Substrate conveyance device and component mounting machine

Abstract

The purpose is to provide a substrate handling apparatus and a component mounting machine that can miniaturize the basic structure of the substrate support and reduce equipment costs. The substrate handling apparatus includes: a handling unit for handling a substrate along a first direction; a pair of guide rails for guiding both ends of the substrate in the width direction; a pair of clamping members, each configured to be movable relative to the pair of guide rails, clamping the substrate between the clamping members and the guide rails at the rising end; and a base member configured to be movable relative to the pair of guide rails, applying an upward external force to the central portion of the pair of clamping members in the first direction by the lifting action.

Description

Technical Field

[0001] This invention relates to a substrate handling device and a component mounting machine. Background Technology

[0002] A substrate mounting machine is used for the production of product substrates. The substrate mounting machine includes a substrate handling device for loading and unloading substrates. The substrate handling device includes a support device for supporting the substrates loaded into the machine during a predetermined substrate mounting operation. Patent Document 1 discloses a component mounting machine for mounting components onto substrates during substrate mounting operations. The support device clamps the substrate between a guide rail and a clamping member, and supports the substrate from below using a support member disposed on a support tray.

[0003] Patent document 1: International Publication No. 2004 / 103054. Summary of the Invention The technical problem that the invention aims to solve

[0004] The support device requires high rigidity to counteract the reaction forces experienced when supporting the substrate; and the configuration area of ​​the support components needs to be expanded to accommodate various substrate sizes. On the other hand, a structure that can use multiple support components to support large substrates is considered redundant compared to a structure that does not require support components to support small substrates. Therefore, the increased rigidity of the support device and the larger size of the support tray may lead to an increase in equipment costs.

[0005] The purpose of this specification is to provide a substrate handling device and a component mounting machine that can miniaturize the basic structure of the substrate support and reduce equipment costs. Means for solving technical problems

[0006] This specification discloses a substrate handling apparatus comprising: a handling unit for handling a substrate along a first direction; a pair of guide rails for guiding both ends of the substrate being handled in the width direction; a pair of clamping members configured to be movable relative to the pair of guide rails, wherein the substrate is clamped between the clamping members and the guide rails at the rising end; and a base member configured to be movable relative to the pair of guide rails, wherein an upward external force is applied to the central portion of the pair of clamping members in the first direction by the upward movement.

[0007] This specification also discloses the technical concept of changing "the substrate handling device according to claim 4" to "the substrate handling device according to claim 4 or 5" in the original claim 6; and the technical concept of changing "the substrate handling device according to claim 7" to "the substrate handling device according to claim 7 or 8" in the original claim 9. Furthermore, this specification also discloses the technical concept of changing "substrate handling device according to any one of claims 1 to 3" to "substrate handling device according to any one of claims 1 to 9" in original claim 10; changing "substrate handling device according to any one of claims 1 to 3" to "substrate handling device according to any one of claims 1 to 10" in original claim 11; and changing "substrate handling device according to any one of claims 1 to 3" to "substrate handling device according to any one of claims 1 to 11" in original claim 12. In addition, this specification also discloses the technical concept of changing "the substrate handling apparatus according to claim 13" to "the substrate handling apparatus according to claim 13 or 14" in the original claim 15; and the technical concept of changing "the substrate handling apparatus according to any one of claims 1 to 3" to "the substrate handling apparatus according to any one of claims 1 to 15" in the original claim 16. Invention Effects

[0008] Based on the structure of this substrate handling device, a pair of clamping members can be raised and lowered by the lifting action of the base component, clamping the substrate between the guide rail and the clamping members. This eliminates the need for a support tray that previously covered the entire working area for substrate handling, allowing for a miniaturization of the basic structure capable of supporting smaller substrates. Consequently, equipment costs can be reduced. Attached Figure Description

[0009] Figure 1 This is a schematic top view of a component mounting machine equipped with a substrate handling device. Figure 2 This is a perspective view showing the substrate handling device. Figure 3 This is a side view schematically showing the state in which the substrate handling device clamps the substrate. Figure 4 This is a schematic top view of a substrate handling device. Figure 5 This is a front view showing the state in which the substrate handling device clamps the substrate. Figure 6 This diagram schematically illustrates the clamping action of the substrate handling device on the substrate. Figure 7 This is a perspective view showing a substrate handling device with a support unit. Figure 8 This is an enlarged cross-sectional view showing the connecting device of the support unit. Figure 9This is a side view schematically showing the state in which a substrate handling device with a support unit clamps and supports the substrate. Detailed Implementation

[0010] 1. Overview of substrate processing machines A substrate mounting machine for producing product substrates uses a substrate transport device to load the substrate, position and clamp it at a predetermined transport direction. After completing the substrate mounting operation, the substrate transport device removes the substrate from the machine. In this embodiment, a component mounting machine 10 equipped with a substrate transport device is exemplified as a substrate mounting machine.

