A manifold microchannel heat sink with heterogeneous turbulence-inducing structures and design method

Abstract

This invention discloses a manifold microchannel heat sink with a heterogeneous turbulence structure and its design method, belonging to the field of heat exchange technology for electronic devices. Addressing the problem that existing microchannel heat dissipation technologies are prone to localized overheating and high overall pumping power when dealing with uneven heat flux density on the heating surface, this invention provides a solution. The heat sink includes a manifold distributor and a microchannel with a built-in turbulence generator. The manifold distributor adopts a uniform cross-section channel design with adjacent manifold inlets and outlets facing each other and the outermost outlet as the outlet, arranged perpendicularly to the microchannel to achieve flow distribution. Within the microchannel, the coolant is guided by the turbulence generator to form a secondary flow that disrupts the thermal boundary layer. Furthermore, this invention provides a design method for a heterogeneous turbulence structure within the channel based on the heat flux density distribution. This invention achieves an optimal trade-off between enhanced heat transfer and pumping power by eliminating hot spots through secondary flow generation in high-heat areas and reducing flow resistance in low-heat areas.

Description

Technical Field

[0001] This invention belongs to the field of heat exchange technology for electronic devices, specifically a manifold microchannel heat sink with a heterogeneous turbulence structure and its design method. Background Technology

[0002] With the rapid development of electronic technology, the integration and power density of electronic components are constantly increasing. In actual operation, high-performance chips are often accompanied by extremely significant non-uniform heat flux density distribution. Currently, the average heat flux density of high-performance chips exceeds 100 W / cm², while the heat flux density in local hot spots can reach over 500 W / cm². This drastic local temperature difference can cause thermal stress concentration, leading to performance degradation of electronic components, a surge in leakage current, and even sudden physical damage and failure. Therefore, targeted and efficient heat dissipation for non-uniform heat flux distribution has become crucial for ensuring the stable performance of electronic devices and improving system reliability. Traditional natural convection or forced air cooling is gradually becoming insufficient to meet the heat dissipation requirements of such high heat flux density scenarios.

[0003] Microchannel cooling technology, as a highly efficient liquid cooling solution, is widely used due to its advantages such as large heat transfer surface area and compact size. However, traditional microchannel heat sinks typically employ a globally uniform, straight-channel design with a uniform cross-section, which cannot adaptively adjust to the actual non-uniform heat flow distribution on the chip surface. This uniform cooling approach to non-uniform heat sources leads to insufficient cooling capacity in localized high-heat-flow areas, resulting in severe overheating; while in low-heat-flow areas, excessive cooling capacity wastes cooling resources. Furthermore, increasing the overall flow rate or reducing the channel size to lower the temperature in high-heat-flow areas significantly increases overall flow resistance, leading to a substantial increase in pump power. To address the issue of large pressure drops in long channels, manifold microchannels improve the macroscopic distribution of coolant and shorten the effective cooling length of individual channels by designing specific inlet and outlet manifold structures, thereby reducing pressure drops while improving overall heat transfer performance. However, existing manifold structure designs mainly focus on macroscopic flow field guidance, which has limited ability to enhance local heat transfer within the channel, especially lacking effective means to actively disrupt the thermal boundary layer on the microchannel walls. Even though some studies have introduced structures such as microneedle ribs inside microchannels, these turbulence structures are mostly uniform single-size designs and do not couple the size and shape of the turbulence structure with the spatial distribution of non-uniform heat flux density.

