Etching apparatus for processing a circuit board

Abstract

The application relates to the field of circuit board etching technology, and particularly discloses an etching equipment for circuit board processing, which comprises an etching box, a transmission belt arranged in the etching box and used for conveying a carrier plate, a placing plate arranged on the surface of the carrier plate and used for limiting the circuit board, a chemical liquid tank and a water tank arranged on the top of the etching box and used for etching and cleaning the circuit board, a rear side plate, a front side plate and a main through pipe, the rear side plate and the front side plate are symmetrically arranged in the etching box, drive shafts for conveying the transmission belt are arranged on the inner side ends of the rear side plate and the front side plate, the rear side plate and the front side plate are sliding adjustment structures in the etching box, and the liquid outlets of the chemical liquid tank and the water tank are connected with the main through pipe. The etching equipment for circuit board processing can adjust the conveying according to the width of the carrier plate, is convenient for processing circuit boards of different batches and different models, is convenient for spraying adjustment, and can ensure uniform etching.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and more particularly to the field of circuit board etching technology, specifically to an etching device for circuit board processing. Background Technology

[0002] Circuit board etching is a core process in PCB (printed circuit board) manufacturing. Its main purpose is to remove unwanted copper foil from the copper-clad board through chemical or physical methods, thereby forming a precise circuit pattern and realizing the electrical connection and functional integration of electronic components.

[0003] For example, patent CN111031693B discloses a circuit board etching device, including an etching chamber with a circuit board lifting device. The lifting device includes a sealing cover; when the lifting device is lowered, the sealing cover seals the etching chamber. A chemical adding device is located on one side of the etching chamber, and a drain pipe and a waste gas collection pipe are located on the other side. The chemical adding device is connected to the etching chamber via a feeding assembly. This invention, by incorporating a circuit board lifting device, ensures that harmful gases generated during the etching process do not evaporate into the air when the device is lowered, thus reducing environmental pollution.

[0004] For example, patent CN117241482B discloses an etching apparatus for circuit board manufacturing, including a conveying component, an etching component, and a cleaning component. The conveying component conveys the circuit board, and the etching component sprays etching solution onto the circuit board on the conveying component. The conveying component includes multiple parallel suction rollers, each with multiple suction wheels and suction holes. The cleaning component cleans the suction holes on the side of the suction rollers away from the circuit board. The apparatus also includes a suction component and a control component. The suction component is connected to the suction holes on each suction roller via a suction air path. A negative pressure sensor for detecting suction pressure is provided on the suction air path. The cleaning component, the negative pressure sensor, and the suction component are electrically connected to the control component. This application effectively avoids clogging of the negative pressure suction holes for absorbing the etching solution, improving the uniformity of the circuit board etching process.

[0005] However, when using commonly used circuit board etching equipment, certain drawbacks still exist in actual processing, such as:

[0006] 1. The etching processing time is not easy to control. Although the current etching equipment can adjust the etching processing time by adjusting the conveying speed and spray length, in actual processing, the adjustment of speed and spray will cause uneven spraying, resulting in uneven etching of the circuit board and affecting the processing quality of the circuit board.

[0007] 2. In order to improve the reaction efficiency and etching accuracy of the etching solution, it is generally necessary to heat and control the etching solution. However, the current etching solution heating device is usually directly installed inside the solution tank. In actual use, this not only leads to uneven temperature of the etching solution, but also causes the etching solution to corrode the heating device in the long term, affecting the heating effect. Furthermore, the etching solution is usually sprayed into the etching equipment through pipelines, and pipeline transmission will change the temperature of the etching solution, affecting the etching.

[0008] Therefore, we propose an etching device for circuit board processing to solve the problems mentioned above. Summary of the Invention

[0009] The purpose of this invention is to provide an etching device for circuit board processing, so as to solve the problems mentioned in the background art of the current circuit board etching device, which is inconvenient to adjust, cannot stably control the temperature of the etching solution, and is prone to uneven etching of circuit boards, thus affecting the quality of circuit board processing.

[0010] To achieve the above objectives, the present invention provides the following technical solution: an etching device for circuit board processing, comprising: an etching box, wherein the interior of the etching box is provided with a conveyor belt for transporting a carrier board, the surface of the carrier board is provided with a placement plate for limiting the circuit board, and the top of the etching box is provided with a chemical tank and a water tank for etching and cleaning the circuit board.

