A component embedding method, device, equipment, medium and product

Abstract

Embodiments of the present application provide a component embedding method, device, equipment, medium and product, and relate to the field of printed circuit board manufacturing. The method drills a first blind hole on a preset inner layer board, and places components into the blind hole along the vertical direction, so that the components are embedded in the inner layer board in a vertical posture, each component only occupies a hole position cross-sectional area, without the need for a large size expansion space in the horizontal direction. Meanwhile, the components are fixed in the blind hole and filled with resin for solidification, so that the components are completely located inside the board body, releasing the board surface area for arranging other functional modules. Through pressing, building up, laser drilling, electroplating hole filling and pattern transfer on the inner layer board with the components fixed, the copper terminals of the components can be vertically interconnected with the outer layer pads, without the need for additional pad area in the horizontal direction, so that more components can be integrated on the limited board surface, solving the problem of low component concentration caused by the embedding method in the prior art.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing, and more particularly to a method, apparatus, equipment, medium, and product for embedding components. Background Technology

[0002] Embedded components are components such as capacitors, resistors, and small active devices mounted on inner layer boards, encapsulated and cured with resin, and then electrically interconnected with surface layer circuitry. As automotive electronics and radio frequency communication products continue to evolve towards thinner, smaller, and higher-density integration, the requirements for circuit board wiring space utilization, signal transmission integrity, and assembly reliability in end products continue to increase. Embedded components have become an important technology to promote the high-quality development of high-density circuit boards.

[0003] In the prior art, components are usually mounted on electrodes formed on the inner layer board. The electrical connection between the components and the electrodes on the inner layer board is achieved by welding. After the connection is completed, insulating resin is used to fill and embed the components and their electrodes. Then, processes such as lamination and pattern transfer are performed to achieve the embedding of components on the board and electrical interconnection with the outer layer circuitry.

[0004] However, in the existing technology, the component embedding method results in a low component concentration, which is difficult to meet the requirements of high-density interconnect PCBs for high wiring space utilization. Summary of the Invention

[0005] This application provides a method, apparatus, equipment, medium, and product for embedding components, in order to solve the technical problem of low component concentration in the prior art.

[0006] In a first aspect, embodiments of this application provide a method for embedding components, comprising:

[0007] A first blind hole is drilled along a first predetermined direction on a predetermined inner layer plate, and a component is placed into the first blind hole along the first predetermined direction; wherein, the first predetermined direction refers to the direction perpendicular to the surface of the predetermined inner layer plate, the depth of the first blind hole is greater than the height of the component, the diameter of the first blind hole is greater than the outer diameter of the component, and the outer diameter refers to the diameter of the circumcircle of the cross-sectional contour of the component.

[0008] The first blind hole is filled with resin and cured to obtain an inner layer plate with the components fixed thereon.

[0009] The inner layer board on which the components are fixed is subjected to lamination, laser drilling, electroplating to fill holes, and pattern transfer to make the copper terminals of the components electrically connected to the pads; wherein, the lamination is used to laminate a first copper foil onto the inner layer board on which the components are fixed, and the pattern transfer is used to etch the first copper foil to obtain the pads.

[0010] In one possible design, before drilling the first blind hole along a predetermined first direction on the predetermined inner layer plate and placing the component into the first blind hole along the predetermined first direction, the method further includes:

[0011] Obtain the customer's stack-up design specifications and component specifications, and determine the core board type and number of sheets based on the customer's stack-up design specifications and component specifications;

[0012] The inner layer pattern is transferred to multiple inner layer core boards corresponding to the core board type and the number of sheets to obtain multiple inner layer core boards with etched inner layer patterns;

[0013] Multiple inner core boards with etched inner layer patterns and a preset prepreg are pressed together to obtain the preset inner layer board.

[0014] In one possible design, drilling the first blind hole along a predetermined first direction on a predetermined inner layer plate includes:

[0015] A through hole is drilled along the preset first direction on the preset inner layer plate, and the through hole is metallized to obtain a through hole; wherein the diameter of the through hole and the diameter of the through hole are both larger than the outer diameter of the component;

[0016] The through holes are filled with resin. After the resin cures, the resin in the through holes is ground so that the recess depth of the surface of the resin in the through holes relative to the surface of the preset inner layer plate is less than a preset threshold, thereby obtaining resin plugging.

[0017] A first blind hole is drilled along a preset first direction on the first end face of the resin plug hole, and a second blind hole is drilled along a preset second direction on the second end face of the resin plug hole; wherein the sum of the depth of the first blind hole and the depth of the second blind hole is equal to the depth of the resin plug hole, the central axis of the first blind hole coincides with the central axis of the second blind hole, the preset second direction is opposite to the preset first direction, and both the first end face and the second end face are parallel to the plate surface.

[0018] In one possible design, the process of filling and curing the first blind hole with resin to obtain the inner layer plate on which the components are fixed includes:

[0019] The first blind hole and the second blind hole are filled with resin. After the resin is cured, the resin in the first blind hole and the second blind hole is ground so that the recess depth of the surface of the resin in the first blind hole and the second blind hole relative to the surface of the preset inner layer plate is less than a preset threshold, and the ground inner layer plate is obtained.

[0020] The polished inner layer board is subjected to AOI inspection. If the inspection results determine that there are no voids or depressions in the resin in the first blind hole and the second blind hole, the polished inner layer board is identified as the inner layer board with the fixed components.

[0021] In one possible design, the process of laminating and adding layers, laser drilling, electroplating to fill holes, and transferring patterns on the inner layer board where the components are fixed, to electrically connect the copper terminals of the components to the pads, includes:

[0022] The inner layer board with fixed components is patterned and transferred to form power layer lines and pads on the inner layer board with fixed components, resulting in a patterned inner layer board. A first dielectric layer and a first copper foil are then laminated onto the patterned inner layer board to obtain a laminated inner layer board.

[0023] A third blind hole is drilled on the inner layer plate after lamination and layering, respectively along the preset first direction and the preset second direction; wherein the central axis of the third blind hole coincides with the central axis of the second blind hole;

[0024] A fourth blind hole is drilled into the inner layer plate after lamination and layering, which is directed toward the resin plug hole along the preset first direction and the preset second direction respectively; wherein, the hole ring is an annular copper pad obtained by metallizing the through hole, filling it with resin and grinding.

[0025] Both the third and fourth blind holes are metallized and electroplated to fill the holes, so that the copper terminals of the components can be connected to the first copper foil through the third blind hole, and the power layer lines can be connected to the first copper foil through the fourth blind hole, thus obtaining the inner layer board after electroplating and filling the holes.

[0026] In one possible design, after performing lamination, laser drilling, electroplating, and pattern transfer on the inner layer board with the fixed components to electrically connect the copper terminals of the components to the pads, the design further includes:

[0027] The inner layer board after electroplating and filling holes is subjected to pattern transfer to obtain a semi-finished board;

[0028] The structure of the pads of the third blind via is adjusted to adapt the structure to the preset HDI stack-up specifications, resulting in a semi-finished board with adjusted pads.

[0029] A second dielectric layer and a second copper foil are laminated onto the semi-finished board with adjusted pads to obtain a laminated and layered semi-finished board.

[0030] A fifth blind hole is drilled along the preset first direction toward the pad of the third blind hole on the semi-finished board after lamination and layering.

[0031] The fifth blind hole is metallized and electroplated to fill the hole, so that the pad of the third blind hole can be connected to the second copper foil through the fifth blind hole, thus obtaining the semi-finished board after the addition of layers;

[0032] The pattern of the added-layer semi-finished board is transferred to obtain a circuit-formed semi-finished board, and the circuit-formed semi-finished board is processed by PCB post-processing to obtain a PCB board.

[0033] Secondly, embodiments of this application provide an embedding device for electronic components, comprising:

[0034] An embedded module is used to drill a first blind hole along a preset first direction on a preset inner layer plate, and to place a component into the first blind hole along the preset first direction; wherein, the preset first direction refers to the direction perpendicular to the surface of the preset inner layer plate, the depth of the first blind hole is greater than the height of the component, the diameter of the first blind hole is greater than the outer diameter of the component, and the outer diameter refers to the diameter of the circumcircle of the cross-sectional contour of the component.

[0035] A filling module is used to fill and cure the first blind hole with resin to obtain an inner layer board with fixed components.

[0036] The first lamination module is used to perform lamination layering, laser drilling, electroplating filling, and pattern transfer on the inner layer board on which the components are fixed, so that the copper terminals of the components are electrically connected to the pads; wherein, the lamination layering is used to laminate a first copper foil on the inner layer board on which the components are fixed, and the pattern transfer is used to etch the first copper foil to obtain the pads.

[0037] In one possible design, the component embedding device further includes:

[0038] The determination module is used to obtain the customer's stack-up design specifications and component specifications, and determine the core board type and number of sheets based on the customer's stack-up design specifications and component specifications;

[0039] The first pattern transfer module is used to transfer the inner layer pattern of multiple inner layer core boards corresponding to the core board type and the number of sheets, so as to obtain multiple inner layer core boards with etched inner layer patterns.

[0040] The second lamination module is used to laminate the multiple inner core boards with etched inner layer patterns and the preset prepreg to obtain the preset inner layer board.

[0041] In one possible design, the embedded module includes:

[0042] A first drilling unit is used to drill through holes along a predetermined first direction on the predetermined inner layer plate, and to perform hole metallization on the through holes to obtain conductive holes; wherein, the diameter of the through holes and the diameter of the conductive holes are both larger than the outer diameter of the component;

[0043] The first filling unit is used to fill the through hole with resin. After the resin is cured, the resin in the through hole is ground so that the recess depth of the surface of the resin in the through hole relative to the surface of the preset inner layer plate is less than a preset threshold, thereby obtaining resin plugging.