[0004] Therefore, to address the above issues, there is a need to design a microchannel heat dissipation structure that is designed for non-uniform heat flux density and has flow regulation capabilities. Summary of the Invention

[0005] This invention provides a manifold microchannel heat sink with a heterogeneous turbulence structure and a design method, which solves the problems of local hot spots, flow distribution adjustment and structural design in existing heat dissipation technologies.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A manifold microchannel heat sink with a heterogeneous turbulence structure includes a manifold distributor (1), a turbulence generator (2), and a microchannel (3). The microchannel (3) includes a microchannel substrate (31) and a microchannel body (32) disposed on the microchannel substrate (31). The microchannel body (32) includes multiple parallel channels, each of which is equipped with a turbulence generator (2). The manifold distributor (1) is installed on the top of the microchannel (3). The manifold distributor (1) includes multiple parallel manifold channels. Each manifold channel is open at one end and sealed at the other end. Adjacent manifold channels open towards each other to form an inlet manifold channel (11) and an outlet manifold channel (12), respectively. The two outermost manifold channels have the same opening direction and are both outlet manifold channels (12). The width of each manifold channel is equal. The channel direction of the manifold channel is perpendicular to the channel direction on the microchannel body (32). The structural parameters of the turbulence generator (2) are heterogeneously configured according to the non-uniform heat flux density spatial distribution of the heating surface of the electronic device to be cooled.

[0007] Preferably, the turbulence generator (2) has a helical structure, and its characteristic parameters include dimensionless pitch. m and dimensionless thickness n .in m The ratio of the pitch to the width of the microchannel (3) is given. n The ratio of thickness to width of microchannel (3). A single turbulence generator (2) is divided into several characteristic segments along the microchannel axis, and the dimensionless pitch of each characteristic segment... m and dimensionless thickness n The local heat flux density corresponding to its location is set independently, and a smooth transition connection is adopted at the junction of adjacent characteristic sections to form a continuous heterogeneous body with variable axial parameters.

[0008] Preferably, the dimensionless pitch m The value range is 0.2-0.5, and the dimensionless thickness is... n The value range is 0.1-0.4.

[0009] Preferably, adjacent manifold channels are separated by a partition rib (13), the thickness of which is a, where a = 0.3-0.5 mm.

[0010] Preferably, it also includes an encapsulation structure (4) disposed outside the manifold distributor (1), the turbulence generator (2) and the microchannel (3). The encapsulation structure (4) is provided with a coolant main inlet (41), a coolant main outlet (42) and a diverter plate (43). The coolant main inlet (41) is connected to the inlet manifold channel (11), the coolant main outlet (42) is connected to the outlet manifold channel (12), and the diverter plate (43) has diverter holes of different sizes on its surface.

[0011] Preferably, the system further includes an intelligent control system, which includes a temperature sensor array (51) arranged on the outer surface of the microchannel substrate (31), a pressure sensor (52) arranged in the inlet manifold channel (11) and the outlet manifold channel (12), and a flow regulating valve group (54) arranged at the inlet end of the inlet manifold channel (11); the temperature sensor array (51), the pressure sensor (52) and the flow regulating valve group (54) are electrically connected to a controller (53).

[0012] A method for designing characteristic parameters of a turbulence structure, used to generate a parameterized structure for a turbulence generator (2) in the heat sink, characterized by comprising the following steps: The non-uniform heat flux density spatial distribution data of the heating surface of the electronic device to be cooled is obtained, the local heat flux density is extracted as the boundary condition, and the single turbulence generator is divided into several characteristic segments along the axial direction. A microchannel fluid-structure interaction numerical model was established, and the local heat flux density, dimensionless pitch and dimensionless thickness of the turbulence generator were selected as experimental factors. Multiple sets of sample points were extracted using the response surface methodology for calculation, and regression models for heat transfer performance index and flow resistance index were constructed respectively.

[0013] With the goal of maximizing the comprehensive heat transfer enhancement evaluation factor, a multi-objective optimization algorithm is used to solve for the optimal combination of dimensionless pitch and dimensionless thickness parameters of the turbulence generator for different local heat flux densities.

[0014] Based on the heat flux density of the heating surface, it is divided into different characteristic regions. The optimal parameter combination obtained by solving is mapped to the characteristic segments of the turbulence generator corresponding to different characteristic regions to generate a heterogeneous structure oriented towards non-uniform heat flux density.

