Method of resin plug hole and printed circuit board

Abstract

The application relates to the technical field of printed circuit boards, and discloses a resin hole plugging method and a printed circuit board. The resin hole plugging method comprises the following steps: providing a substrate, the substrate has a back hole surface and a connecting surface, the substrate is provided with a to-be-plugged hole position, and the to-be-plugged hole position penetrates through the hole surface; obtaining three-dimensional shape information of the connecting surface; providing a backing plate, and machining a supporting surface which is matched with the connecting surface on the backing plate according to the three-dimensional shape information; placing the substrate on the backing plate, so that the connecting surface is attached to the supporting surface; and plugging resin ink into the to-be-plugged hole position from the side of the substrate which is away from the backing plate. The resin hole plugging method and the printed circuit board provided by the application are used for solving the problem that resin ink of a conventional resin hole plugging method is easy to overflow from the bottom of a substrate and pollute a board surface.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and more particularly to a method for resin-filled vias and a printed circuit board. Background Technology

[0002] In the production process of printed circuit boards, it is often necessary to fill some holes with resin, that is, to fill the holes with resin ink and then cure the resin ink.

[0003] Conventional resin plugging methods typically employ a combination of a plugging screen, a substrate, and a pad. The substrate is placed on the pad, and then resin is plugged into the holes of the substrate using a plugging screen positioned above the substrate. However, the resin ink is prone to overflowing from the bottom of the substrate, contaminating the board surface. Summary of the Invention

[0004] This application provides a method for resin plugging and a printed circuit board, which solves the problem that resin ink easily overflows from the bottom of the substrate and contaminates the board surface in conventional resin plugging methods.

[0005] In a first aspect, embodiments of this application provide a method for resin plugging, comprising: A substrate is provided, the substrate having a plugging surface and a connecting surface opposite to each other, the substrate having a hole to be plugged, the hole to be plugged penetrating the plugging surface; Obtain the three-dimensional shape information of the connecting surface; A pad is provided, and a support surface adapted to the connection surface is machined on the pad according to the three-dimensional shape information; The substrate is placed on the pad so that the connecting surface is in contact with the supporting surface; Resin ink is inserted into the hole to be filled from the side of the substrate away from the pad.

[0006] In some embodiments, obtaining the three-dimensional shape information of the connection surface includes: The connection surface is divided into multiple sampling areas; Obtain the three-dimensional shape information corresponding to each sampling region.

[0007] In some embodiments, machining a support surface adapted to the connection surface on the pad according to the three-dimensional shape information includes: The pad is divided into multiple processing areas, and the multiple processing areas are set up to correspond to the multiple sampling areas; Based on the three-dimensional shape information of the corresponding sampling area, a processing surface is processed in the corresponding processing area, and the support surface includes all the processing surfaces corresponding to the processing areas.

[0008] In some embodiments, obtaining the three-dimensional shape information corresponding to each sampling region includes: Select sampling points within the sampling area; Obtain the three-dimensional coordinate information corresponding to the sampling point, and use the three-dimensional coordinate information as the three-dimensional shape information of the current sampling area.

[0009] In some embodiments, the number of sampling points is multiple, and the multiple sampling points are distributed at intervals.

[0010] In some embodiments, obtaining the three-dimensional shape information of the connection surface specifically includes: placing the substrate on the measurement surface, the measurement surface being a plane, the plugging surface facing the measurement surface, and obtaining the height information of the substrate corresponding to different regions of the connection surface; Alternatively, obtaining the three-dimensional shape information of the connecting surface specifically includes: obtaining the three-dimensional shape information of the connecting surface by three-dimensional laser scanning; Alternatively, obtaining the three-dimensional shape information of the connecting surface may specifically include obtaining the three-dimensional shape information of the connecting surface through white light photogrammetry.

