Heat dissipation device, electronic device comprising same, and heat dissipation method for electronic device

Abstract

Provided are a heat dissipating device, an electronic device including the heat dissipating device, and a heat dissipating method. The heat dissipating device includes a capillary tube in which a working fluid will travel and a capillary force controller. The capillary tube includes a first section configured to absorb heat generated by a heat source, a second section spaced apart from the first section and configured to dissipate the absorbed heat, and a third section connecting the first section and the second section. The capillary force controller is in the third section and is configured to increase or decrease a capillary force so that the working fluid that has absorbed the heat in the first section moves to the second section and the working fluid that has released the heat in the second section moves to the first section.

Description

Technical Field

[0001] Embodiments of this disclosure relate to heat dissipation devices, electronic devices including heat dissipation devices, and heat dissipation methods for electronic devices. For example, embodiments of this disclosure relate to heat dissipation devices including pulsating heat pipes (“PHP”), electronic devices including heat dissipation devices, and heat dissipation methods using heat dissipation devices. Background Technology

[0002] High-resolution, high-brightness electronic devices use higher input power levels. However, increased input power can raise the temperature of the electronic device.

[0003] Heat can be regulated in electronic devices using thermally conductive methods, carbon materials (e.g., natural graphite sheets, synthetic graphite), aluminum, copper, etc. Additionally, heat pipes, vacuum chambers, etc., can be used to regulate heat in electronic devices.

[0004] Heat pipes may include an internal core structure. As the thickness of a heat pipe decreases, the vapor flow path narrows and its thermal performance may deteriorate.

[0005] To address this problem, a pulsating heat pipe (“PHP”) has been developed. PHP can transfer heat through the oscillation of a working fluid and a vapor plug within a bundle of capillary channels, without requiring a wick.

[0006] The information disclosed in this background section is intended to enhance the understanding of the background technology of this disclosure and may contain information that does not constitute prior art. Summary of the Invention

[0007] One or more embodiments of this disclosure relate to a heat dissipation device with enhanced operational stability.

[0008] One or more embodiments of this disclosure are directed to electronic devices including heat dissipation devices.

[0009] One or more embodiments of this disclosure relate to heat dissipation methods for electronic devices.

[0010] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0011] A heat dissipation device according to one or more embodiments of the present disclosure includes: a capillary in which a working fluid will travel, the capillary including a first section configured to absorb heat generated by a heat source, a second section spaced apart from and / or separated (e.g., separated or isolated) from the first section and configured to dissipate the absorbed heat, and a third section connecting the first section and the second section; and a capillary force controller located in the third section and configured to increase or decrease the capillary force such that the working fluid that absorbs heat in the first section moves to the second section and the working fluid that releases heat in the second section moves to the first section.

[0012] In one or more embodiments, the third section may include a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section, and the capillary force controller may include a surface treatment portion having a surface energy in the 3-1 sub-section that is greater than that in the 3-2 sub-section.

[0013] In one or more embodiments, the working fluid may alternately form a gaseous working fluid and a liquid working fluid, and the contact angle defined by the liquid working fluid and the gaseous working fluid at the inner surface of the surface-treated section may decrease along the flow direction in sub-section 3-1 and increase along the flow direction in sub-section 3-2.

[0014] In one or more embodiments, the third section may include a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section, and the capillary force controller may include a diameter changing portion configured such that the inner diameter of the 3-1 sub-section increases along the flow direction of the working fluid and the inner diameter of the 3-2 sub-section decreases along the flow direction of the working fluid.

[0015] In one or more embodiments, the third section may include a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section, and the capillary force controller may include a surface area adjuster such that the surface area of ​​the inner wall of the 3-1 sub-section increases along the flow direction of the working fluid and the surface area of ​​the inner wall of the 3-2 sub-section decreases along the flow direction of the working fluid.

[0016] In one or more embodiments, the surface area adjuster may include protrusions extending from the inner surface of the 3-2 sub-segments.

[0017] In one or more embodiments, the surface area adjuster may include a mesh arranged in 3-2 sub-segments.

[0018] In one or more embodiments, the surface area adjuster may include a linear structure arranged within 3-2 sub-segments.

[0019] In one or more embodiments, the surface area adjuster may include porous material arranged in 3-2 sub-sections.

[0020] An electronic device according to one or more embodiments of the present disclosure includes a display device and a heat dissipation device for cooling the display device. The heat dissipation device includes: a capillary in which a working fluid will travel, the capillary including a first section configured to absorb heat generated by a heat source, a second section spaced apart from and / or separated from the first section (e.g., separated or isolated) and configured to dissipate the absorbed heat, and a third section connecting the first section and the second section; and a capillary force controller located in the third section and configured to increase or decrease the capillary force such that the working fluid that absorbs heat in the first section moves to the second section and the working fluid that releases heat in the second section moves to the first section.

[0021] In one or more embodiments, the third section may include a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section, and the capillary force controller may include a surface treatment portion having a surface energy in the 3-1 sub-section that is greater than that in the 3-2 sub-section.

[0022] In one or more embodiments, the working fluid may alternately form a gaseous working fluid and a liquid working fluid, and the contact angle defined by the liquid working fluid and the gaseous working fluid at the inner surface of the surface-treated section may decrease along the flow direction in sub-section 3-1 and increase along the flow direction in sub-section 3-2.

[0023] In one or more embodiments, the third section may include a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section, and the capillary force controller may include a diameter changing portion configured such that the inner diameter of the 3-1 sub-section increases along the flow direction of the working fluid and the inner diameter of the 3-2 sub-section decreases along the flow direction of the working fluid.

[0024] In one or more embodiments, the third section may include a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section, and the capillary force controller may include a surface area adjuster such that the surface area of ​​the inner wall of the 3-1 sub-section is smaller than the surface area of ​​the inner wall of the 3-2 sub-section, or the surface area of ​​the inner wall of the 3-1 sub-section increases along the flow direction of the working fluid and the surface area of ​​the inner wall of the 3-2 sub-section decreases along the flow direction of the working fluid.

[0025] In one or more embodiments, the surface area adjuster may include at least one selected from the group consisting of: protrusions extending from the inner surface of the 3-2 sub-segment or the 3-1 sub-segment, a mesh disposed within the 3-2 sub-segment, a linear structure disposed within the 3-2 sub-segment, and a porous material disposed within the 3-2 sub-segment.

[0026] In one or more embodiments, the electronic device may further include: a surface energy changing section on a portion of the inner surface of the flow path, the surface energy changing section including a first region and a second region alternating with each other, the first region having a first surface energy and the second region having a second surface energy different from the first surface energy.

[0027] In one or more embodiments, the inner surface of the first region may be hydrophilic, and the inner surface of the second region may be hydrophobic.

[0028] A heat dissipation method for an electronic device according to one or more embodiments of the present disclosure includes: forming a surface energy variation section comprising alternating first and second regions on a portion of the inner surface of a flow path, the first region having a first surface energy and the second region having a second surface energy lower than the first surface energy; filling the flow path with a working fluid; and dissipating heat from a heat source while the working fluid travels through the flow path.

[0029] In one or more embodiments, the working fluid alternately forms a gaseous working fluid and a liquid working fluid, and wherein the step (e.g., action or task) of dissipating heat from a heat source while the working fluid travels through the flow path includes: interrupting the flow of the liquid working fluid at the interface between the first and second zones; forming a liquid column at the interface by surface tension; and reducing the size of the gaseous working fluid by the liquid column.

[0030] In one or more embodiments, the heat source may include at least one selected from the group consisting of: a display device comprising a plurality of pixels and an electronic device comprising the display device and a housing housing the display device.

