and the resistance and inductance parameters of the internal routing within the module package are extracted. A specific thermally conductive adhesive is used to fill the spaces between the ceramic substrate, SiC dies, and aluminum ribbon to create a 400-type power device. The SiC uses a dual-parallel configuration, meaning each SiC power transistor is actually implemented by two SiC dies connected in parallel. The SiC power module parameters are 1200V, 230A, and 8mohm on-resistance.

[0034] When stacking the power board 100, control board 200, and power board 300, the power device 400 is placed at the bottom. During potting, the heat-conducting block 410 of the power device 400 is exposed on the outer surface of the module (to facilitate heat conduction of the internal high-power devices). During module installation, the heat-conducting block 410 is connected to the mounting flange using countersunk screws (rivets are first driven into the four corner holes of the heat-conducting block), and then the module is fixed to the external heat dissipation structure using the lugs of the mounting flange. When the module is working, an excellent heat conduction channel is formed through the bottom heat-conducting block—mounting flange—external heat dissipation structure, transferring heat to the external structure of the module, thereby achieving a good heat dissipation effect.

[0035] Reasonable PCB layout and proper stacking of multilayer boards: Place the power board 100 on top of the module, and simultaneously cut out the corresponding position of the control layer power 500 on the top power layer 100 of the control board 200, as shown below. Figure 1 As shown, this facilitates power supply heat dissipation. Additionally, if space permits, a thermal pad can be placed on top of the module before connecting it to the external heat dissipation structure. During module installation, the mounting flange is connected using countersunk screws through the screw holes or rivet holes at the four corners of the thermal block 410 (rivets are used first if there are no screw holes at the corners). The module is then fixed to the external heat dissipation structure using the lugs on the mounting flange. Simultaneously, heat from the power device 400 can also be conducted to the external heat dissipation structure. Thermal grease is applied between the components during assembly.

[0036] The servo driver in this embodiment employs SIP (System-in-Package) technology. After stacking multiple boards, it is integrally encapsulated with a specific resin possessing high insulation, high temperature resistance, and impact resistance, thereby reinforcing and protecting the components and providing excellent impact and vibration resistance. The encapsulated module has passed mechanical shock and vibration tests. The surface of the servo driver is electroplated with nickel-gold, effectively shielding external electromagnetic interference and suppressing internal electromagnetic radiation, while also providing corrosion resistance.

[0037] The servo driver according to the embodiments of this application is implemented using SIP packaging technology. The module has advantages such as miniaturization, high power density, and excellent vibration and shock resistance. Through the cooperation of the heat-conducting block and the external heat dissipation structure, as well as the setting of the control layer power supply 500, the module achieves efficient heat dissipation and facilitates the installation, fixing and wiring of the module. The module consists of a power board 100, a control board 200 and a power board 300 from top to bottom. The interconnecting lines between the boards (busbars, motor lines, power lines, control signal lines, etc.) are distributed on different sides of the module to reduce interference. The power device of the module is made by high-temperature sintering of SiC bare dies onto a specific ceramic substrate and connecting them by aluminum ribbon bonding to form an integrated power device. Compared with existing technologies, this application uses SIP packaging technology to achieve high integration and miniaturization of the servo driver; it has excellent shock and vibration resistance; strong anti-interference capability, effectively suppressing electromagnetic interference through reasonable layer layout, ground shielding, and nickel-gold plating on the module surface; efficient heat dissipation, by high-temperature sintering of SiC bare dies onto a specific ceramic substrate and connecting them through aluminum strip bonding to form a power component; and convenient assembly and wiring, as the module can be fixed to external structural components by screws through the lugs at the four corners of the mounting flange at the bottom of the module.

[0038] Secondly, embodiments of this application also propose a method for manufacturing a servo driver based on SIP (System-in-Package) 3D packaging technology, such as... Figure 4 As shown, the method includes the following steps: Step S100: Stack the power board 100, control board 200 and power board 300 sequentially from top to bottom; wherein, the power board 100 is provided with a drive power supply circuit, the control board 200 is provided with a control circuit, a data acquisition circuit and a communication circuit, the data acquisition circuit and the communication circuit are both electrically connected to the control circuit, and the power board 300 is provided with power devices, a drive circuit and a monitoring circuit, the drive circuit is used to drive the power devices, and the monitoring circuit is used to monitor the voltage and current of the power devices; Step S200: The stacked power board 100, control board 200 and power board 300 are encapsulated with resin to obtain an encapsulated module; Step S300: Cut the potting module to obtain a cut module; Step S400: Electroplating nickel-gold onto the surface of the cutting module, and interconnecting the power board 100, control board 200 and power board 300 by laser scribing to obtain the servo driver.

