LED patch control method and device

Abstract

The present application relates to a kind of LED patch control method and device, it is related to lamp pearl automatic mounting technical field, it includes response to the in-place signal of patch carrier plate, obtains task information and equipment information;Read from task information, the position of sticking, sticking angle and sticking number, read from equipment information, suction cup position, suction cup number, feeding position and detection position;According to suction cup position, determine suction cup interval, according to the position of sticking, determine sticking interval;According to sticking interval and suction cup interval, match synchronous execution combination and single-point execution combination are executed;Based on the same synchronous execution combination and single-point execution combination, according to the angle of sticking, suction cup initial angle and lamp pearl initial angle determine adjustment vector;Determine the material taking parameter by feeding position, detection position and adjustment vector;Determine and execute the patch instruction of control adsorption suction cup operation by combining synchronous execution combination, single-point execution combination and material taking parameter.The present application has the effect of improving patch efficiency.

Description

Technical Field

[0001] This invention relates to the field of automated LED chip mounting technology, and in particular to an LED chip mounting control method and device. Background Technology

[0002] LED chip mounting is an automated process that precisely picks up individual LED light-emitting elements and mounts them onto pre-set solder points on a circuit board. It is a core step in the production of LED light strips and LED display modules.

[0003] The existing LED chip mounting system adopts a single-head cyclic operation mode on the same side. The conveyor mechanism transports and positions the PCB chip mounting carrier to the chip mounting position, the tape feeder feeds out the LED chips one by one, and the gripping structure picks up the LED chips and completes the component gripping and pressing mounting one by one.

[0004] However, this production method can only pick up and mount one by one. Even if there are multiple mating positions with matching spacing on the circuit board, it cannot call up multiple sets of suction cups to complete the mounting simultaneously, resulting in low overall mounting efficiency. Summary of the Invention

[0005] To improve LED chip mounting efficiency, this invention provides an LED chip mounting control method and apparatus.

[0006] In a first aspect, the present invention provides an LED chip control method, which adopts the following technical solution: An LED chip control method, comprising: S10: In response to the positioning signal of the mounting carrier, acquire the task information for performing the mounting and the device information for performing the mounting; S11: Read the bonding position, bonding angle, and bonding number of the patch to be bonded from the task information; read the suction cup position, suction cup number, loading position, and detection position to be gripped from the equipment information. S12: Determine the suction cup interval between any two suction cups based on the suction cup position, and determine the bonding interval between any two bonding positions. The suction cups are preset suction execution components, and multiple suction cups are installed on the same mounting plate. S13: Match multiple synchronous execution combinations of bonding numbers and suction cup numbers corresponding to each other based on the bonding interval and suction cup interval, and sequentially match the remaining bonding numbers and suction cup numbers to form single-point execution combinations. S14: Based on the same synchronous execution combination and single-point execution combination, determine the adjustment vector of the suction cup when gripping the LED according to the bonding angle, the preset initial angle of the suction cup and the initial angle of the LED. S15: The feeding parameters for multiple adsorption suction cups to sequentially grab LED beads and perform detection are determined by the feeding position, detection position, and adjustment vector; S16: Combine synchronous execution combination, single-point execution combination and material picking parameters to determine and execute the placement instructions that control the operation of the adsorption suction cup.

[0007] By adopting the above technical solution, and using the combination of synchronous execution of bonding interval and suction cup interval matching and single-point execution combination, motion commands to control the rotation of suction cups to grasp materials are generated accordingly. This can automatically adapt to different arrangement of patch carriers, and use the structure of multiple suction cups to synchronously press down the patch, thereby improving the overall patching efficiency.

[0008] Optionally, synchronous execution of combined matching methods includes: S20: Select the bonding intervals that are the same as the suction cup intervals and sort them according to the order of the bonding numbers; S21: Match the bonding number corresponding to the first bonding interval with the suction cup number to form the first synchronous execution combination; S22: Based on the preset execution cycle, compare with the first synchronous execution combination to obtain the remaining suction cup number and its corresponding remaining suction cup interval; S230: If there is a remaining suction cup gap, compare the remaining suction cup gap with the subsequent bonding gap in sequence; S231: The bonding number corresponding to the bonding interval that is consistent with the remaining suction cup interval is matched with the suction cup number to form the subsequent synchronous execution combination; S24: If there are no remaining suction cup intervals, then the next bonding interval will be matched with the suction cup number based on the execution cycle to form a subsequent synchronous execution combination; S25: Repeat the above steps until all the bonding intervals that are the same as the suction cup intervals constitute a synchronous execution combination.

[0009] By adopting the above technical solution, points with matching spacing are selected according to the solder joint number sequence. Within a single execution cycle, idle suction cups are filled first. After the suction cups are used up, numbers are reassigned to form single-point tasks, ensuring that multi-suction cup synchronous mounting is executed as continuously as possible.

[0010] Optionally, methods for determining the adjustment vector include: S300: Based on the same synchronous execution combination, the offset angle that the corresponding mounting plate needs to be adjusted is determined according to the connection between the mating positions; S301: Based on the same single-point execution combination, the initial angle of the suction cup is used as the offset angle; S31: Determine the relative offset vector between the LED on the bonding carrier and the mounting plate by using the offset angle and the bonding angle; S32: Combine the relative offset vector, the initial angle of the suction cup, and the initial angle of the LED to determine the adjustment vector that adjusts the suction cup from its initial angle to form a relative offset vector with the initial angle of the LED.

[0011] By adopting the above technical solution, the suction cup rotation vector is calculated using the initial angle and target mounting angle of the LED, and the overall rotation and single-axis rotation angle are calculated separately, which improves the accuracy of the LED bead bonding angle when multiple suction cups are mounted at the same time.

[0012] Optionally, after determining the adjustment vector, the following may also be included: S40: Based on the same execution cycle, read all adjustment vectors and sort them according to the execution order; S41: Calculate the real-time adjustment vector by comparing the current adjustment vector with the next adjustment vector; S42: Replace the next adjustment vector with the real-time adjustment vector; S43: Determine the material taking parameters based on the replaced adjustment vector; S44: After executing the last set of adjustment vectors, control the suction cup to execute according to the preset reset parameters.

