Heat dissipation fin, heat dissipation module and electronic device

Abstract

The application provides a heat dissipation fin, a heat dissipation module and an electronic device, and relates to the technical field of electronic products. The heat dissipation fin comprises a first plate body, a second plate body and a plurality of heat conduction fins, the first plate body and the second plate body are stacked and distributed along a first direction; the plurality of heat conduction fins are arranged between the first plate body and the second plate body, the plurality of heat conduction fins are arranged at intervals along a second direction, the first direction intersects the second direction; the first plate body can move along the first direction between a first position and a second position relative to the second plate body, in the case that the first plate body is at the first position, the interval distance between the first plate body and the second plate body is a first distance, and at least part of the area of the heat conduction fin is in a bent state; in the case that the first plate body is at the second position, the interval distance between the first plate body and the second plate body is a second distance, and the heat conduction fin is in a stretched state; the first distance is smaller than the second distance; the thinness, miniaturization and heat dissipation efficiency of the electronic device can be considered.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and in particular to a heat sink, a heat dissipation module, and an electronic device. Background Technology

[0002] Electronic components in electronic devices generate a significant amount of heat during operation, which needs to be dissipated quickly to prevent disruption to the device's continuous operation. However, the heat dissipation modules required for rapid heat dissipation occupy considerable space, conflicting with the miniaturization design of electronic devices. Therefore, balancing heat dissipation efficiency with miniaturization has become a pressing technical challenge in the current technological field. Summary of the Invention

[0003] This application provides a heat sink, a heat dissipation module, and an electronic device. The heat sink, when applied to an electronic device, can improve the heat dissipation efficiency of the electronic device and help to achieve miniaturization and thinner design of the electronic device.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, a heat dissipation fin is provided, which includes a first plate, a second plate, and a plurality of heat-conducting plates. The first plate and the second plate are stacked and distributed along a first direction. The plurality of heat-conducting plates are disposed between the first plate and the second plate and are arranged at intervals along a second direction, wherein the first direction and the second direction intersect.

[0005] The first plate can move relative to the second plate along a first direction between a first position and a second position. When the first plate is in the first position, the distance between the first plate and the second plate is a first distance, and at least a portion of the heat-conducting sheet is in a bent state. When the first plate is in the second position, the distance between the first plate and the second plate is a second distance, and the heat-conducting sheet is in a stretched state.

[0006] The first distance mentioned above is less than the second distance. That is, when the first plate changes from the first position to the second position, the distance between the first plate and the second plate increases, and the first plate moves away from the second plate. When the first plate changes from the second position to the first position, the distance between the first plate and the second plate decreases, and the first plate moves closer to the second plate.

[0007] When the first plate moves away from the second plate, the extension length of the heat-conducting fin in the first direction increases, the heat dissipation channel within the heat dissipation fin increases, and the air resistance decreases. Consequently, the airflow through the heat dissipation channel increases, allowing the heat dissipation fin to fully exchange heat with the airflow within the heat dissipation channel. The heat carried away by the airflow within the heat dissipation channel increases, resulting in better heat dissipation performance of the heat dissipation fin. When this heat dissipation fin is applied to electronic devices, it helps to improve the overall heat dissipation efficiency of the device.

[0008] The first plate can move relative to the second plate along a first direction between a first position and a second position, and the distance between the first and second plates can be adjusted as needed. It is understandable that when electronic devices are operating, especially under high load (e.g., when running games or other applications), the heat-generating components produce a significant amount of heat, leading to severe temperature increases; conversely, when operating under low load, the heat-generating components produce less heat.

[0009] Therefore, when the heat-generating components of an electronic device generate a large amount of heat and the heat dissipation effect needs to be improved, the distance between the first plate and the second plate can be adjusted to the second distance; when the heat-generating components of an electronic device generate a small amount of heat or the electronic device is not working, the distance between the first plate and the second plate can be adjusted to the first distance to avoid the heat dissipation fins occupying too much space inside the electronic device.

[0010] In this way, the heat sink fins can be kept to a minimum size when the electronic device is running under low load or not in use, thus achieving the goal of making the electronic device thinner and smaller; at the same time, the heat sink fins can be used in specific scenarios to ensure strong heat dissipation capacity and improve the heat dissipation efficiency of the electronic device.

[0011] In one possible implementation of the first aspect, the heat-conducting sheet includes a first portion and a second portion, the first portion being connected to the second portion; when the first plate moves relative to the second plate between a first position and a second position, the first portion changes between a bent state and a stretched state. By changing the first portion between the bent and stretched states, the size of the heat dissipation channel can be altered, thereby improving the heat dissipation effect.

[0012] The second part can remain unchanged and can serve as the rigid part of the heat-conducting plate to support the first part, which helps to achieve the installation and positioning of the heat-conducting plate between the first plate and the second plate.

[0013] In one possible implementation of the first aspect, the first portion is connected to the first plate and the second portion is connected to the second plate, such that the heat-conducting sheet is connected between the first plate and the second plate.

[0014] In one possible implementation of the first aspect, a second portion is provided, which is connected between the first portion and the second plate to connect the heat-conducting sheet to the second plate; the second portion may also provide support for the first portion.

[0015] In one possible implementation of the first aspect, two second parts are provided, with the first part connected between the two second parts, and the two second parts are fixedly connected to the first plate and the second plate respectively, so that the two second parts can provide support for the first part on opposite sides of the first part.

[0016] In one possible implementation of the first aspect, the material of the first part includes graphene, which has thermal conductivity and can conduct and dissipate heat.

[0017] In one possible implementation of the first aspect, a portion of the first part and the second part are stacked and fixedly connected in the second direction. This increases the connection area between the first part and the second part, thereby improving the connection reliability between the first part and the second part and thus enhancing the overall reliability of the heat-conducting sheet.

[0018] In one possible implementation of the first aspect, when at least a portion of the heat-conducting sheet is in a bent state, at least a portion of the heat-conducting sheet forms an arc-shaped structure.

[0019] It is understandable that, given a fixed distance between the first and second plates, at least a portion of the heat-conducting sheet forms an arc shape relative to a planar structure. This results in a larger surface area, meaning a larger heat dissipation area and higher heat dissipation efficiency. Furthermore, the arc shape of the heat-conducting sheet ensures that the bending direction remains constant, preventing interference between adjacent sheets due to inconsistent deformation directions, which could cause noise or airflow problems.

[0020] In one possible implementation of the first aspect, the heat-conducting sheet has multiple arc-shaped structures, and the multiple arc-shaped structures are distributed along the first direction, which can further increase the heat dissipation area of ​​the heat-conducting sheet and improve the heat dissipation efficiency.

[0021] In one possible implementation of the first aspect, the heat-conducting sheet undergoes elastic deformation when it is in a bent or stretched state. This elastic force of the heat-conducting sheet can thus assist the relative movement between the first and second plates.

[0022] In one possible implementation of the first aspect, the second plate includes multiple sub-plates, with heat-conducting sheets connected to the sub-plates. The number of sub-plates and heat-conducting sheets are the same and correspond one-to-one. Adjacent sub-plates are detachably connected, which can reduce the processing difficulty of the first plate. In addition, if one of the sub-plates is damaged, it is convenient to disassemble and replace it.

