Display module, manufacturing method and display device

Abstract

The application provides a display module, comprising: a substrate and a display panel located on one side of the substrate and comprising an array film layer, the substrate is provided with a first connecting structure on the side away from the display panel and out of light, the first connecting structure is formed by a connecting metal layer in the substrate and is electrically connected with the array film layer; the other side of the substrate is provided with a fitting groove, the bottom of the fitting groove is located inside the substrate and is provided with a reinforcing structure for accommodating and fixing a chip-on-film, the chip-on-film is integrated with a display driving chip and is fixed in the fitting groove through an adhesive structure, the reinforcing structure is trapezoidal, the occlusal force of the adhesive structure is improved, the lap height difference of a third connecting structure is reduced by fixing the chip-on-film in the fitting groove, and then the risk of fracture of the third connecting structure is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to an ultra-narrow bezel or bezel-less display module, its manufacturing method, and a display device. Background Technology

[0002] With the continuous advancement of display technology and the ever-increasing demands of consumers for visual experience, terminal display products are developing towards narrower bezels or even "zero bezels." To achieve a near-zero bezel display effect, panel design typically requires back-bonding and silver paste overlapping processes. However, in actual manufacturing processes, there is a significant gap between the COF (Chip on Film) pads and the panel pads, making the silver paste overlapping area prone to breakage, which in turn leads to problems such as decreased display reliability.

[0003] Therefore, under the premise of achieving a near-zero bezel display effect, how to effectively solve the risk of breakage and reliability issues caused by large drop differences during the silver paste bonding process has become one of the key issues that urgently need to be addressed in the current development of OLED display panel technology. Summary of the Invention

[0004] In view of this, the present invention provides a display module and display device to solve the reliability problem caused by large overlap of silver paste.

[0005] In a first aspect, the present invention provides a display module, the display module including a display panel, the display panel including a substrate and an array film layer, the substrate including a first organic layer and a connecting metal layer and a second organic layer stacked sequentially; a first connection structure is provided on the light-emitting side of the substrate away from the display panel, the first connection structure being formed by the connecting metal layer and electrically connected to the array film layer; an interlocking groove is provided on the light-emitting side of the substrate away from the display panel, the bottom of the interlocking groove being located in the second organic layer, and a reinforcing structure is provided at the bottom of the interlocking groove; a flip-chip film, at least a portion of the display driver chip is integrated in the flip-chip film, an adhesive structure is provided between the flip-chip film and the reinforcing structure, the flip-chip film being disposed in the interlocking groove through the adhesive structure; wherein, along the direction away from the display panel from the substrate, the cross-sectional area of ​​the reinforcing structure gradually increases; and a second connection structure electrically connected to the driver chip is provided on the flip-chip film, the first connection structure and the second connection structure being electrically connected through a third connection structure.

[0006] In conjunction with the first aspect, in some embodiments, the substrate further includes a first buffer layer and a second buffer layer stacked between the first organic layer and the second organic layer, and a connecting metal layer located between the first buffer layer and the second buffer layer; wherein the first organic layer and the second organic layer are made of polyimide, and the first buffer layer and the second buffer layer are inorganic layers.

[0007] Furthermore, the first buffer layer includes a SiOx film layer and an amorphous silicon film layer. The SiOx film layer and the amorphous silicon film layer are stacked sequentially along the direction from the substrate to the display panel. The thickness of the SiOx film layer is 3000Å ​​to 6000Å, and the thickness of the amorphous silicon film layer is 20Å to 40Å.

[0008] Furthermore, the second buffer layer includes a SiOx film with a thickness of 3000 Å to 6000 Å.

[0009] Furthermore, the connecting metal layer includes at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer is 1000 Å to 3000 Å.

[0010] Furthermore, the thickness of the first organic layer is 10 μm to 20 μm, and the thickness of the second organic layer is 5 μm to 8 μm.

[0011] Furthermore, the third connection structure is a silver paste bridging structure, with one end of the third connection structure in contact with the first connection structure and the other end in contact with the second connection structure.

[0012] Furthermore, the reinforcing structure and the second organic layer are made of the same material. Preferably, the reinforcing structure is formed by etching the second organic layer, and the height of the reinforcing structure is 3μm to 6μm.

[0013] In conjunction with the first aspect, in the display module provided by the embodiments of the present invention, the display panel includes a display area and a non-display area, and the fitting groove is located in the display area.

[0014] Furthermore, the reinforcing structure at the bottom of the fitting groove is trapezoidal, with the base angle of the trapezoid being 40° to 80°; preferably, there are multiple reinforcing structures spaced apart from each other, and the trapezoids are isosceles trapezoids.

[0015] In conjunction with the first aspect, in the display module provided by the embodiments of the present invention, the adhesive structure is formed by curing the adhesive filled in the fitting groove, and the thickness of the adhesive is 5um < H ≤ 10um; optionally, the adhesive includes at least one of single / two-component epoxy adhesive, UV-curable structural adhesive, silicone structural adhesive, pressure-sensitive adhesive, and hot melt adhesive.

[0016] In conjunction with the first aspect, the display module provided in the embodiments of the present invention further includes: an OLED film layer located on the side of the array film layer away from the substrate; an encapsulation layer located on the side of the OLED film layer away from the substrate; an optically transparent adhesive layer located on the side of the encapsulation layer away from the substrate; and a glass cover plate located on the side of the optically transparent adhesive layer away from the substrate; wherein...

[0017] Along the direction away from the substrate, the encapsulation layer comprises a first sub-encapsulation layer, a second sub-encapsulation layer, and a third sub-encapsulation layer stacked sequentially. The first sub-encapsulation layer is an inorganic encapsulation layer, including at least one of SiOx or SiNx, with a thickness of 0.5 μm to 1 μm. The second sub-encapsulation layer is an organic encapsulation layer, including at least one of epoxy acrylate, polyurethane acrylate, and polyester acrylate, with a thickness of 1 μm to 20 μm. The third sub-encapsulation layer is an inorganic encapsulation layer, including at least one of SiOx or SiNx. Furthermore, the second sub-encapsulation layer is formed by inkjet printing.

