An LED lamp bead

Abstract

The application provides an LED lamp bead, which comprises a package body and at least two conductive pins connected with the package body, the conductive pin comprises a bearing part in the package body and a support pin protruding out of the package body, the support pin comprises a support part, a welding surface is arranged on the support part, the at least two support pins protrude from different outer surfaces of the package body, the support part is located in the same plane of the package body through bending, and the welding surfaces are coplanar. Because the support pins are distributed on different outer surfaces of the package body and the welding surfaces are coplanar, the multi-side support structure is used to avoid the problem of gravity imbalance caused by uneven mass distribution of the "cantilever type" single-side support structure, the top surface of the package body is a pickup surface, the adsorption force of the suction nozzle of a chip mounter can be improved, the stability of adsorption is improved, and the material throwing rate of the suction nozzle is reduced. When the surface tension generated by the molten solder cooling of the support pins located on different outer surfaces is balanced and automatically centered, a self-alignment effect is formed, and the occurrence rate of the tombstone effect is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an LED lamp bead. Background Technology

[0002] As LED applications continue to expand, ambient lighting for TV background walls has become an important component of smart homes. Market demand lies in concealing LED light strips behind the TV, allowing light to diffuse across the wall and create a uniform, soft, and non-directly illuminated "wall-washing" effect. This places requirements on LED light sources such as side-emitting light, high brightness, long-distance projection (typically 3-5 meters), and consistent mounting height.

[0003] Currently, the main packaging solutions on the market include front-mounted LEDs and side-emitting LEDs. For front-mounted LEDs, their vertical upward light path creates an optical conflict with the requirements of TV background wall light strips. The light shines directly onto the TV back panel, with only a small amount reflected onto the wall, resulting in low luminous efficiency, poor uniformity, and easy light leakage from the sides of the TV. The energy of the light scattered after directly hitting the TV back panel is severely attenuated, failing to achieve the requirement of uniform projection over long distances. To change the vertical light path, a reflective structure needs to be added, which significantly increases the module thickness and cannot fit the narrow space between the TV and the wall. For side-emitting LEDs, their large emission angle (approximately 120°) makes it impossible to achieve uniform wall washing over long distances. Furthermore, their unstable center of gravity and small pad spacing easily lead to assembly misalignment and short circuits, and their poor RGB effect cannot meet the requirements for vibrant colors. In summary, neither front-mounted nor side-emitting LEDs are suitable for the ambient lighting needs of a TV background wall.

[0004] Custom-designed side-emitting LEDs for TV background walls can meet the requirements to a certain extent. These LED chips are fixed to the vertical sidewall of a bracket, with all pads and leads extending from a single side, forming a cantilever beam-like asymmetrical structure. However, this structure has the following drawbacks: 1. Uneven placement center of gravity: The mass distribution of the package is severely uneven, leading to unstable device posture during placement and after nozzle pickup, making it prone to rotation or offset during high-speed placement; 2. Uneven soldering stress and tombstone effect: During reflow soldering, molten solder generates uneven surface tension on pads that are asymmetrically distributed on only one or both sides. Due to the lack of tension balance on the opposite side, one end of the device is easily pulled up, causing tilting and tombstoneing, greatly reducing production yield; 3. Insufficient pickup area: The effective pickup area at the top is small (only the thickness of the thin wall), resulting in insufficient area to form an effective seal with the placement machine nozzle, easily leading to vacuum suction leakage, causing nozzle ejection and misaligned placement. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide an LED lamp bead that aims to solve the technical problems of unbalanced mounting center of gravity, uneven welding stress, and insufficient pickup surface of the customized "cantilever beam" side-emitting LEDs in the prior art.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution: An LED light bead, comprising: The package (10) has an optical cavity (110) for lateral light emission. At least two conductive pins (210) are connected to the package (10), the conductive pins (210) including a carrier portion (211) located inside the package (10) and a support pin (220) protruding outside the package (10). The carrier (211) is exposed inside the optical cavity (110), and the carrier (211) is used to weld LED chips (40). The support pin (220) includes a support portion (221) on which a welding surface (222) is provided. At least two of the support pins (220) extend from different outer surfaces of the package (10), are bent so that the support portion (221) is located on the same plane of the package (10), and the soldering surfaces (222) are coplanar for soldering to an external circuit board.