[0011] Also includes:

[0012] The rear side plate and the front side plate are symmetrically arranged inside the etching chamber, and the inner ends of the rear side plate and the front side plate are equipped with drive shafts for conveying the conveyor belt. The rear side plate and the front side plate are sliding adjustment structures inside the etching chamber.

[0013] The main pipe is connected to the outlets of the medicine tank and the water tank. The outer side of the main pipe is connected to the auxiliary pipes inserted into the top of the etching box at equal intervals. The middle part of the main pipe is equipped with a solenoid valve for regulating the connection status of the auxiliary pipes.

[0014] Meanwhile, a left baffle and a right baffle are fixedly installed at the left and right ends of the inside of the etching box, and a middle baffle that can slide and adjust according to the connection state of the auxiliary pipe is provided in the middle of the inside of the etching box.

[0015] An inclined plate is fixedly installed on the inner bottom of the etching box, and a filter box is fixed to the bottom of the inclined plate.

[0016] Furthermore: the rear side plate and the front side plate are symmetrically connected with first adjusting rods with opposite thread directions at both ends, and the outer side of the end of the first adjusting rod is connected with a first transmission belt. The middle part of the etching box is provided with a sliding groove plate protruding inward, and the bottom surfaces of the rear side plate and the front side plate are slidably connected to the top surface of the sliding groove plate.

[0017] Furthermore: the bottom surface of the carrier plate is provided with a slot that engages with a push plate fixedly installed on the surface of the conveyor belt; a pressing limiting mechanism is provided on the top surface of the rear side plate and the front side plate above the carrier plate; and an extrusion plate is fixed on the inner side of the rear side plate and the front side plate on the entry side of the carrier plate.

[0018] Furthermore: the downward limiting mechanism includes:

[0019] A pressure strip is provided on the upper part of both the rear and front side panels, and a fixing block is integrally protruding from the outer end of the pressure strip;

[0020] A fixing screw is fixedly installed on the top surface of the rear side plate and the front side plate, and the fixing block is correspondingly sleeved on the outside of the fixing screw;

[0021] A spring is sleeved on the outside of the fixing screw and connected between the fixing block and the rear or front side plate. A nut is connected to the top of the fixing screw.

[0022] The side cross-sectional shape of the pressure strip is an inverted "L" shape, and the inner bottom surface of the pressure strip has a protruding strip with an arc-shaped cross-section.

[0023] Furthermore, the inner side of the conveyor belt is provided with a support frame fixed to the inner side of the rear or front side plate, and a support shaft is rotatably mounted on the top of the support frame.

[0024] Furthermore, a fixing frame is fixedly installed on the top of the etching box, and a through groove is opened on the inner side of the fixing frame. A temperature control element is installed inside the through groove between the medicine tank, the water tank and the auxiliary pipe.

[0025] Furthermore: the bottom of the liquid tank is connected to the main pipe via a first pump, the water tank is connected to the main pipe via a second pump, and the bottom of the main pipe is connected to the nozzles evenly arranged on the top of the etching box via secondary pipes at equal intervals.

[0026] Furthermore, the inner sides of the left and right baffles and the inner and outer sides of the middle baffle are all provided with flow collection grooves. The bottom surfaces of the left, right, and middle baffles are all in an inwardly concave arc-shaped structure. The top two sides of the middle baffle are connected with second adjusting rods. The ends of the second adjusting rods are connected to a second transmission belt, which is connected to the output end of the drive motor.

[0027] Furthermore, the left baffle, right baffle, and middle baffle are provided with slots inside, the bottom of the slots are connected to air jet pipes, the bottom ends of the air jet pipes are evenly distributed at the bottom of the middle baffle, the top of the slots are connected to connecting pipes, and the top of the connecting pipes are connected to an air pump installed on the outside of the etching box.

[0028] Furthermore: the inclined plate is fixedly arranged in a ring structure inside the etching box, the surface of the inclined plate is arranged obliquely downward, the top surface of the filter box and the bottom surface of the inclined plate are spaced apart, the filter box is equipped with a filter screen inside, and the front side of the etching box is provided with a front door corresponding to the gap between the inclined plate and the filter box.

