Display panel, preparation method thereof and display device

Abstract

Provided is a display panel, comprising: a substrate, comprising a display area and a binding area located at least one side of the display area, the binding area being configured to bind a driving chip; wherein the binding area comprises a first binding area and a second binding area, the first binding area is arranged adjacent to the second binding area, the first binding area comprises at least one first pad, the second binding area comprises at least one second pad, the first pad and the second pad are arranged at intervals in a first direction and / or a second direction; the height of the second pad in the direction perpendicular to the surface of the substrate facing the display area is greater than the height of the first pad in the direction perpendicular to the surface of the substrate facing the display area.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to display panels, methods for their fabrication, and display devices. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are microdisplays that have emerged in recent years. Using mature silicon-based semiconductor processes, high-PPI (pixel density) and high-refresh-rate OLED displays can be fabricated for applications in VR (Virtual Reality) and AR (Augmented Reality). Silicon-based OLED displays have bonding areas on the sides for connection to the driver chip. However, during the bonding process between the driver chip and the pads in the bonding area, the central part of the bonding area experiences less stress, while the sides or perimeter experience greater stress. This leads to impedance differences, which can easily cause poor wiring and uneven display.

[0003] The information disclosed in this section is only for understanding the background of the inventive concept of this disclosure, and therefore may include information that does not constitute prior art. Summary of the Invention

[0004] To address at least one aspect of the above-mentioned problems, embodiments of this disclosure provide a display panel, a method for manufacturing the same, and a display device.

[0005] One aspect of the embodiments of this disclosure provides a display panel, including:

[0006] A substrate includes a display area and a bonding area located on at least one side of the display area, the bonding area being configured to bond a driver chip;

[0007] The bonding area includes a first bonding area and a second bonding area, which are disposed adjacent to each other. The first bonding area includes at least one first pad, and the second bonding area includes at least one second pad. The first pad and the second pad are arranged at intervals in a first direction and / or a second direction. The height of the second pad in the direction perpendicular to the surface of the substrate facing the display area is greater than the height of the first pad in the direction perpendicular to the surface of the substrate facing the display area.

[0008] According to some exemplary embodiments, the orthographic projection of the first bonding region on the substrate surrounds the orthographic projection of the second bonding region on the substrate.

[0009] According to some exemplary embodiments, the first binding area includes a first side edge near the display area, the first side edge being spaced apart from the display area by a first interval distance; the second binding area includes a second side edge near the display area, the second side edge being spaced apart from the display area by a second interval distance; the first interval distance is smaller than the second interval distance.

[0010] According to some exemplary embodiments, the first binding area includes a first binding sub-area and a second binding sub-area, the first binding sub-area and the second binding sub-area are located on both sides of the second binding area, and the first binding sub-area, the second binding area and the second binding sub-area are arranged sequentially at intervals in a first direction.

[0011] According to some exemplary embodiments, the first binding area includes a first side edge near the display area, the first side edge being spaced apart from the display area by a first interval distance; the second binding area includes a second side edge near the display area, the second side edge being spaced apart from the display area by a second interval distance; the first interval distance and the second interval distance are substantially equal; the first side edge is parallel to the first direction.

[0012] According to some exemplary embodiments, the area of ​​the orthographic projection of the second pad on the substrate is greater than the area of ​​the orthographic projection of the first pad on the substrate.

[0013] According to some exemplary embodiments, the width of the orthographic projection of the first pad on the substrate in a first direction is smaller than the width of the orthographic projection of the second pad on the substrate in the first direction.

[0014] According to some exemplary embodiments, the second binding area includes a first side and a second side disposed opposite to each other in a first direction, a third side and a fourth side disposed opposite to each other in a second direction, and a middle portion located around the first side, the second side, the third side and the fourth side;

[0015] In the direction from the middle portion to at least one of the first side and the second side, and / or in the direction from the middle portion to at least one of the third side and the fourth side, the area of ​​the orthogonal projection of the second pad on the substrate gradually decreases.

[0016] In another aspect of the embodiments of this disclosure, a display device is provided, the display device comprising: a display panel according to any of the preceding claims; and a driver chip, the driver chip being bonded to a first pad and a second pad of the display panel.