[0023] In one possible implementation of the first aspect, two adjacent sub-plates are designated as a first sub-plate and a second sub-plate. The first sub-plate includes a first main body and a first insertion portion, the first insertion portion being connected to the end of the first main body facing the second sub-plate. The second sub-plate includes a second main body, which is arranged in a second direction with the first main body. A first insertion groove is formed on the second main body, penetrating the end face of the second main body facing the first main body. The first insertion portion and the first insertion groove are engaged. This engagement of the first insertion portion and the first insertion groove simplifies the sub-plate structure and facilitates efficient assembly of multiple sub-plates.

[0024] In one possible implementation of the first aspect, the thickness of the heat-conducting sheet is 0.05mm to 0.2mm, which avoids the heat-conducting sheet being too thin to ensure the structural strength of the heat-conducting sheet, and also avoids the heat-conducting sheet being too thick to ensure that the heat-conducting sheet can switch between a bent state and a stretched state.

[0025] Secondly, a heat dissipation module is provided, which includes heat dissipation fins and a heat dissipation fan. The heat dissipation fins are the heat dissipation fins in any of the above technical solutions. A heat dissipation channel is formed between two adjacent heat-conducting fins in the heat dissipation fins, and the air outlet of the heat dissipation fan is opposite to the heat dissipation channel.

[0026] The other technical effects brought about by any design method in the second aspect can be found in the technical effects brought about by different design methods in the first aspect, and will not be repeated here. In addition, by aligning the exhaust vent of the cooling fan with the heat dissipation channel, airflow can be accelerated, which helps the heat conductor to dissipate heat and helps to improve the heat dissipation efficiency of the heat sink fins.

[0027] In one possible implementation of the second aspect, the heat dissipation module further includes a heat pipe, which includes an evaporation end and a condensation end that are interconnected. The evaporation end is thermally connected to the heat-generating device of the electronic device and can absorb the heat generated by the heat-generating device. The condensation end is thermally connected to the heat dissipation fins and can transfer the heat released by the condensation end to the heat dissipation fins and dissipate it through the heat dissipation fins.

[0028] Thirdly, an electronic device is provided, comprising a first housing, a heat-generating device, and a heat dissipation module. The first housing has an accommodating space and an air outlet communicating with the accommodating space. The heat-generating device is located within the accommodating space; the heat dissipation module is any of the heat dissipation modules in the second aspect described above, located within the accommodating space, with the heat dissipation channel opposite to the air outlet.

[0029] For the other technical effects brought about by any design method in the third aspect, please refer to the technical effects brought about by different design methods in the second aspect, which will not be repeated here.

[0030] In one possible implementation of the third aspect, the first housing includes a first structural member and a second structural member spaced apart in a first direction, at least a portion of the first structural member being movable relative to the second structural member in the first direction; a second plate is fixed to the first structural member, and the first plate is fixed to the second structural member. When the second structural member moves relative to the first structural member in the first direction, the second structural member can drive the first plate to move relative to the second plate in the first direction, thereby switching the heat-conducting sheet between a bent state and a stretched state. Attached Figure Description

[0031] Figure 1 Perspective views of electronic devices provided in some embodiments of this application; Figure 2 A perspective view of another state of the electronic device provided in some embodiments of this application; Figure 3 According to Figure 1 A schematic diagram of the electronic device from another perspective; Figure 4 This is a partial structural diagram of the operating portion provided in some embodiments of this application; Figure 5 According to Figure 4 A schematic diagram showing the relative motion between the first and second structural components; Figure 6 A schematic diagram illustrating the relative motion of a keyboard assembly and a second structural member as provided in some embodiments of this application; Figure 7 A schematic diagram of some electronic components within a first housing provided for some embodiments of this application; Figure 8 This is a schematic diagram of the heat dissipation fins in related technologies; Figure 9 This is a schematic diagram illustrating the interaction between heat dissipation fins and heat pipes provided in some embodiments of this application; Figure 10 This is a schematic diagram illustrating the interaction between the heat dissipation module and the first housing according to some embodiments of this application; Figure 11This is a schematic diagram illustrating the interaction between heat dissipation fins and cooling fans provided in some embodiments of this application; Figure 12 Schematic diagram of the structure of heat dissipation fins provided in some embodiments of this application Figure 1 ; Figure 13 Schematic diagram of the structure of heat dissipation fins provided in some embodiments of this application Figure 2 ; Figure 14 This is a schematic diagram illustrating the interaction between the heat dissipation fins and the first housing according to some embodiments of this application; Figure 15 A perspective view of the heat dissipation fins provided in some embodiments of this application; Figure 16 for Figure 15 Enlarged view of the circled area at point A; Figure 17 This is a schematic diagram of the heat dissipation fins provided in some other embodiments of this application, wherein the heat-conducting sheet is in a bent state; Figure 18 This is a schematic diagram of the structure of heat dissipation fins provided in some other embodiments of this application, wherein the heat-conducting sheet is in a stretched state; Figure 19 This is a schematic diagram of the structure of heat dissipation fins provided in some embodiments of this application; Figure 20 Schematic diagram of the structure of heat dissipation fins provided in other embodiments of this application Figure 1 ; Figure 21 Schematic diagram of the structure of heat dissipation fins provided in other embodiments of this application Figure 2 ; Figure 22 According to Figure 15 A schematic diagram of the heat dissipation fins from another perspective; Figure 23 This is a schematic diagram of the assembly of two adjacent sub-plates provided in some embodiments of this application.

[0032] Figure label: 100. Electronic equipment; e1. First direction; e2. Second direction; D1. First distance; D2. Second distance; 10. Display section; 101. Screen; 102. Second housing; 103. Back panel; 104. First frame; 20. Operating part; 2. First housing; 21. First structural component; 211. Second frame; 212. Keyboard assembly; 22. Second structural component; 23. Side panel; 231. First side panel; 2311. First layer; 2312. Second layer; 232. Second side panel; 201. Main board; 202. Electronic components; 2a. Heating element; K. Air outlet; Q. Accommodation space; 3. Heat dissipation module; 31. Heat pipe; 311. Evaporator end; 312. Condenser end; 313. Flexible section; 32. Heat conduction plate; 33. Cooling fan; 330. Air outlet; 4. Heat dissipation fins; 40. Heat dissipation channel; 41. First plate; 411. First fixing hole; 42. Second plate; 420. Sub-plate; 421. First sub-plate; 4211. First main body; 4212. First insertion part; 422. Second sub-plate; 4221. Second main body; 4222. First insertion slot; 4223. Second insertion part; 43. Heat-conducting plate; 431. First part; 4311. First connection area; 4312. Deformable area; 4313. Second connection area; 432. Second part; 5. Rotating shaft mechanism. Detailed Implementation

[0033] In the embodiments of this application, the terms "first," "second," "third," "fourth," and "fifth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," "third," "fourth," and "fifth" may explicitly or implicitly include one or more of that feature.

[0034] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0035] In the embodiments of this application, unless otherwise specified, the description of "parallel" indicates approximate parallelism within a certain allowable error range, which can be a range where the angle of deviation from absolute parallelism is less than or equal to 5°. The description of "perpendicular" indicates approximate perpendicularity within a certain allowable error range, which can be a range where the angle of deviation from absolute perpendicularity is less than or equal to 5°.

[0036] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0037] In the embodiments of this application, "multiple" refers to two or more.

[0038] This application provides an electronic device, which can be user equipment (UE) or a terminal device. For example, the electronic device can be a laptop computer, a portable Android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device, an in-vehicle device, a wearable device, a virtual reality (VR) terminal device (e.g., VR glasses), an augmented reality (AR) terminal device (e.g., AR glasses), or other mobile or fixed terminals. The form of the electronic device is not specifically limited in the embodiments of this application.

