Display panel, preparation method thereof, display module and electronic device

Abstract

This application provides a display panel, its manufacturing method, a display module, and an electronic device, relating to the field of display technology. The display panel includes a display area, an isolation area, and an opening area. The isolation area includes a first substrate, an insulating isolation pillar, and a cathode. The insulating isolation pillar includes an organic insulating portion, a first metal portion, and a second metal portion, which are disposed on opposite sides of a first portion of the organic insulating portion. A first surface of the organic insulating portion is connected to a first top surface of the first metal portion, with the edge of the first surface extending beyond the edge of the first top surface. A second surface of the organic insulating portion is connected to a second top surface of the second metal portion, with the edge of the second surface extending beyond the edge of the second top surface. A first portion of the cathode is disposed on the first substrate, and a second portion of the cathode is disposed on a third surface of the second portion of the organic insulating portion. The insulating isolation pillar effectively isolates the cathode, making the isolation area less prone to electrochemical corrosion, thus reducing the risk of display defects in the display area.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and its manufacturing method, a display module and an electronic device. Background Technology

[0002] An isolation zone is provided between the display area and the opening area of ​​the display panel. This isolation zone is used to seal and waterproof the opening area, preventing moisture from eroding the display area along the sidewalls of the opening area and causing display failure. The isolation zone is equipped with insulating isolation pillars 40, such as... Figure 1 As shown, Figure 1 This is a cross-sectional schematic diagram of an insulating isolation pillar 40 in a conventional technical solution. The insulating isolation pillar includes a metal portion 401 and an insulating portion 402. The metal portion 401 includes a first metal layer 4011, a second metal layer 4012, and a third metal layer 4013. The first metal layer 4011, the second metal layer 4012, and the third metal layer 4013 form an "I"-shaped structure, used to disconnect the cathode 403 of the encapsulation area to form a first portion 4031 and a second portion 4032. The insulating portion 402 is used to connect the second portions 4032 of the cathodes 403 on both sides of the insulating isolation pillar 40 in series through the metal portion 401, causing the isolation area to become energized.

[0003] Because the traditional insulating part 402 uses organic insulating material, during the manufacturing process of the display panel, the organic insulating material suffers from shrinkage due to the baking process and tolerances due to the alignment precision process. As a result, the horizontal dimension of the insulating part 402 is smaller than that of the metal part. The insulating part 402 cannot completely isolate the first part 4031 of the cathode 403 and the metal part 401. The disconnected first part 4031 and second part 4032 of the cathode 403 can be reconnected through the metal part 401, causing the isolation area to become charged and undergo electrochemical corrosion. The encapsulation of the isolation area fails, allowing moisture and oxygen to enter the display area. The light-emitting layer of the display area is corroded and cannot emit light normally, resulting in "black spots" ("black spots" are the parts of the display area that cannot emit light normally) appearing in the display area. Summary of the Invention

[0004] This application provides a display panel that is less prone to "black spots", a method for manufacturing the same, a display module, and an electronic device.

[0005] In a first aspect, embodiments of this application provide a display panel. The display panel includes a display area, an isolation area, and an opening area, with the isolation area disposed between the display area and the opening area. The isolation area includes a first substrate, an insulating isolation pillar, and a cathode. The insulating isolation pillar includes an organic insulating portion, a first metal portion, and a second metal portion. The first metal portion and the second metal portion are disposed on the first substrate. The organic insulating portion includes a first part and a second part. The first part of the organic insulating portion is connected between the second part of the organic insulating portion and the first substrate. The first metal portion and the second metal portion are disposed on opposite sides of the first part of the organic insulating portion. The first surface of the second part of the organic insulating portion is connected to the first top surface of the first metal portion, and the edge of the first surface extends beyond the edge of the first top surface of the first metal portion. The second surface of the second part of the organic insulating portion is connected to the second top surface of the second metal portion, and the edge of the second surface extends beyond the edge of the second top surface of the second metal portion. The cathode includes a first part and a second part. The first part of the cathode is disposed on the first substrate, and the second part of the cathode is disposed on the third surface of the second part of the organic insulating portion. The third surface of the second part of the organic insulating portion faces away from the first metal portion and the second metal portion.

[0006] It is understandable that by setting up insulating isolation pillars to isolate the cathode of the isolation zone, the current of the cathode of the display zone can be prevented from being conducted to the cathode of the isolation zone, causing the isolation zone to become charged and undergo electrochemical corrosion, resulting in the failure of the isolation zone's encapsulation. This also prevents water vapor and oxygen at the through-hole location from entering the display zone through the encapsulation failure, thereby preventing the appearance of "black spots" ("black spots" are the parts of the display zone that cannot emit light normally) in the display zone.

[0007] Compared to Figure 1As shown, even when the cathode is isolated by a metal portion, it may still be connected in series through the metal. In the technical solution of this application, the first and second portions of the cathode are isolated by the edge of the first surface of the second portion of the organic insulating portion extending beyond the edge of the first top surface of the first metal portion. The second portion of the cathode and the first metal portion are completely separated by the organic insulating portion, preventing the second portion of the cathode from contacting the first metal portion. This prevents the disconnected first and second portions of the cathode from being connected in series through the first metal portion, thus preventing current from the cathode in the display area from being conducted to the cathode in the isolation area, causing the isolation area to become charged and undergo electrochemical corrosion, leading to packaging failure of the isolation area. Furthermore, the fifth sidewall of the first portion of the organic insulating portion can be connected to the first sidewall of the first metal portion, and the first surface of the second portion of the organic insulating portion can be connected to the first top surface of the first metal portion. At the position of the first sidewall of the first metal portion, the organic insulating portion can prevent the first portions of the cathodes on both sides of the first metal portion from being connected in series through the first metal portion, preventing current from the cathode in the display area from being conducted to the cathode in the isolation area, causing the isolation area to become charged and undergo electrochemical corrosion, leading to packaging failure of the isolation area. Insulating isolation pillars effectively isolate the cathode, and the encapsulation of the isolation area is less prone to failure, which helps reduce the risk of "black spots" appearing in the display area.

[0008] In some embodiments of this application, the first metal portion includes a first metal layer, the bottom surface of which is connected to a first substrate. It is understood that the first metal portion can be a single-layer metal layer. The molding process is simple.

[0009] In some embodiments of this application, the first metal portion includes a second metal layer and a third metal layer. The second metal layer is disposed on a first substrate, and the third metal layer is disposed on the surface of the second metal layer away from the first substrate. The surface of the third metal layer away from the second metal layer is the first top surface of the first metal portion.

[0010] Understandably, compared to traditional technical solutions, such as Figure 1 As shown, the first metal part has three metal layers, forming a groove to isolate the cathode. In this application, the first metal part does not have a third metal layer, thus eliminating the third metal layer. The first and second parts of the cathode can be separated by the edge of the organic insulating part, preventing the second part of the cathode from contacting and connecting with the first metal part, and preventing the first and second parts of the cathode from being re-electrically connected through the first metal part. Therefore, the insulating isolation column of this application provides a better cathode isolation function.

[0011] In some embodiments of this application, the material used for the third metal layer includes aluminum.

[0012] Understandably, the first metal portion of the insulating isolation pillar can be formed in the same process as the source or drain of the display area. This eliminates the need for additional processes and avoids increasing production costs.

[0013] In some embodiments of this application, a pad layer is provided between the first metal portion, the second metal portion, and the first substrate.

[0014] Understandably, by setting a high pad, the insulating isolation column increases the distance between its top surface and the first substrate during cathode formation, making it easier for the cathode to break at the sidewall of the insulating isolation column, thus improving the column's ability to isolate the cathode. Furthermore, by setting a high pad, the height of the insulating isolation column can be increased in the thickness direction of the first substrate, which helps improve its anti-overflow effect.

[0015] In some embodiments of this application, the padding layer includes a first layer, a second layer, a third layer, a first metal pad layer, and a second metal pad layer. The first, second, and third layers are stacked along the thickness direction of the display panel. The third layer is disposed on a first substrate. The second metal pad layer is disposed between the third and second layers. The first metal pad layer is disposed between the second and first layers. A first metal portion is disposed on the surface of the first layer away from the second layer. The third bottom surface of the second layer connects to the third top surface of the second metal pad layer, and the edge of the third bottom surface extends beyond the edge of the third top surface of the second metal pad layer. The second layer serves to separate the first portion of the cathode from the second portion of the cathode.

[0016] Understandably, the second layer of the shim can be used to isolate the first part of the cathode from the second part of the cathode. Increasing the number of insulating isolation pillars separating the cathode improves the effectiveness of this isolation.

[0017] In some embodiments of this application, the padding layer includes a first layer, a second layer, a third layer, a first metal pad layer, and a second metal pad layer. The first, second, and third layers are stacked along the thickness direction of the display panel. The third layer is disposed on a first substrate. The second metal pad layer is disposed between the third and second layers. The first metal pad layer is disposed between the second and first layers. A first metal portion is disposed on the surface of the first layer away from the second layer. Along the thickness direction of the display panel, the first metal pad layer includes a first sub-layer, a second sub-layer, and a third sub-layer stacked together. The first sub-layer is disposed on the surface of the second layer away from the second metal pad layer. The materials used for the first and third sub-layers include titanium or molybdenum, and the material used for the second sub-layer includes aluminum.

[0018] Understandably, the first metal pad can be formed in the same process as the source or drain. This eliminates the need for additional processes and avoids increasing production costs.

[0019] In some embodiments of this application, the isolation region further includes metal isolation pillars disposed on the first substrate and spaced apart from the insulating isolation pillars. Each metal isolation pillar includes a first conductive layer, a second conductive layer, and a third conductive layer stacked together. The first conductive layer is disposed on the first substrate, and the sixth bottom surface of the third conductive layer is connected to the sixth top surface of the second conductive layer, with the edge of the sixth bottom surface extending beyond the edge of the sixth top surface of the second conductive layer. The cathode further includes a third portion disposed on the surface of the third conductive layer away from the second conductive layer. Multiple insulating isolation pillars are provided, with at least one metal isolation pillar between two adjacent insulating isolation pillars.

[0020] Understandably, by setting up metal isolation pillars to disconnect the cathode, the pathway for moisture and oxygen at the via d location is cut off as much as possible, allowing them to infiltrate along the cathode of the isolation zone towards the display area. This reduces moisture and oxygen levels in the isolation zone, lowering the risk of isolation zone encapsulation failure.

[0021] At least one metal isolation post should be provided between two adjacent insulating isolation posts. This helps to maintain a larger distance between the two adjacent insulating isolation posts. When etching the organic layer to form the organic insulating part of the insulating isolation post, the organic insulating parts of the two insulating isolation posts are separated, avoiding the organic insulating parts of the two insulating isolation posts from sticking together and failing to isolate the cathode.

[0022] Secondly, embodiments of this application provide a method for manufacturing a display panel. The method for manufacturing a display panel includes:

[0023] The display panel includes a display area and an isolation area. A first metal layer, a second metal layer and a third metal layer are formed sequentially on the substrate of the display panel. The first metal layer, the second metal layer and the third metal layer of the display area are used to form the source and / or drain of the display area.

[0024] The third metal layer of the isolation zone is removed, and a portion of the first metal layer and a portion of the second metal layer of the isolation zone form a first metal part to be processed, and a portion of the first metal layer and a portion of the second metal layer of the isolation zone form a second metal part to be processed.

[0025] An organic insulating portion is formed on the first metal portion to be processed, on the second metal portion to be processed, and between the first metal portion to be processed and the second metal portion to be processed.

[0026] The second metal layer of the first metal part to be treated and the second metal layer of the second metal part to be treated are etched to form the first metal part and the second metal part. The organic insulating part includes a first part and a second part. The first part of the organic insulating part is connected between the second part of the organic insulating part and the substrate of the isolation region. The first metal part and the second metal part are disposed on both sides of the first part of the organic insulating part. The first surface of the second part of the organic insulating part is connected to the first top surface of the first metal part, and the edge of the first surface extends beyond the edge of the first top surface of the first metal part. The second surface of the second part of the organic insulating part is connected to the second top surface of the second metal part, and the edge of the second surface extends beyond the edge of the second top surface of the second metal part.

[0027] A cathode is formed, and the cathode of the isolation region is broken at the edge of the first surface and the edge of the second surface to form a first part and a second part. The first part of the cathode is disposed on the substrate of the isolation region, and the second part of the cathode is disposed on the third surface of the second part of the organic insulating part.

[0028] Understandably, it can be used as a reference. Figure 1 The conventional technical solution for the structure shown in the diagram involves first forming a first metal layer, a second metal layer, and a third metal layer sequentially, then directly etching the second metal layer, and finally forming an organic insulating portion. The organic insulating portion tends to shrink when heated, exposing the third metal layer. After disconnection, the second part of the cathode can contact and be electrically connected to the third metal layer. The first and second parts of the cathode, after disconnection, are reconnected through the third metal layer, failing to completely insulate the two parts of the cathode. In the embodiments of this application, the technical solution is to first remove the third metal layer, then form the organic insulating portion, and finally etch the second metal layer. This ensures that the organic insulating portion effectively covers the first top surface of the first metal portion and the second top surface of the second metal portion. Furthermore, the organic insulating portion isolates the cathode, eliminating the problem of the cathode contacting the third metal layer. Therefore, the first and second parts of the cathode do not reconnect. The insulating isolation pillar of this application provides better isolation for the cathode, and the encapsulation effect of the encapsulation area is also better.

[0029] Thirdly, embodiments of this application provide a display panel. The display panel includes a display area, an isolation area, and an opening area, with the isolation area disposed between the display area and the opening area. The isolation area includes a first substrate, an insulating isolation pillar, and a cathode. The insulating isolation pillar includes a first metal portion, an inorganic insulating portion, and a padding layer. The padding layer is disposed on the first substrate, and the first metal portion is disposed on the surface of the padding layer away from the first substrate. The inorganic insulating portion includes a first part and a second part. The first part of the inorganic insulating portion is connected between the second part of the inorganic insulating portion and the first substrate, and the first metal portion is located on one side of the first part of the inorganic insulating portion. A fourth surface of the second part of the inorganic insulating portion is connected to a first top surface of the first metal portion, and the edge of the fourth surface extends beyond the edge of the first top surface of the first metal portion. The cathode includes a first part and a second part. The first part of the cathode is disposed on the first substrate, and the second part of the cathode is disposed on a fifth surface of the second part of the inorganic insulating portion. The fourth surface and the fifth surface of the second part of the inorganic insulating portion are disposed opposite to each other. The padding layer includes a first metal padding layer and a first layer. Along the thickness direction of the display panel, the first metal padding layer includes a first sub-layer, a second sub-layer, and a third sub-layer stacked together, with the first layer disposed between the first metal part and the third sub-layer.

[0030] It is understood that in the technical solution of this application, an inorganic insulating part is provided to isolate the first part and the second part of the cathode. The inorganic insulating part is made of inorganic insulating material, and the second part of the cathode and the first metal part are completely separated by the inorganic insulating part, preventing the second part of the cathode from contacting the first metal part. This prevents the disconnected first part and the second part of the cathode from being connected in series through the first metal part, and prevents the current of the cathode in the display area from being conducted to the cathode in the isolation area, causing the isolation area to become charged and undergo electrochemical corrosion, resulting in the failure of the isolation area's encapsulation.

[0031] In some embodiments of this application, the first metal pad is made of the same material as the first source electrode of the display area.

[0032] It is understandable that the first metal pad can be formed in the same process as the first source electrode.

[0033] In some embodiments of this application, the materials used for the first and third sublayers include titanium or molybdenum, and the material used for the second sublayer includes aluminum.

[0034] In some embodiments of this application, the fifth bottom surface of the third sublayer is connected to the fifth top surface of the second sublayer, the edge of the fifth bottom surface extends beyond the edge of the fifth top surface of the second sublayer, and the third sublayer is used to separate the first portion of the cathode and the second portion of the cathode.

[0035] Understandably, the three sub-layers of the padding layer are used to isolate the first and second parts of the cathode. This increases the number of times an insulating isolation column can isolate the cathode, and the more times an insulating isolation column can isolate the cathode, the better the cathode isolation effect.