[0007] Compared to related technologies, the advantages of this invention are as follows: By making the welding surfaces of the several support portions formed by bending and extending the conductive pins coplanar, the same optical cavity structure design as the front-emitting package can be adopted while maintaining the side-emitting light path, thus meeting the ambient lighting requirements of the TV background wall without the need for additional reflective structures; because the support pins are distributed on different outer surfaces of the package and the several welding surfaces are coplanar, the multi-sided support structure avoids the problem of center of gravity imbalance caused by uneven mass distribution in the "cantilever" single-sided support structure. When the pick-and-place machine picks up the components, the side of the package facing away from the welding surface is the pickup surface, which can improve the suction force of the pick-and-place machine nozzle, improve the stability of the pick-and-place, and reduce the nozzle rejection rate; during the reflow soldering process, the surface tension generated by the molten solder of the support pins on different outer surfaces when cooled is balanced and automatically centered. Even if there is a slight offset in the placement, the solder tension will automatically pull the device back to the center of the pad, forming a self-alignment effect and reducing the occurrence rate of tombstone effect.

[0008] Furthermore, at least one of the support pins (220) is bent to the left or right side of the package (10), and at least one of the support pins (220) is bent to the bottom surface of the package (10).

[0009] Furthermore, at least one of the support pins (220) is bent to the left side of the package (10), and at least one of the support pins (220) is bent to the right side of the package (10).

[0010] Furthermore, at least one of the support pins (220) is bent to the rear side of the package (10), and at least one of the support pins (220) is bent to the bottom surface of the package (10).

[0011] Furthermore, at least three of the support pins (220) are distributed on the three outer surfaces of the package (10).

[0012] Furthermore, at least one of the support pins (220) is bent to the bottom surface of the package (10), at least one of the support pins (220) is bent to the left side of the package (10), and at least one of the support pins (220) is bent to the right side of the package (10).

[0013] Furthermore, at least one of the support pins (220) is bent to the bottom surface of the package (10), at least one of the support pins (220) is bent to the left or right side of the package (10), and at least one of the support pins (220) is bent to the rear side of the package (10).

[0014] Furthermore, when at least one of the support pins (220) is bent to the left side of the package (10), at least one of the support pins (220) is bent to the right side of the package (10), and the number of support pins (220) on the left side of the package (10) is the same as the number of support pins (220) on the right side of the package (10), the support pins (220) on the left side of the package (10) and the support pins (220) on the right side of the package (10) are symmetrically arranged along the axis of the package (10).

[0015] Furthermore, a bending plate (30) is connected to one end of the support pin (220) facing away from the bearing portion (211), and the bending plate (30) extends from the support pin (220) in a direction facing away from the welding surface (222).

[0016] Furthermore, the number of conductive pins (210) is two, four, six, or eight. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the LED lamp bead structure in Embodiment 1 of the present invention; Figure 2This is a schematic diagram of the internal structure of the LED beads in Embodiment 1 of the present invention; Figure 3 This is a partial structural diagram of the LED lamp bead in Embodiment 1 of the present invention; Figure 4 This is a partial structural diagram of the LED lamp bead in Embodiment 2 of the present invention from a first viewing angle; Figure 5 This is a partial structural diagram of the LED lamp bead in Embodiment 2 of the present invention from a second perspective; Figure 6 This is a partial structural diagram of the LED lamp bead in Embodiment 3 of the present invention; Figure 7 This is a partial structural diagram of the LED lamp bead in Embodiment 4 of the present invention; Figure 8 This is a partial structural diagram of the LED lamp bead in Embodiment 5 of the present invention; Figure 9 This is a partial structural schematic diagram of the LED lamp bead in Embodiment 6 of the present invention from a first viewing angle; Figure 10 This is a partial structural schematic diagram of the LED lamp bead in Embodiment 6 of the present invention from a second perspective; Figure 11 This is a partial structural diagram of the LED lamp bead in Embodiment 7 of the present invention; Figure 12 This is a partial structural diagram of the LED lamp bead in Embodiment 8 of the present invention; Explanation of key component symbols: 10. Package body; 110. Optical cavity; 120. Pick-up plane; 210. Conductive pin; 211. Carrier; 220. Support pin; 221. Support; 222. Welding surface; 30. Bending plate; 40. LED chip; 50. Bonding wire; 60. Partition wall; 610. Light emission cavity; 70. White track; 80. Encapsulating adhesive layer.

