Connection plate and method for manufacturing the same

Abstract

This application discloses a connector plate and its fabrication method. The fabrication method includes: locally gold-plating predetermined areas on opposite sides of a metal layer, wherein the predetermined areas correspond to the tail areas of each bidirectional terminal; attaching a dielectric support layer to one side of the metal layer; etching the metal layer to form the initial shape of multiple bidirectional terminals; and stamping the terminal areas of each bidirectional terminal; pressing an outer circuit layer onto opposite sides of the metal layer and the dielectric support layer; wherein the positions on the outer circuit layer corresponding to the terminal areas of each bidirectional terminal are hollowed out; and gold-plating the terminal areas of each bidirectional terminal through the outer circuit layer to complete the overall gold plating of each bidirectional terminal, thus obtaining a bidirectional spring-loaded connector plate. This solution enables the fabrication of a detachable connector plate, offering high flexibility, facilitating subsequent maintenance, debugging, or replacement, and improving the reliability and stability of the connector plate.

Description

Technical Field

[0001] This application relates to the technical field of spring-loaded connections, and in particular to a connecting plate and its preparation method. Background Technology

[0002] The high system density and high performance requirements of printed circuit board end applications have placed higher demands on the interconnection technology of printed circuit boards.

[0003] Traditional adapter boards, limited by manufacturing and post-maintenance limitations, can no longer meet the current needs of PCB terminal interconnection applications.

[0004] There is an urgent need for a highly flexible and high-performance inter-board interconnection solution. Summary of the Invention

[0005] The main technical problem addressed by this application is to provide a connecting plate and its preparation method, thereby solving the aforementioned problem.

[0006] To address the aforementioned problems, this application provides a method for fabricating a connector plate, comprising: obtaining a metal layer; wherein the metal layer is used to fabricate a plurality of bidirectional terminals; partially gold-plating a predetermined area on opposite sides of the metal layer, wherein the predetermined area corresponds to the tail area of ​​each bidirectional terminal; attaching a dielectric support layer to one side of the metal layer; etching the metal layer to form the initial shape of the plurality of bidirectional terminals; and stamping the terminal area of ​​each bidirectional terminal; pressing an outer circuit layer onto opposite sides of the metal layer and the dielectric support layer; wherein the position on the outer circuit layer corresponding to the terminal area of ​​each bidirectional terminal is hollowed out; and gold-plating the terminal area of ​​each bidirectional terminal through the outer circuit layer to complete the overall gold plating of each bidirectional terminal, thereby obtaining a bidirectional spring connector plate.

[0007] The method of attaching a dielectric support layer to one side of the metal layer includes: attaching a dielectric support layer to the entire side of the metal layer; and stamping the terminal area of ​​each bidirectional terminal, including: partially opening a window in the dielectric support layer based on the terminal area of ​​each bidirectional terminal; and stamping the terminal area of ​​each bidirectional terminal until one terminal of the bidirectional terminal is pressed to tilt toward the side facing the metal layer, and the other terminal of the bidirectional terminal is pressed to tilt toward the other side facing the metal layer.

[0008] The process of pressing outer circuit layers onto the opposite sides of the metal layer and the dielectric support layer includes: obtaining a first outer circuit layer, a dielectric layer, and a second outer circuit layer, and partially opening windows in the first outer circuit layer, the dielectric layer, and the second outer circuit layer based on the terminal areas of each bidirectional terminal; sequentially stacking and bonding the first outer circuit layer, the dielectric support layer, the metal layer, the dielectric layer, and the second outer circuit layer, exposing the terminal areas of each bidirectional terminal on the metal layer, and then pressing them together.

[0009] The process involves gold plating the terminal areas of each bidirectional terminal on the outer circuit layer to complete the overall gold plating of each bidirectional terminal, resulting in a bidirectional spring contact board. This includes: fabricating multiple metallized holes on the outer circuit layers on opposite sides of the metal layer to connect the tail areas of each bidirectional terminal; patterning each outer circuit layer to form electroplated gold leads, wherein the electroplated gold leads are connected to each metallized hole; and gold plating the terminal areas of each bidirectional terminal using the electroplated gold leads and each metallized hole to complete the overall gold plating of each bidirectional terminal, resulting in a bidirectional spring contact board.

[0010] The process involves preparing multiple metallized vias on the outer circuit layers on opposite sides of the metal layer to connect the tail regions of each bidirectional terminal. This includes drilling holes in the outer circuit layers on opposite sides of the metal layer until the metal layer is reached, exposing the tail regions of each bidirectional terminal to obtain multiple blind vias; and metallizing each blind via to obtain metallized vias.