[0044] The second drilling unit is used to drill the first blind hole along the preset first direction on the first end face of the resin plug hole, and to drill the second blind hole along the preset second direction on the second end face of the resin plug hole; wherein the sum of the depth of the first blind hole and the depth of the second blind hole is equal to the depth of the resin plug hole, the central axis of the first blind hole coincides with the central axis of the second blind hole, the preset second direction is opposite to the preset first direction, and both the first end face and the second end face are parallel to the plate surface.

[0045] In one possible design, the filling module includes:

[0046] The second filling unit is used to fill the first blind hole and the second blind hole with resin. After the resin is cured, the resin in the first blind hole and the second blind hole is ground so that the surface of the resin in the first blind hole and the second blind hole is less than the surface of the preset inner layer plate by a preset threshold, so as to obtain the ground inner layer plate.

[0047] An inspection unit is used to perform AOI inspection on the ground inner layer board. If the inspection results determine that there are no voids or depressions in the resin in the first blind hole and the second blind hole, the ground inner layer board is identified as the inner layer board with the fixed components.

[0048] In one possible design, the first pressing module includes:

[0049] A pattern transfer unit is used to transfer the pattern of the inner layer board on which the components are fixed, so as to form power layer lines and pads on the inner layer board on which the components are fixed, to obtain the inner layer board after pattern transfer, and to press a first dielectric layer and a first copper foil on the inner layer board after pattern transfer to obtain the inner layer board after lamination and layering.

[0050] The third drilling unit is used to drill third blind holes in the inner layer plate after lamination and layering, respectively along the preset first direction and the preset second direction; wherein the central axis of the third blind hole coincides with the central axis of the second blind hole;

[0051] The fourth drilling unit is used to drill a fourth blind hole in the inner layer plate after lamination and layering, towards the hole ring that is directed toward the resin plug hole along the preset first direction and the preset second direction respectively; wherein, the hole ring is an annular copper pad obtained by metallizing the through hole, filling it with resin and grinding.

[0052] The electroplating and filling unit is used to perform hole metallization and electroplating filling on both the third and fourth blind holes, so that the copper terminals of the components can be connected to the first copper foil through the third blind hole, and the power layer lines can be connected to the first copper foil through the fourth blind hole, thus obtaining the inner layer board after electroplating and filling.

[0053] In one possible design, the component embedding device further includes:

[0054] The second pattern transfer module is used to transfer the pattern of the inner layer board after electroplating and filling the holes to obtain a semi-finished board.

[0055] An adjustment module is used to adjust the structure of the pads of the third blind hole so that the structure can be adapted to the preset HDI stack-up specifications, thereby obtaining a semi-finished board with adjusted pads.

[0056] The third lamination module is used to laminate the second dielectric layer and the second copper foil onto the semi-finished board after the pads have been adjusted, to obtain the laminated semi-finished board.

[0057] A drilling module is used to drill a fifth blind hole along the preset first direction toward the pad of the third blind hole on the semi-finished board after lamination and layering.

[0058] A hole metallization module is used to perform hole metallization and electroplating filling on the fifth blind hole, so that the pad of the third blind hole can be connected to the second copper foil through the fifth blind hole to obtain a semi-finished board after layering;

[0059] The third pattern transfer module is used to transfer patterns from the added-layer semi-finished board to obtain a circuit-formed semi-finished board, and to perform PCB post-processing on the circuit-formed semi-finished board to obtain a PCB board.

[0060] Thirdly, embodiments of this application provide an electronic device, including: a processor, and a memory communicatively connected to the processor;

[0061] The memory stores computer-executed instructions;

[0062] When the processor executes the computer execution instructions stored in the memory, it is used to implement the embedding method of the component as described in any of the first aspects.

[0063] Fourthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the embedding method of the component as described in any of the first aspects.

[0064] Fifthly, embodiments of this application provide a computer program product, including a computer program, which, when executed by a processor, is used to implement the embedding method of the components as described in any of the first aspects.

[0065] This application provides a method, apparatus, device, medium, and product for embedding components. By drilling a first blind hole perpendicular to the surface of a pre-defined inner layer board, and placing the component into the blind hole along this vertical direction, the component is vertically embedded within the inner layer board. Compared to traditional horizontal placement or surface mounting methods, vertical embedding allows for the arrangement of more components per unit area because each component occupies only one hole cross-sectional area, eliminating the need for large horizontal expansion space. Furthermore, the component is fixed within the blind hole and filled with cured resin; its overall height is less than the depth of the blind hole, thus remaining entirely within the board and not protruding outwards. This frees up a significant amount of board surface area for arranging other functional modules. Through lamination, laser drilling, electroplating, and pattern transfer of the inner layer board with the fixed components, the component's copper terminals can achieve vertical interconnection with the outer layer pads without relying on additional horizontal pad area. This allows for the integration of more components on a limited board surface, solving the problem of low component concentration caused by the embedding method in existing technologies. Attached Figure Description

[0066] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0067] Figure 1 A schematic diagram illustrating an application scenario of the component embedding method provided in this application embodiment;

[0068] Figure 2 A flowchart illustrating the component embedding method provided in the embodiments of this application. Figure 1 ;

[0069] Figure 3 A flowchart illustrating the component embedding method provided in the embodiments of this application. Figure 2 ;

[0070] Figure 4 A flowchart illustrating the component embedding method provided in the embodiments of this application. Figure 3 ;

[0071] Figure 5This is a schematic diagram of the structure of hole A provided in an embodiment of this application;

[0072] Figure 6 This is a schematic cross-sectional view of hole A after resin plugging, provided in an embodiment of this application.

[0073] Figure 7 A cross-sectional schematic diagram of a blind hole formed by drilling after resin plugging, provided in an embodiment of this application;

[0074] Figure 8 This is a schematic diagram showing the vertical placement of components into blind hole B according to an embodiment of this application;

[0075] Figure 9 This is a schematic diagram of the screen printing resin fixing components provided in the embodiments of this application;

[0076] Figure 10 This is a schematic diagram of the structure of blind hole M and blind hole N provided in the embodiments of this application;

[0077] Figure 11 For the electroplating filling and pattern transfer provided in the embodiments of this application, a component connection network diagram is created;

[0078] Figure 12 A schematic cross-sectional view of an HDI multilayer PCB board with vertically embedded components provided in an embodiment of this application;

[0079] Figure 13 A schematic diagram of the structure of the component embedding device provided in the embodiments of this application;

[0080] Figure 14 A schematic diagram of the structure of the electronic device provided in this application.

[0081] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0082] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0083] In the embodiments of this application, the terms "first" and "second" are used to distinguish identical or similar items with substantially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that "first" and "second" do not necessarily imply difference. It should be noted that in the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design scheme described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner. In the embodiments of this application, "at least one" refers to one or more, and "more than one" refers to two or more.

[0084] It should be noted that the phrase "at...time" in the embodiments of this application can refer to the instant at which a certain situation occurs, or to a period of time after the occurrence of a certain situation. The embodiments of this application do not specifically limit this. In addition, the embedding method, apparatus, device, medium, and product of a component provided in the embodiments of this application are only examples. An embedding method, apparatus, device, medium, and product of a component may also include more or less content.

[0085] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0086] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0087] To clearly understand the technical solution of this application, the solutions of the prior art will first be described in detail. Component embedding involves mounting components such as capacitors, resistors, and small active devices on an inner layer board, encapsulating and curing them with resin, and then electrically interconnecting them with the surface layer circuitry. As automotive electronics and radio frequency communication products continue to evolve towards thinner, smaller, and higher-density integration, the requirements for circuit board wiring space utilization, signal transmission integrity, and assembly reliability in end products are constantly increasing. Component embedding has become an important technology driving the high-quality development of high-density circuit boards.

[0088] In existing technologies, components are typically mounted on electrodes formed on inner layer boards. Electrical connections between the components and the electrodes on the inner layer board are achieved through soldering. After connection, insulating resin is used to simultaneously fill and embed the components and their electrodes. Subsequent processes include lamination, layer building, and pattern transfer to achieve component embedding on the board and electrical interconnection with outer layer circuitry. However, existing technologies typically place components on surface electrodes of the inner layer board, achieving electrical connections through soldering, and then embedding the components and electrodes together through overall resin filling. This approach requires a large area around the components for soldering and resin flow, resulting in a significant area of ​​the inner layer board surface being occupied by components, thus reducing the effective space available for wiring. Furthermore, due to the planar mounting layout, components must maintain a certain spacing, preventing tight arrangement. These factors combined result in low component density, making it difficult to meet the high wiring space utilization requirements of high-density interconnect PCBs. Therefore, existing technologies suffer from the technical problem of low component density.

[0089] Therefore, addressing the issue of low component density in existing technologies, the research found that, to solve this problem: Optionally, components can be vertically embedded inside the inner layer board instead of being flatly mounted on its surface. This allows the component's body to occupy the board's thickness direction rather than its surface direction, freeing up more surface wiring space and increasing component integration density per unit area. Optionally, blind vias or through-slots can be fabricated in the inner layer board to house the components completely, preventing them from protruding from the board surface and thus avoiding the occupation of additional planar area, leaving more space for high-density wiring. Optionally, after the components are placed in the housing, they can be fixed with resin filling, eliminating the need for pre-soldering between the components and electrodes. This saves on solder pad area and heat-affected zone required for soldering, allowing components to be placed more compactly within the board, further increasing density. Optionally, after the components are placed and fixed with resin, additional layers can be added by lamination and blind holes can be drilled in the corresponding positions. Then, the blind holes can be metallized and electroplated to fill them, so that the component terminals can be connected to the inner and outer layers of circuitry through electroplated copper pillars. This avoids soldering each component individually, simplifies the layout constraints, and facilitates higher density centralized arrangement.

