A heat conduction device and electronic equipment

Abstract

The application provides a heat conduction device and an electronic device. The heat conduction device comprises a base, a first target body and a second target body which are arranged at at least one outer surface of the base, a first target gap is arranged between the first target body and the second target body, at least one of the first target body and the second target body can be deformed, and a heat conduction metal medium is arranged in the first target gap, and the heat conduction metal medium can be in a liquid state.

Description

Technical Field

[0001] This application relates to the field of thermal conductivity technology, and more particularly to a thermal conductivity device and electronic device. Background Technology

[0002] In related technologies, electronic devices include heat-conducting structures, but the configuration of these structures is relatively simple, resulting in poor adaptability. Summary of the Invention

[0003] This disclosure provides a heat-conducting device and an electronic device.

[0004] This disclosure provides a heat-conducting device, including: Matrix; A first target body and a second target body are disposed at a distance from each other on at least one outer surface of the substrate; a first target gap exists between the first target body and the second target body; at least one of the first target body and the second target body is deformable; A thermally conductive metal medium is disposed within the first target gap; the thermally conductive metal medium can be in a liquid state.

[0005] In some embodiments, the first deformation force of the deformable target body in the first target body and the second target body is greater than the second deformation force of the liquid thermally conductive metal medium; Under the action of external force, the deformable target body deforms, and the liquid-like heat-conducting metal medium located on the periphery of the deformable target body deforms.

[0006] In some embodiments, the deformable target body in the first target body and the second target body includes a core and a wrapping portion surrounding the core, wherein a portion of the thermally conductive metal medium and the wrapping portion can react to form a reaction layer, the reaction layer wrapping around the outside of the core to deform together with the core.

[0007] In some embodiments, the material of the target body is copper, and the material of the thermally conductive metal medium includes gallium; the copper and the gallium can undergo a chemical reaction to form a compound, and the compound forms the reaction layer.

[0008] In some embodiments, when the first target body and the second target body are in contact with the heating element, the deformable target body can contact the recessed area of ​​the heating element through deformation; or, The first target body is deformable; the first target body includes a first sub-target body and a second sub-target body spaced apart, the first sub-target body and the second sub-target body have the same height, and when the first sub-target body and the second sub-target body are in contact with the heating element, the first sub-target body and the second sub-target body can contact the recessed areas of the heating element at different depths through deformation.

[0009] In some embodiments, the first target body is deformable, and the first target body includes at least two spaced-apart third sub-target bodies and at least two spaced-apart fourth sub-target bodies; the at least two third sub-target bodies and at least two fourth sub-target bodies are located in different regions on the same surface side of the substrate. The thermally conductive metal medium between at least two third sub-targets has a first temperature, and the thermally conductive metal medium between at least two fourth sub-targets has a second temperature; when the first temperature is greater than the second temperature, the thermally conductive metal medium between at least two third sub-targets can move into the gap between the at least two fourth sub-targets.

[0010] In some embodiments, the substrate includes a first outer surface and a second outer surface disposed opposite to each other in the thickness direction; the first target body and the second target body are disposed on at least one of the first and second outer surfaces; the thermal conductivity of the heat-conducting device in the thickness direction of the substrate is greater than the thermal conductivity of the heat-conducting device in the length or width direction of the substrate; and / or, The first target body has a circular cross-section perpendicular to the thickness direction of the substrate; and / or, The substrate, the first target body, and the second target body are all made of the same metal; and / or, The first target body is whisker-shaped; and / or, The maximum cross-sectional dimension of the first target body in the direction perpendicular to the thickness of the substrate is less than 1 μm.

[0011] This disclosure also provides an electronic device, including: The heat conduction device includes: Matrix; A first target body and a second target body are disposed at a distance from each other on the first outer surface of the substrate; a first target gap exists between the first target body and the second target body; at least one of the first target body and the second target body is deformable; A thermally conductive metal medium is disposed within the first target gap; the thermally conductive metal can be in a liquid state. A heating element is disposed on the first outer surface of the substrate; the heating element is in contact with the first target body, the second target body and the thermally conductive metal medium respectively; When the heating element is working, the thermally conductive metal medium is in a liquid state.

[0012] In some embodiments, the heating element has a first region and a second region on the side facing the first outer surface, and the first target body includes at least two spaced third sub-target bodies and at least two spaced fourth sub-target bodies; at least two third sub-target bodies are in contact with the first region, and at least two fourth sub-target bodies are in contact with the second region; When the temperature of the first region is greater than the temperature of the second region, the thermally conductive metal medium between at least two third sub-targets can move toward the gap between at least two fourth sub-targets on the second region side.

[0013] In some embodiments, the heating element exerts a first force on the first target body, and the first force is greater than the first deformation force of the first target body.

[0014] In some embodiments, the substrate includes a first outer surface and a second outer surface disposed opposite to each other in the thickness direction; a first target body and a second target body are spaced apart from each other on the second outer surface; the electronic device includes: A heat-conducting component is disposed on the second outer surface side of the substrate; the heat-conducting component is in contact with the first target body, the second target body and the heat-conducting metal medium respectively; The heating element has a third region and a fourth region on the side facing the first outer surface; the third region has a first distance from the heat-conducting element, and the fourth region has a second distance from the heat-conducting element; the first distance is greater than the second distance. After the heating element starts working, the thickness of the heat-conducting device in the third region increases, and the thickness of the heat-conducting device in the fourth region decreases.

[0015] In some embodiments, the heat-conducting component exerts a second force on the first target body, the second force being greater than the deformation force of the first target body. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the heat conduction device provided in the embodiments of this disclosure. Figure 1 ; Figure 2 This is a schematic diagram of the structure of the heat conduction device provided in the embodiments of this disclosure. Figure 2 ; Figure 3 This is a schematic diagram of the structure of the heat conduction device provided in the embodiments of this disclosure. Figure 3 ; Figure 4 This is a schematic diagram of the structure of the heat conduction device provided in the embodiments of this disclosure. Figure 4 ; Figure 5 This is a schematic diagram of the structure of the heat conduction device provided in the embodiments of this disclosure. Figure 5 ; Figure 6 This is a schematic diagram of the structure of the heat conduction device provided in the embodiments of this disclosure. Figure 6 ; Figure 7 This is a schematic diagram of the structure of the heat conduction device provided in the embodiments of this disclosure. Figure 7 ; Figure 8 This is a schematic diagram of the structure of the heat conduction device provided in the embodiments of this disclosure. Figure 8 ; Figure 9 yes Figure 8 Partial structural diagram; Figure 10 This is a schematic diagram of the structure of a semi-finished product for manufacturing a heat-conducting device according to an embodiment of this disclosure. Figure 1 ; Figure 11 This is a schematic diagram of the structure of a semi-finished product for manufacturing a heat-conducting device according to an embodiment of this disclosure. Figure 2 ; Figure 12 This is a schematic diagram of the structure of a semi-finished product for manufacturing a heat-conducting device according to an embodiment of this disclosure. Figure 3 ; Figure 13 This is a partial structural diagram of the electronic device provided in the embodiments of this disclosure. Figure 1 ; Figure 14 This is a partial structural diagram of the electronic device provided in the embodiments of this disclosure. Figure 2 .

[0017] It should be noted that the terms "first" and "second" mentioned above are only used to distinguish between different options and do not represent the degree of superiority or inferiority of the options or their priority in the implementation process. Figure Descriptions: 100, Substrate; 110, First outer surface; 111, First sub-region; 112, Second sub-region; 120, Second outer surface; 200, First target body; 210, First core; 220, First encapsulation part; 201, First sub-target body; 202, Second sub-target body; 203, Third sub-target body; 204, Fourth sub-target body; 300, Second target body; 400, Thermally conductive metal medium; 410, First reaction layer; 420, Second reaction layer; 510, First target gap; 520, Second target gap; 610, First film layer; 620, Second film layer; 631, First through hole; 632, Second through hole; 640, Solvent removal; 700, Heating element; 710, First region; 720, Second region; 730, Third region; 740, Fourth region. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] The following combination Figures 1 to 14 The heat conduction device and electronic device described in the embodiments of this disclosure will be described in detail.

[0020] In the embodiments disclosed herein, such as Figure 1 As shown, the heat-conducting device may include: a substrate 100, a first target body 200, a second target body 300, and a heat-conducting metal medium 400. The first target body 200 and the second target body 300 are spaced apart on at least one outer surface of the substrate 100; a first target gap 510 is formed between the first target body 200 and the second target body 300; at least one of the first target body 200 and the second target body 300 is deformable; the heat-conducting metal medium 400 is disposed within the first target gap 510; the heat-conducting metal can be in a liquid state.