[0036] In some embodiments of this application, the first metal portion includes a first metal layer, the bottom surface of which is connected to the first substrate. It is understood that the first metal portion can be a single-layer metal layer. The molding process is simple.

[0037] In some embodiments of this application, the first metal portion further includes a second metal layer and a third metal layer. The second metal layer is disposed on the first substrate, and the third metal layer is disposed on the surface of the second metal layer away from the first substrate. The surface of the third metal layer away from the second metal layer is the first top surface of the first metal portion.

[0038] Understandably, compared to traditional technical solutions, such as Figure 1 As shown, the first metal part is provided with three metal layers, and the groove formed by the three metal layers is used to isolate the cathode. In this application, the first metal part is not provided with a third metal layer, and the third metal layer is eliminated. The first part of the cathode and the second part of the cathode can be separated by the edge of the inorganic insulating part, which avoids the second part of the cathode from contacting and connecting with the first metal part, and avoids the first part of the cathode and the second part of the cathode from being re-electrically connected through the first metal part. The insulating isolation column of this application has a better effect in isolating the cathode.

[0039] In some embodiments of this application, the insulating isolation post further includes a second metal portion. The first and second metal portions are disposed on a first substrate, and are located on opposite sides of the first portion of the inorganic insulating portion. A sixth surface of the second portion of the inorganic insulating portion is connected to the second top surface of the second metal portion, and the edge of the sixth surface extends beyond the edge of the second top surface of the second metal portion.

[0040] Understandably, by providing a second metal section, during the process of forming the cathode of the isolation zone, the cathode will break off on both sides of the first part of the inorganic insulating section, forming a layered first part and second part. The inorganic insulating section of an insulating isolation column can isolate the cathode of the isolation zone twice, and the insulating isolation column has a better isolation effect on the cathode.

[0041] Fourthly, embodiments of this application provide a method for manufacturing a display panel. The method for manufacturing a display panel includes:

[0042] The display panel includes a display area and an isolation area. A first metal layer, a second metal layer and a third metal layer are formed sequentially on the substrate of the display panel. The first metal layer, the second metal layer and the third metal layer of the display area are used to form the source and / or drain of the display area.

[0043] The third metal layer of the isolation zone is removed, and at least a portion of the first metal layer of the isolation zone and at least a portion of the second metal layer of the isolation zone are used to form the first metal part to be processed.

[0044] An inorganic insulating part is formed on the first metal part to be processed in the isolation zone.

[0045] The second metal layer of the first metal part to be processed is etched to form the first metal part. The inorganic insulating part includes a first part and a second part. The first part of the inorganic insulating part is connected between the second part of the inorganic insulating part and the substrate of the isolation area. The first metal part is located on one side of the first part of the inorganic insulating part. The fourth surface of the second part of the inorganic insulating part is connected to the first top surface of the first metal part. The edge of the fourth surface extends beyond the edge of the first top surface of the first metal part.

[0046] A cathode is formed, and the cathode of the isolation region is broken at the edge of the fourth surface of the inorganic insulating part to form a first part and a second part. The first part of the cathode is disposed on the substrate of the isolation region, and the second part of the cathode is disposed on the fifth surface of the second part of the inorganic insulating part.

[0047] It is understandable that the third metal layer is removed first, then the inorganic insulating part is formed, and finally the second metal layer to be processed is etched. This ensures that the inorganic insulating part covers the second metal layer well, and the inorganic insulating part is used to isolate the cathode. The cathode does not have the problem of contacting the third metal layer, and the first part and the second part of the cathode will not be reconnected. The insulating isolation pillar of this application has a good isolation effect on the cathode and a good encapsulation effect on the encapsulation area.

[0048] Fifthly, embodiments of this application provide a display module. The display module includes a cover plate and a display panel as described in the first aspect, with the cover plate stacked on the display panel. Alternatively, the display module includes a cover plate and a display panel as described in the third aspect, with the cover plate stacked on the display panel.

[0049] Understandably, the cover plate is layered over the display panel to protect it and prevent damage from external interference. This reduces the likelihood of "black spots" forming on the display panel and extends the lifespan of the display module.

[0050] Sixthly, embodiments of this application provide an electronic device. The electronic device includes a housing and a display module, the display module being mounted on the housing. The display module is less prone to developing "black spots," resulting in a longer lifespan for the electronic device. Attached Figure Description

[0051] To illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below;

[0052] Figure 1 This is a cross-sectional schematic diagram of an insulating isolation column in a traditional technical solution;

[0053] Figure 2A This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0054] Figure 2B yes Figure 2A The diagram shown is an exploded view of the electronic device.

[0055] Figure 3 yes Figure 2B An enlarged view of the display panel at point A;

[0056] Figure 4 yes Figure 3 The diagram shows a partial cross-sectional view of one embodiment of the display panel at the BB line;

[0057] Figure 5 yes Figure 3 A cross-sectional view of one embodiment of the display panel shown at the BB line;

[0058] Figure 6 yes Figure 3 A cross-sectional view of the display panel shown at the BB line in another embodiment;

[0059] Figure 7 yes Figure 3 A cross-sectional view of the display panel shown at the BB line in another embodiment;

[0060] Figure 8A yes Figure 3 A cross-sectional view of the display panel shown at the BB line in another embodiment;

[0061] Figure 8B yes Figure 3 A cross-sectional view of the display panel shown at the BB line in another embodiment;

[0062] Figure 9 yes Figure 8B A schematic diagram of another embodiment of the display panel shown at point C;

[0063] Figure 10 yes Figure 8B A schematic diagram of another embodiment of the display panel shown at point C;

[0064] Figure 11 yes Figure 8B A schematic diagram of another embodiment of the display panel shown at point C;

[0065] Figure 12 yes Figure 8B A schematic diagram of another embodiment of the display panel shown at point C;

[0066] Figure 13 yes Figure 8B A schematic diagram of another embodiment of the display panel shown at point C;

[0067] Figure 14 yes Figure 8B A schematic diagram of another embodiment of the display panel shown at point C;

[0068] Figure 15 yes Figure 8B A schematic diagram of another embodiment of the display panel shown at point C;

[0069] Figure 16 yes Figure 8B A schematic diagram of another embodiment of the display panel shown at point C;

[0070] Figure 17 yes Figure 2B A schematic diagram of another embodiment of the display panel shown at point A;

[0071] Figure 18 yes Figure 17 A cross-sectional view of the display panel shown at the DD line in another embodiment;

[0072] Figure 19 yes Figure 2B A schematic diagram of another embodiment of the display panel shown at point A;

[0073] Figures 20 to 26 This is a cross-sectional view of the product structure corresponding to a manufacturing process of a display panel;

[0074] Figure 27 This is a schematic diagram of another embodiment of the insulating isolation column provided in this application.

[0075] Figure 28 yes Figure 27 A schematic diagram of another embodiment of the structure shown in the figure;

[0076] Figures 29 to 31 This is a cross-sectional view of the product structure corresponding to another manufacturing process of the display panel;

[0077] Figure 32 This is a front plan view of another display panel provided in the embodiments of this application, along the plane in which it is located;

[0078] Figure 33This is a front plan view of another display panel provided in the embodiments of this application, along the plane in which it is located;

[0079] Figure 34 This is a planar front view of another display panel provided in the embodiments of this application, in the plane direction where the panel is located. Detailed Implementation

[0080] The embodiments of this application are described below with reference to the accompanying drawings. The embodiments described herein with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0081] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. It should be understood that in this application, "electrical connection" can be understood as components physically contacting and conducting electricity; it can also be understood as a form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship. For example, A connecting to B or A being connected to B can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and A and B can be separated.

[0082] Furthermore, the term "fixed" in this document should be interpreted broadly. For example, "fixed" can mean direct fixing or indirect fixing through an intermediate medium. "Fixed" refers to connections where the relative positional relationship remains unchanged after connection. The directional terms used in the embodiments of this application, such as "upper" and "lower," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to two or more.

[0083] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0084] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0085] References to "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0086] It is understood that the specific embodiments described herein are merely for explaining the relevant application and not for limiting the application. It should also be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings.

[0087] The embodiments of this application are described below with reference to the accompanying drawings.

[0088] Figure 2A This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application. It should be noted that the figure only schematically shows some components included in the electronic device 1000; the actual size, location, and structure of these components are not limited by the figure. Similarly, the following figures only schematically show some components; the actual size, location, and structure of these components are not limited by the following figures. Specific details will not be elaborated further below.

[0089] like Figure 2A As shown, the electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), personal computer, laptop computer, in-vehicle display, wearable device, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, or VR helmet, etc., that has a display module 100. Figure 1 The electronic device 1000 shown is described using a mobile phone as an example.

[0090] Figure 2B yes Figure 2A The diagram shows an exploded view of the structure of the electronic device 1000.

[0091] like Figure 2A and Figure 2B As shown, the electronic device 1000 may include a display module 100, a housing 200, and electronic devices 300. The housing 200 can serve as a structural support component for the display module 100 and the electronic devices 300. This application does not specifically limit the structure of the housing 200.

[0092] For example, the display module 100 is mounted on the housing 200. The display module 100 may be within the internal space of the electronic device 1000 enclosed by the housing 200. The display module 100 may be a flat screen, i.e., the edges of the display module 100 are not curved to form an arc surface. Alternatively, the display module 100 may be a curved screen, i.e., the edges of the display module 100 are curved to form an arc surface. In addition, the display module 100 may be a non-foldable rigid screen or a foldable screen. The electronic device 300 may be a foldable device or a non-foldable device.

[0093] Exemplarily, the electronic device 300 can be mounted on the housing 200, and the electronic device 300 can be located inside the electronic device 1000. The electronic device 300 may include a camera module, a fingerprint module, or other modules that need to receive external light. The electronic device 300 may also include a HOME button, an earpiece, or a speaker, etc. The electronic device 300 in this application is described using a camera module as an example.

[0094] like Figure 2B As shown, the display module 100 may include a display panel 10 and a cover plate 20. The cover plate 20 is stacked on the top surface 10a of the display panel 10. The cover plate 20 can be used to protect the display panel 10.

[0095] For example, the cover plate 20 can be made of glass or polyimide, etc. The display panel 10 can be an organic light-emitting diode (OLED) panel, a quantum dot light-emitting diode (QLED) panel, etc. This embodiment will be described using an OLED display panel 10 as an example.

[0096] like Figure 2BAs shown, the display panel 10 may include a top surface 10a, a bottom surface 10b, and a side wall 10c. The display panel 10 is provided with a through hole 10d. The through hole 10d can form openings on the top surface 10a and the bottom surface 10b of the display panel 10. In some embodiments of this application, the through hole 10d may also adopt other structures. These will be described in detail below with reference to the accompanying drawings, and will not be repeated here.

[0097] like Figure 2B As shown, the light-collecting surface 301 of the electronic device 300 is positioned opposite to the through hole 10d. It should be understood that, in this application, the relative positioning of component A and component B can be such that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, and projection C and projection D can at least partially overlap. Figure 2B The direction of the target is indicated by a dotted line with an arrow.

[0098] When the electronic device 300 is a camera module, fingerprint module, infrared light sensor, or other module that needs to receive external light, the electronic device 300 can receive external light from the electronic device 1000 through the through hole 10d. When the electronic device 300 is a HOME button, the HOME button can be exposed relative to the top surface 10a of the display panel 10 through the through hole 10d for easy pressing or touching by the user. When the electronic device 300 is an earpiece or speaker, the through hole 10d can be used to allow sound to pass through.

[0099] The number of vias 10d is not limited to the one shown in the figure. In some embodiments of this application, the number of vias 10d can also be multiple, depending on the product requirements. For example, when there are two electronic devices 300, the number of vias 10d is also two. Furthermore, the position and shape of the vias 10d are not limited to... Figure 2B The location and shape are shown. For example, the cross-sectional shape of the through hole 10d can be rectangular, elliptical, or other irregular shapes.

[0100] Figure 3 yes Figure 2B The enlarged view of the display panel 10 shown at point A.

[0101] like Figure 2B and Figure 3 As shown, the display panel 10 includes a display (Active Area, AA) area 1, an encapsulation area 2, and an opening area 3. The area where the through hole 10d is located constitutes the opening area 3 of the display panel 10. The encapsulation area 2 connects the display area 1 and the through hole 10d (i.e., the opening area 3). Figure 3The display area 1 and the encapsulation area 2 are schematically distinguished by a dotted line. The display area 1 can be used for image display. The encapsulation area 2 can be used to isolate the opening area 3 from the display area 1, preventing water, oxygen, etc. from the opening area 3 from entering the display area 1, which could damage the light-emitting structure in the display panel 10 and prevent it from emitting light. The encapsulation area 2 can also be used to set up fan-out traces, which can be used to electrically connect the pixel units within the display area 1.

[0102] For example, the shape of the encapsulation region 2 can be a ring-shaped structure. In some embodiments of this application, the shape of the encapsulation region 2 can also be rectangular, elliptical, or other irregular shapes, and the shape of the encapsulation region 2 is not specifically limited.

[0103] The structure of the electronic device 1000 and the display module 100 has been described in detail above with reference to the accompanying drawings. The structure of the display area 1 and the packaging area 2 will be described below with reference to the accompanying drawings.

[0104] Figure 4 yes Figure 3 The image shows a partial cross-sectional view of the display panel 10 at the BB line in one embodiment. Figure 4 The diagram illustrates the layer structure of the display area 1 on the BB line of the display panel 10.

[0105] like Figure 4 As shown, the display area 1 includes a substrate (BP) 11, a thin film transistor (TFT) layer 12, a pixel define layer (PDL) 13, a pixel unit layer 14, an encapsulation layer 15, and a protective layer 16. In this embodiment, during use, the substrate 11 is the layer of the display area 1 furthest from the user. The TFT layer 12 may contain one or more thin film transistors; this application does not specifically limit its application.

[0106] For example, substrate 11 serves as a carrier substrate for the layers above it (e.g., thin-film transistor layer 12). The material of substrate 11 can be polyimide (PI), polyethylene terephthalate (PET), paper, metal, ultrathin glass, etc.

[0107] like Figure 4As shown, the thin-film transistor layer 12 may include a buffer layer 121, an active layer 122, a gate insulator (GI) 123, an inner layer dielectric (ILD) 124, a gate 125, a source (S) 126, a drain (D) 127, a planarization layer (PLN) 128, a channel layer 1291, a shielding layer 1292, a light-shielding structure 1293, and an inorganic protective layer (PVX) 1294. Exemplarily, the gate insulator 123 includes a first gate insulator 1231, a second gate insulator 1232, and a third gate insulator 1233. The gate 125 includes a first gate 1251, a second gate 1252, and a third gate 1253. The source 126 includes a first source 1261, a second source 1262, and a third source 1263. The planarization layer 128 includes a first planarization layer 1281, a second planarization layer 1282, and a third planarization layer 1283. The buffer layer 121 includes a first buffer layer 1211 and a second buffer layer 1212.

[0108] Exemplarily, a first buffer layer 1211 may be disposed on a substrate 11. A shielding layer 1292 is embedded within the first buffer layer 1211. An active layer 122 is disposed on the surface of the first buffer layer 1211 away from the substrate 11. A first gate insulating layer 1231 is disposed on the surface of the first buffer layer 1211 away from the substrate 11 and covers the active layer 122. A first gate 1251 is disposed on the surface of the first gate insulating layer 1231 away from the first buffer layer 1211. A second gate insulating layer 1232 is disposed on the surface of the first gate insulating layer 1231 away from the first buffer layer 1211 and covers the first gate 1251. The second gate 1252 and the light-shielding structure 1293 are both disposed on the surface of the second gate insulating layer 1232 away from the first gate insulating layer 1231. The second buffer layer 1212 is disposed on the surface of the second gate insulating layer 1232 away from the first gate insulating layer 1231 and covers the second gate 1252 and the light-shielding structure 1293. A channel layer 1291 is disposed on the surface of the second buffer layer 1212 that is away from the second gate insulating layer 1232. A third gate insulating layer 1233 is disposed on the surface of the second buffer layer 1212 that is away from the second gate insulating layer 1232 and covers the channel layer 1291. A third gate 1253 is disposed on the surface of the third gate insulating layer 1233 that is away from the second buffer layer 1212. An interlayer insulating layer 124 is disposed on the surface of the third gate insulating layer 1233 that is away from the second buffer layer 1212 and covers the third gate 1253.