[0029] Compared with the prior art, the present invention has at least the following beneficial effects: the etching equipment for circuit board processing can adjust the conveying according to the width of the circuit board carrier, which is convenient for processing circuit boards of different batches and models, and can also be easily adjusted for spraying, thus ensuring uniform etching.

[0030] 1. In this solution, the distance between the rear and front side plates can be adjusted inside the etching box by rotating the first adjusting rod, thereby adjusting the distance between the two conveyor belts to facilitate the placement of different carrier plates, which are then pushed and conveyed by the push plate for continuous use.

[0031] 2. In this solution, pressure strips are installed on the top inner side of the rear and front side panels. The pressure strips can press down on the sides of the carrier plate, thereby maintaining the stability of the carrier plate in conjunction with the push plate. At the same time, the height of the pressure strips is adjustable, which is convenient for use on different models of carrier plates.

[0032] 3. In this solution, the main pipe connects both the chemical tank and the water tank. Multiple sets of solenoid valves in the middle regulate the connection between the main pipe and the auxiliary pipe, which facilitates the adjustment of the number of spray nozzles for chemical and water spraying, thereby facilitating the adjustment of etching time, reducing delay, and improving etching uniformity.

[0033] 4. In this solution, a temperature control element is installed in the space between the bottom of the chemical tank and the water tank and the auxiliary pipe. This allows for simultaneous temperature control of the chemical tank, water tank, and auxiliary pipe, preventing pipeline transportation from affecting the stability of the etching solution and preventing water mist temperature changes from affecting the etching reaction, thus ensuring etching accuracy and efficiency.

[0034] 5. In this solution, the left baffle, right baffle and middle baffle are used to block the mist in the etching area and the cleaning area. At the same time, the middle baffle can slide in the middle of the etching box and can be adjusted according to the spray of the nozzle. Furthermore, the bottom surface of the left baffle, right baffle and middle baffle is arc-shaped and the surface is opened with a collection groove to facilitate the liquid to drip from both sides and avoid directly dripping onto the carrier plate, which would affect the etching accuracy.

[0035] 6. In this solution, the inclined plate is fixed to the bottom side of the etching box so that the dripping medicine or water rolls into the interior of the filter box connected below, which facilitates the use of the filter box with the filter screen for filtration, and facilitates liquid recovery and impurity cleaning. Attached Figure Description

[0036] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0037] Figure 1 This is a schematic diagram of the front structure of the present invention;

[0038] Figure 2 This is a schematic diagram of the rear structure of the present invention;

[0039] Figure 3 This is a schematic diagram of the front cross-section of the present invention from below;

[0040] Figure 4 This is a schematic diagram of the front cross-section top view of the present invention;

[0041] Figure 5 This is a partial structural diagram of the rear side plate, conveyor belt, and pressure strip of the present invention;

[0042] Figure 6 For the present invention Figure 1 Enlarged structural diagram at point A in the middle;

[0043] Figure 7 This is a schematic diagram of the side cross-section structure of the present invention;

[0044] Figure 8 This is a schematic diagram of the overall bottom view of the carrier plate of the present invention;

[0045] Figure 9 This is an exploded structural diagram of the medicine tank, water tank, and temperature control element of the present invention;

[0046] Figure 10 This is a schematic diagram of the assembly structure of the auxiliary pipe and the solenoid valve of the present invention;

[0047] Figure 11 This is an exploded structural diagram of the left baffle, right baffle, and middle baffle of the present invention;

[0048] Figure 12 This is a schematic diagram of the internal cross-sectional structure of the intermediate baffle of the present invention.

[0049] In the diagram: 1. Etching box; 2. Rear side plate; 3. Front side plate; 4. First adjusting rod; 5. First transmission belt; 6. Slide plate; 7. Drive shaft; 8. Transmission belt; 9. Push plate; 10. Extrusion plate; 11. Carrier plate; 12. Placement plate; 13. Slot; 14. Pressure strip; 15. Fixing block; 16. Fixing screw; 17. Spring; 18. Protruding strip; 19. Support frame; 20. Support shaft; 21. Liquid tank; 22. Water tank; 23. Fixing frame; 24. First pump; 5. Second pump; 26. Main pipe; 27. Secondary pipe; 28. Nozzle; 29. ​​Solenoid valve; 30. Temperature control element; 31. Left baffle; 32. Right baffle; 33. Middle baffle; 34. Collection trough; 35. Empty trough; 36. Jet pipe; 37. Connecting pipe; 38. Air pump; 39. Second adjusting rod; 40. Second transmission belt; 41. Drive motor; 42. Sealing box; 43. Inclined plate; 44. Filter box; 45. Filter screen; 46. Front door; 47. Waste discharge pump. Detailed Implementation