[0011] 2. Composition of Production Line Ln The aforementioned component mounting machine 10, along with other substrate mounting machines, are arranged side-by-side to form a production line Ln. This line performs the mounting process of components onto substrate 91 as a predetermined substrate mounting operation. Production line Ln consists of multiple substrate mounting machines arranged along the transport direction of substrate 91 (…). Figure 1 Multiple substrate processing machines are configured in the left and right directions. Each of these machines can be communicatively connected to the host machine (omitted in the figure) of the unified control production line Ln.

[0012] As a series of substrate processing machines, production line Ln consists, for example, a printer, a reflow oven, and an inspection unit. The printer prints solder paste onto the component mounting positions of the already loaded substrate 91. The reflow oven heats the substrate 91, which is transported from the upstream side of production line Ln, melting the solder on the substrate 91 and performing soldering. The inspection unit checks whether the appearance or function of the product substrates produced by production line Ln is normal.

[0013] In this embodiment, multiple production lines Ln can be configured within the product substrate factory. Furthermore, the configuration of each of the multiple production lines Ln can be appropriately added to or modified depending on factors such as the type of product substrate to be produced. Specifically, the multiple production lines Ln can be appropriately equipped with buffer devices for temporarily holding the transported substrate 91, substrate supply devices, substrate flipping devices, various inspection devices, shielding installation devices, adhesive coating devices, ultraviolet irradiation devices, and other substrate handling machines.

[0014] 3. Structure of component mounting machine 10 like Figure 1 As shown, the component mounting machine 10 includes a substrate handling device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15, a nozzle station 16, and a control device 17. In the following description, the left and right directions of the component mounting machine 10 ( Figure 1 The left and right directions and the first direction are set as the X direction, and the front and back directions of the component mounting machine 10 that intersect the X direction are set as follows: Figure 1The vertical direction (the up and down direction and the second direction) is defined as the Y direction, and the vertical direction (orthogonal to the X and Y directions) is defined as the Y direction. Figure 1 The forward and backward directions are defined as the Z direction.

[0015] 3-1. Substrate handling device 11 The substrate handling device 11 comprises a handling unit 20, a pair of guide rails 30, and a clamping unit 40. In this embodiment, the substrate handling device 11 includes two handling units 20A and 20B arranged side by side in the Y direction, a pair of guide rails 30A and 30B corresponding to each handling unit 20A and 20B, and two clamping units 40A and 40B.

[0016] Each transport unit 20 has a pair of conveyor belts 21. The pair of conveyor belts 21 are annular belts and are rotated by a drive device (not shown). The pair of conveyor belts 21 rotate with a substrate 91 mounted on top, and are configured to transport the substrate 91 along the X-direction. A pair of guide rails 30 extend along the transport direction (X-direction) of the substrate 91 and guide both ends of the substrate 91 being transported on the conveyor belts 21 in the width direction (Y-direction). At least one of the guide rails 30 is mounted on a base in a manner that allows it to move along the Y-direction.

[0017] The transport unit 20 transports the substrate 91 sequentially along the transport direction and positions the substrate 91 at a predetermined position within the machine. The clamping unit 40 clamps the positioned substrate 91. The detailed structure of the substrate transport device 11, including the clamping unit 40, will be described later. After the component mounting process is performed, the substrate transport device 11 moves the substrate 91 outside the component mounting machine 10.

[0018] 3-2. Component supply device 12 The component supply device 12 includes a plurality of slots 121 arranged side-by-side in the X direction and a plurality of reel holding sections 122. Feeders 123 are detachably installed in each of the plurality of slots 121. The feeders 123 supply components in a manner capable of picking up components by feeding and moving a carrier tape containing many components. The reel holding sections 122 hold the reels wound with the carrier tape in a replaceable manner. Furthermore, the component supply device 12 can also supply, for example, larger components arranged on a tray placed on a pallet. In this configuration, the component supply device 12 supplies components by extracting a predetermined tray from a storage device containing multiple trays according to the installation process.