[0013] By adopting the above technical solution, all adjustment vectors are transformed into incremental adjustment vectors between adjacent actions. The rotation angle is directly superimposed on the previous posture, eliminating the need to return to the mechanical zero position for each gripping action. This reduces the travel motion of reciprocating to zero and further improves the operating efficiency of continuous placement.

[0014] Optionally, the execution of the patch instruction may also include: S50: In response to a pressing signal that controls the suction cup with LED beads to perform a pressing action, emits a ranging laser to measure the execution distance between the suction cup and the patch carrier. S51: Obtain the thickness of the LED chip and the solder paste information on the surface mount carrier; S52: Determine the bonding distance corresponding to the ranging laser when bonding the bottom of the LED chip to the substrate under standard working conditions based on equipment information and chip thickness; S53: When the execution distance is not greater than the bonding distance, read the suction cup number of the currently executed patch; S54: Set the gas supply parameters for room temperature drying gas according to the solder paste information; S55: Based on the air supply parameters, the preset condensation device corresponding to the chuck number blows airflow onto the solder paste surface; S56: After the solder paste has partially cured, compressed air is introduced into the suction cup to release the LED beads from the suction cup, and the suction cup is raised to complete the placement process.

[0015] By adopting the above technical solution, the downward height is monitored in real time by the ranging laser. The curing process is only started when the component is pressed into the bonding position. After pressing, the surface of the solder paste is dried and cured by room temperature airflow to prevent the LED beads from shifting when the suction cup detaches.

[0016] Optionally, the following may be included before performing the blowing procedure: S60: Determine the melting temperature of the solder paste based on the solder paste information; S61: Collect the surface temperature of the solder paste; S62: When the surface temperature is lower than the melting temperature, match the suction cup position according to the suction cup number; S63: Combine the bonding distance, suction cup position, and preset laser position to determine the rotation vector of the control heating laser toward the area around the suction cup; S64: Set the heating parameters for controlling the heating laser based on solder paste information and surface temperature; S65: Controls the emission of a heating laser to melt solder paste based on rotation vector and heating parameters.

[0017] By adopting the above technical solution, when the solder paste hardens due to low ambient temperature, the laser power is automatically matched according to the solder paste material parameters and the current temperature difference to locally micro-heat the solder paste so that it reaches a melting and wetting state, ensuring that the LED beads can be fully sunk into the solder paste.

[0018] Optionally, the following may also be included when executing heating parameters: Based on the solder paste information, determine the steady-state temperature at which the solder paste will not flow due to airflow impact; S70: Collect and update the surface temperature of solder paste; S71: When the surface temperature is consistent with the preset buffer temperature, the output power of the heating laser is controlled based on the preset down-adjustment parameter; S72: When the surface temperature matches the melting temperature, control the heating laser to stop outputting; S73: When the surface temperature is consistent with the steady-state temperature, execute the air blowing process.

[0019] By adopting the above technical solution, the solder paste temperature is continuously monitored during the laser heating process. When the buffer temperature is reached, the laser power is reduced in advance to avoid a rapid temperature rise. When the temperature reaches the melting temperature, the laser is turned off immediately to prevent the solder paste from flowing over a large area. The airflow is turned on to purge the solder paste after the temperature drops to a stable temperature where the fluidity is stable.

[0020] Secondly, this application provides an LED patch mounting device, which adopts the following technical solution: An LED chip mounting device, controlled by an LED chip mounting control method described in the first aspect, includes a gripping component, a conveying component, and a feeding component. The conveying component is provided with a chip mounting station, and the feeding component is provided with a feeding station. The conveying assembly is used to convey the surface mount carrier to the surface mount station for surface mount operation, and the feeding assembly is used to convey the LED beads one by one to the feeding station for the gripping assembly to grip. The gripping assembly includes multiple suction cups for vacuum adsorption and a mounting plate for assembling the suction cups. The suction cups are telescopically mounted on the mounting plate in a direction away from or near the loading station. The mounting plate has multiple degrees of translation and rotation freedom to drive the suction cups through the loading station and the patching station.

[0021] By adopting the above technical solution, the multi-axis movement and rotation capability of the mounting plate is utilized to drive multiple suction cups to simultaneously complete material picking and placement, reducing the idle stroke of frequent material picking and continuously realizing the synchronous pressing and placement of multiple components, effectively improving the overall chip placement efficiency.

[0022] Optionally, it also includes a detection component for detecting the grasped LED beads, the detection component being provided with a detection station; The inspection station is located between the loading station and the mounting station. The gripping component grips the LED beads on the loading station and, after being inspected at the inspection station, mounts the LED beads onto the mounting substrate at the mounting station.

[0023] By adopting the above technical solution, an independent inspection station is added between the material loading station and the chip mounting station. The LED beads are picked up and their positions are corrected at this station. The angle deviation is corrected in advance, which avoids unqualified LED beads from being directly mounted, reduces the defect rate of mounting misalignment, and improves the finished product qualification rate.

[0024] Optionally, the gripping component, the feeding component, and the detection component are symmetrically arranged in two sets along the conveying direction of the conveying component. The two sets of gripping components sequentially grip the LED beads and perform the placement operation on the placement carrier board on the placement station.

[0025] By adopting the above technical solution, the two sets of gripping components, feeding components and detection components are symmetrically arranged along the conveying direction. The two sets of machine heads alternately complete the feeding, detection and mounting actions, staggering the waiting time between each other, eliminating the waiting time of the process, and further improving the continuous production capacity of the whole line.