[0011] In some embodiments, before obtaining the three-dimensional shape information of the connection surface, the method for plugging the resin hole further includes: The initial warpage of the substrate is measured. If the initial warpage is greater than a preset value, the substrate is corrected so that the actual warpage of the substrate is less than or equal to the preset value.

[0012] In some embodiments, the pad is provided with air guide holes, the air guide holes including a first hole and a second hole that are connected, the diameter of the first hole is larger than the diameter of the second hole, the first hole has an opening formed in the support surface, the first hole is disposed opposite to and connected to the hole to be plugged, and the diameter of the first hole is larger than the diameter of the hole to be plugged.

[0013] In some embodiments, the pad is an aluminum substrate containing a lubricating aluminum sheet.

[0014] Secondly, embodiments of this application provide a printed circuit board, which is manufactured by the resin plugging method described in the first aspect.

[0015] The resin plugging method provided in this application has the following advantages: Since the substrate has a plugging surface and a connecting surface facing away from each other, and the substrate is provided with a hole to be plugged, the hole to be plugged penetrates the plugging surface, and the three-dimensional shape information of the connecting surface is obtained first, and then a support surface that matches the connecting surface is processed on the pad according to the three-dimensional shape information, so when the substrate is placed on the pad, the connecting surface and the support surface can be made to fit together, thereby preventing the resin from overflowing from the bottom of the substrate and contaminating the board surface when resin ink is plugged into the hole to be plugged from the side of the substrate away from the pad.

[0016] The advantages of the printed circuit board provided in this application compared to the prior art can be seen in the description of the advantages of the resin plugging method provided in this application compared to the prior art, which will not be repeated here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart of a resin plugging method in one embodiment of this application; Figure 2 This is a schematic diagram of the substrate structure in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of the pad in one embodiment of this application; Figure 4 It is based on three-dimensional shape information Figure 3 The diagram shows a support surface machined on the pad to fit the connection surface; Figure 5 Is Figure 4 The diagram shows a gas vent machined into the pad. Figure 6 This is a schematic diagram of resin ink being inserted into the hole to be filled from the side of the substrate away from the pad in one embodiment of this application; Figure 7 Is Figure 6 A schematic diagram of the substrate structure after resin ink has been inserted into the holes to be filled; Figure 8 This is a diagram showing the thickness data of different regions of the substrate in one embodiment of this application; Figure 9 yes Figure 8 The thickness distribution diagram corresponding to the substrate is shown.

[0019] The markings in the diagram mean: 10. Substrate; 101. Hole-plugging surface; 102. Connecting surface; 103. Hole to be plugged; 20. Pad; 201. Support surface; 21. Air vent; 211. First hole; 212. Second hole; 30. Perforated screen; 301. Screen perforation; 40. Hole plugging machine; 50. Resin ink. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0023] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0024] In the production process of printed circuit boards, it is often necessary to fill some holes with resin, that is, to fill the holes with resin ink and then cure the resin ink.

[0025] Conventional resin via-filling methods typically employ a combination of a via-filling screen, a substrate, and a backing plate. The substrate is placed on the backing plate, and resin is then filled into the vias of the substrate using a via-filling screen positioned above it. However, due to thickness tolerances in the laminated substrate, warping and deformation can occur. Consequently, the substrate and backing plate may not adhere tightly, resulting in gaps between them during via filling. This causes the resin ink to easily overflow from the bottom of the substrate through the vias, forming a "pasty" resin ink defect that contaminates the board surface.

[0026] In view of this, this application provides a method for resin plugging and a printed circuit board. Since the substrate has a plugging surface and a connecting surface facing away from each other, and the substrate is provided with a hole to be plugged, the hole to be plugged penetrates the plugging surface. The three-dimensional shape information of the connecting surface is obtained first, and then a support surface that matches the connecting surface is processed on the pad according to the three-dimensional shape information. Therefore, when the substrate is placed on the pad, the connecting surface and the support surface can be made to fit together. Thus, when resin ink is plugged into the hole to be plugged from the side of the substrate away from the pad, the resin is prevented from overflowing from the bottom of the substrate and contaminating the board surface.