[0021] The inventors discovered that when a heat-conducting structure and a heat-generating structure are fitted together, the tightness of the fit is poor, affecting the heat conduction performance. For example, when the heat-conducting medium, such as liquid metal, is placed within the gaps formed by the mesh structure, the mesh structures are interconnected and intertwined, restricting their movement and thus affecting their deformation capacity, resulting in poor fit between the mesh structure and the heat-generating structure. In this disclosure, the first target body 200 and the second target body 300 are spaced apart and not connected. When the heat-conducting metal medium 400 is in a liquid state, there is essentially no mutual tension between the first target body 200 and the second target body 300. This allows the deformable target body to deform without tension, thereby improving the tightness of the fit between the deformable target body and the heat-generating element 700 and other structures, and consequently increasing the contact area and heat conduction performance with the heat-generating element 700 and other structures.

[0022] In this embodiment, the structure of the substrate 100 is not limited. For example, the substrate 100 can be a plate-like structure, a block-like structure, a sheet-like structure, a foil-like structure, etc. The substrate 100 is used to support the first target body 200, the second target body 300, and the thermally conductive metal medium 400. The material of the substrate 100 is not limited. For example, the material of the substrate 100 can be thermally conductive materials such as copper, aluminum, and silver. As an example, the substrate 100 can be copper foil, aluminum foil, silver foil, etc. This disclosure does not limit this aspect.

[0023] The thickness of the substrate 100 is not limited. For example, the thickness of the substrate 100 can be less than or equal to 1 mm, 0.5 mm, 0.1 mm, etc. As another example, the substrate 100 can be copper foil, aluminum foil, silver foil, etc., and the thickness of the substrate 100 can be 15 μm to 30 μm, 20 μm to 30 μm, 25 μm to 30 μm, 20 μm to 25 μm, etc. This disclosure does not impose any limitations on this.

[0024] In this embodiment, the structure of the first target body 200 is not limited. For example, the first target body 200 can be a plate-like structure, a block-like structure, a sheet-like structure, a strip-like structure, a column-like structure, a whisker-like structure, etc. As an example, the first target body 200 can be whisker-like. The whisker-like first target body 200 has a relatively small size, which can improve the deformation capability of the first target body 200. The cross-sectional shape of the first target body 200 in the thickness direction perpendicular to the base 100 is not limited. The cross-section of the first target body 200 in the thickness direction perpendicular to the base 100 can be circular, elliptical, rectangular, etc. As an example, the cross-section of the first target body 200 in the thickness direction perpendicular to the base 100 can be circular, which is convenient for processing and manufacturing, and also facilitates the movement of the liquid heat-conducting metal medium 400 around the first target body 200.

[0025] The first target body 200 serves to conduct heat and also cooperates with the substrate 100 and the second target body 300 to form a space accommodating the heat-conducting metal medium 400. The material of the first target body 200 is not limited. For example, the material of the first target body 200 can be thermally conductive materials such as copper, aluminum, or silver. As an example, the first target body 200 can be a copper strip, aluminum strip, or silver strip. As another example, the first target body 200 can be a copper pillar, aluminum pillar, or silver pillar. As yet another example, the first target body 200 can be copper whiskers, aluminum whiskers, or silver whiskers; a smaller first target body 200 can improve the deformability of the first target body 200.

[0026] The first target body 200 can be disposed on the substrate 100 by means of bonding, welding, or other methods. This disclosure does not limit this.

[0027] The number of the first target body 200 is not limited. For example, such as Figure 1 and Figure 2 As shown, the number of first target objects 200 can be one. Alternatively, the number of first target objects 200 can be at least two, at least three, at least four, etc. As an example, such as... Figure 4 and Figure 5 As shown, the number of first target bodies 200 can be multiple.

[0028] The dimension of the first target body 200 in the thickness direction of the substrate 100 is not limited. For example, the dimension of the first target body 200 in the thickness direction of the substrate 100 can be less than 1 mm, 0.5 mm, 0.1 mm, etc. As an example, the dimension of the first target body 200 in the thickness direction of the substrate 100 can be 60 μm to 70 μm, 65 μm to 80 μm, 60 μm to 65 μm, 65 μm to 90 μm, etc. This disclosure does not limit this aspect.

[0029] In some examples, the first target body 200 may be strip-shaped, and may be positioned along the thickness direction of the substrate 100. The dimension of the first target body 200 in the thickness direction of the substrate 100 may be greater than its dimension in the length direction of the substrate 100, and the dimension of the first target body 200 in the thickness direction of the substrate 100 may be greater than its dimension in the width direction of the substrate 100. In other words, the first target body 200 has the largest dimension in the thickness direction of the substrate 100, and the first target body 200 has the smallest dimension in either the length or width direction of the substrate 100.

[0030] The minimum size of the first target body 200 is not limited. For example, the minimum size of the first target body 200 in the length or width direction of the substrate 100 can be less than or equal to 10µm, 5µm, 2µm, 1µm, etc. As an example, the minimum size of the first target body 200 in the length or width direction of the substrate 100 can be 0.1µm to 1µm, 0.2µm to 1µm, 0.4µm to 1µm, 0.5µm to 0.9µm, 0.6µm to 0.8µm, 0.7µm to 0.8µm, etc. In some examples, the maximum cross-sectional size of the first target body 200 in the direction perpendicular to the thickness of the substrate 100 is less than 10µm, 5µm, 2µm, 1µm, etc.

[0031] In this embodiment, the structure of the second target body 300 is not limited. For example, the second target body 300 can be a plate-like structure, a block-like structure, a sheet-like structure, a strip-like structure, a frame-like structure, a whisker-like structure, etc. The second target body 300 can be used for heat conduction and can also be used to cooperate with the substrate 100 and the first target body 200 to form a space for accommodating the heat-conducting metal medium 400. The material of the second target body 300 is not limited. For example, the material of the second target body 300 can be copper, aluminum, silver, or other materials with thermal conductivity. As an example, the second target body 300 can be a copper sheet, aluminum sheet, silver sheet, etc. As another example, the second target body 300 can be a copper frame, aluminum frame, silver frame, etc. For yet another example, the material of the second target body 300 can be non-metallic materials such as foam, plastic, rubber, thermally conductive adhesive, etc. Here, the second target body 300 is deformable. Here, the second target body 300 can be a frame-like structure, a sheet-like structure, etc. As an example, the second target body 300 may be arranged in a ring around the periphery of the first target body, and the first target body 200 may be located within the space enclosed by the second target body 300. This allows the second target body 300 to limit the range of movement of the heat-conducting metal medium 400, preventing it from moving to other areas and thus improving the safety of the heat-conducting device. This disclosure does not limit the scope of the invention.

[0032] The number of second target objects 300 is not limited. For example, the number of second target objects 300 can be one. Or, for example, the number of second target objects 300 can be at least two, at least three, etc.

[0033] The dimension of the second target 300 in the thickness direction of the substrate 100 is not limited. For example, the dimension of the second target 300 in the thickness direction of the substrate 100 can be less than 1 mm, 0.5 mm, 0.1 mm, etc. As an example, the dimension of the second target 300 in the thickness direction of the substrate 100 can be 60 μm to 70 μm, 65 μm to 80 μm, 60 μm to 65 μm, 65 μm to 90 μm, etc. This disclosure does not limit this.

[0034] The dimension of the second target 300 in the thickness direction of the substrate 100 can be greater than the dimension of the second target 300 in the length direction of the substrate 100, and the dimension of the second target 300 in the thickness direction of the substrate 100 can be greater than the dimension of the second target 300 in the width direction of the substrate 100. In other words, the dimension of the second target 300 in the thickness direction of the substrate 100 is the largest, and the dimension of the second target 300 in the length or width direction of the substrate 100 is the smallest.

[0035] In some examples, the second target body 300 may be strip-shaped and may be positioned along the thickness direction of the substrate 100. The minimum dimension of the second target body 300 in the length or width direction of the substrate 100 is not limited. For example, the minimum dimension of the second target body 300 in the length or width direction of the substrate 100 may be less than or equal to 10µm, 5µm, 2µm, 1µm, etc. As an example, the minimum dimension of the second target body 300 in the length or width direction of the substrate 100 may be 0.1µm to 1µm, 0.2µm to 1µm, 0.4µm to 1µm, 0.5µm to 0.9µm, 0.6µm to 0.8µm, 0.7µm to 0.8µm, etc.

[0036] The second target 300 can be disposed on the substrate 100 by means of bonding, welding, or other methods. This disclosure does not limit this.