[0018] In a second aspect, the present invention provides a method for fabricating a display module, the method comprising: providing a substrate, the substrate comprising a first organic layer, a first buffer layer, a connecting metal layer, a second buffer layer, and a second organic layer; A display panel is fabricated on a first side of a substrate. The display panel includes an array film layer, an OLED film layer, and an encapsulation layer that are sequentially stacked along a direction away from the substrate. The array film layer is electrically connected to a connecting metal layer located in the substrate through a via. A polarizing layer, an optically transparent adhesive layer, and a cover glass are sequentially attached above the encapsulation layer. A first connection structure is formed by laser etching in the first connection region on the second side of the substrate to expose the connection metal layer. The metal of the connection metal layer in the region where the first connection structure is located is isolated from the metal of other regions of the connection metal layer. The second connection area on the second side of the substrate is laser-etched to expose the second organic layer and form an interlocking groove. The bottom of the interlocking groove is provided with an etched reinforcement structure. The cross-sectional area of ​​the reinforcement structure gradually increases along the direction away from the display panel. The orthographic projections of the first connection area and the second connection area on the substrate do not overlap.

[0019] In conjunction with the second aspect, the preparation method provided by the present invention further includes: filling the fitting groove with adhesive, attaching a flip-chip film in the area where the adhesive is located, curing the adhesive to form an adhesive structure, the flip-chip film encapsulating at least a portion of the display driver chip, and the exposed portion of the flip-chip film being provided with a second connection structure electrically connected to the driver chip.

[0020] Furthermore, applying silver paste electrically connects the first connection structure to the second connection structure, and laser sintering solidifies the silver paste to form a third connection structure, with one end of the third connection structure in contact with the first connection structure and the other end in contact with the second connection structure.

[0021] Additionally, a protective adhesive is applied to form a protective structure that covers the first connecting structure, the second connecting structure, and the third connecting structure.

[0022] Furthermore, the first organic layer and the second organic layer are made of polyimide, and the first buffer layer and the second buffer layer are inorganic layers.

[0023] Furthermore, the first buffer layer includes a SiOx film layer and an amorphous silicon film layer, which are stacked sequentially along the direction from the substrate to the display panel. The SiOx film layer has a thickness of 3000Å ​​to 6000Å, and the amorphous silicon film layer has a thickness of 20Å to 40Å.

[0024] Furthermore, the second buffer layer includes a SiOx film with a thickness of 3000 Å to 6000 Å.

[0025] In addition, the connecting metal layer includes at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer is 1000 Å to 3000 Å.

[0026] Furthermore, the thickness of the first organic layer is 10 μm to 20 μm, and the thickness of the second organic layer is 5 μm to 8 μm.

[0027] Furthermore, along the direction away from the display panel from the substrate, the second connection structure protrudes from the first organic layer.

[0028] Furthermore, the reinforcing structure is formed by etching the second organic layer, and the height of the reinforcing structure is 3μm to 6μm; preferably, the reinforcing structure is a plurality of mutually spaced trapezoids, the base angle of the trapezoids is 40° to 80°, and more preferably, the trapezoids are isosceles trapezoids.

[0029] Thirdly, the present invention provides a display device comprising a display module as provided in any embodiment of the first aspect of the present invention, or comprising a display module prepared by a preparation method as provided in any embodiment of the second aspect of the present invention.

[0030] In the display module provided by the present invention, by forming an interlocking groove on the side of the substrate away from the display panel to accommodate and fix the flip-chip film, the connection height difference between the connecting metal on the flip-chip film and the connecting metal on the display panel is reduced, thereby reducing the risk of silver paste overlap breakage. The first connection structure located on the back of the display panel is electrically connected to the array film layer through a via. The first connection structure is electrically connected to the second connection structure on the flip-chip film with integrated driver chip, so that the display module provided by the present invention achieves a borderless display effect. In addition, a trapezoidal reinforcement structure is provided at the bottom of the interlocking groove to improve the reliability of the module.

[0031] It should be understood that the description in this section is not intended to identify key or important features of embodiments of the invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a structural model diagram of the silver paste overlap on the back of the display panel in related technologies; Figure 2 This is a structural model diagram of the silver paste overlap structure on the back of the display panel provided in an embodiment of the present invention; Figure 3A This is a simplified flowchart of some steps in the display panel manufacturing method provided by the embodiments of the present invention; Figure 3B These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figure 4 These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figure 5 These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figures 6A-6B These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figures 7A-7B These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figure 8A yes Figure 7B Enlarged view of a portion of the simplified structural diagram within the dashed box; Figure 8B yes Figure 7B Another representation of the relevant structure within the dashed box; Figures 9A-9B These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figure 10 These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figure 11 These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figure 12 These are partial structural model diagrams of the display panel manufacturing process provided in the embodiments of the present invention; Figure 13 This is a partial structural model diagram of a display device provided by the present invention.