[0026] In summary, the present invention has at least one of the following beneficial technical effects: By using the combination of synchronous execution of bonding interval and suction cup interval matching and single-point execution, corresponding motion commands are generated to control the rotation of the suction cup to grasp the material. It can automatically adapt to different arrangement of patch carriers and use the structure of multiple suction cups to press down the patch synchronously, thereby improving the overall patching efficiency. The descending height is monitored in real time by a ranging laser. The curing process is only started when the component is pressed into the bonding position. After pressing, the surface of the solder paste is dried and cured by room temperature airflow to prevent the LED beads from shifting when the suction cup detaches. By utilizing the multi-axis movement and rotation capabilities of the mounting plate, multiple suction cups can be driven to simultaneously complete material picking and placement, reducing the idle stroke of frequent material picking and continuously realizing the synchronous pressing and placement of multiple components, effectively improving the overall chip placement efficiency. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of an LED patch device according to this application; Figure 2 This is a partial schematic diagram of an LED patch device according to this application; Figure 3 yes Figure 2 Enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the gripping component of an LED chip mounting device according to this application.

[0028] The parts referred to by the numbers in the above attached diagrams are as follows: 1. Workbench; 2. Gripping assembly; 21. Adsorption suction cup; 22. Mounting plate; 3. Conveying assembly; 31. Patch placement station; 4. Feeding assembly; 41. Feeding station; 5. Inspection assembly; 51. Inspection station. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0030] This invention discloses an LED patch device.

[0031] Reference Figure 1 and Figure 2 An LED chip mounting device includes a worktable 1, a gripping component 2, a conveying component 3, a feeding component 4, and a detection component 5. The gripping component 2, the conveying component 3, the feeding component 4, and the detection component 5 are all mounted on the worktable 1.

[0032] Two sets of gripping components 2, feeding components 4 and detection components 5 are symmetrically arranged along the conveying direction of conveying components 3. The two sets of gripping components 2 grip the LED beads in sequence and perform the placement operation on the placement carrier plate on the conveying components 3.

[0033] Reference Figure 3 The conveying component 3 can adopt a linear guide rail transfer structure. The conveying component 3 is used to move the patch carrier to the execution area of ​​the gripping component 2 in sequence to stay and wait for the patching operation. The position of the patch carrier at this time is set as the patching station 31.

[0034] The feeding component 4 can be a tape feeder, which is an existing technology. In this embodiment, multiple tape feeders are installed side by side and locked on the side of the workbench 1. The rolled LED beads are encapsulated in the carrier tape. The carrier tape is installed on the tape feeder and fed at equal intervals. At the same time, the upper protective film is peeled off, and the position where the LED beads stay and wait for the gripping component 2 to pick them up is set as the feeding station 41.

[0035] The detection component 5 can be a vision camera. The detection component 5 is fixedly installed on the upper surface of the workbench 1 with the lens facing upward. When the gripping component 2 passes over the detection component 5 with the LED beads and stops, the image is captured and the position and angle deviation of the LED beads when they are gripped are identified. The area above the lens is set as the detection station 51.

[0036] Reference Figure 4 The gripping component 2 includes multiple suction cups 21 and a mounting plate 22. All suction cups 21 are vertically extended and retracted on the mounting plate 22 with the suction cups facing downwards and the lower end faces of all suction cups 21 located on the same horizontal plane. All suction cups 21 are arranged at equal intervals along the X-axis. The mounting plate 22 is translated above the worktable 1 through a multi-axis translation structure and drives the suction cups 21 to move synchronously. At the same time, the mounting plate 22 has rotational freedom to drive the suction cups 21 to rotate as a whole. Driven by the mounting plate 22, the suction cups 21 can pass through the loading station 41, the inspection station 51 and the patching station 31.

[0037] The conveying assembly 3 drives the mounting carrier to move and stop on the mounting station 31. The loading assembly 4 loads the LED beads and stops them on the loading station 41. The multi-axis translation structure is activated, which drives the mounting plate 22 and the suction cup 21 to move. The first suction cup 21 is moved above the loading station 41, and the suction cup 21 is controlled to press down to adhere to the LED beads on the loading station 41. After adhesion, the gas inside the suction cup 21 is sucked to achieve negative pressure, thereby adsorbing and grabbing the LED beads. After resetting, the second suction cup 21 is controlled to move to the upper position. Above the material loading station 41, the loading station 41 drives the new LED beads to be loaded. The above steps are repeated to complete the gripping of all the suction cups 21. Then, the mounting plate 22 is controlled to move to the inspection station 51. All the gripped LED beads pass through the inspection station 51 in sequence and the inspection component 5 is controlled to inspect the LED beads. After inspection, the suction cups 21 are driven to move to the surface mount station 31 to attach the LED beads to the surface mount carrier in sequence. Molten solder paste is pre-applied to the corresponding bonding positions on the surface mount carrier. The molten solder paste fixes the LED beads to the surface mount carrier.

[0038] Based on the same inventive concept, embodiments of the present invention provide an LED patch control method.

[0039] An LED chip control method includes the following steps: S10: In response to the positioning signal of the mounting carrier, acquire the task information for performing the mounting and the device information for performing the mounting.

[0040] The "position signal" refers to the ready switch signal emitted by the position sensor after the chip carrier is transported to the chip placement station 31 and mechanically locked. When the chip carrier moves to the position and presses against the stop block, the photoelectric sensor is blocked and sends a level signal, which is the "position signal".

[0041] Task information refers to all process data for the current batch of surface mount technology (SMT) operations, including all pad location numbers, coordinates, component angles, material types, etc. It is preset and entered into the system by the operator before starting the equipment according to the SMT requirements, and the task information is directly read when needed.

[0042] Equipment information refers to the fixed hardware parameters of the equipment that performs the patch placement, including the number of suction cups, the center coordinates of the suction cups, the coordinates of the loading station 41, the coordinates of the inspection station 51, and other data. The equipment information is obtained by manually moving each axis and recording the coordinate position of each suction cup through equipment origin calibration. The number of suction cups is measured or set by the operator and then integrated into the equipment information, which is pre-entered into the system.

[0043] S11: Read the bonding position, bonding angle, and bonding number of the patch to be bonded from the task information, and read the suction cup position, suction cup number, loading position, and detection position to be gripped from the equipment information.

[0044] The bonding position refers to the two-dimensional plane coordinates of the center point of each patch on the patch carrier; the bonding position is set in advance by the operator according to the patch requirements and integrated into the task information, and can be directly read when used.