[0037] The first target 200 and the second target 300 may be disposed on one, two, or three outer surfaces of the substrate 100. This disclosure does not limit this.

[0038] A first target gap 510 may exist between the first target body 200 and the second target body 300; in other words, when the heat-conducting metal medium 400 is in a liquid state, the first target body 200 and the second target body 300 are not connected to each other, thereby eliminating the interaction force between the first target body 200 and the second target body 300. The value of the first target gap 510 is not limited. For example, the first target gap 510 may be greater than the minimum dimension of the first target body 200 in the length or width direction of the base 100. As an example, the ratio of the first target gap 510 to the minimum dimension of the first target body 200 in the length or width direction of the base 100 may be 1.1 to 2.5, 1.1 to 3, 1.5 to 3, 1.5 to 2, etc. As another example, the first target gap 510 may be smaller than the minimum dimension of the first target body 200 in the length or width direction of the base 100. As an example, the ratio of the minimum dimension of the first target gap 510 to the minimum dimension of the first target body 200 in the length or width direction of the base 100 can be 0.3 to 0.4, 0.4 to 0.5, 0.3 to 0.8, 0.3 to 0.6, etc. For another example, the volume of the first target gap 510 is smaller than the volume of the first target body 200 to prevent an excessive amount of heat-conducting metal medium 400 from reacting entirely with the first target body 200. In other words, to prevent the entire first target body 200 from chemically reacting with the heat-conducting metal medium 400, the volume of the first target gap 510 can be set relatively small. As an example, the ratio of the sum of the volumes of the first target body 200 and the second target body 300 to the volume of the first target gap 510 can be 3.5 to 4.5, 3.5 to 4, 4 to 4.5, etc. This disclosure does not limit this.

[0039] The deformability of at least one of the first target body 200 and the second target body 300 may include the deformability of both the first target body 200 and the second target body 300, or the deformability of only one of the first target body 200 and the second target body 300. This disclosure does not limit this. As an example, both the first target body 200 and the second target body 300 may be deformable to improve the deformability of the heat-conducting device.

[0040] The materials of the first target body 200 and the second target body 300 can be the same or different. As an example, the materials of the first target body 200 and the second target body 300 are different. Both the first target body 200 and the second target body 300 can be deformable. The material of the first target body 200 can be a thermally conductive metal material such as copper or aluminum, while the second target body 300 can be a non-metallic material such as foam, plastic, or rubber. Here, the second target body 300 can be arranged in a ring around the periphery of the first target body. The second target body 300 may not have thermal conductivity. The second target body 300 does not chemically react with the thermally conductive metal medium 400 and can stably confine the thermally conductive metal medium 400 within the first target gap 510 between the second target body 300 and the first target body 200. Of course, the second target body 300 can also be a polymer thermally conductive adhesive structure with thermal conductivity, such as silicone thermally conductive adhesive or non-silicone thermally conductive adhesive. Here, the second target body 300 neither reacts chemically with the thermally conductive metal medium 400, nor does it stably confine the thermally conductive metal medium 400 within the first target gap 510 between the second target body 300 and the first target body 200, and it is also thermally conductive. As another example, the first target body 200 and the second target body 300 are made of the same material, and both the first target body 200 and the second target body 300 can be deformable. The materials of the first target body 200 and the second target body 300 can be metal materials with thermal conductivity, such as copper or aluminum. Here, the second target body 300 can be arranged in a ring around the periphery of the first target part, and the second target body 300 can be thermally conductive. Of course, the second target body 300 can also be strip-shaped. Here, the heat-conducting device can also include shielding components such as heat-conducting adhesive structures, foam, plastics, rubber, and other non-metallic materials. The shielding components can be located around the first target body 200 and the second target body 300 to limit the placement range of the heat-conducting metal medium 400 and prevent the liquid heat-conducting metal medium 400 from moving to other areas, thereby improving the safety of the heat-conducting device. This disclosure does not limit this aspect.

[0041] In some examples, the substrate 100, the first target body 200, and the second target body 300 can be made of the same metal to improve the thermal conductivity of the heat-conducting device. As an example, the substrate 100, the first target body 200, and the second target body 300 can be made of the same material, such as copper or aluminum. Here, the first target body 200 and the second target body 300 can be in the form of strips.

[0042] In some examples, such as Figure 4 and Figure 5As shown, the number of first target bodies 200 can be at least two, the number of second target bodies 300 can be at least two, the at least two second target bodies 300 are located on at least one side of the at least two first target bodies 200, and there can be a second target gap 520 between adjacent first target bodies 200, and the heat-conducting metal medium 400 is disposed in the second target gap 520; some first target bodies 200 and second target bodies 300 have a first target gap 510; here, each target body is not connected, thereby greatly improving the deformation capability of the deformable target body.

[0043] Here, the first target body 200 and the second target body 300 can be the same or different. The first target gap 510 and the second target gap 520 can be the same or different. As an example, the first target body 200 and the second target body 300 are the same, both of which are deformable, and the first target gap 510 and the second target gap 520 can be the same to facilitate processing and manufacturing.

[0044] In this embodiment, the thermally conductive metal medium 400 can be in a liquid state. For example, the thermally conductive metal medium 400 can be in a liquid state at a set temperature. The set temperature can be the temperature at which the thermally conductive metal medium 400 changes from a solid state to a liquid state; in other words, the set temperature can be the melting point of the thermally conductive metal medium 400. The value of the set temperature is not limited. For example, the set temperature can be 30 to 40 degrees Celsius, 35 to 40 degrees Celsius, 30 to 35 degrees Celsius, etc. Here, at room temperature, the thermally conductive metal medium 400 can be in a solid state to facilitate the installation and transportation of the heat-conducting device. Another example is that the set temperature can be 0 to 10 degrees Celsius, 10 to 30 degrees Celsius, 10 to 20 degrees Celsius, 20 to 50 degrees Celsius, 25 to 40 degrees Celsius, etc. The material of the thermally conductive metal medium 400 is not limited. The thermally conductive metal medium 400 can include pure metals or alloys. For example, the thermally conductive metal medium 400 can include at least one of metals such as gallium (Ga), indium (In), and tin (Sn). For example, the thermally conductive metal medium 400 may be at least one of gallium-indium alloy (Ga-In), gallium-indium-tin alloy (Ga-In-Sn), gallium-tin alloy (Ga-Sn), etc. This disclosure does not limit it in this respect.

[0045] During the manufacturing process, the ambient temperature can be higher than the set temperature. Here, the thermally conductive metal medium 400 can be in a liquid state, making it easy to fill the first target gap 510 and the second target gap 520 with the liquid thermally conductive metal medium 400. In some examples, at room temperature, the thermally conductive metal medium 400 is in a solid state, the first target body 200 and the second target body 300 are deformable, the substrate 100 can be flexible and deformable, and the heat-conducting device can be flexible and deformable as a whole to facilitate the installation of the heat-conducting device. During installation, since the thermally conductive metal medium 400 is within the space defined by the substrate 100, the first target body 200, and the second target body 300 as a framework, there is no need for a special machine for applying the liquid thermally conductive metal medium 400. The heat-conducting device can be placed as a whole at the installation position, which is convenient for installation, disassembly, and maintenance, and can reduce installation and after-sales maintenance costs. During use, the restrictive effect of the substrate 100, the first target body 200, and the second target body 300 reduces the risk of short circuits and material failure caused by the liquid thermally conductive metal medium 400 flowing into other structures, thereby improving the safety of the heat-conducting device. Simultaneously, the heat-conducting device as a whole can form a paste-like thermally conductive structure that is both deformable and conductive, greatly improving the fit between the heat-conducting device and structures such as the heating element 700. Furthermore, due to the restrictive effect of the substrate 100, the first target body 200, and the second target body 300, the liquid thermally conductive metal medium 400 is difficult to move outside the heat-conducting device.

[0046] In some implementations of the embodiments of this disclosure, the first deformation force of the deformable target body in the first target body 200 and the second target body 300 is greater than the second deformation force of the liquid thermally conductive metal medium 400; under the action of external force, the deformable target body deforms, and the liquid thermally conductive metal medium 400 located on the periphery of the deformable target body deforms. For example, during the installation of the heat-conducting device, it comes into contact with structures such as the heating element 700. When the external force between the heating element 700 and the heat-conducting device is greater than or equal to the first deformation force, the second deformation force of the liquid heat-conducting metal medium 400 is relatively small, causing the deformable target body to deform. This improves the tightness of the fit between the deformable target body and the heating element 700 and other structures. At the same time, since the second deformation force of the liquid heat-conducting metal medium 400 is less than the first deformation force, the liquid heat-conducting metal medium 400 located on the periphery of the deformable target body can also deform adaptively after the target body is deformed. This further improves the tightness of the fit between the heat-conducting metal medium 400 and the heating element 700 and other structures, thereby improving the heat conduction performance of the heat-conducting device.

