Display device, method of manufacturing display device, and electronic device

Abstract

The present disclosure relates to a display apparatus, a method of manufacturing a display apparatus, and an electronic apparatus. The display apparatus includes a substrate including a first surface and a second surface opposite the first surface; a light emitting apparatus disposed on the first surface in a display area, wherein the light emitting apparatus emits light; a metal film disposed on the second surface and overlapping at least a portion of the second surface in a plan view; and an insulating layer disposed above the second surface and covering the metal film, wherein the metal film includes a non-magnetic material.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2025-0021061, filed on February 18, 2025, and all benefits arising therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] Various embodiments of this disclosure relate to display devices, methods of manufacturing display devices, and electronic devices. Background Technology

[0003] With the development of multimedia, display devices have become increasingly important. In response, various types of display devices, such as organic light-emitting diodes (OLEDs) and liquid crystal displays (LCDs), are widely used in various fields.

[0004] Display devices may include pixels. Light-emitting devices included in each pixel may include electrodes spaced apart from each other and an emitting layer disposed between the electrodes. The electrodes and emitting layers may be formed in various ways, and the deposition method for the electrodes or emitting layers may be a method of depositing a deposition material on the surface to be deposited using a mask (e.g., a fine metal mask (FMM)). Summary of the Invention

[0005] Embodiments of this disclosure provide a display device with improved display quality, a method for manufacturing the display device, and an electronic device. Specifically, embodiments of this disclosure provide a display device and a method for manufacturing the display device, wherein the display device is manufactured using a deposition apparatus and the risks caused by mask adhesion to the substrate during the deposition process are reduced.

[0006] A display device according to an embodiment of the present disclosure includes: a substrate including a first surface and a second surface opposite to the first surface; a light-emitting device disposed on the first surface in a display area, wherein the light-emitting device emits light; a metal film disposed on the second surface and overlapping at least a portion of the second surface in a plan view; and an insulating layer disposed above the second surface and covering the metal film, wherein the metal film comprises a non-magnetic material.

[0007] In this implementation, the metal film may overlap with the display area in the plan view.

[0008] In an implementation, the metal film may overlap with the non-display area surrounding the display area in a plan view.

[0009] In an implementation, the display area may include an emission area corresponding to the light-emitting device, and the metal film may overlap with at least one of the emission areas in a plan view.

[0010] In an embodiment, the metal film may have a thickness greater than or equal to about 10 nanometers (nm) and less than or equal to about 10 micrometers (μm).

[0011] A method for manufacturing a display device according to another embodiment of the present disclosure includes: forming a metal film on a second surface of a substrate; forming an insulating layer above the second surface of the substrate to cover the metal film; forming a backplate structure on a first surface of the substrate opposite to the second surface; arranging the second surface of the substrate adjacent to a magnet assembly; arranging the first surface of the substrate adjacent to a mask; and depositing a deposition material from a deposition source on the first surface of the substrate through the mask.

[0012] In some embodiments, the metal film may include a non-magnetic material.

[0013] In one implementation, the metal film may overlap with the display area of ​​the display device in a plan view.

[0014] In an implementation, the metal film may overlap with the non-display area arranged around the display area of ​​the display device in a plan view.

[0015] In one embodiment, the area where the deposited material is deposited may correspond to the emitting area of ​​the display device, and the metal film may overlap with at least one of the emitting areas in the plan view.

[0016] In an embodiment, the metal film may have a thickness greater than or equal to about 10 nm and less than or equal to about 10 μm.

[0017] In one embodiment, during the process of arranging the second surface of the substrate adjacent to the magnet assembly, the magnet assembly and the substrate can be arranged adjacent to each other and an electrostatic chuck can be inserted therebetween.

[0018] In this implementation, the metal film can shield the electric field generated by the electrostatic chuck.

[0019] In one embodiment, the magnet assembly may include a yoke and a magnetic field forming portion disposed on the yoke, wherein the magnetic field forming portion forms a magnetic field.

[0020] In some implementations, the mask may include a fine metal mask.

[0021] In one implementation, the backsheet structure can be formed after the metal film and the insulating layer are formed.

[0022] In one implementation, the backplane structure can be formed before the metal film and the insulating layer are formed.

[0023] An electronic device according to another embodiment of the present disclosure includes: a processor; and a display device including pixels that display an image under the control of the processor. In such an embodiment, the display device includes: a substrate including a first surface and a second surface opposite to the first surface; a light-emitting device disposed on the first surface in a display area, wherein the light-emitting device emits light; a metal film disposed on the second surface and overlapping at least a portion of the second surface in a plan view; and an insulating layer disposed above the second surface and covering the metal film, wherein the metal film comprises a non-magnetic material. Attached Figure Description

[0024] Figure 1 This is a schematic cross-sectional view of a deposition apparatus according to an embodiment of the present disclosure.

[0025] Figure 2 This illustrates the application of substances during the deposition process, including those included in the deposition process. Figure 1 A diagram of the external forces acting on the mask in the deposition equipment.

[0026] Figures 3 to 7 This is a perspective view showing an example of a display device that is to be subjected to... Figure 1 The deposited objects of the deposition equipment.

[0027] Figure 8 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0028] Figure 9 This is a flowchart illustrating a method for manufacturing a display device according to another embodiment of the present disclosure.

[0029] Figure 10 This is a schematic plan view of a display device manufactured by a method for manufacturing a display device according to an embodiment of the present disclosure.

[0030] Figure 11 yes Figure 10 A schematic cross-sectional view of the display panel.

[0031] Figure 12 yes Figure 10 A schematic planar diagram of pixels.

[0032] Figure 13 This is a block diagram of an electronic device according to embodiments of the present disclosure.

[0033] Figure 14 Schematic diagrams of electronic devices according to various embodiments are shown. Detailed Implementation

[0034] The invention will now be described more fully with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals throughout refer to the same elements.