[0031] A heat dissipation device according to one or more embodiments of the present disclosure may include a capillary controller in the third section. Therefore, according to aspects of the present disclosure or one or more embodiments, the heat dissipation device can improve heat dissipation performance without altering the flow path, working fluid, and heat of dry burning (“maximum Q”). Because a heat dissipation device according to one or more embodiments of the present disclosure may include a capillary controller, the capillary controller can reduce (rapidly reduce) the maximum temperature of the display device during initial startup, even under low heat input conditions.

[0032] According to aspects of this disclosure or one or more embodiments, the heat dissipation device can control the direction of heat transfer by controlling the degree of cooling at specific locations. For example, working fluid evaporating in the evaporation section can flow to the condensation section, and working fluid condensing in the condensation section can flow to the evaporation section, thereby rapidly reducing the maximum temperature of the display device. In one or more embodiments, cooling can also be concentrated at specific locations.

[0033] In one or more embodiments of this disclosure, the heat dissipation device can be designed in one or more suitable ways based on the location of the heat source, heat capacity, etc. For example, if the heat generation is greatest in the central part of the display (e.g., when the heat generation is greatest in the central part of the display), the heat dissipation device can be positioned to dissipate heat from the central part of the display to the edge parts.

[0034] In one or more embodiments, the heat dissipation device according to one or more embodiments of this disclosure can be tailored to the environment in which it is used. For example, in addition to display devices, it can be applied to one or more suitable fields, such as batteries.

[0035] In one or more embodiments, the heat dissipation device according to one or more embodiments of the present disclosure can be applied to vertically driven displays. In the case of the heat dissipation device, the length of the vibrating heat pipe may be short, so it cannot be applied to large-area displays, and if vertically mounted (e.g., when vertically mounted), the working fluid may accumulate at the bottom due to gravity, resulting in a lack of circulation and ineffective heat dissipation. The heat dissipation device according to one or more embodiments of the present disclosure can artificially induce circulating flow by increasing / decreasing capillary force.

[0036] According to aspects of this disclosure or one or more embodiments, a heat dissipation device according to one or more embodiments of this disclosure can prevent or reduce dry burning by including a surface energy changing section. Attached Figure Description

[0037] The accompanying drawings are included to provide a further understanding of this disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure. In the drawings: Figure 1 This is a block diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0038] Figure 2 A schematic perspective view of an electronic device according to an embodiment of the present disclosure is shown.

[0039] Figure 3 This is an exploded perspective view showing an electronic device according to one or more embodiments of the present disclosure.

[0040] Figure 4 This illustrates one or more embodiments according to this disclosure. Figure 3 A plan view of the display device.

[0041] Figure 5 This illustrates one or more embodiments according to this disclosure. Figure 3 A block diagram of the display device.

[0042] Figure 6 This is a plan view of a heat dissipation device according to one or more embodiments of the present disclosure.

[0043] Figure 7 The illustration schematically depicts one or more embodiments according to this disclosure. Figure 6 The flow path of the heat dissipation device.

[0044] Figure 8 It is along one or more embodiments of this disclosure. Figure 6 A cross-sectional view showing the length of the capillary tube of the heat dissipation device at region A.

[0045] Figure 9 It is a cross-sectional view taken along the length of a portion of the capillary tube of the heat dissipation device according to one or more embodiments of the present disclosure.

[0046] Figure 10 It is along one or more embodiments of this disclosure. Figure 6 A cross-sectional view showing the length of the capillary tube at region A.

[0047] Figure 11 It is along one or more embodiments of this disclosure. Figure 10 The sectional view taken from line II-II'.

[0048] Figures 12 to 14Each is a cross-sectional view taken along the length of a portion of the capillary tube of the heat dissipation device according to an embodiment of the present disclosure.

[0049] Figure 15 It is based on the embodiments of this disclosure. Figure 6 The surface energy can change the three-dimensional image of a section.

[0050] Figure 16 According to the embodiments of this disclosure, along Figure 15 A sectional view taken from line IV-IV'.

[0051] Figure 17 According to the embodiments of this disclosure, along Figure 15 A sectional view taken from line IV-IV'.

[0052] Figure 18 This illustrates the formation of an embodiment according to the present disclosure. Figure 15 A schematic diagram of the grooves on the inner surface of the flow path.

[0053] Figures 19 to 23 This disclosure illustrates a method for heat dissipation of an electronic device using a heat dissipation device, according to one or more embodiments of the present disclosure. Figure 6 A cross-sectional view of the capillary tube of the heat dissipation device.

[0054] Figure 24 and Figure 25 It is shown that... Figure 6 A view of the heat source associated with the heat dissipation device. Detailed Implementation

[0055] This disclosure can be modified in many alternative forms, and therefore specific embodiments will be shown and described in more detail in the accompanying drawings. However, it should be understood that this is not intended to limit this disclosure to the specific forms disclosed, but rather to cover all modifications, equivalents, and substitutions that fall within the spirit and scope of this disclosure.

[0056] In the following description, exemplary embodiments will be described in more detail with reference to the accompanying drawings. However, this disclosure may be implemented in a variety of different forms and should not be construed as being limited to the embodiments shown herein. Rather, these embodiments are provided as examples so that this disclosure will be thorough and complete and will fully convey to those skilled in the art the aspects and features of this disclosure. Therefore, processes, elements, and techniques that are unnecessary for those skilled in the art to fully understand the aspects and features of this disclosure may not be described. Unless otherwise stated, the same reference numerals denote the same elements throughout the drawings and written description, and therefore, their repeated descriptions may not be provided. In the drawings, for clarity, the relative dimensions (e.g., including length, width, and thickness) of elements, layers, and regions may be exaggerated.

[0057] For ease of explanation, spatial relative terms such as “above,” “below,” “lower,” “under,” “above,” “upper,” etc., may be used herein to describe the relationship between one element or feature and another element(s) as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as “below,” “under,” or “below” other elements or features will subsequently be oriented “above” other elements or features. Thus, the exemplary terms “below” and “under” can encompass both above and below orientations. The device may have other orientations (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0058] It will be understood that when an element, such as a region, layer, membrane, area, or portion, is referred to as being "on" or "connected" to another element, it can be directly on or directly connected to the other element, or one or more intervening elements may exist. Conversely, when an element or layer is referred to as being "directly" on, "directly connected to," or "adjacent" to another element or layer, no intervening element or layer exists. Furthermore, it will be understood that when an element is referred to as being "between" two elements, it can be the only element between the two elements, or one or more intervening elements may exist.

[0059] As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprises,” “comprising,” “includes,” “including,” “have,” and “having” specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Additionally, the terms “comprise(s)” / “comprising,” “include(s)” / “including,” “have” / “has” / “having” or similar terms include or support the terms “consisting of” and “substantially consisting of”, indicating the presence of the stated features, integrals, steps, operations, elements, and / or components, while other features, integrals, steps, operations, elements, components, and / or groups thereof are absent or substantially absent.

[0060] As used herein, the term “and / or” includes any and all combinations of one or more of the items in the related list. Unless otherwise apparent from this disclosure, expressions such as “at least one of,” “multiple,” “one of,” and other prepositional phrases that precede / follow an element of a list, if written as a conjunctive list, should be understood to include disjunctive words, and vice versa. For example, expressions “at least one of a, b, and c,” “choose one of the group consisting of a, b, and c,” “selected from at least one of a, b, and c,” “from at least one of a, b, and c,” “from one of a, b, and c,” “at least one of a to c” mean only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0061] As used in this article, the terms “use,” “using,” and “used” can be understood as synonyms with the terms “utilize,” “utilizing,” and “utilized,” respectively.

[0062] The display device according to one or more embodiments can be applied to various electronic devices. The electronic device according to one or more embodiments includes the aforementioned display device and may include modules or devices with other additional functions besides the display device.

