Image sensor packaging structure, lens module, packaging method and electronic device

Abstract

This application relates to the field of image sensor packaging technology, and in particular to image sensor packaging structures, lens modules and packaging methods, and electronic devices. To achieve advantages such as high yield, low cost, and small footprint in lens modules, this application proposes a lens module comprising leads, a PCB substrate, and an image sensing chip. The leads are electrically interconnected with a first pad on the image sensing chip and a second pad on the PCB substrate. An insulating barrier is formed on the image sensing chip covering the connection between the leads and the first pad. An encapsulation is formed on the PCB substrate covering the leads and the connection between the leads and the second pad. A lens holder is also connected to the PCB substrate, and a lens is mounted on the lens holder. The barrier and encapsulation prevent damage to the leads, improving yield; simultaneously, they eliminate the need for an IC substrate and solder balls, which helps reduce costs, save time, and miniaturize the image sensor packaging structure.

Description

Technical Field

[0001] This application relates to the field of image sensor packaging technology, and in particular to image sensor packaging structures, lens modules and packaging methods, and electronic devices. Background Technology

[0002] The image sensing chip (bare die) in the lens module can be packaged using two different packaging methods.

[0003] The first packaging method: Chip On Board (COB) packaging.

[0004] COB packaging is a technology that directly packages image sensing chips onto a PCB substrate.

[0005] The COB-packaged lens module includes a PCB substrate with finger pads, an image sensor chip with an image-sensitive area and bonding pads, leads, a lens holder, an infrared cut-off filter plane glass, and a lens. The image sensor chip is mounted on the PCB substrate using chip mounting adhesive. The two ends of the leads are electrically interconnected with the bonding pads on the image sensor chip and the finger pads on the PCB substrate, respectively, to electrically connect the image sensor chip to the PCB substrate. The lens holder, which holds the infrared cut-off filter plane glass and the lens, is attached to the PCB substrate and houses the image sensor chip and leads.

[0006] The second packaging method is the Imaging Ball Grid Array (IBGA) package.

[0007] IBGA packaging is a technology that mounts an image sensor chip face up on an IC substrate and achieves electrical interconnection between the image sensor chip and the IC substrate through wire bonding. At the same time, solder balls are processed on the bottom of the IC substrate and the IC substrate is soldered to the PCB substrate to achieve electrical interconnection between the image sensor chip and the PCB substrate.

[0008] The IBGA-packaged lens module includes a PCB substrate, an image sensor chip with an image-sensitive area and bonding pads, leads, a dam, encapsulating adhesive, a lens bracket, an infrared cut-off filter plane glass, a lens, an IC substrate with finger pads, and solder balls. The image sensor chip is mounted on the IC substrate using chip mounting adhesive. The two ends of the leads are electrically interconnected with the bonding pads on the image sensor chip and the finger pads on the IC substrate, respectively, to electrically connect the image sensor chip to the IC substrate. A cover glass is connected to the image sensor chip via a dam formed by encapsulating adhesive to protect the image-sensitive area of ​​the image sensor chip. The dam surrounds the image-sensitive area of ​​the image sensor chip and covers the connection points between the leads and bonding pads to protect these connections. Encapsulating adhesive is formed around the cover glass and the periphery of the image sensor chip on the IC substrate to form a sealed structure for the image sensor chip. Simultaneously, the encapsulating adhesive covers the leads and the connections between the leads and finger pads, thereby protecting the leads and the connections between the leads and finger pads. Conductive vias are formed on the IC substrate. Solder balls electrically connected to the conductive vias are formed on the side of the IC substrate opposite to the image sensor chip. The IC substrate is electrically connected to the PCB substrate through the solder balls. A lens holder, which is fixed with an infrared cut-off filter plane glass and a lens, is bonded to the PCB substrate and houses the IC substrate, the image sensor chip, and the lead wires.

[0009] For lens modules packaged using the COB (Chip-on-Board) method, there are two unfavorable factors affecting the yield rate of the lens module: (1) Before installing the infrared cut-off filter plane glass, due to the exposure of the image sensing chip, the production environment must be strictly controlled during the packaging process to avoid dust in the environment from contaminating the image sensitive area on the image sensing chip.

[0010] (2) The leads are also exposed without protection, which poses a risk of damage to the leads.

[0011] For lens modules packaged using the IBGA method, their structure is relatively complex and the cost is relatively high; at the same time, the lens module occupies a large space.