[0035] It will be understood that when a component is referred to as being "on" another component, it can be directly on the other component, or there can be an intervening component between them. Conversely, when a component is referred to as being "directly on" another component, there is no intervening component. Throughout the specification, in cases where a component is "connected" to another component, the component can be "directly connected," or the component can be "indirectly connected" with another component inserted between it.

[0036] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. Thus, reference to “a” element following “the” element in a claim includes one element and multiple elements. For example, “a single element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. “At least one of X, Y, and Z” and “selected from at least one of X, Y, and Z” can be construed as only X, only Y, only Z, or any combination of two or more of X, Y, and Z (e.g., XYZ, XY, YZ, and XZ). It will also be understood that when the terms “comprising” and / or “including” or “containing” and / or “comprise” are used in this specification, they specify the presence of the stated features, areas, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components and / or groups thereof.

[0038] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship of one element to another, as illustrated in the accompanying drawings. It will be understood that, in addition to the orientations shown in the drawings, the relative terms are intended to also include different orientations of the devices in use. For example, if a device in one of the drawings is flipped, an element described as being “down” to other elements will be oriented “up” to other elements. Thus, the term “down” can include both “down” and “up” orientations, depending on the specific orientation of the drawing. Similarly, if a device in one of the drawings is flipped, an element described as being “below” or “under” other elements will be oriented “above” to other elements. Thus, the term “below” or “under” can include both “up” and “down” orientations.

[0039] Taking into account the measurements discussed and the errors associated with the measurement of specific quantities (i.e., limitations of the measurement system), the terms “about” or “approximately” as used herein include the stated values ​​and the average value within an acceptable range of deviation from the specific values ​​as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0040] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as they have in the context of the relevant art and this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0041] Embodiments are described herein with reference to illustrative cross-sectional views as idealized embodiments. Thus, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but should include, for example, deviations in shape due to manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate precise shapes of the regions and are not intended to limit the scope of the claims.

[0042] Figure 1 This is a schematic cross-sectional view of a deposition apparatus DED according to an embodiment of the present disclosure.

[0043] refer to Figure 1 Implementations of a deposition apparatus (DED) may include a chamber (CHM), a deposition source (DES), an electrostatic chuck (ESC), and a magnet assembly (MAS).

[0044] The chamber CHM can provide an internal space INS, and the deposition process can be performed within the internal space INS of the chamber CHM. In an embodiment, for example, the support member SUP, electrostatic chuck ESC, actuator DPT, connecting member CNM, yoke YOP, magnetic field forming part MP, deposition source DES, and transfer rod ML of transfer part DM can be arranged in the internal space INS of the chamber CHM.

[0045] Despite Figure 1 Although not shown, the chamber CHM can be configured to be at least partially open. According to an embodiment, the open portion of the chamber CHM can be opened or closed (shielded) by a gate valve or the like.

[0046] The deposition source DES can be arranged within the internal space INS of the chamber CHM. The deposition source DES can store the deposition material OLM within it. The deposition source DES can spray the deposition material OLM in a direction toward the mask FMM and the substrate SUB. In an embodiment, for example, the deposition source DES can spray a deposition material OLM comprising at least one selected from organic materials, inorganic materials, and conductive materials in the direction toward the mask FMM. Although in Figure 1 Not shown, but the deposition apparatus DED may also include a conveying device (or, for example, a moving unit such as a linear stage, a stage system, a robotic arm, or a rotary / linear combination stage) for moving the deposition source DES in a horizontal direction (e.g., a first direction DR1 or a second direction DR2).

[0047] The support member SUP can support and fix the mask FMM. In addition, the support member SUP can raise and lower the mask FMM within a predetermined distance range, or rotate the mask FMM within a predetermined angle range.

[0048] The mask FMM can be arranged and fixed on the support member SUP. During the deposition process, the mask FMM can be adjacent to the substrate SUB. The mask FMM can be positioned between the deposition source DES and the substrate SUB to guide the deposition of the deposition material OLM on the desired area of ​​the substrate SUB. In an embodiment, the deposition material OLM deposited on the substrate SUB can be configured as an emitting layer included in the light-emitting device of the display device. Therefore, the area on the substrate SUB where the deposition material OLM is deposited can correspond to the emitting area of ​​the display device.

[0049] In some implementations, for example, the mask FMM may include a fine metal mask. Furthermore, the mask FMM may have openings through which the deposited material OLM can pass, and the mask FMM may include multiple frames surrounding or defining the openings.

[0050] A substrate SUB can be disposed on a mask FMM. The substrate SUB can be a base substrate on which a deposition material OLM is deposited. The substrate SUB can include a first surface S1 and a second surface S2 opposite to the first surface S1. The deposition material OLM can be deposited on the first surface S1 of the substrate SUB through the mask FMM. Therefore, the deposition material OLM can be deposited in the region overlapping with the opening of the mask FMM. A pattern formed by the deposition material OLM can be formed on the first surface S1 of the substrate SUB.

[0051] A metal film MTF and an insulating layer ISL can be disposed above a substrate SUB. In one embodiment, for example, a metal film MTF comprising a non-magnetic material can be disposed on a second surface S2 of the substrate SUB. The insulating layer ISL can cover the metal film MTF on the second surface S2 of the substrate SUB. The insulating layer ISL can be disposed on the metal film MTF. The second surface S2 can be a surface opposite to the first surface S1 of the substrate SUB on which the deposited material OLM is deposited. The metal film MTF and the insulating layer ISL can be disposed between the substrate SUB and the electrostatic chuck ESC.

[0052] As display devices undergoing deposition in a deposition apparatus (DED) become larger, the dimensions of the substrate sub-block (SUB) and the mask frame-mounted mirror (FMM) also increase, potentially exacerbating warpage of the substrate SUB and FMM. In some implementations, the deposition apparatus (DED) may include an electrostatic chuck (ESC) to reduce or mitigate this warpage.