[0017] Another aspect of the embodiments of this disclosure provides a method for manufacturing a display panel, the method comprising:

[0018] Perform a first patterning process on a substrate to form a first bonding region; and

[0019] A second patterning process is performed on the substrate to form a second bonding region;

[0020] The bonding area includes a first bonding area and a second bonding area, and the substrate includes a display area. The bonding area is located on at least one side of the display area. The first bonding area and the second bonding area are disposed adjacent to each other. The first bonding area includes at least one first pad, and the second bonding area includes at least one second pad. The first pad and the second pad are arranged at intervals in a first direction and / or a second direction. The height of the second pad in the direction perpendicular to the surface of the substrate facing the display area is greater than the height of the first pad in the direction perpendicular to the surface of the substrate facing the display area. Attached Figure Description

[0021] Other objects and advantages of this disclosure will become apparent from the following description of the disclosure with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the disclosure.

[0022] Figure 1 The schematic diagram illustrates a planar structure of a display panel according to some exemplary embodiments of the present disclosure;

[0023] Figure 2 A cross-sectional view of a display panel according to some exemplary embodiments of the present disclosure is schematically shown;

[0024] Figure 3 The schematic diagram illustrates a planar structure of a display panel according to some exemplary embodiments of the present disclosure;

[0025] Figure 4 The schematic diagram illustrates a planar structure of a display panel according to some other exemplary embodiments of the present disclosure;

[0026] Figure 5 A schematic plan view of a binding area in a display panel according to some other exemplary embodiments of the present disclosure is shown;

[0027] Figure 6 The schematic diagram illustrates a planar structure of a display panel according to some other exemplary embodiments of the present disclosure;

[0028] Figure 7 A schematic plan view of a binding area in a display panel according to some other exemplary embodiments of the present disclosure is shown;

[0029] Figure 8 The schematic diagram illustrates the structure of a display device according to some exemplary embodiments of the present disclosure;

[0030] Figure 9 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure is shown schematically.

[0031] Figure 10A A cross-sectional view schematically illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure is shown.

[0032] Figure 10B A cross-sectional view schematically illustrating a method for fabricating a display panel according to an embodiment of the present disclosure is shown.

[0033] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the accompanying drawings used to describe embodiments of this disclosure may be enlarged or reduced; that is, these drawings are not drawn to actual scale. Detailed Implementation

[0034] The technical solutions of this disclosure will be further described in detail below through embodiments and in conjunction with the accompanying drawings. In this specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of this disclosure with reference to the accompanying drawings is intended to explain the overall inventive concept of this disclosure and should not be construed as a limitation thereof.

[0035] Furthermore, in the following detailed description, numerous specific details are set forth for ease of explanation to provide a thorough understanding of the embodiments disclosed herein. However, it will be apparent that one or more embodiments may be practiced without these specific details.

[0036] It should be understood that although the terms first, second, etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] It should be understood that when an element or layer is referred to as being "formed on" another element or layer, that element or layer may be formed directly or indirectly on the other element or layer. That is, for example, intermediate elements or intermediate layers may exist. Conversely, when an element or layer is referred to as being "directly formed on" another element or layer, there are no intermediate elements or intermediate layers. Other terms used to describe relationships between elements or layers (e.g., "between" and "directly between," "adjacent" and "directly adjacent," etc.) should be interpreted in a similar manner. Furthermore, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, XZ, and YZ.

[0038] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “including” are used herein, it indicates the presence of the stated features, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0039] In this document, unless otherwise expressly specified and limited, the term “connection” should be interpreted broadly. For example, “connection” can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0040] Silicon-based OLED display devices combine CMOS technology and OLED technology, using monocrystalline silicon as the active driving backplane to fabricate active organic light-emitting diode (OLED) display devices. The structure of a silicon-based OLED device consists of two parts: the driving backplane and the OLED device itself. The driving backplane may include a first chip (also called a panel chip) fabricated on a silicon substrate using standard CMOS technology. The first chip may include pixel circuits, row and column driving circuits, and other functional circuits. To improve the display effect of the silicon-based OLED display device, a second chip can usually be externally connected. For example, the second chip may include a display driver IC (DDIC chip). The second chip may include row and column driving modules, digital-to-analog conversion modules, communication modules, data processing modules, power supply modules, and other functional modules. For high-resolution applications, the second chip can use a digital interface to complete data transmission through data sampling and comparison.