[0047] In this implementation, the thermally conductive metal medium 400 can be in a liquid state during installation, where the ambient temperature during installation is higher than the set temperature. Alternatively, the thermally conductive metal medium 400 can be in a liquid state during the heat conduction process of the heat-conducting device and in a solid state during installation to improve installation safety. Here, the ambient temperature during installation is lower than the set temperature, and the heat conduction temperature of the heat-conducting device is higher than the set temperature. This disclosure does not limit this aspect.

[0048] In this implementation, both the first target body 200 and the second target body 300 can be deformable, and the first deformation forces of the first target body 200 and the second target body 300 can be the same or different. As an example, the first target body 200 and the second target body 300 are the same.

[0049] In this implementation, the value of the first deformation force is not limited. For example, the value of the first deformation force can be 20 psi (pounds per square inch) to 30 psi, 25 psi to 30 psi, 20 psi to 25 psi, etc. This disclosure does not limit it.

[0050] In some examples, the electronic device can be a computer, and the locking force between the heating element 700 and the heat-conducting device can be greater than the first deformation force. For example, the locking force between the heating element 700 and the heat-conducting device can be 40 psi to 50 psi, 35 psi to 40 psi, 32 psi to 37 psi, etc. By making the first deformation force less than the locking force between the heating element 700 and the heat-conducting device, the tightness of the fit between the heating element 700 and the heat-conducting device can be greatly increased. At the same time, a more suitable first deformation force can also improve the relatively stable first target gap 510 between the first target body 200 and the second target body 300 for the heat-conducting metal medium 400, which facilitates the formation of a skeleton structure for setting the heat-conducting metal medium 400.

[0051] In some implementations of the embodiments of this disclosure, the deformable target body in the first target body 200 and the second target body 300 includes a core and a wrapping portion surrounding the core. A portion of the thermally conductive metal medium 400 and the wrapping portion react to form a reaction layer. The reaction layer wraps around the outside of the core and deforms together with it. This deformation of the reaction layer with the core allows the core to bring the reaction layer into closer contact with the structure such as the heating element 700. For example, in some examples, the surface of the structure such as the heating element 700 may have a recessed area. The core can bring the reaction layer into the recessed area, thereby increasing the amount of heat-conducting device entering the recessed area, and thus improving the tightness of the contact between the heat-conducting device and the structure such as the heating element 700. Simultaneously, the reaction layer can also prevent the remaining portion of the thermally conductive metal medium 400 from continuing to react with the target body, thereby reducing the rate at which the remaining portion of the thermally conductive metal medium 400 continues to react with the target body, thus maintaining a certain amount of unreacted thermally conductive metal medium 400.

[0052] In this implementation, the material of the target body is not limited. For example, the material of the target body may include one of copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), and gold (Au). The material of the thermally conductive metal medium 400 is not limited. For example, the material of the thermally conductive metal medium 400 may include at least one of gallium (Ga), indium (In), and tin (Sn). The reaction layer may include a compound formed by a chemical reaction between the target body and the thermally conductive metal medium 400. The composition of the reaction layer is not limited. For example, the reaction layer may include copper digabide (CuGa2), copper tritinide (Cu3Sn), etc.

[0053] In this implementation, at least one of the first target body 200 and the second target body 300 is deformable. For example, as Figure 6 As shown, both the first target body 200 and the second target body 300 are deformable. The first target body 200 may include a first core 210 and a first wrapping portion 220 surrounding the first core 210. A portion of the thermally conductive metal medium 400 and the first wrapping portion 220 can react to form a first reaction layer 410. The first reaction layer 410 wraps around the outside of the first core 210 and deforms together with the first core 210. The first core 210 can drive the first reaction layer 410 to deform together, causing the first reaction layer 410 to move to the region corresponding to the first core 210. The second target body 300 may include a second core and a second wrapping portion surrounding the second core. A portion of the thermally conductive metal medium 400 and the second wrapping portion can react to form a second reaction layer 420. The second reaction layer 420 wraps around the outside of the second core and deforms together with the second core. The second core can drive the second reaction layer 420 to deform together, causing the second reaction layer 420 to move to the region corresponding to the second core.

[0054] In this implementation, the shape of the core is not limited. For example, the core can be block-shaped, strip-shaped, column-shaped, whisker-shaped, etc. For example, the shape of the first core 210 can be the same as the shape of the first target body 200, and the shape of the second core can be the same as the shape of the second target body 300.

[0055] In this implementation, the shape of the wrapping part is not limited. For example, the wrapping part can be cylindrical, cap-shaped, etc. One end of the core is connected to the substrate 100, and the periphery of the core is surrounded by the wrapping part, which can reduce the reaction rate between the remaining part of the heat-conducting metal medium 400 and the core.

[0056] In this implementation, a portion of the thermally conductive metal medium 400 reacts with the entirety of the encapsulation portion to form a reaction layer. For example, such as... Figure 6As shown, the first target body 200 and the second target body 300 can be strip-shaped. One end of each of the first target body 200 and the second target body 300 is connected to the base 100 in the thickness direction. A portion of the thermally conductive metal medium 400 contacts a portion of the first encapsulation portion 220. A portion of the thermally conductive metal medium 400 can move along the surface of the first target body 200 and react with the entire first encapsulation portion 220 to form a cylindrical first reaction layer 410. Similarly, a portion of the thermally conductive metal medium 400 can move along the surface of the second target body 300 and react with the entire second encapsulation portion to form a cylindrical second reaction layer 420. During manufacturing, the other ends of the first target body 200 and the second target body 300 can be shielded by tooling or similar fixtures to prevent the other ends of the first target body 200 and the second target body 300 from reacting with the portion of the thermally conductive metal medium 400, thus allowing the other ends of the first target body 200 and the second target body 300 to contact structures such as the heating element 700. Of course, in other examples, the other ends of the first target 200 and the second target 300 may also partially react with the thermally conductive metal medium 400, where the encapsulation portion is cap-shaped and the reaction layer is cap-shaped. This disclosure does not limit this.

[0057] In this implementation, the target body can be made of copper, and the thermally conductive metal medium 400 can be made of gallium; copper and gallium can react chemically to form a compound, and the compound forms a reaction layer.

[0058] In this implementation, the reaction layer is solid during use, while the thermally conductive metal medium 400 can be liquid. In some examples, the reaction layer can enter the corresponding recessed area along with the core, and the unreacted thermally conductive metal medium 400 can flow in the remaining area, thereby improving the tightness of the fit between the heat-conducting device and the recessed area.

[0059] In this implementation, the target material can be copper, and the thermally conductive metal medium 400 can be gallium. Copper and gallium can react chemically to form a compound, which forms a reaction layer. This reaction layer reduces the rate at which gallium continues to react with the target material and also causes the reaction layer to deform along with the target material. Furthermore, copper has good thermal conductivity, significantly improving the thermal conductivity of the heat-conducting device. Additionally, gallium has a relatively low melting point, higher than room temperature. When the heat-conducting device is conducting heat, liquid gallium can enhance thermal conductivity. When the device is not conducting heat, gallium can remain solid, improving the safety of gallium transportation and storage and reducing the risk of gallium corroding other structures.

[0060] Here, the chemical reaction can be an alloying reaction between gallium and solid copper, mainly involving atomic diffusion and producing intermetallic compounds.

[0061] Here, the thermally conductive metal medium 400 may also include liquid metals such as indium (In) and tin (Sn). This disclosure does not limit this.

[0062] The composition of the compound is not limited here. For example, the compound may include copper digabium (CuGa2), copper 9-gabium (Cu9Ga4), etc. This disclosure does not limit this.

[0063] In some implementations of the embodiments of this disclosure, when the first target body 200 and the second target body 300 are in contact with the heating element 700, the deformable target body can contact the recessed area of ​​the heating element 700 through deformation, thereby improving the tightness of the contact between the heat conduction device and the recessed area.

[0064] In this implementation, when the heat-conducting metal medium 400 is in a liquid state, the deformable target body is not subject to the pulling force of other target bodies, and thus can contact the recessed area of ​​the heating element 700 based on its own deformation. If the target body is connected to other target bodies, for example, a mesh-like heat-conducting structure, due to the connection of the various structures, it is difficult for the mesh-like heat-conducting structure to enter the recessed area of ​​the heating element 700, or the amount of the mesh-like heat-conducting structure entering the recessed area of ​​the heating element 700 is relatively small. Therefore, by ensuring that the target body is not pulled by other target bodies, the amount of a single target body entering the recessed area of ​​the heating element 700 can be greatly increased, thereby improving the tightness of the contact between the heat-conducting device and the recessed area of ​​the heating element 700, increasing the contact area, and increasing the heat conduction performance.

