Vehicle-mounted power supply device, power assembly and electric vehicle

Abstract

This application provides an on-board power supply device, a powertrain, and an electric vehicle, relating to the field of electric vehicle technology. The on-board power supply device has a housing for accommodating a heat dissipation device, a circuit board, a first electrical component, and a second electrical component. A first portion and a second portion of the heat dissipation device are arranged between the circuit board and the housing. The first electrical component is arranged opposite to the first portion, and the second electrical component is arranged opposite to the second portion, with the height of the first electrical component being less than the height of the second electrical component. The first portion is closer to the circuit board than the second portion, and the first and second portions are used to cool the first and second electrical components, respectively. Based on the different heights of the first and second electrical components, this application adjusts the spacing between the integrated first and second portions of the heat dissipation device and the circuit board, thereby improving the integration of the heat dissipation device and reducing the size of the on-board power supply device while avoiding uneven cooling of electrical components of different heights.

Description

Technical Field

[0001] This application relates to the field of electric vehicle technology, and in particular to an on-board power supply device, powertrain, and electric vehicle. Background Technology

[0002] The on-board power supply unit of electric vehicles utilizes electrical components to perform functions such as AC / DC conversion, ensuring the normal operation of the powertrain and the electric vehicle. To reduce the risk of electrical component failure due to overheating, the on-board power supply unit can use a cooling system to transfer coolant to dissipate the heat generated by the electrical components during operation. However, the limited space of the on-board power supply unit places higher demands on the cooling efficiency and integration of the cooling system. Summary of the Invention

[0003] This application provides an on-board power supply device, powertrain, and electric vehicle that can balance the cooling efficiency and integration of the heat dissipation device.

[0004] In a first aspect, embodiments of this application provide an on-board power supply device. The housing of the on-board power supply device accommodates a heat dissipation device, a circuit board, a first electrical component, and a second electrical component. The heat dissipation device is arranged along a first direction between the circuit board and the housing. The circuit board is used to fixably connect the first electrical component and the second electrical component. The first electrical component is distributed between a first portion of the heat dissipation device and the circuit board, and the second electrical component is distributed between a second portion of the heat dissipation device and the circuit board.

[0005] In this configuration, the height by which the first electrical component protrudes from the circuit board along the first direction is less than the height by which the second electrical component protrudes from the circuit board, and the distance between the first part of the heat dissipation device and the circuit board along the first direction is less than the distance between the second part of the heat dissipation device and the circuit board. The first part of the heat dissipation device is used to transfer coolant to cool the first electrical component, and the second part of the heat dissipation device is used to transfer coolant to cool the second electrical component.

[0006] In this embodiment, the first electrical component and the second electrical component share a circuit board, and the first and second electrical components protrude from the circuit board at unequal heights. When using a heat dissipation device to cool the first and second electrical components, it is necessary to consider how to balance cooling efficiency and integration of the heat dissipation device.

[0007] In this embodiment, the first part of the heat dissipation device is opposite to the first electrical component, and the second part of the heat dissipation device is opposite to the second electrical component. Based on the height relationship between the first and second electrical components, the distance between the first part of the heat dissipation device and the circuit board is adjusted to be smaller than the distance between the second part of the heat dissipation device and the circuit board. By utilizing the first and second parts of the heat dissipation device to transfer coolant, the difference in the heat transfer path between the first and second electrical components and the coolant can be shortened, reducing the amount of heat transfer from the first electrical component to the coolant via air, and improving cooling efficiency.

[0008] Since the first and second parts of the heat dissipation device are integrated into one unit, compared to using two separate heat dissipation devices to cool the first and second electrical components respectively, the embodiments of this application can reduce the structural complexity and installation difficulty of the heat dissipation device while avoiding uneven cooling of electrical components with different heights. This also facilitates the flow of coolant between the first and second parts and reduces the space occupied by the heat dissipation device in the first direction. The heat dissipation device and the housing are separate structures, eliminating the need to directly integrate the first and second parts of the heat dissipation device into the housing, which helps reduce the design and manufacturing difficulty of the housing.

[0009] In one embodiment, the on-board power supply device includes an on-board charger and a motor controller. The on-board charger outputs direct current to charge the power battery of the electric vehicle, and the motor controller outputs alternating current to control the drive motor. The on-board charger includes a first electrical component, the motor controller includes a second electrical component, and a first portion of the heat dissipation device is used to transfer coolant to a second portion of the heat dissipation device.

[0010] In this embodiment, the first electrical component is an on-board charger, and the second electrical component is a motor controller. A heat dissipation device is used to cool the first and second electrical components. Since the distances between the first and second parts of the heat dissipation device and the circuit board are different, it can be adapted to the height relationship between the first and second electrical components. The heat generated by the on-board charger is generally less than that of the motor controller, and the temperature rise after the coolant exchanges heat with the first electrical component alone is less than that after the coolant exchanges heat with the second electrical component alone. This embodiment adjusts the coolant transfer from the first part to the second part, allowing the coolant to exchange heat with the first and second electrical components sequentially. This embodiment reduces the difficulty of sharing a circuit board between the first electrical component of the on-board charger and the second electrical component of the motor controller while avoiding localized overheating of the on-board charger and the motor controller. This facilitates a single-board design for the on-board charger and the motor controller, balancing cooling efficiency and volume control within a limited space. The first and second parts of the heat dissipation device are an integrated structure, and they can share the inlet and outlet channels, facilitating the adjustment of the coolant flow sequence within the first and second parts of the heat dissipation device.

[0011] In one embodiment, the height by which the first portion of the heat sink protrudes from the side of the circuit board relative to the second portion of the heat sink is a first dimension. The depth by which the first portion of the heat sink is recessed from the side of the circuit board relative to the second portion of the heat sink is a second dimension. The first dimension is greater than the second dimension.

[0012] In this embodiment, the first part of the heat dissipation device protrudes from the side facing the circuit board relative to the side facing the circuit board of the second part of the heat dissipation device, and the side facing away from the circuit board of the first part of the heat dissipation device is recessed relative to the side facing away from the circuit board of the second part of the heat dissipation device. The first dimension is larger than the second dimension, indicating that the first part of the heat dissipation device shortens the distance between the first part and the circuit board by protruding towards the circuit board. The first part of the heat dissipation device utilizes the space left by the relatively small height of the first electrical component, shortening the heat transfer path between the coolant and the first electrical component, thus achieving a compact arrangement of the heat dissipation device, the first electrical component, and the second electrical component. This improves the utilization rate of the internal space of the vehicle power supply device and helps the vehicle power supply device adapt to the requirements of miniaturization design.

[0013] In one embodiment, a third portion of the heat dissipation device surrounds the first and second portions of the heat dissipation device. The distance between the third portion of the heat dissipation device and the circuit board along the first direction is less than the distance between the first portion of the heat dissipation device and the circuit board. The second portion of the heat dissipation device is recessed relative to the third and first portions to form a receiving groove for accommodating a second electrical component.

[0014] This application addresses the problem of accommodating a second electrical component within a limited space using a heat dissipation device. By integrating a third part into the heat dissipation device and adjusting the positional and height relationships between the first, second, and third parts, the heat dissipation device not only balances the cooling effect on the first and second electrical components but also forms a receiving groove with the first, second, and third parts. This groove protects and isolates the second electrical component, improving the efficiency of the vehicle power supply device. The third part of the heat dissipation device is an integral structure with the first and second parts, which helps reduce the number of structural components in the vehicle power supply device.

[0015] In one embodiment, the heat dissipation device includes a base plate and a cover plate. The base plate includes a first groove and a second groove, which are distributed on the side of the base plate facing away from the circuit board. The openings of the first groove and the second groove face away from the circuit board along a first direction. The opening of the first groove is distributed at the bottom of the second groove, and the cover plate is used to enclose the opening of the second groove. The gap between the cover plate and the first groove is used to transfer coolant to cool a first electrical component, and the gap between the cover plate and the second groove is used to transfer coolant to cool a second electrical component.