[0018] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0019] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of the invention are illustrated in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] Please see Figures 1 to 3 Embodiment 1 of the present invention provides an LED lamp bead, including a package 10 and at least two conductive pins 210 connected to the package 10. The package 10 is white PCT, white PPA, black PPA, transparent PC, white EMC or white ceramic, and its color and reflectivity can be adjusted according to optical requirements. The conductive pins 210 include a substrate layer and a surface electroplating layer covering the substrate layer. The substrate layer is a conductive / thermal conductive material. Preferably, the substrate layer is a copper layer, an iron layer, an aluminum layer or an iron-nickel alloy layer. The surface electroplating layer is a silver layer, a palladium layer, a copper-nickel-silver layer or a nickel-palladium-gold layer.

[0023] The conductive pin 210 includes a carrier portion 211 located within the package 10 and a support pin 220 protruding from the package 10. The carrier portion 211 is used for soldering the LED chip 40. Understandably, the carrier portion 211 and the support pin 220 are integrally formed to form the conductive pin 210. A gap is formed between adjacent carrier portions 211, and a white channel 70 is provided in the gap. By providing the white channel 70, different functional areas can be separated within the package 10.

[0024] The package 10 has a side-emitting optical cavity 110, and the carrier portion 211 is exposed inside the optical cavity 110. It should be noted that side-emitting means that when the package 10 is connected to an external circuit board, the light emission direction is parallel to the mounting surface (i.e., the soldering surface 222). Furthermore, the front side of the package 10 is recessed to form the optical cavity 110 to achieve side-emitting. The optical cavity 110 is circular, square, elliptical, or irregularly shaped. At least one LED chip 40 is disposed inside the optical cavity 110. The sidewall of the optical cavity 110 forms an obtuse angle with the front side of the package 10. Preferably, the angle of the obtuse angle is 115°~130° to adjust the light emission angle of the light emitted by the LED chip 40 after reflection by the sidewall of the cup-shaped cavity. By controlling the angle, the main beam emitted by the LED chip 40 is directly emitted in the target direction after one reflection, avoiding light energy loss caused by multiple reflections.

[0025] The optical cavity 110 is provided with a plurality of partition walls 60, which divide the optical cavity 110 into a plurality of light-emitting cavities 610. Specifically, the number of light-emitting cavities 610 can be one, two, or three. An encapsulating adhesive layer 80 is provided within each light-emitting cavity 610. By providing the partition walls 60, the plurality of light-emitting cavities 610 are formed, achieving light isolation within the cavity. Combined with the encapsulating adhesive layer 80, sufficient light mixing can be achieved while ensuring independent control of the LED chip 40, eliminating the "rainbow pattern" phenomenon. Preferably, the encapsulating adhesive layer 80 is a transparent adhesive layer, a frosted adhesive layer (with added diffusion particles), or a fluorescent adhesive layer. It should be noted that the encapsulating adhesive layer 80 can be made into a lens structure through dispensing or molding processes to further adjust the light emission angle of the LED chip 40. In some embodiments, the height of the front side of the partition wall 60 is less than the height of the front side of the package 10, so as to form a secondary dispensing space between the front side of the package 10 and the front side of the partition wall 60 and the front side of the package 10, so as to further optimize the light mixing effect.

