Packaging method of LED

Abstract

The application provides a CSP LED packaging method, which comprises the following steps: arranging an array of LED chips on a carrier, wherein the LED chips are flip-chip mounted on the carrier; covering encapsulating glue on the carrier, so that each LED chip is wrapped with the encapsulating glue; trimming the shape of the encapsulating glue wrapped around each LED chip; covering reflective white glue on the carrier and the encapsulating glue, so that each LED chip is further wrapped with the reflective white glue; removing the carrier; attaching a fluorescent film on the array of LED chips; and cutting the array of LED chips to obtain single CSP LED packaging pieces. In the embodiment, the shape and size of the encapsulating glue are controlled by trimming, so that the cup opening size of the manufactured CSP LED packaging pieces is larger, and the light emitting efficiency of the packaging pieces is improved.

Description

Technical Field

[0001] This application relates to the field of LED packaging technology, and in particular to an LED packaging method. Background Technology

[0002] CSP (Chip-Scale Package) is a new type of semiconductor packaging technology that encapsulates a chip within a very small package, resulting in a package that is roughly the same size as the chip itself. Applying CSP technology to LED chip packaging yields very small LED packages. When used in display products, this allows for the integration of more LEDs within the same area, thereby increasing the output power of the display.

[0003] One type of bracketless GSP LED package involves first wrapping the LED chip with encapsulating adhesive, and then wrapping the encapsulating adhesive with reflective white adhesive. This type of package emits light only from the front, resulting in good light color uniformity and good directional light emission. The opening formed by the reflective white adhesive is also called the cup opening, and its size affects the light extraction efficiency of the package. However, because there is no bracket, the size of the cup opening is mainly controlled by the flowability of the encapsulating adhesive, making it difficult to increase the size of the cup opening. Therefore, the light extraction efficiency of the package is relatively low. Summary of the Invention

[0004] This application provides an LED packaging method that aims to increase the cup size of the CSP LED package, thereby improving the light extraction efficiency of the CSP LED package.

[0005] The specific technical solution is as follows:

[0006] This application provides an LED packaging method, the packaging method comprising:

[0007] An array of LED chips is arranged on a substrate, wherein the LED chips are flip-chip mounted on the substrate;

[0008] Encapsulating adhesive is applied to the carrier wafer so that each LED chip is surrounded by the encapsulating adhesive.

[0009] The shape of the encapsulating adhesive surrounding each LED chip is adjusted;

[0010] Reflective white adhesive is applied to the carrier and the encapsulating adhesive, so that each LED chip is also surrounded by the reflective white adhesive.

[0011] Remove the carrier;

[0012] A fluorescent film is attached to the array of LED chips;

[0013] The array of LED chips is cut to obtain a single CSP LED package.

[0014] The encapsulation method in this embodiment involves covering the LED chip with encapsulating adhesive, then reshaping the shape of the encapsulating adhesive around the LED chip to achieve a preset shape and size for each LED chip, before finally covering it with reflective white adhesive. Compared to related technologies that rely solely on the natural flowability of the encapsulating adhesive to control the cup size, this embodiment controls the shape and size of the encapsulating adhesive through reshaping. This allows the manufactured CSP LED package to achieve a larger cup size, thereby improving the light extraction efficiency of the CSP LED package.

[0015] In some embodiments, the step of shaping the encapsulant surrounding each of the LED chips includes:

[0016] A shaping tool is provided, the shaping tool comprising a plurality of shaping slots arranged in an array;

[0017] The shaping tool is attached to the substrate so that each shaping groove is attached to a corresponding LED chip, and the shape of the encapsulating adhesive around the LED chip is adjusted using the wall of the shaping groove.

[0018] As described above, this method also provides a shaping tool for shape trimming. The shaping tool has multiple shaping slots, each corresponding one-to-one with an LED chip. That is, the arrangement of the shaping slots matches the arrangement of the LED chips on the carrier. During shape trimming, the shaping tool is simply placed against the carrier, aligning the shaping slot with the corresponding LED chip. The walls of the shaping slots then shape the encapsulating adhesive, ensuring that the encapsulating adhesive around the LED chip achieves the preset shape and size. Using this shaping tool to trim the shape of the encapsulating adhesive around the LED chip is simple and improves packaging efficiency.