[0011] The process involves plating gold on the terminal areas of each bidirectional terminal using electroplated gold leads and metallized holes to complete the overall gold plating of each bidirectional terminal. This includes: attaching a first protective layer to the opening of each metallized hole; plating gold on the terminal areas of each bidirectional terminal using electroplated gold leads and metallized holes to complete the overall gold plating of each bidirectional terminal; removing the first protective layer; and etching away the electroplated gold leads and the metal layer inside each metallized hole to obtain a bidirectional spring contact plate.

[0012] The process of partially gold-plating the preset areas on opposite sides of the metal layer includes: attaching a second protective layer to opposite sides of the metal layer, and exposing areas on opposite sides of the metal layer corresponding to the tail areas of each bidirectional terminal based on the design position of each bidirectional terminal; performing double-sided gold plating on the metal layer to gold-plat the tail areas of each bidirectional terminal; and removing the second protective layer.

[0013] The metal layer is a beryllium copper layer; the terminal areas of each bidirectional terminal are stamped and formed, followed by: strengthening the metal layer and dielectric support layer at a preset temperature and for a preset time to precipitate the BeCu phase until the yield strength and hardness reach the preset conditions; the preset temperature range is 300-350 degrees Celsius, the preset time range is 3-5 hours, the preset yield strength range is 900~1200 MPa, and the preset hardness range is 380~420 HV.

[0014] To address the aforementioned problems, this application provides a connecting plate, which is prepared by the connecting plate preparation method of any of the above claims. The connecting plate includes: a first outer layer, a plurality of bidirectional terminals, and a second outer layer that are sequentially stacked and bonded together; the tail region of each bidirectional terminal is sandwiched between the first outer layer and the second outer layer, and the positions on the first outer layer and the second outer layer corresponding to the terminal regions of each bidirectional terminal are hollowed out; wherein, one terminal of each bidirectional terminal is tilted toward one side of the connecting plate, and the other terminal of the bidirectional terminal is tilted toward the opposite side of the connecting plate.

[0015] Among them, the width of each bidirectional terminal gradually decreases along the direction away from the tail area; the width of the terminal on the side closer to the tail area is 200-250um, and the width of the terminal on the side away from the tail area is 80-120um; the vertical distance between the side of the terminal away from the tail area and the tail area is 0.2-0.5mm; the length of each terminal is 700-900um, and the minimum distance between the two terminals of the bidirectional terminal is 60-100um.

[0016] The beneficial effects of this application are as follows: Unlike existing technologies, this application first ensures the plating precision of the terminal tail through localized gold plating, and reduces the scrap rate of bidirectional terminals due to lack of support structure during processing by setting a dielectric support layer; finally, it achieves overall gold plating of the terminal area through the outer circuit layer, thereby improving product yield; combining the processes of localized gold plating before etching and gold plating of terminals after lamination, a bidirectional spring contact connection board is fabricated. This bidirectional spring contact connection board can achieve detachable conductive connections, offering high flexibility and facilitating subsequent maintenance, debugging, or replacement. Furthermore, the above fabrication method reduces the production cost of the bidirectional spring contact connection board, improves processing efficiency and quality stability, and is beneficial for meeting the needs of high-system-density PCB interconnect applications. Attached Figure Description

[0017] Figure 1 This is a schematic flowchart of an embodiment of the method for preparing the connecting plate of this application; Figure 2 This is a schematic flowchart of another embodiment of the method for preparing the connecting plate of this application; Figure 3This is a schematic diagram of an embodiment of the initial shape of the bidirectional terminal of this application; Figure 4 This is a schematic diagram of the structure of one embodiment after etching of the metal layer in this application; Figure 5 This is a side view of one embodiment of the bidirectional terminal after stamping according to this application; Figure 6 This is a side view structural diagram of the connecting plate according to an embodiment of this application. Detailed Implementation

[0018] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0019] If the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0020] Please see Figure 1 , Figure 1 This is a schematic flowchart of an embodiment of the method for preparing the connecting plate of this application. The method for preparing the connecting plate in this embodiment specifically includes the following steps: Step S11: Obtain a metal layer; wherein the metal layer is used to fabricate multiple bidirectional terminals.

[0021] The materials used for the metal layer include, but are not limited to, copper, beryllium copper, silver, tin, phosphor bronze, and nickel. The metal layer is used to fabricate multiple bidirectional terminals, which are interconnected in the vertical direction of the board to conduct electricity between opposite sides of the board.

[0022] In a specific application scenario, the metal layer can be a batch of large boards, used to mass-produce multiple interconnecting boards, which are then separated independently through cutting. Each interconnecting board has multiple bidirectional terminals. These bidirectional terminals can be arranged in an array of units on the metal layer, with each array unit used to fabricate one interconnecting board. The multiple bidirectional terminals on each array unit can be uniformly arranged using methods such as array arrangement, staggered arrangement, concentric circle arrangement, and spiral arrangement, depending on the interconnection requirements of the boards, and are not limited here. The spacing between adjacent bidirectional terminals can range from 0.5 to 2.0 mm, and the number and arrangement of bidirectional terminals on different array units can be set based on actual conditions, and are not limited here.