[0016] This application addresses the problem of improving the sealing performance and simplifying the structure of a heat dissipation device while balancing the cooling effects of a first electrical component and a second electrical component. This application utilizes a first groove and a second groove to transfer coolant for cooling the first and second electrical components respectively. The bottom of the first groove is closer to the circuit board than the bottom of the second groove, shortening the heat transfer path between the first electrical component and the coolant, thus preventing insufficient cooling of the first electrical component due to its smaller height. The first and second grooves are integrated into the base plate of the heat dissipation device, facilitating communication between them and reducing the flow resistance of the coolant. The openings of the first and second grooves face the same direction, and the wall of the second groove surrounds the opening of the first groove, allowing them to share the cover plate of the heat dissipation device, reducing the number of structural components. Utilizing the gap between the cover plate and the first and second grooves for coolant transfer reduces the number of sealing surfaces in the heat dissipation device, lowers the risk of coolant leakage, and improves cooling efficiency.

[0017] In one embodiment, the cover plate includes a through hole, and the base plate includes a two-section protrusion and an annular mounting surface. The annular mounting surface is distributed on the groove wall of the second groove, the two-section protrusion is distributed on the bottom of the second groove, and the annular mounting surface surrounds the two-section protrusion. The two-section protrusion includes a first protrusion and a second protrusion, the first protrusion being fixedly connected to the bottom of the second groove via the second protrusion. The annular mounting surface and the second protrusion have the same protruding dimension relative to the bottom of the second groove. The first protrusion is used to embed into the through hole, and the second protrusion and the annular mounting surface are used to abut against the cover plate.

[0018] This application addresses the problem of improving sealing performance when integrating a first groove and a second groove into a heat dissipation device. By connecting the two-section protrusion and annular mounting surface of the base plate to the cover plate, the cover plate achieves a seal between the first and second grooves. The annular mounting surface surrounds the two-section protrusion, and the annular mounting surface and the two-section protrusion are distributed at different positions on the base plate, allowing different parts of the base plate to connect to the cover plate, thus improving the connection strength between the cover plate and the base plate. Since the bottom of the first groove is recessed towards the circuit board relative to the bottom of the second groove, this application distributes the two-section protrusion at the bottom of the second groove, which helps to reduce the length of the two-section protrusion along the first direction and reduces the difficulty of connecting the cover plate to the two-section protrusion. The first section of the two-section protrusion connects to the through hole, and the second section of the two-section protrusion and the annular mounting surface together abut against the cover plate, increasing the contact area between the two-section protrusion and the base plate, and enhancing the sealing performance of the heat dissipation device.

[0019] In one embodiment, the base plate includes a first strip-shaped protrusion, and two-segment protrusions and the groove wall of a second groove are distributed on both sides of the opening of the first groove. One end of the second segment of the two-segment protrusion is connected to the groove wall of the second groove through the first strip-shaped protrusion, and the first strip-shaped protrusion is used to abut against the cover plate. The other end of the second segment of the two-segment protrusion forms a notch between itself and the groove wall of the second groove, and the notch is used to connect the gap between the cover plate and the first groove and the gap between the cover plate and the second groove.

[0020] This embodiment of the application solves the problem of guiding coolant flow using the second protrusion by adjusting the positional relationship between the second protrusion, the first strip protrusion, and the wall of the second groove. Besides abutting against the cover plate, one end of the second protrusion connects to the wall of the second groove via the first strip protrusion, while the other end forms a notch with the wall of the second groove. The first strip protrusion is adjacent to the opening of the first groove, allowing coolant to flow between the first and second grooves through the notch. The abutment between the first strip protrusion and the cover plate increases the contact area between the second groove and the cover plate, improving the connection strength.

[0021] In one embodiment, the base plate includes a plurality of second strip-shaped protrusions and a plurality of guide teeth. The plurality of second strip-shaped protrusions are distributed at intervals with the two-segment protrusions and the first strip-shaped protrusions at the bottom of the second groove. The plurality of second strip-shaped protrusions abut against the cover plate and separate the gap between the bottom of the second groove and the cover plate to form a plurality of coolant flow channels. The plurality of guide teeth are used to guide the flow direction of coolant in the plurality of coolant flow channels.

[0022] In this embodiment, multiple second strip-shaped protrusions are distributed at the bottom of the second groove, and these protrusions can adjust the distribution of coolant in the gap between the second groove and the cover plate. Two coolant channels are formed on both sides of one second strip-shaped protrusion. The multiple coolant channels a can avoid the problem of coolant being too concentrated or too dispersed, thus enhancing the cooling effect of the heat dissipation device on the second electrical components. Based on the multiple coolant channels formed by the multiple second strip-shaped protrusions, multiple guide teeth can turbulentize the coolant in each channel, enhancing the turbulence of the coolant.

[0023] In one embodiment, the heat dissipation device includes a filler, a cover plate for fixing the filler, a first groove for receiving the filler, and a gap between the filler and the first groove for transferring coolant.

[0024] This embodiment of the application solves the problem of controlling the flow rate of coolant in the first groove while simplifying the structure of the first groove and the cover plate by introducing a filler. The opening of the first groove is distributed at the bottom of the second groove, and the gap length between the cover plate and the first groove along the first direction is greater than the gap length between the cover plate and the second groove. If the length of the gap is not controlled, the flow rate difference of coolant in the first groove and the second groove can easily become too large, which is not conducive to balancing the cooling effect of the heat dissipation device on the first electrical component and the second electrical component, resulting in the problem of insufficient local cooling. This embodiment of the application distributes the filler between the cover plate and the first groove. Since the filler is a separate structure from the cover plate and the first groove, it can transform the gap between the cover plate and the first groove used for coolant transmission into the gap between the filler and the first groove, and can reduce the structural modifications to the first groove and the cover plate, avoiding the need to control the flow rate of coolant in the first groove by increasing the bottom of the first groove or the thickness of the cover plate.

[0025] In this embodiment, by introducing a filler, not only is the flow rate of the coolant in the gap between the cover plate and the first groove increased, but air bubbles in the gap between the cover plate and the first groove are also reduced. Since the thermal conductivity of air is lower than that of coolant, it is beneficial to enhance the heat exchange effect and prevent localized insufficient cooling.

[0026] In one embodiment, the filler is a groove-shaped structure, and the cover plate is used to fix the groove wall of the filler to enclose the groove of the filler.

[0027] This embodiment of the application, by designing the filler as a groove-shaped structure, can reduce the weight of the filler while controlling the coolant flow rate in the first groove and simplifying the structure of the first groove and the cover plate, thus contributing to the lightweight design of the vehicle power supply device. The cover plate is used to enclose the groove of the filler, which can reduce the amount of coolant flowing into the groove of the filler and improve the utilization rate of coolant.

[0028] In one embodiment, the first groove includes a first groove wall and a second groove wall, which are distributed opposite to each other on both sides of the filler. The base plate includes a liquid inlet channel for supplying coolant into the gap between the filler and the first groove; the liquid inlet channel is distributed on the first groove wall of the first groove. The gap between the second groove wall and the filler is used to supply coolant into the gap between the bottom of the second groove and the cover plate; the size of the gap between the second groove wall and the filler increases in the direction toward the cover plate.