[0015] Preferably, in the above steps, the heating surface is divided into a high heat flux density region, a medium heat flux density region, and a low heat flux density region according to the heat flux density. For the turbulence generator characteristic section in the high heat flux density region, the dimensionless pitch is 0.1-0.2 and the dimensionless thickness is 0.3-0.4; for the turbulence generator characteristic section in the medium heat flux density region, the dimensionless pitch is 0.3-0.4 and the dimensionless thickness is 0.2-0.3; for the turbulence generator characteristic section in the low heat flux density region, the dimensionless pitch is 0.4-0.5 and the dimensionless thickness is 0.1-0.2.

[0016] Preferably, in the above steps, a transition buffer is provided at the junction of adjacent different feature sections, and an interpolation function is used to perform continuous and smooth transition processing on the dimensionless pitch and dimensionless thickness of the turbulence generator.

[0017] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a manifold microchannel heat sink with a heterogeneous turbulence structure. By adding a turbulence generator inside each microchannel, the coolant, during its flow within the microchannel, is guided by the flow field of the turbulence generator to form a secondary flow. This flow can effectively disrupt the formation and thickening trend of the thermal boundary layer, thereby significantly reducing the thermal resistance between the coolant and the microchannel wall. Simultaneously, the secondary flow can enhance the radial mixing effect of the coolant, promote heat transfer within the coolant, and thus optimize the temperature distribution uniformity within the microchannel, preventing localized overheating of the heating surface of the electronic device being cooled. Furthermore, the present invention uses inlet and outlet manifolds of adjacent manifolds. By employing a microchannel main structure with uniform cross-section design, the coolant can be evenly distributed among the microchannels through the diversion and convergence of the manifold, effectively avoiding the heat dissipation dead zones caused by insufficient flow in local channels and improving the overall heat dissipation uniformity of the radiator. Furthermore, the heterogeneous layout of the turbulence generator ensures that the heat dissipation requirements of high heat flux density areas are met while avoiding the introduction of excessive flow resistance in low heat flux density areas, thus achieving the optimal trade-off between heat dissipation performance and overall pressure drop at the system level. Furthermore, this invention proposes a turbulence generator size design method, which establishes a precise mapping relationship between local heat sources and microstructures through a combination of response surface methodology and multi-objective optimization. Compared to traditional designs, this method can achieve dynamic matching of axial parameters within a single channel for complex non-uniform thermal fields, effectively eliminating local hot spots, reducing the maximum junction temperature, and reducing the overall system pump power, achieving a globally optimal trade-off between heat transfer performance and flow pressure drop. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a manifold microchannel heat sink with a heterogeneous turbulence structure according to Embodiment 1 of the present invention. Figure 2 This is a schematic diagram of the overall structure of the heterogeneous turbulence heat sink according to Embodiment 1 of the present invention; Figure 3 This is a top view of the manifold microchannel heat sink in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of the turbulence generator of the present invention; Figure 5 This is an exploded view of the packaging structure and manifold distributor of Embodiment 2 of the present invention; Figure 6 This is a schematic diagram of the overall structure of the manifold microchannel heat sink according to Embodiment 2 of the present invention; Figure 7 This is a schematic diagram of three types of manifold microchannel flow divider structures in Embodiment 2 of the present invention; Figure 8 This is a schematic diagram of the adaptive control system of Embodiment 3 of the present invention.

[0019] In the diagram, 1-manifold distributor, 2-turbulence generator, 3-microchannel, 4-encapsulation structure; 11-inlet manifold channel, 12-outlet manifold channel, 13-separation rib; 31-microchannel substrate, 32-microchannel body, 33-microchannel area for coolant inflow, 34-microchannel area for coolant outflow, 41-total coolant inlet, 42-total coolant outlet, 43-diffuser plate, 51-temperature sensor array, 52-pressure sensor, 53-controller, 54-flow regulating valve assembly, a-diffuser plate for low-power operation of electronic equipment with relatively concentrated heat distribution, b-diffuser plate for low-power operation of electronic equipment with relatively concentrated heat distribution on the left side of the channel, c-diffuser plate for low-power operation of electronic equipment with relatively concentrated heat distribution on the right side of the channel. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art without inventive effort in relation to the embodiments of the invention are within the scope of protection of the invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0024] Example 1 like Figure 1 As shown, this embodiment 1 provides a manifold microchannel heat sink, including a manifold distributor 1, a turbulence generator 2, and a microchannel 3; The microchannel 3 includes a microchannel substrate 31 and a microchannel body 32 disposed on the microchannel substrate 31. The microchannel body 32 includes multiple parallel channels, each channel is provided with a turbulence generator 2. A manifold distributor 1 is installed on the top of the microchannel 3. The manifold distributor 1 includes multiple parallel manifold channels. Each manifold channel is open at one end and sealed at the other end. Adjacent manifold channels open towards each other. According to the opening direction, they are set as an inlet manifold channel 11 and an outlet manifold channel 12. The two outermost manifold channels have the same opening direction and are the outlet manifold channels 12. The channel width of each manifold channel is equal. The channel direction of the manifold channel is perpendicular to the channel direction on the microchannel body 32.