[0050] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0051] Please see Figures 1-12 The present invention provides the following technical solution:

[0052] An etching device for circuit board processing includes: an etching box 1, a rear side plate 2, a front side plate 3, a first adjusting rod 4, a first transmission belt 5, a slide plate 6, a drive shaft 7, a transmission belt 8, a push plate 9, an extrusion plate 10, a carrier plate 11, a placement plate 12, a slot 13, a pressure strip 14, a fixing block 15, a fixing screw 16, a spring 17, a protruding strip 18, a support frame 19, a support shaft 20, a solution tank 21, a water tank 22, a fixing frame 23, and a first... Pump 24, second pump 25, main pipe 26, auxiliary pipe 27, nozzle 28, solenoid valve 29, temperature control element 30, left baffle 31, right baffle 32, middle baffle 33, collection trough 34, empty trough 35, jet pipe 36, connecting pipe 37, air pump 38, second adjusting rod 39, second transmission belt 40, drive motor 41, sealing box 42, inclined plate 43, filter box 44, filter screen 45, front door 46, and waste discharge pump 47;

[0053] Among them: such as Figure 1 , Figure 2 , Figure 3 and Figure 4In the etching chamber 1, a conveyor belt 8 for transporting the carrier board 11 is provided inside. A placement plate 12 for positioning the circuit board is provided on the surface of the carrier board 11. A chemical tank 21 and a water tank 22 for etching and cleaning the circuit board are provided on the top of the etching chamber 1. A rear side plate 2 and a front side plate 3 are symmetrically arranged inside the etching chamber 1, and drive shafts 7 for transporting the conveyor belt 8 are installed on the inner ends of the rear side plate 2 and the front side plate 3. The rear side plate 2 and the front side plate 3 have a sliding adjustment structure inside the etching chamber 1. The inner sides of plate 2 and front side plate 3 are symmetrically connected with first adjusting rods 4 with opposite thread directions at both ends. The outer side of the end of the first adjusting rod 4 is connected with a first transmission belt 5. The middle part of the etching box 1 is provided with a sliding groove plate 6 protruding inward. The bottom surfaces of the rear side plate 2 and the front side plate 3 are slidably connected to the top surface of the sliding groove plate 6. The bottom surface of the carrier plate 11 is provided with a slot 13 that engages with the push plate 9 fixedly installed on the surface of the transmission belt 8. The inner sides of the rear side plate 2 and the front side plate 3 are fixed with an extrusion plate 10 on the entry side of the carrier plate 11.

[0054] In specific application scenarios, the motor connected to the inner side of the first transmission belt 5 drives the first transmission belt 5 to rotate the first adjusting rod 4. The opposing threaded structures at both ends of the first adjusting rod 4 cause the rear side plate 2 and the front side plate 3 to slide relative to each other, thereby adjusting the distance between the rear side plate 2 and the front side plate 3. This, in turn, adjusts the transmission belt 8 to provide stable support for both sides of the carrier plate 11, allowing the push plate 9 fixed to the surface of the transmission belt 8 to engage with the corresponding slot 13 on the bottom surface of the carrier plate 11. The push plate 9 has a tapered front end and a long plate rear end. The front end of the push plate 9 is inserted into the outside of the slot 13 and then continuously conveyed by the conveyor belt 8. The rear end of the push plate 9 keeps the carrier plate 11 being pushed stably. The pressing plate 10 with a sloping surface structure is fixedly installed on the inner side of the rear side plate 2 and the front side plate 3, which can press the carrier plate 11 into the center to ensure the stable engagement of the push plate 9 and the slot 13 for easy conveying. After the carrier plate 11 enters the etching box 1, it is sprayed with chemical solution inside the chemical solution tank 21 for etching. After continued conveying, it is sprayed with water inside the water tank 22 for cleaning to quickly complete the etching operation.