[0019] 3-3. Component Transfer Device 13 The component transfer device 13 transfers components supplied by the component supply device 12 to predetermined mounting positions on the substrate 91 that has been moved into the machine by the substrate transport device 11. The head drive device 131 of the component transfer device 13 moves the moving stage 132 horizontally (in the X and Y directions) via a linear motion mechanism. A mounting head 133 is replaceably fixed to the moving stage 132 via clamping components (not shown). Various tools are detachably mounted on the mounting head 133.

[0020] The aforementioned tool includes a suction nozzle 134 for holding the component. The suction nozzle 134 uses supplied negative pressure air to adsorb and hold the component. The lifting position, angle, and negative pressure air supply status of the suction nozzle 134 relative to the mounting head 133 are controlled. In addition, as another tool, a chuck for clamping the component can also be mounted on the mounting head 133.

[0021] 3-4. Component camera 14, substrate camera 15 The component camera 14 and the substrate camera 15 are digital imaging devices equipped with imaging elements such as CMOS. The component camera 14 and the substrate camera 15 perform imaging based on control signals and transmit the image data acquired through the imaging. The component camera 14 is configured to image the component held by the suction nozzle 134 from below. The substrate camera 15 is mounted on the moving stage 132 in a manner that allows it to move horizontally integrally with the mounting head 133. The substrate camera 15 is configured to image the substrate 91 from above.

[0022] Furthermore, in addition to photographing the surface of the substrate 91, the substrate camera 15 can also photograph various devices within the movable range of the moving stage 132. For example, the substrate camera 15 can capture images of reference marks, barcodes, and tools (such as the suction nozzle 134) housed in the suction nozzle station 16 (described later). Thus, in order to acquire image data for various image processing tasks, the substrate camera 15 can be used to photograph different subjects.

[0023] 3-5. Suction Station 16 A nozzle station 16 is installed inside the component mounting machine 10. The nozzle station 16 is a tool station within the component mounting machine 10, which serves as a substrate mounting machine, housing various tools used for substrate mounting. In this embodiment, the nozzle station 16 holds multiple nozzles 134 in a removable manner. During nozzle 134 replacement processing, the nozzle station 16 holds the nozzle 134 removed from the mounting head 133 and holds other nozzles 134 in a removable manner. Thus, the component mounting machine 10 is configured to automatically change the nozzles 134 according to the type of component being mounted, for example, during the mounting process.

[0024] 3-6. Control Device 17 The control device 17 mainly consists of a CPU, various memories, and control circuits. The control device 17 performs the mounting process for components onto the substrate 91. During the mounting process, the control device 17 controls the operation of the component transfer device 13 based on information output from various sensors, image processing results, and pre-stored control programs. This controls the position and angle of the multiple suction nozzles 134 supported by the mounting head 133.

[0025] 4. Detailed structure of substrate handling device 11 The component mounting machine 10 of this embodiment is a dual-track conveyor with multiple transport units 20A and 20B as described above. Each of the transport units 20 has a pair of conveyor belts 21 and a pair of guide rails 30 mounted on a base in a manner that allows relative movement along the Y direction. Therefore, the substrate transport device 11 can adjust the spacing between the pair of conveyor belts 21 and the pair of guide rails 30 according to the Y-direction dimension of the substrate 91.

[0026] Here, when performing a predetermined substrate handling operation, such as component mounting, the substrate handling device 11 sometimes includes a support device that supports the substrate 91 from below to improve the accuracy of the mounting process. The support device requires high rigidity to counteract the reaction force exerted when supporting the substrate 91, and furthermore, the arrangement area of ​​the support members needs to be expanded to accommodate various substrate sizes. On the other hand, a structure that can use multiple support members to support large substrates is redundant compared to a structure that does not require support members to support small substrates.

[0027] Therefore, for manufacturers whose production accounts for a high proportion of small product substrates, the increased rigidity of the support device and the larger size of the support tray for placing the support components may lead to increased equipment costs. In view of this, the substrate handling device 11 of this embodiment adopts a structure that enables miniaturization of the basic structure supporting the substrate 91. The clamping unit 40 of the substrate handling device 11 includes a pair of clamping members 41 and a base member 42. The clamping unit 40 may also be configured as in this embodiment to also include an intermediate member 43 and a lifting device 50.