[0026] The support pin 220 includes a support portion 221, on which a soldering surface 222 is provided. At least two support pins 220 extend from different outer surfaces of the package 10 and are bent so that the support portion 221 is located on the same plane of the package 10, and the soldering surface 222 is coplanar, so as to be soldered to an external circuit board. It should be noted that the plane on which the different support portions 221 are located is the soldering surface 222, which is located on one outer surface of the package (10). In this embodiment, the support portion 221 and the welding surface 222 are both located on the bottom surface of the package 10. While maintaining the side-emitting light path, the same optical cavity structure as the front-emitting package can be adopted, eliminating the need for additional reflective structures to meet the ambient lighting requirements of the TV background wall. Due to the multi-sided distribution of the support pins 220, the functional area design and the direction of the partition wall 60 are unrestricted, allowing for the design of deeper and wider light-mixing cavities. Combined with high-reflectivity materials, this effectively reduces ineffective lateral and backscattering, improves the positive light utilization rate, and enhances the uniformity of wall illumination and light mixing. Because the support pins 220 are distributed on different outer surfaces of the package 10, and several welding surfaces 222 are coplanar, the multi-sided support structure avoids the imbalance problem caused by uneven mass distribution in a "cantilever" single-sided support structure, improving the overall structural stability. When the pick-and-place machine performs the pick-and-place operation, the side of the package 10 facing away from the welding surface 222 forms a pickup plane. 120, the pickup plane 120 is used for adsorption by the pick-and-place machine nozzle, which can improve the adsorption force of the pick-and-place machine nozzle, thereby improving the stability of adsorption and reducing the nozzle rejection rate; during the reflow soldering process, the surface tension generated by the molten solder of the support pins 220 located on different outer surfaces when cooled is balanced and automatically centered. Even if there is a slight offset in the placement, the solder tension will automatically pull the device back to the center of the pad, forming a self-alignment effect, reducing the occurrence rate of tombstone effect. It is compatible with existing SMT production lines, requires no special process modification, improves the production line pass rate, and can meet the needs of large-scale mass production; the thickness of the package 10 can be increased according to the requirements, and the multi-sided support pins 220 naturally form a reinforcing rib effect. The conductive pins 210 can also serve as an external support and protective frame, forming a composite reinforced structure of "embedded metal spine", which effectively improves the resistance to mechanical impact, bending and torsional strength, reduces the lens breakage rate and solder joint detachment rate during coiling, and ensures that the LED strip can withstand coiling, installation and long-term use. The multi-sided support pins 220 provide ample space for increasing the pad area. Several conductive pins 210 form a multi-path three-dimensional heat dissipation structure. The support pins 220 protruding from the package 10 can directly convect with the air to dissipate heat, realizing an auxiliary heat dissipation channel, effectively reducing the operating junction temperature, thereby significantly improving the light decay lifespan, ensuring long-term color stability, and enabling the finished product to better adapt to the high-temperature sealed environment of the back of the TV, significantly expanding the application range.

[0027] One end of the support pin 220 facing away from the carrier portion 211 is connected to a bending plate 30. The bending plate 30 extends from the support pin 220 in a direction away from the welding surface 222. By setting the bending plate 30, external mechanical stress (such as installation extrusion, LED strip bending) is limited to the bending point and digested, avoiding stress transmission that could cause the internal gold wire of the package 10 to break or the LED chip 40 to be damaged. It can also buffer thermal stress and improve the reliability of the solder joint under temperature cycling.

[0028] Preferably, two bonding wires 50 are connected to the LED chip 40, and the ends of the two bonding wires 50 facing away from the LED chip 40 are connected to different carrier portions 211. The support portions 221 of the two support pins 220 corresponding to the same LED chip 40 are distributed on different outer surfaces of the package body 10. With this structural arrangement, the crossover of bonding wires and spatial conflicts of the "one-line" side light emission can be reduced.

[0029] In this embodiment, there are four conductive pins 210 and four support pins 220 distributed on the two outer surfaces of the package 10. Specifically, two support pins 220 are bent to the rear side of the package 10 and two support pins 220 are bent to the bottom surface of the package 10. That is, at least two support pins 220 are distributed on the two outer surfaces of the package 10, at least one support pin 220 is bent to the rear side of the package 10, and at least one support pin 220 is bent to the bottom surface of the package 10. It can be understood that the four soldering surfaces 222 are located on the bottom surface of the package 10, and the pickup plane 120 is the top surface of the package 10.

[0030] Please see Figure 4 and Figure 5 Embodiment 2 of the present invention provides an LED lamp bead, which differs from the LED lamp bead described in Embodiment 1 in that... The four support pins 220 are distributed on the three outer surfaces of the package 10. Specifically, two support pins 220 are bent to the bottom surface of the package 10, one support pin 220 is bent to the left side surface of the package 10, and one support pin 220 is bent to the right side surface of the package 10. That is, at least three support pins 220 are distributed on the three outer surfaces of the package, at least one support pin 220 is bent to the bottom surface of the package 10, at least one support pin 220 is bent to the left side surface of the package 10, and at least one support pin 220 is bent to the right side surface of the package 10. The number of support pins 220 on the left side surface of the package 10 is the same as the number of support pins 220 on the right side surface of the package 10, and they are symmetrically arranged along the axis of the package 10. The overall stability of the structure is further improved by the symmetrical arrangement. Understandably, the four welding surfaces 222 are located on the bottom surface of the package 10, and the pickup plane 120 is the top surface of the package 10.