[0019] In some embodiments, the step of providing a shaping tool, the shaping tool comprising a plurality of shaping slots arranged in an array, includes:

[0020] A shaping tool is provided, comprising a substrate and shaping units arranged in an array on one side of the substrate, wherein each shaping unit forms a bowl-shaped shaping groove.

[0021] The shaping tool has multiple shaping units, each forming a bowl-shaped shaping groove. During the shaping of the encapsulating adhesive, the tool can be placed against the substrate, allowing the shaping groove to fit onto a corresponding LED chip. This allows the walls of the shaping groove to mold the encapsulating adhesive around the LED chip, achieving a preset shape and size. By controlling the shape and size of the encapsulating adhesive through this shaping process, the manufactured CSPLED package can achieve a larger cup size, thereby improving the light extraction efficiency of the package.

[0022] In some embodiments, the shaping groove includes a first segment and a second segment that are interconnected, wherein the second segment is located on the side of the first segment away from the substrate;

[0023] The step of using the wall of the shaping groove to trim the shape of the encapsulating adhesive around the LED chip includes:

[0024] The second section's wall surface is used to shape the encapsulating adhesive, while the first section is used to avoid obstructing the LED chip.

[0025] The shaping groove is constructed as an interconnected first section and a second section. When the shape of the encapsulating adhesive around the LED chip is adjusted using the wall of the second section, the first section can avoid the LED chip. At the same time, the first section also ensures that the LED chip maintains a certain distance from the substrate during the shape adjustment process, thereby preventing the substrate from squeezing the LED chip and causing damage.

[0026] In some embodiments, the inner diameter of the first segment is smaller than the inner diameter of the second segment.

[0027] Encapsulating adhesive is wrapped around each LED chip. Correspondingly, the inner diameter of the first segment can be constructed to be smaller than the inner diameter of the second segment, as long as the inner diameter of the first segment meets the requirement of avoiding the LED chip. In this way, the size of the first segment will not be too large, which helps to ensure the structural strength and rigidity of the shaping tool.

[0028] In some embodiments, prior to the step of shaping the encapsulating adhesive surrounding each of the LED chips, the encapsulation method further includes:

[0029] The encapsulating adhesive is first cured to change it from a liquid state to a semi-solid state.

[0030] The encapsulant is first cured to a semi-solid state, and then its shape is trimmed, thereby enabling the encapsulant to maintain its trimmed shape.

[0031] In some embodiments, after the step of shaping the encapsulating adhesive surrounding each of the LED chips, the encapsulation method further includes:

[0032] The encapsulating adhesive is cured a second time, causing it to change from a semi-solid state to a solid state.

[0033] The encapsulant is first cured to a semi-solid state, and then its shape is shaped. After shaping, the encapsulant undergoes a second curing process, transforming it from a semi-solid to a solid state. This gives the encapsulant a stable shape, allowing it to maintain its shape even under external forces, thus improving the structural stability of the manufactured CSPLED package.

[0034] In some embodiments, after the step of covering the carrier and the encapsulating adhesive with reflective white adhesive, the encapsulation method includes:

[0035] The reflective white adhesive is cured to change it from a liquid state to a solid state.

[0036] By curing the reflective white adhesive, it is transformed from a liquid to a solid state, thus giving it a stable shape. Even when subjected to external forces, it can maintain its shape, thereby improving the structural stability of the manufactured CSPLED package.

[0037] In some embodiments, the step of removing the carrier includes:

[0038] The carrier wafer located on the array of LED chips is removed by a grinding device.

[0039] Removing the substrate by grinding is not only highly efficient, but also ensures the flatness of the structure after substrate removal, thus ensuring good flatness of the fluorescent film attached in subsequent steps.

[0040] In some embodiments, after the step of removing the carrier wafer, the packaging method further includes:

[0041] The top surface of the LED chip and the top surface of the encapsulant are polished.