[0109] Along the thickness direction of the display panel 10, the shielding layer 1292 can be disposed opposite to the active layer 122 to shield device signals, such as light signals, on the side of the substrate 11 away from the active layer 122, thereby preventing interference with the internal devices of the display panel 10. The shielding layer 1292 can be made of a metallic material, such as molybdenum (Mo).

[0110] Along the thickness direction of the display panel 10, the light-shielding structure 1293 and the channel layer 1291 are disposed opposite to each other for light-shielding of the channel layer 1291. The light-shielding structure 1293 can be made of a light-shielding material.

[0111] For example, the channel layer 1291 may be made of indium gallium zinc oxide (IGZO). In some embodiments of this application, the channel layer 1291 may also be made of other materials.

[0112] Exemplarily, the first source 1261 may include a first portion 1264 and a second portion 1265. The drain 127 may also include a first portion 1271 and a second portion 1272. The first portion 1264 of the first source 1261 and the first portion 1271 of the drain 127 are disposed on the surface of the interlayer insulating layer 124 away from the third gate insulating layer 1233. The second portion 1265 of the first source 1261 and the second portion 1272 of the drain 127 are electrically connected to the active layer 122 or the channel layer 1291 through the interlayer insulating layer 124 and other insulating layers. The inorganic protective layer 1294 is disposed on the surface of the interlayer insulating layer 124 away from the third gate insulating layer 1233 and covers the first portion 1264 of the first source 1261 and the first portion 1271 of the drain 127. The inorganic protective layer 1294 can be used to protect the first source 1261 and drain 127, preventing the side aluminum layers of the first source 1261 and drain 127 from being etched during the process, forming undercuts. A first planarization layer 1281 is disposed on the surface of the inorganic protective layer 1294 away from the interlayer insulating layer 124. The second source 1262 may include a first portion 1266 and a second portion 1267. The first portion 1266 of the second source 1262 is disposed on the surface of the first planarization layer 1281 away from the interlayer insulating layer 124, and the second portion 1267 of the second source 1262 passes through the first planarization layer 1281 and the inorganic protective layer 1294, connecting to the first portion 1264 of the first source 1261. The second planarization layer 1282 is disposed on the surface of the first planarization layer 1281 away from the interlayer insulating layer 124 and covers the first portion 1266 of the second source 1262. The third source electrode 1263 may include a first portion 1268 and a second portion 1269. The first portion 1268 of the third source electrode 1263 is disposed on the surface of the second planarization layer 1282 away from the first planarization layer 1281, and the second portion 1269 of the third source electrode 1263 enters the second planarization layer 1282 and connects to the first portion 1266 of the second source electrode 1262. The third planarization layer 1283 is disposed on the surface of the second planarization layer 1282 away from the first planarization layer 1281 and covers the first portion 1268 of the third source electrode 1263.

[0113] The above is one embodiment of the thin-film transistor layer 12. In some embodiments of this application, the thin-film transistor layer 12 may also have a first drain, a second drain, a third drain, and a source. This application does not limit the specific layer structure of the thin-film transistor layer 12.

[0114] For example, the materials used in the first planarization layer 1281, the second planarization layer 1282, and the third planarization layer 1283 may include organic materials. For instance, the materials used in the first planarization layer 1281, the second planarization layer 1282, and the third planarization layer 1283 may all be photosensitive polyimide (PSPI).

[0115] like Figure 4 As shown, the pixel definition layer 13 can be disposed on the surface of the third planarization layer 1283 of the thin-film transistor layer 12, away from the second planarization layer 1282. The pixel unit layer 14 can be used to implement the display function of the display area 1; the pixel unit layer 14 is also called the light-emitting device layer. The pixel unit layer 14 may include an anode 141, a light-emitting layer (EL) 142, and a cathode 143 stacked sequentially. The anode 141 may include a first portion 1411 and a second portion 1412. The first portion 1411 of the anode 141 can be disposed on the surface of the third planarization layer 1283, away from the second planarization layer 1282, and connected to the pixel definition layer 13. The second portion 1412 of the anode 141 can pass through the third planarization layer 1283 and connect to the third source 1263. The light-emitting layer 142 can be disposed on the surface of the first portion 1411 of the anode 141, away from the third planarization layer 1283. The cathode 143 can be disposed on the surface of the light-emitting layer 142 that is away from the anode 141.

[0116] In some embodiments of this application, the cathode 143 can be fabricated using a full-surface vapor deposition method, and the cathode 143 has a continuous structure in the display area 1. A portion of the cathode 143 may be located on the surface of the light-emitting layer 142 away from the anode 141, and a portion may be located on the surface of the pixel definition layer 13 away from the thin-film transistor layer 12. The cathode 143 can be made of a magnesium-silver alloy or other metallic or non-metallic materials.

[0117] For example, the material of the light-emitting layer 142 can be an organic material, including organic small molecule light-emitting materials, coordination light-emitting materials, and polymers.

[0118] In some embodiments of this application, the pixel unit layer 14 may further include a photospacer (PS) 144. The photospacer 144 may be disposed between the cathode 143 and the pixel definition layer 13. The photospacer 144 may be used to support the fine metal mask (FMM) during the deposition of the cathode 44, preventing it from scratching the layer structure of the display panel 10.

[0119] For example, the cathode support post 144 may be made of an organic material. For instance, the cathode support post 144 may be made of photosensitive polyimide (PSPI).

[0120] like Figure 4 As shown, the encapsulation layer 15 can be disposed on the surface of the pixel unit layer 14 away from the thin-film transistor layer 12. Exemplarily, the encapsulation layer 15 may include a first encapsulation layer 151, a second encapsulation layer 152, and a flexible interlayer 153. The first encapsulation layer 151 is located on the surface of the cathode 143 away from the light-emitting layer 142. The flexible interlayer 153 is located between the first encapsulation layer 151 and the second encapsulation layer 152.

[0121] Since the material of the light-emitting layer 142 is an organic material, organic materials are easily oxidized when exposed to water vapor and oxygen, causing the light-emitting layer 142 to fail. At this time, the encapsulation layer 15 can encapsulate the pixel unit layer 14 of the display area 1, that is, protect the pixel unit layer 14, thereby preventing water vapor and oxygen in the air from affecting the lifespan of the light-emitting layer 142.

[0122] The flexible interlayer 153 can act as a water and oxygen buffer for structures such as the thin-film transistor layer 12 and pixel unit layer 14 below the encapsulation layer 15, reducing encapsulation failure caused by foreign matter. The first encapsulation layer 151 and the second encapsulation layer 152 can also seal the flexible interlayer 153.

[0123] For example, the first encapsulation layer 151 and the second encapsulation layer 152 can be SiO layers or SiN layers fabricated by chemical vapor deposition (CVD). The flexible interlayer 153 can be an acrylate or cured polyester polymer organic layer formed by ink jet printing (IJP) technology.

[0124] The protective layer 16 may be disposed on the surface of the encapsulation layer 15 that is away from the substrate 11. Exemplarily, the protective layer 16 may be disposed on the surface of the second encapsulation layer 152 of the encapsulation layer 15 that is away from the flexible interlayer 153.

[0125] Figure 5 yes Figure 3 The diagram shows a cross-sectional view of the display panel 10 at the BB line of one embodiment.

[0126] like Figure 3 and Figure 5 As shown, the encapsulation area 2 may include an isolation area 4 and a fan-out area 5. The fan-out area 5 may be connected between the isolation area 4 and the display area 1. Figure 3The display area 1, isolation area 4, and fan-out area 5 are schematically distinguished by dotted lines. For example, isolation area 4 can be annular and arranged around the through hole 10d. Fan-out area 5 can also be annular and arranged around isolation area 4.

[0127] The isolation zone 4 can be used to prevent water vapor and oxygen at the position of the through hole 10d from entering the display area 1 through the hole wall of the through hole 10d along the cathode 44 of the isolation zone 4, causing the light-emitting layer of the display area 1 to be corroded and unable to emit light normally, that is, to avoid the appearance of "black spots" ("black spots" are the parts of the display area 1 that cannot emit light normally) in the display area 1.

[0128] like Figure 5 As shown, the fan-out area 5 may include a second substrate 51, a fan-out trace 52, a cathode 53, an encapsulation layer 54, and a protective layer 55.

[0129] The fan-out traces 52 of the fan-out area 5 can be disposed on the second substrate 51. Exemplarily, the fan-out traces 52 can be electrically connected to the pixel units via horizontal switch gate traces, horizontal light-emitting gate traces, and vertical data traces in the display panel 10, thereby preventing line breaks due to the aperture area 3 and causing malfunction of the display panel 10. The traces electrically connected by the fan-out traces 52 are not limited to, nor do they need to completely include, the aforementioned three types of traces; these three types of traces are merely examples. In specific embodiments, one or more of these three types of traces can be disconnected in the fan-out area 5. The fan-out traces 52 can be a collection of metal traces wound along the edge of the aperture area 3. The area where the fan-out traces 52 are located is the fan-out area 5.

[0130] For example, the material of the second substrate 51 can be polyimide (PI), polyethylene terephthalate (PET), paper, metal, ultra-thin glass, etc.

[0131] In some embodiments of this application, the second substrate 51 of the fan-out area 5 may be connected to the substrate 11 of the display area 1 (e.g., Figure 4 (As shown) It is formed through the same process. In this way, no additional processes are needed, and production costs are not increased.

[0132] The cathode 53 of the fan-out region 5 can be disposed on the second substrate 51 of the fan-out region 5 and cover the fan-out trace 52 of the fan-out region 5.

[0133] The encapsulation layer 54 of the fan-out region 5 can be disposed on the surface of the cathode 53 of the fan-out region 5, away from the second substrate 51. Exemplarily, the encapsulation layer 54 of the fan-out region 5 may include a first encapsulation layer 541, a second encapsulation layer 542, and a flexible interlayer 543. The flexible interlayer 543 is located between the first encapsulation layer 541 and the second encapsulation layer 542. The first encapsulation layer 541 is disposed on the surface of the cathode 53 of the fan-out region 5, away from the second substrate 51.

[0134] The protective layer 55 of the fan-out region 5 can be disposed on the surface of the encapsulation layer 54 of the fan-out region 5 that is away from the cathode 53 of the fan-out region 5. For example, the protective layer 55 of the fan-out region 5 can be disposed on the surface of the second encapsulation layer 542 of the encapsulation layer 54 of the fan-out region 5 that is away from the cathode 53 of the fan-out region 5.

[0135] like Figure 5 As shown, the isolation region 4 may include a first substrate 41, an insulating isolation pillar 43, a cathode 44, an encapsulation layer 45 (ThinFilm Encapsulation, TFE), and a protective layer 406.

[0136] The first substrate 41 serves to provide a support substrate for the layers above it (e.g., insulating isolation pillars 43). Exemplarily, the material of the first substrate 41 may be polyimide (PI), or it may be polyethylene terephthalate (PET), paper, metal, ultrathin glass, etc.

[0137] In some embodiments of this application, the first substrate 41 of the encapsulation region 2 may be connected to the substrate 11 of the display region 1 (e.g., Figure 4 (As shown) It is formed through the same process. In this way, no additional processes are needed, and production costs are not increased.

[0138] An insulating isolation post 43 can be disposed on the first substrate 41. The insulating isolation post 43 can be annular and disposed around the through hole 10d. The specific structure and function of the insulating isolation post 43 will be described below with reference to the accompanying drawings. It is understood that the shape of the insulating isolation post 43 can be adjusted according to the shape of the through hole 10d and the shape of the isolation area 4, and is not limited to the shape shown in this application.

[0139] The insulating isolation post 43 can be used to isolate the cathode 44 of the isolation zone 4, such that the cathode 44 of the isolation zone 4 is isolated to form a first portion 441 and a second portion 442. The first portion 441 of the cathode 44 of the isolation zone 4 can be disposed on the first substrate 41. The second portion 442 of the cathode 44 of the isolation zone 4 can be disposed on the surface of the insulating isolation post 43 away from the first substrate 41. It should be noted that the cathode 44 being isolated to form the first portion 441 and the second portion 442 means that the first portion 441 and the second portion 442 are disconnected and isolated at the isolation point. Disconnection can mean that the height of the first portion 441 from the first substrate 41 at the isolation point and the height of the second portion 442 from the first substrate 41 at the isolation point are not equal. The first portion 441 and the second portion 442 being isolated at the isolation point means that there is a gap between the first portion 441 and the second portion 442 and they are electrically insulated.

[0140] The isolation zone 4 is isolated from the cathode 44 by an insulating isolation pillar 43. This prevents the current from the cathode 143 of the display area 1 from being conducted to the cathode 44 of the isolation zone 4, thus preventing the isolation zone 4 from becoming charged and undergoing electrochemical corrosion, which would lead to the failure of the isolation zone 4's encapsulation. It also prevents moisture and oxygen at the via 10d position from entering the display area 1 through the location of the encapsulation failure.

[0141] In some embodiments of this application, when the isolation region 4 further includes a light-emitting layer (not shown), the insulating isolation pillar 43 can also be used to block the light-emitting layer of the isolation region 4. The insulating isolation pillar 43 can be used to prevent water vapor and oxygen at the opening region 3 from passing through the through hole 10d (e.g., Figure 2B The hole wall (as shown) enters the display area 1 along the light-emitting layer of the isolation area 4, thereby preventing the light-emitting layer 142 of the display area 1 from being corroded and unable to emit light normally, that is, preventing the appearance of "black spots" ("black spots" are the parts of the display area 1 that cannot emit light normally) in the display area 1.

[0142] In some embodiments of this application, the cathode 44 of the isolation region 4 may be connected to the cathode 143 of the display region 1 (e.g., Figure 4 (As shown) It is formed through the same process. In this way, no additional processes are needed, and production costs are not increased.

[0143] The encapsulation layer 45 can be disposed on the first substrate 41 and cover the insulating isolation pillar 43 and the cathode 44. The encapsulation layer 45 can serve as a water and oxygen buffer for the structure below the flexible encapsulation layer 45, reducing encapsulation failure caused by foreign objects.

[0144] For example, the encapsulation layer 45 may include a first encapsulation layer 451, a second encapsulation layer 452, and a flexible interlayer 453. The flexible interlayer 453 is located between the first encapsulation layer 451 and the second encapsulation layer 452. The first encapsulation layer 451 is disposed on the side of the cathode 44 away from the first substrate 41.

[0145] In some embodiments of this application, the flexible encapsulation layer 45 of the encapsulation region 2 can be coupled to the flexible encapsulation layer 15 of the display region 1 (e.g., ...). Figure 4 (As shown) It is formed through the same process. In this way, no additional processes are needed, and production costs are not increased.

[0146] For example, the materials of the first encapsulation layer 451 and the second encapsulation layer 452 can be silicon nitride (SiNx) or silicon oxide (SiOx). The material of the flexible interlayer 453 can be acrylate or a cured polyester polymer organic material.

[0147] In some embodiments of this application, the protective layer 406 may be disposed on the surface of the encapsulation layer 45 that is remote from the first substrate 41. Exemplarily, the protective layer 406 may be disposed on the surface of the second encapsulation layer 452 that is remote from the first encapsulation layer 451.

[0148] The above text, with reference to the accompanying drawings, describes one structure of the isolation zone 4. The following text, with reference to the accompanying drawings, will describe several structures of the insulating isolation column 43.

[0149] like Figure 3 and Figure 5 As shown, the insulating isolation post 43 may include an organic insulating portion 431 and a first metal portion 432. For example, both the organic insulating portion 431 and the first metal portion 432 may be annular and disposed around the through hole 10d.