[0031] Please see Figure 6 Embodiment 3 of the present invention provides an LED lamp bead, which differs from the LED lamp bead described in Embodiment 1 in that... In this embodiment, there are two conductive pins 210, and two support pins 220 are distributed on the two outer surfaces of the package 10. Specifically, one support pin 220 is bent to the bottom surface of the package 10, and one support pin 220 is bent to the right side surface of the package 10. That is, at least two support pins 220 are distributed on the two outer surfaces of the package 10, at least one support pin 220 is bent to the bottom surface of the package 10, and at least one support portion is bent to the left or right side surface of the package 10. It can be understood that the two soldering surfaces 222 are located on the bottom surface of the package 10, and the pickup plane 120 is the top surface of the package 10.

[0032] Please see Figure 7 Embodiment 4 of the present invention provides an LED lamp bead, which differs from the LED lamp bead described in Embodiment 1 in that... In this embodiment, there are two conductive pins 210, and two support pins 220 are distributed on the two outer surfaces of the package 10. Specifically, one support pin 220 is bent to the bottom surface of the package 10, and one support pin 220 is bent to the right side surface of the package 10. That is, at least two support pins 220 are distributed on the two outer surfaces of the package 10, at least one support pin 220 is bent to the bottom surface of the package 10, and at least one support portion is bent to the left or right side surface of the package 10. The number of support pins 220 located on the left side surface of the package 10 is the same as the number of support pins 220 located on the right side surface of the package 10, and they are symmetrically arranged along the axis of the package 10. It can be understood that the two soldering surfaces 222 are located on the bottom surface of the package 10, and the pickup plane 120 is the top surface of the package 10.

[0033] Please see Figure 8 Embodiment 5 of the present invention provides an LED lamp bead, which differs from the LED lamp bead described in Embodiment 1 in that... The four support pins 220 are distributed on the three outer surfaces of the package 10. Specifically, two support pins 220 are bent to the bottom surface of the package 10, one support pin 220 is bent to the left side surface of the package 10, and one support pin 220 is bent to the rear side surface of the package 10. That is, at least three support pins 220 are distributed on the three outer surfaces of the package, at least one support pin 220 is bent to the bottom surface of the package 10, at least one support pin 220 is bent to the left or right side surface of the package 10, and at least one support pin 220 is bent to the rear side surface of the package 10. Understandably, the four soldering surfaces 222 are located on the bottom surface of the package 10, and the pickup plane 120 is the top surface of the package 10.

[0034] Please see Figure 9 and Figure 10 Embodiment 6 of the present invention provides an LED lamp bead, which differs from the LED lamp bead described in Embodiment 1 in that... In this embodiment, the number of conductive pins 210 is six, and the six support pins 220 are distributed on the three outer surfaces of the package 10. Specifically, one support pin 220 is bent to the left side of the package 10, two support pins 220 are bent to the right side of the package 10, and three support pins 220 are bent to the bottom surface of the package 10. That is, at least three support pins 220 are distributed on the three outer surfaces of the package 10, at least one support pin 220 is bent to the bottom surface of the package 10, at least one support pin 220 is bent to the left side of the package 10, and at least one support pin 220 is bent to the right side of the package 10. It can be understood that the six soldering surfaces 222 are located on the bottom surface of the package 10, and the pickup plane 120 is the top surface of the package 10.