[0090] This application provides a method, apparatus, device, medium, and product for embedding components. By drilling a first blind hole perpendicular to the surface of a pre-defined inner layer board, and placing the component into the blind hole along this vertical direction, the component is vertically embedded within the inner layer board. Compared to traditional horizontal placement or surface mounting methods, vertical embedding allows for the arrangement of more components per unit area because each component occupies only one hole cross-sectional area, eliminating the need for large horizontal expansion space. Furthermore, the component is fixed within the blind hole and filled with cured resin; its overall height is less than the depth of the blind hole, thus remaining entirely within the board and not protruding outwards. This frees up a significant amount of board surface area for arranging other functional modules. Through lamination, laser drilling, electroplating, and pattern transfer of the inner layer board with the fixed components, the component's copper terminals can achieve vertical interconnection with the outer layer pads without relying on additional horizontal pad area. This allows for the integration of more components on a limited board surface, solving the problem of low component concentration caused by the embedding method in existing technologies.

[0091] Based on the above-mentioned inventive discovery, the technical solution of this application is proposed.

[0092] The following describes the application scenarios of the component embedding method provided in the embodiments of the present invention. Figure 1 This is a schematic diagram illustrating an application scenario of the component embedding method provided in this application embodiment. For example... Figure 1 As shown, the application scenario includes a control terminal 101 and a component 102. The control terminal 101 drills a first blind hole along a preset first direction on a preset inner layer board, and places the component 102 into the first blind hole along the preset first direction. The control terminal 101 fills and cures the first blind hole with resin to obtain an inner layer board with the component 102 fixed. The control terminal 101 performs lamination, laser drilling, electroplating, and pattern transfer on the inner layer board with the component 102 fixed, so that the copper terminals of the component 102 are electrically connected to the pads.

[0093] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0094] Figure 2 A flowchart illustrating the component embedding method provided in the embodiments of this application. Figure 1 .like Figure 2 As shown, in this embodiment, the execution entity of this invention is the control terminal. Therefore, the component embedding method provided in this embodiment includes the following steps:

[0095] S201. Drill a first blind hole along a preset first direction on a preset inner layer plate, and place the component into the first blind hole along the preset first direction; wherein, the preset first direction refers to the direction perpendicular to the surface of the preset inner layer plate, the depth of the first blind hole is greater than the height of the component, the diameter of the first blind hole is greater than the outer diameter of the component, and the outer diameter refers to the diameter of the circumcircle of the cross-sectional contour of the component.

[0096] The first blind hole is a non-through hole machined in the preset inner layer board along a direction perpendicular to the board surface using mechanical or laser drilling. Its depth is designed to be greater than the height of the component to be embedded, and its diameter is designed to be greater than the outer circle diameter of the component's cross-section, so that the component can be completely recessed into the hole without protruding from the board surface, providing space for subsequent resin filling and vertical embedding. The preset first direction is a pre-defined direction perpendicular to the surface of the preset inner layer board, usually a vertical direction from the upper surface of the preset inner layer board to the lower surface.

[0097] Specifically, a mechanical drilling machine can be used to drill a first blind hole at a predetermined location on the inner layer board. The depth of the blind hole should be greater than the component's height, and the diameter should be greater than the component's outer diameter. Then, a pick-and-place machine picks up the component and vertically places it into the first blind hole, perpendicular to the board surface. This step transforms the component's placement from horizontal to vertical embedding, freeing up surface wiring space. By changing the component's mounting from horizontal to vertical embedding, the component's body occupies the thickness direction of the board rather than the surface direction, thus freeing up more surface wiring space and increasing the component integration density per unit area. The component's outer diameter is smaller than the diameter of the first blind hole, and the component's height is smaller than the depth of the first blind hole, ensuring the component is completely recessed into the hole and does not protrude from the board surface, avoiding the occupation of additional planar area.

[0098] S202. The first blind hole is filled with resin and cured to obtain the inner layer board with the components fixed on it.

[0099] Specifically, a vacuum resin plugging device can be used to inject special resin for printed circuit boards (PCBs) into the first blind hole. After the resin is completely filled, it is sent to a high-temperature oven for heating and curing. Then, a ceramic grinding machine is used to grind the excess resin on the board surface to make it smooth, resulting in an inner layer board with fixed components. This step is used to completely wrap the components with resin and cure them to form a fixed structure, so that the components will not be displaced during subsequent processing. At the same time, the components are encapsulated inside the board and do not protrude outward, thereby freeing up the board surface area for the placement of other functional modules.

[0100] S203. Perform lamination, laser drilling, electroplating, and pattern transfer on the inner layer board with fixed components to make the copper terminals of the components electrically connected to the pads; wherein, lamination is used to laminate the first copper foil on the inner layer board with fixed components, and pattern transfer is used to etch the first copper foil to obtain the pads.

[0101] The first copper foil is used when laminating and adding layers to the inner layer board on which the components are fixed. It is used after the components are embedded and the resin is cured. The prepreg and the first copper foil are stacked on the upper and lower sides of the inner layer board in sequence. The first copper foil is attached to the surface of the inner layer board by vacuum lamination. Subsequently, the copper terminals of the components are led out to the first copper foil layer by laser drilling and electroplating. Then, the first copper foil is etched into the required pad pattern by pattern transfer, thereby realizing the electrical connection between the components and the board pads.

[0102] Specifically, a vacuum laminator can be used to stack prepreg and the first copper foil on both sides of the inner layer board where the components are fixed, and then press them together under high temperature and pressure. Then, a UV laser drilling machine is used to drill blind holes at corresponding positions above the copper terminals of the components, exposing the copper terminals of the components at the bottom of the blind holes. The blind holes are then metallized and filled with copper by copper plating lines and through-hole plating lines, so that the blind holes are filled with copper and connected to the copper terminals of the components. Finally, the first copper foil is laminated, exposed, developed, and etched to remove the unwanted copper layer and form pads that connect with the blind holes. This step is used to bring out the copper terminals of the components embedded in the inner layer board to the pads on the board surface through blind hole plating, so as to realize the electrical interconnection between the components and the external circuitry.

[0103] By vertically placing components into pre-drilled intermediate layer vias, the main body of the component is completely submerged in the thickness direction of the board. Subsequently, through processes such as layer addition, laser drilling, via filling plating, and pattern transfer, vertical interconnect channels can be led out from both ends of the component. Therefore, it is possible to vertically embed components in the vias of the intermediate layer of an N-order (N≥1) High Density Interconnect Board (HDI). Through processes such as layer addition, laser drilling, via filling plating, and pattern transfer, vertical interconnection between the outer BGA pads of the PCB and the internally embedded components can be achieved, thereby realizing specific electrical functions.

[0104] This embodiment provides a component embedding method. By drilling a first blind hole in a direction perpendicular to the board surface on a preset inner layer board, and placing the component into the blind hole in this vertical direction, the component is vertically embedded inside the inner layer board. Compared with traditional horizontal placement or surface mounting methods, vertical embedding can arrange more components per unit area because each component only occupies the cross-sectional area of ​​one hole, without requiring a large horizontal expansion space. At the same time, the component is fixed in the blind hole and filled with resin for curing. Its overall height is less than the depth of the blind hole, so it is completely located inside the board and does not protrude outward, freeing up a large area of ​​the board surface for the arrangement of other functional modules. By laminating and adding layers, laser drilling, electroplating filling, and pattern transfer on the inner layer board with the fixed components, the copper terminals of the components can be vertically interconnected with the outer layer pads without relying on additional pad area in the horizontal direction. More components can be integrated on a limited board surface, solving the problem of low component concentration caused by the constraints of the embedding method in the prior art.

[0105] In one possible design, S201 involves drilling a first blind hole along a predetermined first direction on a predetermined inner layer plate, including:

[0106] S2011. Drill through holes along a preset first direction on a preset inner layer board, and perform hole metallization on the through holes to obtain conductive holes; wherein, the diameter of the through holes and the diameter of the conductive holes are both larger than the outer diameter of the components.

[0107] Specifically, a CNC mechanical drilling machine can be used to drill through holes in a pre-designed inner layer board. The diameter of the through hole is larger than the outer diameter of the component. Then, through a copper plating line and a full-board electroplating line, the hole wall is chemically coated with copper and electroplated with thickened copper to cover the hole wall with a conductive copper layer, thus obtaining a through hole. This step is used to form a metallized channel that runs vertically through the pre-designed inner layer board, providing a basic structure for subsequent resin plugging and blind hole processing.

[0108] S2012. Fill the through holes with resin. After the resin cures, grind the resin in the through holes so that the recess depth of the resin surface in the through holes relative to the surface of the preset inner layer plate is less than a preset threshold, thereby obtaining resin plugging.

[0109] Specifically, a vacuum resin plugging machine can be used to press PCB-specific resin into the vias from one side of the board, ensuring complete filling without air bubbles. The board is then placed in an oven to heat and cure the resin. Finally, a ceramic grinder with a sanding belt is used to grind the board surface, removing excess resin and controlling the resin surface depression depth relative to the board surface to be less than 15 micrometers, resulting in resin-filled vias. This step fills and smooths the inside of the vias with resin, providing a solid resin pillar for subsequently drilling two reverse blind holes coaxially within the via.

[0110] S2013. Drill a first blind hole along a preset first direction on the first end face of the resin plug hole, and drill a second blind hole along a preset second direction on the second end face of the resin plug hole; wherein, the sum of the depth of the first blind hole and the depth of the second blind hole is equal to the depth of the resin plug hole, the central axis of the first blind hole coincides with the central axis of the second blind hole, the preset second direction is opposite to the preset first direction, and both the first end face and the second end face are parallel to the board surface.

[0111] The second preset direction is the opposite of the first preset direction and is also perpendicular to the surface of the inner layer board. It is typically a vertical direction pointing from the lower surface to the upper surface of the inner layer board. The first preset direction is typically perpendicular to the board surface from top to bottom and points inwards, while the second preset direction is perpendicular to the board surface from bottom to top and points inwards. Both the first and second preset directions are perpendicular to the surface of the inner layer board and are used to define the machining direction when drilling holes from both sides of the board, ensuring that the first and second blind holes are coaxially aligned.