[0034] Explanation of reference numerals in the attached figures: 10: Substrate 101: First organic layer; 102: First buffer layer 103: Second buffer layer; 104: Second organic layer 105: Connecting metal layer 20: Display panel 201: First sub-encapsulation layer; 202: Second sub-encapsulation layer 203: Third Sub-encapsulation Layer 210: Array film layer; 220: OLED film layer 30: Polarizing layer; 40: Optically transparent adhesive layer 50: Cover glass; 60: Crystal-coated film 601: First connection structure; 602: Second connection structure 603: Third connecting structure; 604: Reinforcing structure 605 / 6051: Adhesive structure; 606: Protective structure 70: Flexible circuit board T1: First connection area; T2: Second connection area 100: Display Module 200: Display device Detailed Implementation To enable those skilled in the art to better understand the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0035] As described in the background section, terminal display products in related technologies are developing towards narrower bezels or even "zero bezels." To achieve a near-zero bezel display effect, panel design typically requires back-bonding and silver paste bonding processes. (Reference) Figure 1 In actual manufacturing processes, COF (Chip on Film) is typically attached to the back of the display module using double-sided adhesive NCF. The thickness of both the COF and the NCF adhesive is usually around 55μm, resulting in a significant overlap between the COF pad connection structure and the display panel pad connection structure. This makes the silver paste overlap area prone to breakage, leading to reduced display reliability and other issues. (Reference) Figure 1This is a simplified structural model of a display module with extremely narrow bezels or even "zero bezels" in related technologies. The display module includes a substrate 10A, a display panel 20A, a cover glass 50A, a flip-chip film 60A, a first connection structure 601A, a second connection structure 602A, a third connection structure 603A, and a protective structure 606A. The flip-chip film is attached to the substrate using double-sided adhesive. The first connection structure 601A is connected to the driving circuit layer (array film layer, not shown) in the display panel 20A via a via (not shown). The second connection structure 602A connects to the display driver chip integrated within the flip-chip film 60A. The first connection structure 601A and... The second connection structure 602A is electrically connected to the third connection structure 603A. Typically, the first connection structure is a display panel pad, the second connection structure is a flip-chip film pad, and the third connection structure is an overlap line formed after silver paste coating, sintering, and curing. Since the flip-chip film 60A and the double-sided adhesive 605A have a combined thickness of approximately 55μm, there is a significant height difference between the first connection structure 601A and the second connection structure 602A. This results in a high risk of breakage for the cured silver paste overlap line. With the trend towards ultra-narrow bezels and zero bezels in terminal display products, seeking a reliable structural design to eliminate the risk of silver paste overlap line breakage has become one of the key problems that need to be solved in this field. It should be noted that, for the purpose of distinguishing it from the accompanying drawings and reference numerals provided in the embodiments of this invention, the reference numerals are... Figure 1 The structures shown are distinguished from those in the accompanying drawings of the present invention by reference numerals. In the illustrations, the English abbreviations such as PI (polyimide, flexible substrate), NCF (double-sided adhesive), COF (crystal-on-film), and CG (cover glass) are abbreviations for panel structures known in the display panel industry.

[0036] In view of this, the present invention provides a display module 100, with reference to... Figure 2The display module 100 includes a display panel 20, which includes a substrate 10 and an array film layer. The substrate 10 is sequentially stacked with a first organic layer 101, a first buffer layer 102, a connecting metal layer 105, a second buffer layer 103, and a second organic layer 104. The array film layer 210 is located on a first side of the substrate 10. On the second side facing the substrate 10, a first connection structure 601 is provided on the substrate 10. The first connection structure 601 is formed by the connecting metal layer 105 and is electrically connected to the array film layer 210. A fitting groove is provided on the second side of the substrate 10, with its bottom located on the second organic layer 104, and a reinforcing structure is provided at the bottom of the fitting groove. A flip-chip film 60 is provided, in which at least a portion of the display driver chip is integrated. An adhesive structure 605 is provided between the flip-chip film 60 and the reinforcing structure, and the flip-chip film 60 is disposed in the fitting groove through the adhesive structure 605. The cross-sectional area of ​​the reinforcing structure gradually increases along the direction away from the display panel 20 from the substrate 10. The flip-chip film 60 is provided with a second connection structure 602 electrically connected to the driver chip. The first connection structure 601 and the second connection structure 602 are electrically connected via a third connection structure 603. By fixing the flip-chip film 60 in the fitting groove, the display module 100 effectively reduces the overlap height difference of the third connection structure 603, which can effectively solve reliability problems such as the breakage of the overlap line caused by a large segment difference. It should be noted that in this application, the substrate 10 belongs to the structure of the display panel 20 and provides substrate support for other structures of the display panel 20. In this application, the first side and the second side of the substrate are referenced with the plane where the surface of the second organic layer in the substrate faces the array film layer. The light-emitting side of the reference plane facing the display panel is the first side, and the light-emitting side away from the display panel is the second side. Alternatively, it can be understood that the light-emitting side of the display panel is the first side, and the backlight side of the display panel is the second side.

[0037] In conjunction with the above implementation methods, continue to refer to Figure 2 In some embodiments, the first organic layer 101 and the second organic layer 104 are made of polyimide, and the first buffer layer 102 and the second buffer layer 103 are inorganic layers.

[0038] Specifically, the first buffer layer 102 is composed of a SiOx film layer and an amorphous silicon film layer. Along the direction from the substrate 10 to the display panel 20, the SiOx film layer and the amorphous silicon film layer are stacked sequentially. The thickness of the SiOx film layer is 5000Å to 7000Å, preferably 6000Å, and the thickness of the amorphous silicon film layer is 20Å to 40Å, preferably 30Å.

[0039] Specifically, the second buffer layer 103 is a SiOx film with a thickness of 3000 Å to 6000 Å, preferably 5000 Å.

[0040] Specifically, the connecting metal layer 105 is at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer 105 is 1000 Å to 4000 Å, preferably 2500 Å.

[0041] Specifically, the thickness of the first organic layer 101 is 10μm to 20μm. Optionally, if the overall thickness of the display module 100 allows, the thickness of the first organic layer 101 is preferably 20μm. The thickness of the second organic layer 104 is 5μm to 8μm. Optionally, if the overall thickness of the display module 100 allows, the thickness of the second organic layer 104 is preferably 8μm.

[0042] Specifically, the third connection structure 603 is a silver paste bridging structure. One end of the third connection structure 603 is in contact with the first connection structure 601, and the other end is in contact with the second connection structure 602. In some embodiments, the first connection structure 601 is a connection pad of the display panel 20, the second connection structure 602 is a connection pad of the flip-chip film 60, and the third connection structure 603 is an overlap line formed by laser sintering and curing after silver paste is applied.

[0043] Specifically, the reinforcing structure and the second organic layer 104 are made of the same material. Preferably, the reinforcing structure is formed by etching the second organic layer 104. The height of the reinforcing structure is 3μm to 6μm. To ensure the reliability of the substrate 10, the thickness of the remaining part of the second organic layer 104 after etching is 2μm to 5μm. The height of the reinforcing structure can be adjusted according to the thickness of the second organic layer 104. When the thickness of the second organic layer 104 is 8μm, the height of the reinforcing structure is preferably 4μm. At this time, the remaining thickness of the second organic layer 104 after etching is also 4μm. When the thickness of the second organic layer 104 is 6μm, the height of the reinforcing structure is preferably 3μm. At this time, the remaining thickness of the second organic layer 104 after etching is also 3μm. When the height of the reinforcing structure is 3μm to 6μm and the thickness of the remaining part of the second organic layer 104 after etching is 2μm to 5μm, the height of the reinforcing structure is preferably half the thickness of the second organic layer 104.