[0041] In the manufacturing process of silicon-based OLED displays, to improve display quality, the module surface must not have significant color differences to avoid affecting the user's picture quality experience. During the bonding process between the driver chip and the bonding pads in the bonding area, the central part of the bonding area experiences less force, while the sides or perimeter experience greater force, resulting in a certain impedance difference. This can easily lead to problems such as poor wiring and uneven display (mura).

[0042] To address at least one of the above problems, embodiments of this disclosure provide a display panel, a method for manufacturing the same, and a display device.

[0043] Figure 1 The schematic diagram illustrates a planar structure of a display panel according to some exemplary embodiments of the present disclosure; Figure 2 The schematic diagram illustrates a cross-sectional view of a display panel according to some exemplary embodiments of the present disclosure, for example, Figure 2 It can be the edge of the display panel Figure 1 The cross-sectional view taken from line AA' in the diagram.

[0044] Reference Figures 1-2The display panel 100 includes a substrate 1, a display area AA, and a bonding area 2 located on at least one side of the display area AA. The bonding area 2 is configured to bond a driver chip. The bonding area 2 includes a first bonding area 21 and a second bonding area 22, which are disposed adjacent to each other. The first bonding area 21 includes at least one first pad 211, and the second bonding area 22 includes at least one second pad 221. The first pad 211 and the second pad 221 are spaced apart in a first direction X and / or a second direction Y. The height h2 of the second pad 221 in the direction perpendicular to the surface of the substrate 1 facing the display area AA is greater than the height h1 of the first pad 211 in the direction perpendicular to the surface of the substrate 1 facing the display area AA.

[0045] In an exemplary embodiment, the display panel 100 includes a substrate 1. For example, the substrate 1 is a rigid substrate 1, which can be, exemplarily, a silicon substrate. A display area AA is provided on one side of the substrate 1, and a bonding area 2 is provided on the other side. The height of the second pad 221 in the second bonding area 22 of the bonding area 2 is higher than the height of the first pad 211 in the first bonding area 21. Therefore, by increasing the height of the middle pad, during the bonding process where the force is greater at the periphery and less at the center, the pads in the middle of the display panel 100 can make uniform contact with the pads on the driver chip, reducing the risk of poor lines or uneven display.

[0046] Figure 3 The schematic diagram illustrates a planar structure of a display panel according to some exemplary embodiments of the present disclosure.

[0047] According to some exemplary embodiments, the orthographic projection of the first bonding region 21 on the substrate 1 surrounds the orthographic projection of the second bonding region 22 on the substrate 1. The first bonding region 21 includes a first side L1 near the display region AA, and the first side L1 is separated from the display region AA by a first spacing distance d1; the second bonding region 22 includes a second side L2 near the display region AA, and the second side L2 is separated from the display region AA by a second spacing distance d2; the first spacing distance d1 is smaller than the second spacing distance d2.

[0048] For example, refer to Figure 3 The first binding area 21 is disposed around the second binding area 22, and a portion of the first binding area 21 is closer to the display area AA relative to the second binding area 22. For example, the first side L1 of the first binding area 21 near the display area AA and the first interval distance between the first binding area 21 and the display area AA can be greater than 500μm.

[0049] Since the overall shape of the first bonding area 21 and the second bonding area 22 is adapted to the shape of the driver chip, and since the driver chip is usually elongated, the first bonding area 21 and the second bonding area 22 can also be elongated, including a long side and a short side. Therefore, the first direction can be the extension direction of the long side, and the second direction can be the extension direction of the short side. At least a portion of the first pad 211 and the second pad 221 are configured to receive signals output by the driver chip, and at least another portion of the first pad 211 and the second pad 221 are configured to transmit external signals to the driver chip. A portion of the first pad 211 and the second pad 221 can also be configured without signal input or output, serving as dummy pads to support the driver chip.

