Replacement method for same-function different line sequence package chip on motherboard

Abstract

This invention relates to a method for replacing chips with the same function but different line order packages on a motherboard, comprising: preparing the chip to be replaced, a first PCB adapter board, and a second PCB adapter board; the first PCB adapter board has a first pad on its BOTTOM side; a first BGA package array is provided on its TOP side; the second PCB adapter board has a second BGA package array on its BOTTOM side; and a plurality of second pads are provided on its TOP side; soldering the chip to be replaced onto the second PCB adapter board; soldering the first PCB adapter board onto the motherboard; and soldering the second PCB adapter board to the first PCB adapter board; the method only requires soldering the first PCB adapter board, the second PCB adapter board, and the replacement chip onto the pads of the original chip on the motherboard, without affecting the normal use of the motherboard, without requiring redesign of the motherboard, and can achieve the replacement of chips with the same function but different packages or peripheral circuits, with low cost and good flexibility and versatility.

Description

Technical Field

[0001] This invention relates to the technical field of methods for replacing chips with the same function but different line order packages on a motherboard, and in particular to a method for replacing chips with the same function but different line order packages on a motherboard. Background Technology

[0002] With the development of information technology, people's lives have gradually become information-based. As a high-performance computer, the server plays a crucial role in this process. Therefore, it is very important to quickly and effectively solve potential problems in the system and ensure the availability of the server system.

[0003] The chips on the motherboards of existing servers may be unstable due to supply chain instability. The chips initially selected may not be available in a stable supply, or although the motherboard is of high value, the demand may be low. There may also be design errors in the motherboard that need to be corrected. In such cases, it is necessary to replace the chips with chips that have the same function but different pin definitions, different packages, or different peripheral circuits.

[0004] However, existing motherboard designs are expensive, and because the original chip hardware design is fixed, new chips cannot often be used directly after replacement. This results in the motherboard having to be redesigned to accommodate the new chips, which is too costly.

[0005] Therefore, in this patent application, the applicant has carefully researched a method for replacing chips with the same function but different line order packages on the motherboard to solve the above problems. Summary of the Invention

[0006] The present invention addresses the shortcomings of the prior art by providing a method for replacing chips with the same function but different line order packages on a motherboard. This method only requires soldering a first PCB adapter board, a second PCB adapter board, and the replacement chip onto the original chip's pads on the motherboard. It does not affect the normal use of the motherboard and does not require redesigning the motherboard. It can replace chips with the same function but different packages or peripheral circuits, with low cost and good flexibility and versatility.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A method for replacing a chip with the same function but different line sequence package on a motherboard, comprising preparing the chip to be replaced, a first PCB adapter board and a second PCB adapter board, wherein the size of the first PCB adapter board is the same as the size of the original chip on the motherboard. The BOTTOM side of the first PCB adapter board is set up with several first pads that are identical to the pad packages of the original chips on the motherboard but with mirrored pin order. The top side of the first PCB adapter board is provided with a first BGA package array for connecting the corresponding pins of the original chip. The number of circular pads of the first BGA package array is not less than the number of pins of the original chip. The BOTTOM side of the second PCB adapter board is provided with a second BGA package array for connecting the first BGA package array. The pads of the second BGA package array are connected one-to-one with the pads of the first BGA package array. The array arrangement of the second BGA package array and the first BGA package array is the same. The top side of the second PCB adapter board is provided with several second pads for connecting the corresponding pins of the chip to be replaced. Several electronic components that differ from the original chip are set on the second PCB adapter board; Solder the chip to be replaced onto the second PCB adapter board, and connect the second pad to the chip to be replaced. Solder the first PCB adapter board onto the motherboard, and connect the first pad to the original chip pad. The second PCB adapter board is soldered to the first PCB adapter board, and the first BGA package array is connected to the second BGA package array.

[0008] As a preferred embodiment, at least one of the circular pads in the first BGA package array and the circular pads in the second BGA package array is provided with solder balls, and the circular pads in the first BGA package array are connected to the circular pads in the second BGA package array through the solder balls.

[0009] As a preferred option, several electronic components are mounted on the top surface of the second PCB adapter board.