[0112] The first blind hole is drilled from the first end face (upper surface) of the resin plug hole along a predetermined first direction, and the second blind hole is drilled from the second end face (lower surface) of the resin plug hole along a predetermined second direction. The drilling directions of the two blind holes are opposite. The first and second blind holes are located inside the same resin plug hole, their central axes coincide, and the sum of their depths is equal to the depth of the resin plug hole.

[0113] The first end face and the second end face refer to the two opposite end faces of the resin plug hole. The first end face is usually the upper surface of the resin plug hole, which is coplanar with the upper surface of the preset inner layer board. The second end face is the lower surface of the resin plug hole, which is coplanar with the lower surface of the preset inner layer board. Both end faces are parallel to the board surface. The first blind hole is drilled from the first end face along the preset first direction, and the second blind hole is drilled from the second end face along the preset second direction.

[0114] Specifically, a double-sided controlled-depth drilling device can be used to drill a first blind hole on the first end face (upper surface) of the resin plug hole along a predetermined downward first direction, and simultaneously drill a second blind hole on the second end face (lower surface) along a predetermined upward second direction. The two directions are opposite. The device's built-in alignment system ensures that the central axes of the two blind holes coincide, and the drilling depth is controlled to ensure that the remaining resin thickness between the two blind holes is 0.2 to 0.3 mm. This step forms two coaxial, opposing blind holes inside the resin plug hole, extending from both ends towards the middle, with a thin layer of resin in between serving as a bottom support for the component, providing a precise cavity for vertical placement of the component.

[0115] By coaxially creating complementary first and second blind holes on the copper ring structure of the resin-filled vias, and using the metallized surface of the copper ring as a reference for hole positioning, the accuracy of the blind hole machining position and depth is ensured. The copper ring structure of the resin-filled vias not only provides boundary constraints for the cavity to accommodate components, but also serves as a conductive basis for subsequent interlayer interconnects, improving the coaxial accuracy and dimensional consistency of blind hole molding, and facilitating the precise installation of subsequent components into the cavity.

[0116] The technical effect of this solution in this embodiment is as follows: By first processing through holes in the inner layer plate and metallizing the holes to form conductive holes, and then forming resin plug holes through resin filling, curing and controlled grinding, first blind holes and second blind holes with complementary depths are opened coaxially at both ends of the resin plug holes. The hole position reference is achieved by relying on the copper ring structure of the resin plug holes, and the processing position and depth of the blind holes are constrained by the coaxial hole structure. This not only utilizes the molding resin area to limit the mounting cavity space of the components, but also uses the outer metal hole ring to build a solid conductive foundation for subsequent interlayer interconnection, improving the coaxial accuracy and dimensional consistency of the blind hole forming, facilitating the precise installation of subsequent components into the cavity, and optimizing the stability of the plate hole structure.

[0117] In one possible design, S202, the first blind hole is filled with resin and cured to obtain an inner layer board with components fixed thereon, including:

[0118] S2021. The first blind hole and the second blind hole are filled with resin. After the resin is cured, the resin in the first blind hole and the second blind hole is ground so that the surface of the resin in the first blind hole and the second blind hole is less than the surface of the preset inner layer plate by a preset threshold, and the ground inner layer plate is obtained.

[0119] Specifically, a vacuum resin plugging device can be used to simultaneously inject PCB-specific resin into the first and second blind holes. With vacuum assistance, the resin completely fills the two blind holes without air bubbles. Then, the board is sent to a high-temperature oven to heat and cure the resin. Next, a ceramic grinding machine with abrasive belt is used to grind the board surface to remove the resin overflowing from the blind holes. The depth of the resin surface in the two blind holes relative to the board surface is controlled to be less than 15 micrometers. The resulting inner layer board is then ground. This step is used to fill and smooth the resin at the top of the components placed vertically in the first blind hole and at the bottom of the second blind hole. During the grinding process, a 0.2-0.3 mm resin thickness is retained at the bottom of the plug hole as a bottom support for the components.

[0120] The first and second blind holes are filled with resin. After the resin cures, the resin in the first and second blind holes is ground to ensure that the surface depth of the resin in the first and second blind holes relative to the surface of the inner layer board is less than a preset threshold, resulting in a ground inner layer board. During the grinding process, a 0.2-0.3mm resin thickness is retained at the bottom of the resin-filled holes to ensure that the components will not shift due to mechanical stress during subsequent processing. This design avoids direct contact between the components and the inner layer board substrate due to over-drilling, reducing mechanical stress damage to the components. At the same time, the resin thickness provides a buffer, ensuring the stability of the components during subsequent processing (such as lamination and drilling).

[0121] S2022. Perform AOI inspection on the ground inner layer board. If the inspection results determine that there are no voids or depressions in the resin in the first and second blind holes, the ground inner layer board is determined to be the inner layer board with fixed components.

[0122] Specifically, an automated optical inspection device can be used to scan the ground inner layer board. A high-resolution camera captures images of the first and second blind via areas, and image analysis algorithms are used to identify whether there are voids or depressions on the resin surface within the vias. The depth of any depression is measured to be less than 15 micrometers. If all blind vias are free of voids and the depression depth is within acceptable limits, the ground inner layer board is marked as the inner layer board with the components fixed in place. This step verifies the resin filling quality within the first and second blind vias, ensuring that the components are completely encapsulated and the surface is smooth, thus preventing unreliable electrical interconnections due to filling defects during subsequent processing.

[0123] The Automated Optical Inspection (AOI) process includes: using a high-resolution camera to capture images of the first and second blind hole areas; using image analysis algorithms to identify whether there are voids or depressions on the resin surface inside the holes; and measuring whether the depression depth is less than 15 micrometers. If the inspection results confirm that the resin has no voids and the depression depth is acceptable, it is allowed to proceed to the component pre-assembly process; otherwise, resin re-printing is required. This inspection step can standardize the planar shape of the resin inside the blind holes, avoid resin molding defects from being left to later processes, screen out defective substrates in advance, ensure the flatness of the inner layer board substrate and the quality of cavity molding, and provide a regular and reliable mounting reference surface for the smooth placement and assembly of components, avoiding the impact of uneven surfaces on the vertical placement of subsequent components.

[0124] The technical effect of this solution in this embodiment is as follows: by finely grinding the resin surface after the blind hole resin is filled and cured, the size of the resin end face depression is controlled within a set threshold. AOI inspection is also used to check the resin molding quality inside the hole. Only under the condition of passing quality inspection without voids or defective depressions is the resin transferred to the component pre-assembly process. This can regulate the internal resin plane shape of the blind hole, avoid resin molding defects from being left to the later process, screen out defective substrates in advance, ensure the flatness of the inner layer board substrate and the cavity molding quality, and provide a regular and reliable mounting reference surface for the smooth placement and assembly of components.

[0125] In one possible design, S203 involves laminating and adding layers to the inner layer board on which the components are fixed, laser drilling, electroplating to fill the holes, and transferring patterns to electrically connect the copper terminals of the components to the pads, including:

[0126] S2031. Perform pattern transfer on the inner layer board with fixed components to form power layer lines and pads on the inner layer board with fixed components, to obtain the inner layer board after pattern transfer, and press the first dielectric layer and the first copper foil on the inner layer board after pattern transfer to obtain the inner layer board after lamination and layering.

[0127] The first dielectric layer is an insulating material layer formed by curing a prepreg under high temperature and pressure. It is used to isolate the inner layer circuitry from the outer copper foil and provide interlayer insulation. The first copper foil is a thin conductive metal layer pressed onto the outer surface of the first dielectric layer. After the inner layer board pattern transfer is completed and the power layer circuitry and pads are formed, the first dielectric layer and the first copper foil are stacked sequentially on the upper and lower surfaces of the inner layer board. They are then vacuum-pressed to firmly adhere to the board surface. This provides an add-on structure for subsequently drilling the third and fourth blind holes at corresponding positions, electroplating to fill the holes, and realizing the electrical interconnection between the component copper terminals and the power layer circuitry and the first copper foil.

[0128] Specifically, a photosensitive dry film can be attached to the copper foil surface of the inner layer board where the components are fixed. The power layer circuitry and pad patterns are formed on the dry film through exposure and development. Then, the copper layer without dry film protection is removed by etch solution. After the film is removed, the inner layer board with transferred patterns is obtained. Then, the first dielectric layer and the first copper foil are stacked on the upper and lower sides of the inner layer board in sequence and sent to a vacuum press to be pressed under high temperature and high pressure. This solidifies the first dielectric layer and adheres the first copper foil to the surface of the inner layer board, resulting in the laminated inner layer board. This step is used to create power layer circuitry and pad patterns on the surface of the inner layer board and to laminate a new dielectric layer and copper foil on top of them, providing a basic structure for drilling blind holes that connect the component terminals and the power layer.

[0129] S2032. Drill a third blind hole in the inner layer plate after lamination and layering along a preset first direction and a preset second direction respectively; wherein the central axis of the third blind hole coincides with the central axis of the second blind hole.

[0130] Specifically, a dual-axis laser drilling machine can be used to drill the first third blind hole vertically downward along a preset first direction on the upper surface of the laminated inner layer board, ensuring that the bottom of the blind hole accurately falls on the surface of the upper copper terminal of the component. Simultaneously, a second third blind hole is drilled vertically upward along a preset second direction on the lower surface of the laminated inner layer board, ensuring that the bottom of the blind hole accurately falls on the surface of the lower copper terminal of the component. The coaxial alignment system built into the machine ensures that the central axis of the two third blind holes coincides with the central axis of the second blind hole. This step is used to drill two independent vertical channels in the laminated inner layer board that connect the upper and lower copper terminals of the component, respectively, preparing for subsequent electroplating to fill the holes and form electrical paths connecting the upper and lower ends of the component with the corresponding copper foil layers.