[0027] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0028] Please refer to Figure 1 and Figure 2 In a first aspect, embodiments of this application provide a method for resin plugging, comprising: S100: A substrate 10 is provided, the substrate 10 having a plugging surface 101 and a connecting surface 102 facing away from each other, and the substrate 10 having a plugging position 103, the plugging position 103 penetrating the plugging surface 101.

[0029] The substrate 10 can be a multilayer board with multiple circuit layers, and its thickness can be 4mm-10mm. The hole to be plugged 103 can be a metallized hole or a non-metallized hole. The hole to be plugged 103 can penetrate the connecting surface 102.

[0030] S200: Obtain the three-dimensional shape information of the connection surface 102.

[0031] The three-dimensional shape information of the connecting surface 102 can be obtained by a coordinate measuring machine, or by three-dimensional laser scanning or white light photogrammetry.

[0032] S300: Please refer to this as well. Figures 3 to 5 A pad 20 is provided, and a support surface 201 adapted to the connecting surface 102 is machined on the pad 20 according to the three-dimensional shape information.

[0033] The support surface 201, which is adapted to the connecting surface 102, can be machined on the pad 20 by means of mechanical milling or 3D printing. The material of the pad 20 can be iron, steel, or aluminum, etc.

[0034] For example, the pad 20 is fixed on the worktable of a CNC deep machining equipment. The three-dimensional shape information of the connecting surface 102 is input, and a deep milling cutter is used to perform contour-guided deep machining on the upper surface of the pad 20. For the downward-arched areas on the connecting surface 102, a downward-protruding structure is machined at the corresponding position on the pad 20. For the upward-recessed areas on the connecting surface 102, a downward-recessed structure is machined at the corresponding position on the pad 20, or a flat surface is maintained. After the deep machining is completed, the three-dimensional morphology of the support surface 201 and the three-dimensional morphology of the connecting surface 102 are complementary and correspond to each other. That is, in the hole-plugging assembly state, the connecting surface 102 and the support surface 201 achieve zero-gap tight fit, providing strong support during hole plugging and solving the problems of bonding gaps and resin ink overflow caused by the thickness uniformity and warping of the substrate 10.

[0035] It is understandable that drilling information of the hole positions 103 to be plugged in the substrate 10 during the previous process can be recorded. For example, when the hole positions 103 to be plugged include through holes and back drilled holes, the drilling information includes: Through-hole information: through-hole location coordinates, hole diameter, and hole density distribution.

[0036] Back-drilling information: back-drilling location coordinates, back-drilling depth, and back-drilling diameter.

[0037] The drilling information mentioned above is used to determine the distribution position of the air guide holes 21 on the pad 20, ensuring that the air guide holes 21 correspond one-to-one with the holes to be plugged 103. Subsequently, air guide holes 21 corresponding to the holes to be plugged 103 can be machined on the pad 20.

[0038] S400: Please refer to this as well. Figure 6 Place the substrate 10 on the pad 20 so that the connecting surface 102 is in contact with the supporting surface 201.

[0039] When the substrate 10 is placed on the pad 20, the connecting surface 102 and the supporting surface 201 are in contact, that is, there is no gap between the connecting surface 102 and the supporting surface 201.

[0040] S500: Please refer to this as well. Figure 7 Resin ink 50 is inserted into the hole to be filled 103 from the side of the substrate 10 away from the pad 20.

[0041] The substrate 10 can be placed on the hole-filling machine 40. A hole-filling screen 30 is placed on the side of the substrate 10 away from the pad 20. Resin ink 50 is inserted into the hole to be filled 103 through the screen holes 301 of the hole-filling screen 30.

[0042] For example, the perforated screen plate 30, the pad 20, and the perforation machine 40 are arranged in a top-to-bottom order.