[0039] Please see Figure 1 and Figure 2 , Figure 1 A perspective view of an electronic device 100 provided in some embodiments of this application; Figure 2 This is a perspective view of another state of the electronic device 100 provided in some embodiments of this application. This embodiment and the following embodiments are illustrated using a laptop computer as an example, but this does not represent a limitation of this application. It is understood that the electronic device 100 can also be other devices, such as a foldable phone.

[0040] See Figure 1 and Figure 2 The electronic device 100 includes a display part 10, an operation part 20 and a rotating mechanism 5. The operation part 20 includes a first housing 2, which includes a keyboard assembly 212. The display part 10 includes a screen 101 and a second housing 102, with the screen 101 disposed in the second housing 102.

[0041] Electronic device 100 has an open state and a folded state, wherein Figure 1 The electronic device 100 shown is in a folded state. Figure 2 The electronic device 100 shown is in the open state. In the folded state, the electronic device 100 is roughly rectangular and flat. Therefore, for the convenience of the following descriptions of the embodiments, an XYZ coordinate system is established. Specifically, the width direction of the electronic device 100 in the folded state is defined as the Y-axis, the length direction as the X-axis, and the thickness direction as the Z-axis. It should be noted that the above coordinate system applies not only to the electronic device 100 in the folded state but also to the operation section 20 in the open state.

[0042] It is understandable that the coordinate system of electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here. When electronic device 100 is other products, electronic device 100 can also be roughly square or circular, etc., and no specific limitation is made here.

[0043] Figure 1 and Figure 2 The electronic device 100 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 Restrictions.

[0044] Continue reading Figure 1 and Figure 2 In some embodiments, the second housing 102 includes a back plate 103 and a first frame 104, with the first frame 104 connected and fixed to the back plate 103. For example, the back plate 103 and the first frame 104 can be fixed by means of bonding, snap-fitting, threaded connection, or welding. In other embodiments, the back plate 103 can be integrally formed with the first frame 104, that is, the second housing 102 is an integrally formed structure. The material of the second housing 102 includes, but is not limited to, metal, ceramic, plastic, and glass. In order to achieve the thinness and lightness of the electronic device 100 while ensuring the structural strength of the second housing 102, at least a portion of the material of the first housing 2 can be metal.

[0045] The screen 101 is fixed to the first frame 104 and / or the back panel 103. The screen 101 and the back panel 103 are stacked in the thickness direction of the screen 101. The first frame 104 is located on the outer periphery of the screen 101 and is used to protect the screen 101. The screen 101 can be fixed to the second housing 102 by means of adhesive, snap-fit, etc. When the electronic device 100 is in a folded state, the screen 101 and the keyboard assembly 212 are in the first direction e1 (e.g., refer to...). Figure 1 and Figure 2 The backplate 103 is located on the side of the screen 101 facing away from the keyboard assembly 212, opposite to each other in the Z-axis direction.

[0046] Screen 101 is used to display images, videos, etc. Screen 101 may include a light-transmitting cover and a display screen. The light-transmitting cover and the display screen are stacked and fixedly connected by adhesive or other means. The light-transmitting cover is located on the side of the display screen facing away from the back panel 103. The light-transmitting cover mainly serves to protect the display screen and prevent dust. The material of the light-transmitting cover includes, but is not limited to, glass. The display screen can be a flexible display screen or a rigid display screen. The keyboard assembly 212 described above is used for editing or other operations on the content displayed on screen 101.

[0047] See Figure 2 and Figure 3 , Figure 3 According to Figure 1 The diagram shows another perspective view of the electronic device 100. In some embodiments, a hinge mechanism 5 connects the display portion 10 and the operation portion 20, allowing them to rotate relative to each other, thereby enabling the electronic device 100 to switch between an open state and a folded state. The axis of rotation of the hinge mechanism 5 is parallel to the X-axis. During the process of switching the electronic device 100 from a folded state to an open state, the end of the display portion 10 away from the hinge mechanism 5 rotates away from the operation portion 20, so that an angle is formed between the display portion 10 and the operation portion 20, and the screen 101 is separated from the operation portion 20. In this state, the user can view the content displayed on the screen 101 and perform operations such as editing the content displayed on the screen 101 through the operation portion 20 (e.g., keyboard assembly 212).

[0048] When the electronic device 100 is in a folded state, the display part 10 and the operation part 20 are interlocked, and the screen 101 and the keyboard assembly 212 are both located between the first housing 2 and the second housing 102, thereby providing effective protection for the screen 101 and the keyboard assembly 212.

[0049] In addition, the pivot mechanism 5 can also provide damping force so that the display part 10 can be held in different positions when the electronic device 100 is in the open state. That is, the display part 10 and the operation part 20 have different angles, so as to adapt to different users' usage habits and different usage scenarios, which is conducive to improving the user experience.

[0050] It should be noted that when the electronic device 100 is in the open state, the angle between the display part 10 and the operation part 20 is greater than or equal to 90°, which ensures that the user can view the content displayed on the screen 101 normally. For example, when the electronic device 100 is in the open state, the angle between the display part 10 and the operation part 20 can be 90°, 100°, 110°, 120°, 130°, 140°, 150°, 160°, 170° or 180°.

[0051] See Figure 1 and Figure 2In some embodiments, the first housing 2 may include a first structural member 21 and a second structural member 22, which are spaced apart in a first direction e1. The first structural member 21 includes a keyboard assembly 212 and a second frame 211. The keyboard assembly 212 is connected to the second frame 211, and the second frame 211 is located on the outer periphery of the keyboard assembly 212. The keyboard assembly 212 and the second structural member 22 are spaced apart in the first direction e1, as are the second frame 211 and the second structural member 22. For example, the second frame 211 and the second structural member 22 may be plate-shaped.

[0052] For example, the keyboard assembly 212 is fixed relative to the second frame 211. In other examples, the keyboard assembly 212 may rotate relative to the second frame 211 or move in the first direction e1.

[0053] In some embodiments, the first housing 2 may further include a side plate 23, which is connected to at least one of the first structural member 21 and the second structural member 22, and an accommodating space is formed between the first structural member 21, the second structural member 22, and the side plate 23. Figure 2 and Figure 3 (Not shown). When the side plate 23 is connected to both the first structural member 21 and the second structural member 22, the side plate 23 can be connected between the first structural member 21 and the second structural member 22. For example, the side plate 23 can be fixed to the first structural member 21 by means of bonding, snap-fitting, threaded connection, or welding; the side plate 23 can be fixed to the second structural member 22 by means of bonding, snap-fitting, threaded connection, or welding.

[0054] In some other embodiments, the side plate 23 may be integrally formed with the first structural member 21; or, the side plate 23 may be integrally formed with the second structural member 22.

[0055] In some embodiments, the material of the first housing 2 includes, but is not limited to, metal, ceramic, plastic, and glass. To achieve a thinner and lighter electronic device 100 while maintaining the structural strength of the first housing 2, at least a portion of the material of the first housing 2 may be metal.

[0056] In some embodiments, see Figure 2 and Figure 3 The first housing 2 has an air inlet and an air outlet K, both of which communicate with the accommodating space. The air inlet can be one or more, and can be located on at least one of the first structural member 21, the second structural member 22, and the side plate 23; the air outlet K can also be one or more, and can be located on at least one of the first structural member 21, the second structural member 22, and the side plate 23.