[0053] This electrostatic chuck (ESC) can be positioned above the second surface S2 of the substrate SUB. The ESC can be positioned between the substrate SUB and the magnet assembly MAS. During the deposition process, the ESC can be coupled to the substrate SUB to align the substrate SUB at a predetermined location and effectively prevent or substantially mitigate movement of the substrate SUB. Furthermore, the ESC effectively prevents or substantially mitigates gas leakage between the ESC and the substrate SUB, and effectively prevents or substantially mitigates the substrate SUB being lifted by gas.

[0054] An electrostatic chuck (ESC) may include a plurality of electrodes (MGS) arranged within the ESC. The plurality of electrodes (MGS) may include at least one first electrode and at least one second electrode. The at least one first electrode may have a first polarity, and the at least one second electrode may have a second polarity opposite to the first polarity. In embodiments, for example, the first polarity may be positive (+), and the second polarity may be negative (-), but is not limited thereto. In embodiments, for example, the first polarity may be negative (-), and the second polarity may be positive (+).

[0055] The driver DPT can drive the electrostatic chuck ESC. In one embodiment, for example, the driver DPT can be connected to and drive the electrostatic chuck ESC via a connecting member CNM. In another embodiment, for example, a power source is included in the driver DPT, and the power source of the driver DPT can be electrically connected to a first electrode and a second electrode included in the electrostatic chuck ESC via the connecting member CNM.

[0056] When power from the driver DPT is applied to the electrostatic chuck ESC, an electric field can be formed in the region surrounding the electrostatic chuck ESC. In one embodiment, for example, an electric field can be formed around the electrostatic chuck ESC by applying a predetermined voltage to the first and second electrodes of the electrostatic chuck ESC using power from the driver DPT. Therefore, the electric field can bring the substrate SUB and the mask FMM into close contact (or adhere) to each other. In another embodiment, for example, the electric field formed by the electrostatic chuck ESC can pull the substrate SUB and the mask FMM in a direction toward the electrostatic chuck ESC (e.g., third direction DR3). However, when the metal film MTF and the insulating layer ISL are arranged between the substrate SUB and the electrostatic chuck ESC, the electric field formed by the electrostatic chuck ESC may not affect the mask FMM below the substrate SUB. Therefore, the electric field formed by the electrostatic chuck ESC can pull the metal film MTF, the insulating layer ISL, and the substrate SUB in a direction toward the electrostatic chuck ESC, but may not pull the mask FMM.

[0057] The magnet assembly MAS can be disposed above the second surface S2 of the substrate SUB. The magnet assembly MAS can be disposed spaced apart from the second surface S2 of the substrate SUB. The electrostatic chuck ESC can be disposed between the magnet assembly MAS and the substrate SUB. The magnet assembly MAS can be raised or lowered in the third direction DR3. In an embodiment, for example, the magnet assembly MAS can be moved adjacent to the substrate SUB during a deposition process.

[0058] The magnet assembly MAS may include a yoke plate YOP and a magnetic field forming section MP.

[0059] The yoke (YOP) may include a plate that guides the path of the magnetic field. In some embodiments, for example, the yoke (YOP) may include a magnetic material, such as stainless steel or the like. However, embodiments are not limited thereto.

[0060] The yoke YOP can be arranged on a plane. The plane on which the yoke YOP is arranged can be defined based on a first direction DR1 and a second direction DR2. In an embodiment, for example, at least a portion of the yoke YOP can extend in the first direction DR1, and at least another portion of the yoke YOP can extend in the second direction DR2.

[0061] The magnetic field forming portion MP can be disposed on one surface of the yoke YOP. In one embodiment, for example, the magnetic field forming portion MP can be disposed on one surface of the yoke YOP facing the electrostatic chuck ESC. The magnetic field forming portion MP can be disposed between the yoke YOP and the electrostatic chuck ESC. In one embodiment, for example, the magnetic field forming portion MP can include a magnetic material, including a permanent magnet, an electromagnet, or the like. However, the embodiments are not limited thereto.

[0062] The magnet assembly (MAS) can generate a magnetic field. Therefore, the magnetic field can bring the substrate (SUB) and the mask (FMM) into close contact (or adhesion) with each other. In an embodiment, for example, the magnetic field generated by the magnet assembly (MAS) can pull the mask (FMM), which includes metallic material, in a direction toward the magnet assembly (MAS) (e.g., third-direction DR3). Therefore, during the deposition process, the bonding force between the substrate (SUB) and the mask (FMM) can be increased, and sagging of the substrate (SUB) and the mask (FMM) can be effectively prevented or substantially mitigated.

[0063] The transmission section DM can be connected to the magnet assembly MAS. The transmission section DM can include a transmission rod ML and a transmission body MC. The transmission body MC can raise or lower the magnet assembly MAS in a third direction DR3 via the transmission rod ML. In addition, the transmission body MC can rotate the magnet assembly MAS within a predetermined angle range via the transmission rod ML, and can also move linearly in various directions within a predetermined distance range.

[0064] The magnet assembly (MAS) can be arranged to overlap with the electrostatic chuck (ESC) on the third-direction DR3. When the magnetic field generated by the magnet assembly (MAS) and the electric field generated by the electrostatic chuck (ESC) act simultaneously on the mask fMM, the mask fMM and the substrate SUB can be brought into close contact with each other; however, the position of the mask fMM may unintentionally change. In implementations, for example, when the magnetic force generated by the magnetic field and the electrostatic force generated by the electric field act in different directions, or when the strength or direction of these two forces is mismatched, the alignment of the mask fMM on the substrate SUB may differ from the desired or anticipated alignment. Therefore, the relative position of the mask fMM with respect to the substrate SUB may unintentionally change.

