Automatic tin ball planting machine for BGA chip

Abstract

The present application relates to the field of tin ball planting equipment, and particularly relates to a BGA chip automatic tin ball planting machine, which comprises a tray conveying mechanism arranged on a table plate, a tin paste scraping mechanism and a tin paste dotting mechanism located at one side of the tray conveying mechanism, a vacuum fixing mechanism and a tray jacking mechanism located below the tray conveying mechanism, the vacuum fixing mechanism and the tray jacking mechanism being arranged side by side along the feeding direction of the tray conveying mechanism, a ball planting mechanism located above the tray conveying mechanism and the tray jacking mechanism, and a first visual detection assembly and a second visual detection assembly respectively located at two sides of the tray conveying mechanism. The present application realizes full-automatic batch ball planting on the contact pin of the chip, has high ball planting efficiency and good ball planting effect, has low equipment investment cost and low maintenance cost, has low dependence on professional technicians, and solves the problems of high equipment cost, poor compatibility with different specifications of chips, high maintenance cost and high technical threshold of the current automatic ball planting machine or laser ball planting machine.

Description

Technical Field

[0001] This invention relates to the field of solder ball placement equipment, and more particularly to an automatic solder ball placement machine for BGA chips. Background Technology

[0002] BGA chip soldering (also known as "balling") is a key process in electronic repair and rework. Its purpose is to reinstall solder balls on the pads at the bottom of the BGA chip to ensure reliable soldering to the PCB board. Currently, BGA chip soldering techniques are mainly divided into three categories: manual balling, automatic balling machine balling, and laser balling. Traditional manual BGA chip soldering is mainly accomplished through the following steps: 1. Prepare the BGA balling tools; the stencil must be cleaned to prevent the solder balls from rolling unevenly; 2. Arrange the stencil... 1. Place the chip on the ball-mounting platform base; 2. Cover with the solder squeegee frame; 3. Print solder paste onto the solder squeegee mesh. The worker should try to control the angle, force, and speed of the squeegee when scraping by hand. After completion, remove the solder squeegee frame; 4. After confirming that each BGA pad is evenly printed with solder paste, put the solder ball frame on for positioning, then put in the solder ball, and shake the ball-mounting platform back and forth and left and right to let the solder ball roll into the mesh. After confirming that there is a solder ball in each mesh, the solder ball can be collected and the solder ball frame can be removed. The manual method of soldering BGA chips has low efficiency. The shortcomings of poor performance and high cost hinder industrial development. When using automatic ball-mounting machines, automated ball-mounting is achieved through robotic arm positioning and vacuum nozzles for ball placement. However, this method can only handle a limited number of balls at a time. To meet the needs of batch ball placement, multiple robotic arms are typically equipped with vacuum nozzles for each ball placement. Due to the small gap between adjacent balls on BGA chip pads, it is difficult for multiple robotic arms to simultaneously handle ball placement, significantly limiting efficiency. Furthermore, high-end automatic ball-mounting machines cost over one million yuan per unit and have poor chip specification compatibility, requiring custom fixtures and programs when changing product models, making the high processing costs unaffordable for small and medium-sized enterprises. Laser ball-mounting equipment has even higher maintenance costs and technical barriers, limiting its widespread application. Therefore, developing a device that can automate and batch ball-mounting of chips with low investment costs, high efficiency, and good performance to meet industrial development needs has become the primary problem to be solved. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide an automatic BGA chip solder ball placement machine that achieves automated batch solder ball placement of chips, has low equipment investment costs, high solder ball placement efficiency, good results, and meets the needs of industrial development.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The BGA chip automatic solder ball placement machine includes a platform. The platform is equipped with a tray conveying mechanism, a solder paste leveling mechanism, a solder paste application mechanism, a vacuum fixing mechanism, a tray lifting mechanism, a ball placement mechanism, a first vision inspection component, and a second vision inspection component. A tray is movably mounted on the tray conveying mechanism, which conveys the tray. The solder paste leveling mechanism is located on one side of the tray conveying mechanism and is used to store and level the solder paste. The vacuum fixing mechanism is located below the tray conveying mechanism and is used to evacuate the tray on the tray conveying mechanism to fix the chip. The solder paste application mechanism is located on the tray conveying mechanism... On one side, a solder paste application mechanism picks up solder paste from a solder paste leveling mechanism and applies it to the chips on the tray conveying mechanism. A tray lifting mechanism is located below the tray conveying mechanism. A vacuum fixing mechanism and a tray lifting mechanism are arranged side by side along the feeding direction of the tray conveying mechanism. The tray lifting mechanism is used to lift the tray on the tray conveying mechanism. A ball-planting mechanism is located above the tray conveying mechanism and the tray lifting mechanism and is used to plant solder balls on the chips on the tray conveying mechanism. A first vision detection component is located on the other side of the tray conveying mechanism and is used to identify whether the chips on the tray conveying mechanism have solder paste applied. A second vision detection component is located on one side of the tray conveying mechanism and is used to detect whether the chips have solder balls implanted.

[0005] Furthermore, the solder paste leveling mechanism includes multiple vertical columns mounted on the platform and a drive device mounting bracket. Each column has a solder tray at its top for holding solder paste. First linear guides are mounted on both sides of the solder tray. A first slider is mounted on each first linear guide. A solder scraping moving seat is mounted on each of the two first sliders. A solder scraping movable groove is formed through the top and bottom of the solder scraping moving seat. A scraper is movably mounted within the scraper movable groove. Scraper longitudinal drive devices are mounted at both ends of the solder scraping moving seat. A connecting plate is mounted at the output end of the scraper longitudinal drive device. The connecting plate is located above the scraper longitudinal drive device. The end of the connecting plate furthest from the output end of the scraper longitudinal drive device is fixedly connected to the scraper. A scraper transverse drive device is mounted on the drive device mounting bracket. The output end of the scraper transverse drive device is fixedly connected to the solder scraping moving seat.

[0006] Furthermore, the solder paste dispensing mechanism includes a solder paste dispensing bracket mounted on a platform, a solder paste dispensing lateral moving component mounted on the solder paste dispensing bracket, a solder paste dispensing lateral moving frame mounted on the moving part of the solder paste dispensing lateral moving component, a solder paste dispensing longitudinal moving component mounted on the solder paste dispensing lateral moving frame, a solder paste dispensing longitudinal moving frame mounted on the moving part of the solder paste dispensing longitudinal moving component, and a solder paste dispensing fixture mounted at the bottom of the solder paste dispensing longitudinal moving frame. The solder paste fixture includes a fixture body, and a plurality of solder paste dotting needle groups are provided at the bottom of the fixture body. Each solder paste dotting needle group includes a plurality of solder paste dotting needles installed at the bottom of the fixture body. The plurality of solder paste dotting needles in the same solder paste dotting needle group are arranged longitudinally and are parallel to each other.

[0007] Furthermore, the vacuum fixing mechanism includes a vacuum fixing base frame mounted on the platform and multiple limiting brackets. Multiple linear bearings are mounted on the top of the vacuum fixing base frame, and a linear guide rod is slidably installed within each linear bearing. A first vacuum suction cup is mounted on the top of each linear guide rod. A first drive device mounting plate is mounted on the top of the vacuum fixing base frame, and a suction cup drive device is mounted on the first drive device mounting plate. The output end of the suction cup drive device is fixedly connected to the first vacuum suction cup. Multiple limiting plates are mounted on the outer periphery of the first vacuum suction cup. Multiple limiting brackets are located on the periphery of the vacuum fixing base frame. Each limiting bracket has a limiting portion integrally formed extending laterally towards the first vacuum suction cup at its top. Each limiting bracket corresponds one-to-one with a limiting plate, and each limiting plate is located below the limiting portion of its corresponding limiting bracket.

[0008] Specifically, the first vacuum suction cup includes a base plate installed at the top of each linear guide rod and a frame on the edge of the base plate. The top of the base plate is equipped with multiple support platforms, and each support platform supports the bottom of the material tray. A first through hole for installing a vacuum connector is opened longitudinally through the base plate. The tray includes a tray body, with multiple positioning holes on the edge of the tray body and multiple positioning grooves on the top of the tray body for positioning the chips. A second through hole is provided through the top and bottom of the positioning grooves. The first visual inspection component includes a first camera bracket mounted on a platform. A first CCD camera and a light source are mounted sequentially from top to bottom on the top of the first camera bracket. The first CCD camera and the light source are located above the vacuum fixing mechanism.

