Method for removing burrs from irregular slot holes of printed circuit board

Abstract

The present application relates to the technical field of printed circuit board mechanical drilling, and discloses a printed circuit board special-shaped slot hole and hole connection burr removing method, which comprises the following steps: S1, constructing a micro-crack pre-guide structure in the transition area of the special-shaped slot hole and the hole connection of the printed circuit board; S2, performing low-stroke micro-cutting processing on the special-shaped slot hole and the hole connection area; S3, applying pulse oscillation to the area where the micro-cutting is completed for burr stripping; S4, starting the chip removal process within the time window after the burr stripping, and removing the burr from the processing area in the negative pressure suction and condensation capture mode; and S5, adjusting the parameters based on the monitoring data of the feedback. The micro-crack pre-guide structure is constructed by drilling at the connection of the slot and the slot, the slot and the hole, and the hole and the hole, which significantly improves the surface quality and consistency of the printed circuit board, is simple to operate, does not require complex equipment or high-skilled operators, reduces the production cost, has a wide application range, and can be applied to burr removal of various special-shaped slot hole and hole connections.

Description

Technical Field

[0001] This invention relates to the field of mechanical drilling technology for printed circuit boards, specifically a method for removing burrs from irregularly shaped slots and holes in printed circuit boards. Background Technology

[0002] Printed circuit boards (PCBs), as one of the core components of modern electronic devices, involve various precision machining processes in their production. Among these, irregularly shaped slots and interconnects are common structures in PCB design, widely used for connectivity, signal transmission, and power management in multilayer boards. During the hole machining process, burrs of various shapes are typically generated, especially noticeable in the machining of irregularly shaped slots. These burrs not only affect the product's appearance quality but can also negatively impact subsequent soldering and assembly processes, and even affect the PCB's electrical performance and reliability.

[0003] Mechanical drilling is a common processing method in printed circuit board (PCB) manufacturing, especially when forming irregularly shaped slots and holes such as T-shaped, cross-shaped, or other intersecting slots and holes. Burrs easily form at the junctions of slots, holes, and other shaped holes. These burrs not only affect the appearance quality of the PCB but can also negatively impact subsequent processes such as electroplating and soldering, reducing product reliability and yield. Currently, the industry mainly removes burrs through manual grinding or chemical etching, but these methods are inefficient, costly, and difficult to guarantee consistency. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a method for removing burrs from irregularly shaped slots and interconnected holes on printed circuit boards. This method solves the problems of low efficiency and poor consistency of manual polishing, environmental pollution risks and damage to the circuit board caused by chemical etching, and high cost and high skill requirements for laser removal.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a method for removing burrs from irregularly shaped slots and connecting holes on printed circuit boards, comprising the following steps: S1. In the transition area between irregular slots and interconnecting holes on the printed circuit board, a microcrack pre-guided structure is constructed to guide the stress distribution of subsequent processing at a microscale. S2. Perform low-stroke micro-cutting on irregular slots and connecting hole areas to promote material fracture and reduce burr generation along the direction of the microcrack guide structure. S3. Apply pulsed oscillation to the area where micro-cutting has been completed for burr removal, so that the burrs are removed from the substrate surface under acoustic-thermal coupling conditions. S4. Start the chip removal process within the time window after the burr is removed, and remove the burrs from the processing area by negative pressure suction and condensation capture. S5. Adjust parameters based on feedback monitoring data to dynamically control the burr removal process.

[0006] As a further description of the above technical solution: S1 includes: A microcrack guide structure is formed by applying pulsed piezoelectric extrusion or surface micro-impact to the transition region of the slot; The location of the microcrack guiding structure is determined based on the geometric changes and stress concentration trends of the region. By using structured width, depth, and spacing parameters, microcrack guiding structures can be adapted to guide the microfracture behavior of materials during subsequent processing. Among them, the microcrack pre-guided structure is constructed by drilling at the connection points of grooves, grooves and holes, and holes, and is used to add through holes at the intersections to remove burrs.