[0065] In this implementation, to reduce or mitigate this phenomenon or unintentional change in the position of the mask FMM, the electric field generated by the electrostatic chuck ESC can be shielded by arranging a metal film MTF on the substrate SUB. The mask FMM is arranged on a first surface S1 of the substrate SUB, and the metal film MTF, comprising a non-magnetic material, can be arranged on a second surface S2 of the substrate SUB. The metal film MTF arranged on the second surface S2 of the substrate SUB allows a magnetic field to pass through it, but shields the electric field. Therefore, the metal film MTF allows the magnetic field provided by the magnet assembly MAS to pass through it and shields the electric field provided by the electrostatic chuck ESC. Therefore, the position of the mask FMM can be controlled by the magnetic field of the magnet assembly MAS without being affected by the electric field of the electrostatic chuck ESC, and thus, the relative position of the mask FMM with respect to the substrate SUB can be controlled with high reliability.

[0066] Figure 2 This illustrates the application of substances during the deposition process, including those included in the deposition process. Figure 1 A diagram of the external forces acting on the mask FMM in the DED deposition equipment.

[0067] refer to Figure 1 and Figure 2 In the implementation, the first external force F1, the second external force F2 and the third external force F3 can be applied to the mask FMM and the substrate SUB through the magnet assembly MAS and the electrostatic chuck ESC.

[0068] The magnetic field generated by the magnet assembly MAS can serve as a first external force F1. This first external force F1 can act on the mask FMM, substrate SUB, and electrostatic chuck ESC on the third-direction DR3. In one embodiment, for example, the first external force F1 can be a magnetic force capable of pulling the mask FMM, which includes metallic material, on the third-direction DR3. Furthermore, the first external force F1 can be a magnetic force generated between the plurality of electrodes MGS arranged in the electrostatic chuck ESC and the magnet assembly MAS. In another embodiment, the first external force F1 can be a magnetic force formed by aligning the magnetic moments of the plurality of electrodes MGS with the magnetic field generated by the magnet assembly MAS.

[0069] The electric field generated by the electrostatic chuck ESC can serve as a second external force F2 and a third external force F3. These forces can act on the substrate SUB and the mask FMM on the third-direction DR3. In an embodiment, for example, the second external force F2 and the third external force F3 can be electrostatic forces capable of pulling the substrate SUB and the mask FMM on the third-direction DR3 through the electric field generated by the voltage applied to the electrostatic chuck ESC.

[0070] For the substrate SUB and the mask FMM, the direction in which the first external force F1 is applied can be the same as the direction in which the second external force F2 and the third external force F3 are applied. Therefore, during the deposition process, the bonding force between the substrate SUB and the mask FMM can be increased using the first external force F1, the second external force F2, and the third external force F3, and sagging of the substrate SUB and the mask FMM can be prevented or mitigated. However, when the mask FMM is in close contact with the substrate SUB using the electrostatic force of the electrostatic chuck ESC, and the magnetic force of the magnet assembly MAS is additionally applied, the position of the mask FMM may unintentionally change. In this case, the alignment of the mask FMM and the substrate SUB may be unintentionally altered.

[0071] According to an embodiment, the metal film MTF can be disposed between the substrate SUB and the electrostatic chuck ESC. Therefore, the third external force F3 generated by the electrostatic chuck ESC can be shielded by the metal film MTF. By disposing the metal film MTF, which includes a non-magnetic material, between the substrate SUB and the electrostatic chuck ESC, the first external force F1 generated by the magnet assembly MAS can pass through the metal film MTF, and the third external force F3, one of the second external force F2 and the third external force F3 generated by the electrostatic chuck ESC, can be shielded by the metal film MTF. In the embodiment, as described above, by effectively preventing or substantially mitigating unintentional misalignment of the mask FMM by the third external force F3, the position of the mask FMM can be controlled with relatively high reliability to improve pixel position accuracy (PPA), thereby improving display quality. This may be even more effective in high-resolution display devices and / or precision manufacturing processes where pixel accuracy is critical. The size, position, and / or design of the metal film MTF can be varied or modified, which will be referred to below. Figures 3 to 7 Provide a detailed description.

[0072] Figures 3 to 7 This is a perspective view illustrating an embodiment of a display device, which is to be subjected to... Figure 1 The deposition equipment DED deposits objects.

[0073] refer to Figure 3 The substrate SUB may include a first surface S1 and a second surface S2 that are opposite to each other in its thickness direction or third direction DR3.

[0074] The mask FMM can be disposed on the first surface S1 of the substrate SUB. The mask FMM can be patterned on the first surface S1 of the substrate SUB using a deposited material OLM (see [reference]). Figure 1 The first surface S1 of the substrate SUB can be a surface on which a light-emitting device layer, including a light-emitting device, is disposed. Although in Figures 3 to 7 Not shown, but in subsequent processes, the backplane structure can be arranged on the first surface S1 of the substrate SUB. In embodiments, for example, the backplane structure may include capacitors, various wires, thin-film transistors for driving pixels, or the like.

[0075] refer to Figure 1 and Figure 3The metal film MTF can be disposed on the second surface S2 of the substrate SUB. The metal film MTF comprises a non-magnetic material and can therefore shield the electric field generated by the electrostatic chuck ESC. In an embodiment, for example, the metal film MTF can overlap with the second surface S2 to completely cover the second surface S2 in a planar view (e.g., viewed from the surface defined by the first direction DR1 and the second direction DR2, or viewed from a third direction DR3). However, the embodiment is not limited to this. In an embodiment, for example, the metal film MTF can overlap with at least a portion of the second surface S2 in a planar view.

[0076] The metal film MTF may have a thickness t greater than or equal to about 10 nanometers (nm) and less than or equal to about 10 micrometers (μm). In an embodiment, for example, the shielding efficiency (A) of the metal film MTF is determined based on the thickness t of the metal film MTF, and therefore the thickness t of the metal film MTF can be calculated using Equation 1.