[0025] By using a turbulence generator 2 inside each microchannel, the coolant, during its flow within the microchannel, is guided by the flow field of the turbulence generator to form a secondary flow. This flow pattern effectively disrupts the formation and thickening trend of the thermal boundary layer, thereby significantly reducing the thermal resistance between the coolant and the microchannel wall. Simultaneously, the secondary flow enhances the radial mixing effect of the coolant, promotes heat transfer within the coolant, improves the uniformity of temperature distribution within the microchannel, and prevents local hot spots from appearing on the heating surfaces of the electronic devices to be cooled. Furthermore, this invention employs an inlet and outlet manifold design with adjacent manifolds and a microchannel main structure of equal cross-section. Through the diversion and convergence effects of the manifolds, it ensures uniform distribution of coolant among the microchannels, avoiding the heat dissipation dead zone problem caused by insufficient flow in local channels, and further improving the overall heat dissipation uniformity of the radiator.

[0026] like Figure 2 As shown, the manifold distributor 1 is machined with two inlet manifold channels 11 and three outlet manifold channels 12; the inlet manifold channels 11 are constant cross-section channels for coolant inflow, and the outlet manifold channels 12 are constant cross-section channels for coolant outflow; wherein, the width of the inlet manifold channels 11 is equal to the width of the outlet manifold channels 12; in this embodiment 1, the inlet manifold channels 11 and the outlet manifold channels 12 are separated by a partition rib wall 13, and the thickness of the partition rib wall 13 is 0.5 mm.

[0027] The widths of the inlet manifold channel 11 and the outlet manifold channel 12 W 1. All are 0.4 mm, and the channel height is H 1 represents 1 mm; the thickness of the microchannel substrate is 0.1 mm; the width of the microchannel... W 2 is 2 mm, channel height H 2 is 0.8 mm.

[0028] like Figure 3 As shown, the microchannel body 32 includes a microchannel region 33 for coolant inflow and a microchannel region 34 for coolant outflow; the microchannel region 33 for coolant inflow is located directly below the inlet manifold channel 11, and the microchannel region 34 for coolant outflow is located directly below the outlet manifold channel 12; the microchannel region includes eight parallel channels, each channel having a width of 0.4 mm and a spacing of 0.1 mm between adjacent channels; the microchannel region 33 for coolant inflow is connected to the inlet manifold channel 11, and the microchannel region 34 for coolant outflow is connected to the outlet manifold channel 12.

[0029] The microchannel 3 contains a turbulence generator 2, and the material of the turbulence generator 2 and the material of the microchannel body 32 are both copper alloy materials with high thermal conductivity. The two ends of the turbulence generator 2 are flush with the inlet end and the outlet end of the microchannel 3, respectively.