[0009] Furthermore, the tray conveying mechanism includes a first belt conveyor, a second belt conveyor, a lateral positioning component, a first blocking component, and a second blocking component mounted on the platform. The first belt conveyor and the second belt conveyor are arranged side by side along the tray conveying direction and are connected end to end. The inlet and outlet ends of the first belt conveyor are respectively equipped with a first proximity switch and a second proximity switch. The inlet end of the second belt conveyor is equipped with a third proximity switch. The lateral positioning component is located on the other side of the tray conveying mechanism and is used to laterally position the tray. The first blocking component is located below the first belt conveyor and is used to block and position the tray being conveyed on the first belt conveyor. The second blocking component is located below the second belt conveyor and is used to block and position the tray being conveyed on the second belt conveyor. The first blocking assembly includes a second drive device mounting plate mounted on the platform, a baffle drive device mounted on the top of the second drive device mounting plate, and a baffle mounted on the output end of the baffle drive device; the structure of the second blocking assembly is the same as that of the first blocking assembly. The lateral positioning assembly includes a lateral positioning bracket mounted on a platform, a push plate driving device mounted on the top of the lateral positioning bracket, and a lateral push plate mounted on the output end of the push plate driving device.

[0010] Specifically, the material tray lifting mechanism includes a lifting bracket mounted on the platform, a suction cup longitudinal moving assembly mounted on the lifting bracket, a suction cup lifting frame mounted on the moving part of the suction cup longitudinal moving assembly, and a second vacuum suction cup for supporting the material tray mounted on the suction cup lifting frame. The structure of the second vacuum chuck is the same as that of the first vacuum chuck.

[0011] Furthermore, the ball-planting mechanism includes two ball-planting brackets mounted side-by-side on a platform, with a mesh plate mounting frame between the two ball-planting brackets. A mesh plate for positioning solder balls is installed within the mesh plate mounting frame. Each of the two ball-planting brackets is equipped with a second linear guide rail, and each second linear guide rail is fitted with a second slider. A solder box mounting frame is mounted on both second sliders. A solder box for holding solder balls is mounted at the bottom of the solder box mounting frame, with the bottom surface of the solder box fitting against the top surface of the mesh plate. A mounting base is mounted on one end of the solder box mounting frame. A third drive device mounting plate and two support bearings are sequentially mounted at the top of one of the ball-planting brackets. One of the second linear guide rails and the mounting base are located between the two support bearings. A lead screw assembly is mounted on the two support bearings. A solder box transverse movement drive device is mounted on the third drive device mounting plate. A coupling is mounted at the output end of the solder box transverse movement drive device, and the output end of the solder box transverse movement drive device is connected to the lead screw of the lead screw assembly via the coupling. The nut of the lead screw assembly is fixedly connected to the mounting base.

[0012] Furthermore, the stencil has multiple mesh groups, each mesh group including multiple mesh holes. The multiple mesh groups correspond one-to-one with multiple positioning slots on the sheet, and each mesh hole in the same mesh group corresponds one-to-one with each pin contact on the same chip.

[0013] Specifically, the tin box includes a first push plate and a second push plate mounted side by side at the bottom of the tin box mounting frame. A first end plate is connected between the same ends of the first push plate and the second push plate, and a second end plate is connected between the same ends of the first push plate and the second push plate. The first push plate, the second push plate, the first end plate and the second end plate form a receiving frame with an upper opening and a lower opening. The bottom surfaces of the first push plate, the second push plate, the first end plate and the second end plate are all on the same plane, and the bottom surfaces of the first push plate, the second push plate, the first end plate and the second end plate are in contact with the top surface of the mesh plate. The two sides of the bottom end of the first push plate are laterally extended and integrally formed with inclined push portions. The longitudinal section of the inclined push portion is set in a descending wedge shape. The shape of the second push plate is the same as that of the first push plate. The second visual inspection component includes a second camera bracket mounted on the platform. A second CCD camera and a third CCD camera are sequentially mounted on the top of the second camera bracket along the direction of the material tray conveying. The second CCD camera is located above the ball-planting mechanism.

[0014] Furthermore, the automatic solder ball placement machine for BGA chips adopts a PLC control system as the main controller of the whole machine. The PLC control system is connected to the material tray conveying mechanism, solder paste leveling mechanism, solder paste application mechanism, vacuum fixing mechanism, material tray lifting mechanism, ball placement mechanism, first vision detection component and second vision detection component to realize the signal interaction and linkage motion control of the whole machine.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. By providing a solder paste dispensing mechanism on one side of the tray conveying mechanism, a tray lifting mechanism and a vacuum fixing mechanism below the tray conveying mechanism, and a ball-planting mechanism above the tray conveying mechanism and the tray lifting mechanism, the present invention achieves fully automatic batch solder paste dispensing and ball-planting of chips. The ball-planting efficiency is high and the ball-planting effect is good. Moreover, it does not require multiple robotic arms and multiple vacuum nozzles to be configured for batch ball-planting of chips. When changing to different models of products, there is no need to re-customize the fixtures and programs, which reduces the investment cost of the equipment. It has good compatibility with chips of various specifications and solves the problems of high equipment cost and poor compatibility with different specifications of chips caused by the current automatic ball-planting machine using multiple robotic arms and multiple vacuum nozzles to pick up and place solder balls.

[0016] 2. Its overall structural design enables a series of operations on a single machine, including automatically leveling the solder paste in the solder tray, automatically conveying and positioning the tray before solder paste application, automatically fixing the chips on the tray in batches, automatically applying solder paste to the chips on the tray in batches, automatically checking for leaks and providing automatic feedback on the test results after solder paste application, automatically placing solder balls on the chips on the tray, and automatically checking for defects and providing automatic feedback on the test results after solder ball placement. This achieves automated and intelligent batch solder ball placement of chips, greatly improving production efficiency and capacity while ensuring a high product yield. The equipment is easy to operate, has low dependence on the professional skills of operators, and low maintenance costs. It solves the problems of low efficiency, poor effect, and high labor costs associated with traditional manual chip solder ball placement, as well as the problems of high maintenance costs and high technical barriers associated with current laser solder ball placement equipment. Attached Figure Description

[0017] For ease of explanation, the present invention will be described in detail below with reference to the preferred embodiments and accompanying drawings.

[0018] Figure 1 This is a perspective view of an automatic solder ball placement machine for BGA chips according to the present invention.

[0019] Figure 2 This is a perspective view of the solder paste leveling mechanism of an automatic solder ball attaching machine for BGA chips according to the present invention.

[0020] Figure 3 This is a perspective view of the solder paste application mechanism of an automatic solder ball placement machine for BGA chips according to the present invention.

[0021] Figure 4 This is a perspective view of a solder paste application fixture for an automatic solder ball placement machine for BGA chips according to the present invention.

[0022] Figure 5 This invention relates to an automatic solder ball placement machine for BGA chips. Figure 4 A magnified view of part A.

[0023] Figure 6 This is a perspective view of the vacuum fixing mechanism of an automatic solder ball attaching machine for BGA chips according to the present invention.

[0024] Figure 7 This is a front view of the vacuum fixing mechanism of an automatic BGA chip solder ball attaching machine according to the present invention.

[0025] Figure 8 This is a schematic diagram of the vacuum fixing mechanism for vacuum fixing of chips in an automatic BGA chip ball-planting machine according to the present invention.

[0026] Figure 9This is a perspective view of a combination of a first belt conveyor line, a second belt conveyor line, a lateral positioning component, a first blocking component, a vacuum fixing mechanism, a first vision inspection component, and a second vision inspection component in an automatic BGA chip solder ball attaching machine according to the present invention.

[0027] Figure 10 This is a perspective view of the tray conveying mechanism of an automatic BGA chip solder ball attaching machine according to the present invention.

[0028] Figure 11 This is a perspective view of the tray lifting mechanism of an automatic BGA chip solder ball attaching machine according to the present invention.

[0029] Figure 12 This is a perspective view of the ball-planting mechanism of an automatic solder ball-planting machine for BGA chips according to the present invention.

[0030] Figure 13 This is a perspective view of the stencil of an automatic BGA chip ball-planting machine according to the present invention.

[0031] Figure 14 This is a perspective view of the solder tray of an automatic solder ball attaching machine for BGA chips according to the present invention.