[0077] [Formula 1]

[0078] In Equation 1, L represents the thickness t of the metal film MTF, and δ represents the skin depth, where the skin depth represents the physical distance at which electromagnetic waves can penetrate into the metal film MTF. δ can be calculated using Equation 2.

[0079] [Equation 2]

[0080] In Equation 2, μ1 represents magnetic transmissivity, ω represents angular frequency, and σ1 represents electrical conductivity.

[0081] Therefore, when a metal film MTF with a thickness t greater than or equal to about 10 nm and less than or equal to about 10 μm is arranged on the second surface S2 of the substrate SUB, the magnetic field formed by the magnet assembly MAS can pass through the metal film MTF, and the electric field formed only by the electrostatic chuck ESC can be effectively shielded by the metal film MTF.

[0082] An insulating layer ISL can be disposed on the second surface S2 of the substrate SUB. The insulating layer ISL can be arranged on and cover the metal film MTF. The insulating layer ISL can be arranged on the metal film MTF to provide electrical insulation and physical protection for the metal film MTF. Therefore, the insulating layer ISL can minimize or reduce the impact of other processes on the metal film MTF and effectively prevent or substantially mitigate electrical problems or mechanical damage that may occur during the process.

[0083] In addition to metal film MTF Figures 4 to 7 The implementation methods shown are the same as Figure 3The implementation methods shown are essentially the same. In the following text, details will be omitted or simplified. Figure 4 Any repeated detailed description of the same or similar elements of the embodiments shown, and will be based on the description of the embodiments. Figure 3 The differences in the embodiments shown are described. Figures 4 to 7 The implementation shown is as follows.

[0084] refer to Figure 1 and Figure 4 In one embodiment, the metal film MTF' is disposed on the second surface S2 of the substrate SUB and may overlap with the display area DA. In another embodiment, for example, the metal film MTF' may overlap with the display area DA of the substrate SUB in a planar view (e.g., viewed from a plane defined by the first direction DR1 and the second direction DR2). Furthermore, the metal film MTF' may not overlap with the non-display area NDA of the substrate SUB in a planar view.

[0085] In this implementation, since the metal film MTF' is arranged to overlap with the display area DA, the effect of the electric field of the shielding electrostatic chuck ESC can be concentrated in the display area DA. Therefore, the electrostatic interaction between the substrate SUB and the mask FMM arranged on the first surface S1 of the substrate SUB can be reduced, thereby effectively preventing or mitigating unintentional changes in the position of the mask FMM.

[0086] refer to Figure 1 and Figure 5 In another embodiment, the metal film MTF'' can be disposed on the second surface S2 of the substrate SUB and can overlap with the non-display area NDA. In this embodiment, for example, the metal film MTF'' can overlap with the non-display area NDA of the substrate SUB in a planar view. Furthermore, the metal film MTF'' may not overlap with the display area DA of the substrate SUB in a planar view.

[0087] In this implementation, since the metal film MTF'' is arranged to overlap with the non-display area NDA, the effect of the electric field of the shielding electrostatic chuck ESC can be concentrated in the non-display area NDA. The non-display area NDA is the region where no deposition process is performed, and the effect of the shielding metal film MTF'' on the electric field can be limited. However, the metal film MTF'' overlapping with the non-display area NDA can shield the electric field together with existing metal films (such as electrodes and reflective films) included in the display area DA. Therefore, in this implementation, due to the characteristics of the product, the metal film MTF'' is arranged not to overlap with the display area DA, which can effectively prevent or substantially mitigate unintentional changes in the position of the mask FMM.

[0088] refer to Figure 1 and Figure 6In another embodiment, the metal film MTF''' can be disposed on the second surface S2 of the substrate SUB and can overlap with the emission region EMA included in the display region DA. The emission region EMA can be the region in which the emission layer of the light-emitting device is disposed. The metal film MTF''' can overlap with the opening of the pixel defining layer of the emission region EMA defining the pixel PXL.

[0089] In such an implementation, since the metal film MTF''' overlaps with at least one of the emitting regions EMA, the emission efficiency, along with the effect of shielding the electric field of the electrostatic chuck ESC, can be improved. In this implementation, for example, the metal film MTF''' can be arranged to overlap with the emitting region EMA and protect the light-emitting device from the influence of external electric fields. Furthermore, as described above, the metal film MTF''' shields the electric field, thereby effectively preventing or mitigating unintentional changes in the position of the mask FMM. Additionally, the metal film MTF''' can maintain emission consistency using precise pixel arrangement.

[0090] refer to Figure 1 and Figure 7 In another embodiment, the metal film MTF can be disposed on the second surface S2 of the substrate SUB and can overlap with a plurality of electrodes MGS included in the electrostatic chuck ESC.

[0091] In such an implementation, because the metal film MTF'''' is arranged to overlap with the multiple electrodes MGS of the electrostatic chuck ESC, the metal film MTF'''' can strongly shield the electric field formed by the multiple electrodes MGS of the electrostatic chuck ESC in a specific region. In this implementation, for example, the metal film MTF'''' can be arranged to overlap with the multiple electrodes MGS, and can be placed only in the region where the electric field is to be shielded, and can reduce the impact on the emission region EMA (see [link to implementation]). Figure 6 The impact of ).

[0092] The use of references will be described below. Figures 1 to 7 Implementation of the method for manufacturing a display device using the described deposition equipment.