[0012] Therefore, there is an urgent need for lens modules with high yield rates, low costs, and small footprints, as well as corresponding packaging methods. Summary of the Invention

[0013] To address the aforementioned issues, the first aspect of this application provides an image sensor packaging structure, including leads, a PCB substrate, and an image sensing chip mounted on the PCB substrate. The image sensing chip has a first pad, the PCB carrier has a second pad, and the two ends of the lead are electrically interconnected with the first pad and the second pad, respectively. The image sensing chip has an image sensitive area on the side away from the PCB substrate, and an insulating dam is formed on the image sensing chip that surrounds the image sensitive area and covers the connection between the lead and the first pad. The PCB substrate also has a package that covers the leads and insulates the connection between the leads and the second pad.

[0014] The aforementioned image sensor packaging structure, through the dam and package body, can protect the leads, the connection between the leads and the first pad, and the connection between the leads and the second pad in all directions, thus preventing lead damage and improving yield. At the same time, it eliminates the need for IC carrier board and solder balls, which helps to reduce costs and save time, and also facilitates the miniaturization of the image sensor packaging structure.

[0015] In some embodiments, a light-transmitting cover plate is connected to the dam body, at least covering the image-sensitive area of ​​the image sensor chip. The cover plate can prevent dust from the environment from falling on the image-sensitive area, thus preventing contamination of the image-sensitive area and improving the yield rate.

[0016] In some embodiments, the cover plate is an infrared cut-off filter cover plate.

[0017] Infrared cut-off filter covers can simultaneously prevent image-sensitive areas from being contaminated and correct colors. Their simple structure helps reduce costs. When applied to the lens module within the image sensor packaging structure, they can also shorten the minimum distance between the lens closest to the image sensor chip and the image-sensitive area, shortening the optical path and thus reducing stray light, ghosting, and glare, thereby improving image quality.

[0018] In some embodiments, the encapsulation body also covers the periphery of the cover plate to protect the cover plate.

[0019] In some embodiments, both the dam body and the encapsulation body are formed of organic insulating material.

[0020] In some embodiments, the dam body and the encapsulation body are formed of the same organic insulating material.

[0021] In some embodiments, the dam body and the encapsulation body are formed by an adhesive.

[0022] The second aspect of this application provides a lens module, including the image sensor packaging structure in any of the above embodiments, wherein a lens bracket is also mounted on the PCB carrier, and a lens is mounted on the lens bracket. The lens bracket and the lens together cover the leads, the image sensing chip and the second pad.

[0023] When the cover plate is an infrared cut-off filter cover plate, it can simultaneously prevent image-sensitive areas from being contaminated and correct colors. Its simple structure helps reduce costs. Simultaneously, it shortens the minimum distance between the lens closest to the image sensor chip and the image-sensitive area, reducing the optical path and thus decreasing stray light, ghosting, and flare, improving image quality. Furthermore, it eliminates the need for an infrared cut-off filter plane glass on the lens mount, reducing costs, saving time, and facilitating the miniaturization of the lens module.

[0024] In some embodiments, when the image sensor packaging structure includes the cover plate, and the cover plate is a full-spectrum transmission cover plate, an infrared cut-off filter plane glass is also mounted on the lens bracket, and the infrared cut-off filter plane glass is located between the lens and the cover plate.

[0025] A third aspect of this application provides an electronic device including the lens module from any of the above embodiments. Exemplarily, the electronic device may be a video camera or a camera.

[0026] A fourth aspect of this application provides an image sensor packaging method, comprising the following steps: The image sensing chip is mounted on the PCB substrate; Install leads so that the two ends of the leads are electrically interconnected with the first pad on the image sensor chip and the second pad on the PCB carrier, respectively. An insulating dam is formed on the image sensing chip and an insulating package is formed on the PCB substrate. The dam surrounds the image sensitive area on the image sensing chip and covers the connection between the lead and the first pad. The package covers the lead and the connection between the lead and the second pad.

[0027] After packaging, the aforementioned image sensor packaging method effectively protects the leads from damage by using a dam and a package body, thus improving yield. Furthermore, compared to the IGBA packaging method, it eliminates the need for an IC substrate and solder balls, which helps reduce costs and save time, and also facilitates the miniaturization of the image sensor packaging structure.

[0028] In some embodiments, the step of forming an insulating dam on the image sensing chip and forming an insulating package on the PCB substrate includes: applying sealant to the image sensing chip to form the dam; bonding a light-transmitting cover plate to the dam such that the cover plate at least covers the image-sensitive area on the image sensing chip; and applying encapsulating adhesive to the PCB substrate to form the package.