[0032] Figure 15 This is a cross-sectional view of the solder tray of an automatic solder ball attaching machine for BGA chips according to the present invention. Attached Figure Description

[0033] 1. Table; 2. Tray conveying mechanism; 3. Solder paste leveling mechanism; 4. Solder paste application mechanism; 5. Vacuum fixing mechanism; 6. Tray lifting mechanism; 7. Ball placement mechanism; 8. First vision inspection component; 9. Second vision inspection component; 10. Tray; 31. Column; 32. Drive unit mounting bracket; 33. Solder tray; 34. First linear guide rail; 35. First slider; 36. Solder scraper moving seat; 37. Solder scraper movable groove; 38. Scraper; 39. Scraper longitudinal drive device; 30. Connecting plate; 301. Scraper transverse drive device; 41. Solder paste application bracket; 42. Solder paste application lateral movement assembly; 43. Solder paste application lateral movement frame; 44. Solder paste application longitudinal movement assembly; 45. Solder paste application longitudinal movement frame; 46. Solder paste application fixture; 47. Fixture body; 48. Solder paste application needle; 51. Vacuum-fixed base frame; 52. Limiting bracket; 53. Linear bearing; 54. Linear guide rod; 55. First vacuum suction cup; 56. First drive device mounting plate; 57. Suction cup drive device; 58. Limiting plate; 59. Limiting part; 550. Base plate; 551. Frame; 552. Support platform; 553. First through hole; 101. Tray body; 102. Positioning hole; 103. Positioning groove; 104. Second through hole; 81. First camera bracket; 82. First CCD camera; 83. Light source; 21. First belt conveyor; 22. Second belt conveyor; 23. Lateral positioning assembly; 24. First blocking assembly; 25. Second blocking assembly; 26. First proximity switch; 27. Second proximity switch; 28. Third proximity switch; 231. Lateral positioning bracket; 232. Push plate drive device; 233. Lateral push plate; 241. Second drive device mounting plate; 242. Baffle drive device; 243. Baffle; 61. Lifting bracket; 62. Suction cup longitudinal movement assembly; 63. Suction cup lifting frame; 64. Second vacuum suction cup; 71. Ball planting bracket; 72. Mesh plate mounting frame; 73. Mesh plate; 74. Second linear guide rail; 75. Second slider; 76. Solder box mounting bracket; 77. Solder box; 78. Mounting base; 79. Third drive device mounting plate; 70. Support bearing; 701. Lead screw pair; 702. Solder box transverse movement drive device; 703. Coupling; 731. Mesh opening; 771. First push plate; 772. Second push plate; 773. First end plate; 774. Second end plate; 775. Upper opening; 776. Lower opening; 777. Slanted push section; 91. Second camera bracket; 92. Second CCD camera; 93. Third CCD camera. Detailed Implementation

[0034] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0036] Reference Figure 1As shown, an automatic solder ball placement machine for BGA chips according to the present invention includes a platform 1. The platform 1 is equipped with a tray conveying mechanism 2, a solder paste leveling mechanism 3, a solder paste application mechanism 4, a vacuum fixing mechanism 5, a tray lifting mechanism 6, a ball placement mechanism 7, a first vision inspection component 8, and a second vision inspection component 9. A tray 10 is movably mounted on the tray conveying mechanism 2, which conveys the tray 10. The solder paste leveling mechanism 3 is located on one side of the tray conveying mechanism 2 and is used to store and level the solder paste. The vacuum fixing mechanism 5 is located below the tray conveying mechanism 2 and is used to evacuate the tray 10 on the tray conveying mechanism 2 to fix the chip. The solder paste application mechanism 4 is located on one side of the tray conveying mechanism 2 and applies solder paste. Mechanism 4 picks up solder paste from solder paste scraping mechanism 3 and applies solder paste to the chip on tray conveying mechanism 2. Tray lifting mechanism 6 is located below tray conveying mechanism 2. Vacuum fixing mechanism 5 and tray lifting mechanism 6 are arranged side by side along the feeding direction of tray conveying mechanism 2. Tray lifting mechanism 6 is used to lift tray 10 on tray conveying mechanism 2. Ball placement mechanism 7 is located above tray conveying mechanism 2 and tray lifting mechanism 6 and is used to place solder balls on the chip on tray conveying mechanism 2. First vision detection component 8 is located on the other side of tray conveying mechanism 2 and is used to identify whether the chip on tray conveying mechanism 2 has solder paste. Second vision detection component 9 is located on one side of tray conveying mechanism 2 and is used to detect whether the chip has solder balls.

[0037] Reference Figure 2 As shown, the solder paste leveling mechanism 3 includes two or more vertically mounted columns 31 on the platform 1 and a drive device mounting bracket 32. Each column 31 has a solder tray 33 for holding solder paste mounted at its top. First linear guide rails 34 are mounted on both sides of the solder tray 33. A first slider 35 is mounted on each first linear guide rail 34. A solder scraping moving seat 36 is mounted on both first sliders 35. The solder scraping moving seat 36 slides linearly along the first linear guide rails 34 with the first sliders 35. A solder scraping movable groove 37 is formed through the top and bottom of the solder scraping moving seat 36. A scraper 38 is movably mounted within the scraper movable groove 37. Scrapers are mounted longitudinally at both ends of the solder scraping moving seat 36. A connecting plate 30 is installed at the output end of the longitudinal drive device 39. The connecting plate 30 is located above the longitudinal drive device 39. The end of the connecting plate 30 away from the output end of the longitudinal drive device 39 is fixedly connected to the scraper 38. The longitudinal drive device 39 drives the connecting plate 30 to move in the longitudinal direction, thereby driving the scraper 38 to move in the longitudinal direction. A transverse drive device 301 is installed on the drive device mounting bracket 32. The output end of the transverse drive device 301 is fixedly connected to the solder scraping moving seat 36. The transverse drive device 301 drives the solder scraping moving seat 36 to move linearly back and forth on the first linear guide rail 34 along with the first slider 35.

[0038] By adopting the above technical solution, the longitudinal drive device 39 drives the connecting plate 30 to move longitudinally, thereby causing the scraper 38 to move longitudinally synchronously. The transverse drive device 301 drives the solder scraping moving seat 36 to move linearly back and forth on the first linear guide rail 34 along with the first slider 35, thereby causing the scraper 38 to move linearly back and forth. The transverse drive device 301 and the longitudinal drive device 39 work together to drive the scraper 38 to move in the longitudinal two-dimensional plane. The solder tray 33 contains an appropriate amount of solder paste. The longitudinal drive device 39 drives the scraper 38 to move to the surface of the solder paste. The transverse drive device 301 drives the scraper 38 to move horizontally from the solder tray. The scraper 38 is moved from one side to the other side of the solder tray 33 to smooth the solder paste. The longitudinal drive device 39 drives the scraper 38 to rise and separate it from the upper surface of the solder paste. During the rise of the scraper 38, the solder scraping moving seat 36 scrapes off the solder paste on the scraper 38. The solder paste falls into the solder tray 33 for recycling, which avoids the solder paste on the scraper 38 dripping onto the smoothed solder paste surface and affecting the flatness of the solder paste. The lateral drive device 301 and the longitudinal drive device 39 work together to drive the scraper 38 to smooth the solder paste in the solder tray 33, ensuring that the upper surface of the solder paste remains flat, so as to ensure that the solder paste dispensing mechanism 4 can completely pick up the solder paste.

[0039] In this embodiment, both the scraper lateral drive device 301 and the scraper longitudinal drive device 39 are configured as cylinders.

[0040] Reference Figure 3 As shown, the solder paste dispensing mechanism 4 includes a solder paste dispensing bracket 41 mounted on the platform 1. A solder paste dispensing horizontal moving component 42 is mounted on the solder paste dispensing bracket 41. A solder paste dispensing horizontal moving frame 43 is mounted on the moving part of the solder paste dispensing horizontal moving component 42. The solder paste dispensing horizontal moving component 42 drives the solder paste dispensing horizontal moving frame 43 to move horizontally. A solder paste dispensing vertical moving component 44 is mounted on the solder paste dispensing horizontal moving frame 43. A solder paste dispensing vertical moving frame 45 is mounted on the moving part of the solder paste dispensing vertical moving component 44. The solder paste dispensing vertical moving component 44 drives the solder paste dispensing vertical moving frame 45 to move vertically. A solder paste dispensing fixture 46 is mounted at the bottom of the solder paste dispensing vertical moving frame 45.

[0041] Reference Figure 4 and Figure 5 As shown, the solder paste fixture 46 includes a fixture body 47. The bottom of the fixture body 47 is provided with a plurality of solder paste dotting needle groups. Each solder paste dotting needle group includes a plurality of solder paste dotting needles 48 installed at the bottom of the fixture body 47. The plurality of solder paste dotting needles 48 in the same solder paste dotting needle group are arranged longitudinally and are parallel to each other.