[0093] Figure 8 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0094] refer to Figure 1 and Figure 8In process S1010, a metal film MTF can be formed on the second surface S2 of the substrate SUB. The substrate SUB may include a first surface S1 and a second surface S2 facing away from each other. The first surface S1 of the substrate SUB is the surface on which an OLM (Optical Material Deposited) material is deposited using a deposition equipment DED (Depth Electrode Deposition) device. A pixel circuit layer, a light-emitting device layer, an encapsulation layer, etc., can be sequentially stacked on the first surface S1 of the substrate SUB. The pixel circuit layer may be included in a backplane structure. The light-emitting device layer may include the emitting layer of the light-emitting device. The encapsulation layer may be disposed on the light-emitting device layer. The second surface S2 of the substrate SUB may be the surface facing the electrostatic chuck ESC and the magnet assembly MAS, and may be facing away from the first surface S1.

[0095] In one embodiment, the metal film MTF can be uniformly formed on the second surface S2 of the substrate SUB. In another embodiment, for example, the metal film MTF can be formed by depositing a non-magnetic material using physical vapor deposition (PVD), chemical vapor deposition (CVD), electroplating, or similar methods. However, the embodiments are not limited to this. In another embodiment, for example, the metal film MTF can be manufactured separately and can be inserted through assembly processes, bonding processes, etc.

[0096] The metal film MTF formed on the second surface S2 of the substrate SUB can have a thickness greater than or equal to about 10 nm and less than or equal to about 10 μm. In an embodiment, for example, the thickness of the metal film MTF can be adjusted by controlling the deposition rate and deposition time.

[0097] Furthermore, the metal film MTF can be patterned according to the characteristics and layout of the display device. In implementations, for example, dry etching or wet etching can be used to pattern the metal film MTF. Figures 4 to 7 As shown, the metal film MTF can be patterned to overlap at least a portion of the second surface S2 of the substrate SUB. In such an embodiment, the metal film MTF can be patterned and overlapped with one of the display area DA, the non-display area NDA, and the emitter area EMA. Subsequently, the metal film MTF is annealed, thereby improving its adhesion and mechanical properties.

[0098] In process S1020, an insulating layer ISL covering the metal film MTF can be formed on the second surface S2 of the substrate SUB. In some embodiments, for example, the insulating layer ISL can be formed directly on the metal film MTF located on the second surface S2 of the substrate SUB. In some embodiments, the insulating layer ISL can be formed, for example, by physical vapor deposition (PVD), chemical vapor deposition (CVD), sol-gel method, or similar methods. However, the embodiments are not limited thereto. The insulating layer ISL can be formed to cover the patterned metal film MTF and include a substantially flat top surface. The insulating layer ISL can protect the patterned metal film MTF, increase mechanical stability, provide electrical insulation, and minimize or reduce the impact of other processes on the metal film MTF.

[0099] In process S1030, a backplane structure can be formed on the first surface S1 of the substrate SUB. In one embodiment, for example, the backplane structure can be formed on the first surface S1 of the substrate SUB. The backplane structure can be a circuit including capacitors, various wires, thin-film transistors for driving pixels, or the like.

[0100] In process S1040, the magnet assembly MAS can be moved toward the substrate SUB. The magnet assembly MAS can be moved adjacent to the substrate SUB. In one embodiment, for example, the magnet assembly MAS can be moved adjacent to the substrate SUB and the electrostatic chuck ESC. Therefore, the magnet assembly MAS and the substrate SUB can be arranged close to each other, and the electrostatic chuck ESC is inserted therebetween.

[0101] In process S1050, the substrate SUB and the mask FMM can be brought into close contact. In one embodiment, for example, with the magnet assembly MAS directly adjacent to the substrate SUB, a strong magnetic field can be formed below the magnet assembly MAS. The magnetic field formed by the magnet assembly MAS can also pull the mask FMM, which includes metallic material, in the direction toward the substrate SUB. Therefore, the magnetic field formed by the magnet assembly MAS can bring the substrate SUB and the mask FMM into close contact with each other. In such an embodiment, the electric field formed by the electrostatic chuck ESC is shielded by a metal film MTF arranged between the substrate SUB and the electrostatic chuck ESC, and can remain unaffected by the mask FMM beneath the substrate SUB.

[0102] In process S1060, a deposition material OLM can be deposited. The deposition material OLM can be deposited on the first surface S1 of the substrate SUB. By depositing the deposition material OLM, the emission layer of the light-emitting device layer can be formed.

[0103] The magnetic field generated by the magnet assembly MAS can continuously influence the substrate SUB and the mask FMM. Therefore, during the deposition process, the mask FMM can maintain stable and close contact with the first surface S1 of the substrate SUB.

[0104] Figure 9 This is a flowchart illustrating a method for manufacturing a display device according to another embodiment of the present disclosure.

[0105] refer to Figure 1 and Figure 9 In process S1011, a backplane structure can be formed on the first surface S1 of the substrate SUB. The backplane structure can be formed on the first surface S1 of the substrate SUB, which is patterned with deposited material OLM. The backplane structure can be a circuit including capacitors, various wires, thin-film transistors for driving pixels, or the like.

[0106] In process S1021, a metal film MTF can be formed on the second surface S2 of the substrate SUB. The metal film MTF can be uniformly formed on the second surface S2 of the substrate SUB. In an embodiment, for example, the metal film MTF can be formed by depositing a non-magnetic material using a physical vapor deposition (PVD) method, a chemical vapor deposition (CVD) method, electroplating, or a similar method.

[0107] In process S1031, an insulating layer ISL covering the metal film MTF can be formed on the second surface S2 of the substrate SUB. In some embodiments, for example, the insulating layer ISL can be formed directly on the metal film MTF located on the second surface S2 of the substrate SUB. In some embodiments, the insulating layer ISL can be formed, for example, by physical vapor deposition (PVD), chemical vapor deposition (CVD), sol-gel method, or similar methods. The insulating layer ISL can be formed to cover a patterned metal film MTF and includes a substantially flat top surface.

[0108] Subsequently, processes S1041, S1051, and S1061 are executed. The descriptions of processes S1041, S1051, and S1061 are similar to those in the reference document. Figure 8 The descriptions of processes S1040, S1050, and S1060 are provided, and any repeated detailed descriptions will be omitted.