[0029] In some embodiments, the step of forming an insulating dam on the image sensing chip and an insulating package on the PCB substrate includes: simultaneously applying a sealant to form the dam and an encapsulating adhesive to form the package; and bonding a light-transmitting cover plate to the dam such that the cover plate at least covers the image-sensitive area on the image sensing chip; wherein the sealant and the encapsulating adhesive are the same organic insulating material.

[0030] In this image sensor packaging method, the simultaneous application of sealant and encapsulating adhesive saves one adhesive application step. The sealant and encapsulating adhesive can also cure at the same time, which can greatly save time and improve packaging efficiency.

[0031] In some embodiments, the cover plate is an infrared cut-off filter cover plate.

[0032] Infrared cut-off filter covers can simultaneously prevent image-sensitive areas from being contaminated and correct colors. Their simple structure helps reduce costs. In subsequent lens module packaging, on the one hand, they can shorten the minimum distance between the lens closest to the image sensor chip and the image-sensitive area, shortening the optical path and thus reducing stray light, ghosting, and glare, improving image quality. On the other hand, they can eliminate the need for infrared cut-off filter plane glass, reducing costs, saving time, and facilitating the miniaturization of the lens module.

[0033] The fifth aspect of this application provides a lens module packaging method, including: The steps of the image sensor packaging method in any of the above embodiments; and The step of mounting the lens holder with the lens on the PCB carrier board is to allow the lens holder and the lens to together cover the leads, the image sensor chip and the second pad.

[0034] After the steps of the image sensor packaging method are performed, the dam and package can protect the leads from damage, improving the yield rate. At the same time, compared with the IGBA packaging method, it eliminates the need for IC carrier board and solder balls, which helps to reduce costs and save time, and also facilitates the miniaturization of lens modules.

[0035] When the cover plate is an infrared cut-off filter cover plate, in the step of mounting the lens holder with the lens on the PCB carrier, only the lens is mounted on the lens holder. At this time, it is not necessary to install the infrared cut-off filter plane glass, which helps to reduce costs, save labor time, and facilitate the miniaturization of the lens module. At the same time, since the infrared cut-off filter plane glass located between the lens and the cover plate is eliminated, the minimum distance between the lens closest to the image sensing chip and the image sensitive area can be shortened, the optical path can be shortened, thereby reducing stray light, ghosting and glare, and improving image quality.

[0036] In some embodiments, when the image sensor packaging method includes the step of bonding a cover plate to a dam body and the cover plate is a full-spectrum transmission cover plate, the step of mounting a lens holder with a lens on a PCB carrier includes: mounting a lens holder with the lens and an infrared cut-off filter plane glass on a PCB carrier, wherein the infrared cut-off filter plane glass is located between the lens and the full-spectrum transmission cover plate. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of one embodiment of the image sensor packaging structure of this application; Figure 2 This is a flowchart of the image sensor packaging method of this application; Figure 3 This is a diagram illustrating the packaging process of the image sensor packaging method of this application; Figure 4 This is a top-view diagram of the packaging process of the image sensor packaging method of this application. Figure 5 This is a schematic diagram of the structure of a lens module according to Embodiment 1 of this application; Figure 6 This is a flowchart of Embodiment 1 of the lens module packaging method of this application; Figure 7 This is a diagram illustrating the packaging process of Embodiment 1 of the lens module packaging method of this application; Figure 8 This is a schematic diagram of the structure of the lens module in Embodiment 2 of this application; Figure 9 This is a flowchart of Embodiment 2 of the lens module packaging method of this application; Figure 10 This is a diagram illustrating the packaging process of Embodiment 2 of the lens module packaging method of this application.

[0038] Explanation of key component symbols: The image sensor package structure includes: 100, PCB carrier board 11, second pad 111, image sensing chip 12, image sensitive area 121, first pad 122, lead wire 13, chip mounting adhesive layer 16, dam body 17, package body 18, cover plate 19, lens module 200, lens bracket 21, infrared cut-off filter plane glass 22, lens 23, first lens 231, second lens 232, and third lens 233.

[0039] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0040] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0041] Examples of image sensor packaging structures like Figure 1 As shown, the image sensor package structure 100 includes a PCB substrate 11, an image sensing chip 12 with an image sensitive area 121, leads 13, a dam 17, and a package 18. The image sensitive area 121 is located on the side of the image sensing chip 12 away from the PCB substrate 11. The image sensing chip 12 has a first pad 122, which can be a bonding pad, a rectangular pad, a finger pad, or a circular pad, etc. The PCB substrate 11 has a second pad 111, which can be a finger pad, a rectangular pad, or a circular pad, etc.

