A gas switching device for semiconductor manufacturing

Abstract

The application relates to the technical field of ventilation devices, and discloses a gas switching device for semiconductor preparation, which comprises a gas supply tank, a gas supply mechanism, a switching mechanism, a processing assembly and a gas path switching assembly. The gas supply mechanism is installed in the gas supply tank, the switching mechanism is installed above the gas supply tank, the processing assembly is located in the gas supply mechanism, and the gas path switching assembly is installed on the switching mechanism. The technical scheme solves the problem that the existing gas switching device for semiconductor preparation has a long switching process. Because stable pressure is required, standby path pre-charging needs to be carried out before switching. After the standby path pre-charging pressure is stabilized, the switching cycle is long, real seamless switching cannot be realized, and problems such as process interruption, capacity reduction and large pressure fluctuation are caused.

Description

Technical Field

[0001] This invention relates to the field of ventilation device technology, and more specifically to a gas switching device for semiconductor fabrication. Background Technology

[0002] Semiconductor chip manufacturing is a process in which a series of processes such as thin film growth, photolithography, etching, doping, cleaning, and planarization are repeatedly performed on a single silicon wafer to ultimately form an integrated circuit structure. If the semiconductor manufacturing process is interrupted, the entire batch of wafers will be scrapped. Therefore, a gas switching device is needed. The gas switching device can automatically switch to the backup gas source when the pressure of the main gas cylinder is insufficient, so as to achieve uninterrupted gas supply and improve equipment uptime. In addition, semiconductor manufacturing requires a variety of different gases, such as silicon source gas, etching gas, doping gas, carrier gas, cleaning gas, etc. These gases cannot be introduced into the cavity at the same time. They must be switched sequentially according to the process steps. Therefore, a dedicated gas switching device is needed to achieve orderly opening and closing of the gas path. Therefore, gas switching devices used in semiconductor fabrication are core components of semiconductor process gas circuit systems. They are used to achieve rapid, stable, leak-free, and cross-contamination-free switching between different process gases or main and backup gas sources, ensuring process continuity and wafer yield. Existing gas switching devices for semiconductor fabrication generally consist of five parts: a gas path module, a valve group module, a pressure stabilization and detection module, an evacuation and cleaning module, and a control and safety module. The gas path module is mainly used to depressurize and filter the gas from the high-pressure cylinder before sending it to the switching valve group, ensuring stable and clean inlet pressure. The valve group module is used to switch between different gases, ensuring that only one gas path is open at any given time. The pressure stabilization structure pre-charges, equalizes, and buffers the gas before and after switching, suppressing pressure spikes and fluctuations to ensure stable downstream gas supply. The evacuation and cleaning module performs vacuum suction and inert gas purging on the pipeline during switching to remove residual gas and avoid cross-contamination. The control and safety module is used for alarms, waste gas treatment, etc. The gas switching device for semiconductor fabrication enables orderly switching of gases for multiple processes, meeting the requirements of each process step. It also helps to avoid cross-mixing and cross-contamination of gases, ensure stable gas supply pressure and flow, and achieve uninterrupted gas supply from main and backup gas sources, thereby improving gas switching speed and process efficiency. However, existing gas switching devices for semiconductor fabrication suffer from time-consuming switching processes. Due to the need for stable pressure, backup circuit pre-charging is required before switching. Once the backup circuit pre-charging pressure stabilizes, the switching cycle is long, making it impossible to achieve truly seamless switching. This results in problems such as process interruption, reduced production capacity, and large pressure fluctuations. Summary of the Invention

[0003] This invention proposes a gas switching device for semiconductor fabrication, which solves the problem of time-consuming switching processes in related technologies. Due to the need for stable pressure, backup circuit pre-charging is required before switching. Once the backup circuit pre-charging pressure stabilizes, the switching cycle is long, making it impossible to achieve truly seamless switching, resulting in problems such as process interruption, reduced production capacity, and large pressure fluctuations.

[0004] The technical solution of the present invention is as follows: A gas switching device for semiconductor fabrication includes a gas supply box, a gas supply mechanism, a switching mechanism, a processing component, and a gas path switching component. The gas supply mechanism is installed inside the gas supply box; The switching mechanism is installed above the air supply box; The processing component is located within the gas supply mechanism; The gas path switching component is mounted on the switching mechanism.