[0150] For example, the first metal portion 432 may include a first top surface 4321, a first bottom surface 4322, a first sidewall 4323, and a second sidewall 4324. The first top surface 4321 and the first bottom surface 4322 of the first metal portion 432 are disposed opposite to each other. The first bottom surface 4322 of the first metal portion 432 faces the first base 41. The first top surface 4321 of the first metal portion 432 faces away from the first base 41. One of the second sidewall 4324 and the first sidewall 4323 of the first metal portion 432 faces the display area 1, and the other faces the opening area 3. Figure 5 The diagram illustrates the first metal part 432 with its second sidewall 4324 facing the opening area 3. The first sidewall 4323 and the second sidewall 4324 of the first metal part 432 are both connected between the first top surface 4321 and the first bottom surface 4322 of the first metal part 432.

[0151] The organic insulating portion 431 may include a first portion 4313 and a second portion 4314, which are schematically distinguished by dashed lines in the figure. The first portion 4313 of the organic insulating portion 431 is connected between the second portion 4314 of the organic insulating portion 431 and the first substrate 41. The first metal portion 432 may be located on one side of the first portion 4313 of the organic insulating portion 431, and the second portion 4314 of the organic insulating portion 431 may be located on the side of the first metal portion 432 away from the first substrate 41. Exemplarily, the first portion 4313 of the organic insulating portion 431 includes a fifth sidewall 4398 and a sixth sidewall 4399. One of the fifth sidewall 4398 and the sixth sidewall 4399 faces the display area 1, and the other faces the opening area 3. The fifth sidewall 4398 of the first portion 4313 of the organic insulating portion 431 may be connected to the first sidewall 4323 of the first metal portion 432. The sixth sidewall 4399 of the first portion 4313 of the organic insulating portion 431 faces away from the first metal portion 432. The second portion 4314 of the organic insulating portion 431 may include a first surface 4315 and a third surface 4317. The first surface 4315 of the second portion 4314 of the organic insulating portion 431 is connected to the first top surface 4321 of the first metal portion 432. The third surface 4317 of the second portion 4314 of the organic insulating portion 431 faces away from the first metal portion 432.

[0152] The edge of the first surface 4315 of the second portion 4314 of the organic insulating portion 431 may extend beyond the edge of the first top surface 4321 of the first metal portion 432. Along the thickness direction of the display panel 10, the projection of the edge of the first surface 4315 of the second portion 4314 of the organic insulating portion 431 onto the first substrate 41 extends beyond the projection of the edge of the first top surface 4321 of the first metal portion 432 onto the first substrate 41. The organic insulating portion 431 may be used to isolate the first portion 441 and the second portion 442 of the cathode 44. The first portion 441 of the cathode 44 is disposed on the first substrate 41, and the second portion 442 of the cathode 44 may be disposed on the sixth sidewall 4399 of the first portion 4313 of the organic insulating portion 431 and the third surface 4317 of the second portion 4314 of the organic insulating portion 431. The disconnected first portion 441 and second portion 442 of the cathode 44 are separated by an insulating isolation post 43 and an encapsulation layer 45. For example, the first surface 4315 of the second portion 4314 of the organic insulating portion 431 may intersect with the upper edge of the second sidewall 4324 of the first metal portion 432 and form a first groove 4325. The first portion 441 and the second portion 442 of the cathode 44 may be disconnected at the first groove 4325.

[0153] Understandably, compared to Figure 1As shown, even though the cathode is isolated by a metal portion, it may still be connected in series through the metal. In the technical solution of this application, by setting the edge of the first surface 4315 of the second portion 4314 of the organic insulating portion 431 to extend beyond the edge of the first top surface 4321 of the first metal portion 432, the first portion 441 and the second portion 442 of the cathode 44 are isolated. The second portion 442 of the cathode 44 and the first metal portion 432 are completely separated by the organic insulating portion 431, preventing the second portion 442 of the cathode 44 from contacting the first metal portion 432. This prevents the disconnected first portion 441 and the second portion 442 of the cathode 44 from being connected in series through the first metal portion 432, and prevents the current of the cathode 143 of the display area 1 from being conducted to the cathode 44 of the isolation area 4, causing the isolation area 4 to become charged and undergo electrochemical corrosion, resulting in the failure of the packaging of the isolation area 4. Furthermore, the fifth sidewall 4398 of the first portion 4313 of the organic insulating portion 431 can be connected to the first sidewall 4323 of the first metal portion 432, and the first surface 4315 of the second portion 4314 of the organic insulating portion 431 can be connected to the first top surface 4321 of the first metal portion 432. At the location of the first sidewall 4323 of the first metal portion 432, the organic insulating portion 431 can prevent the first portions 441 of the cathodes 44 on both sides of the first metal portion 432 from being connected in series through the first metal portion 432, thus preventing the current from the cathode 143 of the display area 1 from being conducted to the cathode 44 of the isolation area 4, causing the isolation area 4 to become charged and undergo electrochemical corrosion, leading to the failure of the isolation area 4's encapsulation. Figure 5 As shown, Figure 5 In the enlarged schematic diagram, the first part 441 and the second part 442 of the cathode 44 on the right side of the first metal part 432 are schematically distinguished by dashed lines. The insulating isolation pillar 43 effectively isolates the cathode 44, and the encapsulation of the isolation area 4 is not prone to failure, which helps to reduce the risk of "black spots" appearing in the display area 1.

[0154] For example, the second sidewall 4324 of the first metal portion 432 can be as follows: Figure 5 The slope shown, or the second sidewall 4324 of the first metal part 432, can be parallel to the thickness direction of the display panel 10.

[0155] In some embodiments of this application, such as Figure 5 As shown, the first metal portion 432 may include a first metal layer 4329, the bottom surface of which is connected to the first substrate 41. That is, the first metal portion 432 can be a single-layer metal layer. The molding process is simple. For example, the first metal layer 4329 may be made of aluminum.

[0156] In some embodiments of this application, the material used for the organic insulating portion 431 may include one or more of photosensitive polyimide (PSPI), polyimide (PI), polyamide, polyacrylamide, and phenolic resin. For example, when the material used for the organic insulating portion 431 includes photosensitive polyimide (PSPI), the organic insulating portion 431 is cured by light without the need for heat curing. This avoids thermal shrinkage of the organic insulating portion 431, allows for better control of its dimensional accuracy, and enables the organic insulating portion 431 to better separate the first portion 441 and the second portion 442 of the cathode 44.

[0157] In some embodiments of this application, when the flexible interlayer 453 is formed by inkjet printing, the flexible interlayer 453 is fluid before curing. The insulating isolation pillar 43 can be used to block the uncured flexible interlayer 453 to prevent the uncured flexible interlayer 453 from flowing into the isolation area 4 and out through the isolation area 4 to the opening area 3. That is, the insulating isolation pillar 43 can be used to prevent overflow and block the flow of the uncured flexible interlayer 453. The encapsulation area 2 can be exempted from the setting of the isolation dam. Using the insulating isolation pillar 43 to block the flexible interlayer 453 can reduce the area ratio of the encapsulation area 2 on the display panel 10 and increase the area ratio of the display area 1 in the display panel 10, so that the display panel 10 has more area to be used for displaying images, resulting in a better user experience.

[0158] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 6 yes Figure 3 The cross-sectional view of the display panel 10 shown at the BB line is from another embodiment.

[0159] like Figure 6As shown, the first metal portion 432 may include a second metal layer 4326 and a third metal layer 4327 stacked together. The second metal layer 4326 is disposed on the first substrate 41, and the third metal layer 4327 is disposed on the surface of the second metal layer 4326 away from the first substrate 41. The surface of the third metal layer 4327 facing away from the second metal layer 4326 is the first top surface 4321 of the first metal portion 432. The surface of the second metal layer 4326 facing the first substrate 41 is the first bottom surface 4322 of the first metal portion 432. The second metal layer 4326 includes an eleventh sidewall 4301 and a twelfth sidewall 4303. One of the eleventh sidewall 4301 and the twelfth sidewall 4303 of the second metal layer 4326 faces the display area 1, and the other faces the opening area 3. The third metal layer 4327 includes a thirteenth sidewall 4302, a fourteenth sidewall 4304, and an eighth top surface 4305. The eighth top surface 4305 of the third metal layer 4327 is connected between the thirteenth sidewall 4302 and the fourteenth sidewall 4304 of the third metal layer 4327. The eighth top surface 4305 of the third metal layer 4327 faces away from the second metal layer 4326. One of the thirteenth sidewall 4302 and the fourteenth sidewall 4304 of the third metal layer 4327 faces the display area 1, and the other faces the opening area 3. The eleventh sidewall 4301 of the second metal layer 4326 and the thirteenth sidewall 4302 of the third metal layer 4327 constitute the first sidewall 4323 of the first metal part 432. The twelfth sidewall 4303 of the second metal layer 4326 and the fourteenth sidewall 4304 of the third metal layer 4327 are identical, forming the second sidewall 4324 of the first metal part 432.

[0160] The second portion 442 of the cathode 44 and the first metal portion 432 can be completely separated by the organic insulating portion 431. Exemplarily, the first surface 4315 of the second portion 4314 of the organic insulating portion 431 can intersect with the fourteenth sidewall 4304 of the third metal layer 4327 and form a first groove 4325.

[0161] Understandably, compared to traditional technical solutions, such as Figure 1As shown, the first metal part 432 is provided with three metal layers, and the groove formed by the three metal layers is used to isolate the cathode. In this application, the first metal part 432 is not provided with a third metal layer, and the third metal layer is eliminated. The first surface 4315 of the second part 4314 of the organic insulating part 431 can intersect with the fourteenth sidewall 4304 of the third metal layer 4327 and form the first groove 4325. The first part 441 and the second part 442 of the cathode 44 can be separated by the edge of the organic insulating part 431, which avoids the second part 442 of the cathode 44 from contacting and connecting with the first metal part 432, and avoids the first part 441 and the second part 442 of the cathode 44 from being re-electrically connected through the first metal part 432. The insulating isolation column 43 of this application has a better effect in isolating the cathode 44.

[0162] In some embodiments of this application, the material used for the second metal layer 4326 may include titanium (Ti), and the material used for the third metal layer 4327 may include aluminum (Al). In some embodiments of this application, the material used for the second metal layer 4326 may also include molybdenum (Mo). In some embodiments of this application, the material used for the third metal layer 4327 may also be titanium-molybdenum (MoTi). The third metal layer 4327 may consist of two layers.

[0163] In some embodiments of this application, the first metal portion 432 of the insulating isolation pillar 43 can be formed in the same process as the first source 1261, second source 1262, third source 1263, or drain 127 of the display area 1. In this way, no additional process is required, and production costs are not increased.

[0164] For example, the first metal portion 432 can be formed in the same process as the second source electrode 1262 of the display panel 10. When preparing the first metal portion 432, three metal layers can be formed first, and then the third metal layer can be removed by the etching process used to form the third source electrode 1263 of the display panel 10 to form the first metal portion 432.

[0165] In some embodiments of this application, the isolation region 4 may further include an insulating layer 42. Exemplarily, the insulating layer 42 may be disposed on the first substrate 41. The insulating isolation pillar 43 and the first portion 441 of the cathode 44 may be disposed on the surface of the insulating layer 42 away from the first substrate 41. In some embodiments of this application, the insulating layer 42 and the first buffer layer 1211 of the display area 1 may be formed in the same process. This eliminates the need for additional processes and avoids increasing production costs.

[0166] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 7 yes Figure 3The cross-sectional view of the display panel 10 shown at the BB line is from another embodiment.

[0167] For example, Figure 6 The diagram illustrates the following: the eleventh sidewall 4301 of the second metal layer 4326 and the thirteenth sidewall 4302 of the third metal layer 4327 face the display area 1, while the twelfth sidewall 4303 of the second metal layer 4326 and the fourteenth sidewall 4304 of the third metal layer 4327 face the opening area 3. An insulating isolation pillar 43 isolates the cathode 44 on the side closest to the opening area 3.

[0168] like Figure 7 As shown, the eleventh sidewall 4301 of the second metal layer 4326 and the thirteenth sidewall 4302 of the third metal layer 4327 can also face the opening area 3. The twelfth sidewall 4303 of the second metal layer 4326 and the fourteenth sidewall 4304 of the third metal layer 4327 can also face the display area 1. The insulating isolation pillar 43 isolates the cathode 44 on the side near the display area 1.

[0169] In some embodiments of this application, when there are multiple insulating isolation pillars 43, the multiple insulating isolation pillars 43 can isolate the cathode 44 on the side near the opening area 3 or near the display area 1. Alternatively, some insulating isolation pillars 43 can isolate the cathode 44 on the side near the opening area 3 and some insulating isolation pillars 43 can isolate the cathode 44 on the side near the display area 1.

[0170] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 8A yes Figure 3 The cross-sectional view of the display panel 10 shown at the BB line is from another embodiment.

[0171] like Figure 8AAs shown, the insulating isolation post 43 may further include a second metal portion 433. The first metal portion 432 and the second metal portion 433 are disposed spaced apart on the first base 41. Exemplarily, the second metal portion 433 may include a second top surface 4336, a third sidewall 4334, and a fourth sidewall 4335. One of the third sidewall 4334 and the fourth sidewall 4335 of the second metal portion 433 faces the opening area 3, and the other faces the display area 1. The third sidewall 4334 of the second metal portion 433 faces the first sidewall 4323 of the first metal portion 432. One of the second sidewall 4324 of the first metal portion 432 and the fourth sidewall 4335 of the second metal portion 433 faces the opening area 3, and the other faces the display area 1. Exemplarily, the second metal portion 433 may be disposed on the side of the first metal portion 432 closest to the opening area 3. The second sidewall 4324 of the first metal portion 432 may face the opening area 3. The fourth sidewall 4335 of the second metal part 433 can face the display area 1.

[0172] The first metal portion 432 and the second metal portion 433 may be disposed on both sides of the first portion 4313 of the organic insulating portion 431, and the first metal portion 432 and the second metal portion 433 may be spaced apart and insulated by the organic insulating portion 431. The sixth sidewall 4399 of the first portion 4313 of the organic insulating portion 431 may be connected to the third sidewall 4334 of the second metal portion 433. The second portion 4314 of the organic insulating portion 431 may further include a second surface 4316. The second surface 4316 of the second portion 4314 of the organic insulating portion 431 may be connected to the second top surface 4336 of the second metal portion 433. The edge of the second surface 4316 of the second portion 4314 of the organic insulating portion 431 may extend beyond the edge of the second top surface 4336 of the second metal portion 433. Exemplarily, the second surface 4316 of the second portion 4314 of the organic insulating portion 431 may intersect with the fourth sidewall 4335 of the second metal portion 433 and form a second groove 4333. The first part 441 and the second part 442 of the cathode 44 can be disconnected at the second groove 4333.

[0173] Understandably, by providing the second metal part 433, during the formation of the cathode 44 in the isolation zone 4, the cathode 44 will be broken twice on the side of the organic insulating part 431 facing the display area 1 and on the side facing the opening area 3, forming a layered first part 441 and a second part 442. The organic insulating part 431 of an insulating isolation pillar 43 can isolate the cathode 44 in the isolation zone 4 twice, and the insulating isolation pillar 43 has a better isolation effect on the cathode 44.

[0174] In some embodiments of this application, the second portion 442 of the cathode 44 is entirely disposed on the third surface 4317 of the second portion 4314 of the organic insulating portion 431.

[0175] In some embodiments of this application, the first portion 4313 of the organic insulating portion 431 further includes a bottom wall 4390. The bottom wall 4390 is connected between the fifth side wall 4398 and the sixth side wall 4399. The bottom wall 4390 of the first portion 4313 of the organic insulating portion 431 may be connected to the first substrate 41 between the first metal portion 432 and the second metal portion 433.

[0176] In some embodiments of this application, the second metal portion 433 may include a fourth metal layer 4339. The bottom surface of the fourth metal layer 4339 is connected to the first substrate 41. That is, the second metal portion 433 is a single-layer structure. Exemplarily, the fourth metal layer 4339 may be made of aluminum.