[0010] As a preferred embodiment, the second pad is centrally located on the top surface of the second PCB adapter board.

[0011] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, its main replacement method only requires soldering the first PCB adapter board, the second PCB adapter board and the replacement chip on the original chip pads on the motherboard. It does not affect the normal use of the motherboard and does not require redesigning the motherboard. It can replace chips with the same function but different packages or peripheral circuits. It has low cost and good flexibility and versatility. Secondly, the use of solder balls serves two purposes. First, during reflow soldering, the surface tension of the molten solder balls automatically pulls the second PCB adapter board into the correct position, correcting component misalignment, reducing process precision requirements, and improving yield. Second, it absorbs the shear stress caused by the mismatch in thermal expansion coefficients between the first and second PCB adapter boards, preventing solder joint cracking.

[0012] To more clearly illustrate the structural features and effects of the present invention, a detailed description is provided below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0013] Figure 1 This is a front view of the preferred embodiment of the present invention before soldering (showing the motherboard).

[0014] Figure 2 This is a pinout diagram of a preferred embodiment of the present invention.

[0015] Figure 3 This is a partially enlarged schematic diagram of a preferred embodiment of the present invention (mainly shown on the motherboard).

[0016] Figure 4 This is a schematic diagram of the BOTTOM side of the first PCB adapter board according to a preferred embodiment of the present invention.

[0017] Figure 5 This is a schematic diagram of the top surface of the first PCB adapter board according to a preferred embodiment of the present invention.

[0018] Figure 6 This is a schematic diagram of the top surface of the second PCB adapter board according to a preferred embodiment of the present invention.

[0019] Figure 7 This is a schematic diagram of the BOTTOM side of the second PCB adapter board according to a preferred embodiment of the present invention.

[0020] Explanation of icon numbers: Chip to be replaced 10; First PCB adapter board 20; First pad 21; Second PCB adapter board 30; Second BGA package array 31; Solder ball 32; Second pad 33; Device pad 34; Main board 40; Original chip 50; Pad 501; First BGA package array 51; Detailed Implementation The present invention will now be further described with reference to the accompanying drawings and specific embodiments.

[0021] like Figures 1 to 7 As shown, a method for replacing chips with the same function but different line order packages on a motherboard includes: Prepare the chip to be replaced 10, the first PCB adapter board 20, and the second PCB adapter board 30. The size of the first PCB adapter board 20 is the same as the size of the original chip 50 on the motherboard 40.

[0022] The BOTTOM side of the first PCB adapter board 20 is configured with several first pads 21 that are identical in package to the pads 501 of the original chip 50 on the motherboard 40 but with mirrored pin order.

[0023] The top surface of the first PCB adapter board 20 is provided with a first BGA package array 51 for connecting the corresponding pins of the original chip 50. The number of circular pads in the first BGA package array 51 is not less than the number of pins of the original chip 50. Each circular pad in the first BGA package array 51 is assigned a pin network name corresponding to the original chip 50.

[0024] The BOTTOM side of the second PCB adapter board 30 is provided with a second BGA package array 31 for connecting the first BGA package array 51. The pads of the second BGA package array 31 are connected to the pads of the first BGA package array 51 in a one-to-one correspondence. The array arrangement of the second BGA package array 31 and the first BGA package array 51 is the same. At least one of the circular pads in the first BGA package array 51 and the second BGA package array 31 is provided with a solder ball 32. The circular pads in the first BGA package array 51 are connected to the circular pads in the second BGA package array 31 through the solder ball 32. In this embodiment, each circular pad in the second BGA package array 31 is provided with a solder ball 32. Each circular pad in the second BGA package array 31 is assigned the pin network name corresponding to the chip 10 to be replaced.

[0025] The top surface of the second PCB adapter board 30 is provided with a plurality of second pads 33 for connecting the corresponding pins of the chip 10 to be replaced. In this embodiment, the second pads 33 are centrally located on the top surface of the second PCB adapter board 30.

[0026] Several electronic components that differ from the original chip 50 are disposed on the second PCB adapter board 30. In this embodiment, the several electronic components are disposed on the TOP surface of the second PCB adapter board 30.