[0045] The bonding angle refers to the final rotation angle required for the LED bead to be placed on the pad. The operator pre-sets the movement direction of the mounting board as the reference direction, compares the standard direction of each LED bead with the reference direction to obtain the corresponding bonding angle, and integrates it into the task information, which can be directly read during use.

[0046] The bonding number refers to the unique serial number assigned to each soldering position according to the order of placement. The system automatically numbers the points sequentially from left to right and from front to back based on the bonding position on the chip carrier, and integrates the bonding number into the task information. It can be directly read when needed.

[0047] The suction cup position refers to the center coordinate of each suction cup 21 in the coordinate system of the mounting plate 22. The operator sets the corresponding coordinate position, i.e., the suction cup position, based on the installation position of the suction cup 21 with the center of the mounting plate 22 as the mechanical origin, and integrates it into the equipment information.

[0048] The suction cup number refers to the hardware serial number assigned to the suction cup position; the system numbers the suction cups 21 sequentially according to the installation order, for example, from left to right, they are suction cup a, suction cup b, suction cup c and suction cup d.

[0049] The loading position refers to the fixed coordinate point where the LED beads are picked up from the material strip by the suction cup 21, that is, the coordinate position corresponding to the loading station 41. The fixed coordinates, i.e. the loading position, are set in advance by the operator according to the material strip's discharge position and integrated into the equipment information.

[0050] The detection position refers to the coordinates of the position where the LED bead stops to perform the detection, that is, the coordinate position corresponding to the detection station 51. The operator sets the fixed coordinates in advance according to the installation position of the detection component 5, that is, the detection position, and integrates it into the equipment information.

[0051] S12: Determine the suction cup interval between any two suction cups 21 according to the suction cup position, and determine the bonding interval between any two bonding positions. The suction cup 21 is a preset suction execution component, and multiple suction cups 21 are installed on the same mounting plate 22.

[0052] The suction cup interval refers to the straight-line center distance between the center points of any two suction cups 21; the distance between the two points is calculated by performing a difference operation on the X coordinates of the two suction cups 21.

[0053] Since, under standard conditions, the multiple suction cups 21 on the mounting plate 22 are arranged sequentially with the same spacing, the distance between the suction cups 21 can be obtained simply by calculating the difference between the X coordinates.

[0054] The fitting interval refers to the straight-line distance between any two fitting positions. All fitting positions are read from the task information, and the coordinates of any two fitting positions are substituted into the formula for calculating the distance between two points on a plane to calculate the length of the straight line between the centers of the two points, which is the fitting interval.

[0055] If the length of the bonding interval exceeds the maximum suction cup interval, it means that it is impossible for two suction cups to supply material at the same time. This bonding interval can be directly eliminated to reduce the difficulty of subsequent calculations.

[0056] The adsorption suction cup 21 refers to a vacuum nozzle that uses negative pressure vacuum to generate adsorption force to grab LED beads, that is, an adsorption nozzle in an LED chip mounting device.

[0057] Mounting plate 22 refers to a rigid flat plate on which all adsorption suction cups 21 are uniformly mounted. It can be moved and rotated as a whole, i.e., mounting plate 22 in an LED chip mounting device.

[0058] S13: Match multiple synchronous execution combinations of bonding numbers and suction cup numbers according to the bonding interval and suction cup interval, and sequentially match the remaining bonding numbers and suction cup numbers to form single-point execution combinations.

[0059] Synchronous execution combination refers to a set of suction cup numbers and bonding numbers that are the same size as the suction cup spacing and the bonding spacing, and can complete the bonding of multiple suction cups simultaneously in the same pressing action; the specific method of obtaining them will be disclosed in detail in subsequent steps.

[0060] Single-point execution combination refers to a situation where the bonding interval and suction cup interval do not match, making it impossible to mount multiple suction cups in parallel. Instead, each suction cup must be mounted one by one. Once all synchronous execution combinations are paired, the unpaired suction cup numbers are matched one-to-one with the bonding numbers in sequence to form a single-point execution combination.

[0061] S14: Based on the same synchronous execution combination and single-point execution combination, determine the adjustment vector of the suction cup 21 when gripping the LED bead according to the bonding angle, the preset initial angle of the suction cup and the initial angle of the LED bead.

[0062] The initial angle of the suction cup refers to the angle between the mounting plate 22, on which the suction cup 21 is installed, and the reference direction in the initial state; the mounting plate 22 is reset, the corresponding servo motor is cleared to zero, and the angle value corresponding to the servo zero point position is read, which is the initial angle of the suction cup.

[0063] The initial angle of the LED bead refers to the inherent placement angle of the LED bead when it is stationed at the loading station 41. The angle value of the component pin relative to the reference direction is obtained based on the loading direction of the conveyor belt and the installation direction of the LED bead relative to the conveyor belt. This initial angle of the LED bead is preset and entered into the system.

[0064] The adjustment vector refers to the rotation angle and the most recent rotation direction of the mounting plate 22 that each suction cup 21 needs to control when rotating from its initial position to pick up the LED bead; the method for determining this will be disclosed in detail in subsequent steps.

[0065] S15: The material handling parameters are determined by the feeding position, detection position and adjustment vector to sequentially grab the LED beads and perform the detection.

[0066] The material handling parameters refer to the parameters of the entire process in which the mounting plate 22 drives all the suction cups 21 to pick up LED beads from the loading station 41 and move through the detection station 51. This includes the rotation angle and direction of the mounting plate 22 during material handling. The suction cups 21 are controlled to pass through the loading station 41 in sequence according to their numbers. The suction cups 21 stop at the loading station 41 and rotate the mounting plate 22 based on the corresponding adjustment vector. After rotation, the suction cups 21 are controlled to pick up the LED beads. Then, the next suction cup 21 is replaced until all suction cups 21 have picked up LED beads. The suction cups 21 are then controlled to pass through the detection station 51 in the same order. The material handling parameters are obtained by integrating the above steps.