[0028] 4-1. A pair of clamping parts 41 A pair of clamping members 41 are respectively configured to be able to move up and down relative to a pair of guide rails 30. For example... Figure 2 and Figure 5 As shown, the clamping member 41 is a plate component with an overall rectangular shape. Here, as... Figure 3 As shown, a pair of guide rails 30 have upper wall portions 31 facing the upper surfaces at both ends of the substrate 91 in the width direction, and side wall portions 32 hanging downward from the upper wall portions 31, forming an L-shape when viewed in the X direction. A pair of clamping members 41 are disposed below the upper wall portions 31 of the guide rails 30 together with the conveyor belt 21.

[0029] Furthermore, the clamping members 41 are supported so that they can move relative to the side wall portion 32 in the vertical direction within a predetermined range of movement Rm, while horizontal movement is restricted. When the pair of clamping members 41 moves upward, their rising ends clamp the substrate 91 between the substrate 91 and the guide rail 30. Details regarding the clamping action using the pair of clamping members 41 will be described later.

[0030] 4-2. Base component 42 The base component 42 is configured to be able to move up and down relative to a pair of guide rails 30. In this embodiment, as... Figure 2 and Figure 3 As shown, the base component 42 is a rectangular columnar component extending along the Y direction with both ends located below a pair of clamping members 41. The base component 42 is supported by the lifting guide 53 of the lifting device 50 (described later) to keep the extension direction horizontal at all times. The base component 42 is raised and lowered by the driving force of the lifting device 50, so that the pair of support portions 421 formed on the upper surface reach a predetermined height.

[0031] A pair of support portions 421 are located below the central portion 411 of a pair of clamping members 41. Thus, when the base member 42 rises from its initial height, the pair of support portions 421 directly or indirectly contact the central portion 411 of the pair of clamping members 41 in the X direction. As the base member 42 rises further, an upward external force is applied to each of the pair of central portions 411. Furthermore, when the base member 42 descends, after the pair of clamping members 41 reaches the descending end of its movement range Rm, the base member 42 separates from the pair of clamping members 41.

[0032] As described above, the base component 42 has the function of raising and lowering the pair of clamping members 41 together. The base component 42 only needs to be able to transmit the driving force of the lifting device 50 to the pair of clamping members 41 to ensure this function; it does not need to exist in a way that covers the length of the base plate 91 in the X direction, like the support plate of the support device. Therefore, as... Figure 4 As shown, the width WB of the base component 42 in the X direction is set to be less than 20% of the length LC of the clamping member 41 in the X direction. This achieves miniaturization of the base component 42.

[0033] 4-3. Intermediate Components 43 The intermediate component 43 is a component located between the pair of clamping members 41 and the base component 42. The pair of intermediate components 43 are disposed at the central portion 411 of the pair of clamping members 41 or at the pair of support portions 421 of the base component 42. In this embodiment, the pair of intermediate components 43 are respectively disposed at the central portion 411 of the pair of clamping members 41 and move up and down integrally with the pair of clamping members 41.

[0034] The intermediate component 43 is generally shaped like a rod extending vertically downward from the central portion 411. In this embodiment, as... Figure 5 As shown, the intermediate component 43 has an adjustment mechanism 431 capable of adjusting the length LT in the vertical direction. The adjustment mechanism 431 is, for example, composed of a main body fixed to the clamping member 41 and a nut component having an internal thread that engages with an external thread formed on the main body. The adjustment mechanism 431 adjusts the length LT as a whole by rotating the nut component relative to the main body.

[0035] The intermediate component 43 is located between the central portion 411 and the support portion 421 when the base component 42 applies an upward external force to the pair of clamping members 41. Furthermore, the vertical length LT adjusted by the adjustment mechanism 431 of the intermediate component 43 is used to set the amount of movement Ds of the base component 42 from its initial state until an upward external force is applied to the clamping members 41 (see reference). Figure 6 ).

[0036] 4-4. Lifting device 50 The lifting device 50 is a device for raising and lowering the base component 42. In this embodiment, the lifting device 50 has a direct-acting mechanism 51 and a pair of lifting guides 53. The direct-acting mechanism 51 applies a vertical driving force to the base component 42. The direct-acting mechanism 51 is, for example, a ball screw mechanism, which moves the base component 42 in the Z direction by the action of an electric motor 52. Alternatively, the lifting device 50 may be composed of multiple cylinders. For example, the rods of each cylinder are fixed to both ends of the base component 42 in a detachable manner, and move forward and backward in the Z direction according to the air pressure inside the cylinder.