[0065] In this implementation, at least one of the first target body 200 and the second target body 300 is deformable. For example, both the first target body 200 and the second target body 300 may be deformable, thereby improving the tightness of contact between the first target body 200 and the second target body 300 and the recessed area corresponding to the heat-conducting device.

[0066] In this implementation, the method of forming the recessed area is not limited. For example, the recessed area can be formed by impact from a foreign object, assembly and extrusion, processing, etc. This disclosure does not limit this. For example, a relatively low area exists on the surface of the heating element 700 during processing, which is a recessed area of ​​the heating element 700. The recessed area of ​​the heating element 700 can be a microstructural feature formed during the processing of the heating element 700, while the surface of the heating element 700 can be planar macroscopically. The depth of the recessed area on the surface of the heating element 700 can be represented by the surface roughness of the heating element; different roughnesses result in different depths of the recessed area. In this disclosure, the depth of the recessed area is not limited.

[0067] In this implementation, the number of recessed areas in the heating element 700 is not limited. For example, the heating element 700 may have one recessed area, at least two recessed areas, at least three recessed areas, etc. When the number of recessed areas in the heating element 700 is at least two, the depths of the at least two recessed areas may be the same or different. This disclosure does not limit this.

[0068] In some implementations of the embodiments of this disclosure, the first target body 200 is deformable; the first target body 200 includes a first sub-target body 201 and a second sub-target body 202 spaced apart, the heights of the first sub-target body 201 and the second sub-target body 202 can be the same, when the first sub-target body 201 and the second sub-target body 202 are in contact with the heating element 700, the first sub-target body 201 and the second sub-target body 202 can contact the recessed areas of the heating element 700 at different depths through deformation, by the first sub-target body 201 and the second sub-target body 202 being independently arranged without connection, the first sub-target body 201 and the second sub-target body 202 can adaptively contact the recessed areas of different depths, thereby greatly improving the tightness of the contact between the heat conduction device and the uneven surface of the heating element 700.

[0069] In this implementation, the number of first sub-target bodies 201 is not limited. For example, the number of first target bodies 200 can be at least one, at least two, at least three, at least four, etc. The number of second sub-target bodies 202 is not limited. For example, the number of second target bodies 300 can be at least one, at least two, at least three, at least four, etc. As an example, such as Figure 4 As shown, the number of first sub-targets 201 can be 7. The number of second sub-targets 202 can be 6.

[0070] In some examples, when there are at least two first sub-target bodies 201 and at least two second sub-target bodies 202, the at least two first sub-target bodies 201 and at least two second sub-target bodies 202 can be arranged adjacently, staggered, etc. By having at least two first sub-target bodies 201 and at least two second sub-target bodies in contact with the heat-generating element 700, the tightness of contact between the at least two first sub-target bodies 201 and at least two second sub-target bodies and each region of the heat-generating element 700 can be greatly improved, thereby increasing the contact area and thermal conductivity of each region.

[0071] In some implementations of the embodiments disclosed herein, the first target body 200 is deformable and may include at least two spaced-apart third sub-target bodies 203 and at least two spaced-apart fourth sub-target bodies 204; the at least two third sub-target bodies 203 and at least two fourth sub-target bodies 204 are located in different regions on the same surface side of the substrate 100; the thermally conductive metal medium 400 between the at least two third sub-target bodies 203 may have a first temperature, and the thermally conductive metal medium 400 between the at least two fourth sub-target bodies 204 may have a second temperature; when the first temperature is greater than the second temperature... The heat-conducting metal medium 400 between at least two third sub-target bodies 203 can move into the gap between at least two fourth sub-target bodies 204. Through this movement, heat can be transferred from the at least two third sub-target bodies 203 to the at least two fourth sub-target bodies 204. This prevents the temperature at the at least two third sub-target bodies 203 from becoming relatively high, improves the uniformity of heat conduction in the heat-conducting device, and reduces the risk of localized high temperatures in structures such as the heating element 700 in contact with the heat-conducting device. If the liquid metal in the heat-conducting structure is placed within a grid-like interval, the liquid metal can only move within the grid-like interval and cannot move into the gaps between other grids. The temperature in areas with relatively high temperatures in the heat-conducting structure may remain relatively high, resulting in large temperature differences and poor temperature uniformity across different areas of the heat-conducting structure.

[0072] In this implementation, since the target objects are not connected to each other, the thermally conductive metal medium 400 can move to various regions on the outer surface of the substrate 100. In some examples, when the temperatures of the thermally conductive metal medium 400 in different regions are different, the thermally conductive metal medium 400 with a relatively higher temperature can move to the region with a lower temperature due to changes in density, volume, etc. After releasing heat in the region with a relatively lower temperature, its density, volume, etc., changes again and it moves to the region with a relatively higher temperature. This cycle repeats to transfer heat from the region with a relatively higher temperature to the region with a relatively lower temperature. The principle of this movement is not limited. For example, it can be based on principles such as heat-driven convection.

[0073] In this implementation, the number of at least two spaced-apart third sub-target bodies 203 and at least two spaced-apart fourth sub-target bodies 204, the outer surfaces on which they are disposed, and the areas where they are disposed are all subject to different limitations. For example, at least two spaced-apart third sub-target bodies 203 and at least two spaced-apart fourth sub-target bodies 204 can be disposed on the first outer surface 110 and the second outer surface 120 of the substrate 100, thereby improving the temperature uniformity performance of the heat-conducting device on the first outer surface 110 and the second outer surface 120. As another example, at least two spaced-apart third sub-target bodies 203 and at least two spaced-apart fourth sub-target bodies 204 can be located in multiple regions of an outer surface. This disclosure does not limit this aspect.

[0074] It should be noted that the regions on an outer surface where at least two spaced-apart third sub-target bodies 203 and at least two spaced-apart fourth sub-target bodies 204 are located are determined by the structure of the heating element 700 and other components in contact with the heat-conducting device. For example, the heating element 700 is disposed on the first outer surface 110 side of the base 100, and at least two first target bodies 200 are disposed on the first outer surface 110. The heating element 700 has a first region 710 and a second region 720 facing the first outer surface 110. When the temperature of the first region 710 is greater than the temperature of the second region 720, the first target body 200 corresponding to the first region 710 is the third sub-target body 203, and the first target body 200 corresponding to the second region 720 is the fourth sub-target body 204. The temperature of the third sub-target body 203 is greater than the temperature of the fourth sub-target body 204. Here, the first temperature of the heat-conducting metal medium 400 between at least two third sub-target bodies 203 can be greater than the second temperature of the heat-conducting metal medium 400 between at least two fourth sub-target bodies 204.

[0075] In this implementation, the first temperature and the second temperature are not limited. For example, the first temperature can be 75 to 85 degrees, 60 to 90 degrees, 85 to 100 degrees, etc. Similarly, the second temperature can be 30 to 40 degrees, 40 to 50 degrees, 35 to 45 degrees, etc. This disclosure does not impose any limitations on these aspects.

[0076] In some examples, such as Figure 7As shown, the heat-conducting device may include at least two first target bodies 200 and at least two second target bodies 300. The at least two first target bodies 200 and at least two second target bodies 300 may be disposed on the first outer surface 110. The at least two second target bodies 300 may be located around the at least two first target bodies 200. The first outer surface 110 may include at least two first sub-regions 111 and at least two second sub-regions 112. The first sub-regions 111 may be provided with at least two third sub-target bodies 203, and the second sub-regions 112 may be provided with at least two fourth sub-target bodies 204. The first sub-regions 111 are used to be opposite to the first region 710 of the heating element 700. The second sub-region 112 is configured to be positioned opposite to the second region 720 of the heating element 700. Heat from the first region 710 of the heating element 700 can be transferred to the second sub-region 112 through the thermally conductive metal medium 400 between at least two third sub-target bodies 203. At the same time, heat from the first region 710 of the heating element 700 can also be transferred to the first sub-region 111 through the thermally conductive metal medium 400 between at least two third sub-target bodies 203. This improves the heat conduction capability of the heat conduction device to conduct heat to the first region 710 of the heating element 700, reduces the risk of the first region 710 of the heating element 700 reaching a high temperature, and improves the safety of the heating element 700 in use.