[0042] The two ends of lead 13 are electrically interconnected with the first pad 122 and the second pad 111, respectively, to achieve electrical interconnection between the PCB substrate 11 and the image sensor chip 12. The image sensor chip 12 can be mounted on the PCB substrate 11 using chip mounting adhesive. The chip mounting adhesive forms a chip mounting adhesive layer 16 between the image sensor chip 12 and the PCB substrate 11. At the same time, the image sensitive area 121 and the chip mounting adhesive layer 16 are located at the two ends of the image sensor chip 12, that is, the chip mounting adhesive does not contaminate the image sensitive area 121. Of course, the image sensor chip 12 can also be bonded to the PCB substrate 11 using die attach film (DAF).

[0043] The dam body 17 is formed of an organic insulating material coated on the image sensing chip 12, such as an organic insulating sealant. The organic insulating sealant can be an epoxy resin adhesive, such as the dam body 17 formed by the adhesive, for example, the dam adhesive from the manufacturer Henkel or the manufacturer Derek. The dam 17 surrounds the image sensitive area 121 and fully covers the connection between the lead 13 and the first pad 122 to protect the connection between the lead 13 and the first pad 122 from damage. The package 18 is formed of an organic insulating material coated on the PCB, such as an organic insulating sealant. The organic insulating sealant can be an adhesive, such as the low-temperature epoxy sealant (LES) from manufacturers Qiaoyue and Changxing Materials. The package 18 surrounds the image sensing chip 12 and covers the lead 13 and the connection between the lead 13 and the second pad 111. That is, the package 18 fully covers the part of the lead 13 that is not covered by the dam 17, so as to cooperate with the dam 17 to fully cover the lead 13, the connection between the lead 13 and the first pad 122, and the connection between the lead 13 and the second pad 111, thereby achieving all-round protection for the lead 13. The dam body 17 and the encapsulation body 18 can be formed from the same organic insulating material or from different organic insulating materials.

[0044] In some embodiments, a light-transmitting cover plate 19 may be added, at least covering the image-sensitive area 121 on the image sensor chip 12. The cover plate 19 is bonded to the sealant used to form the dam body 17 to connect to the dam body 17 and protect the image-sensitive area 121 on the image sensor chip 12, thereby preventing dust from the environment from falling on the image-sensitive area 121. The cover plate 19 is flat and may be made of light-transmitting materials such as glass, quartz, sapphire, or plastic.

[0045] In some embodiments, such as Figure 1 As shown, the encapsulation body 18 also covers the periphery of the cover plate 19 to protect the cover plate 19.

[0046] In some embodiments, please refer to Figure 5 To understand this, cover plate 19 is a full-spectrum transmission cover plate, meaning it can transmit all light. When cover plate 19 is a full-spectrum transmission cover plate, after the image sensor packaging structure 100 is applied to the lens module 200, an infrared cut-off filter plane glass 22 needs to be set in the lens module 200 to block infrared light while allowing visible light to pass through, thereby avoiding the overall image from being too red or too warm and ensuring that the colors are not distorted.

[0047] In other embodiments, please refer to Figure 8 To understand this, cover plate 19 is an infrared cut-off filter cover plate, which blocks infrared light while allowing visible light to pass through, thereby preventing the overall image from appearing reddish or warm and ensuring that the colors are not distorted. When cover plate 19 is an infrared cut-off filter cover plate, after the image sensor packaging structure 100 is applied to the lens module 200, it is not necessary to set an infrared cut-off filter plane glass 22 in the lens module 200; the cover plate 19 alone is sufficient to ensure that the colors of the optical module are not distorted.

[0048] In other embodiments, the surface of the cover plate 19 may also be coated with an anti-reflection (AR) film to reduce the reflectivity of the surface of the cover plate 19 and allow more light to pass through the cover plate 19.

[0049] The image sensor packaging structure of this application embodiment has the following beneficial effects: (1) The dam body 17 is arranged around the image sensitive area 121 and covers the connection between the lead wire 13 and the first pad 122. The package body 18 covers the lead wire 13 and the connection between the lead wire 13 and the second pad 111, so that the dam body 17 and the package body 18 can protect the lead wire 13, the connection between the lead wire 13 and the first pad 122 and the connection between the lead wire 13 and the second pad 111 in all aspects, so as to avoid the lead wire 13 being damaged during the packaging process and improve the yield.

[0050] (2) By adding a light-transmitting cover plate 19 that covers at least the image sensitive area 121 on the image sensing chip 12, the cover plate 19 protects the image sensitive area 121, preventing dust from falling on the image sensitive area 121, preventing the image sensitive area from being contaminated, and improving the yield rate.