[0030] Work process: like Figure 2 As shown, the inlet manifold channel 11 and the outlet manifold channel 12 in the manifold distributor 1 are the inflow and outflow channels for the coolant, respectively; for electronic equipment 100 W / cm 2 Up to 500 W / cm 2 The heat flux density is configured with an adaptive flow regulation strategy at the inlet: when the electronic device is in low-power mode, the heat flux density is less than or equal to 150 W / cm³. 2 Under the constant flow mechanism of the external pump, the coolant enters the lower microchannel body 32 through the inlet manifold channel 11 at a basic flow rate. With the aid of the equal cross-section distribution structure of the manifold distributor 1, it is evenly distributed to each channel. When the electronic equipment is at high power, the heat flux density is greater than 300 W / cm³. 2 In this mode, the flow regulation mechanism will simultaneously increase the coolant flow rate, and at the same time, in order to eliminate local hot spots and improve temperature uniformity, it will adjust the flow distribution ratio of the two inlet manifold channels in real time.

[0031] The heat generated by the heating surface of the electronic device is quickly transferred to the channel wall through the microchannel substrate 31. The coolant entering the channel is subjected to local turbulence and forms a secondary flow. At the same time, the turbulence generator 2 serves as an extended heat exchange surface, increasing the heat exchange area in the channel. The coolant undergoes forced convection heat exchange in the channel and flows out through the outlet manifold channel 12, thereby achieving continuous and uniform heat dissipation for electronic devices under different power conditions.

[0032] Example 2 The manifold microchannel heat sink provided in this embodiment 2 has a basically the same heat dissipation process as the manifold microchannel heat sink described in embodiment 1 above, except that, as Figure 5 As shown, an encapsulation structure 4 is added to the structure and connected to the microchannel structure. The encapsulation structure has a total coolant inlet 41, a total coolant outlet 42, and a flow divider 43. The flow divider 43 achieves flow distribution through flow divider holes with local resistance adjustment function on its surface: utilizing the principle of pressure drop difference when fluid passes through different orifices, a large-diameter flow divider hole is set above the channel corresponding to the high heat generation area to reduce the local flow resistance at the inlet, inducing the coolant to preferentially converge to this area and increase the flow rate; while a small-diameter flow divider hole is set above the channel corresponding to the low heat generation area to implement throttling, thereby achieving spatial directional matching according to heat flux density while ensuring the basic heat dissipation flow rate. The flow divider structure is as follows. Figure 7 As shown, specifically, when the electronic device to be cooled is in a low-power mode and the heat distribution is relatively concentrated, using Figure 7 The shunt plate shown in diagram a is used when the electronic device to be cooled is in high-power mode and there is localized overheating. Figure 7 The B or C structure distributor plate adjusts the coolant distribution ratio, allocating more flow to the channels corresponding to high heat generation areas, while ensuring the basic heat dissipation flow to other areas. This suppresses overheating in high-load areas while ensuring the overall stability of heat dissipation.

[0033] Meanwhile, the coolant inlet 41 is used to connect with two inlet manifold channels 11, and the coolant outlet 42 is used to connect with three outlet manifold channels 12; wherein, the coolant inlet 41 on the encapsulation structure serves as a centralized inflow channel for coolant, and the coolant outlet 42 serves as a centralized discharge channel for coolant after heat exchange, which facilitates connection with the external cooling system.

[0034] like Figure 6 As shown, when the electronic device to be cooled is started, the external cooling circulation system is started, pressurizes the low-temperature coolant and delivers it to the coolant main inlet 41. After the coolant enters the manifold distributor, it is precisely distributed to the two inlet manifold channels 11 by the guidance of the diverter plate 43, and then heat dissipation is completed according to the working process described in Example 1.

[0035] Example 3 Based on Example 1, this embodiment 3 further provides a manifold microchannel heat sink with an adaptive flow control system. This control system achieves dynamic optimization control of the heat dissipation process through real-time monitoring and feedback of coolant flow rate, temperature distribution, and the operating status of electronic equipment.

[0036] like Figure 8 As shown, the adaptive control system includes a temperature sensor array 51, arranged on the outer surface of the microchannel substrate 31 in the area in contact with the heating surface of the electronic device, with a total of 25 temperature measurement points in a 5×5 array, used to collect the temperature distribution of the heating surface in real time; a pressure sensor 52 is installed in the inlet manifold channel 11 and the outlet manifold channel 12 to monitor changes in flow resistance; the controller 53 adopts an embedded microprocessor and integrates a temperature acquisition module, a pressure acquisition module, and a valve control drive module; the flow regulating valve group 54 includes two independently controlled miniature solenoid valves, which are respectively installed at the inlet ends of the two inlet manifold channels 11.