[0029] In this embodiment, the inlet channel is used to deliver coolant to the gap between the filler and the first groove. The inlet channel is distributed along the wall of the first groove, allowing control of the dimensions of the heat dissipation device along a first direction and preventing it from encroaching on the contact area between the heat dissipation device and the first electrical component. The inlet channel is distributed along the first wall of the first groove, and the second wall of the first groove is used to deliver coolant into the gap between the second groove and the cover plate. The first and second walls are opposite each other, allowing the coolant to flow orderly through the first and second grooves, avoiding interference between the coolant received and output from the first groove. The coolant flowing into the gap between the second wall and the filler continues to flow towards the cover plate. By adjusting the distance between the second wall and the filler to increase in the direction towards the cover plate, it is beneficial to reduce the resistance of the coolant flowing from the first groove into the second groove and improve the coolant transmission efficiency.

[0030] In one embodiment, the filler includes a clearance structure for avoiding the liquid inlet channel. The distance between the clearance structure and the first tank wall is greater than the distance between the surface of the filler facing the first tank wall and the first tank wall.

[0031] In this embodiment, the coolant needs to come into contact with the filler when flowing from the inlet channel into the first groove. The filler includes a clearance structure. By increasing the gap between the clearance structure and the inlet channel, the clearance structure can serve as a buffer area for coolant transmission, reducing the resistance encountered by the coolant when flowing into the first groove through the inlet channel.

[0032] In one embodiment, the base plate includes a first flow guiding structure and a second flow guiding structure. The first flow guiding structure is distributed at the bottom of the first groove, and the second flow guiding structure is distributed on the second groove wall. The first flow guiding structure is used to separate the gap between the bottom of the first groove and the filler to form multiple coolant channels, and the second flow guiding structure is used to guide the coolant between the groove wall of the first groove and the filler into the gap between the second groove and the cover plate.

[0033] In this embodiment, a first flow guiding structure is distributed at the bottom of the first groove, and the first flow guiding structure can adjust the distribution of coolant in the gap between the first groove and the cover plate. The multiple coolant channels formed by the first flow guiding structure can avoid the problem of coolant being too concentrated or too dispersed, enhancing the cooling effect of the heat dissipation device on the first electrical component. There is a height difference between the bottom of the first groove and the bottom of the second groove. By setting a second flow guiding structure in the second groove, uneven coolant distribution between the filler and the second groove wall, which could lead to air bubbles, is avoided, thus improving the cooling efficiency of the heat dissipation device for the first and second electrical components.

[0034] Secondly, embodiments of this application provide a powertrain, which includes a drive motor, a reducer, and an on-board power supply device as described in any embodiment of the first aspect. The on-board power supply device is used to output DC power to charge the power battery of the electric vehicle and to output AC power to control the drive motor. The drive motor is used to drive the wheels of the electric vehicle through the reducer.

[0035] In the embodiments of this application, the vehicle power supply device in any embodiment of the first aspect is applied to the powertrain. The vehicle power supply device meets the heat dissipation requirements of electrical components of different sizes while improving the integration of the heat dissipation device, and the cooling effect is enhanced, which is conducive to improving the working efficiency of the powertrain.

[0036] Thirdly, embodiments of this application provide an electric vehicle, which includes wheels and a powertrain as described in the second aspect, the powertrain being used to drive the wheels of the electric vehicle.

[0037] In the embodiments of this application, the powertrain in any embodiment of the second aspect is applied to an electric vehicle. Since the size and cooling efficiency of the on-board power supply device of the powertrain are controlled, it is beneficial to increase cabin space, improve driving comfort, and improve work efficiency and range. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0039] Figure 1 This is a schematic diagram of an electric vehicle provided in an embodiment of this application; Figure 2 This is a schematic diagram of the powertrain and wheels provided in an embodiment of this application; Figure 3 This is a schematic diagram of the vehicle-mounted power supply device provided in the embodiments of this application; Figure 4 This is another schematic diagram of the vehicle-mounted power supply device provided in the embodiments of this application; Figure 5This is another schematic diagram of the vehicle-mounted power supply device provided in the embodiments of this application; Figure 6 This is a schematic diagram of the heat dissipation device provided in the embodiments of this application; Figure 7 This is an exploded view of the heat dissipation device provided in the embodiments of this application; Figure 8 This is a cross-sectional view of the heat dissipation device provided in the embodiments of this application; Figure 9 This is an exploded view of a portion of the structure of the heat dissipation device provided in the embodiments of this application; Figure 10 This is a cross-sectional view of the heat dissipation device provided in the embodiments of this application; Figure 11 yes Figure 7 A partial enlarged view of part M in the heat dissipation device shown; Figure 12 This is a schematic diagram of the heat dissipation device provided in the embodiments of this application. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0041] For ease of understanding, the relevant technical terms involved in the embodiments of this application will be explained and described below.

[0042] Parallelism: This can be understood as basically parallel, not limited to an absolutely parallel relationship. Non-absolute parallelism is permissible due to factors such as assembly tolerances, design tolerances, and structural flatness.

[0043] Perpendicular: This can be understood as basically perpendicular, not limited to an absolutely perpendicular intersection. Cases where the intersection is not absolutely perpendicular due to factors such as assembly tolerances, design tolerances, and structural flatness are permissible.

[0044] To improve the integration and cooling efficiency of the heat dissipation device in an on-board power supply device, this application provides an on-board power supply device. The housing of the on-board power supply device accommodates a heat dissipation device, a circuit board, a first electrical component, and a second electrical component. The heat dissipation device is arranged along a first direction between the circuit board and the housing, and is used for detachably fixing the housing. The circuit board is used for fixing the first electrical component and the second electrical component. The first electrical component is distributed between a first portion of the heat dissipation device and the circuit board, and the second electrical component is distributed between a second portion of the heat dissipation device and the circuit board.

[0045] In this configuration, the height by which the first electrical component protrudes from the circuit board along the first direction is less than the height by which the second electrical component protrudes from the circuit board, and the distance between the first part of the heat dissipation device and the circuit board along the first direction is less than the distance between the second part of the heat dissipation device and the circuit board. The first part of the heat dissipation device is used to transfer coolant to cool the first electrical component, and the second part of the heat dissipation device is used to transfer coolant to cool the second electrical component.

[0046] This application embodiment adjusts the distance between the first and second parts of the heat dissipation device and the circuit board based on the different heights at which the first and second electrical components protrude from the circuit board. The first and second parts are integrated as a single unit, which simplifies the structure and reduces the size of the heat dissipation device while avoiding uneven cooling of electrical components at different heights. This facilitates the miniaturization of the vehicle power supply device.

[0047] The vehicle power supply device provided in this application embodiment can be applied to powertrains and electric vehicles.

[0048] Please see Figure 1 , Figure 1 This is a schematic diagram of the electric vehicle 1 provided in an embodiment of this application.

[0049] The electric vehicle 1 in this embodiment includes a powertrain 10, a power battery 20, wheels 30 and a frame 40. The frame 40 is used to fix the powertrain 10 and the power battery 20, and the power battery 20 is used to supply power to the powertrain 10.

[0050] In this embodiment, electric vehicle 1 refers to a wheeled device driven or towed by a power unit. The frame 40 is the structural skeleton of electric vehicle 1, capable of bearing the loads from the internal and external environments. The powertrain 10 is the power source for electric vehicle 1, and is used to drive the wheels 30 of electric vehicle 1.

[0051] It should be noted that, Figure 1 The electric vehicle 1 is shown schematically only, including the powertrain 10, power battery 20, wheels 30 and frame 40, and does not represent the specific structure, size and positional relationship of the powertrain 10, power battery 20, wheels 30 and frame 40.

[0052] Please see Figure 2 , Figure 2 This is a schematic diagram of the powertrain 10 and wheels 30 provided in the embodiments of this application.

[0053] The powertrain 10 of this embodiment includes an on-board power supply 11, a drive motor 12, and a reducer 13. The on-board power supply 11 is electrically connected to the drive motor 12. The on-board power supply 11 is used to receive high-voltage direct current (DC) power from the power battery and convert the DC power into high-voltage alternating current (AC) power to be supplied to the drive motor 12. In one embodiment, the on-board power supply 11 is used to receive power from an external power source and to charge the power battery.