[0109] Figure 10 This is a schematic plan view of a display device DD manufactured by a method for manufacturing a display device according to an embodiment of the present disclosure.

[0110] exist Figure 10 For ease of explanation and description, the structure of a display panel DP displaying an image on the first surface S1 of a substrate SUB, surrounding the display area DA, is schematically shown. However, although in Figure 10 Although not shown in the diagram, drive circuitry (e.g., at least one of a scan driver, a data driver, and a transmit driver), wires, and / or pads may be further arranged on the display panel DP.

[0111] refer to Figure 10 An embodiment of the display device DD may include a display panel DP for displaying images and a substrate SUB for forming the display panel DP. The display panel DP and the substrate SUB for forming the display panel DP may include a display area DA and a non-display area NDA. The display area DA may constitute a screen on which images are displayed, and the non-display area NDA may be an area other than the display area DA.

[0112] Multiple subpixels SP can be arranged in the display area DA. Two or more subpixels among the multiple subpixels SP can constitute a pixel (or a unit pixel) PXL. In an embodiment, for example, a pixel PXL may include a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3, but is not limited thereto. In an embodiment, for example, a pixel PXL may include one first subpixel SP1, two second subpixels SP2, and one third subpixel SP3. Figure 10 The image shows a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3 included in a single pixel PXL. It can be understood that other pixels also include the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3.

[0113] In the following text, at least one of the first subpixel SP1, the second subpixel SP2 and the third subpixel SP3 is arbitrarily referred to as "subpixel SP", or two or more types of subpixels are collectively referred to as "subpixel SP".

[0114] It can be based on stripes or pentiles. ® The subpixels SP are arranged in a regular pattern. However, the arrangement of subpixels SP is not limited to this, and subpixels SP can be arranged in the display area DA in various structures and / or ways.

[0115] Figure 11 yes Figure 10 A schematic cross-sectional view of the display panel DP.

[0116] refer to Figure 11 The implementation of the display panel DP may include an insulating layer ISL, a metal film MTF, a substrate SUB, a pixel circuit layer PCL, a light-emitting device layer LDL, and an encapsulation layer TFE.

[0117] A substrate SUB can include a semiconductor substrate. For example, a substrate SUB can include a bulk silicon wafer or an epitaxial wafer. An epitaxial wafer can include a crystalline material layer, i.e., an epitaxial layer, grown on the bulk substrate by an epitaxial process. A substrate SUB is not limited to bulk wafers or epitaxial wafers and can be formed using various wafers such as polished wafers, annealed wafers, or silicon-on-insulator (SOI) wafers.

[0118] The pixel circuit layer PCL, the light-emitting device layer LDL, and the encapsulation layer TFE can be arranged on the first surface S1 of the substrate SUB (see...). Figure 1 Above.

[0119] The pixel circuit layer (PCL) is disposed on the substrate (SUB) and may include transistors and signal lines connected to the transistors. In embodiments, for example, the transistor may be in the form of an active pattern (or semiconductor pattern), a gate electrode, a source electrode, and a drain electrode stacked sequentially with an insulating layer disposed therebetween. The semiconductor pattern may include amorphous silicon, polycrystalline silicon, low-temperature polycrystalline silicon, organic semiconductors, and / or oxide semiconductors. The gate electrode, source electrode, and drain electrode may include, but are not limited to, at least one selected from aluminum (Al), copper (Cu), titanium (Ti), and molybdenum (Mo). Furthermore, the pixel circuit layer (PCL) may include at least one insulating layer.

[0120] The light-emitting device layer (LDL) can be disposed on the pixel circuit layer (PCL). The LDL can include light-emitting devices. The light-emitting devices are located in each of the sub-pixels (SP) and can be connected to at least one transistor. According to embodiments, the light-emitting devices can include organic light-emitting diodes (OLEDs), inorganic light-emitting diodes (LEDs), quantum dot / well LEDs, or the like. However, embodiments of this disclosure are not limited thereto.

[0121] The encapsulation layer TFE can be disposed on the light-emitting device layer LDL. The encapsulation layer TFE can be in the form of an encapsulation substrate or an encapsulation film composed of multiple films. In embodiments where the encapsulation layer TFE is in the form of an encapsulation film, the encapsulation layer TFE may include inorganic films and / or organic films. In embodiments, for example, the encapsulation layer TFE may have a form in which inorganic films, organic films, and inorganic films are stacked sequentially. The encapsulation layer TFE can prevent or mitigate the infiltration of external air and moisture into the light-emitting device layer LDL and the pixel circuit layer PCL.

[0122] The metal film MTF and the insulating layer ISL can be arranged on the second surface S2 of the substrate SUB (see Figure 1 Above.

[0123] The metal film MTF can be disposed under the substrate SUB and can include a non-magnetic material. The metal film MTF may include a non-magnetic material that is electrically conductive but not magnetic, thereby enabling shielding against electrostatic discharge (ESC) from the electrostatic chuck (see [link to documentation]). Figure 1 The electric field caused by the magnetic field. In embodiments, for example, the metal film MTF may include non-magnetic metals such as silver (Ag), aluminum (Al), gold (Au), copper (Cu), lead (Pb), titanium (Ti), and magnesium (Mg). In another embodiment, for example, the metal film MTF may include a multi-element material, which includes non-magnetic materials such as stainless steel (e.g., 304 stainless steel), aluminum alloys, titanium alloys, magnesium alloys, copper alloys, or the like. However, examples of non-magnetic materials have been described, but are not limited thereto.

[0124] The insulating layer ISL can be disposed beneath the substrate SUB and can cover the metal film MTF. The insulating layer ISL provides protection and electrical insulation for the metal film MTF. Furthermore, by covering the metal film MTF, the insulating layer ISL minimizes or reduces the impact of other processes on the metal film MTF. In embodiments, for example, the insulating layer ISL can be an inorganic insulating layer comprising inorganic materials or an organic insulating layer comprising organic materials.