[0067] S16: Combine synchronous execution combination, single-point execution combination and material picking parameters to determine and execute the patching instruction that controls the operation of the adsorption suction cup 21.

[0068] The placement instruction refers to the specific control process of controlling the suction cup 21 to place the LED beads from the loading position onto the placement carrier. According to the picking parameters, the LED beads are picked up from the loading position and detected. Then, according to the synchronous execution combination and the single-point execution combination, the correspondence between the adsorption number and the suction cup number is determined. The suction cup 21 is moved to the corresponding placement position and pressed down to place the LED beads, thus obtaining the full-process placement instruction.

[0069] When the detection component 5 detects that the LED bead is leaking or has an angular deviation, it records the bonding number corresponding to the suction cup number and does not perform bonding in the current bonding operation. After all bonding numbers have been bonded, it organizes all the recorded bonding numbers and performs the replenishment operation.

[0070] The synchronous execution of the combined matching method includes the following steps: S20: Select the bonding intervals that are the same as the suction cup intervals and sort them according to the order of the bonding numbers.

[0071] The same bonding interval as the suction cup interval means that the distance between two bonding positions is the same as the distance between two suction cup positions, which means that the physical conditions for simultaneous parallel bonding of multiple suction cups 21 are met.

[0072] For example, the distance between bonding number a and bonding number d is 10 mm, and the distance between two adjacent suction cups 21 is also 10 mm; the distance between bonding number b and bonding number g is 20 mm, and the distance between suction cup a and suction cup c is 20 mm; all of the above represent that the corresponding suction cup interval and bonding interval are the same.

[0073] S21: The bonding number corresponding to the first bonding interval is matched with the suction cup number to form the first synchronous execution combination.

[0074] The bonding number corresponding to the first bonding interval after sorting is matched with the suction cup number, thus forming the first group of synchronous execution combinations.

[0075] For example, the first synchronous execution combination is formed by matching the bonding numbers a and d with the suction cups a and b. This means that during a single pressing process, the LED beads on suction cups a and b can be simultaneously bonded to the positions corresponding to bonding numbers a and d.

[0076] S22: Based on the preset execution cycle, compare with the first synchronous execution combination to obtain the remaining suction cup number and its corresponding remaining suction cup interval.

[0077] The execution cycle refers to the maximum number of suction cups that can be used simultaneously in a single pressing and mounting action. It corresponds to the cycle of a single operation. The total number of suction cups read from the equipment information is used as the upper limit of a single cycle. For example, if there are four suction cups 21 installed on the mounting plate 22, after these four suction cups 21 have finished mounting, they need to pick up new LED beads again. These four suction cups 21 correspond to the execution cycle.

[0078] The remaining suction cup number refers to the idle suction cup number that has not yet been assigned a patching task after the component completes the first group of synchronous execution combinations within a single execution cycle; the remaining number is the number after removing the numbers from all suction cup numbers and the numbers that have been paired.

[0079] For example, once suction cups a and b are paired, the remaining suction cups are numbered as suction cup c and suction cup d.

[0080] The remaining suction cup interval refers to the center-to-center distance between the remaining free suction cups; the position of the remaining suction cups is read, and the center-to-center distance between each pair is calculated, which is the remaining suction cup interval.

[0081] For example, if the distance between the remaining suction cups c and d is 10 mm, then 10 mm is the remaining suction cup interval.

[0082] S230: If there is a remaining suction cup gap, compare the remaining suction cup gap with the subsequent bonding gap in sequence.

[0083] The existence of a remaining suction cup interval means that there are still two or more idle suction cups that have not been assigned tasks in the current execution cycle, and subsequent bonding intervals can continue to be matched; check whether the number of remaining suction cups is not less than 2. If it is not less than 2, then there is a remaining suction cup interval.

[0084] S231: The bonding number corresponding to the bonding interval that is consistent with the remaining suction cup interval is matched with the suction cup number to form the subsequent synchronous execution combination.

[0085] Similar to the matching method for the first synchronous execution combination, subsequent synchronous execution combinations are obtained by matching based on the remaining suction cup interval.

[0086] S24: If there are no remaining suction cup intervals, then the next bonding interval will be matched with the suction cup number based on the execution cycle to form a subsequent synchronous execution combination.

[0087] There are no remaining suction cup intervals, which means that there are fewer than two suction cups 21 that have not been assigned in the current cycle, which is insufficient to match the remaining bonding intervals. It is necessary to recycle the suction cup numbers and start a new round of grouping.

[0088] S25: Repeat the above steps until all the bonding intervals that are the same as the suction cup intervals constitute a synchronous execution combination.

[0089] All bonding intervals are allocated to suction cup intervals to form a synchronous execution combination of multiple execution cycles. Then, the bonding numbers that make up the bonding intervals are paired sequentially with the empty individual bonding numbers in all execution cycles to form a single-point execution combination.

[0090] For example, if the distance between mating numbers a, c, and e is 10 mm and they are on a straight line, they can form a synchronous execution combination with suction cups a, b, and c. In this execution cycle, suction cup d can only be matched with mating numbers that are not paired, in order to form a single-point execution combination.

[0091] The method for determining the adjustment vector includes the following steps: S300: Based on the same synchronous execution combination, determine the offset angle that the corresponding mounting plate 22 needs to be adjusted according to the connection between the mating positions.

[0092] The offset angle refers to the overall rotation angle required for the mounting plate 22 to rotate so that multiple LED beads are simultaneously aligned with the corresponding mating positions below. Connect the multiple mating positions in the same group, calculate the angle between the connecting line and the X-axis, and obtain the overall rotation amount of the mounting plate 22, i.e., the offset angle.

[0093] S301: Based on the same single-point execution combination, the initial angle of the suction cup is used as the offset angle.

[0094] Based on the same single-point execution combination, the mounting plate 22 does not need to rotate, so the offset angle is the same as the initial angle of the suction cup and is 0.

[0095] S31: Determine the relative offset vector between the LED on the bonding carrier and the mounting plate 22 by using the offset angle and the bonding angle.