[0037] The control system implements closed-loop control in controller 53: the temperature data collected by temperature sensor array 51 is converted by A / D and then transmitted to the controller. The controller determines whether there is local overheating based on the preset temperature threshold and distribution algorithm. If a hot spot is identified, the coolant flow rate in that area is increased by adjusting the opening of the corresponding valve in the flow regulating valve group 54. At the same time, the pressure drop data monitored by pressure sensor 52 is used to evaluate the flow resistance status and avoid excessive system pressure drop due to valve adjustment.

[0038] Example 4 This embodiment provides a parametric design method for turbulence generators oriented towards non-uniform heat flux density, used to generate customized structures for turbulence generators in manifold microchannel radiators described in any of embodiments 1 to 3. This method mathematically maps local heat flux density to the structural parameters of the turbulence generator, achieving multi-objective optimization of heat transfer enhancement and flow resistance at the system level. Specifically, it includes the following steps: 1. Obtain the spatial distribution data of non-uniform heat flux density on the heating surface of the electronic device to be cooled, and extract the local heat flux density. q As a boundary condition, where q The value range covers the actual operating conditions of the equipment to be cooled. Considering that the heat flux density may have a non-uniform distribution in both the axial direction and the cross-channel direction of the turbulence generator, a single turbulence generator is divided into several characteristic sections along the axial direction. A three-dimensional fluid-structure interaction numerical model including the microchannel body and the turbulence generator is established for computational fluid dynamics and numerical heat transfer, and the dimensionless pitch of the turbulence generator is selected. m and dimensionless thickness n As a key structural independent variable.

[0039] 2. To efficiently construct the mapping relationship between structural parameters and heat dissipation performance, response surface methodology is used for experimental design. Preferably, the Box-Behnken design method is employed, with heat flux density as the primary factor. q Dimensionless pitch m and dimensionless thickness n Multiple sets of orthogonal experimental sample points are generated as experimental factors. The parameters of each sample point are substituted into the three-dimensional fluid-structure interaction numerical model for solution, and the corresponding heat transfer target response value, average temperature of the heating surface of the electronic device to be cooled, and flow resistance target response value, channel flow pressure drop are extracted.

[0040] 3. Introduce comprehensive heat transfer enhancement evaluation factors PEC As an evaluation benchmark, its definition is: ,in Nu 0 and f 0 represents the Nusselt number and friction coefficient of the smooth microchannel without a turbulence generator, respectively. Based on the sample data extracted in step 2, Nusselt numbers are fitted using response surface multivariate regression analysis. Nu and coefficient of friction f Regarding the independent variable ( q , m , n The regression equation is a second-order or higher-order polynomial response surface regression equation. Simultaneously, the predicted values ​​need to be compared with the true values ​​to ensure that the regression model meets the prediction accuracy requirements.

[0041] 4. Fit-oriented response surface model, for different local heat flux densities q i Under the condition of maximizing PEC With the optimization objective as the objective, a non-dominated sorting genetic algorithm is used to find the corresponding Pareto front. The optimal trade-off point is extracted from the Pareto solution set to obtain the corresponding specific heat flux density. q i Optimal combination of turbulence generator parameters m opt and n opt .