[0023] Step S12: Perform partial gold plating on preset areas on opposite sides of the metal layer, wherein the preset areas correspond to the tail areas of each bidirectional terminal.

[0024] After obtaining the metal layer, based on the design position of the bidirectional terminals, local gold plating is performed on preset areas on opposite sides of the metal layer. These preset areas correspond to the tail areas of each bidirectional terminal. In other words, this step involves locally gold plating the preset positions on the metal layer that will subsequently become the tail areas of the bidirectional terminals.

[0025] In a specific application scenario, gold plating can be performed by applying a dry film or an ink solder resist layer to the tail area of ​​the non-bidirectional terminals on opposite sides of the metal layer. Alternatively, the tail area of ​​the non-bidirectional terminals on opposite sides of the metal layer can be plated using a mask printing and sintering method. The specific method of local gold plating is not limited here.

[0026] Step S13: A dielectric support layer is attached to one side of the metal layer, the metal layer is etched to form the initial shape of multiple bidirectional terminals, and the terminal area of ​​each bidirectional terminal is stamped.

[0027] After the tail area of ​​each bidirectional terminal is gold-plated, a dielectric support layer is attached to one side of the metal layer. The dielectric support layer is used to support each bidirectional terminal in the etching step and participate in the subsequent lamination, serving as the dielectric between each bidirectional terminal and the outer circuit layer.

[0028] The materials of the dielectric support layer include, but are not limited to, high-temperature resistant materials such as polyimide (PI), polytetrafluoroethylene (PTFE), and perfluoroalkoxy resin (PFA).

[0029] After a dielectric support layer is bonded to one side of the metal layer, the metal layer is etched to form the initial shape of multiple bidirectional terminals, thus obtaining individual bidirectional terminals. The initial shape of each bidirectional terminal consists of two terminals spaced apart on the tail region. The two terminals can be located on the same side or different sides of the tail region, depending on actual needs, and are not limited here.

[0030] The terminal areas of each bidirectional terminal are stamped to form a three-dimensional shape from the initial bidirectional terminal shape. One terminal of the bidirectional terminal is pressed to tilt towards the side facing the metal layer, and the other terminal of the bidirectional terminal is pressed to tilt towards the other side facing the metal layer, thereby achieving conductivity between the two sides of the metal layer.

[0031] Step S14: Press the outer circuit layer onto the opposite sides of the metal layer and the dielectric support layer respectively; wherein, the positions on the outer circuit layer corresponding to the terminal areas of each bidirectional terminal are cut out.

[0032] Outer circuit layers are laminated to opposite sides of the metal layer and dielectric support layer. After lamination, multiple independent bidirectional terminals can be fixed by laminating the two outer circuit layers together to form a laminated plate. The positions on the outer circuit layers corresponding to the terminal areas of each bidirectional terminal are cut out to avoid the terminals of the bidirectional terminals and thus avoid affecting their structural shape.

[0033] The pressing plate presses against the tail area of ​​each bidirectional terminal, thereby fixing each bidirectional terminal and exposing the terminal area of ​​each bidirectional terminal. The tail area of ​​the bidirectional terminals has been pre-plated with gold.

[0034] Step S15: Gold plating is performed on the terminal areas of each bidirectional terminal through the outer circuit layer to complete the overall gold plating of each bidirectional terminal and obtain the bidirectional spring contact connection board.

[0035] By connecting each bidirectional terminal through the outer circuit layer, gold plating is applied to the terminal area to complete the overall gold plating of each bidirectional terminal, which helps to improve the bidirectional terminal's oxidation resistance, corrosion resistance, and wear resistance.

[0036] This application presents a connecting plate with multiple bidirectional terminals, which are then pressed and fixed together by an outer circuit layer. This connecting plate achieves vertical interconnection between opposite sides through the internally pressed bidirectional terminals. Specifically, the bidirectional spring-loaded connecting plate can be placed between two circuit layers, allowing the bidirectional terminals to contact the pads or contacts on both circuit layers, thus enabling interlayer interconnection between the two circuit layers via the bidirectional spring-loaded connecting plate. The terminals of the bidirectional terminals can make contact with the opposite sides of the connecting plate without soldering or pressing, achieving a detachable conductive connection with high flexibility, facilitating subsequent maintenance, debugging, or replacement. Furthermore, the bidirectional terminals of this application are integrally molded, have low impedance, and high conductivity, improving the performance of inter-board interconnection.