[0077] Of course, in other examples, such as Figure 8 and Figure 9 As shown, at least two first target bodies 200 and at least two second target bodies 300 can also be disposed on the second outer surface 120. The at least two first target bodies 200 and at least two second target bodies 300 on the second outer surface 120 side can contact the heat-conducting element, etc. Similarly, since the target bodies on the second outer surface 120 side are not connected to each other, the temperature uniformity of heat conduction by the heat-conducting element for the heat-conducting device can be improved. For example, the heat at the first sub-region 111 can be transferred to different regions through the heat-conducting metal medium 400 on the second outer surface 120 side, and the heat in the same region can be transferred away through different regions of the heat-conducting element, thereby further improving the temperature uniformity of the heat-conducting device.

[0078] In some implementations of this public embodiment, such as Figure 3As shown, the substrate 100 may include a first outer surface 110 and a second outer surface 120 disposed opposite to each other in the thickness direction; the first target body 200 and the second target body 300 are disposed on at least one of the outer surfaces of the first outer surface 110 and the second outer surface 120; the thermal conductivity of the heat-conducting device in the thickness direction of the substrate 100 may be greater than the thermal conductivity of the heat-conducting device in the length direction or the width direction of the substrate 100; since the thermal conductivity of the heat-conducting device in the thickness direction of the substrate 100 is greater than the thermal conductivity of the heat-conducting device in the length direction or the width direction of the substrate 100, when the heating element 700 and the heat-conducting element are disposed on the first outer surface 110 and the second outer surface 120, the heat conduction capability provided by the heat-conducting device to the heating element 700 and the heat-conducting element in the thickness direction can be improved.

[0079] like Figure 1 and Figure 2 As shown, the first target body 200 and the second target body 300 can be disposed on the first outer surface 110 by means of bonding, welding, or other methods. For example, as... Figure 3 As shown, the first target body 200 and the second target body 300 can be disposed on the first outer surface 110 and the second outer surface 120 by means of bonding, welding, or other methods. Of course, the first target body 200 and the second target body 300 can also be disposed on the second outer surface 120 by means of bonding, welding, or other methods. This disclosure does not limit this.

[0080] The method by which the thermal conductivity of the heat-conducting device in the thickness direction of the substrate 100 is greater than that in the length or width direction of the substrate 100 is not limited. For example, the thermal conductivity of the first target body 200 can be greater than that of the thermally conductive metal medium 400, such as... Figures 1 to 3 As shown, heat can be directly transferred along the thickness direction through the first target body 200, which has a relatively high thermal conductivity. However, along the length or width direction of the substrate 100, heat needs to be transferred through the thermally conductive metal medium 400, which has a relatively low thermal conductivity. Alternatively, the thermal conductivity of the second target body 300 can be greater than that of the thermally conductive metal medium 400, such as... Figures 1 to 3 As shown, heat can be directly transferred in the thickness direction through the second target body 300 with a relatively high thermal conductivity. In the length or width direction of the substrate 100, heat needs to be transferred through the thermally conductive metal medium 400 with a relatively low thermal conductivity.

[0081] Here, as Figure 8 and Figure 9 As shown, the dimension of the heat-conducting device in the length direction can be larger than its dimension in the thickness direction, and the dimension of the heat-conducting device in the width direction can be larger than its dimension in the thickness direction.

[0082] Here, the thermal conductivity of the heat-conducting device in the thickness direction is not limited. For example, the thermal conductivity of the heat-conducting device in the thickness direction can be greater than that of the heat-conducting metal medium 400. By setting the first target body 200 and the second target body 300 with relatively large thermal conductivity, the overall thermal conductivity of the heat-conducting device can be improved, and it can also serve as a framework to limit the movement of the heat-conducting metal medium 400, thereby greatly improving the adaptability of the heat-conducting device.

[0083] In some examples, where the materials of the first target 200, the second target 300, and the substrate 100 are copper, and the thermally conductive metal medium 400 includes gallium, the thermal conductivity of the heat-conducting device in the thickness direction can be 35 W / (mK) to 45 W / (mK), 40 W / (mK) to 45 W / (mK), 35 W / (mK) to 40 W / (mK), etc. The thermal conductivity of the heat-conducting device in the length or width direction can be 30 W / (mK) to 40 W / (mK), 28 W / (mK) to 30 W / (mK), 30 W / (mK) to 35 W / (mK), etc. The thermal conductivity of the thermally conductive metal medium 400 can be 25 W / (mK) to 27 W / (mK), 20 W / (mK) to 25 W / (mK), 23 W / (mK) to 26 W / (mK), etc.

[0084] In some implementations of the embodiments of this disclosure, the first target body 200 and the second target body 300 may be disposed at intervals on the first outer surface 110 and the second outer surface 120 of the substrate 100.

[0085] In this implementation, the formation method of the first target body 200 and the second target body 300 is not limited. For example, the first target body 200 and the second target body 300 can be prepared by methods such as template method, solution chemical synthesis method, and template-free electrodeposition method. This disclosure does not limit this method.

[0086] In some examples, the first target body 200 and the second target body 300 can be made of the same material. The first film layer 610 and the second film layer 620 can be formed on the first outer surface 110 and the second outer surface 120 of the substrate 100 by bonding, welding, or injection molding. The materials of the first film layer 610 and the second film layer 620 can be polymer materials such as polycarbonate (PC) and polyester (PET). The substrate 100 is located between the first film layer 610 and the second film layer 620 in the thickness direction. The first film layer 610 and the second film layer 620 can have first through holes 631 and second through holes 632 formed by laser, high-energy heavy ion irradiation, chemical etching, etc. The substrate 100 is placed in an electrolyte containing the materials of the first target body 200 and the second target body 300 for electroplating. For example, the materials of the first target body 200 and the second target body 300 are copper, and the electrolyte is a copper electrolyte, so that the first through holes 631 and the second through holes 632 form the first target body 200 and the second target body 300. Figure 10 As shown. The substrate 100 is then placed in the removal solvent 640 to remove the first film layer 610 and the second film layer 620, as follows. Figure 11 As shown, the solvent 640 can be dichloromethane (CH2Cl2), chloroform (CHCl3), N-methyl-2-pyrrolidone (NMP), or other solvents capable of removing the first film layer 610 and the second film layer 620, and which do not react with the first target 200 and the second target 300. After removing the first film layer 610 and the second film layer 620, a first target gap 510 is formed between the first target 200 and the second target 300, and a second target gap 520 is formed between two adjacent first target 200s, as shown. Figure 12 As shown, a heat-conducting metal medium 400 can be disposed in the first target gap 510 and the second target gap 520 to form a heat-conducting device.

[0087] Here, before placing the substrate 100 in the removal solvent 640, the substrate 100 can be rinsed in deionized water to remove electrolyte, ionic contaminants, etc. IPA (isopropanol) rinsing can also be performed to remove electrolyte, ionic contaminants, moisture, etc.

[0088] The first through hole 631 can be used to form the first target body 200, and the second through hole 632 can be used to form the second target body 300. The first target body 200 and the second target body can have the same size, and the first through hole 631 and the second through hole 632 can also have the same size. Of course, the first target body 200 and the second target body can also have different sizes, and the first through hole 631 forming the first target body 200 and the second through hole 632 forming the second target body 300 can also have different sizes.

[0089] The positions of the first through hole 631 and the second through hole 632 are not limited. For example, the second through hole 632 can be located on one side of the first through hole 631, on opposite sides, adjacent sides, or on the periphery. As an example, such as Figure 10 As shown, the number of second through holes 632 can be at least two, the number of first through holes 631 can be at least two, and at least two second through holes 632 can be located around at least two first through holes 631; in other words, the second through holes 632 can be located on the outermost side in both the length and width directions.

[0090] The size of the first through hole 631 is not limited. For example, the minimum size of the first through hole 631 can be 0.1um to 1um, 0.2um to 1um, 0.4um to 1um, 0.5um to 0.9um, 0.6um to 0.8um, 0.7um to 0.8um, etc.

[0091] The size of the second through hole 632 is not limited. For example, the minimum size of the second through hole 632 can be 0.1um to 1um, 0.2um to 1um, 0.4um to 1um, 0.5um to 0.9um, 0.6um to 0.8um, 0.7um to 0.8um, etc.