[0042] After removing the carrier wafer using a grinding device, scratches may appear on the top surface of the LED chip and the top surface of the encapsulant due to the grinding process, which can affect the light emission performance of the package. Therefore, after the grinding step, the top surface of the LED chip and the top surface of the encapsulant can be polished to remove the scratches, thereby ensuring the light emission performance of the manufactured CSP LED package. Attached Figure Description

[0043] Figure 1 A schematic flowchart illustrating an LED packaging method according to an embodiment of this application;

[0044] Figure 2 A schematic diagram of an array of LED chips arranged on a substrate;

[0045] Figure 3 This is a schematic diagram showing the application of encapsulating adhesive onto a substrate.

[0046] Figure 4 This is a schematic diagram of covering a reflective white adhesive onto a substrate and encapsulating adhesive.

[0047] Figure 5 A schematic diagram showing the removal of the substrate;

[0048] Figure 6 This is a schematic diagram of attaching a fluorescent film onto an array of LED chips.

[0049] Figure 7 This is a schematic diagram of the CSP LED package obtained after cutting;

[0050] Figure 8 This is a schematic diagram of the structure of a shaping tool provided in an embodiment of this application;

[0051] Figure 9 This is a schematic diagram of the structure of a shaping tool provided in another embodiment of this application;

[0052] Figure 10 This is a schematic diagram of another type of CSP LED package.

[0053] Explanation of reference numerals in the attached figures:

[0054] 10. CSP LED package;

[0055] 100. Slides;

[0056] 200. LED chip; 201. Solder pad;

[0057] 300. Encapsulating adhesive;

[0058] 400. Reflective white adhesive;

[0059] 500, fluorescent film;

[0060] 20. Shaping tools;

[0061] 21. Substrate; 22. Shaping unit; 23. Shaping groove; 231. First section; 232. Second section. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0063] In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0064] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0065] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0066] As mentioned in the background section, one type of bracketless CSP LED package involves first wrapping the LED chip with encapsulating adhesive, and then wrapping the encapsulating adhesive with reflective white adhesive. This type of package emits light only from the front, resulting in good color uniformity and directional light emission. The opening formed by the reflective white adhesive is also called the cup opening, and its size affects the light emission efficiency of the package. However, because there is no bracket, the size of the cup opening is mainly controlled by the flowability of the encapsulating adhesive, making it difficult to increase the size of the cup opening. Therefore, the light emission efficiency of the package is relatively low.

[0067] Based on the above, the applicant proposes the technical solution in this application embodiment. Specifically, after covering the LED chip with encapsulating adhesive, the shape of the encapsulating adhesive around the LED chip is adjusted, and then reflective white adhesive is applied. Compared to the related technology that relies solely on the natural flowability of the encapsulating adhesive to control the cup size, this application solution controls the shape and size of the encapsulating adhesive by adjusting its shape. This allows the manufactured CSP LED package to achieve a larger cup size, thereby improving the light extraction efficiency of the CSP LED package.

[0068] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0069] This application provides an LED packaging method, such as... Figure 1 As shown, the encapsulation method includes the following steps:

[0070] Step S101: Arrange an array of LED chips 200 on the carrier 100, wherein the LED chips 200 are flip-chip mounted on the carrier 100 (e.g., Figure 2 (As shown).

[0071] The substrate 100 is also called a carrier plate or substrate. The material of the substrate 100 can be glass, ceramic, quartz, silicon, etc.

[0072] The array of LED chips 200 refers to an LED chip group composed of multiple LED chips 200 arranged in a matrix. The number of LED chips 200 can be set according to the size of the carrier 100 or according to production requirements. There are gaps between adjacent LED chips 200 to facilitate subsequent cutting.

[0073] The LED chip 200 has a light-emitting surface and pads 201 facing away from the light-emitting surface. Typically, there are two pads 201, corresponding to the positive and negative terminals respectively. The LED chip 200 is flip-chip mounted on the carrier 100, meaning that the light-emitting surface of the LED chip 200 faces the carrier 100, and correspondingly, the pads 201 face away from the carrier 100.