[0037] Furthermore, this application first ensures the electroplating accuracy of the terminal tail by partial gold plating, and reduces the scrap of bidirectional terminals due to lack of support structure during processing by setting a dielectric support layer; finally, it achieves overall gold plating of the terminal area through the outer circuit layer, thereby improving product yield; combining the process of partial gold plating before etching and gold plating of terminals after lamination reduces the production cost of bidirectional spring contact boards, improves processing efficiency and quality stability, and is conducive to meeting the needs of high system density PCB interconnection applications.

[0038] Through the above steps, the method for preparing the connection plate in this embodiment involves locally gold-plating preset areas on opposite sides of the metal layer, wherein the preset areas correspond to the tail areas of each bidirectional terminal; attaching a dielectric support layer to one side of the metal layer; etching the metal layer to form the initial shape of multiple bidirectional terminals; stamping the terminal areas of each bidirectional terminal; pressing an outer circuit layer onto opposite sides of the metal layer and the dielectric support layer; wherein the positions on the outer circuit layer corresponding to the terminal areas of each bidirectional terminal are hollowed out; and gold-plating the terminal areas of each bidirectional terminal through the outer circuit layer to complete the overall gold plating of each bidirectional terminal, thereby realizing the preparation of the bidirectional spring contact connection plate. The bidirectional spring contact connection plate can achieve detachable conductive connection, which is highly flexible and convenient for subsequent maintenance, debugging or replacement. Furthermore, this application first ensures the electroplating accuracy of the terminal tail by partial gold plating, and reduces the scrap of bidirectional terminals due to lack of support structure during processing by setting up a dielectric support layer; finally, it achieves overall gold plating of the terminal area through the outer circuit layer, thereby improving product yield; combining the process of partial gold plating before etching and gold plating of terminals after lamination reduces the production cost of bidirectional spring contact boards, improves processing efficiency and quality stability, and is conducive to meeting the needs of high system density PCB interconnection applications.

[0039] Please see Figure 2 , Figure 2 This is a schematic flowchart of another embodiment of the method for preparing the connector plate according to this application. The method for preparing the connector plate in this embodiment specifically includes the following steps: Step S21: Obtain a metal layer; wherein the metal layer is used to fabricate multiple bidirectional terminals.

[0040] This step is the same as step S11 mentioned above, please refer to the previous text, and will not be repeated here.

[0041] In a specific application scenario, this step can also prepare positioning holes in the metal layer. Specifically, several positioning holes are uniformly prepared on the edge of the metal layer to facilitate accurate subsequent processes.

[0042] Step S22: Apply a second protective layer to the opposite sides of the metal layer, and expose the areas on the opposite sides of the metal layer corresponding to the tail areas of each bidirectional terminal based on the design position of each bidirectional terminal, and perform double-sided gold plating on the metal layer to plate the tail areas of each bidirectional terminal; remove the second protective layer.

[0043] The second protective layer includes, but is not limited to, anti-plating dry film, solder resist ink, etc.

[0044] Based on the design position of each bidirectional terminal, the exposed metal layer covers the areas corresponding to the tail regions of each bidirectional terminal on opposite sides. In a specific application scenario, a second protective layer can be first applied to the entire board on opposite sides of the metal layer, and then the areas corresponding to the tail regions of each bidirectional terminal on opposite sides of the metal layer can be exposed through exposure and development. Alternatively, a second protective layer with cutouts based on the tail regions of each bidirectional terminal can be pre-prepared and then correspondingly attached to the opposite sides of the metal layer.

[0045] Double-sided gold plating is performed on the metal layer to plate the tail area of ​​each bidirectional terminal; after the gold plating is completed, the second protective layer is removed.

[0046] Step S23: A dielectric support layer is attached to one side of the metal layer.

[0047] The dielectric support layer operates at a temperature of at least 300 degrees Celsius to support subsequent strengthening processes.

[0048] The dielectric support layer is bonded to one side of the metal layer to form a continuous support structure. Partial windowing is performed on the terminal area of ​​the bidirectional terminals to ensure that the windowed area precisely corresponds to the terminal area, avoiding coverage of other parts.

[0049] In a specific application scenario, the metal layer and the dielectric support layer can be bonded together by lamination.

[0050] Step S24: Etch the metal layer to etch the metal layer into the initial shape of multiple bidirectional terminals.

[0051] Please see Figure 3 , Figure 3This is a schematic diagram of an embodiment of the initial shape of the bidirectional terminal of this application.

[0052] The bidirectional terminal 30 in this embodiment includes a tail region 31 and two terminal regions 32, which are connected to the tail region 31. The tail region 31 is used for subsequent pressing into the plate to fix the bidirectional terminal 30, and the terminal regions 32 are used for subsequent stamping to achieve interlayer connection in the vertical direction of the plate.