[0042] By adopting the above technical solution, the horizontal moving component 42 drives the horizontal moving frame 43 to move horizontally, and the vertical moving component 44 drives the vertical moving frame 45 to move vertically. The horizontal moving component 42 and the vertical moving component 44 work together to move the solder paste fixture 46 in a vertical two-dimensional space. The bottom of the fixture body is provided with multiple solder paste needle groups, each corresponding to a chip. Each solder paste needle in the same group corresponds to a pin contact point in the same chip. When the solder paste fixture 46 moves to the solder paste leveling mechanism 3, the solder paste needles 48 pick up solder paste from the solder tray 33. The horizontal moving component 42 and the vertical moving component 44 work together to move the solder paste fixture 46 to the tray conveying mechanism 2. The solder paste needles 46... Solder paste needles 48 move to the surface of the chip and contact the corresponding ejector pins to apply solder paste to the ejector pins. After the ejector pins of the chip are covered with solder paste, they are ready for subsequent solder ball placement. Solder paste is picked up from the solder tray 33 by multiple solder paste needle groups. The solder paste horizontal movement component 42 and the solder paste vertical movement component 44 work together to move the solder paste fixture 46 to the tray conveying mechanism 2. Multiple solder paste needle groups simultaneously apply solder paste to multiple chips in the same tray 10, realizing batch solder paste application of the solder paste mechanism 4 to the chips on the tray 10. The solder paste fixture 46 has high efficiency in applying solder paste to the chips. The solder paste is smoothed by the solder paste scraping mechanism 3, so that the amount of solder paste picked up by each solder paste needle 48 of the solder paste fixture 46 is uniform, thereby ensuring that the size of the solder paste applied to the chip by each solder paste needle 48 of the solder paste fixture 46 is uniform and the solder paste application effect of the solder paste fixture 46 is good.

[0043] In this embodiment, the solder paste application lateral movement assembly 42 includes a servo motor and a ball screw type linear module. The servo motor is connected to the ball screw type linear module for transmission. The ball screw type linear module is horizontally mounted on the top of the solder paste application bracket 41, and the solder paste application lateral movement frame 43 is mounted on the moving part of the ball screw type linear module.

[0044] The solder paste application longitudinal movement assembly 44 includes a servo motor, a lead screw pair, and at least two linear guide rails. The servo motor and at least two linear guide rails are mounted on the solder paste application transverse movement frame 43. The at least two linear guide rails are arranged longitudinally and are parallel to each other. The lead screw of the lead screw pair is connected to the output shaft of the servo motor through a coupling. The nut of the lead screw pair is fixedly connected to the solder paste application longitudinal movement frame 45. The servo motor drives the solder paste application longitudinal movement frame 45 to slide up and down along the at least two linear guide rails through the coupling and the lead screw pair.

[0045] Reference Figures 6 to 7As shown, the vacuum fixing mechanism 5 includes a vacuum fixing base 51 mounted on a platform 1 and two or more limiting brackets 52. Two or more linear bearings 53 are mounted on the top of the vacuum fixing base 51. A linear guide rod 54 is slidably installed within each linear bearing 53. A first vacuum suction cup 55 is mounted on the top of each linear guide rod 54. A first drive device mounting plate 56 is mounted on the top of the vacuum fixing base 51. A suction cup drive device 57 is mounted on the first drive device mounting plate 56. The output end of the suction cup drive device 57 is fixedly connected to the first vacuum suction cup 55. The suction cup drive device 57 drives the first vacuum suction cup 55 to rise or fall. Each linear guide rod 54 guides the lifting and lowering movement of the first vacuum suction cup 55. Two or more limiting plates 58 are installed on the outer periphery of the first vacuum suction cup 55. Two or more limiting brackets 52 are located on the periphery of the vacuum fixing base 51. The top of each limiting bracket 52 extends laterally towards the first vacuum suction cup 55 and is integrally formed with a limiting part 59. The two or more limiting brackets 52 correspond one-to-one with the two or more limiting plates 58, and each limiting plate 58 is located below the limiting part 59 of the corresponding limiting bracket 52. The limiting part 59 of the limiting bracket 52 limits the limiting plate 58 as the first vacuum suction cup 55 rises.

[0046] Reference Figure 6 As shown, the first vacuum suction cup 55 includes a base plate 550 installed at the top of each linear guide rod 54 and a frame 551 provided on the edge of the base plate 550. The top of the base plate 550 is provided with two or more support platforms 552, and each support platform 552 jointly supports the bottom of the material tray 10. A first through hole 553 for installing a vacuum connector is opened longitudinally through the base plate 550.

[0047] Reference Figure 8 As shown, the tray 10 includes a tray body 101. The edge of the tray body 101 has two or more positioning holes 102. The top of the tray body 101 has two or more positioning grooves 103 for positioning the chip. A second through hole 104 is provided through the top and bottom of the positioning groove 103.

[0048] Reference Figure 9 As shown, the first visual inspection component 8 includes a first camera bracket 81 mounted on the platform 1. The top of the first camera bracket 81 is equipped with a first CCD camera 82 and a light source 83 from top to bottom. The first CCD camera 82 and the light source 83 are respectively located above the vacuum fixing mechanism 5.

[0049] By adopting the above technical solution, the suction cup driving device 57 drives the first vacuum suction cup 55 to rise or fall. Each linear guide rod 54 guides the lifting and lowering movement of the first vacuum suction cup 55. The first vacuum suction cup 55 drives each limiting plate 58 to rise or fall. The suction cup driving device 57 drives the first vacuum suction cup 55 to rise and fit against the bottom of the material tray 10 on the material tray conveying mechanism 2 to form a vacuum cavity. The first through hole 553 is connected to an external vacuum system through a vacuum connector. The external vacuum system uses the first through hole 553 to control the flow of the first vacuum suction cup 55 and the material tray 10. The vacuum chamber formed by the tray 10 is evacuated. The negative pressure of the vacuum chamber generates negative pressure on the chip on the tray 10 through the second through hole 104, which fixes the chip on the tray 10. After the solder paste dispensing mechanism 4 applies solder paste to the chip on the tray 10, the light source 83 provides illumination to the tray 10 after the chip soldering is completed. The first CCD camera 82 detects whether all the pin contacts of the chip on the tray 10 are covered with solder paste. The first vacuum chuck 55 is driven by the chuck drive device 57 to rise to the bottom of the tray 10 on the tray conveying mechanism 2 and attach to it. An external vacuum system evacuates the first vacuum chuck 55 through the first through-hole 553, thereby fixing the chip onto the tray 10 using negative pressure. This prevents the solder paste dispensing mechanism 4 from touching the chip during solder paste dispensing, which could cause chip displacement. It ensures precise alignment between the solder paste dispensing needle and the chip's ejector pins, improving the accuracy and consistency of solder ball placement. The overall automated process enhances production efficiency and product yield. The limiting bracket 52's limiting part 59 limits the rise of the limiting plate 58, thus controlling the first vacuum chuck 55. The first vacuum chuck 55 is raised to a limit position, controlling its travel to a height that is in contact with the material tray 10. This ensures that the first vacuum chuck 55 exerts maximum negative pressure on the material tray 10 to fix the chips on the material tray 10, improving the fixing effect when applying solder paste to the chips. The first CCD camera 82 detects missing solder paste on the chips after solder paste application and provides feedback on chips with missing solder paste so that qualified chips can be replaced in time. This ensures that all pin contacts of all chips entering the subsequent process are solder paste applied.

[0050] In this embodiment, the suction cup driving device 57 is configured as a cylinder.

[0051] Reference Figure 10 and Figure 11As shown, the material tray conveying mechanism 2 includes a first belt conveyor 21, a second belt conveyor 22, a lateral positioning component 23, a first blocking component 24, and a second blocking component 25 mounted on the platform 1. The first belt conveyor 21 and the second belt conveyor 22 are arranged side by side along the conveying direction of the material tray 10, and the first belt conveyor 21 and the second belt conveyor 22 are connected end to end. The inlet end and the outlet end of the first belt conveyor 21 are respectively equipped with a first proximity switch 26 and a second proximity switch 27. The first proximity switch 26 detects whether a material tray 10 enters the inlet end of the first belt conveyor 21, and the second proximity switch 27 detects whether a material tray 10 enters the inlet end of the first belt conveyor 21. The material tray 10 enters the discharge end of the first belt conveyor 21. The feed end of the second belt conveyor 22 is equipped with a third proximity switch 28. The third proximity switch 28 detects whether a material tray 10 enters the feed end of the second belt conveyor 22. The lateral positioning component 23 is located on the other side of the material tray conveying mechanism 2 and is used to laterally position the material tray 10. The first blocking component 24 is located below the first belt conveyor 21 and is used to block and position the material tray 10 being conveyed on the first belt conveyor 21. The second blocking component 25 is located below the second belt conveyor 22 and is used to block and position the material tray 10 being conveyed on the second belt conveyor 22.