[0177] In some embodiments of this application, the second metal portion 433 may also be disposed on the side of the first metal portion 432 near the opening area 3. The second sidewall 4324 of the first metal portion 432 faces the display area 1. The fourth sidewall 4335 of the second metal portion 433 faces the opening area 3.

[0178] In some embodiments of this application, when the isolation region 4 may further include an insulating layer 42, the first metal portion 432 and the second metal portion 433 may be disposed on the surface of the insulating layer 42 away from the first substrate 41. The first surface 4315 of the organic insulating portion 431 may be connected to the insulating layer 42 between the first metal portion 432 and the second metal portion 433.

[0179] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 8B yes Figure 3 The cross-sectional view of the display panel 10 shown at the BB line is from another embodiment.

[0180] like Figure 8B As shown, the second metal portion 433 may also include a fifth metal layer 4331 and a sixth metal layer 4332. The arrangement of the fifth metal layer 4331 and the sixth metal layer 4332 of the second metal portion 433 can refer to the arrangement of the second metal layer 4326 and the third metal layer 4327 of the first metal portion 432.

[0181] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 9 yes Figure 8B The diagram shows a structural schematic of another embodiment of the display panel 10 at point C.

[0182] like Figure 9As shown, the organic insulating portion 431 may include multiple stacked organic sublayers. Exemplarily, the organic insulating portion 431 may include a first organic sublayer 4311 and a second organic sublayer 4312. The first organic sublayer 4311 is disposed on a first top surface 4321 of the first metal portion 432, a first sidewall 4323 of the first metal portion 432, a second top surface 4336 of the second metal portion 433, a third sidewall 4334 of the second metal portion 433, and a first substrate 41 between the first metal portion 432 and the second metal portion 433. A portion of the second organic sublayer 4312 is disposed on the surface of the first organic sublayer 4311 away from the first metal portion 432, a portion is disposed on the surface of the first organic sublayer 4311 away from the second metal portion 433, and a portion is disposed on the surface of the first organic sublayer 4311 away from the first substrate 41. A second portion 442 of the cathode 44 is disposed on the second organic sublayer 4312.

[0183] It is understood that the organic insulating part 431 may include multiple organic sublayers, the thickness of the organic insulating part 431 can be set to be large, and the height of the insulating isolation post 43 can be high, which is beneficial to improving the anti-overflow effect of the insulating isolation post 43.

[0184] In some embodiments of this application, when the isolation region 4 further includes an insulating layer 42, the insulating layer 42 may be disposed between the first organic sublayer 4311 and the first substrate 41 along the thickness direction of the display panel 10.

[0185] In some embodiments of this application, the first organic sublayer 4311 can be formed in the same process as any one of the first planarization layer 1281, the second planarization layer 1282, and the third planarization layer 1283 of the display area 1. The second organic sublayer 4312 can be formed in the same process as the pixel define layer (PDL) 13 or the cathode support pillar 144 of the display area 1.

[0186] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 10 yes Figure 8B The diagram shows a structural schematic of another embodiment of the display panel 10 at point C.

[0187] like Figure 10As shown, the insulating isolation pillar 43 may include an organic insulating portion 431, a first metal portion 432, a second metal portion 433, and a padding layer 436. The padding layer 436 is disposed between the first metal portion 432, the second metal portion 433, and the first substrate 41. Exemplarily, along the thickness direction of the display panel 10, a portion of the padding layer 436 may be disposed between the organic insulating portion 431 and the insulating layer 42, a portion of the padding layer 436 may be disposed between the first metal portion 432 and the insulating layer 42, and a portion of the padding layer 436 may be disposed between the second metal portion 433 and the insulating layer 42. The padding layer 436 can be used to elevate the insulating isolation pillar 43. Exemplarily, a portion of the organic insulating portion 431 may be disposed on the side of the first metal portion 432 away from the insulating layer 42, a portion may be disposed on the side of the padding layer 436 away from the insulating layer 42, and a portion may be disposed on the side of the second metal portion 433 away from the insulating layer 42.

[0188] Understandably, by providing a padding height 436, the insulating isolation pillar 43 increases the distance between its top surface and the first substrate 41 during the formation of the cathode 44. This makes it easier for the cathode 44 to break at the sidewall of the insulating isolation pillar 43, resulting in a better isolation effect of the insulating isolation pillar 43 on the cathode 44. Furthermore, by providing the padding height 436, the height of the insulating isolation pillar 43 can be increased in the thickness direction of the first substrate 41, which helps improve the anti-overflow effect of the insulating isolation pillar 43.

[0189] In some embodiments of this application, when the isolation region 4 does not include the insulating layer 42, along the thickness direction of the display panel 10, the padding layer 436 may be partially disposed between the organic insulating portion 431 and the first substrate 41, partially disposed between the first metal portion 432 and the first substrate 41, and partially disposed between the second metal portion 433 and the first substrate 41. Exemplarily, the organic insulating portion 431 may be partially disposed on the side of the first metal portion 432 away from the first substrate 41, partially disposed on the side of the padding layer 436 away from the first substrate 41, and partially disposed on the side of the second metal portion 433 away from the first substrate 41.

[0190] In some embodiments of this application, the padding layer 436 may be a three-layer structure, including a first layer 4361, a second layer 4362, and a third layer 4363. The third layer 4363 is disposed on the surface of the insulating layer 42 away from the first substrate 41. The second layer 4362 is located between the first layer 4361 and the third layer 4363. The organic insulating portion 431, the first metal portion 432, and the second metal portion 433 may be disposed on the surface of the first layer 4361 away from the first substrate 41.

[0191] For example, when the isolation zone 4 does not include the insulating layer 42, the third layer 4363 may be disposed on the first substrate 41.

[0192] In some embodiments of this application, the first layer 4361, the second layer 4362, and the third layer 4363 may be made of insulating material. This prevents the first portions 441 of the cathodes 44 on both sides of the insulating isolation pillar 43 from being connected in series through the padding layer 436.

[0193] In some embodiments of this application, the padding layer 436 may also be a single-layer structure. The padding layer 436 may include only one of the first layer 4361, the second layer 4362, and the third layer 4363; or, the padding layer 436 may include more layers. The number of layers of the padding layer 436 can be reasonably set as needed. Furthermore, the padding layer 436 may be formed in the same process as the layer structure of the display area 1, or it may be formed in a separate process. This application does not impose any limitations.

[0194] In some embodiments of this application, such as Figure 4 and Figure 10 As shown, the padding layer 436 can be formed in the same process as one or more of the second buffer layer 1212, gate insulating layer 123, interlayer insulating layer 124, planarization layer 128, and inorganic protective layer 1294 of the display area 1. Specifically, the arrangement can be determined based on the number of layers and their positions in the padding layer 436. For example, when the padding layer 436 includes a first layer 4361, a second layer 4362, and a third layer 4363, the third layer 4363 can be formed in the same process as the first gate insulating layer 1231 of the display area 1. The second layer 4362 can be formed in the same process as the second gate insulating layer 1232 of the display area 1. The first layer 4361 can be formed in the same process as either the second buffer layer 1212 or the third gate insulating layer 1233 of the display area 1. For example, when the padding layer 436 is a single-layer structure, the padding layer 436 can be disposed on the same layer as any one of the interlayer insulating layer 124, the second buffer layer 1212, the first gate insulating layer 1231, the second gate insulating layer 1232 and the third gate insulating layer 1233 of the display area 1.

[0195] Figure 11 yes Figure 8B The diagram shows a structural schematic of another embodiment of the display panel 10 at point C.

[0196] like Figure 11 As shown, the pad layer 436 may be provided with a third groove 4364. The opening of the third groove 4364 may be located on the surface of the first layer 4361 of the pad layer 436 away from the first substrate 41, and between the first metal portion 432 and the second metal portion 433. A portion of the organic insulating portion 431 may be located within the third groove 4364. That is, the third groove 4364 may be used to accommodate a portion of the organic insulating portion 431.

[0197] For example, the third groove 4364 can penetrate the pad layer 436. The pad layer 436 is divided into two parts, located between the first metal part 432 and the first base 41, and between the second metal part 433 and the first base 41, respectively. That is, the third groove 4364 penetrates the first layer 4361, the second layer 4362, and the third layer 4363. The surface of the insulating layer 42 away from the first base 41 serves as the bottom surface of the third groove 4364. In some embodiments of this application, when the isolation region 4 does not include the insulating layer 42, the surface of the first base 41 can serve as the bottom surface of the third groove 4364.

[0198] In some embodiments of this application, the third groove 4364 may also penetrate a portion of the padding layer 436. For example, the third groove 4364 may penetrate the first layer 4361 of the padding layer 436, and the surface of the second layer 4362 away from the first substrate 41 serves as the bottom surface of the third groove 4364. The depth of the third groove 4364 in the direction perpendicular to the first substrate 41 can be designed according to actual needs, and this application does not limit it.

[0199] Understandably, in combination Figure 10 and Figure 11 As shown, the padding layer 436 may or may not have a third groove 4364 provided on it; this application does not impose any restrictions.

[0200] In some embodiments of this application, the third groove 4364 may be annular, and the third groove 4364 may be disposed around the opening area 3. In some embodiments of this application, the third groove 4364 may also be rectangular or other shapes.

[0201] Figure 12 yes Figure 8B The diagram shows a structural schematic of another embodiment of the display panel 10 at point C.

[0202] like Figure 11 and Figure 12 As shown, the padding layer 436 may further include a first metal pad 4366 and a second metal pad 4365. Along the thickness direction of the display panel 10, the second metal pad 4365 is disposed between the third layer 4363 and the second layer 4362. The first metal pad 4366 may be disposed between the second layer 4362 and the first layer 4361. By providing the second metal pad 4365 and the first metal pad 4366, the height of the insulating isolation pillar 43 can be further increased, improving the isolation effect of the insulating isolation pillar 43 on the cathode 44 and its anti-overflow effect on the encapsulation layer 45. Furthermore, the second metal pad 4365 and the first metal pad 4366 can strengthen the strength of the padding layer 436.

[0203] For example, the second metal pad 4365 includes a first portion 4367 and a second portion 4368. The first portion 4367 and the second portion 4368 of the second metal pad 4365 are disposed on the third layer 4363 at a distance. The second layer 4362 covers the first portion 4367 and the second portion 4368 of the second metal pad 4365. Along the thickness direction of the display panel 10, the first portion 4367 and the first metal portion 432 of the second metal pad 4365 are disposed opposite to each other. The second portion 4368 and the second metal portion 433 of the second metal pad 4365 are disposed opposite to each other.

[0204] For example, the first metal pad 4366 may also include a first portion 4369 and a second portion 4370. The first portion 4369 and the second portion 4370 of the first metal pad 4366 are disposed on the second layer 4362 at a distance. The first layer 4361 covers the first portion 4369 and the second portion 4370 of the first metal pad 4366. Along the thickness direction of the display panel 10, the first portion 4369 and the first metal portion 432 of the first metal pad 4366 are disposed opposite to each other. The second portion 4370 and the second metal portion 433 of the first metal pad 4366 are disposed opposite to each other.

[0205] It is understood that dividing the second metal pad 4365 and / or the first metal pad 4366 into two parts allows the portion of the pad 436 between the second metal pad 4365 and the first metal pad 4366 to be recessed away from the surface of the first base 41 and toward the first base 41 to form a groove, without the need to additionally provide a third groove 4364.

[0206] In some embodiments of this application, the second metal pad 4365 and the first metal pad 4366 are made of metallic materials. This strengthens the insulating isolation pillar 43. Exemplarily, the second metal pad 4365 can be connected to the first gate 1251 or the second gate 1252 of the display area 1 (e.g., ...). Figure 4 The first metal pad 4366 can be formed in the same process as the second gate 1252 or the third gate 1253 of the display area 1 (as shown). Figure 4 (As shown) are formed in the same process. When the second metal pad 4365 and the first gate 1251 of the display area 1 are formed in the same process, the first metal pad 4366 can be formed in the same process as the second gate 1252 and the third gate 1253 of the display area 1.

[0207] In some embodiments of this application, the padding layer 436 may also include either the second metal padding layer 4365 or the first metal padding layer 4366, or may have more layers of metal padding.

[0208] In some embodiments of this application, the padding layer 436 may also have a third groove 4364 while providing the second metal padding layer 4365 and the first metal padding layer 4366.

[0209] In some embodiments of this application, the second metal pad 4365 and / or the first metal pad 4366 may not be divided into two parts, and the second metal pad 4365 and / or the first metal pad 4366 may be a continuous structure along the direction from the display area 1 toward the opening area 3.

[0210] In some embodiments of this application, the third layer 4363 of the padding layer 436 of the plurality of insulating isolation pillars 43 can be connected to form a continuous layer structure. When the third layer 4363 of the padding layer 436 is made of inorganic material, the encapsulation and waterproofing effect of the third layer 4363 of the padding layer 436 is better.

[0211] In some embodiments of this application, the second layers 4362 of the plurality of padding layers 436 may also be connected to form a continuous layer structure for better encapsulation and waterproofing. And / or, the first layers 4361 of the plurality of padding layers 436 may also be connected to form a continuous layer structure for better encapsulation and waterproofing.

[0212] Figure 13 yes Figure 8B The diagram shows a structural schematic of another embodiment of the display panel 10 at point C.

[0213] like Figure 13 As shown, the third bottom surface 4383 of the second layer 4362 can connect to the third top surface 4384 of the second metal pad layer 4365, and the edge of the third bottom surface 4383 of the second layer 4362 extends beyond the edge of the third top surface 4384 of the second metal pad layer 4365. The third bottom surface 4383 of the second layer 4362 faces the third layer 4363. The third top surface 4384 of the second metal pad layer 4365 faces away from the third layer 4363. The second layer 4362 can also be used to separate the first portion 441 and the second portion 442 of the cathode 44. It is understood that the edge of the third bottom surface 4383 of the second layer 4362 can extend beyond the edge of the third top surface 4384 of the second metal pad layer 4365, and the second layer 4362 of the pad layer 436 can be used to separate the first portion 441 and the second portion 442 of the cathode 44. Therefore, the position of the insulating isolation column 43 separating the cathode 44 is increased, and the insulating isolation column 43 is more effective in separating the cathode 44.

[0214] For example, the edge of the third bottom surface 4383 of the second layer 4362 may extend beyond the edge of the third top surface 4384 of the second metal pad layer 4365 to form a notch 4360. During the fabrication of the cathode 44, the first portion 441 and the second portion 442 of the cathode 44 may be separated at the notch 4360. The edge of the third bottom surface 4383 of the second layer 4362 and the third layer 4363 are separated by an encapsulation layer 45. It is understood that the notch 4360 can be formed by adjusting the relative positional relationship between the third bottom surface 4383 of the second layer 4362 and the third top surface 4384 of the second metal pad layer 4365. Similarly, the notch 4360 can also be formed by adjusting the relative positional relationship between the fourth bottom surface 4306 of the first layer 4361 and the fourth top surface 4307 of the first metal pad layer 4366. The number of notches 4360 can be one or more. The specific number can be set according to requirements.

[0215] In some embodiments of this application, the padding height 436 includes a seventh sidewall 4371, an eighth sidewall 4372, a seventh top surface 4373, and a seventh bottom surface 4374. The seventh bottom surface 4374 of the padding height 436 is connected to the first base 41. The seventh top surface 4373 of the padding height 436 faces away from the first base 41. The seventh sidewall 4371 and the eighth sidewall 4372 of the padding height 436 are disposed opposite to each other. The seventh sidewall 4371 and the eighth sidewall 4372 of the padding height 436 are the sidewalls of the padding height 436. The seventh sidewall 4371 of the padding height 436 faces the display area, and the eighth sidewall 4372 of the padding height 436 faces the opening area 3. The notch 4360 of the padding height 436 may be located on the seventh sidewall 4371 or the eighth sidewall 4372 of the padding height 436, or as shown in the image. Figure 15 The seventh sidewall 4371 and the eighth sidewall 4372 of the padding layer 436 shown are both provided with a notch 4360.

[0216] Understandably, by setting notches 4360, the padding height 436 can increase the number of times an insulating isolation post 43 can block the cathode 44. For each additional notch 4360 added to the padding height 436, an insulating isolation post 43 can block the cathode 44 one more time, and the insulating isolation post 43 is more effective at blocking the cathode 44.