[0055] Using the above technical solution, two sets of adjustable conveyor belts 8 are set up for transporting the carrier board 11. This allows for adjustment of carrier boards 11 of different widths and models, facilitating the etching and processing of circuit boards of different models.

[0056] Among them: such as Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6In the middle, a pressing limiting mechanism is provided above the carrier plate 11 and installed on the top surface of the rear side plate 2 and the front side plate 3. The pressing limiting mechanism includes: a pressure strip 14, a fixing screw 16 and a spring 17. The pressure strip 14 is provided above the rear side plate 2 and the front side plate 3. A fixing block 15 is integrally protruding from the outer end of the pressure strip 14. The fixing screw 16 is fixedly provided on the top surface of the rear side plate 2 and the front side plate 3. The fixing block 15 is correspondingly sleeved on the outer side of the fixing screw 16. The spring 17 is sleeved on the outer side of the fixing screw 16 and is connected between the fixing block 15 and the rear side plate 2 or the front side plate 3. A nut is connected to the top of the fixing screw 16. The side cross-sectional shape of the pressure strip 14 is an inverted "L" shape. A protruding strip 18 with an arc-shaped cross-section is provided on the inner bottom surface of the pressure strip 14.

[0057] In specific application scenarios, during the process of the carrier plate 11 being conveyed by the push plate 9 following the conveyor belt 8, the height of the pressure strip 14 is adjusted by rotating the nut at the top of the fixed screw 16 so that the pressure strip 14 can press down on the side of the carrier plate 11 through the protrusion 18 integrally fixed on its bottom surface. The arc-shaped structure of the protrusion 18 reduces friction, thereby ensuring the stability of the carrier plate 11. Furthermore, the end of the pressure strip 14 has an arc-shaped upturned structure to ensure the stable entry of the carrier plate 11.

[0058] By adopting the above technical solution, the transport stability of the carrier board 11 can be guaranteed, so as to maintain the stability of the circuit board and facilitate etching.

[0059] Among them: such as Figure 3 , Figure 4 and Figure 5 In the middle, a support frame 19 is provided on the inner side of the conveyor belt 8 and fixed to the inner side of the rear side plate 2 or the front side plate 3. A support shaft 20 is rolled on the top of the support frame 19.

[0060] In specific application scenarios, support frames 19 are fixedly installed at equal intervals on the inner sides of the rear side plate 2 and the front side plate 3. The support frames 19 provide rolling support for the support shaft 20, and the top surface of the support shaft 20 is in contact with the inner side of the conveyor belt 8, which can support the conveyor belt 8 and thus support the carrier plate 11.

[0061] By adopting the above technical solution, the top surface of the conveyor belt 8 can be kept flat by the support shaft 20, thereby ensuring that the carrier plate 11 is always horizontal, avoiding concentrated flow of etching solution, and ensuring uniform etching.

[0062] Among them: such as Figure 1 , Figure 2 , Figure 3 , Figure 9 and Figure 10In the process, the outlets of the liquid tank 21 and the water tank 22 are connected to the main pipe 26. The outer side of the main pipe 26 is connected with the auxiliary pipes 27 inserted into the top of the etching box 1 at equal intervals. The middle of the main pipe 26 is provided with a solenoid valve 29 for controlling the connection state of the auxiliary pipes 27. The top of the etching box 1 is fixedly installed with a fixing bracket 23. The inner side of the fixing bracket 23 is provided with a through groove. The inside of the through groove is provided with a temperature control element 30 located between the liquid tank 21, the water tank 22 and the auxiliary pipes 27. The bottom of the liquid tank 21 is connected to the main pipe 26 through the first pump 24. The water tank 22 is connected to the main pipe 26 through the second pump 25. The bottom of the main pipe 26 is connected to the nozzles 28 evenly arranged on the top of the etching box 1 through the auxiliary pipes 27 at equal intervals.