[0044] In conjunction with the above implementation methods, continue to refer to the appendix. Figure 2 In some embodiments, the display panel 20 includes a display area and a non-display area, the fitting groove is located in the display area, and the first connection structure 601 may be located in the non-display area or the display area. It should be noted that being located in the display area or the non-display area means that the orthographic projection on the substrate 10 is within the orthographic projection range of the display area or the non-display area of ​​the display panel 20 on the substrate 10.

[0045] Furthermore, the reinforcing structure at the bottom of the fitting groove is trapezoidal, with the base angle of the trapezoid being 40° to 80°; preferably, there are multiple reinforcing structures spaced apart from each other, and the trapezoids are isosceles trapezoids with a preferred base angle of 60°.

[0046] In conjunction with the above implementation methods, continue to refer to the appendix. Figure 2 In some embodiments, the adhesive structure 605 is formed by curing adhesive filled in the fitting groove. The thickness of the adhesive is 5µm < H ≤ 10µm. The reinforcing structure at the bottom of the fitting groove is a plurality of spaced trapezoids. The adhesive fills the gaps between the trapezoids. The thickness of the adhesive includes the thickness of the reinforcing structure and is greater than the thickness of the reinforcing structure. The adhesive can cover the reinforcing structure. According to reliability testing, in the embodiments provided by the present invention, 5µm is the critical thickness of the adhesive. When the thickness is greater than 5µm, the reliability test can be passed. When the thickness is less than or equal to 5µm, the reliability test cannot be passed. Optionally, the adhesive includes at least one of single / two-component epoxy adhesive, UV-curable structural adhesive, silicone structural adhesive, pressure-sensitive adhesive, and hot melt adhesive.

[0047] In conjunction with the above implementation methods, continue to refer to the appendix. Figure 2 The display module 100 provided in the embodiments of the present invention further includes: an OLED film layer 220 located on the side of the array film layer 210 away from the substrate 10; an encapsulation layer located on the side of the OLED film layer 220 away from the substrate 10; an optically transparent adhesive layer 40 located on the side of the encapsulation layer away from the substrate 10; and a glass cover plate located on the side of the optically transparent adhesive layer 40 away from the substrate 10.

[0048] Specifically, along the direction away from the substrate 10, the encapsulation layer is provided with a first sub-encapsulation layer 201, a second sub-encapsulation layer 202 and a third sub-encapsulation layer 203 stacked in sequence. The first sub-encapsulation layer 201 is an inorganic encapsulation layer, including at least one of SiOx or SiNx, with a thickness of 0.5μm to 1μm.

[0049] Specifically, the second sub-encapsulation layer 202 is an organic encapsulation layer, including at least one of epoxy acrylate, polyurethane acrylate, and polyester acrylate, with a thickness of 1μm to 20μm, preferably 10μm, formed by inkjet printing, which is also the IJP layer in the display panel 20.

[0050] Specifically, the third sub-encapsulation layer 203 is an inorganic encapsulation layer, including at least one of SiOx or SiNx, with a thickness of 30nm to 0.5μm.

[0051] In another embodiment of the present invention, a method for manufacturing a display module 100 is also provided, as described in the reference. Figure 3A The preparation method includes: S100: A substrate 10 is provided, the substrate 10 including a first organic layer 101, a first buffer layer 102, a connecting metal layer 105, a second buffer layer 103, and a second organic layer 104.

[0052] refer to Figure 3B The structure shown includes a first organic layer 101, a first buffer layer 102, a connecting metal layer 105, a second buffer layer 103, and a second organic layer 104.

[0053] In this step, the first organic layer 101 and the second organic layer 104 are made of polyimide, and the first buffer layer 102 and the second buffer layer 103 are inorganic layers.

[0054] Specifically, the first buffer layer 102 includes a SiOx film layer and an amorphous silicon film layer. The SiOx film layer and the amorphous silicon film layer are stacked sequentially along the direction from the substrate 10 to the display panel 20. The thickness of the SiOx film layer is 3000Å ​​to 6000Å, and the thickness of the amorphous silicon film layer is 20Å to 40Å.

[0055] Specifically, the second buffer layer 103 includes a SiOx film layer with a thickness of 3000 Å to 6000 Å.

[0056] Specifically, the connecting metal layer 105 includes at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer 105 is 1000 Å to 3000 Å.

[0057] Specifically, the thickness of the first organic layer 101 is 10 μm to 20 μm, and the thickness of the second organic layer 104 is 5 μm to 8 μm.

[0058] In conjunction with the above implementation methods, continue to refer to Figure 3A The preparation method further includes, S200: preparing a display panel 20 on a first side of the substrate 10, the display panel 20 including an array film layer 210, an OLED film layer 220 and an encapsulation layer sequentially stacked along a direction away from the substrate 10, wherein the array film layer 210 is electrically connected to a connecting metal layer 105 located in the stack of layers in the substrate 10 through a via.

[0059] refer to Figure 4 The structure shown includes a first organic layer 101, a first buffer layer 102, a connecting metal layer 105, a second buffer layer 103, and a second organic layer 104. One side of the substrate 10 includes an array film layer 210, an OLED film layer 220, and an encapsulation layer that are stacked sequentially.

[0060] In this preparation step, along the direction away from the substrate 10, the encapsulation layer is sequentially stacked with a first sub-encapsulation layer 201, a second sub-encapsulation layer 202 and a third sub-encapsulation layer 203. The first sub-encapsulation layer 201 is an inorganic encapsulation layer, including at least one of SiOx or SiNx, with a thickness of 0.5μm to 1μm.

[0061] Specifically, the second sub-encapsulation layer 202 is an organic encapsulation layer, including at least one of epoxy acrylate, polyurethane acrylate, and polyester acrylate, with a thickness of 1μm to 20μm, preferably 10μm, formed by inkjet printing, which is also the IJP layer in the display panel 20.