[0074] Step S102: Cover the carrier 100 with encapsulating adhesive 300, so that each LED chip 200 is surrounded by encapsulating adhesive 300 (e.g., ...). Figure 3 (As shown).

[0075] The encapsulating adhesive 300 is a transparent colloid, such as transparent silicone, which allows light emitted by the LED chip 200 to be transmitted through the encapsulating adhesive 300. There are several ways to cover the encapsulating adhesive 300 on the carrier 100, such as by brushing or by dispensing.

[0076] Step S103: Trim the shape of the encapsulating adhesive 300 surrounding each LED chip 200.

[0077] Step S104: Cover the carrier 100 and encapsulating adhesive 300 with reflective white adhesive 400, so that each LED chip 200 is also surrounded by reflective white adhesive 400 (e.g., ...). Figure 4 (As shown).

[0078] It is understood that the contact surface between the encapsulating adhesive 300 and the reflective white adhesive 400 constitutes an optical reflective surface, through which the light emitted by the LED chip 200 can be reflected. Since the reflective white adhesive 400 is applied over the encapsulating adhesive 300, the shape of the optical reflective surface and the cup size of the reflective white adhesive 400 both depend on the shape and size of the encapsulating adhesive 300. In step S103, the purpose of adjusting the shape of the encapsulating adhesive 300 is to ensure that the encapsulating adhesive 300 around each LED chip 200 achieves a preset shape and size.

[0079] Step S105: Remove substrate 100 (e.g.) Figure 5 (As shown).

[0080] After removing the carrier 100, the top surfaces of the LED chip 200, the encapsulating adhesive 300, and the reflective white adhesive 400 are all exposed.

[0081] Step S106: Attach a phosphor film 500 (e.g., ...) onto the array of LED chips 200. Figure 6 (As shown).

[0082] The fluorescent film 500 completely covers the top surface of the LED chip 200, the encapsulating adhesive 300, and the top surface of the reflective white adhesive 400. The fluorescent film 500 contains a fluorescent material that emits white light when excited by the light emitted from the LED chip 200. For example, if the LED chip 200 is a blue light-emitting LED chip, the fluorescent film 500 will emit white light when excited by the blue light emitted by the LED chip 200.

[0083] Step S107: Cut the array of LED chips 200 to obtain a single CSP LED package 10 (e.g., Figure 7 (As shown).

[0084] During the cutting process, the cutting location is the gap between adjacent LED chips 200. After the cutting process, individual CSP LED packages 10 are obtained.

[0085] In the encapsulation method of this application embodiment, after covering the LED chip 200 with encapsulating adhesive 300 to surround it, the shape of the encapsulating adhesive 300 around the LED chip 200 is adjusted so that the encapsulating adhesive 300 around each LED chip 200 achieves a preset shape and size, and then reflective white adhesive 400 is covered. Compared with the related technology that relies solely on the natural flowability of the encapsulating adhesive to control the cup size, this embodiment controls the shape and size of the encapsulating adhesive 300 through adjustment. Therefore, the manufactured CSP LED package 10 can obtain a larger cup size, thereby improving the light extraction efficiency of the package.

[0086] It should be noted that the method in this application can also achieve a smaller cup size. Because a step of trimming the shape of the encapsulating adhesive is added, the shape and size of the encapsulating adhesive 300 around each LED chip 200 are controllable. Therefore, a variety of cup size designs can be achieved more flexibly.

[0087] In some embodiments, the step of shaping the encapsulant 300 surrounding each LED chip 200 includes:

[0088] Provide such as Figure 8 or Figure 9 The shaping tool 20 shown includes a plurality of shaping slots 23 arranged in an array;

[0089] The shaping tool 20 is placed against the carrier 100 so that each shaping groove 23 is attached to a corresponding LED chip 200. The shape of the encapsulating adhesive 300 around the LED chip 200 is adjusted using the wall of the shaping groove 23.