[0053] In a specific application scenario, the width of the terminal area 32 of each bidirectional terminal 30 gradually decreases along the direction away from the tail area 31; wherein, the width W2 of the side of the terminal area 32 near the tail area 31 ranges from 200-250um, and may include, but is not limited to, 200um, 205um, 210um, 215um, 220um, 230um, 240um or 250um, etc. This range ensures that the terminal connection has sufficient mechanical strength to support the elastic deformation of the terminal and avoid deformation during electroplating or interconnection.

[0054] The width W1 of the terminal region 32 on the side away from the tail region 31 ranges from 80 to 120 μm, specifically including but not limited to 80 μm, 82 μm, 85 μm, 90 μm, 95 μm, 98 μm, 100 μm, 105 μm, 110 μm, 114 μm, 116 μm, 118 μm, or 120 μm, etc. This narrower width allows for a finer terminal tip, which helps reduce uneven metal deposition during the electroplating gold process and prevents short circuits between terminals.

[0055] The terminal length L1 of each terminal area 32 ranges from 700 to 900 μm, specifically including but not limited to 700 μm, 710 μm, 720 μm, 730 μm, 740 μm, 750 μm, 780 μm, 800 μm, 710 μm, 720 μm, 850 μm, 860 μm or 900 μm, etc. This length range provides a moderate elastic deformation space, so that the terminal area 32 can effectively adapt to the connection surface of different heights when interconnecting between boards.

[0056] The minimum spacing W3 between the two terminal regions 32 of the bidirectional terminal 30 is 60-100um, specifically including but not limited to 60um, 65um, 68um, 70um, 72um, 75um, 80um, 82um, 85um, 88um, 90um, 95um, or 100um. This spacing design ensures that the terminals will not become conductive due to metal deposition during electroplating, while also supporting high-density arrangement.

[0057] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of one embodiment after the metal layer of this application has been etched.

[0058] After etching, multiple bidirectional terminals 42 are stacked on the dielectric support layer 41. At this time, the bidirectional terminals 42 are planar. All the bidirectional terminals 42 form multiple array units 43, and each array unit 43 is used to fabricate an independent bidirectional spring contact plate.

[0059] Step S25: Make partial openings in the dielectric support layer based on the terminal area of ​​each bidirectional terminal, punch the terminal area of ​​each bidirectional terminal, press one terminal of the bidirectional terminal to tilt towards the side facing the metal layer, and press the other terminal of the bidirectional terminal to tilt towards the other side facing the metal layer.

[0060] Before stamping, local windows are made at the corresponding positions of the terminal areas of each bidirectional terminal on the dielectric support layer to avoid subsequent stamping of the terminals. In a specific application scenario, local windows can be made in the dielectric support layer using laser windowing.

[0061] Subsequently, the terminal areas of each bidirectional terminal are stamped, pressing one terminal of the bidirectional terminal to tilt towards the side facing the metal layer, and pressing the other terminal of the bidirectional terminal to tilt towards the other side facing the metal layer.

[0062] Please see Figure 5 , Figure 5 This is a side view of one embodiment of the bidirectional terminal stamping of this application.

[0063] The vertical distance H1 between the side of terminal 51 of the bidirectional terminal 50 away from the tail region 52 and the tail region 52 ranges from 0.2 to 0.5 mm, specifically including but not limited to 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm, etc. The above-mentioned vertical distance range allows for a more reasonable range of elastic deformation of the terminal, thereby achieving a more stable electrical connection.

[0064] In this embodiment, the metal layer is illustrated using a beryllium copper layer as an example. After stamping, the metal layer and the dielectric support layer are subjected to a strengthening treatment at a preset temperature and for a preset duration to precipitate the BeCu phase until the yield strength and hardness reach the preset conditions. The preset temperature range is 300-350 degrees Celsius, including but not limited to 300 degrees Celsius, 305 degrees Celsius, 310 degrees Celsius, 315 degrees Celsius, 320 degrees Celsius, 325 degrees Celsius, 330 degrees Celsius, 340 degrees Celsius, or 350 degrees Celsius, etc.

[0065] The preset duration ranges from 3 to 5 hours, including but not limited to 3 hours, 4 hours, or 5 hours. The preset yield strength ranges from 900 to 1200 MPa, including but not limited to 900 MPa, 1000 MPa, 1100 MPa, or 1200 MPa, etc., and the hardness ranges from 380 to 420 HV, including but not limited to 380 HV, 385 HV, 390 HV, 395 HV, 400 HV, 405 HV, 410 HV, 415 HV, or 420 HV, etc.

[0066] The metal layer is a beryllium copper layer, which gives the terminals high elasticity and conductivity, thus improving connection reliability. This step strengthens the precipitation of the BeCu phase, thereby increasing yield strength and hardness and reducing permanent deformation of the terminals during insertion and removal. Precise control of preset temperature and time ensures stable and repeatable treatment results, further improving product consistency and durability. The microstructure optimization of the precipitated BeCu phase ensures stable mechanical properties of the terminals during long-term use, which is beneficial for meeting the needs of high system density PCB interconnect applications.