[0050] It should be noted that, Figure 1 , Figure 3 The shapes of the first pad 211 and the second pad 221 are only for illustrative purposes, and are not limited to other shapes. Figure 1 , Figure 3 Besides the square shape shown in the diagram, the pads can also be other shapes, such as circles, polygons, etc., and this disclosure does not impose any limitations on them. Furthermore, Figure 1 , Figure 3 The number of pads in the first bonding area 21 and the second bonding area 22 can be determined according to actual needs.

[0051] Figure 4 A schematic diagram of the planar structure of a display panel according to some other exemplary embodiments of the present disclosure is shown. Figure 5 A schematic plan view of a binding area in a display panel according to some other exemplary embodiments of the present disclosure is shown.

[0052] According to some exemplary embodiments, the first binding area 21 in the display panel 200 includes a first binding sub-area 2101 and a second binding sub-area 2102. The first binding sub-area 2101 and the second binding sub-area 2102 are located on both sides of the second binding area 22, and the first binding sub-area 2101, the second binding area 22 and the second binding sub-area 2102 are sequentially spaced apart in the first direction X. The first binding area 21 includes a first side L1 near the display area AA, and the first side L1 is separated from the display area AA by a first interval distance d1. The second binding area 22 includes a second side L2 near the display area AA, and the second side L2 is separated from the display area AA by a second interval distance d2. The first interval distance d1 and the second interval distance d2 are substantially equal. The first side L1 is parallel to the first direction X.

[0053] For example, refer to Figure 4The first binding sub-region 2101 and the second binding sub-region 2102 are located on opposite sides of the second binding region 22 in the first direction X. The first side L1 of the first binding region 21 near the display area AA and the second side L2 of the second binding region 22 near the display area AA are basically flush. The first spacing distance d1 and the second spacing distance d2 are basically equal. Here, "basically equal" means that the ratio of the first spacing distance d1 to the second spacing distance d2 is in the range of 0.8-1.2. The first binding sub-region 2101, the second binding sub-region 2102, and the second binding region 22 can also be elongated to fit the shape of the driver chip.

[0054] According to some exemplary embodiments, the area of ​​the orthographic projection of the second pad 221 onto the substrate 1 is larger than the area of ​​the orthographic projection of the first pad 211 onto the substrate 1. The first spacing m1 between adjacent first pads 211 in the first direction X is larger than the second spacing m2 between adjacent second pads 221 in the first direction. The third spacing m3 between adjacent first pads 211 in the second direction is larger than the fourth spacing m4 between adjacent second pads 221 in the second direction. It should be noted that in the embodiments of this disclosure, "spacing" refers to the distance between the two closest edges of two adjacent pads. (Refer to...) Figure 5 The area of ​​the orthographic projection of the second pad 221 in the second bonding area 22 is larger than the area of ​​the orthographic projection of the first pad 211 in the first bonding area 21. By increasing the area of ​​the second pad 221 in the middle area, it is beneficial to increase the bonding contact area between the middle area and the driver chip, thereby reducing the impedance of the middle area. After the bonding process in which the forces on both sides are large and the forces in the middle are small, the impedance of the middle area is close to or consistent with that of the two sides, reducing the risk of poor line quality or uneven display.

[0055] The area of ​​the orthographic projection of the second pad 221 is larger than the area of ​​the orthographic projection of the first pad 211. The total area of ​​the first bonding area 21 and the second bonding area 22 can remain unchanged relative to the existing bonding area area. The area and shape of the entire bonding area 2 remain basically unchanged, so it can continue to be bonded to the existing driver chip without making major process changes.

[0056] In an exemplary embodiment, the width D1 of the orthographic projection of the first pad 211 onto the substrate 1 in the first direction X is smaller than the width D2 of the orthographic projection of the second pad 221 onto the substrate 1 in the first direction X.

[0057] For example, during the fabrication of the first pad 211 and the second pad 221, the width D2 of the second pad 221 is controlled to be greater than the width D1 of the first pad 211, thereby making the area of ​​the orthographic projection of the second pad 221 greater than the area of ​​the orthographic projection of the first pad 211, which facilitates the fabrication process.

[0058] Figure 6 A schematic diagram of the planar structure of a display panel according to some other exemplary embodiments of the present disclosure is shown. Figure 7 A schematic plan view of a binding area in a display panel according to some other exemplary embodiments of the present disclosure is shown.