[0090] As described above, this method also provides a shaping tool 20 for shape trimming. The shaping tool 20 has multiple shaping grooves 23, each corresponding to a specific LED chip 200. That is, the arrangement of the shaping grooves 23 is consistent with the arrangement of the LED chips 200 on the carrier 100. When trimming the shape of the encapsulant 300, simply place the shaping tool 20 against the carrier 100, so that the shaping groove 23 fits onto a corresponding LED chip 200. This allows the walls of the shaping grooves 23 to shape the encapsulant 300, achieving a preset shape and size around the LED chip 200. Using the shaping tool 20 to trim the shape of the encapsulant 300 around the LED chip 200 is simple and improves encapsulation efficiency.

[0091] The wall surface of the shaping groove 23 can be a conical surface (please refer to...). Figure 8 It can also be a spherical surface (please refer to...). Figure 9 When the wall of the shaping groove 23 is conical, the optical reflective surface of the manufactured CSP LED package 10 is also conical (please refer to...). Figure 7 When the wall of the shaping groove 23 is spherical, the optical reflective surface of the manufactured CSP LED package 10 is spherical (please refer to...). Figure 10 The wall shape of the shaping groove 23 can be selected according to the design requirements of the CSP LED package.

[0092] Please refer to Figure 8 , Figure 9 In one embodiment, the step of providing a shaping tool 20, which includes an array of shaping slots 23, includes:

[0093] A shaping tool 20 is provided, comprising a substrate 21 and shaping units 22 arranged in an array on one side of the substrate 21, wherein each shaping unit 22 forms a bowl-shaped shaping groove 23.

[0094] The arrangement of the shaping unit 22 on the substrate 21 is consistent with the arrangement of the LED chip 200 on the carrier 100, so that the shaping unit 22 and the LED chip 200 have a one-to-one correspondence.

[0095] The shaping tool 20 has multiple shaping units 22, each forming a bowl-shaped shaping groove 23. During the shaping process of the encapsulating adhesive 300, the shaping tool 20 can be placed against the carrier 100, so that the shaping groove 23 is attached to a corresponding LED chip 200. In this way, the walls of the shaping groove 23 can be used to shape the encapsulating adhesive 300, so that the encapsulating adhesive 300 around the LED chip 200 reaches a preset shape and size. By controlling the shape and size of the encapsulating adhesive 300 through shaping, the manufactured CSP LED package 10 can obtain a larger cup size, which is beneficial to improving the light extraction efficiency of the package.

[0096] Please refer to Figure 8 , Figure 9 In one embodiment, the shaping groove 23 includes a first segment 231 and a second segment 232 that are interconnected, with the second segment 232 located on the side of the first segment 231 away from the substrate 21.

[0097] The above-described step of using the wall of the shaping groove 23 to trim the shape of the encapsulating adhesive 300 surrounding the LED chip 200 includes:

[0098] The second section 232 is used to shape the encapsulating adhesive 300, while the first section 231 is used to avoid the LED chip 200.

[0099] When the encapsulating adhesive 300 is applied, it does not cover the entire LED chip 200. In other words, a portion of the LED chip 200 is exposed outside the encapsulating adhesive 300; for example, the pads 201 of the LED chip 200 are exposed. Based on this, the shaping groove 23 is constructed as a first segment 231 and a second segment 232 that are interconnected. When the wall of the second segment 232 is used to shape the encapsulating adhesive 300 surrounding the LED chip 200, the first segment 231 can avoid contact with the LED chip 200. Simultaneously, the first segment 231 also ensures that the LED chip 200 maintains a certain distance from the substrate 21 during the shaping process, thereby preventing the substrate 21 from pressing against the LED chip 200 and causing damage.

[0100] The wall surface of the second segment 232 can be a conical surface (please refer to...). Figure 8 It can also be a spherical surface (please refer to...). Figure 9 When the wall surface of the second segment 232 is conical, the optical reflective surface of the manufactured CSP LED package 10 is also conical (please refer to...). Figure 7 When the wall surface of the second segment 232 is spherical, the optical reflective surface of the manufactured CSP LED package 10 is also spherical (please refer to...). Figure 10).

[0101] like Figure 8 , Figure 9 As shown, in one embodiment, the inner diameter of the first segment 231 is smaller than the inner diameter of the second segment 232.