[0062] Specifically, the third sub-encapsulation layer 203 is an inorganic encapsulation layer, including at least one of SiOx or SiNx, with a thickness of 30nm to 0.5μm.

[0063] Based on the structure in the previous preparation steps, the first organic layer 101 and the second organic layer 104 are made of polyimide, and the first buffer layer 102 and the second buffer layer 103 are inorganic layers.

[0064] The first buffer layer 102 includes a SiOx film layer and an amorphous silicon film layer. The SiOx film layer and the amorphous silicon film layer are stacked sequentially along the direction from the substrate 10 to the display panel 20. The thickness of the SiOx film layer is 3000Å ​​to 6000Å, and the thickness of the amorphous silicon film layer is 20Å to 40Å.

[0065] The second buffer layer 103 includes a SiOx film layer with a thickness of 3000 Å to 6000 Å.

[0066] The connecting metal layer 105 includes at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer 105 is 1000 Å to 3000 Å.

[0067] The thickness of the first organic layer 101 is 10 μm to 20 μm, and the thickness of the second organic layer 104 is 5 μm to 8 μm.

[0068] In conjunction with the above implementation methods, continue to refer to Figure 3A The preparation method further includes: S300: attaching a polarizing layer 30, an optically transparent adhesive layer 40 and a cover glass 50 sequentially on top of the encapsulation layer.

[0069] refer to Figure 5 The structure includes a substrate 10 comprising a first organic layer 101, a first buffer layer 102, a connecting metal layer 105, a second buffer layer 103, and a second organic layer 104. One side of the substrate 10 includes an array film layer 210, an OLED film layer 220, and an encapsulation layer stacked sequentially. Along the direction away from the substrate 10, a polarizing layer 30, an optically transparent adhesive layer 40, and a cover glass 50 are stacked on top of the encapsulation layer.

[0070] Based on the structure obtained in the previous preparation steps, the first organic layer 101 and the second organic layer 104 are made of polyimide, and the first buffer layer 102 and the second buffer layer 103 are inorganic layers.

[0071] The first buffer layer 102 includes a SiOx film layer and an amorphous silicon film layer. The SiOx film layer and the amorphous silicon film layer are stacked sequentially along the direction from the substrate 10 to the display panel 20. The thickness of the SiOx film layer is 3000Å ​​to 6000Å, and the thickness of the amorphous silicon film layer is 20Å to 40Å.

[0072] The second buffer layer 103 includes a SiOx film layer with a thickness of 3000 Å to 6000 Å.

[0073] The connecting metal layer 105 includes at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer 105 is 1000 Å to 3000 Å.

[0074] The thickness of the first organic layer 101 is 10 μm to 20 μm, and the thickness of the second organic layer 104 is 5 μm to 8 μm.

[0075] Along the direction away from the substrate 10, the encapsulation layer is provided with a first sub-encapsulation layer 201, a second sub-encapsulation layer 202 and a third sub-encapsulation layer 203 stacked in sequence. The first sub-encapsulation layer 201 is an inorganic encapsulation layer, including at least one of SiOx or SiNx, and has a thickness of 0.5μm to 1μm.

[0076] The second sub-encapsulation layer 202 is an organic encapsulation layer, including at least one of epoxy acrylate, polyurethane acrylate, and polyester acrylate, with a thickness of 1μm to 20μm, preferably 10μm, and is formed by inkjet printing, which is also the IJP layer in the display panel 20.

[0077] The third sub-encapsulation layer 203 is an inorganic encapsulation layer, including at least one of SiOx or SiNx, with a thickness of 30nm to 0.5μm.

[0078] In conjunction with the above implementation methods, continue to refer to Figure 3A The preparation method further includes: S400: exposing the connecting metal layer 105 by laser etching in the first connection region T1 domain on the second side of the substrate 10 to form a first connection structure 601, wherein the metal of the connecting metal layer 105 in the region where the first connection structure 601 is located is isolated from the metal of other regions of the connecting metal layer 105.

[0079] refer to Figure 6A and Figure 6B The metal connecting the metal layer 105 in other locations is hidden in the figure. Figure 6BThe graphic structure of the first connection structure 601 in the other figures is for the purpose of showing that it is connected to the metal layer of the array film layer 210 through the via and extends towards the array film layer 210. In the subsequent preparation process, the connection metal layer 105, which is not related to the purpose of the present invention, will no longer be shown in the structural model diagram. Figure 6B The structure shown includes a first organic layer 101, a first buffer layer 102, a connecting metal layer 105 (the portion outside the area of ​​the first connecting structure 601 is not shown), a second buffer layer 103, a substrate 10 of the second organic layer 104, an array film layer 210, an OLED film layer 220 and an encapsulation layer stacked sequentially along the direction away from the substrate 10, a polarizing layer 30, an optically transparent adhesive layer 40 and a cover glass 50 stacked sequentially above the encapsulation layer, and a first connecting structure 601 formed by laser etching on the other side of the substrate 10.

[0080] In conjunction with the above implementation methods, continue to refer to Figure 3A The preparation method further includes, S410: the second connection region T2 domain on the second side of the substrate 10 is laser etched to expose the second organic layer 104 to form an interlocking groove. The bottom of the interlocking groove is provided with an etched reinforcing structure. The cross-sectional area of ​​the reinforcing structure gradually increases along the direction away from the display panel 20. The orthogonal projections of the first connection region T1 domain and the second connection region T2 domain on the substrate 10 do not overlap.

[0081] refer to Figure 7A and Figure 7B The structure shown, based on the structure obtained in the previous preparation step, further includes an interlocking groove and a reinforcing structure formed at the bottom of the interlocking groove. The reinforcing structure is not limited to a trapezoidal shape; as long as it is "smaller at the top and larger at the bottom" to enhance the adhesive bonding force, it is acceptable. In some embodiments, multiple isosceles trapezoidal reinforcing structures are simple to prepare and provide significant improvement. For example, refer to... Figure 8A and Figure 8B To enhance the structural area, a top-view magnified view is provided, showing the representation of multiple congruent isosceles trapezoidal reinforcement structures and multiple unequal isosceles trapezoidal reinforcement structures. The number, spacing, and size of the reinforcement structures can be adjusted and determined according to the actual structural parameters.