[0039] Specifically, the servo driver in this application embodiment is implemented using SIP three-dimensional packaging technology. The main process flow is as follows: First, SMT electrical assembly of each layer of circuit board is completed. Then, the power board 100, control board 200 and power board 300 are stacked from top to bottom. The signals that need to be interconnected between each stacked board and other stacked boards are led out through bridge wires and then potted with resin. After potting, the bridge wires are cut to expose them. Then, electroplating and laser engraving are performed to realize the interconnection of signals between layers.

[0040] The method for manufacturing a servo driver based on SIP (System-in-Package) 3D packaging technology described in this application employs SIP technology. After stacking multiple boards, a specific resin with high insulation, high temperature resistance, and impact resistance is used for integrated potting, thereby reinforcing and protecting the components and providing excellent impact and vibration resistance. The potted module has passed mechanical shock and vibration tests. The surface of the servo driver is electroplated with nickel-gold, effectively shielding external electromagnetic interference and suppressing internal electromagnetic radiation, while also providing corrosion resistance.

[0041] Thirdly, embodiments of this application also provide a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the above-described method for manufacturing a servo driver based on SIP 3D packaging technology.

[0042] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0043] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0044] The above provides a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of the present invention.

Claims

1. A servo driver based on SIP (System-in-Package) 3D packaging technology, characterized in that, include: The power board contains the power circuitry. The control board is equipped with a control circuit, a data acquisition circuit, and a communication circuit, wherein the data acquisition circuit and the communication circuit are both electrically connected to the control circuit. A power board is provided with power devices, a drive circuit, and a monitoring circuit. The drive circuit is used to drive the power devices, and the monitoring circuit is used to monitor the power devices. The power board, control board, and power board are stacked sequentially from top to bottom and interconnected. The power board provides operating power to the control board and power board, and the control board controls the operating state of the power board.

2. The servo driver based on SIP 3D packaging technology according to claim 1, characterized in that, The control circuit includes: DSP is used for feedback signal processing, fault diagnosis, and algorithm calculation. An FPGA is electrically connected to the DSP. The FPGA is used for communication interface timing control, resolver decoding, and generating excitation waveforms.

3. The servo driver based on SIP 3D packaging technology according to claim 1, characterized in that, The communication circuit includes at least one communication interface selected from JTAG, RS422, CAN1, CAN2, and 1553B.

4. The servo driver based on SIP 3D packaging technology according to claim 1, characterized in that, The power board, the control board, and the power board are stacked and then encapsulated with encapsulating resin.

5. The servo driver based on SIP 3D packaging technology according to claim 4, characterized in that, The power devices are placed at the bottom of the power board and separated by a ground plane.

6. The servo driver based on SIP 3D packaging technology according to claim 5, characterized in that, The heat-conducting block of the power device is exposed on the outer surface of the encapsulating resin. The heat-conducting block is connected to the mounting flange, and the mounting flange is connected to the heat dissipation structure.

7. The servo driver based on SIP 3D packaging technology according to claim 1, characterized in that, The power lines, bus lines, motor lines, and control signal lines of the servo driver are located on different sides of the servo driver.

8. The servo driver based on SIP 3D packaging technology according to claim 1, characterized in that, The control board is equipped with a control layer power supply, and the power supply board has cutouts corresponding to the position of the control layer power supply.

9. The servo driver based on SIP 3D packaging technology according to claim 1, characterized in that, The power device is obtained by sintering a SiC die onto a ceramic substrate at high temperature and then connecting them by aluminum ribbon bonding. The internal wiring and bonding structure are optimized using Ansoft Q3D simulation tool. Thermally conductive adhesive is used to fill the spaces between the ceramic substrate, the SiC die, and the aluminum ribbon to form the power device. The power device adopts a dual parallel scheme, with each power device consisting of two SiC dies connected in parallel.

10. A method for manufacturing a servo driver based on SIP (System-in-Package) 3D packaging technology, characterized in that, Includes the following steps: The power board, control board, and power board are stacked sequentially from top to bottom. The power board is equipped with a drive power circuit, the control board is equipped with a control circuit, a data acquisition circuit, and a communication circuit. The data acquisition circuit and the communication circuit are both electrically connected to the control circuit. The power board is equipped with a power device, a drive circuit, and a monitoring circuit. The drive circuit is used to drive the power device, and the monitoring circuit is used to monitor the voltage and current of the power device. The stacked power board, control board, and power board are encapsulated with resin to obtain an encapsulated module; The potting module is cut to obtain a cut module; Nickel-gold is electroplated on the surface of the cutting module, and the interconnection of the power board, the control board and the power board is achieved by laser scribing to obtain a servo driver.

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