[0054] The drive motor 12 is used to convert electrical energy into mechanical energy to generate driving torque. The reducer 13 is connected to the drive motor 12 in a transmission manner, and the reducer 13 is used to receive the power output by the drive motor 12 and drive the wheel 30 to rotate.

[0055] Figure 2 The powertrain 10 is shown schematically only, including the on-board power supply unit 11, drive motor 12 and reducer 13, and does not represent the specific structure, size and positional relationship of the on-board power supply unit 11, drive motor 12, reducer 13 and wheels 30.

[0056] In one embodiment, the on-board power supply device 11 includes at least one of an on-board charger, a motor controller, a DC-DC converter, an energy storage converter, and a power distribution device.

[0057] The English name for an on-board charger is On. On-board charger (OBC) is used to convert alternating current (AC) from the power grid into direct current (DC), or to directly transmit DC power to charge the battery or supply power to the vehicle's loads.

[0058] The full name of a motor controller is Motor Control Unit, abbreviated as MCU. A motor controller receives direct current (DC) from the power battery and converts it into alternating current (AC) to drive the motor.

[0059] The English name for a DC converter is DC. to DC Converter, abbreviated as DCDC, is used to convert direct current (DC) at one voltage level to DC at another voltage level.

[0060] The English name for an energy storage converter is Power Conversion System, abbreviated as PCS. Energy storage converters are used to control the charging and discharging process of power batteries, performing AC-DC conversion, and can directly supply power to AC loads in the absence of a power grid.

[0061] The English name for a power distribution unit is Power Distribution Unit, abbreviated as PDU. It can also be called a high-voltage distribution box. The power distribution unit is responsible for the power distribution and management in the high-voltage system of an electric vehicle, providing functions such as charging and discharging control, high-voltage component power-on control, circuit overload and short-circuit protection, high-voltage sampling, and low-voltage control, thus protecting the operation of the high-voltage system.

[0062] During the operation of the vehicle power supply device 11, the electrical components of the vehicle power supply device 11 generate heat. To ensure the normal operation of the vehicle power supply device 11, cooling and heat dissipation of the electrical components are necessary. In one embodiment, the electrical components perform at least one of the following functions: filtering, energy storage, voltage transformation, rectification, and inversion. In another embodiment, the electrical components include at least one of the following: capacitor, inductor, transformer, power transistor, and fuse.

[0063] The vehicle-mounted power supply device 11 of the present application embodiment is described in detail below.

[0064] Please see Figure 3 , Figure 3 This is a schematic diagram of an on-board power supply device 11 provided in an embodiment of this application. The housing 600 of the on-board power supply device 11 in this embodiment of the application is used to accommodate a heat dissipation device 100, a circuit board 200, a first electrical component 300a, and a second electrical component 300b. The heat dissipation device 100 is arranged along a first direction A between the circuit board 200 and the housing 600. The circuit board 200 is used to fixably connect the first electrical component 300a and the second electrical component 300b. The first electrical component 300a is distributed between a first portion 100a of the heat dissipation device 100 and the circuit board 200, and the second electrical component 300b is distributed between a second portion 100b of the heat dissipation device 100 and the circuit board 200.

[0065] Wherein, the height by which the first electrical component 300a protrudes from the circuit board 200 along the first direction A is less than the height by which the second electrical component 300b protrudes from the circuit board 200, and the distance between the first portion 100a of the heat dissipation device 100 and the circuit board 200 along the first direction A is less than the distance between the second portion 100b of the heat dissipation device 100 and the circuit board 200. The first portion 100a of the heat dissipation device 100 is used to transfer coolant to cool the first electrical component 300a, and the second portion 100b of the heat dissipation device 100 is used to transfer coolant to cool the second electrical component 300b.

[0066] In this embodiment, the first electrical component 300a and the second electrical component 300b share a circuit board 200, and the heights at which the first electrical component 300a and the second electrical component 300b protrude from the circuit board 200 are not equal. When using a heat dissipation device 100 to cool the first electrical component 300a and the second electrical component 300b, it is necessary to consider how to balance cooling efficiency and integration of the heat dissipation device 100.

[0067] In this embodiment, the first portion 100a of the heat dissipation device 100 is opposite to the first electrical component 300a, and the second portion 100b of the heat dissipation device 100 is opposite to the second electrical component 300b. Based on the height relationship between the first electrical component 300a and the second electrical component 300b, the distance between the first portion 100a of the heat dissipation device 100 and the circuit board 200 is adjusted to be smaller than the distance between the second portion 100b of the heat dissipation device 100 and the circuit board 200. By utilizing the first portion 100a and the second portion 100b of the heat dissipation device 100 to transfer coolant, the difference in the heat transfer path between the first electrical component 300a and the second electrical component 300b and the coolant can be shortened, reducing the amount of heat transfer from the first electrical component 300a to the coolant via air, and improving cooling efficiency.

[0068] Since the first part 100a and the second part 100b of the heat dissipation device 100 are integrated into one unit, compared to using two separate heat dissipation devices 100 to cool the first electrical component 300a and the second electrical component 300b respectively, the embodiments of this application can reduce the structural complexity and installation difficulty of the heat dissipation device 100 while avoiding uneven cooling of electrical components with different heights. This facilitates the flow of coolant between the first part 100a and the second part 100b and reduces the space occupied by the heat dissipation device 100 in the first direction A. The heat dissipation device 100 and the housing 600 are separate structures, eliminating the need to directly integrate the first part 100a and the second part 100b of the heat dissipation device 100 into the housing 600, which helps reduce the design and manufacturing difficulty of the housing 600. When the on-board power supply device 11 is applied to electric vehicles, the controlled size and cooling efficiency of the on-board power supply device 11 helps to increase cabin space, improve driving comfort, and enhance work efficiency and range.

[0069] In one embodiment, the heat dissipation device 100 is used to detachably secure at least one of the housing 600 and the circuit board 200.

[0070] In one embodiment, the coolant may be cooling water.

[0071] In one embodiment, the first direction A may be the height direction of the vehicle-mounted power supply device 11. In another embodiment, the first direction A may be the direction of gravity.

[0072] Please see Figure 4 and Figure 5 , Figure 4 This is another schematic diagram of the vehicle-mounted power supply device 11 provided in the embodiments of this application. Figure 5 This is another schematic diagram of the vehicle power supply device 11 provided in an embodiment of this application. In one embodiment, if only the size relationship between the first part 100a and the second part 100b of the heat dissipation device 100 and the circuit board 200 is considered, the heat dissipation device 100 can also be designed as follows: Figure 4 and Figure 5 The structure shown.

[0073] Please see Figure 3 In one embodiment, the on-board power supply device 11 includes an on-board charger 400 and a motor controller 500. The on-board charger 400 outputs DC power to charge the power battery of the electric vehicle, and the motor controller 500 outputs AC power to control the drive motor. The on-board charger 400 includes a first electrical component 300a, and the motor controller 500 includes a second electrical component 300b. A first portion 100a of the heat dissipation device 100 is used to transfer coolant to the second portion 100b of the heat dissipation device 100.