[0043] A screen printing plate 30 is positioned on the top layer and is used to quantitatively transfer resin ink 50 to the holes to be filled 103. The screen printing plate 30 consists of a frame, mesh, and an aluminum sheet. The aluminum sheet is attached to the mesh and has screen printing holes 301 corresponding to the holes to be filled 103, used to guide the resin ink 50 to fall precisely into the holes to be filled 103. The diameter of the screen printing holes 301 is slightly larger than the diameter of the holes to be filled 103 on the substrate 10 to ensure that the resin ink 50 is fully filled into the holes to be filled 103. The position of the screen printing holes 301 is precisely located according to the drilling position data of the holes to be filled 103.

[0044] The substrate 10 is clamped between the screen 30 and the pad 20, and precise alignment of the substrate 10 and the pad 20 is ensured by using positioning pins or a vision alignment system. The pad 20 is located below the substrate 10 to support the substrate 10 and expel air from the holes 103 to be plugged. Adjustment is performed to align the centers of the screen holes 301, the holes 103 to be plugged, and the air guide holes 21. The plugging machine 40 is located at the bottom layer and is used to support and fix the entire plugging assembly. The plugging machine 40 is the working platform of the resin plugging equipment, which integrates a vacuum adsorption system to evacuate the holes 103 to be plugged before plugging, expelling air from the holes 103. The vacuum level is <20 Pa, and the evacuation time is 60s-120s.

[0045] The resin ink 50 is evenly coated on the surface of the screen 30 for plugging holes. The squeegee (squeegee) is activated to scrape the resin ink 50 through the screen hole 301, so that the resin ink 50 falls into and fills the hole 103 to be plugged. The air vent 21, in conjunction with the vacuum system of the plugging machine 40, continuously removes the air from the hole 103 to be plugged, ensuring that the resin ink 50 completely fills the hole 103 without air bubbles, thus completing the plugging process.

[0046] As can be seen from the above, the resin plugging method provided in this application embodiment has a plugging surface 101 and a connecting surface 102 facing opposite directions on the substrate 10. The substrate 10 is provided with a plugging position 103 that penetrates the plugging surface 101. The three-dimensional shape information of the connecting surface 102 is obtained first, and then a support surface 201 that matches the connecting surface 102 is processed on the pad 20 according to the three-dimensional shape information. Therefore, when the substrate 10 is placed on the pad 20, the connecting surface 102 and the support surface 201 can be made to fit together. Thus, when resin ink 50 is plugged into the plugging position 103 on the side of the substrate 10 away from the pad 20, the resin is prevented from overflowing from the bottom of the substrate 10 and contaminating the board surface.

[0047] It is understandable that after the resin ink 50 is inserted into the hole 103 on the side of the substrate 10 away from the pad 20, baking, grinding and subsequent processes can continue: Baking: After plugging the holes, perform segmented high-temperature baking to fully cure the resin ink 50 and form a stable filling structure.

[0048] Grinding: After the resin ink 50 has fully cured, use a grinding plate to grind the surface of the plug hole to remove excess resin ink 50 overflowing from the hole and make the plate surface flat.

[0049] Post-processing: Complete subsequent routine manufacturing processes such as circuit fabrication.

[0050] It should be noted that for substrates 10 of the same model and batch, since the lamination parameters are consistent, their thickness data are the same and consistent, that is, the three-dimensional shape information of the connecting surface 102 is consistent (with only slight differences, which are within an acceptable range). Therefore, for substrates 10 of the same model and batch, the same pad 20 can be used.

[0051] Please refer to Figure 1 and Figure 2 In some embodiments, obtaining the three-dimensional shape information of the connection surface 102 includes: First, the connecting surface 102 is divided into multiple sampling areas.

[0052] Secondly, obtain the three-dimensional shape information corresponding to each sampling area.