[0007] Through the above technical solution, the deburring hole penetrates 0.2-0.3mm into the intersection; at the intersection of the slot hole and the figure-eight round hole or the connecting hole of the irregular slot hole, i.e. the cutting direction, a 0.50mm through hole is added so that it is tangent to the intersection point; Then, taking the first 0.50mm serial hole as the origin, add two serial holes clockwise and two counterclockwise along the connecting holes of the figure-eight round hole or the irregular slot hole, respectively. The edge-to-edge spacing of each serial hole is 0.03-0.04mm and is tangent to the corresponding connecting hole of the figure-eight round hole or the irregular slot hole. By precisely controlling the position and spacing of the perforations, the perforations are made tangent to the connecting holes of the irregular slots, thereby removing or dispersing the burrs during the drilling process, achieving the effect of burr removal.

[0008] By drilling deburring holes at the junctions of grooves, grooves and holes, and holes, the depth of the holes is increased to 0.2-0.3mm. Then, at the intersection of the slot and the figure-eight round hole or the connecting hole of the irregular slot, i.e. the direction of the cutter, add a 0.50mm through hole so that it is tangent to the intersection point; Taking the first 0.50mm serial hole as the origin, add two serial holes clockwise and two counterclockwise along the connecting holes of the figure-eight round hole or the irregular slot hole, respectively. The edge-to-edge spacing of each serial hole is 0.03-0.04mm and is tangent to the corresponding connecting hole of the figure-eight round hole or the irregular slot hole. Using the same method, 0.50mm deburring through holes are added diagonally. This technology employs slots and through holes, achieving deburring by drilling deburring holes at the connections between slots, slots and holes, and holes and adding through holes at the intersections. Compared with existing technologies, the technical effects of this solution are as follows: The microcrack pre-guided structure is constructed by drilling at the connection points between slots, slots and holes, and holes. It has the advantages of efficient burr removal, significantly improved surface quality and consistency of printed circuit boards, simple operation, no need for complex equipment or highly skilled operators, reduced production costs, environmental protection and no pollution, avoiding the environmental problems caused by chemical etching, and wide applicability. It can be applied to the burr removal of various irregularly shaped slots and holes.

[0009] As a further description of the above technical solution: S1 also includes: The stress direction of the slot profile, connecting hole position, and interface was analyzed by using a computer-aided model. The arrangement path of the microcrack guiding structure is calculated based on the analysis results; The arrangement path is used to cover corner edges and areas of sudden stress changes.

[0010] The above technical solutions significantly improve the quality control precision of burr removal, avoid processing defects caused by unreasonable stress concentration, thereby improving the overall processing effect of printed circuit boards, making the burr removal process more intelligent and automated, and possessing stronger adaptability and flexibility. In particular, it provides higher processing precision and consistency in the processing of complex irregular slots and interconnected hole structures.

[0011] As a further description of the above technical solution: S2 includes: Multi-stage micro-stroke cutting is performed using micro-cutting tools with micro-serration structures; The depth of cut, step size, and feed rate of each segment are limited to control the material fracture path at the microscale. The propagation of cutting stress is constrained by the direction of the pre-guided structure, which is used to keep residual burrs within a controllable size range.

[0012] Through the above technical solutions, the pre-guided structure further optimizes the propagation path of cutting stress. Through precise stress guidance, stress concentration during the cutting process will not spread excessively, thereby avoiding unnecessary burr generation and improving the quality and stability of the entire removal process.

[0013] As a further description of the above technical solution: S2 also includes: Micro-stroke cutting is initiated within a preset delay time after the formation of the microcrack guide structure; Synchronization matching is performed based on the tool movement rhythm and the pre-guided path; The preset delay time is used to prevent the guide structure from deteriorating due to excessive time.

[0014] By using the above technical solutions, the cutting process and stress guiding structure can be perfectly matched in sync, thereby maximizing the role of the guiding structure and accurately guiding the material to fracture.