[0131] Because the components are vertically positioned inside the through-holes, the copper terminals at their top and bottom ends can be directly aligned with the third blind hole and connected to different signal or power layers through electroplating to fill the holes, forming a short and straight vertical conduction path. This enables vertical interconnection of the PCB's signal layers, components, and power layers, which is beneficial for improving signal stability, current stability, wiring density, and saving PCB surface mount space.

[0132] S2033. Drill a fourth blind hole into the inner layer plate after lamination and layering, respectively, along the preset first direction and the preset second direction, towards the hole ring of the resin plug hole; wherein, the hole ring is an annular copper pad obtained by metallizing the through hole, filling it with resin and grinding.

[0133] The third blind hole is a vertical blind hole drilled through the first dielectric layer after lamination and extension, from the upper and lower surfaces of the board to the copper terminals at the upper and lower ends of the component. Its central axis coincides with the second blind hole. It is used to lead the copper terminals of the component to the first copper foil through electroplating filling. The fourth blind hole is a vertical blind hole drilled through the first dielectric layer after lamination and extension, from the upper and lower surfaces of the board to the annular copper pad at the resin plug position. It is used to connect the power layer circuit to the first copper foil through the annular copper pad and electroplating filling.

[0134] Specifically, a laser drilling machine combined with a high-precision positioning system can be used to first identify the annular copper pad at the resin plug position on the inner layer board after lamination and layering. Then, a fourth blind hole is drilled vertically downwards along a preset first direction on the upper surface of the inner layer board after lamination and layering, so that the bottom of the blind hole falls exactly on the upper surface of the annular copper pad. Then, another fourth blind hole is drilled vertically upwards along a preset second direction on the lower surface of the board, so that the bottom of the blind hole falls exactly on the lower surface of the annular copper pad. The fourth blind holes correspond to the upper and lower surfaces of the same hole ring, and their central axes coincide. This step is used to drill an independent conductive channel connecting the power layer lines and the first copper foil in the inner layer board after lamination and layering, and to achieve electrical interconnection between the upper and lower layers through the annular copper pad.

[0135] S2034. Both the third and fourth blind holes are metallized and electroplated to fill the holes, so that the copper terminals of the components are connected to the first copper foil through the third blind hole, and the power layer circuit is connected to the first copper foil through the fourth blind hole, thus obtaining the inner layer board after electroplating and filling the holes.

[0136] Specifically, the third and fourth blind holes can first be treated with desmearing and chemical copper plating to deposit a continuous layer of chemical copper on the hole walls and the exposed copper terminals of the components. Then, a vertical continuous electroplating line is used to fill the holes with electroplated copper evenly from the bottom to the top using a hole-filling electroplating process, so that the copper completely fills all the blind holes and forms a metallic connection with the first copper foil, the copper terminals of the components, and the power layer circuitry, resulting in the inner layer board after electroplating and hole filling. This step is used to connect the top and bottom ends of the components to the corresponding first copper foils through electroplated copper pillars, and at the same time connect the power layer circuitry to the first copper foils through annular copper pads, completing the electrical interconnection between the embedded components and the board surface circuitry.

[0137] The bottom of the fourth blind via precisely rests on the surface of the annular copper pad of the resin-filled via. The annular copper pad forms an electrical connection with the power layer circuitry through inner layer pattern transfer. Through the electroplating filling of the fourth blind via, the current of the power layer circuitry can be directly transmitted to the first copper foil via the annular copper pad and the copper pillar in the fourth blind via, thereby achieving efficient interconnection between the power layer and the outer layer circuitry.

[0138] Both the third and fourth blind vias undergo via metallization and electroplating to fill them, allowing the copper terminals of components to connect to the first copper foil through the third blind via, and the power layer traces to connect to the first copper foil through the fourth blind via. This coaxial blind via structure achieves layered interconnection between component terminals and power layer traces. The central axis of the third blind via coincides with the central axis of the second blind via, ensuring alignment of the vertical conductive paths between the component copper terminals and the outer first copper foil, preventing electrical connection failures due to interlayer misalignment. The ring of the fourth blind via connects to the power layer traces through electroplated copper pillars, forming a stable conductive path between the power layer and the outer copper foil. This standardizes the arrangement of interlayer conductive paths, improving the stability and neatness of multilayer board interconnections.

[0139] Independent interconnection between the power layer and signal layer is achieved through a layered design using a third and fourth blind via. The third blind via connects the component's copper terminals to the outer copper foil, while the fourth blind via connects the power layer traces to the outer copper foil. This layered blind via design avoids electromagnetic interference between the power layer and signal layer. Furthermore, electroplating fills the vias to form continuous copper pillars, shortening the signal path, reducing parasitic inductance, and improving signal integrity.

[0140] The technical effect of this solution in this embodiment is as follows: By first fabricating power layer lines and pads on the inner layer board after the embedded parts are completed, and then laminating the first dielectric layer and the first copper foil to achieve the addition of layers to the board, the third blind hole for docking components and the fourth blind hole for aligning the resin plug hole ring are then opened coaxially. Through hole metallization and electroplating to fill the holes, the conductivity of the component terminals, power layer lines and the outer first copper foil is achieved respectively. Finally, the complete multilayer circuit board is formed by pattern transfer. The coaxial blind hole structure ensures the alignment accuracy between layers, and the interconnection paths of components and power lines are realized layer by layer. The arrangement of conductive paths between layers is standardized, and the reliable electrical connection of the inner layer embedded components, inner layer power lines and outer layer lines is steadily realized, thereby improving the interconnection stability and wiring regularity of the multilayer board.

[0141] Figure 3 A flowchart illustrating the component embedding method provided in the embodiments of this application. Figure 2 In this embodiment, in Figure 2 Based on the provided embodiments, the method for embedding components is further explained. The method for embedding components includes:

[0142] S301. Obtain the customer's stack-up design specifications and component specifications, and determine the core board type and number of sheets based on the customer's stack-up design specifications and component specifications.

[0143] Specifically, it can receive design files provided by customers, read the stack-up structure requirements and component dimensions, pin positions and other specifications from the files, and then compare them with the core board material library stored in the factory to find the core board type that meets the requirements for stack-up thickness and dielectric constant. It also calculates the number of lamination sheets required based on the component height. This step is used to determine the basic materials and number of layers required to make the preset inner layer board, so as to provide a board of suitable thickness for subsequent drilling of blind holes.

[0144] S302. Perform inner layer pattern transfer on multiple inner layer core boards corresponding to the core board type and number of sheets to obtain multiple inner layer core boards with etched inner layer patterns.

[0145] Specifically, a photosensitive dry film can be attached to the copper foil surface of multiple inner core boards. Circuit patterns are formed on the dry film through exposure and development using a film. Then, the copper layer without dry film protection is removed by immersing the board in an acidic etching solution. Finally, the dry film is removed to obtain multiple inner core boards with etched inner layer patterns. This step is used to create the required circuit pattern on each core board, providing a pattern basis for the inner layer interconnection structure of the multilayer board after subsequent lamination.

[0146] S303. Press together multiple inner core boards with etched inner layer patterns and a preset prepreg to obtain a preset inner layer board.

[0147] Specifically, the first layer of copper foil, the first prepreg, the first inner core board, the second prepreg, the second inner core board, the third prepreg, and the second layer of copper foil can be stacked in the following order from bottom to top. The mixture is then fed into a vacuum press, where the prepreg melts and solidifies under high temperature and pressure, bonding the core boards and copper foil together to obtain the preset inner core board. This step is used to laminate multiple independent core boards together into a multilayer board through an insulating medium, providing an inner core board with sufficient thickness and interlayer insulation for subsequent drilling of blind holes.

[0148] S304. Drill a first blind hole along a preset first direction on a preset inner layer plate, and place the component into the first blind hole along the preset first direction; wherein, the preset first direction refers to the direction perpendicular to the surface of the preset inner layer plate, the depth of the first blind hole is greater than the height of the component, the diameter of the first blind hole is greater than the outer diameter of the component, and the outer diameter refers to the diameter of the circumcircle of the cross-sectional contour of the component.

[0149] S305. The first blind hole is filled with resin and cured to obtain the inner layer board with the components fixed.

[0150] S306. The inner layer board with fixed components is subjected to lamination, laser drilling, electroplating to fill holes, and pattern transfer to make the copper terminals of the components electrically connected to the pads; wherein, lamination is used to laminate the first copper foil on the inner layer board with fixed components, and pattern transfer is used to etch the first copper foil to obtain the pads.

[0151] S304-S306 are similar to S201-S203, and will not be described again in this embodiment.

[0152] The technical effect of this solution in this embodiment is as follows: by combining the customer's stack-up design specifications and component specifications to determine the type and quantity of core boards, and then completing the inner layer pattern transfer processing of multiple inner layer core boards according to the selected parameters, the formed inner layer core boards are then pressed together with prepregs to prepare the preset inner layer boards. This allows for precise selection of substrates according to the actual design requirements of the product, ensuring that the structure and size of the manufactured inner layer boards are compatible with the subsequent vertical embedding processing requirements of components, improving the matching degree between the inner layer board blank and the overall embedding process, stabilizing the manufacturing quality of the inner layer substrate, and ensuring the orderly progress of subsequent blind via opening, component loading and other processes.

[0153] Figure 4 A flowchart illustrating the component embedding method provided in the embodiments of this application. Figure 3 In this embodiment, in Figure 2 Based on the provided embodiments, the method for embedding components is further explained. The method for embedding components includes:

[0154] S401. Drill a first blind hole along a preset first direction on a preset inner layer plate, and place the component into the first blind hole along the preset first direction; wherein, the preset first direction refers to the direction perpendicular to the surface of the preset inner layer plate, the depth of the first blind hole is greater than the height of the component, the diameter of the first blind hole is greater than the outer diameter of the component, and the outer diameter refers to the diameter of the circumcircle of the cross-sectional contour of the component.