[0063] Figure 1 This is a block diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0064] refer to Figure 1 An electronic device EA according to one or more embodiments may include a display module DM, a processor PC, a memory ME, and a power module PM.

[0065] The processor PC may include a central processing unit (“CPU”), an application processor (“AP”), a graphics processing unit (“GPU”), a communication processor (“CP”), an image signal processor (“ISP”), and / or a controller.

[0066] Data used for the operation of the processor PC or display module DM can be stored in the memory ME. When the processor PC executes the application stored in the memory ME, image data signals and / or input control signals can be transmitted to the display module DM, and the display module DM can process the received signals and output image information through the display screen.

[0067] The power module PM may include a power supply module such as a power adapter and / or battery device, as well as a power conversion module that converts the power supplied by the power supply module to generate power for the operation of the electronic device EA.

[0068] At least one of the components of the aforementioned electronic device EA may be included in a display device according to one or more embodiments of the present disclosure. Furthermore, some of the individual modules functionally included in a single module may be included in the display device, and other individual modules may be provided separately from the display device. For example, the display device may include a display module DM, and a processor PC, a memory ME, and a power module PM may be provided in the electronic device EA as a separate device from the display device. In one or more embodiments, the display device may operate based on image data signals and input control signals.

[0069] Figure 2 A schematic perspective view of an electronic device according to one or more suitable embodiments of the present disclosure is shown.

[0070] refer to Figure 2 One or more suitable electronic devices that employ a display device according to one or more embodiments may include not only electronic devices for image display such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d, desktop monitors 10_1e, etc., but also wearable electronic devices (such as smart glasses 10_2a, head-mounted displays 10_2b, smartwatches 10_2c, etc.) that include a display module, and vehicle electronic devices 10_3 (such as vehicle dashboards, central dashboards, center information displays (“CID”) located on the instrument panel, interior mirror displays, etc.) that include a display module.

[0071] Figure 3 This is an exploded perspective view showing an electronic device according to one or more embodiments of the present disclosure.

[0072] refer to Figure 3 An electronic device according to one or more embodiments (e.g., a smartphone 10_1a) may include a display device DD, a heat dissipation device PHP, and a housing that houses them.

[0073] In one or more embodiments as described with reference to the accompanying drawings, the first direction DR1, the second direction DR2, and the third direction DR3 may intersect each other. For example, the first direction DR1, the second direction DR2, and the third direction DR3 may be orthogonal to each other (e.g., perpendicular).

[0074] For example, the plane can be defined by a first direction DR1 and a second direction DR2. The normal direction of the plane (e.g., the thickness direction of the display device DD) can be a third direction DR3.

[0075] Here, "top," "upper," and "upper surface" can refer to the orientation of the second substrate 120 of the display device DD relative to the first substrate 110, i.e., the third-direction DR3. "Bottom," "ground," "base," and "lower surface" can refer to the orientation of the heat dissipation device PHP relative to the first substrate 110 of the display device DD, i.e., the direction opposite to the third-direction DR3.

[0076] Furthermore, in the plan view, "left," "right," "up," and "down" can refer to the direction of the display device DD relative to the plan view. For example, "right" can refer to the first direction DR1, "left" can refer to the direction opposite to the first direction DR1, "up" can refer to the second direction DR2, and "down" can refer to the direction opposite to the second direction DR2.

[0077] In one or more embodiments, the housing may include an upper cover TC disposed on the upper part of the display device DD and a lower cover BC disposed on the lower part of the display device DD.

[0078] The top cover TC can be positioned to cover the edge of the upper surface. The display device DD can include a display area in which multiple pixels are arranged. The display area can be surrounded by a peripheral area. For example, the top cover TC can cover the display area.

[0079] The lower cover BC can be positioned to cover the entire lower surface. The display device DD can be connected to the driver chip DC. For example, the driver chip DC may include a driver circuit 210 and a flexible film 220. The flexible film 220 can be bent such that the driver circuit 210 can be adjacent to the back surface of the display device DD. For example, the surface on which light emitted from multiple pixels is displayed as an image can be the front surface, and the surface facing the front surface on the third-direction DR3 (e.g., opposite to the front surface on the third-direction DR3) can be the back surface. The front surface can be adjacent to the upper cover TC, and the rear surface can be adjacent to the lower cover BC.

[0080] A recess may be defined within the housing. The object to be protected may be accommodated within the space defined by the recess. For example, the object to be protected may be a display device DD. In another example, the object to be protected may be any of a variety of electronic devices including the display device DD. Figure 4 Using a smartphone 10_1a as an example, however, this disclosure is not limited thereto. As stated above, the electronic device EA can be implemented in one or more suitable forms.

[0081] Figure 4 This illustrates one or more embodiments according to this disclosure. Figure 3 A plan view of the display device. Figure 5 This illustrates one or more embodiments according to this disclosure. Figure 3 A block diagram of the display device.

[0082] refer to Figure 3 , Figure 4 and Figure 5 The display device DD may include a display area DA and a non-display area NDA (i.e., the peripheral area).

[0083] The display area DA can be an area for displaying an image. Multiple pixels PX can be arranged in the display area DA. When a pixel PX emits light, the display area DA can display the image.

[0084] The non-display area NDA can be an area where no image is displayed. The non-display area NDA can surround (e.g., encircle) at least a portion of the display area DA. For example, the non-display area NDA can completely surround the display area DA. Drivers that provide signals or voltages to pixels PX can be arranged in the non-display area NDA. For example, drivers can include a gate driver GDV, a light-emitting driver EDV, a data driver DDV, and a controller CON.

[0085] Each pixel PX can be electrically connected to the gate driver GDV, the light-emitting driver EDV, and the data driver DDV. For example, each pixel PX can be connected to the gate driver GDV via the gate line GL, to the light-emitting driver EDV via the light-emitting line EL, and to the data driver DDV via the data line DL. Therefore, each pixel PX can receive the gate signal GS, the light-emitting signal EM, and the data voltage DATA.

[0086] The gate driver GDV can receive a gate control signal GCTRL from the controller CON. The gate driver GDV can generate a gate signal GS based on the gate control signal GCTRL. The gate signal GS can be provided to each of the pixels PX via a gate line GL (e.g., each pixel PX receives the gate signal GS via a corresponding gate line GL among a plurality of gate lines GL connected to the plurality of pixels PX).

[0087] The light-emitting driver EDV can receive the light-emitting control signal ECTRL from the controller CON. The light-emitting driver EDV can generate a light-emitting signal EM based on the light-emitting control signal ECTRL. The light-emitting signal EM can be provided to each of the pixels PX via the light-emitting line EL (e.g., each pixel PX receives the light-emitting signal EM via a corresponding light-emitting line EL among multiple light-emitting lines EL connected to multiple pixels PX).

[0088] The data driver DDV can receive the data control signal DCTRL and the output image data ODAT from the controller CON. The data driver DDV can generate a data voltage DATA based on the data control signal DCTRL and the output image data ODAT. The data voltage DATA can be provided to each of the pixels PX via the data line DL (e.g., each pixel PX receives the data voltage DATA via a corresponding data line DL among multiple data lines DL connected to multiple pixels PX).

[0089] The controller CON can receive control signals CTRL and input image data IDAT from an external device (e.g., a GPU). Based on the control signals CTRL and IDAT, the controller CON can generate gate control signals GCTRL, emission control signals ECTRL, data control signals DCTRL, and output image data ODAT. The controller CON can control the gate driver GDV, the emission driver EDV, and the data driver DDV.