[0052] Reference Figure 10 As shown, the first blocking assembly 24 includes a second drive device mounting plate 241 mounted on the platform 1. A baffle drive device 242 is mounted on the top of the second drive device mounting plate 241, and a baffle 243 is mounted on the output end of the baffle drive device 242. The baffle drive device 242 drives the baffle 243 to rise to block and position the material tray 10 being conveyed on the first belt conveyor line 21. The structure of the second blocking assembly 25 is the same as that of the first blocking assembly 24.

[0053] Reference Figure 10 As shown, the lateral positioning component 23 includes a lateral positioning bracket 231 mounted on the platform 1. A push plate driving device 232 is mounted on the top of the lateral positioning bracket 231. A lateral push plate 233 is mounted on the output end of the push plate driving device 232. The push plate driving device 232 drives the lateral push plate 233 to move towards or away from the first belt conveyor line 21.

[0054] By adopting the above technical solution, the first proximity switch 26 detects whether a tray 10 has entered the feeding end of the first belt conveyor 21. The baffle driving device 242 of the first blocking component 24 drives the baffle 243 to rise to block and position the tray 10 being conveyed on the first belt conveyor 21. The push plate driving device 232 drives the lateral push plate 233 to move closer to the first belt conveyor 21. The lateral push plate 233 pushes the tray 10 to one side of the first belt conveyor 21 to perform lateral positioning of the tray 10. With the cooperation of the first proximity switch 26 detecting whether the tray 10 has been conveyed to the correct position, the baffle 243 and the lateral push plate 233 of the first blocking component 24 achieve positioning of the tray 10 in the horizontal two-dimensional space. This realizes intelligent positioning of the tray 10 before the solder paste dispensing mechanism 4 applies solder paste to the chip. The positioning of the tray 10 is accurate and efficient. After the solder paste is applied to the chip's pin contacts and detected by the first vision detection component 8, the first... When the baffle drive device 242 of the first blocking component 24 drives the baffle 243 to descend, the first belt conveyor 21 continues to convey the tray 10. When the second proximity switch 27 detects that a tray 10 has entered the discharge end of the first belt conveyor 21, the second belt conveyor 22 starts to prepare to receive the tray 10 conveyed from the first belt conveyor 21. When the third proximity switch 28 detects that a tray 10 has entered the feed end of the second belt conveyor 22, the second blocking component 25 blocks and positions the tray 10 entering the feed end of the second belt conveyor 22, thus positioning the tray 10 before the tray lifting mechanism 6 lifts it. After the tray lifting mechanism 6 lifts the tray 10, the ball-planting mechanism 7 plants solder balls on the chip of the tray 10. After the chip solder balls are planted, the tray lifting mechanism 6 lowers the tray 10 and places it on the second belt conveyor 22. The second blocking component 25 releases the tray 10 after the chip solder balls are planted. With the cooperation of detecting whether the material tray 10 has been delivered to the correct position, the second blocking component 25 blocks and positions the material tray 10 being conveyed on the second belt conveyor line 22, thereby realizing intelligent positioning of the material tray 10 before the material tray lifting mechanism 6 lifts the material tray 10. The positioning of the material tray 10 is accurate and efficient.

[0055] In this embodiment, both the baffle driving device 242 and the pusher driving device 232 are configured as cylinders.

[0056] Reference Figure 11 As shown, the material tray lifting mechanism 6 includes a lifting bracket 61 mounted on the platform 1. A suction cup longitudinal moving component 62 is mounted on the lifting bracket 61. A suction cup lifting frame 63 is mounted on the moving part of the suction cup longitudinal moving component 62. The suction cup longitudinal moving component 62 drives the suction cup lifting frame 63 to rise or fall. The suction cup lifting frame 63 is equipped with a second vacuum suction cup 64 for supporting the material tray 10. The structure of the second vacuum suction cup 64 is the same as that of the first vacuum suction cup 55.

[0057] Reference Figure 6 , Figure 8 and Figure 11 As shown, the suction cup longitudinal moving component 62 drives the suction cup lifting frame 63 to rise or fall, thereby driving the second vacuum suction cup 64 to rise or fall. The second vacuum suction cup 64 rises and lifts the material tray 10 on the second belt conveyor 22. The bottom of the second vacuum suction cup 64 and the material tray 10 on it are attached to form a vacuum cavity. The second vacuum suction cup 64 is connected to an external vacuum system through its first through hole 553. The external vacuum system evacuates the vacuum cavity formed by the second vacuum suction cup 64 and the material tray 10 on it. The negative pressure of the vacuum cavity generates negative pressure on the chip on the material tray 10 through the second through hole 104 of the positioning groove 103 of the material tray 10. The chip is fixed on the material tray 10. The suction cup lifting frame 63 is raised by the longitudinal moving component 62 of the suction cup to lift the material tray 10. The second vacuum suction cup 64 and the material tray 10 form a vacuum cavity. The second vacuum suction cup 64 is connected to an external vacuum system to evacuate the vacuum cavity. The negative pressure of the vacuum cavity generates negative pressure on the chip on the material tray 10 through the second through hole 104 of the material tray 10. This lifts the material tray 10 and fixes the chip on the material tray 10 with negative pressure. This achieves positioning of the chip on the material tray 10 before the ball-planting mechanism 7 plants solder balls, and cooperates with the ball-planting mechanism 7 to plant solder balls on the chip on the material tray 10.

[0058] In this embodiment, the suction cup longitudinal movement assembly 62 includes a servo motor, a lead screw pair, and at least two linear guide rails. The servo motor and at least two linear guide rails are mounted on the lifting bracket 61. The at least two linear guide rails are arranged longitudinally and are parallel to each other. The lead screw of the lead screw pair is connected to the output shaft of the servo motor through a coupling. The nut of the lead screw pair is fixedly connected to the suction cup lifting frame 63. The servo motor drives the suction cup lifting frame 63 to slide up and down along the at least two linear guide rails through the coupling and the lead screw pair.

[0059] Reference Figure 12As shown, the ball-planting mechanism 7 includes two ball-planting brackets 71 mounted side-by-side on the platform 1. A mesh plate mounting frame 72 is installed between the two ball-planting brackets 71. A mesh plate 73 for positioning solder balls is installed inside the mesh plate mounting frame 72. A second linear guide rail 74 is installed on each of the two ball-planting brackets 71. A second slider 75 is mounted on each of the two second sliders 75. A solder box mounting bracket 76 is mounted on both second sliders 75. The solder box mounting bracket 76 slides linearly along the second linear guide rails 74 with the second sliders 75. A solder box 77 for holding solder balls is installed at the bottom of the solder box mounting bracket 76. The bottom surface of the solder box 77 is in contact with the top surface of the mesh plate 73. A mounting base 78 is installed on one end of the mounting bracket 76. A third drive device mounting plate 79 and two support bearings 70 are installed sequentially on the top of one of the ball-planting brackets 71. A second linear guide rail 74 and the mounting base 78 are located between the two support bearings 70. The two support bearings 70 are jointly equipped with a lead screw pair 701. A solder box transverse movement drive device 702 is installed on the third drive device mounting plate 79. A coupling 703 is installed at the output end of the solder box transverse movement drive device 702. The output end of the solder box transverse movement drive device 702 is connected to the lead screw drive of the lead screw pair 701 through the coupling 703. The nut of the lead screw pair 701 is fixedly connected to the mounting base 78.

[0060] In this embodiment, the tin box transverse movement drive device 702 is configured as a servo motor.

[0061] Reference Figure 13 As shown, the stencil 73 has multiple mesh groups, each of which includes multiple mesh holes 731. The multiple mesh groups correspond one-to-one with multiple positioning grooves 103 on the material sheet, and each mesh hole 731 in the same mesh group corresponds one-to-one with each pin contact on the same chip.