[0067] Step S26: Obtain the first outer circuit layer, dielectric layer and second outer circuit layer, and perform partial windowing on the first outer circuit layer, dielectric layer and second outer circuit layer based on the terminal area of ​​each bidirectional terminal.

[0068] Both the first outer circuit layer and the second outer circuit layer are single-layer circuit boards, which include a dielectric layer and a conductive layer that are bonded together.

[0069] Based on the terminal regions of each bidirectional terminal, partial windows are made in the first outer circuit layer, dielectric layer, and second outer circuit layer.

[0070] Step S27: The first outer circuit layer, dielectric support layer, metal layer, dielectric layer and second outer circuit layer are stacked and bonded in sequence, so that the terminal areas of each bidirectional terminal on the metal layer are exposed and then pressed together.

[0071] By partially opening windows in the first outer circuit layer, dielectric layer, and second outer circuit layer and aligning them with the terminal positions, the terminal areas are fully exposed after lamination, thereby achieving precise conductivity in the subsequent gold plating process and avoiding product scrap due to incorrect gold plating coverage. The lamination sequence ensures that the metal layer terminal areas remain exposed after lamination, which helps improve the uniformity and consistency of gold plating. The lamination process tightly bonds each layer, further enhancing the structural stability and electroplating yield of the product, which is beneficial for meeting the needs of high system density PCB interconnect applications.

[0072] Step S28: Prepare multiple metallized holes on the outer circuit layers on opposite sides of the metal layer to connect the tail regions of each bidirectional terminal. Pattern each outer circuit layer to form electroplated gold leads, wherein the electroplated gold leads are connected to each metallized hole.

[0073] In a specific application scenario, holes are drilled into the outer circuit layers on opposite sides of the metal layer until the metal layer is reached, exposing the tail area of ​​each bidirectional terminal to obtain multiple blind vias; each blind via is then metallized to obtain metallized vias.

[0074] Each outer circuit layer is patterned to form electroplated gold leads, which are then connected to each metallized via to form a continuous conductive loop, achieving uniform current distribution. This allows for the conduction and gold plating of bidirectional terminals using the electroplated gold leads and the metallized vias.

[0075] In a specific application scenario, the conductive layers of each outer circuit layer can be etched by applying dry film, exposure and development, and etching to form electroplated gold leads that connect all metallized holes.

[0076] Step S29: Gold plating is performed on the terminal areas of each bidirectional terminal through electroplated gold leads and metallized holes to complete the overall gold plating of each bidirectional terminal and obtain a bidirectional spring contact connection plate.

[0077] In a specific application scenario, before gold plating, a first protective layer is applied to the opening of each metallized hole to prevent the metal inside the hole from being plated with gold. Then, gold plating is performed on the terminal areas of each bidirectional terminal through electroplated gold leads and each metallized hole to complete the overall gold plating of each bidirectional terminal; the first protective layer is then removed. Finally, the electroplated gold leads and the metal layer inside each metallized hole are etched away to obtain the bidirectional spring contact plate.

[0078] In this case, the bidirectional spring contact board is not conductive in any area except for the bidirectional terminals. That is, the conductive layer of the outer circuit board is eventually etched away, thereby achieving the vertical interconnection function between layers.

[0079] Finally, the connecting plate undergoes shape processing, quality inspection, and packaging for storage.

[0080] Through the above steps, the method for preparing the connector board in this embodiment first ensures the electroplating accuracy of the terminal tail through local gold plating, and reduces the scrap of bidirectional terminals due to lack of support structure during processing by setting a dielectric support layer; finally, the connection between the outer circuit layer and the metallized holes and the bidirectional terminals achieves overall gold plating of the terminal area, thereby improving product yield; by combining the process of local gold plating before etching and gold plating of terminals after lamination, the preparation and overall gold plating of the bidirectional spring contact connector board are realized. The bidirectional spring contact connector board can achieve detachable conductive connection, which is highly flexible and convenient for subsequent maintenance, debugging or replacement. This reduces the production cost of the bidirectional spring contact connector board, improves processing efficiency and quality stability, and is conducive to meeting the needs of high system density PCB interconnection applications.

[0081] Please see Figure 6 , Figure 6 This is a side view of the connecting plate according to an embodiment of this application. The connecting plate in this embodiment is prepared by the method for preparing the connecting plate of any of the above embodiments.

[0082] The connecting plate 100 of this embodiment includes: a first outer layer 110, a plurality of bidirectional terminals 130 and a second outer layer 120 stacked and attached in sequence; the tail region 131 of each bidirectional terminal 130 is sandwiched therebetween the first outer layer 110 and the second outer layer 120, and the positions on the first outer layer 110 and the second outer layer 120 corresponding to the terminal regions 132 of each bidirectional terminal 130 are hollowed out.