[0090] Figure 6 This is a plan view of a heat dissipation device according to one or more embodiments of the present disclosure. Figure 7 The illustration schematically depicts one or more embodiments according to this disclosure. Figure 6 The flow path of the heat dissipation device.

[0091] For example, Figure 6 This is a floor plan of the PHP cooling system, and Figure 7 The illustration schematically shows an unfolding into a single ring shape. Figure 6 The heat dissipation device of PHP has a flow path FP.

[0092] In one or more embodiments, the heat dissipation device PHP may include a working fluid WF and a capillary CAT filled with the working fluid WF.

[0093] For example, a heat dissipation device PHP may include a first plate, a capillary CAT, and a second plate.

[0094] For example, the first plate may define the overall outline of the heat dissipation device PHP. The first plate may be a flat plate, although this disclosure is not limited thereto, and the shape of the first plate may be any suitable shape that is generally available and / or commonly used.

[0095] For example, the first and second plates may comprise metals or polymer resins. Examples of metals may include aluminum (Al), zinc (Zn), tin (Sn), lead (Pb), copper (Cu), stainless steel, titanium (Ti), etc. These metals may be used alone or in combination with each other. Examples of polymer resins are polyethylene (PE), polycarbonate (PC), polypropylene (PP), polytetrafluoroethylene (PTFE), etc. Thus, the first plate may be flexible and easily bent. However, this disclosure is not limited thereto.

[0096] The working fluid WF can be injected into the capillary CAT. Examples of the working fluid WF may include water (H2O), ammonia (NH3), methanol (CH3OH), ethanol (C2H5OH), single halocarbon compounds, etc. However, this disclosure is not limited thereto. For example, the working fluid WF may also include refrigerants, etc.

[0097] Capillary CATs can be formed in the first plate. For example, capillary CATs can be formed on or in the upper surface of the first plate. For example, capillary CATs can be formed by patterning (e.g., etching) the first plate using a photoresist. However, this disclosure is not limited thereto.

[0098] In some embodiments, the capillary can be formed into a capillary loop in which the tube bends multiple times. The capillary can be a single closed-loop channel formed in a zigzag or spiral pattern. For example, a heat dissipation device can have two or more loops.

[0099] The inner diameter (i.e., hydraulic diameter) of the capillary CAT can vary depending on the type of working fluid WF. For example, the inner diameter can be selected based on the working fluid WF used and / or selected. When the working fluid WF is water, the hydraulic diameter can be from about 1 mm to about 6 mm; if the working fluid WF is ethanol (e.g., when the working fluid WF is ethanol), the hydraulic diameter can be from about 0.6 mm to about 3.2 mm. However, this disclosure is not limited thereto. For example, the hydraulic diameter can vary depending on the density, surface tension, etc., of the working fluid WF.

[0100] In one or more embodiments, the capillary CAT may include a first capillary segment and a second capillary segment that have different diameters from each other. For example, the first capillary segment may have a first diameter, and the second capillary segment may have a second diameter smaller than the first diameter. When the second capillary segment has a smaller diameter, the capillary force acting on the liquid phase of the working fluid WF can be increased. For example, the capillary force may be defined as the product of the length of the flow path FP and the surface tension of the working fluid WF. However, this disclosure is not limited thereto. For example, the capillary CAT may have the same diameter depending on its location, or it may be formed to have three or more different diameters.

[0101] The second plate can be disposed on one side of the first plate. For example, the second plate can be laminated onto the upper surface of the first plate. For example, the second plate can be bonded to the first plate. If the second plate is bonded to the upper surface of the first plate (e.g., when the second plate is bonded to the upper surface of the first plate), then the second plate can cover the capillary CAT. For example, the second plate can seal the capillary CAT.

[0102] However, this disclosure is not limited thereto. For example, the heat dissipation device PHP can have one or more suitable structures. For example, a capillary CAT can be formed between the first plate and the second plate, or formed in the second plate while the first plate covers the second plate.

[0103] The capillary CAT can provide a flow path FP for the working fluid WF. The flow path FP can include a first flow path FP1 and a second flow path FP2. After the capillary CAT is evacuated, the working fluid WF can be injected. In one or more embodiments, a liquid phase (liquid plug) and a gas phase (gas plug) can be alternately positioned in the working fluid WF. The liquid phase working fluid WF1 and the gas phase working fluid WF2 can be alternately positioned along the axis of the capillary CAT. The working fluid WF in the capillary CAT can form a slug train unit comprising the liquid phase working fluid WF1 and the gas phase working fluid WF2 (e.g., composed of the liquid phase working fluid WF1 and the gas phase working fluid WF2) under the action of surface tension.

[0104] The opposite ends of the capillary bundle can be a first section PA1 (i.e., an evaporation section, such as the section where the working fluid WF is more likely to evaporate) and a second section PA2 (i.e., a condensation section, such as the section where the working fluid WF is more likely to condense into a liquid). The working fluid WF can move within the flow path FP defined by the capillary CAT. However, this disclosure is not limited thereto.

[0105] For example, the first section PA1 and the second section PA2 can be defined based on the liquid ratio within the flow path FP according to the operation of the heat dissipation device PHP. For example, the ratio of the working fluid WF filling the flow path FP during manufacturing can be referred to as the average fill rate (in volume %). A relatively hot portion (the portion where the heat source is located) may have a lower liquid ratio in the flow path FP due to the evaporation of the working fluid WF. The portion with a relatively low liquid ratio can be defined as the first section PA1. Conversely, a relatively cool portion may have a higher liquid ratio than the average fill rate due to the condensation of the working fluid WF. The portion with a relatively high liquid ratio in the flow path FP can be defined as the second section PA2.

[0106] In one or more embodiments, the first section PA1 may be a section that absorbs heat generated from the heat source HS. The heat from the evaporation section PA1 may be transferred to the working fluid WF as the latent heat of vaporization. The liquid working fluid WF1 may absorb external heat and evaporate. The gaseous working fluid WF2 may expand due to the evaporation pressure.

[0107] In one or more embodiments, the second section PA2 may be separate from the first section PA1. The second section PA2 may be a section that dissipates heat absorbed by the first section PA1. In the condensation section PA2, the liquid working fluid WF1 may be condensed. The gaseous working fluid WF2 may be contracted by the condensation pressure.

[0108] In one or more embodiments, the third segment PA3 may connect the first segment PA1 and the second segment PA2. For example... Figure 7 As shown, the third section PA3 may include a 3-1 sub-section PA31 that guides the working fluid WF from the first section PA1 to the second section PA2 and a 3-2 sub-section PA32 that guides the working fluid WF from the second section PA2 to the first section PA1.

[0109] Due to the temperature difference between the evaporation section PA1 and the condensation section PA2, the working fluid WF can evaporate in the evaporation section PA1 and condense in the condensation section PA2. The pressure difference between the evaporation pressure and the condensation pressure at both ends (i.e., the evaporation section PA1 and the condensation section PA2) can cause the slug train unit to oscillate back and forth PD3 (i.e., the working fluid WF oscillates back and forth PD3). When the heat input supplied to the capillary CAT increases, the slug train unit can circulate in one direction (e.g., the first flow direction PD1 and the second flow direction PD2). Through oscillation and circulation, the heat dissipation device PHP can transfer heat from the evaporation section PA1 to the condensation section PA2 (i.e., heat can be dissipated).

[0110] In one or more embodiments, the heat dissipation device PHP may include a capillary force controller CFC located in the third segment PA3. The capillary force controller CFC may be configured to increase or decrease the capillary force such that the working fluid WF, which absorbs heat in the first segment PA1, moves to the second segment PA2 and releases heat in the second segment PA2, moves to the first segment PA1. For example, the capillary force controller CFC may include a first capillary force controller CFC1 and a second capillary force controller CFC2. The capillary force controller CFC may be a manual control device for controlling the flow direction PD (e.g., the flow of the working fluid WF in the first flow direction PD1, the second flow direction PD2, and / or the third flow direction PD3). A detailed description of the capillary force controller CFC is described below with reference to... Figures 8 to 14 supply.