[0217] like Figure 13As shown, when the padding layer 436 includes a second metal pad 4365 and a first metal pad 4366, the opening of the notch 4360 can be located in the second metal pad 4365 and the first metal pad 4366. During the fabrication of the display panel 10, the notch 4360 can be formed by etching the second metal pad 4365 and the first metal pad 4366. In some embodiments of this application, the padding layer can also be composed of layers of different materials, and then one of the materials can be etched to form the notch 4360.

[0218] For example, Figure 13 The diagram illustrates four notches 4360. Specifically, the left edge of the third bottom surface 4383 of the second layer 4362 extends beyond the third top surface 4384 of the second metal pad layer 4365 to form a notch 4360 below the left side of the pad layer 4366; the right edge of the third bottom surface 4383 of the second layer 4362 extends beyond the third top surface 4384 of the second metal pad layer 4365 to form a notch 4360 below the right side of the pad layer 4366; the left edge of the fourth bottom surface 4306 of the first layer 4361 extends beyond the edge of the fourth top surface 4307 of the first metal pad layer 4366 to form a notch 4360 above the left side of the pad layer 4366; and the right edge of the fourth bottom surface 4306 of the first layer 4361 extends beyond the fourth top surface 4307 of the first metal pad layer 4366 to form a notch 4360 above the right side of the pad layer 4366.

[0219] Figure 14 yes Figure 8B The diagram shows a structural schematic of another embodiment of the display panel 10 at point C.

[0220] like Figure 14 As shown, along the thickness direction of the display panel 10, the first metal pad layer 4366 may include a first sublayer 4375, a second sublayer 4376, and a third sublayer 4377 stacked together. The first sublayer 4375 is disposed on the surface of the second layer 4362 of the pad layer 436 that is away from the second metal pad layer 4365. The second sublayer 4376 is disposed on the surface of the second layer 4362 of the first sublayer 4375 that is away from the pad layer 4366. The third sublayer 4377 is disposed on the surface of the second sublayer 4376 that is away from the first sublayer 4375. It is understood that the first metal pad layer 4366 can be formed in the same process as the source electrode 126 or the drain electrode 127. In this way, no additional process is required, and production costs are not increased.

[0221] For example, the first metal pad 4366 can be formed in the same process as the first source 1261 or drain 127. The materials used for the first sublayer 4375 and the third sublayer 4377 may include titanium (Ti) or molybdenum (Mo), and the material used for the second sublayer 4376 may include aluminum (Al).

[0222] For example, the first layer 4361 of the padding layer 436 can be formed in the same process as the inorganic protective layer (PVX) 1294 and / or the first planarization layer 1281 of the display area 1.

[0223] In some embodiments of this application, the second metal pad 4365 of the pad layer 436 may also be formed in the same process as any one of the first gate 1251, the second gate 1252, the third gate 1253, the source 126, and the drain 127.

[0224] Figure 15 yes Figure 8B The diagram shows a structural schematic of another embodiment of the display panel 10 at point C. Figure 16 yes Figure 8B The diagram shows a structural schematic of another embodiment of the display panel 10 at point C.

[0225] like Figure 8B , Figure 14 , Figure 15 and Figure 16 As shown, when the padding layer 436 includes a second metal padding layer 4365 and a first metal padding layer 4366, and the first metal padding layer 4366 can be formed in the same process as the source electrode 126 or the drain electrode 127, such as Figure 15 As shown, the first layer 4361 of the padding layer 436 can cover the first metal padding layer 4366; or as... Figure 16 As shown, the first layer 4361 of the padding layer 436 may not cover the first metal padding layer 4366, and a notch 4360 may be formed on the first metal padding layer 4366. Exemplarily, the fifth bottom surface 4391 of the third sub-layer 4377 may connect to the fifth top surface 4392 of the second sub-layer 4376, and the edge of the fifth bottom surface 4391 of the third sub-layer 4377 extends beyond the edge of the fifth top surface 4392 of the second sub-layer 4376.

[0226] For example, when the first metal pad 4366 and the source electrode 126 or the drain electrode 127 are formed in the same process, and the pad layer 436 is provided with a notch 4360, the first metal portion 432 of the insulating isolation pillar 43 can be formed in the same process as the second source electrode 1262. The notch 4360 on the first metal pad 4366 can be formed by etching the second source electrode 1262.

[0227] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 17 yes Figure 2B The diagram shows a structural schematic of another embodiment of the display panel 10 at point A. Figure 18 yes Figure 17 The cross-sectional view of the display panel 10 shown at the DD line is from another embodiment.

[0228] like Figure 17 and Figure 18 As shown, the isolation region 4 may also include a metal isolation pillar 46. The metal isolation pillar 46 is disposed around the opening region 3. The metal isolation pillar 46 is disposed on the first substrate 41. The encapsulation layer 45 of the isolation region 4 covers the insulating isolation pillar 43, the metal isolation pillar 46, and the cathode 44. The metal isolation pillar 46 is disposed at a distance from the insulating isolation pillar 43 through the encapsulation layer 45. The encapsulation layer 45 of the isolation region 4 covers the metal isolation pillar 46. Figure 16 The insulating isolation pillar 43 and the metal isolation pillar 46 are distinguished by lines of different thicknesses. The cathode 44 may also include a third portion 443. The metal isolation pillar 46 can be used to disconnect the first portion 441 and the third portion 443 of the cathode 44. The third portion 443 of the cathode 44 is disposed on the surface of the metal isolation pillar 46 away from the first substrate 41.

[0229] For example, along the thickness direction of the display panel 10, the metal isolation pillar 46 may include a first conductive layer 467, a second conductive layer 468, and a third conductive layer 469 stacked together. The second conductive layer 468 is disposed between the first conductive layer 467 and the third conductive layer 469. The first conductive layer 467 is disposed on the surface of the insulating layer 42 away from the first substrate 41. The third portion 443 of the cathode 44 is disposed on the surface of the third conductive layer 469 away from the second conductive layer 468. The sixth bottom surface 4691 of the third conductive layer 469 may be connected to the sixth top surface 4682 of the second conductive layer 468, and the edge of the sixth bottom surface 4691 of the third conductive layer 469 extends beyond the edge of the sixth top surface 4682 of the second conductive layer 468. The cross-section of the metal isolation pillar 46 may be approximately formed in an "I" shape to separate the first portion 441 and the third portion 443 of the cathode 44.

[0230] Understandably, by setting the metal isolation pillar 46 to disconnect the cathode 44, the channel for moisture and oxygen at the through hole 10d to invade along the cathode 44 of the isolation zone 4 towards the display area 1 is cut off as much as possible. This can reduce moisture and oxygen in the isolation zone 4 and lower the risk of sealing failure of the isolation zone 4.

[0231] In some embodiments of this application, the sixth bottom surface 4691 of the third conductive layer 469 may intersect with the first sidewall 4681 of the second conductive layer 468 and form a fourth groove 465. The sixth bottom surface 4691 of the third conductive layer 469 may intersect with the second sidewall 4693 of the second conductive layer 468 and form a fifth groove 466. Thus, during the formation of the cathode 44, the first portion 441 and the third portion 443 of the cathode 44 may be disconnected at the openings of the fourth groove 465 and the fifth groove 466 of the metal isolation post 46, thereby achieving the function of disconnecting the cathode 44. In some embodiments of this application, the metal isolation post 46 may also selectively provide either the fourth groove 465 or the fifth groove 466.

[0232] For example, when the isolation area 4 also includes a light-emitting layer, the metal isolation pillar 46 can also be used to disconnect the light-emitting layer. The metal isolation pillar 46 can also be used to prevent water vapor and oxygen at the opening area 3 from entering the display area 1 along the light-emitting layer of the isolation area 4, thereby preventing the light-emitting layer 142 of the display area 1 from being corroded and unable to emit light normally, that is, preventing the display area 1 from having "black spots" ("black spots" are the parts of the display area 1 that cannot emit light normally).

[0233] In some embodiments of this application, when the isolation region 4 further includes an insulating layer 42, the metal isolation pillar 46 may be disposed on the surface of the insulating layer 42 away from the first substrate 41.

[0234] For example, when the isolation area 4 also includes a light-emitting layer, the light-emitting layer of the isolation area 4 can be broken twice at the fourth groove 465 and the fifth groove 466 of the metal isolation pillar 46, respectively. This can reduce the amount of water vapor and oxygen entering the display area 1 along the light-emitting layer of the isolation area 4 at the opening area 3, thereby preventing the light-emitting layer 142 of the display area 1 from being corroded and unable to emit light normally, that is, preventing the appearance of "black spots" ("black spots" are the parts of the display area 1 that cannot emit light normally) in the display area 1.

[0235] In some embodiments of this application, the metal isolation pillar 46 may be formed in the same process as the first metal portion 432 of the insulating isolation pillar 43. For example, the first conductive layer 467 of the metal isolation pillar 46 may be formed in the same process as the second metal layer 4326 of the first metal portion 432. The second conductive layer 468 of the metal isolation pillar 46 may be formed in the same process as the third metal layer 4327 of the first metal portion 432.

[0236] Figure 19 yes Figure 2B The diagram shows a structural schematic of another embodiment of the display panel 10 at point A.

[0237] like Figures 17 to 19As shown, the number of metal isolation posts 46 provided in isolation zone 4 can be one or more. The number of insulating isolation posts 43 can also be one or more. For example, Figure 17 The diagram illustrates seven metal isolation posts 46 and two insulating isolation posts 43. Figure 19 The diagram illustrates four insulating isolation posts 43 and five metal isolation posts 46.

[0238] For example, the metal isolation pillar 46 can be located between two adjacent insulating isolation pillars 43, or on the side of the insulating isolation pillar 43 near the opening area 3, or on the side of the insulating isolation pillar 43 near the fan-out area 5. When there are multiple metal isolation pillars 46 and multiple insulating isolation pillars 43, the multiple metal isolation pillars 46 and multiple insulating isolation pillars 43 can be arranged alternately. The arrangement and number of metal isolation pillars 46 and insulating isolation pillars 43 in the isolation area 4 can be arranged according to requirements, and this application does not impose any restrictions.

[0239] In some embodiments of this application, at least one metal isolation pillar 46 is provided between two adjacent insulating isolation pillars 43. This is beneficial for maintaining a large distance between the two adjacent insulating isolation pillars 43. When the organic layer is etched to form the organic insulating portion 431 of the insulating isolation pillar 43, the organic insulating portions 431 of the two insulating isolation pillars 43 are separated, avoiding the organic insulating portions 431 of the two insulating isolation pillars 43 from sticking together and failing to isolate the cathode 44.

[0240] In some embodiments of this application, the metal isolation pillar 46 may be located on the side of the insulating isolation pillar 43 closer to the opening region 3. It is understood that when the isolation region 4 also includes a light-emitting layer, the metal isolation pillar 46 can be used to disconnect the light-emitting layer, reducing the risk of water and oxygen in the opening region 3 eroding the display area 1 along the light-emitting layer of the isolation region 4.

[0241] The above description, in conjunction with the accompanying drawings, details several embodiments of the display panel 10. The following description, in conjunction with the accompanying drawings, details a method for preparing the display panel 10 in one embodiment of this application.

[0242] In some embodiments of this application, the method for fabricating the display panel 10 may include: the display panel 10 includes a display area 1 and an isolation area 4; a first metal layer 491, a second metal layer 492, and a third metal layer 493 are sequentially formed on a substrate of the display panel 10; the first metal layer 491, the second metal layer 492, and the third metal layer 493 (not shown) of the display area 1 may be used to form the source 126 and / or drain 127 of the display area 1 (e.g., ...). Figure 4(As shown). The third metal layer 493 of isolation region 4 is removed. A portion of the first metal layer 491 and a portion of the second metal layer 492 of isolation region 4 are used to form the first metal portion 495 to be processed, and a portion of the first metal layer 491 and a portion of the second metal layer 492 of isolation region 4 are used to form the second metal portion 496 to be processed. An organic insulating portion 431 is formed on the first metal portion 495, on the second metal portion 496 to be processed, and between the first metal portion 495 and the second metal portion 496, providing insulation between them. The second metal layer 492 of the first metal portion 495 and the second metal layer 492 of the second metal portion 496 are etched to form the first metal portion 432 and the second metal portion 433. The organic insulating portion 431 includes a first portion and a second portion. The first portion of the organic insulating portion 431 is connected between the second portion of the organic insulating portion 431 and a first substrate. A first metal portion 432 and a second metal portion 433 are disposed on both sides of the first portion of the organic insulating portion 431. The first surface 4315 of the second portion of the organic insulating portion 431 is connected to the first top surface 4321 of the first metal portion 432. The edge of the first surface 4315 extends beyond the edge of the first top surface 4321 of the first metal portion 432. The second surface 4316 of the second portion of the organic insulating portion 431 is connected to the second top surface 4336 of the second metal portion 433. The edge of the second surface 4316 extends beyond the edge of the second top surface 4336 of the second metal portion 433. A cathode 44 is formed. The cathode 44 of the isolation region 4 is broken at the edge of the first surface 4315 and the edge of the second surface 4316 of the organic insulating part 431, forming a first part 441 and a second part 442. The first part 441 of the cathode 44 is disposed on the first substrate 41 of the isolation region 4, and the second part 442 of the cathode 44 is disposed on the third surface 4317 of the organic insulating part 431.

[0243] In some embodiments of this application, with Figure 13 Taking the structure of the insulating isolation column 43 shown in the figure as an example, the preparation method of one embodiment of the display panel 10 is specifically introduced. Figures 20 to 26 This is a cross-sectional view of the product structure corresponding to one of the manufacturing processes of the display panel 10. For example... Figures 20 to 26 As shown, the method for manufacturing the display panel 10 provided in this application includes the following steps: Figures 20 to 26 A cross-sectional view of the product structure corresponding to one of the manufacturing processes of the isolation area 4 of the display panel 10 is shown.

[0244] like Figure 20As shown, the display panel 10 includes a display area 1 and an isolation area 4. An insulating layer 42 and a padding layer 436 are sequentially formed on a first substrate 41 of the isolation area 4. Exemplarily, along the thickness direction of the first substrate 41, the padding layer 436 may include a third layer 4363, a second metal padding layer 4365, a second layer 4362, a first metal padding layer 4366, and a first layer 4361, which are sequentially stacked. The third layer 4363 is disposed on the surface of the insulating layer 42 away from the first substrate 41.

[0245] like Figure 20 and Figure 21 As shown, a first metal layer 491, a second metal layer 492, and a third metal layer 493 are sequentially formed on the padding layer 436 of the isolation region 4 and the display region 1. The first metal layer 491, the second metal layer 492, and the third metal layer 493 of the display region 1 can be used to form the source 126 and / or the drain 127 of the display region 1 (e.g., Figure 4 (As shown).

[0246] like Figure 21 and Figure 22 As shown, the third metal layer of the isolation region is etched away. A portion of the first metal layer 491 and a portion of the second metal layer 492 of the isolation region 4 form a first metal portion 495 to be processed, and a portion of the first metal layer 491 and a portion of the second metal layer 492 of the isolation region 4 form a second metal portion 496 to be processed.

[0247] For example, the first metal portion 495 to be processed may include a first metal layer 491 and a second metal layer 492 stacked together. The second metal portion 496 to be processed may include a first metal layer 491 and a second metal layer 492 stacked together.

[0248] like Figure 22 and Figure 23 As shown, a first organic sublayer 4311 is formed on the first metal part 495 to be processed, on the second metal part 496 to be processed, and between the first metal part 495 to be processed and the second metal part 496 to be processed.

[0249] like Figure 23 and Figure 24 As shown, the pad layer 436 is etched to expose the second metal pad layer 4365 and / or the first metal pad layer 4366 of the pad layer 436. Exemplarily, the first layer 4361 and the second layer 4362 of the pad layer 436 are etched.