[0037] like Figure 3 As shown, a pair of lifting guides 53 are arranged in the Y direction across the linear motion mechanism 51. The pair of lifting guides 53 restrict the horizontal movement of the base member 42 while guiding the lifting action. With this structure, during the installation process, the lifting device 50 clamps the substrate 91 by raising the base member 42, thereby raising the pair of clamping members 41. Furthermore, when the substrate 91 is being transported, the lifting device 50 releases the substrate 91 by lowering the base member 42, thereby lowering the pair of clamping members 41.

[0038] 5. Clamping action of substrate by substrate handling device 11 The clamping operation of the substrate transport device 11 on the substrate 91 is described below. When the transport unit 20 transports the substrate 91, the clamping unit 40 sets the substrate 91 to an open state, allowing the substrate 91 to move relative to a pair of guide rails 30. The transport unit 20 stops the rotation of the conveyor belt 21, and the substrate 91 is positioned at a predetermined position.

[0039] At this time, as Figure 6 As shown, in the initial state where the base component 42 is located at the descending end NfB, the clamping member 41 is in a position separated from the pair of support portions 421 in the vertical direction. Here, as... Figure 2 and Figure 5 As shown, the upper ends of a pair of helical springs 44 are connected to the clamping member 41 at different positions in the X direction, separated by a central portion 411. The lower ends of the pair of helical springs 44 are connected to the body or base of the substrate transport device 11.

[0040] Thus, the pair of clamping members 41 are forced downward by the force of the helical spring 44, which acts as an elastic component, and are located at the descending end NfC of the movement range Rm when no upward external force is applied by the base member 42. From this initial state, the base member 42 is raised by the drive of the lifting device 50. When the base member 42 rises by a predetermined movement amount Ds or more, the pair of clamping members 41 are respectively subjected to external force by the support part 421.

[0041] In detail, when the base component 42 rises a distance Ds from its initial height, the support portion 421 contacts the intermediate component 43 located in the central portion 411 of the clamping member 41. As the base component 42 rises further from this state, the pair of clamping members 41 are subjected to an upward force by the base component 42, overcoming the force of the pair of helical springs 44 and rising. As the base component 42 rises further, the upper ends of the pair of clamping members 41 contact the lower surface of the substrate 91. Furthermore, when the pair of clamping members 41 rises to a height where the vertical distance between the upper end of the clamping member 41 and the upper wall portion 31 of the guide rail 30 equals the thickness of the substrate 91, they reach the rising end NrC within the movement range Rm.

[0042] Furthermore, as described above, the upper end of the clamping member 41 is positioned vertically below the upper wall portion 31. Thus, as... Figure 6 As shown, the clamping member 41 clamps the substrate 91 vertically between its rising end NrC and the upper wall portion 31 of the guide rail 30. In this way, by overlapping the Y-direction range in which the upper wall portion 31 contacts the upper surface of the substrate 91 and the Y-direction range in which the clamping member 41 contacts the lower surface of the substrate 91, the stability of the clamping state can be improved.

[0043] After the substrate installation and other substrate handling operations are completed, the clamping unit 40 lowers a pair of clamping members 41 via the lifting device 50 to release the substrate 91. Specifically, the lifting device 50 drives the base member 42 to gradually descend from the rising end NrB. Consequently, the pair of clamping members 41 descend along with the base member 42. Even though the clamping members 41 are attached to the lower surface of the substrate 91, they are maintained in a state where the intermediate member 43 is positioned between the clamping members 41 and the base member 42, due to the weight of the clamping members 41 and the force of the helical spring 44.

[0044] The substrate 91 will not contact the upper ends of the pair of clamping members 41, and will be placed on the upper part of the conveyor belt 21. When the pair of clamping members 41 reach the lowering end NfC of the movement range Rm, and the base member 42 further descends, the intermediate member 43 will separate from the support portion 421 of the base member 42. When the base member 42 is lowered to the lowering end NfB by the driving of the lifting device 50, the clamping unit 40 returns to the initial state that allows the handling unit 20 to handle the substrate 91.