[0082] In this step, the reinforcing structure is formed by etching the second organic layer 104, and the height of the reinforcing structure is 3μm to 6μm. Specifically, the reinforcing structure is a plurality of mutually spaced trapezoids, the base angle of the trapezoids is 40° to 80°, and the trapezoids are isosceles trapezoids.

[0083] In conjunction with the above implementation methods, continue to refer to Figure 3AThe preparation method further includes, S500: filling the fitting groove with adhesive, attaching a flip-chip film 60 in the area where the adhesive is located, curing the adhesive to form an adhesive structure 605, the flip-chip film 60 integrating at least part of the display driver chip, and the exposed part of the flip-chip film 60 being provided with a second connection structure 602 electrically connected to the driver chip.

[0084] refer to Figure 9A , Figure 9B and Figure 10 The structure shown includes the previously prepared structure, adhesive filling the fitting groove, a flip-chip film 60 attached to the fitting groove, and an adhesive structure 605 formed by the cured adhesive. The adhesive structure 605 fixes the flip-chip film 60 to the fitting groove. By creating the fitting groove on the substrate 10, the flip-chip film 60 is at least partially located in the fitting groove. Through proper configuration, the assembly height of the flip-chip film 60 can be reduced by at least half, that is, the overlap difference between the first connecting structure 601 and the second connecting structure 602 can be significantly reduced. Specifically, before attaching the flip-chip film 60 to the fitting groove, the bonding between the flexible circuit board 70FPC and the flip-chip film 60 is completed first.

[0085] In conjunction with the above implementation methods, continue to refer to Figure 3A The preparation method further includes, S600: applying silver paste to electrically connect the first connecting structure 601 and the second connecting structure 602, and laser sintering to solidify the silver paste to form a third connecting structure 603, one end of the third connecting structure 603 being in contact with the first connecting structure 601 and the other end being in contact with the second connecting structure 602.

[0086] refer to Figure 11 The structure shown includes, in addition to, the previously prepared structure, a flip-chip thin film 60 and a third connecting structure 603 attached to the interlocking groove. One end of the third connecting structure 603 is in contact with the first connecting structure 601, and the other end is in contact with the second connecting structure 602.

[0087] Based on the structure obtained in the previous preparation steps, the structure obtained in this step includes a first organic layer 101, a first buffer layer 102, a connecting metal layer 105, a second buffer layer 103, and a second organic layer 104. One side of the substrate 10 includes an array film layer 210, an OLED film layer 220, and an encapsulation layer stacked sequentially. Along the direction away from the substrate 10, a polarizing layer 30, an optically transparent adhesive layer 40, and a cover glass 50 are stacked on top of the encapsulation layer.

[0088] The first organic layer 101 and the second organic layer 104 are made of polyimide, while the first buffer layer 102 and the second buffer layer 103 are inorganic layers.

[0089] The first buffer layer 102 includes a SiOx film layer and an amorphous silicon film layer. The SiOx film layer and the amorphous silicon film layer are stacked sequentially along the direction from the substrate 10 to the display panel 20. The thickness of the SiOx film layer is 3000Å ​​to 6000Å, and the thickness of the amorphous silicon film layer is 20Å to 40Å.

[0090] The second buffer layer 103 includes a SiOx film layer with a thickness of 3000 Å to 6000 Å.

[0091] The connecting metal layer 105 includes at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer 105 is 1000 Å to 3000 Å.

[0092] The thickness of the first organic layer 101 is 10 μm to 20 μm, and the thickness of the second organic layer 104 is 5 μm to 8 μm.

[0093] Along the direction away from the substrate 10, the encapsulation layer is provided with a first sub-encapsulation layer 201, a second sub-encapsulation layer 202 and a third sub-encapsulation layer 203 stacked in sequence. The first sub-encapsulation layer 201 is an inorganic encapsulation layer, including at least one of SiOx or SiNx, and has a thickness of 0.5μm to 1μm.

[0094] The second sub-encapsulation layer 202 is an organic encapsulation layer, including at least one of epoxy acrylate, polyurethane acrylate, and polyester acrylate, with a thickness of 1μm to 20μm, preferably 10μm, and is formed by inkjet printing, which is also the IJP layer in the display panel 20.

[0095] The third sub-encapsulation layer 203 is an inorganic encapsulation layer, including at least one of SiOx or SiNx, with a thickness of 30nm to 0.5μm.

[0096] Along the direction of the substrate 10, a polarizing layer 30, an optically transparent adhesive layer 40, and a cover glass 50 are stacked on top of the encapsulation layer.

[0097] In conjunction with the above implementation methods, continue to refer to Figure 3A The preparation method further includes, S700: applying a protective adhesive to form a protective structure 606, the protective structure 606 covering the first connecting structure 601, the second connecting structure 602 and the third connecting structure 603.

[0098] refer to Figure 12 The structure shown includes, in addition to, the previously prepared structure, a protective structure 606 covering the first connecting structure 601, the second connecting structure 602, and the third connecting structure 603.

[0099] Combining the above preparation method, a display module 100 with the following structure can be obtained. (Continue to refer to...) Figure 2 or Figure 12The display module 100 includes a display panel 20, a substrate 10, and an array film layer. The substrate 10 is sequentially stacked with a first organic layer 101, a first buffer layer 102, a connecting metal layer 105, a second buffer layer 103, and a second organic layer 104. The array film layer 210 is located on a first side of the substrate 10. On the second side facing the substrate 10, a first connection structure 601 is provided on the substrate 10. The first connection structure 601 is formed by the connecting metal layer 105 and is electrically connected to the array film layer 210. A fitting groove is provided on the second side of the substrate 10, with its bottom located on the second organic layer 104, and a reinforcing structure is provided at the bottom of the fitting groove. A flip-chip film 60 is provided, in which at least a portion of the display driver chip is integrated. An adhesive structure 605 is provided between the flip-chip film 60 and the reinforcing structure, and the flip-chip film 60 is disposed in the fitting groove through the adhesive structure 605. The cross-sectional area of ​​the reinforcing structure gradually increases along the direction away from the display panel 20 from the substrate 10. The flip-chip film 60 is provided with a second connection structure 602 that is electrically connected to the driver chip. The first connection structure 601 and the second connection structure 602 are electrically connected via a third connection structure 603. By fixing the flip-chip film 60 in the fitting groove, the display module 100 effectively reduces the overlap height difference of the third connection structure 603, which can effectively solve reliability problems such as the breakage of the overlap line caused by a large segment difference.