[0015] As a further description of the above technical solution: S3 includes: High-frequency pulse oscillations are applied to the cutting area to generate a local acoustic-thermal coupling effect; Adjusting the oscillation frequency, power density, and temperature rise rate allows the burrs to loosen under conditions of slight thermal expansion difference; Among them, the oscillation parameter is used to establish a controllable phase change stripping path between the burr and the substrate.

[0016] Through the above technical solution, the application of high-frequency pulse oscillation can effectively generate a local acoustic-thermal coupling effect, induce micro-thermal expansion differences on the material surface, and thus promote the loosening of burrs. By adjusting the oscillation frequency, power density and temperature rise rate, the bonding force between the burrs and the substrate is destroyed, achieving the effect of efficient burr removal.

[0017] As a further description of the above technical solution: S4 includes: After deburring, initiate negative pressure chip removal; Simultaneously, a fine mist of condensate is sprayed to capture suspended burr particles; The negative pressure suction and discharge and the condensate spraying are synchronized in time to prevent secondary adhesion of burrs.

[0018] Through the above technical solutions, the use of negative pressure chip removal can continuously draw away the stripped burr particles from the processing area, reducing the secondary adhesion of burrs. The spraying of micro-mist condensate not only helps to capture burr particles suspended in the air, but also uses the wetting properties of the condensate to enhance the adhesion of burr particles, thereby quickly gathering and removing them.

[0019] As a further description of the above technical solution: S4 also includes: The burr particles are adhered and captured based on the droplet size of the condensate; The collected particles are transported to the collection unit based on the chip discharge flow rate. Among them, the frequency of condensate spraying and the flow rate of chip removal work together to improve the efficiency of burr collection.

[0020] The above technical solutions make the burr removal process more efficient and intelligent. By adjusting the frequency of condensate spraying and the flow rate of chip removal, the efficiency of the entire burr collection and cleaning process can be effectively improved.

[0021] As a further description of the above technical solution: S5 includes: Crack propagation and peeling behavior are monitored using an acoustic emission sensing module; The cutting load and oscillation response are monitored using a vibration sensing module. The processing status is identified based on the monitoring signals, and feedback information is output for parameter adjustment.

[0022] The above technical solution achieves accurate identification and monitoring of the processing status and automatically generates feedback information for optimizing and adjusting cutting parameters. Through dynamic control of crack and burr behavior, cutting force and vibration response, the stability and consistency of the processing process can be improved.

[0023] As a further description of the above technical solution: S5 also includes: Based on feedback data, the parameters of the microcrack guiding structure, cutting rhythm, oscillation peeling parameters and chip removal sequence are dynamically corrected. The process strategy for subsequent cycles is updated based on processing stability and burr removal quality. Closed-loop adjustment is used to maintain the stability and consistency of the entire burr removal process.

[0024] Through the above technical solutions, dynamic adjustment of cutting parameters and process strategies can respond promptly to actual changes in the processing, prevent quality fluctuations caused by process fluctuations, and achieve the effect of synchronizing and maintaining consistency throughout the entire burr removal process.

[0025] This invention provides a method for removing burrs from irregularly shaped slots and connecting holes in printed circuit boards. It has the following beneficial effects: 1. In this invention, the micro-crack pre-guided structure is constructed by drilling at the connection points between grooves, grooves and holes, and holes. It has the advantages of efficient burr removal, significantly improved surface quality and consistency of printed circuit boards, simple operation, no need for complex equipment or highly skilled operators, reduced production costs, wide applicability, and can be applied to burr removal of various irregularly shaped grooves and holes.

[0026] 2. In this invention, the integrated monitoring of acoustic emission sensing and vibration sensing achieves the effect of real-time monitoring of processing status and dynamic adjustment of process parameters. By capturing crack propagation, burr peeling and cutting load changes, the system can adjust key parameters such as cutting rhythm and oscillation frequency based on real-time data to ensure the stability and accuracy of the processing.