[0005] Preferably, the gas supply mechanism includes a door, a main gas tank, a spare gas tank, a main gas pipe, and a spare gas pipe; The door is rotatably connected to the side wall of the gas supply box; The main gas tank is fixedly connected inside the gas supply box; The spare gas tank is fixedly connected inside the gas supply box, and the spare gas tank is located on the side of the gas supply box away from the main gas tank; The main air pipe is connected to the top of the main air tank; One end of the backup air pipe is connected to the top of the backup air tank.

[0006] More preferably, the switching mechanism includes a gas delivery chamber pipe, a vent pipe, a branch pipe, a spare connecting pipe, a flow damper, and a processing component; The gas delivery chamber is connected to the top of the main gas pipe; The vent pipe is connected to the top end of the gas delivery chamber pipe; One end of the branch pipe is connected to the gas delivery chamber pipe, and the other end of the branch pipe is connected to the vent pipe; One end of the spare connecting tube is connected to the other end of the spare air tube, and the other end of the spare connecting tube is connected to the air delivery chamber tube; Two flow-damping plates are provided, and the two flow-damping plates are respectively fixedly connected to one end of the main air pipe and the spare connecting pipe; The processing component is installed inside the gas supply box and is used to clean the pipeline during gas switching.

[0007] Furthermore, the processing assembly includes a first mounting plate, a vacuum pump, a second mounting plate, and a nitrogen purging device; The mounting plate is fixedly connected inside the gas supply box, and the mounting plate is located above the main gas tank and the spare gas tank. The vacuum pump is fixedly connected to the mounting plate 1. The input end of the vacuum pump 1 is connected to the gas delivery chamber pipe, and the output end of the vacuum pump passes through the gas supply box and is connected to the outside. The second mounting plate is fixedly connected inside the gas supply box, and the second mounting plate is located between the first mounting plate and the main gas tank. The nitrogen purging device is installed on the second mounting plate, and the output end of the nitrogen purging device is connected to the main gas pipe.

[0008] Furthermore, the gas path switching assembly includes a one-way valve, a pressure reducing valve one, a pressure reducing valve two, and a gas delivery chamber valve; Two one-way valves are provided, and the two one-way valves are respectively connected to the main air pipe and the backup air pipe; Two pressure reducing valves are provided, and the two pressure reducing valves are respectively connected to the two ends of the branch pipe; The pressure reducing valve 2 is connected to the spare connecting pipe; The gas delivery chamber valve is connected to the gas delivery chamber pipe.

[0009] The working principle and beneficial effects of this invention are as follows: 1. In this invention, when using the gas switching device to switch between the main and backup gas sources, the gas supply mechanism, the switching mechanism, and the gas path switching component work together to open the branch path and close the main path, allowing gas to flow through the branch path. At the same time, the valve of the backup gas path is opened, and gas is introduced into the main path for pressure stabilization. The branch path pressure is kept greater than the main path pressure, so the pressure stabilization will not affect the gas supply of the branch path. After the main path pressure is stable, the replaced main gas tank and the backup gas tank are supplied together. Then, the branch path valve is slowly closed to switch the main gas tank to supply gas to the main path. This reduces pressure fluctuations and pressure stabilization time during switching and does not affect the overall working efficiency of the device. 2. In this invention, when changing the process gas, the branch gas supply is changed first, then the main gas valve is closed, the processing component evacuates the main gas supply, and after evacuation, the branch gas supply and the gas source are closed. Then the processing component purges the main gas supply with inert gas. After purging, the main gas supply is restarted. Since the gas supply is stopped only after evacuation, the gas supply time is shorter compared to the method in the prior art, so the process interruption time is shorter and the process efficiency is improved. Attached Figure Description

[0010] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0011] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the gas supply mechanism of the present invention; Figure 3 This is a schematic diagram of the processing component structure of the present invention; Figure 4 This is a schematic diagram of the switching mechanism and gas path switching component of the present invention; Figure 5 This is a partial cross-sectional structural schematic diagram of the switching mechanism of the present invention.

[0012] In the diagram: 1. Gas supply box; 2. Box door; 3. Main gas tank; 4. Spare gas tank; 5. Main gas pipe; 6. Spare gas pipe; 7. Gas delivery chamber pipe; 8. Vent pipe; 9. Branch pipe; 10. Spare connecting pipe; 11. Flow buffer; 12. Mounting plate one; 13. Vacuum pump; 14. Mounting plate two; 15. Nitrogen purging device; 16. Check valve; 17. Pressure reducing valve one; 18. Pressure reducing valve two; 19. Gas delivery chamber valve; 20. Pressure reducing valve three. Detailed Implementation

[0013] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0014] like Figures 1-5 As shown, this embodiment proposes a gas switching device for semiconductor fabrication, including a gas supply box 1, a gas supply mechanism, a switching mechanism, a processing component, and a gas path switching component. The gas supply mechanism is installed inside the gas supply box 1, the switching mechanism is installed above the gas supply box 1, the processing component is located inside the gas supply mechanism, and the gas path switching component is installed on the switching mechanism. When the gas switching device is working, it reduces pressure fluctuations and stabilization time during switching, without affecting the overall working efficiency of the device. Compared with the existing technology of first closing the passage and then vacuuming and purging, the time to close the gas passage is shorter, so the process interruption time is shorter and the process efficiency is improved.