[0125] Figure 12 yes Figure 10 A schematic plan view of the pixel PXL.

[0126] refer to Figure 10 and Figure 12 In an implementation, a pixel PXL may include a first sub-pixel SP1 to a third sub-pixel SP3 arranged on a first direction DR1.

[0127] The first sub-pixel SP1 may include a first emission region EMA1 and a non-emission region NEA surrounding the first emission region EMA1. The second sub-pixel SP2 may include a second emission region EMA2 and a non-emission region NEA surrounding the second emission region EMA2. The third sub-pixel SP3 may include a third emission region EMA3 and a non-emission region NEA surrounding the third emission region EMA3.

[0128] The first emission region EMA1 can be an area in which light is emitted from the light-emitting device corresponding to the first sub-pixel SP1. The second emission region EMA2 can be an area in which light is emitted from the light-emitting device corresponding to the second sub-pixel SP2. The third emission region EMA3 can be an area in which light is emitted from the light-emitting device corresponding to the third sub-pixel SP3. Although in Figure 12 Not shown, but each emission region EMA1 to EMA3 can be understood as an opening in the pixel-defining layer corresponding to the first sub-pixel SP1 to the third sub-pixel SP3, respectively. In an implementation, for example, a metal film MTF''' (see...) Figure 6 It can be arranged to overlap with at least one of the first transmission area EMA1 to the third transmission area EMA3.

[0129] The display device according to the embodiments can be applied to various electronic devices. The electronic device according to the embodiments includes the display device described above, and may also include modules or devices with additional functions in addition to the display device.

[0130] Figure 13 This is a block diagram of an electronic device 10 according to an embodiment of the present disclosure. (See reference...) Figure 13 The electronic device 10 according to the embodiments may include a display module 11, a processor 12, a memory 13 and a power module 14.

[0131] The processor 12 may include at least one selected from a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0132] The memory 13 can store data information for the operation of the processor 12 or the display module 11. When the processor 12 executes the application stored in the memory 13, image data signals and / or input control signals are sent to the display module 11, and the display module 11 can process the received signals and output image information through the display screen.

[0133] The power module 14 may include a power module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power module to generate power for the operation of the electronic device 10.

[0134] According to the embodiments described above, at least one of the components of the electronic device 10 may be included in the display device. Furthermore, one or more individual modules functionally comprised in a single module may be included in the display device, and other modules may be disposed separately from the display device. In embodiments, for example, the display device includes a display module 11, and the processor 12, memory 13, and power module 14 may be disposed in the electronic device 10 as other devices besides the display device.

[0135] Figure 14 Schematic diagrams of electronic devices according to various embodiments are shown.

[0136] refer to Figure 14Examples of various electronic devices used in the display devices according to embodiments of the present disclosure may include electronic devices for displaying images (such as smartphones 10_1a, tablet PCs 10_1b, laptops 10_1c, televisions 10_1d, or desktop monitors 10_1e), wearable electronic devices including display modules (such as smart glasses 10_2a, head-mounted displays 10_2b, or smartwatches 10_2c), and automotive electronic devices 10_3 including display modules (such as automotive dashboards, center consoles, central information displays (CIDs) placed on dashboards, or interior mirror displays).

[0137] This disclosure should not be construed as limiting itself to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of this disclosure to those skilled in the art.

[0138] According to some embodiments of this disclosure, a display device with improved display quality and a method for manufacturing the display device can be provided.

[0139] While this disclosure has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit or scope of this disclosure as defined by the appended claims.

Claims

1. A display device, including: The substrate includes a first surface and a second surface opposite to the first surface; A light-emitting device is disposed on the first surface in the display area, wherein the light-emitting device emits light; A metal film, disposed on the second surface and overlapping at least a portion of the second surface in a plan view; and An insulating layer is disposed above the second surface and covers the metal film. The metal film comprises a non-magnetic material.

2. The display device according to claim 1, wherein, The metal film overlaps with the display area in the plan view.

3. The display device according to claim 1, wherein, The metal film overlaps with the non-display area surrounding the display area in the plan view.

4. The display device according to claim 1, wherein, The display area includes an emission area corresponding to the light-emitting device, and The metal film overlaps with at least one of the emission regions in the plan view.

5. The display device according to claim 1, wherein, The metal film has a thickness greater than or equal to 10 nm and less than or equal to 10 μm.

6. A method for manufacturing a display device, the method comprising: A metal film is formed on the second surface of the substrate; An insulating layer is formed above the second surface of the substrate to cover the metal film; A backplate structure is formed on the first surface of the substrate opposite to the second surface; The second surface of the substrate is arranged adjacent to the magnet assembly; The first surface of the substrate is arranged adjacent to the mask; as well as Deposited material is deposited from a deposition source on the first surface of the substrate through the mask.

7. The method according to claim 6, wherein, The metal film comprises a non-magnetic material.

8. The method according to claim 6, wherein, The metal film overlaps with the display area of ​​the display device in the plan view.

9. The method according to claim 6, wherein, During the process of arranging the second surface of the substrate adjacent to the magnet assembly, the magnet assembly and the substrate are arranged adjacent to each other and an electrostatic chuck is inserted therebetween. The metal film shields the electric field generated by the electrostatic chuck.

10. Electronic devices, including: processor; as well as A display device, comprising pixels that display images under the control of the processor. The display device further includes: The substrate includes a first surface and a second surface opposite to the first surface; A light-emitting device is disposed on the first surface in the display area, wherein the light-emitting device emits light; A metal film, disposed on the second surface and overlapping at least a portion of the second surface in a plan view; and An insulating layer is disposed above the second surface and covers the metal film, and The metal film comprises a non-magnetic material.

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