[0027] 3. In this invention, the microcrack guiding structure and cutting parameters are adjusted through closed-loop feedback data, which achieves the effect of maintaining the stability and consistency of the burr removal process. Based on the feedback data, the system can correct the microcrack guiding structure parameters and cutting rhythm in real time, ensuring that the crack expands along the predetermined path, the burrs are removed stably, and the fluctuations in the processing are minimized.

[0028] 4. In this invention, by synchronously controlling the oscillation frequency and chip discharge flow rate, not only is the capture probability of burr particles improved, but also the captured particles are effectively removed before settling, thus avoiding the secondary re-attachment or re-adhesion of burrs to the surface of the processing area. Attached Figure Description

[0029] Figure 1 This is a flowchart of the method of the present invention. Detailed Implementation

[0030] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] To better understand the above technical solutions, the technical solutions of the present invention will be clearly and completely described below in conjunction with embodiments.

[0032] Please see the appendix Figure 1 This invention provides a method for removing burrs from irregularly shaped slots and connecting holes on printed circuit boards, comprising the following steps: S1. In the transition area between irregular slots and interconnecting holes on the printed circuit board, a microcrack pre-guided structure is constructed to guide the stress distribution of subsequent processing at a microscale. S1 includes: A microcrack guide structure is formed by applying pulsed piezoelectric extrusion or surface micro-impact to the transition region of the slot; The location of the microcrack guiding structure is determined based on the geometric changes and stress concentration trends of the region. By using structured width, depth, and spacing parameters, microcrack guiding structures can be adapted to guide the microfracture behavior of materials during subsequent processing. Among them, the microcrack pre-guided structure is constructed by drilling at the connection points of grooves, grooves and holes, and holes, and is used to add through holes at the intersections to remove burrs.

[0033] Specifically, to address the stress concentration and burr issues in the transition region of slots, pulsed piezoelectric extrusion or micro-impact technology is used to form spaced microcrack guiding structures in this region. By analyzing the geometric changes and stress concentration trends in the region, the location of the microcrack guiding structures is determined, enabling them to guide the material to generate controllable microfractures during subsequent processing. Compared with related technologies, by optimizing the internal stress field of the material in the pre-processing stage, crack propagation and burr generation are actively controlled, solving the problem of ineffective burr removal. The width, depth, and spacing of the microcrack guiding structure have structural characteristics, which enable it to effectively guide the crack to propagate along a predetermined path without compromising the macroscopic properties of the material, and prevent burrs from extending to unwanted locations. By adding through holes at grooves, holes, and intersections, a multi-path stress guiding network is formed, which further optimizes the stress distribution. In particular, at intersections where stress is prone to concentration, the generation of unstable burrs is effectively suppressed.

[0034] S1 also includes: The stress direction of the slot profile, connecting hole position, and interface was analyzed by using a computer-aided model. The arrangement path of the microcrack guiding structure is calculated based on the analysis results; The layout path is used to cover corner edges and areas of sudden local stress changes.

[0035] Specifically, by introducing a computer-aided model, the stress direction of the slot profile, the location of the connecting holes, and the junction is quantitatively analyzed. By simulating the stress flow direction at the structural geometry, local corners, and junction abrupt changes, the potential crack initiation path and energy accumulation zone of the material under subsequent cutting and vibration can be obtained. Based on this analysis, the arrangement path of the microcrack guiding structure can be calculated so that it can cover the corner edges and stress abrupt change areas, thereby constructing a continuous and efficient stress guiding line inside the material. This arrangement is not a simple geometric equidistant layout, but rather a path optimization based on key stress points identified by the computational model. This ensures that the microcrack guiding structure aligns with the natural stress direction of the material, promoting preferential crack propagation along the preset path during subsequent processing. This reduces the randomness and uncontrollability of burr formation from the source. By using computational analysis to couple the microcrack guiding structure with the material's inherent stress flow field, the guiding structure becomes a low-energy channel for crack propagation. Under localized loads, the material undergoes microfracture along the preset path, rather than disordered tearing in high-stress areas. This transforms the burr generation and detachment process from passive control to predictable and designable active regulation.