[0057] For example, the side plate 23 includes a first side plate 231, a second side plate 232, a third side plate and a fourth side plate connected in sequence. The first side plate 231 is connected to one end of the second structural member 22 near the rotating shaft mechanism 5. At least some of the multiple air outlets K can be opened on the first side plate 231.

[0058] Please see Figures 4-6 , Figure 4 This is a partial structural schematic diagram of the operation section 20 provided in some embodiments of this application; Figure 5 According to Figure 4 A schematic diagram showing the relative motion of the first structural member 21 and the second structural member 22; Figure 6 This is a schematic diagram illustrating the relative movement of a keyboard assembly 212 and a second structural member 22 according to some embodiments of this application. In some embodiments, at least a portion of the first structural member 21 may move relative to the second structural member 22 in a first direction e1.

[0059] For example, the first structural member 21 as a whole can move relative to the second structural member 22 in the first direction e1; or, a part of the first structural member 21 can move relative to the second structural member 22 in the first direction e1.

[0060] A portion of the first structural member 21 may move relative to the second structural member 22 in the first direction e1, including the following situations: the first structural member 21 as a whole may rotate relative to the second structural member 22, that is, the movable end of the first structural member 21 may move relative to the second structural member 22 in the first direction e1; or, the second frame 211 may be fixed relative to the second structural member 22, and the keyboard assembly 212 may move relative to the second structural member 22 in the first direction e1; or, the second frame 211 may be fixed relative to the second structural member 22, and the keyboard assembly 212 may rotate relative to the second frame 211, that is, the movable end of the keyboard assembly 212 may move relative to the second structural member 22 in the first direction e1; or, the keyboard assembly 212 may be fixed relative to the second structural member 22, and the second frame 211 may move relative to the second structural member 22 in the first direction e1.

[0061] Unless otherwise specified, the following description is illustrative of the second structural member 22 as a whole being able to move relative to the first structural member 21 in the first direction e1, but this does not represent a limitation on the application.

[0062] In some embodiments, the rotating shaft mechanism 5 may include a transmission assembly and a rotating shaft, the transmission assembly being driveably connected between the rotating shaft and the second structural member 22. When the display portion 10 and the operation portion 20 rotate relative to each other, causing the electronic device 100 to switch between an open state and a folded state, the rotation of the rotating shaft can drive the transmission assembly to move. The transmission assembly is used to drive the second structural member 22 to move in the first direction e1. Thus, the second structural member 22 can move relative to the first structural member 21 in the first direction e1, and the second structural member 22 and the first structural member 21 can be relatively close or relatively far apart.

[0063] In other embodiments, the transmission assembly may be driveably connected between the rotating shaft and the first structural member 21. When the electronic device 100 is switching between an open state and a folded state, the transmission assembly is used to drive the first structural member 21 to move in the first direction e1, that is, the second structural member 22 can move relative to the first structural member 21 in the first direction e1. The second structural member 22 and the first structural member 21 can be relatively close or relatively far apart.

[0064] In some other embodiments, the transmission assembly can be driveably connected between the rotating shaft and the first structural member 21, and the transmission assembly can also be driveably connected between the rotating shaft and the second structural member 22. During the transition between the open and folded states of the electronic device 100, the transmission assembly can simultaneously drive the first structural member 21 and the second structural member 22 to move in the first direction e1, causing the second structural member 22 to move relative to the first structural member 21 in the first direction e1.

[0065] In some other embodiments, the electronic device 100 may further include a drive mechanism for driving the first structural member 21 and / or the second structural member 22 to move in the first direction e1, such that the second structural member 22 can move relative to the first structural member 21 in the first direction e1. It should be noted that this drive mechanism and the aforementioned rotating shaft can operate independently of each other; that is, even when the rotating shaft is not rotating, the drive mechanism can still drive the second structural member 22 to move relative to the first structural member 21 in the first direction e1.

[0066] As described above, when the second structural member 22 can move relative to the first structural member 21 in the first direction e1, the first side plate 231 may include a first layer 2311 and a second layer 2312 stacked in the thickness direction of the first side plate 231. The first layer 2311 is located on the side of the second layer 2312 facing away from the accommodating space Q. The first layer 2311 can be connected and fixed to the first structural member 21, and the second layer 2312 can be connected and fixed to the second structural member 22. At least one of the first layer 2311 and the second layer 2312 has an air outlet K. When the second structural member 22 moves relative to the first structural member 21 in the first direction e1, the second layer 2312 can move relative to the first layer 2311 in the first direction e1 to open the air outlet K and increase the air outlet area of ​​the accommodating space Q.

[0067] For example, the second layer 2312 has an air outlet K, while the first layer 2311 does not have an air outlet K. When the electronic device 100 is in a folded state, the first layer 2311 blocks the air outlet K to prevent dust, moisture and other impurities in the external environment from entering the accommodating space Q. When the electronic device 100 is in an open state, the air outlet K is connected to the external environment, so that the accommodating space Q can exchange heat with the external environment through the air outlet K.

[0068] In some embodiments, see Figure 7 , Figure 7 This is a schematic diagram of some electronic components within the first housing 2 provided in some embodiments of this application; the operation section 20 also includes a main board 201, which can be used to integrate electronic components 202. The main board 201 includes a printed circuit board (PCB) and electronic components 202, with the electronic components 202 disposed on the PCB. The electronic components 202 include at least one of the following: control chip, resistor, capacitor, controller, inductor, potentiometer, electron tube, electromechanical component, connector, discrete semiconductor device, sensor, power supply, switch, micro motor, electronic transformer, relay, etc.

[0069] The control chip may include at least one of the following: system-on-a-chip (SOC), universal flash storage (UFS), radio frequency power amplifier (RFPA), power management unit (PMU), system-in-package (SIP), radio frequency integrated circuit (RFIC), and charger IC. The SOC may integrate devices such as a central processing unit (CPU) and a graphics processing unit (GPU).

[0070] The motherboard 201 can be electrically connected to devices such as the screen 101 and keyboard assembly 212 to perform signal control, data signal processing, and data signal storage operations on the screen 101 and keyboard assembly 212. Furthermore, through the electrical connection between the motherboard 201 and the screen 101, and the electrical connection between the keyboard assembly 212 and the screen 101, the keyboard assembly 212 can edit the content displayed on the screen 101. For example, the keyboard assembly 212 and the motherboard 201 are electrically connected via an electrical connector, which can be a flexible printed circuit (FPC).

[0071] See Figure 7 In some embodiments, the operation section 20 further includes a heat-generating device 2a and a heat dissipation module 3. The heat dissipation module 3 includes a heat pipe 31, heat dissipation fins 4, and a cooling fan 33, etc. The heat-generating device 2a is a device that generates heat during operation. The heat-generating device 2a may include the aforementioned electronic components 202 (CPU, GPU, etc.) or a battery.

[0072] The cooling fan 33 is located in the accommodating space Q. The cooling fan 33 has an air inlet and an air outlet 330. The air outlet 330 is opposite to and connected to the air outlet K of the first housing 2. The air inlet is connected to the air inlet of the first housing 2.