[0059] According to some exemplary embodiments, the second bonding area 22 in the display panel 300 includes a first side S1 and a second side S2 disposed opposite to each other in a first direction, a third side S3 and a fourth side S4 disposed opposite to each other in a second direction, and an intermediate portion surrounded by the first side S1, the second side S2, the third side S3, and the fourth side S4. From the intermediate portion to at least one of the first side S1 and the second side S2, and / or from the intermediate portion to at least one of the third side S3 and the fourth side S4, the area of ​​the orthogonal projection of the second pad 221 onto the substrate 1 gradually decreases.

[0060] Reference Figure 6 and Figure 7 For example, the middle part is the area where the second pad E is located, the area around the area where the second pad E is located is the area where the second pad F is located, the area around the area where the second pad F is located is the area where the second pad G is located. The second pad E is located in the middle of the second bonding area 22, the second pad F is located in the area around the middle of the second bonding area 22, and the second pad G is located in the area around the middle of the second bonding area 22. From the middle part to the surrounding areas, the area of ​​the second pad 221 gradually decreases, that is, the area of ​​the orthographic projection of the second pad E on the substrate 1 is larger than the area of ​​the orthographic projection of the second pad F on the substrate 1, and the area of ​​the orthographic projection of the second pad F on the substrate 1 is larger than the area of ​​the orthographic projection of the second pad G on the substrate 1. By gradually reducing the area of ​​the second pad 221 in the middle region, the bonding contact area between the middle region and the driver chip is gradually reduced from the center to the periphery. This helps to reduce the impedance of the middle region more evenly. After the bonding process where the force is greater on both sides and less in the middle, the uniformity of the impedance between the middle region and both sides can be controlled more precisely, further reducing the risk of poor line quality or uneven display.

[0061] Figure 8 The schematic diagram illustrates a structural schematic of a display device according to some exemplary embodiments of the present disclosure.

[0062] Embodiments of this disclosure also provide a display device 1000, including a display panel 100, 200 or 300 as described above; and a driver chip 3, which is bonded to a first pad 211 and a second pad 221 of the display panel 100, 200 or 300.

[0063] like Figure 8As shown, the display device 1000 may further include a driver chip 3, which is bonded to the display panel 100, 200, or 300 and configured to provide display driving signals to the display panel 100, 200, or 300. For example, the display driving signals may include gate driving signals and data signals. The gate driving signals may include clock signals, initialization voltage signals, and reset signals.

[0064] The display device in the embodiments of this disclosure includes the display panel as described above. The type of display device is not limited, and it can be an electroluminescent display device. When the display device is an electroluminescent display device, it can be an organic light-emitting diode (OLED) or a quantum dot light-emitting diode (QLED).

[0065] Display device 1000 may include any device or product with display functionality. For example, display device 1000 may be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (such as head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc.

[0066] It should be understood that the display device 1000 according to some exemplary embodiments of the present disclosure has all the features and advantages of the display panel 100, 200 or 300 described above, which can be referred to in the above description of the display panel 100, 200 or 300, and will not be repeated here.

[0067] Figure 9 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure is shown schematically. Figure 10A A cross-sectional view schematically illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure is shown. Figure 10B A cross-sectional view schematically illustrating a method for fabricating a display panel according to an embodiment of the present disclosure is shown.

[0068] According to some exemplary embodiments, refer to Figure 9 and Figures 10A-10B The preparation method of display panel 100, 200 or 300 includes the following steps S910 to S920.

[0069] In step S910, a first patterning process is performed on the substrate 1 to form a first bonding region 21.

[0070] In step S920, a second patterning process is performed on the substrate 1 to form a second bonding region 22; wherein the bonding region 2 includes a first bonding region 21 and a second bonding region 22, the substrate 1 includes a display region AA, and the bonding region 2 is located on at least one side of the display region AA; the first bonding region 21 and the second bonding region 22 are disposed adjacent to each other, the first bonding region 21 includes at least one first pad 211, the second bonding region 22 includes at least one second pad 221, the first pad 211 and the second pad 221 are arranged at intervals in a first direction X and / or a second direction Y; the height h2 of the second pad 221 in the direction perpendicular to the surface of the substrate 1 facing the display region AA is greater than the height h1 of the first pad 211 in the direction perpendicular to the surface of the substrate 1 facing the display region AA.