[0051] (3) The image sensing chip 12 is directly mounted on the PCB carrier 11, and the package 18 is also directly connected to the PCB carrier 11. This eliminates the need for the IC carrier and solder balls in the IBGA-packaged lens module, simplifying the packaging process, reducing material costs, and thus effectively saving costs, time, and improving packaging efficiency. At the same time, since the IC carrier and solder balls are eliminated, the space occupied by the image sensor package structure 100 can also be effectively reduced, which is conducive to the miniaturization of the image sensor package structure 100 and further conducive to the miniaturization of the lens module 200.

[0052] In some embodiments, the image sensor packaging structure 100 may also exclude the cover plate 19. In this case, the embodiment has the above-mentioned beneficial effects (1) and beneficial effects (3).

[0053] Example 1 of an image sensor packaging method Please refer to Figures 2-4 To understand this, the image sensor packaging method of this embodiment includes the following steps: The image sensor chip 12 is mounted on the PCB substrate 11. Specifically, the image sensor chip 12 is mounted on the PCB substrate 11 using chip mounting adhesive. After mounting, a chip mounting adhesive layer 16 is formed between the image sensor chip 12 and the PCB substrate 11. Alternatively, the image sensor chip 12 can be adhered to the PCB substrate 11 using a die bonding film.

[0054] Install lead 13 so that its two ends are electrically interconnected with the first pad 122 on the image sensor chip 12 and the second pad 111 on the PCB carrier board 11, respectively. Lead 13 can be gold wire.

[0055] An insulating dam 17 is formed on the image sensor chip 12. The dam 17 surrounds and covers the connection between the lead 13 and the first pad 122 on the image sensor chip 12. Specifically, a ring of sealant is applied around the image sensitive area 121 on the image sensor chip 12. The sealant covers the connection between the lead 13 and the first pad 122 to form the dam 17 for covering and protecting the connection between the lead 13 and the first pad 122.

[0056] When the image sensor packaging structure 100 includes a light-transmitting cover plate 19, the cover plate 19 is bonded to the enclosure body 17 so that the cover plate 19 at least covers the image sensitive area 121 on the image sensing chip 12 to protect the image sensitive area 121 on the image sensing chip 12; if the image sensor packaging structure 100 does not include the cover plate 19, this step is omitted. The cover plate 19 can be a full-spectrum transmission cover plate or an infrared cut-off filter cover plate, and the surface of the cover plate 19 can also be coated with an AR film.

[0057] An insulating package 18 is formed on the PCB substrate 11, covering the lead 13 and the connection between the lead 13 and the second pad 111. Specifically, encapsulating adhesive is applied to the PCB substrate 11 to form the package 18 that covers and protects the lead 13 and the connection between the lead 13 and the second pad 111. Figure 3 As shown, the encapsulation body 18 can also surround the cover plate 19 to better secure the cover plate 19.

[0058] When packaging only one image sensor package structure 100 at a time, the above steps can be performed to successfully complete the packaging.

[0059] When multiple image sensor packaging structures 100 are packaged simultaneously, all multiple image sensor packaging structures 100 are packaged on the same PCB motherboard. After performing the above steps, a slicing step is also required. In the slicing step, the PCB motherboard is cut into PCB carrier boards 11 to cut the connected multiple image sensor packaging structures 100 into multiple independent single image sensor packaging structures 100.

[0060] The image sensor packaging structure 100 packaged using the image sensor packaging method of this application is the image sensor packaging structure 100 in the embodiments of this application, which has all the beneficial effects of the above image sensor packaging structure 100.

[0061] Furthermore, the image sensor packaging method in this application is simpler than the IBGA packaging method, which can save time and improve packaging efficiency.

[0062] In the above image sensor packaging method, the sealant and the encapsulating adhesive can be different or the same.

[0063] Example 2 of the image sensor packaging method like Figure 9 As shown, the image sensor packaging method includes the following steps: The image sensing chip 12 is mounted on the PCB carrier board 11.

[0064] Install lead wire 13.

[0065] Sealant is applied to the connection between lead 13 and first pad 122 to form a dam 17 that covers and protects the connection between lead 13 and first pad 122. At the same time, encapsulating adhesive is applied to the PCB carrier board 11 to form an encapsulation 18 that covers and protects lead 13 and the connection between lead 13 and second pad 111.

[0066] When the image sensor packaging structure 100 includes a light-transmitting cover plate 19, the light-transmitting cover plate 19 is bonded to the enclosure body 17, such that the cover plate 19 at least covers the image sensitive area 121 on the image sensing chip 12 to protect the image sensitive area 121 on the image sensing chip 12; if the image sensor packaging structure 100 does not include the cover plate 19, this step is omitted. The cover plate 19 can be a full-spectrum transmission cover plate or an infrared cut-off filter cover plate, and the surface of the cover plate 19 can also be coated with an AR film.