[0042] 5. Divide the heating surface into regions with different heat flux densities based on the heat flux density. For high heat flux density regions, the dimensionless pitch of the turbulence generator (2) corresponding to this region is... m The value range is set to 0.2 to 0.3, dimensionless thickness. n The value range is set to 0.3 to 0.4; when the heating surface is in the medium heat flux density region, the dimensionless pitch of the turbulence generator (2) corresponding to this section is... m The value range is set to 0.3 to 0.4, dimensionless thickness. nThe value range is set to 0.2 to 0.3. When the heating surface is in a low heat flux density region, the dimensionless pitch of the turbulence generator (2) corresponding to this section is... m The value range is set to 0.4 to 0.5, dimensionless thickness. n The value range is set to 0.1 to 0.2. For a single microchannel, the internal turbulence generator is segmented and parameter-mapped according to the different heat flux density regions it traverses. For microchannels traversing multiple heat flux density regions, the internal turbulence generator is designed as a continuous heterogeneous body with variable axial pitch and thickness. At the boundary between adjacent segments with different parameters, the pitch and thickness of the turbulence generator are smoothly transitioned using spline interpolation functions. Finally, a solid model of the heterogeneous heat sink and variable parameter turbulence generator for non-uniform heat flux density is generated, and it is manufactured using precision machining technology.

[0043] To verify the effectiveness of the above parametric design method, a design was conducted for a heating surface with a local hotspot heat flux density of 500 W / cm² and a background heat flux density of 100 W / cm². The optimal parameters were extracted for the high heat flux region using the method of this invention. m =0.15, n =0.35; Optimal parameters are extracted for the low heat flux region. m =0.42, n =0.12. Simulation results show that, compared with the uniform parameter selection, the axial variable parameter heterogeneous design of this invention achieves a result of 0.12. m =0.2, n With a standard heatsink of 0.2, the highest junction temperature on the heating surface was reduced by 8.5 ℃, the surface temperature uniformity was improved by 40%, and the total system voltage drop was reduced by 15%, proving the effectiveness of this design method.

[0044] In this invention, the manifold distributor's structural design achieves uniform distribution of coolant among the microchannels, avoiding overheating caused by insufficient local flow. By adding a turbulence generator within the microchannels, the heat transfer area is increased, and the coolant turbulence is enhanced, effectively reducing heat transfer resistance and improving heat exchange efficiency. At the same time, the reasonable structural parameter design ensures that the radiator does not generate excessive flow resistance while enhancing heat exchange, achieving a good balance between heat exchange performance and pressure drop.

[0045] This invention improves the overall heat dissipation performance of microchannel heat sinks by optimizing the structure of manifold microchannels, opening up a new solution to the heat dissipation challenges of high heat flux density electronic devices. As electronic technology rapidly evolves towards higher integration and higher power density, this innovative design has significant application prospects and market potential, effectively addressing the increasing heat dissipation pressures of electronic devices.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0047] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that can be understood by those skilled in the art. The above content is only for illustrating the technical concept of the present invention and should not be construed as limiting the scope of protection of the present invention. Any modifications made based on the technical concept proposed in this invention shall fall within the scope of protection of the claims of this invention.

Claims

1. A manifold microchannel heat sink with a heterogeneous turbulence structure, characterized in that, The system includes a manifold distributor (1), a turbulence generator (2), and a microchannel (3). The microchannel (3) includes a microchannel substrate (31) and a microchannel body (32) disposed on the microchannel substrate (31). The microchannel body (32) includes multiple parallel channels, each of which is equipped with a turbulence generator (2). The manifold distributor (1) is installed on top of the microchannel (3). The manifold distributor (1) includes multiple parallel manifold channels. Each manifold channel is open at one end and sealed at the other end. Adjacent manifold channels open towards each other to form an inlet manifold channel (11) and an outlet manifold channel (12), respectively. The two outermost manifold channels have the same opening direction and are both outlet manifold channels (12). The width of each manifold channel is equal. The channel direction of the manifold channel is perpendicular to the channel direction on the microchannel body (32). The structural parameters of the turbulence generator (2) are heterogeneously configured according to the non-uniform heat flux density spatial distribution of the heating surface of the electronic device to be cooled.

2. A manifold microchannel heat sink with a heterogeneous turbulence structure according to claim 1, characterized in that, The turbulence generator (2) has a spiral structure, and its characteristic parameters include dimensionless pitch. m and dimensionless thickness n ;in m The ratio of the pitch to the width of the microchannel (3) is given. n The ratio of thickness to width of microchannel (3); a single turbulence generator (2) is divided into several characteristic segments along the axial direction of the microchannel, and the dimensionless pitch of each characteristic segment is... m and dimensionless thickness n The local heat flux density corresponding to its location is set independently, and a smooth transition connection is adopted at the junction of adjacent characteristic sections to form a continuous heterogeneous body with variable axial parameters.