[0036] S2. Perform low-stroke micro-cutting on irregular slots and connecting hole areas to promote material fracture and reduce burr generation along the direction of the microcrack guide structure. S2 includes: Multi-stage micro-stroke cutting is performed using micro-cutting tools with micro-serration structures; The depth of cut, step size, and feed rate of each segment are limited to control the material fracture path at the microscale. The propagation of cutting stress is constrained by the direction of the pre-guided structure, which is used to keep residual burrs within a controllable size range.

[0037] Specifically, a micro-cutting tool with a micro-serrated structure is used to perform multi-segment micro-stroke cutting on the area pre-guided by S1. The micro-serrated profile of this type of tool can generate periodic loads within a microscale range, causing the material surface to form a fine and controllable fracture surface at the moment of stress. Through the segmented micro-stroke machining method, the cutting force is not released in a concentrated manner in a single infeed, but is applied gradually in a small amplitude and controllable sequence, thereby avoiding overall tearing; During multi-stage cutting, the depth of cut, step size, and feed rate for each stage are strictly limited to ensure that the cutting energy remains within the range that the microcrack guiding structure can withstand and guide. This parameter constraint prevents cracks from propagating beyond their limits, instead guiding them slowly along a predetermined area to ultimately form a fracture zone with controlled dimensions. In the direction of the cutting load, this invention constrains the propagation of cutting stress by referencing the pre-guided structure direction established in S1, ensuring that the main transmission direction of the cutting force is consistent with the microcrack guiding path. This approach ensures that residual burrs no longer extend randomly along the material's natural weak areas but are instead locked within a predictable range, ultimately resulting in a morphology with controllable dimensions that is easy to subsequently peel off.

[0038] S2 also includes: Micro-stroke cutting is initiated within a preset delay time after the formation of the microcrack guide structure; Synchronization matching is performed based on the tool movement rhythm and the pre-guided path; The preset delay time is used to prevent the guide structure from deteriorating due to excessive time.

[0039] Specifically, by allowing a certain delay time before micro-stroke cutting, the microcrack-guided structure can be fully stabilized, avoiding unnecessary damage caused by immediate cutting when the crack has just formed. The delay time ensures the relief of material stress and the stable development of cracks, thereby preventing the microcrack-guided structure from degrading due to excessive early cutting loads. Synchronization between tool movement and the pre-guided path enables precise stress transfer, ensuring crack propagation follows a predetermined trajectory and reducing the randomness and dimensional inhomogeneity of burrs. This synchronization also improves the accuracy of burr removal, ensuring the efficiency and consistency of the cutting process. By delaying the start of micro-stroke cutting and synchronizing tool movement with the pre-guided structure, the cutting timing and mechanical response are further refined in microscale material fracture control and burr removal, thereby guaranteeing the controllability and consistency of machining quality.

[0040] S3. Apply pulsed oscillation to the area where micro-cutting has been completed for burr removal, so that the burrs are removed from the substrate surface under acoustic-thermal coupling conditions. S3 includes: High-frequency pulse oscillations are applied to the cutting area to generate a local acoustic-thermal coupling effect; Adjusting the oscillation frequency, power density, and temperature rise rate allows the burrs to loosen under conditions of slight thermal expansion difference; Among them, the oscillation parameter is used to establish a controllable phase change stripping path between the burr and the substrate.