[0111] In one or more embodiments, the heat dissipation device PHP may include a surface energy alteration section ECS disposed on a portion of the inner surface of the flow path FP (e.g., at the inner surface of the capillary CAT). The surface energy alteration section ECS may include a first region having a first surface energy and a second region having a second surface energy different from the first surface energy, wherein the first and second regions alternate with each other. The surface energy alteration section ECS may be a device for inducing bubble collapse in a liquid column by alternately arranging surfaces with different wettability. A detailed description of the surface energy alteration section ECS is provided below. Figures 15 to 23 supply.

[0112] The inner surface of the flow path FP can be inspected destructively or non-destructively. For example, the inner surface of the flow path FP can be inspected using physical / chemical treatments such as magnetic particle inspection, radiographic inspection, ultrasonic inspection, eddy current testing, dimensional measurement, 3-D microscopy, probe microscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM), or focused ion beam (FIB) inspection.

[0113] Figure 8 It is along one or more embodiments of this disclosure. Figure 6 A cross-sectional view showing the length of the capillary tube at region A. Figure 9 It is a cross-sectional view taken along the length of a portion of the capillary tube of the heat dissipation device according to one or more embodiments of the present disclosure. Figure 8 and Figure 9 This illustrates one or more embodiments according to the present disclosure. Figure 6 Region A is sub-segment PA31 of 3-1 Figure 7 A view of the first capillary force controller.

[0114] refer to Figure 7 , Figure 8 and Figure 9 In one or more embodiments, the capillary force controller (CFC) may include a surface treatment portion (or surface treatment unit) STP having a surface energy in sub-segment 3-1 PA31 that is greater than that in sub-segment 3-2 PA32.

[0115] In one or more embodiments, the contact angle defined by the interface IN between the liquid working fluid WF1 and the gaseous working fluid WF2 at the inner surface IS of the flow path FP (e.g., at the inner surface IS1 of the surface treatment section STP) can be configured to decrease along the flow direction PD1 of the working fluid WF in the 3-1 sub-section PA31. As the contact angle decreases, the capillary force (i.e., heat flux) can decrease. For example, due to the surface treatment unit STP, the contact angle can decrease along the flow direction PD1 from a second contact angle AN2 to a first contact angle AN1.

[0116] For example, the first contact angle AN1 can be defined by the interface IN1 between the inner surface IS of the flow path FP and the liquid working fluid WF1 and the gas working fluid WF2.

[0117] The second contact angle AN2 can be defined by the interface IN2 between the liquid working fluid WF1 and the gaseous working fluid WF2 when the working fluid WF moves along the flow path FP (e.g., the interface IN2 between the liquid working fluid WF1 and the gaseous working fluid WF2 at the inner surface IS1 of the surface treatment section STP) and the inner surface IS1 of the surface treatment section STP.

[0118] In one or more embodiments, contact angles AN1 and AN2 can be measured using a contact angle goniometer.

[0119] For example, the surface treatment portion STP can be formed by one or more suitable methods, such as sandblasting (a method of forming micro-roughness by physically colliding fine sand particles with the surface of the substrate using compressed air (e.g., by spraying fine sand particles onto the surface of the substrate using compressed air), sandpaper polishing (a method of changing the surface of the substrate by rubbing the surface of the substrate with sandpaper), shot peening (a method of changing the surface of the substrate by spraying fine particles of metal or non-metal called shot or abrasive), plasma etching (etching using gas plasma), acid / alkali etching (etching using acid / alkali solutions), electrical discharge processing (a method of melting and then solidifying the surface of the substrate by using high heat generated by electrical discharge), laser processing (a method of ablating the surface of the substrate by irradiating the surface of the substrate with high-power laser pulses), etc.

[0120] In one or more embodiments, such as Figure 9 As shown, the capillary force controller (CFC) may include a diameter changing section (RTP) configured such that the inner diameter of sub-section 3-1 PA31 increases along the flow direction PD1 of the working fluid WF, and the inner diameter of sub-section 3-2 PA32 decreases along the flow direction PD2 of the working fluid WF. For example, the inner diameter of the capillary CAT may change from a first diameter R1 to a second diameter R2 (or vice versa) at the diameter changing section (RTP). When the diameter increases, the capillary force (i.e., heat flux) may decrease.

[0121] Figure 10 It is along one or more embodiments of this disclosure. Figure 6 A cross-sectional view showing the length of the capillary tube at region A. Figure 11 It is along one or more embodiments of this disclosure. Figure 10 The sectional view taken from line II-II'. Figures 12 to 14Each is a cross-sectional view taken along the length of a portion of the capillary tube of the heat dissipation device according to an embodiment of the present disclosure.

[0122] Figures 10 to 14 This illustrates one or more embodiments according to the present disclosure. Figure 6 Region A is sub-segment PA32 of 3-2 Figure 7 A view of the second capillary force controller CFC2.

[0123] refer to Figure 7 and Figures 10 to 14 In one or more embodiments, the capillary force controller (CFC) may include a surface treatment unit (STP') having a surface energy of sub-segment PA31 that is greater than that of sub-segment PA32 (3-2 sub-segment). While a capillary force controller CFC with reference to sub-segment PA32 is described... Figures 11 to 14 However, for reference Figures 11 to 14 The surface treatment unit STP' described above can also be applied to the above references. Figure 8 The surface treatment unit STP of sub-segment PA31 described in section 3-1.

[0124] In one or more embodiments, the contact angle defined by the interface IN between the liquid working fluid WF1 and the gaseous working fluid WF2 at the inner surface IS of the flow path FP can be configured to increase along the flow direction PD2 of the working fluid WF in the 3-2 sub-section PA32. For example, due to the surface treatment unit STP', the contact angle can increase from a first contact angle AN1 to a second contact angle AN2 along the flow direction PD2.

[0125] In one or more embodiments, the capillary force controller (CFC) may include a surface area adjuster (e.g., Figure 11 SCP-1 Figure 12 SCP2, Figure 13 SCP3 Figure 14 (e.g., SCP), such that the surface area of ​​the inner wall of sub-section PA31 (3-1) is smaller than the surface area of ​​the inner wall of sub-section PA32 (3-2). For example, the capillary force controller CFC may include a surface area adjuster such that the surface area of ​​the inner wall of sub-section PA31 (3-1) increases along its length and the surface area of ​​the inner wall of sub-section PA32 (3-2) decreases along its length. For example, surface treatment units STP and STP' increase the surface area of ​​the inner wall of the flow path FP at surface treatment units STP and STP'.

[0126] For example, such as Figure 11As shown, the surface area regulator SCP1 may include a protrusion PP protruding (e.g., protruding from the inner surface of the 3-2 sub-segment PA32) into the surface treatment units STP, STP' of the 3-2 sub-segment PA32, extending towards the inner surface of the flow path FP. The protrusion PP can reduce the contact angle of the working fluid WF. Therefore, the heat transfer rate can be improved. For example, the protrusion PP can be formed by one or more suitable methods such as powder injection molding.

[0127] However, this disclosure is not limited thereto. For example... Figures 12 to 14 As shown, the capillary force controller (CFC) may include one or more suitable components that can increase or decrease the capillary force.