[0062] Reference Figures 14 to 15 As shown, the solder box 77 includes a first push plate 771 and a second push plate 772 mounted side by side at the bottom of the solder box mounting bracket 76. A first end plate 773 is connected between the same ends of the first push plate 771 and the second push plate 772, and a second end plate 774 is connected between the same ends of the first push plate 771 and the second push plate 772. The first push plate 771, the second push plate 772, the first end plate 773, and the second end plate 774 form a receiving frame with an upper opening 775 and a lower opening 776. The bottom surfaces of the first push plate 771, the second push plate 772, the first end plate 773, and the second end plate 774 are all on the same plane, and the bottom surfaces of the first push plate 771, the second push plate 772, the first end plate 773, and the second end plate 774 are attached to the top surface of the mesh plate 73. The two sides of the bottom end of the first push plate 771 are laterally extended and integrally formed with inclined push portions 777. The longitudinal section of the inclined push portion 777 is set in a descending wedge shape. The shape of the second push plate 772 is the same as that of the first push plate 771.

[0063] Reference Figure 9 As shown, the second visual inspection component 9 includes a second camera bracket 91 mounted on the table 1. The top of the second camera bracket 91 is sequentially equipped with a second CCD camera 92 and a third CCD camera 93 along the conveying direction of the material tray 10. The second CCD camera 92 is located above the ball planting mechanism 7.

[0064] Reference Figure 9 , Figures 12 to 15As shown, by adopting the above technical solution, the solder box transverse movement drive device 702 drives the mounting base 78 and the solder box mounting bracket 76 to slide linearly back and forth on the second linear guide rail 74 along with the second slider 75, thereby driving the solder box 77 to move back and forth, placing the solder ball into the solder box 77. The solder box 77 moves along the direction of the first push plate 771 facing the second push plate 772. The inclined push part 777 on the side of the first push plate 771 facing the second push plate 772 pushes the solder ball in the solder box 77. The solder ball falls into the empty mesh 731 of the stencil plate 73. The distance between the bottom surface of the first push plate 771 and the stencil plate 73 is greater than the radius of the solder ball and less than the diameter of the solder ball. The inclined push part 777 is in contact with the spherical surface of the upper half of the solder ball. Simultaneously, the solder ball is pressed against the inner wall of the mesh 731. As the inclined pusher 777 moves closer to the solder ball, the pushing force from the inclined pusher 777 and the inside of the mesh 731 is converted into downward pressure on the solder ball, pressing it onto the solder paste on the chip's ejector pin contacts, thus achieving solder ball placement on the chip's ejector pin contacts. At the same time, the inclined pusher 777 on the side of the second pusher 772 facing away from the first pusher 771 presses the solder balls scattered on the stencil 73 into the empty mesh 731 on the stencil 73. After the solder box 77 continues to move and moves out of the mesh 731 area of ​​the stencil 73, the solder box 77 moves in the opposite direction to reset. The inclined pusher 777 on the side of the second pusher 772 facing the first pusher 771 pushes the solder balls in the solder box 77 again, thus placing the solder balls in the solder box 77. The solder balls are pressed into the empty mesh 731. Simultaneously, the inclined pusher 777 on the side of the first pusher plate 771 facing away from the second pusher plate 772 presses the solder balls scattered on the stencil 73 into the empty mesh 731 on the stencil 73. This replenishes the solder balls missing from the previous chip solder ball placement process. After the solder tray 77 completes one chip solder ball placement, the second CCD camera 92 detects whether all mesh 731 on the stencil 73 are missing solder balls. If the second CCD camera 92 detects that any mesh 731 on the stencil 73 is missing solder balls, the chip solder ball placement operation is repeated until the second CCD camera 92 detects that all mesh 731 on the stencil 73 are filled with solder balls, thus completing the placement of all chips on the tray 10. After the solder balls are implanted, the tray lifting mechanism 6 lowers the tray 10 and places it on the second belt conveyor 22. The second belt conveyor 22 transports the tray 10 with the implanted solder balls to the area below the third CCD camera 93. The third CCD camera 93 takes pictures of all the chips on the stencil 73 to detect whether any of the pin contacts on the chip are missing solder balls and provides feedback on the detection results. This ensures that solder balls stuck in the mesh 731 of the stencil 73 can be detected in time, preventing defective products from entering subsequent processing steps. The solder box 77 is driven by the solder box lateral movement drive device 702 to slide linearly back and forth on the stencil 73. The inclined push part 777 of the solder box 77 is wedge-shaped.Solder balls are pushed into the mesh 731 on the stencil 73 by the inclined pusher 777, implanting the solder balls into the chip's ejector pin contacts. Two CCD cameras monitor whether the stencil 73 is filled with solder balls and whether all ejector pin contacts of the chip have been implanted with solder balls. This achieves automated batch solder ball implantation and intelligent detection of chip solder ball implantation. The chip solder ball implantation is highly efficient and effective, ensuring a high yield rate. Furthermore, it eliminates the need for multiple robotic arms and vacuum nozzles for batch chip implantation, and does not require customized fixtures and programs when changing to different product models, reducing equipment investment costs and reliance on skilled technicians. It also offers good compatibility with various chip specifications, solving the problems of high equipment costs and poor compatibility with different chip specifications caused by current automatic solder ball implantation machines that use multiple robotic arms and vacuum nozzles for solder ball implantation.