[0041] Specifically, when high-frequency pulse oscillations act on a material, they trigger an acoustic-thermal coupling effect, where the energy transmitted through sound waves is converted into heat, causing a sudden temperature rise in a localized area and resulting in micro-expansion of the material. This micro-expansion is asynchronous with the thermal expansion of the substrate, creating a localized stress difference. This reduces the bonding force between the burr and the substrate, ultimately leading to burr detachment. By adjusting the oscillation frequency, power density, and temperature rise rate, the amplitude and distribution of the thermal expansion difference can be precisely controlled, thereby optimizing the burr removal process. Under oscillation, localized temperature changes on the material surface trigger phase transitions in microscopic regions, such as solid-state phase transitions and localized transformations between elastic and plastic deformation. This phase transition path allows burrs to separate from the substrate along a predetermined direction with minimal energy consumption. This not only improves the efficiency of burr removal but also ensures the integrity and surface quality of the substrate. Through the acoustic-thermal coupling effect generated by high-frequency pulse oscillation and precise control of oscillation parameters, the burr loosening process can be controlled and guided, forming a new path for burr removal.

[0042] S4. Start the chip removal process within the time window after the burr is removed, and remove the burrs from the processing area by negative pressure suction and condensation capture. S4 includes: After deburring, initiate negative pressure chip removal; Simultaneously, a fine mist of condensate is sprayed to capture suspended burr particles; The negative pressure suction and discharge and the condensate spraying are synchronized in time to prevent secondary adhesion of burrs.

[0043] Specifically, the negative pressure chip removal system is activated immediately after the burrs are removed, so that the fine burrs generated at the moment of removal can be quickly extracted from the processing area along the negative pressure channel. The negative pressure chip removal system constructs a directional airflow in a transient adsorption manner, so that the burr particles will not remain or fall back on the processing surface. The high-speed airflow is formed by the pressure difference, which directly carries the particles that have not yet settled away from the interface, avoiding them from participating in secondary contact or scratching the substrate. Simultaneously with the negative pressure chip removal, a micro-mist condensate is sprayed. The condensate enters the chip removal channel in the form of a micro-mist, forming a thin layer around the rapidly moving burr particles. This causes the suspended particles to agglomerate, become humidified, and gain weight, thereby accelerating their capture by the negative pressure airflow. This spraying method does not rely on large amounts of liquid rinsing, but improves the capture efficiency of fine particles through micro-mist condensation. It enhances the settling ability of burr particles in the air without affecting the structural state of the processing area. The negative pressure suction and discharge and the condensate spraying are synchronized in time. When the burrs are just removed by vibration, there is still a certain amount of heat and kinetic energy on the surface. At this time, the synchronous suction and discharge can make the most of the time window before the particles have completely settled, and capture them directly in the air. At the same time, the micro-mist condensate quickly covers the particle surface, making it impossible for them to float again, and preventing the burrs from falling back and adhering to the edge of the slot or the internal structure.

[0044] S4 also includes: The burr particles are adhered and captured based on the droplet size of the condensate; The collected particles are transported to the collection unit based on the chip discharge flow rate. Among them, the frequency of condensate spraying and the flow rate of chip removal work together to improve the efficiency of burr collection.

[0045] Specifically, after the particles are adhered and captured, the chip discharge flow rate enables the coated particles to migrate stably along the negative pressure channel and be quickly transported to the collection point under the drive of airflow. By controlling the instantaneous flow velocity gradient in the chip discharge pipe, it can be ensured that the particles will not be retained, backflowed or deposited, thereby establishing a continuous channel from capture to transport. By utilizing the synergy of flow field shear force and adhesion weight gain effect, the particles maintain the ability to move with the flow and achieve stable far-end discharge. When the spraying frequency is increased, the number of effective coated droplets generated per unit time increases, which can significantly improve the adhesion probability of suspended burrs. The increase in chip removal flow rate can ensure that these newly formed composite particles are quickly removed from the processing area before they fall into place. The droplet formation rate determines the upper limit of the capture capacity, while the chip removal flow rate determines whether the captured particles can be removed in the first time. Only when both are synchronized can we avoid the situation where the droplets have not yet taken effect and the particles have already settled, or the captured particles have been re-attached due to insufficient suction and removal.