[0073] In some embodiments, the heat pipe 31 includes an evaporation end 311 and a condensation end 312 that are interconnected, and the liquid inside the heat pipe 31 can flow between the evaporation end 311 and the condensation end 312. For example, the heat pipe 31 can be a copper pipe. The heat dissipation principle of the heat pipe 31 is as follows: when the evaporation end 311 of the heat pipe 31 is heated, the liquid in the capillary rapidly evaporates to form steam. The steam flows to the condensation end 312 under the pressure difference, releasing heat and re-condensing into liquid. The liquid then flows back to the evaporation end 311 under the action of capillary force.

[0074] The evaporation end 311 is thermally connected to the heat-generating device 2a, and can absorb the heat generated by the heat-generating device 2a. The condensation end 312 is thermally connected to the heat dissipation fins 4, and the heat dissipation fins 4 are located between the air outlet 330 of the cooling fan 33 and the air outlet K of the first housing 2. The heat released by the condensation end 312 can be transferred to the heat dissipation fins 4 and dissipated through the heat dissipation fins 4. By setting the heat dissipation fins 4, the heat dissipation area can be effectively increased, which helps to improve the heat dissipation efficiency.

[0075] It should be noted that the heat pipe 31 and cooling fan 33 described above can be applied to the electronic device 100 in any embodiment of this application.

[0076] See Figure 7 and Figure 8 , Figure 8 This is a schematic diagram of the structure of the heat dissipation fin 4 in the related technology; the heat dissipation fin 4 includes a plurality of heat-conducting plates 43, which are arranged along the second direction e2 (e.g., refer to...). Figure 7 The intervals are set in the X-axis direction. The cooling fan 33 can drive the cold air in the external environment to enter the cooling fan 33 through the air inlet and air outlet, and enter the heat dissipation fins 4 through the air outlet 330 of the cooling fan 33 to exchange heat with the heat conduction plate 43. The hot air after heat exchange is discharged to the external environment through the air outlet K, thereby realizing the heat dissipation of the heat-generating device 2a.

[0077] It should be understood that the aforementioned external environment refers to the exterior of the electronic device 100, and the hot airflow within the accommodating space Q is formed by heat conduction between the heating device 2a and the heat pipe 31 and the air within the accommodating space Q. Cold airflow, in contrast to hot airflow, refers to airflow in the external environment at a temperature lower than the hot airflow temperature within the accommodating space Q.

[0078] The aforementioned cooling fan 33 can be a centrifugal fan or an axial fan. In a centrifugal fan, the gas flow direction is perpendicular to the rotating shaft; the impeller rotation causes the gas to be thrown outwards under centrifugal force, thus generating airflow. In an axial fan, the gas flow direction is parallel to the rotating shaft; the blades propel the gas axially.

[0079] With the continuous development of technology, the performance of electronic components 202 such as CPU and GPU in electronic device 100 has been improved. However, during the operation of electronic device 100, the heat generated by components such as CPU and GPU also increases. However, the heat dissipation effect of heat dissipation module 3 in related technologies is poor, and it is difficult to improve the heat dissipation performance of electronic device 100. When the heat generated by heat-generating device 2a accumulates excessively in the accommodating space Q, it can easily cause the electronic device 100 to overheat, limit its frequency, or even shut down.

[0080] In order to improve the heat dissipation performance of electronic device 100, a larger cooling fan 33 is used in related technologies to increase the air flow in the accommodating space Q. Although it can achieve a better heat dissipation effect, it requires a higher accommodating space Q, which leads to an increase in the overall thickness of electronic device 100, which is not conducive to the thin and light design of electronic device 100.

[0081] To resolve the above technical issues, please refer to Figure 9 and Figure 10 , Figure 9 This is a schematic diagram showing the interaction between the heat dissipation fins 4 and the heat pipe 31 in some embodiments of this application; Figure 10 This is a schematic diagram showing the cooperation between the heat dissipation module 3 and the first housing 2 according to some embodiments of this application; this application provides a heat dissipation module 3, which includes a heat pipe 31, a cooling fan 33, and heat dissipation fins 4. The structure of the cooling fan 33 can be referred to Figure 7 The structure of the cooling fan 33 shown is designed and will not be described in detail here.

[0082] The heat pipe 31 may also include a condensing end 312, an evaporating end 311, and a flexible section 313. The flexible section 313 is connected between the condensing end 312 and the evaporating end 311, and the flexible section 313 can deform as the relative positions of the condensing end 312 and the evaporating end 311 change.

[0083] See Figure 9 and Figure 10 In some embodiments, the heat dissipation module 3 may further include a heat-conducting plate 32, which is thermally connected between the evaporation end 311 of the heat pipe 31 and the heat-generating device 2a. The heat-conducting plate 32 may be a metal plate. The heat-conducting plate 32 can fully conform to the heat-generating device 2a, increasing the heat conduction area between the heat-generating device 2a and the evaporation end 311, thereby improving the heat transfer efficiency between the heat-generating device 2a and the evaporation end 311. For example, the heat-conducting plate 32 can cover the motherboard 201 along the first direction e1, ensuring that the heat-conducting plate 32 can cover more electronic components 202 on the motherboard 201, thus better improving the heat dissipation efficiency of the electronic components 202. The heat-conducting plate 32 can also cover the evaporation end 311 along the first direction e1, ensuring the heat transfer area between the evaporation end 311 and the heat-conducting plate 32, thereby improving the heat transfer efficiency.

[0084] See Figure 9 and Figure 10 This application provides a heat dissipation fin 4, which includes a first plate 41, a second plate 42, and a plurality of heat-conducting plates 43. The first plate 41 and the second plate 42 are stacked along a first direction e1. The plurality of heat-conducting plates 43 are disposed between the first plate 41 and the second plate 42, and the plurality of heat-conducting plates 43 are spaced apart along a second direction e2. The first direction e1 and the second direction e2 intersect. For example, the first direction e1 and the second direction e2 are perpendicular.

[0085] The first plate 41 or the second plate 42 can be thermally connected to the condenser end 312 of the heat pipe 31, and the heat released from the condenser end 312 can be transferred to the first plate 41 or the second plate 42. When the first plate 41 is thermally connected to the condenser end 312, the heat-conducting plate 43 can be thermally connected to the first plate 41; when the second plate 42 is thermally connected to the condenser end 312, the heat-conducting plate 43 can be thermally connected to the second plate 42. In this way, the heat released from the condenser end 312 can be transferred to the heat-conducting plate 43 through either the first plate 41 or the second plate 42. For example, both the first plate 41 and the second plate 42 can be made of metal.

[0086] For example, the heat-conducting plate 32 can be made of metal; or, the heat-conducting plate 32 can be made of graphite; or, the heat-conducting plate 32 can be made of other materials with thermal conductivity.

[0087] See Figure 10 and Figure 11 , Figure 11 This is a schematic diagram illustrating the interaction between the heat dissipation fins 4 and the cooling fan 33 in some embodiments of this application. In some embodiments, a heat dissipation channel 40 is formed between the first plate 41, the second plate 42, and two adjacent heat-conducting plates 43. When the heat dissipation fins 4 are disposed on the electronic device 100, the heat dissipation fins 4 can be located between the air outlet 330 of the cooling fan 33 and the air outlet K of the first housing 2, and the heat dissipation channel 40 can be opposite to the air outlet 330 of the cooling fan 33. The cooling fan 33 drives the cold air to flow through the heat dissipation channel 40, and the cold air can absorb the heat on the heat dissipation fins 4 and discharge the heat to the outside of the electronic device 100.