[0067] In Embodiment 1 of the image sensor packaging method, the sealant and encapsulating adhesive can be the same or different, and they are not applied simultaneously. In Embodiment 2 of the image sensor packaging method, the sealant and encapsulating adhesive are the same organic insulating material, so they can be applied simultaneously, further saving time and improving packaging efficiency.

[0068] The similarities between Embodiment 1 and Embodiment 2 of the image sensor packaging method are as follows: both the image sensing chip 12 and the lead wire 13 are uniformly bonded, and both form an insulating dam 17 on the image sensing chip 12 and an insulating package 18 on the PCB carrier board 11. The dam 17 surrounds the image sensitive area 121 on the image sensing chip 12 and covers the connection between the lead wire 13 and the first pad 122. The package 18 covers the lead wire 13 and the connection between the lead wire 13 and the second pad 111.

[0069] The difference between Embodiment 1 and Embodiment 2 of the above-mentioned image sensor packaging method is that in Embodiment 1, the sealant is applied first and the encapsulating adhesive is applied later, while in Embodiment 2, the sealant and encapsulating adhesive are applied simultaneously.

[0070] Lens module embodiment like Figure 5 and Figure 8 As shown, the lens module 200 includes the image sensor packaging structure 100 of this application. A lens bracket 21 is also connected to the PCB carrier 11, and a lens 23 is mounted on the lens bracket 21. The lens 23 includes a first lens 231, a second lens 232, and a third lens 233. The lens bracket 21 and the lens 23 together cover the lead wire 13, the image sensing chip 12, and the second pad 111. Those skilled in the art can set the specific parameters and number of lenses 23 according to actual needs.

[0071] In some embodiments, such as Figure 5 As shown, cover plate 19 is a full-spectrum transmission cover plate, and infrared cut-off filter plane glass 22 is mounted on lens bracket 21 to correct color. Infrared cut-off filter plane glass 22 is located between lens 23 and cover plate 19.

[0072] In some embodiments, such as Figure 8 As shown, cover plate 19 is an infrared cut-off filter cover plate with infrared cut-off function to correct color. The lens bracket 21 does not need to install the infrared cut-off filter plane glass 22, eliminating the need for a mounting structure on the lens bracket 21 for mounting the infrared cut-off filter plane glass 22. This effectively shortens the axial length of the lens bracket, reduces the volume and space occupied by the lens module 200, and facilitates the miniaturization of the lens module 200. Simultaneously, it reduces the minimum distance between the third lens 233, which is closest to the image sensing chip 12, and the image sensitive area 121, shortening the optical path, reducing stray light, ghosting, and glare, and improving image quality.

[0073] In addition, the image sensing chip 12 is directly mounted on the PCB substrate 11. When the distance between the lens 23 and the image sensitive area 121 remains unchanged, the distance between the lens 23 and the PCB substrate 11 can also be shortened, which is more conducive to the miniaturization of the lens module 200.

[0074] In some embodiments, when the cover plate 19 is an infrared cut-off filter cover plate with infrared cut-off function, the surface of the infrared cut-off filter cover plate may be coated with an anti-reflection (AR) film to reduce the reflectivity of the infrared cut-off filter cover plate surface and allow more light to pass through the infrared cut-off filter cover plate.

[0075] Examples of lens module packaging methods The lens module packaging method of this application is used to package any one of the lens modules 200 in the lens module embodiments of this application.

[0076] The lens module packaging method of this application includes the image sensor packaging method of any embodiment of this application, and further includes, based on the steps included in the image sensor packaging method of any embodiment of this application, the step of mounting a lens holder with lens 23 on a PCB substrate, such that the lens holder and lens 23 together cover the lead 13, the image sensing chip 12, and the second pad 122. Hereinafter, the step of mounting the lens holder 21 with lens 23 on the PCB substrate 11 is also referred to as the lens packaging step.

[0077] In some embodiments, please refer to Figure 6 and Figure 7When the cover plate 19 is a full-spectrum transmission cover plate, an infrared cut-off filter plane glass 22 is also installed on the lens bracket 21. The infrared cut-off filter plane glass 22 is located between the lens 23 and the full-spectrum transmission cover plate to correct the color.

[0078] In some embodiments, please refer to Figure 9 and Figure 10 When the cover plate 19 is an infrared cut-off filter cover plate, it is not necessary to install the infrared cut-off filter plane glass 22 on the lens bracket 21, and the infrared cut-off filter cover plate can correct the color. At this time, the encapsulated lens module 200 occupies less space, which is beneficial to the miniaturization of the lens module 200.