[0045] According to the structure of this substrate handling device 11, the lifting action of the base member 42 causes a pair of clamping members 41 to rise and fall, clamping the substrate 91 between the guide rail 30 and the clamping members 41. Therefore, the support tray that covers the entire working area for substrate handling, as in the past, can be omitted, allowing for a miniaturization of the basic structure capable of supporting smaller substrates 91. As a result, equipment costs can be reduced.

[0046] 6. Support unit 60 In the substrate handling apparatus 11 formed by the structure described above, depending on the type of product substrate to be produced, in addition to clamping based on the guide rail 30 and the clamping member 41, it is sometimes necessary to support the substrate 91 from below. For example, this is necessary to prevent the substrate 91 from deflecting when the substrate 91 has a large width in the Y direction or when a large pressing force is applied when mounting components onto the substrate 91.

[0047] Therefore, the substrate handling apparatus 11 of this embodiment additionally adopts a structure that allows for the expansion of the function of using support members to support the substrate 91, compared to the basic structure of clamping the substrate 91 as described above. For example... Figure 7 As shown, the substrate transport device 11 may further include a support unit 60 detachably mounted on the upper part of the base member 42. The support unit 60 has a planar mounting area 651 for mounting a support member 70, which supports the substrate 91 transported to a predetermined position from below. The support unit 60 includes a bracket 61, a connecting device 62, and a tray 65.

[0048] 6-1. Bracket 61 The bracket 61 is placed at a predetermined position on the base component 42. For example... Figure 8 As shown, the bracket 61 is a block component having a U-shaped inner surface that faces the upper surface of the base component 42 and the two sides in the X direction. The bracket 61 is mounted above the base component 42 in a manner that fits into the inner surface.

[0049] 6-2. Connecting device 62 The connecting device 62 integrally connects the base component 42 to the bracket 61. This restricts the Y-direction movement of the bracket 61 relative to the base component 42. In this embodiment, the connecting device 62 has a pair of plungers 63 disposed at different positions in the X-direction. Each plunger 63 consists of a base 631 and a protrusion 632. The base 631 is located in the bracket 61 facing the outer surface, i.e., the side surface 422, of the base component 42. The protrusion 632 is configured to protrude from the base 631 towards the side surface 422 and engage with a mounting groove 423 provided on the side surface 422 of the base component 42.

[0050] A pair of plungers 63 are fixed to the bracket 61 by means such as hollow screws, and the initial protrusion of the protrusion 632 from the inner circumferential surface of the bracket 61 is adjustable. According to this structure, when the bracket 61 is mounted in a fitted manner from above the base member 42, the plungers 63 are in the following state: the protrusion 632 is pressed into the interior of the base 631 by the reaction force from the side 422 of the base member 42. When the bracket 61 is fitted to the height where the inner circumferential surface of the bracket 61 contacts the upper surface of the base member 42, the protrusion 632 of the plunger 63 protrudes outward from the base 631 and engages with the mounting groove 423 of the base member 42.

[0051] When an upward force is applied to disassemble the bracket 61, the protrusion 632 is pressed into the interior of the base 631, and the plunger 63 allows the bracket 61 to move upward (disassemble). Thus, the bracket 61 is designed to be assembled and disassembled relative to the base component 42 without the need for tools. Furthermore, a plurality of mounting slots 423 are pre-formed at predetermined intervals along the Y direction on the side surfaces 422 on both sides of the base component 42. Therefore, the bracket 61 can be selectively mounted at the positions where the plurality of mounting slots 423 are formed.

[0052] 6-3. Pallet 65 The tray 65 is fixed to the upper surface of the bracket 61, and a placement area 651 is formed on the upper surface of the tray 65. The tray 65 is a rectangular plate-shaped component viewed from above, and is made of a magnetic metal material. The tray 65 is integrally fixed to the bracket 61 by bolts when placed on the upper surface of the bracket 61. The tray 65 can be attached and detached from the base component 42 integrally with the bracket 61. The placement area 651 of the tray 65 faces the lower surface of the base plate 91 after being positioned by the transport unit 20, forming a placement surface for the support component 70.

[0053] Here, the support unit 60 is selected from multiple types of trays 65A and 65B with different sizes or shapes in the configuration area 651 and multiple types of brackets 61A and 61B corresponding to the predetermined trays 65, corresponding to the external dimensions of multiple types of substrates 91. Figure 7 The following state is shown: two types of trays 65A and 65B and two types of brackets 61A and 61B corresponding to their respective Y-direction widths are mounted on the base component 42 and a support component 70 is arranged in their respective configuration areas 651.