[0128] For example, in Figure 12 In this context, the surface area adjuster SCP2 may include a mesh MES arranged within the surface treatment units STP and STP' of sub-segment PA32 in the 3-2 sub-section to increase the surface area. For example... Figure 13 As shown, the surface area adjuster SCP3 may include a linear structure WI arranged within the surface treatment units STP, STP' of sub-segment PA32 in the 3-2 sub-segment to increase the surface area. Figure 14 As shown, the surface area regulator SCP4 may include porous material POM arranged in the surface treatment units STP, STP' of sub-segment PA32 in sub-section 3-2 to increase the surface area. The mesh MES, linear structure WI, and porous material POM can improve heat dissipation performance by reducing the thickness of the liquid film on the inner surface of the flow path FP. When the surface area increases, capillary force (i.e., heat flux) can increase. However, this disclosure is not limited thereto. Surface area regulators SCP2, SCP3, and SCP4 may also be arranged in sub-segment PA31 in sub-section 3-1. Even in this case, the surface area of ​​sub-segment PA32 in sub-section 3-2 may be greater than the surface area of ​​sub-segment PA31 in sub-section 3-1.

[0129] However, the above are examples, and this disclosure is not limited thereto. For example, the heat dissipation device PHP may also include one or more suitable components to increase capillary force. For example, similar to the above references Figure 8 and Figure 9 As described, it can be configured (through surface treatment) to have a smaller contact angle or a smaller diameter.

[0130] Figure 15 , Figure 16 , Figure 17 and Figure 18 This is a view showing a heat dissipation device according to one or more embodiments of the present disclosure.

[0131] For example, Figure 15 Embodiments according to this disclosure are shown. Figure 6 The surface energy can change part of the section. Figure 16 According to the embodiments of this disclosure, along Figure 15 A sectional view taken from line IV-IV'. Figure 17 According to the embodiments of this disclosure, along Figure 15 A sectional view taken from line IV-IV'. Figure 18 This illustrates the formation of an embodiment according to the present disclosure. Figure 15 A schematic diagram of the grooves on the inner surface of the flow path.

[0132] refer to Figure 3 , Figure 6 , Figures 15 to 18 In one or more embodiments, the electronic device EA may include a surface energy changing section ECS disposed on a portion of the inner surface IS of the flow path FP. The surface energy changing section ECS includes a first section (or first region) SE1 having a first surface energy and a second section (or second region) SE2 having a second surface energy different from the first surface energy, wherein the first region SE1 and the second region SE2 alternate with each other.

[0133] Vibration may occur due to dry burning in the flow path FP of the heat dissipation device PHP. Dry burning refers to the phenomenon where, in a two-phase flow, the inner surface IS of the flow path FP may no longer be in contact with the liquid working fluid WF1, and the thin liquid film flowing along the inner surface IS is disrupted, causing the inner surface IS of the flow path FP to dry out. For example, dry burning refers to the phenomenon where the liquid working fluid WF1 and the gaseous working fluid WF2 alternately contact the inner surface IS of the flow path FP. The heat transfer coefficient of the inner surface IS of the flow path FP may decrease from a wet state to a dry-wet state. Therefore, the temperature of the inner surface IS may increase due to dry burning.

[0134] When vibration occurs due to the aforementioned dry burning, the temperature of the inner surface IS of the flow path FP may oscillate between wet and dry states as the heat transfer coefficient of the inner surface IS of the flow path FP fluctuates to maintain heat flux. Therefore, periodic changes in thermal stress may occur, which could potentially damage the heat dissipation device PHP.

[0135] To prevent or reduce this situation, in one or more embodiments, the heat dissipation device PHP may include a surface energy changing section ECS in which a first segment SE1 having a first surface energy and a second segment SE2 having a second surface energy different from the first surface energy are alternately positioned on the inner surface IS of the flow path FP.

[0136] In one or more embodiments, the surface energy changing section ECS can be formed by alternately arranging materials with different surface energies. In one or more embodiments, the surface energy changing section ECS can be alternately positioned to have sections with different surface energies using surface treatment techniques. In one or more embodiments, the surface energy changing section ECS can be arranged at at least one location during a cycle from the section where the liquid working fluid WF1 is introduced to the section where it is discharged.

[0137] In the first section SE1, the liquid working fluid WF1 can flow along the inner surface IS of the flow path FP in the form of a liquid film. In the first section SE1, the gaseous working fluid WF2 can flow along the center of the flow path FP.

[0138] In one or more embodiments, the inner surface of the first segment SE1 may be hydrophilic, and the inner surface of the second segment SE2 may be hydrophobic. For example, if the heat dissipation device PHP can be formed of a hydrophilic metal (e.g., when the heat dissipation device PHP can be formed of a hydrophilic metal), a surface treatment using a hydrophobic material may be performed only on the second segment SE2.

[0139] If the working fluid WF and the inner surface IS are in thermodynamic equilibrium (e.g., when the working fluid WF and the inner surface IS are in thermodynamic equilibrium), then the contact angle can be defined. The contact angle can vary depending on the properties of the working fluid WF, the shape of the inner surface IS, etc.

[0140] For example, the contact angle between the hydrophilic inner surface and the working fluid WF can be approximately 8 degrees, and the contact angle between the hydrophobic inner surface and the working fluid WF can be approximately 160 degrees. The higher the surface energy (i.e., the higher the wettability), the more the working fluid WF can contact the hydrophilic inner surface (e.g., the smaller the contact angle can be). In such an embodiment, more evaporation can be induced in the evaporation section PA1, thereby further improving heat dissipation performance.

[0141] In one or more embodiments, the surface energy alteration segment ECS may include a surface treatment layer L1 (e.g., see...). Figure 16 The surface treatment layer L1 can be a layer treated with at least one of plasma, ozone, and ultraviolet light. For example, the surface treatment layer L1 can be surface-treated with plasma, ozone, ultraviolet light, etc., to provide a region that is surface-treated to be hydrophobic (e.g., the second segment SE2). For example, the surface treatment layer L1 can be formed by one or more suitable methods, such as patterning with a hydrophobic structure.

[0142] In one or more embodiments, the surface energy alteration segment ECS may include a coating L2 (e.g., see...). Figure 17The coating L2 can be formed from a material having a hydrophobic component. In one or more embodiments, the coating L2 can be formed from fluororesins, fluorosilane coupling agents, fluoroisocyanate compounds, alkylthiols, organosilane compounds, fatty acids, aromatic azide compounds, etc. These can be used alone or in combination with each other. For example, the coating L2 can be formed by thinly coating the inner surface IS of the flow path FP with a hydrophobic material. However, this disclosure is not limited thereto. The coating L2 can also be formed by using chemical bonds (e.g., covalent bonds) between the hydrophobic material and the metal surface. However, this disclosure is not limited thereto.

[0143] like Figure 18 As shown, in one or more embodiments, the shape of the groove GR (e.g., depth DEP, etc.) can be adjusted so that the inner surface IS of the flow path FP has hydrophobic / hydrophilic properties.

[0144] For example, if the groove GR is formed at a microscale or smaller scale (e.g., when the groove GR is formed at a microscale or smaller scale), the height difference (e.g., depth DEP) between the portion corresponding to the mountain and the portion corresponding to the valley is relatively small, and air can be included between the mountain and the valley to minimize or reduce the contact angle with the fluid. Therefore, the inner surface IS of the flow path FP in which the groove GR is formed can have hydrophobic properties.

[0145] For another example, if the groove GR is formed on a millimeter or larger scale or linearly, the inner surface IS of the flow path FP can be hydrophilic.

[0146] For example, physical grooves can be formed by sanding, CNC machining, lasers, etc. As another example, chemical grooves can be formed using one or more suitable etchants.

[0147] In one or more embodiments, surface treatment can be performed not only on the second segment SE2, but also on the first segment SE1. For example, a hydrophilic material (e.g., a material having -OH groups) can be used to form a coating on the first segment SE1.