[0015] The gas supply mechanism includes a door 2, a main gas tank 3, a spare gas tank 4, a main gas pipe 5, and a spare gas pipe 6. The door 2 is rotatably connected to the side wall of the gas supply box 1. The main gas tank 3 is fixedly connected inside the gas supply box 1. The spare gas tank 4 is fixedly connected inside the gas supply box 1 and is located on the side of the gas supply box 1 away from the main gas tank 3. The main gas pipe 5 is connected to the top of the main gas tank 3. One end of the spare gas pipe 6 is connected to the top of the spare gas tank 4. The main gas tank 3 is used for the main gas supply. When the gas in the main gas tank 3 is insufficient, the gas supply is switched to the spare gas tank 4.

[0016] The switching mechanism includes a gas delivery pipe 7, a ventilation pipe 8, a branch pipe 9, a backup connecting pipe 10, a flow damper 11, and a processing component. The gas delivery pipe 7 is connected to the top end of the main gas pipe 5, the ventilation pipe 8 is connected to the top end of the gas delivery pipe 7, one end of the branch pipe 9 is connected to the gas delivery pipe 7, and the other end of the branch pipe 9 is connected to the ventilation pipe 8. One end of the backup connecting pipe 10 is connected to the other end of the backup gas pipe 6, and the other end of the backup connecting pipe 10 is connected to the gas delivery pipe 7. The flow damper 11... There are two buffer plates 11, which are fixedly connected to one end of the main gas pipe 5 and the backup connecting pipe 10 respectively. The processing component is installed in the gas supply box 1 and is used to clean the pipeline when the gas is switched. When the main gas tank 3 supplies gas, the gas flows from the main gas tank 3 into the main gas pipe 5, then from the main gas pipe 5 into the gas delivery chamber pipe 7, and then from the gas delivery chamber pipe 7 into the ventilation pipe 8, and then into the semiconductor preparation position. The backup gas tank 4 first flows into the backup gas pipe 6, and then into the gas delivery chamber pipe 7 through the backup connecting pipe 10.

[0017] The processing components include mounting plate 12, vacuum pump 13, mounting plate 2 14, and nitrogen purging device 15. Mounting plate 12 is fixedly connected to the gas supply box 1 and is located above the main gas tank 3 and the spare gas tank 4. Vacuum pump 13 is fixedly connected to mounting plate 12. The input end of vacuum pump 13 is connected to the gas delivery chamber pipe 7, and the output end of vacuum pump 13 passes through the gas supply box 1 and is connected to the outside. Mounting plate 2 14 is fixedly connected to the gas supply box 1 and is located between mounting plate 12 and the main gas tank 3. Nitrogen purging device 15 is installed on mounting plate 2 14, and the output end of nitrogen purging device 15 is connected to the main gas pipe 5. Finally, the gas switching assembly includes a one-way valve 16, a pressure reducing valve 17, a pressure reducing valve 2 18, and a gas delivery valve 19. There are two one-way valves 16, connected to the main gas pipe 5 and the backup gas pipe 6 respectively. There are two pressure reducing valves 17, connected to both ends of the branch pipe 9 respectively. The pressure reducing valve 2 18 is connected to the backup connecting pipe 10. The gas delivery valve 19 is connected to the gas delivery pipe 7. Before switching gas sources, pressure reducing valves 17 and 2 18 are closed, the one-way valve 16 on the main gas pipe 5 is open, the one-way valve 16 on the backup gas pipe 6 is closed, and the gas delivery valve 19 is open, allowing gas to flow from the main gas tank 3 into the main gas pipe. 5. Then, the main air pipe 5 is connected to the gas delivery chamber valve 19, and then the gas delivery chamber valve 19 is connected to the ventilation pipe 8. When the gas source needs to be switched, the one-way valve 16 and the pressure reducing valve 18 on the backup air pipe 6 are slowly activated, while the one-way valve 16 on the main air pipe 5 is slowly closed, the gas delivery chamber valve 19 is closed, and the two pressure reducing valves 17 are opened. The gas from the backup gas tank 4 flows into the backup air pipe 6, and then through the backup connecting pipe 10 into the gas delivery chamber pipe 7. The gas flow flows into the gas delivery chamber pipe 7 above the gas delivery chamber valve 19, and then through the gas delivery chamber pipe 7 into the ventilation pipe 8. After the pressure in the gas delivery chamber pipe 7 stabilizes, the two pressure reducing valves 17 are closed. At this time, the gas is supplied entirely by the backup gas tank 4. After the main gas tank 3 is replaced, the gas supply is switched back to the main gas tank 3. When changing process gases, under normal operating conditions, open pressure reducing valve 18 and close gas delivery valve 19 and pressure reducing valve 20. Gas flows into the ventilation pipe 8 through the branch pipe 9. At this time, the main gas tank 3 transmits gas normally. Vacuum pump 13 starts and evacuates the gas delivery pipe 7 to a vacuum. Then, stop the gas supply from the main gas tank 3, keep the gas delivery valve 19 closed, open the two pressure reducing valves 17, 18, and 20, and start the vacuum pump 13 to continue evacuating the vacuum. Then, the nitrogen purging device 15 cleans and empties the pipeline. Finally, the main gas tank 3 is replaced with a different process gas. This scheme does not affect the gas supply while evacuating the vacuum, so the time required for the evacuation and cleaning process is greatly shortened, effectively ensuring the continuity of the gas switching process and improving process efficiency.