[0088] See Figure 12 and Figure 13 , Figure 12 Schematic diagram of the structure of heat dissipation fins 4 provided in some embodiments of this application Figure 1 ; Figure 13 Schematic diagram of the structure of heat dissipation fins 4 provided in some embodiments of this application Figure 2In some embodiments, the first plate 41 is movable relative to the second plate 42 along a first direction e1 between a first position and a second position. This includes the following situations: the first plate 41 moves along the first direction e1 between the first position and the second position, while the second plate 42 remains stationary, such that the first plate 41 moves relative to the second plate 42 along the first direction e1 between the first position and the second position. Alternatively, the second plate 42 moves along the first direction e1, while the first plate 41 remains stationary, such that the first plate 41 moves relative to the second plate 42 along the first direction e1 between the first position and the second position; or, both the first plate 41 and the second plate 42 move along the first direction e1, such that the first plate 41 moves relative to the second plate 42 along the first direction e1 between the first position and the second position.

[0089] in, Figure 12 The first plate 41 of the heat dissipation fin 4 is in the first position. Figure 13 The first plate 41 of the heat dissipation fin 4 is in the second position.

[0090] When the first plate 41 is in the first position, the distance between the first plate 41 and the second plate 42 is a first distance D1, and at least a portion of the heat-conducting sheet 43 is in a bent state; when the first plate 41 is in the second position, the distance between the first plate 41 and the second plate 42 is a second distance D2, and the heat-conducting sheet 43 is in a stretched state. "At least a portion of the heat-conducting sheet 43 is in a bent state" means that when the first plate 41 is in the first position, a portion of the heat-conducting sheet 43 is bent; or, the entire heat-conducting sheet 43 is bent.

[0091] See Figure 12 and Figure 13 The first distance D1 is less than the second distance D2. That is, when the first plate 41 switches from the first position to the second position, the distance between the first plate 41 and the second plate 42 increases, and the first plate 41 moves away from the second plate 42. When the first plate 41 switches from the second position to the first position, the distance between the first plate 41 and the second plate 42 decreases, and the first plate 41 moves closer to the second plate 42.

[0092] When the first plate 41 moves away from the second plate 42, the extension length of the heat-conducting plate 43 in the first direction e1 increases, the heat dissipation channel 40 within the heat dissipation fin 4 increases, the air resistance decreases, and consequently the airflow through the heat dissipation channel 40 increases. The heat dissipation fin 4 can fully exchange heat with the airflow within the heat dissipation channel 40, increasing the heat carried out by the airflow within the heat dissipation channel 40, thus improving the heat dissipation effect of the heat dissipation fin 4. When this heat dissipation fin 4 is applied within the electronic device 100, it helps to improve the overall heat dissipation efficiency of the device.

[0093] It should be noted that the increase in the heat dissipation channel 40 of the heat sink fin 4 refers to the increase in the cross-sectional area of ​​the heat dissipation channel 40, that is, the increase in the size of the inlet and outlet of the heat dissipation channel 40. The cross-section of the heat dissipation channel 40 can be understood as the surface intercepted by the reference plane on the heat dissipation channel 40, that is, the area enclosed by the outer contour of the virtual structure on the reference plane. The reference plane is parallel to the first direction e1 and the second direction e2.

[0094] The first plate 41 can move relative to the second plate 42 along the first direction e1 between a first position and a second position, and the distance between the first plate 41 and the second plate 42 can be adjusted as needed. It is understood that when the electronic device 100 is in operation, especially when the electronic device 100 is running under high load (e.g., when opening applications such as games), the heat-generating device 2a generates a lot of heat, and the heat-generating device 2a heats up significantly; when the electronic device 100 is running under low load, the heat-generating device 2a generates less heat.

[0095] Therefore, when the heat-generating device 2a of the electronic device 100 generates a large amount of heat and the heat dissipation effect needs to be improved, the distance between the first plate 41 and the second plate 42 can be adjusted to the second distance D2; when the heat-generating device 2a of the electronic device 100 generates a small amount of heat or the electronic device 100 is not working, the distance between the first plate 41 and the second plate 42 can be adjusted to the first distance D1 to avoid the heat dissipation fins 4 occupying too much space inside the electronic device 100 (such as the aforementioned accommodating space Q).

[0096] In this way, the heat sink 4 can be kept to a small size when the electronic device 100 is running under low load or when the electronic device 100 is not working, thus achieving the goal of making the electronic device 100 thinner and smaller; at the same time, the heat sink 4 can be used in specific scenarios to ensure strong heat dissipation capacity, thereby improving the heat dissipation efficiency of the electronic device 100.

[0097] See Figure 14 , Figure 14 This diagram illustrates the interaction between the heat dissipation fins 4 and the first housing 2 in some embodiments of this application. In some embodiments, the second plate 42 is fixed to the first structural member 21, and the first plate 41 is fixed to the second structural member 22. For example, the first plate 41 can be fixed to the second structural member 22 by fasteners (e.g., screws or bolts). The first plate 41 has a first fixing hole 411, and the second structural member 22 has a second fixing hole. Fasteners are adapted to pass through the first fixing hole 411 and the second fixing hole to fix the first plate 41 to the second structural member 22.

[0098] Of course, in some other examples, the first plate 41 can also be fixed to the second structural member 22 by welding or gluing.

[0099] When the second structural member 22 moves relative to the first structural member 21 in the first direction e1, the second structural member 22 can drive the first plate 41 to move relative to the second plate 42 in the first direction e1, so that the heat-conducting sheet 43 switches between a bent state and a stretched state. For example, when the second structural member 22 moves away from the first structural member 21, the first plate 41 moves away from the second plate 42, and the heat dissipation channel 40 in the heat dissipation fin 4 increases, improving the overall heat dissipation efficiency.

[0100] For example, the second plate 42 can be fixed to the second frame 211 of the first structural member 21, and the first plate 41 can be fixed to the second structural member 22; or, the second plate 42 can be fixed to the keyboard assembly 212, and the first plate 41 can be fixed to the second structural member 22. In this way, at least a portion of the first structural member 21 can move relative to the second structural member 22 in the first direction e1, thereby causing the first plate 41 to move relative to the second plate 42 in the first direction e1, that is, the second plate 42 to move relative to the first plate 41 in the first direction e1, so that the heat-conducting sheet 43 switches between a bent state and a stretched state. In some embodiments, the condenser end 312 of the heat pipe 31 can be connected between the second plate 42 and the first structural member 21, that is, the second plate 42 is fixed to the first structural member 21 through the heat pipe 31.

[0101] It should be noted that when the heat-conducting sheet 43 is in a stretched state, it means that the heat-conducting sheet 43 is stretched relative to its bent state. During the switching between the bent and stretched states, the heat-conducting sheet 43 may or may not have elasticity.

[0102] In some embodiments, when the heat-conducting sheet 43 is in a bent state, the heat-conducting sheet 43 undergoes elastic deformation and has elasticity; when the heat-conducting sheet 43 switches to a stretched state, the heat-conducting sheet 43 is in a natural state (i.e., a state without elasticity).

[0103] Alternatively, when the heat-conducting sheet 43 is in a bent state, it undergoes elastic deformation and possesses elasticity; when the heat-conducting sheet 43 switches to a stretched state, it still possesses elasticity. Compared to the bent state, the elasticity of the heat-conducting sheet 43 in the stretched state is smaller, but the direction of the elasticity remains unchanged.