[0063] In specific application scenarios, the temperature control element 30 can heat the liquids inside the chemical tank 21 and water tank 22, thereby ensuring the reaction efficiency of the etching solution and maintaining the etching solution and cleaning water at the same temperature. This avoids the adverse effects caused by rapid temperature changes during cold water spray cleaning. Furthermore, when it is necessary to adjust the etching time and spray range, the opening and closing of the solenoid valve 29 is adjusted at the connection between the main pipe 26 and the auxiliary pipe 27. Figure 10 The left three groups and right three groups of solenoid valves 29 can be opened, while the middle solenoid valve 29 is closed, thereby adjusting the connection between the auxiliary pipe 27 and the main pipe 26. This adjusts the connection between the auxiliary pipe 27 and the liquid tank 21 or water tank 22, facilitating the spraying of etching solution and cleaning solution using the first pump 24 and the second pump 25 via the nozzle 28. Simultaneously, the temperature control element 30 is located inside the mounting bracket 23, below which is the auxiliary pipe 27. The temperature control element 30 can simultaneously heat the nozzle 28. Component 30 adopts a surround electric heat tracing constant temperature heating element, which is laid in the inner groove of the fixing frame 23 and set at the bottom of the liquid tank 21, the water tank 22, and the upper part of the outer wall of the auxiliary pipe 27. After the temperature control element is powered on, it continuously conducts heat to the tank and the pipeline, and simultaneously maintains the temperature of the etching solution inside the liquid tank 21, the cleaning water in the water tank 22, the liquid flowing in the pipeline, and the end nozzle 28. This avoids the liquid cooling down during pipeline transportation, ensures that the sprayed liquid temperature is consistent, and can prevent the etching efficiency from being affected by the temperature change of the etching solution after being transported through the pipeline.

[0064] By adopting the above technical solution, the number of nozzles 28 used for spraying in the liquid tank 21 and water tank 22 can be adjusted through selective connection between the auxiliary pipe 27 and the main pipe 26, thereby facilitating the adjustment of spraying time and range to improve etching efficiency.

[0065] Among them: such as Figure 3 , Figure 7 , Figure 11 and Figure 12In the etching box 1, a left baffle 31 and a right baffle 32 are fixedly installed at the left and right ends. A middle baffle 33 is set in the middle of the etching box 1, which can slide and adjust according to the connection state of the auxiliary pipe 27. The inner sides of the left baffle 31 and the right baffle 32, as well as the inner and outer sides of the middle baffle 33, are provided with flow collection grooves 34. The bottom surfaces of the left baffle 31, the right baffle 32, and the middle baffle 33 are all in an inwardly concave arc structure. The top two sides of the middle baffle 33 are connected with second adjusting rods 39. The ends of the second adjusting rods 39 are connected to a second transmission belt 40, which is connected to the output end of the drive motor 41.

[0066] In specific application scenarios, the fixation of the left baffle 31 and right baffle 32 at the left and right ends of the etching chamber 1 prevents the water mist from the etching solution and cleaning solution from escaping to the outside. Simultaneously, the start of the drive motor 41 drives the second adjusting rod 39 to rotate via the second transmission belt 40, adjusting the position of the middle baffle 33 inside the etching chamber 1. This allows the position of the middle baffle 33 to be adjusted according to the opening and closing of the solenoid valve 29, thereby adapting to the adjustment of the travel length of the etching and cleaning areas, ensuring the completion of the etching reaction. Meanwhile, the left baffle... 31. The flow collection grooves 34 formed on the surfaces of the right baffle 32 and the middle baffle 33 can collect and flow the liquid sprayed onto their surfaces. The bottom surfaces of the left baffle 31, the right baffle 32 and the middle baffle 33 are all arc-shaped guide structures with the center convex upward. The flow collection grooves 34 are formed on the surface of the baffles and are arranged obliquely from the center to the outside. The liquid sprayed onto the surface of the baffles converges to both sides along the flow collection grooves. The liquid dripping downward along the surface of the baffles is guided to drip onto both sides of the etching box along the arc-shaped bottom surface. It will not drip vertically onto the surface of the carrier board and the circuit board below, thus avoiding local accumulation of liquid and uneven etching.

[0067] The above technical solution can be used with the nozzle 28 for spraying, and it is convenient to collect the atomized liquid on the side to avoid dripping onto the circuit board surface and ensure the uniformity of the etching reaction.

[0068] in: Figure 11 and Figure 12 In the middle, the left baffle 31, the right baffle 32 and the middle baffle 33 are provided with slots 35. The bottom of the slots 35 is connected to the jet pipes 36. The bottom ends of the jet pipes 36 are evenly arranged at the bottom of the middle baffle 33. The top of the slots 35 is connected to the connecting pipes 37. The top end of the connecting pipes 37 is connected to the air pump 38 installed on the outside of the etching box 1.