[0053] By adopting the above scheme, the three-dimensional shape information of the entire connecting surface 102 can be obtained relatively easily and accurately.

[0054] Optionally, a support surface 201 adapted to the connecting surface 102 is machined on the pad 20 according to the three-dimensional shape information, including: First, the pad 20 is divided into multiple processing areas, and multiple processing areas are set up to correspond to multiple sampling areas.

[0055] Secondly, based on the three-dimensional shape information of the corresponding sampling area, the processing surface is processed in the corresponding processing area, and the support surface 201 includes the processing surfaces corresponding to all processing areas.

[0056] This design allows for the convenient and accurate fabrication of a support surface 201 that matches the connecting surface 102, ensuring that the support surface 201 fits tightly against the connecting surface 102.

[0057] As a feasible approach, the three-dimensional shape information corresponding to each sampling region is obtained, including: First, select sampling points within the sampling area.

[0058] Secondly, obtain the three-dimensional coordinate information corresponding to the sampling point, and use the three-dimensional coordinate information as the three-dimensional shape information of the current sampling area.

[0059] This setup allows for convenient and rapid acquisition of the three-dimensional shape information of each sampling area.

[0060] It is understandable that when machining surfaces within a corresponding machining area using mechanical milling, the depth of control for the entire machining area can be determined based on the three-dimensional coordinate information corresponding to the sampling points. That is, the machining surface corresponding to each machining area is a plane, and the height of the machining surface corresponding to different machining areas is different.

[0061] Optionally, there may be multiple sampling points, and these sampling points may be distributed at intervals.

[0062] This setup allows for convenient, rapid, and accurate acquisition of the three-dimensional shape information of each sampling area, avoiding single-point sampling errors.

[0063] Please refer to Figure 1 and Figure 2 In some embodiments, obtaining the three-dimensional shape information of the connection surface 102 specifically includes: placing the substrate 10 on the measurement surface, the measurement surface being a plane, the plugging surface 101 facing the measurement surface, and obtaining the height information of the substrate 10 corresponding to different regions of the connection surface 102.

[0064] By adopting the above scheme, the three-dimensional shape information of the entire connecting surface 102 can be obtained relatively easily and accurately.

[0065] It should be noted that while obtaining the height information of the substrate 10 corresponding to different regions of the connection surface 102, the position information along the length and width directions of the substrate 10 corresponding to different regions can also be obtained, thereby obtaining the three-dimensional coordinate information corresponding to different regions, and using this three-dimensional coordinate information as the three-dimensional shape information.

[0066] It is understandable that dividing the connection surface 102 into multiple sampling areas allows for the acquisition of height information of the substrate 10 corresponding to different sampling areas, i.e., the thickness information of the substrate 10 corresponding to different sampling areas. Multiple sampling points can be set within each sampling area, and the average height information corresponding to multiple sampling points is used as the height information corresponding to the current area, i.e., the thickness information of the substrate 10 corresponding to the current area. A high-precision thickness gauge can be used to measure the thickness of different areas of the connection surface 102 of the substrate 10 at multiple points, recording the thickness distribution data to form a thickness tolerance information package. The measured sampling points should cover all areas of the connection surface 102 of the substrate 10, including corner areas and the center area, to comprehensively reflect the thickness distribution characteristics.

[0067] For example, please refer to Figure 7 and Figure 8 When the connecting surface 102 is divided into 16 sampling areas, the height information of the substrate 10 corresponding to each of the 16 sampling areas can be obtained, i.e., the thickness information of the substrate 10 corresponding to each of the 16 sampling areas. During the processing of the support surface 201, it is manufactured in 16 processing areas with controlled fabrication, and the control depth is adapted to the thickness information of the corresponding sampling area. Specifically, in... Figure 9 In the figure, the horizontal axis represents the division of the 16 sampling areas into four groups, and the vertical axis represents the board thickness corresponding to different sampling areas, in mm. The board thickness is greater in the central area of ​​the substrate 10 and less in the surrounding areas, with a thickness range of 0.33 mm. The thicker the board, the greater the thickness range will be.