[0104] In the above situation, as the first plate 41 moves away from the second plate 42, the cross-sectional area of ​​the heat dissipation channel 40 increases and the elasticity of the heat-conducting plate 43 decreases. The elasticity of the heat-conducting plate 43 can provide assistance for the relative movement between the first plate 41 and the second plate 42.

[0105] In other embodiments, when the heat-conducting sheet 43 is in a stretched state, the heat-conducting sheet 43 undergoes elastic deformation and has elasticity; when the heat-conducting sheet 43 switches to a bent state, the heat-conducting sheet 43 is in a natural state.

[0106] Alternatively, when the heat-conducting sheet 43 is in a stretched state, it undergoes elastic deformation and possesses elasticity; when the heat-conducting sheet 43 switches to a bent state, it still possesses elasticity. Compared to the stretched state, the elasticity of the heat-conducting sheet 43 in the bent state is smaller, but the direction of the elasticity remains unchanged.

[0107] In the above situation, as the first plate 41 moves toward the direction closer to the second plate 42, the cross-sectional area of ​​the heat dissipation channel 40 decreases, the elasticity of the heat-conducting plate 43 decreases, and the elasticity of the heat-conducting plate 43 can provide assistance for the relative movement between the first plate 41 and the second plate 42.

[0108] In addition, during the process of switching between the bent state and the stretched state, the heat-conducting sheet 43 always has elasticity and the direction of elasticity remains unchanged. This can ensure that the deformation direction of the heat-conducting sheet 43 remains unchanged, and avoid the interference between two adjacent heat-conducting sheets 43 due to inconsistent deformation directions, which could cause noise or wind obstruction problems.

[0109] The specific structure of the heat-conducting plate 43 will be explained below.

[0110] Please see Figure 15 and Figure 16 , Figure 15 A perspective view of the heat dissipation fins 4 provided in some embodiments of this application; Figure 16 for Figure 15 Enlarged view of the circled portion at point A; in some embodiments, the heat-conducting plate 43 includes a first portion 431 and a second portion 432, with the first portion 431 connected to the second portion 432; when the first plate 41 moves relative to the second plate 42 between a first position and a second position, the first portion 431 changes between a bent state and a stretched state. By changing the first portion 431 between the bent and stretched states, the size of the heat dissipation channel 40 can be changed, improving the heat dissipation effect; the second portion 432 may not deform, and the second portion 432 can serve as the rigid part of the heat-conducting plate 43, supporting the first portion 431, which helps to achieve the installation and positioning of the heat-conducting plate 43 between the first plate 41 and the second plate 42.

[0111] The first part 431 is connected to the first plate 41, and the second part 432 is connected to the second plate 42, so that the heat-conducting sheet 43 is connected between the first plate 41 and the second plate 42.

[0112] See Figure 16In some embodiments, the second portion 432 is configured as a single unit, connected between the first portion 431 and the second plate 42, to connect the heat-conducting sheet 43 to the second plate 42; the second portion 432 can also provide support for the first portion 431. For example, the second portion 432 and the second plate 42 are fixedly connected by welding or adhesive. Alternatively, the second portion 432 and the second plate 42 can also be integrally formed.

[0113] In some other embodiments, two second portions 432 are provided, with a first portion 431 connected between the two second portions 432. The two second portions 432 are arranged in a first direction e1, and are respectively fixedly connected to the first plate 41 and the second plate 42. In this way, the two second portions 432 can provide support for the first portion 431 on opposite sides of the first portion 431.

[0114] In some embodiments, the material of the first portion 431 includes graphene, which has thermal conductivity and can conduct and dissipate heat. The material of the first portion 431 may also include metals such as copper or aluminum and their alloys.

[0115] In some embodiments, a portion of the first part 431 and the second part 432 are stacked and fixedly connected in the second direction e2. For example, the first part 431 includes a first connecting region 4311, a deformable region 4312, and a second connecting region 4313 connected sequentially in the first direction e1. The first connecting region 4311 and the second part 432 are stacked and fixedly connected in the second direction e2. This increases the connection area between the first part 431 and the second part 432, thereby improving the connection reliability between the first part 431 and the second part 432, and thus improving the overall reliability of the heat-conducting sheet 43.

[0116] The second connection area 4313 is stacked and fixedly connected to the first plate 41 in the first direction e1. This increases the connection area between the heat-conducting sheet 43 and the first plate 41, thereby improving the connection reliability between the heat-conducting sheet 43 and the first plate 41.

[0117] For example, the first connecting area 4311 and the second part 432 can be connected and fixed by welding or gluing; the second connecting area 4313 and the first plate 41 can also be connected and fixed by welding or gluing.

[0118] Continue reading Figure 16In some embodiments, when at least a portion of the heat-conducting sheet 43 is in a bent state, at least a portion of the heat-conducting sheet 43 forms an arc-shaped structure. For example, the deformable region 4312 of the heat-conducting sheet 43 forms an arc-shaped structure, and the curvature of the arc-shaped structure changes as the deformable region 4312 transitions between a bent state and a stretched state.

[0119] It should be noted that "at least a portion of the heat-conducting plate 43 forms an arc-shaped structure" means that the cross-sectional shape of at least a portion of the heat-conducting plate 43 is arc-shaped. The cross-section of the heat-conducting plate 43 is the surface intercepted by the aforementioned reference plane on the heat-conducting plate 43.

[0120] See Figure 17 and Figure 18 , Figure 17 This is a schematic diagram of the structure of the heat dissipation fin 4 provided in some other embodiments of this application, wherein the heat-conducting sheet 43 is in a bent state; Figure 18 The diagram below shows the structure of the heat dissipation fin 4 in some other embodiments of this application, wherein the heat conduction sheet 43 is in a stretched state; in other embodiments, the heat conduction sheet 43 is formed as an arc-shaped structure, and the curvature of the arc-shaped structure changes during the transition between the bent state and the stretched state of the heat conduction sheet 43.

[0121] See Figure 19 , Figure 19 The diagram below shows the structure of the heat dissipation fin 4 provided in some embodiments of this application. In some embodiments, when the heat-conducting sheet 43 is in a bent state, the heat-conducting sheet 43 may have multiple arc-shaped structures, and the multiple arc-shaped structures are distributed along the first direction e1.

[0122] In summary, during the switching between the bent and stretched states of the heat-conducting sheet 43, the deformable region 4312 or the heat-conducting sheet 43 always maintains an arc-shaped structure. On the one hand, given a fixed distance between the first plate 41 and the second plate 42, at least a portion of the heat-conducting sheet 43 forms an arc-shaped structure relative to the planar structure, resulting in a larger surface area of ​​the heat-conducting sheet 43, which means a larger heat dissipation area and higher heat dissipation efficiency. On the other hand, the fact that the deformable region 4312 always maintains an arc-shaped structure ensures that the bending direction of the heat-conducting sheet 43 remains unchanged, preventing interference between adjacent heat-conducting sheets 43 due to inconsistent deformation directions, which could cause noise or wind obstruction problems.

[0123] In some other embodiments, Figure 20 Schematic diagram of the structure of heat dissipation fins 4 provided in other embodiments of this application Figure 1 ; Figure 21 Schematic diagram of the structure of heat dissipation fins 4 provided in other embodiments of this application Figure 2When at least a portion of the heat-conducting sheet 43 is in a bent state, at least a portion of the heat-conducting sheet 43 forms a folded structure, the cross-sectional shape of which is "V", "W" or "Z". The beneficial effects of this shape of heat-conducting sheet 43 can be referred to as the beneficial effects of the arc-shaped heat-conducting sheet 43 described above, and therefore will not be repeated.