[0148] It may be difficult to pinpoint the location where dry burning might occur. Therefore, the surface energy changing section ECS can be located anywhere within the heatsink PHP. For example, in Figure 6 In this context, it is described as being located at the third segment PA3; however, this disclosure is not limited thereto. For example, the surface energy changing segment ECS may be located at the first segment PA1 or the second segment PA2.

[0149] If the entire inner surface IS of the flow path FP is coated with a hydrophobic material, it may create resistance between the hydrophilic fluid and the inner surface IS, which could lead to a decrease in heat dissipation performance. Therefore, only a portion of the flow path FP (e.g., the second section SE2) can be formed to be hydrophobic.

[0150] Dry burning caused by the agglomeration of the gaseous working fluid WF2 can be prevented or reduced by the collapse of bubbles. See below for reference. Figures 19 to 23 Provide a more detailed description.

[0151] However, the following are examples, and this disclosure is not limited thereto. For example, the cross-section of the tube may have one or more suitable shapes, such as circular or square.

[0152] Figures 19 to 23 This describes a method for heat dissipating heat in an electronic device using a heat dissipation device, according to one or more embodiments. Figure 6 A cross-sectional view of the capillary tube of the heat dissipation device. Figures 21 to 23 These are, respectively, one or more embodiments according to this disclosure. Figures 19 to 20 A magnified view of region C.

[0153] A heat dissipation method for an electronic device according to one or more embodiments of the present disclosure may include: forming a surface energy changing section ECS on a portion of the inner surface IS of a flow path FP, comprising alternating first regions SE1 (e.g., hydrophilic sections) and second regions SE2 (e.g., hydrophobic sections), the first regions SE1 having a first surface energy and the second regions SE2 having a second surface energy lower than the first surface energy (S100); filling the flow path FP with a working fluid WF (S200); and dissipating heat from a heat source while the working fluid WF travels through the flow path FP.

[0154] The liquid working fluid WF1 can flow as a liquid film along the inner surface IS of the hydrophilic section.

[0155] In one or more embodiments, during the step (e.g., an action or task) of dissipating heat from a heat source while the working fluid WF travels through the flow path FP, the flow of the liquid working fluid WF1 can be stopped (e.g., interrupted) at the interface between the first section SE1 and the second section SE2. In the hydrophobic section, the flow of the liquid working fluid WF1 can be stopped by friction (S310). Due to the surface tension at the interface between the first section SE1 and the second section SE2, the liquid working fluid WF1 can form a liquid column WW. As the thickness of the liquid film gradually increases, the liquid column WW can be formed by condensation due to surface tension (S320). The liquid column WW can reduce the size of the gaseous working fluid WF2. The liquid column WW can block or reduce the flow path FP to cause bubble collapse. As the bubble size decreases, dry burning can be prevented or reduced (S330). The inner diameter of the flow path FP can be configured to allow the formation of the liquid column WW.

[0156] Figure 24 and Figure 25 This illustrates a method according to one or more embodiments. Figure 6 A schematic diagram of the heat source associated with the heat dissipation device.

[0157] refer to Figure 3 , Figure 6 , Figure 24 and Figure 25 In one or more embodiments, the heat source HS can be any one of a display device DD including a plurality of pixels PX, or an electronic device EA including the display device DD and a housing TC and BC that house the display device DD.

[0158] For example, a first image IM1, a second image IM2, and a third image IM3 can be displayed on a display device DD. The second image IM2 can emit a color that is relatively close to white compared to the first image IM1. The third image IM3 can emit a color that is close to black (the darkest color). In such an embodiment, as... Figure 25 As shown, heat generation can be concentrated in the portion that emits the first image IM1 (first heating portion HS1) and the portion that emits the second image IM2 (second heating portion HS2).

[0159] For example, the portion where the heating sections HS1 and HS2 converge can be the first segment PA1, the portion spaced apart from and / or separated from the first segment PA1 (e.g., separated or isolated) can be the second segment PA2, and the portion between the first segment PA1 and the second segment PA2 can be the third segment PA3, as described above. Figure 6 and Figure 7 A more detailed description.

[0160] The display device DD and the electronic device EA including the display device DD can have relatively low power consumption. For example, the power consumption of the display device DD can be only about 0.1 to about 0.2 W / cm². 2 Sufficient heat may be required to initiate the circulation of the working fluid WF. If the working fluid WF of the heat sink PHP does not circulate, the heat transfer efficiency may decrease. As the non-operating time of the heat sink PHP increases, the maximum temperature of the display device DD may increase.

[0161] A heat dissipation device PHP according to one or more embodiments of the present disclosure may include a capillary force controller CFC in a third segment PA3. Therefore, a heat dissipation device PHP according to one or more embodiments of the present disclosure can improve heat dissipation performance without changing the flow path FP, the working fluid WF, and the heat of dry burning (“maximum Q”).

[0162] When changing the flow, fluid properties (viscosity, latent heat, specific heat, thermal conductivity, surface tension, reactivity, vapor pressure, vapor and liquid density, molar mass, etc.) must be considered. When changing the working fluid, it may be difficult to find a fluid that only changes one desired or suitable property. When changing the number of turns, the heat of dry burning (“maximum Q”) may increase, but the heat of startup (Q) may decrease, without substantially expanding the effective operating heat range.

[0163] However, since the heat dissipation device PHP according to one or more embodiments of this disclosure may include a capillary force controller CFC, the capillary force controller CFC may reduce (rapidly reduce) the maximum temperature of the display device DD during initial startup, even under low heat input conditions.

[0164] In one or more embodiments, the heat dissipation device PHP according to one or more embodiments of this disclosure can control the direction of heat transfer by controlling the degree of cooling at a specific location. For example, the working fluid WF evaporating in the evaporation section PA1 can flow to the condensation section PA2, and the working fluid WF condensing in the condensation section PA2 can flow to the evaporation section PA1, thereby rapidly reducing the maximum temperature of the display device DD. In one or more embodiments, cooling can also be concentrated at a specific location.

[0165] In one or more embodiments, the heat dissipation device PHP according to one or more embodiments of the present disclosure can be designed in one or more suitable ways based on the location of the heat source HS, heat capacity, etc. For example, if the heat generation is greatest in the central part of the display (e.g., when the heat generation is greatest in the central part of the display), the heat dissipation device PHP can be positioned to dissipate heat from the central part of the display to the edge part.

[0166] In one or more embodiments, the heat dissipation device PHP according to one or more embodiments of this disclosure can be tailored to the environment. For example, it can be applied to one or more suitable fields, such as batteries, in addition to display devices DD.

[0167] In one or more embodiments, the heat dissipation device PHP according to one or more embodiments of the present disclosure can be applied to vertically driven displays. In the case of the heat dissipation device, the length of the vibrating heat pipe may be short, so it cannot be applied to large-area displays, and if vertically mounted (e.g., when vertically mounted), the working fluid WF may accumulate at the bottom due to gravity, resulting in a lack of circulation and ineffective heat dissipation. The heat dissipation device PHP according to one or more embodiments of the present disclosure can artificially induce circulating flow by increasing / decreasing capillary force.

[0168] In one or more embodiments, the heat dissipation device PHP according to one or more embodiments of the present disclosure can prevent or reduce dry burning by including a surface energy changing segment ECS.

[0169] The heat dissipation device PHP according to one or more embodiments can be applied to the manufacturing process of one or more suitable display devices, including computers, laptops, cellular phones, smartphones, PMPs, PDAs, or MP3 players.

[0170] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms, such as those defined in common dictionaries, shall be interpreted as having the same meaning as they have in the relevant field and / or the context of this specification, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0171] Furthermore, when describing embodiments of this disclosure, the word "may" is used to mean "one or more embodiments of this disclosure".