[0079] In some embodiments, please refer to Figure 6 and Figure 7 The packaging method for the lens module includes the following steps: The image sensing chip 12 is mounted on the PCB carrier board 11.

[0080] Install lead wire 13.

[0081] A sealant is applied to the image sensing chip 12 to form a dam 17 that covers and protects the connection between the lead 13 and the first pad 122.

[0082] When the image sensor packaging structure 100 includes a cover plate 19, the cover plate 19 is bonded to the enclosure 17 to protect the image sensitive area 121 on the image sensing chip 12. The cover plate 19 can be a full-spectrum transmission cover plate.

[0083] Encapsulating adhesive is applied to the PCB substrate 11 to form an encapsulation body 18 that covers and protects the lead 13 and the connection point between the lead 13 and the second pad 111. Figure 1 As shown, the encapsulation body 18 can also surround the cover plate 19 to better secure the cover plate 19.

[0084] Slicing step. The multi-chip image sensor package structure 100 connected together is sliced ​​into multiple independent single-chip image sensor package structures 100.

[0085] Lens packaging steps. The lens holder 21, which contains the lens 23 and the infrared cut-off filter plane glass 22, is bonded to the PCB carrier board 11.

[0086] Compared to the IGBA packaging method, in this application, when packaging the lens module 200, the IC carrier board and solder balls can be eliminated, as well as the steps of installing solder balls and soldering the IC carrier board to the PCB carrier board are eliminated, saving time, saving costs, improving packaging efficiency, and reducing the space occupied by the packaged lens module 200, which is conducive to the miniaturization of the lens module 200.

[0087] In some embodiments, please refer to Figure 9 and Figure 10 The packaging method for the lens module includes the following steps: The image sensing chip 12 is mounted on the PCB carrier board 11.

[0088] Install lead wire 13.

[0089] Sealant is applied to the connection between lead 13 and the first pad 122 to form a dam 17 that covers and protects the connection between lead 13 and the first pad 122. Simultaneously, encapsulating adhesive is applied to the PCB substrate 11 to form an encapsulation 18 that covers and protects lead 13 and the connection between lead 13 and the second pad 111. The sealant and encapsulating adhesive are of the same type.

[0090] The cover plate 19 is bonded to the dam body 17 to protect the image sensitive area 121 on the image sensing chip 12. The cover plate 19 is an infrared cut-off filter cover plate.

[0091] Slicing steps.

[0092] Lens packaging steps. The lens holder 21 containing the lens 23 is bonded to the PCB carrier board 11. At this point, it is no longer necessary to install the infrared cut-off filter plane glass 22, which is beneficial for further miniaturization of the lens module 200.

[0093] Compared to Figure 6 and Figure 7 Regarding the packaging method of the lens module, Figure 9 and Figure 10 The lens module packaging method also has the following beneficial effects: (1) Applying sealant and encapsulating adhesive at the same time can save one adhesive application step. The sealant and encapsulating adhesive can also cure at the same time, which can greatly save time and improve encapsulation efficiency.

[0094] (2) Color correction using an infrared cut-off filter cover eliminates the need to install an infrared cut-off filter plane glass 22 on the lens bracket, thereby reducing the axial length of the lens module and facilitating its miniaturization. At the same time, it reduces the minimum distance between the third lens 233, which is closest to the image sensing chip 12, and the image-sensitive area 121, shortening the optical path, reducing stray light, ghosting, and glare, and improving image quality.

[0095] It is important to emphasize that, firstly, this application combines the advantages of both COB and IGBA packaging methods, improving yield while controlling costs; secondly, by setting the cover plate 19 as an infrared cut-off filter cover plate, this application eliminates the need for the infrared cut-off filter plane glass 22, thus eliminating the process of installing the infrared cut-off filter plane glass 22, further saving costs. Simultaneously, it facilitates the miniaturization of the lens module and improves image quality. The material of the infrared cut-off filter cover plate can be the same as that of the infrared cut-off filter plane glass 22. Furthermore, this application uses the same type of adhesive for both the sealant and the encapsulating adhesive, saving a coating step and allowing both the sealant and encapsulating adhesive to cure simultaneously, significantly saving time and improving packaging efficiency.

[0096] Examples of electronic devices The electronic device can be a camera or camcorder with image capture capabilities, and includes the lens module 200 described in this application. The beneficial effects of the electronic device are: (1) When the yield rate of lens module 200 is high, the cost of lens module 200 in electronic device can be reduced, thereby reducing the cost of electronic device.