[0124] In some embodiments, the thickness of the heat-conducting sheet 43 is 0.05mm to 0.2mm, for example, the thickness of the heat-conducting sheet 43 can be 0.05mm, 0.06mm, 0.07mm, 0.09mm, 0.1mm, 0.12mm, 0.15mm, 0.17mm, 0.18mm, or 0.2mm. By using a thickness of 0.05mm to 0.2mm for the heat-conducting sheet 43, it is possible to avoid the heat-conducting sheet 43 being too thin, thus ensuring the structural strength of the heat-conducting sheet 43; and to avoid the heat-conducting sheet 43 being too thick, thus ensuring that the heat-conducting sheet 43 can switch between a bent state and a stretched state.

[0125] The specific structure of the second plate 42 will be explained below.

[0126] See Figure 22 , Figure 22 According to Figure 15 The diagram shows another perspective view of the heat dissipation fins 4. In some embodiments, the second plate 42 includes multiple sub-plates 420, with heat-conducting plates 43 fixedly connected to the sub-plates 420. The number of sub-plates 420 and heat-conducting plates 43 are the same and correspond one-to-one. Adjacent sub-plates 420 can be detachably connected, which can reduce the processing difficulty of the first plate 41. In addition, if one of the sub-plates 420 is damaged, it is convenient to remove and replace the sub-plate 420.

[0127] When the heat-conducting plate 43 includes a first part 431 and a second part 432, the first part 431 is connected to the second part 432, and the second part 432 can be integrally formed with the subplate body 420. For example, the second part 432 and the subplate body 420 are L-shaped as a whole.

[0128] Of course, in some other embodiments, the heat-conducting sheet 43 can be integrally formed with the subplate 420.

[0129] See Figure 23 , Figure 23This is a schematic diagram of the assembly of two adjacent sub-plates 420 according to some embodiments of this application. In some embodiments, the two adjacent sub-plates 420 are a first sub-plate 421 and a second sub-plate 422. The first sub-plate 421 includes a first main body 4211 and a first insertion part 4212. The first insertion part 4212 is connected to one end of the first main body 4211 facing the second sub-plate 422. The aforementioned heat-conducting sheet 43 can be connected to the first main body 4211. The second sub-plate 422 includes a second main body 4221. The second main body 4221 and the first main body 4211 are arranged in the second direction e2. A first insertion groove 4222 is provided on the second main body 4221, and the first insertion groove 4222 penetrates the end face of the second main body 4221 facing the first main body 4211. The first insertion part 4212 and the first insertion groove 4222 are inserted and matched, resulting in a simple structure and convenient and efficient assembly process.

[0130] For example, the first insertion slot 4222 may penetrate the first body portion 4211 along the first direction e1.

[0131] In some embodiments, the second sub-board body 422 may also have a second insertion portion 4223, which is connected to one end of the second main body portion 4221 facing away from the first main body portion 4211. The second insertion portion 4223 can be inserted into the insertion slots of other sub-board bodies 420 to facilitate the assembly of multiple sub-board bodies 420.

[0132] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0133] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation fin, characterized in that, include: A first plate and a second plate, wherein the first plate and the second plate are stacked together along a first direction; Multiple heat-conducting sheets are disposed between the first plate and the second plate, and the multiple heat-conducting sheets are arranged at intervals along the second direction, the first direction intersecting the second direction; The first plate is capable of moving relative to the second plate along the first direction between a first position and a second position. When the first plate is in the first position, the distance between the first plate and the second plate is a first distance, and at least a portion of the heat-conducting sheet is in a bent state. When the first plate is in the second position, the distance between the first plate and the second plate is a second distance, and the heat-conducting sheet is in a stretched state. The first distance is less than the second distance.

2. The heat dissipation fins according to claim 1, characterized in that, The heat-conducting sheet includes a first part and a second part, the first part being connected to the second part; when the first plate moves relative to the second plate between the first position and the second position, the first part changes between the bent state and the stretched state.

3. The heat dissipation fins according to claim 2, characterized in that, The first part is connected to the first plate, and the second part is connected to the second plate.

4. The heat dissipation fins according to claim 2, characterized in that, The second part is configured as one, and the second part is connected between the first part and the second plate.

5. The heat dissipation fins according to claim 2, characterized in that, The second part is provided in two parts, and the first part is connected between the two second parts. The two second parts are respectively fixedly connected to the first plate and the second plate.

6. The heat dissipation fins according to claim 2, characterized in that, The material in the first part includes graphene.

7. The heat dissipation fins according to claim 2, characterized in that, A portion of the first part and the second part are stacked and fixedly connected in the second direction.

8. The heat dissipation fins according to any one of claims 1-7, characterized in that, When at least a portion of the heat-conducting sheet is in the bent state, at least a portion of the heat-conducting sheet forms an arc-shaped structure.

9. The heat dissipation fins according to claim 8, characterized in that, The heat-conducting sheet has multiple arc-shaped structures, and the multiple arc-shaped structures are distributed along the first direction.

10. The heat dissipation fins according to any one of claims 1-7, characterized in that, When the heat-conducting sheet is in the bent state or the stretched state, the heat-conducting sheet undergoes elastic deformation.

11. The heat dissipation fins according to any one of claims 1-7, characterized in that, The second plate includes multiple sub-plates, and the heat-conducting sheet is connected to the sub-plate. The number of sub-plates and the number of heat-conducting sheets are the same and correspond one-to-one. Adjacent sub-plates can be detachably connected.

12. The heat dissipation fins according to claim 11, characterized in that, The two adjacent sub-plates are respectively a first sub-plate and a second sub-plate. The first sub-plate includes a first main body and a first insertion part. The first insertion part is connected to the end of the first main body facing the second sub-plate. The second sub-plate includes a second main body portion, which is arranged with the first main body portion in the second direction. The second main body portion is provided with a first insertion groove, which penetrates the end face of the second main body portion facing the first main body portion. The first insertion portion and the first insertion groove are inserted into each other.

13. The heat dissipation fins according to any one of claims 1-7, characterized in that, The thickness of the heat-conducting sheet is 0.05mm to 0.2mm.

14. A heat dissipation module, characterized in that, include: The heat dissipation fins, as described in any one of claims 1-13, wherein a heat dissipation channel is formed between two adjacent heat-conducting fins; A cooling fan, wherein the air outlet of the cooling fan is opposite to the heat dissipation channel.

15. The heat dissipation module according to claim 14, characterized in that, It also includes a heat pipe, which has an evaporation end and a condensation end that are connected to each other. The evaporation end is thermally connected to the heat-generating device of the electronic device, and the condensation end is thermally connected to the heat dissipation fins.

16. An electronic device, characterized in that, include: The first housing has an accommodating space, and the first housing has an air outlet communicating with the accommodating space; The heating element is located within the accommodating space; A heat dissipation module, as described in claim 14 or 15, wherein the heat dissipation module is located within the accommodating space, and the heat dissipation channel is opposite to the air outlet.

17. The electronic device according to claim 16, characterized in that, The first housing includes a first structural member and a second structural member arranged at intervals in the first direction, at least a portion of the first structural member being movable relative to the second structural member in the first direction; the second plate is fixed to the first structural member, and the first plate is fixed to the second structural member.

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