[0065] Reference Figures 1 to 15 As shown, the present invention also provides a working process of an automatic solder ball placement machine for BGA chips: the solder paste leveling mechanism 3 levels the solder paste, the solder tray 33 contains an appropriate amount of solder paste, the squeegee horizontal drive device 301 drives the squeegee 38 to move horizontally from one side of the solder tray 33 to the other side of the solder tray 33 to level the solder paste, the squeegee vertical drive device 39 drives the squeegee 38 to rise, the solder scraping moving seat 36 scrapes the solder paste on the squeegee 38, and the solder paste falls into the solder tray 33 for recycling. The squeegee horizontal drive device 301 and the squeegee vertical drive device 39 work together to drive the squeegee 38 to level the solder paste in the solder tray 33, ensuring that the upper surface of the solder paste remains flat. Before solder paste is applied, the tray conveyor mechanism conveys and positions the tray 10. When the first proximity switch 26 detects that the tray 10 has entered the feed end of the first belt conveyor 21, the baffle drive device 242 of the first blocking component 24 drives the baffle 243 to rise to block and position the tray 10 being conveyed on the first belt conveyor 21. The push plate drive device 232 drives the lateral push plate 233 to move closer to the first belt conveyor 21. The lateral push plate 233 pushes the tray 10 to one side of the first belt conveyor 21 to position the tray 10 laterally. The baffle 243 and the lateral push plate 233 of the first blocking component 24 are used to position the tray 10 in a two-dimensional space in the horizontal direction. Vacuum fixing mechanism 5 applies negative pressure to fix the chip. Suction cup driving device 57 drives the first vacuum suction cup 55 to rise and fit against the bottom of the tray 10 on the tray conveying mechanism 2. The first vacuum suction cup 55 rises and fits against the bottom of the tray 10 on the tray conveying mechanism 2 to form a vacuum cavity. The first through hole 553 is connected to an external vacuum system through a vacuum connector. The external vacuum system evacuates the vacuum cavity through the first through hole 553. The negative pressure in the vacuum cavity attracts the chip through the second through hole 104 of the tray 10 to fix the chip on the tray 10. This avoids the chip shifting caused by the soldering needle touching the chip when the solder paste dispensing mechanism 4 applies solder paste to the chip on the tray 10. It ensures the precise docking of the soldering needle and the chip's pin contact. The solder paste dispensing mechanism 4 applies solder paste to the chips and performs the first visual inspection. The solder paste dispensing lateral movement component 42 and the solder paste dispensing longitudinal movement component 44 work together to move the solder paste dispensing fixture 46 to the solder paste leveling mechanism 3. The solder paste dispensing needle 48 picks up solder paste from the solder tray 33. The solder paste dispensing lateral movement component 42 and the solder paste dispensing longitudinal movement component 44 work together to move the solder paste dispensing fixture 46 to the material tray conveying mechanism 2. The solder paste dispensing needle 48 of the solder paste dispensing fixture 46 moves to the surface of the chip and touches the corresponding ejector pin contact to apply solder paste to the ejector pin contact. This enables the solder paste dispensing mechanism 4 to apply solder paste to the chips on the material tray 10 in batches. The first CCD camera 82 performs solder paste leakage detection on the chips after solder paste dispensing is completed. The detection results of chips with missing solder paste are fed back so that they can be replaced with qualified solder paste chips in time, ensuring that all ejector pin contacts of all chips entering the subsequent process are solder paste dispensed. Before solder balls are applied, the tray conveying mechanism 2 conveys and positions the chip. After the chip's pin contacts are coated with solder paste and detected by the first vision detection component 8, the baffle driving device 242 of the first blocking component 24 drives the baffle 243 to descend. The first belt conveyor 21 continues to convey the tray 10. The second proximity switch 27 detects that the tray 10 has entered the discharge end of the first belt conveyor 21, and the second belt conveyor 22 starts. The third proximity switch 28 detects that the tray 10 has entered the feed end of the second belt conveyor 22. The second blocking component 25 blocks and positions the tray 10 entering the feed end of the second belt conveyor 22, thereby positioning the tray 10 before the tray lifting mechanism 6 lifts it. The material tray lifting mechanism 6 lifts the material tray 10 before the solder ball is placed. The suction cup longitudinal moving component 62 drives the second vacuum suction cup 64 to rise or fall. The second vacuum suction cup 64 rises and lifts the material tray 10 on the second belt conveyor line 22. The material tray 10 rises and fits with the mesh plate 73 of the ball placement mechanism 7. At the same time, the second vacuum suction cup 64 and the bottom of the material tray 10 on it fit together to form a vacuum cavity. The second vacuum suction cup 64 is connected to an external vacuum system through its first through hole 553. The external vacuum system evacuates the vacuum cavity formed by the second vacuum suction cup 64 and the material tray 10 on it. The negative pressure of the cavity generates negative pressure on the chip in the positioning groove 103 through the second through hole 104 of the material tray 10 to fix the chip on the material tray 10. This realizes the positioning of the chip on the material tray 10 before the ball placement mechanism 7 places solder balls on it, and cooperates with the ball placement mechanism 7 to place solder balls on the chip on the material tray 10 in the subsequent process. The solder ball placement mechanism 7 places solder balls onto the chip and performs a second visual inspection, placing the solder balls into the solder tray 77. The solder tray lateral movement drive device 702 drives the solder tray 77 to reciprocate on the stencil 73. The inclined push part 777 on the side of the first push plate 771 facing the second push plate 772 pushes the solder balls in the solder tray 77, causing the solder balls to fall into the empty mesh holes 731 of the stencil 73. The distance between the bottom surface of the first push plate 771 and the stencil 73 is greater than the radius of the solder ball but less than the diameter of the solder ball. The inclined push part 777 and the solder ball... The upper spherical surfaces abut against each other, while the solder balls are abutted against the inner wall of the mesh 731. As the inclined pusher 777 moves closer to the solder ball, the pushing force from the inclined pusher 777 and the inside of the mesh 731 is converted into downward pressure on the solder ball, pressing the solder ball onto the solder paste on the chip's ejector pin contacts, thus achieving solder ball placement on the chip's ejector pin contacts. At the same time, the inclined pusher 777 on the side of the second pusher 772 facing away from the first pusher 771 presses the solder balls scattered on the stencil 73 into the empty mesh holes on the stencil 73. Within 731, after the solder box 77 continues to move and moves out of the mesh area 731 of the stencil 73, the solder box 77 moves back to its original position in the opposite direction. The inclined push part 777 of the second push plate 772 facing the first push plate 771 pushes the solder balls in the solder box 77, pressing them back into the empty mesh 731. At the same time, the inclined push part 777 of the first push plate 771 facing away from the second push plate 772 presses the solder balls scattered on the stencil 73 into the empty mesh 731 on the stencil 73, thus reversing the previous... During the chip solder ball placement process, any missing pin contacts are replenished with solder balls. After the solder box 77 completes one round of chip solder ball placement by reciprocating movement, the second CCD camera 92 detects whether all mesh holes 731 on the stencil 73 are missing solder balls. When the second CCD camera 92 detects that there are missing solder balls in the mesh holes 731 on the stencil 73, the chip solder ball placement operation is repeated until the second CCD camera 92 detects that all mesh holes 731 on the stencil 73 are filled with solder balls. The tray conveyor 2 transports the tray 10 after the chip solder balls have been placed and performs a third visual inspection on it. After all the chips on the tray 10 have been soldered, the tray lifting mechanism 6 lowers the tray 10 and places it on the second belt conveyor 22. The second belt conveyor 22 transports the tray 10 with the solder balls placed to the area below the third CCD camera 93. The third CCD camera 93 takes pictures of all the chips on the stencil 73 to detect whether any of the pin contacts on the chips are missing solder balls and provides feedback on the detection results. This ensures that solder balls stuck in the mesh 731 of the stencil 73 can be detected in time, preventing defective products with solder balls from flowing into subsequent processing steps.

[0066] The overall structural design of this BGA chip automatic solder ball placement machine realizes a series of operations on a single machine, including: automatically leveling the solder paste in the solder tray 33; automatically conveying and positioning the material tray 10 before solder paste application; automatically fixing the chips on the material tray 10 in batches; automatically applying solder paste to the chips on the material tray 10 in batches; automatically checking for leaks and providing automatic feedback on the test results after solder paste application; automatically placing solder balls on the chips on the material tray 10; and automatically checking for defects and providing automatic feedback on the test results after solder ball placement on the material tray 10. This achieves fully automated batch solder ball placement of the pin contacts on the chips, with high efficiency and good ball placement effect, solving the problem of traditional solder ball placement. The traditional method of manually placing solder balls on chips suffers from low efficiency, poor results, and high labor costs. Meanwhile, this new method eliminates the need for multiple robotic arms and vacuum nozzles to handle solder balls, and avoids the need to customize fixtures and programs when changing product models. The equipment is simple to operate, requires less technical expertise from operators, and has low initial and maintenance costs. It solves the problems of high equipment costs and poor compatibility with different chip sizes caused by the current automatic solder ball placement machines that require multiple robotic arms and vacuum nozzles. It also addresses the high maintenance costs and technical barriers associated with laser solder ball placement equipment.

[0067] The above embodiments are merely examples of the present invention and are not intended to limit the implementation and scope of the present invention. All technical solutions that are the same as or equivalent to the contents described in the claims of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic solder ball placement machine for BGA chips, comprising a platform (1), characterized in that: The tray (1) is equipped with a tray conveying mechanism (2), a solder paste leveling mechanism (3), a solder paste application mechanism (4), a vacuum fixing mechanism (5), a tray lifting mechanism (6), a ball placement mechanism (7), a first vision inspection component (8), and a second vision inspection component (9). A tray (10) is movably mounted on the tray conveying mechanism (2). The tray conveying mechanism (2) conveys the tray (10). The solder paste leveling mechanism (3) is located on one side of the tray conveying mechanism (2) and is used to store solder paste and level it. The vacuum fixing mechanism (5) is located below the tray conveying mechanism (2) and is used to evacuate the tray (10) on the tray conveying mechanism (2) to fix the chip. The solder paste application mechanism (4) is located on one side of the tray conveying mechanism (2). The solder paste application mechanism (4) is located from the solder paste leveling mechanism. (3) Apply solder paste to the chip on the tray conveying mechanism (2). The tray lifting mechanism (6) is located below the tray conveying mechanism (2). The vacuum fixing mechanism (5) and the tray lifting mechanism (6) are arranged side by side along the feeding direction of the tray conveying mechanism (2). The tray lifting mechanism (6) is used to lift the tray (10) on the tray conveying mechanism (2). The ball-planting mechanism (7) is located above the tray conveying mechanism (2) and the tray lifting mechanism (6) and is used to plant solder balls on the chip on the tray conveying mechanism (2). The first vision detection component (8) is located on the other side of the tray conveying mechanism (2) and is used to identify whether the chip on the tray conveying mechanism (2) has solder paste. The second vision detection component (9) is located on one side of the tray conveying mechanism (2) and is used to detect whether the chip has solder balls implanted.

2. The automatic solder ball placement machine for BGA chips according to claim 1, characterized in that: The solder paste scraping mechanism (3) includes multiple vertical columns (31) mounted on the platform (1) and a drive unit mounting bracket (32). Each column (31) has a solder tray (33) at its top for holding solder paste. First linear guides (34) are mounted on both sides of the solder tray (33). Each first linear guide (34) is equipped with a first slider (35). Two first sliders (35) are equipped with a solder scraping moving seat (36). A solder scraping movable groove (37) is opened through the top and bottom of the solder scraping movable seat (36). The solder scraping movable groove (37) is movable within the groove. The device is equipped with a scraper (38), and the two ends of the tin scraping moving base (36) are respectively equipped with a scraper longitudinal drive device (39). The output end of the scraper longitudinal drive device (39) is equipped with a connecting plate (30). The connecting plate (30) is located above the scraper longitudinal drive device (39). The end of the connecting plate (30) away from the output end of the scraper longitudinal drive device (39) is fixedly connected to the scraper (38). The drive device mounting bracket (32) is equipped with a scraper transverse drive device (301). The output end of the scraper transverse drive device (301) is fixedly connected to the tin scraping moving base (36).