[0027] The chip to be replaced 10 is soldered onto the second PCB adapter board 30, and the second pad 33 is connected to the chip to be replaced 10. The first PCB adapter board 20 is soldered onto the motherboard 40, and the first pad 21 is connected to the original chip 50 pad 41. By soldering the second PCB adapter board 30 to the first PCB adapter board 20 and connecting the first BGA package array 51 to the second BGA package array, the replacement chip can be replaced.

[0028] The following explanation will take the replacement of the original CM3166 chip 50 (hereinafter referred to as the second chip) on the motherboard 40 with the replacement chip 10 (hereinafter referred to as the first chip), model number CS5212, in its original position: The pin layouts of the second chip and the first chip are as follows: Figure 2 As shown.

[0029] The pin functions of the second chip and the first chip are shown in Table 1.

[0030] Table 1

[0031] As shown in Table 1, pins 1 to 10 of the second chip correspond to pins 6, 5, 8, 7, 2, 3, 1, 26, 20 and 14 of the first chip, respectively.

[0032] Pins 17 to 23 of the second chip correspond to pins 21, 22, 23, 18, 19, 16 and 15 of the first chip, respectively.

[0033] Pins 28 and 33 of the second chip correspond to pins 32 and 33 of the first chip, respectively.

[0034] The size of the first PCB adapter board 20 is the same as the size of the second chip. For example... Figure 3 As shown, it displays the pad distribution of the second chip on the motherboard 40 in a top-down view.

[0035] like Figure 4 As shown, the BOTTOM side of the first PCB adapter board 20 is provided with several first pads 21. For example... Figure 5 As shown, in a top-down view, the first BGA package array 51 is arranged in 6 rows and 6 columns. The correspondence between each circular pad in the first BGA package array 51 and the pins of the second chip is shown in Table 2.

[0036] Table 2

[0037] As can be seen from the data in Table 2, columns 1, 2, 3, 4, 5 and 6 of the first BGA package array 51 correspond to pins 1 to 6 of the second chip, respectively.

[0038] The first BGA package array 51 has columns 2, 1, 2, 2, 3, 4, 5, and 6 that are connected to pins 32, 33, 33, 16, and 7 of the second chip, respectively.

[0039] The 3rd row, 1st column, 3rd row, 2nd column, 3rd row, 3rd column, 3rd row, 4th column, 3rd row, 5th column, and 6th column in the first BGA package array 51 are respectively connected to pins 31, 33, 33, 33, 15, and 8 of the second chip.

[0040] The first BGA package array 51 has columns 4, 1, 2, 3, 4, 4, 5, and 6, which are respectively connected to pins 28, 33, 33, 33, 14, and 9 of the second chip.

[0041] The 5th row, 1st column, 5th row, 2nd column, 5th row, 3rd column, 5th row, 4th column, 5th row, 5th column, and 5th row, 6th column in the first BGA package array 51 are respectively connected to pins 23, 33, 33, 33, 13, and 10 of the second chip.

[0042] The 6th row, 1st column, 6th row, 2nd column, 6th row, 3rd column, 6th row, 4th column, 6th row, 5th column, and 6th row, 6th column in the first BGA package array 51 are respectively connected to pins 22, 21, 20, 19, 18, and 17 of the second chip.

[0043] like Figure 6 As shown, the top surface of the second PCB adapter board 30 is provided with a number of second pads 33 and device pads 34 for soldering a number of electronic devices.

[0044] like Figure 7 As shown, when viewed from below, the second BGA package array 31 is arranged in 6 rows and 6 columns.

[0045] The correspondence between each circular pad in the second BGA package array 31 and the pins of the first chip is shown in Table 3.

[0046] Table 3

[0047] As shown in Table 3, columns 1, 2, 3, 4, 5, and 6 of the second BGA package array 31 are respectively connected to pins 16, 19, 18, 23, 22, and 21 of the first chip.

[0048] The second BGA package array 31, with columns 2, 1, 2, 2, 3, 4, and 6, corresponds to pins 15, 33, 33, 33, and 14 of the first chip, respectively.

[0049] The 3rd row, 1st column, 3rd row, 2nd column, 3rd row, 3rd column, 3rd row, 4th column, and 3rd row, 6th column in the second BGA package array 31 are respectively connected to pins 32, 33, 33, 33, and 20 of the first chip.