[0092] This embodiment describes an electronic device, including a heat-conducting device and a heat-generating element 700. The heat-conducting device may include a substrate 100, a first target body 200, a second target body 300, and a heat-conducting metal medium 400. The first target body 200 and the second target body 300 may be spaced apart on the first outer surface 110 of the substrate 100; a first target gap 510 may be formed between the first target body 200 and the second target body 300; at least one of the first target body 200 and the second target body 300 is deformable; the heat-conducting metal medium 400 may be disposed within the first target gap 510; the heat-conducting metal may be in a liquid state; the heat-generating element 700 may be disposed on the first outer surface 110 side of the substrate 100; the heat-generating element 700 is in contact with the first target body 200, the second target body 300, and the heat-conducting metal medium 400 respectively; the heat-generating element 700... When in operation, the thermally conductive metal medium 400 is in a liquid state. The heat from the heating element 700 can be transferred away through the first target body 200, the second target body 300, and the liquid thermally conductive metal medium 400. At the same time, since the first target body 200 and the second target body 300 are not connected to each other, the thermally conductive metal medium 400 can move in various regions on the first outer surface 110 side. This not only improves the uniformity of the thermally conductive metal medium 400 in various regions of the first outer surface 110, but also transfers the heat from the relatively high temperature areas of the heating element 700 to other areas of the heat-conducting device.

[0093] The above embodiments have described the heat-conducting device, the substrate 100, the first target body 200, the second target body 300, and the heat-conducting metal medium 400, which will not be repeated here.

[0094] In the embodiments disclosed herein, the structure of the electronic device is not limited. For example, the electronic device may be a mobile phone, tablet, laptop, or other electronic device.

[0095] In the embodiments of this disclosure, the thickness of the heat-conducting device is not limited. For example, the thickness of the heat-conducting device can be less than 1 mm, 0.9 mm, 0.8 mm, etc. As an example, the thickness of the heat-conducting device can be 0.15 mm to 0.2 mm, 0.1 mm to 0.3 mm, 0.1 mm to 0.5 mm, etc. This disclosure does not limit it in this respect.

[0096] In this embodiment, the structure of the heat-generating element 700 is not limited. For example, the heat-generating element 700 may include a power supply, electronic components, memory, or other heat-generating structures. As an example, the heat-generating element 700 may be a heat-generating structure with processing capabilities, such as a central processing unit (CPU) or a graphics processing unit (GPU). As an example, the heat-generating element 700 may be a resistor, capacitor, inductor, diode, transistor, field-effect transistor, transformer, integrated circuit, etc. This disclosure does not limit its scope.

[0097] The thickness of the heating element 700 is not limited. For example, the thickness of the heating element 700 may be less than 1 mm, 0.9 mm, 0.8 mm, etc. As an example, the thickness of the heating element 700 may be 0.1 mm to 0.2 mm, 0.2 mm to 0.3 mm, 0.15 mm to 0.25 mm, etc. This disclosure does not limit it in this respect.

[0098] In some implementations of the embodiments of this disclosure, the heating element 700 facing the first outer surface 110 may have a first region 710 and a second region 720. The first target body 200 may include at least two spaced-apart third sub-target bodies 203 and at least two spaced-apart fourth sub-target bodies 204. At least two third sub-target bodies 203 are in contact with the first region 710, and at least two fourth sub-target bodies 204 are in contact with the second region 720. When the temperature of the first region 710 is higher than the temperature of the second region 720, the thermally conductive metal medium 400 between the at least two third sub-target bodies 203 can move to the gap between the at least two fourth sub-target bodies 204 on the side of the second region 720. This allows the heat of the first region 710 to be carried away both through the area where the at least two third sub-target bodies 203 are located and through the area where the at least two fourth sub-target bodies 204 are located, reducing the risk of the first region 710 having a relatively high temperature and improving the temperature uniformity of the heating element 700.

[0099] The above embodiments have described at least two spaced third sub-target bodies 203 and at least two spaced fourth sub-target bodies 204, as well as the first deformation force, and will not be repeated here.

[0100] In this implementation, the area, relative size, and number of the first region 710 and the second region 720 are not limited. For example, the heat-generating component 700 can be a CPU, GPU, or other structure with processing capabilities. The first region 710 can be the core region of the heat-generating component 700. The temperature of the core region is relatively high, and if the temperature of the core region is too high, it may affect the performance of the heat-generating component 700. By using a heat-conducting device to ensure uniform heat distribution, the maximum temperature of the core region can be reduced, thereby improving the safety of the heat-generating component 700 in use.

[0101] In this implementation, the heating element 700 can exert a first force on the first target body 200. The first force can be greater than the first deformation force of the first target body 200. By making the first force greater than the first deformation force, the first target body 200 can be deformed, thereby improving the tightness of contact between the first target body 200 and the heating element 700. At the same time, if there is a recessed area on the surface of the heating element 700, the first target body 200 can deform into the recessed area of ​​the heating element 700, thereby further improving the tightness of contact between the first target body 200 and the heating element 700.

[0102] The first force is the locking force between the heating element 700 and the heat-conducting device. This first force is less than the force that would damage or cause malfunction of the heating element 700. The value of the first force is not limited. For example, the first force can be 40 psi to 50 psi, 35 psi to 40 psi, 32 psi to 37 psi, etc. It should be noted that if the first force is too large, the heating element 700 may be damaged or malfunction. As an example, the heating element 700 can be mounted on the motherboard by soldering or other methods. The first force can be less than the connection force at the soldered area between the heating element 700 and the motherboard to prevent the heating element 700 from separating from the motherboard. The first force can also be less than the deformation force on the motherboard to prevent deformation that could affect the performance of the electronic device. In this disclosure, the first target body 200 can be deformed by making the first deformation force less than the first action force without affecting the performance of the electronic device. When the deformation force of the heat-conducting structure's mesh structure is greater than the first action force, the performance of the electronic device is affected when the heat-conducting structure's mesh structure is deformed. For example, the heating element 700 may be damaged, the welding area may be damaged, the motherboard may be deformed, or the heat-conducting structure's mesh structure may not be able to deform at all.

[0103] In this implementation, the substrate 100 may include a first outer surface 110 and a second outer surface 120 disposed opposite to each other in the thickness direction; the first target body 200 and the second target body 300 may be disposed at intervals on the second outer surface 120; the electronic device may include a heat-conducting element, which may be disposed on the side of the second outer surface 120 of the substrate 100; the heat-conducting element may contact the first target body 200, the second target body 300 and the heat-conducting metal medium 400 respectively; wherein, the heating element 700 facing the first outer surface 110 may have a third region 730 and a fourth region 740; there may be a first distance L1 between the third region 730 and the heat-conducting element, and there may be a second distance L2 between the fourth region 740 and the heat-conducting element; the first distance L1 may be greater than the second distance L2; after the heating element 700 operates for a first time, the thickness of the heat-conducting device at the third region 730 increases, and the thickness of the heat-conducting device at the fourth region 740 decreases.

[0104] In this implementation, before installation, the thickness of the third region 730 and the thickness of the fourth region 740 of the heat-conducting device can be the same or substantially the same. After installation, the heat-conducting device is located between the heating element 700 and the heat-conducting element in the thickness direction, and the thickness of the third region 730 and the thickness of the fourth region 740 can be the same or substantially the same. When the heating element 700 is working, the heat-conducting metal medium 400 is in a liquid state. The deformation of the first target body 200 and the second target body 300 in the third region 730 is relatively small, and the interaction force between the heat-conducting metal medium 400 in the third region 730 is relatively small. The deformation of the first target body 200 and the second target body 300 in the fourth region 740 is relatively large, and the interaction force between the heat-conducting metal medium 400 in the fourth region 740 is relatively large. The heat-conducting metal medium 400 in the fourth region 740 can move towards the side of the third region 730 with a larger distance, thereby allowing the third region 730 to... The amount of heat-conducting metal medium 400 increases, and the cycle continues. For example, after the heating element 700 has been working for a short time, the amount of heat-conducting metal medium 400 that has moved to the third region 730 reaches equilibrium. For example, the interaction force between the heat-conducting metal medium 400 in the third region 730 is basically the same as the interaction force between the heat-conducting metal medium 400 in the fourth region 740. This allows the heat-conducting device to adaptively change the thickness of different regions and be positioned between the heating element 700 and the heat-conducting element at different distances, further improving the tightness of the contact between the heat-conducting device and each region of the heating element 700 and the heat-conducting element, as well as the heat conduction performance. At the same time, in some examples, the heat-conducting device of this disclosure can also reduce the problem that the heat-conducting device cannot contact the heating element 700 or the heat-conducting element due to the first distance L1 being too large.

[0105] In this implementation, the first time period is not limited. For example, the first time period can be 24 to 60 hours, 80 to 100 hours, 50 to 300 hours, etc. This disclosure does not limit this.

[0106] In this implementation, the structure of the heat-conducting component is not limited. For example, the heat-conducting component can be a solid structure. As an example, the heat-conducting component can be a structure with thermal conductivity such as copper or aluminum. As another example, the heat-conducting component can be a non-solid structure. As an example, the heat-conducting component can be a heat pipe, a vapor chamber, or other heat-conducting structure with a capillary structure. This disclosure does not limit this aspect.