[0018] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A gas switching device for semiconductor production, comprising a gas supply tank (1), characterized in that, Also includes: A gas supply mechanism is installed inside the gas supply box (1); A switching mechanism is installed above the air supply box (1); A processing component, located within the gas supply mechanism; A gas path switching assembly is mounted on the switching mechanism.

2. The gas switching device for semiconductor manufacturing according to claim 1, wherein The gas supply mechanism includes: Box door (2), the box door (2) is rotatably connected to the side wall of the air supply box (1); The main gas tank (3) is fixedly connected inside the gas supply box (1); A spare gas tank (4) is fixedly connected inside the gas supply box (1) and is located on the side of the gas supply box (1) away from the main gas tank (3). Main air pipe (5), which is connected to the top of the main air tank (3); A spare air tube (6) is provided, one end of which is connected to the top of the spare air tank (4).

3. The gas switching device for semiconductor manufacturing according to claim 2, wherein The switching mechanism includes: Gas delivery chamber (7), the gas delivery chamber (7) is connected to the top end of the main gas pipe (5); Ventilation tube (8), the ventilation tube (8) is connected to the top end of the gas delivery tube (7); Diversion branch pipe (9), one end of which is connected to the gas delivery chamber pipe (7), and the other end of which is connected to the ventilation pipe (8); A spare connecting pipe (10) is provided, one end of which is connected to the other end of the spare air pipe (6), and the other end of which is connected to the air delivery chamber pipe (7). Two flow-slowing plates (11) are provided, and the two flow-slowing plates (11) are respectively fixedly connected to one end of the main air pipe (5) and the spare connecting pipe (10); A processing component is installed inside the gas supply box (1) and is used to clean the pipeline during gas switching.

4. The gas switching device for semiconductor manufacturing according to claim 3, wherein The processing component includes: Mounting plate one (12) is fixedly connected inside the air supply box (1) and is located above the main air tank (3) and the spare air tank (4); Vacuum pump (13), the vacuum pump (13) is fixedly connected to the mounting plate (12), the input end of the vacuum pump (13) is connected to the gas delivery chamber (7), and the output end of the vacuum pump (13) passes through the gas supply box (1) and is connected to the outside. Mounting plate two (14) is fixedly connected inside the air supply box (1) and is located between mounting plate one (12) and the main air tank (3); A nitrogen purging device (15) is installed on the mounting plate 2 (14), and the output end of the nitrogen purging device (15) is connected to the main gas pipe (5).

5. A gas switching device for semiconductor fabrication according to claim 4, characterized in that, The gas path switching component includes: Two check valves (16) are provided, and the two check valves (16) are respectively connected to the main air pipe (5) and the backup air pipe (6); Pressure reducing valve 1 (17), there are two pressure reducing valves 1 (17), and the two pressure reducing valves 1 (17) are respectively connected to the two ends of the branch pipe (9); Pressure reducing valve 2 (18), which is connected to the spare connecting pipe (10); Gas delivery chamber valve (19) is connected to the gas delivery chamber pipe (7).

Images