[0100] In the display module 100, the first organic layer 101 and the second organic layer 104 are made of polyimide, and the first buffer layer 102 and the second buffer layer 103 are inorganic layers.

[0101] Specifically, the first buffer layer 102 is composed of a SiOx film layer and an amorphous silicon film layer. Along the direction from the substrate 10 to the display panel 20, the SiOx film layer and the amorphous silicon film layer are stacked in sequence, wherein the thickness of the SiOx film layer is 6000 Å and the thickness of the amorphous silicon film layer is 30 Å.

[0102] Specifically, the second buffer layer 103 is a SiOx film with a thickness of 5000 Å.

[0103] Specifically, the connecting metal layer 105 is at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer 105 is 1000 Å to 4000 Å, preferably 2500 Å.

[0104] Specifically, the first organic layer 101 has a thickness of 20 μm, and the second organic layer 104 has a thickness of 8 μm.

[0105] Specifically, the third connection structure 603 is a silver paste bridging structure. One end of the third connection structure 603 is in contact with the first connection structure 601, and the other end is in contact with the second connection structure 602. The first connection structure 601 is the connection pad of the display panel 20, the second connection structure 602 is the connection pad of the flip-chip film 60, and the third connection structure 603 is the bridging line formed by laser sintering and curing after silver paste is applied.

[0106] Specifically, the reinforcing structure and the second organic layer 104 are made of the same material, and the height of the reinforcing structure is preferably 4μm.

[0107] Specifically, the display panel 20 includes a display area and a non-display area, with a fitting groove located in the display area and a first connecting structure 601 located in the non-display area.

[0108] Specifically, the reinforcing structure at the bottom of the fitting groove is trapezoidal with a base angle of 60°. There are multiple reinforcing structures that are spaced apart from each other, and the trapezoids are isosceles trapezoids.

[0109] Specifically, the adhesive structure 605 is formed by curing adhesive that fills the fitting groove. The adhesive has a thickness of 6 μm and is a pressure-sensitive adhesive.

[0110] Specifically, the display module 100 further includes: an OLED film layer 220 located on the side of the array film layer 210 away from the substrate 10; an encapsulation layer located on the side of the OLED film layer 220 away from the substrate 10; an optically transparent adhesive layer 40 located on the side of the encapsulation layer away from the substrate 10; and a glass cover plate located on the side of the optically transparent adhesive layer 40 away from the substrate 10.

[0111] Specifically, along the direction away from the substrate 10, the encapsulation layer is provided with a first sub-encapsulation layer 201, a second sub-encapsulation layer 202 and a third sub-encapsulation layer 203 stacked in sequence. The first sub-encapsulation layer 201 is a SiOx inorganic encapsulation layer with a thickness of 1μm.

[0112] Specifically, the second sub-encapsulation layer 202 is an epoxy acrylate organic encapsulation layer with a thickness of 10μm, formed by inkjet printing, which is also the IJP layer in the display panel 20.

[0113] Specifically, the third sub-encapsulation layer 203 is a SiNx inorganic encapsulation layer with a thickness of 100nm.

[0114] In the display module provided by the present invention, by forming an interlocking groove on the side of the substrate away from the display panel to accommodate and fix the flip-chip film, the connection height difference between the connecting metal on the flip-chip film and the connecting metal on the display panel is reduced, thereby reducing the risk of silver paste overlap breakage. The first connection structure located on the back of the display panel is electrically connected to the array film layer through a via. The first connection structure is electrically connected to the second connection structure on the flip-chip film with integrated driver chip, so that the display module provided by the present invention achieves a borderless display effect. In addition, a trapezoidal reinforcement structure is provided at the bottom of the interlocking groove to improve the reliability of the module.

[0115] In other embodiments of the present invention, a display device 200 is also provided, such as... Figure 13 As shown, the display device includes the display module 100 provided in any embodiment of the present invention. Therefore, the display device provided in the embodiments of the present invention also has the beneficial effects described in any of the above embodiments. Figure 13 This is a schematic diagram of the structure of a display device 200 provided in an embodiment of the present invention, with reference to... Figure 13 The display device 200 is the application terminal of the display module 100 provided by the present invention, and may include, but is not limited to, the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, vehicle display, medical equipment, industrial control equipment, touch interactive terminal, etc. The embodiments of the present invention do not make any special limitations on this.

[0116] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display module, characterized by include: The display panel includes a substrate and an array of film layers. The substrate includes a first organic layer and a second organic layer connected to a metal layer, which are stacked sequentially. The substrate has a first connection structure on the light-emitting side away from the display panel. The first connection structure is formed by patterning the connection metal layer and is electrically connected to the array film layer. An interlocking groove is disposed on the light-emitting side of the substrate away from the display panel, the bottom of the interlocking groove is located in the second organic layer, and a reinforcing structure is provided at the bottom of the interlocking groove; A flip-chip film, in which at least a portion of the display driver chip is integrated, is provided with an adhesive structure between the flip-chip film and the reinforcing structure, and the flip-chip film is disposed in the fitting groove through the adhesive structure; wherein... Along the direction away from the display panel on the substrate, the cross-sectional area of ​​the reinforcing structure gradually increases; and a second connection structure electrically connected to the driving chip is provided on the flip-chip film. Along the direction away from the display panel on the substrate, the second connection structure protrudes from the first organic layer, and the first connection structure and the second connection structure are electrically connected through a third connection structure.