[0096] The relative offset vector refers to the set of relative angles and relative directions between the mounting plate 22 and the LED lamp bead installation orientation after the mounting plate 22 is rotated. The relative angle is calculated by subtracting the fitting angle and the offset angle, and the relative direction is determined based on the positive or negative value of the calculation result. The relative offset vector is then obtained by integrating these values.

[0097] S32: Combine the relative offset vector, the initial angle of the suction cup, and the initial angle of the LED to determine the adjustment vector that adjusts the suction cup 21 from the initial angle of the suction cup to form a relative offset vector with the initial angle of the LED.

[0098] When the mounting plate 22, after adjusting the vector, picks up the LED beads from the loading station 41, the angle between the mounting plate 22 and the LED beads is the angle in the relative offset vector, and the direction of the offset is the same.

[0099] After determining the adjustment vector, the following steps are also included: S40: Based on the same execution cycle, read all adjustment vectors and sort them according to the execution order.

[0100] Read all adjustment vectors in the same execution cycle and arrange them in the order of execution.

[0101] S41: The real-time adjustment vector is calculated by comparing the current adjustment vector with the next adjustment vector.

[0102] The real-time adjustment vector refers to the incremental angle required to rotate from the previous posture to the next posture, which is a relative angle. The angle increment is obtained by subtracting the previous set of adjustment vectors from the next set of adjustment vectors, which is the real-time adjustment vector.

[0103] For example, if the previous rotation angle was 90° clockwise and the next rotation angle was 120° clockwise, then the real-time adjustment vector will rotate 30 degrees clockwise without needing to reset to zero; it will directly rotate another 30°.

[0104] S42: Replace the next adjustment vector with the real-time adjustment vector.

[0105] S43: Determine the material taking parameters based on the replaced adjustment vector.

[0106] The new material taking parameters are determined based on the replaced adjustment vector, and the determination method is the same as the original method.

[0107] S44: After executing the last set of adjustment vectors, control the suction cup 21 to execute according to the preset reset parameters.

[0108] The reset parameters are the parameters that the mounting plate 22 drives the suction cup 21 to move to the initial position and rotate to the initial state after all the adjustment vectors in the current execution cycle are completed. The servo motor origin coordinates are pre-entered into the system to generate a zero-return motion program, and the rotation angle, motion speed, and delay duration are uniformly saved as reset parameters.

[0109] The following steps are also included when executing the patch placement instruction.

[0110] S50: In response to a pressing signal that controls the suction cup 21 with LED beads to perform a pressing action, a ranging laser is emitted to measure the execution distance between the suction cup 21 and the mounting plate.

[0111] The downward pressure signal is the trigger signal that drives the suction cup 21 to press down the LED beads to achieve the chip placement operation; when the mounting plate 22 drives the suction cup 21 to move and stop above the corresponding bonding position, the system automatically triggers and sends out the downward pressure signal.

[0112] The execution distance refers to the real-time height value between the laser emission position and the patch carrier obtained by the ranging laser in real time; the height value is output in real time by the laser ranging sensor, which is the execution distance.

[0113] S51: Obtain the thickness of the LED chip and the solder paste information on the surface mount substrate.

[0114] LED bead thickness refers to the overall height dimension of the LED bead body; the operator determines the LED bead model and measures the bead thickness in advance according to the surface mount requirements, and then enters the information into the system beforehand.

[0115] Solder paste information refers to the relevant material parameters of the solder paste used to fix LED chips on the surface mount carrier, including melting temperature, etc. The operator determines the type of solder paste in advance according to the surface mount requirements, measures the relevant material parameters of the solder paste, integrates the solder paste information, and enters it into the system.

[0116] S52: Determine the bonding distance corresponding to the distance measurement laser when the bottom of the LED bead is bonded to the substrate under standard working conditions based on equipment information and LED bead thickness.

[0117] The bonding distance refers to the distance that the ranging laser should measure when the bottom surface of the LED bead is just pressed against the surface of the chip carrier board with solder paste. The bonding distance is calculated by reading the vertical distance between the laser emission position and the bottom surface of the suction cup from the equipment information according to the installation position of the laser emitter, and summing the vertical distance with the thickness of the LED bead.

[0118] S53: When the execution distance is not greater than the bonding distance, read the suction cup number of the currently executed patch.

[0119] If the execution distance is not greater than the bonding distance, it means that the suction cup 21 has driven the lower surface of the LED bead to squeeze the solder paste and bond it to the surface of the surface mount carrier.

[0120] S54: Set the gas supply parameters for room temperature drying gas based on the solder paste information.

[0121] The gas supply parameters refer to the execution parameters such as the gas supply pressure and ventilation time of the dry gas at room temperature. The solder paste viscosity is read from the solder paste information, and the corresponding gas supply pressure and ventilation time are looked up from the gas supply correspondence table according to the solder paste viscosity. The gas supply correspondence table is a data table that records different solder paste viscosities and their corresponding gas supply pressure and ventilation time. The higher the solder paste viscosity, the longer the gas supply pressure and ventilation time.

[0122] Since the solder paste is in a molten state under standard conditions, and compressed air needs to be introduced when the chuck releases the LED beads, this compressed air may push the not-yet-fully-fixed LED beads, causing the LED beads to be misaligned. Therefore, the surface of the molten solder paste is simply cured by blowing with room temperature dry gas, so as to initially fix the LED beads before the chuck detaches from the LED beads.

[0123] The suction cup 21 has an annular sealing cover around its perimeter. When the suction cup 21 is pressed down into place, the sealing cover will form a near-sealed air cavity around the contact point, preventing the dry airflow from affecting other solder paste in the surrounding area.

[0124] S55: Based on the air supply parameters, the preset condensation device corresponding to the chuck number blows airflow onto the solder paste surface.

[0125] The condensation device refers to the pulsed air path assembly installed on the outside of the adsorption suction cup 21, which is used to introduce dry airflow around the adsorption suction cup 21 to accelerate the solidification of the molten solder paste surface layer.