[0050] The 4th row, 2nd column, 4th row, 3rd column, 4th row, 4th column, and 4th row, 6th column in the second BGA package array 31 are respectively connected to pins 33, 33, 33 and 26 of the first chip.

[0051] The 5th row, 2nd column, 5th row, 3rd column, 5th row, 4th column, and 5th row, 6th column in the second BGA package array 31 are respectively connected to pins 33, 33, 33 and 1 of the first chip.

[0052] The 6th row, 1st column, 6th row, 2nd column, 6th row, 3rd column, 6th row, 4th column, 6th row, 5th column, and 6th row, 6th column in the second BGA package array 31 are respectively connected to pins 6, 5, 8, 7, 2, and 3 of the first chip.

[0053] The first chip is soldered onto the second PCB adapter board 30, and each pin of the first chip is soldered to the corresponding second pad 33.

[0054] The first PCB adapter board 20 is soldered onto the motherboard 40, and the first pad 21 is connected to the original chip 50 pad 41. The second PCB adapter board 30 is soldered to the first PCB adapter board 20, and each circular pad in the second BGA package array 31 is soldered to the corresponding circular pad in the first BGA package array 51 through the corresponding solder ball 32 (for example, the 1 row and 1 column in the second BGA package array 31 is soldered to the 6 rows and 1 column in the first BGA package array 51), thus completing the replacement of the first chip.

[0055] The key design feature of this invention is that its replacement method only requires soldering the first PCB adapter board, the second PCB adapter board, and the replacement chip onto the original chip's pads on the motherboard. This does not affect the normal use of the motherboard and does not require redesigning the motherboard. It can replace chips with the same function but different packages or peripheral circuits, which is low-cost and has good flexibility and versatility. Secondly, the use of solder balls serves two purposes. First, during reflow soldering, the surface tension of the molten solder balls automatically pulls the second PCB adapter board into the correct position, correcting component misalignment, reducing process precision requirements, and improving yield. Second, it absorbs the shear stress caused by the mismatch in thermal expansion coefficients between the first and second PCB adapter boards, preventing solder joint cracking.

[0056] The above description is merely a preferred embodiment of the present invention and does not constitute any limitation on the technical scope of the present invention. Therefore, any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A method for replacing chips with the same function but different line order packages on a motherboard, characterized in that, include: Prepare the chip to be replaced, the first PCB adapter board, and the second PCB adapter board. The size of the first PCB adapter board is the same as the size of the original chip on the motherboard. The BOTTOM side of the first PCB adapter board is set up with several first pads that are identical to the pad packages of the original chips on the motherboard but with mirrored pin order. The top side of the first PCB adapter board is provided with a first BGA package array for connecting the corresponding pins of the original chip. The number of circular pads of the first BGA package array is not less than the number of pins of the original chip. The BOTTOM side of the second PCB adapter board is provided with a second BGA package array for connecting the first BGA package array. The pads of the second BGA package array are connected one-to-one with the pads of the first BGA package array. The array arrangement of the second BGA package array and the first BGA package array is the same. The top side of the second PCB adapter board is provided with several second pads for connecting the corresponding pins of the chip to be replaced. Several electronic components that differ from the original chip are set on the second PCB adapter board; Solder the chip to be replaced onto the second PCB adapter board, and connect the second pad to the chip to be replaced. Solder the first PCB adapter board onto the motherboard, and connect the first pad to the original chip pad. The second PCB adapter board is soldered to the first PCB adapter board, and the first BGA package array is connected to the second BGA package array.

2. The method for replacing chips with the same function but different line order packages on a motherboard according to claim 1, characterized in that: At least one of the circular pads in the first BGA package array and the circular pads in the second BGA package array is provided with solder balls, and the circular pads in the first BGA package array are connected to the circular pads in the second BGA package array through the solder balls.

3. The method for replacing chips with the same function but different line order packages on a motherboard according to claim 1, characterized in that: Several electronic components are mounted on the top surface of the second PCB adapter board.

4. The method for replacing chips with the same function but different line order packages on a motherboard according to claim 1, characterized in that: The second pad is centrally located on the top surface of the second PCB adapter board.

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