[0102] The encapsulating adhesive 300 is wrapped around each LED chip 200. Correspondingly, the inner diameter of the first segment 231 can be constructed to be smaller than the inner diameter of the second segment 232, as long as the inner diameter of the first segment 231 meets the requirement of avoiding the LED chip 200. In this way, the size of the first segment 231 will not be too large, which helps to ensure the structural strength and rigidity of the shaping tool 20.

[0103] In some embodiments, prior to the step of trimming the shape of the encapsulating adhesive 300 surrounding each LED chip 200, the encapsulation method further includes:

[0104] The encapsulating adhesive 300 is first cured to change it from a liquid to a semi-solid state.

[0105] Curing can be achieved through baking. For example, baking the encapsulating adhesive 300 at a specific temperature for a specific time will transform the encapsulating adhesive 300 from a liquid state to a solid state. In this embodiment, the encapsulating adhesive 300 can be transformed into a semi-solid state after the first curing by shortening the baking time or lowering the baking temperature. For example, the baking time can be 1 / 3 to 2 / 3 of the specific time, or the baking temperature can be kept stable at about half of the specific temperature. Here, semi-solid refers to a state that simultaneously possesses the properties of liquid and solid. A semi-solid substance has both the plasticity and fluidity of a liquid and the stability and support of a solid.

[0106] The encapsulating adhesive 300 is brought to a semi-solid state through the first curing process, and then its shape is trimmed so that the encapsulating adhesive 300 can maintain the trimmed shape.

[0107] In one embodiment, after the step of trimming the shape of the encapsulating adhesive 300 surrounding each LED chip 200, the encapsulation method further includes:

[0108] The encapsulating adhesive 300 is cured a second time, so that the encapsulating adhesive 300 changes from a semi-solid to a solid state.

[0109] The encapsulant 300 is first cured to a semi-solid state, and then its shape is trimmed. After trimming, the encapsulant 300 is cured a second time to transform it from a semi-solid to a solid state. This gives the encapsulant 300 a stable shape, which can remain unchanged even when subjected to external forces, thereby improving the structural stability of the manufactured CSP LED package 10.

[0110] In some embodiments, after the step of covering the reflective white adhesive 400 onto the carrier 100 and the encapsulating adhesive 300 described above, the encapsulation method includes:

[0111] The reflective white adhesive 400 is cured to change it from a liquid state to a solid state.

[0112] Curing can be achieved by baking. By curing the reflective white adhesive 400, the reflective white adhesive 400 is transformed from a liquid to a solid state. This gives the reflective white adhesive 400 a stable shape, which can maintain its shape even when subjected to external forces, thereby improving the structural stability of the manufactured CSP LED package 10.

[0113] In some embodiments, the step of removing the carrier 100 includes:

[0114] The carrier 100 located on the array of LED chips 200 is removed by a grinding device.

[0115] Removing the substrate 100 by grinding is not only highly efficient, but also ensures the flatness of the structure after removing the substrate 100, thus ensuring good flatness of the fluorescent film 500 attached in subsequent steps.

[0116] In one embodiment, after the step of removing the carrier 100, the packaging method further includes:

[0117] The top surface of the LED chip 200 and the top surface of the encapsulant 300 are polished.

[0118] After removing the substrate 100 using a grinding device, scratches may appear on the top surface of the LED chip 200 and the top surface of the encapsulant 300 due to the grinding process. These scratches can affect the light emission performance of the CSP LED package. Therefore, after the grinding step, the top surfaces of the LED chip 200 and the encapsulant 300 can be polished to remove the scratches, thereby ensuring the light emission performance of the manufactured CSP LED package 10.

[0119] In one embodiment, the LED packaging method includes the following steps:

[0120] Step S201: Arrange an array of LED chips 200 on the carrier 100, wherein the LED chips 200 are flip-chip mounted on the carrier 100;

[0121] Step S202: Cover the carrier 100 with encapsulating adhesive 300 so that each LED chip 200 is surrounded by encapsulating adhesive 300.