[0068] In other embodiments, obtaining the three-dimensional shape information of the connection surface 102 specifically includes obtaining the three-dimensional shape information of the connection surface 102 by means of three-dimensional laser scanning.

[0069] Alternatively, obtain the three-dimensional shape information of the connection surface 102, specifically by obtaining the three-dimensional shape information of the connection surface 102 through white light photogrammetry.

[0070] By adopting the above scheme, the three-dimensional shape information of the entire connecting surface 102 can be obtained relatively easily and accurately.

[0071] Please refer to Figure 1 and Figure 2 In some embodiments, the method for resin plugging the orifice before obtaining the three-dimensional shape information of the connection surface 102 further includes: The initial warpage of substrate 10 is measured. If the initial warpage is greater than a preset value, substrate 10 is corrected so that the actual warpage of substrate 10 is less than or equal to the preset value.

[0072] By adopting the above solution, it is possible to avoid excessive initial warpage of the substrate 10, which would make it difficult to process the support surface 201.

[0073] It should be noted that the initial warpage of the substrate 10 can be measured using the IPC (International Electron Industries Connection Association) standard. The thickness tolerance information package, the warpage distribution data (including the three-dimensional topography image), and the drilling location data can be integrated into the substrate 10 information package, which serves as the input parameters for the subsequent processing of the support surface 201 on the pad 20. The pad 20 is then processed in this way, so that the shape of the support surface 201 actively conforms to the shape of the connecting surface 102.

[0074] For example, if the initial warpage is ≤0.7%, it is considered a normal board. The three-dimensional shape information of the connecting surface 102 is directly obtained, such as measuring the board thickness, and the average board thickness is confirmed to be the control depth of the pad 20, in order to process the support surface 201. If the initial warpage is >0.7%, it is initially determined to be an abnormal board, requiring additional reverse pressure baking treatment to correct the substrate 10. When the warpage is improved by the reverse pressure baking treatment, if the substrate 10 deforms due to the pressure of the hole-filling screen 30 during hole filling, the substrate 10 is treated as a normal board as described above. When the warpage is severe (>0.7%) after the reverse pressure baking treatment, and the substrate 10 does not deform due to the pressure of the hole-filling screen 30 during hole filling, the support surface 201 of the pad 20 needs to be raised and lowered according to the curvature of the connecting surface 102 of the substrate 10, i.e., to compensate and correct the aforementioned control depth.

[0075] Please refer to Figures 3 to 6 Optionally, the pad 20 is provided with an air guide hole 21, which includes a first hole 211 and a second hole 212 that are connected. The diameter of the first hole 211 is larger than the diameter of the second hole 212. The first hole 211 has an opening formed on the support surface 201. The first hole 211 is disposed opposite to and connected to the hole to be plugged 103. The diameter of the first hole 211 is larger than the diameter of the hole to be plugged 103.

[0076] This configuration ensures that the first hole 211 is aligned with the hole to be plugged 103, improves the airflow smoothness of the air guide hole 21, and enhances the fullness and flatness of the resin plugging hole.

[0077] Optionally, the pad 20 is an aluminum substrate 10 containing a lubricating aluminum sheet.

[0078] This configuration provides stable support strength, ensuring that the pad 20 does not undergo unexpected deformation under plugging pressure. At the same time, the aluminum-based material has high rigidity and does not shed powder, which can avoid the problem of epoxy resin pad 20 shedding powder and contaminating the board surface, thus ensuring the cleanliness of the board surface.

[0079] Secondly, embodiments of this application provide a printed circuit board, which is manufactured by the resin plugging method as described in the first aspect.