[0083] In this configuration, one terminal 131 of each bidirectional terminal 130 is tilted toward one side of the connecting plate 100, and the other terminal 131 of the bidirectional terminal 130 is tilted toward the opposite side of the connecting plate 100. Furthermore, the entire surface of the bidirectional terminal 130 is gold-plated.

[0084] Through the above structure, the connecting board of this embodiment, with its inclined bidirectional terminal design, achieves conductive interconnection in the vertical direction. This allows the bidirectional spring-loaded connecting board to be placed between two circuit layers, enabling the bidirectional terminals to contact the pads or contacts on both circuit layers, thus achieving interlayer interconnection between the two circuit layers via the bidirectional spring-loaded connecting board. The terminals of the bidirectional terminals can make contact with the boards on opposite sides of the connecting board without soldering or pressing, achieving a detachable conductive connection with high flexibility, facilitating subsequent maintenance, debugging, or replacement. Furthermore, the bidirectional terminals of this application are integrally molded, have low impedance, and high conductivity, improving the performance of inter-board interconnection.

[0085] In some embodiments, the width of the terminal 132 of each bidirectional terminal 130 gradually decreases along the direction away from the tail region 131; wherein, the width of the side of the terminal 132 near the tail region 131 is in the range of 200-250um, specifically including but not limited to 200um, 205um, 210um, 215um, 220um, 230um, 240um or 250um, etc. This range ensures that the connection of the terminal 132 has sufficient mechanical strength to support the elastic deformation of the terminal 132 and avoid deformation during electroplating or interconnection.

[0086] The width of the side of terminal 132 away from the tail region 131 ranges from 80 to 120 μm, specifically including but not limited to 80 μm, 82 μm, 85 μm, 90 μm, 95 μm, 98 μm, 100 μm, 105 μm, 110 μm, 114 μm, 116 μm, 118 μm, or 120 μm, etc. This narrower width makes the tip of terminal 132 smaller, which is beneficial for reducing the unevenness of metal deposition in the electroplating gold process and preventing short circuits between terminals.

[0087] The terminal length of each terminal 132 ranges from 700 to 900 μm, specifically including but not limited to 700 μm, 710 μm, 720 μm, 730 μm, 740 μm, 750 μm, 780 μm, 800 μm, 710 μm, 720 μm, 850 μm, 860 μm, or 900 μm, etc. This length range provides a moderate elastic deformation space, enabling the terminal 132 to effectively adapt to connection surfaces of different heights when interconnecting between boards.

[0088] The minimum spacing between the two terminals 132 of the bidirectional terminal 130 is 60-100µm, specifically including but not limited to 60µm, 65µm, 68µm, 70µm, 72µm, 75µm, 80µm, 82µm, 85µm, 88µm, 90µm, 95µm, or 100µm, etc. This spacing design ensures that the terminals 132 will not become conductive due to metal deposition during electroplating, while also supporting high-density arrangement.

[0089] The vertical distance between the side of terminal 132 of bidirectional terminal 130 away from tail region 131 and tail region 131 ranges from 0.2 to 0.5 mm, specifically including but not limited to 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm, etc. The above-mentioned vertical distance range allows for a more reasonable elastic deformation range of terminal 132, thereby achieving a more stable electrical connection.

[0090] The connection board 100 in this embodiment can be applied to scenarios such as optical modules, aerospace, and high-density interconnection. It has low packaging and disassembly difficulty, high flexibility, and is easy to repair and replace.

[0091] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method for preparing a connecting plate, characterized in that, The method for preparing the connecting plate includes: A metal layer is obtained; wherein the metal layer is used to fabricate a plurality of bidirectional terminals; Partial gold plating is performed on predetermined areas on opposite sides of the metal layer, wherein the predetermined areas correspond to the tail areas of each of the bidirectional terminals; A dielectric support layer is attached to one side of the metal layer, the metal layer is etched to form the initial shape of a plurality of bidirectional terminals, and the terminal area of ​​each bidirectional terminal is stamped. An outer circuit layer is laminated to the opposite sides of the metal layer and the dielectric support layer; wherein, the positions on the outer circuit layer corresponding to the terminal areas of each of the bidirectional terminals are cut out; The terminal areas of each of the bidirectional terminals are gold-plated through the outer circuit layer to complete the overall gold plating of each of the bidirectional terminals, thereby obtaining a bidirectional spring contact connection board.

2. The method for preparing the connecting plate according to claim 1, characterized in that, The dielectric support layer is attached to one side of the metal layer, including: A dielectric support layer is bonded to one side of the metal layer; The stamping of the terminal areas of each of the bidirectional terminals includes: The dielectric support layer is partially opened based on the terminal region of each of the bidirectional terminals; the terminal region of each of the bidirectional terminals is stamped until one terminal of the bidirectional terminal is pressed to tilt toward the side of the metal layer, and the other terminal of the bidirectional terminal is pressed to tilt toward the other side of the metal layer.