[0046] S5. Adjust parameters based on feedback monitoring data to dynamically control the burr removal process.

[0047] S5 includes: Crack propagation and peeling behavior are monitored using an acoustic emission sensing module; The cutting load and oscillation response are monitored using a vibration sensing module. The processing status is identified based on the monitoring signals, and feedback information is output for parameter adjustment.

[0048] Specifically, the acoustic emission sensing module first monitors the crack propagation and burr removal behavior in the processing area in real time. The acoustic emission signal can capture the transient energy released when the crack propagates at the microscale, enabling the system to identify the crack initiation position, propagation rate and mechanical changes during the removal process, thus providing an accurate basis for judging whether the burr has stably detached along the pre-guided path. Secondly, a vibration sensing module is used to synchronously monitor the cutting load and oscillation response. This module analyzes the vibration amplitude, frequency, and load fluctuations of the tool and workpiece system, and can reflect changes in cutting force, the coupling effect of oscillation energy, and minute deviations in the tool contact state in real time, enabling a comprehensive assessment of the mechanical stability during the machining process. Finally, by comprehensively processing the acoustic emission and vibration monitoring signals, and using the identification results through the feedback control module to dynamically adjust the cutting and oscillation parameters, the system can identify the processing status in real time, automatically correct abnormal working conditions, and maintain the stability of crack guidance and burr removal. The adjustment mechanism enables the processing system to maintain adaptive control under complex loads and microscale crack evolution, greatly improving the accuracy and consistency of burr removal.

[0049] S5 also includes: Based on feedback data, the parameters of the microcrack guiding structure, cutting rhythm, oscillation peeling parameters and chip removal sequence are dynamically corrected. The process strategy for subsequent cycles is updated based on processing stability and burr removal quality. Closed-loop adjustment is used to maintain the stability and consistency of the entire burr removal process.

[0050] Specifically, firstly, the parameters of the microcrack guiding structure, cutting rhythm, oscillation peeling parameters, and chip removal sequence are dynamically corrected based on real-time feedback data. By integrating the signals obtained from the acoustic emission and vibration sensing modules, the current processing status is evaluated, and the corresponding parameters are adjusted in real time according to data changes. When the crack propagation speed does not meet expectations, the system will adjust the guiding path of the microcrack guiding structure, or optimize the synchronization between the vibration frequency and the cutting rhythm based on the oscillation response, so as to remain undisturbed and stable during the burr removal process. The system updates the process strategy for subsequent cycles based on processing stability and burr removal quality. By analyzing data feedback from the previous cycle, it identifies potential deviations or instabilities during processing and further optimizes parameters such as cutting depth and feed rate to better suit the current material condition and cutting requirements. This achieves continuous adaptation of the processing technology to different working conditions, avoiding accuracy degradation or processing failures caused by fixed parameter settings.

[0051] Through a closed-loop adjustment mechanism, the system maintains the stability and consistency of the entire burr removal process. By continuously monitoring and dynamically correcting key processing parameters, the system can automatically respond to sudden changes or abnormal fluctuations that occur during processing, keeping the burr removal operation in the best condition at all times, thereby effectively improving processing accuracy, quality and production efficiency.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for removing burrs from irregularly shaped slots and connecting holes on printed circuit boards, characterized in that, Includes the following steps: S1. In the transition area between irregular slots and interconnecting holes on the printed circuit board, a microcrack pre-guided structure is constructed to guide the stress distribution of subsequent processing at a microscale. S2. Perform low-stroke micro-cutting on irregular slots and connecting hole areas to promote material fracture and reduce burr generation along the direction of the microcrack guide structure. S3. Apply pulsed oscillation to the area where micro-cutting has been completed for burr removal, so that the burrs are removed from the substrate surface under acoustic-thermal coupling conditions. S4. Start the chip removal process within the time window after the burr is removed, and remove the burrs from the processing area by negative pressure suction and condensation capture. S5. Adjust parameters based on feedback monitoring data to dynamically control the burr removal process.