[0122] Step S203: Perform the first curing of the encapsulating adhesive 300 to change the encapsulating adhesive 300 from a liquid state to a semi-solid state;

[0123] Step S204: Provide a shaping tool 20, which includes multiple shaping slots 23 arranged in an array;

[0124] Step S205: Place the shaping tool 20 against the carrier 100 so that each shaping groove 23 is attached to a corresponding LED chip 200. Use the wall of the shaping groove 23 to trim the shape of the encapsulating adhesive 300 around the LED chip 200.

[0125] Step S206: Perform a second curing of the encapsulating adhesive 300 to change it from a semi-solid to a solid state;

[0126] Step S207: Cover the carrier 100 and the encapsulating adhesive 300 with reflective white adhesive 400, so that each LED chip 200 is also surrounded by reflective white adhesive 400.

[0127] Step S208: Curing the reflective white adhesive 400 to change it from a liquid to a solid state;

[0128] Step S209: The carrier 100 located on the array of LED chips 200 is ground off by a grinding device;

[0129] Step S210: Polish the top surface of the LED chip 200 and the top surface of the encapsulant 300;

[0130] Step S211: Attach the fluorescent film 500 onto the array of LED chips 200;

[0131] Step S212: Cut the array of LED chips 200 to obtain a single CSP LED package 10.

[0132] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for packaging an LED, characterized in that, include: An array of LED chips is arranged on a substrate, wherein the LED chips are flip-chip mounted on the substrate; Encapsulating adhesive is applied to the carrier wafer so that each LED chip is surrounded by the encapsulating adhesive. The shape of the encapsulating adhesive surrounding each LED chip is adjusted; Reflective white adhesive is applied to the carrier and the encapsulating adhesive, so that each LED chip is also surrounded by the reflective white adhesive. Remove the carrier; A fluorescent film is attached to the array of LED chips; The array of LED chips is cut to obtain a single CSP LED package.

2. The LED packaging method according to claim 1, characterized in that, The step of shaping the encapsulating adhesive surrounding each of the LED chips includes: A shaping tool is provided, the shaping tool comprising a plurality of shaping slots arranged in an array; The shaping tool is attached to the substrate so that each shaping groove is attached to a corresponding LED chip, and the shape of the encapsulating adhesive around the LED chip is adjusted using the wall of the shaping groove.

3. The LED packaging method according to claim 2, characterized in that, The step of providing a shaping tool, the shaping tool comprising a plurality of shaping slots arranged in an array, includes: A shaping tool is provided, comprising a substrate and shaping units arranged in an array on one side of the substrate, wherein each shaping unit forms a bowl-shaped shaping groove.

4. The LED packaging method according to claim 3, characterized in that, The shaping groove includes a first section and a second section that are interconnected, with the second section located on the side of the first section away from the substrate; The step of using the wall of the shaping groove to trim the shape of the encapsulating adhesive around the LED chip includes: The second section's wall surface is used to shape the encapsulating adhesive, while the first section is used to avoid obstructing the LED chip.

5. The LED packaging method according to claim 4, characterized in that, The inner diameter of the first segment is smaller than the inner diameter of the second segment.

6. The LED packaging method according to claim 1, characterized in that, Before the step of trimming the shape of the encapsulating adhesive surrounding each of the LED chips, the encapsulation method further includes: The encapsulating adhesive is first cured to change it from a liquid state to a semi-solid state.

7. The LED packaging method according to claim 6, characterized in that, After the step of trimming the shape of the encapsulating adhesive surrounding each of the LED chips, the encapsulation method further includes: The encapsulating adhesive is cured a second time, causing it to change from a semi-solid state to a solid state.

8. The LED packaging method according to claim 1, characterized in that, After the step of covering the carrier and the encapsulating adhesive with reflective white adhesive, the encapsulation method includes: The reflective white adhesive is cured to change it from a liquid state to a solid state.

9. The LED packaging method according to claim 1, characterized in that, The step of removing the substrate includes: The carrier wafer located on the array of LED chips is removed by a grinding device.

10. The LED packaging method according to claim 9, characterized in that, After the step of removing the carrier wafer, the packaging method further includes: The top surface of the LED chip and the top surface of the encapsulant are polished.

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