2. The display module according to claim 1, characterized in that, The substrate further includes a first buffer layer and a second buffer layer stacked between the first organic layer and the second organic layer, and the connecting metal layer is located between the first buffer layer and the second buffer layer; wherein... The first organic layer and the second organic layer are made of polyimide, and the first buffer layer and the second buffer layer are inorganic layers. Preferably, the first buffer layer includes a SiOx film layer and an amorphous silicon film layer, which are arranged along the direction from the substrate to the display panel. The SiOx film layer and the amorphous silicon film layer are stacked sequentially, wherein the thickness of the SiOx film layer is 3000Å ​​to 6000Å and the thickness of the amorphous silicon film layer is 20Å to 40Å. Preferably, the second buffer layer comprises a SiOx film layer with a thickness of 3000 Å to 6000 Å; Preferably, the connecting metal layer comprises at least one of molybdenum or titanium, aluminum, and titanium, and the thickness of the connecting metal layer is 1000 Å to 3000 Å. Preferably, the thickness of the first organic layer is 10 μm to 20 μm, and the thickness of the second organic layer is 5 μm to 8 μm.

3. The display module according to claim 2, characterized in that, The third connection structure is a silver paste bridging structure, with one end of the third connection structure in contact with the first connection structure and the other end in contact with the second connection structure; The reinforcing structure is made of the same material as the second organic layer; Preferably, the reinforcing structure is formed by etching the second organic layer, and the height of the reinforcing structure is 3μm to 6μm.

4. The display module according to claim 1, characterized in that, The display panel includes a display area and a non-display area, and the second connection structure is located in the display area; The reinforcing structure is trapezoidal, and the base angle of the trapezoid is 40° to 80°; Preferably, the trapezoid is an isosceles trapezoid.

5. The display module according to claim 1, characterized in that, The adhesive structure is formed by curing the adhesive filled in the fitting groove, wherein the thickness of the adhesive is 5µm < H ≤ 10µm; Preferably, the adhesive includes at least one of single / two-component epoxy adhesive, UV-curable structural adhesive, silicone structural adhesive, pressure-sensitive adhesive, and hot melt adhesive.

6. The display module of any one of claims 1-5, wherein, Also includes: The OLED film layer is located on the side of the array film layer away from the substrate; The encapsulation layer is located on the side of the OLED film layer away from the substrate; An optically transparent adhesive layer is located on the side of the encapsulation layer away from the substrate; A glass cover plate is located on the side of the optically transparent adhesive layer away from the substrate; wherein... Along the direction away from the substrate, the encapsulation layer is sequentially stacked with a first sub-encapsulation layer, a second sub-encapsulation layer, and a third sub-encapsulation layer. The first sub-encapsulation layer is an inorganic encapsulation layer, including at least one of SiOx or SiNX, with a thickness of 0.5 μm to 1 μm. The second sub-encapsulation layer is an organic encapsulation layer, including at least one of epoxy acrylate, polyurethane acrylate, and polyester acrylate, with a thickness of 1 μm to 20 μm. The third sub-encapsulation layer is an inorganic encapsulation layer, including at least one of SiOx or SiNX. Preferably, the second sub-encapsulation layer is formed by inkjet printing.

7. A method for manufacturing a display module, characterized in that, include: A substrate is provided, the substrate comprising a first organic layer, a first buffer layer, a connecting metal layer, a second buffer layer, and a second organic layer; A display panel is fabricated on a first side of the substrate. The display panel includes an array film layer, an OLED film layer, and an encapsulation layer sequentially stacked along a direction away from the substrate. The array film layer is electrically connected to the connecting metal layer located in the substrate through a via. A polarizing layer, an optically transparent adhesive layer, and a cover glass are sequentially attached above the encapsulation layer. A first connection structure is formed by laser etching in a first connection region on the second side of the substrate to expose the connection metal layer, wherein the metal of the connection metal layer in the region where the first connection structure is located is isolated from the metal of other regions of the connection metal layer. A second connection region on the second side of the substrate is laser-etched to expose the second organic layer and form an interlocking groove. The bottom of the interlocking groove is provided with an etched reinforcing structure. The cross-sectional area of ​​the reinforcing structure gradually increases in the direction away from the display panel. The orthographic projections of the first connection region and the second connection region on the substrate do not overlap.

8. The preparation method according to claim 7, characterized in that, Also includes: The fitting groove is filled with adhesive, a flip-chip film is attached to the area where the adhesive is located, and the adhesive is cured to form an adhesive structure. The flip-chip film encapsulates at least a portion of the display driver chip, and the exposed portion of the flip-chip film is provided with a second connection structure that is electrically connected to the driver chip. Applying silver paste electrically connects the first connection structure and the second connection structure. Laser sintering solidifies the silver paste to form a third connection structure, with one end of the third connection structure in contact with the first connection structure and the other end in contact with the second connection structure. A protective adhesive is applied to form a protective structure that covers the first connecting structure, the second connecting structure, and the third connecting structure.

9. The preparation method according to claim 8, characterized in that, The first organic layer and the second organic layer are made of polyimide, and the first buffer layer and the second buffer layer are inorganic layers. The first buffer layer includes a SiOx film layer and an amorphous silicon film layer, which are arranged along the direction from the substrate to the display panel. The SiOx film layer and the amorphous silicon film layer are stacked sequentially, wherein the thickness of the SiOx film layer is 3000Å ​​to 6000Å and the thickness of the amorphous silicon film layer is 20Å to 40Å. The second buffer layer includes a SiOx film layer with a thickness of 3000 Å to 6000 Å; The connecting metal layer includes at least one of molybdenum or titanium aluminum titanium, and the thickness of the connecting metal layer is 1000 Å to 3000 Å. The thickness of the first organic layer is 10 μm to 20 μm, and the thickness of the second organic layer is 5 μm to 8 μm; Along the direction away from the display panel from the substrate, the second connection structure protrudes from the first organic layer; The reinforcing structure is formed by etching the second organic layer, and the height of the reinforcing structure is 3μm to 6μm; preferably, the reinforcing structure is trapezoidal, and the base angle of the trapezoid is 40° to 80°; more preferably, the trapezoid is an isosceles trapezoid.

10. A display device, characterized in that, The display device includes a display module as described in any one of claims 1-6, or a display module prepared by the preparation method as described in any one of claims 7-9.

Images