[0097] (2) Based on the miniaturization of the lens module 200, it is beneficial to the miniaturization of electronic devices.

[0098] (3) When the minimum distance between the third lens 233 in the lens module 200 and the image sensitive area 121 is reduced, the optical path of the lens module 200 becomes shorter, the imaging quality is better, and correspondingly, the imaging quality of the electronic device is also better.

[0099] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. An image sensor packaging structure, characterized in that, Includes leads, PCB substrate, and image sensing chip mounted on the PCB substrate; The image sensing chip has a first pad, the PCB carrier has a second pad, and the two ends of the lead are electrically interconnected with the first pad and the second pad, respectively. The image sensing chip has an image sensitive area on the side away from the PCB substrate, and an insulating dam is formed on the image sensing chip that surrounds the image sensitive area and covers the connection between the lead and the first pad. The PCB substrate also has a package that covers the leads and insulates the connection between the leads and the second pad.

2. The image sensor packaging structure as described in claim 1, characterized in that, The dam body is connected to a light-transmitting cover plate that at least covers the image-sensitive area of ​​the image sensing chip.

3. The image sensor packaging structure as described in claim 2, characterized in that, The cover plate is an infrared cut-off filter cover plate.

4. The image sensor packaging structure as described in claim 2, characterized in that, The package also covers the periphery of the cover plate.

5. The image sensor packaging structure as described in claim 1, characterized in that, Both the dam body and the enclosure body are formed of organic insulating materials.

6. The image sensor packaging structure as described in claim 1, characterized in that, The dam body and the enclosure body are formed of the same organic insulating material.

7. The image sensor packaging structure as described in claim 1, characterized in that, The dam body and the enclosure body are formed by adhesive.

8. A lens module, characterized in that, The image sensor packaging structure includes any one of claims 1 to 7, wherein a lens bracket is also mounted on the PCB substrate, a lens is mounted on the lens bracket, and the lens bracket and the lens together cover the leads, the image sensing chip and the second pad.

9. The lens module as described in claim 8, characterized in that, When the image sensor packaging structure includes the cover plate, and the cover plate is a full-spectrum transmission cover plate, an infrared cut-off filter plane glass is also installed on the lens bracket, and the infrared cut-off filter plane glass is located between the lens and the cover plate.

10. An electronic device, characterized in that, Includes the lens module as described in claim 8 or 9.

11. A method for packaging an image sensor, characterized in that, Includes the following steps: The image sensing chip is mounted on the PCB substrate; Install leads so that the two ends of the leads are electrically interconnected with the first pad on the image sensor chip and the second pad on the PCB carrier, respectively. An insulating dam is formed on the image sensing chip and an insulating package is formed on the PCB substrate. The dam surrounds the image sensitive area on the image sensing chip and covers the connection between the lead and the first pad. The package covers the lead and the connection between the lead and the second pad.

12. The image sensor packaging method as described in claim 11, characterized in that, The steps of forming an insulating dam on the image sensing chip and forming an insulating package on the PCB substrate include: applying sealant to the image sensing chip to form the dam; bonding a light-transmitting cover plate to the dam, such that the cover plate at least covers the image-sensitive area on the image sensing chip; and applying encapsulating adhesive to the PCB substrate to form the package.

13. The image sensor packaging method as described in claim 11, characterized in that, The steps of forming an insulating dam on the image sensing chip and forming an insulating package on the PCB substrate include: simultaneously applying a sealant to form the dam and an encapsulating adhesive to form the package; and bonding a light-transmitting cover plate to the dam such that the cover plate at least covers the image-sensitive area on the image sensing chip; wherein the sealant and the encapsulating adhesive are the same organic insulating material.

14. The image sensor packaging method as described in claim 12 or 13, characterized in that, The cover plate is an infrared cut-off filter cover plate.

15. A lens module packaging method, characterized in that, include: The steps of the image sensor packaging method as described in any one of claims 11 to 14; as well as The step of mounting the lens holder with the lens on the PCB carrier board is to allow the lens holder and the lens to together cover the leads, the image sensor chip and the second pad.

16. The lens module packaging method as described in claim 15, characterized in that, When the image sensor packaging method includes the step of bonding a cover plate to the dam body and the cover plate is a full-spectrum transmission cover plate, the step of mounting the lens holder with the lens on the PCB carrier includes: mounting the lens holder with the lens and the infrared cut-off filter plane glass on the PCB carrier, wherein the infrared cut-off filter plane glass is located between the lens and the full-spectrum transmission cover plate.

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