[0080] The printed circuit board provided in this application embodiment has a substrate 10 with a hole-filling surface 101 and a connecting surface 102 facing away from each other. The substrate 10 is provided with a hole-filling position 103, which penetrates the hole-filling surface 101. The three-dimensional shape information of the connecting surface 102 is obtained first, and then a support surface 201 that matches the connecting surface 102 is processed on the pad 20 according to the three-dimensional shape information. Therefore, when the substrate 10 is placed on the pad 20, the connecting surface 102 and the support surface 201 can be made to fit together. Thus, when resin ink 50 is inserted into the hole-filling position 103 from the side of the substrate 10 away from the pad 20, the resin is prevented from overflowing from the bottom of the substrate 10 and contaminating the board surface.

[0081] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for resin plugging, characterized in that, include: A substrate is provided, the substrate having a plugging surface and a connecting surface opposite to each other, the substrate having a hole to be plugged, the hole to be plugged penetrating the plugging surface; Obtain the three-dimensional shape information of the connecting surface; A pad is provided, and a support surface adapted to the connection surface is machined on the pad according to the three-dimensional shape information; The substrate is placed on the pad so that the connecting surface is in contact with the supporting surface; Resin ink is inserted into the hole to be filled from the side of the substrate away from the pad.

2. The method for resin plugging according to claim 1, characterized in that, The step of obtaining the three-dimensional shape information of the connection surface includes: The connection surface is divided into multiple sampling areas; Obtain the three-dimensional shape information corresponding to each sampling region.

3. The method for resin plugging according to claim 2, characterized in that, The step of machining a support surface on the pad that matches the connecting surface based on the three-dimensional shape information includes: The pad is divided into multiple processing areas, and the multiple processing areas are set up to correspond to the multiple sampling areas; Based on the three-dimensional shape information of the corresponding sampling area, a processing surface is processed in the corresponding processing area, and the support surface includes all the processing surfaces corresponding to the processing areas.

4. The method for resin plugging according to claim 2, characterized in that, The step of obtaining the three-dimensional shape information corresponding to each sampling region includes: Select sampling points within the sampling area; Obtain the three-dimensional coordinate information corresponding to the sampling point, and use the three-dimensional coordinate information as the three-dimensional shape information of the current sampling area.

5. The method for resin plugging according to claim 4, characterized in that, The number of sampling points is multiple, and the multiple sampling points are distributed at intervals.

6. The method for resin plugging according to claim 1, characterized in that, The step of obtaining the three-dimensional shape information of the connection surface specifically includes: placing the substrate on the measurement surface, wherein the measurement surface is a plane, the plugging surface faces the measurement surface, and obtaining the height information of the substrate corresponding to different regions of the connection surface; Alternatively, obtaining the three-dimensional shape information of the connecting surface specifically includes: obtaining the three-dimensional shape information of the connecting surface by three-dimensional laser scanning; Alternatively, obtaining the three-dimensional shape information of the connecting surface may specifically include obtaining the three-dimensional shape information of the connecting surface through white light photogrammetry.

7. The method for resin plugging according to claim 1, characterized in that, Before obtaining the three-dimensional shape information of the connection surface, the method for plugging the resin hole further includes: The initial warpage of the substrate is measured. If the initial warpage is greater than a preset value, the substrate is corrected so that the actual warpage of the substrate is less than or equal to the preset value.

8. The method for resin plugging according to any one of claims 1 to 7, characterized in that, The pad is provided with air guide holes, which include a first hole and a second hole that are connected to each other. The diameter of the first hole is larger than the diameter of the second hole. The first hole has an opening formed on the support surface. The first hole is disposed opposite to and connected to the hole to be plugged. The diameter of the first hole is larger than the diameter of the hole to be plugged.

9. The method for resin plugging according to any one of claims 1 to 7, characterized in that, The pad is an aluminum substrate containing a lubricating aluminum sheet.

10. A printed circuit board, characterized in that, The printed circuit board is manufactured by the resin plugging method as described in any one of claims 1 to 9.

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