[0155] S402. The first blind hole is filled with resin and cured to obtain the inner layer board with the components fixed.

[0156] S403. Perform lamination, laser drilling, electroplating, and pattern transfer on the inner layer board with fixed components to make the copper terminals of the components electrically connected to the pads; wherein, lamination is used to laminate the first copper foil on the inner layer board with fixed components, and pattern transfer is used to etch the first copper foil to obtain the pads.

[0157] S401-S403 are similar to S201-S203, and will not be described again in this embodiment.

[0158] S404. The inner layer board after electroplating and filling holes is transferred to obtain a semi-finished board.

[0159] Specifically, a photosensitive dry film can be attached to the surface of the inner layer board after electroplating and filling the holes. The outer layer circuit pattern is transferred to the dry film through exposure and development. Then, the board is placed in an acidic etching solution to remove the copper layer without the protection of the dry film. Finally, the dry film is removed to obtain a semi-finished board. This step is used to process the copper foil on the surface of the inner layer board after electroplating and filling the holes into the required circuit pattern to form a semi-finished board.

[0160] S405. Adjust the structure of the pads for the third blind via to adapt the structure to the preset HDI stack-up specifications, and obtain the semi-finished board with adjusted pads.

[0161] Specifically, the values ​​for pad diameter and annular ring width in the preset HDI stack-up specifications can be pre-set in the equipment. During the exposure process, a laser direct imaging device automatically modifies the graphic size of the third blind via pad according to these values, directly imaging the adjusted pad graphic on the semi-finished board coated with photosensitive dry film. After development and etching, the semi-finished board with adjusted pads is obtained. This step is used to ensure that the size and shape of the third blind via pad meet the interlayer alignment accuracy and electrical reliability requirements of high-order HDI stack-up, providing a matching pad structure for subsequent lamination and drilling of the fifth blind via, ensuring the accuracy of subsequent drilling and electroplating, and avoiding drilling offset or electrical connection failure due to pad size deviation.

[0162] Optionally, the pad diameter can be reduced to decrease interlayer deviation according to the interlayer alignment accuracy requirements of the HDI stack, while the annular ring width can be increased to improve the adhesion between the pad and the copper foil, thereby ensuring the accuracy of subsequent drilling and electroplating.

[0163] S406. Laminate the second dielectric layer and the second copper foil onto the semi-finished board after the pads have been adjusted to obtain the laminated semi-finished board.

[0164] The second dielectric layer is an insulating material layer formed by curing a prepreg under high temperature and pressure. It is used to provide new interlayer insulation on the surface of the semi-finished board after the pads are adjusted. The second copper foil is a thin conductive metal layer pressed onto the outer surface of the second dielectric layer. After the structural adjustment of the third blind hole pad is completed, the second dielectric layer and the second copper foil are stacked on the upper and lower surfaces of the semi-finished board in sequence. They are then vacuum-pressed to firmly adhere to the board surface, providing an added layer structure for subsequent drilling of the fifth blind hole along the preset first direction and electroplating to fill the hole, thereby realizing the electrical interconnection between the third blind hole pad and the second copper foil.

[0165] Specifically, the second dielectric layer and the second copper foil can be stacked sequentially on the top and bottom surfaces of the semi-finished board after the pads have been adjusted. The board is then fed into a vacuum press and held at a high temperature of 180 to 200 degrees Celsius and a high pressure of 300 to 400 pounds per square inch for 60 to 90 minutes. This allows the second dielectric layer to melt and solidify, and the second copper foil to adhere to the board surface, resulting in a laminated semi-finished board. This step is used to add a new insulating dielectric layer and an outer copper foil to the surface of the semi-finished board after the pads have been adjusted, providing the necessary laminated structure for subsequent drilling of the fifth blind hole.

[0166] On the semi-finished board after lamination and layering, a fifth blind hole is drilled along the preset first direction toward the pad of the third blind hole. The drilling positioning of the fifth blind hole is based on the adjusted graphic size of the pad to ensure that the center of the fifth blind hole is aligned with the pad of the third blind hole, and to avoid drilling offset due to pad size deviation.

[0167] S407. Drill a fifth blind hole along the preset first direction toward the pad of the third blind hole on the semi-finished board after lamination and layering.

[0168] The fifth blind via is a vertical through-hole set on the laminated semi-finished board after the second dielectric layer and the second copper foil are laminated and before the next round of pattern transfer. This blind via is drilled downwards from the upper surface of the laminated semi-finished board along a predetermined first direction, passing through the second dielectric layer, and its bottom precisely falls on the surface of the pad of the third blind via, thereby establishing an electrical connection channel between the pad of the third blind via and the outer second copper foil.

[0169] Specifically, a laser drilling machine can be used in conjunction with a vision positioning system to automatically identify the position of the third blind hole pad in the semi-finished board after lamination and layering. Then, a fifth blind hole is drilled vertically downward from the upper surface of the board along a preset first direction, so that the bottom of the fifth blind hole accurately falls on the surface of the pad of the third blind hole. This step is used to drill a vertical channel in the second dielectric layer that connects the third blind hole pad with the outer second copper foil, preparing for subsequent electroplating to fill the holes and achieve interlayer electrical interconnection.

[0170] S408. The fifth blind hole is metallized and electroplated to fill the hole, so that the pad of the third blind hole can be connected to the second copper foil through the fifth blind hole, thus obtaining the semi-finished board after the addition of layers.

[0171] Specifically, the fifth blind via can be desmeared first, and then a layer of chemical copper can be deposited on the via wall using a copper plating line. Then, a vertical continuous electroplating line can be used to fill the via with copper plating from the bottom to the top, so that the copper completely fills the fifth blind via and forms a metal connection with the pads of the third blind via and the second copper foil, resulting in a semi-finished board after the addition of layers. This step is used to connect the pads of the third blind via to the second copper foil through the solid copper pillar in the fifth blind via, realizing the extension of the electrical channel from the inner layer components to the outer layer copper foil.

[0172] S409. Perform pattern transfer on the added-layer semi-finished board to obtain a circuit-formed semi-finished board, and perform PCB post-processing on the circuit-formed semi-finished board to obtain a PCB board.

[0173] Specifically, a photosensitive dry film can be laminated onto the outer copper foil surface of the laminated semi-finished board. The circuit pattern is then irradiated onto the dry film using an exposure machine. Uncured areas of the dry film are dissolved by a developing solution, followed by the removal of the exposed copper layer using an acidic etching solution. Finally, the remaining dry film is removed, resulting in a semi-finished board with formed circuitry. This semi-finished board then undergoes a series of processes: solder resist ink screen printing, pre-baking, exposure and development to create solder resist openings, text printing, chemical nickel plating, CNC milling and cutting, and electrical continuity testing to obtain the PCB board. This step is used to create a protective solder resist layer and a solderable surface coating on the surface of the semi-finished board after circuitry formation, and to complete the shape processing and electrical verification to obtain the PCB board.

[0174] The technical effect of this solution in this embodiment is as follows: by optimizing the pad structure corresponding to the third blind hole according to the HDI stack-up specifications, the second dielectric layer and the second copper foil are sequentially laminated to complete the additional layering. The fifth blind hole for the docking pad is directionally drilled and filled by metallization and electroplating to achieve electrical connection between the pad and the second copper foil. Then, the finished product is completed through pattern transfer and subsequent conventional PCB processes. The multi-layer wiring structure can be flexibly expanded according to the design requirements of high-end HDI products, and multi-level interconnected conductive channels can be built layer by layer to smoothly complete the step-by-step interconnection of multi-layer lines. This adapts to the mass production processing requirements of multi-level stack-up boards and improves the compatibility of the product stack-up structure and the reliability of the line interconnection.

[0175] High-level HDI boards are primarily used in service storage PCBs, such as GPUs and computing boards. These PCBs typically have a large number of components mounted on their surfaces, such as capacitors, resistors, and inductors, occupying more than 40% of the PCB surface space, which is not conducive to the installation of other functional modules. At the same time, the signals between the numerous components on the board interfere with each other, affecting signal stability; the connection paths between components are long, resulting in transmission loss; in addition, due to the mounting process and environmental factors, the components have certain thermal stability and reliability issues.

[0176] Therefore, embedded component technology has gradually developed and replaced some surface mount processes. Traditional embedded component technologies generally fall into two categories: one is the embedding of a single component, which is electrically connected to two copper electrodes on the component surface through blind vias on the outer layer of the PCB. The other is matrix or modular embedded components, where the components are placed horizontally and connected to two pads on the inner layer of the board via solder. The top of the component terminals is interconnected with the outer layer pads through lamination, laser drilling, and electroplating to achieve electrical connection.

[0177] Existing technologies employ a single-device embedding method, resulting in low device concentration and relatively limited surface mount space. In existing technologies, embedded devices are placed horizontally, with device terminals connected to inner layer pads via solder. This process is complex, has a low yield rate, and high production costs. Furthermore, when devices are horizontally embedded in existing technologies, because the device surface is at the same height as the board surface or even protrudes from the board, they are easily damaged or crushed during subsequent processes such as screen printing, resin fixing, and grinding, leading to product failure.

[0178] In the process of screen printing resin to fix components, a layered resin composite filling process can be adopted. First, a high-flow resin (such as epoxy resin) is used to quickly fill blind holes and cover the surface of the component; then, a high-rigidity resin (such as polyimide) is filled to enhance the structural strength. Step-by-step curing and ultrasonic cleaning remove air bubbles and impurities from the filled gaps, improving the uniformity and adhesion of the resin layer and ensuring that the component is not damaged by mechanical stress during subsequent processing.