3. The method for preparing the connecting plate according to claim 1, characterized in that, The step of laminating outer circuit layers onto opposite sides of the metal layer and the dielectric support layer includes: The first outer circuit layer, the dielectric layer, and the second outer circuit layer are obtained, and local windows are made in the first outer circuit layer, the dielectric layer, and the second outer circuit layer based on the terminal regions of each of the bidirectional terminals. The first outer circuit layer, dielectric support layer, metal layer, dielectric layer and second outer circuit layer are stacked and bonded in sequence, so that the terminal areas of each bidirectional terminal on the metal layer are exposed and then pressed together.

4. The method for preparing the connecting plate according to claim 1 or 3, characterized in that, The process involves gold plating the terminal areas of each of the bidirectional terminals through the outer circuit layer to complete the overall gold plating of each of the bidirectional terminals, resulting in a bidirectional spring contact connection board, comprising: Multiple metallized holes are respectively formed on the outer circuit layers on opposite sides of the metal layer to connect the tail regions of each of the bidirectional terminals; Each of the outer circuit layers is patterned to form electroplated gold leads, wherein the electroplated gold leads are respectively connected to each of the metallized vias; The terminal areas of each bidirectional terminal are plated with gold through the electroplated gold leads and the metallized holes to complete the overall gold plating of each bidirectional terminal, thereby obtaining a bidirectional spring contact plate.

5. The method for preparing the connecting plate according to claim 4, characterized in that, The method of fabricating multiple metallized vias in the outer circuit layers on opposite sides of the metal layer to connect the tail regions of each of the bidirectional terminals includes: Drill holes in the outer circuit layers on opposite sides of the metal layer until the metal layer is reached, so as to expose the tail area of ​​each bidirectional terminal and obtain multiple blind vias. Each of the blind holes is metallized to obtain the metallized holes.

6. The method for preparing the connecting plate according to claim 4, characterized in that, The step of plating gold on the terminal areas of each of the bidirectional terminals through the electroplated gold leads and each of the metallized holes to complete the overall gold plating of each of the bidirectional terminals includes: A first protective layer is applied to the opening of each of the metallized holes; The terminal areas of each bidirectional terminal are plated with gold through the electroplated gold leads and each of the metallized holes to complete the overall gold plating of each bidirectional terminal. Remove the first protective layer; The electroplated gold leads and the metal layers in each of the metallized holes are etched away to obtain the bidirectional spring contact plate.

7. The method for preparing the connecting plate according to claim 1, characterized in that, The step of locally plating gold on predetermined areas on opposite sides of the metal layer includes: A second protective layer is attached to the opposite sides of the metal layer, and the areas on the opposite sides of the metal layer corresponding to the tail areas of each of the bidirectional terminals are exposed based on the design position of each of the bidirectional terminals. The metal layer is double-sided gold plated to plate the tail area of ​​each of the bidirectional terminals. Remove the second protective layer.

8. The method for preparing the connecting plate according to claim 1, characterized in that, The metal layer is a beryllium copper layer; the process of stamping the terminal areas of each of the bidirectional terminals then includes: The metal layer and the dielectric support layer are subjected to a strengthening treatment at a preset temperature and for a preset duration to precipitate the BeCu phase until the yield strength and hardness reach the preset conditions. The preset temperature range is 300-350 degrees Celsius, the preset duration range is 3-5 hours, the preset yield strength range is 900-1200 MPa, and the preset hardness range is 380-420 HV.

9. A connecting plate, characterized in that, The connecting plate is prepared by the method for preparing a connecting plate according to any one of claims 1-8, and the connecting plate comprises: A first outer layer, a plurality of bidirectional terminals, and a second outer layer are stacked and fitted together in sequence; the tail area of ​​each bidirectional terminal is sandwiched between the first outer layer and the second outer layer, and the positions on the first outer layer and the second outer layer corresponding to the terminal areas of each bidirectional terminal are hollowed out; In this configuration, one terminal of each bidirectional terminal is tilted toward one side of the connecting plate, and the other terminal of the bidirectional terminal is tilted toward the opposite side of the connecting plate.

10. The connecting plate according to claim 9, characterized in that, The width of each bidirectional terminal gradually decreases along the direction away from the tail region; wherein, the width of the terminal on the side closer to the tail region ranges from 200-250um, and the width of the terminal on the side away from the tail region ranges from 80-120um; the vertical distance between the side of the terminal away from the tail region and the tail region ranges from 0.2-0.5mm. The terminal length of each terminal ranges from 700 to 900 μm, and the minimum spacing between the two terminals of the bidirectional terminal is 60 to 100 μm.

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