[0074] In this embodiment, the first electrical component 300a belongs to the on-board charger 400, and the second electrical component 300b belongs to the motor controller 500. A heat dissipation device 100 is used to cool the first electrical component 300a and the second electrical component 300b. Since the distances between the first part 100a and the second part 100b of the heat dissipation device 100 and the circuit board 200 are different, it can be adapted to the height relationship between the first electrical component 300a and the second electrical component 300b. The heat generated by the on-board charger 400 is generally less than that of the motor controller 500, and the temperature rise after the coolant exchanges heat with the first electrical component 300a alone is less than the temperature rise after the coolant exchanges heat with the second electrical component 300b alone. In this embodiment, by adjusting the transfer of coolant from the first part 100a to the second part 100b, the coolant sequentially exchanges heat with the first electrical component 300a and the second electrical component 300b. This embodiment of the application, while avoiding localized overheating of the on-board charger 400 and the motor controller 500, reduces the difficulty of sharing the circuit board 200 between the first electrical component 300a of the on-board charger 400 and the second electrical component 300b of the motor controller 500. This facilitates a single-board design for the on-board charger 400 and the motor controller 500, balancing the cooling efficiency and volume control of the on-board power supply device 11 within a limited space. The first part 100a and the second part 100b of the heat dissipation device 100 are an integral structure. The first part 100a and the second part 100b of the heat dissipation device 100 can share the inlet channel 118a and the outlet channel 118b of the heat dissipation device 100, facilitating the adjustment of the flow sequence of coolant in the first part 100a and the second part 100b of the heat dissipation device 100.

[0075] In one embodiment, the first electrical component 300a and the second electrical component 300b may belong to any two different devices among the on-board charger 400, motor controller 500, DC converter, energy storage converter and power distribution device, as long as the height of the first electrical component 300a protruding relative to the circuit board 200 along the first direction A is less than the height of the second electrical component 300b protruding relative to the circuit board 200 along the first direction A. The order in which the coolant flows in the first part 100a and the second part 100b of the heat dissipation device 100 can be adjusted according to the heat generation of the first electrical component 300a and the second electrical component 300b.

[0076] Please see Figure 3 In one embodiment, the first portion 100a of the heat sink 100 protrudes at a height relative to the second portion 100b of the heat sink 100, with a first dimension L1. The side of the first portion 100a of the heat sink 100 facing away from the circuit board 200 is recessed at a depth relative to the second portion 100b of the heat sink 100, with a second dimension L2. The first dimension L1 is greater than the second dimension L2.

[0077] In this embodiment, the first portion 100a of the heat dissipation device 100 protrudes from the side facing the circuit board 200 relative to the second portion 100b of the heat dissipation device 100, while the side facing away from the circuit board 200 of the first portion 100a is recessed relative to the second portion 100b of the heat dissipation device 100. The first dimension L1 is larger than the second dimension L2, indicating that the first portion 100a of the heat dissipation device 100 shortens the distance between itself and the circuit board 200 by protruding towards it. The first portion 100a of the heat dissipation device 100 utilizes the space left by the relatively small height of the first electrical component 300a. By shortening the heat transfer path between the coolant and the first electrical component 300a, a compact arrangement of the heat dissipation device 100, the first electrical component 300a, and the second electrical component 300b is achieved, improving the utilization rate of the internal space of the vehicle power supply device 11 and facilitating the adaptation of the vehicle power supply device 11 to miniaturization design requirements.

[0078] In one embodiment, a first portion 100a of the heat dissipation device 100, facing the side of the circuit board 200, is used to support a first electrical component 300a. A second portion 100b of the heat dissipation device 100, facing the side of the circuit board 200, is used to support a second electrical component 300b.

[0079] Please see Figure 3 and Figure 6 , Figure 6 This is a schematic diagram of the heat dissipation device 100 provided in an embodiment of this application. In one embodiment, such as... Figure 6 As shown, the third part 100c of the heat dissipation device 100 surrounds the first part 100a and the second part 100b of the heat dissipation device 100. Figure 3 As shown, the distance between the third portion 100c of the heat dissipation device 100 and the circuit board 200 along the first direction A is smaller than the distance between the first portion 100a of the heat dissipation device 100 and the circuit board 200. Figure 3 and Figure 6 As shown, the second portion 100b of the heat dissipation device 100 is recessed relative to the third portion 100c and the first portion 100a of the heat dissipation device 100 to form a receiving groove 100d. Figure 3 As shown, the receiving slot 100d is used to receive the second electrical component 300b.

[0080] This application embodiment solves the problem of how to accommodate a second electrical component 300b within a limited space using a heat dissipation device 100. By integrating a third part 100c into the heat dissipation device 100, the positional and height relationships between the first part 100a, the second part 100b, and the third part 100c of the heat dissipation device 100 are adjusted. This allows the heat dissipation device 100 to not only balance the cooling effect of the first electrical component 300a and the second electrical component 300b, but also to form a receiving groove 100d with the first part 100a, the second part 100b, and the third part 100c. The receiving groove 100d protects and isolates the second electrical component 300b, improving the working efficiency of the vehicle power supply device 11. The third part 100c of the heat dissipation device 100 is an integral structure with the first part 100a and the second part 100b, which helps reduce the number of structural components in the vehicle power supply device 11.

[0081] Please see Figure 3 and Figure 7 , Figure 7 This is an exploded view of the heat dissipation device 100 provided in an embodiment of this application. In one embodiment, as shown... Figure 3 and Figure 7 As shown, the heat dissipation device 100 includes a base plate 110 and a cover plate 120. The base plate 110 includes a first groove 111 and a second groove 112. Figure 3 As shown, the first groove 111 and the second groove 112 are distributed on the side of the base plate 110 facing away from the circuit board 200, and the openings of the first groove 111 and the second groove 112 face away from the circuit board 200 along the first direction A. Figure 7 As shown, the opening of the first groove 111 is distributed at the bottom of the second groove 112, and the cover plate 120 is used to enclose the opening of the second groove 112. Figure 3 As shown, the gap between the cover plate 120 and the first groove 111 is used to transfer coolant to cool the first electrical component 300a, and the gap between the cover plate 120 and the second groove 112 is used to transfer coolant to cool the second electrical component 300b.

[0082] This application embodiment addresses the problem of improving the sealing performance and simplifying the structure of the heat dissipation device 100 while balancing the cooling effects of the first electrical component 300a and the second electrical component 300b. This application embodiment utilizes a first groove 111 and a second groove 112 to transfer coolant and cool the first electrical component 300a and the second electrical component 300b respectively. The bottom of the first groove 111 is closer to the circuit board 200 than the bottom of the second groove 112, which shortens the heat transfer path between the first electrical component 300a and the coolant, preventing insufficient cooling of the first electrical component 300a due to its smaller height. The first groove 111 and the second groove 112 are integrated into the base plate 110 of the heat dissipation device 100, facilitating communication between the first groove 111 and the second groove 112 and reducing the flow resistance of the coolant in the heat dissipation device 100. The openings of the first groove 111 and the second groove 112 face the same direction. The wall of the second groove 112 surrounds the opening of the first groove 111, allowing the first groove 111 and the second groove 112 to share the cover plate 120 of the heat dissipation device 100, thus reducing the number of structural components of the heat dissipation device 100. By utilizing the gap between the cover plate 120 and the first groove 111 and the second groove 112 to transfer coolant, the number of sealing surfaces of the heat dissipation device 100 can be reduced, the risk of coolant leakage can be lowered, and the cooling efficiency can be improved.

[0083] In one embodiment, the first groove 111 belongs to the first part 100a of the heat dissipation device 100, and the second groove 112 belongs to the second part 100b of the heat dissipation device 100.

[0084] Please see Figure 7 In one embodiment, the cover plate 120 includes a through hole 121, and the base plate 110 includes a two-section protrusion 113 and an annular mounting surface 114. The annular mounting surface 114 is distributed on the groove wall of the second groove 112, and the two-section protrusion 113 is distributed on the groove bottom of the second groove 112, with the annular mounting surface 114 surrounding the two-section protrusion 113. The two-section protrusion 113 includes a first protrusion 113a and a second protrusion 113b, with the first protrusion 113a fixedly connected to the groove bottom of the second groove 112 via the second protrusion 113b. The annular mounting surface 114 and the second protrusion 113b protrude at the same size relative to the groove bottom of the second groove 112. The first protrusion 113a is used to embed into the through hole 121, and the second protrusion 113b and the annular mounting surface 114 are used to abut against the cover plate 120.