[0107] The thickness of the thermally conductive component is not limited. For example, the thickness of the thermally conductive component can be 1 mm to 2 mm, 2 mm to 3 mm, 2 mm to 5 mm, etc. This disclosure does not limit it in this regard.

[0108] In this implementation, the area, region, and quantity of the third region 730 and the fourth region 740 are not limited. The third region 730 and the fourth region 740 can be regions with different dimensions in the thickness direction on the side of the heating element 700, and the formation method of the third region 730 and the fourth region 740 is not limited. For example, the third region 730 and the fourth region 740 can be formed by processing, manufacturing, transportation, impact, etc. Or, for example, the third region 730 and the fourth region 740 can be formed by compression, deformation, etc., after the heating element 700 has been in operation for a set time. Here, if the third region 730 and the fourth region 740 are formed by compression, deformation, etc., after the heating element 700 has been in operation for a set time, the heat-conducting metal medium 400 of the heat-conducting device can adaptably move continuously to improve its fit with the heating element 700, thereby greatly improving the adaptability of the heat-conducting device to scenarios where the installation space changes over time.

[0109] In this implementation, the regions corresponding to the heat-conducting element and the third region 730 and the fourth region 740 can be regions where the heat-conducting element has different dimensions in the thickness direction. The formation method of the regions corresponding to the heat-conducting element and the third region 730 and the fourth region 740 is similar to the formation method of the third region 730 and the fourth region 740 described above, and will not be repeated here.

[0110] In this implementation, the values ​​of the first spacing L1 and the second spacing L2 are not limited. For example, the second spacing L2 can be 0.15mm to 0.2mm, 0.1mm to 0.3mm, 0.1mm to 0.5mm, etc. This disclosure does not limit this. The difference between the first spacing L1 and the second spacing L2 can be 1um to 10um, 5um to 10um, 3um to 5um, etc. This disclosure does not limit this.

[0111] In this implementation, the heat-conducting component can exert a second force on the first target body 200, and this second force can be greater than the first deformation force of the first target body 200. The second force is a locking force between the heat-conducting component and the heat-conducting device, and is less than the force that would damage or cause failure of the heat-conducting component. The value of the second force is not limited. For example, the second force can be 40 psi to 50 psi, 35 psi to 40 psi, 32 psi to 37 psi, etc. This disclosure does not limit this.

[0112] In some examples, such as Figure 8 and Figure 9As shown, the substrate 100 may include a first outer surface 110 and a second outer surface 120 disposed opposite to each other in the thickness direction; a first target body 200 and a second target body 300 may be disposed on the first outer surface 110 and the second outer surface 120, the first target body 200 and the second target body 300 may be the same, and the number of the first target body 200 and the second target body 300 may be at least two, the thermally conductive metal medium 400 is disposed in the second target gap 520 between two adjacent first target bodies 200, and in the first target gap 510 between the first target bodies 200 and the second target bodies 300. The materials of the first target body 200, the second target and the substrate 100 may include copper, the thermally conductive metal medium 400 may include gallium, and the heat-generating element 700 may be a CPU. Compared with thermal grease of the same size, the thermally conductive device disclosed herein has better thermal conductivity and can reduce the temperature of a CPU with a power consumption of 145W to 88 degrees Celsius, which is 4 degrees Celsius lower than that of thermal grease, thereby greatly improving the heat dissipation capacity and safety of the CPU.

[0113] As shown in the table below,

[0114] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range. Words such as "including" or "comprising" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0115] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0116] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0117] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0118] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0119] In this article, the term "and / or" is merely a description of the relationship between related objects, identifying three possible relationships, such as A and / or B. Specifically, it can be understood as: A and B can be included simultaneously, A can exist alone, or B can exist alone, and any of the above three situations can be met.

[0120] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0121] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and scope of this application are included within the scope of protection of this application.

Claims

1. A heat-conducting device, comprising: Matrix; The first target body and the second target body are disposed at intervals on at least one outer surface of the substrate; A first target gap exists between the first target body and the second target body; at least one of the first target body and the second target body is deformable. A thermally conductive metal medium is disposed within the first target gap; The thermally conductive metal medium can be in a liquid state.

2. The heat-conducting device according to claim 1, wherein the first deformation force of the deformable target body in the first target body and the second target body is greater than the second deformation force of the liquid heat-conducting metal medium; Under the action of external force, the deformable target body deforms, and the liquid-like heat-conducting metal medium located on the periphery of the deformable target body deforms.

3. The heat-conducting device according to claim 1, wherein the deformable target body in the first target body and the second target body includes a core and a wrapping portion surrounding the core, wherein a portion of the heat-conducting metal medium and the wrapping portion can react to form a reaction layer, the reaction layer wrapping the outside of the core to deform together with the core.

4. The heat-conducting device according to claim 3, wherein the material of the target body is copper, and the material of the heat-conducting metal medium includes gallium; the copper and the gallium can undergo a chemical reaction to form a compound, and the compound forms the reaction layer.

5. In the heat-conducting device according to claim 1, when the first target body and the second target body are in contact with the heating element, the deformable target body can contact the recessed area of ​​the heating element through deformation; or, The first target body is deformable; the first target body includes a first sub-target body and a second sub-target body spaced apart, the first sub-target body and the second sub-target body have the same height, and when the first sub-target body and the second sub-target body are in contact with the heating element, the first sub-target body and the second sub-target body can contact the recessed areas of the heating element at different depths through deformation.

6. The heat-conducting device according to claim 1, wherein the first target body is deformable, and the first target body includes at least two spaced-apart third sub-target bodies and at least two spaced-apart fourth sub-target bodies; the at least two third sub-target bodies and the at least two fourth sub-target bodies are located in different regions on the same surface side of the substrate; The thermally conductive metal medium between at least two third sub-targets has a first temperature, and the thermally conductive metal medium between at least two fourth sub-targets has a second temperature; when the first temperature is greater than the second temperature, the thermally conductive metal medium between at least two third sub-targets can move into the gap between the at least two fourth sub-targets.

7. The heat-conducting device according to any one of claims 1 to 6, wherein the substrate includes a first outer surface and a second outer surface disposed opposite to each other in the thickness direction; the first target body and the second target body are disposed on at least one of the first outer surface and the second outer surface; the thermal conductivity of the heat-conducting device in the thickness direction of the substrate is greater than the thermal conductivity of the heat-conducting device in the length direction or the width direction of the substrate; and / or, The first target body has a circular cross-section perpendicular to the thickness direction of the substrate; and / or, The substrate, the first target body, and the second target body are all made of the same metal; and / or, The first target body is whisker-shaped; and / or, The maximum cross-sectional dimension of the first target body in the direction perpendicular to the thickness of the substrate is less than 1 μm.

8. An electronic device, comprising: The heat conduction device includes: Matrix; A first target body and a second target body are disposed at a distance from each other on the first outer surface of the substrate; a first target gap exists between the first target body and the second target body; at least one of the first target body and the second target body is deformable; A thermally conductive metal medium is disposed within the first target gap; the thermally conductive metal can be in a liquid state. A heating element is disposed on the first outer surface of the substrate; the heating element is in contact with the first target body, the second target body and the thermally conductive metal medium respectively; When the heating element is working, the thermally conductive metal medium is in a liquid state.

9. The electronic device according to claim 8, wherein the heating element has a first region and a second region on the side facing the first outer surface, and the first target body includes at least two spaced-apart third sub-target bodies and at least two spaced-apart fourth sub-target bodies; at least two third sub-target bodies are in contact with the first region, and at least two fourth sub-target bodies are in contact with the second region; When the temperature of the first region is greater than the temperature of the second region, the thermally conductive metal medium between at least two third sub-targets can move toward the gap between at least two fourth sub-targets on the second region side.

10. The electronic device according to claim 9, wherein the substrate includes a first outer surface and a second outer surface disposed opposite to each other in the thickness direction; a first target body and a second target body are spaced apart from each other on the second outer surface; the electronic device comprises: A heat-conducting component is disposed on the second outer surface side of the substrate; The heat-conducting component is in contact with the first target body, the second target body and the heat-conducting metal medium respectively; The heating element has a third region and a fourth region on the side facing the first outer surface; the third region has a first distance from the heat-conducting element, and the fourth region has a second distance from the heat-conducting element; the first distance is greater than the second distance. After the heating element starts working, the thickness of the heat-conducting device in the third region increases, and the thickness of the heat-conducting device in the fourth region decreases.

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