3. The automatic solder ball placement machine for BGA chips according to claim 1, characterized in that: The solder paste application mechanism (4) includes a solder paste application bracket (41) mounted on a platform (1), a solder paste application lateral movement component (42) mounted on the solder paste application bracket (41), a solder paste application lateral movement frame (43) mounted on the moving part of the solder paste application lateral movement component (42), a solder paste application longitudinal movement component (44) mounted on the solder paste application lateral movement frame (43), a solder paste application longitudinal movement frame (45) mounted on the moving part of the solder paste application longitudinal movement component (44), and a solder paste application fixture (46) mounted at the bottom of the solder paste application longitudinal movement frame (45). The solder paste application fixture (46) includes a fixture body (47). The bottom of the fixture body (47) is provided with multiple solder paste application needle groups. Each solder paste application needle group includes multiple solder paste application needles (48) installed at the bottom of the fixture body (47). The multiple solder paste application needles (48) of the same solder paste application needle group are arranged longitudinally and are parallel to each other.

4. The automatic solder ball placement machine for BGA chips according to claim 1, characterized in that: The vacuum fixing mechanism (5) includes a vacuum fixing base (51) mounted on a platform (1) and multiple limiting brackets (52). Multiple linear bearings (53) are mounted on the top of the vacuum fixing base (51). A linear guide rod (54) is slidably installed inside each linear bearing (53). A first vacuum suction cup (55) is mounted on the top of each linear guide rod (54). A first drive device mounting plate (56) is mounted on the top of the vacuum fixing base (51). A suction cup drive device (57) is mounted on the first drive device mounting plate (56). The output end of the device (57) is fixedly connected to the first vacuum suction cup (55). Multiple limiting plates (58) are installed on the outer periphery of the first vacuum suction cup (55). Multiple limiting brackets (52) are located on the periphery of the vacuum fixing base (51). The top of each limiting bracket (52) extends laterally towards the first vacuum suction cup (55) and is integrally formed with a limiting part (59). Multiple limiting brackets (52) correspond one-to-one with multiple limiting plates (58), and each limiting plate (58) is located below the limiting part (59) of the corresponding limiting bracket (52).

5. The automatic solder ball placement machine for BGA chips according to claim 4, characterized in that: The first vacuum suction cup (55) includes a base plate (550) installed at the top of each linear guide rod (54) and a frame (551) provided on the edge of the base plate (550). The top of the base plate (550) is provided with a plurality of support platforms (552), and each support platform (552) supports the bottom of the material tray (10). A first through hole (553) for installing a vacuum connector is opened longitudinally through the base plate (550). The tray (10) includes a tray body (101), the edge of the tray body (101) is provided with a plurality of positioning holes (102), the top of the tray body (101) is provided with a plurality of positioning grooves (103) for positioning the chip, and a second through hole (104) is provided at the top and bottom of the positioning groove (103) through the longitudinal direction. The first visual inspection component (8) includes a first camera bracket (81) mounted on a platform (1). The top of the first camera bracket (81) is equipped with a first CCD camera (82) and a light source (83) from top to bottom. The first CCD camera (82) and the light source (83) are located above the vacuum fixing mechanism (5).

6. The automatic solder ball placement machine for BGA chips according to claim 1, characterized in that: The material conveying mechanism (2) includes a first belt conveyor (21), a second belt conveyor (22), a lateral positioning component (23), a first blocking component (24), and a second blocking component (25) mounted on the platform (1). The first belt conveyor (21) and the second belt conveyor (22) are arranged side by side along the conveying direction of the material tray (10), and the first belt conveyor (21) and the second belt conveyor (22) are connected end to end. The inlet end and the outlet end of the first belt conveyor (21) are respectively equipped with a first proximity switch (26) and a second proximity switch (27). The feed end of the second belt conveyor (22) is equipped with a third proximity switch (28), the lateral positioning component (23) is located on the other side of the tray conveying mechanism (2) and is used to laterally position the tray (10), the first blocking component (24) is located below the first belt conveyor (21) and is used to block and position the tray (10) being conveyed on the first belt conveyor (21), and the second blocking component (25) is located below the second belt conveyor (22) and is used to block and position the tray (10) being conveyed on the second belt conveyor (22). The first blocking assembly (24) includes a second drive device mounting plate (241) mounted on the platform (1), a baffle drive device (242) is mounted on the top of the second drive device mounting plate (241), and a baffle (243) is mounted on the output end of the baffle drive device (242). The structure of the second blocking component (25) is the same as that of the first blocking component (24); The lateral positioning component (23) includes a lateral positioning bracket (231) mounted on the platform (1), a push plate driving device (232) is mounted on the top of the lateral positioning bracket (231), and a lateral push plate (233) is mounted on the output end of the push plate driving device (232).

7. The automatic solder ball placement machine for BGA chips according to claim 5, characterized in that: The material tray lifting mechanism (6) includes a lifting bracket (61) mounted on the platform (1), a suction cup longitudinal moving assembly (62) mounted on the lifting bracket (61), a suction cup lifting frame (63) mounted on the moving part of the suction cup longitudinal moving assembly (62), and a second vacuum suction cup (64) mounted on the suction cup lifting frame (63) for supporting the material tray (10). The structure of the second vacuum chuck (64) is the same as that of the first vacuum chuck (55).

8. The automatic solder ball placement machine for BGA chips according to claim 1, characterized in that: The ball-planting mechanism (7) includes two ball-planting brackets (71) mounted side by side on the platform (1), a mesh plate mounting frame (72) between the two ball-planting brackets (71), a mesh plate (73) for positioning solder balls is installed inside the mesh plate mounting frame (72), a second linear guide rail (74) is installed on each of the two ball-planting brackets (71), a second slider (75) is mounted on each of the second linear guide rails (74), a solder box mounting frame (76) is mounted on both of the second sliders (75), a solder box (77) for holding solder balls is installed at the bottom of the solder box mounting frame (76), the bottom surface of the solder box (77) is in contact with the top surface of the mesh plate (73), and a mounting base (77) is installed on one end of the solder box mounting frame (76). 8) The top of one of the ball-planting brackets (71) is successively equipped with a third drive device mounting plate (79) and two support bearings (70). A second linear guide rail (74) and a mounting seat (78) are located between the two support bearings (70). The two support bearings (70) are jointly equipped with a lead screw pair (701). The third drive device mounting plate (79) is equipped with a tin box transverse movement drive device (702). The output end of the tin box transverse movement drive device (702) is equipped with a coupling (703). The output end of the tin box transverse movement drive device (702) is connected to the lead screw of the lead screw pair (701) through the coupling (703). The nut of the lead screw pair (701) is fixedly connected to the mounting seat (78).

9. The automatic solder ball placement machine for BGA chips according to claim 8, characterized in that: The stencil (73) has multiple mesh groups, each of which includes multiple mesh holes (731). The multiple mesh groups correspond one-to-one with multiple positioning grooves (103) on the material sheet, and each mesh hole (731) in the same mesh group corresponds one-to-one with each pin contact on the same chip.

10. The automatic solder ball placement machine for BGA chips according to claim 9, characterized in that: The tin box (77) includes a first push plate (771) and a second push plate (772) mounted side by side at the bottom of the tin box mounting bracket (76). A first end plate (773) is connected between the same ends of the first push plate (771) and the second push plate (772), and a second end plate (774) is connected between the same ends of the first push plate (771) and the second push plate (772). The first push plate (771), the second push plate (772), the first end plate (773), and the second end plate (774) form a receiving frame with an upper opening (775) and a lower opening (776). The bottom surfaces of the first push plate (771), the second push plate (772), the first end plate (773), and the second end plate (774) are all on the same plane, and the bottom surfaces of the first push plate (771), the second push plate (772), the first end plate (773), and the second end plate (774) are attached to the top surface of the mesh plate (73). The two sides of the bottom end of the first push plate (771) are laterally extended and integrally formed with inclined push parts (777). The longitudinal section of the inclined push part (777) is set in a descending wedge shape. The shape of the second push plate (772) is the same as that of the first push plate (771). The second visual inspection component (9) includes a second camera bracket (91) mounted on the table (1). The top of the second camera bracket (91) is sequentially equipped with a second CCD camera (92) and a third CCD camera (93) along the conveying direction of the material tray (10). The second CCD camera (92) is located above the ball planting mechanism (7).

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