[0085] This application embodiment solves the problem of improving sealing performance when the heat dissipation device 100 integrates the first groove 111 and the second groove 112. By connecting the two-section protrusion 113 and the annular mounting surface 114 of the base plate 110 to the cover plate 120, the cover plate 120 achieves sealing of the first groove 111 and the second groove 112. The annular mounting surface 114 surrounds the two-section protrusion 113, and the annular mounting surface 114 and the two-section protrusion 113 are distributed at different positions of the base plate 110, which can realize the connection between different parts of the base plate 110 and the cover plate 120, thereby improving the connection strength between the cover plate 120 and the base plate 110. Since the bottom of the first groove 111 is recessed towards the circuit board 200 relative to the bottom of the second groove 112, this application embodiment distributes the two-section protrusion 113 at the bottom of the second groove 112, which helps to reduce the length of the two-section protrusion 113 along the first direction A and reduces the difficulty of connecting the cover plate 120 and the two-section protrusion 113. The first protrusion 113a of the two-section protrusion 113 is connected to the through hole 121, and the second protrusion 113b of the two-section protrusion 113 and the annular mounting surface 114 together abut against the cover plate 120, increasing the contact area between the two-section protrusion 113 and the base plate 110 and enhancing the sealing performance of the heat dissipation device 100.

[0086] Please see Figure 7 In one embodiment, the base plate 110 includes a first strip-shaped protrusion 115a, and two-section protrusions 113b and the groove walls of the second groove 112 are distributed on both sides of the opening of the first groove 111. One end of the second protrusion 113b is connected to the groove wall of the second groove 112 through the first strip-shaped protrusion 115a, and the first strip-shaped protrusion 115a is used to abut against the cover plate 120. The other end of the second protrusion 113b forms a notch 1121 between itself and the groove wall of the second groove 112, and the notch 1121 is used to connect the gap between the cover plate 120 and the first groove 111 with the gap between the cover plate 120 and the second groove 112.

[0087] This embodiment of the application solves the problem of guiding coolant flow using the second protrusion 113b by adjusting the positional relationship between the second protrusion 113b, the first strip protrusion 115a, and the groove wall of the second groove 112. Besides abutting against the cover plate 120, one end of the second protrusion 113b can connect to the groove wall of the second groove 112 via the first strip protrusion 115a, while the other end forms a notch 1121 with the groove wall of the second groove 112. The first strip protrusion 115a is adjacent to the opening of the first groove 111, allowing coolant to flow between the first groove 111 and the second groove 112 through the notch 1121. The abutment between the first strip protrusion 115a and the cover plate 120 increases the contact area between the second groove 112 and the cover plate 120, thus improving the connection strength.

[0088] Please see Figure 7In one embodiment, the base plate 110 includes a plurality of second strip-shaped protrusions 115b and a plurality of guide teeth 116. The plurality of second strip-shaped protrusions 115b are distributed at intervals with the two-segment protrusions 113 and the first strip-shaped protrusions 115a at the bottom of the second groove 112. The plurality of second strip-shaped protrusions 115b are used to abut against the cover plate 120 and to separate the gap between the bottom of the second groove 112 and the cover plate 120 to form a plurality of coolant flow channels 117a. The plurality of guide teeth 116 are used to guide the flow direction of coolant in the plurality of coolant flow channels 117a.

[0089] In this embodiment, multiple second strip-shaped protrusions 115b are distributed at the bottom of the second groove 112. These protrusions adjust the distribution of coolant in the gap between the second groove 112 and the cover plate 120. Two coolant channels 117a are formed on both sides of one of the second strip-shaped protrusions 115b. These multiple channels prevent the coolant from being too concentrated or too dispersed, enhancing the cooling effect of the heat dissipation device 100 on the second electrical component 300b. Based on the multiple coolant channels 117a formed by the multiple second strip-shaped protrusions 115b, multiple guide teeth 116 turbulentize the coolant in each channel 117a, increasing the turbulence of the coolant.

[0090] Please see Figure 3 and Figure 7 In one embodiment, the heat dissipation device 100 includes a filler 130, a cover plate 120 for fixing the filler 130, a first groove 111 for receiving the filler 130, and a gap between the filler 130 and the first groove 111 for transferring coolant.

[0091] This embodiment of the application solves the problem of controlling the flow rate of coolant in the first groove 111 by introducing a filler 130, while simplifying the structure of the first groove 111 and the cover plate 120. The opening of the first groove 111 is distributed at the bottom of the second groove 112, and the gap length between the cover plate 120 and the first groove 111 along the first direction A is greater than the gap length between the cover plate 120 and the second groove 112. If the length of the gap is not controlled, the flow rate difference of coolant in the first groove 111 and the second groove 112 may be too large, which is not conducive to balancing the cooling effect of the heat dissipation device 100 on the first electrical component 300a and the second electrical component 300b, resulting in the problem of insufficient local cooling. In this embodiment, the filler 130 is distributed between the cover plate 120 and the first groove 111. Since the filler 130 is a separate structure from the cover plate 120 and the first groove 111, it can transform the gap between the cover plate 120 and the first groove 111 used for transmitting coolant into the gap between the filler 130 and the first groove 111. It can also reduce the structural modifications to the first groove 111 and the cover plate 120, and avoid controlling the coolant flow rate in the first groove 111 by increasing the bottom of the first groove 111 or the thickness of the cover plate 120.

[0092] In this embodiment, by introducing the filler 130, not only is the flow rate of the coolant in the cover plate 120 and the first groove 111 increased, but the coolant distribution between the cover plate 120 and the first groove 111 is also reduced to achieve a more uniform distribution, thus preventing air bubbles. Since the thermal conductivity of air is lower than that of coolant, this is beneficial for enhancing heat exchange and preventing localized insufficient cooling.

[0093] In another embodiment, the filler 130 may also be spaced apart from the cover plate 120, and the filler 130 is fixedly connected to a portion of the groove wall of the first groove 111. The distance between the filler 130 and the cover plate 120 along the first direction A is less than the distance between the filler 130 and the bottom of the first groove 111.

[0094] Please see Figure 3 In one embodiment, the length of the gap between the second groove 112 and the cover plate 120 along the first direction A is less than the length of the filler 130.

[0095] In this embodiment, if the gap between the second groove 112 and the cover plate 120 is too large, it can easily lead to an excessive coolant flow rate in the second groove 112, resulting in uneven coolant flow rates in the first groove 111 and the second groove 112. This embodiment uses the length of the filler 130 along the first direction A as a reference to control the distance between the second groove 112 and the cover plate 120, which helps to avoid uneven cooling caused by excessive flow rate differences.

[0096] Please see Figure 7 and Figure 8 , Figure 8 This is a cross-sectional view of the heat dissipation device 100 provided in an embodiment of this application. In one embodiment, the filler 130 has a groove-shaped structure, and the cover plate 120 is used to fix and connect the groove wall of the filler 130 to enclose the groove opening of the filler 130.

[0097] In this embodiment, by designing the filler 130 as a groove-shaped structure, the weight of the filler 130 can be reduced while controlling the coolant flow rate in the first groove 111 and simplifying the structure of the first groove 111 and the cover plate 120. This contributes to the lightweight design of the vehicle power supply device 11. The cover plate 120 is used to enclose the groove of the filler 130, which can reduce the amount of coolant flowing into the groove of the filler 130 and improve the utilization rate of the coolant.

[0098] In one embodiment, the filler 130 may be made of metal or plastic.