[0069] In specific application scenarios, by starting the air pump 38, the connection between the connecting pipe 37 and the empty tank 35 and the air jet pipe 36 can be achieved, allowing the air jet pipe 36 to spray downwards. When the gas is sprayed out at the bottom of the left baffle 31, it can clean the surface of the circuit board above the incoming carrier board 11, avoiding affecting the etching. At the same time, it can prevent the atomized etching liquid from being blown down and collected, and prevent the etching liquid from spreading outwards. When the gas is sprayed out at the bottom of the middle baffle 33, it can quickly blow away the etching liquid on the surface of the circuit board entering the cleaning area, so as to quickly weaken or even remove the reaction, in order to ensure the etching accuracy. At the same time, it can isolate the water mist in the etching area and the cleaning area to avoid mutual interference. When the gas is sprayed out at the bottom of the right baffle 32, it can clean the cleaning water on the surface of the circuit board, making it easy to dry the surface for use.

[0070] The above technical solution can utilize airflow to perform functions such as isolation, cleaning, and drying, ensuring etching precision.

[0071] Among them: such as Figure 3 , Figure 4 and Figure 7 In the process, the inclined plate 43 is fixedly installed on the inner bottom of the etching box 1, and the filter box 44 is fixedly installed on the bottom of the inclined plate 43. The inclined plate 43 is fixedly arranged in a ring structure inside the etching box 1. The surface of the inclined plate 43 is arranged obliquely downward. The top surface of the filter box 44 is separated from the bottom surface of the inclined plate 43. The filter screen 45 is installed inside the filter box 44. The front side of the etching box 1 is provided with a front door 46 corresponding to the interval between the inclined plate 43 and the filter box 44. The bottom outer side of the etching box 1 is equipped with a waste discharge pump 47.

[0072] In specific application scenarios, the inclined structure of the inclined plate 43 facilitates the centralized collection of dripping liquid, and the liquid flows directly into the interior of the filter box 44. The filter screen 45 laid inside the filter box can filter out the reaction impurities in the liquid, so that the filtered liquid drips to the bottom of the etching box 1 and is discharged by the waste pump 47. Furthermore, by opening the front door 46, the filter screen 45 inside the filter box 44 can be rolled up and taken out for replacement through the gap between the inclined plate 43 and the filter box 44.

[0073] The above technical solution allows for direct wastewater filtration and discharge based on the internal space, which helps to accelerate the circulation efficiency and improve production efficiency.

[0074] Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention; the contents not described in detail in this specification belong to the prior art known to those skilled in the art; in addition, the directional terms such as up, down, left, right, front, and back in the text only represent their relative positions and not absolute positions.

[0075] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0076] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An etching apparatus for processing a circuit board, comprising: The etching box (1) is provided with a conveyor belt (8) for conveying the carrier board (11) inside. The surface of the carrier board (11) is provided with a placement plate (12) for limiting the circuit board. The top of the etching box (1) is provided with a chemical tank (21) and a water tank (22) for etching and cleaning the circuit board. Its characteristic is that it further includes: The rear side plate (2) and the front side plate (3) are symmetrically arranged inside the etching box (1), and the inner ends of the rear side plate (2) and the front side plate (3) are equipped with drive shafts (7) for conveying the conveyor belt (8). The rear side plate (2) and the front side plate (3) are sliding adjustment structures inside the etching box (1). The main pipe (26) is connected to the outlets of the liquid tank (21) and the water tank (22). The main pipe (26) is connected to the outer side of the auxiliary pipe (27) which is inserted into the top of the etching box (1) at equal intervals. The main pipe (26) is provided with a solenoid valve (29) for controlling the connection state of the auxiliary pipe (27) in the middle. Meanwhile, a left baffle (31) and a right baffle (32) are fixedly installed at the left and right ends inside the etching box (1), and a middle baffle (33) is provided in the middle of the etching box (1) to slide and adjust in accordance with the connection state of the secondary pipe (27). Inclined plate (43) is fixedly installed on the bottom inner side of the etching box (1), and a filter box (44) is fixed to the bottom of the inclined plate (43).