[0035] Please see Figure 11 Embodiment 7 of the present invention provides an LED lamp bead, which differs from the LED lamp bead described in Embodiment 1 in that... In this embodiment, there are six conductive pins 210 and six support pins 220 distributed on the three outer surfaces of the package 10. Specifically, one support pin 220 is bent to the left side of the package 10, one support pin 220 is bent to the right side of the package 10, and four support pins 220 are bent to the bottom surface of the package 10. That is, at least three support pins 220 are distributed on the three outer surfaces of the package 10, at least one support pin 220 is bent to the bottom surface of the package 10, at least one support pin 220 is bent to the left side of the package 10, and at least one support pin 220 is bent to the right side of the package 10. The number of support pins 220 on the left side of the package 10 is the same as the number of support pins 220 on the right side of the package 10, and they are symmetrically arranged along the axis of the package 10. Understandably, the six welding surfaces 222 are located on the bottom surface of the package 10, and the pickup plane 120 is the top surface of the package 10.

[0036] Please see Figure 12 Embodiment 8 of the present invention provides an LED lamp bead, which differs from the LED lamp bead described in Embodiment 1 in that... In this embodiment, there are eight conductive pins 210 and eight support pins 220 distributed on the three outer surfaces of the package. Specifically, two support pins 220 are bent to the left side of the package 10, two support pins 220 are bent to the right side of the package 10, and four support pins 220 are bent to the bottom surface of the package 10. That is, at least three support pins 220 are distributed on the three outer surfaces of the package 10, at least one support pin 220 is bent to the bottom surface of the package 10, at least one support pin 220 is bent to the left side of the package 10, and at least one support pin 220 is bent to the right side of the package 10. The number of support pins 220 on the left side of the package 10 is the same as the number of support pins 220 on the right side of the package 10, and they are symmetrically arranged along the axis of the package 10. Understandably, the eight welding surfaces 222 are located on the bottom surface of the package 10, and the pickup plane 120 is the top surface of the package 10.

[0037] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0038] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. An LED lamp bead, characterized in that, include: The package (10) has an optical cavity (110) for lateral light emission. At least two conductive pins (210) are connected to the package (10), the conductive pins (210) including a carrier portion (211) located inside the package (10) and a support pin (220) protruding outside the package (10). The carrier (211) is exposed inside the optical cavity (110), and the carrier (211) is used to weld LED chips (40). The support pin (220) includes a support portion (221) on which a welding surface (222) is provided. At least two of the support pins (220) extend from different outer surfaces of the package (10), are bent so that the support portion (221) is located on the same plane of the package (10), and the soldering surfaces (222) are coplanar for soldering to an external circuit board.

2. The LED lamp bead according to claim 1, characterized in that, At least one of the support pins (220) is bent to the left or right side of the package (10), and at least one of the support pins (220) is bent to the bottom surface of the package (10).

3. The LED lamp bead according to claim 1, characterized in that, At least one of the support pins (220) is bent to the left side of the package (10), and at least one of the support pins (220) is bent to the right side of the package (10).

4. The LED lamp bead according to claim 1, characterized in that, At least one of the support pins (220) is bent to the rear side of the package (10), and at least one of the support pins (220) is bent to the bottom surface of the package (10).

5. The LED lamp bead according to claim 1, characterized in that, At least three of the support pins (220) are distributed on the three outer surfaces of the package (10).

6. The LED lamp bead according to claim 5, characterized in that, At least one of the support pins (220) is bent to the bottom surface of the package (10), at least one of the support pins (220) is bent to the left side of the package (10), and at least one of the support pins (220) is bent to the right side of the package (10).

7. The LED lamp bead according to claim 5, characterized in that, At least one of the support pins (220) is bent to the bottom surface of the package (10), at least one of the support pins (220) is bent to the left or right side of the package (10), and at least one of the support pins (220) is bent to the rear side of the package (10).

8. The LED lamp bead according to claim 1 or 5, characterized in that, When at least one of the support pins (220) is bent to the left side of the package (10), at least one of the support pins (220) is bent to the right side of the package (10), and the number of support pins (220) on the left side of the package (10) is the same as the number of support pins (220) on the right side of the package (10), the support pins (220) on the left side of the package (10) and the support pins (220) on the right side of the package (10) are symmetrically arranged along the axis of the package (10).

9. The LED lamp bead according to claim 1, characterized in that, A bending plate (30) is connected to one end of the support pin (220) facing away from the bearing portion (211), and the bending plate (30) extends from the support pin (220) in a direction facing away from the welding surface (222).

10. The LED lamp bead according to claim 1, characterized in that, The number of conductive pins (210) is two, four, six, or eight.

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