[0126] S56: After the solder paste has partially cured, compressed air is introduced into the suction cup 21 to release the LED beads from the suction cup, and the suction cup 21 is raised to complete the placement process.

[0127] The following steps are included before performing the air blowing procedure: S60: Determine the melting temperature of the solder paste based on the solder paste information.

[0128] Melting temperature refers to the initial temperature at which solder paste changes from a highly viscous solid state to a flowable, wet state. Operators obtain the corresponding melting temperature in advance based on the solder paste model and integrate it into the solder paste information. When using the solder paste, the melting temperature is directly read.

[0129] S61: Collect the surface temperature of the solder paste.

[0130] Surface temperature refers to the actual measured temperature of the solder paste surface layer in real time, which is collected by the infrared temperature probe. The surface temperature is obtained by the infrared temperature measurement module, which is pre-installed on the outside of the adsorption suction cup 21, to collect the solder paste at the bonding position in real time.

[0131] S62: When the surface temperature is lower than the melting temperature, match the suction cup position according to the suction cup number.

[0132] If the surface temperature is lower than the melting temperature, it means that the solder paste is thick and hardened, and the LED beads cannot be fully embedded in the solder paste to achieve tight wetting. Therefore, the laser preheating and softening process must be started.

[0133] S63: Combine the bonding distance, suction cup position and preset laser position to determine the rotation vector of the control heating laser toward the area around the suction cup 21.

[0134] The laser position refers to the fixed installation coordinates of the laser emitter. The laser emitter has two close laser emitting ends, which emit ranging lasers or heating lasers respectively. The laser position is the specific coordinate of the heating laser emission position. The laser position is set in advance by the operator according to the installation position of the laser emitter and entered into the system.

[0135] The rotation vector refers to the swing angle and swing direction required to control the rotation of the laser emitter and align the heated laser with the bonding position. The rotation vector is obtained by combining the bonding distance, the coordinates of the suction cup position, and the coordinates of the laser position, and calculating the deflection angle and deflection direction of the laser using trigonometric functions.

[0136] S64: Set the heating parameters for controlling the heating laser based on solder paste information and surface temperature.

[0137] Heating parameters refer to the laser output power set when the laser emitter is executed. The thermistor coefficient of the solder paste is read from the solder paste information. Based on the thermistor coefficient, the corresponding base power is looked up from the laser correspondence table. The laser correspondence table is a data table that records different thermistors and their corresponding base powers. The higher the thermistor coefficient, the lower the base power. Then, the temperature difference is calculated based on the melting temperature and surface temperature. The base power is corrected based on the temperature difference to obtain the laser output power. The larger the temperature difference, the larger the correction coefficient.

[0138] S65: Controls the emission of a heating laser to melt solder paste based on rotation vector and heating parameters.

[0139] The following steps are also included when executing heating parameters: The steady-state temperature at which the solder paste will not flow due to airflow impact is determined based on the solder paste information.

[0140] Steady-state temperature refers to the safe temperature at which the solder paste viscosity rises after it has been fully impregnated and softened, and the airflow will not cause the solder paste to flow or the LED beads to shift. Process tests are conducted in advance to record the temperature value corresponding to the drop in solder paste fluidity, i.e., the steady-state temperature, and the data is pre-entered into the system.

[0141] S70: Collect and update the surface temperature of the solder paste.

[0142] S71: When the surface temperature is consistent with the preset buffer temperature, the output power of the heating laser is controlled based on the preset down-adjustment parameter.

[0143] The buffer temperature refers to the warning node temperature below the melting temperature. When the laser power reaches this node, it is reduced in advance. The buffer temperature is set to 90% of the steady-state temperature. When the steady-state temperature is obtained, the system automatically calculates the buffer temperature.

[0144] If the surface temperature is the same as the buffer temperature, it means that the solder paste temperature is about to reach the melting point. The heating power must be reduced to avoid the solder paste flowing over a large area due to excessive temperature rise.

[0145] The reduction parameter refers to the magnitude of the laser power reduction in a single operation; it is preset by the operator and entered into the system, and in this embodiment, it is set to 10%.

[0146] S72: When the surface temperature matches the melting temperature, control the heating laser to stop outputting.

[0147] When the surface temperature matches the melting temperature, it means the solder paste has just reached the optimal wetting state. Immediately cut off the laser output and stop heating.

[0148] Since the surface temperature is a continuously fluctuating value, when the surface temperature continues to fluctuate around the melting temperature, it is considered consistent. The duration threshold and the fluctuation range of the temperature judgment are preset by the operator and entered into the system.

[0149] S73: When the surface temperature is consistent with the steady-state temperature, execute the air blowing process.

[0150] When the surface temperature is consistent with the steady-state temperature, it means that the solder paste fluidity has returned to a safe range. At this time, turning on the airflow to blow away the components will not cause them to bend, and the blowing and shaping process can be performed.

[0151] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. An LED patch control method, characterized in that, include: S10: In response to the positioning signal of the mounting carrier, acquire the task information for performing the mounting and the device information for performing the mounting; S11: Read the bonding position, bonding angle, and bonding number of the patch to be bonded from the task information; read the suction cup position, suction cup number, loading position, and detection position to be gripped from the equipment information. S12: Determine the suction cup interval between any two suction cups (21) according to the suction cup position, and determine the bonding interval between any two bonding positions. The suction cup (21) is a preset suction execution component, and multiple suction cups (21) are installed on the same mounting plate (22). S13: Match multiple synchronous execution combinations of bonding numbers and suction cup numbers corresponding to each other based on the bonding interval and suction cup interval, and sequentially match the remaining bonding numbers and suction cup numbers to form single-point execution combinations. S14: Based on the same synchronous execution combination and single-point execution combination, determine the adjustment vector of the suction cup (21) when grasping the lamp bead according to the contact angle, the preset initial angle of the suction cup and the initial angle of the lamp bead; S15: Determine the picking parameters of multiple adsorption suction cups (21) sequentially to grab the LED beads and perform the detection by the feeding position, detection position and adjustment vector; S16: Combine synchronous execution combination, single-point execution combination and material picking parameters to determine and execute the patching instruction to control the operation of the adsorption suction cup (21).