2. The method for removing burrs from irregularly shaped slots and connecting holes on printed circuit boards according to claim 1, characterized in that, S1 includes: A microcrack guide structure is formed by applying pulsed piezoelectric extrusion or surface micro-impact to the transition region of the slot; The location of the microcrack guiding structure is determined based on the geometric changes and stress concentration trends of the region. By using structured width, depth, and spacing parameters, microcrack guiding structures can be adapted to guide the microfracture behavior of materials during subsequent processing. Among them, the microcrack pre-guided structure is constructed by drilling at the connection points of grooves, grooves and holes, and holes, and is used to add through holes at the intersections to remove burrs.

3. The method for removing burrs from irregularly shaped slots and connecting holes on printed circuit boards according to claim 1, characterized in that, S1 further includes: The stress direction of the slot profile, connecting hole position, and interface was analyzed by using a computer-aided model. The arrangement path of the microcrack guiding structure is calculated based on the analysis results; The arrangement path is used to cover corner edges and areas of sudden stress changes.

4. The method for removing burrs from irregularly shaped slots and connecting holes on printed circuit boards according to claim 1, characterized in that, S2 includes: Multi-stage micro-stroke cutting is performed using micro-cutting tools with micro-serration structures; The depth of cut, step size, and feed rate of each segment are limited to control the material fracture path at the microscale. The propagation of cutting stress is constrained by the direction of the pre-guided structure, which is used to keep residual burrs within a controllable size range.

5. The method for removing burrs from irregularly shaped slots and connecting holes on a printed circuit board according to claim 1, characterized in that, S2 further includes: Micro-stroke cutting is initiated within a preset delay time after the formation of the microcrack guide structure; Synchronization matching is performed based on the tool movement rhythm and the pre-guided path; The preset delay time is used to prevent the guide structure from deteriorating due to excessive time.

6. The method for removing burrs from irregularly shaped slots and connecting holes on a printed circuit board according to claim 1, characterized in that, S3 includes: High-frequency pulse oscillations are applied to the cutting area to generate a local acoustic-thermal coupling effect; Adjusting the oscillation frequency, power density, and temperature rise rate allows the burrs to loosen under conditions of slight thermal expansion difference; Among them, the oscillation parameter is used to establish a controllable phase change stripping path between the burr and the substrate.

7. The method for removing burrs from irregularly shaped slots and connecting holes on a printed circuit board according to claim 1, characterized in that, S4 includes: After deburring, initiate negative pressure chip removal; Simultaneously, a fine mist of condensate is sprayed to capture suspended burr particles; The negative pressure suction and discharge and the condensate spraying are synchronized in time to prevent secondary adhesion of burrs.

8. The method for removing burrs from irregularly shaped slots and connecting holes on a printed circuit board according to claim 1, characterized in that, S4 further includes: The burr particles are adhered and captured based on the droplet size of the condensate; The collected particles are transported to the collection unit based on the chip discharge flow rate. Among them, the frequency of condensate spraying and the flow rate of chip removal work together to improve the efficiency of burr collection.

9. The method for removing burrs from irregularly shaped slots and connecting holes on a printed circuit board according to claim 1, characterized in that, S5 includes: Crack propagation and peeling behavior are monitored using an acoustic emission sensing module; The cutting load and oscillation response are monitored using a vibration sensing module. The processing status is identified based on the monitoring signals, and feedback information is output for parameter adjustment.

10. The method for removing burrs from irregularly shaped slots and connecting holes on a printed circuit board according to claim 1, characterized in that, The S5 also includes: Based on feedback data, the parameters of the microcrack guiding structure, cutting rhythm, oscillation peeling parameters and chip removal sequence are dynamically corrected. The process strategy for subsequent cycles is updated based on processing stability and burr removal quality. Closed-loop adjustment is used to maintain the stability and consistency of the entire burr removal process.

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