[0054] 7. The base plate is supported by the support member 70. The support member 70 is detachably disposed in the mounting area 651. In this embodiment, the support member 70 includes a rigid pin with a top end made of a harder component (e.g., a metal component) and a flexible pin with a top end made of a softer component (e.g., a rubber component). A magnet is embedded in the base of the support member 70 at its lower end, and it is magnetically fixed to the support plate 65.

[0055] When the tray 65 is installed on the base component 42, the support component 70 is manually positioned in the placement area 651 of the tray 65 by the operator. Furthermore, when the nozzle station 16 houses a pick-up device (not shown) for holding the support component 70, the control device 17 can install the pick-up device onto the mounting head 133 and use the pick-up device to perform a configuration change process for the support component 70. The control device 17 can identify the current position of the support component 70 based on image data acquired by the substrate camera 15.

[0056] A predetermined type of tray 65 is mounted on the base component 42 via a bracket 61, and a support component 70 is disposed in the placement area 651 of the tray 65. When the base component 42 is at the lowering end NfB, the top end of the support component 70 moves downward away from the lower surface of the substrate 91 being moved into the machine. When the base component 42 is raised by the lifting device 50, and the clamping unit 40 clamps the substrate 91 between itself and the guide rail 30, as... Figure 9 As shown, the support unit 60 is in a support state where the top part of the support member 70 is in contact with the lower surface of the substrate 91.

[0057] In other words, by adjusting the length of the intermediate component 43 through the adjustment mechanism 431, the height of the top end of the support component 70 is made consistent with the height of the upper end of the clamping member 41, which rises integrally with the base component 42. The support unit 60 supports the substrate 91 by bringing the support component 70 into contact with the lower surface of the substrate 91. Thus, the support unit 60 prevents the substrate 91 from deflecting by maintaining the height of the contact portion of the top end of the support component 70.

[0058] After the installation and other substrate operations are completed, the lifting device 50 retracts the pair of clamping members 41 and the support member 70 downwards, setting the substrate 91 to a released state and no longer supported by the support member 70. As a result, the substrate 91 is placed on the upper part of the conveyor belt 21. After the clamping unit 40 and the support unit 60 return to their initial state, the transport unit 20 moves the substrate 91 out of the machine.

[0059] Based on the structure of this substrate handling device 11, the basic structure supporting the substrate 91 can be miniaturized, while the support member 70 can be used to support the substrate 91 as needed. Therefore, even for larger substrates 91, in addition to clamping, the lower surface can be supported from below, thus further stabilizing the support of the substrate 91. Furthermore, the lifting and lowering of the support member 70 can be performed simultaneously by driving the lifting device 50 that raises and lowers a pair of clamping members 41, thereby reducing equipment costs.

[0060] 8. Variations of the implementation method In this embodiment, the substrate mounting machine is configured as a component mounting machine 10 that mounts components onto the substrate 91. In contrast, other substrate mounting machines can be applied as long as the substrate 91 is clamped by a pair of clamping members 41 and a predetermined substrate mounting operation is performed. For example, the substrate mounting operation in the substrate mounting machine may be solder printing, applying bonding components to the substrate 91 using a working head, or inspecting the appearance and function of the substrate 91. Explanation of reference numerals in the attached figures

[0061] 1: Component mounting machine (substrate handling machine), 11: Substrate handling device, 20: Handling unit, 21: Conveyor belt, 30: Guide rail, 31: Upper wall, 32: Side wall, 40: Clamping unit, 41: Clamping component, 411: Central part, 42: Base component, 421: Support part, 422: Side (outer surface), 423: Mounting slot, 43: Intermediate component, 431: Adjustment mechanism, 44: Coil spring (elastic component), 50: Lifting device, 51: Direct action mechanism, 52: Electric motor, 53: Lifting guide. 60: Support unit; 61: Bracket; 62: Connecting device; 63: Piston; 631: Base; 632: Protrusion; 65, 65A, 65B: Pallet; 651: Configuration area; 70: Support component; 91: Base plate; Rm: Movement range; NrC: (Clamping member) Rising end; NfC: (Clamping member) Falling end; LC: Length; LT: (Intermediate component) Length; NrB: (Base component) Rising end; NfB: (Base component) Falling end; WB: (Base component) Width; Ds: Movement amount.