[0099] In one embodiment, the cover plate 120 and the filler 130 can be fixed by any one of brazing, friction stir welding, diffusion welding or screw fastening.

[0100] Please see Figure 7 and Figure 8 In one embodiment, such as Figure 7 As shown, the first groove 111 includes a first groove wall 1101 and a second groove wall 1102, which are distributed opposite to each other on both sides of the filler 130. Figure 7 As shown, the base plate 110 includes a liquid inlet channel 118a, which is used to deliver coolant into the gap between the filler 130 and the first groove 111. The liquid inlet channel 118a is distributed on the first groove wall 1101 of the first groove 111. Figure 8 As shown, the gap between the second groove wall 1102 and the filler 130 is used to deliver coolant to the gap between the bottom of the second groove 112 and the cover plate 120, and the size of the gap between the second groove wall 1102 and the filler 130 increases in the direction toward the cover plate 120.

[0101] In this embodiment, the inlet channel 118a is used to deliver coolant to the gap between the filler 130 and the first groove 111. The inlet channel 118a is distributed along the wall of the first groove 111, controlling the size of the heat dissipation device 100 along the first direction A and preventing it from encroaching on the contact area between the heat dissipation device 100 and the first electrical component 300a. The inlet channel 118a is distributed along the first wall 1101 of the first groove 111, and the second wall 1102 of the first groove 111 is used to deliver coolant into the gap between the second groove 112 and the cover plate 120. The first wall 1101 and the second wall 1102 are opposite each other, allowing the coolant to flow orderly through the first groove 111 and the second groove 112, avoiding mutual interference between the coolant received and output by the first groove 111. The coolant flowing into the gap between the second groove wall 1102 and the filler 130 continues to flow toward the cover plate 120. By adjusting the distance between the second groove wall 1102 and the filler 130 to increase in the direction toward the cover plate 120, it is beneficial to reduce the resistance of the coolant flowing from the first groove 111 into the second groove 112 and improve the transmission efficiency of the coolant.

[0102] In one embodiment, the distance between the filler 130 and the bottom of the first groove 111, the average distance between the filler 130 and the second groove wall 1102, and the distance between the cover plate 120 and the second groove 112 decrease or increase sequentially. In this embodiment, the coolant flows sequentially through the distance between the filler 130 and the bottom of the first groove 111, the distance between the filler 130 and the second groove wall 1102, and the distance between the cover plate 120 and the second groove 112. This embodiment adjusts the variation trend of the three distances according to the flow direction of the coolant to avoid repeated changes in the size of different gaps through which the coolant flows, thereby reducing the flow resistance of the coolant.

[0103] like Figure 8 As shown, in one embodiment, the angle α between the second groove wall 1102 and the bottom of the first groove 111 is less than or equal to 130 degrees. In this embodiment, with the groove depth of the first groove 111 along the first direction A remaining constant, controlling the angle between the second groove wall 1102 and the bottom of the first groove 111 facilitates shortening the flow path of the coolant between the first groove 111 and the second groove 112, thereby improving cooling efficiency. Furthermore, an angle α between the second groove wall 1102 and the bottom of the second groove 112 being less than or equal to 130 degrees also helps control the size occupied by the heat dissipation device 100 in other directions, reducing the layout difficulty of the heat dissipation device 100 in the vehicle power supply device 11 and reducing the volume of the vehicle power supply device 11. In one embodiment, the angle α between the second groove wall 1102 and the bottom of the first groove 111 is less than or equal to 110 degrees.

[0104] like Figure 6 and Figure 7As shown, in one embodiment, the base plate 110 includes a coolant outlet channel 118b, which is used to supply coolant to the heat exchanger of the powertrain. The heat exchanger uses the coolant to reduce the temperature of the cooling oil and then outputs cooling oil to cool the drive motor or lubricate the reducer. The coolant outlet channel 118b is distributed at the bottom of the second groove 112, and the opening of the coolant outlet channel 118b faces away from the cover plate 120.

[0105] Please see Figure 9 and Figure 10 , Figure 9 This is an exploded view of a portion of the structure of the heat dissipation device 100 provided in the embodiments of this application. Figure 10 This is a cross-sectional view of the heat dissipation device 100 provided in an embodiment of this application. In one embodiment, such as... Figure 9 and Figure 10 As shown, the filler 130 includes a clearance structure 131 for clearing the liquid inlet channel 118a. Figure 10 As shown, the distance between the clearance structure 131 and the first groove wall 1101 is greater than the distance between the surface of the filler 130 facing the first groove wall 1101 and the first groove wall 1101.

[0106] In this embodiment, the coolant flowing from the inlet channel 118a into the first groove 111 needs to come into contact with the filler 130. The filler 130 includes a clearance structure 131. By increasing the gap between the clearance structure 131 and the inlet channel 118a, the clearance structure 131 can serve as a buffer area for coolant transmission, reducing the resistance encountered by the coolant as it flows into the first groove 111 through the inlet channel 118a.

[0107] Please see Figure 7 and Figure 11 , Figure 11 yes Figure 7 A partially enlarged view of portion M of the heat dissipation device 100 shown. In one embodiment, as... Figure 11 As shown, the base plate 110 includes a first flow guiding structure 119a and a second flow guiding structure 119b. The first flow guiding structure 119a is distributed at the bottom of the first groove 111, and the second flow guiding structure 119b is distributed on the second groove wall 1102. Figure 7 and Figure 11 As shown, the first flow guiding structure 119a is used to separate the gap between the bottom of the first groove 111 and the filler 130 to form a plurality of coolant flow channels 117b, and the second flow guiding structure 119b is used to guide the coolant between the groove wall of the first groove 111 and the filler 130 into the gap between the second groove 112 and the cover plate 120.

[0108] In this embodiment, the first flow guiding structure 119a is distributed between the bottom of the first groove 111 and the filler 130. The first flow guiding structure 119a can adjust the distribution of coolant in the gap between the bottom of the first groove 111 and the filler 130. The multiple coolant channels 117b formed by the first flow guiding structure 119a can avoid the problem of coolant being too concentrated or too dispersed, and enhance the cooling effect of the heat dissipation device 100 on the first electrical component 300a. There is a height difference between the bottom of the first groove 111 and the bottom of the second groove 112. By setting the second flow guiding structure 119b in the second groove 112, uneven distribution of coolant between the filler 130 and the second groove wall 1102, air bubbles are avoided, which is beneficial to improving the cooling efficiency of the heat dissipation device 100 on the first electrical component 300a and the second electrical component 300b.

[0109] In one embodiment, the length of the first flow guiding structure 119a along the first direction A is less than the length of the filler 130. In this embodiment, the length of the first flow guiding structure 119a along the first direction A can represent the minimum distance between the filler 130 and the bottom of the first groove 111. By adjusting the length of the first flow guiding structure 119a along the first direction A, the filler 130 can better control the flow rate of the coolant in the first groove 111.

[0110] In one embodiment, the base plate 110 includes a plurality of second flow guiding structures 119b, the extension direction of each second flow guiding structure 119b being parallel to the extension direction of the second groove wall 1102, and the arrangement direction of the plurality of second flow guiding structures 119b intersecting the extension direction of the second groove wall 1102.

[0111] The number of first grooves 111 in the heat dissipation device 100 of this application embodiment is not limited to one. Please refer to... Figure 12 , Figure 12 This is a schematic diagram of a heat dissipation device 100 provided in an embodiment of this application. In one embodiment, the base plate 110 may include a plurality of first grooves 111, each first groove 111 being used to accommodate a filler, and the gap between each first groove 111 and a filler being used to connect the gap between the second groove 112 and the cover plate.