2. The etching apparatus for processing a circuit board according to claim 1, wherein: The rear side plate (2) and the front side plate (3) are symmetrically connected with first adjusting rods (4) with opposite thread directions at both ends. The outer side of the end of the first adjusting rod (4) is connected with a first transmission belt (5). The middle part of the etching box (1) is provided with a sliding groove plate (6) protruding inward. The bottom surfaces of the rear side plate (2) and the front side plate (3) are slidably connected to the top surface of the sliding groove plate (6).

3. The etching apparatus for processing a circuit board according to claim 1, wherein: The bottom surface of the carrier plate (11) is provided with a slot (13) that engages with the push plate (9) fixedly installed on the surface of the conveyor belt (8). A pressing limiting mechanism is provided on the top surface of the rear side plate (2) and the front side plate (3) above the carrier plate (11). The inner side surfaces of the rear side plate (2) and the front side plate (3) are fixed with a pressing plate (10) on the entry side of the carrier plate (11).

4. The etching equipment for circuit board processing according to claim 3, characterized in that: The downward limiting mechanism includes: Pressure strip (14) is provided above both the rear side plate (2) and the front side plate (3), and a fixing block (15) is integrally protruding from the outer end of the pressure strip (14). A fixing screw (16) is fixedly installed on the top surface of the rear side plate (2) and the front side plate (3), and a fixing block (15) is correspondingly sleeved on the outside of the fixing screw (16); Spring (17), the spring (17) is sleeved on the outside of the fixing screw (16), and the spring (17) is connected between the fixing block (15) and the rear side plate (2) or the front side plate (3). The top end of the fixing screw (16) is connected to a nut. The side cross-sectional shape of the pressure strip (14) is an inverted "L" shape, and the inner bottom surface of the pressure strip (14) is provided with a protruding strip (18) with an arc-shaped cross-section.

5. The etching equipment for circuit board processing according to claim 1, characterized in that: The inner side of the conveyor belt (8) is provided with a support frame (19) fixed to the inner side of the rear side plate (2) or the front side plate (3), and a support shaft (20) is rolled on the top of the support frame (19).

6. The etching equipment for circuit board processing according to claim 1, characterized in that: The top of the etching box (1) is fixedly installed with a fixing frame (23). A through groove is opened on the inner side of the fixing frame (23). A temperature control element (30) is set inside the through groove between the liquid tank (21), the water tank (22) and the auxiliary pipe (27).

7. The etching equipment for circuit board processing according to claim 1, characterized in that: The bottom of the liquid tank (21) is connected to the main pipe (26) via the first pump (24), and the water tank (22) is connected to the main pipe (26) via the second pump (25). The bottom of the main pipe (26) is connected to the nozzles (28) on the top of the etching box (1) by secondary pipes (27) arranged at equal intervals.

8. The etching equipment for circuit board processing according to claim 1, characterized in that: The inner sides of the left baffle (31) and the right baffle (32) and the inner and outer sides of the middle baffle (33) are all provided with flow collection grooves (34). The bottom surfaces of the left baffle (31), the right baffle (32) and the middle baffle (33) are all in an inwardly concave arc structure. The top two sides of the middle baffle (33) are connected with second adjusting rods (39). The ends of the second adjusting rods (39) are connected to a second transmission belt (40). The second transmission belt (40) is connected to the output end of the drive motor (41).

9. The etching equipment for circuit board processing according to claim 1, characterized in that: The left baffle (31), right baffle (32) and middle baffle (33) are provided with slots (35). The bottom of the slots (35) is connected to a jet pipe (36). The bottom of the jet pipe (36) is evenly arranged at the bottom of the middle baffle (33). The top of the slots (35) is connected to a connecting pipe (37). The top of the connecting pipe (37) is connected to an air pump (38) installed on the outside of the etching box (1).

10. An etching apparatus for circuit board processing according to claim 1, characterized in that: The inclined plate (43) is fixedly arranged in a ring structure inside the etching box (1). The surface of the inclined plate (43) is arranged obliquely downward. The top surface of the filter box (44) is separated from the bottom surface of the inclined plate (43). The filter box (44) is provided with a filter screen (45). The front side of the etching box (1) is provided with a front door (46) corresponding to the interval between the inclined plate (43) and the filter box (44).

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