Claims

1. A substrate handling device, comprising: The transport unit transports the substrate along the first direction; A pair of guide rails guide both ends of the substrate being transported in the width direction; A pair of clamping members, each configured to be movable relative to a pair of guide rails, clamp the substrate between the clamping members and the guide rails at their rising ends; and The base component is configured to be able to rise and fall relative to the pair of guide rails, thereby applying an upward external force to the central portion of the pair of clamping members in the first direction.

2. The substrate handling apparatus according to claim 1, wherein, The substrate handling device also includes a lifting device. The lifting device clamps the substrate by raising the base component, thereby raising a pair of clamping members; and releases the substrate by lowering the base component, thereby lowering a pair of clamping members.

3. The substrate handling apparatus according to claim 2, wherein, The lifting device has: A direct-acting mechanism applies a vertical driving force to the base component; and A pair of lifting guides are arranged across the linear motion mechanism in a second direction orthogonal to the first direction, restricting the horizontal movement of the base component while guiding the lifting motion of the base component.

4. The substrate handling apparatus according to any one of claims 1 to 3, wherein, The base component extends along a second direction orthogonal to the first direction and has a pair of support portions located below the central portion of the pair of clamping members.

5. The substrate handling apparatus according to claim 4, wherein, The width of the base component in the first direction is set to be less than 20% of the length of the clamping member in the first direction.

6. The substrate handling apparatus according to claim 4, wherein, In the initial state where the base component is at the descending end, the pair of clamping members are separated from the pair of supports in the vertical direction; when the base component rises above a predetermined amount of movement, the pair of clamping members are respectively subjected to external forces by the pair of supports.

7. The substrate handling apparatus according to claim 6, wherein, The substrate handling device also includes an intermediate component. The intermediate component is disposed at the central portion of a pair of clamping members or at a pair of support portions of the base component, and is located between the central portion and the support portion when the base component applies an upward external force to the pair of clamping members.

8. The substrate handling apparatus according to claim 7, wherein, The intermediate component has an adjustment mechanism that can adjust the length in the vertical direction, and the amount of movement of the base component from the initial state to the point where an upward external force is applied to the clamping member is set according to the length in the vertical direction of the intermediate component.

9. The substrate handling apparatus according to claim 7, wherein, The intermediate components are respectively located at the central portion of the pair of clamping members.

10. The substrate handling apparatus according to any one of claims 1 to 3, wherein, Each of the pair of guide rails has an upper wall portion facing the upper surfaces at both ends in the width direction of the substrate. A pair of clamping members are configured such that their upper ends are located below the vertical direction of the upper wall portion in a second direction orthogonal to the first direction, and the substrate is clamped between the clamping members and the upper wall portion of the guide rail in the vertical direction at the rising end for clamping.

11. The substrate handling apparatus according to any one of claims 1 to 3, wherein, The pair of clamping members are supported so that they can move up and down within a predetermined range of motion relative to the pair of guide rails, and are located at the lower end of the range of motion under the force of the elastic member when no upward external force is applied by the base member, the elastic member applying a downward force to the clamping members relative to the guide rails.

12. The substrate handling apparatus according to any one of claims 1 to 3, wherein, The substrate transport device further includes a support unit, which is detachably mounted on the base component and has a planar configuration area for arranging support members. The support members support the substrate being transported to a predetermined position from below.

13. The substrate handling apparatus according to claim 12, wherein, The support unit has: A bracket is placed at a predetermined position on the base component; A connecting device integrally connects the base component to the bracket; and A tray is fixed to the upper surface of the bracket, and the configuration area is formed on the upper surface of the tray.

14. The substrate handling apparatus according to claim 13, wherein, The connecting device has a plunger consisting of a base and a protrusion. The base is located in the bracket at a position facing the outer surface of the base component. The protrusion is configured to protrude from the base toward the outer surface and engage with a mounting groove on the outer surface of the base component.

15. The substrate handling apparatus according to claim 13, wherein, The support unit is selected from a variety of trays of different sizes or shapes in the configuration area and a variety of brackets corresponding to the predetermined trays, corresponding to the external dimensions of the various types of substrates.

16. A component mounting machine comprising a substrate handling device according to any one of claims 1 to 3, and mounting components onto the substrate.

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