[0179] Optionally, the first blind via can be blind via B, the second blind via can be blind via C, the resin plug via can be via A, the third blind via can be blind via M, and the fourth blind via can be blind via N. Based on the customer's laminated design specifications and the specifications of the embedded components, the corresponding core board type and number can be selected. Inner layer pattern transfer and etching are performed, and the inner layer core board and prepreg are laminated to form the inner layer board for which the embedded components need to be placed. Figure 5 This is a schematic diagram of the structure of hole A provided in an embodiment of this application, as shown below. Figure 5 As shown, a power layer circuit 503 is arranged inside the PCB substrate 502, and the central area is a hole A501. A hole ring 504 is formed on the sidewall of the hole A501.

[0180] Hole A501 is metallized by electroplating a layer of copper to form a through hole. The electroplated through hole is then filled with via-filling resin 505. After the via-filling resin 505 cures, it is then ground. Figure 6 This is a schematic cross-sectional view of hole A after resin plugging, as provided in the embodiments of this application. Figure 6 As shown, the PCB substrate 502 has power layer lines 503 arranged inside, and the hole A501 is completely filled with hole-filling resin 505. The surface of the resin is ground to provide a void-free processing reference surface for subsequent controlled depth drilling.

[0181] Figure 7 This is a cross-sectional schematic diagram of a blind hole formed by drilling after resin plugging, as provided in an embodiment of this application. Figure 7 As shown, a blind hole B506 is drilled downwards from the top of the via-filling resin 505, and a blind hole C507 is drilled upwards from the bottom of the via-filling resin 505. Power layer lines 503 are arranged inside the PCB substrate 502. The height of hole A501 is H1, which is the thickness of the board. The height of blind hole B506 is H2, and the height of blind hole C507 is H3. When drilling blind hole B506, the resin thickness can be retained by 0.2~0.3mm, which is the height H3 of blind hole C507.

[0182] A pick-and-place machine can be used to vertically place component 508 into blind via B506. Component 508 can be a cuboid or a cylinder. Figure 8 This is a schematic diagram of a component being vertically placed into blind hole B, as provided in an embodiment of this application. Figure 8 As shown, component 508 is vertically placed inside blind hole B506. The copper terminals 509 at both ends of component 508 face the top and bottom sides of the board, respectively. Component 508 has a length or height of H4 and a diameter of D. The diameters of hole A501, blind hole B506, D, H1, H2, H3, and H4 satisfy the following relationship:

[0183] The diameter of hole A501 minus the diameter of blind hole B506 is ≥ 0.2 mm. The diameter of blind hole B506 minus D is 0.2-0.3 mm. H2-H4=0.1-0.3 mm, H3=0.2-0.3 mm, and H1=H2+H3.

[0184] After component 508 is vertically placed into blind via B506, screen printing can be used to fill blind via B506 with pure adhesive resin 510, followed by curing and grinding to make it smooth. Figure 9 This is a schematic diagram of the screen-printed resin fixing components provided in the embodiments of this application, such as... Figure 9 As shown, blind hole C507 is filled with pure adhesive resin 510, and the gap between blind hole B506 and component 508 is also filled with pure adhesive resin 510. After the pure adhesive resin 510 is cured, it is ground.

[0185] After grinding with pure resin 510, the material undergoes AOI inspection to confirm the filling is free of voids or depressions (depressions <15µm are acceptable). Otherwise, additional resin is applied. After component embedding and resin screen printing for fixation, the power layer circuitry and pads are fabricated through a pattern transfer process. Figure 10 This is a schematic diagram of the structure of blind hole M and blind hole N provided in the embodiments of this application, as shown below. Figure 10 As shown, layers are laminated on both sides of the inner layer of the embedded device. The dielectric layer 514 has a thickness of 0.05-0.10 mm, and the copper foil 513 has a thickness of 1 / 3-1 / 2 oz. After lamination, the board is milled and positioning holes are drilled. Then, blind holes N512 are drilled above the hole ring 504, and blind holes M511 are drilled on both the top and bottom sides of the component 508. The diameter of blind hole N512 can be 0.075~0.15 mm, and the diameter of blind hole M511 can be 0.25~0.35 mm (controlling the aspect ratio <1.2:1). Blind holes M511 and N512 are metallized and electroplated to fill the holes, connecting the surface layer to the copper terminal 509 of the component. Figure 11 For the electroplating filling and pattern transfer provided in the embodiments of this application, a component connection network diagram is created, such as... Figure 11 As shown, blind vias M511 and N512 are sequentially metallized and electroplated to fill the holes. The electroplated copper layer in blind via M511 connects the copper foil 513 to the copper terminal 509 of the component, and the electroplated copper layer in blind via N512 connects the copper foil 513 to the via ring 504. This achieves complete electrical interconnection between the surface circuitry, embedded components, and internal power layer circuitry, creating a component interconnection network and realizing the design function.

[0186] You can also modify the pad pattern of hole M on the device, and then add layers, repeating the steps of "lamination layer addition, laser drilling, electroplating filling, pattern transfer, and making component connection network" to create a higher-order HDI network. Then, through the conventional PCB process, such as solder mask, text, surface treatment, molding and testing, the entire PCB product is completed. Figure 12 This is a schematic cross-sectional view of an HDI multilayer PCB board with vertically embedded components, as provided in the embodiments of this application. Figure 12 As shown, in Figure 11 Based on the electroplated filling structure, the lamination-laser drilling-electroplated filling process is repeated. Through multiple laminations, the dielectric layer 514 and copper foil 513 are stacked alternately to form a high-level structure. The layers are vertically interconnected through blind holes M511 and N512 after electroplating filling. The components are wrapped and fixed by pure glue resin 510 and via-plugging resin 505, forming an integrated structure with the multilayer structure of the PCB substrate, which has both high integration and reliable interlayer interconnection performance.

[0187] The component embedding method provided in this application uses laser blind holes to drill from both sides of the board to the upper and lower terminals of the component, and then fills the blind holes completely with solid copper pillars through electroplating. This transforms the connection points between the component and each layer from traditional solder joints into continuous metal bodies. Furthermore, the vertical structure expands in the same direction during temperature cycling. Therefore, this method uses laser blind holes and electroplating filling technology to achieve interconnection between the two ends of the component and the PCB signal and power layers, ensuring the thermal reliability of the component interconnection.

[0188] The component embedding method provided in this application embodiment first retains a 0.2-0.3 mm resin thickness at the bottom as a buffer layer by controlling the depth of drilling during vertical embedding. After the component is placed, resin filling and grinding are performed. The entire process avoids the thermal shock to the component caused by high-temperature soldering. At the same time, it simplifies the process to vertical placement and resin curing by a pick-and-place machine. Therefore, this method optimizes the vertical embedding process of components, improves production efficiency, and provides a buffer layer for the top and bottom ends of the component to prevent damage to the component during subsequent processing.

[0189] Figure 13 This is a schematic diagram of the structure of the component embedding device provided in the embodiments of this application. Figure 13 As shown, the device for embedding the component includes:

[0190] The embedded module 1301 is used to drill a first blind hole along a preset first direction on a preset inner layer plate and to place the component into the first blind hole along the preset first direction; wherein, the preset first direction refers to the direction perpendicular to the surface of the preset inner layer plate, the depth of the first blind hole is greater than the height of the component, the diameter of the first blind hole is greater than the outer diameter of the component, and the outer diameter refers to the diameter of the circumcircle of the cross-sectional contour of the component.

[0191] The filling module 1302 is used to fill and cure the first blind hole with resin to obtain an inner layer board with fixed components.

[0192] The first lamination module 1303 is used to perform lamination layering, laser drilling, electroplating filling, and pattern transfer on the inner layer board on which the components are fixed, so that the copper terminals of the components are electrically connected to the pads; wherein, lamination layering is used to laminate the first copper foil on the inner layer board on which the components are fixed, and pattern transfer is used to etch the first copper foil to obtain the pads.

[0193] In one possible design, the component embedding device also includes:

[0194] The determination module is used to obtain the customer's stack-up design specifications and component specifications, and to determine the core board type and number of sheets based on the customer's stack-up design specifications and component specifications.

[0195] The first pattern transfer module is used to transfer the inner layer patterns of multiple inner layer core boards corresponding to the core board type and number of core boards, so as to obtain multiple inner layer core boards with etched inner layer patterns.

[0196] The second lamination module is used to laminate multiple inner core boards with etched inner layer patterns and a preset prepreg to obtain a preset inner layer board.

[0197] In one possible design, the embedded module 1301 includes:

[0198] The first drilling unit is used to drill through holes along a preset first direction on a preset inner layer board and to metallize the through holes to obtain through holes; wherein the diameter of the through holes and the diameter of the through holes are both larger than the outer diameter of the components.

[0199] The first filling unit is used to fill the through hole with resin. After the resin is cured, the resin in the through hole is ground so that the recess depth of the surface of the resin in the through hole relative to the surface of the preset inner layer plate is less than a preset threshold, thereby obtaining resin plugging.

[0200] The second drilling unit is used to drill a first blind hole along a preset first direction on the first end face of the resin plug hole, and to drill a second blind hole along a preset second direction on the second end face of the resin plug hole; wherein the sum of the depth of the first blind hole and the depth of the second blind hole is equal to the depth of the resin plug hole, the central axis of the first blind hole coincides with the central axis of the second blind hole, the preset second direction is opposite to the preset first direction, and both the first end face and the second end face are parallel to the board surface.

[0201] In one possible design, the filling module 1302 includes:

[0202] The second filling unit is used to fill the first blind hole and the second blind hole with resin. After the resin is cured, the resin in the first blind hole and the second blind hole is ground so that the surface of the resin in the first blind hole and the second blind hole is less than the surface of the preset inner layer plate by a preset threshold, so as to obtain the ground inner layer plate.

[0203] The inspection unit is used to perform AOI inspection on the ground inner layer board. If the inspection results determine that there are no voids or depressions in the resin in the first and second blind holes, the ground inner layer board is determined to be an inner layer board with fixed components.