2. The LED chip control method according to claim 1, characterized in that, The matching methods for synchronous execution of combinations include: S20: Select the bonding intervals that are the same as the suction cup intervals and sort them according to the order of the bonding numbers; S21: Match the bonding number corresponding to the first bonding interval with the suction cup number to form the first synchronous execution combination; S22: Based on the preset execution cycle, compare with the first synchronous execution combination to obtain the remaining suction cup number and its corresponding remaining suction cup interval; S230: If there is a remaining suction cup gap, compare the remaining suction cup gap with the subsequent bonding gap in sequence; S231: The bonding number corresponding to the bonding interval that is consistent with the remaining suction cup interval is matched with the suction cup number to form the subsequent synchronous execution combination; S24: If there are no remaining suction cup intervals, then the next bonding interval will be matched with the suction cup number based on the execution cycle to form a subsequent synchronous execution combination; S25: Repeat the above steps until all the bonding intervals that are the same as the suction cup intervals constitute a synchronous execution combination.

3. The LED chip control method according to claim 2, characterized in that, Methods for determining the adjustment vector include: S300: Based on the same synchronous execution combination, determine the offset angle that the corresponding mounting plate (22) needs to be adjusted according to the connection between the mating positions; S301: Based on the same single-point execution combination, the initial angle of the suction cup is used as the offset angle; S31: Determine the relative offset vector between the LED on the bonding carrier and the mounting plate (22) by using the offset angle and the bonding angle; S32: Combine the relative offset vector, the initial angle of the suction cup and the initial angle of the lamp bead to determine the adjustment vector that adjusts the suction cup (21) from the initial angle of the suction cup to form a relative offset vector with the initial angle of the lamp bead.

4. The LED chip control method according to claim 3, characterized in that, After determining the adjustment vector, the following is also included: S40: Based on the same execution cycle, read all adjustment vectors and sort them according to the execution order; S41: Calculate the real-time adjustment vector by comparing the current adjustment vector with the next adjustment vector; S42: Replace the next adjustment vector with the real-time adjustment vector; S43: Determine the material taking parameters based on the replaced adjustment vector; S44: After executing the last set of adjustment vectors, control the suction cup (21) to execute according to the preset reset parameters.

5. The LED chip control method according to claim 1, characterized in that, Executing the patch instruction also includes: S50: In response to a pressing signal that controls the suction cup (21) with LED beads adsorbed to perform a pressing action, a ranging laser is emitted to measure the execution distance between the suction cup (21) and the patch carrier. S51: Obtain the thickness of the LED chip and the solder paste information on the surface mount carrier; S52: Determine the bonding distance corresponding to the ranging laser when bonding the bottom of the LED chip to the substrate under standard working conditions based on equipment information and chip thickness; S53: When the execution distance is not greater than the bonding distance, read the suction cup number of the currently executed patch; S54: Set the gas supply parameters for room temperature drying gas according to the solder paste information; S55: Based on the air supply parameters, the preset condensation device corresponding to the chuck number blows airflow onto the solder paste surface; S56: After the solder paste has partially cured, compressed air is introduced into the suction cup (21) to release the LED beads from adsorption, and the suction cup (21) is raised to complete the placement process.

6. The LED chip control method according to claim 5, characterized in that, Before performing the air blowing procedure, the following also applies: S60: Determine the melting temperature of the solder paste based on the solder paste information; S61: Collect the surface temperature of the solder paste; S62: When the surface temperature is lower than the melting temperature, match the suction cup position according to the suction cup number; S63: Combine the bonding distance, suction cup position and preset laser position to determine the rotation vector of the control heating laser toward the area around the suction cup (21); S64: Set the heating parameters for controlling the heating laser based on solder paste information and surface temperature; S65: Controls the emission of a heating laser to melt solder paste based on rotation vector and heating parameters.

7. The LED chip control method according to claim 6, characterized in that, Executing heating parameters also includes: Based on the solder paste information, determine the steady-state temperature at which the solder paste will not flow due to airflow impact; S70: Collect and update the surface temperature of solder paste; S71: When the surface temperature is consistent with the preset buffer temperature, the output power of the heating laser is controlled based on the preset down-adjustment parameter; S72: When the surface temperature matches the melting temperature, control the heating laser to stop outputting; S73: When the surface temperature is consistent with the steady-state temperature, execute the air blowing process.

8. An LED chip mounting device, controlled by an LED chip mounting control method as described in claims 1 to 7, characterized in that, It includes a gripping component (2), a conveying component (3) and a feeding component (4), wherein the conveying component (3) is provided with a patch placement station (31) and the feeding component (4) is provided with a feeding station (41). The conveying assembly (3) is used to convey the mounting carrier to the mounting station (31) for mounting operation, and the feeding assembly (4) is used to convey the LED beads one by one to the feeding station (41) for the gripping assembly (2) to grip. The gripping assembly (2) includes a plurality of suction cups (21) for vacuum adsorption and a mounting plate (22) for assembling the plurality of suction cups (21). The suction cups (21) are telescopically mounted on the mounting plate (22) in a direction away from or close to the loading station (41). The mounting plate (22) has multiple degrees of translation and rotation to drive the suction cups (21) through the loading station (41) and the patching station (31).

9. An LED chip mounting device according to claim 8, characterized in that, It also includes a detection component (5) for detecting the LED beads after they are grasped, and the detection component (5) is provided with a detection station (51). The inspection station (51) is located between the loading station (41) and the mounting station (31). The gripping component (2) grips the LED beads on the loading station (41) and, after being inspected by the inspection station (51), attaches the LED beads to the mounting substrate of the mounting station (31).

10. An LED patch mounting device according to claim 9, characterized in that, The gripping component (2), the feeding component (4) and the detection component (5) are symmetrically arranged in two sets along the conveying direction of the conveying component (3). The two sets of gripping components (2) grip the LED beads in sequence and perform the placement operation on the placement carrier board on the placement station (31).

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