[0112] In this embodiment, the number of first grooves 111 can be increased and the relative positions of the first grooves 111 and the second grooves 112 can be adjusted according to the arrangement characteristics and heat dissipation requirements of multiple electrical components. The length of the first electrical component 300a cooled by each first groove 111 along the first direction A is less than the length of the second electrical component 300b cooled by the second groove 112 along the first direction A. Each first groove 111 can be used to shorten the heat transfer path between the heat dissipation device 100 and some smaller electrical components, reducing the risk of local overheating of the vehicle power supply device 11.

[0113] like Figure 12 As shown, in one embodiment, the base plate 110 includes a partition 1122, which is distributed at the bottom of the second groove 112 and serves to separate the openings of the two first grooves 111. In this embodiment, the two first grooves 111 are distributed on both sides of the partition 1122, which can reduce the back-and-forth flow of coolant between adjacent first grooves 111. The partition 1122 can guide the coolant into the second groove 112, making the cooling effect of the coolant on different electrical components more balanced.

[0114] It should be noted that, Figure 3 , Figure 4 , Figure 5 and Figure 12 This is merely a simplified view of the heat dissipation device 100 according to an embodiment of this application.

[0115] The on-board power supply device, powertrain, and electric vehicle provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and embodiments of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in specific embodiments and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A vehicle-mounted power supply device, characterized in that, The housing of the vehicle-mounted power supply device is used to accommodate a heat dissipation device, a circuit board, a first electrical component, and a second electrical component. The heat dissipation device is arranged along a first direction between the circuit board and the housing. The circuit board is used to fixably connect the first electrical component and the second electrical component. The first electrical component is distributed between a first portion of the heat dissipation device and the circuit board, and the second electrical component is distributed between a second portion of the heat dissipation device and the circuit board, wherein: Along the first direction, the height by which the first electrical component protrudes from the circuit board is less than the height by which the second electrical component protrudes from the circuit board. Along the first direction, the distance between the first part of the heat dissipation device and the circuit board is less than the distance between the second part of the heat dissipation device and the circuit board. The first part of the heat dissipation device is used to transfer coolant to cool the first electrical component, and the second part of the heat dissipation device is used to transfer coolant to cool the second electrical component.

2. The vehicle-mounted power supply device according to claim 1, characterized in that, The on-board power supply device includes an on-board charger and a motor controller. The on-board charger is used to output DC power to charge the power battery of the electric vehicle, and the motor controller is used to output AC power to control the drive motor. The on-board charger includes the first electrical component, and the motor controller includes the second electrical component. The first part of the heat dissipation device is used to transfer coolant to the second part of the heat dissipation device.

3. The vehicle-mounted power supply device according to any one of claims 1-2, characterized in that, The height by which the first part of the heat dissipation device protrudes from the side of the circuit board relative to the second part of the heat dissipation device is a first dimension, and the depth by which the first part of the heat dissipation device is recessed from the side of the circuit board relative to the second part of the heat dissipation device is a second dimension, wherein the first dimension is greater than the second dimension.

4. The vehicle-mounted power supply device according to any one of claims 1-3, characterized in that, The third part of the heat dissipation device surrounds the first part and the second part of the heat dissipation device. The distance between the third part of the heat dissipation device and the circuit board along the first direction is smaller than the distance between the first part of the heat dissipation device and the circuit board. The second part of the heat dissipation device is recessed relative to the third part and the first part of the heat dissipation device to form a receiving groove, which is used to receive the second electrical component.

5. The vehicle-mounted power supply device according to any one of claims 1-4, characterized in that, The heat dissipation device includes a base plate and a cover plate. The base plate includes a first groove and a second groove, which are distributed on the side of the base plate facing away from the circuit board. The openings of the first groove and the second groove face away from the circuit board along the first direction. The opening of the first groove is distributed at the bottom of the second groove. The cover plate is used to enclose the opening of the second groove. The gap between the cover plate and the first groove is used to transfer coolant to cool the first electrical component. The gap between the cover plate and the second groove is used to transfer coolant to cool the second electrical component.

6. The vehicle-mounted power supply device according to claim 5, characterized in that, The cover plate includes a through hole, and the base plate includes a two-section protrusion and an annular mounting surface. The annular mounting surface is distributed on the groove wall of the second groove, and the two-section protrusion is distributed on the bottom of the second groove. The annular mounting surface surrounds the two-section protrusion, which includes a first protrusion and a second protrusion. The first protrusion is fixedly connected to the bottom of the second groove through the second protrusion. The annular mounting surface and the second protrusion have the same protruding size relative to the bottom of the second groove. The first protrusion is used to embed into the through hole, and the second protrusion and the annular mounting surface are used to abut against the cover plate.

7. The vehicle-mounted power supply device according to claim 6, characterized in that, The base plate includes a first strip-shaped protrusion. The two-segment protrusion and the groove wall of the second groove are distributed on both sides of the groove opening of the first groove. One end of the second segment of the two-segment protrusion is connected to the groove wall of the second groove through the first strip-shaped protrusion. The first strip-shaped protrusion is used to abut against the cover plate. The other end of the second segment of the two-segment protrusion forms a notch between itself and the groove wall of the second groove. The notch is used to connect the gap between the cover plate and the first groove and the gap between the cover plate and the second groove.

8. The vehicle-mounted power supply device according to claim 7, characterized in that, The base plate includes multiple second strip-shaped protrusions and multiple guide teeth. The multiple second strip-shaped protrusions are distributed at intervals with the two-segment protrusions and the first strip-shaped protrusions at the bottom of the second groove. The multiple second strip-shaped protrusions are used to abut against the cover plate and to separate the gap between the bottom of the second groove and the cover plate to form multiple coolant flow channels. The multiple guide teeth are used to guide the flow direction of coolant in the multiple coolant flow channels.

9. The vehicle-mounted power supply device according to any one of claims 5-8, characterized in that, The heat dissipation device includes a filler, the cover plate is used to fix the filler, the first groove is used to accommodate the filler, and the gap between the filler and the first groove is used to transfer coolant.

10. The vehicle-mounted power supply device according to claim 9, characterized in that, The filler is a groove-shaped structure, and the cover plate is used to fix and connect the groove wall of the filler to enclose the groove opening of the filler.

11. The vehicle-mounted power supply device according to claim 9 or 10, characterized in that, The first groove includes a first groove wall and a second groove wall, which are distributed opposite to each other on both sides of the filler. The bottom plate includes a liquid inlet channel for supplying coolant to the gap between the filler and the first groove. The liquid inlet channel is distributed on the first groove wall of the first groove. The gap between the second groove wall and the filler is used to supply coolant to the gap between the bottom of the second groove and the cover plate. The size of the gap between the second groove wall and the filler increases in the direction toward the cover plate.

12. The vehicle-mounted power supply device according to claim 11, characterized in that, The filler includes a clearance structure for avoiding the liquid inlet channel. The clearance structure is positioned at a distance greater than the distance between the surface of the filler facing the first tank wall and the first tank wall.

13. The vehicle-mounted power supply device according to claim 11 or 12, characterized in that, The base plate includes a first flow guiding structure and a second flow guiding structure. The first flow guiding structure is distributed at the bottom of the first groove, and the second flow guiding structure is distributed on the second groove wall. The first flow guiding structure is used to separate the gap between the bottom of the first groove and the filler to form multiple coolant channels. The second flow guiding structure is used to guide the coolant between the groove wall of the first groove and the filler into the gap between the second groove and the cover plate.

14. A powertrain, characterized in that, The powertrain includes a drive motor, a reducer, and an on-board power supply device as described in any one of claims 1-13, the on-board power supply device being used to output direct current to charge the power battery of the electric vehicle and to output alternating current to control the drive motor, the drive motor being used to drive the wheels of the electric vehicle through the reducer.

15. An electric vehicle, characterized in that, The electric vehicle includes wheels and a powertrain as described in claim 14, the powertrain being used to drive the wheels of the electric vehicle.

Images