[0250] like Figure 24 and Figure 25As shown, the second metal layer 492 of the first metal portion 495 to be processed and the second metal layer 492 of the second metal portion 496 to be processed are etched to form the first metal portion 432 and the second metal portion 433. Specifically, the first metal layer 491 of the first metal portion 495 to be processed forms the second metal layer 4326 of the first metal portion 432, and the second metal layer 492 of the first metal portion 495 to be processed forms the third metal layer 4327 of the first metal portion 432. The first metal layer 491 of the second metal portion 496 to be processed forms the fifth metal layer 4331 of the second metal portion 433, and the second metal layer 492 of the second metal portion 496 to be processed forms the sixth metal layer 4332 of the second metal portion 433.

[0251] For example, a wet etching process can be used to etch the second metal layer 492 of the first metal portion 495 to be treated and the second metal layer 492 of the second metal portion 496 to be treated.

[0252] For example, the second metal pad 4365 and the first metal pad 4366 of the pad layer 436 are etched to form a notch 4360.

[0253] like Figure 25 and Figure 26 As shown, a second organic sublayer 4312 is formed on a first organic sublayer 4311, and the first organic sublayer 4311 and the second organic sublayer 4312 constitute an organic insulating portion 431. The surface of the first organic sublayer 4311 facing the first metal portion 432 is the first surface 4315 of the organic insulating portion 431, and the surface of the first organic sublayer 4311 facing the second metal portion 433 is the second surface 4316 of the organic insulating portion 431. The surface of the second organic sublayer facing away from the first organic sublayer 4311 is the third surface 4317 of the organic insulating portion 431.

[0254] like Figure 24 and Figure 13 As shown, after the insulating isolation pillar 43 structure is formed, the cathode 44 is formed. During the forming process, the cathode 44 is broken on both sides of the second part 4314 of the organic insulating portion 431 to form a first part 441 and a second part 442. The first part 441 of the cathode 44 is disposed on the first substrate 41, and the second part 442 of the cathode 44 is disposed on the third surface of the second part 4314 of the organic insulating portion 431.

[0255] In some embodiments of this application, the second organic sublayer 4312 may not be formed in the preparation method of the display panel 10. Figure 22 and Figure 23 In the steps shown, the first organic sublayer 4311 directly constitutes the organic insulating part 431.

[0256] Understandably, it can be used as a reference. Figure 1The structure shown in the conventional technical solution involves first forming a first metal layer 491, a second metal layer 492, and a third metal layer 493 sequentially, then directly etching the second metal layer 492, and finally forming an organic insulating portion 431. The organic insulating portion 431 easily shrinks when heated, exposing the third metal layer 493. After disconnection, the second part 442 of the cathode 44 can contact and be electrically connected to the third metal layer 493. The first part 441 and the second part 442 of the cathode 44, after disconnection, are reconnected through the third metal layer 493, failing to completely insulate the two parts of the cathode 44. In the embodiments of this application, as... Figures 20 to 25 As shown, the technical solution of this application is to first remove the third metal layer 493, then form the organic insulating portion 431, and finally etch the second metal layer 492. This ensures that the organic insulating portion 431 can better cover the first top surface 4321 of the first metal portion 432 and the second top surface 4336 of the second metal portion 433. The organic insulating portion 431 is used to isolate the cathode 44, so the cathode 44 does not have the problem of contacting the third metal layer 493. The first part 441 and the second part 442 of the cathode 44 will not be reconnected. The insulating isolation pillar 43 of this application has a good isolation effect on the cathode 44, and the encapsulation effect of the encapsulation area 2 is good.

[0257] In some embodiments of this application, the insulating isolation pillar 43, including a first metal portion 432, a second metal portion 433, an inorganic insulating portion 437, and a padding layer 436, can all be formed simultaneously using the layer structure of the display area 1. This fabrication method does not require additional steps; it only requires changing the shape of the mask in the isolation area 4, without increasing production costs.

[0258] In some embodiments of this application, when the first metal portion 432, the second metal portion 433, and the second source electrode 1262 of the display area 1 are formed in the same process, the removal of the third metal layer 493 of the first metal portion 495 and the third metal layer 493 of the second metal portion 496 can be completed using the etching process during the formation of the third source electrode 1263. This eliminates the need for a new mask, avoids increasing the number of process steps, and helps reduce costs. Similarly, when the first metal portion 432, the second metal portion 433, and the first source electrode 1261 of the display area 1 are formed in the same process, the removal of the third metal layer 493 of the first metal portion 495 and the third metal layer 493 of the second metal portion 496 can be completed using the etching process during the formation of the second source electrode 1262.

[0259] For example, the first organic sublayer 4311 can be formed in the same process as the planarization layer 128 of the display area 1 or the cathode support pillar 144.

[0260] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 27 This is a schematic diagram of another embodiment of the insulating isolation column 43 provided in this application. Figure 27 The diagram shows two insulating isolation pillars 43. Figure 27 The perspective can be referenced Figure 5 From that perspective.

[0261] like Figure 27 As shown, the insulating isolation post 43 may include a first metal part 432, an inorganic insulating part 437, and a pad height 436. The pad height 436 is disposed on the first substrate 41, and the first metal part 432 may be disposed on the surface of the pad height 436 away from the first substrate 41.

[0262] The first metal portion 432 may include a first top surface 4321, a first bottom surface 4322, a first sidewall 4323, and a second sidewall 4324. The inorganic insulating portion 437 may include a first portion 4393 and a second portion 4394. Along the thickness direction of the display panel 10, the first portion 4393 of the inorganic insulating portion 437 may be connected between the second portion 4394 of the inorganic insulating portion 437 and the first substrate 41. The first metal portion 432 may be located on one side of the first portion 4393 of the inorganic insulating portion 437, and the second portion 4394 of the inorganic insulating portion 437 may be located on the side of the first metal portion 432 away from the first substrate 41. Exemplarily, the first portion 4393 of the inorganic insulating portion 437 may include a ninth sidewall 4396 and a tenth sidewall 4397. One of the ninth sidewall 4396 and the tenth sidewall 4397 faces the display area 1, and the other faces the opening area 3. The ninth sidewall 4396 of the first portion 4393 of the inorganic insulating portion 437 can be connected to the first sidewall 4323 of the first metal portion 432. The tenth sidewall 4397 of the inorganic insulating portion 437 faces away from the first metal portion 432. The second portion 4394 of the inorganic insulating portion 437 may include a fourth surface 4378 and a fifth surface 4379. The fourth surface 4378 of the second portion 4394 of the inorganic insulating portion 437 is connected to the first top surface 4321 of the first metal portion 432, and the edge of the fourth surface 4378 extends beyond the edge of the first top surface 4321 of the first metal portion 432. The fifth surface 4379 of the second portion 4394 of the inorganic insulating portion 437 faces away from the first metal portion 432. The inorganic insulating portion 437 can be used to separate the first portion 441 and the second portion 442 of the cathode 44. The first portion 441 of the cathode 44 can be disposed on the first substrate 41, and the second portion 442 of the cathode 44 can be disposed on the fifth surface 4379 of the second portion 4394 of the inorganic insulating portion 437 and the tenth sidewall 4397 of the first portion 4393 of the inorganic insulating portion 437.

[0263] For example, the fourth surface 4378 of the inorganic insulating portion 437 may intersect with the second sidewall 4324 of the first metal portion 432 and form a groove.

[0264] It is understood that in the technical solution of this application, an inorganic insulating part 437 is provided to isolate the first part 441 and the second part 442 of the cathode 44. The inorganic insulating part 437 is made of inorganic insulating material. The second part 442 of the cathode 44 and the first metal part 432 are completely separated by the inorganic insulating part 437, preventing the second part 442 of the cathode 44 from contacting the first metal part 432. This prevents the disconnected first part 441 and the second part 442 of the cathode 44 from being connected in series through the first metal part 432, and prevents the current of the cathode 143 of the display area 1 from being conducted to the cathode 44 of the isolation area 4, causing the isolation area 4 to become charged and undergo electrochemical corrosion, resulting in the failure of the packaging of the isolation area 4.

[0265] In some embodiments of this application, the inorganic insulating portion 437 may be made of an inorganic insulating material. For example, the material used in the inorganic insulating portion 437 may include one or more of silicon nitride (SiNx) and silicon oxide (SiOx).

[0266] In some embodiments of this application, an inorganic protective layer (not shown) may be added above the second source electrode 1262 and the first planarization layer 1281 of the display area 1 to protect the second source electrode 1262 and prevent the side aluminum layer of the second source electrode 1262 from being etched and forming an undercut during the process. The inorganic protective layer on the second source electrode 1262 can be configured similarly to the inorganic protective layer 1294 on the first source electrode 1261, and will not be described again here. Exemplarily, when an inorganic protective layer is provided above the second source electrode 1262 and the first planarization layer 1281 of the display area 1, the first metal part 432 of the insulating isolation pillar 43 can be formed in the same process as the second source electrode 1262, and the inorganic insulating part 437 can be formed in the same process as the inorganic protective layer above the second source electrode 1262.

[0267] In some embodiments of this application, the padding layer 436 includes a first metal padding layer 4366, a second metal padding layer 4365, a first layer 4361, a second layer 4362, and a third layer 4363. The arrangement of the second metal padding layer 4365, the first layer 4361, the second layer 4362, and the third layer 4363 can be referred to the foregoing description. Figure 14The insulating isolation pillar 43 shown is configured as follows: The first metal pad 4366 may include a first sub-layer 4375, a second sub-layer 4376, and a third sub-layer 4377 stacked together. The first sub-layer 4375 is disposed on the surface of the second layer 4362 of the pad height 436 that is away from the second metal pad 4365. The second sub-layer 4376 is disposed on the surface of the first sub-layer 4375 that is away from the surface of the second layer 4362 of the pad height 436. The third sub-layer 4377 is disposed on the surface of the second sub-layer 4376 that is away from the first sub-layer 4375. The first layer 4361 is disposed between the first metal portion 432 and the third sub-layer 4377.

[0268] For example, the first metal pad 4366 can be formed in the same process as the first source 1261 or drain 127. The material used for the first metal pad 4366 can be the same as the material used for the first source 1261 or drain 127 of the display area 1. In this way, no additional process is required, and no increase in production cost is required.

[0269] For example, the materials used in the first sublayer 4375 and the third sublayer 4377 may include titanium (Ti) or molybdenum (Mo), and the materials used in the second sublayer 4376 may include aluminum (Al).

[0270] In some embodiments of this application, the padding layer 436 may also omit the second metal padding layer 4365, the second layer 4362, and the third layer 4363.

[0271] Figure 28 yes Figure 27 A schematic diagram of another embodiment of the structure shown.

[0272] like Figure 28As shown, the insulating insulating post 43 may include a first metal portion 432, a second metal portion 433, an inorganic insulating portion 437, and a padding layer 436. The arrangement of the inorganic insulating portion 437 with the first metal portion 432, the second metal portion 433, and the padding layer 436 can refer to the arrangement of the organic insulating portion 431 with the first metal portion 432, the second metal portion 433, and the padding layer 436 described above. The second portion 4394 of the inorganic insulating portion 437 may also include a sixth surface 4395. The sixth surface 4395 may be connected to the second top surface 4336 of the second metal portion 433, and the edge of the sixth surface 4395 extends beyond the edge of the second top surface 4336 of the second metal portion 433. In this way, the cathode 44 can be interrupted twice, at the edges of the fourth surface 4378 and the sixth surface 4395 of the inorganic insulating portion 437, respectively. The second portion 442 of the cathode 44 and the first metal portion 432 can be completely separated by the inorganic insulating portion 437. The second portion 442 of the cathode 44 is disposed on the fifth surface 4379 of the second portion 4394 of the inorganic insulating portion 437. Exemplarily, the second portion 4394 of the inorganic insulating portion 437 may include two sub-parts, one sub-part connected to the first metal portion 432 and the other sub-part connected to the second metal portion 433. The fifth surface 4379 may also include two parts, one part facing away from the first metal portion 432 and the other part facing away from the second metal portion 433.

[0273] In some embodiments of this application, the padding layer 436 may be provided with a notch 4360. The method of providing the notch 4360 can be referred to the preceding text. Figure 16 The setting method of the notch 4360 in the embodiment shown will not be described again here.

[0274] In some embodiments of this application, the method for fabricating the display panel 10 may include: the display panel 10 includes a display area 1 and an isolation area 4; a first metal layer 491, a second metal layer 492, and a third metal layer 493 are sequentially formed on a substrate of the display panel 10; the first metal layer 491, the second metal layer 492, and the third metal layer 493 of the display area 1 can be used to form the source electrode 126 and / or the drain electrode 127 of the display area 1; the third metal layer 493 of the isolation area 4 is removed, and at least a portion of the first metal layer 491 and at least the second metal layer 492 of the isolation area 4 form a first metal portion 495 to be processed; an inorganic insulating portion 437 is formed on the first metal portion 495 to be processed in the isolation area 4. The second metal layer 492 of the first metal portion 495 to be processed is etched to form the first metal portion 432. The inorganic insulating portion 437 includes a first portion 4393 and a second portion 4394. The first portion 4393 of the inorganic insulating portion 437 is connected between the second portion 4394 of the inorganic insulating portion 437 and the first substrate 41. The first metal portion 432 is located on one side of the first portion 4393 of the inorganic insulating portion 437. The fourth surface 4378 of the second portion 4394 of the inorganic insulating portion 437 is connected to the first top surface 4321 of the first metal portion 432. The edge of the fourth surface 4378 extends beyond the edge of the first top surface 4321 of the first metal portion 432. A cathode 44 is formed. The cathode 44 of the isolation region 4 is broken at the edge of the fourth surface 4378 of the inorganic insulating part 437 to form a first part 441 and a second part 442. The first part 441 of the cathode 44 is disposed on the first substrate 41 of the isolation region 4, and the second part 442 of the cathode 44 is disposed on the fifth surface 4379 of the second part 4394 of the inorganic insulating part 437.

[0275] by Figure 27 Taking the insulating isolation post 43 shown in the figure as an example, another method for preparing the insulating isolation post 43 will be introduced in conjunction with the accompanying drawings, which is consistent with the previous description. Figures 20 to 26 The same technical content in the illustrated embodiments will not be repeated. Figures 29 to 31 This is a cross-sectional view of the product structure corresponding to another manufacturing process of the display panel 10. For example... Figures 29 to 31 As shown, the method for manufacturing the display panel 10 provided in this embodiment includes the following steps:

[0276] like Figure 29 As shown, a pad layer 436 is formed on the first substrate 41. A first metal portion 495 to be processed, a second metal portion 496 to be processed, and an inorganic insulating portion 437 are formed on the pad layer 436. The arrangement of the pad layer 436, the first metal portion 495 to be processed, and the second metal portion 496 to be processed can refer to the arrangement in the previous embodiment, such as... Figure 21 and Figure 22 As shown, this will not be elaborated upon here.

[0277] For example, the first metal pad 4366 of the pad layer 436 can be connected to the first source 1261 or drain 127 (e.g., Figure 4 (As shown) are formed through the same process.

[0278] like Figure 29 and Figure 30 As shown, the pad layer 436 is etched to expose the second metal pad layer 4365 and the first metal pad layer 4366 of the pad layer 436. Exemplarily, the first layer 4361 and the second layer 4362 of the pad layer 436 are etched.

[0279] like Figure 30 and Figure 31 As shown, the second metal layer 491 of the first metal portion 495 to be processed and the second metal layer 492 of the second metal portion 496 to be processed are etched to form the first metal portion 432 and the second metal portion 433.

[0280] By way of example, the second metal pad 4365 and the first metal pad 4366 of the pad layer 436 may also be etched to form a notch 4360.

[0281] The above text, with reference to the accompanying drawings, describes the structure of one type of opening region 3. The following text, with reference to the accompanying drawings, will further describe several other structures of the opening region 3.

[0282] In some embodiments of this application, the same technical content as in the foregoing embodiments will not be repeated. Figure 32 This is a planar front view of the display panel 10 in the plane direction provided in another embodiment of this application. Figure 32 The display area 1 and the encapsulation area 2 are schematically distinguished by dotted lines.