3. A manifold microchannel heat sink with a heterogeneous turbulence structure according to claim 2, characterized in that, The dimensionless pitch m The value range is 0.2-0.5, and the dimensionless thickness is... n The value range is 0.1-0.

4.

4. A manifold microchannel heat sink with a heterogeneous turbulence structure according to claim 1, characterized in that, Adjacent manifold channels are separated by a partition rib (13), the thickness of which is a, where a = 0.3-0.5 mm.

5. A heterogeneous secondary flow radiator for non-uniform heat flux density according to claim 1, characterized in that, It also includes an encapsulation structure (4) disposed outside the manifold distributor (1), the turbulence generator (2) and the microchannel (3). The encapsulation structure (4) is provided with a coolant main inlet (41), a coolant main outlet (42) and a diverter plate (43). The coolant main inlet (41) is connected to the inlet manifold channel (11), the coolant main outlet (42) is connected to the outlet manifold channel (12), and the diverter plate (43) has diverter holes of different sizes on its surface.

6. A manifold microchannel heat sink with a heterogeneous turbulence structure according to claim 1, characterized in that, It also includes an intelligent control system, which includes a temperature sensor array (51) arranged on the outer surface of the microchannel substrate (31), a pressure sensor (52) arranged in the inlet manifold channel (11) and the outlet manifold channel (12), and a flow regulating valve group (54) arranged at the inlet end of the inlet manifold channel (11); the temperature sensor array (51), the pressure sensor (52) and the flow regulating valve group (54) are electrically connected to a controller (53).

7. A method for designing characteristic parameters of a turbulence structure, used to generate a parameterized structure for the turbulence generator (2) in any one of claims 1-6, characterized in that, Includes the following steps: The non-uniform heat flux density spatial distribution data of the heating surface of the electronic device to be cooled is obtained, the local heat flux density is extracted as the boundary condition, and the single turbulence generator is divided into several characteristic segments along the axial direction. A microchannel fluid-structure interaction numerical model was established, and the local heat flux density, dimensionless pitch and dimensionless thickness of the turbulence generator were selected as experimental factors. Multiple sets of sample points were extracted by response surface methodology for calculation, and regression models for heat transfer performance index and flow resistance index were constructed respectively. With the goal of maximizing the comprehensive heat transfer enhancement evaluation factor, the optimal combination of dimensionless pitch and dimensionless thickness parameters of the turbulence generator is solved by a multi-objective optimization algorithm for different local heat flux densities. Based on the heat flux density of the heating surface, it is divided into different characteristic regions. The optimal parameter combination obtained by solving is mapped to the characteristic segments of the turbulence generator corresponding to different characteristic regions to generate a heterogeneous physical structure oriented towards non-uniform heat flux density.

8. The design method according to claim 7, characterized in that, In the above steps, the heating surface is divided into a high heat flux density region, a medium heat flux density region, and a low heat flux density region according to the heat flux density. For the turbulence generator characteristic section in the high heat flux density region, the dimensionless pitch is 0.1-0.2 and the dimensionless thickness is 0.3-0.

4. For the turbulence generator characteristic section in the medium heat flux density region, the dimensionless pitch is 0.3-0.4 and the dimensionless thickness is 0.2-0.

3. For the turbulence generator characteristic section in the low heat flux density region, the dimensionless pitch is 0.4-0.5 and the dimensionless thickness is 0.1-0.

2. The dimensionless pitch is the ratio of the pitch to the width of the microchannel (3) and the dimensionless thickness is the ratio of the thickness to the width of the microchannel (3).

9. The design method according to claim 7, characterized in that, In the aforementioned steps, a transition buffer zone is set at the junction of adjacent different feature sections, and an interpolation function is used to perform continuous and smooth transition processing on the dimensionless pitch and dimensionless thickness of the turbulence generator.

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