[0071] Reference Figures 10A-10B In the embodiments of this disclosure, two photomasks are used. After photoresist is applied, the first photomask is exposed and developed to prepare the first pad of the first bonding area 21 with a lower height. After photoresist is applied, the second photomask is exposed and developed to prepare the second pad of the second bonding area 22 with a higher height. By changing the height of the pads in the middle area and the sides or surrounding areas, the pads on the display panel can make uniform contact with the pads on the driver chip during the bonding process between the driver chip and the display panel, thereby improving line defects and mura.

[0072] As used herein, the terms “approximately,” “about,” “approximately,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “about” or “approximately” as used herein includes the stated value and indicates that the particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0073] While some embodiments based on the general inventive concept of this disclosure have been illustrated and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of this disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display panel, comprising: A substrate includes a display area and a bonding area located on at least one side of the display area, the bonding area being configured to bond a driver chip; The bonding area includes a first bonding area and a second bonding area, which are disposed adjacent to each other. The first bonding area includes at least one first pad, and the second bonding area includes at least one second pad. The first pad and the second pad are arranged at intervals in a first direction and / or a second direction. The height of the second pad in the direction perpendicular to the surface of the substrate facing the display area is greater than the height of the first pad in the direction perpendicular to the surface of the substrate facing the display area.

2. The display panel according to claim 1, wherein, The orthographic projection of the first bonding region on the substrate surrounds the orthographic projection of the second bonding region on the substrate.

3. The display panel according to claim 2, wherein, The first binding area includes a first side edge near the display area, and the first side edge is separated from the display area by a first interval distance; the second binding area includes a second side edge near the display area, and the second side edge is separated from the display area by a second interval distance; the first interval distance is smaller than the second interval distance.

4. The display panel according to claim 1, wherein, The first binding area includes a first binding sub-area and a second binding sub-area, which are located on both sides of the second binding area. The first binding sub-area, the second binding area and the second binding area are arranged at intervals in a first direction.

5. The display panel according to claim 4, wherein, The first binding area includes a first side edge near the display area, and the first side edge is spaced apart from the display area by a first interval distance; the second binding area includes a second side edge near the display area, and the second side edge is spaced apart from the display area by a second interval distance; the first interval distance and the second interval distance are substantially equal; the first side edge is parallel to the first direction.

6. The display panel according to any one of claims 1-5, wherein, The area of ​​the second pad projected onto the substrate is larger than the area of ​​the first pad projected onto the substrate.

7. The display panel according to claim 6, wherein, The width of the orthographic projection of the first pad on the substrate in the first direction is smaller than the width of the orthographic projection of the second pad on the substrate in the first direction.

8. The display panel according to claim 1, wherein, The second binding area includes a first side and a second side disposed opposite to each other in a first direction, a third side and a fourth side disposed opposite to each other in a second direction, and a middle portion located around the first side, the second side, the third side and the fourth side; In the direction from the middle portion to at least one of the first side and the second side, and / or in the direction from the middle portion to at least one of the third side and the fourth side, the area of ​​the orthogonal projection of the second pad on the substrate gradually decreases.

9. A display device, characterized in that, include: Display panel according to any one of claims 1 to 8; A driver chip, which is bonded to the first and second pads of the display panel.

10. A method for manufacturing a display panel, the method comprising: A first patterning process is performed on the substrate to form a first bonding region; as well as A second patterning process is performed on the substrate to form a second bonding region; The bonding area includes a first bonding area and a second bonding area, and the substrate includes a display area. The bonding area is located on at least one side of the display area. The first bonding area and the second bonding area are disposed adjacent to each other. The first bonding area includes at least one first pad, and the second bonding area includes at least one second pad. The first pad and the second pad are arranged at intervals in a first direction and / or a second direction. The height of the second pad in the direction perpendicular to the surface of the substrate facing the display area is greater than the height of the first pad in the direction perpendicular to the surface of the substrate facing the display area.

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