[0283] like Figure 32 As shown, the shape of the opening area 3 can also be racetrack-shaped. A racetrack-shaped opening area 3 can provide a larger channel for light to pass through or sound to propagate in the electronic device 300. The opening area 3 can be located to the left of the central axis M of the display panel. In some embodiments of this application, the opening area 3 can also be located on the central axis M of the display panel, that is, the central axis M passes through the area of ​​the display panel where the opening area 3 is located.

[0284] The shape of the opening area 3 is not limited to Figure 2B The circle shown and Figure 32 The racetrack-shaped shape shown can be further modified in some embodiments of this application, where the opening area 3 can be rectangular, elliptical, or other irregular shapes. Furthermore, the shape of the opening area 3 and the encapsulation area 2 can be different; for example, the opening area 3 can be rectangular, and the encapsulation area 2 can be circular. The shapes of the opening area 3 and the encapsulation area 2 can be designed according to requirements, and this application does not impose any limitations.

[0285] Furthermore, the number of opening areas 3 is not limited to Figure 2B and Figure 20 One is shown. In some embodiments of this application, the number of opening regions 3 may also be multiple, such as two. Specifically, it can be determined according to the needs of the product.

[0286] Figure 33 This is a planar front view of the display panel 10 in the plane direction provided in another embodiment of this application. Figure 33 The display area 1 and the encapsulation area 2 are schematically distinguished by dotted lines.

[0287] like Figure 33 As shown, the opening area 3 can also form an opening on the side wall 10c of the display panel 10. For example, the opening area 3 can form an opening on the top side wall 101c of the display panel. In some embodiments of this application, the opening area 3 can also form an opening on the bottom side wall 102c, the left side wall 103c, or the right side wall 104c of the display panel 10.

[0288] Since the opening area 3 forms an opening in the side wall 10c, the opening area 3 formed by the display panel 10 is an open area. At this time, when the encapsulation area 2 is arranged around the opening area 3, the shape of the encapsulation area 2 can be changed accordingly, and the encapsulation area 2 also becomes an open area. The shape of the insulating isolation pillar 43 of the encapsulation area 2 can be changed according to the position of the opening area 3; for example, the insulating isolation pillar 43 can be arc-shaped.

[0289] Figure 34 This is a planar front view of the display panel 10 in the plane direction provided in another embodiment of this application. Figure 34 The display area 1 and the encapsulation area 2 are schematically distinguished by dotted lines.

[0290] like Figure 34 As shown, the opening region 3 forms openings on the top sidewall 101c and the left sidewall 103c. This increases the openness of the opening region 3. When the encapsulation region 2 is positioned around the opening region 3, the encapsulation region 2 has a larger open area. In some embodiments of this application, the opening region 3 may also form openings on the top sidewall 101c and the right sidewall 104c, or on the bottom sidewall 102c and the left sidewall 103c, or on the bottom sidewall 102c and the right sidewall 104c.

[0291] It is understood that, without conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0292] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0293] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display panel (10), characterized in that, It includes a display area (1), an isolation area (4) and an opening area (3), wherein the isolation area (4) is disposed between the display area (1) and the opening area (3); The isolation zone (4) includes a first substrate (41), an insulating isolation column (43), and a cathode (44); The insulating isolation column (43) includes an organic insulating part (431), a first metal part (432), and a second metal part (433). The first metal part (432) and the second metal part (433) are disposed on the first substrate (41). The organic insulating part (431) includes a first part (4313) and a second part (4314). The first part (4313) of the organic insulating part (431) is connected between the second part (4314) of the organic insulating part (431) and the first substrate (41). The first metal part (432) and the second metal part (433) are disposed on both sides of the first part (4313) of the organic insulating part (431). The first surface (4315) of the second portion (4314) of the organic insulating part (431) is connected to the first top surface (4321) of the first metal part (432), and the edge of the first surface (4315) extends beyond the edge of the first top surface (4321) of the first metal part (432). The second surface (4316) of the second portion (4314) of the organic insulating part (431) is connected to the second top surface (4336) of the second metal part (433), and the edge of the second surface (4316) extends beyond the edge of the second top surface (4336) of the second metal part (433). The cathode (44) includes a first portion (441) and a second portion (442). The first portion (441) of the cathode (44) is disposed on the first substrate (41). The second portion (442) of the cathode (44) is disposed on the third surface (4317) of the second portion (4314) of the organic insulating portion (431). The third surface (4317) of the second portion (4314) of the organic insulating portion (431) faces away from the first metal portion (432) and the second metal portion (433).

2. The display panel (10) according to claim 1, characterized in that, The first metal part (432) includes a first metal layer (4329), the bottom surface of which is connected to the first substrate (41).

3. The display panel (10) according to claim 1, characterized in that, The first metal part (432) includes a second metal layer (4326) and a third metal layer (4327). The second metal layer (4326) is disposed on the first substrate (41), and the third metal layer (4327) is disposed on the surface of the second metal layer (4326) away from the first substrate (41). The surface of the third metal layer (4327) away from the second metal layer (4326) is the first top surface (4321) of the first metal part (432).

4. The display panel (10) according to claim 3, characterized in that, The material used in the third metal layer (4327) includes aluminum.

5. The display panel (10) according to any one of claims 1 to 4, characterized in that, A pad layer (436) is provided between the first metal part (432), the second metal part (433) and the first substrate (41).

6. The display panel (10) according to claim 5, characterized in that, The padding layer (436) includes a first layer (4361), a second layer (4362), a third layer (4363), a first metal pad layer (4366), and a second metal pad layer (4365). The first layer (4361), the second layer (4362), and the third layer (4363) are stacked along the thickness direction of the display panel (10). The third layer (4363) is disposed on the first substrate (41). The second metal pad layer (4365) is disposed between the third layer (4363) and the second layer (4362). The first metal pad layer (4366) is disposed between the second layer (4362) and the first layer (4361). The first metal part (432) is disposed on the surface of the first layer (4361) away from the second layer (4362). The third bottom surface (4383) of the second layer (4362) is connected to the third top surface (4384) of the second metal pad layer (4365), and the edge of the third bottom surface (4383) extends beyond the edge of the third top surface (4384) of the second metal pad layer (4365); The second layer (4362) is used to separate the first portion (441) of the cathode (44) and the second portion (442) of the cathode (44).

7. The display panel (10) according to claim 5, characterized in that, The padding layer (436) includes a first layer (4361), a second layer (4362), a third layer (4363), a first metal pad layer (4366), and a second metal pad layer (4365). The first layer (4361), the second layer (4362), and the third layer (4363) are stacked along the thickness direction of the display panel (10). The third layer (4363) is disposed on the first substrate (41). The second metal pad layer (4365) is disposed between the third layer (4363) and the second layer (4362). The first metal pad layer (4366) is disposed between the second layer (4362) and the first layer (4361). The first metal part (432) is disposed on the surface of the first layer (4361) away from the second layer (4362). Along the thickness direction of the display panel (10), the first metal pad layer (4366) includes a first sub-layer (4375), a second sub-layer (4376) and a third sub-layer (4377) stacked together, wherein the first sub-layer (4375) is disposed on the surface of the second layer (4362) away from the second metal pad layer (4365); The first sublayer (4375) and the third sublayer (4377) are made of materials including titanium or molybdenum, and the second sublayer (4376) is made of materials including aluminum.

8. The display panel (10) according to any one of claims 1 to 7, characterized in that, The isolation zone (4) further includes a metal isolation column (46), which is disposed on the first substrate (41) and spaced apart from the insulating isolation column (43); The metal isolation pillar (46) includes a first conductive layer (467), a second conductive layer (468) and a third conductive layer (469) stacked together. The first conductive layer (467) is disposed on a first substrate (41). The sixth bottom surface (4691) of the third conductive layer (469) is connected to the sixth top surface (4682) of the second conductive layer (468). The edge of the sixth bottom surface (4691) extends beyond the edge of the sixth top surface (4682) of the second conductive layer (468). The cathode (44) further includes a third portion (443), which is disposed on the surface of the third conductive layer (469) away from the second conductive layer (468). The number of insulating isolation columns (43) is multiple, and at least one metal isolation column (46) is provided between two adjacent insulating isolation columns (43).

9. A method for preparing a display panel (10), characterized in that, include: The display panel (10) includes a display area (1) and an isolation area (4). A first metal layer (491), a second metal layer (492) and a third metal layer (493) are formed sequentially on the substrate of the display panel (10). The first metal layer (491), the second metal layer (492) and the third metal layer (493) of the display area (1) are used to form the source (126) and / or drain (127) of the display area (1). Remove the third metal layer (493) of the isolation region (4), and a portion of the first metal layer (491) and a portion of the second metal layer (492) of the isolation region (4) form a first metal part (495) to be processed, and a portion of the first metal layer (491) and a portion of the second metal layer (492) of the isolation region (4) form a second metal part (496) to be processed; An organic insulating portion (431) is formed on the first metal portion (495) to be processed, on the second metal portion (496) to be processed, and between the first metal portion (495) to be processed and the second metal portion (496) to be processed; The second metal layer (492) of the first metal portion (495) to be treated and the second metal layer (492) of the second metal portion (496) to be treated are etched to form the first metal portion (432) and the second metal portion (433). The organic insulating portion (431) includes a first portion (4313) and a second portion (4314). The first portion (4313) of the organic insulating portion (431) is connected between the second portion (4314) of the organic insulating portion (431) and the substrate of the isolation region (4). The first metal portion (432) and the second metal portion (433) are disposed on the first portion of the organic insulating portion (431). On both sides of the organic insulating part (4313), the first surface 4315 (4315) of the second part (4314) of the organic insulating part (431) is connected to the first top surface (4321) of the first metal part (432), and the edge of the first surface (4315) extends beyond the edge of the first top surface (4321) of the first metal part (432). The second surface 4316 (4316) of the second part (4314) of the organic insulating part (431) is connected to the second top surface (4336) of the second metal part (433), and the edge of the second surface (4316) extends beyond the edge of the second top surface (4336) of the second metal part (433). A cathode (44) is formed, wherein the cathode (44) of the isolation region (4) is broken at the edge of the first surface (4315) and the edge of the second surface (4316) to form a first part (441) and a second part (442). The first part (441) of the cathode (44) is disposed on the substrate of the isolation region (4), and the second part (442) of the cathode (44) is disposed on the third surface (4317) of the second part (4314) of the organic insulating part (431).

10. A display panel (10), characterized in that, It includes a display area (1), an isolation area (4) and an opening area (3), wherein the isolation area (4) is disposed between the display area (1) and the opening area (3); The isolation zone (4) includes a first substrate (41), an insulating isolation column (43), and a cathode (44); The insulating isolation column (43) includes a first metal part (432), an inorganic insulating part (437), and a pad height (436). The pad height (436) is disposed on the first substrate (41), and the first metal part (432) is disposed on the surface of the pad height (436) away from the first substrate (41). The inorganic insulating part (437) includes a first part (4393) and a second part (4394). The first part (4393) of the inorganic insulating part (437) is connected between the second part (4394) of the inorganic insulating part (437) and the first substrate (41). The first metal part (432) is located on one side of the first part (4393) of the inorganic insulating part (437). The fourth surface (4378) of the second part (4394) of the inorganic insulating part (437) is connected to the first top surface (4321) of the first metal part (432), and the edge of the fourth surface (4378) extends beyond the edge of the first top surface (4321) of the first metal part (432). The cathode (44) includes a first part (441) and a second part (442). The first part (441) of the cathode (44) is disposed on the first substrate (41). The second part (442) of the cathode (44) is disposed on the fifth surface (4379) of the second part (4394) of the inorganic insulating part (437). The fourth surface (4378) of the second part (4394) of the inorganic insulating part (437) and the fifth surface (4379) of the second part (4394) of the inorganic insulating part (437) are disposed opposite to each other. The padding layer (436) includes a first metal padding layer (4366) and a first layer (4361). Along the thickness direction of the display panel (10), the first metal padding layer (4366) includes a first sub-layer (4375), a second sub-layer (4376), and a third sub-layer (4377) stacked together. The first layer (4361) is disposed between the first metal part (432) and the third sub-layer (4377).

11. The display panel (10) according to claim 10, characterized in that, The material used for the first metal pad (4366) is the same as the material used for the first source electrode (1261) of the display area (1).

12. The display panel (10) according to claim 10 or 11, characterized in that, The first sublayer (4375) and the third sublayer (4377) are made of materials including titanium or molybdenum, and the second sublayer (4376) is made of materials including aluminum.

13. The display panel (10) according to any one of claims 10 to 12, characterized in that, The fifth bottom surface (4391) of the third sublayer (4377) is connected to the fifth top surface (4392) of the second sublayer (4376), and the edge of the fifth bottom surface (4391) extends beyond the edge of the fifth top surface (4392) of the second sublayer (4376). The third sublayer (4377) is used to separate the first part (441) of the cathode (44) and the second part (442) of the cathode (44).

14. The display panel (10) according to any one of claims 10 to 13, characterized in that, The first metal part (432) includes a first metal layer (4329), the bottom surface of which is connected to the first substrate (41).

15. The display panel (10) according to any one of claims 10 to 13, characterized in that, The first metal part (432) further includes a second metal layer (4326) and a third metal layer (4327). The second metal layer (4326) is disposed on the first substrate (41), and the third metal layer (4327) is disposed on the surface of the second metal layer (4326) away from the first substrate (41). The surface of the third metal layer (4327) away from the second metal layer (4326) is the first top surface (4321) of the first metal part (432).

16. The display panel (10) according to any one of claims 10 to 15, characterized in that, The insulating isolation column (43) further includes a second metal part (433), the first metal part (432) and the second metal part (433) are disposed on the first base (41), and the first metal part (432) and the second metal part (433) are disposed on both sides of the first part (4393) of the inorganic insulating part (437); The sixth surface (4395) of the second portion (4394) of the inorganic insulating part (437) is connected to the second top surface (4336) of the second metal part (433), and the edge of the sixth surface (4395) extends beyond the edge of the second top surface (4336) of the second metal part (433).

17. A method for preparing a display panel (10), characterized in that, include: The display panel (10) includes a display area (1) and an isolation area (4). A first metal layer (491), a second metal layer (492) and a third metal layer (493) are formed sequentially on the substrate of the display panel (10). The first metal layer (491), the second metal layer (492) and the third metal layer (493) of the display area (1) are used to form the source (126) and / or drain (127) of the display area (1). Remove the third metal layer (493) of the isolation region (4), and at least a portion of the first metal layer (491) and at least a portion of the second metal layer (492) of the isolation region (4) form a first metal part (495) to be processed; An inorganic insulating portion (437) is formed on the first metal portion (495) to be processed in the isolation zone; The second metal layer (492) of the first metal part (495) to be processed is etched to form the first metal part (432). The inorganic insulating part (437) includes a first part (4393) and a second part (4394). The first part (4393) of the inorganic insulating part (437) is connected between the second part (4394) of the inorganic insulating part (437) and the substrate of the isolation region (4). The first metal part (432) is located on one side of the first part (4393) of the inorganic insulating part (437). The fourth surface (4378) of the second part (4394) of the inorganic insulating part (437) is connected to the first top surface (4321) of the first metal part (432). The edge of the fourth surface (4378) extends beyond the edge of the first top surface (4321) of the first metal part (432). A cathode (44) is formed, wherein the cathode (44) of the isolation region (4) is broken at the edge of the fourth surface (4378) of the inorganic insulating part (437) to form a first part (441) and a second part (442). The first part (441) of the cathode (44) is disposed on the substrate of the isolation region (4), and the second part (442) of the cathode (44) is disposed on the fifth surface (4379) of the second part (4394) of the inorganic insulating part (437).

18. A display module (100), characterized in that, Includes a cover plate (20) and a display panel (10) as claimed in any one of claims 1 to 8, wherein the cover plate (20) is stacked on the display panel (10); or, It includes a cover plate (20) and a display panel (10) as claimed in any one of claims 10 to 16, wherein the cover plate (20) is stacked on the display panel (10).

19. An electronic device, characterized in that, It includes a housing (200) and a display module (100) as claimed in claim 18, the display module (100) being mounted on the housing (200).

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