[0172] As used herein, the terms “substantially,” “about,” and similar terms are used as approximate terms rather than terms of degree, and are intended to account for inherent biases in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “substantially” as used herein includes the value and means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, “substantially” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value.

[0173] Furthermore, any numerical range disclosed and / or described herein is intended to include all subranges containing the same numerical precision within the described range. For example, the range “1.0 to 10.0” is intended to include all subranges between (and inclusive of) the described minimum value of 1.0 and the described maximum value of 10.0, that is, for example, having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit described herein is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to modify this specification, including the claims, to clearly describe any subranges contained within the range expressly described herein.

[0174] The heat dissipation device, display device, electronic device, means for manufacturing a display device, and / or any other related device or component according to embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuit), software, or a combination of software, firmware, and hardware. For example, various components of the device can be formed on a single integrated circuit (IC) chip or on separate IC chips. Furthermore, various components of the device can be implemented on a flexible printed circuit film, a tape-on-a-chip (TCP), a printed circuit board (PCB), or formed on a substrate. Additionally, various components of the device can be processes or threads running on one or more processors in one or more computing devices, executing computer program instructions, and interacting with other system components for performing the various functions described herein. The computer program instructions are stored in memory implemented in the computing device using, for example, standard storage devices, such as random access memory (RAM). The computer program instructions can also be stored, for example, on other non-transitory computer-readable media, such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that, without departing from the scope of embodiments of the present disclosure, the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed across one or more other computing devices.

[0175] In light of the entire contents of this disclosure, those skilled in the art will understand that each suitable feature of the various embodiments of this disclosure may be combined in part or in whole, or combined with one another, and may be technically interlocked and operated in a variety of suitable ways, and each embodiment may be implemented independently of one another or in combination with one another in any suitable way, unless otherwise stated or implied.

[0176] It will be understood that, unless otherwise described, the description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Therefore, as will be apparent to those skilled in the art, unless specifically indicated otherwise, features, characteristics, and / or elements described in connection with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. It should be understood that the foregoing are examples of various exemplary embodiments and should not be construed as limiting to the specific embodiments disclosed herein, and various modifications to the disclosed embodiments and other exemplary embodiments are intended to be included within the spirit and scope of this disclosure as defined in the appended claims and their equivalents.

Claims

1. A heat dissipation device, comprising: A capillary tube in which the working fluid will travel, the capillary tube comprising: The first section is configured to absorb heat generated by a heat source; The second section, spaced apart from the first section and configured to dissipate the absorbed heat; and The third segment connects the first segment and the second segment; and A capillary force controller, located in the third section and configured to increase or decrease the capillary force, such that the working fluid that absorbs the heat in the first section moves to the second section and the working fluid that releases the heat in the second section moves to the first section.

2. The heat dissipation device according to claim 1, wherein, The third section includes a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section. The capillary force controller includes a surface treatment portion having a surface energy in the 3-1 sub-section that is greater than that in the 3-2 sub-section.

3. The heat dissipation device according to claim 2, wherein, The working fluid alternately forms a gaseous working fluid and a liquid working fluid, and The contact angle defined by the liquid working fluid and the gas working fluid at the inner surface of the surface treatment section decreases along the flow direction in the 3-1 sub-section and increases along the flow direction in the 3-2 sub-section.

4. The heat dissipation device according to claim 1, wherein, The third section includes a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section. The capillary force controller includes a diameter changing section configured such that the inner diameter of the 3-1 sub-section increases along the flow direction of the working fluid and the inner diameter of the 3-2 sub-section decreases along the flow direction of the working fluid.

5. The heat dissipation device according to claim 1, wherein, The third section includes a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section. The capillary force controller includes a surface area adjuster such that the surface area of ​​the inner wall of the 3-1 sub-section is smaller than the surface area of ​​the inner wall of the 3-2 sub-section.

6. The heat dissipation device according to claim 5, wherein, The surface area adjuster includes a protrusion extending from the inner surface of the 3-2 sub-segment.

7. The heat dissipation device according to claim 5, wherein, The surface area adjuster includes a mesh within the 3-2 sub-section.

8. The heat dissipation device according to claim 5, wherein, The surface area adjuster includes a linear structure within the 3-2 sub-segment.

9. The heat dissipation device according to claim 5, wherein, The surface area adjuster comprises porous material within the 3-2 sub-section.

10. An electronic device comprising: Display device; as well as A heat dissipation device for cooling the display device, the heat dissipation device comprising: A capillary tube in which the working fluid will travel, the capillary tube comprising: The first section is configured to absorb heat generated by a heat source; The second section, spaced apart from the first section and configured to dissipate the absorbed heat; and The third segment connects the first segment and the second segment; and A capillary force controller, located in the third section and configured to increase or decrease the capillary force, such that the working fluid that absorbs the heat in the first section moves to the second section and the working fluid that releases the heat in the second section moves to the first section.

11. The electronic device according to claim 10, wherein, The third section includes a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section. The capillary force controller includes a surface treatment portion having a surface energy in the 3-1 sub-section that is greater than that in the 3-2 sub-section.

12. The electronic device according to claim 11, wherein, The working fluid alternately forms a gaseous working fluid and a liquid working fluid, and The contact angle defined by the liquid working fluid and the gas working fluid at the inner surface of the surface treatment section decreases along the flow direction in the 3-1 sub-section and increases along the flow direction in the 3-2 sub-section.

13. The electronic device according to claim 10, wherein, The third section includes a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section. The capillary force controller includes a diameter changing section configured such that the inner diameter of the 3-1 sub-section increases along the flow direction of the working fluid and the inner diameter of the 3-2 sub-section decreases along the flow direction of the working fluid.

14. The electronic device according to claim 10, wherein, The third section includes a 3-1 sub-section that guides the working fluid from the first section to the second section and a 3-2 sub-section that guides the working fluid from the second section to the first section. The capillary force controller includes a surface area adjuster such that the surface area of ​​the inner wall of the 3-1 sub-section is smaller than the surface area of ​​the inner wall of the 3-2 sub-section.

15. The electronic device of claim 14, wherein the surface area adjuster comprises: The material is selected from at least one of the following groups: a protrusion extending from the inner surface of the 3-2 sub-segment, a mesh within the 3-2 sub-segment, a linear structure within the 3-2 sub-segment, and a porous material within the 3-2 sub-segment.

16. The electronic device of claim 10, further comprising: A surface energy changing section on a portion of the inner surface of the flow path, the surface energy changing section comprising alternating first and second sections, the first section having a first surface energy and the second section having a second surface energy different from the first surface energy.

17. The electronic device according to claim 16, wherein, The inner surface of the first region is hydrophilic, and The inner surface of the second region is hydrophobic.

18. A method for heat dissipation in an electronic device, comprising: A surface energy variation section comprising alternating first and second regions is formed on a portion of the inner surface of the flow path, the first region having a first surface energy and the second region having a second surface energy lower than the first surface energy; The flow path is filled with working fluid; and Heat is dissipated from the heat source as the working fluid travels through the flow path.

19. The heat dissipation method according to claim 18, in, The working fluid alternately forms a gaseous working fluid and a liquid working fluid. The step of dissipating heat from the heat source while the working fluid travels through the flow path includes: The flow of the liquid working fluid is interrupted at the interface between the first zone and the second zone; A liquid column is formed at the interface by surface tension; and The size of the gas-phase working fluid is reduced by the liquid column.

20. The heat dissipation method according to claim 18, wherein, The heat source includes at least one selected from the group consisting of: a display device comprising a plurality of pixels and an electronic device comprising the display device and a housing accommodating the display device.

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