[0204] In one possible design, the first pressing module 1303 includes:

[0205] The pattern transfer unit is used to transfer the pattern of the inner layer board on which the components are fixed, so as to form power layer lines and pads on the inner layer board on which the components are fixed, to obtain the inner layer board after pattern transfer, and to press the first dielectric layer and the first copper foil on the inner layer board after pattern transfer to obtain the inner layer board after lamination and layering.

[0206] The third drilling unit is used to drill third blind holes in the inner layer plate after lamination and layering, respectively along a preset first direction and a preset second direction; wherein the central axis of the third blind hole coincides with the central axis of the second blind hole.

[0207] The fourth drilling unit is used to drill a fourth blind hole on the inner layer plate after lamination and layering, towards the hole ring that is directed toward the resin plugging hole along a preset first direction and a preset second direction, respectively; wherein, the hole ring is an annular copper pad obtained by metallizing the through hole, filling it with resin and grinding.

[0208] The electroplating and filling unit is used to metallize and electroplat the third and fourth blind holes so that the copper terminals of the components can be connected to the first copper foil through the third blind hole, and the power layer lines can be connected to the first copper foil through the fourth blind hole, thus obtaining the inner layer board after electroplating and filling.

[0209] In one possible design, the component embedding device also includes:

[0210] The second pattern transfer module is used to transfer the pattern of the inner layer board after electroplating and filling the holes to obtain a semi-finished board.

[0211] The adjustment module is used to adjust the structure of the pads of the third blind hole to adapt the structure to the preset HDI stack-up specifications, so as to obtain a semi-finished board with adjusted pads.

[0212] The third lamination module is used to laminate the second dielectric layer and the second copper foil onto the semi-finished board after the pads have been adjusted, so as to obtain the laminated semi-finished board.

[0213] The drilling module is used to drill a fifth blind hole along a preset first direction toward the pad of the third blind hole on the semi-finished board after lamination and layering.

[0214] The hole metallization module is used to metallize and electroplate the fifth blind hole so that the pad of the third blind hole can be connected to the second copper foil through the fifth blind hole, resulting in a semi-finished board after layering.

[0215] The third pattern transfer module is used to transfer patterns from the added-layer semi-finished board to obtain a circuit-formed semi-finished board, and then perform PCB post-processing on the circuit-formed semi-finished board to obtain a PCB board.

[0216] The component embedding device provided in this embodiment can perform... Figures 2 to 4 The technical solution of the component embedding method embodiment shown herein, its implementation principle and technical effect are similar to Figures 2 to 4 The embodiment of the component embedding method shown is similar and will not be described in detail here.

[0217] Figure 14 A schematic diagram of the structure of the electronic device provided in this application. Figure 14 As shown, the electronic device 140 provided in this embodiment includes at least one processor 1401 and a memory 1402. Optionally, the device 140 also includes a communication component 1403. The processor 1401, memory 1402, and communication component 1403 are connected via a bus 1404.

[0218] In the specific implementation process, at least one processor 1401 executes computer execution instructions stored in memory 1402, causing at least one processor 1401 to execute the above-mentioned component embedding method.

[0219] The specific implementation process of processor 1401 can be found in the above-mentioned embodiment of the component embedding method. The implementation principle and technical effect are similar, and will not be repeated here.

[0220] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0221] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0222] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0223] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method for embedding components.

[0224] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method for embedding components.

[0225] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0226] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0227] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0228] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0229] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0230] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0231] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0232] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A method for embedding a component, characterized in that, include: A first blind hole is drilled along a first predetermined direction on a predetermined inner layer plate, and a component is placed into the first blind hole along the first predetermined direction; wherein, the first predetermined direction refers to the direction perpendicular to the surface of the predetermined inner layer plate, the depth of the first blind hole is greater than the height of the component, the diameter of the first blind hole is greater than the outer diameter of the component, and the outer diameter refers to the diameter of the circumcircle of the cross-sectional contour of the component. The first blind hole is filled with resin and cured to obtain an inner layer plate with the components fixed thereon. The inner layer board on which the components are fixed is subjected to lamination, laser drilling, electroplating to fill holes, and pattern transfer to make the copper terminals of the components electrically connected to the pads; wherein, the lamination is used to laminate a first copper foil onto the inner layer board on which the components are fixed, and the pattern transfer is used to etch the first copper foil to obtain the pads.

2. The method according to claim 1, characterized in that, Before drilling a first blind hole along a predetermined first direction on a predetermined inner layer plate and placing the component into the first blind hole along the predetermined first direction, the method further includes: Obtain the customer's stack-up design specifications and component specifications, and determine the core board type and number of sheets based on the customer's stack-up design specifications and component specifications; The inner layer pattern is transferred to multiple inner layer core boards corresponding to the core board type and the number of sheets to obtain multiple inner layer core boards with etched inner layer patterns; Multiple inner core boards with etched inner layer patterns and a preset prepreg are pressed together to obtain the preset inner layer board.

3. The method according to claim 1, characterized in that, Drilling a first blind hole along a predetermined first direction on a predetermined inner layer plate includes: A through hole is drilled along the preset first direction on the preset inner layer plate, and the through hole is metallized to obtain a through hole; wherein the diameter of the through hole and the diameter of the through hole are both larger than the outer diameter of the component; The through holes are filled with resin. After the resin cures, the resin in the through holes is ground so that the recess depth of the surface of the resin in the through holes relative to the surface of the preset inner layer plate is less than a preset threshold, thereby obtaining resin plugging. A first blind hole is drilled along a preset first direction on the first end face of the resin plug hole, and a second blind hole is drilled along a preset second direction on the second end face of the resin plug hole; wherein the sum of the depth of the first blind hole and the depth of the second blind hole is equal to the depth of the resin plug hole, the central axis of the first blind hole coincides with the central axis of the second blind hole, the preset second direction is opposite to the preset first direction, and both the first end face and the second end face are parallel to the plate surface.

4. The method according to claim 3, characterized in that, The process of filling and curing the first blind hole with resin to obtain the inner layer plate on which the components are fixed includes: The first blind hole and the second blind hole are filled with resin. After the resin is cured, the resin in the first blind hole and the second blind hole is ground so that the recess depth of the surface of the resin in the first blind hole and the second blind hole relative to the surface of the preset inner layer plate is less than a preset threshold, and the ground inner layer plate is obtained. The polished inner layer board is subjected to AOI inspection. If the inspection results determine that there are no voids or depressions in the resin in the first blind hole and the second blind hole, the polished inner layer board is identified as the inner layer board with the fixed components.

5. The method according to claim 4, characterized in that, The process of laminating and adding layers, laser drilling, electroplating to fill holes, and transferring patterns on the inner layer board with the fixed components to electrically connect the copper terminals of the components to the pads includes: The inner layer board with fixed components is patterned and transferred to form power layer lines and pads on the inner layer board with fixed components, resulting in a patterned inner layer board. A first dielectric layer and a first copper foil are then laminated onto the patterned inner layer board to obtain a laminated inner layer board. A third blind hole is drilled on the inner layer plate after lamination and layering, respectively along the preset first direction and the preset second direction; wherein the central axis of the third blind hole coincides with the central axis of the second blind hole; A fourth blind hole is drilled into the inner layer plate after lamination and layering, which is directed toward the resin plug hole along the preset first direction and the preset second direction respectively; wherein, the hole ring is an annular copper pad obtained by metallizing the through hole, filling it with resin and grinding. Both the third and fourth blind holes are metallized and electroplated to fill the holes, so that the copper terminals of the components can be connected to the first copper foil through the third blind hole, and the power layer lines can be connected to the first copper foil through the fourth blind hole, thus obtaining the inner layer board after electroplating and filling the holes.

6. The method according to claim 5, characterized in that, After performing lamination, laser drilling, electroplating, and pattern transfer on the inner layer board with the fixed components to electrically connect the copper terminals of the components to the pads, the process further includes: The inner layer board after electroplating and filling holes is subjected to pattern transfer to obtain a semi-finished board; The structure of the pads of the third blind via is adjusted to adapt the structure to the preset HDI stack-up specifications, resulting in a semi-finished board with adjusted pads. A second dielectric layer and a second copper foil are laminated onto the semi-finished board with adjusted pads to obtain a laminated and layered semi-finished board. A fifth blind hole is drilled along the preset first direction toward the pad of the third blind hole on the semi-finished board after lamination and layering. The fifth blind hole is metallized and electroplated to fill the hole, so that the pad of the third blind hole can be connected to the second copper foil through the fifth blind hole, thus obtaining the semi-finished board after the addition of layers; The pattern of the added-layer semi-finished board is transferred to obtain a circuit-formed semi-finished board, and the circuit-formed semi-finished board is processed by PCB post-processing to obtain a PCB board.

7. A device for embedding electronic components, characterized in that, include: An embedded module is used to drill a first blind hole along a preset first direction on a preset inner layer plate, and to place a component into the first blind hole along the preset first direction; wherein, the preset first direction refers to the direction perpendicular to the surface of the preset inner layer plate, the depth of the first blind hole is greater than the height of the component, the diameter of the first blind hole is greater than the outer diameter of the component, and the outer diameter refers to the diameter of the circumcircle of the cross-sectional contour of the component. A filling module is used to fill and cure the first blind hole with resin to obtain an inner layer board with fixed components. The first lamination module is used to perform lamination layering, laser drilling, electroplating filling, and pattern transfer on the inner layer board on which the components are fixed, so that the copper terminals of the components are electrically connected to the pads; wherein, the lamination layering is used to laminate a first copper foil on the inner layer board on which the components are fixed, and the pattern transfer is used to etch the first copper foil to obtain the pads.

8. An electronic device, characterized in that, include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executed instructions; When the processor executes the computer execution instructions stored in the memory, it is used to implement the component embedding method as described in any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the embedding method of the component as described in any one of claims 1 to 6.

10. A computer program product, characterized in that, Includes a computer program, which, when executed by a processor, is used to implement the embedding method of the component as described in any one of claims 1 to 6.

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